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11942662 | DESCRIPTION OF EMBODIMENTS The structure of a prismatic secondary battery20according to an embodiment will be described below. The present invention is not limited to the following embodiment. FIG.1is perspective view of the prismatic secondary battery20.FIG.2is a sectional view taken along line II-II inFIG.1. As illustrated inFIG.1andFIG.2, the prismatic secondary battery20has a battery case100. The battery case100includes a bottomed, cylindrical prismatic outer body1having an opening, and a sealing plate2that seals the opening of the prismatic outer body1. The prismatic outer body1and the sealing plate2are preferably each made of metal, and preferably made of, for example, aluminum or an aluminum alloy. The prismatic outer body1houses, together with an electrolyte, an electrode body3including plural positive electrode plates and plural negative electrode plates that are stacked with separators each interposed therebetween. An insulating sheet14is disposed between the electrode body3and the prismatic outer body1. A positive electrode tab40and a negative electrode tab50are disposed on an edge of the electrode body3adjacent to the sealing plate2. The positive electrode tab40is electrically connected to a positive electrode external terminal7with a second positive electrode current collector6band a first positive electrode current collector6ainterposed therebetween. The negative electrode tab50is electrically connected to a negative electrode external terminal9with a second negative electrode current collector8band a first negative electrode current collector8ainterposed therebetween. The positive electrode tab40is connected to a surface of the second positive electrode current collector6badjacent to the electrode body3. The positive electrode tab40is being bent. This configuration provides a secondary battery having a high volumetric energy density. The negative electrode tab50is connected to a surface of the second negative electrode current collector8badjacent to the electrode body3. The negative electrode tab50is being bent. This configuration provides a secondary battery having a high volumetric energy density. The positive electrode external terminal7is fixed to the sealing plate2with an external insulating member11, which is made of resin, interposed therebetween. The negative electrode external terminal9is fixed to the sealing plate2with an external insulating member13, which is made of resin, interposed therebetween. The positive electrode external terminal7is preferably made of metal, and more preferably made of aluminum or an aluminum alloy. The negative electrode external terminal9is preferably made of metal, and more preferably made of copper or a copper alloy. More preferably, the negative electrode external terminal9has a copper or copper alloy portion inside the battery case100and has an aluminum or aluminum alloy portion outside the battery case100. The negative electrode external terminal9preferably has the surface coated with nickel or the like. The conduction path between the positive electrode plate and the positive electrode external terminal7is provided with a current interrupting mechanism60. The current interrupting mechanism60operates so as to interrupt the conduction path between the positive electrode plate and the positive electrode external terminal7when the internal pressure of the battery case100reaches a predetermined value or higher. The conduction path between the negative electrode plate and the negative electrode external terminal9may be provided with a current interrupting mechanism. The sealing plate2has a gas release valve17. The gas release valve17fractures when the internal pressure of the battery case100reaches a predetermined value or higher and releases gas in the battery case100to the outside of the battery case100. The operating pressure of the gas release valve17is set to a value larger than the operating pressure of the current interrupting mechanism60. The sealing plate2has an electrolyte injection port15. After an electrolyte is injected into the battery case100through the electrolyte injection port15, the electrolyte injection port15is sealed with a sealing plug16. Next, a method for producing the prismatic secondary battery20will be described. [Production of Positive Electrode Plate] A positive electrode slurry containing a lithium-nickel-cobalt-manganese composite oxide as a positive electrode active material, polyvinylidene fluoride (PVdF) as a binder, a carbon material as a conductive agent, and N-methyl-2-pyrrolidone (NMP) as a dispersion medium is prepared. The positive electrode slurry is applied to each surface of an aluminum foil. The aluminum foil has a rectangular shape and a thickness of 15 μm and functions as a positive electrode core. The positive electrode slurry is dried to remove N-methyl-2-pyrrolidone in the positive electrode slurry, whereby a positive electrode active material mixture layer is formed on the positive electrode core. The positive electrode active material mixture layer is then pressed into a predetermined thickness. The resulting positive electrode plate is cut into a predetermined shape. FIG.3is a plan view of a positive electrode plate4prepared by using the above-described method. As illustrated inFIG.3, the positive electrode plate4has a body having a positive electrode active material mixture layer4bon each surface of a rectangular positive electrode core4a. The positive electrode plate4has the positive electrode tab40. The positive electrode core4aprojects from an edge of the body, and the projecting positive electrode core4aconstitutes the positive electrode tab40. The positive electrode tab40may be a part of the positive electrode core4aas illustrated inFIG.3, or the positive electrode tab40may be formed by connecting another member to the positive electrode core4a. Preferably, a part of the positive electrode tab40adjacent to the positive electrode active material mixture layer4bhas a positive electrode protective layer4d. The positive electrode protective layer4dhas a larger electrical resistance than the positive electrode active material mixture layer4b. The positive electrode protective layer4dpreferably contains a binder and ceramic particles made of alumina, silica, zirconia, or other ceramics. The positive electrode protective layer4dmore preferably contains conductive particles made of a carbon material or other materials. [Production of Negative Electrode Plate] A negative electrode slurry containing graphite as a negative electrode active material, a styrene-butadiene rubber (SBR) as a binder, carboxymethylcellulose (CMC) as a thickener, and water is prepared. The negative electrode slurry is applied to each surface of a copper foil. The copper foil has a rectangular shape and a thickness of 8 μm and functions as a negative electrode core. The negative electrode slurry is dried to remove water in the negative electrode slurry, whereby a negative electrode active material mixture layer is formed on the negative electrode core. The negative electrode active material mixture layer is then pressed into a predetermined thickness. The resulting negative electrode plate is cut into a predetermined shape. FIG.4is a plan view of a negative electrode plate5prepared by using the above-described method. As illustrated inFIG.4, the negative electrode plate5has a body having a negative electrode active material mixture layer5bon each surface of a rectangular negative electrode core5a. The negative electrode plate5has a negative electrode tab50. The negative electrode core5aprojects from an edge of the body, and the projecting negative electrode core5aconstitutes the negative electrode tab50. The negative electrode tab50may be a part of the negative electrode core5aas illustrated inFIG.4, or the negative electrode tab50may be formed by connecting another member to the negative electrode core5a. [Production of Electrode Body Element] Stacked electrode body elements (3a,3b) are produced as follows: preparing50positive electrode plates4and51negative electrode plates5by using the foregoing methods; and stacking the positive electrode plates4and the negative electrode plates5with rectangular polyolefin separators each interposed therebetween. As illustrated inFIG.5, the stacked electrode body elements (3a,3b) are produced so as to include the stacked positive electrode tabs40of the positive electrode plates4and the stacked negative electrode tabs50of the negative electrode plates5on one edge. The separator is located on each outer surface of the electrode body elements (3a,3b), the electrode plates and the separators are fixed to each other with a tape or the like such that they are stacked on top of one another. Alternatively, the separators may each have adhesive layers so that each separator adheres to a corresponding one of the positive electrode plates4and each separator adheres to a corresponding one of the negative electrode plates5. Preferably, the separators have the same size as the negative electrode plates5or have a larger size than the negative electrode plates5in plan view. The positive electrode plate4and the negative electrode plate5may be stacked on top of each other after the peripheries of two separators between which the positive electrode plate4is interposed are hot melted. To produce the electrode body elements (3a,3b), the positive electrode plate4and the negative electrode plate5can also be stacked on top of each other by using a long separator while the long separator is bent in hairpin curves. Alternatively, the positive electrode plate4and the negative electrode plate5can also be stacked on top of each other by using a long separator while the long separator is wound. [Assembly of Sealing Body] With reference toFIG.2,FIG.6,FIG.7, andFIG.8, a method for attaching the positive electrode external terminal7and the first positive electrode current collector6ato the sealing plate2, and the structure of the current interrupting mechanism60will be described. The external insulating member11is disposed on the outer surface side of a positive electrode terminal attachment hole2ain the sealing plate2, and an internal insulating member10and a cup-shaped conductive member61are disposed on the inner surface side of the positive electrode terminal attachment hole2a. Next, the positive electrode external terminal7is inserted into the through-hole of the external insulating member11, the positive electrode terminal attachment hole2aof the sealing plate2, the through-hole of the internal insulating member10, and the through-hole of the conductive member61. The end of the positive electrode external terminal7is crimped onto the conductive member61. The positive electrode external terminal7, the external insulating member11, the sealing plate2, the internal insulating member10, and the conductive member61are fixed accordingly. The crimped portion of the positive electrode external terminal7is preferably welded to the conductive member61by means of laser welding or the like. The internal insulating member10and the external insulating member11are preferably each made of resin. The conductive member61has an opening adjacent to the electrode body3. A disc-shaped deformation plate62is placed so as to close the opening of the conductive member61, and a peripheral portion of the deformation plate62is weld-connected to the conductive member61. The opening of the conductive member61is sealed with the deformation plate62accordingly. The conductive member61and the deformation plate62are preferably each made of metal, and more preferably made of aluminum or an aluminum alloy. The opening of the conductive member61adjacent to the electrode body3does not necessarily have a circular shape, but may have a rectangular shape. The deformation plate62is shaped so as to seal the opening of the conductive member61. Next, a first insulating member63made of resin is disposed on the electrode body3side with respect to the deformation plate62. Preferably, the first insulating member63has a connection part, and the connection part is connected to the internal insulating member10. Preferably, the first insulating member63has a claw-shaped hook fixation part, the conductive member61has a flange, a recess, or a protrusion, and the hook fixation part of the first insulating member63is fixed to the flange, the recess, or the protrusion of the conductive member61. The first insulating member63has a fixation protrusion63aon its surface adjacent to the electrode body3. The first insulating member63preferably has an insulating member first region63xdisposed below the deformation plate62, an insulating member second region63yextending from the end of the insulating member first region63xtoward the sealing plate2, and an insulating member third region63zhorizontally extending from the end of the insulating member second region63y. The insulating member third region63zhas an insulating member opening63bat a position facing the electrolyte injection port15of the sealing plate2. An insulating member protrusion63cprotruding toward the electrode body3is disposed at the edge of the insulating member opening63b. Next, the first positive electrode current collector6ais disposed on the electrode body3side with respect to the first insulating member63. The first positive electrode current collector6ahas a fixation through-hole6d. The fixation protrusion63aof the first insulating member63is inserted into the fixation through-hole6dof the first positive electrode current collector6a, and the diameter of the end of the fixation protrusion63ais enlarged. As a result, the first insulating member63and the first positive electrode current collector6aare fixed to each other. A fixation part70is formed accordingly. As illustrated inFIG.6, four fixation parts70are preferably provided so as to surround the connection part between the deformation plate62and the first positive electrode current collector6a. The deformation plate62and the first positive electrode current collector6aare then weld-connected to each other through a through-hole in the first insulating member63. Preferably, the first positive electrode current collector6ahas a thin portion6c, and the thin portion6cis preferably weld-connected to the deformation plate62. Preferably, the thin portion6chas an opening at its center, and a peripheral portion of the opening is weld-connected to the deformation plate62. The thin portion6cmore preferably has an annular notch that surrounds the connection part between the deformation plate62and the first positive electrode current collector6a. The first insulating member63and the first positive electrode current collector6amay be connected to each other in advance, and the first insulating member63connected to the first positive electrode current collector6amay be disposed on the electrode body3side with respect to the deformation plate62. When the internal pressure of the battery case100reaches a predetermined value or higher, the deformation plate62deforms such that a central portion of the deformation plate62moves upward (toward the positive electrode external terminal7). The thin portion6cof the first positive electrode current collector6afractures upon deformation of the deformation plate62. The fracture causes disconnection of the conduction path between the positive electrode plate4and the positive electrode external terminal7. The leak inspection on the connection part between the conductive member61and the deformation plate62can be carried out by supplying gas to the inside of the current interrupting mechanism60through a terminal through-hole7bformed in the positive electrode external terminal7. While the gas causes the deformation plate62to push against the first positive electrode current collector6a, the deformation plate62and the first positive electrode current collector6acan be weld-connected to each other. Finally, the terminal through-hole7bis sealed with a terminal sealing member7a. The terminal sealing member7apreferably includes a metal plate7xand a rubber member7y. The first positive electrode current collector6ahas a current collector first region6a1disposed below the deformation plate62, a current collector second region6a2extending from an end of the current collector first region6a1toward the sealing plate2, and a current collector third region6a3horizontally extending from an upper end of the current collector second region. The current collector third region6a3has a current collector protrusion6xon its surface adjacent to the electrode body3. The current collector first region6a1of the first positive electrode current collector6ais disposed so as to face the insulating member first region63xof the first insulating member63. The current collector second region6a2of the first positive electrode current collector6ais disposed so as to face the insulating member second region63yof the first insulating member63. The current collector third region6a3of the first positive electrode current collector6ais disposed so as to face the insulating member third region63zof the first insulating member63. With reference toFIG.2,FIG.6,FIG.7, andFIG.9, a method for attaching the negative electrode external terminal9and the first negative electrode current collector8ato the sealing plate2will be described. The external insulating member13is disposed on the outer surface side of a negative electrode terminal attachment hole2bin the sealing plate2, and an internal insulating member12and the first negative electrode current collector8aare disposed on the inner surface side of the negative electrode terminal attachment hole2b. Next, the negative electrode external terminal9is inserted into the through-hole of the external insulating member13, the negative electrode terminal attachment hole2bof the sealing plate2, the through-hole of the internal insulating member12, and the through-hole of the first negative electrode current collector8a. The end of the negative electrode external terminal9is crimped onto the first negative electrode current collector8a. The external insulating member13, the sealing plate2, the internal insulating member12, and the first negative electrode current collector8aare fixed accordingly. The crimped portion of the negative electrode external terminal9is preferably weld-connected to the first negative electrode current collector8aby means of laser welding or the like. The internal insulating member12and the external insulating member13are preferably each made of resin. [Connection Between Second Current Collector and Tabs] FIG.10is a view illustrating a method for connecting the positive electrode tabs40(40a,40b) to the second positive electrode current collector6b, and a method for connecting the negative electrode tabs50(50a,50b) to the second negative electrode current collector8b. Two electrode body elements are produced by using the above-described method and defined as a first electrode body element3aand a second electrode body element3b. The first electrode body element3aand the second electrode body element3bmay have the completely same structure or may have different structures. The second positive electrode current collector6band the second negative electrode current collector8bare disposed between the first electrode body element3aand the second electrode body element3b. The stacked positive electrode tabs40aprotruding from the first electrode body element3aare disposed on the second positive electrode current collector6b. The stacked negative electrode tabs50aprotruding from the first electrode body element3aare disposed on the second negative electrode current collector8b. The stacked positive electrode tabs40bprotruding from the second electrode body element3bare disposed on the second positive electrode current collector6b. The stacked negative electrode tabs50bprotruding from the second electrode body element3bare disposed on the second negative electrode current collector8b. The positive electrode tabs40aand the positive electrode tabs40bare weld-connected to the second positive electrode current collector6bto form weld-connected parts90. The negative electrode tabs50aand the negative electrode tabs50bare weld-connected to the second negative electrode current collector8bto form weld-connected parts90. Weld connection is preferably performed in the following manner. As illustrated inFIG.11, the tabs (the positive electrode tabs40aor40b, the negative electrode tabs50aor50b) and the current collector (the second positive electrode current collector6b, the second negative electrode current collector8b) are sandwiched between welding jigs95from above and below. In this state, welding is performed. The welding method is preferably ultrasonic welding or resistance welding. Such welding ensures weld connection between the stacked tabs and the current collector. In the case where many tabs are stacked, for example, in the case where 20 or more tabs are stacked, ultrasonic welding or resistance welding can form more reliable weld-connected parts than laser welding or the like because ultrasonic welding or resistance welding can be performed with the tabs and the current collector sandwiched between a pair of welding jigs95. In resistance welding, the pair of welding jigs95is a pair of resistance welding electrodes. In ultrasonic welding, the pair of welding jigs95correspond to a horn and an anvil. The positive electrode tabs40aof the first electrode body element3aare connected to one side of the second positive electrode current collector6bwith respect to a central portion of the second positive electrode current collector6bin the width direction. The positive electrode tabs40bof the second electrode body element3bare connected to the other side of the second positive electrode current collector6bwith respect to a central portion of the second positive electrode current collector6bin the width direction. The negative electrode tabs50aof the first electrode body element3aare connected to one side of the second negative electrode current collector8bwith respect to a central portion of the second negative electrode current collector8bin the width direction. The negative electrode tabs50bof the second electrode body element3bare connected to the other side of the second negative electrode current collector8bwith respect to a central portion of the second negative electrode current collector8bin the width direction. As illustrated inFIG.10, the second positive electrode current collector6bhas an opening6z. After the second positive electrode current collector6bis connected to the first positive electrode current collector6a, the opening6zis placed at a position corresponding to the electrolyte injection port15of the sealing plate2. The positive electrode tabs40aof the first electrode body element3aare connected to one side of the second positive electrode current collector6bwith respect to the opening6zin the width direction of the second positive electrode current collector6b. The positive electrode tabs40bof the second electrode body element3bare connected to the other side of the second positive electrode current collector6bwith respect to the opening6zin the width direction of the second positive electrode current collector6b. As the second positive electrode current collector6b, the positive electrode tabs40a, and the positive electrode tabs40bare viewed in the direction perpendicular to the sealing plate2, portions of the positive electrode tabs40aand the positive electrode tabs40bsubstantially parallel to the second positive electrode current collector6bpreferably do not overlap the opening6z. This configuration can avoid the second positive electrode current collector6bor the positive electrode tabs40aand the positive electrode tabs40bfrom interfering with injection of an electrolyte. Here, either one of the following steps may be performed first: a fixation step of fixing the first positive electrode current collector6aand the first negative electrode current collector8ato the sealing plate2; and a connection step of respectively connecting the positive electrode tabs40and the negative electrode tabs50to the second positive electrode current collector6band the second negative electrode current collector8b. Preferably, after the positive electrode tabs are connected to the second positive electrode current collector and the negative electrode tabs are connected to the second negative electrode current collector, the second positive electrode current collector is connected to the first positive electrode current collector, and the second negative electrode current collector is connected to the first negative electrode current collector. [Connection Between First Positive Electrode Current Collector and Second Positive Electrode Current Collector] As illustrated inFIG.6andFIG.7, the first positive electrode current collector6ahas a current collector protrusion6x. As illustrated inFIG.10, the second positive electrode current collector6bhas a current collector opening6y. As illustrated inFIGS.7and8, the second positive electrode current collector6bis placed on the insulating member third region63zof the first insulating member63such that the current collector protrusion6xof the first positive electrode current collector6ais positioned in the current collector opening6yof the second positive electrode current collector6b. The current collector protrusion6xof the first positive electrode current collector6ais welded to the edge of the current collector opening6yof the second positive electrode current collector6bby means of irradiation with an energy ray, such as a laser. The first positive electrode current collector6aand the second positive electrode current collector6bare connected to each other accordingly. The second positive electrode current collector6bhas a current collector first recess6faround the current collector opening6y. In other words, the current collector opening6yis formed at the center of the current collector first recess6f. The first positive electrode current collector6aand the second positive electrode current collector6bare weld-connected to each other at the current collector first recess6f. When the current collector first recess6fis formed around the current collector opening6y, the first positive electrode current collector6aand the second positive electrode current collector6bcan be weld-connected to each other without increasing the height of the current collector protrusion6x. As illustrated inFIG.8, the second positive electrode current collector6bhas a tab connection region6b1to which the positive electrode tabs40are connected, and a current collector connection region6b2to which the first positive electrode current collector6ais connected. A stepped part6A is formed between the tab connection region6b1and the current collector connection region6b2. In the direction perpendicular to the sealing plate2, the distance between the sealing plate2and the tab connection region6b1is smaller than the distance between the sealing plate2and the current collector connection region6b2. Such a configuration results in a small space occupied by the current collection part and provides a secondary battery having a high volumetric energy density. The tab connection region6b1is preferably disposed substantially parallel (e.g., at an angle of ±20° or less) to the sealing plate2. As illustrated inFIG.10, the second positive electrode current collector6bhas target holes6eon both sides of the current collector opening6y. During welding between the first positive electrode current collector6aand the second positive electrode current collector6bby means of irradiation with an energy ray, such as a laser, the target holes6eare preferably used as targets for image correction. Preferably, position correction is performed by detecting the target holes6eon the image, and irradiation with energy rays is performed along the shape of the current collector opening6y. Each target hole6emay be a recess instead of a through-hole. The area of each target hole6ein plan view is preferably smaller than the area of the current collector opening6yin plan view. In the width direction of the second positive electrode current collector6b, the current collector opening6yis preferably aligned with the target holes6e. As illustrated inFIG.8, a current collector second recess6wis formed in a surface of the first positive electrode current collector6athat faces the first insulating member63and that is located on the back side of the current collector protrusion6x. This configuration is preferred because it is easy to form a large weld-connected part between the first positive electrode current collector6aand the second positive electrode current collector6b. The formation of the current collector second recess6wcan protect the first insulating member from damage caused by welding heat during weld connection between the first positive electrode current collector6aand the second positive electrode current collector6b. As illustrated inFIG.8, the lower end (the end adjacent to the electrode body3) of the insulating member protrusion63cof the first insulating member63preferably protrudes downward (toward the electrode body3) beyond the lower surface of the second positive electrode current collector6baround the opening6z. This configuration can assuredly avoid contact between the sealing plug16and the second positive electrode current collector6b. Such contact is effectively avoided when the sealing plug16that seals the electrolyte injection port15in the sealing plate2protrudes downward (toward the electrode body3) beyond the lower surface of the sealing plate2. The insulating member protrusion63cpreferably has an annular shape. However, the insulating member protrusion63cdoes not necessarily have an annular shape and may have a partially cut annular shape. The second positive electrode current collector6bhas the opening6zat a position facing the electrolyte injection port15formed in the sealing plate2. The insulating member third region63zof the first insulating member63preferably has a fixation part to be fixed to the second positive electrode current collector6b. For example, a claw-shaped fixation part can be formed in the first insulating member63and can be hooked on and fixed to the second positive electrode current collector6b. Alternatively, the first insulating member63may be fixed to the second positive electrode current collector6bas follows: forming a protrusion in the first insulating member63; forming an opening or cut for fixation in the second positive electrode current collector6b; inserting the protrusion of the first insulating member63into the opening or cut for fixation in the second positive electrode current collector6b; and enlarging the diameter of the end of the protrusion of the first insulating member63. As illustrated inFIG.8, the insulating member first region63xof the first insulating member63is disposed so as to face the current collector first region6a1of the first positive electrode current collector6a. The insulating member second region63yof the first insulating member63is disposed so as to face the current collector second region6a2of the first positive electrode current collector6a. This configuration can assuredly avoid formation of a conduction path between the first positive electrode current collector6aand the deformation plate62or between the first positive electrode current collector6aand the conductive member61after the current interrupting mechanism60operates to disconnect electrical connection between the first positive electrode current collector6aand the deformation plate62. [Connection Between First Negative Electrode Current Collector and Second Negative Electrode Current Collector] As illustrated inFIG.6andFIG.7, the first negative electrode current collector8ahas a current collector protrusion8x. As illustrated inFIG.9andFIG.12, the second negative electrode current collector8bhas a current collector opening8y. As illustrated inFIG.12, the second negative electrode current collector8bis placed on the internal insulating member12such that the current collector protrusion8xof the first negative electrode current collector8ais positioned in the current collector opening8yof the second negative electrode current collector8b. The current collector protrusion8xof the first negative electrode current collector8ais welded to the edge of the current collector opening8yof the second negative electrode current collector8bby means of irradiation with an energy ray, such as a laser. The first negative electrode current collector8aand the second negative electrode current collector8bare connected to each other accordingly. The second negative electrode current collector8bhas a current collector first recess8faround the current collector opening8y. In other words, the current collector opening8yis formed at the center of the current collector first recess8f. The first negative electrode current collector8aand the second negative electrode current collector8bare weld-connected to each other at the current collector first recess8f. Like the second positive electrode current collector6b, the second negative electrode current collector8bhas target holes8e. The first negative electrode current collector8aand the second negative electrode current collector8bare preferably made of copper or a copper alloy. The first negative electrode current collector8aand the second negative electrode current collector8beach preferably have a nickel layer on their surfaces. A nickel layer is preferably formed on the surface of the current collector protrusion8xof the first negative electrode current collector8a. A nickel layer is preferably formed on the surface of the second negative electrode current collector8bat the edge of the current collector opening8y. As illustrated inFIG.9, a current collector second recess8wis formed in a surface of the first negative electrode current collector8athat faces the internal insulating member12and that is located on the back side of the current collector protrusion8x. This configuration is preferred because it is easy to form a large weld-connected part between the first negative electrode current collector8aand the second negative electrode current collector8b. The formation of the current collector second recess8wcan protect the internal insulating member12from damage caused by welding heat during weld connection between the first negative electrode current collector8aand the second negative electrode current collector8b. As illustrated inFIG.9, the second negative electrode current collector8bhas a tab connection region8b1to which the negative electrode tabs50are connected, and a current collector connection region8b2to which the first negative electrode current collector8ais connected. A stepped part8A is formed between the tab connection region8b1and the current collector connection region8b2. In the direction perpendicular to the sealing plate2, the distance between the sealing plate2and the tab connection region8b1is smaller than the distance between the sealing plate2and the current collector connection region8b2. Such a configuration results in a small space occupied by the current collection part and provides a secondary battery having a high volumetric energy density. The internal insulating member12preferably has a fixation part to be fixed to the second negative electrode current collector8b. For example, a claw-shaped fixation part can be formed in the internal insulating member12and can be hooked on and fixed to the second negative electrode current collector8b. Alternatively, the internal insulating member12may be fixed to the second negative electrode current collector8bas follows: forming a protrusion in the internal insulating member12; forming an opening or cut for fixation in the second negative electrode current collector8b; inserting the protrusion of the internal insulating member12into the opening or cut for fixation in the second negative electrode current collector8b; and enlarging the diameter of the end of the protrusion of the internal insulating member12. Since the shape of the current collector protrusion6xin the first positive electrode current collector6ais different from the shape of the current collector protrusion8xin the first negative electrode current collector8a, this configuration can assuredly avoid accidental connection between the first positive electrode current collector6aand the second negative electrode current collector8bor between the first negative electrode current collector8aand the second positive electrode current collector6b. The current collector protrusion6xin the first positive electrode current collector6ais formed such that the major axis of the current collector protrusion6xextends in the transverse direction of the sealing plate2. The current collector protrusion8xin the first negative electrode current collector8ais formed such that the major axis of the current collector protrusion8xextends in the longitudinal direction of the sealing plate2. Such a configuration can absorb a difference between the center-to-center distance between the current collector protrusion6xin the first positive electrode current collector6aand the current collector protrusion8xin the first negative electrode current collector8aand the center-to-center distance between the current collector opening6yin the second positive electrode current collector6band the current collector opening8yin the second negative electrode current collector8b. This configuration can avoid the possibility of assembly defects in the case of positioning both on the positive electrode side and the negative electrode side and the possibility of low positional accuracy due to a failure of positioning on one electrode side in the case of positioning on the other electrode side. The shape of the current collector protrusion6xin the first positive electrode current collector6ais preferably different from the shape of the current collector protrusion8xin the first negative electrode current collector8a. The current collector protrusion6xand the current collector protrusion8xpreferably have a non-perfect circular shape and preferably have a rectangular shape, an elliptical shape, or a track shape. In the case where one of the current collector protrusion6xin the first positive electrode current collector6aand the current collector protrusion8xin the first negative electrode current collector8ahas a major axis direction different from that of the other, the current interrupting mechanism is preferably provided on the positive electrode side, the major axis of the current collector protrusion6xin the first positive electrode current collector6apreferably extends in the transverse direction of the sealing plate2, and the major axis of the current collector protrusion8xin the first negative electrode current collector8apreferably extends in the longitudinal direction of the sealing plate2. This configuration can reduce a space occupied by the current collection part. <Production of Electrode Body> The positive electrode tabs40a, the positive electrode tabs40b, the negative electrode tabs50a, and the negative electrode tabs50bare bent such that the upper surface of the first electrode body element3aand the upper surface of the second electrode body element3binFIG.10comes into contact with each other. Accordingly, the first electrode body element3aand the second electrode body element3bare combined together into one electrode body3. <Assembly of Prismatic Secondary Battery> The electrode body3attached to the sealing plate2is covered with the insulating sheet14and inserted into the prismatic outer body1. The insulating sheet14is preferably formed by bending a flat insulating sheet in a box shape or bag shape. The opening of the prismatic outer body1is closed by joining the sealing plate2and the prismatic outer body1by means of laser welding or the like. Subsequently, a non-aqueous electrolyte containing an electrolyte solvent and an electrolyte salt is injected through the electrolyte injection port15provided in the sealing plate2. The electrolyte injection port15is sealed with the sealing plug16. <Method for Producing Prismatic Secondary Battery> The above-described method can reduce the proportion of a space occupied by the current collection part including the positive electrode tabs40, the first positive electrode current collector6a, the second positive electrode current collector6b, the negative electrode tabs50, the first negative electrode current collector8a, the second negative electrode current collector8b, and other components, and can provide a secondary battery having a high volumetric energy density. According to the above-described configuration, there is provided a highly reliable secondary battery since a stack of a plurality of the tabs can stably and strongly be weld-connected to the second current collector. [Modification 1] FIG.13is a bottom view of a sealing plate to which each component has been attached in a prismatic secondary battery according to Modification 1.FIG.14is a view illustrating the process of connecting tabs to second current collectors in the prismatic secondary battery according to Modification 1. The prismatic secondary battery according to Modification 1 differs from the prismatic secondary battery20according to the embodiment in the shapes of the first negative electrode current collector and the second negative electrode current collector. In the prismatic secondary battery according to Modification 1, a current collector protrusion108xin a first negative electrode current collector108ais formed such that the major axis of the current collector protrusion108xextends in the transverse direction of the sealing plate2. In the prismatic secondary battery according to Modification 1, a current collector opening108yin a second negative electrode current collector108bis formed such that the major axis of the current collector opening108yextends in the transverse direction of the sealing plate2. This configuration can further reduce a space occupied by the current collecting part. The second negative electrode current collector108bhas a current collector first recess108faround the current collector opening108y. Like the second negative electrode current collector8b, the second negative electrode current collector108bhas target holes108e. A current collector second recess108wis formed in a surface of the first negative electrode current collector108athat faces the internal insulating member12and that is located on the back side of the current collector protrusion108x. [Modification 2] FIG.15is a bottom view of a sealing plate to which each component has been attached in a prismatic secondary battery according to Modification 2.FIG.16is a sectional view in the longitudinal direction of the sealing plate to which each component has been attached.FIG.17is an enlarged view illustrating the first positive electrode current collector, the second positive electrode current collector, the current interrupting mechanism, and the surrounding area inFIG.16. The prismatic secondary battery according to Modification 2 differs from the prismatic secondary battery according to Modification 1 in the shapes of the first positive electrode current collector, the second positive electrode current collector, and the first insulating member. In Modification 2, a first positive electrode current collector106ahas a current collector protrusion106xin a region under a deformation plate62(a region adjacent to electrode body3). A second positive electrode current collector106bhas a tab connection region106b1to which positive electrode tabs are connected, a linkage region106b2extending downward (toward the electrode body3) from an end of the tab connection region106b1, and a current collector connection region106b3extending horizontally from an end of the linkage region106b2. The current collector connection region106b3has a current collector opening106y. The edge of the current collector opening106yis weld-connected to the current collector protrusion106xby means of laser welding or the like. This configuration can reduce a space occupied by the current collecting part. The tab connection region106b1of the second positive electrode current collector106bis disposed so as to face an insulating member third region163zof a first insulating member163. The linkage region106b2of the second positive electrode current collector106bis disposed so as to face an insulating member second region163yof the first insulating member163. The first positive electrode current collector106ais disposed so as to face an insulating member first region163x. Like the first positive electrode current collector6a, the first positive electrode current collector106ahas a thin portion106c. The thin portion106cis weld-connected to the deformation plate62. A current collector second recess106wis formed in a surface of the first positive electrode current collector106athat faces the first insulating member163and that is located on the back side of the current collector protrusion106x. The second positive electrode current collector106bhas a current collector first recess106faround the current collector opening106y. The second positive electrode current collector106bhas an opening106zat a position facing an electrolyte injection port15in the sealing plate2. The first insulating member163has an insulating member opening163bat a position facing the electrolyte injection port15in the sealing plate2. An insulating member protrusion163cprotruding downward is disposed at the edge of the insulating member opening163b. The prismatic secondary battery according to Modification 2 differs from the prismatic secondary battery20according to the embodiment in the positions of fixation parts70at which the first insulating member163is fixed to the first positive electrode current collector106a. In the prismatic secondary battery according to Modification 2, as illustrated inFIG.16, two fixation parts70are aligned with each other in the transverse direction of the sealing plate2. The first insulating member163in the prismatic secondary battery according to Modification 2 differs from the first insulating member63in the prismatic secondary battery20according to the embodiment in the position at which the fixation protrusion is formed. <Others> The embodiment is an example where the electrode body3is composed of two electrode body elements3aand3b, but the configuration is not limited to this example. The electrode body3may be one stacked electrode body. The electrode body3may be one wound electrode body in which a long positive electrode plate and a long negative electrode plate are wound with a separator interposed therebetween. These two electrode body elements3aand3bare not necessarily stacked electrode bodies and may be wound electrode bodies in which a long positive electrode plate and a long negative electrode plate are wound with a separator interposed therebetween. The connection between the first positive electrode current collector and the second positive electrode current collector and the connection between the first negative electrode current collector and the second negative electrode current collector are preferably performed by means of irradiation with an energy ray, such as a laser, an electron beam, and an ion beam. REFERENCE SIGNS LIST 20Prismatic secondary battery100Battery case1Prismatic outer body2Sealing plate2aPositive electrode terminal attachment hole2bNegative electrode terminal attachment hole3Electrode body3a,3bElectrode body element4Positive electrode plate4aPositive electrode core4bPositive electrode active material mixture layer4dPositive electrode protective layer40,40a,40bPositive electrode tab5Negative electrode plate5aNegative electrode core5bNegative electrode active material mixture layer50,50a,50bNegative electrode tab6aFirst positive electrode current collector6a1Current collector first region6a2Current collector second region6a3Current collector third region6cThin portion6dFixation through-hole6wCurrent collector second recess6xCurrent collector protrusion6bSecond positive electrode current collector6b1Tab connection region6b2Current collector connection region6eTarget hole6fCurrent collector first recess6yCurrent collector opening6zOpening6A Stepped part7Positive electrode external terminal7aTerminal sealing member7xMetal plate7yRubber member7bTerminal through-hole8aFirst negative electrode current collector8wCurrent collector second recess8xCurrent collector protrusion8bSecond negative electrode current collector8b1Tab connection region8b2Current collector connection region8eTarget hole8fCurrent collector first recess8yCurrent collector opening8A Stepped part9Negative electrode external terminal10Internal insulating member11External insulating member12Internal insulating member13External insulating member14Insulating sheet15Electrolyte injection port16Sealing plug17Gas release valve60Current interrupting mechanism61Conductive member62Deformation plate63First insulating member63aFixation protrusion63bInsulating member opening63cInsulating member protrusion63xInsulating member first region63yInsulating member second region63zInsulating member third region70Fixation part90Weld-connected part95Welding jig106aFirst positive electrode current collector106cThin portion106wCurrent collector second recess106xCurrent collector protrusion106bSecond positive electrode current collector106b1Tab connection region106b2Linkage region106b3Current collector connection region106fCurrent collector first recess106yCurrent collector opening106zOpening108aFirst negative electrode current collector108wCurrent collector second recess108xCurrent collector protrusion108bSecond negative electrode current collector108yCurrent collector opening108eTarget hole108fCurrent collector first recess163First insulating member163bInsulating member opening163cInsulating member protrusion163xInsulating member first region163yInsulating member second region163zInsulating member third region | 50,411 |
11942663 | DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the terminal component and secondary battery disclosed herein will be described. The embodiment described herein is, of course, not intended to specifically limit the present disclosure. The present disclosure is not limited to the embodiment described herein, unless otherwise specified. Each drawing is schematically drawn and does not necessarily reflect the actual configuration. In addition, members and parts that perform the same action are designated, as appropriate, by the same reference numerals, and duplicate description thereof will be omitted. Secondary Battery In the present description, the “secondary battery” means a device capable of charging and discharging. The secondary battery is inclusive of a battery generally called a lithium ion battery, a lithium secondary battery, or the like, a lithium polymer battery, a lithium ion capacitor, or the like. Here, a lithium ion secondary battery will be illustrated as a form of the secondary battery. Lithium-Ion Secondary Battery10 FIG.1is a partial cross-sectional view of a lithium ion secondary battery10. InFIG.1, a state in which the inside is exposed is drawn along a wide surface on one side of a substantially rectangular parallelepiped battery case41. The lithium ion secondary battery10shown inFIG.1is a so-called sealed battery.FIG.2is a cross-sectional view showing a II-II cross section ofFIG.1. InFIG.2, a partial cross-sectional view of a substantially rectangular parallelepiped battery case41in a state where the inside is exposed along a narrow surface on one side is schematically drawn. As shown inFIG.1, the lithium ion secondary battery10includes an electrode body20, a battery case41, a positive electrode terminal42, and a negative electrode terminal43. Electrode Body20 The electrode body20is accommodated in the battery case41in a state of being covered with an insulating film (not shown) or the like. The electrode body20includes a positive electrode sheet21as a positive electrode element, a negative electrode sheet22as a negative electrode element, and separator sheets31and32as separators. The positive electrode sheet21, the first separator sheet31, the negative electrode sheet22, and the second separator sheet32are long strip-shaped members, respectively. In the positive electrode sheet21, a positive electrode active material layer21bincluding a positive electrode active material is formed on both sides of a positive electrode current collecting foil21a(for example, an aluminum foil) having a predetermined width and thickness, except for a non-formation portion21a1that is set to a constant width at one end in the width direction. For example, in a lithium ion secondary battery, the positive electrode active material is a material capable of releasing lithium ions during charging and absorbing lithium ions during discharging, such as a lithium transition metal composite material. Various positive electrode active materials have been generally proposed in addition to the lithium transition metal composite material, and the type of the positive electrode active material is not particularly limited. In the negative electrode sheet22, a negative electrode active material layer22bincluding a negative electrode active material is formed on both sides of a negative electrode current collecting foil22a(here, a copper foil) having a predetermined width and thickness, except for a non-formation portion22a1that is set to a constant width at one end in the width direction. For example, in a lithium ion secondary battery, the negative electrode active material is a material capable of occluding lithium ions during charging and releasing the occluded lithium ions during discharging, such as natural graphite. Various negative electrode active materials have been generally proposed in addition to natural graphite, and the type of the negative electrode active material is not particularly limited. For the separator sheets31and32, for example, a porous resin sheet which has a required heat resistance and through which an electrolyte can pass is used. Various separator sheets have been proposed for the separator sheets31and32, and the type thereof is not particularly limited. Here, the negative electrode active material layer22bis formed, for example, to be wider than the positive electrode active material layer21b. The width of the separator sheets31and32is larger than that of the negative electrode active material layer22b. The non-formation portion21a1of the positive electrode current collecting foil21aand the non-formation portion22a1of the negative electrode current collecting foil22aare directed to opposite sides in the width direction. Further, the positive electrode sheet21, the first separator sheet31, the negative electrode sheet22, and the second separator sheet32are oriented in the length direction, stacked in this order and wound. The negative electrode active material layer22bcovers the positive electrode active material layer21bwith the separator sheets31and32interposed therebetween. The negative electrode active material layer22bis covered with separator sheets31and32. The non-formation portion21a1of the positive electrode current collecting foil21aprotrudes from one side of the separator sheets31and32in the width direction. The non-formation portion22a1of the negative electrode current collecting foil22aprotrudes from the separator sheets31and32on the opposite side in the width direction. As shown inFIG.1, the above-described electrode body20is flattened along one plane including the winding axis so as to be accommodated in the case body41aof the battery case41. The non-formation portion21a1of the positive electrode current collecting foil21ais arranged on one side, and the non-formation portion22a1of the negative electrode current collecting foil22ais arranged on the opposite side along the winding axis of the electrode body20. Battery Case41 As shown inFIG.1, the electrode body20is accommodated in the battery case41. The battery case41has a case body41ahaving a substantially rectangular parallelepiped angular shape with one side open, and a lid41bmounted on the opening. In this embodiment, the case body41aand the lid41bare formed of aluminum or an aluminum alloy mainly composed of aluminum, from the viewpoint of weight reduction and ensuring the required rigidity. Case Body41a As shown inFIGS.1and2, the case body41ahas a substantially rectangular parallelepiped angular shape with one side open. The case body41ahas a substantially rectangular bottom surface portion61, a pair of wide surface portions62and63, and a pair of narrow surface portions64and65. Each of the pair of wide surface portions62and63rises from the long side of the bottom surface portion61. Each of the pair of narrow surface portions64and65rises from the short side of the bottom surface portion61. An opening41a1surrounded by a pair of wide surface portions62and63and a pair of narrow surface portions64and65is formed on one side surface of the case body41a. Lid41b The lid41bis mounted on the opening41a1of the case body41asurrounded by the long sides of the pair of wide surface portions62and63and the short sides of the pair of narrow surface portions64and65. The peripheral edge of the lid41bis joined to the edge of the opening41a1of the case body41a. Such joining may be performed by, for example, continuous welding with no gaps. Such welding can be achieved, for example, by laser welding. In this embodiment, a positive electrode terminal42and a negative electrode terminal43are attached to the lid41b. The positive electrode terminal42includes an internal terminal42aand an external terminal42b. The negative electrode terminal43includes an internal terminal43aand an external terminal43b. The internal terminals42aand43aare attached to the inside of the lid41bwith an insulator72interposed therebetween. The external terminals42band43bare attached to the outside of the lid41bwith a gasket71interposed therebetween. The internal terminals42aand43aextend inside the case body41a. The internal terminal42aof the positive electrode is connected to the non-formation portion21a1of the positive electrode current collecting foil21a. The internal terminal43aof the negative electrode is connected to the non-formation portion22a1of the negative electrode current collecting foil22a. As shown inFIG.1, the non-formation portion21a1of the positive electrode current collecting foil21aof the electrode body20and the non-formation portion22a1of the negative electrode current collecting foil22aare attached to the internal terminals42aand43athat are attached to both sides of the lid41bin the longitudinal direction. The electrode body20is accommodated in the battery case41in a state of being attached to the internal terminals42aand43aattached to the lid41b. Here, the wound electrode body20is illustrated by way of example. The structure of the electrode body20is not limited to such a form. The structure of the electrode body20may be, for example, a laminated structure in which a positive electrode sheet and a negative electrode sheet are alternately laminated with a separator sheet interposed therebetween. Further, a plurality of electrode bodies20may be accommodated in the battery case41. FIG.3is a sectional view taken along line III-III ofFIG.2.FIG.3shows a cross section of a part where the negative electrode terminal43is attached to the lid41b. In this embodiment, a member in which dissimilar metals are joined is used for the external terminal43bof the negative electrode. InFIG.3, the cross-sectional shape of the external terminal43bis schematically shown without showing the structure of the metals constituting the external terminal43b, the interface between the dissimilar metals, the gap between the dissimilar metals, or the like. As shown inFIG.3, the lid41bhas an attachment hole41b1for attaching the external terminal43bof the negative electrode. The attachment hole41b1penetrates the lid41bat a predetermined position of the lid41b. The internal terminal43aand the external terminal43bof the negative electrode are attached to the attachment hole41b1of the lid41bwith the gasket71and the insulator72interposed therebetween. On the outside of the attachment hole41b1, a step41b2on which the gasket71is mounted is provided around the attachment hole41b1. The step41b2is provided with a seat surface41b3on which the gasket71is arranged. The seat surface41b3is provided with a projection41b4for positioning the gasket71. Here, as shown inFIG.3, the external terminal43bof the negative electrode includes a head43b1, a shaft43b2, and a caulking piece43b3. The head43b1is a part arranged outside the lid41b. The head43b1is a part that is larger than the attachment hole41b1and arranged at the gasket71. The shaft43b2is a part mounted in the attachment hole41b1with the gasket71interposed therebetween. The shaft43b2protrudes downward from a substantially central portion of the head43b1. As shown inFIG.3, the caulking piece43b3is a part caulked to the internal terminal43aof the negative electrode inside the lid41b. The caulking piece43b3extends from the shaft43b2and is bent and caulked to the internal terminal43aof the negative electrode after being inserted into the lid41b. Gasket71 As shown inFIG.3, the gasket71is a member attached to the attachment hole41b1and the seat surface41b3of the lid41b. In this embodiment, the gasket71includes a seat71a, a boss71b, and a side wall71c. The seat71ais apart mounted on the seat surface41b3provided on the outer surface around the attachment hole41b1of the lid41b. The seat71ahas a substantially flat surface corresponding to the seat surface41b3. The seat71ais provided with a depression corresponding to the projection41b4of the seat surface41b3. The boss71bprojects from the bottom surface of the seat71a. The boss71bhas an outer shape along the inner side surface of the attachment hole41b1so as to be mounted on the attachment hole41b1of the lid41b. The inner surface of the boss71bserves as a mounting hole for mounting the shaft43b2of the external terminal43b. The side wall71crises upward from the peripheral edge of the seat71a. The head43b1of the external terminal43bis mounted on a part surrounded by the side wall71cof the gasket71. The gasket71is arranged between the lid41band the external terminal43bto ensure insulation between the lid41band the external terminal43b. Further, the gasket71ensures the airtightness of the attachment hole41b1of the lid41b. From this point of view, it is preferable to use a material having excellent chemical resistance and weather resistance. In this embodiment, PFA is used for the gasket71. PFA is a copolymer of tetrafluoroethylene and perfluoroalkoxyethylene (Tetrafluoroethylene Perfluoroalkylvinylether Copolymer). The material used for the gasket71is not limited to PFA. Insulator72 The insulator72is a member mounted inside the lid41baround the attachment hole41b1of the lid41b. The insulator72includes a base72a, a hole72b, and a side wall72c. The base72ais a part arranged along the inner surface of the lid41b. In this embodiment, the base72ais a substantially flat plate-shaped part. The base72ais arranged along the inner side surface of the lid41b, and has a size such that the base does not protrude from the lid41bso that it can be housed in the case body41a. The hole72bis provided correspondingly to the attachment hole41b1. In this embodiment, the hole72bis provided in a substantially central portion of the base72a. On the side surface of the lid41bfacing the inner side surface, a recessed step72b1is provided around the hole72b. The step72b1accommodates the distal end of the boss71bof the gasket71mounted in the attachment hole41b1. The side wall72crises downward from the peripheral edge of the base72a. A proximal portion43a1provided at one end of the internal terminal43aof the negative electrode is accommodated in the base72a. Since the insulator72is arranged inside the battery case41, it is preferable that the insulator72have a required chemical resistance. In this embodiment, PPS is used for the insulator72. PPS is a polyphenylene sulfide resin. The material used for the insulator72is not limited to PPS. The internal terminal43aof the negative electrode includes the proximal portion43a1and a connection piece43a2(seeFIGS.1and2). The proximal portion43a1is a part mounted on the base72aof the insulator72. In this embodiment, the proximal portion43a1has a shape corresponding to the inside of the side wall72caround the base72aof the insulator72. As shown inFIGS.1and2, the connection piece43a2extends from one end of the proximal portion43a1and extends into the case body41ato be connected to the non-formation portion22a1of the negative electrode of the electrode body20. In this embodiment, the gasket71is attached to the outside of the lid41bwhile the boss71bis being mounted on the attachment hole41b1. The external terminal43bis mounted on the gasket71. At this time, the shaft43b2of the external terminal43bis inserted into the boss71bof the gasket71, and the head43b1of the external terminal43bis arranged on the seat71aof the gasket71. The insulator72and the internal terminal43aare attached to the inside of the lid41b. As shown inFIG.3, the caulking piece43b3of the external terminal43bis bent and caulked to the proximal portion43a1of the internal terminal43a. The caulking piece43b3of the external terminal43band the proximal portion43a1of the negative electrode terminal43may be partially metal-joined in order to improve conductivity. For the internal terminal42aof the positive electrode of the lithium ion secondary battery10, the required level of oxidation-reduction resistance is not higher than that of the negative electrode. From the viewpoint of required oxidation-reduction resistance and weight reduction, aluminum can be used for the internal terminal42aof the positive electrode. By contrast, for the internal terminal43aof the negative electrode, the required level of oxidation-reduction resistance is higher than that of the positive electrode. From this point of view, copper may be used for the internal terminal43aof the negative electrode. Meanwhile, as the bus bar to which the external terminal43bis connected, aluminum or an aluminum alloy may be used from the viewpoint of weight reduction and cost reduction. The present inventor has studied the use of copper or copper alloy for a part of the external terminal43bthat is joined to the internal terminal43a, and the use of aluminum or an aluminum alloy for a part of the external terminal43bthat is connected to the bus bar. In order to realize such a structure, in this embodiment, a member obtained by dissimilar metal joining of copper and aluminum is used as the external terminal43b. The structure of the terminal component200used as the external terminal43bwill be described hereinbelow. Terminal Component200 FIG.4is a cross-sectional view schematically showing the terminal component200. As shown inFIGS.1and2, the terminal component200is attached to the battery case41so that a part of the terminal component is connected to the internal terminal43ainside the battery case41, and a part is partially exposed to the outside of the battery case41. The terminal component200includes a first metal201and a second metal202overlapped on the first metal201. A part of the first metal201is connected to the internal terminal43ainside the battery case41. The second metal202is exposed to the outside of the battery case41. The first metal201and the second metal202are configured of different metals. A part of the first metal201is connected to the internal terminal43ainside the battery case41when the terminal component200is used as the external terminal43b. In this embodiment, the first metal is configured of copper. The first metal201has a shaft201aand a flange201b. The shaft201ais a part serving as the shaft43b2to be inserted into the attachment hole41b1of the lid41b. The flange201bis a substantially rectangular flat plate-shaped part that is provided at one end of the shaft201aand is wider than the shaft201a. The shaft201ais provided with a part201cthat serves as the caulking piece43b3that is to be further caulked to the internal terminal43aon the side opposite to the side where the flange201bis provided. The second metal202is a part exposed to the outside of the battery case41when the terminal component200is used as the external terminal43b. In this embodiment, the second metal is configured of aluminum. In this embodiment, the first metal201includes a protrusion201dhaving a flat top portion201d1. The protrusion201dis provided at the center of a facing surface201b1of the flange201b. The protrusion201dis a substantially disk-shaped part. The second metal202is a flat plate-shaped metal member overlapped on the first metal201. The second metal202has a substantially rectangular shape in which the facing surface202afacing the first metal201corresponds to the facing surface201b1of the first metal201. The second metal202is joined to the top portion201d1of the protrusion201dof the first metal201. In this embodiment, the first metal201and the second metal202are metal-joined at the top portion201d1of the protrusion201dof the first metal201. The metal-joined joint portion203is formed at the top portion201d1and the central portion of the facing surface202a. The method of joining the top portion201d1of the protrusion201dand the second metal202is not particularly limited, and for example, the joining can be performed by a method such as ultrasonic pressure welding, friction welding, resistance welding, and the like. The joint portion203joined in this way is formed by solid-phase joining without using an adhesive layer of an adhesive or a solder. In this embodiment, a region other than the protrusion201dis a gap between the facing surface201b1of the first metal201and the facing surface202aof the second metal202. However, the region between the facing surface201b1and the facing surface202ais not limited to such a form. A member that does not electrically connect the first metal201and the second metal202may be arranged in the region. For example, when a vibration is applied to the lithium ion secondary battery10, the vibration may be transmitted to the terminal component200via a bus bar. In order to alleviate the concentration of such an external load on the protrusion201d, for example, a gasket71or the like may be arranged in the region. Such a member that does not electrically connect the first metal201and the second metal202may be partially or entirely arranged in the region. When the lithium ion secondary battery10is charged or discharged, a current flows through the terminal component200used as the external terminal43b. At this time, a current also flows through the first metal201and the second metal202. As shown inFIG.4, the protrusion201dof the first metal201has a narrower cross-sectional area through which an electric current passes than surrounding portions. As a result, when a current flows through the terminal component200due to charging or discharging of the lithium ion secondary battery10, the current is concentrated in the protrusion201d. In this way, the amount of Joule heat generated in the portion where the current is concentrated is larger than in the other portions. Further, the joint portion203is formed with a dissimilar metal joint in which the first metal201and the second metal202are joined. Therefore, when a current flows through the terminal component200, the amount of Joule heat generated in in the protrusion201dand the joint portion203is larger than in the surrounding portions. Here, the cross section of the protrusion201dthat is orthogonal to the projection direction of the protrusion201dis set such that fusing occurs when a current equal to or higher than a predetermined current value flows between the first metal201and the second metal202. Here, the projection direction is a direction perpendicular to the facing surface201b1provided with the protrusion201d. Here, the predetermined current value is set based on, for example, a peak current value in the normal usage mode of the battery. Although not limited to this, the predetermined current value can be set to twice or more the above-mentioned peak current value. Fusing occurring when a current equal to or higher than the predetermined current value flows is, for example, a process in which one of the first metal201and the second metal202is melted, thereby electrically separating the first metal and the second metal from each other in the protrusion. The fusing referred to herein may occur when the protrusion201dreaches the melting point and melts, or when the protrusion201ddoes not melt and the other second metal202melts at the joint portion203. Since the cross section of the protrusion201dorthogonal to the projection direction is set to such a cross section, the protrusion201dfunctions as a fuse that cuts off the electrical connection of the first metal201and the second metal202when an overcurrent occurs. In the terminal component200disclosed herein, the dimensions of the protrusion201dthat functions as a fuse can be set, as appropriate, according to the assumed overcurrent, metal types of the first metal201and the second metal202, and the like. An example will be described below. Described hereinbelow is the setting of the dimensions of the protrusion201dwhen a cut-off current is 940 A and an energizing time is 100 sec. The first metal201having the disk-shaped protrusion201dis configured of copper, and the second metal202is configured of aluminum. A case will be considered in which the second metal202, which has a melting point lower than that of the first metal201, melts when the above-mentioned current flows through the protrusion201dof the first metal201. First, the conditions under which the second metal202, which has a melting point lower than that of the first metal201, melts will be considered. The heat quantity Qmrequired for the second metal202to melt is represented by Qm=m×c×ΔT by using the mass m, the specific heat c, and the temperature difference ΔT. The melting point of aluminum constituting the second metal202is 660.3° C. When the room temperature is 25° C., the temperature difference ΔT required to melt the second metal202is 635.3° C. The specific gravity ρ of aluminum is 2.7 g/cm3. The specific heat c of aluminum is 0.9 J/(g·° C.). Let S be the area of the joint portion203. In this embodiment, in the joint portion203, the second metal of 0.1 mm is melted, and the first metal201and the second metal202are disconnected. The heat quantity Qmfor melting the second metal202is expressed by the following formula. Qm=S×0.1 (mm)×2.7 (g/cm3)×0.9 (J/(g·° C.))×635.3(° C.) Next, the Joule heat generated at the protrusion201dof the first metal201will be considered. The Joule heat Qhgenerated at the protrusion201dof the first metal201is represented by Qh=R×I2×t by using the resistance value R, the current value I, and the energization time t. As described above, the assumed current value I is 940 A. The energization time t is 100 sec. The resistance value R is represented by R=ρv×L/S by using the volume resistivity ρv, the length L through which the current flows, and the cross-sectional area S through which the current flows. For example, at 20° C., the volume resistivity ρvof copper constituting the first metal201is 1.69 μΩ·cm. The length L through which the current flows is the height of the protrusion201d. The Joule heat Qhgenerated at the protrusion201dof the first metal201is expressed by the following formula. Qh=1.69 (μΩ·cm)×L/S×(940 (Å))2×100 (sec) When the Joule heat Qhgenerated at the protrusion201dof the first metal201is higher than the heat quantity Qmrequired for melting the second metal202, fusing occurs at the protrusion201d. That is, the cross-sectional area and height of the protrusion201dof the first metal201can be set so as to satisfy Qm<Qh. For example, the height of the protrusion201dof the first metal201can be 0.1 mm and the diameter can be 6 mm. At this time, when the above current flows, a Joule heat of 5.3 J is generated at the protrusion201d, and the second metal202in contact with the protrusion201dis melted to cause fusing. Contact resistance is generated in the joint portion203because the joining interface is obtained by joining dissimilar metals. Further, as the temperature of the first metal201rises, the volume resistivity of the protrusion201drises. That is, more Joule heat can be generated at the joint portion203than in the above calculation. For example, the dimensions of the protrusion201dmay be adjusted, as appropriate, by using computer simulation or by performing a preliminary test using a sample simulating the structure of the terminal component200. The terminal component200proposed herein is provided with a protrusion201dat the joining interface between the first metal201and the second metal202. The first metal201and the second metal202are joined at the top portion201d1of the protrusion201d. As described above, the cross section of the protrusion201dthat is orthogonal to the projection direction of the protrusion201dis set in at least a part thereof such that fusing occurs when a current equal to or higher than a predetermined current value flows. In this case, the terminal component200is fused when a current equal to or higher than a predetermined current value flows. Therefore, the terminal component200can have a function as a fuse. The protrusion201dmay be configured to be provided outside the battery case41. With this configuration, even when the current is concentrated in the protrusion201dand a large Joule heat is generated as compared with the surroundings, the temperature inside the battery case41is not affected. Therefore, as compared with the case where a fuse is provided inside the battery case41, it is possible to suppress the decomposition of an electrolytic solution inside the battery case41due to the heat generated by the protrusion201d. In other words, it is possible to suppress deterioration of battery performance due to heat generation in a part that functions as a fuse. In the terminal component200disclosed herein, the first metal201and the second metal202may be configured of different metals. For example, by configuring the first metal201of the same metal type as the metal type of the bus bar, the joining strength between the first metal201and the joining interface of the bus bar can be increased. By using the same metal type as the internal terminal43afor the second metal202, the joining strength between the second metal202and the internal terminal43acan be increased. In this way, by using dissimilar metals for the first metal201having a part connected to the internal terminal and the second metal202having a part exposed to the outside of the battery case, it is possible to exclude the possibility of a dissimilar metal joint location being provided at the bus bar joining interface outside the battery case. A metal joint made of dissimilar metals is formed at the joint portion203in which different metals are joined. Such a joint portion has a higher electrical resistance than a joint portion composed of the same type of metal or a portion formed by thinning a part of one type of metal. Greater Joule heat is generated at the joint portion203where different metals are joined. When the terminal component200configured of different metals and a terminal component configured of the same metal are set to the same cut-off current, the protrusion201dof the terminal component200configured of different metals can have a thicker and shorter shape. In other words, it is possible to realize stronger mechanical strength while imparting a fuse function to the protrusion201d. In the terminal component200disclosed herein, the first metal201and the second metal202are metal-joined at the top portion201d1of the protrusion. The first metal201and the second metal202are joined by so-called solid-phase joining without interposing an intermediate layer such as a solder or a brazing material. By joining the first metal201and the second metal202without interposing an intermediate layer in this way, good conduction between the first metal201and the second metal202is ensured during normal use of the battery as well. In the above-described embodiment, the first metal201includes the protrusion201d, but this embodiment is not limiting. The second metal may have a protrusion having a flat top portion, and the first metal may be joined to the protrusion. At this time, the surface of the first metal facing the second metal is preferably a flat surface. In the above-described embodiment, the protrusion has a disk shape, but this embodiment is not limiting. The protrusion may be a polygonal flat plate-shaped part such as a quadrangular prism. Further, the cross-sectional shape and area of the protrusion do not have to be constant. The cross section of the protrusion may be tapered from the proximal end of the protrusion toward the top portion. The cross section of the protrusion may be thickened from the proximal end of the protrusion toward the top portion. The terminal component and secondary battery disclosed herein have been described in various ways. Unless otherwise specified, the embodiments of the terminal component and battery mentioned herein do not limit the present disclosure. Further, the secondary battery disclosed herein can be variously modified, and constituent elements thereof and processes referred to herein can be omitted, as appropriate, or combined, as appropriate, unless a specific problem occurs. | 31,833 |
11942664 | DETAILED DESCRIPTION The following disclosure describes various embodiments of battery parts, such as battery terminals or bushings and the like, and associated assemblies and methods of manufacture and use. In one embodiment, a battery terminal configured in accordance with the present disclosure includes a body having a base portion that is configured to be embedded in battery container material when the corresponding battery container is formed. The base portion includes several torque resisting features and gripping features that resist torsional or twist loads that are applied to the battery terminal after it has been joined to the battery container. In one embodiment, for example, a through hole extends through the battery terminal, and the base portion includes a textured or knurled surface at an inner periphery portion of the base portion. The textured surface can include a plurality of alternating grooves and protrusions in a beveled interior surface of the base portion, with the grooves positioned in a helical or angled pattern. In certain embodiments, the grooves can include a first group of grooves angled or extending in a first direction and a second group of grooves angled or extending in a second direction opposite the first direction. In still further embodiments, battery terminals configured in accordance with the present disclosure can include torque resisting features including, for example, flanges, lips, and/or other projections having polygonal shapes, as well as channels, grooves, indentations, serrations, teeth, etc. configured to engage the battery container material. Certain details are set forth in the following description and inFIGS.1-8Dto provide a thorough understanding of various embodiments of the disclosure. Other details describing well-known structures and systems often associated with battery parts (e.g., lead and/or lead alloy battery parts, moldable battery containers, etc.), and methods for forming such parts (e.g., forming, casting, injection molding, etc.), as well as other battery parts and assemblies, are not set forth in the following disclosure to avoid unnecessarily obscuring the description of the various embodiments of the disclosure. Many of the details, dimensions, angles and/or other portions shown in the FIGURES are merely illustrative of particular embodiments of the disclosure. Accordingly, other embodiments can have other details, dimensions, angles and/or portions without departing from the spirit or scope of the present disclosure. In addition, further embodiments of the disclosure may be practiced without several of the details described below, while still other embodiments of the disclosure may be practiced with additional details and/or portions. In the FIGURES, identical reference numbers identify identical or at least generally similar elements. To facilitate the discussion of any particular element, the most significant digit or digits of any reference number refers to the FIGURE in which that element is first introduced. For example, element110is first introduced and discussed with reference toFIG.1. FIG.1Ais a front view andFIG.1Bis a side view of a battery part100configured in accordance with an embodiment of the disclosure. Referring toFIGS.1A and1Btogether, in the illustrated embodiment the battery part100comprises a battery terminal or terminal bushing. The battery part100can be formed from lead, lead alloy, and/or other suitable materials by forming (e.g., cold-forming, cold-forming with a segmented mold, hot-forming, roll-forming, stamping, etc.), casting (e.g., die casting), forging, machining, and/or other suitable methods known in the art. In one aspect of this embodiment, the battery part100includes a projecting portion or lug portion104that extends from a base portion103. The battery part100can also include a passage or through-hole106extending through the battery part100from a first end portion101to a second end portion102. In another aspect of this embodiment, the base portion103includes a first torque-resisting feature105spaced apart from a second torque-resisting feature107by an annular channel111. In the illustrated embodiment, the first torque-resisting feature105includes a first flange112and the second torque-resisting feature107includes a second flange114. Each of the first and second flanges112and114projects from the base portion103and extends around the battery part100. In other embodiments, however, battery parts configured in accordance with the present disclosure can include one or more flanges that extend only partially around the base portion103of the battery part100. Each of the first and second flanges112and114is configured to resist torsional or twist loads that are applied to the battery part100after it has been joined to a battery container (as described in more detail below). More particularly, in the illustrated embodiment the first flange112has a polygonal shape (e.g., a dodecagonal shape) with a plurality of flat, or at least generally flat, side portions113a-l. Similarly, the second flange114also has a polygonal shape (e.g., a dodecagonal shape) with a plurality of flat, or at least generally flat, side portions115a-l. Accordingly, the first and second flange portions112and114of the illustrated embodiment have non-circular peripheries that are configured to enhance the ability of the battery part100to resist torsional loads during use. In other embodiments, however, battery parts configured in accordance with the present disclosure can include more or fewer flanges (e.g., torque flanges) or flange portions having other shapes, including those, for example, disclosed in International Patent Application No. PCT/US2008/064161, titled “Battery Parts and Associated Methods of Manufacture and Use,” filed May 19, 2008, which is incorporated herein by reference in its entirety. These flange or flange portion shapes can include, for example, polygons (e.g., octagons, hexagons, pentagons, squares, rectangles, triangles, etc.), rectilinear shapes, curvilinear shapes, non-circular shapes, circular or partially-circular shapes, symmetrical shapes, non-symmetrical shapes, irregular shapes, saw-tooth shapes, sun-burst shapes, star patterns, cross-shapes, peripheral teeth, serrations, flat surface portions, angular surface portions, concave surface portions, convex surface portions, etc. Battery parts configured in accordance with the present disclosure can also include other torque-resisting features such as other types of flanges, portions of flanges, lips, protrusions, and/or other projections that extend around, or at least partially around, the battery part100with non-circular peripheries. Such torque-resisting features can also include recessed portions or indentations in the battery part100. In addition, in various embodiments the first flange112can have a different shape than the second flange114. Accordingly, the present disclosure is not limited to dodecagonal-shaped or polygonal-shaped torque resisting flanges, but extends to other flanges, flange portions and other torque resisting features having other shapes. Additionally, other embodiments of the disclosure can include battery terminals, terminal bushings, and other battery parts having configurations that may differ from that illustrated inFIGS.1A and1B. For example, battery terminals and other battery parts having lugs and/or other features that may differ from that shown inFIGS.1A and1Bcan also include aspects of the present disclosure disclosed herein. According to another feature of the embodiment illustrated inFIGS.1A and1B, the battery part100includes other torque resisting features in addition to the shapes of the first flange112and the second flange114. For example, the second flange114includes a serrated or tooth-like edge portion facing the first flange112. More specifically, the second flange114includes a plurality of recesses or grooves117a-npartially extending through the second flange114. For example, as shown inFIG.1C, which is an enlarged detail view of a portion of the battery part100ofFIG.1A, the illustrated groove117ahas an upside down U-shaped configuration with a slanted or beveled sidewall125extending from the first side portion115atoward the channel111. Referring again toFIGS.1A and1B, in the illustrated embodiment and as also described below with reference toFIG.2A, the grooves117a-nextend through the second flange114in the same direction and at least generally parallel to one another. In other embodiments, however, the grooves117a-ncan extend in other directions including, for example, radially inwardly towards the base portion103. The grooves117a-nare configured to engage or otherwise grip the battery container material that is molded around the second flange114to at least partially prevent the battery part100from twisting or otherwise moving in the battery container. In a further aspect of this embodiment, the base portion103includes a sealing portion109positioned between the first flange112and the second flange114. In the illustrated embodiment, the sealing portion109includes the annular channel111that extends around the base portion103. The sealing portion109, in combination with the first and second flanges112and114, can interface with the battery container material that is molded around them to form a torturous path-type seal to inhibit or prevent electrolyte or acid from escaping the battery container. In other embodiments, battery parts configured in accordance with the present disclosure can include other types of sealing portions, sealing rings, and/or other sealing features that extend around, or at least partially around the base portion103. According to yet another feature of this embodiment, the battery part100includes a stepped cavity that forms the through-hole106extending through the base and lug portions103and104. More specifically, in the illustrated embodiment, a first cavity121extends from the base portion103partially into the lug portion104. The first cavity121has a tapered cylindrical or generally frustoconical shape that is axially aligned with a second cavity123in the lug portion104. The second cavity123extends from the first cavity121through the remainder of the lug portion104towards the second end portion102. The second cavity123also has a tapered cylindrical or generally frustoconical shape with a tapering cross-sectional dimension or diameter that is smaller than a corresponding tapering diameter of the first cavity121. The through-hole106includes a stepped portion or shoulder127at the interface between the first and second cavities121and123. As explained in detail below, when the battery part100is at least partially embedded in the battery container material, the battery container material can flow into the battery part100adjacent to a portion of the first cavity121up to the shoulder127. In the illustrated embodiment, the base portion103also includes a plurality of gripping features130(shown in broken lines inFIGS.1A and1B) forming a textured or knurled surface at the inner periphery portion of the base portion103. As described in more detail below, the gripping features130are configured to grip or otherwise engage the material of the battery container and/or resist torque when the battery part100is embedded in a battery container. FIG.2Ais a top end view andFIG.2Bis a bottom end view of the battery part100illustrated inFIGS.1A-1C. Referring first toFIG.2A, as shown in the illustrated embodiment, the grooves117a-n(shown in broken lines) in the second flange114extend in the same direction and are at least generally parallel to one another. In this manner, the depth of each groove117into the second flange114towards the base portion103(e.g., in a direction generally perpendicular to a longitudinal axis of the battery part100) varies around the periphery of the second flange114. As noted above, however, in other embodiments, the grooves117can extend in other directions, including, for example radially outward from the battery part100. In addition, more or less grooves117than those illustrated inFIG.2Acan extend into the second flange114. Referring next toFIG.2B, in the illustrated embodiment the gripping features130include a plurality of teeth or protrusions positioned between adjacent grooves, notches, or channels that form a textured or knurled surface231around the inner periphery portion of the base portion103(e.g., at the inner diameter of the lower portion of the first cavity121). More specifically, the gripping features130include a first group232of alternating grooves234and protrusions235extending around at least approximately 180 degrees of the inner periphery of the base portion103. The gripping features130also include a second group236of alternating grooves238and protrusions239extending around at least approximately the remaining 180 degrees of the inner periphery of the base portion103. According to one feature of the illustrated embodiment, the grooves234in the first group232are generally the same as the grooves238in the second group236, with the exception that the grooves238in the second group are arranged in a helical pattern that is opposite a helical pattern of the grooves234in the first group232(i.e., the grooves234and238of the first and second groups232and236are angled or slanted in opposite directions). More specifically, each of the grooves234and238can be formed in the shape of a segment of a helix (e.g., generally similar to the pattern of teeth in a helical gear), with the grooves234in the first group232at an angle that is opposite or otherwise different from the grooves238in the second group236. In other embodiments, however, all of the grooves234and238can extend in generally the same direction or pattern (e.g., clockwise, counterclockwise, etc.), or different portions or groups of the grooves234and238can extend in different directions. Moreover, in still further embodiments the gripping features130(e.g., the grooves234and238and the protrusions235and239) can be straight, rather than arranged in a helical pattern around the inner periphery of the base portion103. Further aspects of the gripping features130are described in detail below with reference toFIGS.3A and3B. FIG.3Ais a partial side cross-sectional view of the battery part100illustrated inFIGS.1A-2B, taken substantially along line3A-3A inFIG.2A. This view illustrates the gripping features130that form the textured (e.g., knurled, serrated, notched, saw-tooth, indented, etc.) surface around an inner periphery331of the base portion103. For example,FIG.3Aillustrates the second group236of grooves238and protrusions239that are formed in an inner surface of the first cavity121. Moreover, the inner periphery331of the base portion103further includes an inclined or beveled face339extending radially outward from an inner surface337of the first cavity121towards a bottom surface340of the battery part100. Each groove238extends through a portion of the inner surface337and the beveled surface339and is angled or slanted at an angle B relative to a longitudinal axis L of the battery part100. In certain embodiments, the angle B can be from about 15 degrees to about 35 degrees, or about 25 degrees. In other embodiments the angle B can have other dimensions. Although the illustrated gripping features130are described herein as alternating channels or grooves236and238and corresponding protrusions235and239, one skilled in the art will appreciate that the gripping features can include any forms or shapes that collectively form the textured surface at the inner periphery331of the base portion103. For example, the gripping features130can include grooves, channels, recesses, holes, indentations, depressions, notches, teeth, serrations, bumps, etc., to create the textured beveled face339and/or inner periphery331. Moreover, the gripping features130can be arranged in any pattern, including, for example, non-helical patterns, symmetrical patterns, non-symmetrical patterns, etc. As also shown inFIG.3A, the through-hole106has the largest cross-sectional dimension or diameter at the bottom surface340, and the diameter of the through-hole106tapers or decreases along the beveled face339, and further along the inner surface337of the first cavity121and an inner surface335of the second cavity123towards the second end portion102of the battery part100. According to another feature of this embodiment, the battery part100includes an offset between the sizes of the first cavity121and the second cavity123. As described above, for example, the battery part100includes the shoulder127at the interface between the first cavity121and the second cavity123. Accordingly, an extension line342(shown in broken lines) extending from the inner surface335of the second cavity123is spaced apart from the inner surface337of the first cavity121by a width W. As described in detail below, when the battery part100is encased in battery container material with a mold part or plug positioned in the battery part100, the battery container material can flow into a portion of the first cavity121to at least partially fill-in the width W between the inner surface337of the first cavity121and the extension line342up to the shoulder127. Moreover, and as also described below, the gripping features130can at least partially facilitate the flow of the battery container material into the first cavity121, as well as grip or otherwise engage the battery container material to prevent the battery part100from twisting or moving in the battery container. FIG.3Bis a partial isometric end view of the battery part100further illustrating several of the features described above. For example, as shown inFIG.3B, the battery part100includes the gripping features130at the inner diameter or inner periphery331of the base portion103. More specifically, the grooves234and238, and corresponding protrusions235and239, extend from the bottom surface340along the beveled surface339to the inner surface337of the first cavity121. Accordingly, the gripping features130form the textured or knurled inner periphery331of the battery part100.FIG.3Balso illustrates the shoulder127at the interface of the first cavity121and the second cavity123. FIGS.4A-4Care a series of views illustrating several features of a battery assembly440configured in accordance with an embodiment of the disclosure. Referring first toFIG.4A,FIG.4Ais a partial cut-away isometric side view of the battery assembly440including the battery part100(i.e., the battery part100described above with reference toFIGS.1A-3B) fixedly attached to a battery casing or container442so that the lug portion104is exposed and accessible. The battery container442can be formed from a moldable material448, such as polypropylene, polyethylene, other plastics, thermoplastic resins, and/or other suitable materials known in the art. During manufacture of the battery assembly440, molten container material448can be flowed around the base portion103of the battery part100so that the first flange112is embedded in the container material448, and the second flange114is embedded in the container material448adjacent to an outer surface portion444. The container material448also molds around the base portion103to create a seal that can prevent or at least inhibit liquid (e.g., electrolyte, acid, water, etc.) from escaping the battery container442. Moreover, the container material448also flows and/or molds around the torque resisting features and characteristics of the base portion103described above to prevent the battery part100from twisting or moving in the battery container442when an external force is applied. According to another feature of this embodiment, and as noted above, the container material448can also flow and mold around a portion of the interior of the battery part100. More specifically, at this stage in the manufacturing, the battery assembly400includes a mold plug or die member450received in the through-hole106of the battery part100. The die member450substantially fills the second cavity123(FIGS.1A and1B) and contacts the inner surface106of the lug portion104, however, there is a gap in the first cavity121between the die member450and the inner surface337of first cavity121of the battery part100(see, e.g.,FIG.3Aillustrating the gap G having a width W, andFIG.5). Accordingly, the container material448can flow into the first cavity121and at least partially fill the first cavity121between the die member450and the battery part100. After the battery part100has been secured to the battery container442as illustrated inFIG.4A, the die member450is removed from the through-hole106. The through-hole106can then be filled with molten lead or other suitable material to form a mechanical and electrical connection between the battery part100and a battery grid (not shown) within the battery container442. FIG.4Bis a partially exploded view, andFIG.4Cis a fully exploded view of the battery assembly400. The battery assembly400is shown in the partially exploded and exploded views for purposes of illustrating several features of the engagement or interface of the container material448with the battery part100. For example, referring toFIGS.4B and4Ctogether, the container material448includes a wall portion460that extends into the battery part100(and surrounds the die member450when the die member is positioned in the battery part100) adjacent to the inner surface337of the first cavity121(FIG.3A). The wall portion460is formed when the container material flows into the gap between the inner surface337of the first cavity121and the die member450. In certain embodiments, the wall portion460has a height that corresponds to the height of the shoulder127at the interface between the first and second cavities121and123of the battery part100(FIG.3A). In other embodiments, the container material may not completely fill the gap between the battery part100and the die member450. FIG.5is a partial side cross-sectional view of a completed battery assembly570configured in accordance with another embodiment of the disclosure. In the illustrated embodiment, the battery part100is fixedly attached to the moldable material448of the battery container442. The battery assembly570also includes a lead anode or conductor572that is mechanically and electrically connected to the battery part100. More specifically, the conductor572fills the through-hole106and can be connected to a battery grid (not shown) positioned within the battery container442. According to one aspect of this embodiment, an exterior surface574of the conductor572is spaced apart from the inner surface337of the first cavity121by a gap having a width W. However, as described above with reference toFIGS.4A-4C, the wall portion460of the mold material448is positioned adjacent to the inner surface337of the first cavity121to fill the gap between the conductor570and the battery part100. In certain embodiments and as shown inFIG.5, the wall portion460completely fills the gap and extends to the shoulder127of the battery part. In other embodiments, however, the mold material448may only partially fill the gap between the conductor572and the battery part100. One advantage of the embodiments described above with reference toFIGS.1A-5is that the gripping features130forming the textured surface at the inner periphery portion of the base portion103may advantageously reduce the amount of lead required to make the battery part100. Moreover, the grooves234and238of the gripping features130also advantageously facilitate the flow of the battery container material448adjacent to the inner surface337of the first cavity121when the battery part100is embedded in the battery container442. In addition, the gripping features130may also engage the battery container material448and at least partially prevent the battery part100from twisting (e.g., in a clockwise direction and/or a counter clockwise direction) in the battery container442and/or from otherwise loosening or moving in the battery container442. FIG.6Ais a front view of a battery part600configured in accordance with another embodiment of the disclosure.FIG.6Bis a partial side cross-sectional view of the battery part600ofFIG.6A. Referring toFIGS.6A and6Btogether, the battery part600includes several features that are at least generally similar in structure and function to the corresponding features of the battery parts described above with reference toFIGS.1A-5. For example, the battery part600illustrated inFIGS.6A and6Bincludes a projecting portion or lug portion604extending from a base portion603, and a through-hole606extending longitudinally through the battery part600. The base portion603includes a first torque-resisting feature605spaced apart from a second torque-resisting feature607by an annular channel611. The first torque-resisting feature605includes a first flange612and the second torque-resisting feature607includes a second flange614. The first flange612can have a polygonal shape and can include a plurality of flat, or at least generally flat, side portions615. The second flange614can include a plurality of recesses or grooves617extending at least partially through the second flange614. The base portion603also includes a plurality of gripping features630(shown in broken lines inFIG.6A) forming a textured or knurled surface at the inner periphery portion of the base portion603. The gripping features630, in combination with the first and second torque resisting features605and607, are configured to grip or otherwise engage the material of a battery container when the battery part600is embedded in the battery container. The base portion603further includes a first sealing portion609between the first flange612and the second flange614. The first sealing portion609can include the annular channel611extending around the base portion603. The first sealing portion609, in combination with the first and second flanges612and614, can form an interface with the battery container material that is molded around them to form a torturous path-type seal to inhibit or prevent electrolyte, acid, and/or other fluids from escaping the battery container. In one aspect of the illustrated embodiment, the battery part600includes a first engaging portion676that is also configured to form a seal with the battery container material and/or engage the battery container material to prevent the battery part600from moving or loosening in the battery container. More specifically, and as illustrated in detail inFIG.6B, the second seal portion676includes an annular groove678extending between gripping projections or sealing members677(identified individually as a first gripping projection or sealing member677aand a second gripping projection or sealing member677b). In the illustrated embodiment, the sealing members677and the groove678extend around a periphery of the base portion603above the second flange614. Each of the sealing members677includes a flange or annular lip with an edge portion679(identified individually as a first edge portion679aand a second edge portion679b) extending outwardly from the base portion603. The sealing members677form a bifurcated portion of the second flange614with the edge portions679extending radially outwardly from the base portion603. In certain embodiments, and as explained in detail below, each edge portion679is at least partially deformed (e.g., crimped) or otherwise deflected or directed towards the opposing edge portion679. For example, the first engaging portion676can include a first dimension D1between the edge portions679of the sealing members677that is less than a second dimension D2of the groove678, the second dimension D2spanning across the largest opening or dimension in the groove678. Due to the deformed or crimped edge portions679, the inner surfaces of the sealing members677facing the groove678are at least partially curved and non-planar. The first sealing member677aalso includes a stepped or shoulder portion680that is adjacent to a lateral face681extending radially away from the lug portion604. According to yet another feature of the illustrated embodiment, the battery part600includes a second engaging portion682at a stepped or shoulder portion627of the through-hole606. More specifically, the through-hole606includes a first cavity621extending from the base portion603partially into the lug portion604. The first cavity621has a tapered cylindrical or generally frustoconical shape that is axially aligned with a second cavity623in the lug portion604. The second cavity623extends from the first cavity621through the remainder of the lug portion604. The second cavity623also has a tapered cylindrical or generally frustoconical shape with a tapering cross-sectional dimension or diameter that is smaller than a corresponding tapering diameter of the first cavity621. An extension line642(shown in broken lines) extending from an inner surface635of the second cavity623is spaced apart from an inner surface637of the first cavity121by a first width W1. The shoulder portion627of the through-hole606is located at the interface between the first cavity621and the second cavity623. At the shoulder portion627, the second engaging portion682includes a web, flange, lip, or projection683extending downwardly from the inner surface635of the second cavity623into the first cavity621. The projection683is spaced apart from the inner surface637of the first cavity621and defines a pocket or recess684therebetween. In the illustrated embodiment the projection683is deformed (e.g., crimped) or otherwise deflected or directed towards the inner surface637of the first cavity621such that an end portion of the projection683is spaced apart from the inner surface637of the first cavity621by a second width W2that is less than the first width W1. As described in detail below, when the battery part600is encased in battery container material with a mold part or plug positioned in the cavity606of the battery part600, the battery container material can flow into a portion of the first cavity621to at least partially fill the first width W1between the inner surface637of the first cavity621and the extension line642. When the battery part600is embedded in the battery container material, the second engaging portion682, including the projection683forming the pocket684at the shoulder portion627, can at least partially engage and/or retain the battery container material to prevent the battery part600from twisting or moving in the battery container. The second engaging portion682can also prevent a fluid from leaking from the battery container. FIG.6Cis a front view of the battery part600ofFIG.6A, illustrating the battery part600before forming or completing certain features of the first engaging portion676and the second engaging portion682.FIG.6Dis a partial side cross-sectional view of the battery part ofFIG.6C. Referring toFIGS.6C and6Dtogether, at this stage the edge portions679of the corresponding sealing members677have not yet been deformed or directed towards one another. More specifically, and as shown inFIG.6D, a third dimension D3between the edge portions679is greater than the second dimension D2of the groove678before the sealing members677are deformed. In addition, at the stage illustrated inFIGS.6C and6D, the projection683of the second engaging portion682has not yet been deformed or directed towards the inner surface of the first cavity621. Rather, the projection683is generally parallel with the inner surface of the second cavity623. The process of deforming or completing these features of the first and second engaging portions676and682is described in detail below with reference toFIGS.9A-9D. FIG.7is a partial side cross-sectional view of a completed battery assembly770configured in accordance with an embodiment of the disclosure. In the illustrated embodiment, the battery assembly770includes the battery part600described above with reference toFIGS.6A and6B, which is fixedly attached to moldable material748of a battery container742. The lateral face681of the base portion603is at least generally aligned with an exterior surface749of the battery container742. The battery assembly770further includes a lead anode or conductor772that is mechanically and electrically connected to the battery part600. For example, the conductor772can completely fill the second cavity623of the through-hole606and can be connected to a battery grid (not shown) positioned within the battery container742. Moreover, an exterior surface774of the conductor772is spaced apart from the inner surface637of the first cavity621by a gap having the first width W1. A wall portion760of the mold material748is molded adjacent to the inner surface637of the first cavity621to fill the gap between the conductor770and the battery part600. In the illustrated embodiment, the wall portion760extends to the shoulder portion627of the battery part600. In the illustrated embodiment, the first engaging portion676and the second engaging portion682engage or otherwise contact the mold material748to retain and seal the battery part600in the battery container742. Accordingly, the first engaging portion676and the second engaging portion682at least partially prevent the battery part600from pulling out of the battery container742and/or prevent fluid from leaking from the battery container742at the interface between the battery container742and the battery part600. More specifically, with reference to the first engaging portion676, the crimped or angled edge portions679of the sealing members677retain the mold material748in the groove678between the sealing members677. For example, as the mold material748solidifies around the base portion603of the battery part600, the sealing members677retain the mold material748in the groove678and at least partially prevent the mold material748from shrinking or retracting away from the base portion603. Similarly, the projection683of the second engaging portion682also at least partially engages and/or retains the mold material748in the recess684and adjacent to the inner surface637of the first cavity621of the battery part600. The projection683accordingly at least partially prevents the mold material748from shrinking or retracting out of the pocket684. FIG.8Ais a cross-sectional side view of an assembly885for forming a battery part in accordance with an embodiment of the disclosure.FIG.8Bis an enlarged detail view of a portion of the assembly885ofFIG.8A. Referring to FIGS.8A and8B together, in the illustrated embodiment the assembly885is a forming die assembly that is used to crimp or deform the engaging features of the battery part600described above with reference toFIGS.6A-7. InFIGS.8A and8B, the battery part600is shown in the assembly885at the stage ofFIGS.6C and6Dbefore the engaging members677are crimped or deformed. The assembly885includes a first block or die member892and a second block or die member886. The first and second die members892and886are movable relative to each another in the directions indicated by arrow A (e.g., towards and away from each other). The first die member892includes a cavity893that has a first shaping or deforming surface894. The second die member886has a corresponding second shaping or deforming surface887. The first deforming surface894is aligned with the second deforming surface887. Moreover, the first and second deforming surfaces894and887are also aligned with the corresponding edge portions679of the first and second sealing members677aand677bof the battery part600. As shown inFIGS.8A and8B, at this stage of the processing, the first die member892is spaced apart from the second die member886by a gap G. The second die member886receives a sleeve888, which in turn receives a plunger or core889. The core889includes an end portion890having a third crimping or deforming surface891. The third deforming surface891can be a tapered or angled shoulder of the end portion890of the core889to crimp or deform the extension683of the second engaging portion682. The core889is movable relative to the first and second die members892and886in the directions indicated by arrow A. To form the crimped or deformed features of the battery part600, the battery part600is positioned in the assembly885as shown inFIGS.8A and8B. More specifically, the battery part600is positioned between the first die member892and the second die member886, with the end portion890of the core889inserted into the battery part600. At this stage in the manufacturing, the first deforming surface894of the first die member892contacts the first sealing member677a, the second deforming surface887of the second die member886contacts the second sealing member677b, and the third deforming surface891of the core889contacts the extension683. In one embodiment, when the first die member892drives the battery part600towards the second die member886and the core889, the first deforming surface894deforms the edge portion679of the first sealing member677aand the second deforming surface887deforms the edge portion679of the second sealing member677b(as shown inFIGS.8C and8D). More specifically, when the first die member892moves towards the second die member886, the first and second deforming surfaces894and887form an annular groove around the battery part600that deflects or otherwise deforms (e.g., plastically deforms) the edge portions679of the sealing members677towards one another. Moreover, the third deforming surface891of the core889simultaneously deforms the extension683. More specifically, as the core889is further inserted into the battery part600, the extension683deflects or otherwise deforms (e.g., plastically) along the tapered third deforming surface891. As will be appreciated by those of ordinary skill in the art, the first die member892, the second die member886, the sleeve888, and the core889can all be independently movable relative to one another to crimp or deform the features of the battery part600(e.g., the core889, sleeve888, and/or second die member886can independently move towards the first die member892). Moreover, as will also be appreciated by those of ordinary skill in the art, any of the components of the assembly885can be sized and/or interchanged with other components according to the size and specification of the battery part600. FIG.8Cis a cross-sectional side view of an assembly885after the assembly885has crimped or deformed the sealing members677and the extension683of the battery part600.FIG.8Dis an enlarged detail view of a portion of the assembly885ofFIG.8C. Referring toFIGS.8C and8Dtogether, with the movable components of the assembly885in the illustrated closed or deforming position (e.g., with the first die member892contacting the second die member886and/or the core889), the sealing members677and the extension683have been crimped or deformed to provide the sealing and engaging features of these components as described above with reference toFIGS.6A-7. The various battery parts described above can be manufactured from lead, lead alloys, and/or other suitable materials known to those of ordinary skill in the art. In addition, these parts can be manufactured by any suitable manufacturing method such as die casting, cold forming, die forming, die bending, roll forming, stamping, forging, machining, etc. For example, in one embodiment, the battery parts described herein can be formed by cold-forming with a segmented mold, such as a segmented mold having two segments. In addition, various embodiments of the battery parts described herein can be formed in accordance with methods disclosed in, and can include features at least generally similar to, those disclosed in U.S. Pat. No. 5,349,840, which is incorporated herein in its entirety by reference. From the foregoing, it will be appreciated that specific embodiments of the disclosure have been described herein for purposes of illustration, but that various modifications may be made without deviating from the spirit and scope of the various embodiments of the disclosure. For example, although many of the FIGURES described above illustrate battery parts having cylindrical portions (e.g., cylindrical lug portions, base portions, through-holes, etc.), in other battery parts configured in accordance with the present disclosure these portions can have one or more flat sides and/or other non-cylindrical surfaces. Further, while various advantages associated with certain embodiments of the disclosure have been described above in the context of those embodiments, other embodiments may also exhibit such advantages, and not all embodiments need necessarily exhibit such advantages to fall within the scope of the disclosure. | 40,742 |
11942665 | DESCRIPTION OF EMBODIMENTS A separator member for a fuel cell according to each embodiment of the present disclosure, and a method of manufacturing the separator member are described in detail below. The following embodiments merely exemplify the present disclosure, and are not intended to limit the present disclosure to the following contents. The present disclosure may be appropriately modified and carried out within the scope of the gist of the present disclosure. The separator member for a fuel cell of the present disclosure is preferably used as a member for a separator included in a fuel cell. The separator member for a fuel cell in the present disclosure refers to a member before the member is worked into a separator for a fuel cell. Embodiment 1 (Configuration of Separator Member10for Fuel Cell) A separator member10for a fuel cell of Embodiment 1 includes a first resin layer including a resin, and a graphite layer that is layered on the first resin layer, and substantially made of graphite, wherein the layering amount of the graphite layer is 50 g/m2or less, and the volume resistivity of the graphite is 3 mΩ·cm or less. FIG.1is a schematic cross-sectional view illustrating the separator member10for a fuel cell. The separator member10for a fuel cell includes a configuration in which graphite layers11are layered on both faces of a first resin layer13. The first resin layer13includes a resin. The kind of the resin is not particularly limited as long as the first resin layer13of the separator member for a fuel cell can be made of the resin, and the resin enables the separator member for a fuel cell to be worked into a separator for a fuel cell. Examples of the resin include a thermosetting resin composition or a thermoplastic resin composition. Examples of the thermosetting resin composition include an epoxy-based resin composition containing epoxy resin as a main agent, a phenol-based resin composition containing a phenol resin as a main agent, a polyimide-based resin composition containing a thermosetting polyimide resin as a main agent, a melamine-based resin composition containing a melamine resin as a main agent, a urethane-based resin composition containing a urethane resin as a main agent, a diallyl phthalate-based resin composition containing a diallyl phthalate resin as a main agent, an unsaturated polyester-based resin composition containing an unsaturated polyester resin as a main agent, and a cyanate ester-based resin composition containing as a cyanate ester resin as a main agent. Such an epoxy-based resin composition is preferred from the viewpoint of heat resistance, durability, and workability, as well as adhesion between the first resin layer13and the graphite layers11. Examples of the thermoplastic resin composition include an acrylic-based resin composition containing an acrylic resin as a main agent, a polyacrylonitrile-based resin composition containing a polyacrylonitrile resin as a main agent, a polyimide-based resin composition containing a thermoplastic polyimide resin as a main agent, a polyamide-based resin composition containing a polyamide resin as a main agent, a polyethersulfone-based resin composition containing a polyethersulfone resin as a main agent, a phenoxy-based resin composition containing a phenoxy resin as a main agent, a polypropylene-based resin composition containing a polypropylene resin as a main agent, a polycarbonate-based resin composition containing a polycarbonate resin as a main agent, a polyethylene-based resin composition containing a polyethylene resin as a main agent, a polyester-based resin composition containing a polyester resin as a main agent, an acrylonitrile-butadiene-styrene-based resin composition containing an acrylonitrile-butadiene-styrene (ABS) resin as a main agent, a polystyrene-based resin composition containing a polystyrene (PS) resin as a main agent, a polyphenylene sulfide-based resin composition containing a polyphenylene sulfide (PPS) resin composition as a main agent, and a polyamide-imide-based resin composition containing a polyamide-imide (PAD resin as a main agent. The polyethersulfone-based resin composition and the polypropylene-based resin composition are preferred from the viewpoint of heat resistance, durability, and workability, as well as adhesion between the first resin layer13and the graphite layers11. A conductive material may be added to the resin of the first resin layer13from the viewpoint of increasing the conductivity of the separator member10for a fuel cell. Examples of the conductive material include artificial graphite, natural graphite, carbon black, carbon fiber, and carbon nanotube (CNT). Use of artificial graphite and/or natural graphite is preferred from the viewpoint of conductivity and a cost. Assuming that the total mass of the resin is 100 parts by mass on a solid content basis, the amount of added conductive material is preferably 40 to 90 parts by mass, more preferably 60 to 90 parts by mass, and still more preferably 60 to 85 parts by mass from the viewpoint of workability. The thickness of the first resin layer13is preferably 100 to 800 μm, depending on the thickness of the separator for a fuel cell itself, and is 100 to 700 μm from the viewpoint of thinness and workability. The graphite included in the graphite layers11is not particularly limited, and is preferably natural graphite from the viewpoint of reducing a volume resistivity to a low level. The graphite is more preferably expanded graphite from the viewpoint of enabling the graphite layer having a uniform and small thickness to be made. The volume resistivity of the graphite is preferably 3 mΩ·cm or less, and more preferably 1 mΩ·m or less, from the viewpoint of securing the conductivity of the separator for a fuel cell. The layering amount of each of the graphite layers11is 50 g/m2or less, preferably 0.3 to 50 g/m2, and more preferably 0.5 to 30 g/m2, from the viewpoint of thinness and workability. The thickness of each of the graphite layers11is preferably 0.1 μm or more and 50 μm or less from the viewpoint of conductivity and workability. The thickness of each of the graphite layers11is more preferably 0.2 μm or more and 15 μm or less from the viewpoint of conductivity and thinning. The thickness of each of the graphite layers11refers to the thickness of the graphite layer after the separator member10for a fuel cell has been worked into a separator for a fuel cell. The graphite layers11are substantially made of graphite. The phrase “substantially made of graphite” refers to a state in which the amount of nonconductive material present in each of the graphite layers11is small enough for the conductivity of the separator member10for a fuel cell to be prevented from being inhibited. Specifically, the phrase “substantially made of graphite” refers to a state in which a material included in each of the graphite layers11includes 95% by weight or more of graphite having a volume resistivity of 3 mΩ·cm or less. The separator member10for a fuel cell of Embodiment 1 is described by taking, as an example, the configuration in which the graphite layers11are layered on the both faces of the first resin layer13. However, a separator member10for a fuel cell may include a configuration in which a graphite layer11is layered only on one face of the first resin layer13. In another configuration of a separator member10for a fuel cell, another layer may be layered between a first resin layer13and a graphite layer11. The other layer may be a single layer or a multilayer. For example, in the case of the single layer, a resin included in the single layer may be the same as or different from the resin of the first resin layer13. When the resin included in the single layer is different from the resin included in the first resin layer13, the resin included in the first resin layer13includes a thermoplastic resin composition, and the other layers include a thermosetting resin composition. As a result, followability to a mold in a case in which the separator member10for a fuel cell is worked into a separator for a fuel cell is improved. (Method of Manufacturing Separator Member10for Fuel Cell) A method of manufacturing a separator member10for a fuel cell includes: a first resin layer making step of making a first resin layer13including a resin; and a graphite layer making step of making, on the first resin layer13, a graphite layer11that has a layering amount of 50 g/m2or less and is substantially made of graphite having a volume resistivity of 3 mΩ·cm or less. The first resin layer making step includes: a resin application step of applying the resin to a film subjected to mold release treatment; and a resin curing step of the first resin layer13in a semi-curing state. The graphite layer making step includes: a graphite sheet layering step of layering a graphite sheet including the graphite on the first resin layer13and pressure-bonding the graphite sheet to the first resin layer13; and a peeling step of peeling the graphite sheet from the first resin layer13after the graphite sheet layering step. FIG.2is a view for explaining the method of manufacturing the separator member10for a fuel cell. The resin application step is described with reference to the section (a) ofFIG.2. An application apparatus201applies a resin included in a first resin layer203to a mold-release-treated face of a film205subjected to mold release treatment. At least one face of the film205is preferably subjected to mold release treatment. The film205is not particularly limited as long as the film205can be peeled from the first resin layer203that has been cured. Examples of the material of the film205include plastics such as polyethylene terephthalate, polyethylene, and polypropylene, and paper. Examples of a material used in the mold release treatment include silicone-based materials and fluorine-based materials. A known application apparatus can be adopted as the application apparatus201, which is not particularly limited. For example, a die coater, a comma coater, a gravure coater, or the like can be used. Examples of a method of the application include: a method in which the application apparatus201is moved to apply the resin to the film205as illustrated in the section (a) ofFIG.2; and a method in which the film205is moved to apply the resin. The resin curing step is described with reference to the section (b) ofFIG.2. The first resin layer203becomes in a semi-curing state (B-stage state) by drying the first resin layer203. A drying machine is used for the drying. The first resin layer203is preferably heated to dry the first resin layer203. Heat drying conditions can be selected depending on the thickness of the first resin layer203, as appropriate. For example, the heat drying conditions are 40 to 200° C. and 1 to 120 minutes. The surfaces of the first resin layer203that has been dried may have tackiness (stickiness). As a result, adhesion between the first resin layer203and graphite sheets207used in the subsequent graphite sheet layering step becomes favorable. In such a case, the semi-curing state (also referred to as “B-stage state”) refers to a state in which the curing reaction of the resin does not completely proceed. Hereinafter, “semi-curing state” as used herein is used as having a meaning similar thereto. The thickness of the first resin layer203is preferably 100 μm or more from the viewpoint of improving shape followability to a mold for molding into a separator for a fuel cell, and of securing a uniform thickness. For example, when the thickness of the separator member for a fuel cell is some hundreds of micrometers, two first resin layers203of 100 μm can be produced to affix resin faces of the first resin layers203to each other to obtain the first resin layer203having a thickness of 200 by way of example. By way other example, three or more first resin layers203having a thickness of 50 to 100 μm can be produced, layered, and affixed to obtain the first resin layer203having a thickness of some hundreds of micrometers. The graphite sheet layering step is described with reference to the section (c) ofFIG.2. The film205is peeled from the first resin layer203in the semi-curing state. The graphite sheets207are layered on both faces of the first resin layer203, and the graphite sheets207are pressure-bonded to the faces by rollers209. The rollers209are moved in the face direction of a layered body206. The pressure-bonding by the rollers may be achieved by moving the layered body206. After the pressure-bonding, the layered body206is obtained. Pressurization may be performed at ordinary temperature for the pressure-bonding, and the pressure-bonding may be performed while performing heating from the viewpoint of improving the adhesion between the first resin layer203and the graphite sheets207. In addition to the method using the rollers209, for example, a method using a pressing machine is also acceptable. For pressure-bonding, pressurization may be performed at ordinary temperature, or pressurization may be performed while heating is performed. The conditions of the heating and the pressurization can be selected as appropriate depending on the thicknesses of the graphite sheets207and on the thickness of the first resin layer203. For example, conditions of 20 to 200° C. and 0.1 to 20 MPa are possible. In the graphite sheet layering step, the graphite sheets207may be separately layered on the both faces of the first resin layer203, and the graphite sheets207may be separately pressure-bonded to the faces. For example, one graphite sheet207is layered on the resin face of the first resin layer203that has been subjected to the resin curing step, and the graphite sheet207is pressure-bonded to the resin face. Then, the film205may be peeled to layer the other graphite sheet207on the exposed resin face of the first resin layer203and to pressure-bond the graphite sheet207to the resin face. Examples of the graphite sheets207include: a natural graphite sheet obtained by molding natural graphite in a sheet shape using neither a binding material nor an additive; and an artificial graphite sheet obtained by burning an organic film such as polyimide. The natural graphite sheet refers to a graphite sheet obtained by acid-treating natural graphite, rapidly heating the natural graphite until the natural graphite becomes in a high-temperature (for example, 900 to 1000° C.) state, and compressively processing the expanded natural graphite. From the viewpoint of decreasing a volume resistivity and uniformalizing a layering amount, the graphite sheets207used are preferably natural graphite sheets. The peeling step is described with reference to the section (d) ofFIG.2. A method of peeling the graphite sheets207is preferably a peeling method in which the graphite sheets207are preferably peeled from the layered body206, followed by making graphite layers210on the surfaces of the first resin layer203. Examples thereof include a method in which the graphite sheets207are peeled so that only the graphite sheets207are stripped off from an end of the layered body206. The graphite sheets207are peeled from the layered body206, and then, the graphite layers210that each have a layering amount of 50 g/m2or less and are substantially made of graphite having a volume resistivity of 3 mΩ·cm or less are made on the both surfaces of the first resin layer203. A layered body220in which the graphite layers210are made corresponds to the separator member10for a fuel cell. The graphite layers210correspond to the graphite layers11of the separator member10for a fuel cell, illustrated inFIG.1. The first resin layer203corresponds to the first resin layer13. The graphite sheets207peeled from the first resin layer203can be used plural times unless the graphite sheets207are broken. In another method of making the graphite layers210, the graphite sheets207may be wound and fixed around the outer peripheral faces of the rollers, and the rollers may be pressed against the first resin layer203to make the graphite layers210. According to this method, the first resin layer making step and the graphite layer making step can be unified in a single line, and the separator member10for a fuel cell can be continuously manufactured. Examples of other methods of making the first resin layer203include a method in which a solventless-type resin of which the viscosity is adjusted is stretched in a film shape to make the first resin layer203; and a method in which fibrous resins are deposited on a film-shaped base material by a sheet making method to make the first resin layer203. According to these methods, working is facilitated because the first resin layer203includes no solvent. Examples of another method of manufacturing the separator member10for a fuel cell include a method including: an affixing step of affixing a graphite sheet and adhesive faces of self-adhesive films to each other; a step of preparing self-adhesive films with graphite layers, in which the self-adhesive films are peeled from the graphite sheet to obtain the self-adhesive films with graphite layers; a first resin layer making step of making a first resin layer including a resin; a layering pressure-bonding step of layering the graphite layers of the self-adhesive films with the graphite layers on both faces of the first resin layer obtained in the first resin layer making step so that the graphite layers come into contact with the faces, and pressure-bonding the graphite layers to the faces; and a peeling step of peeling the self-adhesive films from a layered body obtained in the layering pressure bonding step. According to this manufacturing method, the separator member10for a fuel cell can be manufactured without changing the shape of the first resin layer even when the first resin layer is easily broken, or even when it is difficult to handle the first resin layer. A method of manufacturing a separator member10for a fuel cell in which a graphite layer11is made on one face of a first resin layer13includes, for example: a resin application step of applying a resin to a film subjected to mold release treatment; a resin curing step of making a first resin layer in a semi-curing state; a graphite sheet layering step of layering a graphite sheet including graphite on the first resin layer and pressure-bonding the graphite sheet to the first resin layer; and a peeling step of peeling the graphite sheet after the graphite sheet layering step. As a result, the separator member10for a fuel cell, in which the graphite layer11is made on the one face of the first resin layer13, can be obtained. The separator member10for a fuel cell, in which the graphite layer11is made on the one face of the first resin layer13, can be manufactured by applying another method, without limitation to the exemplified method. In accordance with the configuration of the separator member10for a fuel cell, neither recesses nor projections caused by swelling are present on a surface of the separator for a fuel cell after the separator member10for a fuel cell is worked into a separator for a fuel cell. Further, working of the separator member10for a fuel cell into the separator for a fuel cell is facilitated. Mechanisms, by which the separator for a fuel cell is not swollen and the separator member10for a fuel cell is excellent in workability, and which is presumed by the present inventors, are described. The graphite layers11, viewed from the above of the graphite layers11of the separator member10for a fuel cell, are in a state in which graphite is irregularly arranged. The state is presumed to be made when the graphite sheets are peeled. The irregular arrangement of the graphite is considered to be also caused by the shape of the graphite. The shape of the graphite is a flake shape having a principal face. Such a shape allows a certain graphite to be in a state in which the principal face of the graphite is arranged substantially in parallel to the XY plane (principal plane of graphite layer) on a surface of each of the graphite layers. Another certain graphite is in a state in which the principal face of the graphite is perpendicular to the XY plane. Another certain graphite is in a state in which the principal face of the graphite is inclined with respect to the XY plane, that is, in a state in which the principal face of the graphite is at an angle with respect to the XY plane. In such a manner, graphites of which the principal faces are oriented in various directions coexist on the surface of each of the graphite layers11. Further, gas generated in the case of curing the first resin layers is released in an open manner without remaining between the graphite layers11and the first resin layer13by combination with such irregular arrangement of graphite and the small thicknesses of the graphite layers11. As a result, swelling is presumed to be prevented from occurring in the separator member for a fuel cell. Further, the graphite included in the graphite layers11has mold release characteristics, and therefore, it is not necessary to use a mold release agent that facilitates unmolding between the separator member10for a fuel cell and a mold for molding. Since the need for the mold release agent is eliminated as described above, the deterioration of the hydrophilicity of the separator itself for a fuel cell, caused by the mold release agent, can be also suppressed. Further, regions in which the graphite and the resin included in the first resin layer13coexist are made on interfaces between the graphite layers11and the first resin layer13, and in the vicinities of the interfaces, by the pressure-bonding in the manufacturing process. As a result, adhesion between the graphite layers11and the first resin layer13is presumed to be improved. Embodiment 2 (Configuration of Separator Member30for Fuel Cell) A separator member30for a fuel cell in Embodiment 2 includes: a first resin layer including a resin; and a graphite layer substantially made of graphite. A conductive fiber base material and a second resin layer including a resin are layered between the first resin layer and the graphite layer in order in which the conductive fiber base material is closer to the first resin layer than the second resin layer. The thickness of the second resin layer is smaller than the thickness of the first resin layer. The layering amount of the graphite layer is 50 g/m2or less, and the volume resistivity of the graphite is 3 ma cm or less. FIG.3is a schematic cross-sectional view illustrating an example of the separator member30for a fuel cell in Embodiment 2. The separator member30for a fuel cell has a configuration in which conductive fiber base materials35, second resin layers33, and graphite layers31are layered on both faces of a first resin layer37in order in which the conductive fiber base materials35are closer to the first resin layer37than the second resin layers33, and the second resin layers33are closer to the first resin layer37than the graphite layers31. The first resin layer37has the same configuration as the configuration of the first resin layer13of the separator member10for a fuel cell. The second resin layers33include a resin. The kind of the resin is not particularly limited. Examples of the resin include a thermosetting resin composition or a thermoplastic resin composition. Examples of the thermosetting resin composition include an epoxy-based resin composition containing an epoxy resin as a main agent, a phenol-based resin composition containing a phenol resin as a main agent, a polyimide-based resin composition containing a thermosetting polyimide resin as a main agent, a melamine-based resin composition containing a melamine resin as a main agent, a urethane-based resin composition containing a urethane resin as a main agent, a diallyl phthalate-based resin composition containing a diallyl phthalate resin as a main agent, an unsaturated polyester resin composition containing an unsaturated polyester resin as a main agent, and a cyanate ester-based resin composition containing a cyanate ester resin as a main agent. The epoxy-based resin composition is preferred from the viewpoint of heat resistance, durability, and workability. Examples of the thermoplastic resin composition include an acrylic-based resin composition containing an acrylic resin as a main agent, a polyacrylonitrile-based resin composition containing a polyacrylonitrile resin as a main agent, a polyimide-based resin composition containing a thermoplastic polyimide resin as a main agent, a polyamide-based resin composition containing a polyamide resin as a main agent, a polyethersulfone-based resin composition containing a polyethersulfone resin as a main agent, a phenoxy-based resin composition containing a phenoxy resin as a main agent, a polypropylene-based resin composition containing a polypropylene resin as a main agent, a polycarbonate-based resin composition containing a polycarbonate resin as a main agent, a polyethylene-based resin composition containing a polyethylene resin as a main agent, a polyester-based resin composition containing a polyester resin as a main agent, an acrylonitrile-butadiene-styrene-based resin composition containing an acrylonitrile-butadiene-styrene (ABS) resin as a main agent, a polystyrene-based resin composition containing a polystyrene (PS) resin as a main agent, a polyphenylene sulfide-based resin composition containing a polyphenylene sulfide (PPS) resin composition as a main agent, and a polyamide-imide-based resin composition containing a polyamide-imide (PAD resin as a main agent. The polyethersulfone-based resin composition and the polypropylene-based resin composition are preferred from the viewpoint of heat resistance, durability, and workability. The resin included in the second resin layers33may be the same as a resin included in the first resin layer37, or may be different from the resin included in the first resin layer37. From the viewpoint of holding the shape of a separator for a fuel cell without allowing the second resin layers33closer to surface layers to be deformed by heat, it is preferable that the resin included in the first resin layer37is a thermoplastic resin composition, and the resin included in the second resin layers33is a thermosetting resin composition. The resin included in the second resin layers33may contain a conductive material from the viewpoint of enhancing the conductivity of the separator member30for a fuel cell. Examples of the conductive material include artificial graphite, natural graphite, carbon black, carbon fibers, and a carbon nanotube (CNT). The artificial graphite and/or the natural graphite are preferably used from the viewpoint of conductivity and a cost. The second resin layers33may include conductive short fibers. The thickness of each of the second resin layers33is smaller than the thickness of the first resin layer37. The thickness is preferably 3 to 100 μm, and is 5 to 50 μm from the viewpoint of thinness and workability. The graphite layers31are substantially made of graphite. The phrase “substantially made of graphite” refers to a state in which the amount of nonconductive material present in each of the graphite layers31is small enough for the conductivity of the separator member30for a fuel cell to be prevented from being inhibited. Specifically, the phrase “substantially made of graphite” refers to a state in which a material included in each of the graphite layers31includes 95% by weight or more of graphite having a volume resistivity of 3 mΩ·cm or less. The conductive fiber base materials35are not particularly limited as long as each of the conductive fiber base materials35has a sheet shape and is a fiber material having conductivity. Short fibers having conductivity and non-woven fabrics both having conductivity are preferred from the viewpoint of enhancing the strength and elastic modulus of the separator member30for a fuel cell. Fibers included in the non-woven fabrics may be not only a single kind of fibers but also several kinds of fibers. Examples of the short fibers and the fibers included in non-woven fabrics include carbon fibers, glass fibers, chemical fibers such as polyester, and fibers derived from minerals such as alumina and silica. Carbon fibers, polyester fibers, and polyphenylene sulfide (PPS) fibers are preferred from the viewpoint of heat resistance and chemical resistance. A non-woven fabric including carbon fibers is further preferred from the viewpoint of allowing the conductivity of the separator member30for a fuel cell to be favorable and enhancing the elastic modulus of the separator member30for a fuel cell. The conductive fiber base materials35included in the separator member30for a fuel cell are located at positions closer to the surface layers than the first resin layer37, whereby a separator itself for a fuel cell can be inhibited from cracking when the separator member30for a fuel cell is worked into the separator for a fuel cell, or when a fuel cell is used. The weight of each of the conductive fiber base materials35is preferably 5 to 200 g/m2, and more preferably 5 to 50 g/m2, from the viewpoint of workability. The separator member30for a fuel cell may has, as another configuration, a configuration in which a conductive fiber base material35, a second resin layer33, and a graphite layer31are layered only on one face of the first resin layer37in order in which the conductive fiber base material35is closer to the first resin layer37than the second resin layer33, and the second resin layer33is closer to the first resin layer37than the graphite layer31. (Method of Manufacturing Separator Member30for Fuel Cell) A method of manufacturing a separator member30for a fuel cell includes: a first resin layer making step of making a first resin layer including a resin; a second resin layer making step of making a second resin layer in a semi-curing state, including a resin and having a thickness that is smaller than the thickness of the first resin layer; a conductive fiber base material layering step of layering a conductive fiber base material on the second resin layer and pressure-bonding the conductive fiber base material to the second resin layer by heating; a graphite layer making step of making a graphite layer that has a layering amount of 50 g/m2or less, and is substantially made of graphite having a volume resistivity of 3 mΩ·cm or less on a resin face of the second resin layer, on which the conductive fiber base material is layered; and a first resin layer layering step of layering the first resin layer on the conductive fiber base material of the second resin layer, and heating and pressurizing the first resin layer. The first resin layer making step includes: a resin application step of applying the resin to a film subjected to mold release treatment; and a resin curing step of making the first resin layer in a semi-curing state. The second resin layer making step includes: a second resin application step of applying the resin to a film subjected to mold release treatment; and a second resin curing step of making the second resin layer in a semi-curing state. The graphite layer making step includes: a graphite sheet layering step of layering a graphite sheet including the graphite on a resin face of the second resin layer, on which the conductive fiber base material is layered, and pressure-bonding the graphite sheet to the resin face; and a peeling step of peeling the graphite sheet after the graphite sheet layering step. FIGS.4A to4Care views for describing the method of manufacturing the separator member30for a fuel cell. The resin application step is described with reference to the section (a) ofFIG.4A. An application apparatus401applies a resin included in a first resin layer402to a mold-release-treated face of a film403subjected to mold release treatment. The same film as the film205used in Embodiment 1 can be used as the film403. The same application apparatus as the application apparatus201used in Embodiment 1 can be used as the application apparatus401. The resin curing step is described with reference to the section (a-1) ofFIG.4A. The first resin layer402is preferably dried by heating the first resin layer402using a drying machine. Heat drying conditions can be selected depending on the thickness of the first resin layer402, as appropriate. For example, the heat drying conditions are 40 to 200° C. and 1 to 120 minutes. The first resin layer402that has been dried is in a semi-curing state (B-stage state). Like the first resin layer203, a surface of the resin included in the first resin layer402may have tackiness. The second resin application step is described with reference to the section (b) ofFIG.4A. An application apparatus409applies a resin included in a second resin layer404to the mold-release-treated face of the film403subjected to the mold release treatment. The same application apparatus as the application apparatus401in the resin application step can be used as the application apparatus409. The second resin curing step is described with reference to the section of (b-1) ofFIG.4A. The second resin layer404is preferably heated and dried using a drying machine. Heat drying conditions can be selected depending on the thickness of the second resin layer404, as appropriate. For example, the heat drying conditions are 40 to 200° C. and 1 to 120 minutes. The second resin layer404that has been dried is in a semi-curing state (B-stage state). From the viewpoint of allowing the conductivity of a separator for a fuel cell to be favorable and enhancing the elastic modulus of the separator for a fuel cell, it is preferable that the thickness of the second resin layer404that has been dried is smaller than the thickness of the first resin layer402. Like the first resin layer402, a surface of the resin included in the second resin layer404may have tackiness. The conductive fiber base material layering step is described with reference to the section (c) ofFIG.4B. In a layered body420, a conductive fiber base material405is layered on a resin face of the second resin layer404layered on the film403. The layered body420is heated and pressurized by a pressing machine. The layered body420may be pressurized at ordinary temperature. The conditions of the heating and the pressurization can be selected depending on the thickness of the conductive fiber base material405and on the thickness of the second resin layer404, as appropriate. For example, the conditions of the heating and the pressurization are 20 to 350° C. and 0.1 to 50 MPa. Pressure-bonding may be performed using a roller instead of the pressing machine. The condition of the pressure-bonding may be a pressure at which the conductive fiber base material405brings into intimate contact with the surface of the second resin layer404. The pressure-bonding with heating is also acceptable. For example, conductive short fibers including carbon fibers, instead of the conductive fiber base material405, may be uniformly sprinkled on the surface of the second resin layer404, and may be then pressed against the surface. The graphite sheet layering step is described with reference to the section (d) ofFIG.4B. The film403is peeled from the layered body420, and a graphite sheet406is layered on the resin face of the second resin layer404. Then, the pressure-bonding is performed from the graphite sheet406by a roller408. When the graphite sheet406that has been pressure-bonded is peeled from the resin face of the second resin layer404, the pressure-bonding is preferably performed at a pressure at which a graphite layer is made. From the viewpoint of enhancing adhesion between the second resin layer404and the graphite sheet406, the pressure-bonding may be performed while heating. The conditions of the pressure-bonding can be selected, as appropriate, depending on the thickness of the graphite sheet406and on the thickness of the second resin layer404. For example, the conditions are 20 to 350° C. and 0.1 to 50 MPa. In addition to the method using the roller408, for example, the pressurization may be performed with a pressing machine, or the pressurization may be performed while heating. The first resin layer layering step is described with reference to the section (e) ofFIG.4B. The first resin layer402from which the film403is peeled is layered on a surface of the conductive fiber base material405included in a layered body430. Another layered body430is layered on a resin face of the first resin layer402so that a conductive fiber base material405comes in contact with the resin face, and the layered bodies430are heated and pressurized with pressing machines410. As a result, a layered body440in which the first resin layer402is layered on the conductive fiber base materials405is obtained. The conditions of the heating and the pressurization can be selected depending on the thickness of the layered body440, as appropriate. For example, the conditions are 20 to 350° C. and 0.1 to 50 MPa. The peeling step is described with reference to the section (f) ofFIG.4C. In the peeling step in the method of manufacturing the separator member30for a fuel cell, the graphite sheets406can be peeled by the same process as the peeling step in the method of manufacturing the separator member10for a fuel cell. For example, only the graphite sheets406are peeled so as to be stripped off from an end of the layered body440. The peeling of the graphite sheets406from the second resin layers404allows graphite that is part of the graphite sheets406to remain in the second resin layers404, and graphite layers407to be made to obtain a layered body450. The graphite sheets406may be peeled before the layered body440is heated and pressurized. In such a case, the first resin layer402corresponds to the first resin layer37of the separator member30for a fuel cell shown inFIG.3. The conductive fiber base materials405correspond to the conductive fiber base materials35. The second resin layers404correspond to the second resin layers33. The graphite layers407correspond to the graphite layers31. In another method of making graphite layers407, graphite sheets406may be wound and fixed around the outer peripheral surface of a roller, and the roller may be pressed against second resin layers404. As a result, the graphite layers407can be made on the second resin layers404. Examples of another method of layering a conductive fiber base material include a method in which short fibers are uniformly sprinkled on the surfaces of a first resin layer37to layer the short fibers when the short fibers are used as conductive fiber base materials35. Examples of another method include a method in which short fibers are uniformly sprinkled on resin surfaces of second resin layers33, and heated and pressurized to obtain the second resin layers33with conductive fiber base materials35in which the short fibers are layered on one face of each of the second resin layers33. With regard to such second resin layers33with conductive fiber base materials35, the second resin layers33themselves have high strength and high elastic moduli. A separator member30for a fuel cell, in which the second resin layers33with the conductive fiber base materials35are used, can be obtained by layering the second resin layers33with the conductive fiber base materials35on both faces of a first resin layer37so that the short fibers come into contact with both the faces, and by heating and pressurizing the second resin layers33with the conductive fiber base materials35. EXAMPLES The present disclosure is described in more detail with reference to Examples and Comparative Examples below. The present disclosure is not limited to Examples below. The following component was specifically used as each component included in resin compositions in Examples and Comparative Examples. (Materials of First Resin Layer) (1) Main agent A: cresol novolac type epoxy resin, epoxy equivalent of 211 g/eq (EOCN-102S-70, manufactured by Nippon Kayaku Co., Ltd.), (2) Curing agent A: novolac type phenol resin, hydroxyl equivalent of 105 g/eq (BRG-556, manufactured by Aica Kogyo Company, Limited), (3) Reinforcing agent: phenoxy resin (YP-50, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), (4) Curing accelerator A: 2-undecylimidazole (C11Z, manufactured by SHIKOKU CHEMICALS CORPORATION), (5) Internal mold release agent: carnauba wax (Carnauba Wax No. 1 Powder, manufactured by Nippon Wax Co., Ltd.), and (6) Conductive filler A: artificial graphite, average particle diameter of 25 μm (SGP-25, manufactured by SEC CARBON, LIMITED). (Graphite Sheet) (1) Graphite sheet A: thickness of 200 μm, density of 1.0 g/cm3, volume resistivity of 0.7 mΩ·cm (PF-20 manufactured by TOYO TANSO CO., LTD.), and (2) Graphite sheet B: thickness of 40 μm, density of 2.0 g/cm3, volume resistivity of 0.1 mΩ·cm (artificial graphite sheet). (Material of Second Resin Layer) (1) Main agent B: bisphenol A type epoxy resin, epoxy equivalent of 189 g/eq (JER828, manufactured by Mitsubishi Chemical Corporation), (2) Curing agent A: novolac type phenol resin, hydroxyl equivalent of 105 g/eq (BRG-556, manufactured by Aica Kogyo Company, Limited), (3) Reinforcing agent: phenoxy resin (YP-50, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), (4) Curing accelerator A: 2-undecylimidazole (C11Z, manufactured by SHIKOKU CHEMICALS CORPORATION), and (5) Conductive filler B: acetylene black (Denka Black 100% Press, manufactured by Denka Company Limited). (Conductive Fiber Base Material) (1) Carbon fiber non-woven fabric A: basis weight of 10 g/m2(CFP-010PV, manufactured by Nippon Polymer Sangyo Co., Ltd.), and (2) Carbon fiber non-woven fabric B: basis weight of 30 g/m2(CFP-030PE, manufactured by Nippon Polymer Sangyo Co., Ltd.). In Examples and Comparative Examples, production of samples, each evaluation method, and each measurement method were performed as follows. (1) Resin Sheet for First Resin Layer (1-1) Resin Composition for First Resin Layer Each of 100 parts by mass of the main agent A, 48.8 parts by mass of the curing agent A, and 35 parts by mass of the reinforcing agent was dissolved in methyl ethyl ketone, and each of the solutions was added into a container to prepare a liquid mixture. Then, each of a solution obtained by dissolving 3 parts by mass of the curing accelerator A in methanol, 560 parts by mass of the conductive filler A, and 1 part by mass of the internal mold release agent was added to the liquid mixture, the resultant was sufficiently stirred at room temperature, and methyl ethyl ketone was added to the resultant so that the resultant had a viscosity within a range of 100 to 3000 mPa·s, to obtain a resin composition for a first resin layer. (1-2) Resin Sheet for First Resin Layer The resin composition for a first resin layer was applied to a release face of a film with a thickness of 38 μm, subjected to mold release treatment (PET38X, manufactured by LINTEC Corporation) so that the dried resin composition had a thickness of 400 μm, and was then dried under conditions of 70° C. and 7 minutes to obtain resin sheets for a first resin layer. Then, two resin sheets for a first resin layer were layered so that resin faces of the resin sheets fit each other. Then, the layered resin sheets were pressure-bonded to each other under conditions of 80° C., 0.4 m/min, and 0.6 MPa using a laminating machine (VA-700, manufactured by TAISEI LAMINATOR CO, LTD.) to obtain a resin sheet for a first resin layer, having a thickness of 620 μm. (2) Resin Sheet for Second Resin Layer (2-1) Resin Composition for Second Resin Layer Each of 100 parts by mass of the main agent B, 54.5 parts by mass of the curing agent A, and 35 parts by mass of the reinforcing agent was dissolved in methyl ethyl ketone, and each of the solutions was added into a container to prepare a liquid mixture. Then, each of a solution obtained by dissolving 3 parts by mass of the curing accelerator A in methanol, and 48 parts by mass of the conductive filler B was added to the liquid mixture, the resultant was sufficiently stirred at room temperature, and methyl ethyl ketone was added to the resultant so that the resultant had a viscosity within a range of 100 to 3000 mPa·s, to obtain a resin composition for a second resin layer. (2-2) Resin Sheet for Second Resin Layer The resin composition for a second resin layer was applied to a release face of a film with a thickness of 38 μm, subjected to mold release treatment (PET38X, manufactured by LINTEC Corporation) so that the dried resin composition had a thickness of 20 μm, and was then dried under conditions of 70° C. and 3 minutes to obtain a resin sheet for a second resin layer. (3) Separator Member10for Fuel Cell A separator member10for a fuel cell was produced as described below. A graphite sheet was affixed to an adhesive face of a pressure-sensitive adhesive sheet (SPV Tape manufactured by Nitto Denko Corporation). The pressure-sensitive adhesive sheet was pressure-bonded under conditions of 80° C., 0.4 m/min, and 0.6 MPa using a laminating machine. Then, the graphite sheet was peeled from the pressure-sensitive adhesive sheet, to obtain a pressure-sensitive adhesive sheet with graphite, to which part of the graphite sheet adhered. The two pressure-sensitive adhesive sheets were prepared, respective faces, to which the graphite adhered, of the pressure-sensitive adhesive sheets were affixed to both faces of the resin sheet for the first resin layer, from which the films were peeled, and the faces were pressure-bonded under conditions of 80° C., 0.4 m/min, and 0.6 MPa. Then, the pressure-sensitive adhesive sheets were peeled to obtain the separator member10for a fuel cell, of which both faces were provided with the graphite layers. In such a case, the layering amount of the graphite layers of the separator member10for a fuel cell was 1.8 g/m2(0.9 g/m2on each face). The layering amount of the graphite layer was determined in the following procedure. Each of a resin sheet for a first resin layer, which has not yet been provided with a graphite layer, and a resin sheet for a first resin layer, which has been provided with a graphite layer, was prepared. Each resin sheet was cut in a square measuring 10 cm per side. Each of the masses of the cut resin sheets was measured. Then, the mass of the resin sheet, which has not yet been provided with the graphite layer, was subtracted from the mass of the resin sheet for a first resin layer, which has been provided with the graphite layer. A value calculated by dividing a mass, obtained by the subtraction, by the area of the cut sample was regarded as the layering amount of the graphite layer per unit area. (4) Separator Member30for Fuel Cell A separator member30for a fuel cell was produced as described below. First, a carbon fiber non-woven fabric was layered on the resin face of the resin sheet for the second resin layer, and pressure-bonded under conditions of 100° C., 0.4 m/min, and 0.6 MPa using a laminating machine. Then, the film was peeled from the resin sheet for the second resin layer, a graphite sheet was layered on the resin face, and pressure-bonded under condition of 80° C., 0.4 m/min, and 0.6 MPa, and the graphite sheet was then peeled to obtain a layered body made by layering the carbon fiber non-woven fabric, the resin sheet for the second resin layer, and the graphite layer in the order mentioned. In such a case, the layering amount of the graphite layer was 12 g/m2. The two layered bodies were prepared, the respective layered bodes were layered on both faces of the resin sheet for the first resin layer so that faces of the carbon fiber non-woven fabrics fit both the faces, and pressure-bonded under conditions of 100° C., 0.2 m/min, and 0.6 MPa to obtained the separator member30for a fuel cell. In a method of measuring the layering amount of the graphite layer in the separator member30for a fuel cell, the layering amount was determined in the same procedure as the above-described procedure of determining the layering amount of the graphite of the separator member10for the fuel cell except that the resin sheet for the first resin layer, which has not yet been provided with the graphite layer, and the resin sheet for the first resin layer, which has been provided with the graphite layer, were changed to the resin sheet for the second resin layer with the carbon fiber non-woven fabric, which has not yet been provided with the graphite layer, and the resin sheet for the second resin layer with the carbon fiber non-woven fabric, which has been provided with the graphite layer. <Measurement of Volume Resistivity> Conductivity was evaluated by measuring a volume resistivity. (1) Production of Sample for Measurement A separator member (sample) for a fuel cell, cut in 100 mm×100 mm, was prepared. A mold release agent (RIMRIKEIN-849, manufactured by Chukyo Yushi Co., Ltd.) was applied to the hot plate of a pressing machine (Manual Hydraulic-Pressure Hot Press IMC-185B (improved), manufactured by Imoto machinery Co., LTD), and the sample was placed, and press-molded under conditions of 180° C., 3 minutes, and 20 MPa, to obtain a sample for measurement of a flat plate. (2) Measurement Method The volume resistivity (mu cm) of the sample for measurement was measured using a four-point probe method (RM3545, manufactured by HIOKI E.E. CORPORATION) in conformity with JIS K7194. <Measurement of Thickness> The thickness was measured using a micrometer when the sample for measurement was produced. The thickness of the graphite layer was measured using an optical microscope. <Measurement of Strength> (1) Production of Sample for Measurement The sample produced for measuring the volume resistivity was cut to make a sample for measurement, having a width of 10 mm and a length of 20 mm. (2) Measurement Method The measurement was performed using an autograph test machine (AG-10, manufactured by SHIMADZU CORPORATION). In the measurement, a breaking load was measured by performing three-point bending (supporting-point distance of 10 mm and test rate of 2 mm/min). Strength (MPa) was calculated from the obtained breaking load in conformity with HS K7171. <Measurement of Moisture Vapor Transmission Rate> A gas barrier property was evaluated by measuring a moisture vapor transmission rate. (1) Production of Sample for Measurement The sample produced for measuring the volume resistivity was cut to make a sample for measurement, having a circular shape having a diameter of 76 mm. (2) Measurement Method The moisture vapor transmission rate (%) was measured under conditions of 40° C. and 90% RH in conformity with JIS Z0208, and determined as a value (g/m2·24 h) of a 24-hour moisture permeability amount per square meter. Evaluation criteria were as follows. Excellent: moisture vapor transmission rate of less than 13% Good: moisture vapor transmission rate of 13% or more and less than 32% Poor: moisture vapor transmission rate of 32% or more <Workability> Workability was evaluated by confirming whether or not the resin adhered to the hot plate of the pressing machine by visual observation when the sample for measurement was produced by press. Evaluation criteria were as follows. Good: No adhesion of resin to hot plate of pressing machine Poor: Adhesion of resin to hot plate of pressing machine <Swelling after Working> Whether or not the worked sample was swollen was confirmed by visual observation. Evaluation criteria were as follows. Good: No swelling, or no practical problem even with swelling Poor: Swelling and practical problem Example 1 (Separator Member10for Fuel Cell, Configuration of Graphite Layers on Both Faces) A separator member10for a fuel cell, of which both faces were provided with graphite layers, was produced according to (3) the procedure of producing the separator member10for a fuel cell. Example 2 (Separator Member10for Fuel Cell, Configuration of Graphite Layer on One Face) A separator member10for a fuel cell, of which only one face was provided with a graphite layer, was produced according to (3) the procedure of producing the separator member10for a fuel cell. Example 3 (Separator Member30for Fuel Cell, Configuration of Graphite Layers on Both Faces) A separator member30for a fuel cell, of which both faces were provided with graphite layers, was produced according to (4) the procedure of producing the separator member30for a fuel cell using the carbon fiber non-woven fabric A as a carbon fiber non-woven fabric. Example 4 (Separator Member30for Fuel Cell, Configuration of Graphite Layers on Both Faces) A separator member30for a fuel cell, of which both faces were provided with graphite layers, was produced according to (4) the procedure of producing the separator member30for a fuel cell using the carbon fiber non-woven fabric B as a carbon fiber non-woven fabric. Comparative Example 1 (Separator Member10for Fuel Cell without any Graphite Layer) A resin sheet for a first resin layer, having a thickness of about 360 μm, was produced according to (1-2) the procedure of producing the resin sheet for the first resin layer. The resin sheet was used as a separator member10for a fuel cell without any graphite layer. Comparative Example 2 (Separator Member10for Fuel Cell, Layering Amount of Graphite Layer is More than 200 g/m2) A resin sheet for a first resin layer, having a thickness of 100 μm, was produced according to (1-2) the procedure of producing the resin sheet for the first resin layer. The graphite sheets A were layered on both faces of the resin sheet, and pressure-bonded to both the faces under conditions of 80° C., 0.2 m/min, and 0.6 MPa to produce a separator member10for a fuel cell including a graphite layer having a layering amount of 200 g/m2on one face. Comparative Example 3 (Separator Member10for Fuel Cell, Layering Amount of Graphite Layer is More than 80 g/m2) A resin sheet for a first resin layer, having a thickness of 550 μm, was produced according to (1-2) the procedure of producing the resin sheet for the first resin layer. The graphite sheets B were layered on both faces of the resin sheet, and pressure-bonded to both the faces under conditions of 80° C., 0.2 m/min, and 0.6 MPa to produce a separator member10for a fuel cell including a graphite layer having a layering amount of 80 g/m2on one face. TABLE 1ComparativeComparativeComparativeExample 1Example 2Example 3Example 4Example 1Example 2Example 3Thickness (μm) of sample364351375407361400403layering amount (g/m2) of0.90.912.412.7020080graphite layer (on one face)Thickness (μm) of graphiteUnmeasurableUnmeasurable3628017144.7layer (on one face),(theoretical(theoretical*measured with optical microscopevalue of 2.6)value of 2.6)Volume resistivity (mΩ · cm)7.87.46.34.89.210.5Strength (MPa)6671117187662459Moisture vapor transmission rateGoodGoodExcellentExcellentPoorPoorGoodWorkabilityGoodGood (*)GoodGoodPoorGoodGoodSwelling after workingGoodGoodGoodGoodGoodGoodPoor(*) In Example 2, a film was disposed and molded on a face provided with no graphite layer. Based on the results in Table 1, the volume resistivities, as the indicators of conductivity, in all of Examples 1 to 4 were lower than the volume resistivity in Comparative Example 1, and the moisture vapor transmission rates, as the indicators of a gas bather property, in all of Examples 1 to 4 were better than the moisture vapor transmission rates in Comparative Examples 1 and 2. Workability and swelling after working were good in all of Examples. Further, the strengths in Examples 3 and 4 were found to be at least 1.7 or more times higher than the strengths in Comparative Examples. The foregoing describes some example embodiments for explanatory purposes. Although the foregoing discussion has presented specific embodiments, persons skilled in the art will recognize that changes may be made in form and detail without departing from the broader spirit and scope of the invention. Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense. This detailed description, therefore, is not to be taken in a limiting sense, and the scope of the invention is defined only by the included claims, along with the full range of equivalents to which such claims are entitled. This application claims the benefit of Japanese Patent Application No. 2020-98939, filed on Jun. 5, 2020, the entire disclosure of which is incorporated by reference herein. INDUSTRIAL APPLICABILITY A separator member for a fuel cell of the present disclosure has industrial applicability for the member of a separator for a fuel cell. REFERENCE SIGNS LIST 10,30Separator member for fuel cell11,31,210,407Graphite layer13,37,203,402First resin layer201,401,409Application apparatus205,403Film207,406Graphite sheet209,408Roller33,404Second resin layer35,405Conductive fiber base material410Pressing machine206,220,420,430,440,450Layered body | 57,265 |
11942666 | DESCRIPTION OF EMBODIMENTS Hereinafter, the present invention is described in more detail. A precursor sheet for fuel cell separator according to the present invention includes an electroconductive substrate sheet, a dense layer containing first graphite particles, and an electroconductive layer containing second graphite particles, wherein the dense layer and the electroconductive layer contain a resin, the first graphite particles have a bulk density of 1.7 g/cm3or more and a volume resistivity of 20 mΩ·cm or more when compressed at 30 MPa, and the second graphite particles have a bulk density of 1.5 g/cm3or more and a volume resistivity of less than 20 mΩ·cm when compressed at 30 MPa. [1] Dense Layer The dense layer constituting the precursor sheet for fuel cell separator (hereinafter, it is abbreviated as a “precursor sheet”.) of the present invention contains the first graphite particles and the resin, and mainly functions as a gas impermeable layer. In the precursor sheet of the present invention, as the first graphite particles, those with a bulk density of 1.7 g/cm3or more, preferably 1.7 to 1.9 g/cm3, and a volume resistivity of 20 mΩ·cm or more, preferably 20 to 30 mΩ·cm, more preferably 22 to 28 mΩ·cm when compressed at 30 MPa are used. Graphite particles within this range have appropriate anisotropy, filling property, and fluidity, so that characteristics such as gas impermeability, electroconductivity, and surface smoothness (reduction of contact resistance) can be imparted to a fuel cell separator including a dense layer containing the graphite particles. The shape of the first graphite particles is not particularly limited, but flat graphite particles are preferable instead of spherical graphite particles because particles having a certain degree of anisotropy or more are suitable for forming the dense layer. The flat graphite particles have a basal surface on which a carbon hexagonal net surface appears and an edge surface on which an end portion of the carbon hexagonal net surface appears. The flat graphite particles are exemplified by flake graphite, vein graphite, amorphous graphite, flaky graphite, kish graphite, pyrolytic graphite, and highly oriented pyrolytic graphite. Among these flat graphite particles, flaky graphite and kish graphite excellent in anisotropy and surface smoothness are preferable, and flaky graphite is more preferable. In addition, the average particle size of the first graphite particles is not particularly limited, but is preferably 1 to 30 μm, and more preferably 1 to 15 μm because particles having a small particle size are suitable for forming the dense layer. The average particle size in the context of the present invention means median diameter (d50) measured by particle size distribution analysis based on laser diffractometry (the same applies hereinafter). The first graphite particles may be natural graphite or artificial graphite as long as the above characteristics are satisfied. The resin contained in the dense layer may be a thermoplastic resin or a thermosetting resin, but preferably contains a thermosetting resin, and more preferably contains only a thermosetting resin. The thermoplastic resin is preferably any of resins having a melting point or a glass transition point of 100° C. or higher from the viewpoint of heat resistance, but not specifically limited thereto. Specific examples thereof include polyethylene, polypropylene, polyphenylene sulfide, polytetrafluoroethylene, tetrafluoroethylene-ethylene copolymer, polychlorotrifluoroethylene, polyamide, polyetherketoneetherketoneketone, polyetherketone, liquid crystal polymer, polyimide, polyamideimide, polyphenylsulfone, polyetherimide and polysulfone, polybutylene terephthalate, polyethylene naphthalate, ABS resin, polycycloolefin and polyethersulfone, and derivatives thereof having a melting point of 100° C. or higher, polycarbonate, polystyrene and polyphenylene oxide, and derivatives thereof having a glass transition point of 100° C. or higher, and these may be used alone or in combination of two or more thereof. Although the upper limit of the melting point or glass transition point is not specifically limited, it is preferably 300° C. or lower, from the viewpoint of productivity of the precursor sheet and the fuel cell separator. The thermosetting resin is not particularly limited, and can be appropriately selected from those conventionally widely used as binder resins such as carbon separators. Specific examples thereof include a phenol resin, an epoxy resin, a furan resin, an unsaturated polyester resin, a urea resin, a melamine resin, a diallyl phthalate resin, a bismaleimide resin, a polycarbodiimide resin, a silicone resin, a vinyl ester resin, and a benzoxazine resin, and these may be used alone or in combination of two or more thereof. Among them, an epoxy resin is preferable because it is excellent in heat resistance and mechanical strength. The content ratio between the first graphite particles and the resin is not particularly limited, but from the viewpoint of imparting characteristics such as gas impermeability, electroconductivity, and surface smoothness (reduction in contact resistance) to the obtained fuel cell separator, the content of the resin is preferably 5 to 50 parts by weight and more preferably 10 to 35 parts by weight with respect to 100 parts by weight of the first graphite particles, and in the case of a thermosetting resin, it is preferable that the thermosetting resin is contained in an amount of 10 to 25% by weight in the entire precursor sheet. The dense layer may further contain a conduction auxiliary, aiming at reducing resistivity of the obtained fuel cell separator. The conduction auxiliary is exemplified by carbon black, graphene, carbon fiber, carbon nanofiber, carbon nanotube, various metal fibers, and inorganic and organic fibers on which metal is deposited or plated, and these may be used alone or in combination of two or more thereof. Among them, carbon materials having a small particle size such as carbon black and graphene are preferable from the viewpoint of maintaining surface smoothness. The carbon black is exemplified by furnace black, acetylene black, Ketjen black, and channel black, and furnace black is preferable from the viewpoint of cost. The carbon fiber is exemplified by polyacrylonitrile (PAN)-based carbon fiber derived from PAN fiber, pitch-based carbon fiber derived from pitches such as petroleum pitch, and phenol-based carbon fiber derived from phenolic resin. PAN-based carbon fiber is preferable from the viewpoint of cost. The fibrous conduction auxiliary preferably has an average fiber length of 0.1 to mm, from the viewpoint of balancing moldability and electroconductivity, which is more preferably 0.1 to 7 mm, and even more preferably 0.1 to 5 mm. The average fiber diameter is preferably 3 to 50 μm from the viewpoint of moldability, which is more preferably 3 to 30 μm, and even more preferably 3 to 15 μm. The content of the conduction auxiliary in the dense layer is preferably 0.1 to 10% by weight, and more preferably 0.5 to 7% by weight. Besides the aforementioned ingredients, the dense layer may contain other ingredient commonly used for the fuel cell separator. Such other ingredient is exemplified by internal mold releasing agents such as stearate-based wax, amide-based wax, montanate-based wax, carnauba wax and polyethylene wax; surfactants such as anionic, cationic and nonionic ones; strong acid; strong electrolyte; base; known flocculants suited to polyacrylamide-based, sodium polyacrylate-based and polymethacrylate-based surfactants; and thickeners such as carboxymethyl cellulose, starch, vinyl acetate, polylactic acid, polyglycolic acid and polyethylene oxide. The dense layer can be formed by applying a composition for forming a dense layer containing the first graphite particles, a resin, and other additives such as a conduction auxiliary to be used as necessary, and a solvent onto a base layer (substrate sheet or electroconductive layer). In addition, the dense layer can be formed by impregnating a layer formed by applying a composition containing the first graphite particles and a solvent onto the base layer with a resin. The solvent is not particularly limited as long as the coatable composition can be prepared, but is exemplified by water; aliphatic hydrocarbon-based solvents such as pentane, hexane, and heptane; aromatic hydrocarbon-based solvents such as toluene, p-xylene, o-xylene, m-xylene, and ethylbenzene; ketone-based solvents such as acetone, methyl ethyl ketone, methyl isopropyl ketone, diethyl ketone, methyl isobutyl ketone, methyl n-butyl ketone, cyclopentanone, and cyclohexanone; ester-based solvents such as ethyl acetate, isopropyl acetate, n-propyl acetate, isobutyl acetate, and n-butyl acetate; and aliphatic alcohol-based solvents such as methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, t-butanol, 1-pentanol, 1-hexanol, and cyclohexanol; ether-based solvents such as diethyl ether, tetrahydrofuran, and 1,4-dioxane, and amide-based solvents such as N,N-dimethylformamide, N,N-dimethylacetamide (DMAc), and N-methylpyrrolidone; cyclic urea-based solvents such as 1,3-dimethyl-2-imidazolidinone and 1,3-dimethyl-3,4,5,6-tetrahydro-2(1H)-pyrimidinone, and dimethyl sulfoxide, and these may be used alone or in combination of two or more. The coating method is not particularly limited, and may be appropriately selected from known methods such as a spin coating method, a dipping method, a flow coating method, an inkjet method, a jet dispenser method, a spray method, a bar coating method, a gravure coating method, a roll coating method, a transfer printing method, a brush coating method, a blade coating method, an air knife coating method, and a die coating method. When a solvent is used, the temperature at which the solvent is removed cannot be generally defined because it varies depending on the solvent used, and the temperature is required to be lower than the melting point or the like of the thermoplastic resin or the curing start temperature of the thermosetting resin, but the temperature can be generally about room temperature to 150° C., and is more preferably about 50 to 130° C. The thickness of the dense layer constituting the precursor sheet is not particularly limited, but is preferably 5 to 30 μm and more preferably 5 to 20 μm per layer in consideration of the balance between gas impermeability and smoothness, and electroconductivity. [2] Electroconductive Layer The electroconductive layer constituting the precursor sheet of the present invention contains second graphite particles and a resin, and mainly imparts formability (mold shape followability) to the precursor sheet and imparts electroconductivity to the fuel cell separator. In the precursor sheet of the present invention, as the second graphite particles, those with a bulk density of 1.5 g/cm3or more, preferably 1.5 to 1.9 g/cm3, more preferably 1.6 to 1.9 g/cm3, and a volume resistivity of less than 20 mΩ·cm, preferably mΩ·cm or less, more preferably 9 mΩ·cm or less when compressed at 30 MPa are used. Graphite particles within this range have high isotropy, fluidity, and electroconductivity, so that formability can be imparted to the precursor sheet, and characteristics such as good electroconductivity can be imparted to the fuel cell separator. On the other hand, the volume resistivity is preferably 3.5 mΩ·cm or more, and more preferably 5 mΩ·cm or more, from the viewpoint of imparting high fluidity and enhancing uniformity in the electroconductive layer. Since the graphite particles within this range have an appropriate particle size and particle size distribution, the formability and electroconductivity of the precursor sheet can be further enhanced. The shape of the second graphite particles is not particularly limited, but graphite particles having an isotropic shape are preferable, and spherical graphite particles are more preferable since particles having fluidity are suitable for forming the electroconductive layer. Also, the average particle size of the second graphite particles is not particularly limited, but is preferably 5 to 50 μm, more preferably 5 to 30 μm, and is preferably larger than the average particle size of the graphite particles constituting the dense layer. The second graphite particles may be natural graphite or artificial graphite as long as they satisfy the above characteristics. The resin contained in the electroconductive layer may be a thermoplastic resin or a thermosetting resin, but preferably contains a thermosetting resin. Specific examples of the thermoplastic resin and the thermosetting resin include those similar to the resins exemplified for the dense layer. The electroconductive layer can be formed by applying a composition for forming an electroconductive layer containing the second graphite particles, a resin, and other additives such as a conduction auxiliary to be used as necessary, and a solvent onto a base layer (substrate sheet or dense layer). In addition, the electroconductive layer can be formed by impregnating a layer formed by applying a composition containing the second graphite particles and a solvent onto the base layer with a resin. Also at the time of forming the electroconductive layer, the solvent, coating method, and solvent removal temperature described in the dense layer can be adopted. The composition for forming an electroconductive layer preferably contains a binder resin having thickening properties and adhesive properties from the viewpoint of obtaining a predetermined thickness and uniformity at the time of application. As the binder resin, an aqueous resin is more preferable because thickening properties and adhesive properties can be obtained with a small amount and the solvent can be easily removed. The aqueous resin is not particularly limited, and specific examples thereof include aqueous resins such as an acrylic resin, a polyurethane resin, a polyester resin, a to polyolefin resin, a polyvinyl resin, a polyether resin, a polyamide resin, a polyimide resin, a polyallylamine resin, a phenol resin, an epoxy resin, a phenoxy resin, a urea resin, a melamine resin, an alkyd resin, a formaldehyde resin, a silicone resin, a fluororesin, and polysaccharides such as carboxymethyl cellulose, aqueous emulsions obtained by emulsion polymerization, and dispersions, and these may be used alone or in combination of two or more thereof. Among them, an acrylic resin, a polyvinyl resin, a polyether resin, and polysaccharides such as carboxymethyl cellulose, which can obtain sufficient adhesive properties particularly in a small amount, are preferable. The content of the binder resin is not particularly limited, but is preferably 0.1 to 10% by weight, and more preferably 0.5 to 7% by weight in the electroconductive layer. When the content is less than 0.1% by weight, there is a possibility that thickening properties and adhesive properties are insufficient, and when the content is 10% by weight or more, there is a possibility that electroconductivity is reduced. The content ratio between the second graphite particles and the resin is not particularly limited, but is preferably 5 to 50 parts by weight, more preferably 10 to 35 parts by weight of the resin, with respect to 100 parts by weight of the second graphite particles, in consideration of the formability of the precursor sheet described above, and the electroconductivity of the fuel cell separator. In the case of the thermosetting resin, it is preferable that the thermosetting resin is contained in an amount of 10 to 25% by weight in the entire precursor sheet. The electroconductive layer may further contain a conduction auxiliary, aiming at reducing resistivity of the obtained fuel cell separator. Specific examples of the conduction auxiliary include those similar to those exemplified for the dense layer. The content of the conduction auxiliary in the electroconductive layer is preferably to 10% by weight, and more preferably 0.5 to 7% by weight. In addition, the electroconductive layer may contain other components exemplified in the dense layer. The thickness of the electroconductive layer constituting the precursor sheet is not particularly limited, but is preferably 10 to 200 μm and more preferably 30 to 150 μm per layer in consideration of the balance between formability and electroconductivity. [3] Substrate Sheet The electroconductive substrate sheet constituting the precursor sheet of the present invention is not particularly limited, and may be appropriately selected from those conventionally used as a precursor sheet for fuel cell separator such as a paper sheet, a carbon fiber sheet, a carbon fiber-reinforced carbon composite material sheet, a metal foil, and a metal mesh containing an electroconductive filler and an organic fiber, and a paper sheet containing an electroconductive filler and an organic fiber is preferable. The electroconductive filler constituting the substrate sheet is not specifically limited, and any known materials having been used for the fuel cell separator are employable. Specific examples thereof include carbon materials; metal powders; and inorganic or organic powders on which metal is deposited by evaporation or plating, and carbon material is preferable. The carbon material is exemplified by graphites such as natural graphite, synthetic graphite obtained by baking needle coke, synthetic graphite obtained by baking lump coke, and expandable graphite obtained by chemical treatment of natural graphite; crushed carbon electrode; coal pitch; petroleum pitch; coke; activated carbon; glassy carbon; acetylene black; and Ketjen black, and among them, graphite is preferable from the viewpoint of electroconductivity. The electroconductive filler may be used singly or in combination of two or more kinds thereof. The shape of the electroconductive filler is not limited, and may be any of sphere, scale, lump, foil, plate, needle and irregular shape. From the viewpoint of gas impermeability of the separator, a scaly shape is preferable. The electroconductive filler preferably has an average particle size of 5 to 200 μm, which is more preferably 10 to 80 μm. With the average particle size of the electroconductive filler within the aforementioned ranges, a necessary level of electroconductivity is obtainable while retaining gas impermeability. The content of the electroconductive filler in the substrate sheet is preferably 50 to 96% by weight, and more preferably 60 to 90% by weight. With the content of the electroconductive filler controlled within the aforementioned ranges, a necessary level of electroconductivity is obtainable without damaging the formability. On the other hand, the organic fiber preferably has a melting point higher than the heating temperature at the time of manufacturing the fuel cell separator. By using such organic fiber (also referred to as a “first organic fiber”, hereinafter), it now becomes possible to improve mechanical strength of the precursor sheet and the fuel cell separator precursor obtainable therefrom. The material of the first organic fiber is exemplified by aramids such as poly-p-phenylene terephthalamide (decomposition temperature: 500° C.) and poly-m-phenylene isophthalamide (decomposition temperature: 500° C.), polyacrylonitrile (melting point: 300° C.), cellulose (melting point: 260° C.), acetate (melting point: 260° C.), nylon polyester (melting point: 260° C.), polyphenylene sulfide (PPS) (melting point: 280° C.), polyetheretherketone (melting point: 340° C.), polyphenylsulfone (no melting point), polyamideimide (melting point: 300° C.), polyetherimide (melting point: 210° C.), and copolymers containing these materials as main materials, and these may be used alone or in combination of two or more. These can be appropriately selected in consideration of the formability of the precursor sheet, and the mechanical strength, electroconductivity, and durability of the separator. In addition, the organic fiber may contain a second organic fiber having a melting point lower than a heating temperature at the time of manufacturing the fuel cell separator. The second organic fiber preferably has affinity to a resin contained in the dense layer and the electroconductive layer. Materials for composing the second organic fiber is preferably polyethylene (PE) (melting point=120 to 140° C. (HDPE), 95 to 130° C. (LDPE), polypropylene (PP) (melting point=160° C.), and polyphenylene sulfide, and these may be used alone or in combination of two or more. When the second organic fiber is contained, the first organic fiber preferably has a melting point 10° C. or more higher than the aforementioned heating temperature, from the viewpoint of reliably retaining the fiber shape necessary for imparting impact resistance, which is more preferably higher by 20° C. or more, and even more preferably higher by 30° C. or more. On the other hand, the second organic fiber preferably has a melting point 10° C. or more lower than the aforementioned heating temperature, from the viewpoint of moldability, which is more preferably lower by 20° C. or more, and even more preferably lower by 30° C. or more. Difference between the melting points of the first and second organic fibers is preferably 40° C. or larger, and more preferably 60° C. or larger. When the second organic fiber is contained, the first organic fiber is preferably aramid, polyacrylonitrile, cellulose, acetate or nylon-polyester, meanwhile the second organic fiber is preferably PE, PP or PPS. Note that, in a case where PE or PP is used as the second organic fiber, it is acceptable to use, as the first organic fiber, aramid, polyacrylonitrile, cellulose, acetate or nylon-polyester, which may even be PPS as well. The organic fiber preferably has an average fiber length of 0.1 to 10 mm, from the viewpoint of stabilizing grammage during paper making, and of keeping mechanical strength of the obtainable paper sheet, which is more preferably 0.1 to 6 mm, and even more preferably 0.5 to 6 mm. The first and second organic fibers preferably have an average fiber diameter of to 100 μm from the viewpoint of moldability, which is more preferably 0.1 to 50 μm, and even more preferably 1 to 50 μm. Note that the average fiber length and average fiber diameter in the present invention are arithmetic average values of fiber length and fiber diameter of 100 fibers measured under an optical microscope or electron microscope. The content of the organic fiber in the substrate sheet is preferably 1 to 20% by weight, and more preferably 3 to 15% by weight. Also, the content of the second organic fiber, when contained, is preferably 10 to 80% by weight, and more preferably 50 to 80% by weight. The paper sheet may further contain a conduction auxiliary, aiming at reducing resistivity of the fuel cell separator obtainable therefrom. Specific examples of the conduction auxiliary include those similar to those exemplified for the dense layer, but carbon fibers are preferable, and PAN-based carbon fiber is more preferable. The content of the conduction auxiliary in the paper sheet is preferably 1 to 20% by weight, and more preferably 2 to 10% by weight. Also, the paper sheet may contain other components exemplified in the dense layer. The paper sheet can be obtained by papermaking a composition containing the aforementioned individual ingredients. Method of paper making may be any of known methods without special limitation. For example, the paper sheet may be manufactured by dispersing a composition containing the aforementioned individual ingredients into a solvent such as water unable to dissolve them, by allowing the obtained dispersion to deposit the ingredients on a substrate, and then by drying the obtained deposit. The grammage of the paper sheet is preferably 150 to 300 g/m2. The thickness of the substrate sheet used in the present invention is not particularly limited, but is preferably 10 μm to 1.0 mm in consideration of the mechanical strength and the like of the fuel cell separator. When the substrate sheet is a porous sheet such as a paper sheet, the substrate sheet may contain a resin. The resin contained in the substrate sheet may be a thermoplastic resin or a thermosetting resin, but is preferably a thermosetting resin. Specific examples of the thermoplastic resin and the thermosetting resin include those similar to the resins exemplified for the dense layer, but in the case of the thermosetting resin, it is preferable that the thermosetting resin is contained in an amount of 10 to 25% by weight in the entire precursor sheet. The method of incorporating the resin into the substrate sheet is exemplified by a method in which the resin film is heated and melted to be impregnated, and a method in which the substrate sheet is immersed in the liquid resin to be impregnated. After all of the dense layer, the electroconductive layer, and the substrate sheet are laminated, a resin may be impregnated, or a resin may be contained in a composition for forming the dense layer and the electroconductive layer, and a lower layer thereof may be impregnated with the resin when applying the composition. For example, when a dense layer is formed on the outermost surface, a laminate of a substrate sheet and an electroconductive layer is prepared, and then a composition for forming a dense layer containing a resin is applied to the laminate to impregnate the entire laminate with the resin. [4] Precursor Sheet In the precursor sheet of the present invention, the order of lamination of the substrate sheet, the electroconductive layer, and the dense layer is not particularly limited, and any order can be adopted, and the number of layers of each of the electroconductive layer and the dense layer is not particularly limited, and any number of layers can be adopted, but in consideration of effectively exhibiting the functions of the dense layer and the electroconductive layer described above, it is preferable that the outermost surface is constituted by the dense layer. That is, a three-layer structure in which an electroconductive layer is laminated on one surface of a substrate sheet, and a dense layer is laminated on a surface of the electroconductive layer is one preferred aspect. Furthermore, in consideration of further enhancing the formability of the precursor sheet and further enhancing the electroconductivity of the obtained fuel cell separator, it is preferable that electroconductive layers are formed on both side surfaces of the substrate sheet. That is, a five-layer structure in which electroconductive layers are laminated on both side surfaces of the substrate sheet, and a dense layer is laminated on each of the surfaces of the electroconductive layers is another preferred aspect. [5] Fuel Cell Separator The fuel cell separator may be manufactured by heating and molding the precursor sheet of the present invention. The molding method is preferably compression molding, but is not specifically limited thereto. The conditions for the compression molding are not particularly limited, but the mold temperature is preferably 150 to 190° C. In a case where the paper sheet is used as the substrate sheet, the die temperature is preferably 10° C. or more lower than the melting point of the organic fiber (first organic fiber), which is more preferably 20° C. or more lower. The molding pressure is preferably 1 to 100 MPa, and is more preferably 1 to 60 MPa. The compression molding time is not particularly limited, and can be appropriately set to about 3 seconds to 1 hour. The thickness of the dense layer after compression molding is not particularly limited, but is preferably 0.5 to 20 μm per layer, and 15% or less of the total thickness of the separator in the entire dense layer. The thickness of the electroconductive layer after compression molding is preferably 20 to 150 μm per layer. In general, a solid polymer electrolyte fuel cell is formed by juxtaposing a large number of unit cells each including a pair of electrodes sandwiching a solid polymer electrolyte membrane and a pair of separators forming a gas supply/discharge flow path sandwiching the electrodes, and the fuel cell separator of the present invention can be used as a part or all of the plurality of separators. EXAMPLES Hereinafter, the present invention is described more specifically with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples. Physical properties in Examples were measured by the following methods. (1) Compression Density and Volume Resistivity of Graphite Particles 0.2 g of graphite powder was put in a cylinder with a diameter of 12 mm, and the cylinder was lightly tapped to level the surface. Subsequently, the graphite powder was gradually compressed at a constant speed of 30 N/sec with cylindrical gold-plated copper electrodes having the same diameter installed at both ends of the cylinder, and the resistance between the electrodes and filling height at the time when 3395 N (30 MPa) was reached were measured. Autograph (AG-X 10 kN manufactured by Shimadzu Corporation) was used for the compression. The resistance between the electrodes was converted from the voltage between the electrodes when applying a constant current of 1 A/cm2between the gold-plated copper electrodes, and this was taken as the volume resistivity (unit: mΩ·cm). In addition, the compression density (unit: g/cm3) was calculated from the weight of the graphite powder and the filling height. (2) Gas Impermeability of Fuel Cell Separator A flat separator was molded, and the hydrogen gas permeation coefficient (unit: cm3·cm/(cm2·sec·cmHg)) was measured in accordance with JIS K7126-1: 2006 (Plastics Film and sheeting —Determination of gas-transmission rate—Part 1: Differential-pressure method). The type of the test was gas chromatography, gas impermeability was measured under the conditions of 23° C., and a test gas (hydrogen gas) on the high pressure side of 150.3 kPa. (3) Electroconductivity of Fuel Cell Separator A flat separator was molded, sandwiched between gold-plated copper electrodes each having a side of 2 cm, pressurized at 2.5 MPa for 10 seconds, then lowered to 1.0 MPa, and the voltage between the electrodes when applying a constant current of 1 A/cm2between the gold-plated copper electrodes was measured. The obtained voltage between the electrodes was converted into a resistance, which was defined as a penetration resistance (unit: mΩ·cm2) of the separator, and electroconductivity was evaluated. (4) Formability of Fuel Cell Separator A separator was molded using a mold having a corrugated and convex shape, and an SEM image of a cross section was photographed. Dimensions and internal porosity were measured from the image, and consistency with the mold shape and presence or absence of voids were confirmed. (5) Mechanical Strength of Fuel Cell Separator A flat separator was molded, and the mechanical strength was measured by a three-point bending test in accordance with JIS K7171 under an environment of 25° C. [1] Preparation of Substrate Sheet Manufacturing Example 1 Eighty-seven parts by weight of graphite, 3 parts by weight of PAN-based carbon fiber, and 10 parts by weight of cellulose fiber were placed in water, and the mixture was stirred to obtain a fiber slurry. The slurry was subjected to paper making, to obtain a carbon-supported paper sheet. The obtained paper sheet was found to have a grammage of 190 g/m2. [2] Preparation of Precursor Sheet Example 1-1 Hereinafter, the density and the volume resistivity represent values when the graphite powder was compressed at 30 MPa. Ninety-five parts by weight of spherical graphite with a density of 1.69 g/cm3and a volume resistivity of 5.8 mΩ·cm and an average particle size of 15 μm, 5 parts by weight of polyacrylic acid (molecular weight: 1 million) as an aqueous resin as a binder resin, and water as a solvent were mixed to prepare a slurry for forming an electroconductive layer having a solid content concentration of 45% by weight. This slurry was applied to both surfaces of the substrate sheet obtained in Manufacturing Example 1 to form an electroconductive layer on each of both surfaces of the substrate sheet. The obtained electroconductive layer had a thickness of 110 μm per layer. Subsequently, 15 parts by weight of flaky graphite with a density of 1.75 g/cm3and a volume resistivity of 24.5 mΩ·cm and an average particle size of 5 μm, 85 parts by weight of an epoxy resin, and acetone were mixed to prepare a slurry for forming a dense layer having a solid content concentration of 50% by weight. This slurry was applied to the surface of each of the two previously formed electroconductive layers to form a dense layer and impregnate the electroconductive layers with the epoxy resin, thereby obtaining a precursor sheet having a five-layer structure of dense layer/electroconductive layer/substrate sheet/electroconductive layer/dense layer. The thermosetting resin contained in the entire precursor sheet was 20% by weight. The obtained dense layer had a thickness of 10 μm per layer. Example 1-2 A precursor sheet having a five-layer structure was obtained in the same manner as in Example 1-1 except for using spherical graphite with a density of 1.82 g/cm3and a volume resistivity of 7.6 mΩ·cm and an average particle size of 10 μm as the graphite contained in the electroconductive layer. Example 1-3 A precursor sheet having a five-layer structure was obtained in the same manner as in Example 1-1 except for using flaky graphite with a density of 1.72 g/cm3and a volume resistivity of 26.1 mΩ·cm and an average particle size of 4 μm as the graphite contained in the dense layer. Example 1-4 A precursor sheet having a five-layer structure was obtained in the same manner as in Example 1-1 except for using flaky graphite with a density of 1.88 g/cm3and a volume resistivity of 27.6 mΩ·cm and an average particle size of 13 μm as the graphite contained in the dense layer. Example 1-5 A precursor sheet having a five-layer structure was obtained in the same manner as in Example 1-1 except for using spherical graphite with a density of 1.63 g/cm3and a volume resistivity of 8.2 mΩ·cm and an average particle size of 10 μm as the graphite contained in the electroconductive layer. Example 1-6 A precursor sheet having a five-layer structure was obtained in the same manner as in Example 1-1 except for using spherical graphite with a density of 1.88 g/cm3and a volume resistivity of 5.2 mΩ·cm and an average particle size of 13 μm as the graphite contained in the electroconductive layer. Example 1-7 A precursor sheet having a five-layer structure was obtained in the same manner as in Example 1-1 except for using spherical graphite with a density of 1.62 g/cm3and a volume resistivity of 17 mΩ·cm and an average particle size of 5 μm as the graphite contained in the electroconductive layer. Example 1-8 A precursor sheet having a five-layer structure was obtained in the same manner as in Example 1-1 except for using spherical graphite with a density of 1.58 g/cm3and a volume resistivity of 8 mΩ·cm and an average particle size of 10 μm as the graphite contained in the electroconductive layer. Example 1-9 A precursor sheet having a five-layer structure was obtained in the same manner as in Example 1-1 except for using spherical graphite with a density of 1.87 g/cm3and a volume resistivity of 17 mΩ·cm and an average particle size of 25 μm as the graphite contained in the electroconductive layer. Example 1-10 A precursor sheet having a five-layer structure was obtained in the same manner as in Example 1-1 except for using spherical graphite with a density of 1.93 g/cm3and a volume resistivity of 14.5 mΩ·cm and an average particle size of 40 μm as the graphite contained in the electroconductive layer. Example 1-11 A precursor sheet having a five-layer structure was obtained in the same manner as in Example 1-1 except for using spherical graphite with a density of 1.71 g/cm3and a volume resistivity of 12.4 mΩ·cm and an average particle size of 15 μm as the graphite contained in the electroconductive layer. Example 1-12 A precursor sheet having a five-layer structure was obtained in the same manner as in Example 1-1 except for using spherical graphite with a density of 1.8 g/cm3and a volume resistivity of 3.8 mΩ·cm and an average particle size of 35 μm as the graphite contained in the electroconductive layer. Example 1-13 A precursor sheet having a five-layer structure was obtained in the same manner as in Example 1-1 except for using flat graphite with a density of 1.92 g/cm3and a volume resistivity of 26 mΩ·cm and an average particle size of 20 μm as the graphite contained in the dense layer. Example 1-14 A precursor sheet having a five-layer structure was obtained in the same manner as in Example 1-1 except for using 92 parts by weight of spherical graphite with a density of 1.69 g/cm3and a volume resistivity of 5.8 mΩ·cm and an average particle size of 15 μm as the graphite contained in the electroconductive layer, 8 parts by weight of polyvinylidene fluoride as the binder resin, and N-methylpyrrolidone (NMP) as the solvent. Comparative Example 1-1 Without forming an electroconductive layer and a dense layer, the paper sheet obtained in Manufacturing Example 1 was impregnated with an epoxy resin to obtain a precursor sheet. The thermosetting resin contained in the entire precursor sheet was 20% by weight. Comparative Example 1-2 The slurry for forming a dense layer used in Example 1-1 was applied to both surfaces of the paper sheet obtained in Manufacturing Example 1 to form two dense layers, thereby obtaining a precursor sheet having a three-layer structure of dense layer/substrate sheet/dense layer. The thermosetting resin contained in the entire precursor sheet was 20% by weight. Comparative Example 1-3 A three-layer structure of electroconductive layer/substrate sheet/electroconductive layer was formed in the same manner as in Example 1-1 except that a dense layer was not formed, and then impregnated with an epoxy resin in the same manner as in Comparative Example 1-1 to obtain a precursor sheet. The thermosetting resin contained in the entire precursor sheet was 20% by weight. Comparative Example 1-4 A precursor sheet having a five-layer structure was obtained in the same manner as in Example 1-1 except for using spherical graphite with a density of 1.62 g/cm3and a volume resistivity of 17 mΩ·cm and an average particle size of 5 μm as the graphite contained in the dense layer. Comparative Example 1-5 A precursor sheet having a five-layer structure was obtained in the same manner as in Example 1-1 except for using spherical graphite with a density of 1.76 g/cm3and a volume resistivity of 8.5 mΩ·cm and an average particle size of 8 μm as the graphite contained in the dense layer. Comparative Example 1-6 A precursor sheet having a five-layer structure was obtained in the same manner as in Example 1-1 except for using flaky graphite with a density of 1.75 g/cm3and a volume resistivity of 24.5 mΩ·cm and an average particle size of 5 μm as the graphite contained in the electroconductive layer. Comparative Example 1-7 A precursor sheet having a five-layer structure was obtained in the same manner as in Example 1-1 except for using flaky graphite with a density of 1.62/cm3and a volume resistivity of 26.7 mΩ·cm and an average particle size of 2 μm as the graphite contained in the dense layer. Comparative Example 1-8 Eighty parts by weight of spherical graphite with a density of 1.69 g/cm3and a volume resistivity of 5.8 mΩ·cm and an average particle size of 15 μm, 20 parts by weight of an epoxy resin, and acetone as a solvent were mixed, and then vacuum-dried and pulverized to obtain a mixed powder of graphite and the epoxy resin. The mixed powder was pressure-molded into a plate shape to obtain a precursor sheet. A summary of the above Examples and Comparative Examples is shown in Table 1. TABLE 1Dense layerElectroconductive layerAverageAverageResinPresenceVolumeparticlePresenceVolumeparticleratioorDensityresistivitysizeorDensityresistivitysizeBinderSubstrate[% byabsence[g/cm3][mΩ · cm][μm]absence[g/cm3][mΩ · cm][μm]resinsheetweight]Example 1-1Both1.7524.55Both1.695.815AqueousPaper20surfacessurfacessheetExample 1-2Both1.7524.55Both1.827.610AqueousPaper20surfacessurfacessheetExample 1-3Both1.7226.14Both1.695.815AqueousPaper20surfacessurfacessheetExample 1-4Both1.8827.613Both1.695.815AqueousPaper20surfacessurfacessheetExample 1-5Both1.7524.55Both1.638.210AqueousPaper20surfacessurfacessheetExample 1-6Both1.7524.55Both1.885.213AqueousPaper20surfacessurfacessheetExample 1-7Both1.7524.55Both1.62175AqueousPaper20surfacessurfacessheetExample 1-8Both1.7524.55Both1.58810AqueousPaper20surfacessurfacessheetExample 1-9Both1.7524.55Both1.871725AqueousPaper20surfacessurfacessheetExample 1-10Both1.7524.55Both1.9314.540AqueousPaper20surfacessurfacessheetExample 1-11Both1.7524.55Both1.7112.415AqueousPaper20surfacessurfacessheetExample 1-12Both1.7524.55Both1.83.835AqueousPaper20surfacessurfacessheetExample 1-13Both1.922620Both1.695.815AqueousPaper20surfacessurfacessheetExample 1-14Both1.7524.55Both1.695.815Non-Paper20surfacessurfacesaqueoussheetComparativeNone———None———NonePaper20Example 1-1sheetComparativeBoth1.7524.55None———NonePaper20Example 1-2surfacessheetComparativeNone———Both1.695.815AqueousPaper20Example 1-3surfacessheetComparativeBoth1.62175Both1.695.815AqueousPaper20Example 1-4surfacessurfacessheetComparativeBoth1.768.58Both1.695.815AqueousPaper20Example 1-5surfacessurfacessheetComparativeBoth1.7524.55Both1.7524.55AqueousPaper20Example 1-6surfacessurfacessheetComparativeBoth1.6226.72Both1.695.815AqueousPaper20Example 1-7surfacessurfacessheetComparativeNone———One1.695.815NoneNone20Example 1-8layer [3] Preparation of Fuel Cell Separator Example 2-1 The precursor sheet obtained in Example 1-1 was compression-molded at 180° C. and 60 MPa for 1 minute using a planar mold and a mold having a corrugated and convex shape to obtain a fuel cell separator. The thickness of the separator molded in the planar shape was 250 μm. Among them, the thickness of the dense layer was 5 μm per layer, and the thickness of the electroconductive layer was 70 μm per layer. Examples 2-2 to 2-14 Fuel cell separators were obtained in the same manner as in Example 2-1 except for changing to the precursor sheets prepared in Examples 1-2 to 1-14. Comparative Example 2-1 Two precursor sheets obtained in Comparative Example 1-1 were stacked, and compression-molded at 180° C. and 60 MPa for 1 minute using a mold having a corrugated and convex shape to obtain a fuel cell separator. Comparative Examples 2-2 to 2-8 Fuel cell separators were obtained in the same manner as in Example 2-1 except for changing to the precursor sheets prepared in Comparative Examples 1-2 to 1-8. Gas impermeability, electroconductivity, formability, and mechanical strength of the obtained fuel cell separator were measured by the above methods, and evaluated according to the following criteria. The results are shown in Table 2. [Gas Impermeability] ◯: The hydrogen gas permeability coefficient is less than 5.0×10−9cm3·cm/(cm2·sec·cmHg).x: The hydrogen gas permeability coefficient is equal to or more than 5.0×10−9cm3·cm/(cm2·sec·cmHg). [Electroconductivity]⊚: The penetration resistance is less than 10 mΩ·cm2.◯: The penetration resistance is 10 mΩ·cm2or more and less than 13 mΩ·cm2.Δ: The penetration resistance is 13 mΩ·cm2or more and less than 15 mΩ·cm2.x: The penetration resistance is 15 mΩ·cm2or more. [Formability]◯: The dimensional error with the mold shape is 5% or less and the internal porosity is less than 1% at any three points.Δ: The dimensional error with the mold shape is 5% or less and the internal porosity is 1% or more and 3% or less at any three points.x: The dimensional error with the mold shape is 5% or more and the internal porosity is 3% or more. [Mechanical Strength]◯: The bending stress in a three-point bending test is 60 MPa or more.Δ: The bending stress in a three-point bending test is 50 MPa or more and less than 60 MPa.x: The bending stress in a three-point bending test is less than or equal to 50 MPa. TABLE 2Separator characteristicsGasElectro-impermeabilityconductivityFormabilityStrengthExample 2-1◯⊚◯◯Example 2-2◯⊚◯◯Example 2-3◯⊚◯◯Example 2-4◯⊚◯◯Example 2-5◯⊚◯◯Example 2-6◯⊚◯◯Example 2-7◯◯◯◯Example 2-8◯◯◯◯Example 2-9◯◯◯◯Example 2-10◯Δ◯◯Example 2-11◯◯◯◯Example 2-12◯◯◯◯Example 2-13◯ΔΔ◯Example 2-14◯Δ◯ΔComparativeXXX◯Example 2-1Comparative◯XX◯Example 2-2ComparativeX◯◯◯Example 2-3ComparativeX◯◯◯Example 2-4ComparativeX◯◯◯Example 2-5Comparative◯XX◯Example 2-6ComparativeXX◯◯Example 2-7ComparativeX◯◯XExample 2-8 As shown in Table 2, it can be seen that the fuel cell separators obtained in Examples 2-1 to 2-14 are excellent in gas impermeability and electroconductivity, and are also excellent in formability, whereas the fuel cell separators obtained in Comparative Examples 2-1 to 2-3 without a dense layer and/or an electroconductive layer, the fuel cell separators obtained in Comparative Examples 2-4 to 2-7 in which the characteristics of graphite are out of the scope of the present invention, and the separator for fuel cell obtained in Comparative Example 2-8 composed of only an electroconductive layer are inferior in any one or all of the above-mentioned separator characteristics. | 45,848 |
11942667 | DETAILED DESCRIPTION Hereinafter, some embodiments of the present disclosure will be described in detail with reference to the exemplary drawings. It should be noted that when components in the drawings are designated by reference numerals, the same components have the same reference numerals as far as possible even though the components are illustrated in different drawings. Further, in description of the embodiments of the present disclosure, when it is determined that a detailed description of a related well-known configuration or function disturbs understanding of the embodiments of the present disclosure, the detailed description will be omitted. In the description of components of the embodiments of the present disclosure, the terms such as first, second, A, B, (a) and (b) may be used. These terms are not used to delimit an essence, an order or sequence, and the like of a corresponding component but used merely to distinguish the corresponding component from other component(s). Further, unless otherwise defined, all terms used herein including technical or scientific terms have the same meanings as those commonly understood by those skilled in the art to which the present disclosure belongs. The terms defined in the generally used dictionaries should be construed as having the meanings that coincide with the meanings of the contexts of the related technologies, and should not be construed as ideal or excessively formal meanings unless clearly defined in the present application. Hereinafter, embodiments of the present disclosure will be described in detail with reference toFIGS.1to5. FIG.1is a view illustrating a configuration of a flying object to which a fuel cell system is applied according to an embodiment of the present disclosure. Referring toFIG.1, the flying object to which the fuel cell system is applied may have a configuration in which radiators110,120, and130are arranged so that a downdraft (wind power) generated from a propeller wing200according to rotation of a rotor for flight of the flying object passes through the radiators110,120, and130of a fuel cell system100. In this case, it is illustrated inFIG.1that the radiators110,120, and130include the main radiator110and the two sub-radiators120and130, but the number of the main radiator110and the number of the sub-radiators120and130are not limited. The main radiator110may include a cooling fan111. In this case, the cooling fan111may be disposed to be perpendicular to a direction of the downdraft so as not to rotate due to the downdraft generated by the propeller wing200. Further, each of the main radiator110and the sub-radiators120and130may include a stack radiator STACK RAD for dissipating heat generated in a fuel cell stack143(seeFIG.2) and an electric component radiator ELEC RAD for dissipating heat generated in an electric component152(seeFIG.2). As illustrated inFIG.1, the fuel cell system applied to the flying object according to the embodiment of the present disclosure may include the main radiator110and the sub-radiators120and130for dissipating heat using the downdraft generated in the propeller wing200for the flight of the flying object. Further, the main radiator110and the sub-radiators120and130may be classified according to the presence or absence of the cooling fan111. In this case, the cooling fan111may be disposed in the main radiator110in a direction perpendicular to the direction of the downdraft so as not to rotate due to the downdraft generated in the propeller wing200. FIG.2is a view illustrating a configuration of the fuel cell system according to the embodiment of the present disclosure. Referring toFIG.2, the fuel cell system100may include the main radiator110, the first sub-radiator120, the second sub-radiator130, a stack cooling water pump141, a bypass valve142, the fuel cell stack143, a heater144, first to third stack cooling water valves145,146, and147, a temperature control valve148, an electric component cooling water pump151, the electric component152, first to third electric component cooling water valves153,154, and155, and a controller160. The main radiator110may include the stack radiator STACK RAD, the electric component radiator ELEC RAD, and the cooling fan111. The stack radiator STACK RAD included in the main radiator110may discharge heat of cooling water introduced through the first stack cooling water valve145to the outside air. The electric component radiator ELEC RAD included in the main radiator110may discharge heat of cooling water introduced through the first electric component cooling water valve153to the outside air. The cooling fan111may supply external air to the stack radiator STACK RAD and the electric component radiator ELEC RAD of the main radiator110. In this case, the cooling fan111may rotate under control of the controller160and may supply the external air to the main radiator110during the rotation. The first sub-radiator120may include the stack radiator STACK RAD and the electric component radiator ELEC RAD. The stack radiator STACK RAD of the first sub-radiator120may discharge heat of cooling water introduced through the second stack cooling water valve146to the outside air. The electric component radiator ELEC RAD of the first sub-radiator120may discharge heat of cooling water introduced through the second electric component cooling water valve154to the outside air. The second sub-radiator130may include the stack radiator STACK RAD and the electric component radiator ELEC RAD. The stack radiator STACK RAD of the second sub-radiator130may discharge heat of cooling water introduced through the third stack cooling water valve147to the outside air. The electric component radiator ELEC RAD of the second sub-radiator130may discharge heat of cooling water introduced through the third electric component cooling water valve155to the outside air. In this case, the cooling water passing through the stack radiator STACK RAD of the main radiator110, the stack radiator STACK RAD of the first sub-radiator120, and the stack radiator STACK RAD of the second sub-radiator130may be introduced into the temperature control valve148. Further, the cooling water passing through the electric component radiator ELEC RAD of the main radiator110, the electric component radiator ELEC RAD of the first sub-radiator120, and the electric component radiator ELEC RAD of the second sub-radiator130may be introduced into the electric component cooling water pump151. The temperature control valve148may receive the cooling water passing through only the fuel cell stack143or the cooling water passing through the fuel cell stack143and the stack radiators STACK RAD of the main radiator110and the first and second sub-radiators120and130. The temperature control valve148may control the temperature of the cooling water provided to the stack cooling water pump141by controlling the amount of the cooling water introduced through only the fuel cell stack143and the amount of the cooling water passing through the stack radiators STACK RAD of the main radiator110and the first and second sub-radiators120and130under the control of the controller160. That is, the temperature control valve148may provide, to the stack cooling water pump141, the cooling water introduced from a flow path passing through only the fuel cell stack143and the cooling water introduced from a flow path passing through the fuel cell stack143and the stack radiators STACK RAD of the main radiator110and the first and second sub-radiators120and130. To dissipate the heat generated in the fuel cell stack143, the stack cooling water pump141may circulate the cooling water passing through the bypass valve142, the fuel cell stack143, the heater144, the stack radiator STACK RAD of the main radiator110, the stack radiators STACK RAD of the first and second sub-radiators120and130, and the temperature control valve148. The number of rotations of the stack cooling water pump141may be controlled under the control of the controller160, and a circulation speed of the cooling water may be increased or decreased on the basis of the number of rotations according to the control of the controller160. The bypass valve142may transmit the cooling water provided from the stack cooling water pump141to the fuel cell stack143or the heater144according to the control of the controller160. When the cooling water is provided from the bypass valve142, the heater144may increase the temperature of the cooling water according to the control of the controller160. The first stack cooling water valve145may transmit the cooling water to the stack radiator STACK RAD of the main radiator110or may block the cooling water from being transmitted to the stack radiator STACK RAD of the main radiator110, according to the control of the controller160. The second stack cooling water valve146may transmit the cooling water to the stack radiator STACK RAD of the first sub-radiator120or may block the cooling water from being transmitted to the stack radiator STACK RAD of the first sub-radiator120, according to the control of the controller160. The third stack cooling water valve147may transmit the cooling water to the stack radiator STACK RAD of the second sub-radiator130or may block the cooling water from being transmitted to the stack radiator STACK RAD of the second sub-radiator130according to the control of the controller160. To dissipate the heat generated in the electric component152, the electric component cooling water pump151may allow the cooling water to circulate to the electric component radiator ELEC RAD of the main radiator110. The number of rotations of the electric component cooling water pump151may be controlled according to the control of the controller160, and the circulation speed of the cooling water for dissipating the heat generated in the electric component152may be increased or decreased on the basis of the number of rotations according to the control of the controller160. The first electric component cooling water valve153may transmit the cooling water to the electric component radiator ELEC RAD of the main radiator110or may block the cooling water from being transmitted to the electric component radiator ELEC RAD of the main radiator110, according to the control of the controller160. The second electric component cooling water valve154may transmit the cooling water to the electric component radiator ELEC RAD of the first sub-radiator120or may block the cooling water from being transmitted to the electric component radiator ELEC RAD of the first sub-radiator120, according to the control of the controller160. The third electric component cooling water valve155may transmit the cooling water to the electric component radiator ELEC RAD of the second sub-radiator130or may block the cooling water from being transmitted to the electric component radiator ELEC RAD of the second sub-radiator130, according to the control of the controller160. The electric component radiator ELEC RAD of the main radiator110may discharge the heat of the cooling water transmitted through the first electric component cooling water valve153to the outside air. The electric component radiator ELEC RAD of the first sub-radiator120may discharge the heat of the cooling water transmitted through the second electric component cooling water valve154to the outside air. The electric component radiator ELEC RAD of the second sub-radiator130may discharge the heat of the cooling water transmitted through the third electric component cooling water valve155to the outside air. In this case, the cooling water of which the heat is dissipated through the electric component radiator ELEC RAD of the main radiator110, the electric component radiator ELEC RAD of the first sub-radiator120, and the electric component radiator ELEC RAD of the second sub-radiator130may be introduced into the electric component cooling water pump151. The controller160may control the first to third stack cooling water valves145,146, and147, the first to third electric component cooling water valves153,154, and155, the stack cooling water pump141, and the electric component cooling water pump151on the basis of the temperature of the outside air and an operation mode of the flying object. For example, the controller160may control the number of rotations of each of the stack cooling water pump141and the electric component cooling water pump151on the basis of the temperature of the outside air and the operation mode of the flying object. Further, the controller160may switch the first to third stack cooling water valves145,146, and147and the first to third electric component cooling water valves153,154, and155to an open state or a closed state on the basis of the operation mode of the flying object. In more detail, the controller160may determine the range of the number of rotations according to the operation mode of the flying object and may increase or decrease the number of rotations of each of the stack cooling water pump141and the electric component cooling water pump151according to the temperature of the outside air within the determined range of the number of rotations. The controller160may determine the range of the number of rotations according to the operation mode of the flying object and may decrease the number of rotations of each of the stack cooling water pump141and the electric component cooling water pump151within the determined range of the number of rotations as the temperature of the outside air decreases. Meanwhile, the controller160may determine the range of the number of rotations according to the operation mode of the flying object and may increase the number of rotations of each of the stack cooling water pump141and the electric component cooling water pump151within the determined range of the number of rotations as the temperature of the outside air increases. The operation mode of the flying object may include an initial start mode, an emergency operation mode, a normal operation mode, and a maximum output mode. When the operation mode of the flying object is the initial start mode or the emergency operation mode, the controller160may switch the first stack cooling water valve145and the first electric component cooling water valve153to the open state and switch the second and third stack cooling water valves146and147and the second and third electric component cooling water valves154and155to the closed state. In this case, the cooling water is introduced into the main radiator110through the first stack cooling water valve145and the first electric component cooling water valve153, the controller160may rotate the cooling fan111. Thus, the cooling water may dissipate the heat through the stack radiator STACK RAD and the electric component radiator ELEC RAD of the main radiator110. When the operation mode of the flying object is the normal operation mode, the controller160may switch the second and third stack cooling water valves146and147and the second and third electric component cooling water valves154and155to the open state and switch the first stack cooling water valve145and the first electric component cooling water valve153to the closed state. In this case, when the cooling water is introduced into the stack radiators STACK RAD and the electric component radiators ELEC RAD of the first and second sub-radiators120and130through the second and third stack cooling water valves146and147and the second and third electric component cooling water valves154and155, the controller160may stop the rotation of the cooling fan111. Thus, the cooling water may dissipate the heat through the stack radiators STACK RAD and the electric component radiators ELEC RAD of the first and second sub-radiators120and130. When the operation mode of the flying object is in the maximum output mode, the controller160may switch the first to third stack cooling water valves145,146, and147and the first to third electric component cooling water valves153,154, and155to the open state. In this case, the controller160may rotate the cooling fan111, and the cooling water may dissipate the heat through the stack radiators STACK RAD and the electric component radiators ELEC RAD of the main radiator110and the first and second sub-radiators120and130. FIG.3is a view illustrating a configuration of a fuel cell system according to another embodiment of the present disclosure. Referring toFIG.3, a fuel cell system according to another embodiment of the present disclosure may include the main radiator110, the first sub-radiator120, the second sub-radiator130, the stack cooling water pump141, the fuel cell stack143, the heater144, the first to third stack cooling water valves145,146, and147, a flow path switching valve149, the electric component cooling water pump151, the electric component152, the first to third electric component cooling water valves153,154, and155, and the controller160. The main radiator110, the first sub-radiator120, the second sub-radiator130, the stack cooling water pump141, the fuel cell stack143, the heater144, the first to third stack cooling water valves145,146, and147, the electric component cooling water pump151, the electric component152, the first to third electric component cooling water valves153,154, and155, and the controller160, which are illustrated inFIG.3, may be configurations that perform the same operations as those of the main radiator110, the first sub-radiator120, the second sub-radiator130, the stack cooling water pump141, the fuel cell stack143, the heater144, the first to third stack cooling water valves145,146, and147, the electric component cooling water pump151, the electric component152, the first to third electric component cooling water valves153,154, and155, and the controller160, which are illustrated inFIG.2. Thus, a detailed description of each configuration is substituted for the description of each component inFIG.2. The flow path switching valve149may perform the operations performed by the bypass valve142and the temperature control valve148ofFIG.2under the control of the controller160. For example, the flow path switching valve149may, under the control of the controller160, adjust the temperature of the cooling water introduced into the stack cooling water pump141by adjusting the amount of the cooling water passing through the main radiator110and the first and second sub-radiators120and130to introduce the cooling water to the stack cooling water pump141and by adjusting the amount of the cooling water passing through the heater144turned off without passing through the main radiator110and the first and second sub-radiators120and130to introduce the cooling water to the stack cooling water pump141. Further, the flow path switching valve149may control the flow path of the cooling water under the control of the controller160so that the cooling water circulates through one of the fuel cell stack143and the heater144. FIGS.4and5are flowcharts for describing a control operation for the fuel cell system according to the embodiment of the present disclosure. In particular,FIG.4is a view for describing an operation which allows the cooling water to circulate through at least one of the main radiator110, the first sub-radiator120, and the second sub-radiator130according to the operation mode of the flying object. Referring toFIG.4, a method of controlling circulation of cooling water in a fuel cell system according to the embodiment of the present disclosure may include an initial start mode operation S1, a first valve control operation S2, an operation mode selection operation S3, an emergency operation mode application operation S4, a second valve control operation S5, a normal operation mode application operation S6, a third valve control operation S7, a maximum output operation mode application operation S8, a fourth valve control operation S9, and an operation termination determination operation S10. The initial start mode operation S1 may be a mode selected when the flying object is started. In this case, the fuel cell stack143may generate electric energy to supply the electric energy to the rotor of the flying object so as to rotate the rotor. The propeller wing200may be rotated by the rotation of the rotor, the downdraft may be formed by the rotation of the propeller wing200, and thus the flying object may take off. The first valve control operation S2 may include an operation in which, in the initial start mode, to stably manage the heat of the fuel cell stack143and the electric component152, the first stack cooling water valve145and the first electric component cooling water valve153are switched to the open state so that the cooling water is provided to the stack radiator STACK RAD and the electric component radiator ELEC RAD of the main radiator110, and an operation of operating the cooling fan111. The operation mode selection operation S3 may include an operation in which, after the initial start mode operation S1, one operation mode of the emergency operation mode S4, the normal operation mode S6, and the maximum output operation mode S8 is selected from an operator of the flying object or a system of the flying object. When the emergency operation mode S4 is selected in the operation mode selection operation S3, the second valve control operation S5 may be performed. Further, when the normal operation mode S6 is selected in the operation mode selection operation S3, the third valve control operation S7 may be performed. Further, when the maximum output operation mode S8 is selected in the operation mode selection operation S3, the fourth valve control operation S9 may be performed. The second valve control operation S5 may include an operation in which, in the emergency operation mode, to stably manage the heat of the fuel cell stack143and the electric component152, the first stack cooling water valve145and the first electric component cooling water valve153are switched to the open state so that the cooling water is provided to the stack radiator STACK RAD and the electric component radiator ELEC RAD of the main radiator110, and an operation of operating the cooling fan111. The third valve control operation S7 may include an operation in which, in the normal operation mode, the second and third stack cooling water valves146and147and the second and third electric component cooling water valves154and155are switched to the open state so that the cooling water is provided to the first and second sub-radiators120and130. In this case, the stack radiators STACK RAD and the electric component radiators ELEC RAD of the first and second sub-radiators120and130may dissipate the heat of the cooling water using the downdraft caused by the rotation of the propeller wing200. The fourth valve control operation S9 may include an operation in mode which, in the maximum output operation mode, all of the first to third stack cooling water valves145,146and147and the first to third electric component cooling water valves153,154and155are switched to the open state so that the cooling water may be provided to the main radiator110and the first and second sub-radiators120and130, and an operation of operating the cooling fan111. In the fourth valve control operation S9, during the maximum output operation mode, the cooling water may be provided to all of the radiators110,120, and130so that the heat of the fuel cell stack143and the electric component152is dissipated to the maximum. After one operation among the second to fourth valve control operations S5, S7, and S9 is performed, the operation termination determination operation S10 may be performed. The operation termination determination operation S10 may include an operation of determining whether or not the operation of the flying object is terminated. When it is determined in the operation termination determination operation S10 that the operation of the flying object is not terminated (No), the operation mode selection operation S3 may be performed again. Meanwhile, when it is determined in the operation termination determination operation S10 that the operation of the flying object is terminated (Yes), the method of controlling circulation of cooling water in a fuel cell system according to the embodiment of the present disclosure may be terminated. FIG.5illustrates a method of controlling a cooling water pump in a fuel cell system on the basis of the operation mode of the flying object and the temperature of the outside air (outdoor air). In this case,FIG.5may be a method of controlling a circulation speed of the cooling water by controlling the number of rotations of the cooling water pump according to the operation mode of the flying object and an outside air temperature. It may be understood that the cooling water pump includes the stack cooling water pump141and the electric component cooling water pump151illustrated inFIG.2. TABLE 1A1 <Temperature application rangeTemp < A1Temp < A2. . .Temp > AnOperationInitial start orB0B1. . .MaxmodeemergencyoperationNormal operationC0C1. . .MaxMaximum outputD0D1. . .Maxoperation Table 1 may show an initial selection value of the number of rotations of the cooling water pump according to the temperature of the outside air and the operation mode of the flying object. In this case, the numbers of rotations of the stack cooling water pump141and the electric component cooling water pump151according to each operation mode may be different from each other. For example, when an outside air temperature Temp is lower than A1, in the initial start mode or the emergency operation mode, the initial number of rotations of the cooling water pump may be set to B0, in the normal operation mode, the initial number of rotations of the cooling water pump may be set to C0, and in the maximum output operation, the initial number of rotations of the cooling water pump may be set to D0. Further, when the outside air temperature Temp is higher than A1 and lower than A2, in the initial start mode or the emergency operation mode, the initial number of rotations of the cooling water pump may be set to B1, in the normal operation mode, the initial number of rotations of the cooling water pump may be set to C1, and in the maximum output operation, the initial number of rotations of the cooling water pump may be set to D1. Further, when the outside air temperature Temp is higher than An, in the initial start mode or the emergency operation mode, the normal operation mode, and the maximum output operation mode, the initial number of rotations of the cooling water pump may be set to a maximum value Max. In this case, as the outside air temperature Temp becomes larger, the initial number of rotations of the cooling water pump in each operation mode may be increased. That is, B1 may have a value higher than that of B0, C1 may have a value higher than that of C0, and D1 may have a value higher than that of D0. Referring to Table 1 andFIG.5, a method of controlling a cooling water pump of a fuel cell system according to the embodiment of the present disclosure will be described as follows. The method of controlling a cooling water pump of a fuel cell system according to the embodiment of the present disclosure may include an initial start mode or emergency operation mode selection operation S11, a normal operation mode selection operation S12, a maximum output mode selection operation S13, a cooling water pump rotation number selection operation S14, a cooling water pump rotation number input operation S15, a temperature comparison operation S16, a first temperature difference determination operation S17, a rotation number decrease operation S18, a second temperature difference determination operation S19, a rotation number increase operation S20, an outside air temperature application range change determination operation S21, and an application range selection operation S22. One operation mode may be selected from the initial start mode or emergency operation mode selection operation S11, the normal operation mode selection operation S12, and the maximum output mode selection operation S13. The cooling water pump rotation number selection operation S14 may include an operation of selecting the initial number of rotations of the cooling water pump according to the selected operation mode. Referring to Table 1, in the cooling water pump rotation number selection operation S14, one value may be selected from values in Table 1 according to the selected operation mode. The cooling water pump rotation number input operation S15 may be an operation in which the one value selected from the values in Table 1 is set to the initial number of rotations of the cooling water pump. In this case, when the initial number of rotations of the cooling water pump is set, the cooling water pump may be operated at the set initial number of rotations. The temperature comparison operation S16 may include an operation of determining whether the measured temperature of the cooling water is higher than a target temperature. In this case, the measured temperature of the cooling water may be obtained by measuring the temperature of the cooling water flowing into the fuel cell stack143. In the temperature comparison operation S16, when the measured temperature of the cooling water is not higher than the target temperature (No), the first temperature difference determination operation S17 may be performed. Meanwhile, in the temperature comparison operation S16, when the measured temperature of the cooling water is higher than the target temperature (Yes), the second temperature difference determination operation S19 may be performed. The first temperature difference determination operation S17 may include an operation of determining whether a difference between the measured temperature of the cooling water and the target temperature is within a preset temperature difference. In the first temperature difference determination operation S17, when the difference between the measured temperature of the cooling water and the target temperature is within the preset temperature difference (Yes), the outside air temperature application range change determination operation S21 may be performed. Meanwhile, in the first temperature difference determination operation S17, when the difference between the measured temperature of the cooling water and the target temperature is not within the preset temperature difference (No), the rotation number decrease operation S18 may be performed. The rotation number decrease operation S18 may include an operation of decreasing the number of rotations of the cooling water pump. After the rotation number decrease operation S18 is performed, the outside air temperature application range change determination operation S21. That is, when the measured temperature of the cooling water is not higher than the target temperature, and when the difference between the measured temperature of the cooling water and the target temperature is within the preset temperature difference, the outside air temperature application range change determination operation S21 may be performed. Meanwhile, when the measured temperature of the cooling water is not higher than the target temperature, and when the difference between the measured temperature of the cooling water and the target temperature is not within the preset temperature difference (when the difference is higher than the preset temperature difference), after the number of rotations of the cooling water pump is decreased, the outside air temperature application range change determination operation S21 may be performed. The second temperature difference determination operation S19 may include an operation of determining whether a difference between the measured temperature of the cooling water and the target temperature is within the preset temperature difference in a state in which the measured temperature of the cooling water is higher than the target temperature. In the second temperature difference determination operation S19, when the difference between the measured temperature of the cooling water and the target temperature is within the preset temperature difference (Yes), the outside air temperature application range change determination operation S21 may be performed. Meanwhile, in the second temperature difference determination operation S19, when the difference between the measured temperature of the cooling water and the target temperature is not within the preset temperature difference (No, when the difference is higher than the preset temperature difference), the rotation number increase operation S20 may be performed. The rotation number increase operation S20 may include an operation of increasing the number of rotations of the cooling water pump. That is, when the temperature of the cooling water is higher than the target temperature by the preset temperature difference or more, after the number of rotations of the cooling water pump is increased, the outside air temperature application range change determination operation S21 may be performed. Meanwhile, when the temperature of the cooling water is higher than the target temperature by less than the preset temperature difference, the outside air temperature application range change determination operation S21 may be performed. As a result, in the method of controlling a cooling water pump of a fuel cell system according to the embodiment of the present disclosure, when the difference between the measured temperature of the cooling water and the target temperature is equal to or higher than the preset temperature difference after the initial number of rotations of the cooling water pump is set by the operation mode, the outside air temperature application range change determination operation S21 may be performed after the number of rotations of the cooling water pump is increased or decreased. Further, in the method of controlling a cooling water pump of a fuel cell system according to the embodiment of the present disclosure, when the difference between the measured temperature of the cooling water and the target temperature is within the preset temperature difference after the initial number of rotations of the cooling water pump is set by the operation mode, the number of rotations of the cooling water pump is not increased or decreased, and the outside air temperature application range change determination operation S21 may be performed. The outside air temperature application range change determination operation S21 may include an operation of determining whether the measured outside air temperature Temp deviates from a currently selected temperature section among a temperature section shown in Table 1. In the outside air temperature application range change determination operation S21, when the measured outside air temperature deviates from the selected temperature section (Yes), the application range selection operation S22 may be performed in which the temperature section is selected according to the measured outside air temperature. Meanwhile, in the outside air temperature application range change determination operation S21, when the measured outside air temperature does not deviate from the selected temperature section (No), the cooling water pump rotation number input operation S15 may be performed in which the initial number of rotations of the cooling water pump is maintained. As described above, in the method of controlling a cooling water pump of a fuel cell system according to the embodiment of the present disclosure, the number of rotations of the cooling water pump is controlled on the basis of the operation mode and the outside air temperature, and thus thermal management efficiency of the fuel cell system may be increased, and power consumption required for thermal management may be minimized. The present technology has an advantage in that heat generated in a fuel cell system used in a flying object may be efficiently dissipated. In addition, various effects directly or indirectly identified though the present document may be provided. The above description is merely illustrative of the technical spirit of the present disclosure, and those skilled in the art to which the present disclosure belongs may make various modifications and changes without departing from the essential features of the present disclosure. Thus, the embodiments disclosed in the present disclosure are not intended to limit the technology spirit of the present disclosure, but are intended to describe the present disclosure, and the scope of the technical spirit of the present disclosure is not limited by these embodiments. The scope of protection of the present disclosure should be interpreted by the appended claims, and all technical spirits within the scope equivalent thereto should be interpreted as being included in the scope of the present disclosure. | 37,087 |
11942668 | DETAILED DESCRIPTION In the following detailed description, reference will be made to the accompanying drawing(s), in which identical functional elements are designated with like numerals. The aforementioned accompanying drawings show by way of illustration, and not by way of limitation, specific embodiments and implementations consistent with principles of the present invention. These implementations are described in sufficient detail to enable those skilled in the art to practice the invention and it is to be understood that other implementations may be utilized and that structural changes and/or substitutions of various elements may be made without departing from the scope and spirit of present invention. The following detailed description is, therefore, not to be construed in a limited sense. The pure hydrogen gas supply is commonly pumped into and stored in high pressure tanks at roughly 350 bar to 700 bar. The oxygen is sourced from the surrounding ambient air, containing roughly 21% oxygen, and thus must be pressurized by a device before entering the fuel cell stack to achieve high volumetric flow rates and high overall levels of power density for the fuel cell system. The device responsible for pressurizing and creating the necessary air flow is usually an air compressor. These air compressors come in two main varieties: mechanical compressors coupled to a shaft, or electronically controlled compressors. Since the hydrogen supply is already in pressurized form, it is traditional to throttle the power output of the fuel cell by modifying the amount of air being fed into the fuel cell. This is done by speeding up or slowing down the air compressor as required by the application. Because the air compressor is a physical object, there are limits to how quickly it can be sped up or slowed down, thus affecting the response time of the fuel cell's power delivery. Generally, the oxygen supply (provided by compressed air) is the limiting factor of fuel cell power output. Secondly, as ambient air contains mostly nitrogen (78%), there are other chemical reactions and processes that take place within the fuel cell. These other processes lead to inefficiencies in the system, and thus do not allow the fuel cell to operate in a linear power output, nor without a minimum power requirement. The minimum operating power requirement for a fuel cell stack is centered around the humidity level within the fuel cell stack. Since water vapor is a product of the chemical reaction between hydrogen and oxygen, controlling the fuel cell is as much about getting the water out, as it is getting the reactant gases in. The management of this water vapor is extremely important, as too much water vapor on each cell will reduce surface area available for future chemical reactions to occur, and thus lowering the power output of the stack; and too little water vapor on each cell will increase the available surface area for the reaction, increasing the reaction rate, and potentially causing the fuel cell to heat up and oxidize the membrane on which the reactions occur. This oxidation is irreversible, and will permanently damage the fuel cell's ability to produce its rated power output. This minimum power requirement is a challenge for aviation use cases, as an aircraft's load profile is dramatically different from common fuel cell applications. Primarily, as the passengers board, the system is started up, and the plane taxis to the runway in preparation for take-off, the plane uses very little power, most likely below the manufacturer's minimum power requirement for safe operation. Currently, the most common implementation of a fuel cell system100requires a buffer battery104to physically drive the load/application, leaving the fuel cell system100to only charge the battery104as needed (SeeFIG.1). More particularly, the system100includes a fuel cell101operably coupled to a compressor102to feed the air to the fuel cell101, a DC/DC converter103, a buffer battery104, and inverter105all operably connected to ultimately run a motor106. If power required by the application is below the manufacturer's minimum power requirements, the vehicle uses the buffer battery104to propel itself. Once the system100deems the battery104must be charged, the fuel cell101kicks on and charges the battery104. This creates a smooth and known power requirement for the fuel cell101above its minimum operating power threshold, while the battery104tailors to the dynamic nature of the load. In the proposed systems, there are quite a few inventive techniques that allow the successful operation and deployment of fuel cell technology without the use of a buffer battery (SeeFIG.2), with no detrimental effects to performance and the application. 1. Actively Managing Fuel Cell Load Demand—Below Minimum Power The fuel cell system100is designed to operate in a very narrow temperature range. At power levels above the manufacturer's minimum power output, the fuel cell will continue to heat itself in the process of generating power output and regulate its own temperature. In the case when the power generation is below the manufacturer's minimum power and the fuel cell cannot raise its own temperature to the specified range, the present disclosure envisions adding a sizeable load to the system100via a resistive heater circuit(s) in the fuel cell's coolant circuit(s) (not shown). This heater circuit(s) will be combined in parallel with the load and fuel cell output. This strategy will accomplish two things: simultaneously raise the load power drawn from the fuel cell, and heat up the coolant circuit(s) to the correct operating temperatures. While a traditional system100may use a battery to operate below minimum power requirement levels, it is envisioned to utilize the above method of increasing the load power. 2. Actively Managing Fuel Cell Load Demand—Above Maximum Power (not Shown) The power output of a fuel cell101is limited by the reaction rate, and as such, the oxygen supply is usually the limiting factor of traditional systems. If oxygen supply is taken care of (see below for various methods to accomplish this purpose), then the next limiting factor for fuel cell101power output is thermal management and keeping the fuel cell stack within the correct operating temperature range. It is contemplated that using an active cooling system (not shown), controlled and monitored by the fuel cell system100to actively cool the fuel cell101stack to allow operation past the designed maximum power level will accomplish this purpose. This can be done with traditional cooling circuits (not shown) consisting of coolant pumps, temperature sensors, heat exchangers, and valves to direct and confirm the direction of flow throughout the system100. While a traditional system may use a battery104to operate short intervals above the fuel cell's101maximum output levels, the above method will allow the safe operation of the fuel cell101without the use of a buffer battery104. 3. Lowering the Stack Temperature to Facilitate a Lower Minimum Operating Power (not Shown) The fuel cell101stack is an actively-cooled component, with specifically targeted operating temperatures. These temperatures promote ideal reaction rates at each cell membrane, thus promoting peak power outputs. While the manufacturer of the fuel cell101designs the fuel cell101for a specific maximum power output, the idea is to operate the fuel cell101at a lower core temperature when the power required by the application is below the minimum power threshold of the fuel cell101stack. This provides the following benefits: Lower fuel cell101stack core temperature creates a higher temperature delta as the fuel cell101operates between cell membrane temperature and reaction temperature. This higher temperature delta facilitates the formation of more condensation on the cell membranes. More condensation on each fuel cell101cools the membrane and prevents the damaging oxidation from occurring. Lack of oxidation on the fuel cells101promotes low power applications, thus not requiring the buffer battery104. 4. Feed Forward Load Prediction Algorithm (FIG.3) During normal operation of the fuel cell, e.g., fuel cell201(FIG.2), the response time of the fuel cell, e.g., fuel cell201, power output compared to the application requirements is almost exclusively due to the physical ramp up of the air compressor, e.g., compressor302. At or close to maximum power levels, the fuel cell201also begins to encounter a thermal limit to its power output. It is envisioned to use multiple inputs from the pilot320and control system315to generate a future load feed forward calculating algorithm310in preparation of future conditions and power requirements and to adjust the air supply303,302and active cooling mechanisms built into the fuel cell temperature control system325. Using a series of pilot-operated inputs320along with calculations from the plane's avionics and control system315, the compressor302speed can be anticipated for future power requirements, rather than rely on instantaneous power requirements (surges). This ensures that the fuel cell201has the correct amount of airflow at all times, regardless of external factors and instantaneous power surges. This will decrease power delivery response time from the fuel cell201, contributing to an overall safer operation of the fuel cell system300. It is also envisioned that if the cooling circuits are also ramped up in preparation for high power output, then safer and more reliable operation of the fuel cell201will occur. This anticipatory calculation is the feed forward portion of the algorithm310shown inFIG.3. 5. Electronically Controlled Air Compressor for Quick Response (FIGS.4A and4B) In order for the fuel cell system400,500to operate without a buffer battery, the power delivery must be smooth, controllable, and predictable as the load requirements change. Since the fuel cell system400,500is almost exclusively throttled through the flow of oxygen into the fuel cell stack, the supply of oxygen must also be equally controllable. In order to accomplish this, the air compressor402,502a-502csupplying the oxygen must be controllable independent of the load. There are two methods to achieve this:1) using an electronically controllable air compressor, which is fed input signals from an external device, e.g., compressor control system403,503. This external device403,503will be in the flight computer onboard the aircraft; and/or2) using a shaft-driven mechanical air compressor, using the drivetrain for its input power (not shown). In order to control the flow and pressure of air into the fuel cell system400,500at various engine speeds, the compressor402,502a-502cwill have either an electronically-controlled valve or spring-actuated wastegate (not shown) that bleeds unnecessary air away.6. Oversized Air Compressor for Quick Response (FIG.4A) Generally, the air compressors402are sized to provide the fuel cell's peak output power at their fastest speeds/highest flow rates. Since there is a certain time lag for the air compressor402to speed up and slow down as power demands vary, the air compressor402can be oversized to compensate for this lag. With a larger air compressor402in the system, the fuel cell will be able to meet its air requirements sooner, as it does not need it to come to full speed. If the air requirements are met sooner, then the use case for a buffer battery is eliminated.7. Paralleled Air Compressors for Quick Response (FIG.4B) Conversely to the previous inventive idea, if a larger air compressor, e.g., compressor402, is not feasible due to packaging constraints or weight, several air compressors502a-502nplumbed in parallel may be used to meet the fuel cell's air requirements. These air compressors502a-502nmay vary in size, or be staged in a compounding setup to better fit the packaging and air requirements of the application. Smaller air compressors502a-502nwill have less inertia to overcome and therefore are able to change their flow rates quicker. If the air requirements are met sooner, a buffer battery may be eliminated.8. Starting the Fuel Cell System without an Onboard High Voltage Source In order for fuel cell systems to start creating power, air flow must first be introduced. As discussed previously, the air flow traditionally comes from an onboard electric air compressor. These air compressors are generally high voltage items, and thus require a high voltage source to begin operating. This high voltage source is usually the buffer battery. Without a buffer battery, it is envisioned that the following methods may be utilized to start the fuel cell system: Because only a small amount of air flow is required to begin the fuel cell system, a small, low-voltage air compressor can be designed into the system that operates at the traditional 24V aviation voltage level. This compressor would be sized so that it could provide enough air flow to start the main compressor(s) in the fuel cell system from the fuel cell output power at any point in the plane's flight plan, primarily used for ground start operation, and emergency in-flight restart operation. A ground start procedure using a high voltage battery can be implemented to start the fuel cell process. From that point on, the fuel cell and air compressors would be self-sufficient. If a failure occurred during flight, and the system needed to be restarted, a valve can be built into the plane and fuel cell system to utilize a “Ram-Air” effect using the plane's forward motion to provide the necessary airflow to restart the fuel cell system. The fuel cell system can also carry an emergency supply of compressed air that can be used to start the fuel cell system in the event of an emergency. The compressed air can be sized to allow for several restart attempts, and will provide ample air to start the fuel cell system so it can then start the onboard high voltage air compressor. The motor(s) in an electric drivetrain free-wheel when power is not applied. If an in-air restart needs to occur, and a mechanical air compressor is being utilized, rather than an electric air compressor, then the spinning of the propeller attached to the free-wheeling motors should be enough energy to spin the air compressor and generate the necessary air flow through the fuel cell system to power up the motor(s) and begin normal operation again. FIG.1illustrates overall architectures—traditional and proposed Systems:101—Fuel Cell: Provides electric power to inverter.102—Air Compressor: Provides the necessary Air Flow to the Fuel Cell.103—DC/DC Converter: Conditions the Fuel Cell Voltage Output to Charge the Battery.104—Battery: In conventional systems, this is used to fill gaps where the Fuel Cell(s) lack power.105—Inverter: Converts DC electricity from the fuel cell into AC electricity for the motor.106—Motor: Generates torque to spin the propulsor's shaft. FIG.3illustrates Feed Forward Load Prediction Algorithm Control Loop. FIGS.4A,4Billustrate Electronically Controlled Air Compressor(s) For Quick Response. FIG.4Ashows a typical system configuration with a single oversized air compressor. FIG.4Bshows a system configuration utilizing ‘n’ number of air compressors. Finally, it should be understood that processes and techniques described herein are not inherently related to any particular apparatus and may be implemented by any suitable combination of components. Further, various types of general purpose devices may be used in accordance with the teachings described herein. It may also prove advantageous to construct specialized apparatus to perform the method steps described herein. The present invention has been described in relation to particular examples, which are intended in all respects to be illustrative rather than restrictive. Moreover, other implementations of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. Various aspects and/or components of the described embodiments may be used singly or in any combination in aircraft power plants. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims. | 16,384 |
11942669 | DETAILED DESCRIPTION In some aspects, the present disclosure is directed to methods and systems for removing impurities from an electrolyte solution using a chemical reduction and filtration process. A particularly useful embodiment is described below in the context of a vanadium redox flow battery (VRFB) in which one or more impurities in the vanadium-based electrolyte solution that would in the normal course clog the electrochemical cell of the VRFB during normal use are removed. An oxidation process, such as an electrochemical oxidation process, can be used after filtration to adjust the valence of the reduced electrolyte solution to a desired value, often an electrolyte 3.5 valence. In other aspects, the present disclosure is directed to methods and systems directed to and relating to commissioning a redox flow battery (RFB). In a particular embodiment, an electrolyte solution is first reduced to a relatively low oxidation valence and then oxidized to make negative and positive electrolyte solutions having differing valences. The negative and positive electrolyte solutions are installed into the negative and positive sides of an RFB, respectively, thereby eliminating the need for the typical battery-charging process that accompanies conventional battery commissioning. These and other aspects of the present disclosure are described and exemplified below in detail. Referring now to the drawings,FIG.1illustrates an overall process of making an electrolyte solution having a desired valence by reduction-based purification followed by filtration and oxidation-based valence adjustment. To understand the purification process, i.e., the electrochemical reduction and filtering shown inFIG.1, it must be understood that the purification at issue involves the removal of solid precipitates that form from impurities in the electrolyte solution at a relatively low vanadium valence. In some electrolyte solutions, certain impurities are in aqueous states when the valence of the electrolyte solution is relatively high but are transformed to their solid forms when the valence of the electrolyte solution is sufficiently low. Depending on the use of the electrolyte solution, the solids formed when the electrolyte solution's valence is relatively low can be detrimental to that use. For example, in the context of an RFB, impurity solids on the negative side of the RFB's electrochemical cell can clog the negative electrode, causing the electrical performance of the RFB to degrade as the negative electrode becomes increasingly clogged by the solids over time. Using a VRFB as an example, in order to manufacture electrolyte solutions for a VRFB cost effectively, an inexpensive source of vanadium oxides is required. Generally, low price vanadium oxides have high levels of impurities that end up in the electrolyte solutions and have a large negative impact on VRFB performance. As noted above, the most detrimental impurities are the ones that are aqueous in the as-received electrolyte solution, but will precipitate out as solids that clog the negative electrode after the system's initial charge. In other words, the most detrimental impurities are soluble/aqueous in an electrolyte solution of vanadium (III)/(IV) ions but are insoluble (i.e. form solid precipitates) in a solution of vanadium (II)/(III) ions. The purification process illustrated inFIG.1can readily be used to filter the precipitatable impurities out of the electrolyte solution prior to using the solution in a VRFB. Referring particularly toFIG.1, this figure illustrates purification and valence-adjustment performed in accordance with the present disclosure in the context of an example electrolyte solution in which the electrolyte has four possible oxidation states, here, +2, +3, +4, and +5. As seen in zone100ofFIG.1, the purification process involves first reducing the electrolyte solution to a valence that is lower than the valence at which the target impurity(ies) precipitate(s) out of the electrolyte solution. The starting valence in zone100can be anywhere from 3.5 to 5.0, depending on the vanadium oxide feedstock used; inFIG.1we assume V2O5is the sole feedstock and the resulting starting valence is 5.0. In the example illustrated, the electrolyte solution is reduced approximately to its lowest oxidation state (here, an oxidation state of (II) (2.0)). For a vanadium-based electrolyte solution, for example, target impurities precipitate out of the solution at a valence at or below a valance of 3.0. Consequently, in some embodiments, the reduction need only take the valence of the electrolyte solution below about 3.0, such as 2.9 to 2.0. However, a lower valence can be desirable to accelerate the reduction process. The reduction can be performed using any suitable process, such as electrochemical reduction using an electrochemical cell. In one example, a hybrid electrochemical cell may be used, wherein one half-cell utilizes a VRB electrolyte, and the other half-cell uses a non-VRB reductant. In another example, the electrochemical cell may be configured to accept a VRB electrolyte on both halves of the cell. Once the impurities precipitate out of the electrolyte solution, in zone104ofFIG.1solid precipitates are removed from the solution. Precipitate removal can be performed using any suitable removal means, such as via one or more porous filters and/or one or more cyclones, among other things. Depending on the use of the electrolyte solution, only the precipitates of a certain size may need to be removed, such that the removal equipment can be designed accordingly. For example, in a VRFB that includes a negative electrode having a particular pore size, precipitates of a certain size smaller than this pore size may not need to be filtered, since they can flow through the negative electrode and not clog it. At an optional step, illustrated in zone108ofFIG.1, the purified electrolyte solution, i.e., the solution having the desired amount of precipitate removed, may be oxidized to a desired valence. As an example and using a vanadium electrolyte, the purified electrolyte solution may be oxidized so that it has a mix of vanadium (III) and vanadium (IV) ions and a valence of about 3.5, which is the valence of conventional vanadium-based electrolyte solution typically provided for commissioning VRFBs. This mix is represented by line112inFIG.1. As another example using vanadium as the electrolyte, and as shown inFIG.1, purified electrolyte solution may be oxidized to create two electrolyte solutions of differing valences, such as one electrolyte solution of valence at or below 3.0, such as a valence of 2.5, containing vanadium (II) and vanadium (III) ions and another electrolyte solution of valence at or above 4.0, such as a 4.5 valence, containing vanadium (IV) and vanadium (V) ions. These two electrolyte solutions are represented, respectively, inFIG.1by lines116and120. In this example, these two electrolyte solutions can be used, respectively, as the negative and positive electrolyte solutions of a VRFB. As mentioned above, when a VRFB is conventionally commissioned, an electrolyte solution of 3.5 valence is provided to both the negative and positive electrolyte tanks of the VRFB, and then the battery is charged so that the negative-side electrolyte solution settles at a valence of about 2.5 and the positive-side electrolyte solution settles at a valence of about 4.5. However, when the method ofFIG.1is used to make the negative (such as a 2.5 valence) and positive (such as a 4.5 valence) electrolyte solutions and these electrolyte solutions are added to the VRFB, the commissioning charge step can be eliminated. It is noted that if the feedstock electrolyte solution is sufficiently pure, i.e., is sufficiently devoid of precipitatable impurities, then the impurity removal step can be eliminated in the process of making the negative and positive electrolyte solutions. This embodiment may be particularly useful when a high-oxidation-state material, such as V2O5is used as sole vanadium feedstock for making the electrolyte. In some embodiments, any of the methods represented byFIG.1may be performed at an electrolyte solution production facility such that the resulting electrolyte solution(s) is/are transported to the location of use, such as VRFB installation quite remote from the production facility. However, the cost of transporting electrolyte solutions can be quite high due to factors such as distance, corrosivity of the electrolyte solutions, and the fact that a large percentage of the weight of the solutions is due to the solvents (e.g., acid and water) in the solutions. Consequently, in other embodiments, any of the methods represented byFIG.1may be performed at or in close proximity to the location of use. For example, components, such as reduction equipment, precipitate removal equipment, and oxidation equipment, of a system can be containerized, palletized, or otherwise made readily transportable so that the method(s) can be performed locally. In some embodiments, electrochemical cells are used for reduction and oxidation, and those cells need to be energized with electricity to drive the reactions. In such embodiments that are used proximate to the use locations of the fabricated electrolyte solutions and in which the solutions are used for batteries for renewable energy sources, such as wind turbines and solar farms, the electricity needed for the reduction and/or oxidation processes can be provided by the renewable energy sources. Advantages of methods of the present disclosure over existing methods include:No prior method utilizes precipitation of impurities for removal. Precipitated impurities are removed mechanically, for example, via filtration and/or a hydrocyclone.No prior method utilizes both an electrochemical oxidation and reduction of the electrolyte for the formation and removal of key impurities.No prior method uses electrochemical cells for reduction and oxidation of the VRB electrolyte. An example of a cell for vanadium-based electrolyte reduction is a hydrogen/VRB cell, where H2gas is oxidized (consumed) at the cathode and VRB electrolyte is reduced at the anode. The oxidation cell is similar: H2is produced on the anode, and VRB electrolyte is oxidized on the cathode.No other method allows the production of both separate anolyte and catholyte solutions for a VRFB system using the same electrochemical system. FIG.2illustrates an example purification process200that uses two electrochemical sub-processes, namely, a reduction/purification sub-process200(1) for reducing and purifying the electrolyte solution and an oxidation sub-process200(2) for adjusting the valence of the electrolyte solution to a desired valence. Process200of this example enables the use of vanadium oxides of a single oxidation state and of reduced purity. The formation and purification of the electrolyte solution in example process200is performed in a continuous manner, and the process is designed to operate at room temperature. Example process200removes impurities that are the most detrimental to VRFB performance, namely, impurities that are aqueous in a mixed vanadium (III)/(IV) solution but that will form solid precipitates after charging to make vanadium (II)/(III) solution. As noted above, it is these precipitates that can clog the negative electrode. The purification performed by process200relies on the discovery that the most detrimental impurities will precipitate out in a vanadium (II)/(III) solution and that these impurities can be removed mechanically, such as by filtration and/or cycloning, among other things. In this example, other impurities, such as K, Na, and Al, are not removed in process200, because they remain as aqueous ions in a vanadium (II)/(III) solution; however, the impact of these aqueous ions on battery performance is negligible. Electrochemical reduction and subsequent oxidation of the vanadium-based electrolyte are critical to its formation and purification. In this example, the reduction and oxidation of the electrolyte solution are performed in two separate sub-processes, each using one or more of its own electrochemical cells. It is noted that for the sake of illustration, only a single electrochemical cell is shown for each of the two sub-processes200(1) and200(2), though each sub-process could use two or more electrochemical cells. Reduction/purification sub-process200(1), wherein electrochemical reduction of the vanadium electrolyte occurs, is performed by a “reduction cell”204, such as a hybrid electrochemical cell. Electricity (not illustrated) is provided to operate reduction cell204, and vanadium-based electrolyte solution208is reduced on the cathode204C, and a reductant212is oxidized on the anode204A. In the illustrated example, reductant212is H2gas, which provides for a relatively simple and inexpensive system. However, other reductants, such as water, formic acid, ethylene glycol, among others, could be used for reductant212. FIG.3Aillustrate an example construction of a reduction cell300that can be used for reduction cell204ofFIG.2. Referring toFIG.3A, example reduction cell300includes an electrolyte flow field304, a gas flow field308(here, for H2gas), a proton-exchange membrane312, a carbon-paper electrode316, and a gas diffusion layer320coated with an H2oxidation reaction catalyst (not shown). Electrolyte solution208(FIG.2) is flowed into electrolyte flow field304, while reductant212, here, H2gas, is flowed into gas flow field308.FIG.3Billustrates the operation example reduction cell300, with block324representing the anode side of the reduction cell receiving H2reductant212, block328representing the cathode side of the reduction cell receiving electrolyte solution208, and block332representing proton-exchange membrane312that allows hydrogen protons to pass from the cathode side to the anode side, with the flow of electrons following suit.FIG.3Balso illustrates the reduction of vanadium-based electrolyte solution208and the oxidation of H2reductant212. Those skilled in the art will readily understand, the construction of reduction cell300illustrated inFIG.3Ais merely an example and that other constructions may be used as desired. Referring again toFIG.2, reduction/purification sub-process200(1) performs two functions: 1) it creates vanadium (II) ions that aid in the chemical dissolution and reduction of an electrolyte216, here V2O5powder, and 2) it precipitates out the most deleterious impurities220and enables their removal via mechanical means (e.g., filtration and/or cycloning). In the example shown inFIG.2, system200includes one or more suitable filters, here a coarse filter224and a pair of fine filters228(1) and228(2). The result is a purified electrolyte solution208P that is purified to the extent that some or all of the precipitated impurities220have been removed, again, here, by filters224,228(1), and228(2). Reduction/purification process200(1) may be controlled by an appropriate controller264that controls the process. Controller264may include any suitable hardware, such as a programmable logic controller, general purpose computer, application-specific integrated circuit, or any other hardware device(s) capable of executing a suitable control algorithm. Many types of hardware suitable for controller264are well known in the art. In one example, controller264is configured, via software or otherwise, to control the valence of the electrolyte solution flowing out of reduction cell204, here electrolyte solution208(2.0), by controlling the flow of impure electrolyte solution208from tank252into the reduction cell. In this example, inputs to the control algorithm include user settings, such as the electrical current within reduction cell204, and a valence measurement of the electrolyte in tank252by a suitable valence sensor (not shown). For example, with a fixed cell current, controller264determines whether or not the measured valence is below a target value (e.g., the precipitation valence) and outputs one or more control signals that control one or more flow-control devices (not shown) that in turn control the flow of impure electrolyte solution208into reduction tank252. Such flow-control devices may be, for example, one or more pumps, one or more valves, or one or more devices that changes the flow of impure feedstock into tank252, or any combination of these, among others. In other embodiments, controller264can be configured to control both cell current and flow of impure electrolyte solution208so as to control the valence of the electrolyte solution within tank252. Those skilled in the art will readily understand how to create a suitable algorithm for the control scheme selected for controller264based on this disclosure and for the type of hardware used. Oxidation sub-process200(2) in this example uses electrochemical oxidation to oxidize the purified electrolyte solution to bring it up to its desired valence state (such as near a 3.5 valence, near a 2.5 valence, and/or near a 4.5 valence, depending on the desired use). In this example, a hybrid electrochemical cell, referred to herein as an “oxidation cell”232, is used to drive the oxidation in response to electricity (not illustrated) provided to the cell. Purified vanadium-based electrolyte solution208P is oxidized on the anode232A, and an oxidant236is reduced on the cathode232C. In one example, protons are reduced to form H2gas on cathode232C. This is particularly convenient when H2gas is used as reductant212in the reduction cell204as mentioned above. After oxidation, the valence-adjusted electrolyte solution(s) may be optionally transferred to a VRFB, as illustrated at box240. FIG.4Aillustrate an example construction of a reduction cell400that can be used for oxidation cell232ofFIG.2. Referring toFIG.4A, example oxidation cell400includes an electrolyte flow field404, an oxidant flow field408(here, for H2gas), a proton-exchange membrane412, an oxidation-side carbon-paper electrode416, a reduction-side carbon-paper electrode420, and a gas diffusion layer424coated with an H2oxidation reaction catalyst (not shown). Electrolyte solution208(FIG.2) is flowed into electrolyte flow field404, while oxidant236, here, protons, are formed in the oxidant flow field408.FIG.4Billustrates the operation of example oxidation cell400, with block428representing the cathode side of the oxidation cell that receives H2O236, block432representing the anode side of the oxidation cell that receives electrolyte solution208P, and block436representing proton-exchange membrane412that allows hydrogen protons to pass from the cathode side to the anode side, with the flow of electrons following suit.FIG.4Balso illustrates the oxidation of vanadium-based electrolyte solution208P and the reduction of the protons into H2gas, which is removed by H2O236. Those skilled in the art will readily understand the construction of reduction cell400illustrated inFIG.4Ais merely an example and that other constructions may be used as desired. Inputs for example process200ofFIG.2are:Materials:Generally, a solvent244for dissolving metal oxides216, here V2O5powder. For the vanadium compound of the illustrated example, this solvent is composed of one or more strong acids, such as sulfuric acid and/or hydrochloric acid. In other embodiments, other solvents, such as hydrobromic acid, and chloric acid, among others, can be used.If the forgoing solvent is not a polar solvent, a polar solvent248. For the illustrated vanadium compound, water is used.An electrolyte, such as electrolyte216. In the present example, the electrolyte is vanadium pentoxide (V2O5) powder. In other embodiments one or more vanadium oxides may be used, such as vanadium (III) oxide (V2O3) alone or in combination with vanadium (V) oxide (V2O5). In other embodiments, other electrolytes, such as iron-chrome flow battery, and all uranium flow battery, among others, can be used.A proton-donating reductant, such as reductant212. In the present example, H2gas is used. In other embodiments, another reductant, such as hydrogen, water, formic acid, ethylene glycol, H2O2, among others, can be used.A proton-consuming oxidant, such as oxidant232. In this example, protons were reduced to H2gas. An alternative could be to use oxygen or Air, where O2is reduced to H2O.Electricity:Electricity (not illustrated) provides the energy input into both the reduction cell and oxidation cell. The final purified and adjusted electrolyte solution208P+A in the present example (i.e., a vanadium-based electrolyte solution valence-adjusted to 3.5 valence) may contain:electrolyte with a supporting acid solution (generally sulfuric acid and/or hydrochloric acid);a balance of vanadium (III) and (IV) ions in solution in generally a 1:1 ratio; andadditional additives for thermal stabilization. In this example, reduction/purification sub-process200(1) involves the electrochemical reduction of vanadium electrolyte solution208. The chemical/electrochemical reactions for this exemplary reduction/purification sub-process200(1) are shown below in Table I. TABLE IEqn. 1: V2O5(s)+ 2H+→ 2VO2++ H2OV2O5dissolutionEqn. 2: 2VO2++ 4V2++ 8H+→ 6V3++ 4 H2OChemical Reduction of V(V) reduction by V(II)Eqn. 3: 6V3++ 6e− → 6V2+Electrochemical reduction of V(III) ion in reductioncell − cathode reactionEqn. 4: 3H2→ 6H++ 6e−Electrochemical oxidation of reductant in reductioncell (H2as example reductant) − anode reactionEqn. 5: V2O5(s)+ 4H++3H2→ 2V2++ 5H2ONet reaction for reduction/purification sub-process One of the main challenges of using V2O5powder (electrolyte216) is its limited solubility in strong acid solutions. Instead of making a vanadium (V) electrolyte solution, this exemplary process utilizes a reduced electrolyte solution of predominantly vanadium (II) ions to both dissolve and reduce the V2O5powder. V2O5powder, water, and acid are slowly added to a well-mixed tank (tank252inFIG.2) containing electrolyte solution208of predominately vanadium (II) ions. The valence of predominantly vanadium (II) solution208in tank252is maintained via reduction cell204. When the V2O5powder (metal oxide216) is dissolved (Table I, Eqn. 1) and reduced (Table I, Eqn. 2) in predominantly vanadium (II) solution208, other vanadium ions are oxidized (Table I, Eqn. 2). This oxidation of vanadium ions is balanced using reduction cell204, which continuously reduces electrolyte solution208to maintain a constant valence. Measurements from a set of sensors (not shown) that measure the vanadium (II) and (III) concentration and the total volume may be used to control the feed rates of V2O5(metal oxide216), acid (solvent244), and water (polar solvent248) into Tank252, the electrical current into reduction cell204, and the extraction rate of approximately 2.0 valence electrolyte208(2.0) from the outlet2040of the reduction cell to a tank256of oxidation sub-process200(2). Examples of sensors for measuring the vanadium (II) and (III) concentration include commercial off-the-shelf optical sensors and electrochemical cells having reference electrodes, among others. The vanadium (II) ions in tank252serve two purposes. First, they aid in the rapid dissolution and reduction of V2O5powder (metal oxide216), as described previously. Second, the vanadium (II) ions provide a reducing atmosphere to reduce many of the most deleterious impurities (e.g., impurities220) to their solid, neutral states. When in their solid states, the impurities are filtered out using mechanical means, again, here a series of course filter224and fine filter228(1) placed upstream of reduction cell204. In the example shown, coarse filter224, for example, an activated carbon filter, filters relatively larger precipitated solids, and fine filters228(1) and228(2), for example, PTFE hydrophilic filters, filter relatively smaller precipitated particles. As noted above, in a VRFB context, the level of filtration can be dependent on the pore size of the negative electrode(s) used in the target VRFB. In this example impurities220that precipitate out of reduced electrolyte solution208can include, but are not limited to, As and Ge metal precipitates. Filters224,228(1), and228(2) before reduction cell204serve two functions: they 1) remove impurities220from electrolyte solution208and 2) protect the reduction cell from the precipitated impurities. The second function is successfully achieved if any of filters224,228(1), and228(2) has a smaller effective pore size than the carbon-paper electrode of the reduction cell204, such as carbon paper electrode316ofFIG.3A. The system of filters224,228(1), and228(2) and reduction cell204shown inFIG.2allows for the continuous operation of the reduction cell. Methods that use electroplating/electrowinning would require frequent chemical cleaning of the cell or electrode replacement, temporarily shutting down operation. Reduction cell204operates by reducing vanadium (III) ions at cathode204(C) (Table I, Eqn. 3) and oxidizing reductant212at anode204(A). As noted above, in this example H2gas is used as reductant212(Table I, Eqn. 4), but as also noted above, other chemical reductants could be used, such as water, formic acid, or ethylene glycol, among others. In this example, reductant212, here H2gas, is provided both from an H2source260and an oxidation cell232of oxidation sub-process200(2), which produces H2gas. An example of construction of reduction cell204and the appropriate half-cell reactions are shown inFIGS.3A and3B, respectively. Downstream of outlet204O (FIG.2) of reduction cell204, a portion of purified electrolyte solution208P is returned to tank252to aid in the dissolution and reduction of V2O5powder (metal oxide216), and a portion is moved to oxidation sub-process200(2). Oxidation sub-process200(2) involves oxidizing purified electrolyte solution208P. The chemical/electrochemical reactions for this exemplary process are shown below in Table II. TABLE IIEqn. 6: H++ e− → ½ H2Hydrogen gas generation(cathode reaction)Eqn. 7: V3++ H2O → VO2++ 2H++e−Vanadium electrolyteoxidation (anode reaction)Eqn. 8: V3++ H2O → ½H2+ VO2++ H+Net reaction for oxidationcell process Purified electrolyte solution208P of average valence that is below the critical precipitation valence (i.e. below 2.9) transferred from sub-process200(1) into tank256. Purified electrolyte solution208P in tank256is kept just below the final desired valence (generally 3.5 in this example). Purified electrolyte solution208P from tank252is pumped into oxidation cell232, which oxidizes the purified electrolyte solution to the desired final valence to make valence-adjusted electrolyte solution208P+A. A portion of the output of oxidation cell232is returned to tank256to maintain a constant valence, and, in the present example, the remainder is transferred into a VRFB, as indicated by box240. In this example, electrochemical oxidation cell232oxidizes purified electrolyte solution208P and reduces protons (i.e., produces H2gas). Specifically, oxidation cell232oxidizes vanadium (III) ions at the anode232A via the half-reaction shown in Table II, Equation 7, and reduces protons to form H2gas at the cathode232C, as described by the half-reaction shown in Table II, Equation 6. The net reaction for example oxidation cell232is given in Table II, Equation 8. In oxidation cell232, water is circulated on the H2-producing side (i.e., cathode232C), as it helps wash away any vanadium ions that migrate over the membrane232M to the cathode. As described above, an alternative process could produce purified valence-adjusted electrolyte solution208P+A at any desired valence. For example, oxidation cell232could oxidize a first batch of purified valence-adjusted electrolyte solution208P+A to 2.5 valence for the negative electrolyte solution of a VRFB and a second batch of the purified valence-adjusted electrolyte solution to 4.5 valence for the positive electrolyte solution of the VRFB. Transferring these two separate solutions into, respectively, the catholyte tank and the anolyte tank of a VRFB would eliminate the need for the formation charging process required in commissioning a new battery system. In another embodiment, shown inFIGS.12A and12B, each of one or more electrochemical cells, here electrochemical cell1200having a negative side1200N (FIG.12A) and a positive side1200P (FIG.12B), accepts an electrolyte solution, such as a vanadium-based electrolyte solution, on both the positive and negative sides of the cell. This eliminates the need for a separate reductant for the reduction/purification sub-process and a separate oxidant for the oxidation sub-process.FIG.13illustrates and example electrochemical cell1300that can be used as electrochemical cell1200ofFIGS.12A and12B. Referring toFIG.13, electrochemical cell1300may have a symmetric design comprised of negative and positive flow fields1304N, and1304P, respectively, negative and positive carbon paper electrodes1308N and1308P, respectively, and a proton-exchange membrane1312between the negative and positive sides of the cell. In one example for purifying a vanadium-based electrolyte solution, the starting impure electrolyte solution1204(FIG.12A) may be made of roughly equal amounts vanadium (III) and vanadium (IV) and contains at least one impurity to be removed by the process. Impure electrolyte solution1204could be made, for example, using either of the methods described in the Background section above (i.e., either Method 1 or Method 2). In the process illustrated inFIGS.12A and12B, the negative electrode1200N of each electrochemical cell1200reduces electrolyte solution1204to below a critical impurity precipitation valence (see, e.g., zone104ofFIG.1), while the positive electrode1200P of each electrochemical cell oxidizes vanadium (III) to vanadium (IV). Upstream of the negative electrode(s)1200N (FIG.12A), one or more filters, represented schematically at1212ofFIG.12Aand which can be the same as or similar to filters224,228(1), and228(2) ofFIG.2, capture precipitated impurities in the negative-side electrolyte solution1204N prior to them entering negative electrode1200N. After passing through filter(s)1212, a portion of this now-purified electrolyte1204P solution can, for example, be transferred to a positive electrolyte tank1216(FIG.12B). This transfer process counteracts the electrochemical oxidation of the fluid in the positive-side electrolyte loop1220(FIG.12B) and maintains an approximately 3.5 valence. Similarly, starting electrolyte solution1200(FIG.12A) of lower-purity is slowly transferred to a negative-side electrolyte tank1224. This transfer chemically counteracts the electrochemical reduction and maintains a valence at or below the critical precipitation valence. The solution in positive-side electrolyte loop1228(FIG.12B) (stored in positive-side tank1216) is free of the key contaminants that would precipitate in a VRFB system. The positive-side purified and oxidized electrolyte solution1204P+O is free deleterious impurities and is transferred to a holding tank1232, where it may be stored prior to use, for example, in a VRFB system. While this embodiment adds additional material costs for the electrolyte due to the chemical reducing agent or the reduced vanadium oxide, its primary function is to remove key impurities from the electrolyte. When individual electrochemical cells use the same basic electrolyte solution on both their positive and negative sides, these cells may be conveniently called “electrolyte-only electrochemical cells.” It is noted that on the reduction/purification side (FIG.12A), the reduction/purification process1236may be controlled by an appropriate controller1240that controls the reduction/purification sub-process. Like controller264ofFIG.2, controller1240ofFIG.12Amay include any suitable hardware, such as programmable logic controller, general purpose computer, application-specific integrated circuit, or any other hardware device(s) capable of executing a suitable control algorithm. Many types of hardware suitable for controller1240are well known in the art. In one example, controller1240is configured, via software or otherwise, to control the valence of the electrolyte solution flowing out of negative side1200N of reduction cell1200, here electrolyte solution1204P by controlling the flow of impure electrolyte solution1204from negative-side electrolyte tank1224into the reduction cell. In this example, inputs to the control algorithm include user settings, such as the electrical current within reduction cell1200, and a valence measurement taken of the electrolyte1208in the tank1224by a suitable valence sensor. For example, with a fixed cell current, controller1240determines whether or not the measured valence is below a target value (e.g., the precipitation valence) and outputs one or more control signals that control one or more flow-control devices (not shown) that control the flow of impure electrolyte solution1204into reduction cell1200. Such flow-control devices may be, for example, one or more pumps, one or more valves, or one or more devices that changes the flow impure feedstock into the negative-side electrolyte tank1224, or any combination of these, among others. In other embodiments, controller1240can be configured to control both cell current and impure electrolyte solution flow so as to control the valence of the electrolyte solution (here, solution1208). Those skilled in the art will readily understand how to create a suitable algorithm for the control scheme selected for controller1240based on this disclosure and considering the type of hardware used. FIG.14illustrates the operation of example electrochemical cell1200(FIGS.12A and12B), with block1400representing the cathode side of the electrochemical cell that receives electrolyte solution1204from negative side electrolyte tank1224(FIG.12A), block1404representing the anode side of the electrochemical cell that receives electrolyte solution1204(mix) from positive-side tank1216(FIG.12B), and block1408representing proton-exchange membrane1312(FIG.13) that allows hydrogen protons to pass from the cathode side to the anode side. Those skilled in the art will readily understand the construction of electrochemical cell1200illustrated inFIGS.12A and12Bis merely an example and that other constructions may be used as desired. Lab-Scale Experimental Results Overview and Summary of Lab Scale Results A purification process in accordance with aspects of the present disclosure was demonstrated on the lab scale. Following is an overview of that process.A desirable industrial-scale system is a system that performs continuous electrolyte formation/purification. However, for proof of concept at the lab scale, a batch process was used.Reduction of the 3.5 valence initial electrolyte solution was done using a H2/VRB hybrid electrochemical cell500(FIG.5) identical to the cell illustrated inFIG.3A.Oxidation of the purified electrolyte solution was performed in a hybrid electrochemical cell800(FIG.8) identical to the cell illustrated inFIG.4A. Reduction/Purification Sub-process Demonstration at Lab-Scale Two samples of an initial electrolyte solution having a starting valence of 3.5, i.e., Batch 1 and Batch 2, were subjected to a version of the reduction/purification process described above. Each sample was 3 liters in volume and was reduced to a solution of 2.0 valence. The vanadium content of each sample was between 1.4 mol/liter and 1.65 mol/liter. The same reduction cell500(FIG.5) (no electrode replacement or membrane replacement) was used for both samples. The construction of reduction cell500is identical in construction and operation to reduction cell300as illustrated inFIGS.3A and3B, respectively. The active area of reduction cell500(FIG.5) was 23 cm2. FIG.5illustrates the lab-scale reduction/purification sub-process used in the testing of Batches 1 and 2. A hydrogen cylinder504provided hydrogen to an H2/VRB cell508on the positive electrode508P. The dry hydrogen was humidified by passing it through deionized water (DI) in a bubbler512. A flow regulator516controlled the flow of hydrogen into H2/VRB cell500. A VRB electrolyte520was stored in a plastic tank524. VRB electrolyte520in tank524was recirculated through H2/VRB cell508on the negative electrode508N and passed through two filters528(1) and528(2) prior to entering the cell. Recirculation was performed by a peristaltic pump (not shown). A DC current (not illustrated) was applied to H2/VRB cell508, which oxidized the hydrogen and reduced the vanadium in VRB electrolyte520. Filters528(1) and528(2) upstream of H2/VRB cell508consisted, respectively, of a coarse filter (activated carbon) and a fine filter (hydrophilic PTFE filter with 0.5-micron pore size). Cell voltages in H2/VRB cell500are shown inFIG.6Afor Batch 1 and inFIG.7Afor Batch 2, and cell pressures are shown inFIG.6Bfor Batch 1 and inFIG.7Bfor Batch 2. Open-circuit voltages reported inFIGS.6A and7Awere measured by periodically removing DC current from the cell. The reduction/purification sub-process appears to have been successful in both instances, demonstrating two key concepts, namely:The pressure (FIGS.6B and7B) measured upstream of filters528(1) and528(2) (FIG.5) increased as the process continued. This pressure rise indicates that filters528(1) and528(2) are successfully capturing impurities that are precipitating.The pressure (FIGS.6B and7B) just upstream of reduction cell508(FIG.5) does not increase during the sub-process, indicating that filters528(1) and528(2) protect the reduction cell from clogging because of precipitated impurities. Oxidation Sub-Process Demonstration at Lab-Scale Batch 1 of the purified electrolyte solution from the reduction/purification sub-process was oxidized to a 3.5 valence using an H2/VRB cell800(FIG.8), which was identical in construction and operation to the construction and operation of oxidation cell400shown inFIGS.4A and4B, respectively. The batch-type oxidation sub-process performed at the lab scale is illustrated inFIG.8. DI water was stored in a plastic tank804, where it is recirculated through H2/VRB cell800on the negative electrode. The flow of DI water helped remove any vanadium that migrated over to the negative electrode800N. VRB electrolyte808was stored in plastic tank812and was recirculated through H2/VRB cell800on the positive electrode800P of the cell. A DC current (not illustrated) was applied to H2/VRB cell800, which reduced protons to hydrogen gas and oxidized the vanadium in VRB electrolyte808. The voltage and current densities within H2/VRB cell800are shown, respectively, inFIGS.9A and9B. The active area of H2/VRB cell800(FIG.8) was 23 cm2. Verification of Electrolyte Purification at Lab-Scale Batch 1 was tested in a sub-scale VRB system to verify that the key impurities had been removed to an acceptable level in the electrolyte. The performance of the electrolyte before and after the purification process is shown inFIG.10, which compares the negative electrode pressures during operation before and after the lab-scale purification process. Full cell operation metrics for the purified Batch 1 electrolyte (voltages, cell resistances, cycle performance, and pressures) are shown inFIGS.11A to11C. InFIG.11B, “CE” stands for Coulombic efficiency, “EE” stands for energy efficiency, and “Util” stands for utilization of vanadium. Data represented inFIG.11Care for negative-side pressure and positive-side pressure with a lab-scale full VRB cell with respective vanadium-based electrolyte solutions flowing on corresponding respective sides of the cell. An overview of the system parameters and specifications is given below and illustrated inFIGS.11A to11C:Cycling parameters:Open-circuit voltage at end of discharge=1.28 VOpen-circuit voltage at end of charge=1.52 VMax charge cell voltage=1.6 VSystem Specifications:1.46 mol/liter V3.50 valence2.8 liter total system volume (positive and negative electrolytes)2× Carbon paper electrodesProton exchange membrane11 cm2active area The foregoing has been a detailed description of illustrative embodiments of the invention. It is noted that in the present specification and claims appended hereto, conjunctive language such as is used in the phrases “at least one of X, Y and Z” and “one or more of X, Y, and Z,” unless specifically stated or indicated otherwise, shall be taken to mean that each item in the conjunctive list can be present in any number exclusive of every other item in the list or in any number in combination with any or all other item(s) in the conjunctive list, each of which may also be present in any number. Applying this general rule, the conjunctive phrases in the foregoing examples in which the conjunctive list consists of X, Y, and Z shall each encompass: one or more of X; one or more of Y; one or more of Z; one or more of X and one or more of Y; one or more of Y and one or more of Z; one or more of X and one or more of Z; and one or more of X, one or more of Y and one or more of Z. Various modifications and additions can be made without departing from the spirit and scope of this invention. Features of each of the various embodiments described above may be combined with features of other described embodiments as appropriate in order to provide a multiplicity of feature combinations in associated new embodiments. Furthermore, while the foregoing describes a number of separate embodiments, what has been described herein is merely illustrative of the application of the principles of the present invention. Additionally, although particular methods herein may be illustrated and/or described as being performed in a specific order, the ordering is highly variable within ordinary skill to achieve aspects of the present disclosure. Accordingly, this description is meant to be taken only by way of example, and not to otherwise limit the scope of this invention. Exemplary embodiments have been disclosed above and illustrated in the accompanying drawings. It will be understood by those skilled in the art that various changes, omissions and additions may be made to that which is specifically disclosed herein without departing from the spirit and scope of the present invention. | 42,369 |
11942670 | DETAILED DESCRIPTION FIG.1shows an electrochemical system1of the type proposed here, comprising a plurality of structurally identical metal separator plates or bipolar plates2, which are arranged in a stack and are stacked along a z-direction7. To form the electrochemical cells of the system1, a membrane electrode assembly (MEA) is arranged in each case between adjacent separator plates2of the stack6(see for exampleFIG.2). Each MEA typically contains at least one membrane, for example an electrolyte membrane. Furthermore, a gas diffusion layer (GDL) may be arranged on one or both surfaces of the MEA. The separator plates2and the MEAs10of the stack6are clamped between two end plates3,4. The z-direction7will also be referred to as the stacking direction. In the present example, the system1is a fuel cell stack6. Each two adjacent separator plates2of the stack6therefore enclose between them an electrochemical cell, which serves for example to convert chemical energy into electrical energy. In alternative embodiments, the system1may also be configured as an electrolyzer, as a compressor, or as a redox flow battery. Separator plates can likewise be used in these electrochemical systems. The structure of these separator plates may then correspond to the structure of the separator plates2explained in detail here, although the media guided on and/or through the separator plates in the case of an electrolyzer, an electrochemical compressor or a redox flow battery may differ in each case from the media used for a fuel cell system. The same applies to the structure of a humidifier for an electrochemical system. The z-axis7, together with an x-axis8and a y-axis9, spans a right-handed Cartesian coordinate system. The separator plates2in each case define a plate plane, wherein the plate planes of the separator plates are each aligned parallel to the x-y plane, and thus perpendicular to the stacking direction or to the z-axis7. The end plate4includes a plurality of media connections5, via which media are suppliable to the system1and via which media are dischargeable out of the system1. Said media that can be fed to the system1and discharged from the system1may comprise for example fuels such as molecular hydrogen or methanol, reaction gases such as air or oxygen, reaction products such as water vapor or depleted fuels, or coolants such as water and/or glycol. FIG.1can represent both parts of a conventional electrochemical system1and an electrochemical system1according to the present disclosure. FIG.2shows, in a perspective view, two adjacent separator plates or bipolar plates2of an electrochemical system of the same type as the system1fromFIG.1, as well as a membrane electrode assembly (MEA)10which is arranged between said adjacent separator plates2, the MEA10inFIG.2being largely obscured by the separator plate2facing towards the viewer. Embodiments of separator plate2are formed from two integrally joined individual plates2a,2b(see e.g.,FIG.3), of which only the first individual plate2afacing the observer is visible inFIG.2, which hides the second individual plate2b.The individual plates2a,2bmay be made of sheet metal, such as stainless steel sheet. The individual plates2a,2bmay, e.g., be welded together, e.g., by laser welded connections. The individual plates2a,2bhave through-openings, which are aligned with one another and form through-openings11a-cof the separator plate2. The MEA10also has corresponding aligned through-openings, the specification of a separate reference sign being omitted here for reasons of clarity. When a plurality of MEAs10and separator plates of the same type as the separator plate2are stacked, the through-openings11a-ctogether with the corresponding through-openings of the MEAs form lines which extend through the stack2in the stacking direction7(seeFIG.1). Typically, each of the lines formed by the through-openings11a-cis fluidically connected to one of the ports5in the end plate4of the system1. Coolant may, e.g., be introduced into the stack or removed from the stack via the ducts formed by the through-openings11a.In contrast, the lines formed by the through-openings11b,11cmay be configured to supply fuel and reaction gas to the electrochemical cells of the fuel cell stack of the system1and to discharge the reaction products from the stack. In order to seal off the through-openings11a-cwith respect to the interior of the stack2and with respect to the surrounding environment, the first individual plate2amay in each case have sealing arrangements in the form of sealing beads12a-c,which are in each case arranged around the through-openings11a-cand in each case completely surround the through-openings11a-c.On the rear side of the separator plates2, facing away from the viewer ofFIG.2, the second individual plate2bmay have corresponding sealing beads for sealing off the through-openings11a-c. In a region18located opposite the electrochemically active region of the MEA10, the first individual plates2ausually have, on the front side thereof facing towards the viewer ofFIG.2, a flow field17with structures for guiding a reaction medium along the front side of the individual plate2a.InFIG.2, these structures are defined by a plurality of webs and channels extending between the webs and delimited by the webs. On the front side of the separator plate2, facing towards the viewer ofFIG.2, the first individual plate2ausually additionally has a distribution or collection region20with distributing channels29. The distribution or collection region20comprises structures which are configured to distribute over the flow field17a medium that is introduced into the distribution or collection region20from a first of the two through-openings11b,and/or to collect or to pool a medium flowing towards the second of the through-openings11bfrom the flow field17. InFIG.2, the distributing structures of the distribution or collection region20are likewise defined by webs and channels extending between the webs and delimited by the webs. At the transition between the distribution and collection region20and the flow field17, a transition region21is located on each side of the flow field17, each of said transition regions being oriented parallel to the y-direction9inFIG.2. In the transition region21, the media-guiding structures have for example a reduced height compared to the adjoining regions17and20(seeFIG.3). In the exemplary embodiment shown, the first individual plates2aeach also have a further sealing arrangement in the form of a perimeter bead12d,which extends around the flow field17located opposite the active region18, and also around the distribution or collection region20and the through-openings11b,11cand seals these off with respect to the through-opening11a,that is to say with respect to the coolant circuit, and with respect to the environment surrounding the system1. The second individual plates2beach comprise corresponding perimeter beads. The structures of the flow field17, the distributing structures of the distribution or collection region20and the sealing beads12a-dare each formed in one piece with the individual plates2aand are integrally formed in the individual plates2a,for example in an embossing or deep-drawing process or by means of hydroforming. The same applies to the corresponding structures of the second individual plates2b. The two through-openings11bor the lines through the plate stack of the system1that are formed by the through-openings11bare often each fluidically connected to one another via passages13bin the sealing beads12b,via the distributing structures of the distribution or collection region20and of the transition region21and via the flow field17of the first individual plates2afacing towards the viewer ofFIG.2. Analogously, the two through-openings11cor the lines through the plate stack of the system1that are formed by the through-openings11care each fluidically connected to one another via corresponding bead passages, via corresponding distributing structures, transition regions and via a corresponding flow field on an outer side of the second individual plates2bfacing away from the viewer ofFIG.2. In contrast, the through-openings11aor the lines through the plate stack of the system1that are formed by the through-openings11aare usually each fluidically connected to one another via a cavity19that is enclosed or surrounded by the individual plates2a,2b.This cavity19serves in each case to guide a coolant through the separator plate2, such as for cooling the flow field17of the separator plate2and thus indirectly the electrochemically active region18of the MEA10. FIG.3schematically shows a section A-A through part of the plate stack of the system1ofFIG.1, the sectional plane being oriented perpendicular to the plate planes of the separator plates2. The structurally identical separator plates2of the stack each comprise the above-described first metal individual plate2aand the above-described second metal individual plate2b.Also shown are the flow field17, which in terms of its extension corresponds to the electrochemically active region18of the MEA10, the transition region21and the distribution or collection region20of the separator plates2, each of the regions17,21,20having structures for guiding media along the outer faces of the separator plates2, here for instance in the form of webs and channels bounded by the webs. A membrane electrode assembly (MEA)10is arranged in each case between adjacent separator plates2of the stack. The MEAs10usually each comprise a membrane14, for example an electrolyte membrane with catalyst layers, and a reinforcing layer connected thereto, here in each case two reinforcing layers15a,15b.The reinforcing layers15a,15band the membrane14overlap in the transition region21. By way of example, the at least one reinforcing layer15a,15bmay in each case be connected on one side to the membrane14in a materially bonded manner, for example by an adhesive bond or by lamination. The at least one reinforcing layer15a,15bis usually formed of a film material, for example a thermoplastic film material or a thermosetting film material. The region of the membrane14of the MEA10that is not covered by the reinforcing layers15a,15bextends in each case over the flow fields17of the adjoining separator plates2, forms the active region18located opposite said flow fields17and there enables an electrochemical reaction on the membrane14or the catalyst layer present thereon. In addition, the membrane14extends at least partially into the transition region21. The reinforcing layers15a,15bof the MEA10can in this case serve to position and fasten the MEA10between the adjoining separator plates2. Separator plates2may have indentations or notches52and the MEAs10have indentations or notches51as a lateral positioning aid. The separator plates2and the MEAs10are in each case stacked one on top of the other in an alternating manner such that, with their positioning aids52,51, they laterally adjoin positioning means and are guided by the latter. However, since the MEA is very easily movable and bendable, there is a risk that the MEA will not be positioned correctly since it may for example expand or bulge in the edge region, i.e. may spread out in the stacking direction. The MEA10may thus deviate from the correct position relative to the bipolar plate. The present disclosure counters this in that the MEAs are not applied to the separator plates2only at the time of stacking the entire stack, but rather a composite structure (cf. assembly50below) consisting of the MEA10and the separator plate2is stacked. It is also conceivable that a composite structure consisting of a separator plate2with two MEAs10is stacked alternately with a separator plate without an MEA. The reinforcing layers15a,15beach cover the distribution or collection region20of the adjoining separator plates2or extend into the distribution or collection region20of the adjoining separator plates2. As shown inFIG.3, the reinforcing layers15a,15bmay additionally also cover the transition region21of the adjoining separator plates2or may extend into the transition region21of the adjoining separator plates2. The edges of the reinforcing layers15a,15bbound the active region18. In the example ofFIG.3, the frame-like reinforcing layer15of the MEA10comprises in each case a first frame-like reinforcing layer15a,also referred to as the first film layer15a,and a second frame-like reinforcing layer15b,also referred to as the second film layer15b,each of the film layers15a,15bbeing connected to the membrane14. InFIG.3, the film layers15a,15bin the region21are arranged at least partially on both sides of the respective membrane14and border the latter along the stacking direction or along the z-direction7. The film layers15a,15bare connected to the membrane14and to one another in the region20by means of an adhesive47, which will often not be explicitly mentioned elsewhere in this document. Alternatively, the frame-like reinforcing layer15of the MEA may also be designed as a single-layer film material. The connection to embodiments of the MEA then takes place via an overlap region, but this is formed only on one side with respect to the MEA. The MEA10thus has in each case a greater thickness in the transition region21of the frame-like reinforcing layer15than in the region of the MEA10different than or bordered by the transition region21, the thickness of the MEA10in each case being determined along the stacking direction or along the z-direction7. As shown inFIG.3, gas diffusion layers16may additionally be arranged in the active region18. The gas diffusion layers16enable the flowing onto the membrane14over a region of the surface of the membrane14that is as large as possible and can thus improve the media exchange over the membrane14. The gas diffusion layers16may for example in each case be arranged on both sides of the membrane14in the active region18between the adjoining separator plates2. The gas diffusion layers16may for example be formed of an electrically conductive fibre fleece or may comprise an electrically conductive fibre fleece. The gas diffusion layer(s)16and the membrane14are collectively referred to as the membrane composite. To accommodate both the frame-like reinforcing layer15of the MEA10and the gas diffusion layers16in the transition region21, the media-guiding structures of the transition region21of the separator plates2may have a reduced height compared to the media-guiding structures of the adjoining regions17and20, so as to prevent excessive compression of the separator plates2, the MEAs10and the gas diffusion layers16in the transition region21. Differences between the present disclosure and conventional plate stacks occur in parts other than that shown inFIG.3, and therefore the illustration inFIG.3shows a part of the conventional electrochemical cells ofFIG.2but could be identical for assemblies according to the present disclosure. FIG.4Ashows, in a plan view, two parts of the separator plate2ofFIG.2, such as of the first individual plate2aof the separator plate2ofFIG.2.FIG.4Blikewise shows, in a plan view, corresponding parts of the MEA10adjoining the separator plate2shown inFIG.4a, or of the frame-like reinforcing layer15thereof according toFIG.2, the frame-like reinforcing layer15hereinafter also being referred to as the frame15. Purely for the sake of clarity, only some of the elements of the separator plate2described above in relation toFIG.2are denoted by reference signs inFIG.4A. InFIGS.4A and4B, the separator plate2and the frame15are deliberately shown substantially true to scale in relation to one another in order thus to illustrate which regions of the separator plate2and of the adjoining MEA10come into congruence with one another in a plate stack of the type shown inFIG.1. The frame-like reinforcing layer or the frame15of the MEA10comprises pairs of cutouts22a-cas well as a central cutout23. The area of the membrane14bordered by the frame-like reinforcing layer15is arranged in the region of the central cutout23of the frame-like reinforcing layer15, said area coming into congruence with the flow field17of the adjoining separator plate2in the plate stack of the system1so that, in the active region18, protons can pass through the membrane14. The frame-like reinforcing layer15bounds the central cutout23, which in turn thus also defines the electrochemically active region of the MEA10. The cutouts22a-cof the frame-like reinforcing layer15of the MEA10are dimensioned in such a way and the MEA10is or can be arranged relative to the adjacent separator plates2in such a way that the cutouts22a-calign with the through-openings11a-cof the adjoining separator plates2so that medium can pass through the cutouts22a-cof the frame-like reinforcing layer15. InFIGS.4A,4B, the frame-like reinforcing layer15of the MEA10is dimensioned in such a way and the MEA10is or can be arranged relative to the adjoining separator plates2in such a way that the frame-like reinforcing layer15entirely or at least partially covers the distribution or collection region20of the adjoining separator plates2. Reference is hereinafter made toFIG.9by way of example. In general, the separator plate2has a first flat side71and an opposite second flat side72. The individual plates2a,2bcan be referred to as the first layer2aand second layer2bof the separator plate2. The first layer2ahas a first flat side71a,which coincides with the first flat side71of the separator plate2. In addition, the first layer2ahas a second flat side72a,which adjoins a first flat side71bof the second layer2b.The second layer2bcomprises a second flat side72b,which is coincides with the second flat side72of the separator plate2. FIGS.5A and5Bshow a separator plate2and an associated MEA10which, when joined together, form an assembly50or a composite structure (cf. for exampleFIGS.12-18,20,23A-E) for the electrochemical system1. The separator plate2ofFIG.5Asubstantially corresponds to the separator plate2shown inFIG.4A. In comparison to the MEA10ofFIG.4B, the MEA10ofFIG.5Bhas tabs30for positioning the MEA10relative to the separator plate2and/or for fastening the MEA10to the separator plate2. InFIG.5B, the MEA10comprises four tabs30. However, fewer than four or more than four tabs30may also be provided. The tab30is connected at one side to the frame-like reinforcing layer15. The tab30also has a free end35, which is fastened to the separator plate2in order to form the joined assembly50. In the corresponding joined assembly50, the frame-like reinforcing layer15is arranged on the first flat side71of the separator plate2, while the free end35of the tab30is arranged on the second flat side72of the separator plate2. By way of the at least one tab30, the MEA10can thus be connected to the separator plate2in a form-fitting and/or force-fitting manner. In some embodiments, there is therefore no need for a materially bonded connection, such as an adhesive bond, between the MEA10and the separator plate2. As shown inFIG.5B, the frame-like reinforcing layer15may have, in the region of the tab30, a protrusion40which protrudes laterally beyond an outer edge25of the separator plate2. For fastening purposes or to form the assembly50, the tab30is placed or pushed over the outer edge25of the separator plate2. The MEA10ofFIG.6Bdiffers from the MEA10ofFIG.5Bin that the frame-like reinforcing layer15has, in the region of the tab30, a protrusion41which protrudes laterally beyond an inner edge24of the separator plate2. In the exemplary embodiment shown, the inner edge24is part of the through-opening11c.As an alternative or in addition, the protrusion41may also protrude beyond an inner edge of the through-openings11aor11b.In the assembly50, the tab30is inserted in the through-opening11cso that the free end35of the tab30is arranged on the second flat side72of the separator plate2. The separator plate2ofFIG.6Asubstantially corresponds to the separator plate2shown inFIGS.5A and4A. Thus, inFIGS.5B and6B, the frame-like reinforcing layer15adjacent to the tab30protrudes beyond an inner or outer edge24,25of the separator plate2. In the embodiments ofFIGS.5A,5B,6A,6B, the separator plate2need not be adapted to the MEA10with the tabs30. Conventional separator plates2can therefore be used for the assemblies50of these embodiments, without having to be modified for this purpose. The separator plates2shown inFIGS.7A,8A,9-20,21A-C,21E have modifications compared to known separator plates2, which modifications will be described below. In the embodiment ofFIG.7A, a recess60is provided in the outer edge region of the separator plate2. The MEA10ofFIG.7Bhas a plurality of tabs30which are arranged on different sides of the electrochemically active region or of the membrane14. In order to form the assembly50, the tabs30of the frame-like reinforcing layer15can be placed or pushed over the outer edge25of the separator plate in the region of the recess60. Therefore, instead of the protrusion40,41in the MEA10(seeFIGS.5B,6B), a notch60may also be formed on the outer edge or inner edge of the separator plate2in order to make it possible to fasten the tab30to the separator plate2. It can also be seen inFIG.7Bthat incisions42are provided in the frame-like reinforcing layer15, which incisions extend at an angle, usually substantially perpendicularly, to an insertion or push-in direction of the tab30. The incisions42adjoin the tab30at the point where the tab30is connected to the frame-like reinforcing layer15. These incisions42may aid a mobility of the respective tab30or prevent tearing of the tab30. Although the incisions42are described only in connection withFIG.7B, they can be implemented in any frame-like reinforcing layer15as required. The MEA10shown inFIG.8Blikewise has a plurality of tabs30,31,32, the tabs30,31,32having different shapes. In this case, only the tabs30have incisions48similar to the incisions42of the preceding embodiment, but here these are at a significantly larger angle. For receiving the tabs30,31,32, through-openings61are formed in the outer edge region of the separator plate2ofFIG.8A. When joining together the separator plate2and the MEA10, the tab30is inserted in the corresponding through-opening61in such a way that the tab30engages through the through-opening61and thus is arranged on the opposite flat side of the separator plate2. To avoid any slipping of the MEA10with respect to the separator plate, the through-opening61may be designed in such a way that it bounds laterally, with a substantially precise fit, the tab30engaging therethrough. The respective through-opening61may receive one tab30or a plurality of tabs31,32. For instance, the MEA10comprises two tabs31,32, the free ends35of these tabs31,32pointing away from one another and engaging through the same through-opening61. Located between the tabs31,32is a web-like strip of the reinforcing layer15, to which each of the tabs31,32is connected. FIGS.9-11each show a section through a portion of a separator plate2. The separator plate2ofFIG.9comprises two layers2a,2b,which have mutually aligned through-openings61a,61b,into which a tab30of an MEA10can be inserted. The separator plate2ofFIG.9has no embossed structure in the region of the through-openings61a,61b. FIG.10likewise shows a separator plate2on its own, that is to say without an MEA10. The first layer2aof the separator plate2comprises a through-opening61for receiving a tab30, while the second layer2bhas no opening in the region of the through-opening61of the first layer2a.In addition, the embossed structure62is provided only in the depicted embodiment of first layer2a. In the separator plate2ofFIG.11, both through-openings61a,61band embossed structures62a,62bare provided in both layers2a,2b. FIGS.12-17each schematically show a section through a portion of an assembly50comprising an MEA10and a separator plate2. For the sake of clarity, the separator plate2and the MEA10are shown at a distance from one another here. In practice, however, they bear against one another. The separator plate has the same design inFIGS.12-15and comprises two individual plates or layers2a,2b,wherein only the first layer2acomprises a through-opening61for receiving a tab30. Since only the first layer2ahas said through-opening61, the free end of the tab30is arranged on the second flat side72aof the first layer2a.The reinforcing layer15is in this case arranged on the opposite first flat side71aof the first layer2a. The first layer2amay additionally comprise an embossed structure62, which adjoins the through-opening61. Typically, the embossed structure is provided in an outer edge region of the layer2aor separator plate2, outside of the region enclosed by the perimeter bead12d.In the present exemplary embodiment, the reinforcing layer15does not bear against the embossed structure62, but its edge partially covers the embossed structure62. The embossed structure62forms a receptacle for the free end of the tab30and bounds the tab30laterally. In addition, the embossed structure may be designed to stiffen the region of the layer2aaround the tab30. The embossed structure62may thus serve to stabilize the assembly50, but can also act as a spacer for the tab30. Since the embossed structure62is usually provided only for fastening the tab30, no sealing function or flow-guiding function is associated with this type of embossed structure62. The assemblies50ofFIGS.12-15differ in the type of MEA10used, while the separator plate2used is the same in each case. The reinforcing layer15of the MEA10ofFIG.12is single-layered and comprises a single film layer, wherein the tab30is formed integrally with the reinforcing layer15and is inserted in the opening61of the layer2a. The reinforcing layer15of the MEA10ofFIG.13is two-layered and comprises a first film layer44and a second film layer45. The film layers44,45are connected to one another in a materially bonded manner via an interposed adhesive layer47. Alternatively, the film layers44,45may for example be laminated to one another. The tab30is formed integrally with both film layers44,45of the reinforcing layer15and is inserted in the opening61of the layer2a. The reinforcing layer15of the MEA10ofFIG.14is single-layered, the tab30and the reinforcing layer15being separate elements. The tab30and the reinforcing layer15are connected to one another at a connection point46in a materially bonded manner, for example by means of an adhesive bond or a welded joint. The free end35of the tab30is inserted in the opening61of the layer2a.One advantage of this embodiment is that conventional MEAs10can be subsequently provided with the tab30. In the embodiment ofFIG.15, the reinforcing layer15of the MEA10is two-layered and comprises a first film layer44and a second film layer45, which may correspond to the aforementioned film layers15a,15b.The film layers44,45are connected to one another in a materially bonded manner via an interposed adhesive layer47. Alternatively, the film layers44,45may for example be laminated to one another. In a cut-out region43, the second film layer45is not connected to the first film layer44and at that location forms the tab30. The tab30is thus formed integrally with the second layer45of the reinforcing layer15and is inserted in the opening61of the layer2a.Since the cutout43is covered by the first film layer44, the reinforcing layer15has no opening in the region of the tab30, as a result of which the likelihood of a short-circuit can be reduced. The embodiment ofFIG.16has a number of modifications compared to that ofFIG.15. On the one hand, the tab30engages not only through the opening61of the layer2a,but rather through the openings61a,61bof both layers2a,2b.It thus comes to lie on the second flat side72bof the second layer2b,but in this way is also arranged on the side of the second flat side72aof the first layer2a,while the frame-like reinforcing layer15is arranged on the first flat side71aof the first layer2a.Furthermore, in a manner differing fromFIG.15, the adhesive layer47inFIG.16is not removed in the region of the recess43. Rather, inFIG.16, the adhesive layer47in the region of the recess43is covered with a thin film49, which prevents contact between the adhesive layer47and the first layer2aof the separator plate2so that the separator plate2is not adhesively bonded to the MEA10and can be moved relative to the latter while positioning the separator plate2and the MEA10. In the MEAs ofFIGS.5B,6B,7B,8B,12,13, the tab30is formed integrally with the frame-like reinforcing layer15. To this end, the frame-like reinforcing layer15has incisions which delimit a border of the tab30. To cover the cutout defined by the tab30, the reinforcing layer15of the embodiments ofFIGS.5B,6B,7B,8B,12,13may have a further film layer, which covers the respective cutout. This further film layer may be provided only or at least in the region of the cutout or tab30or may extend over the entire area of the frame-like reinforcing layer15. InFIGS.5B,6B,7B,8B, the tabs30are arranged at different locations on the MEA10. The tabs30may be arranged on opposite sides of the electrochemically active region18or of the membrane14. The MEA10, for instance the membrane14, may be under slight tensile stress in the region between the tabs30. The MEA10can thus be smoothed, which prevents the formation of wrinkles in the MEA10. The assemblies50shown inFIGS.12-17can be connected to one another or stacked to form the stack6of the electrochemical system1.FIG.18shows, by way of example, a multi-layer system consisting of two assemblies50a,50bwhich are connected to one another, the structure of each assembly50a,50bbeing at least locally similar to the assembly50shown inFIG.12. InFIG.18, tabs30of single-layer MEAs10are in each case inserted in a layer of the separator plate2in order thus to form a pre-assembled unit consisting of two separator plates2and two MEAs10. As stacking continues, the MEA10of the next pre-assembled unit will be pushed into the opening61having an adjoining embossed structure62. The assembly50ofFIG.17substantially corresponds to the assembly ofFIG.12, the illustration inFIG.17being rotated through 180° in relation toFIG.12. In addition, the second layer2bofFIG.17comprises a second embossed structure63, wherein the embossed structure63forms a receptacle for the free end35of the tab30and the free end35of the tab30is located in the receptacle formed by the second embossed structure63. The embossed structures62,63may be arranged diagonally opposite and offset from one another (seeFIG.17) so that the end35of the tab30pointing away from the reinforcing layer15can be received in the space between the embossed structures62,63. The embossed structures62,63may additionally point in different directions (cf.FIG.17) or in the same direction (cf.FIG.11) with respect to a plate plane of the separator plate2. In a further embodiment, the first embossed structure62of the first layer2ais omitted, so that only the second layer2bhas a second embossed structure in the region of the tab30. The tabs30,31,32, protrusions40,41, incisions42,48, recesses60, openings61and/or embossed structures62,63,64described above and shown in the figures may supplement one another and be combined with one another in an assembly50, a stack6and/or an electrochemical system1. The way in which the assembly50can be produced will be explained with reference toFIGS.19and20. First, an MEA10, which has an above-described tab30, and a separator plate2are provided. The MEA10is placed onto the separator plate2or moved towards the separator plate2. The tab30is then inserted in the through-opening61of the separator plate2by means of a ram80. Due to the embossed structure62acting as a recess, the free end35of the tab30latches into the receptacle defined by the embossed structure62, thereby creating the assembly50. Alternatively, the free end35of the tab30may also be pushed into the receptacle defined by the opening61and the embossed structure62. The joining step by means of the ram80is therefore optional. FIGS.21A-Eeach schematically show a top view of a portion of an outer edge region of a separator plate2.FIGS.22A-Eeach schematically show a top view of a portion of a frame-like reinforcing layer15of an MEA10.FIGS.23A-Eeach schematically show a top view of an assembly50which comprises the separator plate2ofFIGS.21A-21Eand the associated MEA10ofFIGS.22A-22E. In the embodiment ofFIG.23A, it can be seen that the tab30is inserted through the through-opening61of the separator plate2. The through-opening61bounds the tab30laterally with a substantially precise fit. In the embodiment ofFIG.23B, it can be seen that the tab30is inserted through the through-opening62of the separator plate2, the tab30being bounded laterally by two embossed structures64formed in the separator plate and being held in position by these. The embodiment ofFIG.23Cshows that two tabs31,32engage in the same opening61of the separator plate2. The free ends35of the tabs31,32point away from one another and are arranged on the rear side of the layer2a. In the embodiment ofFIG.23D, the triangular tab30is arranged in the region of the protrusion40of the MEA10, the protrusion40protruding beyond an outer edge25of the separator plate2. No additional measures have been taken on the separator plate2in order to receive or position the tab30. In the embodiment ofFIG.23E, the separator plate2has two embossed structures64, which define a receiving area for the tab30and laterally bound the free end35of the tab30. It should be noted that the embodiments ofFIGS.23A,23B,23C,23D and/or23Ecan be combined with one another. In the preceding embodiments, the frame-like reinforcing layer15and the at least one tab30,31,32may be made of an electrically insulating material. In a manner differing from the two-layer separator plates2shown, the separator plate may also be single-layered. By way of example, the separator plate2is a single plate of a humidifier plate. As can be seen from the accompanying figures, the tabs30,31,32may have different shapes. The tab30,31,32may for example be semi-circular, rectangular, trapezoidal, crescent-shaped, tongue-shaped, U-shaped or V-shaped. The present disclosure also proposes a stack6of multiple assemblies50of the type described above. The assemblies50of the stack6may in this case be structurally identical; however, at least two different assemblies50may also be installed in the stack6. The present disclosure additionally provides an electrochemical system1which contains the stack6or at least one assembly50of the type described above. The electrochemical system1may be a fuel cell system, an electrochemical compressor, an electrolyzer, or a redox flow battery. The separator plates2or assemblies50can also be used in a humidifier for an electrochemical system, the electrochemically active region in such cases being replaced by a region permeable to water vapor. Finally, it should be noted that the features of the embodiments ofFIGS.5-23may be claimed individually or combined with one another, insofar as they do not contradict one another. FIGS.1-23Eshow example configurations with relative positioning of the various components. If shown directly contacting each other, or directly coupled, then such elements may be referred to as directly contacting or directly coupled, respectively, at least in one example. Similarly, elements shown contiguous or adjacent to one another may be contiguous or adjacent to each other, respectively, at least in one example. As an example, components laying in face-sharing contact with each other may be referred to as in face-sharing contact. As another example, elements positioned apart from each other with only a space there-between and no other components may be referred to as such, in at least one example. As yet another example, elements shown above/below one another, at opposite sides to one another, or to the left/right of one another may be referred to as such, relative to one another. Further, as shown in the figures, a topmost element or point of element may be referred to as a “top” of the component and a bottommost element or point of the element may be referred to as a “bottom” of the component, in at least one example. As used herein, top/bottom, upper/lower, above/below, may be relative to a vertical axis of the figures and used to describe positioning of elements of the figures relative to one another. As such, elements shown above other elements are positioned vertically above the other elements, in one example. As yet another example, shapes of the elements depicted within the figures may be referred to as having those shapes (e.g., such as being circular, straight, planar, curved, rounded, chamfered, angled, or the like). Further, elements shown intersecting one another may be referred to as intersecting elements or intersecting one another, in at least one example. Further still, an element shown within another element or shown outside of another element may be referred as such, in one example. It will be appreciated that the configurations and routines disclosed herein are exemplary in nature, and that these specific embodiments are not to be considered in a limiting sense, because numerous variations are possible. Moreover, unless explicitly stated to the contrary, the terms “first,” “second,” “third,” and the like are not intended to denote any order, position, quantity, or importance, but rather are used merely as labels to distinguish one element from another. The subject matter of the present disclosure includes all novel and non-obvious combinations and sub-combinations of the various systems and configurations, and other features, functions, and/or properties disclosed herein. As used herein, the term “approximately” is construed to mean plus or minus five percent of the range unless otherwise specified. The following claims particularly point out certain combinations and sub-combinations regarded as novel and non-obvious. These claims may refer to “an” element or “a first” element or the equivalent thereof. Such claims should be understood to include incorporation of one or more such elements, neither requiring nor excluding two or more such elements. Other combinations and sub-combinations of the disclosed features, functions, elements, and/or properties may be claimed through amendment of the present claims or through presentation of new claims in this or a related application. Such claims, whether broader, narrower, equal, or different in scope to the original claims, also are regarded as included within the subject matter of the present disclosure. | 38,800 |
11942672 | In drawings:1. cavity body;2. dielectric resonance block;3. dielectric support frame;4. cover plate;5. coupling among multi-mode;6. input/output;7. mode tuning screw;8. multi-mode coupling screw;9. transverse window between multi-mode and metal bars. DETAILED DESCRIPTION OF THE EMBODIMENTS The present disclosure will be further described in detail below with reference to the drawings in conjunction with specific embodiments. The drawing and specific embodiments facilitate a clear understanding of the present disclosure, but do not limit the present disclosure. In order to highlight the content of the present disclosure, some common technologies in the cavity, such as tuning screws, coupling screws, booms, boom seats, and nut fixing, and fixing and installation methods of some dielectric resonators such as bonding, welding, sintering and crimping methods will not be repeated here. The cavity high-Q triple-mode dielectric resonance structure includes a cavity body1and a cover plate4, wherein the cavity1and the cover plate4are tightly connected; a dielectric resonance block2and a dielectric support frame3are disposed in the cavity body; and the dielectric support frame is connected with the inner wall of the cavity body. Some embodiments of the present disclosure disclose a cavity high-Q triple-mode dielectric resonance structure applied to the filter. The triple-mode dielectric resonance structure includes a cavity and a cover plate, wherein a dielectric resonance block and a dielectric support frame are arranged inside the cavity; the dielectric resonance block is of a cube-like solid structure; the dielectric support frame is respectively connected with the dielectric resonance block and an inner wall of the cavity; the dielectric resonance block and the dielectric support frame form a triple-mode dielectric resonance rod; a dielectric constant of the dielectric support frame is less than a dielectric constant of the dielectric resonance block; a ratio K of a size of single side of the inner wall of the cavity to a size of the corresponding single side of the dielectric resonance block is as follows: when K is greater than or equal to a conversion point 1 and is less than or equal to a conversion point 2, a Q-value of a higher-order mode adjacent to a base mode, of the triple-mode dielectric resonance structure is converted into the Q-value of the base mode of the triple-mode dielectric resonance structure, the resonance frequency of the base mode after conversion is equal to the resonance frequency of the base mode before conversion, the Q-value of the base mode after conversion is greater than the Q-value of the base mode before conversion, the resonance frequency of the higher-order mode adjacent to the base mode after conversion is equal to the resonance frequency of the higher-order mode adjacent to the base mode before conversion, and the Q-value of the higher-order mode adjacent to the base mode after conversion is less than the Q-value of the higher-order mode adjacent to the base mode before conversion; the triple-mode dielectric resonance structure is internally provided with a coupling structure for changing orthogonal properties of electromagnetic field of a degenerate triple-mode in the cavity; and the triple-mode dielectric resonance structure is internally provided with a frequency tuning device for changing tuning frequency of the degenerate triple-mode in the cavity. In some embodiments of the present disclosure, a value of the conversion point 1 and a value of the conversion point 2 both vary according to different resonance frequencies of the base mode of the dielectric resonance block, a dielectric constant of the dielectric resonance block, and a dielectric constant of the support frame. In some embodiments of the present disclosure, when the resonance frequency of the base mode of the dielectric resonance block after conversion remains unchanged, a Q-value of the triple-mode dielectric resonance structure is related to the ratio K, the dielectric constant of the dielectric resonance block and the size of the dielectric resonance block. In some embodiments of the present disclosure, when the ratio K increases from 1.0 to a maximum, the ratio K has triple Q-value conversion points in a variation range; and each Q-value conversion point enables the Q-value of the base mode and the Q-value of the higher-order mode adjacent to the base mode to be converted; and when the Q-value of the higher-order mode adjacent to the base mode is converted into the Q-value of the base mode, the Q-value of the base mode is higher than the Q-value of the base mode before conversion. In some embodiments of the present disclosure, in four regions formed by a starting point, an ending point and triple Q-value conversion points of the ratio K, the Q-value of the base mode and the Q-value of the higher-order mode adjacent to the base mode change gradually vary with a variation of a size of a cavity body and a size of the dielectric resonance block, and requirements for applications of different regions in the filter are different. In some embodiments of the present disclosure, the value of the conversion point 1 is greater than or equal to 1.03 and is less than or equal to 1.25; the value of the conversion point 2 is greater than or equal to 1.03 and is less than or equal to 1.25; and the value of the conversion point 1 is less than the value of the conversion point 2. In some embodiments of the present disclosure, a coupling structure is disposed on the dielectric resonance block; and the coupling structure includes at least two structures which include at least one type of holes, grooves, cut corners, and chamfers which are not in parallel arrangement. In some embodiments of the present disclosure, the grooves or the cut corners or the chamfers are disposed on edges of the dielectric resonance block. In some embodiments of the present disclosure, the holes or the grooves are disposed on the end surfaces of the dielectric resonance block, and the center lines of the holes or the grooves are parallel to the edges perpendicular to the end surfaces with the holes or the grooves on the dielectric resonance block. In some embodiments of the present disclosure, the coupling structure is disposed on the cavity; and the coupling structure includes at least two chamfers or bosses or chamfers and bosses not in parallel arrangement at the inner corners of the cavity, or tap wires/sheets disposed in the cavity and not in contact with the dielectric resonance block, or the coupling structure includes at least two chamfers or bosses or chamfers and bosses not in parallel arrangement at the inner corners of the cavity, and tap wires/sheets disposed in the cavity and not in contact with the dielectric resonance block. In some embodiments of the present disclosure, the frequency tuning device includes at least one type of a tuning screw/disk disposed on the cavity, a thin film disposed on the surface of a dielectric resonance block, a thin film disposed on the inner wall of the cavity and a thin film disposed on the inner wall of the cover plate. In some embodiments of the present disclosure, at least one end surface of the dielectric resonance block is disposed at least one dielectric support frame. Some embodiments of the present disclosure also disclose a filter including the high-Q triple-mode dielectric resonance structure. The filter includes a cavity body, a cover plate and an input-output structure, wherein at least one high-Q triple-mode dielectric resonance structure is disposed in the cavity body. In some embodiments of the present disclosure, the high-Q triple-mode dielectric resonance structure, a single-mode resonance structure, a two-mode resonance structure, and a triple-mode resonance structure are combined in different forms to form filters of different volumes; a coupling between any two resonance cavities formed by the arrangement and combination of the high-Q triple-mode dielectric resonance structure, a single-mode resonance cavity, a two-mode resonance cavity, and a triple-mode resonance cavity is only realized through a window size between the two resonance cavities under the condition that two resonance rods in the two resonance cavities are parallel; the window size is determined according to the coupling quantity; and the filters have functional characteristics that the filters include but are not limited to band pass filters, band stop filters, high pass filters, and low pass filters, and filters form duplexers, multiplexers and combiners. In some embodiments of the present disclosure, under a condition that the resonance frequency of the cavity high-Q triple-mode dielectric resonance structure remains unchanged, the Q-value of the triple-mode dielectric resonance structure is related to a ratio K of a side length of the inner wall of the cavity body to a side length of the dielectric resonance block, a dielectric constant of the dielectric resonance block, and a size variation range of a dielectric block; and a range of the ratio K is related to different resonance frequencies, and the dielectric constants of the dielectric resonance rod and the support frame. According to the above embodiment, when the ratio K of the side length size of the inner wall of the cavity to the size of the dielectric resonance block in the cavity high-Q triple-mode dielectric resonance structure increases from 1.0 to the maximum in a variation range, the ratio K has three conversion points in the variation range; each conversion point enables the Q-value of the resonance frequency of the base mode and the Q-value of the resonance frequency of the adjacent higher-order mode to be converted; and when the Q-value of the adjacent higher-order mode is converted into the Q-value of the base mode, the Q-value of the base mode is higher than the Q-value of the base mode before conversion. In some embodiments, in the four regions formed by a starting point, a ending point and the three Q-value conversion points of the ratio K, the Q-value of the base mode and the Q-value of the adjacent higher-order mode vary gradually with the variation of the size of the cavity body and the size of the dielectric resonance block; and requirements for applications of different regions in the filter are different. In some embodiments, the dielectric resonance block of the present disclosure is of a cube-like solid structure, wherein definition of a cube-like shape is as follows: the dielectric resonance block is a cuboid or a cube; when the dielectric resonance block has equal sizes in three directions of axes X, Y and Z, a degenerate triple-mode is formed and is coupled with other single cavities to form a band-pass filter; when the dielectric resonance block has slightly unequal sizes in three directions of axes X, Y and Z, an orthogonal-like triple-mode resonance is formed; if the orthogonal-like triple-mode is still coupled with other cavities to form the band-pass filter, sizes are all acceptable; if the orthogonal-like triple-mode is not coupled with other cavities to form the band-pass filter, the sizes are unacceptable; and when the differences of the sizes of the dielectric resonance block in three directions of axes X, Y and Z are greatly different, the degenerate triple-mode or the orthogonal-like triple-mode is not formed, but three modes with different frequencies are formed, thus, the three modes with different frequencies are not coupled with other cavities to form the band-pass filter, and the sizes are not acceptable. In some embodiments, the cavity high-Q triple-mode dielectric resonance structure is internally provided with at least two coupling devices which are used for changing the orthogonal properties of the electromagnetic field of the degenerate triple-mode in the cavity and are not in parallel arrangement; each coupling device includes cut corners or holes or cut corners and holes disposed beside the edges of the dielectric resonance block, or includes chamfers/cut corners disposed beside the edges of the cavity, or includes the cut corners or holes or the cut corners and holes disposed beside the edges of the dielectric resonance block, and the chamfers/cut corners disposed beside the edges of the cavity, or includes tap wires/sheets disposed on the non-parallel plane in the cavity; each cut corner is in the shape of a triangular prism or a cuboid or a sector; and each hole is circular, rectangular or polygonal. After corner cutting or perforating, the side length of the dielectric resonance block increases under a condition of maintaining frequency, and the Q-value decreases slightly; a depth of the cut corner or the hole is of a through or partial cut corner/partial hole structure according to a required coupling quantity; the size of the cut corner/chamfer/hole affects the coupling quantity; coupling screws are disposed on a coupling device in the directions perpendicular or parallel to the cut corners or in the directions parallel to the holes, or in the directions perpendicular or parallel to the cut corners and in the directions parallel to the holes; the coupling screw is made of metal, or the coupling screw is made of metal, a surface of which is electroplated with copper or sliver, or the coupling screw is made of a dielectric, or the coupling screw is made of the dielectric, a surface of which is metallized; and the coupling screw is in a shape of any one of a metal rod, a dielectric rod, a metal disk, a dielectric disk, a metal rod with a metal disk, a metal rod with a dielectric disk, a dielectric rod with a metal disk, and a dielectric rod with a dielectric disk. In some embodiments, the degenerate triple-mode in directions of axes X, Y and Z is formed in the cavity high-Q triple-mode dielectric resonance structure; the tuning frequency of the degenerate triple-mode in the X-axis direction is realized by adding debugging screws or tuning disks to places where a field strength is concentrated on one side or two sides of the X-axis corresponding to the cavity to change a distance or capacitance; a tuning frequency of the degenerate triple-mode in the Y-axis direction is realized by adding debugging screws or tuning disks to places where a field strength is concentrated on one side or two sides of the Y-axis corresponding to the cavity to change the distance or capacitance; and a tuning frequency of the degenerate triple-mode in the Z-axis direction can be realized by adding debugging screws or tuning disks to places where a field strength is concentrated on one side or two sides of the Z-axis corresponding to the cavity to change the distance or capacitance; in addition, a surface of the dielectric resonance block, the inner wall of the cavity body, or an inner wall of the cover plate, and the bottom of the tuning screw is pasted with dielectric constant thin films having different shapes and thicknesses; the thin film is made of ceramic dielectric and ferroelectric materials; the frequency of the degenerate triple-mode is adjusted by changing the dielectric constant; the tuning screw or the tuning disk is made of metal, or the tuning screw or the tuning disk is made of metal, a surface of which is electroplated with copper or silver; or the tuning screw or the turning disk are made of a dielectric; or the tuning screw or the tuning disk is made of a dielectric, a surface of which is metalized; and the tuning screw is in a shape of any one of a metal rod, a dielectric rod, a metal disk, a dielectric disk, a metal rod with a metal disk, and a metal rod with a dielectric disk, a dielectric rod with a metal disk, and a dielectric rod with a dielectric disk. A frequency temperature coefficient of the cube-like dielectric resonance block is controlled by adjusting the ratio of dielectric materials, and is compensated according to the frequency deviation change of the filter under different temperature conditions; when the dielectric support frame is fixed to an inner wall of the cavity body, an elastomer is adopted for transition between the dielectric support frame and the inner wall of the cavity body to avoid a stress generated by the cavity body and the dielectric material in an environment of sudden temperature changes and buffer a reliability risk caused by material expansion coefficients. In some embodiments, the cavity high-Q triple-mode dielectric resonance structure includes the cavity, the dielectric resonance block and the support frames. When the cavity is cube-like, the single cube-like dielectric resonance block and the dielectric support frames are arranged in any axial direction of the cavity, a center of the dielectric resonance block coincides with or is close to a center of the cavity. The air-like support frames support any single surface of the cube-like dielectric block, or support six surfaces, or different two surfaces, three surfaces, four surfaces and five surfaces in different combinations; each surface is supported by one dielectric support frame or the plurality of dielectric support frames; and the one or the plurality of dielectric support frames is disposed on different surfaces according to needs. A support frame with the dielectric constant which is greater than a dielectric constant of air and is less than the dielectric constant of the dielectric resonance block supports any single surface of the cube-like dielectric block, or supports six surfaces, or different two surfaces, three surfaces, four surfaces and five surfaces in different combinations; the surface without the support frame is air; a air surface is arbitrarily combined with the dielectric support frame; each surface is supported by one dielectric support frame or the plurality of dielectric support frames, or a composite dielectric constant support frames made of a plurality of layers of different dielectric constant dielectric materials; a single-layer or multiple-layer dielectric material support frames are arbitrarily combined with the cube-like dielectric block; one or a plurality of support frames are arranged on different surfaces according to needs; and in order to maintain a frequency and Q-value of the triple-mode, a size of the dielectric support frame corresponding to an axial direction of the dielectric resonance block is slightly reduced. The support combination of the single surface is used to support any one surface of the dielectric resonance block, especially a bottom surface or a load-bearing surface in a vertical direction; a support combination of two surfaces includes parallel surfaces such as upper and lower surfaces, front and rear surfaces, and left and right surfaces, also includes non-parallel surfaces such as a upper surface and a front surface, a upper surface and a left surface, and a upper surface and a right surface; a support combination of three surfaces includes three mutually perpendicular surfaces or two parallel surfaces and one non-parallel surface; a support combination of four surfaces includes two pairs of parallel surfaces or a pair of parallel surfaces and the other two non-parallel surfaces; the support combination of five surfaces includes a support structure on other faces except any one surface of the front surface/rear surface/left surface/right surface/upper surface/lower surface; and the support combination of the six surfaces includes support structures of the front surface/rear surface/left surface/right surface/upper surface/lower surface. In some embodiments, any end of the cube-like dielectric resonance block and the dielectric support frame are connected by crimping, bonding or sintering; for connection of one surface or combined connection of different surfaces, a plurality of layers of dielectric support frames are fixed by a mode of bonding, sintering, crimping and other manners; the dielectric support frames and the inner wall of the cavity body are connected by fixing manners such as bonding, crimping, welding, sintering and bolts; a radio frequency channel formed by coupling of radio frequency signals in three directions of axes X, Y and Z of triple-mode causes loss and generates heat; and the dielectric resonance block is fully connected with the inner wall of the metal through the dielectric support frame to guide heat into a cavity for heat dissipation. In some embodiments, the cube-like dielectric resonance block has a single dielectric constant or a composite dielectric constant; the dielectric resonance block with the composite dielectric constant is made of two or more materials with different dielectric constants; materials with different dielectric constants is combined by up and down, or left and right, or asymmetric or nested manners to form the dielectric resonance block with the composite dielectric constant; when the materials of different dielectric constants are nested in the dielectric resonance block, one layer of or a plurality of layers of materials are nested in the dielectric resonance block; and the dielectric resonance block with the composite dielectric constant needs to meet the a change variation rules of Q-value conversion points. When side cutting coupling is performed among triple modes of the dielectric resonance block, in order to maintain a required frequency, corresponding side lengths of two surfaces adjacent to cut sides are adjusted in parallel; the dielectric resonance block is made of ceramic or dielectric materials; and a surface of the dielectric resonance block is added with dielectric sheets with different thicknesses and different dielectric constants. In some embodiments, the dielectric constant of the dielectric support frame is similar to the dielectric constant of air, or the dielectric constant of the support frame is greater than the dielectric constant of air and is less than the dielectric constant of the dielectric resonance block; a surface area of the dielectric support frame is less than or equal to a surface area of the cube-like dielectric resonance block; and the dielectric support frame is cylindrical, square or rectangular solid-shaped. The dielectric support frame is of a solid structure or a hollow structure; the dielectric support frame being of the hollow structure includes a single hole or a plurality of holes; each of the single hole or a plurality of holes is round, square, polygonal and arc; the dielectric support frame is made of plastic, ceramic, and dielectrics, or the dielectric support frame is air; the dielectric support frame is connected with the dielectric resonance block; when the dielectric constant of the dielectric support frame is similar to the dielectric constant of air, the dielectric support has no effect on the triple-mode resonance frequency; when the dielectric constant of the dielectric support frame is greater than the dielectric constant of air but less than the dielectric constant of the dielectric resonance block, in order to maintain the original triple-mode frequency, a size of the dielectric support frame, which corresponds to an axial direction of the dielectric resonance block, is slightly reduced; the support frame with the dielectric constant being similar to the dielectric constant of air, and the support frame with the dielectric constant being greater than the dielectric constant of air and being less than the dielectric constant of the dielectric resonance block are arranged in different directions and different corresponding surfaces of the dielectric resonator block in combination. When the above two support frames with different dielectric constants are used in combination, the size of the support frame with the dielectric constant being greater than the dielectric constant of air, which corresponds to the axial direction of the dielectric resonance block, is slightly reduced on the original basis. In some embodiments, the cavity is cube-like; a coupling among the triple modes is realized by performing side cutting on any two adjacent surfaces of the cavity under a premise that a size of the cube-like dielectric resonance block is not changed; a size of the cut side is related to a required coupling quantity; a coupling between the two modes in the triple-mode coupling is realized by the cut sides of the cube-like cavity; the remaining coupling is realized by cutting corners at the two adjacent sides of the cavity; a wall cannot be broken when the corners are cut at the adjacent sides of the cavity; corner cutting surfaces need to be completely sealed with the cavity. The cavity is made of metal or nonmetal materials; the metal or nonmetal surface is electroplated with copper or silver; and when the cavity is made of the nonmental materials, the inner wall of the cavity is electroplated with conductive materials such as silver or copper, for example, the plastic and composite material surface is electroplated with the copper or the silver In some embodiments, the cavity high-Q triple-mode dielectric resonance structure, the single-mode resonance structure, the two-mode resonance structure, and a triple-mode resonance structure are combined in different forms to form filters of different volumes; a coupling between any two resonance cavities formed by an arrangement and combination of the high-Q triple-mode dielectric resonance structure, the single-mode resonance cavity, the two-mode resonance cavity, and the triple-mode resonance cavity is only realized through the window size between the two resonance cavities under the condition that two resonance rods in the two resonance cavities are parallel; the window size is determined according to the coupling quantity; and the filters have the functional characteristics that the filters include but are not limited to band pass filters, band stop filters, high pass filters, and low pass filters, and the filters form duplexers, multiplexers and combiners. The dielectric constant of the cube-like dielectric resonance block of the present disclosure is greater than the dielectric constant of the support frame. When a ratio of the single side size of the inner wall of the cavity to the single side size of the dielectric resonance block is between 1.03-1.30, the Q-value of the higher-order mode is inverted to the Q-value of the base mode, the Q-value of the triple-mode dielectric base mode is increased, and the Q-value of the higher-order mode is reduced. Compared with traditional single-mode dielectric filters and triple-mode dielectric filters, the Q-value of the filter is increased by more than 30% under a same volume and frequency; according to this rule, the triple-mode structure is combined with different types of single cavities, for example, the triple-mode structure is combined with a cavity single-mode, the triple-mode structure is combined with a TM mode, and the triple-mode is combined with a TE single mode. The more triple-mode is used in the filter, the smaller a filter volume is, and the smaller the insertion loss is; and the cavity high-Q multi-mode dielectric resonance structure can produce triple-mode resonances in directions of axes X, Y, and Z respectively. When a ratio of the side length of the inner wall of the cavity to the corresponding side length of the dielectric resonance block is between 1.0 to the conversion point 1 of the Q-value conversion, particularly when the ratio is 1.0, the cavity has the Q-value of a pure dielectric, and when the cavity size increases, the Q-value constantly increases on a basis of the Q-value of the pure dielectric, the Q-value of the higher-order mode is greater than the Q-value of the base mode; and when the ratio increases to the conversion point 1, the Q-value of an original higher-order mode is approximate to a new Q-value of the base mode. After the ratio enters the conversion point 1, the Q-value of the base mode is greater than the Q-value of the higher-order mode under a condition of keeping the resonance frequency of the base mode unchanged. With an increase of the ratio, as sizes of the dielectric block and cavity increase, the Q-value of the base mode increases, and the Q-value of the higher-order mode increases at a same time. When the ratio is approximate to the conversion point 2 of Q-value, the Q-value of the base mode is highest. When the ratio is between the conversion point 1 of the Q-value of the base mode and the conversion point 2 of the Q-value of the base mode, a frequency of the higher-order mode is sometimes far from and sometimes approximate to a frequency of the base mode with the variation of the ratio of the cavity to the dielectric resonance block between the conversion point 1 and the conversion point 2. After the ratio enters the conversion point 2, the Q-value of the base mode is less than the Q-value of the higher-order mode. With an increase of the ratio, as the size of the dielectric resonance block decreases, the size of the cavity increase, the Q-value of the base mode constantly increases; and when the ratio is approximate to the conversion point 3, the Q-value of the base mode is approximate to the Q-value at the conversion point 2. After the ratio enters the conversion point 3, the Q-value of the base mode increases with an increase of the ratio, the Q-value of the higher-order mode decreases with an increase of the ratio, the size of the dielectric resonance block decreases with an increase of the ratio, and the size of the cavity constantly increases. When the size of the cavity is approximate to the ¾ wavelength size of the cavity, as the size of the dielectric resonance block constantly decreases, the Q-value of the base mode decreases accordingly, and the frequency of the higher-order mode is sometimes far from and sometimes approximate to the frequency of the base mode with the increase of the ratio. A specific ratio of the conversion point is related to the dielectric constant and frequency of the dielectric resonance block and whether the dielectric resonator block has the single or composite dielectric constant. A side length of the inner wall of the cavity and a side length of the dielectric resonance block can have equal or unequal size in three directions of axes X, Y and Z. When the cavity and the cub-like dielectric resonance block have equal sizes in three directions of axes X, Y and Z, a triple-mode is formed; when the cavity and the cub-like dielectric resonance block have slightly unequal sizes in three directions of axes X, Y and Z, a triple-mode is formed; when the size of the cavity body in one of directions of axes X, Y and Z and the corresponding single side size of the dielectric resonance block are different from the single side sizes in the other two directions, or a symmetrical single side sizes of any one of the cavity body and the dielectric resonance block are different from the single side sizes in the other two directions, a frequency of one of the triple modes changes and is different from a frequency of the other two modes. The greater a size difference is, the greater a frequency difference between one mode and the other two modes is. When a size in one direction is greater than sizes in the other two directions, the frequency drops on the original basis. When the size in one direction is smaller than the size in the other two directions, the frequency rises on an original basis, and thus, the triple-mode is gradually turned into a two-mode or a single-mode; when the cavity and the dielectric resonance block have greatly different sizes in three directions of axes X, Y and Z, and the symmetrical single side sizes in three directions of axes X, Y and Z are different, the frequency of the triple modes in the triple-mode are different; in a case where side length sizes in the three directions differ greatly, the base mode is a single-mode; in a case where a side length sizes in the three directions are slightly different, a frequency difference is not large; and although the frequency changes, a triple-mode state can still be maintained by the tuning device. The coupling among the triple modes can adopt at least two coupling devices which are arranged in the cavity high-Q triple-mode dielectric resonance structure, and are used for changing the orthogonal properties of the electromagnetic field of the degenerate triple-mode in the cavity and are not in parallel arrangement; each coupling device includes cut corners or holes or corners and holes disposed beside the edges of the dielectric resonance block, or includes chamfers/cut corners disposed beside the edges of the cavity, or includes the cut corners or holes or corners and holes disposed beside the edges of the dielectric resonance block, and the chamfers/cut corners disposed beside the edges of the cavity, or includes tap wires or/sheets disposed on the non-parallel planes in the cavity; each cut corner is in the shape of a triangular prism or a cuboid or a sector; and each hole is circular, rectangular or polygonal. After corner cutting or perforating, under the condition of maintaining frequency, the side length of the dielectric resonance block increases, and the Q-value decreases slightly; the depth of the cut corner or the hole is of a through or partial cut corner/partial hole structure according to the required coupling quantity; and the size of the cut corner/chamfer/hole affects the coupling quantity. Coupling screws are arranged on coupling devices in the directions perpendicular or parallel to the cut corners or in the directions parallel to the holes or in the directions perpendicular or parallel to the cut corners and in the directions parallel to the holes; the coupling screw is made of metal, or the coupling screw is made of metal, the surface of which is electroplated with copper or sliver, or the coupling screw is made of a dielectric, or the coupling screw is made of a dielectric, the surface of which is metallized; and the coupling screw is in the shape of any one of a metal rod, a dielectric rod, a metal disk, a dielectric disk, the metal rod with the metal disk, the metal rod with the dielectric disk, the dielectric rod with the metal disk, and the dielectric rod with the dielectric disk. The tuning frequency of the triple-mode in the X-axis direction is realized by adding debugging screws or tuning disks to the places where the field strength is concentrated on one side or two sides of the X-axis corresponding to the cavity to change the distance or capacitance; the tuning frequency of the triple-mode in the Y-axis direction is realized by adding debugging screws or tuning disks to the places where the field strength is concentrated on one side or two sides of the Y-axis corresponding to the cavity to change the distance or capacitance; and the tuning frequency of the triple-mode in the Z-axis direction is realized by adding debugging screws or tuning disks to the places where the field strength is concentrated on one side or two sides of the Z-axis corresponding to the cavity to change the distance or capacitance. The Q-value conversion triple-mode structure of a dielectric resonator, the single-mode resonance cavity, the two-mode resonance cavity or the triple-mode resonance cavity are arbitrarily arranged and combined in different forms to form the required filters of different sizes; the filters have the functional characteristics that the filters include but are not limited to band pass filters, band stop filters, high pass filters, and low pass filters, and the filters form duplexers and multiplexers; and the coupling between any two resonance cavities formed by the arrangement and combination of the single-mode resonance cavity, the two-mode resonance cavity or the triple-mode resonance cavity is realized through the window size between the two resonance cavities under the condition that two resonance structures are parallel. Some embodiments of the present disclosure has beneficial effects that the cavity high-Q triple-mode dielectric resonance structure is simple and convenient to use; by setting the ratio of the single side size of the inner wall of the metal cavity of the dielectric multimode structure to the single side size of the dielectric resonance block between 1.01 and 1.30, the resonance rod is cooperated with the cavity body to form the multi-mode structure, meanwhile a reversion of specific parameters is realized, and thus, the high Q-value is obtained at a smaller spacing between the resonance rod and a cavity body; further, some embodiments of the present disclosure discloses the filter with the high-Q triple-mode dielectric resonance structure; and compared with a traditional triple-mode filter, the insertion loss of the filter is reduced by the more than 30% under the premise of the same frequency and same volume. The magnetic fields of a frequency conversion multimode structure of a dielectric resonator formed by a cube-like dielectric resonance block, a dielectric support frame and the cavity body cover plate in three directions of axes X, Y and Z of the cavity body are mutually orthogonal and perpendicular to form three resonance modes that do not interfere with each other; and the frequency of the higher-order mode is converted into the frequency of the high-Q base mode to form coupling the among three magnetic fields. The strength of the coupling is adjusted to meet the different bandwidth requirements of the filter. When the two filters with the high-Q triple-mode dielectric structures are used in a typical 1800-MHz frequency filter, the volume of the filter is equivalent to the volume of six single cavities of an original cavity, and the volume is reduced by 40% on a basis of the original cavity filter, and the insertion loss can also be reduced by about 30%. As the volume is greatly reduced, processing man-hours and the plating area are reduced accordingly; although the dielectric resonance block is used, the cost of the dielectric resonance block is equivalent to the cost of the cavity; if the material cost of the dielectric resonance block can be greatly reduced, the cost advantage of this design will be more obvious; when there are more filter cavity bodies, even 3 triple-mode structures can be used, and advantages brought by the volume and performances are more obvious. Simulation Embodiment 1 As shown inFIG.1, the cavity high-Q multi-mode dielectric resonance structure includes a cavity body1and a cover plate4, wherein a dielectric resonance block and six dielectric support frames are disposed in the cavity body1, and the dielectric support frames are cylindrical. In order to clarify the essence of the present disclosure more clearly, the present disclosure is further explained below with reference to data. In the following table data, by controlling the frequency of a base mode in the multi-mode resonance structure within a range of 1880 MHz±5 MHz, the dielectric constant of the dielectric resonance block is 35, and the Q×F of materials is 80,000; the side length of the single cavity is changed, and thus, the size of the dielectric resonance block varies accordingly in order to ensure the resonance frequency of the base mode, which is shown by the variation of the Q-value of the single cavity with A1/A2. See the table below for specific data. A curve of the Q-values of the base mode and the higher-order mode adjacent to the base mode varying with A1/A2=K and the schematic diagram of conversion points are shown inFIG.2: TABLE 1Side length ofinner wall ofSide length ofQ-value @Higher-ordercavity A1dielectric blockRatio(1880 MHz ±Higher-orderfrequency(mm)A2(mm)(A1\A2)5 MHz)frequencyQ-value10022.244.50444861955230349222.324.12439032070236298822.363.94435442128242648422.413.75431212182252028022.453.56426242233265517622.493.38420292278283447222.563.19412952313305856822.63.01404102343327456422.72.82392772350349116022.82.63378542364363745622.952.44360142366372775223.152.25336352355375445023.252.15322262348374144823.42.05305862334370374423.751.85266992298355904024.41.64217002228328243625.71.40155062086267243427.11.25118771936207013327.431.20177461905106503227.21.18163571949100373026.531.1313367205589982825.671.0910551218381662624.561.068225233775332423.221.03634025177012 The bolded part in table 1 is a data between 1.03-1.30. In this interval, it can be seen that the Q-value increases significantly, and the Q-value near the outside of this interval is obviously lower than the Q-value of this interval. The ratio of the side length of the single cavity to the dielectric resonance block and the critical point curve are statistically completed under a premise that the frequency is 1880 MHz±5 MHz, and the dielectric constant is 35. When A1/A2 enters a conversion point 1, in a frequency band used, the Q-value of the single cavity of the base mode becomes higher, and the Q-value of the single cavity of the higher-order mode adjacent to the base mode decreases; When A1/A2 enters a conversion point 2, in the frequency band used, the Q-value of the single cavity of the base mode becomes lower, and the Q-value of the single cavity of the higher-order mode adjacent to the base mode becomes higher; When A1/A2 enters a conversion point 3, in the frequency band used, the Q-value of the single cavity of the base mode increases with the increase of the size and the Q-value of the single cavity of the higher-order mode adjacent to the base mode decreases with the increase of the size; When A1/A2 is between 1.0 and the conversion point 1, the Q-value of the higher-order mode adjacent to the base mode increases with the increase of the ratio, the Q-value of the single cavity of the base mode increases with the increase of the ratio, but the Q-value of the single cavity of the higher-order mode adjacent to the base mode is greater than the Q-value of the single cavity of the base mode; and the single cavities are coupled with other cavities to form a cavity filter with small volume and general performances. When A1/A2 is between the conversion 1 and the conversion point 2, the Q-value of the higher-order mode adjacent to the base mode increases with the increase of the ratio, and the Q-value of the single cavity of the base mode increases with the increase of the ratio, but the Q-value of the single cavity of the base mode is greater than the Q-value of the single cavity of the higher-order mode adjacent to the base mode; and the single cavities are coupled with other cavities to form a cavity filter with small volume and higher performances. When A1/A2 is between the conversion 2 and the conversion point 3, the Q-value of the higher-order mode adjacent to the base mode first increases and then decreases with the increase of the ratio, and the Q-value of the single cavity of the base mode first decreases and then increases with the increase of the ratio, but the Q-value of the single cavity of the base mode is less than the Q-value of the single cavity of the higher-order mode adjacent to the base mode; and the single cavities are coupled with other cavities to form a cavity multi-mode filter with larger volume and high performances. When A1/A2 is between the conversion 3 and the maximum value, the Q-value of the higher-order mode adjacent to the base mode decreases with the increase of the ratio, and the Q-value of the single cavity of the base mode increases with the increase of the ratio, but the Q-value of the single cavity of the base mode is greater than the Q-value of the single cavity of the higher-order mode adjacent to the base mode; when the size of the cavity is approximate to the ¾ wavelength, the Q-value of the single cavity of the base mode decreases with the increases of the ratio; and the single cavities are coupled with other cavities to form a cavity filter with larger volume and higher performances. Simulation Embodiment 2 As shown inFIG.3, a cavity high-Q multi-mode dielectric resonance structure includes a cavity body1and a cover plate4, wherein a dielectric resonance block is disposed in the cavity body1. When the length, width and height of the inner wall of a typical single cavity are respectively 33 mm*33m*33 mm, the sizes of the dielectric resonance block (without the dielectric support frame, equivalently, air serves as the dielectric support frame) is 27.43 mm*27.43 mm*27.43 mm; when the dielectric constant of the dielectric resonance block is 35, and the Q×F of the materials is 80000, triple modes are formed, the frequency is 1881 MHz, and the Q-value reaches 17746.8. The specific simulation results are shown inFIG.4. FrequencyQ-valueMode 11881.6017746.8Mode 21881.9317771.3Mode 31882.5617797.2Mode 41905.3110678.2 Simulation Embodiment 3 As shown inFIG.5, a cavity high-Q multi-mode dielectric resonance structure includes a cavity body1and a cover plate4, wherein a dielectric resonance block and a plurality of coplanar dielectric support frames are disposed in the cavity body1. The dielectric support frames are cylindrical (or cuboid-shaped). When the length, width and height of an inner wall of the typical single cavity are respectively 33 mm*33m*33 mm, the sizes of the dielectric resonance block (with the dielectric support frames having the diameters of 2 mm, and when the dielectric constant is 1.06, the loss angle tangent is 0.0015) are 27.43 mm×27.43 mm×27.43 mm; when the dielectric constant of the dielectric resonance block is 35 and the Q×F of the materials is 80000, triple modes are formed, the frequency is 1881 MHz, and the Q-value reaches 17645. The specific simulation results are shown inFIG.6. FrequencyQ-valueMode 11885.2017645.1Mode 21885.2717452.1Mode 31885.3417770.4Mode 419005.2710672.9 Simulation Embodiment 4 As shown inFIG.7, a cavity high-Q multi-mode dielectric resonance structure includes a cavity body1and a cover plate4, wherein a dielectric resonance block and a single dielectric support frame are disposed in the cavity body1. The dielectric support frame is annular. When the length, width and height of the inner wall of the typical single cavity are respectively 33 mm*33m*33 mm, the sizes of the dielectric resonance block (with the dielectric support frame having the outer diameter of 7 mm and the inner diameter of 3.2, and when the dielectric constant is 9.8, the Q*F of the materials is 100000) are 27.83 mm×27.83 mm×27.83 mm; when the dielectric constant of the dielectric resonance block is 35 and the Q*F of the material is 80000, triple modes are formed, the frequency is 1880 MHz, and the Q-value reaches 17338.3. The specific simulation results are shown inFIG.8. frequencyQ-valueMode 11879.5017338.3Mode 21881.1117017.3Mode 31881.2017022.8Mode 41901.8510597.5 Simulation Embodiment 5 As shown inFIG.9, a cavity high-Q multi-mode dielectric resonance structure includes a cavity body1and a cover plate4, wherein a dielectric resonance block is disposed in the cavity body1and is made of mediums having different dielectric constants; and high dielectric constant dielectrics are nested in low dielectric constant dielectrics. When the length, width and height of the inner wall of the typical single cavity are respectively 33 mm*33m*33 mm, the sizes of the dielectric resonance block are 27.46 mm×27.46 mm×27.46 mm; when the dielectric constant of the dielectric block is 35 and the Q*F of the materials is 80000, the dielectric constant of the dielectric block nested in the middle of the dielectric is 68, and the Q*F of the material is 12000, the filled volume is 2 mm*2 mm*2 mm, triple modes are formed, the frequency is 1881 MHz, and the Q-value reaches 17635.8; and the specific simulation results are shown inFIG.10. FrequencyQ-valueMode 11881.6717635.9Mode 21881.9017650.3Mode 31882.3217671.7Mode 41906.1410702.8 Simulation Embodiment 6 A filter comprising the cavity high-Q multi-mode dielectric resonance structure includes a cavity body1, a cover plate4, and input/output structures6, wherein the cavity body is internally provided with a cavity similar to a metal cavity filter, a metal resonance rod, and a tuning screw7; and a coupling window or a boom/boom seat and a coupling screw are disposed in the cavity. In particular, the filter is provided with at least one cavity high-Q triple-mode structure; dielectric resonance blocks are disposed in the cavity of the cavity high-Q triple-mode structure and are supported by annular dielectrics; and the multi-mode coupling between the dielectric resonance blocks is realized by cutting the edges. A typical 12-cavity 1.8-GHz triple-mode cavity high-Q dielectric filter is shown inFIG.11. Six metal single cavities and two high-Q triple-mode dielectric resonance structures are adopted in the filter to form three inductive cross coupling and three capacitive cross coupling. Typical performance achieved: pass band frequency of 1805 MHz-1880 MHz, suppression greater than −108 dBm@1710-1785 MHz and −108 dBm@1920-2000 MHz, volume of 129 mm*66.5 mm*35 mm. Refer toFIG.12for the specific simulation curve. Simulation Embodiment 7 In some embodiments, A filter including the cavity high-Q multi-mode dielectric resonance structure includes a cavity body1, a cover plate4, and input/output structures6, wherein the cavity is internally provided with a cavity similar to a metal cavity filter, a metal resonance rod, and a tuning screw7; and a coupling window or a boom/boom seat and a coupling screw are disposed in the cavity. In particular, the filter is provided with at least one cavity high-Q triple-mode structure; dielectric resonance blocks are arranged in the cavity of the cavity high-Q triple-mode structure; the dielectric resonance blocks are supported by square loop-shaped dielectrics; and the multi-mode coupling between the dielectric resonance blocks is realized by cutting the edges (steps). A typical 12-cavity 1.8-GHz triple-mode cavity high-Q dielectric filter is shown inFIG.11. Six metal single cavities and two high-Q triple-mode dielectric resonance structures are adopted in the filter to form three inductive cross coupling and three capacitive cross coupling. Typical performance achieved: pass band frequency of 1805 MHz-1880 MHz, minimum point insertion loss of about 0.52 dB, suppression of greater than-108 dBm@1710-1785 MHz and-108 dBm@1920-2000M Hz, volume of 129 mm*66.5 mm*35 mm. Refer toFIG.14for the specific simulation curve,FIG.15for the real object S-parameter test curve, andFIG.16for the harmonic response curve of 8.5 GHz. The simulation results of single cavities of the traditional TE-mode dielectric filters and TM-mode dielectric filters having the same volume and frequency, and ¾-wavelength metal single cavities having the same frequency are as follows: Comparative Example 1 Single Cavity of TE-Mode Dielectric Resonator Simulation conditions: single cavity 33*33*33, support column ER9.8, radius r1=3.5 mm, height 9 mm, dielectric block ER43, QF=43000, radius 14.3 mm, height 15 mm, F=1880. Simulation result: the Q-value of the single cavity is 11022 when the frequency is 1882.6 MHz. FrequencyQ-valueMode 11882.6111022.9Mode 22167.6414085.4Mode 32167.6714067.6Mode 42172.5018931.7 Comparative Example 2 Single Cavity of TM-Mode Dielectric Resonator Simulation conditions: single cavity 33*33*33, dielectric block ER35, QF=80000, radius 5.8 mm, inner diameter 5.8−3=2.8 mm, height 33 mm, F=1880. Simulation result: the Q-value is 7493 when the frequency is 1878.5 MHz. FrequencyQ-valueMode 11878.507493.67Mode 23157.949161.01Mode 33157.989160.74Mode 432276.412546.6 Comparative Example 3 ¾ Wave Length Cavity Simulation conditions: single cavity 112.6*112.6*1126, dielectric block ER35, QF=80000, radius 5.8 mm, inner diameter 5.8−3=2.8 mm, height 33 mm, F=1880. Simulation result: the Q-value is 20439 when the frequency is 1880 MHz. FrequencyQ-valueMode 11882.8120439.6Mode 21882.9520400.8Mode 31882.9820444.3Mode 42306.8716992.2 Comparative Example 4 1800-MHz 12-Cavity Filter Six metal single cavities and two high-Q triple-mode dielectric structures are adopted to form two inductive cross coupling and four capacitive cross coupling. Typical performance achieved: Pass band frequency: 1805 MHz-1880 MHz Insertion loss: less than-0.9 dB; A suppression for 1710-1785 MHz: greater than 120 dBm; Volume: 129 mm*66.5 mm*35 mm; Performance and pass band frequency by using 12 metal single cavities: 1805 MHz-1880 MHz Insertion loss: less than −1.3 dB A suppression for 1710-1785 MHz: greater than 120 dBm Volume: 162 mm*122 mm*40 mm BRIEF SUMMARY Volume of single cavityFrequencyQ-valueDielectric Q-value33 mm * 33 mm * 331880 MHz17746conversion triple-modemmTE single mode33 mm * 33 mm * 331880 MHz11022mmTM single mode33 mm * 33 mm * 331880 MHz7493mm3/4 wavelength cavity112.6 mm * 112.6 mm *1880 MHz20439112.6 mm From the above table, it can be obtained that the Q-value ratio of the dielectric Q-value conversion triple-mode and TE single mode under the same single-cavity volume and frequency is 17746/11022=1.61. The Q-value ratio of TE single mode and TM single mode at the same single cavity volume and frequency is 11022/7493=1 47. From the comparison of the embodiments 1-5 and the comparative examples 1-3, it can be seen that: 1. When the single cavity of the triple-mode dielectric conversion structure is simulated, and the Q-value conversion is generated, the Q-value is obviously higher than the Q-value before conversion under a premise that the single cavity volumes are little different. 2. When the single cavity of the triple-mode dielectric conversion structure is simulated, the Q-value is obviously higher than the Q-value of the TE dielectric single mode structure and the TM dielectric single mode structure under a same frequency and same volume. Pass bandInsertionfrequencylossvolumeMetal single-mode1805-18801.3 dB162 mm *filterMHz122 mm * 40 mmHigh-Q triple-mode1805-18800.9 dB129 mm *dielectric filterMHz66.5 mm * 35 mm From the comparison of the embodiments 1-7 and the comparative example 4, it can be seen that: when the ratio of the side length of the single cavity to the side length of the cube-like dielectric resonance block is between 1.03-1.30 of the present disclosure, that is, between the conversion point 1 and the conversion point 2, the Q-value is converted and increased, the Q-value is increased by more than 30% in comparison with the triple-mode single cavity without the range of the side length ratio; compared with the traditional TE dielectric single mode filters and TM dielectric single mode filters, the Q-value is significantly improved under the same volume and frequency; and the dielectric resonator applied to the filter has very obvious triple-mode volume and performance advantages. Furthermore, in a case where the single cavity volume is small, the Q value of a high-Q multi-mode dielectric resonance structure of the cavity is significantly higher than the Q value of the other forms of single cavity. The high-Q triple-mode dielectric resonance structure reduces the filter volume by more than 30%. Meanwhile, the loss of the filter is reduced by 30%, and when the performance of the high-Q triple-mode dielectric resonance structure filter is the same as that of the filter known to inventors, the volume is significantly reduced by more than 50% relative to a cavity filter known to inventors. Some embodiments of the present disclosure is aimed to provide a dielectric resonator Q-value conversion triple-mode structure in order to overcome the shortcomings of the art known to inventors, which can reduce an overall insertion loss of the filter, and realizes higher-order Q-value conversion by using the size ratio of a single cube-like dielectric block and a hollow cube-like dielectric resonance block to the inner wall of the cavity so as to meet the requirements of the cavity filter for higher Q-values and smaller volumes. It should be understood that the above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited to this. Changes or replacements which can be easily thought of by those skilled in the art within the technical scope disclosed by the present disclosure shall be covered within the protection scope of the present disclosure. | 56,397 |
11942673 | Note that, in the embodiments described below, in some cases the same portions or portions having similar functions are denoted by the same reference numerals in different drawings, and description of such portions may not be repeated throughout the specification. In some cases, similar reference numerals and letters are used to refer to similar items, and thus once an item is defined in one figure, it need not be further discussed for following figures. The position, size, range, or the like of each structure illustrated in the drawings and the like are not accurately represented in some cases in order to facilitate a better understanding of the inventive concepts disclosed. Thus, the disclosure is not necessarily limited to the position, size, range, or the like as disclosed in the drawings and the like. A component shown in dashed lines in a drawing may be obscured by another component from the perspective of the drawing. DETAILED DESCRIPTION OF THE INVENTION Various exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings in the following. It should be noted that the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise. The following description of some exemplary embodiments is merely illustrative in nature and is in no way intended to limit this disclosure, the applications thereof, or uses thereof. That is to say, the structures and methods discussed herein are illustrated by way of example to explain different embodiments of the structures and methods of the present disclosure. It should be understood by those skilled in the art that, these examples, while indicating the implementations of the present disclosure, are given illustratively, but not exhaustively. Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but are intended to be regarded as a part of the specification where appropriate. In all of the examples as illustrated and discussed herein, any specific values should be interpreted to be illustrative only and non-limiting. Thus, other examples of the exemplary embodiments could have different values. In a first conventional signal processing device, as shown inFIG.1andFIG.2, a feeding cable100′ may extend in a direction parallel or substantially parallel to a surface of a target circuit board200′, and the feeding cable100′ may be located on a back side of the target circuit board200′ (as shown by dashed lines inFIG.1). In order to electrically connect the feeding cable100′ with a target circuit210′ (FIG.1) located on a front surface of the target circuit board200′, for example to feed a communication signal (e.g., a radio frequency signal) carried by the feeding cable100′ to the target circuit210′, an inner conductor110′ of the feeding cable100′ may be exposed and bent toward the target circuit board200′ at a suitable position to be electrically connected with the target circuit210′ through, for example, a solder joint300′. In such a signal processing device, since the feeding cable100′ extends substantially in a direction parallel to the surface of the target circuit board200′, the bending thereof can be very small, and thus a connection between the feeding cable100′ and the target circuit board200′ according to the structural strength requirement can be well achieved generally by a single soldering process and only a single solder joint, without the need of adding an additional fastener or the like. However, in such a signal processing device, at least the exposed inner conductor110′, air or other dielectric between the inner conductor110′ and the target circuit board200′, and the target circuit board200′ will form an inductive impedance, resulting in a low power conversion efficiency of the fed radio frequency signal and a poor feeding effect. In another conventional signal processing device, as shown inFIG.3andFIG.4, the feeding cable100′ may extend perpendicularly or substantially perpendicularly to the target circuit board200′ at a position close to the target circuit board200′, so as to be connected to the target circuit210′ (FIG.3) of the target circuit board200′ in a direct vertical feeding manner. This direct vertical feeding (stalk feeding) manner can effectively reduce a magnitude of the impedance formed by the feeding cable100′ and the target circuit board200′, thereby ensuring the power conversion efficiency during the feeding process, so as to have a better feeding effect with respect to the radio frequency signal. However, in such a signal processing device, the extending direction of the feeding cable100′ is greatly restricted, which in practice often results in a large bend (not shown) in the feeding cable100′, and in turn in a large stress at the connection (e.g., the solder joint300′ as shown inFIG.3) between the feeding cable100′ and the target circuit210′ which can lead to the feeding cable100′ inadvertently detaching from the target circuit210′. In order to avoid the occurrence of the above-mentioned detachment, a fastener400′ may be additionally added to the periphery of the feeding cable100′ to increase the strength of the connection structure. However, the added fastener400′ (FIG.4) will result in an increase in material cost. In addition, in order to fix the fastener400′, a secondary soldering is often required, resulting in increased process difficulty and cost. Exemplary embodiments of the present disclosure provide signal processing devices, which aim to secure a better feeding effect of a radio frequency signal, avoid excessive bending of the feeding cable, make the feeding structure have a good structural strength, and reduce material and process costs as much as possible. In an exemplary embodiment of the present disclosure, as seen inFIGS.5and6a signal processing device is provided. The signal processing device includes a target apparatus and a feeding apparatus, wherein the feeding apparatus includes a first connection member102(FIGS.5and6) that is configured to form a capacitive impedance with the target apparatus and a second connection member104(FIGS.5and6) that is configured to form an inductive impedance with the target apparatus. The first and second connection members102,104are electrically connected to each other, and at least one of the first and second connection members102,104is directly electrically connected to the target apparatus (e.g., through solder joint300ofFIG.6), so as to feed the radio frequency signal passed through the first and second connection members102,104to the target apparatus. The capacitive impedance and the inductive impedance may have opposite signs, and hence the capacitive impedance may at least partially cancel out the inductive impedance. Thus, by providing both a capacitive impedance and the inductive impedance, a better feeding effect of the radio frequency signal may be achieved. In some embodiments, as shown inFIG.5andFIG.6, the feeding apparatus may include a feeding cable100. The feeding cable100may include a first conductor110, an insulating medium120, and a second conductor130, wherein the first connection member102of the above-mentioned feeding apparatus may correspond to a first segment of the first conductor110of the feeding cable100, and the second connection member104may correspond to a second segment of the first conductor110of the feeding cable100. In the feeding cable100, the first conductor110may be configured to transmit a radio frequency signal. In some embodiments, the radio frequency signal may be a U-band signal having a frequency range of 3.6 to 5 GHz, although the present disclosure is not limited thereto. As shown inFIG.5andFIG.6, a first portion of the insulating medium120is covered by the second conductor130and a second portion of the insulating medium120extends beyond a first end of the second conductor130. Additionally, a first portion of the first conductor110is covered by both the second conductor130and the insulating medium120, a second portion of the first conductor110extends beyond the first end of the second conductor130and is covered by only the insulating medium120, and a third portion of the first conductor110extends beyond a first end of the insulating medium120. The exposed third portion of the first conductor110(corresponding to the first connection member102) is configured to be connected to the target apparatus to feed the radio frequency signal to the target apparatus and may form a capacitive impedance with the target apparatus. The exposed second portion of the insulating medium120together with the second portion of the first conductor110(which is within the exposed portion of the insulating medium120and which corresponds to the second connection member104) may form an inductive impedance with the target apparatus. An exposed portion of the second conductor130may electrically insulate the first portion of the first conductor110contained therein from a portion of the target apparatus (e.g., a target circuit board described hereinafter) to prevent the first conductor110from short-circuiting. In some embodiments, the feeding cable100may be a coaxial cable, wherein the first conductor110corresponds to an inner conductor of the coaxial cable, the insulating medium120corresponds to a dielectric layer of the coaxial cable, and the second conductor130corresponds to an outer conductor of the coaxial cable. In the coaxial cable, the inner conductor, the dielectric layer and the outer conductor are coaxially arranged to enable transmission of an analog signal and/or a digital signal. The inner conductor and the outer conductor form a current loop, and the outer conductor can be grounded, so that the radio frequency signal emitted from the inner conductor are isolated by the outer conductor, to improve the signal transmission effect. It will be appreciated that in other embodiments, the feeding apparatus may be in other forms and is not limited to the feeding cable. Also, the first connection member and the second connection member of the feeding apparatus may similarly form a capacitive impedance and an inductive impedance, respectively, with the target apparatus, wherein the capacitive impedance and the inductive impedance at least partially cancel each other to improve the feeding effect. In an ideal case, when an absolute value of the capacitive impedance is equal to an absolute value of the inductive impedance, the capacitive impedance and the inductive impedance can be completely cancelled, and the signal processing device may have the best feeding effect. However, in practical cases, the absolute values of the capacitive impedance and the inductive impedance may be slightly different, but a good feeding effect can also be obtained as long as an absolute value of a sum of the capacitive impedance and the inductive impedance is less than or equal to a preset impedance threshold. The preset impedance threshold can be determined according to the actual requirement. For example, the preset impedance threshold may be 25%, 20%, 15%, 10%, or 5% of the absolute value of the capacitive impedance, or 25%, 20%, 15%, 10%, or 5% of the absolute value of the inductive impedance, or the like. Further, in the signal processing device, and as seen inFIG.10, the extension the a direction of the feeding cable100may be configured such that the maximum bending curvature108is less than or equal to a preset curvature threshold. For example, in some embodiments, the extension direction of the feeding cable100may be parallel to a major surface of the target apparatus. When the maximum bending curvature108of the feeding cable100is excessively large, a large stress is likely to be introduced therein, resulting in a structural strength at the connection between the feeding cable100and the target apparatus being adversely affected. By configuring the extension direction of the feeding cable100such that the maximum bending a curvature108is less than or equal to the preset curvature threshold, the maximum bending curvature108may effectively avoid a large stress caused by excessive bending, thereby securing the structural strength without the need of secondary soldering or addition of other fasteners or the like. Furthermore, when the bending of the feeding cable100is small, the exposed third portion of the first conductor110of the feeding cable100may be connected to the target apparatus by a single soldering process. A single soldering process can help to effectively reduce material and process costs. As shown inFIG.5andFIG.6, in some embodiments, the target apparatus may include a target circuit board200. The target circuit board200may be a printed circuit board. The printed circuit board may be commonly grounded with the second conductor130of the feeding cable100. The target circuit board200may include a substrate290, a conductive member connecting a first side and an opposite second side of the substrate290, and a target circuit210(only shown inFIG.6) disposed on the first side. In some embodiments, the target circuit210may include a calibration circuit212for beamforming calibration, a power distribution circuit214for distributing signal power for different communication links, a phase shifter circuit, or one or more other circuits with specific functionality, etc. The exposed third portion of the first conductor110of the feeding cable100is electrically connected to the conductive member on the second side of the substrate290, and the first conductor110is electrically connected to the target circuit210on the first side of the substrate290through the conductive member connecting the first and second sides of the substrate290, thereby feeding the radio frequency signal to the target circuit210. Due to the presence of the conductive member, the extension direction of the feeding cable100may be configured more flexibly such that the maximum bending curvature of the feeding cable100is less than or equal to the preset curvature threshold. In some embodiments, as shown inFIG.5andFIG.6, the conductive member may include a first pad231, a second pad232as shown inFIG.6, and a pad hole220as shown inFIG.5, wherein the first pad231is disposed on the first side of the substrate290, and the first pad231is electrically connected to the target circuit210. The second pad232is disposed on the second side of the substrate290, and the second pad232is electrically connected to the first conductor110. And, the pad hole220opened through the substrate290physically and electrically connects the first pad231and the second pad232, for example, the pad hole220may be a conductive via filled with a conductive material. In some embodiments, the first pad231is directly connected to the target circuit210and the second pad232is directly connected to the first conductor110. In some embodiments, the first conductor110may be electrically connected to the second pad232by means of soldering. The sizes of the first pad231, the second pad232and the exposed second portion of the insulating medium120may be designed to cancel the capacitive impedance and the inductive impedance as much as possible. Specifically, by adjusting a relationship between a first pad area of the first pad231, a second pad area of the second pad232, and an extension length of the exposed second portion of the insulating medium120, the absolute value of the sum of the capacitive impedance and the inductive impedance can be made small to improve the feeding effect. In some embodiments, the first pad231and the second pad232are spaced apart by the substrate290, and the first pad231and the second pad232are disposed opposite each other. As an overlapping area between projections of the first pad231and the second pad232on the plane of the substrate290increases, the capacitive impedance also increases accordingly, so as to cancel out more inductive impedance. In the specific example shown inFIG.6, the first pad area may be designed to be larger than the second pad area (e.g., a width of the first pad231in a direction perpendicular to the extension direction of the feeding cable100is larger than that of the second pad232), so that the capacitive impedance and the inductive impedance cancel each other as much as possible to improve the feeding effect of the signal. In some embodiments, as shown inFIG.6, on the second side of the target circuit board200, an electrical isolation region250may also be provided, and the material in the electrical isolation region250is insulating, so that the first conductor110may be electrically isolated from the ground of the target circuit board, to avoid short-circuiting the first conductor110to ground. In the above-described exemplary embodiments, due to at least partial mutual cancellation between the capacitive impedance and the inductive impedance, a high power conversion efficiency can be achieved between the feeding apparatus and the target apparatus. Since the direction of the feeding apparatus (e.g., the feeding cable) can be flexibly set, it has a low requirement on the installation space, so that on one hand, the bending can be reduced as much as possible, on the other hand, the structural strength of the feeding structure can be achieved without the need of a secondary soldering process or addition of an additional fastener or the like, thereby effectively reducing the material cost and the process cost. In another exemplary embodiment of the present disclosure, there is provided another signal processing device for realizing connection between the feeding apparatus and the target apparatus through the feeding circuit board. As shown inFIG.7andFIG.8, the signal processing device may include a feeding cable100, a feeding circuit board500, and a target circuit board200as shown inFIG.7. The feeding cable100is configured to transmit a radio frequency signal. In some embodiments, the radio frequency signal may be a U-band signal having a center frequency within the 3.6 to 5 GHz frequency band. The feeding cable100may also be a coaxial cable, and similar to the coaxial cable in the above embodiment, the first conductor of the feeding cable corresponds to the inner conductor of the coaxial cable, the insulating medium corresponds to the dielectric layer of the coaxial cable and the second conductor corresponds to the outer conductor of the coaxial cable, wherein the first conductor may form a loop with the grounded second conductor, thereby transmitting the radio frequency signal. The feeding circuit board500may include a feeding circuit510electrically connected to the feeding cable100and configured to transmit the radio frequency signal. In some embodiments, the feeding circuit board500may also be a printed circuit board. As shown inFIG.7andFIG.8, in a specific configuration of connecting the feeding cable100and the feeding circuit510, the feeding circuit board500may further include a connection hole520penetrating the first and second sides of the feeding circuit board500. The first conductor of the feeding cable100may penetrate from the second side of the feeding circuit board500to the first side of the feeding circuit board500through the connection hole520, to be electrically connected with the feeding circuit510disposed on the first side of the feeding circuit board500. The first conductor may be connected to the feeding circuit510by a single soldering process, e.g., electrically connected to corresponding terminals, pads, etc. included in the feeding circuit510. The structure of the feeding circuit board is generally a stacked type and may include a ground layer and an insulating layer disposed to be at least partially overlapped from the second side to the first side. That is, the ground layer may be located on the second side of the feeding circuit board for grounding, and the insulating layer of the feeding circuit board is usually located between the layer where the feeding circuit is located in and the ground layer to avoid short-circuiting the feeding circuit with ground. Further, in order to avoid short-circuiting the first conductor passing through the connection hole520with the ground layer on the second side of the feeding circuit board, as shown inFIG.9, on the second side of the feeding circuit board, a portion of the ground layer593may be removed/omitted to expose a portion of the insulating layer592that surrounds the connection hole520. In this way, when the first conductor penetrates into the connection hole520, if it contacts the surrounding wall of the connection hole520, it will contact the exposed insulation layer592directly instead of the ground layer593, so that the first conductor and the ground layer593can be electrically isolated from each other. In some embodiments, the second conductor on the outer side of the feeding cable may be electrically connected to the ground layer of the feeding circuit board such that the feeding cable and the feeding circuit board are commonly grounded. In order to achieve the connection between the target circuit board200and the feeding circuit board500, the target circuit board200may include the first pad231, the second pad232, and the pad hole220, as shown inFIG.7andFIG.8, wherein the first pad231is disposed on the first side of the target circuit board200, and the first pad231is electrically connected to the target circuit210disposed on the first side of the target circuit board200. The second pad232is disposed on the second side of the target circuit board200, and the second pad232is electrically connected to the feeding circuit510. The pad hole220penetrates the target circuit board200and electrically connects the first pad231and the second pad232, for example, the pad hole220may be a conductive via filled with a conductive material. In some embodiments, the first pad231is directly connected to the target circuit210as shown inFIG.7, and the second pad232is directly connected to the feeding circuit510. In some embodiments, the feeding circuit510may be electrically connected to the second pad232by means of soldering. In this way, the radio frequency signal carried by the feeding cable100can be fed to the target circuit210through the feeding circuit510. In order to further enhance the structural strength and stability of the signal processing device, the target circuit board500may also be mechanically connected to the feeding circuit board200by other means. As shown inFIG.7andFIG.8, target circuit board200may include a slot260into which the feeding circuit board500is inserted to be mechanically connected to target circuit board200. In particular, considering that the area of the target circuit board200is generally larger than that of the feeding circuit board500and a more sufficient space may be provided, thus the slot260may be opened on the target circuit board200. Since the thickness of the target circuit board200is generally thin, in order to ensure that the feeding circuit board500can be stably connected to the target circuit board200, the slot260may be a through slot that penetrates the target circuit board200, and the feeding circuit board500may be inserted into or removed from the slot260in a direction perpendicular or substantially perpendicular to the surface of the target circuit board200. As shown inFIG.7andFIG.8, the entire surrounding wall of the slot260may surround the periphery of the feeding circuit board500to help maintain reliability of a plugin structure between the feeding circuit board500and the target circuit board200. It can be understood that, in other embodiments, the target circuit board200and the feeding circuit board500may be mechanically connected by other means to secure the structural stability of the signal processing device. In some embodiments, the position of the feeding circuit board500relative to the target circuit board200may be configured such that the maximum bending curvature of the feeding cable100is less than or equal to a preset curvature threshold. That is, by providing the feeding circuit board500, it is possible to achieve electrical connection between the target circuit board200and the feeding cable100while maintaining respective desired arrangement directions of the target circuit board200and the feeding cable100, thereby feeding the radio frequency signal. As shown inFIG.7andFIG.8, the feeding circuit board500may be configured to be perpendicular to the target circuit board200, and the extension direction of the feeding cable100may be configured to be parallel to the surface of the target circuit board200and perpendicular to the surface of the feeding circuit board500. In the exemplary embodiment, due to the connection between the feeding cable and the feeding circuit board, the introduction of extra impedance is effectively avoided, the problem that the radio frequency signal, especially the U-band signal, has high sensitivity to the capacitive impedance and inductive impedance is overcome, high power conversion efficiency is ensured, and a good feeding effect may be achieved. Furthermore, due to the introduction of the feeding circuit board, the arrangement direction of the feeding cable and the target circuit board is made more flexible, thereby helping to avoid excessive bending of the target circuit board and/or the feeding cable and possible damage caused by the excessive bending, to obtain higher structural reliability. Meanwhile, in the signal processing device of the present embodiment, the feeding apparatus and the target apparatus can be connected without a secondary soldering process, thereby contributing to reduction in the process cost and difficulty. The present disclosure further provides an antenna system, which may include the signal processing devices described in the above embodiments. In some embodiments, the operating band of the antenna system may be in the U-band of 3.6 to 5 GHz. In some embodiments, the antenna system may be a beamforming antenna system to enable transmission or reception of directional signals. In addition, the embodiments of the present disclosure may further include the following examples. According to some embodiments of the present disclosure, a signal processing device may include a target apparatus and a feeding apparatus. The feeding apparatus may include: a first conductor configured to transmit a radio frequency signal; an insulating medium covering the first conductor; and a second conductor covering a first portion of the insulating medium. A first portion of the insulating medium may be covered by the second conductor and a second portion of the insulating medium may extend beyond a first end of the second conductor. A first portion of the first conductor may be covered by both the second conductor and the insulating medium and a second portion of the first conductor may extend beyond the first end of the second conductor and may be covered by only the insulating medium. A third portion of the first conductor may extends beyond a first end of the insulating medium. The third portion of the first conductor may be configured to be connected to the target apparatus to feed the radio frequency signal to the target apparatus and is configured to form a capacitive impedance with the target apparatus, the second portion of the first conductor is configured to form an inductive impedance with the target apparatus, and an absolute value of a sum of the capacitive impedance and the inductive impedance is less than or equal to a preset impedance threshold. In some embodiments of the present disclosure, an absolute value of the capacitive impedance is equal to an absolute value of the inductive impedance. In some embodiments of the present disclosure, the third portion of the first conductor is configured to be connected to the target apparatus by a single soldering process. In some embodiments of the present disclosure, the second conductor is configured to be commonly grounded with the target apparatus. In some embodiments of the present disclosure, the feeding apparatus comprises a feeding cable. In some embodiments of the present disclosure, a maximum bending curvature of the feeding cable is less than or equal to a preset curvature threshold. In some embodiments of the present disclosure, the feeding cable is a coaxial cable. According to some embodiments of the present disclosure, a signal processing device may include a target circuit board and a feeding cable. The target circuit board may include a substrate, a conductive member connecting a first side and an opposite second side of the substrate, and a target circuit disposed on the first side, the conductive member being electrically connected to the target circuit. The feeding cable may include a first conductor electrically connected to the conductive member on the second side of the substrate; and the feeding cable may be configured such that a maximum bending curvature of the feeding cable is less than or equal to a preset curvature threshold in an extension direction thereof. In some embodiments of the present disclosure, the extension direction of the feeding cable is parallel to a surface of the substrate. In some embodiments of the present disclosure, the feeding cable further comprises: an insulating medium covers the first conductor; and a second conductor covers the insulating medium. A first portion of the insulating medium may be covered by the second conductor and a second portion of the insulating medium may extend beyond a first end of the second conductor, a first portion of the first conductor may be covered by both the second conductor and the insulating medium, a second portion of the first conductor may extend beyond the first end of the only a second conductor and is covered only by the insulating medium, and a third portion of the first conductor may extend beyond a first end of the insulating medium, In some embodiments of the present disclosure, an absolute value of the capacitive impedance is equal to an absolute value of the inductive impedance. In some embodiments of the present disclosure, the conductive member comprises: a first pad disposed on the first side of the substrate and electrically connected to the target circuit; a second pad disposed on the second side of the substrate and electrically connected to the first conductor; and a pad hole penetrating through the substrate and electrically connecting the first pad and the second pad. In some embodiments of the present disclosure, a first pad area of the first pad, a second pad area of the second pad, and an extension length of the second portion of the insulating medium are configured such that the absolute value of the sum of the capacitive impedance and the inductive impedance is less than or equal to the preset impedance threshold. In some embodiments of the present disclosure, the first pad area is greater than the second pad area. In some embodiments of the present disclosure, the first conductor is electrically connected to the second pad by means of soldering. In some embodiments of the present disclosure, the second conductor is commonly grounded with the target circuit board. In some embodiments of the present disclosure, the feeding cable is a coaxial cable. In some embodiments of the present disclosure, the first side of the target circuit board is further provided with an electrical isolation region to electrically isolate the first conductor from a ground terminal of the target circuit board. In some embodiments of the present disclosure, the target circuit comprises at least one of a calibration circuit and a power distribution circuit. According to some embodiments of the present disclosure, a signal processing device may include a target apparatus and a feeding apparatus. The feeding apparatus may include a first connection member configured to form a capacitive impedance with the target apparatus; and a second connection member electrically connected to the first connection member. The second connection member may be configured to form an inductive impedance with the target apparatus. At least one of the first connection member and the second connection member may be configured to be directly electrically connected to the target apparatus, so as to feed a radio frequency signal passed through the first connection member and the second connection member to the target apparatus, and an absolute value of a sum of the capacitive impedance and the inductive impedance may be less than or equal to a preset impedance threshold. In some embodiments of the present disclosure, an absolute value of the capacitive impedance is equal to an absolute value of the inductive impedance. According to some embodiments of the present disclosure, a signal processing device may include a feeding cable configured to transmit a radio frequency signal; a feeding circuit board comprising a feeding circuit electrically connected to the feeding cable and configured to transmit the radio frequency signal; and a target circuit board comprising a target circuit electrically connected to the feeding circuit, and the target circuit board being mechanically connected to the feeding circuit board. A position of the feeding circuit board relative to the target circuit board is configured such that a maximum bending curvature of the feeding cable is less than or equal to a preset curvature threshold. In some embodiments of the present disclosure, the target circuit board comprises a slot into which the feeding circuit board is inserted to be mechanically connected to the target circuit board. In some embodiments of the present disclosure, the feeding circuit board may include a connection hole that penetrates through a first side and a second side of the feeding circuit board, the feeding circuit being disposed on the first side of the feeding circuit board, and the feeding cable may include a first conductor configured to transmit the radio frequency signal, the first conductor penetrating from the second side of the feeding circuit board to the first side of the feeding circuit board through the connection hole so as to be electrically connected to the feeding circuit. In some embodiments of the present disclosure, the feeding circuit board may include a ground layer and an insulating layer disposed to be at least partially overlapped from the second side to the first side. A portion of the insulating layer surrounding the connection hole may be exposed outside the ground layer to electrically isolate the first conductor from the ground layer In some embodiments of the present disclosure, the first conductor may be connected to the feeding circuit by a single soldering process. In some embodiments of the present disclosure, the target circuit board may include: a first pad disposed on a first side of the target circuit board and electrically connected to the target circuit disposed on the first side of the target circuit board; a second pad disposed on a second side of the target circuit board and electrically connected to the feeding circuit; and a pad hole penetrating through the target circuit board and connecting the first pad and the second pad. In some embodiments of the present disclosure, the feeding circuit board may be configured to be perpendicular to the target circuit board, and an extension direction of the feeding cable is configured to be parallel to a surface of the target circuit board and perpendicular to a surface of the feeding circuit board. According to some embodiments of the present disclosure, an antenna system comprising the signal processing device as described herein is provided. In some embodiments of the present disclosure, the antenna system may be configured to operate in all or a portion of a 3.6 to 5 GHz frequency band. In some embodiments of the present disclosure, the antenna system may be a beamforming antenna system. The terms “front,” “back,” “top,” “bottom,” “over,” “under” and the like, as used herein, if any, are used for descriptive purposes and not necessarily for describing permanent relative positions. It should be understood that such terms are interchangeable under appropriate circumstances such that the embodiments of the disclosure described herein are, for example, capable of operation in other orientations than those illustrated or otherwise described herein. The term “exemplary”, as used herein, means “serving as an example, instance, or illustration”, rather than as a “model” that would be exactly duplicated. Any implementation described herein as exemplary is not necessarily to be construed as preferred or advantageous over other implementations. Furthermore, there is no intention to be bound by any expressed or implied theory presented in the preceding technical field, background, summary or detailed description. The term “substantially”, as used herein, is intended to encompass any slight variations due to design or manufacturing imperfections, device or component tolerances, environmental effects and/or other factors. The term “substantially” also allows for variation from a perfect or ideal case due to parasitic effects, noise, and other practical considerations that may be present in an actual implementation. In addition, the foregoing description may refer to elements or nodes or features being “connected” or “coupled” together. As used herein, unless expressly stated otherwise, “connected” means that one element/node/feature is electrically, mechanically, logically or otherwise directly joined to (or directly communicates with) another element/node/feature. Likewise, unless expressly stated otherwise, “coupled” means that one element/node/feature may be mechanically, electrically, logically or otherwise joined to another element/node/feature in either a direct or indirect manner to permit interaction even though the two features may not be directly connected. That is, “coupled” is intended to encompass both direct and indirect joining of elements or other features, including connection with one or more intervening elements. In addition, certain terminology, such as the terms “first”, “second” and the like, may also be used in the following description for the purpose of reference only, and thus are not intended to be limiting. For example, the terms “first”, “second” and other such numerical terms referring to structures or elements do not imply a sequence or order unless clearly indicated by the context. Further, it should be noted that, the terms “comprise”, “include”, “have” and any other variants, as used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. In this disclosure, the term “provide” is intended in a broad sense to encompass all ways of obtaining an object, thus the expression “providing an object” includes but is not limited to “purchasing”, “preparing/manufacturing”, “disposing/arranging”, “installing/assembling”, and/or “ordering” the object, or the like. Furthermore, those skilled in the art will recognize that boundaries between the above described operations are merely illustrative. The multiple operations may be combined into a single operation, a single operation may be distributed in additional operations and operations may be executed at least partially overlapping in time. Moreover, alternative embodiments may include multiple instances of a particular operation, and the order of operations may be altered in various other embodiments. However, other modifications, variations and alternatives are also possible. The description and drawings are, accordingly, to be regarded in an illustrative rather than in a restrictive sense. Although some specific embodiments of the present disclosure have been described in detail with examples, it should be understood by a person skilled in the art that the above examples are only intended to be illustrative but not to limit the scope of the present disclosure. The embodiments disclosed herein can be combined arbitrarily with each other, without departing from the scope and spirit of the present disclosure. It should be understood by a person skilled in the art that the above embodiments can be modified without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the attached claims. | 40,766 |
11942674 | DESCRIPTION OF EMBODIMENTS The following clearly describes the technical solutions in the embodiments of this disclosure with reference to the accompanying drawings in the embodiments of this disclosure. Apparently, the described embodiments are some rather than all of the embodiments of this disclosure. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of this disclosure shall fall within the protection scope of this disclosure. FIG.1is a structural diagram of an antenna structure according to some embodiments of this disclosure. As shown inFIG.1, the antenna structure includes a resonant arm1, a first feed line portion2, a first floor3, a substrate4, and a second floor5, a second feed line portion6, and at least two radiation pieces7, where the resonant arm1is electrically connected to the first floor3through the first feed line portion2; the substrate4is attached to the second floor5, the second floor5is disposed on a surface of the substrate4proximate to the first floor3, and two ends of a shield layer61of the second feed line portion6are connected to the first floor3and the second floor5respectively; and the at least two radiation pieces7are disposed on a surface of the substrate4away from the second floor5, the second feed line portion6wraps a feed line62inside, and the feed line62passes through the substrate4and the second floor5and electrically connects to the at least two radiation pieces7. In this embodiment, the first floor3may be a main board of a terminal device, a liquid crystal display module, or a metal frame structure that wraps a liquid crystal display module. The antenna structure includes a sub-6 GHz antenna and a millimeter-wave array antenna. The sub-6 GHz antenna works at the band from 0.6 GHz to 6 GHz. The feed line62passes through the substrate4and the second floor5and electrically connects to the at least two radiation pieces7, meaning that each of the at least two radiation pieces7is connected to the feed line62, and the feed line62is connected to a feed source (that is, a millimeter-wave signal source), so that millimeter-wave signals are radiated from the at least two radiation pieces7. In this way, the at least two radiation pieces7form a millimeter-wave array antenna in cooperation with the feed source. The foregoing second feed line portion6may be a coaxial cable or a flexible printed circuit board. In this embodiment, the resonant arm1is electrically connected to the first floor3through the first feed line portion2, which can be understood as the first feed line portion2feeding a sub-6 GHz signal on the floor to the resonant arm1. The second feed line portion6may include at least a shielding layer61, an insulating layer, an inner core layer, and the like. The second feed line portion6wraps a feed line62inside, which can be understood as the inner core layer in the second feed line portion6being a feed line62of a millimeter-wave signal, and the feed line62passes through the substrate4and the second floor5and electrically connects to the at least two radiation pieces7. In this embodiment, the two ends of the shield layer61of the second feed line portion6are connected to the first floor3and the second floor5respectively. To be specific, one end of the shield layer61of the second feed line portion6is connected to the first floor3(ground of the main board), and the other end of the shield layer61of the second feed line portion6is connected to the second floor5(a ground of the millimeter-wave array antenna). Therefore, the ground of the millimeter-wave array antenna becomes part of the sub-6 GHz antenna, acting as the ground of the millimeter-wave array antenna while also serving as part of a radiator of the sub-6 GHz antenna. The shield layer61of the second feed line portion6can also serve as a feed ground structure of the sub-6 GHz antenna. In this embodiment, the inner core layer in the second feed line portion6is the feed line62of the millimeter-wave signal, and the feed line62passes through the substrate4and the second floor5and electrically connects to the at least two radiation pieces7. In this way, the shielding layer61of the second feed line portion6can not only provide good shielding protection for the feed line62, but also allow the feed source to feed a current along the shortest path, making the millimeter-wave array antenna have better performance. In this embodiment, the substrate4, the second floor5, and the radiation pieces7may be a circuit board formed of a rigid FR4 material, or a circuit board with a flexible substrate, for example, a flexible printed circuit board (FPC), a liquid crystal polymer (LCP), or the like. In this embodiment, a millimeter-wave array antenna is added to the sub-6 GHz antenna, and a structure of the millimeter-wave array antenna is reused as a sub-6 GHz antenna or part of a sub-6 GHz antenna, so that the space and communication quality of the sub-6 GHz antenna are not affected. Moreover, the accommodating space for the millimeter-wave antenna is reduced, which helps reduce the volume of the terminal device. Optionally, a connecting portion8is disposed between the resonant arm1and the first feed line portion2. For better understanding the foregoing structure, reference may be made toFIG.2.FIG.2is a structural diagram of an antenna structure according to some embodiments of this disclosure. As shown inFIG.2, a connecting portion8is disposed between the resonant arm1and the second floor5, making a better connection between the resonant arm1and the second floor5. Optionally, the shield layer61of the second feed line portion6is connected to a first end of the second floor5, and the first end is away from the resonant arm1. In this embodiment, for better understanding the foregoing structure, reference may be made toFIG.1andFIG.2. As shown inFIG.1andFIG.2, the shield layer61of the second feed line portion6is connected to the first end of the second floor5, and the first end is away from the resonant arm1. Optionally, the shield layer61of the second feed line portion is connected to a second end of the second floor, and the second end is close to the resonant arm. In this embodiment, for better understanding the foregoing disposing manner, reference may be made toFIG.3andFIG.4, both of which are a structural diagram of an antenna structure according to some embodiments of this disclosure. As shown inFIG.3andFIG.4, the shield layer61of the second feed line portion6is connected to the second end of the second floor5, and the second end is close to the resonant arm1. In this way, the ground of the millimeter-wave array antenna, that is, the second floor5, becomes a parasitic part of the sub-6 GHz antenna, acting as not only the ground of the millimeter-wave array antenna but also an antenna structure of the sub-6 GHz antenna. In this embodiment, a millimeter-wave array antenna is added to the sub-6 GHz antenna, and a structure of the millimeter-wave array antenna is reused as a sub-6 GHz antenna or part of a sub-6 GHz antenna, so that the space and communication quality of the sub-6 GHz antenna are not affected. Moreover, the accommodating space for the millimeter-wave antenna is reduced, which helps reduce the volume of the terminal device. Optionally, the at least two radiation pieces7are arranged along a length direction of the substrate4. In this embodiment, the at least two radiation pieces7are arranged along the length direction of the substrate4. They may be arranged in one or more rows depending on the area of the substrate4, which is not limited herein. The at least two radiation pieces7being arranged along the length direction of the substrate4facilitates the ease of disposing multiple radiation pieces7on the substrate4to form the millimeter-wave array antenna. Optionally, a shape of a radiation piece7is square. In this embodiment, the shape of a radiation piece7is square, and certainly, they may have some other shapes than the square, which is not limited in this embodiment. Optionally, a distance between any two adjacent radiation pieces7in the at least two radiation pieces7is equal. In this embodiment, the distance between any two adjacent radiation pieces7in the at least two radiation pieces7is equal, which facilitates the ease of disposing multiple radiation pieces, making full use of the area of the substrate4, and making the millimeter-wave array antenna have better performance. Optionally, the feed line62is electrically connected to a feed source, and a frequency range of the feed source is the frequency range of millimeter waves. In this embodiment, the feed line62is electrically connected to a feed source, and the frequency range of the feed source is the frequency range of millimeter waves, so that the at least two radiation pieces7can radiate millimeter-wave signals. The antenna structure according to some embodiments of this disclosure includes a resonant arm1, a first feed line portion2, a first floor3, a substrate4, and a second floor5, a second feed line portion6, and at least two radiation pieces7, where the resonant arm1is electrically connected to the first floor3through the first feed line portion2; the substrate4is attached to the second floor5, the second floor5is disposed on a surface of the substrate4proximate to the first floor3, and two ends of a shield layer61of the second feed line portion6are connected to the first floor3and the second floor5, respectively; and the at least two radiation pieces7are disposed on a surface of the substrate4away from the second floor5, the second feed line portion6wraps a feed line62inside, and the feed line62passes through the substrate4and the second floor5and electrically connects to the at least two radiation pieces7. In this way, a millimeter-wave array antenna is added to the antenna structure, and a structure of the millimeter-wave array antenna is reused as a sub-6 GHz antenna or part of a sub-6 GHz antenna, so that the space and communication quality of the sub-6 GHz antenna are not affected. Moreover, the accommodating space for the millimeter-wave antenna is reduced, which helps reduce the volume of the terminal device. Some embodiments of this disclosure further provide a terminal device, including the foregoing antenna structure. In this embodiment, the terminal device may be a mobile phone, a tablet computer, a laptop computer, a personal digital assistant (PDA), a mobile internet device (MID), or a wearable device. It should be noted that the terms “comprise”, “include”, and any of their variants in this specification are intended to cover a non-exclusive inclusion, so that a process, a method, an article, or an apparatus that includes a list of elements not only includes those elements but also includes other elements that are not expressly listed, or further includes elements inherent to such process, method, article, or apparatus. In absence of more constraints, an element preceded by “includes a . . . ” does not preclude the existence of other identical elements in the process, method, article, or apparatus that includes the element. The foregoing describes the embodiments of this disclosure with reference to the accompanying drawings. However, this disclosure is not limited to the foregoing specific implementation manners. The foregoing specific implementation manners are merely illustrative rather than restrictive. As instructed by this disclosure, persons of ordinary skill in the art may develop many other manners without departing from principles of this disclosure and the protection scope of the claims, and all such manners fall within the protection scope of this disclosure. | 11,725 |
11942675 | DETAILED DESCRIPTION When mounting the wireless communication substrate on a wireless communication device, it is necessary to arrange the antenna in a position around which there is no metal component, like the image forming apparatus of the related art. However, in a case where the antenna is arranged in the position around which there is no metal component in a state where a position of a main substrate in the wireless communication device is fixed, it is difficult to easily shift a position of the antenna. One illustrative aspect of the present disclosure is to implement a wireless communication device capable of easily shifting a position of an antenna. First Illustrative Embodiment Hereinafter, a first illustrative embodiment of the present disclosure will be described in detail. (Overall Configuration of Image Forming Apparatus) FIG.1is a perspective view showing an image forming apparatus1according to the present illustrative embodiment.FIG.2is a right side view showing the image forming apparatus1according to the present illustrative embodiment. The image forming apparatus1is an example of the wireless communication device of the present disclosure. In descriptions below, the right lower side ofFIG.1is defined as the front side of the image forming apparatus1, the left upper side ofFIG.1is defined as the rear side of the image forming apparatus1, the right upper side ofFIG.1is defined as the left side of the image forming apparatus1, and the left lower side ofFIG.1is defined as the right side of the image forming apparatus1. In addition, the upper side and the lower side ofFIG.1are respectively defined as the upper side and the lower side of the image forming apparatus1. The image forming apparatus1has an apparatus body2. The apparatus body2is a housing configured to accommodate a feeder unit, an image forming unit, a discharge part, a re-conveying unit, a motor and the like, which are not shown. As shown inFIGS.1and2, the apparatus body2is configured by a front surface cover20, a rear surface cover21, a right side surface cover22, a left side surface cover23, an upper surface cover24and a top cover25, (Wireless Communication Unit80) As shown inFIGS.1and2, the image forming apparatus1includes a wireless communication unit80arranged on a side surface22aof the right side surface cover22. The wireless communication unit80is an example of the wireless communication means for enabling information to be input from an external terminal to the image forming apparatus1by wireless communication. The wireless communication unit80is a part configured to enable communication with an external terminal such as a smart phone by radio waves, and includes a wireless communication substrate81and a sub-substrate (not shown). The wireless communication substrate81shown in the present illustrative embodiment is a substrate configured to implement wireless communication by wireless LAN. The sub-substrate will be described later. FIG.3is a perspective view showing an attached situation of a holder82, a wireless communication substrate81and a sub-substrate86to a main substrate85. In other words.FIG.3is a perspective view showing a structure of the image forming apparatus1. In the below, each substrate and the like of the image forming apparatus1are described. As shown inFIG.3, the image apparatus1includes a main substrate85, the above-described wireless communication substrate81, a sub-substrate86, and a holder82. The main substrate85is a control substrate configured to control an operation of each unit of the image forming apparatus1. The main substrate85is arranged on a backside of the right side surface cover22. The wireless communication substrate81has an antenna configured to perform wireless communication. A plurality of elements is arranged on a substrate surface85cof the main substrate85. The sub-substrate86is a substrate interposed between the main substrate85and the wireless communication substrate81. The sub-substrate86is a substrate for converting a pin shape of a male terminal of a connector81aon the wireless communication substrate81into a convex first connector86afor fitting into a concave shape of a connector85aon the main substrate85. The wireless communication substrate81is connected to the sub-substrate86. The sub-substrate86is connected to the main substrate85. The wireless communication substrate81and the main substrate85are connected via the sub-substrate86. The holder82is configured to cover the sub-substrate86and the wireless communication substrate81, except the first connector86aon the sub-substrate86. In a state where the wireless communication substrate81and the sub-substrate86are held by the holder82, the wireless communication substrate81and the sub-substrate86are attached to the main substrate85. The first connector86aon the sub-substrate86and the connector85aon the main substrate85are connected. The image forming apparatus1has an opening/closing cover83configured to close an opening portion22bformed in the side surface22aof the right side surface22. The image forming apparatus1is configured so that a user can detach the holder82from the main substrate85in a state where the opening/closing cover83is opened. The shape of the first connector86aon the sub-substrate86is a convex shape, not a pin shape. The connector85aon the main substrate85has a concave shape. Therefore, the first connector86aon the sub-substrate86can be easily fitted into the connector85aon the main substrate85, so that the user can easily attach and detach the holder82to and from the main substrate85. Note that, in the present illustrative embodiment, a case where the wireless communication substrate81on the wireless communication unit80is a substrate for wireless LAN (Local Area Network) is exemplified. However, the substrate that is used as the wireless communication substrate81may also be a substrate configured to implement wireless communication by other communication standards, and for example, may be a substrate for NFC (Near Field Communication), a substrate for Bluetooth (registered trademark), or the like. (Wireless Communication Substrate81) As shown inFIG.3, the wireless communication substrate81has a connector81aand an antenna81b. The connector81ais a connector for connecting the wireless communication substrate81to a second connector86bprovided on the sub-substrate86, and is configured to be detachably mounted to the sub-substrate86. The antenna81bis configured as an antenna element for transmitting radio waves from the wireless communication substrate81and receiving radio waves. (Main Substrate85) As shown inFIG.3, the main substrate85has a connector85aand an opening portion85b. The connector85ais a connector for connecting the sub-substrate86to the main substrate85. The opening portion86his a hole portion that is used so as to position the holder82with respect to the main substrate85. A hole diameter of the opening portion85hhas such a size that is slightly larger than an outer shape of a protrusion82fof the holder82, and therefore, the protrusion82fcan be inserted. (Holder82) As shown inFIG.3, the holder82is configured by a first unit82aand a second unit82b. The first unit82aand the second unit82bare fitted to each other and integrated. More specifically, the main substrate85is mounted to the first unit82a. The second unit82bis fitted with the first unit82ain a state where the wireless communication substrate81and the sub-substrate86are sandwiched between the second unit82hand the first unit82a. The upper figure ofFIG.4is a side view showing a connection structure of the main substrate85, the sub-substrate86and the wireless communication substrate81. The lower figure ofFIG.4is a side view showing a connection structure of the main substrate85and the wireless communication substrate81of the related art. Note that, the connection structure shown in the lower figure ofFIG.4is a connection structure of the two substrates in a case where the main substrate85and the wireless communication substrate81of the present illustrative embodiment can be directly connected. FIG.5is a cross-sectional view showing the connection structure of the main substrate85, the sub-substrate86and the wireless communication substrate81. The left figure ofFIG.5shows a state where each substrate is not connected. The right figure ofFIG.5shows a state where each substrate is connected. As shown in the upper figure ofFIG.4andFIG.5, the connector85ais provided on the substrate surface85cof the main substrate85. The first connector86ais provided on a first substrate surface86iof the sub-substrate86, and the second connector86bis provided on a second substrate surface86jthat is a back surface of the first substrate surface86i. That is, as for the sub-substrate86, the substrate surface on which the first connector86ais provided and the substrate surface on which the second connector86his provided are different. The first connector86ais an example of the first connector of the present disclosure. The second connector86bis an example of the second connector of the present disclosure. The first connector86ais electrically connected to the connector85aon the main substrate85so that the first substrate surface86iof the sub-substrate86and the substrate surface85cof the main substrate85are parallel. The second connector86his electrically connected to the connector81aon the wireless communication substrate81so that the second substrate surface86jof the sub-substrate86and a substrate surface81dof the wireless communication substrate81are parallel. Note that, it is assumed that the term ‘parallel’ includes not only a case of being completely parallel but also a state close to parallel, for example, a state of deviating from a parallel plane by several degrees. As shown in the upper figure ofFIG.4, in the image forming apparatus1, a position of the first connector86aand a position of the second connector86bare shifted, seen from a direction orthogonal to the substrate surface85cof the main substrate85, i.e., from a right and left direction of the image forming apparatus1. Note that, it is assumed that the term ‘orthogonal’ includes not only a case of being completely orthogonal but also a stale close to orthogonal, for example, a state of deviating from an orthogonal angle by several degrees. More specifically, in the image forming apparatus1, seen from the right and left direction of the image forming apparatus1, the position of the first connector86ais a position deviating from the position of the second connector86bin a length direction of the main substrate85, i.e., a position deviating by a deviation width X along a front and rear direction of the image forming apparatus1. Here, as shown in the upper figure ofFIG.4, in a case where the connector85aon the main substrate85and the first connector86aon the sub-substrate86are connected and the connector81aon the wireless communication substrate81and the second connector86hon the sub-substrate86are connected, the antenna81bprovided on the wireless communication substrate81is arranged in a position denoted with P1, seen from the right and left direction of the image forming apparatus1. On the other hand, as shown in the lower figure ofFIG.4, in a case where the connector85aon the main substrate85and the connector81aon the wireless communication substrate81are directly connected, the antenna81bprovided on the wireless communication substrate81is arranged in a position denoted with P2, seen from the right and left direction of the image forming apparatus1. As shown in the upper figure and the lower figure ofFIG.4, the position of the first connector86ais shifted from the position of the second connector86bby the deviation width X, so that the position P1of the antenna81bcan be shifted from the position P2of the antenna81bby a deviation width Y. Note that, it is needless to say that the respective values of the deviation width X and the deviation width Y are the same. Specifically, the position P1of the antenna81bin a case where the connector81aon the wireless communication substrate81and the second connector86bare connected can be shifted in the front and rear direction of the image forming apparatus1from the position P2of the antenna81bin a case where the connector85aon the main substrate85and the connector81aon the wireless communication substrate81are directly connected without passing through the sub-substrate86. In the below, the sub-substrate86is described in detail with reference also toFIG.6. FIG.6shows the wireless communication substrate81and components around there. The upper figure ofFIG.6is a perspective view showing outer shapes of the first unit82a, the sub-substrate86, the wireless communication substrate81and the second unit82b. The intermediate figure ofFIG.6is a top view showing the outer shape of the wireless communication substrate81. The lower figure ofFIG.6is a perspective view showing the outer shape of the wireless communication substrate81. As shown inFIGS.5and6, the connector81a, the antenna81band a wireless communication module81care provided on the substrate surface81dof the wireless communication substrate81. Here, as shown inFIG.5, seen from the right and left direction of the image forming apparatus1, the sub-substrate86is divided into a first area86kin which a ground86cis arranged inside an insulating layer86d, and a second area86uconfigured only by the insulating layer86d, without the ground86c. The insulating layer86dis configured by an insulating member. The first area86kis located on a downward side of the image forming apparatus1. The second area86uis located on an upward side of the image forming apparatus1. Seen from the right and left direction of the image forming apparatus1, the first area86koverlaps an area81kin which the connector81aand the wireless communication module81care present on the wireless communication substrate81. In addition, the second area86uoverlaps an area81uin which the antenna81his present on the wireless communication substrate81. According to the above-described configuration, seen from the right and left direction of the image forming apparatus1, the position of the antenna81bon the wireless communication substrate81is included in the second area86uin Which the ground86cis not present on the sub-substrate86. For this reason, the radio waves transmitted and received from the antenna81bon the wireless communication substrate81are not inhibited by the ground86cof the sub-substrate86. Therefore, the wireless communication unit80can perform wireless communication by using the antenna81b, without problem. Note that, a part equivalent to the second area86uof the sub-substrate86is held on the first unit82aof the holder82shown inFIG.3. However, it is not necessary to provide the part equivalent to the second area86uof sub-substrate86, in that it does not interfere with the transmission and reception of the radio waves from the antenna81b. In this case, the holder82can support the sub-substrate86by holding a part equivalent to the first area86kof the sub-substrate86by the first unit82aof the holder82. In addition, according to the above-described configuration, seen from the right and left direction of the image forming apparatus1, the position of the antenna81bon the wireless communication substrate81is included in an area85fin which the main substrate85is not present. For this reason, the radio waves transmitted and received from the antenna81bon the wireless communication substrate81are not inhibited by a ground85dof the main substrate85. Therefore, the wireless communication unit80can perform wireless communication by using the antenna Sib, without problem. As shown inFIG.5, the first connector86aon the sub-substrate86is configured by a convex male terminal. On the other hand, the connector85aon the main substrate85is configured by a concave female terminal. The convex shape of the first connector86aon the sub-substrate86and the concave shape of the connector85aon the main substrate85are fitted, so that the sub-substrate86and the main substrate85are electrically connected. In addition, there may also be a support post configured to support the sub-substrate86and the main substrate85therebetween. In addition, the second connector86hon the sub-substrate86is configured by a female terminal having a hole. On the other hand, the connector81aon the main substrate81is configured by a pin-shaped male terminal. The pin-shaped male terminal of the connector81aon the wireless communication substrate81is inserted into the hole of the second connector86hon the sub-substrate86, so that the sub-substrate86and the wireless communication substrate81are electrically connected. Note that, it is needless to say that the number of the male terminals and the number of the holes of the female terminal are the same. In addition, there may also be a support post configured to support the sub-substrate86and the wireless communication substrate81therebetween. FIG.7is a plan view showing the first substrate surface86iand the second substrate surface86jof the sub-substrate86. The first substrate surface86iis a surface facing the substrate surface85cof the main substrate85shown inFIG.5. The second substrate surface86jis a surface facing the substrate surface81dof the wireless communication substrate81shown inFIG.5. The left figure ofFIG.7shows the first substrate surface86i. The right figure ofFIG.7shows the second substrate surface86j. The sub-substrate86includes a printed substrate86pat a part. In a case where the sub-substrate86is seen from the first substrate surface86ishown in the left figure ofFIG.7, the printed substrate86is divided into a hatching part86mhatched and a non-hatching part86qnot hatched. The hatching part86mhas a multi-layered structure where the ground86cmade of metal is arranged in the insulating layer86d. The hatching part86mcorresponds to the first area86kshown inFIG.5. On the other hand, the non-hatching part86qhas a single-layer structure configured only by the insulating layer86d. The non-hatching part86qcorresponds to the second area86ushown in FIGS. A wiring pattern86eis arranged on a first surface86k1of the hatching part86m. The first connector86ais provided on the first surface86k1and is electrically connected to the wiring pattern86e. On the other hand, in a case where the sub-substrate86is seen from the second substrate surface86jshown in the right figure ofFIG.7, the printed substrate86pis divided into a hatching part86nhatched and a non-hatching part86rnot hatched. The hatching part86nis a part equivalent to the hatching part86mshown in the left figure ofFIG.7, in a case where the sub-substrate86is seen from the second substrate surface86j. Similarly, the non-hatching part86ris a part equivalent to the non-hatching part86qshown in the left figure ofFIG.7, in a case where the sub-substrate86is seen from the second substrate surface86j. A wiring pattern86fis arranged on a second surface86k2of the hatching part86n. The second connector86bis provided on the second surface86k2and is electrically connected to the wiring pattern86f. The printed substrate86pis provided with a through-hole86gpenetrating through the printed substrate86p. The wiring pattern86eshown in the left figure ofFIG.7and the wiring pattern86fshown in the right figure ofFIG.6are electrically connected via the through-hole86g. The wiring pattern86eand the wiring pattern86fare electrically connected, so that the first connector86aand the second connector86bare electrically connected. Note that, in a case where the sub-substrate86and the wireless communication substrate81are supported therebetween by using a support post, the support post is inserted into a through-hole86hprovided to the sub-substrate86. Similarly, in a case where the sub-substrate86and the main substrate85are supported therebetween by using a support post, the support post is inserted into the through-hole86hprovided to the sub-substrate86. Second Illustrative Embodiment In the below, a second illustrative embodiment of the present disclosure is described. Note that, for convenience of description, the members having the same functions as the members described in the first illustrative embodiment are denoted with the same reference signs, and the descriptions thereof are not repeated. FIG.8shows a connection structure of the main substrate85, a sub-substrate86land the wireless communication substrate81in an image forming apparatus1aaccording to a second illustrative embodiment of the present disclosure. The left figure ofFIG.8is a cross-sectional view showing the connection structure. The right figure ofFIG.8is a front view showing the connection structure. As shown inFIG.8, the first connector86athat is electrically connected to the connector85aon the main substrate85and the second connector86bthat is electrically connected to the connector81aon the wireless communication substrate81are provided on the sub-substrate86lof the image forming apparatus1. In this case, the substrate surface85cof the main substrate85and the substrate surface81dof the wireless communication substrate81are all connected to face the first substrate surface86iof the first sub-substrate86l. In addition, the second connector86bon the sub-substrate86land the connector81aon the wireless communication substrate81are connected so that the wireless communication substrate81does not overlap the main substrate85, seen from the direction orthogonal to the substrate surface85cof the main substrate85, i.e., from the right and left direction of the image forming apparatus1a. The antenna81has an antenna pattern81b1wired at an end portion in a length direction of the wireless communication substrate81, along a width direction. The second connector86bon the sub-substrate86land the connector81aon the wireless communication substrate81are connected so that the length direction of the wireless communication substrate81is parallel to the length direction of the main substrate85. Note that, as for the sub-substrate86lof the image forming apparatus1a, the substrate surface on which the first connector86ais provided and the substrate surface on which the second connector86bis provided may be different. For example, the first connector86amay be provided on the first substrate surface86i, and the second connector86bmay be provided on the second substrate surface86j. In addition, the reverse is also possible. In other words, in the left figure ofFIG.8, the second connector86bmay be provided on the second substrate surface86j. In this case, the substrate surface to which the main substrate85is connected and the substrate surface to which the wireless communication substrate81is connected are different. Note that, there may also be a support post configured to support the wireless communication substrate81and the sub-substrate86ltherebetween. In addition, as for arrangement of each substrate, the shape of the holder82of the present illustrative embodiment is required to be different from the first illustrative embodiment. According to the above-described configuration, the wireless communication substrate81can be rotated by 90 degrees with respect to the main substrate85, as compared to the first illustrative embodiment Third Illustrative Embodiment In the below, a third illustrative embodiment of the present disclosure is described. Note that, for convenience of description, the members having the same functions as the members described in the first and second illustrative embodiments are denoted with the same reference signs, and the descriptions thereof are not repeated. FIG.9shows a connection structure of the main substrate85, a sub-substrate862and the wireless communication substrate81in an image forming apparatus1baccording to the present illustrative embodiment. As shown inFIG.9, the first connector86athat is electrically connected to the connector85aon the main substrate85and the second connector86bthat is electrically connected to the connector81aon the wireless communication substrate81are provided on the first substrate surface86iof the sub-substrate862of the image forming apparatus1b. In addition, the second connector86bon the sub-substrate862and the connector81aon the wireless communication substrate81are connected so that the wireless communication substrate81does not overlap the main substrate85, seen from the direction orthogonal to the first substrate surface86iof the main substrate85, i.e., from the right and left direction of the image forming apparatus1b. The antenna81has an antenna pattern81b1wired at an end portion in the length direction of the wireless communication substrate81, along the width direction. In addition, the second connector86bon the sub-substrate862and the connector81aon the wireless communication substrate81are connected so that the width direction of the wireless communication substrate81is parallel to the length direction of the main substrate85. According to the above-described configuration, the antenna81bon the wireless communication substrate81can be configured above the main substrate85. Fourth Illustrative Embodiment In the below, a fourth illustrative embodiment of the present disclosure is described. Note that, for convenience of description, the members having the same functions as the members described in the first, second and third illustrative embodiments are denoted with the same reference signs, and the descriptions thereof are not repeated, FIG.10shows a connection structure of the main substrate85, a sub-substrate863and the wireless communication substrate81in an image forming apparatus1caccording to the present illustrative embodiment. As shown inFIG.10, the first connector86athat is electrically connected to the connector85aon the main substrate85is provided on the first substrate surface86iof the sub-substrate863of the image forming apparatus1c. On the other hand, the second connector86hthat is electrically connected to the connector81aon the wireless communication substrate81is provided on the second substrate surface86jof the sub-substrate863. The sub-substrate863is divided into the first area86kin which the ground86cis arranged inside the insulating layer86d, and the second area86uconfigured only by the insulating layer86dwithout the ground86c, seen from the right and left direction of the image forming apparatus1c. The first area86kis located on a downward side of the image forming apparatus1c. The second area86uis located on an upward side of the image forming apparatus1c. Seen from the right and left direction the image forming apparatus1c, the respective positions of the connector81aand the wireless communication module81con the wireless communication substrate81are included in the first area86k. In addition, the position of the antenna81bon the wireless communication substrate81is included in the second area86u. According to the above-described configuration, seen from the right and left direction of the image forming apparatus1c, the position of the antenna.81bon the wireless communication substrate81does not overlap with the position of the ground86cof the sub-substrate863, so that the radio waves transmitted and received from the antenna81bare not inhibited by the ground86c. Therefore, the wireless communication unit80can perform wireless communication by using the antenna81b, without problem. In addition, according to the above-described configuration, seen from the right and left direction of the image forming apparatus1c, the position of the antenna81bon the wireless communication substrate81is included in the area85fin which the main substrate85is not present. For this reason, the radio waves transmitted and received from the antenna81bon the wireless communication substrate81are not inhibited by a ground85dof the main substrate85. Therefore, the wireless communication unit80can perform wireless communication by using the antenna81b, without problem. Note that, the sub-substrate863is not necessarily provided with a part equivalent to the second area86u. The sub-substrate863may also be a substrate consisting of only a part equivalent to the first area86k. As discussed above, the present disclosure may provide at least the following illustrative, non-limiting aspects. A second illustrative aspect provides the wireless communication device according to the first illustrative aspect, in which the first connector may be provided on a first substrate surface of the sub-substrate, and in which the second connector may be provided on a second substrate surface of the sub-substrate. In the above-described configuration, the first connector is provided on the first substrate surface of the sub-substrate, the second connector is provided on the second substrate surface of the sub-substrate, and the position of the first connector and the position of the second connector are shifted, when seen from the direction orthogonal to the substrate surface of the main substrate. Therefore, according to the above-described configuration, in the above-described configuration, the position of the antenna on the wireless communication substrate is shifted from the position of the antenna in the case where the two connectors are directly connected each other without passing through the sub-substrate. A third illustrative aspect provides the wireless communication device according to the first illustrative aspect, in which the first connector and the second connector may be provided on a first substrate surface of the sub-substrate, and the second connector and the connector on the wireless communication substrate may be connected such that the wireless communication substrate does not overlap the main substrate, seen from the direction orthogonal to the substrate surface of the main substrate. In the above-described configuration, the second connector and the connector on the wireless communication substrate are connected so that the wireless communication substrate does not overlap the main substrate, when seen from the direction orthogonal to the substrate surface of the main substrate. Therefore, according to the above-described configuration, it is possible to prevent the radio waves from transmission and reception of the antenna on the wireless communication substrate from being blocked by the main substrate. A fourth illustrative aspect provides the wireless communication device according to the third illustrative aspect. in which the antenna may have an antenna pattern wired at an end portion in a length direction of the wireless communication substrate, along a width direction of the wireless communication substrate, and in which the second connector and the connector on the wireless communication substrate may be connected such that the length direction of the wireless communication substrate is parallel to a length direction of the main substrate. In the above-described configuration, it is configured so that when seen from the direction orthogonal to the substrate surface of the main substrate, the wireless communication substrate does not overlap the main substrate and the length direction of the wireless communication substrate is parallel to the length direction of the main substrate. Therefore, according to the above-described configuration, the position of the antenna on the wireless communication substrate can be displaced by 90 degrees, as compared to the case where the connector on the main substrate and the connector on the wireless communication substrate are directly connected. A fifth illustrative aspect provides the wireless communication device according to the third illustrative aspect, in which the antenna may have an antenna pattern wired at an end portion in a length direction of the wireless communication substrate, along a width direction of the wireless communication substrate, and in which the second connector and the connector on the wireless communication substrate may be connected such that the width direction of the wireless communication substrate is parallel to a length direction of the main substrate. In the above-described configuration, it is configured so that when seen from the direction orthogonal to the substrate surface of the main substrate, the wireless communication substrate does not overlap the main substrate and the length direction of the wireless communication substrate is parallel to the length direction of the main substrate. Therefore, according to the above-described configuration, as for the position of the antenna on the wireless communication substrate, the main substrate can be displaced, as compared to the case where the connector on the main substrate and the connector on the wireless communication substrate are directly connected. A sixth illustrative aspect provides the wireless communication device according to the second illustrative aspect, in which a position of the second connector may be a position deviating from a position of the first connector along a length direction of the main substrate, seen from the direction orthogonal to the substrate surface of the main substrate. According to the above-described configuration, the position of the antenna on the wireless communication substrate can be shifted along the length direction of the main substrate, as compared to the case where the connector on the main substrate and the connector on the wireless communication substrate are directly connected. A seventh illustrative aspect provides the wireless communication device according to the second illustrative aspect, further including a holder covering the sub-substrate and the wireless communication substrate except the first connector and holding an area of the sub-substrate, in which the area of the sub-substrate may overlap at least a place where the antenna is present, seen from the direction orthogonal to the substrate surface of the main substrate, and may be made of an insulating member. A part of the substrate in the overlapping area of the sub-substrate, which is configured by the insulating member, is held by the holder, so that the wireless communication substrate and the sub-substrate can be appropriately supported by the holder. A eighth illustrative aspect provides the wireless communication device according to the seventh illustrative aspect, in which the first connector may be provided on a first surface, the first surface being a surface other than the area of the first substrate surface of the sub-substrate, in which the second connector may be provided on a second surface, the second surface being a surface other than the area of the second substrate surface of the sub-substrate, in which a wiring pattern may be able to be arranged on the first surface and the second surface, the wiring pattern including: a first wiring pattern connected to the first connector and arranged on the first surface; and a second wiring pattern connected to the second connector and arranged on the second surface, and in which the first wiring pattern and the second wiring pattern are connected via a through-hole of the sub-substrate. According to the above-described configuration, since the wiring patterns wired on the first surface and the second surface of the sub-substrate are connected via the through-hole, the main substrate and the wireless communication substrate can be connected through the first connector and the second connector. In addition, since the wiring patterns are arranged on the surfaces of the sub-substrate other than the area that overlaps a place where the antenna is present, an influence on wireless communication using the antenna can be suppressed. A ninth illustrative aspect provides the wireless communication device according to the first illustrative aspect, in which a shape of the first connector on the sub-substrate may be a convex shape, in which a shape of the connector on the main substrate may be a concave shape, and in which the sub-substrate and the main substrate may be connected by fitting the first connector and the connector on the main substrate. According to the above-described configuration, since the first connector on the sub-substrate and the connector on the main substrate are connectors having fitting-type shapes, it is possible to simply detach the main substrate and the wireless communication substrate. According thereto, it is possible to implement the wireless communication device which can easily shift the position of the antenna. The present disclosure is not limited to each of the above-mentioned illustrative embodiments and can be diversely changed within the scope defined in the claims, and illustrative embodiments implemented by appropriately combining the technical means disclosed in each of the different illustrative embodiments are also included in the technical scope of the present disclosure. | 37,012 |
11942676 | DETAILED DESCRIPTION Herein disclosed are a package, a method of packaging, and a system including the package for an integrated, multi-die radio transceiver. In the following detailed description, reference is made to the accompanying drawings which form a part hereof wherein like numerals designate like parts throughout, and in which is shown, by way of illustration, specific embodiments in which the invention may be practiced. Other embodiments may be utilized, and structural or logical changes may be made, without departing from the intended scope of the embodiments presented. It should also be noted that directions and references (e.g., up, down, top, bottom, primary side, backside, etc.) may be used to facilitate the discussion of the drawings and are not intended to restrict the application of the embodiments of this invention. Therefore, the following detailed description is not to be taken in a limiting sense and the scope of the embodiments of the present invention is defined by the appended claims and their equivalents. DESCRIPTION OF A RADIO TRANSCEIVER Please refer toFIG.1for a functional block diagram of a typical prior art radio transceiver application. A typical radio transceiver usually includes several separate functional blocks, including a Front End Module (FEM)106, a Radio Frequency Integrated Circuit (RFIC)108, and a Base Band/Communication Processor112, that electrically couple to application specific circuitry118. The typical radio transceiver spreads the several functional blocks among different die and integrated circuit packages. The FEM106generally processes a radio frequency (RF) signal collected from an antenna104. The FEM106may include a low noise amplifier for small signal receiver gain larger than about 90 dB or a power amplifier for output power in excess of about 17 dBm or about 50 mW, and passive frequency selection circuits. The FEM106processes the RF signal before communicating a signal to the RFIC108for mixed signal processing. The RFIC108usually converts the RF signal from the FEM106to a digital signal and passes the digital signal to a Base Band/Communication Processor112. The Base Band/Communication Processor112generally communicates with application specific circuitry118that often includes an application processor122coupled to user interface peripherals126and a system memory120. In some instances, the Base Band/Communication Processor112is coupled to a memory110which may be on a separate die, or integrated into the die of the Base Band/Communication Processor112. Power consumption for the application processor may be managed by power management circuitry124. The RFIC108may also receive a signal input gathered from a Global Positioning System Receiver (GPS Receiver)114. The FEM106and RFIC108are often on different die because of functional differences between the circuits that may not be easily achieved through the same die fabrication process. The Base Band/Communication Processor112may typically perform computationally intensive operations and therefore be fabricated using yet another process that differs from either of those used to fabricate the FEM106or the RFIC108. Further, the different die will often be packaged separately, although some prior art radio transceivers have integrated the FEM106and RFIC108within the same package, as indicated by the Prior Art Wireless Integration block102. Usually, the GPS Receiver114will also be packaged separately from other die. Further, the reference oscillator (crystal)116will generally be in a different package due to its sensitivity to temperature variance. Current packages that integrate the FEM106and RFIC108use arrays of solder bumps on the individual die to couple the die to a package substrate. Further, the die are each disposed on the substrate in a substantially two-dimensional layout. A radio frequency transceiver integrated in a single package may address many shortcomings of present radio frequency transceivers. Because the different die will often be packaged separately, current system costs will often be higher than if the various die could be included in a single package. Further, because present systems continue to evolve to smaller form factors, a radio frequency transceiver integrated into a single package may help a system designer to achieve a desired overall system size that by itself is smaller than a radio frequency transceiver spread among several packages. Integration of a Radio Transceiver in a Single Package FIG.2illustrates a functional block diagram of a system200using a radio frequency transceiver202wherein the radio frequency transceiver202is integrated into a single integrated circuit package, shown as300inFIG.3and further described below. The radio frequency transceiver202includes an antenna204, an FEM (analog)206, an RFIC (mixed analog/digital)208, and a Base Band/Communication Processor (digital)212. The reference oscillator (crystal)216resides outside the integrated circuit package300because of its sensitivity to temperature and mechanical stress, both of which are often unavoidable during package assembly. Some embodiments of the radio frequency transceiver202also include a memory210coupled to the Base Band/Communication Processor212. Other embodiments of the radio frequency transceiver202may be capable of receiving input from other types of receivers, for example, a global positioning system receiver214. The signal collected by the alternative receiver214is transmitted to the RFIC208. The digital output of the Base Band/Communication Processor212couples to an application specific integrated circuit218that includes an application processor222. Further, the application processor222couples to a memory220, power management circuitry224, and any peripherals226. The peripherals226often include one or more of the following: an input/output interface, a user interface, an audio, a video, and an audio/video interface. The application processor222often defines the standard used by the radio frequency transceiver202. Exemplary standards may include, by way of example and not limitation, a definition for a personal area network (PAN), such as Blue Tooth (BT), that wirelessly maintains device connectivity over a range of several feet, a local area network (LAN) that ranges from several feet to several tens of feet such as IEEE 802.11a/b/g (Wi-Fi), a metropolitan area network (MAN) such as (Wi-Max), and a wide area network (WAN), for example a cellular network. An exemplary embodiment of a package300that integrates a radio frequency transceiver202is illustrated byFIG.3and utilizes die stacking, or packaging in a third dimension, to alleviate many of the aforementioned problems, such as limited diminishment in size and increased packaging costs, associated with prior art two-dimensional layouts. The integrated radio frequency transceiver202in a single package300includes an antenna204formed by a copper stud322and a stack of a first die306and a second die310coupled to the package substrate328, to which is also coupled a third die302. In the embodiment ofFIG.3, the third die302forms a front end module206and is coupled to the substrate328though solder bumps304. The third die may be formed substantially of gallium arsenide, silicon on sapphire, or silicon germanium. The second die310forms a Base Band/Communication Processor210and mechanically couples to the first die306that includes a radio frequency integrated circuit (RFIC)208. The first die306is electrically coupled to the substrate328, often through solder bumps308. For first die306sizes less than approximately 3.5 mm×3.5 mm underfill may often not be used. Larger first die306may utilize underfill. The second die310is electrically coupled to the substrate328through wire bonds312. One method of mechanically coupling the first die306and second die310includes using an interface bonding agent314, for example an epoxy. Many interface bonding agents314other than epoxy are known, e.g., RTV rubbers. The package300includes an antenna204formed of a copper stud322that couples to a package cover334that may act also as a heat spreader. Also included in the embodiment illustrated byFIG.3is a fourth die316on which is formed memory210. The fourth die316couples to the circuitry of the second die310through a direct chip attach formed of solder bumps318and underfill320. Some embodiments of underfill320may include an adhesive tape or epoxy. Passive components330and332, such as inductor based components used for tuning, may be located at convenient locations on the substrate328if they are not included in the die306including the RFIC208. The passive components330and332may include high speed switching components formed on depleted CMOS devices, thereby enabling reconfigurable adaptive passive circuits. The package substrate328may have solder mask defined pads for surface mount components, and immersion gold plating may be used on the pads. The embodiment of the package300shown includes an array of solder balls326that may be used to electrically and mechanically couple the package300to a printed circuit board (not shown). Some of the solder balls326may be arranged in groups324that will collapse and coalesce during reflow, and form a large area connection convenient for grounding the package300.FIG.4illustrates a substrate402of a package400with an array of signal solder balls404and an array of ground solder balls408. The signal solder balls are distributed using a ball to ball pitch406that maintains the integrity of each solder ball404. The solder balls408used for grounding are distributed with a narrower pitch410such that on reflow the balls coalesce to form a larger area connection. The embodiment shown byFIG.4includes solder balls412that may be used for power, ground, additional signals, or merely additional structural support without any electrical connectivity. A printed circuit board414may include arrays of exposed pads416and418similar to the arrays of solder balls. For example, the pitch420between exposed pads for the signals may be substantially similar to the pitch406for the signal solder balls404. Ground pads418may be a single large area of exposed metal, or an array of large exposed areas, similar to those shown. The substrate414may have outer metal layer thicknesses of approximately 35 μm and inner metal layer thickness ranging from approximately 60 μm to 150 μm. A Single Package Radio Transceiver Assembly Method FIG.5illustrates an exemplary method of integrating a multiple die in a single integrated circuit package. The method illustrated may be used to package a combination of die wherein some of the die forming the radio transceiver are stacked and form a three dimensional integration. For example, the method ofFIG.5includes soldering a first die to a package substrate having a layer of electrical traces and another layer of dielectric material502. A method similar to one illustrated byFIG.5also includes mechanically coupling a second die to the first504. To achieve a functional die stack, wire bonds electrically couple the second die to the package substrate506. As mentioned, the method illustrated byFIG.5results in a substantially integrated radio frequency transceiver. The method illustrated byFIG.5may be used to form a radio frequency transceiver capable of communicating according to any of a multitude of wireless standards that cover operation of networks ranging from personal area networks or local area networks to metropolitan area networks or wide area networks. Consequently,FIG.5illustrates forming an antenna electrically coupled to the substrate508and soldering a third die to the substrate, wherein the antenna, first, second, and third die substantially form a radio transceiver510. The third die will often be substantially formed of gallium arsenide, silicon on sapphire, or silicon germanium, although other materials may often work as well. In a radio frequency transceiver of the type whose assembly process is illustrated byFIG.5, the second die substantially forms the often heavily computational, digital circuits of a base band communication processor. Some embodiments of a radio frequency transceiver couple memory to the digital circuits of the base band communication processor. Some of those embodiments may use a separate die for the memory and couple the memory die to the second die that substantially includes the digital circuits of the base band communications processor. A method of assembly, as illustrated byFIG.5, may couple the memory die to the second die prior to mechanically coupling the second die to the first die512. Further, radio frequency transceivers may often benefit from grounding through large area electrical ground connections. As described above, such connections may form when two or more solder balls collapse and coalesce during reflow and form an electrical connection with larger cross-sectional area than a single constituent solder ball514. A System Embodiment that Includes a Single Package Radio Transceiver FIG.6illustrates a schematic representation of one of many possible systems60that incorporate an embodiment of a single package radio transceiver600. In an embodiment, the package containing a radio frequency transceiver600may be an embodiment similar to that described in relation toFIG.3. In another embodiment, the package600may also be coupled to a sub assembly that includes a microprocessor. In a further alternate embodiment, the integrated circuit package may be coupled to a subassembly that includes an application specific integrated circuit (ASIC). Integrated circuits found in chipsets (e.g., graphics, sound, and control chipsets) or memory may also be packaged in accordance with embodiments described in relation to a microprocessor and ASIC, above. For an embodiment similar to that depicted inFIG.6, the system60may also include a main memory602, a graphics processor604, a mass storage device606, and an input/output module608coupled to each other by way of a bus610, as shown. Examples of the memory602include but are not limited to static random access memory (SRAM) and dynamic random access memory (DRAM). Examples of the mass storage device606include but are not limited to a hard disk drive, a flash drive, a compact disk drive (CD), a digital versatile disk drive (DVD), and so forth. Examples of the input/output modules608include but are not limited to a keyboard, cursor control devices, a display, a network interface, and so forth. Examples of the bus610include but are not limited to a peripheral control interface (PCI) bus, PCI Express bus, Industry Standard Architecture (ISA) bus, and so forth. In various embodiments, the system60may be a wireless mobile phone, a personal digital assistant, a pocket PC, a tablet PC, a notebook PC, a desktop computer, a set-top box, an audio/video controller, a DVD player, a network router, a network switching device, a hand-held device, or a server. Although specific embodiments have been illustrated and described herein for purposes of description of an embodiment, it will be appreciated by those of ordinary skill in the art that a wide variety of alternate and/or equivalent implementations calculated to achieve similar purposes may be substituted for the specific embodiments shown and described without departing from the scope of the present disclosure. For example, a processor and chipset may be integrated within a single package according to the package embodiments illustrated by the figures and described above, and claimed below. Alternatively, chipsets and memory may similarly be integrated, as may be graphics components and memory components. Those with skill in the art will readily appreciate that the description above and claims below may be implemented using a very wide variety of embodiments. This detailed description is intended to cover any adaptations or variations of the embodiments discussed herein. Therefore, it is manifestly intended that this invention be limited only by the claims and the equivalents thereof. | 16,088 |
11942677 | Throughout the drawings, it should be noted that like reference numbers are used to depict the same or similar elements, features, and structures. MODE FOR THE INVENTION The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of various embodiments of the disclosure as defined by the claims and their equivalents. It includes various specific details to assist in that understanding but these are to be regarded as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the various embodiments described herein can be made without departing from the scope and spirit of the disclosure. In addition, descriptions of well-known functions and constructions may be omitted for clarity and conciseness. The terms and words used in the following description and claims are not limited to the bibliographical meanings, but, are merely used by the inventor to enable a clear and consistent understanding of the disclosure. Accordingly, it should be apparent to those skilled in the art that the following description of various embodiments of the disclosure is provided for illustration purpose only and not for the purpose of limiting the disclosure as defined by the appended claims and their equivalents. It is to be understood that the singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to “a component surface” includes reference to one or more of such surfaces. FIG.1is a perspective view showing a front surface of an electronic device according to an embodiment of the disclosure. FIG.2is a perspective view showing a rear surface of the electronic device shown inFIG.1according to an embodiment of the disclosure. Referring toFIGS.1and2, an electronic device100may include a housing110that includes a first surface (or front surface)110A, a second surface (or rear surface)110B, and a lateral surface110C that surrounds a space between the first surface110A and the second surface110B. The housing110may refer to a structure that forms a part of the first surface110A, the second surface110B, and the lateral surface110C. The first surface110A may be formed of a front plate102(e.g., a glass plate or polymer plate coated with a variety of coating layers) at least a part of which is substantially transparent. The second surface110B may be formed of a rear plate111which is substantially opaque. The rear plate111may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or any combination thereof. The lateral surface110C may be formed of a lateral bezel structure (or “lateral member”)118which is combined with the front plate102and the rear plate111and includes a metal and/or polymer. The rear plate111and the lateral bezel structure118may be integrally formed and may be of the same material (e.g., a metallic material such as aluminum). The front plate102may include two first regions110D disposed at long edges thereof, respectively, and bent and extended seamlessly from the first surface110A toward the rear plate111. Similarly, the rear plate111may include two second regions110E disposed at long edges thereof, respectively, and bent and extended seamlessly from the second surface110B toward the front plate102. The front plate102(or the rear plate111) may include only one of the first regions110D (or of the second regions110E). The first regions110D or the second regions110E may be omitted in part. When viewed from a lateral side of the electronic device100, the lateral bezel structure118may have a first thickness (or width) on a lateral side where the first region110D or the second region110E is not included, and may have a second thickness, being less than the first thickness, on another lateral side where the first region110D or the second region110E is included. The electronic device100may include at least one of a display101, audio modules103,107and114, sensor modules104and119, camera modules105,112and113, a key input device117, an indicator, and connector hole108. The electronic device100may omit at least one (e.g., the key input device117or the indicator) of the above components, or may further include other components. The display101may be exposed through a substantial portion of the front plate102, for example. At least a part of the display101may be exposed through the front plate102that forms the first surface110A and the first region110D of the lateral surface110C. The display101may be combined with, or adjacent to, a touch sensing circuit, a pressure sensor capable of measuring the touch strength (pressure), and/or a digitizer for detecting a stylus pen. At least a part of the sensor modules104and119and/or at least a part of the key input device117may be disposed in the first region110D and/or the second region110E. The audio modules103,107and114may correspond to a microphone hole (e.g., audio module103) and speaker holes (e.g., audio modules107and114), respectively. The microphone hole (e.g., audio module103) may contain a microphone disposed therein for acquiring external sounds and, in a case, contain a plurality of microphones to sense a sound direction. The speaker holes (e.g., audio modules107and114) may be classified into an external speaker hole (e.g., audio module107) and a call receiver hole (e.g., audio module114). The microphone hole (e.g., audio module103) and the speaker holes (e.g., audio modules107and114) may be implemented as a single hole, or a speaker (e.g., a piezo speaker) may be provided without the speaker holes (e.g., audio modules107and114). The sensor modules104and119may generate electrical signals or data corresponding to an internal operating state of the electronic device100or to an external environmental condition. The sensor modules104and119may include a first sensor module104(e.g., a proximity sensor) and/or a second sensor module (e.g., a fingerprint sensor) disposed on the first surface110A of the housing110, and/or a third sensor module119(e.g., a heart rate monitor (HRM) sensor) and/or a fourth sensor module (e.g., a fingerprint sensor) disposed on the second surface110B of the housing110. The fingerprint sensor may be disposed on the second surface110B as well as the first surface110A (e.g., the display101) of the housing110. The electronic device100may further include at least one of a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor. The camera modules105,112and113may include a first camera device (e.g., camera module105) disposed on the first surface110A of the electronic device100, and a second camera device (e.g., camera module112) and/or a flash (e.g., camera module113) disposed on the second surface110B. The camera module105or the camera module112may include one or more lenses, an image sensor, and/or an image signal processor. The flash (e.g., camera module113) may include, for example, a light emitting diode or a xenon lamp. Two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device100. The key input device117may be disposed on the lateral surface110C of the housing110. The electronic device100may not include some or all of the key input device117described above, and the key input device117which is not included may be implemented in another form such as a soft key on the display101. The key input device117may include the sensor module disposed on the second surface110B of the housing110. In another embodiment, the key input device117may be implemented using a pressure sensor included in the display101. The indicator may be disposed on the first surface110A of the housing110. For example, the indicator may provide status information of the electronic device100in an optical form. The indicator may provide a light source associated with the operation of the camera module105. The indicator may include, for example, a light emitting diode (LED), an infrared (IR) LED, or a xenon lamp. The connector hole108may include a first connector hole108adapted for a connector (e.g., a universal serial bus (USB) connector) for transmitting and receiving power and/or data to and from an external electronic device. The connector hole108may include a second connector hole (not shown) adapted for a connector (e.g., an earphone jack) for transmitting and receiving an audio signal to and from an external electronic device. Some sensor modules of camera modules105and112, some sensor modules of sensor modules104and119, or an indicator may be arranged to be exposed through a display101. For example, the camera module105, the sensor module104, or the indicator may be arranged in the internal space of an electronic device100so as to be brought into contact with an external environment through an opening of the display101, which is perforated up to a front plate102. In another embodiment, some sensor modules104may be arranged to perform their functions without being visually exposed through the front plate102in the internal space of the electronic device. For example, in this case, an area of the display101facing the sensor module may not require a perforated opening. FIG.3is an exploded perspective view of the electronic device ofFIG.1according to an embodiment of the disclosure. The electronic device300shown inFIG.3may be similar, at least in part, to the electronic device100inFIGS.1and2, or may further include another embodiment of the electronic device. Referring toFIG.3, an electronic device300may include a lateral bezel structure310, a first support member311(e.g., a bracket), a front plate320(e.g., a front cover), a display330(e.g., a display101), an electromagnetic induction panel (not shown), a substrate340(e.g., a printed circuit board (PCB) or FPCB (flexible PCB), or RFPCB (rigid-flexible PCB)), a battery350, a second support member360(e.g., a rear case), an antenna structure600, and a rear plate380(e.g., a rear cover). The electronic device300may omit at least one (e.g., the first support member311or the second support member360) of the above components or may further include another component. Some components of the electronic device300may be the same as or similar to those of the electronic device100shown inFIG.1orFIG.2, thus, descriptions thereof are omitted below. The first support member311is disposed inside the electronic device300and may be connected to, or integrated with, the lateral bezel structure310. The first support member311may be formed of, for example, a metallic material and/or a non-metal (e.g., polymer) material. The first support member311may be combined with the display330at one side thereof and also combined with a printed circuit board (PCB) (e.g., substrate340) at the other side thereof. On a PCB (e.g., substrate340), a processor, a memory, and/or an interface may be mounted. The processor may include, for example, one or more of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communications processor (CP). The memory may include, for example, one or more of a volatile memory and a non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a USB interface, a secure digital (SD) card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device300with an external electronic device and may include a USB connector, an SD card/multimedia card (MMC) connector, or an audio connector. The battery350is a device for supplying power to at least one component of the electronic device300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a part of the battery350may be disposed on substantially the same plane as a PCB (e.g., substrate340). The battery350may be integrally disposed within the electronic device300, and may be detachably disposed from the electronic device300. The antenna structure600may be disposed between the rear plate380and the battery350. The antenna structure600may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna structure600may perform short-range communication with an external device, or transmit and receive power required for charging wirelessly. An antenna structure may be formed by a part or combination of the lateral bezel structure310and/or the first support member311. The electronic device according to certain embodiments may be one of various types of electronic devices. The electronic devices may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above. It should be appreciated that certain embodiments of the disclosure and the terms used therein are not intended to limit the technological features set forth herein to particular embodiments and include various changes, equivalents, or replacements for a corresponding embodiment. With regard to the description of the drawings, similar reference numerals may be used to refer to similar or related elements. As used herein, each of such phrases as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C,” may include any one of, or all possible combinations of the items enumerated together in a corresponding one of the phrases. As used herein, such terms as “1st” and “2nd,” or “first” and “second” may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order). It is to be understood that if an element (e.g., a first element) is referred to, with or without the term “operatively” or “communicatively”, as “coupled with,” “coupled to,” “connected with,” or “connected to” another element (e.g., a second element), it means that the element may be coupled with the other element directly (e.g., wiredly), wirelessly, or via a third element. As used herein, the term “module” may include a unit implemented in hardware, software, or firmware, and may interchangeably be used with other terms, for example, “logic,” “logic block,” “part,” or “circuitry”. A module may be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module may be implemented in a form of an application-specific integrated circuit (ASIC). Various embodiments as set forth herein may be implemented as software (e.g., the program) including one or more instructions that are stored in a storage medium (e.g., internal memory or external memory) that is readable by a machine (e.g., the electronic device100). For example, a processor of the machine (e.g., the electronic device100) may invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to the at least one instruction invoked. The one or more instructions may include a code generated by a complier or a code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. The term “non-transitory” simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium. According to an embodiment, a method according to certain embodiments of the disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., PlayStore™), or between two user devices (e.g., smart phones) directly. If distributed online, at least part of the computer program product may be temporarily generated or at least temporarily stored in the machine-readable storage medium, such as memory of the manufacturer's server, a server of the application store, or a relay server. According to certain embodiments, each component (e.g., a module or a program) of the above-described components may include a single entity or multiple entities. According to certain embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, according to certain embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. According to certain embodiments, operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added. FIG.4is a diagram illustrating a configuration of an electronic device. An electronic device100ofFIG.4may include a support structure390, an antenna structure600, and a tape member700according to an embodiment of the disclosure. Referring toFIG.4, an electronic device100may include a housing110, including a front plate (e.g., the front plate102inFIG.1or the front plate320inFIG.3), a rear plate (e.g., the rear plate180inFIG.1or the rear plate380inFIG.3) toward a direction opposite to the direction of the front plate102, and the side member (e.g., lateral bezel structure118) surrounding an internal space1001between the front plate and the rear plate. The electronic device100may include a support member311at least partially extended from the side member (e.g., lateral bezel structure118) of the electronic device100to the internal space1001. In an embodiment, the electronic device100may include a substrate410(e.g., the substrate340inFIG.3) disposed in the internal space1001in a way to at least partially overlap the support member311. At least one electrical element, such as an application processor (AP), a communication processor (CP), a memory and/or an interface, may be disposed in the substrate410. In an embodiment, the electronic device100may include the support structure390disposed in a way to at least partially overlap the substrate410. The support structure390may be configured to support at least one electronic part (e.g., the substrate410or the display330) disposed in the internal space1001. In an embodiment, the electronic device100may include then antenna structure600disposed in the internal space1001. The antenna structure600may be disposed near the substrate410. For example, the antenna structure600may be disposed under (e.g., the −z direction inFIG.3) a battery (e.g., the battery350inFIG.3) in a way to at least partially overlap the battery350. The antenna structure600may be disposed to overlap at least part of the substrate410. The antenna structure600may include a dielectric substrate (not illustrated) and at least one coil member (not illustrated) disposed in the dielectric substrate. For example, the at least one coil member may include a coil member supporting NFC communication, MST communication and/or wireless charging. The dielectric substrate may include at least one extension part640extended from the dielectric substrate. In an embodiment, the electronic device100may include the tape member700. The tape member700may include a first region420, a second region430, and a connection part440connecting the first region420and the second region430. In an embodiment, when the support structure390is viewed from the top, the first region420of the tape member700may at least partially overlap the support structure390. The second region430of the tape member700may at least partially overlap the antenna structure600. The connection part440of the tape member700may at least partially overlap the at least one extension part640extended from the dielectric substrate of the antenna structure600. The at least one extension part640according to various embodiments may include a plurality of dummy patterns (not illustrated) formed at designated intervals and/or in a designated shape in order to increase stiffness. The at least one extension part640may be attached to the connection part440of the tape member700through an adhesion member. FIG.5is an exploded perspective view of an electronic device ofFIG.1according to an embodiment of the disclosure. Referring toFIG.5, an antenna structure600may be disposed between a tape member700and a sealing member551. The antenna structure600may include a dielectric substrate610and at least one coil member620disposed in the dielectric substrate610. The dielectric substrate610may include the at least one extension part640extended from the dielectric substrate610. The at least one extension part640may include a plurality of dummy patterns formed at designated intervals and/or in a designated shape in order to increase stiffness. The at least one extension part640may be attached to the tape member700through an adhesion member555. For example, the adhesion member555may include conductive sponge or conductive poron. In various embodiments, the electronic device100may include a shielding member disposed at the top (e.g., a second direction (e.g., a direction {circle around (2)})) (e.g., the −z direction inFIG.3) of the at least one extension part640extended from the dielectric substrate610. The at least one extension part640includes the plurality of dummy patterns formed at designated intervals and/or in a designated shape, and has the shielding member disposed therein, so that the stiffness of the at least one extension part640can be further increased. In various embodiments, as the shielding member is disposed on the at least one extension part640, the deterioration of radiation performance of the at least one coil member620attributable to coupling (or indirect coupling) between the at least one coil member620and the plurality of dummy patterns of the at least one extension part640can be prevented. In an embodiment, the electronic device100may include a shielding member554disposed between the antenna structure600and the sealing member551. The shielding member554can block signals, transmitted and received through the at least one coil member620of the antenna structure600, from affecting a part disposed in a first direction (e.g., a direction {circle around (1)}) (e.g., the z direction inFIG.3). For example, the shielding member554may include a protective film, a graphite sheet and/or a shielding sheet. In an embodiment, the electronic device100may include a functional member disposed between the tape member700and the sealing member551. The functional member may include a step compensation member553and/or a heat dissipation member552. For example, the step compensation member553may be configured to compensate for a thickness of the antenna structure600. The heat dissipation member552may play a role to uniformly distribute heat (e.g., a function of efficiently transferring heat) generated from an electrical element (e.g., an application processor (AP), a communication processor (CP), a memory and/or an interface). FIG.6Ais a diagram illustrating an antenna structure according to an embodiment of the disclosure. Referring toFIG.6A, an antenna structure600may include a dielectric substrate610and at least one coil member620disposed in the dielectric substrate610. The dielectric substrate610may include the at least one extension part640extended from the dielectric substrate610. The at least one extension part640may include a plurality of dummy patterns641formed at designated intervals and/or in a designated shape. For example, the plurality of dummy patterns641may be formed to have respective lengths at designated intervals from the antenna structure600to a direction647of a substrate (e.g., the substrate410inFIG.4), but the disclosure is not limited thereto. In various embodiments, since the plurality of dummy patterns641included in the at least one extension part640is formed at designated intervals and/or in a designated shape, the stiffness of the at least one extension part640can be further increased. InFIG.6Aaccording to various embodiments, the plurality of dummy patterns641has been described as having the lengths at the designated intervals in the direction647of the substrate410, but the disclosure is not limited thereto. For example, in relation to the plurality of dummy patterns641, various embodiments will be described with reference toFIG.9to be described later. In an embodiment, the antenna structure600may include a connector unit630disposed so that the at least one coil member620(e.g., a first coil member621and a second coil member622) is elongated through the dielectric substrate610. The connector unit630may be electrically connected to the substrate410. In an embodiment, the at least one coil member620may include the first coil member621and the second coil member622. The first coil member621may include a coil member that transmits and/or receives signals having a frequency band designated to be used for NFC communication. The second coil member622may include a coil member that supports wireless charging. For example, the second coil member622may transmit and/or receive power in a frequency band corresponding to a wireless power consortium (WPC) standard. The second coil member622may transmit, to a battery (e.g., the battery350inFIG.3), power wirelessly received from an external device (e.g., a charging device). Although not illustrated, the at least one coil member620may include a third coil member. The third coil member may include a coil member that supports MST communication. In an embodiment, the electronic device100may include a wireless communication circuit that transmits and/or receives a radio signal in at least one frequency band through the at least one coil member620, for example, the first coil member621. The electronic device100may include a charging circuit that transmits and/or receives wireless charging signals through the at least one coil member620, for example, the second coil member622. FIG.6Bis a diagram illustrating that some region of an antenna structure ofFIG.6Ahas been enlarged according to an embodiment of the disclosure. Referring toFIG.6B, an antenna structure600may include a dielectric substrate610and at least one coil member620disposed in the dielectric substrate610, for example, a first coil member621and a second coil member622. The dielectric substrate610may include the at least one extension part640extended from the dielectric substrate610. The at least one extension part640may include the plurality of dummy patterns641formed to have respective lengths at designated intervals645from the dielectric substrate610to the direction647of a substrate (e.g., the substrate410inFIG.4). In various embodiments, the plurality of dummy patterns641of the at least one extension part640may be formed to be isolated from the at least one coil member620, for example, the first coil member621and/or the second coil member622, at a designated distance650. For example, the distance between the plurality of dummy patterns641and the at least one coil member620may be determined not to affect radiation performance of the at least one coil member620. In various embodiments, as the plurality of dummy patterns641of the at least one extension part640is formed to be isolated from the first coil member621and/or the second coil member622at the designated distance650, the deterioration of radiation performance of the first coil member621and/or the second coil member622, which may occur due to the coupling (or indirect coupling) of the first coil member621and/or the second coil member622and the plurality of dummy patterns641can be prevented. FIG.7is a diagram illustrating the arrangement of an antenna structure and a tape member according to an embodiment of the disclosure. Referring toFIG.7illustrating an antenna structure600, a tape member700may include the first region420, the second region430, and the connection part440connecting the first region420and the second region430. According to various embodiments, the first region420of the tape member700may at least partially overlap a support structure (e.g., the support structure390inFIG.4). The second region430of the tape member700may at least partially overlap the antenna structure600. The connection part440of the tape member700may at least partially overlap the at least one extension part640extended from the dielectric substrate610. In an embodiment, the at least one extension part640disposed in a way to at least partially overlap the connection part440of the tape member700may include the plurality of dummy patterns641formed at designated intervals and/or in a designated shape. As the at least one extension part640includes the plurality of dummy patterns formed at designated intervals and/or in a designated shape, the stiffness of the at least one extension part640can be increased. FIG.8is a cross-sectional view of an electronic device, which is viewed along line A-A′ ofFIG.1, according to an embodiment of the disclosure. Referring toFIG.8, an electronic device100may include a display330, a lateral bezel structure310, a support member311, a substrate340, a battery350, a support structure390, an antenna structure600, a tape member700and/or a rear plate380. In an embodiment, the battery350may be disposed on the same plane as the substrate340. The battery350may supply power to at least one element (e.g., the substrate340) of the electronic device100. In an embodiment, the electronic device100may include a wall3111extended from a housing (e.g., the housing110inFIG.1) to an internal space (e.g., the internal space1001inFIG.1) at a designated height. In an embodiment, the substrate340may be disposed in a first direction (e.g., the y direction inFIG.3) with respect to the wall3111. The battery350may be disposed in a second direction (e.g., the −y direction inFIG.3), that is, a direction opposite to the first direction, with respect to the wall3111. In an embodiment, the antenna structure600may be disposed between the battery350and the rear plate380. The antenna structure600may be disposed in a way to at least partially overlap the battery350. The antenna structure600may include a dielectric substrate (e.g., the dielectric substrate610inFIG.6A) and at least one coil member (e.g., the at least one coil member620inFIG.6A) disposed in the dielectric substrate610. In an embodiment, the tape member700may be disposed between the antenna structure600and the rear plate380. The tape member700may include the first region420, the second region430, and the connection part440connecting the first region420and the second region430. The first region420of the tape member700may at least partially overlap the support structure390. The second region430of the tape member700may at least partially overlap the antenna structure600. The connection part440of the tape member700may at least partially overlap the at least one extension part640extended from the dielectric substrate610of the antenna structure600. In an embodiment, the wall3111may be disposed at a location overlapping the at least one extension part640of the antenna structure600. In an embodiment, the at least one extension part640may include a plurality of dummy patterns (e.g., the plurality of dummy patterns641inFIG.6A) formed at designated intervals and/or in a designated shape. The stiffness of the at least one extension part640can be increased because the at least one extension part640includes the plurality of dummy patterns641formed at designated intervals and/or in a designated shape. Accordingly, a break in the at least one extension part640attributable to the wall3111disposed at a location overlapping the at least one extension part640can be prevented. FIG.9is a diagram illustrating a plurality of dummy patterns forming the at least one extension part of an antenna structure according to an embodiment of the disclosure. Referring toFIG.9, as illustrated in reference numeral <910>, the at least one extension part640of an antenna structure (e.g., the antenna structure600inFIG.6A) may include a plurality of dummy patterns911formed to have respective lengths at designated intervals in a direction913of a connector unit (e.g., the connector unit630inFIG.6A) of the antenna structure600. In various embodiments, as illustrated in reference numeral <920>, the at least one extension part640of the antenna structure600may include a plurality of dummy patterns923(e.g., a mesh pattern) formed to have respective lengths at designated intervals from the antenna structure600to a direction921of a substrate (e.g., the substrate410inFIG.4) and the direction913of a connector unit630of the antenna structure600. In various embodiments, as illustrated in reference numerals <930> and <940>, the at least one extension part640of the antenna structure600may include a plurality of dummy patterns931and941each formed at designated intervals in a diagonal direction. In various embodiments, as illustrated in reference numeral <950>, the at least one extension part640of the antenna structure600may include a plurality of dummy patterns consisting of a plurality of conductors951. FIG.10is a diagram illustrating an antenna structure according to an embodiment of the disclosure. Referring toFIG.10, an antenna structure1000(e.g., the antenna structure600inFIG.6A) may include a dielectric substrate1010(e.g., the dielectric substrate610inFIG.6A) and at least one coil member1020(e.g., the at least one coil member620inFIG.6A) disposed in the dielectric substrate1010. The dielectric substrate1010may include a plurality of extension parts extended from the dielectric substrate1010, for example, a first extension part1040and a second extension part1050. The first extension part1040may include a plurality of dummy patterns1041formed at designated intervals and/or in a designated shape. The second extension part1050may include a plurality of dummy patterns1051formed at designated intervals and/or in a designated shape. For example, the plurality of dummy patterns1041and1051may be formed to have respective lengths at designated intervals from the antenna structure1000to a direction1060of a substrate (e.g., the substrate410inFIG.4), but the disclosure is not limited thereto. The plurality of dummy patterns1041and1051each may consist of any one pattern or combinations of at least two of the plurality of dummy patterns illustrated in reference numerals <910> to <950> ofFIG.9(e.g., the plurality of dummy patterns911formed to have respective lengths at designated intervals in the direction of the connector unit630of the antenna structure600, the plurality of dummy patterns923formed to have a mesh pattern, the plurality of dummy patterns931and941each formed at designated intervals in the diagonal direction, and the plurality of dummy patterns consisting of the plurality of conductors951). In various embodiments, the plurality of dummy patterns1041of the first extension part1040may be formed to have the same interval and/or shape as the plurality of dummy patterns1051of the second extension part1050or to have intervals and/or shape different from intervals and/or a shape of the plurality of dummy patterns1051of the second extension part1050. In an embodiment, the antenna structure1000may include a connector unit1030(e.g., the connector unit630inFIG.6A) disposed so that the at least one coil member1020is elongated through the dielectric substrate1010. The connector unit1030may be electrically connected to the substrate410. The at least one coil member620may include a first coil member1021(e.g., the first coil member621inFIG.6A) and a second coil member1022(e.g., the second coil member622inFIG.6A). The first coil member621may include a coil member that transmits and/or receives signals having a frequency band designed to be used for NFC communication. The second coil member622may include a coil member that supports wireless charging. Although not illustrated, the at least one coil member620may further include a coil member that supports MST communication. In various embodiments, the plurality of dummy patterns1041of the first extension part1040and the plurality of dummy patterns1051of the second extension part1050may be formed to be isolated from the first coil member1021and/or the second coil member1022at a designated distance (e.g.,650inFIG.6B). As the plurality of dummy patterns1041of the first extension part1040and the plurality of dummy patterns1051of the second extension part1050are formed to be isolated from the first coil member1021and/or the second coil member1022at the designated distance (e.g.,650inFIG.6B), the deterioration of radiation performance of the first coil member1021and/or the second coil member1022, which may occur due to coupling (or indirect coupling) between the first coil member1021and/or the second coil member1022and the plurality of dummy patterns1041and1051, can be prevented. FIG.11is a cross-sectional view of an electronic device, which is viewed along line A-A′ ofFIG.1, according to an embodiment of the disclosure. Referring toFIG.11, an electronic device100may include a display330, a lateral bezel structure310, a support member311, a substrate340, a battery350, a shield can1120, an antenna structure600, a tape member700and/or a rear plate380. In an embodiment, the antenna structure600may be disposed between the battery350and the rear plate380. The antenna structure600may be disposed in a way to at least partially overlap the battery350. The antenna structure600may include a dielectric substrate (e.g., the dielectric substrate610inFIG.6A) and at least one coil member (e.g., the at least one coil member620inFIG.6A) disposed in the dielectric substrate610. The dielectric substrate610may include the at least one extension part640extended from the dielectric substrate610. In an embodiment, at least one electrical element1110, such as an application processor (AP), a communication processor (CP), a memory and/or an interface, may be disposed in the substrate340. In an embodiment, the shield can1120can shield electromagnetic waves generated from at least one electrical element1110disposed in the substrate340or the at least one coil member620of the antenna structure600. In an embodiment, the tape member700may be disposed in the antenna structure600and the rear plate380. The tape member700may be formed as a heat dissipation member for diffusing heat generated from the at least one electrical element1110through the shield can1120. The heat dissipation member may include a graphite sheet or a thermal interface material (TIM) tape. In an embodiment, the tape member700may include the first region420, the second region430, and the connection part440connecting the first region420and the second region430. The first region420of the tape member700may at least partially overlap the shield can1120. The second region430of the tape member700may at least partially overlap the antenna structure600. The connection part440of the tape member700may at least partially overlap the at least one extension part640of the antenna structure600. The electronic device100according to various embodiments includes a housing (e.g., the housing110inFIG.1), the substrate340disposed in an internal space (e.g., the internal space1001inFIG.1) of the housing110, the battery350disposed on the same plane as the substrate340, the support structure390disposed to at least partially overlap the substrate340when the substrate340is viewed from the top, the antenna structure600including the dielectric substrate610and the at least one coil member620disposed in the dielectric substrate610as the antenna structure500disposed to at least partially overlap the battery350when the battery350is viewed from the top, and the tape member700including the first region420at least partially overlapping the support structure390, the second region430at least partially overlapping the antenna structure, and the connection part440connecting the first region420and the second region430, when the support structure390is viewed from the top. The dielectric substrate610may include the at least one extension part640extended from the dielectric substrate610and at least partially overlapping the connection part440when the antenna structure600is viewed from the top. The at least one extension part640may include the plurality of dummy patterns641formed at designated intervals and/or in a designated shape. According to various embodiments, the at least one extension part640may be attached to the connection part440through the adhesion member555. According to various embodiments, the shortest distance between the plurality of dummy patterns641and the at least one coil member620may be determined not to affect radiation performance of the at least one coil member620. According to various embodiments, the antenna structure600may be disposed between the tape member700and the sealing member551. According to various embodiments, the housing110may include the front plate320, the rear plate380toward a direction opposite to the direction of the front plate320, and the side member (e.g., lateral bezel structure118) surrounding the internal space1001between the front plate320and the rear plate380. The tape member700may be disposed between the antenna structure600and the rear plate380. According to various embodiments, the electronic device100may include the shielding member554disposed between the antenna structure600and the sealing member551. According to various embodiments, the electronic device100may include a functional member disposed between the tape member700and the sealing member551. According to various embodiments, the functional member may include the step compensation member553for compensating for a thickness of the antenna structure600and/or the heat dissipation member552. The electronic device100according to various embodiments may further include the wall3111extended from the housing110to the internal space1001at a designated height. The wall3111may be disposed at a location overlapping the at least one extension part640when the antenna structure600is viewed from the top. According to various embodiments, the substrate340may be disposed in a first direction (e.g., the y direction inFIG.3) with respect to the wall3111. According to various embodiments, the battery350may be disposed in a second direction (e.g., the −y direction inFIG.3), that is, a direction opposite to the first direction, with respect to the wall3111. According to various embodiments, the plurality of dummy patterns641may be formed to have respective lengths at designated intervals from the antenna structure600to the direction of the substrate340. According to various embodiments, the support structure390may further include the shield can1120for shielding the at least one electrical element1110disposed in the substrate340. According to various embodiments, the tape member700may be formed as a heat dissipation member. According to various embodiments, the heat dissipation member may be configured to diffuse heat generated from the at least one electrical element through the shield can1120. According to various embodiments, the heat dissipation member may include a graphite sheet or a thermal interface material (TIM) tape. According to various embodiments, the electronic device100may include a shielding member disposed on the at least one extension part640extended from the dielectric substrate610when the antenna structure600is viewed from the top. According to various embodiments, the antenna structure600may include the connector unit630disposed so that the at least one coil member620is elongated through the dielectric substrate610. According to various embodiments, the substrate340may include a wireless communication circuit electrically connected to the connector unit630and configured to transmit and/or receive radio signals in at least one frequency band through the at least one coil member620. According to various embodiments, the substrate340may include a charging circuit electrically connected to the connector unit630and configured to transmit and/or receive wireless charging signals through the at least one coil member620. While the disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents. | 46,021 |
11942678 | DESCRIPTION OF EXEMPLARY EMBODIMENTS FIG.1illustrates an antenna and radio head configuration100having a first exemplary mounting mechanism for mounting two radio heads in close proximity to a coupled cellular antenna according to the disclosure. Antenna and radio head configuration100includes a cellular antenna105and two radio heads110. Antenna105is mechanically coupled to a pole101via two antenna mounts107. Mounted between antenna105and pole101are two radio heads110, each of which are mounted to a mounting plate115, which is coupled to upper and lower slide mounts120. Mounting plate115and upper and lower slide mounts120are mechanically coupled to pole101. The configuration illustrated inFIG.1is for nominal operation of the combination of antenna105and the two radio heads110, although not shown are the RF cables coupling the radio heads110to the antenna105. FIG.2illustrates the first exemplary mounting mechanism ofFIG.1with one radio head110translated laterally outward using a first exemplary mounting mechanism according to the invention. Lateral translation of radio head110is enabled by the engagement pins illustrated on the top of upper slide mount120and sliding radio head110mechanically coupled to mounting plate115using upper and lower slide mounts120. Note that upper and lower radio heads110may be laterally translated independently. FIG.3illustrates the first exemplary mounting mechanism ofFIG.2with one radio head110translated laterally and rotated outward using a first exemplary mounting mechanism according to the invention. To enable this, the combination of mounting plate115and upper and lower slide mounts120are coupled to mounting sleeve125, which rotatably fixes radio head110, mounting plate115and upper and lower slide mounts120so that the combination may rotate around pole101. In doing so, laterally translating radio head110outward from behind antenna105allows the combination to be rotated in such a way that radio head110does not make physical contact with antenna105. This enables a technician to service upper radio head110without interfering with the antenna105and also without interfering with—in this example—lower radio head110in operation with antenna105. In other words, the first exemplary mounting mechanism (e.g., the combination of mounting plate115, upper and lower slide mounts120and mounting sleeve125) enables a technician to have access to one radio head110(upper or lower) without interfering with the operation of the other radio head110as it is electrically coupled to antenna105. FIG.4illustrates first exemplary mounting mechanism ofFIG.3with the radio head110removed, further illustrating a first exemplary mounting mechanism (e.g., the combination of mounting plate115, upper and lower slide mounts120and mounting sleeve125) according to the invention. FIG.5illustrates a second exemplary mounting mechanism for mounting two radio heads510in close proximity to a coupled cellular antenna505according to the disclosure. Antenna505is mechanically coupled to a pole501using three antenna mounts507. FIG.6illustrates the second exemplary mounting mechanism ofFIG.5along an axis perpendicular to a vector normal to the array face of the antenna505. Further illustrated are upper radio head510that is coupled to pole501via an upper radio head slide bracket520that mechanically couples to a pole bracket530, and via an upper radio head mounting bracket525that mechanically couples to another pole bracket530. Upper radio head slide bracket520and upper radio head mounting bracket525may both be coupled to an upper radio head mounting plate (not shown) to which upper radio head is mounted. Lower radio head510is coupled to pole501via a lower radio head slide bracket520that mechanically couples to a pole bracket530, and via a lower radio head mounting bracket525that mechanically couples to another pole bracket530. Upper radio head slide bracket520is coupled via pole bracket530such that pole bracket530is mechanically coupled to upper antenna mount507via two mounting bolts540; and upper radio head mounting bracket525engages with pole501via a pole bracket that is affixed to pole510via friction bracket545. Lower radio head slide bracket520is coupled via pole bracket530such that pole bracket530is mechanically coupled to pole501via friction bracket545; and lower radio head mounting bracket525engages with pole501via pole bracket530such that pole bracket530is mechanically coupled to lower antenna mount507via two mounting bolts540. Lower radio head slide bracket520and lower radio head mounting bracket525may both be coupled to a lower radio head mounting plate (not shown) to which lower radio head is mounted. FIG.7is a close up view ofFIG.6, more closely illustrating the mounting mechanism for the lower radio head of the two radio heads; andFIG.8is a close up view ofFIG.6, more closely illustrating the mounting mechanism for the upper radio head of the two radio heads. FIG.9illustrates the antenna and mounting configuration ofFIG.6with the radio heads removed; andFIG.10is an iso view of the antenna configuration ofFIG.9. FIG.11is a close upFIG.10, further illustrating the mounting mechanism for the upper radio of the two radios. FIG.12is another view of the antenna configuration ofFIG.9from another angle, further illustrating the mounting mechanism for the upper radio of the two radios; andFIG.13illustrates the antenna configuration ofFIG.12, with the antenna removed; andFIG.14is a close upFIG.10, further illustrating the mounting mechanism for the lower radio of the two radios. FIG.15illustrates another exemplary mechanism1500for mounting radios110in close proximity to an antenna105according to the disclosure. In this example, radios110are each mounted a mounting plate115; and each mounting plate115is mounted to a base plate1510via upper and lower slide mounts120, which enable the mounting plate115and its attached radio110to be translated laterally in a manner similar to that described above. Base plate1510is mounted to pole101via mounting brackets1530. The dimensions and shape of mounting brackets530are such that they provide a standoff distance from the radios110to the pole101such that they are sufficiently close to the pole101to minimize a downward torque on pole101while providing sufficient distance for radio models that have a greater “thickness”. Further, mounting brackets1530may have a cutout shape to provide clearance for radios110that are “longer” in dimension. As illustrated inFIG.15, antenna105may be mounted so that it is in a fixed downward orientation. This may be enabled by an upper tilt bracket1520, which mechanically couples antenna105to upper mounting bracket1530; and a lower pivot mount1540, which couples antenna105to lower mounting bracket1530. Upper tilt bracket1520may be configurable to enable antenna105to be tilted at different fixed angles. Alternatively, antenna105may be mounted to base plate1510so that antenna105is fixed and parallel to base plate1510. It will be understood that such variations are possible and within the scope of the disclosure. FIG.16is an iso view of the exemplary mechanism1500ofFIG.15, along with antenna105and radios110. | 7,202 |
11942679 | DETAILED DESCRIPTION OF EMBODIMENTS The disclosed systems and method below may be described generally, as well as in terms of specific examples and/or specific embodiments. For instances where references are made to detailed examples and/or embodiments, it should be appreciated that any of the underlying principles described are not to be limited to a single embodiment, but may be expanded for use with any of the other methods and systems described herein as will be understood by one of ordinary skill in the art unless otherwise stated specifically. FIG.1is a block diagram of an antenna extender100optionally extended with a laser-induced plasma114in accordance with an embodiment of the invention. The antenna extender100includes a laser source110and an antenna feed120. The laser source110emits a laser beam along an axis112with sufficient power to produce a laser-induced plasma114in an atmosphere along the axis112of the laser beam. While laser source110emits the laser beam, the laser-induced plasma114extends the antenna feed120. In this embodiment, when the laser source110is deactivated, the antenna feed120is too short to efficiently radiate the radiofrequency signal from radiofrequency transceiver130, but when the laser source110is activated, the antenna feed120extended with the laser-induced plasma114efficiently radiates the radiofrequency signal from radiofrequency transceiver130. The antenna feed120is shown inFIG.1with a minimal stub length for effective conductive coupling between the radiofrequency signal and the laser-induced plasma114. Note the laser-induced plasma114is not specifically included in the antenna extender100, which includes the antenna feed120and the laser source110capable of generating the laser-induced plasma114. In general, the laser source110is arranged to emit the laser beam that is coaxial along the axis112with the antenna feed120. The antenna feed120extends along the axis112for coupling between the radiofrequency signal and the laser-induced plasma114. The antenna feed120extended with the laser-induced plasma114has an enhanced radiation efficiency for the radiofrequency signal that is greater than the antenna feed120that is not extended. The antenna feed120has a stub radiation efficiency for the radiofrequency signal when the laser source110is deactivated and does not emit the laser beam. The enhanced radiation efficiency for the radiofrequency signal is greater than the stub radiation efficiency for the radiofrequency signal because the antenna feed120extended with the laser-induced plasma114has greater radiation efficiency for radiating the radiofrequency signal than the antenna feed120that is not extended. In an embodiment, the laser source110is configured to emit the laser beam only when the radiofrequency signal transfers low-frequency components with long wavelengths not efficiently radiated from the antenna feed120that is not extended. The antenna laser source110is configured to not emit the laser beam when the radiofrequency signal only transfers high-frequency components with short wavelengths efficiently radiated from the antenna feed120that is not extended. FIG.2is a block diagram of an antenna200extended with a laser-induced plasma214in accordance with an embodiment of the invention. The antenna200includes a laser source210, an antenna feed220, and the laser-induced plasma214. The laser beam from the laser source210and the antenna feed220are coaxial along the axis212. The laser source210emits the laser beam along the axis212with sufficient power to produce the laser-induced plasma214in an atmosphere along the axis212of the laser beam. The antenna feed220extends along the axis212and couples between a radiofrequency signal from radiofrequency transceiver230and the laser-induced plasma214. The antenna feed220extended with the laser-induced plasma214has an enhanced radiation efficiency for the radiofrequency signal as compared with the antenna feed220alone. The enhanced radiation efficiency for the radiofrequency signal is greater than a stub radiation efficiency of the antenna feed220alone for the radiofrequency signal because the antenna feed220extended with the laser-induced plasma214has greater radiation efficiency for radiating the radiofrequency signal than the antenna feed220alone. The antenna feed220is shown inFIG.2with a length efficiently radiating high-frequency components of a radiofrequency signal from radiofrequency transceiver230. In one embodiment, the laser source210is configured to cease emitting the laser beam when the radiofrequency signal only transfers high-frequency components with short wavelengths efficiently radiated from the antenna feed220alone. The increased length of the antenna feed220ofFIG.2as compared with the antenna feed120ofFIG.1also produces more effective conductive coupling between the antenna feed220and the laser-induced plasma214. Even when the laser source210is activated to generate the laser-induced plasma214, because the antenna feed220is typically composed of a metal, such as aluminum, copper, or stainless steel, with higher conductivity than the laser-induced plasma214, the longer antenna feed220also increases radiation efficiency as compared with the antenna feed120extended with the laser-induced plasma114ofFIG.1. It will be appreciated that conductive coupling is enhanced when the antenna feed220is coated with a low work function material, such as lanthanum oxide. FIG.3Ais a cross-section through an antenna300extended with a laser-induced plasma314in accordance with an embodiment of the invention.FIG.3Bis a cross-section along section line3-3inFIG.3A. The laser source310is arranged to emit the laser beam that is tubular and surrounds the antenna feed320that is cylindrical along the axis312. The laser source310emits a laser beam along an axis312with sufficient power to produce the laser-induced plasma314in an atmosphere along the axis312of the laser beam. The atmosphere is gaseous or liquid. In one embodiment, an annular mirror316is tilted for acutely reflecting the laser beam, and the antenna feed320passes through a central opening317in the annular mirror316. The antenna feed320extends along the axis312for coupling between a radiofrequency signal and the laser-induced plasma314. The antenna feed320includes four supports326with stubs327coupling between the radiofrequency signal and the laser-induced plasma314. It will be appreciated that there is less than four or more than four supports326with stubs327in various embodiments of the invention. The stubs327of antenna feed320extend along the axis312and are shown inFIG.3Awith a minimal length for effective conductive coupling between the radiofrequency signal and the laser-induced plasma314. The antenna feed320has a first end321and a second end322. The radiofrequency signal from the radiofrequency transceiver330is coupled to the first end321of the antenna feed320. In one embodiment, the antenna feed320includes top inductive and/or capacitive loading324near the second end322. The top loading324increases the radiation efficiency of the antenna300, especially when the laser source310is deactivated to cease producing the laser-induced plasma314. The supports326with stubs327contribute to the top loading, especially the capacitive component of the top loading. It will be appreciated that the top loading324accounts for the effects of the supports326with stubs327, and that the top loading324is disposed either above or below the supports326. The antenna feed320extended with the laser-induced plasma314has an enhanced radiation efficiency for the radiofrequency signal that is greater than a stub radiation efficiency for the radiofrequency signal when the laser source310is deactivated and does not emit the laser beam. In addition, the hollow configuration of the laser-induced plasma314increases the outer surface area of the laser-induced plasma314. This increased surface area reduces the impact of skin effect that tends to confine radiofrequency currents within an outer layer315of the laser-induced plasma314rather than the entire cross-section of the laser-induced plasma314. This increases the radiofrequency conductivity of the laser-induced plasma314, and hence further increases radiation efficiency. FIG.4Ais a cross-section through an antenna400extended with a laser-induced plasma in accordance with an embodiment of the invention.FIG.4Bis a cross-section along section line4-4inFIG.4A. A laser source410emits a laser beam along an axis412with sufficient power to produce a laser-induced plasma414in an atmosphere along the axis412of the laser beam. The antenna feed420is tubular and surrounds the axis412and also surrounds the laser beam that is cylindrical along the axis412. The antenna feed420has a first end421and a second end422. The radiofrequency signal from the radiofrequency transceiver430is coupled to the first end421of the antenna feed420. The antenna feed420includes at least one support426with stub427near the second end422. The support426with stub427couples the radiofrequency signal between the antenna feed420and the laser-induced plasma414. In one embodiment, the antenna feed420includes top inductive and/or capacitive loading near the second end422. For example, the top loading of the antenna feed420includes an inductive coil424(with the same diameter as the tubular antenna feed420) and an annular capacitive plate425above the support426. Although support426is one of three supports shown inFIG.4B, it will be appreciated that there is a different number of supports in other embodiments, including an embodiment with only one support426supporting one stub427. FIG.5is a flow diagram of a process500for operating an antenna extender optionally extended with a laser-induced plasma in accordance with an embodiment of the invention. While extended with the laser-induced plasma, the antenna extender has enhanced radiation efficiency for transmitting and receiving a radiofrequency signal. At step501, process500continuously determines whether the radiofrequency signal transfers low-frequency components with long wavelengths not efficiently radiated from an antenna feed that is not extended. Decision502checks whether the radiofrequency signal transfers such low-frequency components. In response to the radiofrequency signal transferring the low-frequency components, process500proceeds to step503; otherwise, process500proceeds to step504. At step503, the laser source is dynamically activated to emit the laser beam producing the laser-induced plasma, but at step504, the laser source is dynamically deactivated. Decision505checks the transfer mode for the antenna extender. If the transfer mode is currently a transmit mode, process500proceeds to step506. If the transfer mode is currently a receive mode, process500proceeds to step507. At step506during the transmit mode, the radiofrequency signal is coupled to the antenna feed, and if the laser source was activated at step503, then the radiofrequency signal is further coupled to the laser-induced plasma. At step507during the receive mode, the antenna feed is coupled to the radiofrequency signal, and if the laser source was activated at step503, then this couples the laser-induced plasma to the radiofrequency signal via the antenna feed. From steps506and507, process500returns to step501to check for changes in the actual or expected frequency components of the radiofrequency signal and for changes from the transmit mode to the receive mode, or vice versa. In respective additional embodiments, the antenna extender operates only in the transmit mode or only in the receive mode. From the above description of Antenna Extended with a Laser-Induced Plasma, it is manifest that various techniques may be used for implementing the concepts of antenna extender100, antennas200,300, and400, and process500without departing from the scope of the claims. The described embodiments are to be considered in all respects as illustrative and not restrictive. The antenna extender100, antennas200,300, and400, and process500disclosed herein may be practiced in the absence of any element that is not specifically claimed and/or disclosed herein. It should also be understood that each of antenna extender100or antennas200,300, or400or process500is not limited to the particular embodiments described herein, but is capable of many embodiments without departing from the scope of the claims. | 12,470 |
11942680 | DESCRIPTION OF THE PREFERRED EMBODIMENT In the following description, the present invention will be explained with reference to embodiments thereof. However, these embodiments listed herein are not intended to limit the present invention to any specific examples, embodiments, environment, applications or particular implementations described in these exemplary embodiments. Therefore, description of these exemplary embodiments is only for purpose of illustration rather than to limit the present invention. As shown inFIG.1, in a method of folding and extending an antenna structure100capable of transmitting a WiGig band according to the present invention, the antenna structure100is optimized in the following steps: first, mounting a WiGig module200capable of transmitting a WiGig band within a base300, as shown in step A1; next, pivotally arranging the antenna structure100on the base300, as shown in step A2; and folding (i.e., storing) or extending (i.e., opening or spreading outwardly) the antenna structure100relative to the base300to correspondingly reduce or increase the antenna structure100for transmitting and receiving a valid range of a wireless signal based on the WiGig technology. As shown inFIG.2AtoFIG.2D, in a preferred embodiment of the present invention, the antenna structure100comprises two body portions110, and each of the two body portions110has a pivoting end112and a signal transceiving end114opposite to the pivoting end112. In other words, the pivoting end112and the signal transceiving end114are respectively disposed at two opposite ends of the body portion110. Each of the pivoting ends112is pivotally disposed on the base300at a first specific angle SA1with respect to a horizontal plane, and each of the signal transceiving ends114is inclined downward by a second specific angle SA2with respect to the body portion110and disposed away from the body portion110. By the special arrangement of the aforesaid first specific angle SA1and the second specific angle SA2, gains can be obtained by the valid range for transceiving the wireless signal by the antenna structure100of this application, thereby reducing the probability of the occurring of signal dead corners. Referring again toFIG.2AtoFIG.2B, based on the above arrangements, when the antenna structure100is folded with respect to the base300, the antenna structure100is adapted to exhibit an integrated appearance with the base300, thereby achieving the effect of being stored and carried conveniently. As shown inFIG.2CtoFIG.2D, when the antenna structure100is extended relative to the base300, the two body portions110are adapted to rotate a third specific angle SA3outwardly relative to the base300so that the signal transceiving range with the forward direction as the main direction and the left-right direction as the auxiliary direction initially is extended to a signal transceiving range toward the forward, left-right and backward directions, and the signal transceiving range at this point instead takes the left-right direction as the main direction and the forward and backward directions as the auxiliary directions. It shall be particularly appreciated that, although not shown in the aforesaid drawings, the aforesaid WiGig module200performs relevant signal transmission with the antenna structure100via connection of physical lines, as shall be readily appreciated by those of ordinary skill in the art. Moreover, the aforesaid base300is assumed to be disposed on the head of a user, but it is not limited thereto. The signal transmission relationships between the WiGig module200and the antenna structure100described above are also applicable to the following embodiments of the present application. FIG.3AtoFIG.3Bare taken as an example hereinafter to illustrate the wireless signal transmission state between the antenna structure100in the folded state or extended state of the present invention and a signal transmitting end600. First referring toFIG.3A,FIG.3Amay be regarded as a special configuration of the antenna structure100inFIG.2AtoFIG.2Bthat is folded on the base300without the first specific angle SA1and the second specific angle SA2. In this case, because the signal transceiving end114is in the folded state with respect to the base300, and a front surface of the signal transceiving end114that is configured to receive and transmit wireless signals directly faces the signal transmitting end600(i.e., a signal transceiving range with the forward direction as the main direction and the left-right direction as the auxiliary direction), the signal transceiving end114in the folded state is quite suitable for use by users in scenarios not requiring intense actions, e.g., static games and film viewing. Similarly,FIG.3Bmay be regarded as a special configuration of the antenna structure100inFIG.2CtoFIG.2Dthat is extended on the base300without the first specific angle SA1and the second specific angle SA2. In this case, because the signal transceiving end114is in the outwardly extended state with respect to the base300so that a front surface of the signal transceiving end114that is configured to receive and transmit wireless signals is toward the left and right sides of the base station300, and left and right sides of the front surface of the signal transceiving terminal114may also have the function of transceiving wireless signals (i.e., a signal transceiving range with the left-right direction as the main direction and the forward and backward directions as the auxiliary directions), the transceiving range of the signal transceiving end114at this point is at a best reception position. In other words, even if the user is performing actions such as turning back, bowing, raising his/her head or other activities, one of the two signal transceiving ends114can still maintain the directivity and the connection with respect to the signal transmitting end600, thereby ensuring that the reception of the data flow will not be influenced, and preventing operation delay caused by insufficient signal strength or errors in data flow reception during the data transmission by the user. On the other hand, through the computation of an in-built signal processor, the signal transceiving end114in the extended state may also automatically detect and adjust the signal reception amount. For example, when the signal reception amount of one of the two signal receiving ends114is reduced due to excessively large movement of the body (e.g., turning the head to the left/right sides) of the user, the antenna structure100of the present invention will automatically switch the reception strength of another signal receiving end114to increase the signal reception amount, thereby ensuring the connection quality and preventing errors in the reception of data flow. As shown inFIG.4, the present invention additionally provides a method of folding and extending an antenna structure100capable of transmitting a WiGig band, and the method performs optimization on the antenna structure100via the following steps: first, as shown in step B1, disposing the antenna structure100on a head-mounted wireless transmission display device400; and next, as shown in step B2, folding or extending the antenna structure100with respect to the head-mounted wireless transmission display device400to correspondingly reduce or increase the antenna structure100for transceiving a valid range of a wireless signal based on the WiGig technology. In detail, in the aforesaid method, in order to ensure that no obscuration or reception error occurs between the signal transmitting end600and the signal transceiving ends114while taking the directivity between the signal transmitting end600and the signal transceiving ends114into consideration, the signal transceiving end114of the antenna structure100of the present invention may be arranged in the following two configurations, which are respectively as follows: “(1) the two signal transceiving ends114are arranged at left and right sides of the head of a user500with respect to the head of the user500” and “(2) the two signal transceiving ends114are arranged at front and back sides of the head of the user500with respect to the head of the user500”. The aspect where “(1) the two signal transceiving ends114are arranged at left and right sides of the head of a user500with respect to the head of the user500” may be further divided into a first embodiment shown inFIG.5AtoFIG.5Cand a second embodiment shown inFIG.6AtoFIG.6C. First, as depicted inFIG.5AtoFIG.5C, an aspect where the two body portions110of the antenna structure100are respectively arranged at left and right sides of a display screen410of the head-mounted wireless transmission display device400is shown. As shown inFIG.5AtoFIG.5C, when the two body portions110of the antenna structure100are respectively arranged at left and right sides of the display screen410of the head-mounted wireless transmission display device400, and the signal transceiving end114of each of the body portions110is extended outward, a first distance D1between the two signal transceiving ends114is greater than a width of the display screen410. In this way, when the display screen410swings to the left and right sides, one of the two signal transceiving ends114may still maintain the communication with the front signal transmitting end600even if communication between the other one of the two signal transceiving ends114and the front signal transmitting end600is blocked, thereby maintaining the stability during the data flow reception. As depicted inFIG.6AtoFIG.6C, an aspect where the two body portions110of the antenna structure100are respectively arranged at left and right sides of an overhead device420of the head-mounted wireless transmission display device400is shown. As shown inFIG.6AtoFIG.6C, when the two body portions110of the antenna structure100are respectively arranged at left and right sides of the overhead device420of the head-mounted wireless transmission display device400, and the signal transceiving end114of each of the body portions110is extended outward, a second distance D2between the two signal transceiving ends114is greater than a head width of the user500. In this way, when the display screen410swings to the left and right sides, one of the two signal transceiving ends114may also maintain the communication with the front signal transmitting end600even if communication between the other one of the two signal transceiving ends114and the front signal transmitting end600is blocked, thereby maintaining the stability during the data flow reception. It shall be noted that, although not shown in the figures, the antenna structure100in the embodiments ofFIG.5AtoFIG.5CandFIG.6AtoFIG.6Cmay still have special arrangements involving the aforesaid first specific angle SA1, the second specific angle SA2and the third specific angle SA3or the like, and meanwhile have actions of automatically switching the signal reception strength, thereby preventing errors in the reception of the data flow. The aspect where “(2) the two signal transceiving ends114are arranged at front and back sides of the head of the user500with respect to the head of the user500” may be further divided into a third embodiment ofFIG.7A, a fourth embodiment ofFIG.7Band a fifth embodiment ofFIG.7C. In detail, as shown in the third embodiment ofFIG.7A, when the user500is playing a game requiring less intense actions via the head-mounted wireless transmission display device400, the signal transceiving end114of the antenna structure100may be folded on the overhead device420to receive the data flow (i.e., the signal transceiving end114is in the closed state). In this case, the stability in data reception can be effectively ensured simply by disposing the two signal transceiving ends114slightly higher than the head of the user500. Moreover, in the embodiment ofFIG.7A, the two signal transceiving ends114may be further disposed at corresponding positions indicated by C1, C2and C3respectively to satisfy the minimum signal reception requirement during static activities. As shown in the fourth embodiment ofFIG.7B, when the user500is to perform relatively intense actions, the antenna structure100may be extended upward from the initial position indicated by C3ofFIG.7Athrough stretching (i.e., the antenna structure100is in the spread state) so that the two signal transceiving ends114are respectively disposed at the front and back sides of the head of the user500at a specific height above the head of the user500, thereby obtaining a better signal reception range. The aforesaid specific height is preferably 70 mm, but it is not limited thereto. As shown in the fifth embodiment ofFIG.7C, the two signal transceiving ends114may also be extended respectively forward and backward so that the two signal transceiving ends114are across the head of the user500and disposed with a distance between the two signal transceiving ends114being larger than a width of the head of the user500in the front-back direction, thereby achieving the best effect of the signal reception coverage. In another preferred embodiment of the antenna structure100of the present invention shown inFIG.8, when the user500is wearing the head-mounted wireless transmission display device400, each of the two signal transceiving ends114forms an angle of θ1inclining upward and outward with respect to a plumb line, and the angle θ1is preferably 15 degrees to 20 degrees. Each of the two signal transceiving ends114may also form an angle of θ2inclining forward and downward with respect to a horizontal line, and the angle θ2is preferably designed to be 45 degrees so that the received signal range has the best effect even when the user wearing the head-mounted wireless transmission display device10performs intense activities. The present invention also claims an antenna structure capable of transmitting a WiGig band. In the embodiment as shown inFIG.2AtoFIG.2D, an antenna structure100capable of transmitting a WiGig band comprises two body portions110, each of the two body portions110has a pivoting end112and a signal transceiving end114opposite to the pivoting end112. Each of the pivoting ends112is pivotally disposed on a base300at a first specific angle SA1with respect to a horizontal plane, and each of the signal transceiving ends114is inclined downward by a second specific angle SA2with respect to the body portion110and disposed away from the body portion110. Similarly, in the embodiments shown inFIG.5AtoFIG.5C,FIG.6AtoFIG.6CandFIG.7AtoFIG.7C, the antenna structure100may also be pivotally disposed on a head-mounted wireless transmission display device400. Since the embodiment where the antenna structure100is pivotally disposed on the head-mounted wireless transmission display device400has been described in detail in the above paragraphs, this will not be further described herein. It shall be appreciated that, the aforesaid first specific angle SA1is preferably between 0-20 degrees, and the second specific angle SA2is preferably between 0-45 degrees, thereby achieving the best signal reception effect in the folded state. Additionally, when the antenna structure100is extended relative to the base300or the head-mounted wireless transmission display device400, the two body portions110are adapted to rotate a third specific angle SA3outwardly relative to the base300or the head-mounted wireless transmission display device400, and the third specific angle SA3is between 0 and 60 degrees, thereby achieving the best signal reception effect in the extended state. According to the above description, through the special antenna structure100and the method of folding and extending the antenna structure100claimed by the present invention, when a WiGig module200capable of transmitting a WiGig band is used to perform data flow transmission of the head-mounted wireless transmission display device400, e.g., data flow transmission applicable in the fields of VR, AR or MR, the coverage of the signal reception range can be ensured by disposing the two signal transceiving ends114of the antenna structure100respectively at the left and right sides of the head of the user500or disposing the two signal transceiving ends114of the antenna structure100respectively at the front and back sides of the head of the user500even if the WiGig module200is limited in directivity, thereby effectively ensuring the stability in wireless transmission of the data flow and meanwhile making the antenna structure100convenient to be carried by the users. | 16,580 |
11942681 | DETAILED DESCRIPTION In the following description, numerous specific details are set forth to clearly describe various specific embodiments disclosed herein. One skilled in the art, however, will understand that the presently claimed invention may be practiced without all of the specific details discussed below. In other instances, well known features have not been described so as not to obscure the invention. Conventional VLF transmitters used for command and control of submerged platforms are typically large monolithic structures, requiring massive size and operational costs to achieve their mission. These systems typically rely on propagation off the ionosphere and consequently broadcast signals over extremely large areas, making transmit signals relatively easy to intercept. The disclosed invention utilizes arrays of compact VLF transmitters configured to enhance radiation in the direction of the ocean surface and to suppress radiation outside of a desired coverage area to suppress signal reception and interception. This approach allows VLF coverage to be localized to a desired portion of the ocean and reduces the needed transmitter power and cost associated with operating a VLF transmitter. The arrays of VLF transmitter nodes10may be on semi-autonomous platforms and phased to create an array which localizes VLF coverage to some portion of the ocean surface. The semi-autonomous platforms may be maritime, airborne, or space platforms spaced at regular intervals from their nearest neighbors. In this disclosure, the ocean is an example of a body of water. Rather than being an ocean, the body of water may be any body of water, such as a lake. In radio frequency (RF) engineering, it is common to use linear and collinear antenna arrays; however, at VLF frequencies conventional feeding networks used to supply and drive these arrays are impractical due to the spacing between VLF transmitter nodes in the array and the very long wavelength. The present invention describes a system and method of phasing and coordinating the arrays of maritime, airborne or space-borne VLF transmitter nodes. Now referring toFIG.1, a block diagram of one VLF transmitter node10is shown. As shown inFIG.1, the VLF transmitter node10may include a VLF transmitter12, a controller14, a data buffer16, a clock18, a navigation subsystem20and a communications transceiver22. The controller may include a processor, such as a microprocessor or a computer. The navigation subsystem may be a global positioning system (GPS), and include an inertial sensor, such as a gyroscope and so on. The communications transceiver22is configured to operate in a band different than VLF, and may be a high frequency (HF), very high frequency (VHF), ultra high frequency (UHF), or satellite transceiver or radio. The VLF transmitter12, as shown inFIG.2, may include an antenna24, an RF driver26, and a matching network28. The antenna24may be an electrically small monopole, a dipole or a loop antenna. The matching network28may include inductors, capacitors, resistors, switches, and/or any combination of such components appropriate to resonate the antenna and improve transmitter efficiency over the desired VLF bandwidth. The RF driver for the transmitter may include an RF signal generator30electrically connected to an amplifier32. The electromagnetic fields generated by the array of VLF transmitter nodes10may be controlled by varying the relative phase transmitted by each VLF transmitter node10in the array. Coordination and phasing of each VLF transmitter node10in the array with its neighbors may be achieved through a variety of techniques. The data to be transmitted may be received via communications transceiver22and stored in the data buffer16of each VLF transmitter node10for transmission at a time which may be different for each respective VLF transmitter node10in order to properly phase the combined transmission of the array of VLF transmitter nodes10. In one embodiment in order to properly phase the transmission from each VLF transmitter node10in an array, a respective VLF transmitter node10begins transmitting the data from its data buffer16at a time and in a radiation mode predetermined by commands received by the respective VLF transmitter node10via the communications transceiver22. In another embodiment, each respective VLF transmitter node10autonomously determines the time and radiation mode to begin transmission of the data in the data buffer16. The time of transmission and radiation mode of a respective VLF transmitter node10is relative to other nodes10in the array and is relative to the position of the respective VLF transmitter node10in the array of nodes and the radiation mode. A VLF transmitter node10in the array may operate autonomously to sense its position relative to other VLF transmitter nodes10in the array and to control its position in the array using on-board autonomy algorithms processed in the controller and some form of propulsion on the platform hosting the VLF transmitter node10. In this embodiment, the mission and position for each VLF transmitter node10in the array may be preprogrammed. Position data may be determined by the navigation system20through an external source such as GPS, and by using an onboard inertial sensor, such as a gyroscope. Attitude and orientation of each platform that has an VLF transmitter node10may be maintained by measuring relative changes via the onboard inertial sensor and making corrections using engines and/or propulsion systems on the platform hosting the VLF transmitter node10. The relative phasing for each respective transmitter is determined based on the estimated position and orientation of the transmitter relative to other transmitters in the array of nodes. In another embodiment, one VLF transmitter node10in the array is designated as a master node and determines the positions and operations of the other VLF transmitter nodes10in the array through on-board autonomy algorithms or through instructions received by the master node via a long-haul communication channel, which may use the communications transceiver22. In this embodiment, communication between the master node and the other VLF transmitter nodes10in the array may be achieved using a local communication network using the communications transceiver22. The communications transceiver22in each VLF transmitter node10may include the local communication network, and at least the master node needs to include the long-haul communications channel. Each VLF transmitter node10may include both the local and long-haul communications channels to provide redundancy, as well as making the manufacture of each VLF transmitter node10the same. The communications transceiver22in each VLF transmitter node10may be a high frequency (HF), very high frequency (VHF), ultra high frequency (UHF), or satellite transceiver or radio. The master node coordinates the position and phasing of each VLF transmitter node10in the array, and the phasing or transmission time for each VLF transmitter node10may be determined by timing signals received through an external source such as a GPS reference via the navigation system20, or through local signals emitted from the master node to the other VLF transmitter nodes10in the array. In another embodiment, each node in the array is coordinated individually through commands received from a remote operator via the long-haul communication channel. In this embodiment, position, orientation, phasing, and timing are all received by each VLF transmitter node10through the long-haul communication channel via the communications transceiver22in each node, which again may be high frequency (HF), very high frequency (VHF), ultra high frequency (UHF), or satellite transceiver or radio. As shown in the embodiment ofFIG.3, an array of electrically small VLF transmitter nodes40may be supported on semi-autonomous maritime platforms41distributed on the ocean surface, preferably in a regular grid, and positioned less than one half wavelength from one another. The regular grid may be a linear 1 dimensional array, or a 2 dimensional array. Each maritime platform41may be any variety of buoyant vessel, such as a boat, barge, or buoy. In this embodiment, antennas24for each VLF transmitter nodes40are polarized parallel to the ocean surface for magnetic antennas, such as loops, or normal to the ocean surface for electric antennas, such as monopoles and dipoles. Preferably the VLF transmitter nodes40in the array shown inFIG.3are spaced roughly a quarter wavelength from their nearest neighbor and phased to enhance radiation in a direction parallel to the ocean surface, while suppressing radiation in other directions. InFIG.3an example linear one dimensional array is shown and the radiation is shown as endfire radiation38. In one example, each respective VLF transmitter node40autonomously knows via navigation sensor20and information received via communications transceiver22its distance (rho) from a desired center of the array. InFIG.3, the master node42is shown at the center of the array; however, the master node42does not need to be at the desired center of the array. In another embodiment, each respective VLF transmitter node40is informed via the communications transceiver22, as described above, of its desired position in the array and therefore the distance (rho) from a desired center of the array. If the master node42is at the desired center of the array, then given a time, t0, when the master node42begins transmission, each respective VLF transmitter node40begins transmission with an added delay, so that a respective VLF transmitter node40at a distance rho from the master node42at the center of the array begins transmission at time (t0+vg*rho), where vg is a group velocity of a Norton wave, rho is a distance from a desired center of the array, and t0 is a time the master node42at the center of the array begins transmission. The symbol * indicates a multiplication. The equation above for transmission time from each VLF transmitter node is correct, even if master node42is not at the center of the array and even if there is no master node, as long as “t0” is the time at which an actual node or a virtual node at the center of the array begins transmission. In the embodiment shown inFIG.3, the resulting radiation pattern may be a doughnut shaped radiation pattern strongly directed toward the horizon, or parallel to the ocean surface. This radiation pattern is intended to enhance coupling into the Norton surface wave. This may also suppress coupling into the skywave via the ionosphere, thereby better localizing VLF signal coverage and more efficiently directing radiated power along the ocean surface; however, this effect has not been fully investigated to date. In a related embodiment, the phase delay for each VLF transmitter node40may be greater than vg*rho, thereby generating a slow wave. In this embodiment, transmission for a respective VLF transmitter node40at distance rho begins at time (t0+n*vg*rho), where n is a factor greater than 1 corresponding to a synthesized index of refraction for the wave, vg is a group velocity of a Norton wave, rho is a distance from a desired center of the array, and t0 is a time an actual node, which can be, for example, the master node42or a virtual node at the center of the array begins transmission. This configuration generates a traveling wave electromagnetic field43within the confines of the array, as shown inFIG.4, but does not radiate efficiently away from the array. This configuration also suppresses radiation upward to the ionosphere. In another embodiment, this invention includes an array of electrically small VLF transmitter nodes44arranged in a line or plane normal to the surface of the ocean and supported by airborne vehicles46, as shown inFIG.5. The airborne vehicles may be any variety of fixed wing, rotorcraft, lighter than air vehicles, drones, or unmanned airborne vehicles (UAVs). In this embodiment, antennas24for each node44can be oriented parallel or normal to the surface of the ocean. VLF transmitter nodes44in the array are preferably spaced roughly a quarter wavelength from their nearest neighbor and are phased to enhance radiation in the direction of the ocean surface, while suppressing radiation in other directions. The phase of each VLF transmitter node44may be chosen to be delayed in proportion to the propagation phase from the next highest in elevation VLF transmitter node44. This is preferably implemented as a time delay, where each respective VLF transmitter node44begins transmission at time (t0+vg*(hmax−h)), where h is the height of a respective VLF transmitter node44, hmax is the height of the top or highest 45 VLF transmitter node44in the array, vg is a group velocity of an electromagnetic wave in air, and t0 is a time the top or highest 45 VLF transmitter node44in the array begins transmission. In a variation on this embodiment a VLF sensor48is placed on the surface of the ocean within or near, and preferably at the center of, the coverage area49, as shown inFIG.6. The sensor48measures a set of at least one characteristic, for example strength, of the VLF signal generated by the array of VLF transmitter nodes44at a point within or near, and preferably at the center of, the coverage area49. Then the sensor48transmits, via a radio frequency signal at a noninterfering and different frequency, the relevant characteristics of the measured VLF signal. This transmission is then received by each VLF transmitter node44by its communication transceiver22and used as input to on-board adaptive beamforming algorithms operating in the controller14to correct the phasing or timing of a transmission of each VLF transmitter node44in the array and may also be used to adjust the position of the VLF transmitter node44in the array. In another embodiment, this invention includes an array of electrically small VLF transmitters50arranged in a line or in a plane substantially parallel to the surface of the ocean and supported by airborne vehicles52, as shown inFIG.7. By substantially parallel it is meant that the VLF transmitters50are preferably within ⅛ of the transmission wavelength from a plane substantially parallel to the surface of the ocean, where they are in an actual plane or line that is parallel to the tangent line of the ocean surface, or where the VLF transmitters50are all at the same elevation above the earth's surface. These two cases are the same for small array sizes but slightly diverge for large array sizes. The airborne vehicles52may be any variety of fixed wing, rotorcraft, lighter than air vehicles, drones or UAVs. In this embodiment, antennas for each node may be oriented parallel or normal to the surface of the ocean. Nodes in the array are spaced roughly one half wavelength (and less than one wavelength) from their nearest neighbor and are phased to enhance radiation in the direction of the ocean surface to the coverage area53. This embodiment also radiates in an upward direction. In this embodiment, all nodes begin transmission at substantially the same time with substantially the same phase. In a variation on this embodiment a VLF sensor55is placed on the surface of the ocean within or near, and preferably at the center of, the coverage area53, as shown inFIG.8. The sensor55measures a set of at least one characteristic (e.g. strength) of the VLF signal generated by the array of VLF transmitter nodes50at a point within or near, and preferably at the center of, the coverage area53. Then the sensor55transmits, via a radio frequency signal at a noninterfering and different frequency, the relevant characteristics of the measured VLF signal. This signal is then received by each VLF transmitter node50by its communication transceiver22and used as input to on-board adaptive beamforming algorithms operating in the controller14to correct the phasing or timing of a transmission of each VLF transmitter node50in the array and may also be used to adjust the position of the VLF transmitter node50in the array. In a related embodiment, the VLF transmitter nodes50are arranged in two planes both parallel to the surface of the ocean with the two planes vertically separated from one another by less than one half wavelength of the transmission frequency, and preferably separated by approximately one quarter wavelength of the VLF transmission. The VLF transmitter nodes50in each plane may be spaced less than 1 wavelength apart. The VLF transmitter nodes50are preferably phased to radiate straight downward toward the ocean surface, but not upward away from the ocean surface. In one embodiment, all the VLF transmitter nodes50in a plane begin transmission at the same time; however, transmission from the VLF transmitter nodes50in the lower plane is delayed by an amount such that radiation from the lower plane adds in phase to the radiation from the VLF transmitter nodes50in the upper plane and in the direction of the ocean. In another embodiment, the transmission from the VLF transmitter nodes50in the lower plane is delayed by an amount that cancels radiation in an upward direction toward the ionosphere. When the separation between the two planes is a quarter wavelength of the VLF transmission frequency, these two embodiments are the same, and the time delay between the top and bottom plane is given by (vg*(htop−hbottom)), where vg is a group velocity of an electromagnetic wave in air, htop is a height of the upper plane from the ocean surface, and hbottom is a height of the lower plane from the ocean surface. In another embodiment, this invention includes an array of electrically small VLF transmitter nodes60arranged in a line or plane parallel to the surface of the ocean and supported by satellites61, as shown inFIG.9. In a preferred embodiment, the satellites61are arranged in pairs of small satellites61connected by a tether62, with a dipole antenna placed along the length of the tether. In a preferred embodiment, the tether is conductive and is used as the conductor of the dipole antenna. A variety of satellite and antenna configurations may be used. In this embodiment, antennas24for each node in the array are oriented parallel to the surface of the ocean. VLF transmitter nodes60in the array are spaced roughly one half wavelength from their nearest neighbor and are phased to enhance radiation in the direction of the ocean surface and the coverage area63, while suppressing radiation in other directions. This is accomplished by transmitting from all nodes at the same time with the same phase. In a variation on this embodiment a VLF sensor66is placed on the surface of the ocean within and preferably near a center of a desired coverage area63, as shown in FIG. The sensor66measures a characteristic, e.g. the strength, of the VLF signal generated by the array of VLF transmitter nodes60. Then the sensor66broadcasts, via a radio frequency signal at a noninterfering and different frequency, the characteristic of the measured VLF signal, as described above with reference toFIG.8. This broadcasted signal is then received by each VLF transmitter node60by its communication transceiver22and used as input to on-board adaptive beamforming algorithms operating in the controller14to correct the phasing or timing of a transmission of each VLF transmitter node60in the array and may also be used to adjust the position of the VLF transmitter node60in the array, which may require repositioning one or more satellite pairs61. Having now described the invention in accordance with the requirements of the patent statutes, those skilled in this art will understand how to make changes and modifications to the present invention to meet their specific requirements or conditions. Such changes and modifications may be made without departing from the scope and spirit of the invention as disclosed herein. The foregoing Detailed Description of exemplary and preferred embodiments is presented for purposes of illustration and disclosure in accordance with the requirements of the law. It is not intended to be exhaustive nor to limit the invention to the precise form(s) described, but only to enable others skilled in the art to understand how the invention may be suited for a particular use or implementation. The possibility of modifications and variations will be apparent to practitioners skilled in the art. No limitation is intended by the description of exemplary embodiments which may have included tolerances, feature dimensions, specific operating conditions, engineering specifications, or the like, and which may vary between implementations or with changes to the state of the art, and no limitation should be implied therefrom. Applicant has made this disclosure with respect to the current state of the art, but also contemplates advancements and that adaptations in the future may take into consideration of those advancements, namely in accordance with the then current state of the art. It is intended that the scope of the invention be defined by the Claims as written and equivalents as applicable. Reference to a claim node in the singular is not intended to mean “one and only one” unless explicitly so stated. Moreover, no node, component, nor method or process step in this disclosure is intended to be dedicated to the public regardless of whether the node, component, or step is explicitly recited in the Claims. No claim node herein is to be construed under the provisions of 35 U.S.C. Sec. 112, sixth paragraph, unless the node is expressly recited using the phrase “means for . . . ” and no method or process step herein is to be construed under those provisions unless the step, or steps, are expressly recited using the phrase “comprising the step(s) of . . . ”. | 21,843 |
11942682 | DETAILED DESCRIPTION OF EMBODIMENTS The following detailed description of certain embodiments presents various descriptions of specific embodiments. However, the innovations described herein can be embodied in a multitude of different ways, for example, as defined and covered by the claims. In this description, reference is made to the drawings where like reference numerals can indicate identical or functionally similar elements. It will be understood that elements illustrated in the figures are not necessarily drawn to scale. Moreover, it will be understood that certain embodiments can include more elements than illustrated in a drawing and/or a subset of the elements illustrated in a drawing. Further, some embodiments can incorporate any suitable combination of features from two or more drawings. The International Telecommunication Union (ITU) is a specialized agency of the United Nations (UN) responsible for global issues concerning information and communication technologies, including the shared global use of radio spectrum. The 3rd Generation Partnership Project (3GPP) is a collaboration between groups of telecommunications standard bodies across the world, such as the Association of Radio Industries and Businesses (ARIB), the Telecommunications Technology Committee (TTC), the China Communications Standards Association (CCSA), the Alliance for Telecommunications Industry Solutions (ATIS), the Telecommunications Technology Association (TTA), the European Telecommunications Standards Institute (ETSI), and the Telecommunications Standards Development Society, India (TSDSI). Working within the scope of the ITU, 3GPP develops and maintains technical specifications for a variety of mobile communication technologies, including, for example, second generation (2G) technology (for instance, Global System for Mobile Communications (GSM) and Enhanced Data Rates for GSM Evolution (EDGE)), third generation (3G) technology (for instance, Universal Mobile Telecommunications System (UMTS) and High Speed Packet Access (HSPA)), and fourth generation (4G) technology (for instance, Long Term Evolution (LTE) and LTE-Advanced). The technical specifications controlled by 3GPP can be expanded and revised by specification releases, which can span multiple years and specify a breadth of new features and evolutions. In one example, 3GPP introduced carrier aggregation (CA) for LTE in Release 10. Although initially introduced with two downlink carriers, 3GPP expanded carrier aggregation in Release 14 to include up to five downlink carriers and up to three uplink carriers. Other examples of new features and evolutions provided by 3GPP releases include, but are not limited to, License Assisted Access (LAA), enhanced LAA (eLAA), Narrowband Internet of things (NB-IOT), Vehicle-to-Everything (V2X), and High Power User Equipment (HPUE). 3GPP introduced Phase 1 of fifth generation (5G) technology in Release 15, and introduced Phase 2 of 5G technology in Release 16. Subsequent 3GPP releases will further evolve and expand 5G technology. 5G technology is also referred to herein as 5G New Radio (NR). 5G NR supports or plans to support a variety of features, such as communications over millimeter wave spectrum, beamforming capability, high spectral efficiency waveforms, low latency communications, multiple radio numerology, and/or non-orthogonal multiple access (NOMA). Although such RF functionalities offer flexibility to networks and enhance user data rates, supporting such features can pose a number of technical challenges. The teachings herein are applicable to a wide variety of communication systems, including, but not limited to, communication systems using advanced cellular technologies, such as LTE-Advanced, LTE-Advanced Pro, and/or 5G NR. FIG.1is a schematic diagram of one example of a communication network10. The communication network10includes a macro cell base station1, a small cell base station3, and various examples of user equipment (UE), including a first mobile device2a, a wireless-connected car2b, a laptop2c, a stationary wireless device2d, a wireless-connected train2e, a second mobile device2f, and a third mobile device2g. Although specific examples of base stations and user equipment are illustrated inFIG.1, a communication network can include base stations and user equipment of a wide variety of types and/or numbers. For instance, in the example shown, the communication network10includes the macro cell base station1and the small cell base station3. The small cell base station3can operate with relatively lower power, shorter range, and/or with fewer concurrent users relative to the macro cell base station1. The small cell base station3can also be referred to as a femtocell, a picocell, or a microcell. Although the communication network10is illustrated as including two base stations, the communication network10can be implemented to include more or fewer base stations and/or base stations of other types. Although various examples of user equipment are shown, the teachings herein are applicable to a wide variety of user equipment, including, but not limited to, mobile phones, tablets, laptops, IoT devices, wearable electronics, customer premises equipment (CPE), wireless-connected vehicles, wireless relays, and/or a wide variety of other communication devices. Furthermore, user equipment includes not only currently available communication devices that operate in a cellular network, but also subsequently developed communication devices that will be readily implementable with the inventive systems, processes, methods, and devices as described and claimed herein. The illustrated communication network10ofFIG.1supports communications using a variety of cellular technologies, including, for example, 4G LTE and 5G NR. In certain implementations, the communication network10is further adapted to provide a wireless local area network (WLAN), such as WiFi. Although various examples of communication technologies have been provided, the communication network10can be adapted to support a wide variety of communication technologies. Various communication links of the communication network10have been depicted inFIG.1. The communication links can be duplexed in a wide variety of ways, including, for example, using frequency-division duplexing (FDD) and/or time-division duplexing (TDD). FDD is a type of radio frequency communications that uses different frequencies for transmitting and receiving signals. FDD can provide a number of advantages, such as high data rates and low latency. In contrast, TDD is a type of radio frequency communications that uses about the same frequency for transmitting and receiving signals, and in which transmit and receive communications are switched in time. TDD can provide a number of advantages, such as efficient use of spectrum and variable allocation of throughput between transmit and receive directions. In certain implementations, user equipment can communicate with a base station using one or more of 4G LTE, 5G NR, and WiFi technologies. In certain implementations, enhanced license assisted access (eLAA) is used to aggregate one or more licensed frequency carriers (for instance, licensed 4G LTE and/or 5G NR frequencies), with one or more unlicensed carriers (for instance, unlicensed WiFi frequencies). As shown inFIG.1, the communication links include not only communication links between UE and base stations, but also UE to UE communications and base station to base station communications. For example, the communication network10can be implemented to support self-fronthaul and/or self-backhaul (for instance, as between mobile device2gand mobile device2f). The communication links can operate over a wide variety of frequencies. In certain implementations, communications are supported using 5G NR technology over one or more frequency bands that are less than 6 Gigahertz (GHz) and/or over one or more frequency bands that are greater than 6 GHz. For example, the communication links can serve Frequency Range 1 (FR1), Frequency Range 2 (FR2), or a combination thereof. In one embodiment, one or more of the mobile devices support a HPUE power class specification. In certain implementations, a base station and/or user equipment communicates using beamforming. For example, beamforming can be used to focus signal strength to overcome path losses, such as high loss associated with communicating over high signal frequencies. In certain embodiments, user equipment, such as one or more mobile phones, communicate using beamforming on millimeter wave frequency bands in the range of 30 GHz to 300 GHz and/or upper centimeter wave frequencies in the range of 6 GHz to 30 GHz, or more particularly, 24 GHz to 30 GHz. Cellular user equipment can communicate using beamforming and/or other techniques over a wide range of frequencies, including, for example, FR2-1 (24 GHz to 52 GHz), FR2-2 (52 GHz to 71 GHz), and/or FR1 (400 MHz to 7125 MHz). Different users of the communication network10can share available network resources, such as available frequency spectrum, in a wide variety of ways. In one example, frequency division multiple access (FDMA) is used to divide a frequency band into multiple frequency carriers. Additionally, one or more carriers are allocated to a particular user. Examples of FDMA include, but are not limited to, single carrier FDMA (SC-FDMA) and orthogonal FDMA (OFDMA). OFDMA is a multicarrier technology that subdivides the available bandwidth into multiple mutually orthogonal narrowband subcarriers, which can be separately assigned to different users. Other examples of shared access include, but are not limited to, time division multiple access (TDMA) in which a user is allocated particular time slots for using a frequency resource, code division multiple access (CDMA) in which a frequency resource is shared amongst different users by assigning each user a unique code, space-divisional multiple access (SDMA) in which beamforming is used to provide shared access by spatial division, and non-orthogonal multiple access (NOMA) in which the power domain is used for multiple access. For example, NOMA can be used to serve multiple users at the same frequency, time, and/or code, but with different power levels. Enhanced mobile broadband (eMBB) refers to technology for growing system capacity of LTE networks. For example, eMBB can refer to communications with a peak data rate of at least 10 Gbps and a minimum of 100 Mbps for each user. Ultra-reliable low latency communications (uRLLC) refers to technology for communication with very low latency, for instance, less than 2 milliseconds. uRLLC can be used for mission-critical communications such as for autonomous driving and/or remote surgery applications. Massive machine-type communications (mMTC) refers to low cost and low data rate communications associated with wireless connections to everyday objects, such as those associated with Internet of Things (IoT) applications. The communication network10ofFIG.1can be used to support a wide variety of advanced communication features, including, but not limited to, eMBB, uRLLC, and/or mMTC. FIG.2Ais a schematic diagram of one example of a communication link using carrier aggregation. Carrier aggregation can be used to widen bandwidth of the communication link by supporting communications over multiple frequency carriers, thereby increasing user data rates and enhancing network capacity by utilizing fragmented spectrum allocations. In the illustrated example, the communication link is provided between a base station21and a mobile device22. As shown inFIG.2A, the communications link includes a downlink channel used for RF communications from the base station21to the mobile device22, and an uplink channel used for RF communications from the mobile device22to the base station21. AlthoughFIG.2Aillustrates carrier aggregation in the context of FDD communications, carrier aggregation can also be used for TDD communications. In certain implementations, a communication link can provide asymmetrical data rates for a downlink channel and an uplink channel. For example, a communication link can be used to support a relatively high downlink data rate to enable high speed streaming of multimedia content to a mobile device, while providing a relatively slower data rate for uploading data from the mobile device to the cloud. In the illustrated example, the base station21and the mobile device22communicate via carrier aggregation, which can be used to selectively increase bandwidth of the communication link. Carrier aggregation includes contiguous aggregation, in which contiguous carriers within the same operating frequency band are aggregated. Carrier aggregation can also be non-contiguous, and can include carriers separated in frequency within a common band or in different bands. In the example shown inFIG.2A, the uplink channel includes three aggregated component carriers fUL1, fUL2, and fUL3. Additionally, the downlink channel includes five aggregated component carriers fDL1, fDL2, fDL3, fDL4, and fDL5. Although one example of component carrier aggregation is shown, more or fewer carriers can be aggregated for uplink and/or downlink. Moreover, a number of aggregated carriers can be varied over time to achieve desired uplink and downlink data rates. For example, a number of aggregated carriers for uplink and/or downlink communications with respect to a particular mobile device can change over time. For example, the number of aggregated carriers can change as the device moves through the communication network and/or as network usage changes over time. FIG.2Billustrates various examples of uplink carrier aggregation for the communication link ofFIG.2A.FIG.2Bincludes a first carrier aggregation scenario31, a second carrier aggregation scenario32, and a third carrier aggregation scenario33, which schematically depict three types of carrier aggregation. The carrier aggregation scenarios31-33illustrate different spectrum allocations for a first component carrier fUL1, a second component carrier fUL2, and a third component carrier fUL3. AlthoughFIG.2Bis illustrated in the context of aggregating three component carriers, carrier aggregation can be used to aggregate more or fewer carriers. Moreover, although illustrated in the context of uplink, the aggregation scenarios are also applicable to downlink. The first carrier aggregation scenario31illustrates intra-band contiguous carrier aggregation, in which component carriers that are adjacent in frequency and in a common frequency band are aggregated. For example, the first carrier aggregation scenario31depicts aggregation of component carriers fUL1, fUL2, and fUL3that are contiguous and located within a first frequency band BAND1. With continuing reference toFIG.2B, the second carrier aggregation scenario32illustrates intra-band non-continuous carrier aggregation, in which two or more components carriers that are non-adjacent in frequency and within a common frequency band are aggregated. For example, the second carrier aggregation scenario32depicts aggregation of component carriers fUL1, fUL2, and fUL3that are non-contiguous, but located within a first frequency band BAND1. The third carrier aggregation scenario33illustrates inter-band non-contiguous carrier aggregation, in which component carriers that are non-adjacent in frequency and in multiple frequency bands are aggregated. For example, the third carrier aggregation scenario33depicts aggregation of component carriers fUL1and fUL2of a first frequency band BAND1with component carrier fUL3of a second frequency band BAND2. FIG.2Cillustrates various examples of downlink carrier aggregation for the communication link ofFIG.2A. The examples depict various carrier aggregation scenarios34-38for different spectrum allocations of a first component carrier fDL1, a second component carrier fDL2, a third component carrier fDL3, a fourth component carrier fDL4, and a fifth component carrier fDL5. AlthoughFIG.2Cis illustrated in the context of aggregating five component carriers, carrier aggregation can be used to aggregate more or fewer carriers. Moreover, although illustrated in the context of downlink, the aggregation scenarios are also applicable to uplink. The first carrier aggregation scenario34depicts aggregation of component carriers that are contiguous and located within the same frequency band. Additionally, the second carrier aggregation scenario35and the third carrier aggregation scenario36illustrates two examples of aggregation that are non-contiguous, but located within the same frequency band. Furthermore, the fourth carrier aggregation scenario37and the fifth carrier aggregation scenario38illustrates two examples of aggregation in which component carriers that are non-adjacent in frequency and in multiple frequency bands are aggregated. As a number of aggregated component carriers increases, a complexity of possible carrier aggregation scenarios also increases. With reference toFIGS.2A-2C, the individual component carriers used in carrier aggregation can be of a variety of frequencies, including, for example, frequency carriers in the same band or in multiple bands. Additionally, carrier aggregation is applicable to implementations in which the individual component carriers are of about the same bandwidth as well as to implementations in which the individual component carriers have different bandwidths. Certain communication networks allocate a particular user device with a primary component carrier (PCC) or anchor carrier for uplink and a PCC for downlink. Additionally, when the mobile device communicates using a single frequency carrier for uplink or downlink, the user device communicates using the PCC. To enhance bandwidth for uplink communications, the uplink PCC can be aggregated with one or more uplink secondary component carriers (SCCs). Additionally, to enhance bandwidth for downlink communications, the downlink PCC can be aggregated with one or more downlink SCCs. In certain implementations, a communication network provides a network cell for each component carrier. Additionally, a primary cell can operate using a PCC, while a secondary cell can operate using a SCC. The primary and secondary cells may have different coverage areas, for instance, due to differences in frequencies of carriers and/or network environment. License assisted access (LAA) refers to downlink carrier aggregation in which a licensed frequency carrier associated with a mobile operator is aggregated with a frequency carrier in unlicensed spectrum, such as WiFi. LAA employs a downlink PCC in the licensed spectrum that carries control and signaling information associated with the communication link, while unlicensed spectrum is aggregated for wider downlink bandwidth when available. LAA can operate with dynamic adjustment of secondary carriers to avoid WiFi users and/or to coexist with WiFi users. Enhanced license assisted access (eLAA) refers to an evolution of LAA that aggregates licensed and unlicensed spectrum for both downlink and uplink. Furthermore, NR-U can operate on top of LAA/eLAA over a 5 GHz band (5150 to 5925 MHz) and/or a 6 GHz band (5925 MHz to 7125 MHz). FIG.3Ais a schematic diagram of one example of a downlink channel using multi-input and multi-output (MIMO) communications.FIG.3Bis schematic diagram of one example of an uplink channel using MIMO communications. MIMO communications use multiple antennas for simultaneously communicating multiple data streams over common frequency spectrum. In certain implementations, the data streams operate with different reference signals to enhance data reception at the receiver. MIMO communications benefit from higher SNR, improved coding, and/or reduced signal interference due to spatial multiplexing differences of the radio environment. MIMO order refers to a number of separate data streams sent or received. For instance, MIMO order for downlink communications can be described by a number of transmit antennas of a base station and a number of receive antennas for UE, such as a mobile device. For example, two-by-two (2×2) DL MIMO refers to MIMO downlink communications using two base station antennas and two UE antennas. Additionally, four-by-four (4×4) DL MIMO refers to MIMO downlink communications using four base station antennas and four UE antennas. In the example shown inFIG.3A, downlink MIMO communications are provided by transmitting using M antennas43a,43b,43c, . . .43mof the base station41and receiving using N antennas44a,44b,44c, . . .44nof the mobile device42. Accordingly,FIG.3Aillustrates an example of m×n DL MIMO. Likewise, MIMO order for uplink communications can be described by a number of transmit antennas of UE, such as a mobile device, and a number of receive antennas of a base station. For example, 2×2 UL MIMO refers to MIMO uplink communications using two UE antennas and two base station antennas. Additionally, 4×4 UL MIMO refers to MIMO uplink communications using four UE antennas and four base station antennas. In the example shown inFIG.3B, uplink MIMO communications are provided by transmitting using N antennas44a,44b,44c, . . .44nof the mobile device42and receiving using M antennas43a,43b,43c, . . .43mof the base station41. Accordingly,FIG.3Billustrates an example of n×m UL MIMO. By increasing the level or order of MIMO, bandwidth of an uplink channel and/or a downlink channel can be increased. MIMO communications are applicable to communication links of a variety of types, such as FDD communication links and TDD communication links. FIG.3Cis schematic diagram of another example of an uplink channel using MIMO communications. In the example shown inFIG.3C, uplink MIMO communications are provided by transmitting using N antennas44a,44b,44c, . . .44nof the mobile device42. Additional a first portion of the uplink transmissions are received using M antennas43a1,43b1,43c1, . . .43m1of a first base station41a, while a second portion of the uplink transmissions are received using M antennas43a2,43b2,43c2, . . .43m2of a second base station41b. Additionally, the first base station41aand the second base station41bcommunication with one another over wired, optical, and/or wireless links. The MIMO scenario ofFIG.3Cillustrates an example in which multiple base stations cooperate to facilitate MIMO communications. FIG.4Ais a schematic diagram of one example of a communication system110that operates with beamforming. The communication system110includes a transceiver105, signal conditioning circuits104a1,104a2. . .104an,104b1,104b2. . .104bn,104m1,104m2. . .104mn, and an antenna array102that includes antenna elements103a1,103a2. . .103an,103b1,103b2. . .103bn,103m1,103m2. . .103mn. Communications systems that communicate using millimeter wave carriers (for instance, 30 GHz to 300 GHz), centimeter wave carriers (for instance, 3 GHz to 30 GHz), and/or other frequency carriers can employ an antenna array to provide beam formation and directivity for transmission and/or reception of signals. For example, in the illustrated embodiment, the communication system110includes an array102of m×n antenna elements, which are each controlled by a separate signal conditioning circuit, in this embodiment. As indicated by the ellipses, the communication system110can be implemented with any suitable number of antenna elements and signal conditioning circuits. With respect to signal transmission, the signal conditioning circuits can provide transmit signals to the antenna array102such that signals radiated from the antenna elements combine using constructive and destructive interference to generate an aggregate transmit signal exhibiting beam-like qualities with more signal strength propagating in a given direction away from the antenna array102. In the context of signal reception, the signal conditioning circuits process the received signals (for instance, by separately controlling received signal phases) such that more signal energy is received when the signal is arriving at the antenna array102from a particular direction. Accordingly, the communication system110also provides directivity for reception of signals. The relative concentration of signal energy into a transmit beam or a receive beam can be enhanced by increasing the size of the array. For example, with more signal energy focused into a transmit beam, the signal is able to propagate for a longer range while providing sufficient signal level for RF communications. For instance, a signal with a large proportion of signal energy focused into the transmit beam can exhibit high effective isotropic radiated power (EIRP). In the illustrated embodiment, the transceiver105provides transmit signals to the signal conditioning circuits and processes signals received from the signal conditioning circuits. As shown inFIG.4A, the transceiver105generates control signals for the signal conditioning circuits. The control signals can be used for a variety of functions, such as controlling the gain and phase of transmitted and/or received signals to control beamforming. FIG.4Bis a schematic diagram of one example of beamforming to provide a transmit beam.FIG.4Billustrates a portion of a communication system including a first signal conditioning circuit114a, a second signal conditioning circuit114b, a first antenna element113a, and a second antenna element113b. Although illustrated as included two antenna elements and two signal conditioning circuits, a communication system can include additional antenna elements and/or signal conditioning circuits. For example,FIG.4Billustrates one embodiment of a portion of the communication system110ofFIG.4A. The first signal conditioning circuit114aincludes a first phase shifter130a, a first power amplifier131a, a first low noise amplifier (LNA)132a, and switches for controlling selection of the power amplifier131aor LNA132a. Additionally, the second signal conditioning circuit114bincludes a second phase shifter130b, a second power amplifier131b, a second LNA132b, and switches for controlling selection of the power amplifier131bor LNA132b. Although one embodiment of signal conditioning circuits is shown, other implementations of signal conditioning circuits are possible. For instance, in one example, a signal conditioning circuit includes one or more band filters, duplexers, and/or other components. In the illustrated embodiment, the first antenna element113aand the second antenna element113bare separated by a distance d. Additionally,FIG.4Bhas been annotated with an angle θ, which in this example has a value of about 90° when the transmit beam direction is substantially perpendicular to a plane of the antenna array and a value of about 0° when the transmit beam direction is substantially parallel to the plane of the antenna array. By controlling the relative phase of the transmit signals provided to the antenna elements113a,113b, a desired transmit beam angle θ can be achieved. For example, when the first phase shifter130ahas a reference value of 0°, the second phase shifter130bcan be controlled to provide a phase shift of about −2πf(d/v) cos θ radians, where f is the fundamental frequency of the transmit signal, d is the distance between the antenna elements, v is the velocity of the radiated wave, and π is the mathematic constant pi. In certain implementations, the distance d is implemented to be about ½ λ, where λ, is the wavelength of the fundamental component of the transmit signal. In such implementations, the second phase shifter130bcan be controlled to provide a phase shift of about −π cos θ radians to achieve a transmit beam angle θ. Accordingly, the relative phase of the phase shifters130a,130bcan be controlled to provide transmit beamforming. In certain implementations, a baseband processor and/or a transceiver (for example, the transceiver105ofFIG.4A) controls phase values of one or more phase shifters and gain values of one or more controllable amplifiers to control beamforming. FIG.4Cis a schematic diagram of one example of beamforming to provide a receive beam.FIG.4Cis similar toFIG.4B, except thatFIG.4Cillustrates beamforming in the context of a receive beam rather than a transmit beam. As shown inFIG.4C, a relative phase difference between the first phase shifter130aand the second phase shifter130bcan be selected to about equal to −2πf(d/v) cos θ radians to achieve a desired receive beam angle θ. In implementations in which the distance d corresponds to about ½ λ, the phase difference can be selected to about equal to − cos θ radians to achieve a receive beam angle θ. Although various equations for phase values to provide beamforming have been provided, other phase selection values are possible, such as phase values selected based on implementation of an antenna array, implementation of signal conditioning circuits, and/or a radio environment. FIG.5Ais a schematic diagram of another embodiment of a communication system129that operates with beamforming. The communication system129includes signal conditioning circuits120a,120b. . .120n, an antenna array121, and a control circuit124. As shown inFIG.5A, the antenna array121includes stencils122a,122b, . . .122nand electrical adjustment circuits123a,123b, . . .123n. In the illustrated embodiment, the control circuit124provides separate control signals to each of the electrical adjustment circuits123a,123b, . . .123n, which in turn control the patterning of the stencils122a,122b, . . .122n, respectively. By electrically adjusting the stencils122a,122b, . . .122n, an antenna pattern used by each of the signal conditioning circuits120a,120b, . . .120nis controlled. The antenna patterns can be the same or different for each of the stencils122a,122b, . . .122n. For example, the control signals from the control circuit124can be used to provide channel specific adjustment for variation (for instance, arising from manufacturing or operating conditions) and/or to change the antenna pattern to control beam formation. Additionally or alternatively, the control signals can be based on operating frequency. In certain implementations, the electrical adjustment circuits123a,123b, . . .123ncontrol the electrical potential at different points along the stencils122a,122b, . . .122n, thereby controlling the antenna pattern of each stencil. In one embodiment, the stencils122a,122b, . . .122ninclude conductive ink125a,125b, . . .125nthat is guided/controlled by the electrical adjustment circuits123a,123b, . . .123nto achieve a desired antenna pattern for a given stencil. With a given pattern antenna pattern and shape for each antenna, the radiative qualities of the antenna array121can be controlled and the resulting transmit beam and/or receive beam can be correspondingly controlled. For example, the bore sight beam width or side lobes generated can be managed by virtue of control over the resulting pattern of antennas and/or the shape of each antenna within the pattern. In certain embodiments, the antenna system129is used for beamforming. Such beamforming can be on FR2 frequencies, such as FR2-1 (24 GHz to 52 GHz) and FR2-2 (52 GHz to 71 GHz). Table 1 below depicts various examples of 5G FR2 frequency bands, and correspond to example frequency bands for the RF signals transmitted or received by the antenna system129. TABLE 15G FrequencyBand DuplexUL/DL LowUL/DL HighBandType[MHz][MHz]n257TDD2650029500n258TDD2425027500n259TDD3950043500n260TDD3700040000n261TDD2750028350n262TDD4720048200n263TDD5700071000 In the illustrated embodiment, each of the stencils122a,122b, . . .122nis independently controllable by the control circuit124. Thus, the shape of each antenna in the antenna array121can be separately set as desired for beamforming. FIG.5Bis a schematic diagram of another embodiment of a communication system129′ that operates with beamforming. The communication system129′ ofFIG.5Bis similar to the communication system129ofFIG.5A, except that the communication system129′ includes a control circuit124′ that collectively controls the stencils122a,122b, . . .122n. Thus, the shape of each antenna in the antenna array121is commonly controlled in this embodiment. FIG.5Cis a schematic diagram of another embodiment of a communication system129″ that operates with beamforming. The communication system129″ ofFIG.5Cis similar to the communication system129ofFIG.5A, except that the communication system129″ includes a specific implementation of signal conditioning circuits120a′,120b′, . . .120n′. As shown inFIG.5C, the signal conditioning circuits120a′,120b′, . . .120n′ include power amplifiers133a,133b, . . .133n, low noise amplifiers134a,134b, . . .134n, transmit/receive (T/R) switches135a,135b, . . .135n, and gain and phase adjustment circuits136a,136b, . . .136n. The T/R switches135a,135b, . . .135nconnect the outputs of the power amplifiers133a,133b, . . .133nor the inputs of the low noise amplifiers134a,134b, . . .134nto the antennas formed by the stencils122a,122b, . . .122n, respectively. Thus, the antenna array121is used for both transmit and receive, in this embodiment. The gain and phase adjustment circuits136a,136b, . . .136nprovide channel-specific gain and phase adjustments for beamforming. The control circuit124″ ofFIG.5Ccontrols both the gain/phase settings for beamforming and the antenna pattern set by the stencils122a,122b, . . .122n. FIG.6Ais a perspective view of one embodiment of a module140that operates with beamforming.FIG.6Bis a cross-section of the module140ofFIG.6Ataken along the lines6B-6B. The module140includes a laminated substrate or laminate141, a semiconductor die or IC142, surface mount components143, and an antenna array including antenna elements151-166, each of which can be implemented as an electrically-adjustable stencil in accordance with the teachings herein. Although one embodiment of a module is shown inFIGS.6A and6B, the teachings herein are applicable to modules implemented in a wide variety of ways. For example, a module can include a different arrangement of and/or number of antenna elements, dies, and/or surface mount components. Additionally, the module140can include additional structures and components including, but not limited to, encapsulation structures, shielding structures, and/or wirebonds. In the illustrated embodiment, the antenna elements151-166are formed on a first surface of the laminate141, and can be used to transmit and/or receive signals. Although a 4×4 array of antenna elements is shown, more or fewer antenna elements can be provided. Moreover, antenna elements can be arrayed in other patterns or configurations. Furthermore, in another embodiment, multiple antenna arrays are provided, such as separate antenna arrays for transmit and receive and/or multiple antenna arrays for MIMO and/or switched diversity. In certain implementations, the antenna elements151-166are implemented as antenna stencils in accordance with the teachings herein. In the illustrated embodiment, the IC142and the surface mount components143are on a second surface of the laminate141opposite the first surface. In certain implementations, the IC142includes signal conditioning circuits associated with the antenna elements151-166and a control circuit for controlling the antenna elements151-166. In one embodiment, the IC142includes a serial interface, such as a mobile industry processor interface radio frequency front-end (MIPI RFFE) bus and/or inter-integrated circuit (I2C) bus that receives data for controlling the signal conditioning circuits, such as the amount of phase shifting provided by phase shifters. In another embodiment, the IC142includes signal conditioning circuits associated with the antenna elements151-166and an integrated transceiver. The laminate141can be implemented in a variety of ways, and can include for example, conductive layers, dielectric layers, solder masks, and/or other structures. The number of layers, layer thicknesses, and materials used to form the layers can be selected based on a wide variety of factors, which can vary with application. The laminate141can include vias for providing electrical connections to signal feeds and/or ground feeds of the antenna elements151-166. For example, in certain implementations, vias can aid in providing electrical connections between signaling conditioning circuits of the IC142and corresponding antenna elements. The module140can be included in a communication system, such as a mobile phone or base station. In one example, the module140is attached to a phone board of a mobile phone. FIG.7is a schematic diagram of one embodiment of a mobile device800. The mobile device800includes a baseband system801, a transceiver802, a front end system803, antennas804, a power management system805, a memory806, a user interface807, and a battery808. The mobile device800can be used communicate using a wide variety of communications technologies, including, but not limited to, 2G, 3G, 4G (including LTE, LTE-Advanced, and LTE-Advanced Pro), 5G NR, WLAN (for instance, WiFi), WPAN (for instance, Bluetooth and ZigBee), WMAN (for instance, WiMax), and/or GPS technologies. The transceiver802generates RF signals for transmission and processes incoming RF signals received from the antennas804. It will be understood that various functionalities associated with the transmission and receiving of RF signals can be achieved by one or more components that are collectively represented inFIG.7as the transceiver802. In one example, separate components (for instance, separate circuits or dies) can be provided for handling certain types of RF signals. The front end system803aids in conditioning signals transmitted to and/or received from the antennas804. In the illustrated embodiment, the front end system803includes antenna tuning circuitry810, power amplifiers (PAs)811, low noise amplifiers (LNAs)812, filters813, switches814, and signal splitting/combining circuitry815. However, other implementations are possible. For example, the front end system803can provide a number of functionalities, including, but not limited to, amplifying signals for transmission, amplifying received signals, filtering signals, switching between different bands, switching between different power modes, switching between transmission and receiving modes, duplexing of signals, multiplexing of signals (for instance, diplexing or triplexing), or some combination thereof. In certain implementations, the mobile device800supports carrier aggregation, thereby providing flexibility to increase peak data rates. Carrier aggregation can be used for both Frequency Division Duplexing (FDD) and Time Division Duplexing (TDD), and may be used to aggregate a plurality of carriers or channels. Carrier aggregation includes contiguous aggregation, in which contiguous carriers within the same operating frequency band are aggregated. Carrier aggregation can also be non-contiguous, and can include carriers separated in frequency within a common band or in different bands. The antennas804can include antennas used for a wide variety of types of communications. For example, the antennas804can include antennas for transmitting and/or receiving signals associated with a wide variety of frequencies and communications standards. In certain implementations, the antennas804support MIMO communications and/or switched diversity communications. For example, MIMO communications use multiple antennas for communicating multiple data streams over a single radio frequency channel. MIMO communications benefit from higher signal to noise ratio, improved coding, and/or reduced signal interference due to spatial multiplexing differences of the radio environment. Switched diversity refers to communications in which a particular antenna is selected for operation at a particular time. For example, a switch can be used to select a particular antenna from a group of antennas based on a variety of factors, such as an observed bit error rate and/or a signal strength indicator. The mobile device800can operate with beamforming in certain implementations. For example, the front end system803can include amplifiers having controllable gain and phase shifters having controllable phase to provide beam formation and directivity for transmission and/or reception of signals using the antennas804. For example, in the context of signal transmission, the amplitude and phases of the transmit signals provided to the antennas804are controlled such that radiated signals from the antennas804combine using constructive and destructive interference to generate an aggregate transmit signal exhibiting beam-like qualities with more signal strength propagating in a given direction. In the context of signal reception, the amplitude and phases are controlled such that more signal energy is received when the signal is arriving to the antennas804from a particular direction. In certain implementations, the antennas804include one or more arrays of antenna elements to enhance beamforming. The baseband system801is coupled to the user interface807to facilitate processing of various user input and output (I/O), such as voice and data. The baseband system801provides the transceiver802with digital representations of transmit signals, which the transceiver802processes to generate RF signals for transmission. The baseband system801also processes digital representations of received signals provided by the transceiver802. As shown inFIG.7, the baseband system801is coupled to the memory806of facilitate operation of the mobile device800. The memory806can be used for a wide variety of purposes, such as storing data and/or instructions to facilitate the operation of the mobile device800and/or to provide storage of user information. The power management system805provides a number of power management functions of the mobile device800. In certain implementations, the power management system805includes a PA supply control circuit that controls the supply voltages of the power amplifiers811. For example, the power management system805can be configured to change the supply voltage(s) provided to one or more of the power amplifiers811to improve efficiency, such as power added efficiency (PAE). As shown inFIG.7, the power management system805receives a battery voltage from the battery808. The battery808can be any suitable battery for use in the mobile device800, including, for example, a lithium-ion battery. FIG.8is a schematic diagram of a power amplifier system860according to another embodiment. The illustrated power amplifier system860includes a baseband processor841, a transmitter/observation receiver842, a power amplifier (PA)843, a directional coupler844, front-end circuitry845, an antenna846, a PA bias control circuit847, and a PA supply control circuit848. The illustrated transmitter/observation receiver842includes an I/Q modulator857, a mixer858, and an analog-to-digital converter (ADC)859. In certain implementations, the transmitter/observation receiver842is incorporated into a transceiver. The baseband processor841can be used to generate an in-phase (I) signal and a quadrature-phase (Q) signal, which can be used to represent a sinusoidal wave or signal of a desired amplitude, frequency, and phase. For example, the I signal can be used to represent an in-phase component of the sinusoidal wave and the Q signal can be used to represent a quadrature-phase component of the sinusoidal wave, which can be an equivalent representation of the sinusoidal wave. In certain implementations, the I and Q signals can be provided to the I/Q modulator857in a digital format. The baseband processor841can be any suitable processor configured to process a baseband signal. For instance, the baseband processor841can include a digital signal processor, a microprocessor, a programmable core, or any combination thereof. Moreover, in some implementations, two or more baseband processors841can be included in the power amplifier system860. The I/Q modulator857can be configured to receive the I and Q signals from the baseband processor841and to process the I and Q signals to generate an RF signal. For example, the I/Q modulator857can include digital-to-analog converters (DACs) configured to convert the I and Q signals into an analog format, mixers for upconverting the I and Q signals to RF, and a signal combiner for combining the upconverted I and Q signals into an RF signal suitable for amplification by the power amplifier843. In certain implementations, the I/Q modulator857can include one or more filters configured to filter frequency content of signals processed therein. The power amplifier843can receive the RF signal from the I/Q modulator857, and when enabled can provide an amplified RF signal to the antenna846via the front-end circuitry845. The front-end circuitry845can be implemented in a wide variety of ways. In one example, the front-end circuitry845includes one or more switches, filters, duplexers, multiplexers, and/or other components. In another example, the front-end circuitry845is omitted in favor of the power amplifier843providing the amplified RF signal directly to the antenna846. The directional coupler844senses an output signal of the power amplifier823. Additionally, the sensed output signal from the directional coupler844is provided to the mixer858, which multiplies the sensed output signal by a reference signal of a controlled frequency. The mixer858operates to generate a downshifted signal by downshifting the sensed output signal's frequency content. The downshifted signal can be provided to the ADC859, which can convert the downshifted signal to a digital format suitable for processing by the baseband processor841. Including a feedback path from the output of the power amplifier843to the baseband processor841can provide a number of advantages. For example, implementing the baseband processor841in this manner can aid in providing power control, compensating for transmitter impairments, and/or in performing digital pre-distortion (DPD). Although one example of a sensing path for a power amplifier is shown, other implementations are possible. The PA supply control circuit848receives a power control signal from the baseband processor841, and controls supply voltages of the power amplifier843. In the illustrated configuration, the PA supply control circuit848generates a first supply voltage VCC1for powering an input stage of the power amplifier843and a second supply voltage VCC2for powering an output stage of the power amplifier843. The PA supply control circuit848can control the voltage level of the first supply voltage VCC1and/or the second supply voltage VCC2to enhance the power amplifier system's PAE. The PA supply control circuit848can employ various power management techniques to change the voltage level of one or more of the supply voltages over time to improve the power amplifier's power added efficiency (PAE), thereby reducing power dissipation. One technique for improving efficiency of a power amplifier is average power tracking (APT), in which a DC-to-DC converter is used to generate a supply voltage for a power amplifier based on the power amplifier's average output power. Another technique for improving efficiency of a power amplifier is envelope tracking (ET), in which a supply voltage of the power amplifier is controlled in relation to the envelope of the RF signal. Thus, when a voltage level of the envelope of the RF signal increases the voltage level of the power amplifier's supply voltage can be increased. Likewise, when the voltage level of the envelope of the RF signal decreases the voltage level of the power amplifier's supply voltage can be decreased to reduce power consumption. In certain configurations, the PA supply control circuit848is a multi-mode supply control circuit that can operate in multiple supply control modes including an APT mode and an ET mode. For example, the power control signal from the baseband processor841can instruct the PA supply control circuit848to operate in a particular supply control mode. As shown inFIG.8, the PA bias control circuit847receives a bias control signal from the baseband processor841, and generates bias control signals for the power amplifier843. In the illustrated configuration, the bias control circuit847generates bias control signals for both an input stage of the power amplifier843and an output stage of the power amplifier843. However, other implementations are possible. Applications Some of the embodiments described above have provided examples in connection with wireless devices or mobile phones. However, the principles and advantages of the embodiments can be used for any other systems or apparatus that have needs for antenna systems. Such antenna systems can be implemented in various electronic devices. Examples of the electronic devices can include, but are not limited to, consumer electronic products, parts of the consumer electronic products, electronic test equipment, etc. Examples of the electronic devices can also include, but are not limited to, memory chips, memory modules, circuits of optical networks or other communication networks, and disk driver circuits. The consumer electronic products can include, but are not limited to, a mobile phone, a telephone, a television, a computer monitor, a computer, a hand-held computer, a personal digital assistant (PDA), a microwave, a refrigerator, an automobile, a stereo system, a cassette recorder or player, a DVD player, a CD player, a VCR, an MP3 player, a radio, a camcorder, a camera, a digital camera, a portable memory chip, a washer, a dryer, a washer/dryer, a copier, a facsimile machine, a scanner, a multi-functional peripheral device, a wrist watch, a clock, etc. Further, the electronic devices can include unfinished products. CONCLUSION Unless the context clearly requires otherwise, throughout the description and the claims, the words “comprise,” “comprising,” and the like are to be construed in an inclusive sense, as opposed to an exclusive or exhaustive sense; that is to say, in the sense of “including, but not limited to.” The word “coupled”, as generally used herein, refers to two or more elements that may be either directly connected, or connected by way of one or more intermediate elements. Likewise, the word “connected”, as generally used herein, refers to two or more elements that may be either directly connected, or connected by way of one or more intermediate elements. Additionally, the words “herein,” “above,” “below,” and words of similar import, when used in this application, shall refer to this application as a whole and not to any particular portions of this application. Where the context permits, words in the above Detailed Description using the singular or plural number may also include the plural or singular number respectively. The word “or” in reference to a list of two or more items, that word covers all of the following interpretations of the word: any of the items in the list, all of the items in the list, and any combination of the items in the list. Moreover, conditional language used herein, such as, among others, “may,” “could,” “might,” “can,” “e.g.,” “for example,” “such as” and the like, unless specifically stated otherwise, or otherwise understood within the context as used, is generally intended to convey that certain embodiments include, while other embodiments do not include, certain features, elements and/or states. Thus, such conditional language is not generally intended to imply that features, elements and/or states are in any way required for one or more embodiments or that one or more embodiments necessarily include logic for deciding, with or without author input or prompting, whether these features, elements and/or states are included or are to be performed in any particular embodiment. The above detailed description of embodiments of the invention is not intended to be exhaustive or to limit the invention to the precise form disclosed above. While specific embodiments of, and examples for, the invention are described above for illustrative purposes, various equivalent modifications are possible within the scope of the invention, as those skilled in the relevant art will recognize. For example, while processes or blocks are presented in a given order, alternative embodiments may perform routines having steps, or employ systems having blocks, in a different order, and some processes or blocks may be deleted, moved, added, subdivided, combined, and/or modified. Each of these processes or blocks may be implemented in a variety of different ways. Also, while processes or blocks are at times shown as being performed in series, these processes or blocks may instead be performed in parallel, or may be performed at different times. The teachings of the invention provided herein can be applied to other systems, not necessarily the system described above. The elements and acts of the various embodiments described above can be combined to provide further embodiments. While certain embodiments of the inventions have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the disclosure. Indeed, the novel methods and systems described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the methods and systems described herein may be made without departing from the spirit of the disclosure. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the disclosure. | 53,923 |
11942684 | When practical, similar reference numbers denote similar structures, features, or elements. DETAILED DESCRIPTION In some implementations, a system and method utilizes omni-directional antennas at both the donor and server sides. Increased isolation is obtained by using additional degrees of freedom in the antenna design to maximize isolation. For example, in some implementations, at the donor side, a system uses a vertically polarized omni-directional antenna. Additionally or alternately, at the server side, the system can deploy two antennas, one with vertical polarization and one with horizontal polarization. The system can then automatically determine which of the polarizations will yield the biggest isolation and therefore the best system gain. The degrees of freedom that can be utilized are not limited to polarization. Other orthogonal options may be used as well. For example, the donor and server antennas could each have multiple orthogonal beam patterns such as the beam patterns that can be achieved using a circular array antenna. The system could then search through all the combinations of donor and server antenna patterns to find the one that will yield the biggest isolation between donor and server and therefore the highest system gain. In addition to the isolation, other cost functions may also be used to optimize the antennas used. For example, a cost function to maximize the output power level at the server antenna can be used. In this case, the cost function will take into account the isolation between the donor and server antennas as well as the signal strength of a particular base station. The optimization may be performed in two stages, where the donor antenna subsystem is first optimized to provide the strongest input signal level and then the server antenna is optimized to achieve maximum isolation. The combination of maximum isolation plus maximum input signal could yield the highest output power at the server antenna. Alternatively, the input signal level and isolation may be jointly optimized to achieve the same effect. As an alternative to isolation and server antenna output power, the system may use a cost function that optimizes the signal-to-noise ratio of the signal at the output of the server antenna. In this case, the donor antenna sub-system will include a cost function that will adapt the antennas to null out interfering base stations. This action will improve the signal to noise ratio of the donor signal. The server antenna can then be adapted to optimize the isolation to provide maximum coverage of the best quality donor signal from the server antenna. In this type of cost function implementation the active multimode antenna (“modal antenna”) provides an optimal antenna solution where radiation modes are selected for the donor antenna to maximize signal strength from a desired base station or SINR to minimize interference from other base stations while the radiation modes of the modal antenna used for the server antenna can be selected to optimize isolation between donor and server antennas. FIG.1shows a schematic of a basic system for an antenna sub-system for optimizing gain in a repeater in a multi-hop repeater system100. In one specific embodiment in a three-hop repeater, the Donor Antenna Sub-system105consists of four vertically polarized omni-directional antennas, each being tuned to a specific frequency of operation. The Server Antenna Sub-system110consists of two dual-band antennas, tuned to the same frequencies as the Donor antennas105, but with horizontal and vertical polarization. During operation, the repeater120will measure the isolation between the donor and server130for the two different server antenna polarizations (cost function122) and then direct a processor to run an algorithm to maximize the isolation between the donor and server antenna sub-systems (Antenna optimization algorithm123) which will return the optimal gain for the system. FIG.2is a flow diagram of an exemplary antenna optimization method123A for optimizing gain in the system ofFIG.1, as executed by a processor. The method123A inFIG.2accepts a start state, as in205, and iterates through antenna sub-system configurations until a configuration that optimizes the cost function is found. From the initial, or start, state205, the method123A tunes to the donor or server antenna's operating frequency, as in210. From there, the repeater (120inFIG.1) measures the inputs to the cost function, and the method123A receives those input values, as in215. The inputs to the cost function may include the transmitting and receiving power levels, such as in dBm. The method123A then calculates and stores the output of the cost function, as in220. After a number of iterations, the output values of the cost function are compared. During each iteration, the processor that executes the method123A may be associated with one or more memory components where the cost function outputs (and optionally the input values) may be stored. After storing the cost function output for a given set of inputs, the processor determines, according to an algorithm, whether or not there are any further antenna sub-systems for which the cost function calculation must be run, as in225. The system has more than one configuration, and the algorithm will proceed to calculate the cost function for each configuration until cost function outputs have been calculated for all configurations. Accordingly, if the processor executing the method123A has not yet exhausted all antenna sub-system configurations, the processor executing the method123A will cause the system to change to the next antenna sub-system configuration, as in230. The processor executing the method123A will then receive the measured inputs to the cost function, as in215; calculate and store the output of the cost function, as in220; and once again determine whether any further antenna sub-system configurations need to be evaluated for their cost function values, as in225. Once the processor executing the method123A has evaluated all antenna sub-system configurations, the cost function outputs stored in memory are compared, the configuration that best optimizes the cost function is selected, and then the system is directed to set the antenna sub-systems to the configuration that corresponds to the best optimized cost function output values, as in235. The processor executing the method does not start another iteration of the method until a user or other portion of the system reconfigures one or both antenna sub-systems or a portion of the system that would alter the cost function outputs, as in240. FIG.3is a flow diagram of another exemplary antenna optimization method123B for optimizing gain in the system ofFIG.1. The method123B inFIG.3begins with an initial configuration of the donor and server antenna sub-systems, as in305, and continually optimizes the cost function calculation by altering the antenna sub-system configurations. From the initial, or start, state305, the method123B includes tuning the donor or server antenna's operating frequency, as in310. From there, the inputs to the cost function are measured, and those input values, as in315, are received by a processor executing the method. The inputs to the cost function may include the transmitting and receiving power levels, for example in dBm. The optimized antenna sub-system settings are determined based upon an optimization of the cost function, as in320. The antenna sub-system configuration that optimizes the cost function is passed along and applied to cause the antenna sub-systems to conform to the optimized configuration, as in330. The gain, based upon the initial values of components of the system, is also optimized with the cost function. This newly optimized system is used as the starting point for the next iteration of the method123B. Once again, the inputs to the cost function are received, as in315, and further changes to the antenna sub-system configuration are determined that will optimize the output from the cost function, as in320. These changes are applied, as in330, and the next iteration begins. The one or more configurations are iterated through. When no changes to the antenna sub-systems configuration can be determined that will further optimize the cost function at320, then no changes are applied in330. However, should the system be changed, such as by a user or a part of the system that is not influenced by the method123B, then a new start or initial state305is defined and the method123B progresses as described above. In this way, the method123B is always optimizing the cost function, and thus finding the configuration of the system that optimizes system gain. FIG.4A-FIG.4Dare schematics showing various exemplary donor antenna (105A,105B,105C,105D) and server antenna (110A,110B,110C,110D) sub-systems for use with a system for optimizing gain. FIG.4Ashows a schematic displaying a donor antenna sub-system105A and a server antenna sub-system110A in which the physical orientation and null position of the antenna sub-system components can be varied. In the donor antenna sub-system105A, there can be two or more antenna elements106A and106B. These antenna elements106A and106B may have different physical orientations with respect to each other. In the case where there are more than two antenna elements, there may be a pattern to the difference in orientation between any two adjacent antenna elements. Conversely, when more than two antenna elements are present, there may be no distinct pattern to the difference in orientation between any two adjacent antenna elements. Each antenna element106A,106B may receive a signal that is passed through a weighting coefficient multiplier,107A,107B, respectively. The weight assigned to each signal can be optimized to achieve the best output from the cost function (i.e. the best gain for the system). The weighted signals can then be passed to a summing unit108that then passes along a composite signal as the donor antenna sub-system output109to the rest of the system. Similarly, inFIG.4A, the server antenna sub-system110A can have there can be two or more antenna elements111A and111B. These antenna elements111A and111B may have different physical orientations with respect to each other. In the case where there are more than two antenna elements, there may be a pattern to the difference in orientation between any two adjacent antenna elements. Conversely, when more than two antenna elements are present, there may be no distinct pattern to the difference in orientation between any two adjacent antenna elements. Each antenna element111A,111B may receive a signal that is passed through a weighting coefficient multiplier,112A,112B, respectively. The weight assigned to each signal can be optimized to achieve the best output from the cost function, and in turn the optimal gain from the system. The weighted signals can then be passed to a summing unit113that then passes along a composite signal as the server antenna sub-system output114. FIG.4Bshows a schematic displaying a donor antenna sub-system105B and a server antenna sub-system110B in which the mode or pattern of the antenna sub-system components can be varied. The donor antenna sub-system105B can have one or more antenna elements106A that accept an incoming signal that can be processed by more than one mode of resonance. InFIG.4B, the signal is shown to have four modes that the system can switch between to find an optimal setting on the donor antenna sub-system. After the signal is modified by a mode, it is passed to the rest of the system as the donor antenna sub-system output109. The server antenna sub-system110B has a similar configuration with one or more antenna elements111A, multiple modes to select from, and a server antenna sub-system output114. A mode that optimizes the performance of the system can be selected from the multiple modes of the server antenna sub-system110B. The total number of possible combinations depends on the number of possible modes at both the donor antenna sub-system105B and the server antenna sub-system110B. The product of the number of modes at each sub-system yields the total number of possible combinations that can be iterated through to find the overall configuration that optimizes the cost function, and thus the gain of the system. In furtherance of the embodiments described inFIG.4B, and in order to achieve small form and improved isolation, including up to several more degrees of freedom for adjusting isolation between the donor and server antennas, one or both of the donor and server antennas may individually comprise an active multimode antenna (or “modal antenna”). Now, with reference toFIG.5, which shows an exemplary structure of an active multimode antenna500in accordance with one embodiment, the active multimode antenna500comprises: a radiating element520positioned above a circuit board510forming an antenna volume therebetween; one or more parasitic conductor elements530;540(or “parasitic elements”); and one or more active components535;545coupled to the one or more parasitic elements for controlling a state thereof. The one or more active components535;545may comprise a tunable capacitor, tunable inductor, switch, tunable phase shifter or other active controlled component known by those having skill in the art, or a circuit including a combination thereof. The one or more active components535;545are further coupled to a processor550and control lines555for receiving control signals configured to adjust a reactive loading of the respective active components, and thereby change a state associated with the parasitic elements coupled therewith. In each state of the combination of parasitic elements and active components, the active multi-mode antenna is configured to produce a corresponding radiation pattern or “mode”, such that the multimode antenna is configurable about a plurality of possible antenna modes, wherein the multimode antenna provides a distinct radiation pattern in each of the plurality of possible modes. In this regard, the multimode antenna can be implemented in a repeater system in place of an antenna array, thereby providing smaller form. In addition, the multimode antenna can achieve many more antenna modes than an antenna array, and more precise discrete variations in the corresponding antenna radiation patterns. More specifically, the radiating element can be configured with one or more nulls (signal minima) in the radiation pattern, and the combination of parasitic elements and active components can be used to steer the radiation pattern such that the null is directed in a desired direction. As such, the degree to which isolation may be fine-tuned is much improved with the use of a multi-mode antenna when compared to the conventional technique of implementing an array of antennas, since, the multimode antenna provides additional degrees of freedom for steering the radiation pattern and nulls associated therewith. The multimode antenna provides the capability of generating and steering a null for isolation improvement between pairs of antennas while maintaining a lower directivity (i.e. wider beamwidth) radiation pattern compared to traditional array techniques where multiple antennas are used to generate an array pattern. Thus, smaller form and improved isolation is achieved with the implementation of a multimode antenna system in the repeater. It will be understood by those having skill in the art that the active multimode antenna illustrated inFIG.5is capable of changing frequency resonance(s) (“band switching”); changing a vector of signal maxima in the radiation pattern (“beam steering”); changing a vector direction of signal minima (“null steering”); and changing a direction of polarization of the antenna radiation pattern. Whereas conventional techniques utilizes two or more antennas with different polarizations and switching between them, the active multimode antenna ofFIG.5can be implemented with tunable active components, such as variable capacitors and the like, for incrementally inducing a change in the corresponding radiation pattern of the active multimode antenna, resulting in more degrees of freedom when compared to the conventional embodiments. Moreover, whileFIG.5shows one embodiment of an active multimode antenna, other embodiments can be similarly implemented. Details of certain variations are described in each of the related documents as incorporated by reference herein, and may be further appreciated upon a thorough review of the contents thereof. FIG.4Cshows a schematic displaying a donor antenna sub-system105C and a server antenna sub-system110C in which the polarization of the antenna sub-system components can be varied. The donor antenna sub-system105C has at least one antenna element106A that sends the received signal along to the rest of the system as the donor antenna sub-system output109without any modification. The server antenna sub-system110C has two or more antenna elements with different polarization. InFIG.4C, the server antenna sub-system110C antenna elements include an antenna element with horizontal polarization115A and an antenna element with vertical polarization115B. The output from each antenna element leads to a switch116. The processor executing the method can cause the server antenna sub-system switch116to toggle between the different polarizations115A and115B while the cost function is calculated for each configuration. Once the configuration is found that optimizes the cost function, the switch is toggled to the appropriate position, and the resulting signal is the output114from the server antenna sub-system. FIG.4Dshows a schematic displaying a donor antenna sub-system105D and a server antenna sub-system110D in which the sectors of the antenna sub-system components can be varied. The donor antenna sub-system105D has one or more antenna elements120A and120B that may send the received signal along to the rest of the system as the donor antenna sub-system output109without any modification. A switch121may be used to toggle between the donor antenna elements120A and120B. The server antenna sub-system110D has two or more antenna elements with different sectors130A and130B. InFIG.4D, the server antenna sub-system110D includes a switch131for toggling between the different server antenna elements130A and30B. The processor executing the method can cause the donor antenna sub-system switch to toggle between the different sectors, each associated with an antenna element120A and120B, as well as causing the server antenna sub-system switch to toggle between the different sectors, each associated with an antenna element130A and130B, while the cost function is calculated for each configuration. Once the configuration is found that optimizes the cost function, the switches121and/or131may be toggled to the appropriate position, and the resulting signal is the output114from the server antenna sub-system. The number of sectors and/or antenna elements at each antenna sub-system may differ. For example, each antenna sub-system may have two sectors. Alternatively, the donor antenna sub-system may have two sectors and the server antenna sub-system may have more than two sectors, or vice-versa. A system (100inFIG.1), can employ of the combinations of donor and server antenna sub-systems described above. In some implementations, a system can include more than one of the combinations of donor and server antenna sub-systems described above. While this specification contains many specifics, these should not be construed as limitations on the scope of an invention that is claimed or of what may be claimed, but rather as descriptions of features specific to particular embodiments. Certain features that are described in this specification in the context of separate embodiments can also be implemented in combination in a single embodiment. Conversely, various features that are described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable sub-combination. Moreover, although features may be described above as acting in certain combinations and even initially claimed as such, one or more features from a claimed combination can in some cases be excised from the combination, and the claimed combination may be directed to a sub-combination or a variation of a sub-combination. Similarly, while operations are depicted in the drawings in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. Although embodiments of various methods and devices are described herein in detail with reference to certain versions, it should be appreciated that other versions, methods of use, embodiments, and combinations thereof are also possible. Therefore the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein. | 21,173 |
11942685 | DESCRIPTION OF EMBODIMENTS First Embodiment A communication device according to a first embodiment will be described with reference toFIGS.1A to4. FIG.1Ais a plan view of an antenna device used in the communication device according to the first embodiment.FIG.1Bis a sectional view taken along dot-dash line1B-1B inFIG.1A.FIG.1Cis a perspective view of a waveguide structure included in the communication device according to the first embodiment. A first antenna11and a second antenna12are provided on a support surface31, which is one surface of a module board30(FIG.1B). The module board30also functions as a support member that supports the first antenna11and the second antenna12. The first antenna11includes a plurality of first radiating elements11aand the second antenna12includes a plurality of second radiating elements12a. The module board30has a ground plane32therein. A patch antenna includes the first radiating elements11a, the second radiating elements12a, and the ground plane32. The first antenna11is an array antenna including the plurality of first radiating elements11aand the second antenna12is an array antenna including the plurality of second radiating elements12a. An operating frequency f2of the second antenna12is higher than an operating frequency f1of the first antenna11. Here, the operating frequency of an antenna is defined as the frequency at which the antenna gain is maximized. In a plan view, the plurality of first radiating elements11aare disposed in, for example, a 2-by-2 matrix and the second radiating elements12aare disposed in, for example, a 3-by-4 matrix. Part of a housing50faces the support surface31of the module board30at a distance. A waveguide structure20is disposed between the support surface31of the module board30and the housing50. The waveguide structure20is in contact with both the module board30and the housing50. For example, the waveguide structure20is disposed outside the range of the half-value angle of the main beam as viewed from the first antenna11in the route of the radio waves received by the second antenna12. The waveguide structure20is preferably disposed so as to contain the second antenna12without overlapping with the first antenna11in a plan view. The waveguide structure20(FIG.1C) includes metal walls disposed like a grid in a plan view. The plurality of second radiating elements12aof the second antenna12are disposed so as to correspond to a plurality of cavities21of the grid-like metal walls. Specifically, the second radiating elements12aare disposed inside the corresponding cavities21in a plan view. The relative positional relationship between the second radiating element12aand the corresponding cavity21is the same for all the second radiating elements12a. Of the grid-like metal walls, the side walls of each of the plurality of cavities21function as one waveguide (referred to below as a unit waveguide) and cause radio waves with a desired wavelength to pass therethrough. In addition, the waveguide structure20functions as a reflector for radio waves with a wavelength sufficiently long for the dimensions of the cavity21. Specifically, the waveguide structure20causes radio waves with the operating frequency of the second antenna12to pass therethrough and further attenuates radio waves with the operating frequency of the first antenna11than radio waves with the operating frequency of the second antenna12. FIG.2is a block diagram of a radar function portion of the communication device according to the first embodiment. This radar function portion includes the functions of time division multiple access (TDMA), frequency modulated continuous wave (FMCW), and multi-input multi-output (MIMO). Some of the plurality of second radiating elements12aconstitute a second antenna12T for transmission and the other of the plurality of second radiating elements12aconstitute a second antenna12R for reception. A second transmit-receive circuit42supplies high frequency signals to the plurality of second radiating elements12aof the second antenna12T for transmission. The high frequency signals received by the plurality of second radiating elements12aof the second antenna12R for reception are input to the second transmit-receive circuit42. The second transmit-receive circuit42includes a signal processing circuit80, a local oscillator81, transmission processing circuitry82, and reception processing circuitry85. The local oscillator81outputs a local signal SL having a frequency that linearly increases or decreases over time based on a chirp control signal Sc from the signal processing circuit80. The local signal SL is given to the transmission processing circuitry82and the reception processing circuitry85. The transmission processing circuitry82includes a plurality of switches83and a plurality of power amplifiers84. The switch83and the power amplifier84are provided for each of the second radiating elements12athat constitute the second antenna12T for transmission. The switch83is turned on and off based on a switching control signal Ss from the signal processing circuit80. The local signal SL is input to the power amplifier84when the switch83is on. The power amplifier84amplifies the power of the local signal SL and supplies the amplified power to the corresponding second radiating element12a. The radio waves emitted from the second antenna12T for transmission are reflected by the target and the reflected waves are received by the second antenna12R for reception. The reception processing circuitry85includes a plurality of low noise amplifiers87and a plurality of mixers86. The low noise amplifier87and the mixer86are provided for each of the second radiating elements12athat constitute the second antenna12R for reception. An echo signal Se received by the plurality of second radiating elements12athat constitute the second antenna12R for reception is amplified by the low noise amplifier87. The mixer86multiplies the amplified echo signal Se by the local signal SL to generate a beat signal Sb. The signal processing circuit80includes, for example, an AD converter, a microcomputer, and the like and calculates the distance and orientation to the target by performing signal processing on the beat signal Sb. FIG.3is a block diagram of the communication function portion of the communication device according to the first embodiment. The high frequency signal is supplied from a first transmit-receive circuit41to the first radiating elements11aof the first antenna11and the high frequency signal received by the first radiating elements11ais input to the first transmit-receive circuit41. The first transmit-receive circuit41includes a baseband integrated circuit device (BBIC)110and a high frequency integrated circuit device (RFIC)90. The high frequency integrated circuit device90includes an intermediate frequency amplifier91, an up-down conversion mixer92, a transmit-receive toggle switch93, a power divider94, a plurality of phase shifters95, a plurality of attenuators96, and a plurality of transmit-receive toggle switches97, a plurality of power amplifiers98, a plurality of low noise amplifiers99, and a plurality of transmit-receive toggle switches100. First, the transmission function will be described. An intermediate frequency signal is input from the baseband integrated circuit device110to the up-down conversion mixer92via the intermediate frequency amplifier91. The high frequency signal generated by up-converting the intermediate frequency signal using the up-down conversion mixer92is input to the power divider94via the transmit-receive toggle switch93. The high frequency signals divided by the power divider94are input to the first radiating elements11athrough the phase shifters95, the attenuators96, the transmit-receive toggle switches97, the power amplifiers98, and the transmit-receive toggle switches100. Next, the reception function will be described. The high frequency signals received by the plurality of first radiating elements11aare input to the power divider94through the transmit-receive toggle switches100, the low noise amplifiers99, the transmit-receive toggle switches97, the attenuators96, and the phase shifters95. The high frequency signal synthesized by the power divider94is input to the up-down conversion mixer92through the transmit-receive toggle switch93. The intermediate frequency signal generated by down-converting the high frequency signal using the up-down conversion mixer92is input to the baseband integrated circuit device110through the intermediate frequency amplifier91. Next, the excellent effect of the first embodiment will be described with reference toFIG.4. FIG.4is a schematic diagram of the communication device according to the first embodiment and a radio wave reflector present in a radio wave emission space of the communication device. A radio wave reflector60is present in the space to which the radio waves of the first antenna11and the second antenna12are emitted. The first antenna11is used by, for example, a fifth generation mobile communication system (5G communication system) and operates in the 26 GHz band. The second antenna12is used for, for example, a millimeter-wave radar and gesture sensor system and has an operating frequency of 79.5 GHz. The waveguide structure20causes most of radio waves with a frequency of 79.5 GHz, which is the operating frequency of the second antenna12, to pass therethrough and significantly attenuates radio waves in the operating frequency band of the first antenna11. The radio waves emitted from the second antenna12are reflected by the radio wave reflector60and the reflected waves are received by the second antenna12. The radio waves emitted from the first antenna11are also reflected by the radio wave reflector60and the reflected waves enter the second antenna12. The antenna gain of the second antenna12is maximized at the operating frequency 79.5 GHz thereof, but has some gain in the operating frequency band of the first antenna11. Accordingly, the reflected waves of the radio waves in, for example, the 26 GHz band are also received by the second antenna12. When a signal in the 26 GHz band is amplified by the low noise amplifier87of the second transmit-receive circuit42(FIG.2), the harmonic wave is generated by the non-linearity of the low noise amplifier. The third harmonic wave of the signal in the 26 GHz band includes a signal with a frequency that matches 79.5 GHz or is close to 79.5 GHz. Accordingly, the third harmonic wave of the reception signal in the 26 GHz band becomes noise for the signal transmitted and received by the second antenna12. In the first embodiment, the waveguide structure20attenuates the radio waves that are emitted from the first antenna11, are reflected by the radio wave reflector60, and enter the second antenna12, so the strength of the third harmonic wave generated by the non-linearity of the low noise amplifier is also reduced. Accordingly, it is possible to reduce the effect of noise caused by the radio waves emitted from the first antenna11on the signal transmitted and received by the second antenna12. Furthermore, in the first embodiment, the relative positional relationship between the plurality of second radiating elements12aof the second antenna12and the corresponding cavities21of the waveguide structure20is the same for all the second radiating elements12a. Accordingly, variation in the antenna gain between the individual second radiating elements12acan be reduced. Next, the attenuation required for the waveguide structure20will be described with reference toFIG.5. FIG.5is a graph illustrating an example of changes in the signal strength from emission from the first antenna11and the second antenna12until detection by the second transmit-receive circuit42(FIG.2) through reflection by the radio wave reflector60(FIG.4). The vertical axis represents the signal strength in units dBm. The horizontal axis represents the equivalent isotropic radiated power (EIRP) of the antenna and the factors of changing the signal strength, that is, the propagation loss of radio waves, the loss caused by the radar scattering cross section (RCS) of the radio wave reflector, the propagation loss due to the waveguide structure20(FIGS.1A and1B), the reception gain of the antenna, and the generation efficiency of the third harmonic wave due to the non-linearity of the low noise amplifier. FIG.5illustrates the case in which the second antenna12is provided for a millimeter wave radar with a frequency of 79.5 GHz and the first antenna11is provided for transmission and reception in the 26 GHz band of a 5G communication system. Radio waves with a frequency of 26.5 GHz included in the 26 GHz band are emitted from the first antenna11and radio waves with a frequency of 79.5 GHz are emitted from the second antenna12. The frequency of the third harmonic wave emitted from the first antenna11is equal to the frequency of the fundamental wave emitted from the second antenna12. The thick solid lines in the graph inFIG.5represent fluctuations in the strength of the signal related to radio waves with a frequency of 79.5 GHz emitted from the second antenna12. The relatively high-density hatched region represents the range of the strength of the signal related to radio waves with a frequency of 79.5 GHz emitted from the second antenna12. The thin solid lines illustrate fluctuations in the strength of the signal related to radio waves with a frequency of 26.5 GHz emitted from the first antenna11. The relatively low-density hatched region represents the range of the strength of the signal related to radio waves with a frequency of 26.5 GHz emitted from the first antenna11. The dashed line illustrates the strength of the signal related to radio waves with a frequency of 26.5 GHz emitted from the first antenna11when the waveguide structure20is not disposed. The EIRP of the fundamental wave of the first antenna11is assumed to be 30 dBm. In this case, for example, the EIRP of the third harmonic wave is approximately −4 dBm. The EIRP of radio waves with a frequency of 79.5 GHz emitted from the second antenna12used by the radar system needs to be set to be sufficiently higher than the EIRP of the third harmonic wave emitted from the first antenna11. For example, the EIRP of a frequency of 79.5 GHz from the second antenna12is set to 39 dBm, which is sufficiently higher than −4 dBm. First, the radar system including the second antenna12will be described. It is assumed that a patch array antenna in which in which eight traveling wave patch arrays are arranged in parallel is used as the second antenna12. When the antenna gain is 25 dBi, the EIRP can be 39 dBm by setting the input power for one port to 5 dBm. When the radio wave reflector100maway is detected, the round-trip distance of radio waves is 200 meters. This propagation loss is approximately 116 dB. Accordingly, the signal strength after occurrence of the propagation loss is −77 dBm. Furthermore, when the radar scattering cross section (RCS) of the radio wave reflector is assumed to be the range not less than −10 dB and not more than +10 dB, the signal strength in consideration of the RCS of the radio wave reflector is not less than −87 dBm and not more than −67 dBm. Since almost all of radio waves with a frequency of 79.5 GHz pass through the waveguide structure20, the loss due to the waveguide structure20is hardly caused. Accordingly, the signal strength after passing through the waveguide structure20is not less than −87 dBm and not more than −67 dBm. When the reception gain of the second antenna12is assumed to be 25 dBi, the signal strength of the reception signal by the second antenna12is not less than −62 dBm and not more than −42 dBm. Accordingly, the reception sensitivity RS of the second transmit-receive circuit42(FIG.2) is preferably at least smaller than −62 dBm. The reception sensitivity RS is preferably set to approximately −72 dBm with a margin of approximately 10 dB. Next, the effect of the radio waves emitted from the first antenna11for a 5G communication system on the radar system will be described. The signal strength of the third harmonic wave of the fundamental wave with a frequency of 26.5 GHz emitted from the first antenna11needs to be smaller than the reception sensitivity RS of the radar system, that is, −72 dBm to prevent this harmonic wave from affecting the radar system. The EIRP with a frequency of 26.5 GHz from the first antenna11is assumed to be, for example, 30 dBm as described above. For example, when the radio waves are emitted from the first antenna11, are reflected by the radio wave reflector disposed 1 meter away, and enter the second antenna12, the propagation loss for a 2-meter round trip is approximately 67 dB. Accordingly, the signal strength after occurrence of the propagation loss is −37 dBm. When the RCS of an obstacle is approximately −10 dB, the signal strength in consideration of the RCS of the obstacle is −47 dBm. First, the case in which the waveguide structure20is not disposed will be described. When the reception gain of the second antenna12at 79.5 GHz is 25 dBi, the reception gain at 26.5 GHz is smaller than 25 dBi. For example, the reception gain at 26.5 GHz is 0 dBi. At this time, the signal strength of the reception signal with a frequency of 26.5 GHz received by the second antenna12is −47 dBm. When the third harmonic wave generation efficiency due to the non-linearity of the low noise amplifier is assumed to be −20 dB, the signal strength of the third harmonic wave at a frequency of 79.5 GHz after passing through the low noise amplifier is −67 dBm. Since this signal strength is larger than the reception sensitivity RS, that is, −72 dBm, the third harmonic wave is detected as a valid signal by the radar system. Accordingly, the radio waves with a frequency of 26.5 GHz received by the second antenna12must be attenuated by the waveguide structure20before reception. In order to make the signal strength of the third harmonic wave lower than the reception sensitivity RS, the attenuation is preferably approximately 10 dB and more preferably approximately 20 dB with a margin as indicated by the thin solid lines inFIG.5. By attenuating radio waves with a frequency of 26.5 GHz by 10 dB using the waveguide structure20, the signal strength of the third harmonic wave can be made lower than the reception sensitivity RS of the radar system. Furthermore, by attenuating radio waves with a frequency of 26.5 GHz by 20 dB using the waveguide structure20, the signal strength of the third harmonic wave can be made sufficiently lower than the reception sensitivity RS of the radar system. Although the example illustrated inFIG.5introduces various assumptions, these assumptions reflect the utilization situations in actual radar systems and 5G communication systems. Accordingly, in general, the attenuation of radio waves with the operating frequency of the first antenna11by the waveguide structure20is preferably larger than or equal to 10 dB and more preferably larger than or equal to 20 dB. The attenuation of radio waves by the waveguide structure20can be adjusted by changing the height (corresponding to the length of the waveguide) of the waveguide structure20. Second Embodiment Next, a communication device according to a second embodiment will be described with reference toFIG.6A. The structure common to the communication device (FIGS.1A,1B, and1C) according to the first embodiment will not be described below. FIG.6Ais a sectional view of the communication device according to the second embodiment. In the communication device according to the first embodiment, the waveguide structure20(FIG.1B) is in contact with both the module board30and the housing50. In contrast, in the second embodiment, the waveguide structure20is fixed to the housing50with an adhesive and not in contact with the module board30. It should be noted that the housing50and the waveguide structure20may also be manufactured by insert molding. The plurality of second radiating elements12aof the second antenna12are aligned with the waveguide structure20when the module board30is installed in the housing50. This makes the positional relationship between the plurality of second radiating elements12aand the waveguide structure20in a plan view identical to that in the first embodiment. Next, a communication device according to a modification of the second embodiment will be described with reference toFIG.6B. FIG.6Bis a sectional view of the communication device according to the modification of the second embodiment. In the modification, the waveguide structure20is fixed to the module board30with an adhesive and not in contact with the housing50. Even in the structure in which the waveguide structure20is not in contact with one of the module board30and the housing50as in the second embodiment or the modification of the second embodiment, the same excellent effect as in the first embodiment can be obtained. Third Embodiment Next, a communication device according to a third embodiment will be described with reference toFIGS.7A and7B. The structure common to the communication device (FIGS.1A,1B, and1C) according to the first embodiment will not be described below. FIG.7Ais a plan view of an antenna device used in the communication device according to the third embodiment andFIG.7Bis a sectional view taken along dot-dash line7B-7B inFIG.7A. In the first embodiment, the waveguide structure20(FIGS.1A and1C) includes the grid-like metal walls. In contrast, in the third embodiment, the waveguide structure20includes a plurality of conductor pillars22and a grid-like conductor pattern23. A dielectric film33that covers the first antenna11and the second antenna12is disposed on the support surface31of the module board30. The plurality of conductor pillars22disposed along the grid-like straight lines in a plan view are embedded in the dielectric film33. The second radiating elements12aof the second antenna12are disposed in the space portions between the plurality of grid-like straight lines including the plurality of conductor pillars22, respectively. The upper ends of the plurality of conductor pillars22are exposed to the upper surface of the dielectric film33. The conductor pattern23is disposed on the dielectric film33so as to pass through the upper ends of the conductor pillars22exposed to the upper surface of the dielectric film33and the conductor pattern23electrically connects the upper ends of the plurality of conductor pillars22to each other. The lower ends of the plurality of conductor pillars22reach the ground plane32in the module board30and are electrically connected to the ground plane32. The spacing between the plurality of conductor pillars22is set so that the spaces corresponding to the cavities of the grid formed by the plurality of conductor pillars22function as a waveguide for radio waves with the operating frequency of the first antenna11. For example, the spacing between the plurality of conductor pillars22is set to ¼ or less of the wavelength in the dielectric film33of the radio waves with the operating frequency of the second antenna12. The plurality of conductor pillars22disposed so as to surround one second radiating element12ain a plan view and the conductor pattern23that electrically connects the upper ends of the conductor pillars22function as the unit waveguide corresponding to the one second radiating element12a. Next, the excellent effect of the third embodiment will be described. In the third embodiment as well, the waveguide structure20attenuates the radio waves in the operating frequency band of the first antenna11, so the same excellent effect as in the first embodiment can be obtained. The attenuation of radio waves is larger as the height to the upper end of the waveguide structure20from the support surface31is larger. In the third embodiment, the cavities21of the waveguide structure20are filled with the dielectric film33with a dielectric constant higher than that in air. Accordingly, the substantial length related to radio wave propagation from the support surface31to the upper end of the waveguide structure20is longer than that when the cavities21are hollow. As a result, the excellent effect of increasing the attenuation of radio waves by the waveguide structure20can be obtained. Next, modifications of the third embodiment will be described. Although the plurality of conductor pillars22are connected to the ground plane32in the third embodiment, the plurality of conductor pillars22do not need to be connected to the ground plane32. In addition, although the upper ends of the plurality of conductor pillars22are connected to each other by the conductor pattern23in the third embodiment, the plurality of conductor pillars22may be electrically connected to each other by the grid-like conductor pattern of an internal layer in the middle portions between the upper ends and the lower ends of the plurality of conductor pillars22as well. By connecting the plurality of conductor pillars22to each other in the middle portions, the function as the unit waveguide can be enhanced. Fourth Embodiment Next, a communication device according to a fourth embodiment will be described with reference toFIG.8. The structure common to the communication device (FIGS.1A,1B, and1C) according to the first embodiment will not be described below. FIG.8is a sectional view of the communication device according to the fourth embodiment. In the first embodiment, the first antenna11and the second antenna12are provided on the common module board30(FIG.1B) and the module board30is used as the support member that supports the first antenna11and the second antenna12. In contrast, in the fourth embodiment, the first antenna11and the second antenna12are formed on a first module board30A and a second module board30B, which are different from each other, respectively. The first module board30A and the second module board30B internally have a ground plane32A and a ground plane32B, respectively. The waveguide structure20is fixed to the second module board30B. The first module board30A and the second module board30B are fixed to a support surface36of a common support member35. The support member35is housed in the housing50and fixed to the housing. Next, the excellent effect of the fourth embodiment will be described. In the fourth embodiment as well, the same excellent effect as in the first embodiment can be obtained by disposing the waveguide structure20. In addition, the first antenna11and the second antenna12are formed on different module boards in the fourth embodiment, so the degree of flexibility in the arrangement of both antennas increases. Fifth Embodiment Next, a communication device according to a fifth embodiment will be described with reference toFIGS.9A and9B. The structure common to the communication devices according to the first embodiment (FIG.1A) and the second embodiment (FIG.6A) will not be described below. FIG.9Ais a plan view of the communication device according to the fifth embodiment andFIG.9Bis a sectional view taken along dot-dash line9B-9B inFIG.9A. In the first embodiment (FIG.1A), the plurality of cavities21of the grid-like metal walls constituting the waveguide structure20correspond one-to-one to the plurality of second radiating elements12aof the second antenna12. In contrast, in the fifth embodiment, two cavities of the grid-like metal walls constituting the waveguide structure20correspond to one second radiating element12a. That is, two unit waveguides are disposed for one second radiating element12a. In a plan view, the straight line portions of the metal walls that extend in the column direction (vertical direction inFIG.9A) pass through the middles of the second radiating elements12a, respectively. In the fifth embodiment as well, the waveguide structure20attenuates the radio waves with the basic frequency emitted from the first antenna11, as in the first embodiment and the second embodiment. The radio waves with the frequency transmitted or received by the second antenna12are hardly attenuated by the waveguide structure20. Next, the excellent effect of the fifth embodiment will be described. In the fifth embodiment as well, the radio waves with the fundamental frequency that are emitted from the first antenna11, are reflected by the radio wave reflector60(FIG.4), and enter the second antenna12are attenuated by the waveguide structure20, as in the first embodiment and the second embodiment. Accordingly, the signal with the fundamental frequency input to the low noise amplifier87(FIG.2) is weakened. As a result, the signal strength of the harmonic wave component generated by the non-linearity of the low noise amplifier87also reduces. Accordingly, the effect of the noise caused by the radio waves emitted from the first antenna11on the signal transmitted and received by the second antenna12can be reduced. Furthermore, in the fifth embodiment as well, the relative positional relationship between the plurality of unit waveguides included in the waveguide structure20and the plurality of second radiating elements12aof the second antenna12is the same for all the second radiating elements12a. Accordingly, the variation in the antenna gain between the individual second radiating elements12acan be reduced. In the fifth embodiment, the upper and lower edges of the four edges of the second radiating element12aof the second antenna12intersect with the metal wall and the left and right edges do not intersect with the metal wall inFIG.9A. In this case, the second radiating element12ais preferably excited so that the edges that do not intersect with the metal wall become the wave source. That is, inFIG.9A, the polarization direction of the second radiating element12ais preferably the left-right direction. Next, modifications of the fifth embodiment will be described. In the fifth embodiment, in a plan view, the straight line portions of the metal walls that extend in the column direction pass through the middles of the second radiating elements12a, but the straight line portions that extend in the row direction of the metal walls may pass through the middles of the second radiating elements12a. In addition, one second radiating element12acorresponds to two unit waveguides in the fifth embodiment, but one second radiating element12amay correspond to three or more unit waveguides. Sixth Embodiment Next, a communication device according to a sixth embodiment will be described with reference toFIGS.10A and10B. The structure common to the communication device (FIGS.9A and9B) according to the fifth embodiment will not be described below. FIG.10Ais a plan view of the communication device according to the sixth embodiment andFIG.10Bis a sectional view taken along dot-dash line10B-10B inFIG.10A. In the fifth embodiment, one second radiating element12acorresponds to two unit waveguides. In contrast, in the sixth embodiment, two second radiating elements12acorrespond to one unit waveguide. Specifically, one unit waveguide is disposed for two second radiating elements12aarranged in the row direction. The shape of each of the unit waveguides in a plan view is a rectangle with long sides in the row direction, and one unit waveguide contains two second radiating elements12ain a plan view. In the sixth embodiment as well, the waveguide structure20attenuates the radio waves with the basic frequency emitted from the first antenna11, as in the fifth embodiment. The radio waves with the frequency transmitted or received by the second antenna12are hardly attenuated by the waveguide structure20. Next, the excellent effect of the sixth embodiment will be described. In the sixth embodiment as well, the effect of the noise caused by the radio waves emitted from the first antenna11on the signal transmitted and received by the second antenna12can be reduced as in the fifth embodiment. Next, a modification of the sixth embodiment will be described. Although one unit waveguide corresponds to two second radiating elements12ain the sixth embodiment, one unit waveguide may correspond to three or more second radiating elements12a. For example, in a plan view, one unit waveguide may contain three or more second radiating elements12a. Seventh Embodiment Next, a communication device according to a seventh embodiment will be described with reference toFIGS.11A and11B. The structure common to the communication devices (FIGS.1A to5) according to the first embodiment will not be described below. FIG.11Ais a plan view of the communication device according to the seventh embodiment andFIG.11Bis a sectional view taken along dot-dash line11B-11B inFIG.11A. The communication device according to the seventh embodiment includes the waveguide structure20having a unit waveguide disposed in the route of the radio waves received by the second antenna12, as in the first embodiment. In addition, the waveguide structure20is disposed outside the range of the half-value angle of the main beam as viewed from the first antenna11. It is possible to use, as the waveguide structure20, a structure having a waveguide function that further attenuates the radio waves with the operating frequency of the first antenna11than the radio waves with the operating frequency of the second antenna12. Next, the excellent effect of the seventh embodiment will be described. In the seventh embodiment as well, the effect of the noise caused by the radio waves emitted from the first antenna11on the signal transmitted and received by the second antenna12can be reduced, as in the first embodiment. It goes without saying that each of the above-described embodiments is exemplary and the structures described in different embodiments can be partially replaced or combined with each other. Similar advantageous effects provided by similar structures in a plurality of embodiments are not mentioned sequentially in each of the embodiments. Further, the present disclosure is not limited to the above-described embodiments. It is obvious for those skilled in the art that various alterations, improvements, combinations, and the like can be made. | 34,280 |
11942686 | DETAILED DESCRIPTION OF THE INVENTION This description provides examples, and is not intended to limit the scope, applicability or configuration of the invention. Rather, the ensuing description will provide those skilled in the art with an enabling description for implementing embodiments of the invention. Various changes may be made in the function and arrangement of elements. Thus, various embodiments may omit, substitute, or add various procedures or components as appropriate. For instance, it should be appreciated that the methods may be performed in an order different than that described, and that various steps may be added, omitted, or combined. Also, aspects and elements described with respect to certain embodiments may be combined in various other embodiments. It should also be appreciated that the following systems, methods, devices, and software may individually or collectively be components of a larger system, wherein other procedures may take precedence over or otherwise modify their application. For purposes of this disclosure, the term “aligned” generally refers to being parallel, substantially parallel, or forming an angle of less than 35.0 degrees. For purposes of this disclosure, the term “transverse” generally refers to perpendicular, substantially perpendicular, or forming an angle between 55.0 and 125.0 degrees. For purposes of this disclosure, the term “length” generally refers to the longest dimension of an object. For purposes of this disclosure, the term “width” generally refers to the dimension of an object from side to side and may refer to measuring across an object perpendicular to the object's length. For purposes of this disclosure, the term “electrode” may generally refer to a portion of an electrical conductor intended to be used to make a measurement, and the terms “route” and “trace” generally refer to portions of an electrical conductor that are not intended to make a measurement. For purposes of this disclosure in reference to circuits, the term “line” generally refers to the combination of an electrode and a “route” or “trace” portions of the electrical conductor. For purposes of this disclosure, the term “Tx” generally refers to a transmit line, electrode, or portions thereof, and the term “Rx” generally refers to a sense line, electrode, or portions thereof. For the purposes of this disclosure, the term “electronic device” may generally refer to devices that can be transported and include a battery and electronic components. Examples may include a laptop, a desktop, a mobile phone, an electronic tablet, a personal digital device, a watch, a gaming controller, a gaming wearable device, a wearable device, a measurement device, an automation device, a security device, a display, a vehicle, an infotainment system, an audio system, a control panel, another type of device, an athletic tracking device, a tracking device, a card reader, a purchasing station, a kiosk, or combinations thereof. It should be understood that use of the terms “capacitance module,” “touch pad” and “touch sensor” throughout this document may be used interchangeably with “capacitive touch sensor,” “capacitive sensor,” “capacitance sensor,” “capacitive touch and proximity sensor,” “proximity sensor,” “touch and proximity sensor,” “touch panel,” “trackpad,” “touch pad,” and “touch screen.” It should also be understood that, as used herein, the terms “vertical,” “horizontal,” “lateral,” “upper,” “lower,” “left,” “right,” “inner,” “outer,” etc., can refer to relative directions or positions of features in the disclosed devices and/or assemblies shown in the Figures. For example, “upper” or “uppermost” can refer to a feature positioned closer to the top of a page than another feature. These terms, however, should be construed broadly to include devices and/or assemblies having other orientations, such as inverted or inclined orientations where top/bottom, over/under, above/below, up/down, and left/right can be interchanged depending on the orientation. In some cases, the capacitance module is located within a housing. The capacitance module may be underneath the housing and capable of detecting objects outside of the housing. In examples, where the capacitance module can detect changes in capacitance through a housing, the housing is a capacitance reference surface. For example, the capacitance module may be disclosed within a cavity formed by a keyboard housing of a computer, such as a laptop or other type of computing device, and the sensor may be disposed underneath a surface of the keyboard housing. In such an example, the keyboard housing adjacent to the capacitance module is the capacitance reference surface. In some examples, an opening may be formed in the housing, and an overlay may be positioned within the opening. In this example, the overlay is the capacitance reference surface. In such an example, the capacitance module may be positioned adjacent to a backside of the overlay, and the capacitance module may sense the presence of the object through the thickness of the overlay. For the purposes of this disclosure, the term “reference surface” may generally refer to a surface through which a pressure sensor, a capacitance sensor, or another type of sensor is positioned to sense a pressure, a presence, a position, a touch, a proximity, a capacitance, a magnetic property, an electric property, another type of property, or another characteristic, or combinations thereof that indicates an input. For example, the reference surface may be a housing, an overlay, or another type of surface through which the input is sensed. In some examples, the reference surface has no moving parts. In some examples, the reference surface may be made of any appropriate type of material, including, but not limited to, plastics, glass, a dielectric material, a metal, another type of material, or combinations thereof. For the purposes of this disclosure, the term “display” may generally refer to a display or screen that is not depicted in the same area as the capacitive reference surface. In some cases, the display is incorporated into a laptop where a keyboard is located between the display and the capacitive reference surface. In some examples where the capacitive reference surface is incorporated into a laptop, the capacitive reference surface may be part of a touch pad. Pressure sensors may be integrated into the stack making up the capacitance module. However, in some cases, the pressure sensors may be located at another part of the laptop, such as under the keyboard housing, but outside of the area used to sense touch inputs, on the side of the laptop, above the keyboard, to the side of the keyboard, at another location on the laptop, or at another location. In examples where these principles are integrated into a laptop, the display may be pivotally connected to the keyboard housing. The display may be a digital screen, a touch screen, another type of screen, or combinations thereof. In some cases, the display is located on the same device as the capacitive reference surface, and in other examples, the display is located on another device that is different from the device on which the capacitive reference surface is located. For example, the display may be projected onto a different surface, such as a wall or projector screen. In some examples, the reference surface may be located on an input or gaming controller, and the display is located on a wearable device, such as a virtual reality or augmented reality screen. In some cases, the reference surface and the display are located on the same surface, but on separate locations on that surface. In other examples, the reference surface and the display may be integrated into the same device, but on different surfaces. In some cases, the reference surface and the display may be oriented at different angular orientations with respect to each other. FIG.1depicts an example of an electronic device100. In this example, the electronic device is a laptop. In the illustrated example, the electronic device100includes input components, such as a keyboard102and a capacitive module, such as a touch pad104, that are incorporated into a housing103. The electronic device100also includes a display106. A program operated by the electronic device100may be depicted in the display106and controlled by a sequence of instructions that are provided by the user through the keyboard102and/or through the touch pad104. An internal battery (not shown) may be used to power the operations of the electronic device100. The keyboard102includes an arrangement of keys108that can be individually selected when a user presses on a key with a sufficient force to cause the key108to be depressed towards a switch located underneath the keyboard102. In response to selecting a key108, a program may receive instructions on how to operate, such as a word processing program determining which types of words to process. A user may use the touch pad104to give different types of instructions to the programs operating on the computing device100. For example, a cursor depicted in the display106may be controlled through the touch pad104. A user may control the location of the cursor by sliding his or her hand along the surface of the touch pad104. In some cases, the user may move the cursor to be located at or near an object in the computing device's display and give a command through the touch pad104to select that object. For example, the user may provide instructions to select the object by tapping the surface of the touch pad104one or more times. The touch pad104is a capacitance module that includes a stack of layers disposed underneath the keyboard housing, underneath an overlay that is fitted into an opening of the keyboard housing, or underneath another capacitive reference surface. In some examples, the capacitance module is located in an area of the keyboard's surface where the user's palms may rest while typing. The capacitance module may include a substrate, such as a printed circuit board or another type of substrate. One of the layers of the capacitance module may include a sensor layer that includes a first set of electrodes oriented in a first direction and a second layer of electrodes oriented in a second direction that is transverse the first direction. These electrodes may be spaced apart and/or electrically isolated from each other. The electrical isolation may be accomplished by deposited at least a portion of the electrodes on different sides of the same substrate or providing dedicated substrates for each set of electrodes. Capacitance may be measured at the overlapping intersections between the different sets of electrodes. However, as an object with a different dielectric value than the surrounding air (e.g., finger, stylus, etc.) approach the intersections between the electrodes, the capacitance between the electrodes may change. This change in capacitance and the associated location of the object in relation to the capacitance module may be calculated to determine where the user is touching or hovering the object within the detection range of the capacitance module. In some examples, the first set of electrodes and the second set of electrodes are equidistantly spaced with respect to each other. Thus, in these examples, the sensitivity of the capacitance module is the same in both directions. However, in other examples, the distance between the electrodes may be non-uniformly spaced to provide greater sensitivity for movements in certain directions. In some cases, the display106is mechanically separate and movable with respect to the keyboard with a connection mechanism114. In these examples, the display106and keyboard102may be connected and movable with respect to one another. The display106may be movable within a range of 0 degrees to 180 degrees or more with respect to the keyboard102. In some examples, the display106may fold over onto the upper surface of the keyboard102when in a closed position, and the display106may be folded away from the keyboard102when the display106is in an operating position. In some examples, the display106may be orientable with respect to the keyboard102at an angle between 35 to 135 degrees when in use by the user. However, in these examples, the display106may be positionable at any angle desired by the user. In some examples, the display106may be a non-touch sensitive display. However, in other examples at least a portion of the display106is touch sensitive. In these examples, the touch sensitive display may also include a capacitance module that is located behind an outside surface of the display106. As a user's finger or other object approaches the touch sensitive screen, the capacitance module may detect a change in capacitance as an input from the user. While the example ofFIG.1depicts an example of the electronic device being a laptop, the capacitance sensor and touch surface may be incorporated into any appropriate device. A non-exhaustive list of devices includes, but is not limited to, a desktop, a display, a screen, a kiosk, a computing device, an electronic tablet, a smart phone, a location sensor, a card reading sensor, another type of electronic device, another type of device, or combinations thereof. FIG.2depicts an example of a portion of a capacitance module200. In this example, the capacitance module200may include a substrate202, first set204of electrodes, and a second set206of electrodes. The first and second sets204,206of electrodes may be oriented to be transverse to each other. Further, the first and second sets204,206of electrodes may be electrically isolated from one another so that the electrodes do not short to each other. However, where electrodes from the first set204overlap with electrodes from the second set206, capacitance can be measured. The capacitance module200may include one or more electrodes in the first set204or the second set206. Such a substrate202and electrode sets may be incorporated into a touch screen, a touch pad, a location sensor, a gaming controller, a button, and/or detection circuitry. In some examples, the capacitance module200is a mutual capacitance sensing device. In such an example, the substrate202has a set204of row electrodes and a set206of column electrodes that define the touch/proximity-sensitive area of the component. In some cases, the component is configured as a rectangular grid of an appropriate number of electrodes (e.g., 8-by-6, 16-by-12, 9-by-15, or the like). As shown inFIG.2, the capacitance module208includes a capacitance controller208. The capacitance controller208may include at least one of a central processing unit (CPU), a digital signal processor (DSP), an analog front end (AFE) including amplifiers, a peripheral interface controller (PIC), another type of microprocessor, and/or combinations thereof, and may be implemented as an integrated circuit, a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), a combination of logic gate circuitry, other types of digital or analog electrical design components, or combinations thereof, with appropriate circuitry, hardware, firmware, and/or software to choose from available modes of operation. In some cases, the capacitance controller208includes at least one multiplexing circuit to alternate which of the sets204,206of electrodes are operating as drive electrodes and sense electrodes. The driving electrodes can be driven one at a time in sequence, or randomly, or drive multiple electrodes at the same time in encoded patterns. Other configurations are possible such as a self-capacitance mode where the electrodes are driven and sensed simultaneously. Electrodes may also be arranged in non-rectangular arrays, such as radial patterns, linear strings, or the like. A shield layer (seeFIG.3) may be provided beneath the electrodes to reduce noise or other interference. The shield may extend beyond the grid of electrodes. Other configurations are also possible. In some cases, no fixed reference point is used for measurements. The touch controller208may generate signals that are sent directly to the first or second sets204,206of electrodes in various patterns. In some cases, the component does not depend upon an absolute capacitive measurement to determine the location of a finger (or stylus, pointer, or other object) on a surface of the capacitance module200. The capacitance module200may measure an imbalance in electrical charge to the electrode functioning as a sense electrode which can, in some examples, be any of the electrodes designated in either set204,206or, in other examples, with dedicated-sense electrodes. When no pointing object is on or near the capacitance module200, the capacitance controller208may be in a balanced state, and there is no signal on the sense electrode. When a finger or other pointing object creates imbalance because of capacitive coupling, a change in capacitance may occur at the intersections between the sets of electrodes204,206that make up the touch/proximity sensitive area. In some cases, the change in capacitance is measured. However, in alternative example, the absolute capacitance value may be measured. While this example has been described with the capacitance module200having the flexibility of the switching the sets204,206of electrodes between sense and transmit electrodes, in other examples, each set of electrodes is dedicated to either a transmit function or a sense function. FIG.3depicts an example of a substrate202with a first set204of electrodes and a second set206of electrodes deposited on the substrate202that is incorporated into a capacitance module. The first set204of electrodes and the second set206of electrodes may be spaced apart from each other and electrically isolated from each other. In the example depicted inFIG.3, the first set204of electrodes is deposited on a first side of the substrate202, and the second set206of electrodes is deposited on the second side of the substrate202, where the second side is opposite the first side and spaced apart by the thickness of the substrate202. The substrate may be made of an electrically insulating material thereby preventing the first and second sets204,206of electrodes from shorting to each other. As depicted inFIG.2, the first set204of electrodes and the second set206of electrodes may be oriented transversely to one another. Capacitance measurements may be taken where the intersections with the electrodes from the first set204and the second set206overlap. In some examples, a voltage may be applied to the transmit electrodes and the voltage of a sense electrode that overlaps with the transmit electrode may be measured. The voltage from the sense electrode may be used to determine the capacitance at the intersection where the sense electrode overlaps with the transmit electrode. In the example ofFIG.3depicting a cross section of a capacitance module, the substrate202may be located between a capacitance reference surface212and a shield214. The capacitance reference surface212may be a covering that is placed over the first side of the substrate202and that is at least partially transparent to electric fields. As a user's finger or stylus approach the capacitance reference surface212, the presence of the finger or the stylus may affect the electric fields on the substrate202. With the presence of the finger or the stylus, the voltage measured from the sense electrode may be different than when the finger or the stylus are not present. As a result, the change in capacitance may be measured. The shield214may be an electrically conductive layer that shields electric noise from the internal components of the electronic device. This shield may prevent influence on the electric fields on the substrate202. In some cases, the shield is solid piece of material that is electrically conductive. In other cases, the shield has a substrate and an electrically conductive material disposed on at least one substrate. In yet other examples, the shield is layer in the touch pad that performs a function and also shields the electrodes from electrically interfering noise. For example, in some examples, a pixel layer in display applications may form images that are visible through the capacitance reference surface, but also shields the electrodes from the electrical noise. The voltage applied to the transmit electrodes may be carried through an electrical connection216from the touch controller208to the appropriate set of electrodes. The voltage applied to the sense electrode through the electric fields generated from the transmit electrode may be detected through the electrical connection218from the sense electrodes to the touch controller208. While the example ofFIG.3has been depicted as having both sets of electrodes deposited on a substrate, one set of electrodes deposited on a first side and a second set of electrodes deposited on a second side; in other examples, each set of electrodes may be deposited on its own dedicated substrate. Further, while the examples above describe a touch pad with a first set of electrodes and a second set of electrodes; in some examples, the capacitance module has a single set of electrodes. In such an example, the electrodes of the sensor layer may function as both the transmit and the receive electrodes. In some cases, a voltage may be applied to an electrode for a duration of time, which changes the capacitance surrounding the electrode. At the conclusion of the duration of time, the application of the voltage is discontinued. Then a voltage may be measured from the same electrode to determine the capacitance. If there is no object (e.g., finger, stylus, etc.) on or in the proximity of the capacitance reference surface, then the measured voltage off of the electrode after the voltage is discontinued may be at a value that is consistent with a baseline capacitance. However, if an object is touching or in proximity to the capacitance reference surface, then the measured voltage may indicate a change in capacitance from the baseline capacitance. In some examples, the capacitance module has a first set of electrodes and a second set of electrodes and is communication with a controller that is set up to run both mutual capacitance measurements (e.g., using both the first set and the second set of electrodes to take a capacitance measurement) or self-capacitance measurements (e.g., using just one set of electrodes to take a capacitance measurement). FIG.4depicts an example of a capacitance module incorporated into a touch screen. In this example, the substrate202, sets of electrodes204,206, and electrical connections216,218may be similar to the arrangement described in conjunction withFIG.3. In the example ofFIG.4, the shield214is located between the substrate202and a display layer400. The display layer400may be a layer of pixels or diodes that illuminate to generate an image. The display layer may be a liquid crystal display, a light emitting diode display, an organic light emitting diode display, an electroluminescent display, a quantum dot light emitting diode display, an incandescent filaments display, a vacuum florescent display, a cathode gas display, another type of display, or combinations thereof. In this example, the shield214, the substrate202, and the capacitance reference surface212may all be at least partially optically transparent to allow the image depicted in the display layer to be visible to the user through the capacitance reference surface212. Such a touch screen may be included in a monitor, a display assembly, a laptop, a mobile phone, a mobile device, an electronic tablet, a dashboard, a display panel, an infotainment device, another type of electronic device, or combinations thereof. FIG.5adepicts an example of a sensor layer500in accordance with the present disclosure. In this example, the sensor layer500contains a capacitance sensor502, a shield feature501, and an antenna503. The capacitance sensor502contains a first set504of electrodes and a second set505of electrodes, which cross each other. The electrodes of the first set504of electrodes may be sense electrodes, transmit electrodes, or another type of electrodes. The electrodes of the second set505of electrodes may be sense electrodes, transmit electrodes, or another type of electrodes. The electrodes of the first set504and second set505of electrodes may be printed, etched, or otherwise formed on the sensor layer500. Together, the first set504and second set505of electrodes may form a mutual capacitance sensor. This example depicts the capacitance sensor502as a mutual capacitance sensor that has two sets of electrodes. In other examples, a capacitance sensor may be a self-capacitance sensor, utilizing only a single set of electrodes. Therefore, while the capacitance sensor502contains two sets of electrodes in this example, a capacitance sensor may include one set of electrodes, two sets of electrodes, three sets of electrodes, a different number of sets of electrodes, or combinations thereof. When two electrodes are formed on the same layer, one of the electrodes may be routed through the substrate of a layer so that the two electrodes do not come into contact at the junctions where the individual electrodes of the first set504and the second505cross. In this example, the electrodes from the first set504of electrodes may be routed through the substrate of the sensor layer500to avoid contact with the electrodes from the second set505of electrodes (seeFIG.5b). The sensor layer502may contain an antenna503. The antenna may be used to transmit a wireless signal according to a Wi-Fi protocol, short-range wireless protocol, NFC protocol, or Zigbee protocol. In this example, the antenna503has a square wave shape, which may be used to transmit a wireless signal according to a Wi-Fi protocol or short-range wireless protocol. While this example depicts the antenna503with a square wave shape, an antenna may have a different shape. For example, an antenna may have a square wave shape, spiral shape, a linear shape, another type of shape, or combinations thereof. While a single antenna is identified in the sensor layer500, a sensor layer may include a different number of antennas. In other examples, a sensor layer may include one antenna, two antennas, three antennas, a different number of antennas, or combinations thereof. In this example, the shield feature501surrounds capacitance sensor502. The shield feature501may include a ground ring, which may be made of copper, galvanized steel, another type of grounding material, or a combination thereof. In cases where the shield feature501includes a ground ring, the ground ring may be etched, printed, or otherwise formed on the sensor layer500. While in this example the shield feature501surrounds the capacitance sensor502, in other examples, a shield feature may be positioned differently on a sensor layer. For example, a shield feature may surround only part of a sensor, or surround an antenna, or surround only part of an antenna, etc. While the shield feature501has a rectangular shape in this example, a shield feature may have many shapes. In other examples, a shield feature may have a spiral shape, a square shape, a rectangular shape, a circular shape, a symmetric shape, an unsymmetric shape, another type of shape, or a combination thereof. While the shield feature501is continuous and only includes one section in this example, in other examples, a shield feature may be discontinuous and/or include multiple sections on the surface of the substrate. Shield features that are discontinuous and/or include multiple sections may isolate two electrical elements from each other. The mutual capacitance sensor formed by the first set504and second set505of electrodes may be sensitive to electrical interference that may originate from the antenna503. In some examples, by placing the shield feature501between the capacitive sensor502and the antenna503, the capacitive sensor may be electrically isolated from interference from the antenna, and the antenna may be electrically isolated from interference that may originate from the capacitive sensor. Because the shield feature501enables the capacitive sensor502and antenna503to operate without interfering with each other, the capacitive sensor and antenna may be placed on the same layer. Placing the antenna504and capacitive sensor502on the same layer may presents several advantages, including reducing the size of a capacitance module and reducing material cost. FIG.5bdepicts a cross sectional view of the sensor layer500depicted inFIG.5a. The shield feature501, which surrounds the capacitive sensor502, extends vertically from the sensor layer500further than the electrodes from either the first set504or the second set505of electrodes extend from the sensor layer500. The shield feature501may also extend vertically from the sensor layer500further than the antenna503extends from the sensor layer. By extending vertically further from the sensor layer500, the shield feature501may better reduce interference between the capacitance sensor502and antenna503compared to a shield feature that did not extend as much. In such examples, the vertical height of the shield feature may be greater than at least one electrode of the sensor, the antenna, or combinations thereof. In other examples, the shield feature, antenna, and at least one electrode has the same height. In yet another example, at least one electrode and/or the antenna has a greater height than the shield feature. The electrodes from the first set504of electrodes may be routed through the substrate of the sensor layer500. By being routed through the substate, the electrodes504may avoid physical contact with the electrodes from the second set505of electrodes. Routing one set of electrodes through the substrate may prevent two electrodes from touching each other and shorting out. FIG.6depicts an example of a stack of layers600in accordance with the present disclosure. In this example, the stack600includes a sensor layer601, a shield layer602, and a component layer603. Although three layers are identified in the stack600, a stack of layers may include more or less layers. For example, a stack may include two layers, four layers, another number of layers, or combinations thereof. In some examples, the sensor may constructed using multiple layers. In the depicted example, the sensor layer601includes a first set608of electrodes and a second set609of electrodes. The electrodes of the first and second sets608,609of electrodes may be sense electrodes, transmit electrodes, or another type of electrodes. Together, the first set608of electrodes and second set609of electrodes may form a mutual capacitance sensor. The sensor layer601includes a shield feature604. The shield feature604is placed between the mutual capacitance sensor formed by the first set608and second set609of electrodes and the antenna605. In this example, the shield feature604is a ground ring that surrounds the mutual capacitance sensor. In this example, the shield feature604is continuous and includes only one section, although in other examples a shield feature may be discontinuous and/or include more than one section. The shield feature604may prevent electrical interference between the antenna605and the electrodes from the first set608and second set609of electrodes. A shield feature may be grounded. In this example, the shield feature604is routed through the substrate of the sensor layer601and through the substrate of the component layer603. The shield feature604may be connected to a grounding deposit607on the component layer603which grounds the shield feature. The grounding deposit may be made of copper, gold, iron, another type of grounding material, or a combination thereof. In some examples, the grounding deposit may be constructed to connect to a frame of an electric device, such as a casing of a laptop, a mobile device, electronic tablet, or another type of ground. The component layer603may contain several components610that are used to operate the capacitance module. Components may include but are not limited to a central processing unit (CPU), a digital signal processor (DSP), an analog front end (AFE), an amplifier, a peripheral interface controller (PIC), another type of microprocessor, an integrated circuit, a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), a combination of logic gate circuitry, other types of digital or analog electrical components, or combinations thereof. The stack of layers600includes a shield layer602. The shield layer602may be made of a material constructed to block electrical interference, such as copper, aluminum, another appropriate shielding material, or a combination thereof. The shield layer602may be positioned adjacent to the sensor layer601to shield the electrically sensitive elements on the sensor layer, such as the first set608of electrodes, the second set609of electrodes, or the antenna605. In some examples, the shield feature604may pass through or around the sensor layer601and the component layer603, the shield feature604and the shield layer602may be electrically isolated from each other. To accommodate the shield feature604, the shield layer602is shaped and positioned such that the shield feature may pass by the shield layer without touching it. The shield feature604may conduct some voltage from either the antenna605or the electrodes from the first set608and second set609of electrodes. By keeping the shield feature604and the shield layer603electrically isolated from each other, the shield layer may shield the sensor layer601from interference more effectively than if the shield feature and shield layer were connected. WhileFIG.6depicts an example a sensor layer where two sets of electrodes are formed on one side of the layer, electrodes may be positioned differently in a stack of layers. For instance, in examples where a stack includes two sets of electrodes, a first set of electrodes may be on one side of a sensor layer and a second set may be on another side of the same sensor layer, or a first set of electrodes may be on a first sensor layer while a second set of electrodes is on a second sensor layer in the stack. FIG.7depicts an example of a stack of layers700in accordance with the present disclosure. In this example, the stack of layers700includes a sensor layer701, the shield layer602, and the component layer603. While three layers are identified in the stack of layers700, a stack of layers may include a different number of layers. The sensor layer701includes the antenna605, the first set608of electrodes, the second set609of electrodes and a shield feature702between the first set and second set of electrodes. In this example, the first set608of electrodes is formed on a first side of the sensor layer701and the second set609of electrodes is formed on a second side of the sensor layer. By forming the first set608and second set609of electrodes on different sides of the same layer, the sets of electrodes are isolated from one another without having to route one of the sets of electrodes through the substrate. The shield feature702surrounds the first set608and second set609of electrodes and is located between the sets of electrodes and the antenna605. Because the first set608and second set609of electrodes are on two sides of the sensor layer701, the shield feature is also formed on the two sides of the layer. The shield feature701is continuous and is routed through the substrate of the sensor layer701. The shield feature701passes the shield layer609and routes through the substrate of the component layer603where it connects to the grounding deposit607. In this example, the grounding deposit607grounds the shield feature702. FIG.8depicts an example of a stack of layers800in accordance with the present disclosure. The stack of layers800includes a first sensor layer801, a second sensor layer802, a shield layer803, and a component layer. While four layers are identified in the stack of layers800, a stack of layers may have a different number of layers. The first sensor layer contains the antenna605which broadcasts a wireless transmission606. The first set608of electrodes is formed on the first sensor layer801. Surrounding the first set608of electrodes, a first portion805aof the shield feature is formed between the first set of electrodes and the antenna605. The first portion805aof the shield feature may help to isolate the antenna605from the first set608of electrodes and prevent the two from electrically interfering with each other. The first portion805aof the shield feature is routed through the substrate of the first sensor layer801and connects to a third portion805cof the shield feature. The second sensor layer contains the second set609of electrodes. A second portion805bof the shield feature surrounds the second set609of electrodes. The second portion805bof the shield feature may help to isolate the antenna605from the second set609of electrodes and prevent the two from electrically interfering with each other. The second portion805bof the shield feature is routed through the substrate of the second sensor layer802and connects to the third portion805cof the shield feature. While, in this example, the antenna605is located on the first sensor layer, in examples where a stack of layers includes more than one sensor layer, an antenna may be located on any of the sensor layers. For example, in examples where a stack of layers includes two sensor layers, an antenna may be formed on a first sensor layer or a second sensor layer. In examples, where a stack of layers includes three sensor layers, an antenna may be formed on a first sensor layer, a second sensor layer, or a third sensor layer, and so on. While the stack of layers800includes only one antenna, a stack of layers may include a different number of antennas. For example, a stack may include two antennas, three antennas, or a different number of antennas. In examples where a stack includes more than one sensor layer, a first antenna may be formed on a first sensor layer while a second antenna may be formed on a second sensor layer, or a first and second antenna may be formed on a first sensor layer, etc. The third portion805cof the shield feature passes by the shield layer803. The third portion805cof the shield feature and the shield layer803are electrically independent from each other. The shield layer804may be made of a material constructed to block electrical interference, such as copper, aluminum, another appropriate shielding material, or a combination thereof. The shield layer804may be positioned adjacent to the sensor layers801,802to shield the electrically sensitive elements on the sensor layers, such as the first set608of electrodes, the second set609of electrodes, or the antenna605. The third portion805cof the shield feature is routed through the substrate of the component layer804, where it connects to the grounding deposit607. The grounding deposit607grounds the third portion805cof the shield feature and consequently grounds the first and second portions805a,805bof the shield feature which are connected to the third portion. FIG.9depicts an example of a stack of layers900in accordance with the present disclosure. In this example, the antenna605is located on the second sensor layer802. FIG.10depicts an example of a stack of layers1000in accordance with the present disclosure. In this example, a shield feature1005surrounds the antenna605. In this example, the shield feature1005is a ground ring. The shield feature1005is routed through the first sensor layer801and the second sensor layer802. The shield feature1005is electrically independent from the shield layer803and passes by it on one side. The shield feature1005routes through the component layer804where it is connected to the grounding deposit607. The grounding deposit607grounds the shield feature1005. By surrounding the antenna605with the shield feature1005, the shield feature may electrically insulate the antenna from the electrodes of the first set608and second set609of electrodes. Placing the shield feature1005between the antenna605and first set608and second set609of electrodes may prevent the elements from interfering with each other. FIG.11depicts an example of a stack of layer1100in accordance with the present disclosure. In this example, a first portion1101aof a shield feature surrounds the first set608of electrodes and a second portion1101bof the shield feature surrounds the second set609of electrodes. In contrast to examples where a shield feature is continuous and grounded (seeFIGS.6-10), the shield feature in this example is discontinuous and ungrounded. The first portion1101aof the shield feature is electrically independent from the second portion1101bof the shield feature and both are ungrounded. Shield features that are ungrounded may be easier to form on a layer, while still shielding an antenna from a set of electrodes and vice versa. In some cases, an ungrounded and discontinuous shield feature may reduce the flow of electrons in the shield feature, which may reduce a temperature increase that may occur in some instances where the antenna induces an electrical current flow in the shield feature. In some cases, the shield feature is discontinuous in the substrate surface. In some cases, segments of the shield feature are electrically connected to one another by joining the segments to each other by routing the shield element together on a different layer. In yet another example, the segments of the shield feature are electrically independent of each other. In still yet another example, the shield feature is continuous, but is ungrounded. FIG.12adepicts an example of a sensor layer1200in accordance with the present disclosure. In this example, the sensor layer1200includes an antenna1201, a shield feature1202, a first set1203of electrodes, and a second set1204of electrodes. For illustrative purposes, a close-up1205of the sensor layer1200depicts a portion of the layer in greater detail. The sensor layer1200includes the antenna1201. While one antenna is included in the sensor layer1200, in other examples, a sensor layer may include more than one antenna. The antenna1201is placed on one side of the sensor layer1201and has a square wave shape. This shape may be used to transmit a wireless signal according to a Wi-Fi protocol or short-range wireless protocol. The first set1203and second set1204of electrodes are placed on another side of the sensor layer1200apart from the antenna1201. In this example, the electrodes from the first and second set1203,1204of electrodes cross each other. The electrodes from the first set1203and second set1204of electrodes may be sense electrodes, transmit electrodes, or type of electrodes. The first set1203and second set1204of electrodes form a mutual capacitance sensor1206. While the electrodes in this example form a mutual capacitance sensor, in other examples, electrodes may form a different type of capacitive sensor, such as a self-capacitance sensor. In this example, the electrodes from the first set1203and second set1204of electrodes are electrically independent from each other. By remaining electrically independent from each other, the first and second set1203,1204of electrodes are prevented from shorting each other out. In locations where an electrode from the first set1203crosses an electrode from the second set1204, the electrode from the second set may be routed through the substrate of the sensor layer1200. In this way, the electrodes remain electrical independent from each other and do not touch. The shield feature1202surrounds a portion of the mutual capacitance sensor1206on the sensor layer1200. In this example, the shield feature1202is a ground ring. The shield feature1202may electrically isolate the mutual capacitance sensor1206from the antenna1201. By placing the shield feature1202between at least part of the mutual capacitance sensor1206and the antenna1201, interference to the capacitance sensor from the antenna may be reduced and vice versa. Part of the mutual capacitance sensor1206is outside of the perimeter of the shield feature1202, leaving a portion of the sensor exposed to the antenna1201. By extending the mutual capacitance sensor1206beyond the limits of the shield feature1202, the sensitive region of the capacitance module may be extended. The shield feature1202is electrically independent from the electrodes of the first set1203and second set1204of electrodes which form the mutual capacitance sensor1206. To preserve their electrical independence, wherever the shield feature1202and electrodes from the first or second set1203,1204of electrodes would overlap, electrodes may be routed through the substrate of the sensor layer1200to prevent contact. In this example, the electrodes from the first set1203of electrodes are routed through the substrate of the sensor layer under the shield feature1202. For illustrative purposes, the close-up1205of the sensor layer1200illustrates both the electrical independence of the first set1203of electrodes from the second set1204of electrodes and the electrical independence of the first set of electrodes from the shield feature1202. Electrodes from the second set1204of electrodes are routed through the substrate of the sensor layer1200underneath electrodes from the first set1203of electrodes. The electrodes from the first set1203do not physically touch electrodes from the second set1204of electrodes. Electrodes from the first set1203of electrodes are routed through the substrate of the sensor layer1200underneath the shield feature1202. The electrodes from the first set1203of electrodes do not physically touch the shield feature1202. FIG.12bdepicts an example of the sensor layer1200. For illustrative purposes, the sensor layer1200is depicted from the side in this example.FIG.12billustrates how the electrodes from the first set1203of electrodes are routed through the substrate of the sensor layer1200underneath the shield feature1202to avoid contact with the shield feature. While previous examples depict shield features with a square shape (seeFIGS.5a&12a), a shield feature may have a different shape.FIG.13depicts an example of a sensor layer1300in accordance with the present disclosure. The sensor layer1300includes an antenna1301, a shield feature1302, and a set1304of electrodes. The antenna1301is formed on one portion of the sensor layer1300. The antenna has a square wave shape, which may be used to transmit a wireless signal according to a Wi-Fi protocol or short-range wireless protocol. Although the sensor layer1300includes a single antenna1301in this example, in other examples, a sensor layer may include more than one antenna. The set1303of electrodes1304are placed along the width of the sensor layer1300. The electrodes1304may be sense electrodes, transmit electrodes, or another type of electrodes. The set1303of electrodes1304forms a self-capacitance sensor1306. The electrodes1304that form the self-capacitance sensor1306extend along each side of the antenna1301. By extending along the sides of the antenna1301, the electrodes1304occupy a greater portion of the sensor layer1300than they would otherwise, which may increase the size of the sensing region of the sensor layer. The shield feature1302surrounds the self-capacitance sensor1306. The shield feature1302is placed between the antenna1301and the electrodes1304that form the self-capacitance sensor1306. By placing the shield feature1302in between the antenna1301and the self-capacitance sensor1306, the antenna and the capacitance sensor may be electrically insulated from each other. The shield feature1302may prevent electrical interference to the self-capacitance sensor1306from the antenna1301and vice versa. The shield feature1302has an 8-sided shape to fully surround the self-capacitance sensor1306. FIG.14depicts an example of a sensor layer1400in accordance with the present disclosure. The sensor layer1400includes an antenna1404, a first set1402of electrodes, a second set1403of electrodes, and a shield feature1401. The antenna1404surrounds the shield feature1401along with the first and second set1402,1403of electrodes. The antenna1404has a spiral shape that may be used to transmit a wireless signal according to an NFC protocol. The first set1402of electrodes and the second set1403of electrodes may contain sense electrodes, transmit electrodes, another type of electrodes, or combinations thereof. In this example, the first set1402of electrodes and the second set1403of electrodes cross each other. The first set1402of electrodes and the second set1403of electrodes form a mutual capacitance sensor1405. While this example depicts a sensor layer1400including a mutual capacitance sensor1405, in other examples, a sensor layer may include a different type of sensor, such as a self-capacitance sensor. In this example, the shield feature1401surrounds the mutual capacitance sensor1405and is surrounded by the antenna1404. The shield feature1401is placed in between the mutual capacitance sensor1405and the antenna1404. The shield feature1401may prevent electrical and/or magnetic interference between the antenna1404and the mutual capacitance sensor1405. In some examples, the shield feature may include a material that is electrically conductive and magnetically conductive. In other examples, the material may be electrically conductive, but magnetically insulating. In yet other examples, the material may be magnetically conductive and electrically insulating. One example of a magnetically conductive, but electrically insulating material is ferrite material. The shield feature may be made of a single material, multiple materials, layers of materials, or combinations thereof. FIG.15adepicts an example of a sensor layer1500in accordance with the present disclosure. The sensor layer1500includes an antenna1501, a first portion1502aof a shield feature, a second portion1502bof the shield feature, a third portion1502cof the shield feature, a first set1503of electrodes, and a second set1504of electrodes. The antenna1501may be formed on one part of the sensor layer1500. The antenna1501has a square wave shape, which may be used to transmit a wireless signal according to a Wi-Fi protocol or short-range wireless protocol. The antenna1501may be made of copper, gold, another appropriate antenna material, or combinations thereof. The antenna1501may be etched, printed, or otherwise formed on the sensor layer1500. While the sensor layer1500includes one antenna1501, in other examples, a sensor layer may include multiple antennas. The first set1503of electrodes and the second set1504of electrodes may contain sense electrodes, transmit electrodes, another type of electrodes, or combinations thereof. In this example, the first set1503and second set1504of electrodes cross each other. The first set1504and second set1504of electrodes form a mutual capacitance sensor1510. While the sensor layer in this example contains a mutual capacitance sensor1510, in other examples, a sensor layer may contain a different type of sensor such as a self-capacitance sensor. The electrodes from the first set1503of electrodes and the second set1504of electrodes are electrically independent from each other. Where an electrode from the first set1504crosses an electrode from the second set1504, the electrode from the second set may be routed through the substrate of the sensor layer1500. By routing one electrode through the sensor layer1500, the two electrodes remain electrically independent from each other and do not touch. The mutual capacitance sensor1510may be surrounded by a shield feature that includes a first portion1502a, second portion1502b, and third portion1502c. The first portion1502of the shield feature is located between the mutual capacitance sensor1510and the antenna1501and may prevent electrical interference between the antenna and the sensor. The second portion1502bis located along one side of the mutual capacitance sensor. The third portion1502cis located along another side of the mutual capacitance sensor. In examples where a shield feature includes multiple portions, the portions may be connected to each other through vias in the substrate or some other method, or the portions may be electrically independent from each other. It is also possible for some portions of a shield feature to be connected, while other portions of the same shield feature are electrically independent. In examples where a shield feature includes multiple portions, some portions may be grounded, while other portions may be electrically independent. In this example, the first portion1502, the second portion1502b, and the third portion1502cof the shield feature are all electrically independent from each other. Separating a shield feature into multiple portions may present a few advantages, including, but not limited to, reducing material cost, reinforcing certain portions of a sensor layer which may need additional shielding between elements, and reducing the footprint of a shield feature on a sensor layer, which may help to reduce size. Gaps between portions of a shield feature might be located in positions where shielding is not necessary, so that interference caused by a gap of shielding material may be minimized. Such gaps may be located where they are not in between two electrical elements. For example, a gap1511between the second portion1502band the third portion1502cof the shield feature is placed so it is only adjacent to the mutual capacitance sensor1510. In other examples, the gap may be located in other regions of the shield feature. FIG.15bdepicts an example of a stack of layers1512in accordance with the present disclosure. The stack of layers1512includes the sensor layer1500described inFIG.15a, a shield layer1505, and a component layer1506. For illustrative purposes, the layers of the stack of layers1512are shown from a side view. The first portion1502aof the shield feature is routed through the substrate of the sensor layer1500. The first portion1502aof the shield feature passes by the shield layer1505and is routed through the component layer1506where it is connected to a grounding deposit1508. The grounding deposit1508may be made of copper, gold, another appropriate grounding material, or a combination thereof. The grounding deposit1508grounds the first portion1502aof the shield feature. The second portion1502band the third portion1502c(portion1502cis not pictured inFIG.15b) of the shield feature are not grounded to the grounding feature1508, whereas the first portion1502aof the shield feature is grounded to the grounding feature. Grounding the second portion1502band third portion1502cof the shield feature may not be necessary for the second or third portion to shield the capacitance sensor1510. By keeping the second portion1502band third portion1502cof the shield feature electrically independent from both the first portion1502aof the shield feature and the grounding deposit1508, the materials that would otherwise ground them may be saved, reducing the cost, complexity, and size of the apparatus. Where an electrode from the first set1503crosses an electrode from the second set1504, the electrode from the second set may be routed through the substrate of the sensor layer1500. In this way, the first set1503of electrodes is electrically independent from the second set1504. The shield layer1505may be made of copper, steel, or another appropriate shielding material that may be etched, printed, or otherwise formed on a substrate. The shield layer1505may prevent electrical and/or magnetic interference from interfering with the sensitive electrical elements on the sensor layer1500, such as the antenna1501or the mutual capacitance sensor1510. The shield layer1505is electrically independent from the first portion1502aof the shield feature. As the shield feature shields electrical signals on the sensor layer, the shield feature may pick up electrical signals. By keeping the shield layer1505electrically independent from the shield feature, the shield layer may be prevented from conducting and propagating any electrical signals that the shield feature may pick up. The component layer1506includes components1507and the grounding deposit1508. The components1507may be used to operate the capacitance module. Components may include but are not limited to a central processing unit (CPU), a digital signal processor (DSP), an analog front end (AFE), an amplifier, a peripheral interface controller (PIC), another type of microprocessor, an integrated circuit, a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), a combination of logic gate circuitry, other types of digital or analog electrical components, or combinations thereof. FIG.16adepicts an example of a sensor layer1600in accordance with the present disclosure. The sensor layer1600includes the antenna1501, a first portion1602aof a shield feature, a second portion1602bof the shield feature, a third portion1602cof the shield feature, and a set1604of electrodes. The set1604of electrodes may include sense electrodes, transmit electrodes, or another type of electrodes. The set1604of electrodes forms a self-capacitance sensor1610. The first portion1602aof the shield feature is located in between the antenna1501and the self-capacitance sensor1610. The first portion1602aof the shield feature may prevent electrical interference to the self-capacitance sensor1610from the antenna1501and vice versa. The second portion1602band the third portion1602cof the shield feature surround the self-capacitance sensor1610together with the first portion1602aof the shield feature. FIG.16bdepicts an example of a stack of layers1612in accordance with the disclosure. The stack of layers1612in this example may include the sensor layer1600described inFIG.16a, the shield layer1505described inFIG.15b, and the component layer1506described inFIG.15b. In this example, the first portion1602a, second portion1602b, and third portion1602cof the shield feature are each routed through the substrate of the sensor layer1600and connected to each other. The shield feature1602is routed past the shield layer1505and through the substrate of the component layer1506, where it is connected to the grounding deposit1508. The grounding deposit1508may provide a connection to ground. FIG.17adepicts an example of a sensor layer1700in accordance with the present disclosure. The sensor layer1700includes the antenna1501, the self-capacitance sensor1610, a first portion1702aof a shield feature, and a second portion1702bof the shield feature. In some embodiments, additional portions of a shield feature may be included between two elements, such as an antenna and a capacitive sensor. By placing an additional portion between two elements, the shield feature may more effectively prevent interreference between the two elements. In this example, a first portion1702aof the shield feature and a second portion1702bare formed on the sensor layer1700to prevent electrical interference between the antenna1501and the self-capacitance sensor1610. The first portion1702aof the shield feature is located between the antenna1501and one side of the second portion1702bof the shield feature. The first portion1702aprovides additional shielding between the antenna1501and the self-capacitance sensor1610and may help prevent electrical interference between the two elements. The second portion1702bof the shield feature is a ground ring which surrounds the self-capacitance sensor. The second portion1702bof the shield feature prevents electrical interference to the self-capacitance sensor1610from the antenna1501and vice versa. FIG.17bdepicts an example of a stack of layers1712in accordance with the present disclosure. The stack of layer1712may include the sensor layer1700described inFIG.17a, the shield layer1505, and the component layer1506. The first portion1702aof the shield feature and the second portion1702bof the shield feature on the sensor layer are routed through the substrate of the sensor layer1700and connected to each other. The shield feature1702passes by the shield layer1505and is routed through the substrate of the component layer1506, where it is connected to the grounding deposit1508. FIG.18depicts an example of a sensor layer1800in accordance with the present disclosure. The sensor layer1800includes an antenna1801, a shield feature1802, a first set1803of electrodes, and a second set1804of electrodes. The antenna1801is located on one part of the sensor layer1800and has a spiral shape. This shape of antenna may be used to transmit a wireless signal according to an NFC protocol. The antenna1801may be made of copper, gold, another appropriate material, or a combination thereof. The antenna1801may be printed, etched, or otherwise formed on the sensor layer. While in this example the sensor layer1800contains just one antenna1801, in other examples, a sensor layer1800may contain more than one antenna. The first set1803of electrodes and the second set1804of electrodes may be transmit electrodes, sense electrodes, another type of electrodes, or combinations thereof. The first set1803and second set1804of electrodes form a mutual capacitance sensor. The first and second sets1803,1804of electrodes are electrically independent from each other. Where an electrode from the first set1803of electrodes crosses an electrode from the second set1804of electrodes, an electrode from either the first set of electrodes or second set of electrodes may be routed through the substrate of the sensor layer1800underneath the other electrode, preserving the electrical independence of the two sets of electrodes. The shield feature1802surrounds the mutual capacitance sensor formed by the first set1803and second set1804of electrodes. In this example, the shield feature is a ground ring. The shield feature1802is located in between the mutual capacitance sensor and the antenna1801. The shield feature1802may prevent electrical interference to the mutual capacitance sensor from the antenna1801and vice versa. FIG.19depicts an example of a sensor layer1900in accordance with the present disclosure. The sensor layer1900includes a first antenna1901, a second antenna1902, the shield feature1802, the first set1803of electrodes, and the second set1804of electrodes. The first antenna1901and second antenna1902are formed on one part of the sensor layer1900. The first antenna1901has a square wave shape that may be used to transmit a wireless signal according to a Wi-Fi protocol or short-range wireless protocol. The second antenna1902has a spiral shape that may be used to transmit a wireless signal according to an NFC protocol. FIG.20depicts an example of a sensor layer2000in accordance with the present disclosure. The sensor layer2000includes an antenna2001, the first set1803of electrodes, the second set1804of electrodes, and a shield feature2002. The antenna2001is located on one part of the sensor layer2000and has a spiral shape. This shape of antenna may be used to transmit a wireless signal according to an NFC protocol. The antenna2001may be made of copper, gold, another appropriate material, or a combination thereof. The antenna2001may be printed, etched, or otherwise formed on the sensor layer. The shield feature2002surrounds the mutual capacitance sensor that is formed by the first set1803of electrodes and the second set1804of electrodes. The shield feature2002has a spiral shape. In some circumstances, the shape of the shield feature2002may help to prevent electrical interference to the mutual capacitance sensor from the antenna2001than a square shaped shield feature because the spiral shape of this shield feature has multiple sides that are located in between the antenna2001and the mutual capacitance sensor. FIG.21depicts an example of a sensor layer2100in accordance with the present disclosure. The sensor layer2100includes the antenna2001, the first set1803of electrodes, the second set1804of electrodes, a first portion2102aof a shield feature, and a second portion2102bof the shield feature. The first portion2102aof the shield feature and the second portion2102bof the shield feature form concentric rectangles which surround the mutual capacitance sensor formed by the first set1803and second set1804of electrodes. The first and second portion2102a,2102bare located in between the antenna2001and the mutual capacitance sensor, and may prevent the two elements from electrically interfering with each other. In some circumstances, by having two rectangular portions, the shield feature formed by the first portion2102aand the second portion2102bmay more effectively prevent electrical interference between the antenna2001and the mutual capacitance sensor than a shield feature that only included a single rectangular portion. The first portion2102aand the second portion2102bof the shield feature may be connected or electrically independent from each other. The first portion2102aand the second portion2102bof the shield feature may each be grounded or ungrounded. It should be noted that the methods, systems and devices discussed above are intended merely to be examples. It must be stressed that various embodiments may omit, substitute, or add various procedures or components as appropriate. For instance, it should be appreciated that, in alternative embodiments, the methods may be performed in an order different from that described, and that various steps may be added, omitted or combined. Also, features described with respect to certain embodiments may be combined in various other embodiments. Different aspects and elements of the embodiments may be combined in a similar manner. Also, it should be emphasized that technology evolves and, thus, many of the elements are exemplary in nature and should not be interpreted to limit the scope of the invention. Specific details are given in the description to provide a thorough understanding of the embodiments. However, it will be understood by one of ordinary skill in the art that the embodiments may be practiced without these specific details. For example, well-known circuits, processes, algorithms, structures, and techniques have been shown without unnecessary detail in order to avoid obscuring the embodiments. Also, it is noted that the embodiments may be described as a process which is depicted as a flow diagram or block diagram. Although each may describe the operations as a sequential process, many of the operations can be performed in parallel or concurrently. In addition, the order of the operations may be rearranged. A process may have additional steps not included in the figure. Having described several embodiments, it will be recognized by those of skill in the art that various modifications, alternative constructions, and equivalents may be used without departing from the spirit of the invention. For example, the above elements may merely be a component of a larger system, wherein other rules may take precedence over or otherwise modify the application of the invention. Also, a number of steps may be undertaken before, during, or after the above elements are considered. Accordingly, the above description should not be taken as limiting the scope of the invention. | 67,696 |
11942687 | DETAILED DESCRIPTION It will be readily understood that the components of the embodiments as generally described herein and illustrated in the appended figures could be arranged and designed in a wide variety of different configurations. Thus, the following more detailed description of various embodiments, as represented in the figures, is not intended to limit the scope of the present disclosure but is merely representative of various embodiments. While the various aspects of the embodiments are presented in drawings, the drawings are not necessarily drawn to scale unless specifically indicated. The present solution may be embodied in other specific forms without departing from its spirit or essential characteristics. The described embodiments are to be considered in all respects only as illustrative and not restrictive. The scope of the present solution is, therefore, indicated by the appended claims rather than by this detailed description. All changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope. Reference throughout this specification to features, advantages, or similar language does not imply that all of the features and advantages that may be realized with the present solution should be or are in any single embodiment of the present solution. Rather, language referring to the features and advantages is understood to mean that a specific feature, advantage, or characteristic described in connection with an embodiment is included in at least one embodiment of the present solution. Thus, discussions of the features and advantages, and similar language, throughout the specification may, but do not necessarily, refer to the same embodiment. Furthermore, the described features, advantages and characteristics of the present solution may be combined in any suitable manner in one or more embodiments. One skilled in the relevant art will recognize, in light of the description herein, that the present solution can be practiced without one or more of the specific features or advantages of a particular embodiment. In other instances, additional features and advantages may be recognized in certain embodiments that may not be present in all embodiments of the present solution. Reference throughout this specification to “one embodiment”, “an embodiment”, or similar language means that a particular feature, structure, or characteristic described in connection with the indicated embodiment is included in at least one embodiment of the present solution. Thus, the phrases “in one embodiment”, “in an embodiment”, and similar language throughout this specification may, but do not necessarily, all refer to the same embodiment. As used in this document, the singular form “a”, “an”, and “the” include plural references unless the context clearly dictates otherwise. Unless defined otherwise, all technical and scientific terms used herein have the same meanings as commonly understood by one of ordinary skill in the art. As used in this document, the term “comprising” means “including, but not limited to”. The present solution generally concerns a novel technique for providing and maintaining an adequate tensioning load to anchor points of a surface shaping tension cord network. The novel technique can be used in various applications. The applications include, but are not limited to, antenna applications, solar concentrator applications, any other membrane surface application, or an assembly of tension members, without a membrane surface, whose geometry is controlled by the boundary attachments. The present solution will be discussed below in relation to antenna applications for ease of discussion. In accordance with the antenna applications, the present solution provides antenna systems including precision antennas. The precision antennas are simpler in design, more reliable, and lower in cost as compared to conventional precision antennas, such as those mentioned in the Background section of this document. Unlike some conventional solutions (e.g., truss reflectors with nets or cords as surface shaping elements), the repeatability of the present antenna does not rely on the precision of a deployment mechanism and deployable support structure. The present antenna is also an edge-mounted, offset-fed reflector that can be easily modified for a wide variety of missions. The present antenna's reflector performance is only dependent upon the accuracy of the mesh surface that is shaped by a network of tension cords (rather than the accuracy, stability and repeatability of the deployable structure as is the case for conventional precision antennas). The tension cord network of the present solution has high stiffness and maintains the correct shape so long as a preload force is maintained on boundary interfaces between the tension cord network and a perimeter hoop structure. This is achieved by providing a perimeter hoop structure with anchor points that have variable locations relative to the tension cord network while the antenna is in use and/or is in its fully extended position. The variable anchor point locations are achieved by: coupling the tension cord network to the perimeter hoop structure using a plurality of resilient members (e.g., springs); and/or providing a plurality of resilient members (e.g., springs or flexible battens) as part of the perimeter hoop structure that each extend between two respective anchor points of the plurality of anchor points. The resilient members allow a distance between each respective anchor point and a central axis of a flexible antenna reflector surface to change (e.g., increase or decrease) when the antenna is in use. The present approach is novel because unlike previous deployable reflectors its reflector performance and accuracy do not (1) rely on precise structure-to-surface interfaces (boundary interfaces), (2) require structures with thermos-elastic stability even when exposed to extreme changes in environmental conditions (e.g., temperatures while in orbit), and (3) require a deployment mechanism with precise repeatability. The present approach also provides an antenna with a minimized overall cost, minimized total number of parts and a minimized hands-on assembly time. The support structure (i.e., the collective tension cord network and perimeter structure) of the present solution is adaptable to surfaces with different shapes and sizes. Design Theory of Present Solution Referring now toFIG.1, there is provided an illustration that is useful for understanding a conventional tension surface assembly100. The assembly100comprises a surface102, a surface shaping cord network130,132,134, rigid support structures116,118,120and tension members (e.g., cords)110,112,114. The surface can include, but is not limited to, a membrane surface. The surface102has a plurality of boundary points. The term “boundary point”, as used herein, means a point along a continuous line forming a boundary of a closed geometric shape. In order to provide desirable tension to the surface102such that it maintains the proper shape during use, the surface shaping cord network130-134must be coupled to the rigid support structures116-120at each boundary point104,106,108. Tension members110,112,114facilitate this coupling of the surface shaping cord network130-134to the support structure116-120at respective anchor points122,124,126. The term “anchor point”, as used herein, refers to a point on a support structure to which an object is anchored or coupled. The tension members110-114provide interfaces to the support structures with relatively high stiffness matched to the high stiffness of the surface shaping cord network130-134. These interfaces are stable since the support structures116-120are rigid structures with fixed locations. Referring now toFIG.2, there is provided an illustration that is useful for understanding a novel tension surface assembly200in accordance with the present solution. The assembly200comprises a surface202, a surface shaping cord network230,232,234, support structures216,218,220and tension members210,212,214. The surface can include, but is not limited to, a membrane surface. The surface202has a plurality of boundary points204,206,208. In order to provide desirable tension to the surface202such that it maintains the proper shape during use, the surface shaping cord network230-234must be coupled to the support structures216-220at each boundary point202,206,208. Tension members210,212,214facilitate this coupling of the surface shaping cord network230-234to the support structure216-220at respective anchor points222,224,226. The tension members210-214provide interfaces to the support structures with relatively low stiffness relative to the relatively high stiffness of the surface shaping cord network230-234. In this regard, the tension members210-214can include, but are not limited to, resilient members (e.g., springs). The resilient members allow greater distortion of the support structures216,218,220(as compared to the distortion allowed in the conventional assembly shown inFIG.1) without having the surface202and/or surface shaping cord network230-234experience any slack or looseness. Accordingly, the desired tension is provided to the surface202even when the support structures216,218,220move relative to the surface202as shown by the dotted line arrows. These interfaces are considered compliant interfaces since the load vectors of the tension members210-214remain with the same range of values, and therefore the locations of the anchor points222-226are within the same acceptable range of distortion at all time while in use. Referring now toFIG.3, there is provided an illustration that is useful for understanding the acceptable range of distortion for the anchor points222-226of a surface shaping cord network230-234. If cords230-234are relatively stiff and a force304is in the direction of the bounded dotted lines306and308, no matter where or what the force of304the structural surface shaping cord network230-234remains tensioned and will have minimum relative distortion. If on the other hand, anchor points are precise anchor points as is the case inFIG.1rather than force vectors as is the case inFIG.2, then the positions of the anchor points must be precisely located. Otherwise, displacement of the anchor point locations by a small amount results in the surface shaping cord network losing tension and going slack (distorting). By using resilient members as the tension members210-214, the surface shaping cord network230-234remains tensioned and in a precise relative location so long as the force directions302-306are between the extended lines306/308,310/312,314/316. Thus, the directions and magnitudes of the forces302,304,306applied to the surface shaping cord network230-234can vary significantly when the resilient members are added to the assembly200without causing any loosening or slack of the surface202. In this way, the surface and the surface shaping cord network continue to remain taut even when the anchor point locations change relative to the surface shaping cord network230-234. Illustrative Antennas Extendable perimeter truss antennas are configured to transmit and receive radio waves. These antennas include an antenna feed structure (not shown) and an extendable reflector structure. The antenna feed structure is configured to convey radio waves between a transceiver and a flexible antenna reflector surface. Antenna feed structures are well known in the art, and therefore will not be described herein. However, it should be understood that the antenna feed method can include any suitable antenna feed structure. For example, the antenna feed structure may include an antenna horn, an orthomode transducer, a frequency duplexer, a waveguide, waveguide switches, a rotary joint, active patch elements and/or an electronically steerable feed. The antenna feed structure is provided on a reflective surface side of the perimeter truss antenna During transmit operations of the perimeter truss antenna, the reflector surface is illuminated by an incident Radio Frequency (“RF”) signal from the antenna feed. At least a portion of the RF signal is reflected by the reflector surface to yield a desired reflected RF energy distribution. In a receive mode, incident RF energy is focused by the reflector and directed toward the antenna feed. An illustrative extendable reflector structure400will now be described in relation toFIGS.4-9. The extendable reflector structure400can be mounted on a support structure, such as a space borne vehicle (e.g., a spacecraft). The objective of the extendable reflector structure400is to: (a) maintain a deployed surface accuracy without reliance on the precision of the deployment mechanism; (b) provide a reflector with a desirably shaped aperture; (c) provide a deployed aperture with a less complex and costly mechanical deployment support structure; and (d) provide an antenna with a repeatable deployment that does not rely on the precision of the deployment mechanism. As shown inFIGS.4-8, the extendable reflector structure400has an appearance that is similar to a conventional radial perimeter truss reflector. However, the extendable reflector structure400is designed to allow a flexible antenna reflector surface402and a surface shaping (or tension) cord network404to continue to remain taut even when anchor point locations406,408change relative to the surface shaping cord network404. The manner in which this is achieved will become evident as the discussion progresses. In general, the extendable reflector structure400has a circular, parabolic shape when it is in its fully extended position as shown inFIG.4. The extendable reflector structure400includes the flexible antenna reflector surface402, the surface shaping (or tension) cord network404, and a support structure410. The support structure410is also referred to herein a perimeter hoop structure. The reflector surface402is formed from any material that is suitable as an antenna's reflective surface. Such materials include, but are not limited to, reflective wire knit mesh materials similar to light weight knit fabrics. In its fully extended position shown inFIG.4, the reflector surface402has a size and shape selected for directing RF energy into a desired pattern. For example, the reflector surface402has a scalloped cup shape with concave peripheral edge portions412. The present solution is not limited in this regard. The reflector surface402extends around a central longitudinal axis414of the extendable reflector structure400. As such, the reflector surface402may be a curve symmetrically rotated about the central longitudinal axis414, a paraboloid rotated around an offset and inclined axis, or a surface shaped to focus the RF signal in a non-symmetric pattern. The reflector surface402is fastened to the support structure410via the surface shaping cord network404. The surface shaping cord network404supports the reflector surface402creating a parabolic shape. The reflector surface402is dominantly shaped by the surface shaping cord network404. The surface shaping cord network404defines and maintains the shape of the reflector surface402when in use. In this regard, the surface shaping cord network404includes a plurality of interconnected cords (or thread like strings)416. The cords416are positioned between the reflector surface402and the support structure410so as to provide structural stiffness to the reflector surface402when the perimeter truss antenna is in use. When the extendable reflector structure400is in its fully deployed configuration, the surface shaping cord network404is a stable structure under tension. The tension is achieved by applying pulling forces to the cords by means the support structure410. The support structure410is a foldable structure that can be transitioned from a fully stored or non-extended position shown inFIG.8to a fully extended position shown inFIG.6. A partially extended position of the support structure410is shown inFIG.7. The support structure410is formed of a plurality of rigid battens418that are coupled to each other via joint mechanisms600,602. Joint mechanisms600simply allow battens to bend into and away from adjacent battens as shown inFIG.7. In contrast, joint mechanisms602allow battens to move away from and towards adjacent battens, as well as allow horizontal battens604to slide therethrough as also shown inFIG.7. Referring now toFIG.9, there is provided an illustration that is useful for understanding novel features of the extendable reflector structure400shown inFIGS.4-8. Notably, the extendable reflector structure400comprises resilient members900,902,904,906respectively coupled between anchor points908,910,912,914of the battens6041,6042and boundary points916,918,920,922of the surface shaping cord network404. The resilient members are selected to provide adequate tensioning loads to the boundary points of the surface shaping cord network404. In this regard, the resilient members900-906include, but are not limited to, springs. In some scenarios, the springs have a spring rate of 240 pounds per inch. The present solution is not limited in this regard. Each batten6041,6042has two anchor points associated therewith. More specifically, batten6041has anchor points908and912located at opposing ends thereof. Similarly, batten6042has anchor points910and914located at opposing ends thereof. Anchor points908,910are coupled to a front cord930of the surface shaping cord network404, while anchor points912and914are coupled to a rear cord932of the surface shaping cord network404. A plurality of fixed length tie cords928are provided between the front cord930and rear cord932. These tie cords928are spaced apart along the lengths of the front and rear cords930,932. Each batten6041,6042is rigid such that when it moves in an x, y or z direction by a given amount at least one resilient member900,902,904or906is stretched or compressed whereby the reflector surface402and the surface shaping cord network404remain taut despite a change in the anchor point location(s) relative thereto. The tightness of the surface and surface shaping cord network is maintained since the anchor point location(s) remain within an acceptable range of distortion therefore even when changed. Referring now toFIG.10, there is provided a cross-sectional view of another extendable reflector structure1000. Extendable reflector structure1000is similar to the extendable reflector structure400shown inFIGS.4-9except for the inclusion of an inflatable hoop1002. The inflatable hoop1002encompasses the extendable reflector structure1000. In this regard, the inflatable hoop1002is coupled to the rigid battens1004,1006via cords1008. Referring now toFIG.11, there is provided a cross-sectional view of another extendable reflector structure1100. The extendable reflector structure1100comprises a plurality of battens1102,1104, cords1106,1108,1110,1112, and a surface shaping cord network1114. The cords1106,1108,1110,1112are respectively coupled between anchor points1116,1118,1120,1122of the battens1102,1104and boundary points1124,1126,1128,1130of the surface shaping cord network1114. Each batten1102,1104has two anchor points associated therewith. More specifically, batten1102has anchor points1116and1120located at opposing ends thereof. Similarly, batten1104has anchor points1118and1122located at opposing ends thereof. Anchor points1116,1118are coupled to a front cord1132of the surface shaping cord network1114, while anchor points1120and1122are coupled to a rear cord1134of the surface shaping cord network1114. A plurality of fixed length tie cords1136are provided between the front cord1132and rear cord1134. These tie cords1136are spaced apart along the lengths of the front and rear cords1132,1134. Notably, the battens1102,1104are flexible, and thus constitute springs. As such, the battens1102,1104can bend towards and way from the surface shaping cord network1114. The battens1102,1104are designed to provide adequate tensioning loads to the boundary points of the surface shaping cord network. In effect, the surface1138and the surface shaping cord network1114remain taut despite a change in the anchor point location(s) relative thereto (as a result from batten bending. The tightness of the surface and surface shaping cord network is maintained since the anchor point location(s) remain within an acceptable range of distortion therefore even when changed. Referring now toFIG.12, there is provided a flow diagram of an illustrative method1200for operating an antenna. The method begins with1202and continues with1204where the antenna is obtained. The antenna is in its stowed position. The antenna comprises a tension cord network (e.g., surface shaping cord network404ofFIG.4-9) coupled to a plurality of anchor points (e.g., anchor points908,910,912,914ofFIG.9) of a perimeter hoop structure (e.g., support structure410ofFIGS.4-9). In some scenarios, the tension cord network is coupled to the perimeter hoop structure by a plurality of resilient members (e.g., springs) (e.g., resilient members900,902,904,906ofFIG.9). The perimeter hoop structure comprises a ring, a plurality of stiff battens (e.g., battens604ofFIGS.4-9), or a plurality of spreader bars that each extend between two respective anchor points of the plurality of anchor points. In other scenarios, the perimeter hoop structure comprises a plurality of resilient members that each extend between two respective anchor points of the plurality of anchor points. Each resilient member of the plurality of resilient members comprises a spring or a flexible batten (e.g., battens1102,1104ofFIG.11). In next1206, the antenna is transitioned from the stowed position to a fully extended position. The tension cord network is used to support a flexible antenna reflector surface (e.g., reflector surface402ofFIGS.4-9) such that a desired shape of the same is provided, as shown by1208. In1210, locations of the anchor points are allowed to change relative to the tension cord network while the antenna is in use. Accordingly, a distance between at least one of the anchor points and a central axis of the flexible antenna reflector surface may change (e.g., increase or decrease) when the antenna is in use. As shown by1212, the flexible antenna reflector surface continues to be held taut when the locations of the anchor points change relative to the tension cord network. Subsequently,1214is performed where method1200ends or other processing is performed. The present solution applies to any structure where a deployable precision surface (a) is used to reflect or concentrate RF energy or light (such as a wire mesh, a membrane or a splined radial panel), and (b) is shaped/controlled by use of a network of tensioned cords and ties in configurations such as concentric cord catenaries or front/rear triangular facet nets. Compliant spring interfaces link the tensioned cord network to a deployable supporting structure. Spring properties are selected so that sufficient tension for surface accuracy is maintained throughout the tensioned cord network despite larger manufacturing and environmental distortion of the deployable support structure than is tolerable within the surface. An illustrative solution is a perimeter truss reflector with triangular faceted front and rear nets (e.g., with an RF reflective mesh membrane restrained in concave near parabolic shape by the front net). Each net's outer perimeter is fastened to battens that are in turn connected to the deployable structure through compliant springs. Thus, the deployable structure is partially isolated from the precision surface shaping elements. Accordingly, the present solution's dependence on structural deployment precision is reduced. The battens of the perimeter truss reflector may be deployed by any structure that expands from a stowed position and provides a radial outward force to the battens (including inflatable toroid, various types of truss hoop structures, pantographs, articulated hoop structures, etc.). As evident from the above discussion, the present solution provides a novel design approach to decouple and desensitize the accuracy of precision tensioned cord networks (that shape reflector surfaces) from the accuracy of structures and mechanisms used to deploy the assembly. Previous design practice has always relied on the high precision of the deployment mechanism and deployable support structure. The key to the present solution is the selection of resilient member (e.g., spring) stiffness and allowable vector (load and direction) of the resilient member's force that will maintain acceptable preload and dimensional accuracy in the surface shaping cord network and tie network. Compliance in deployed space structures is generally unfavorable because of reduced vibration frequencies. However, the membrane surface is very low mass and will not significantly couple with the vibration of the host spacecraft. The surface shaping network resilient member interface makes the deployable structure an interchangeable subassembly compatible with a wider range of configurations to deploy reflector surfaces. Although the present solution has been illustrated and described with respect to one or more implementations, equivalent alterations and modifications will occur to others skilled in the art upon the reading and understanding of this specification and the annexed drawings. In addition, while a particular feature of the present solution may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for any given or particular application. Thus, the breadth and scope of the present solution should not be limited by any of the above described embodiments. Rather, the scope of the present solution should be defined in accordance with the following claims and their equivalents. | 26,127 |
11942688 | DETAILED DESCRIPTION With reference toFIGS.1and2, front and side-sectional views are shown, respectively, of an illustrative radio frequency (RF) aperture, including an interface printed circuit board (i-PCB)10having a front side12and a back side14, and an array of electrically conductive tapered projections20having bases22disposed on the front side12of the i-PCB10and extending away from the front side12of the i-PCB10. The illustrative i-PCB10is indicated inFIG.1as having dimensions 5-inch by 5-inch—this is merely a non-limiting illustrative example of a compact RF aperture.FIG.1shows the front view of the RF aperture, with an inset in the upper left showing a perspective view of one electrically conductive tapered projection20. This illustrative embodiment of the electrically conductive tapered projection20has a square cross-section with a larger square base22and an apex which does not extend to a perfect tip but rather terminates at a flattened apex24(in other words, the electrically conductive tapered projection20of the inset has a frustoconical shape). This is merely an illustrative example, and more generally the electrically conductive tapered projections20can have any type of cross-section (e.g. square as in the inset, or circular, or hexagonal, or octagonal, or so forth). The apex24can be flat, as in the example of the inset, or can come to a sharp point, or can be rounded or have some other apex geometry. The rate of tapering as a function of height (i.e. distance “above” the base22, with the apex24being at the maximum “height”) can be constant, as in the example of the inset, or the rate of tapering can be variable with height, e.g. the rate of tapering can increase with increasing height so as to form a projection with a rounded peak, or can be decreasing with increasing height so as to form a projection with a more pointed tip. Similarly, as best seen inFIG.1, the illustrative array of the electrically conductive tapered projections20is a rectilinear array with regular rows and orthogonal regular columns; however, the array may have other symmetry, e.g. a hexagonal symmetry, octagonal symmetry, or so forth. In the illustrative example of the inset, the square base22and square apex24lead to the electrically conductive tapered projection20having four flat slanted sidewalls26; however, other sidewall shapes are contemplated, e.g. if the base and apex are circular (or the base is circular and the apex comes to a point) then the sidewall will be a slanted or tapering cylinder; for a hexagonal base and a hexagonal or pointed apex there will be six slanted sidewalls, and so forth. With continuing reference toFIGS.1and2and with further reference toFIG.3, the RF aperture further comprises RF circuitry, which in the illustrative embodiment includes chip baluns30mounted on the back side14of the i-PCB10. Alternatively, the baluns30may be otherwise implemented, e.g., as baluns inscribed into the i-PCB10. In another approach, the signal chain(s) driving the RF aperture may be entirely differential signal chains, in which case the baluns can be omitted. Each chip balun30has a balanced port PB (seeFIGS.3and6) electrically connected with two neighboring electrically conductive tapered projections of the array of electrically conductive tapered projections via electrical feedthroughs32passing through the i-PCB10. Each chip balun30further has an unbalanced port Pu (seeFIGS.3and6) connecting with the remainder of the RF circuitry. The illustrative RF circuitry further includes RF power splitter/combiners40for combining the outputs from the unbalanced ports Pu of the chip baluns30. As seen inFIG.3, the illustrative electrical configuration of the RF circuitry employs first level 1×2 RF power splitter/combiners401that combine pairs of unbalanced ports Pu, and second level 1×2 RF power splitter/combiners402that combine outputs of pairs of the first level RF power splitter/combiners401. This is merely an illustrative approach, and other configurations are contemplated, such as using 1×3 (which combine three lines), 1×4 (combining four lines), or higher-combining RF power splitter/combiners, or various combinations thereof. The illustrative RF circuitry further includes a signal conditioning circuit42interposed between each unbalanced port Pu of the chip baluns30and the first level 1×2 power splitter401. The signal conditioning circuit42connected with each unbalanced port includes: an RF transmit amplifier T; an RF receive amplifier R; and RF switching circuitry including switches RFS configured to switch between a transmit mode operatively connecting the RF transmit amplifier T with the unbalanced port and a receive mode operatively connecting the RF receive amplifier R with the unbalanced port. With continuing reference toFIGS.1-3and with further reference toFIGS.4and5, a compact design is achieved (e.g., depth of 3-inches in the non-limiting illustrative example ofFIG.3) in part by employing one or more printed circuit boards (PCBs) including at least the i-PCB10. In the illustrative example shown inFIG.3, the chip baluns30are mounted on the back side14of the i-PCB10. Optionally, the other electronic components may also be mounted on the back side of the i-PCB10on whose front side12the array of electrically conductive tapered projections20are disposed. However, there may be insufficient real estate on the i-PCB10to mount all the electronics of the RF circuitry. In the illustrative embodiment, this is handled by providing a second printed circuit board50which is disposed parallel with the i-PCB10and faces the back side14of the i-PCB10. Said another way, the second printed circuit board50is disposed on the (back) side14of the i-PCB10opposite from the (front) side12of the i-PCB10on which the electrically conductive tapered projections20are disposed. The RF circuitry comprises electronic components mounted on the second printed circuit board50, which may also be referred to herein as a signal conditioning PCB or SC-PCB50, and additionally or alternatively comprises electronic components mounted on the i-PCB10(typically on the back side14of the i-PCB, although it is also contemplated (not shown) to mount components of the RF circuitry on the front side of the i-PCB in field space between the electrically conductive tapered projections20. If the SC-PCB50is provided, as shown inFIG.2it is suitably secured in parallel with the i-PCB10by standoffs54, and single-ended feedthroughs52are provided to electrically interconnect the i-PCB10and the SC-PCB50(seeFIG.3). If the RF circuitry is unable to fit onto the real estate of two PCBs10,50, a third (and fourth, and more, as needed) PCB may be added (not shown) to accommodate the components of the RF circuitry. FIG.4shows a front view of the i-PCB10including vias and mounting holes and diagrammatically indicated locations of baluns30and resistor pads as indicated in the legend shown inFIG.4. (The resistors are used to terminate the unused side of the pyramids to help lower radar cross section). With reference toFIG.2and with further reference toFIG.5, the illustrative RF aperture has an enclosure58which in the illustrative example is secured at its periphery with the periphery of the i-PCB10so as to enclose the RF circuitry. This is merely one illustrative arrangement, and other designs are contemplated, e.g. both PCBs10,50may be disposed inside an enclosure (although such an enclosure should not comprise RF shielding extending forward so as to occlude the area of the RF aperture).FIG.5diagrammatically illustrates a rear view of the enclosure58of the RF aperture, showing diagrammatically indicated RF connectors (or ports)60(also shown or indicated inFIGS.2and3), control electronics62(for example, illustrative phased array beam steering electronics63shown by way of non-limiting illustration; these electronics62,63may be mounted on the exterior of the enclosure58and/or may be disposed inside the enclosure58providing beneficial RF shielding), and a power connector64for providing power for operating the active components of the RF circuitry (e.g. operating power for the active RF transmit amplifiers T and the active RF receive amplifiers R, and the switches RFS). The particular arrangement of the various components60,62,63,64over the area of the back side of the enclosure can vary widely from that shown inFIG.5, and moreover, these components may be located elsewhere, e.g. the RF connectors60could alternatively be located at an edge of the RF aperture or so forth. It will also be appreciated that the RF aperture could be constructed integrally with some other component or system—for example, if the RF aperture is used as the RF transmit and/or receive element of a mobile ground station, a maritime radio, an unmanned aerial vehicle (UAV), or so forth, in which case the enclosure58might be replaced by having the RF aperture built into a housing of the mobile ground station, maritime radio, UAV fuselage, or so forth. In such cases, the RF connectors60might also be replaced by hard-wired connections to the mobile ground station, maritime radio, UAV electronics, or so forth. With particular reference toFIG.3, an illustrative electrical configuration for the illustrative RF circuitry is shown. In this non-limiting illustrative example, the array of electrically conductive tapered projections20is assumed to be a 5×5 array of electrically conductive tapered projections20, as shown inFIGS.1and4. The balanced ports PB of the chip baluns30connect adjacent (i.e. neighboring) pairs of electrically conductive tapered projections20of the array so as to receive the differential RF signal between the two adjacent electrically conductive tapered projections20(in receive mode; or, alternatively, to apply a differential RF signal between the two adjacent electrically conductive tapered projections20in transmit mode). As detailed in Steinbrecher, U.S. Pat. No. 7,420,522 which is incorporated herein by reference in its entirety, the tapering of the electrically conductive tapered projections20presents a separation between the two electrically conductive tapered projections20that varies with the “height”, i.e. with distance “above” the base22of the electrically conductive tapered projections20. This provides broadband RF capture since a range of RF wavelengths can be captured corresponding to the range of separations between the adjacent electrically conductive tapered projections20introduced by the tapering. The RF aperture is thus a differential segmented aperture (DSA), and has differential RF receive (or RF transmit) elements corresponding to the adjacent pairs of electrically conductive tapered projections20. These differential RF receive (or transmit) elements are referred to herein as aperture pixels. For the illustrative rectilinear 5×5 array of adjacent electrically conductive tapered projections20, this means there are 4 aperture pixels along each row (or column) of 5 electrically conductive tapered projections20. More generally, for a rectilinear array of projections having a row (or column) of N electrically conductive tapered projections20, there will be a corresponding N−1 pixels along the row (or column).FIG.3shows a QUAD subassembly, which is an interconnection of a row (or column) of four pixels. As there are four rows, and four columns, this leads to 4×4 or 16 such QUAD subassemblies. The resistor pads are used as terminations for the unused edges of the perimeter pyramids to prevent unnecessary reflections. Without the resistors mounted via the resistor pads, those surfaces would be left floating and could re-radiate incident RF energy, causing an enhanced radar cross section. In the illustrative embodiment shown inFIG.3, the second level 1×2 RF power splitter/combiner402of each QUAD subassembly connects with an RF connector60at the backside of the enclosure58. Hence, as seen inFIG.5, there are eight RF connectors for the eight QUAD subassemblies, denoted inFIGS.4and5as the row QUAD subassemblies N1, N2, N3, N4and the column QUAD subassemblies M1, M2, M3, M4. The Gnd(N) row and the Gnd(M) column are circuit grounds to allow a common path for current flow from the captured RF energy along the perimeter sides of the pyramids. The use of the QUAD subassemblies permits a high level of flexibility in RF coupling to the RF aperture. For example, the illustrative phased array beam steering electronics63may be implemented by introducing appropriate phase shifts ϕN, N=1, . . . , 4 for the row QUAD subassemblies N1, N2, N3, N4and phase shifts ϕM, M=1, . . . , 4 for the column QUAD subassemblies M1, M2, M3, M4to steer the transmitted RF signal beam in a desired direction, or to orient the RF aperture to receive an RF signal beam from a desired direction (transmit or receive being controlled by the settings of the switches RFS of the signal conditioning circuits42). Other applications that may be implemented by the RF aperture include: simultaneous “Transmit/Receive, dual circular polarization modes”, and “Scalability” by physically locating multiple DSAs in close physical proximity giving the combined effect of increased aperture size. In an alternative embodiment diagrammatically shown inFIG.3, the RF connectors60may be replaced by analog-to-digital (ND) converters66and digital connectors68via which digitized signals are output. More generally, the ND conversion may be inserted anywhere in the RF chain, for example ND converters could be placed at the outputs of the signal conditioning circuits42and the analog first and second level RF power splitter/combiners401,402then replaced by digital signal processing (DSP) circuitry. The described electronics employing PCBs10,50, chip baluns30, and active signal conditioning components (e.g. active transmit amplifiers T and receive amplifiers R) advantageously enables the RF aperture to be made compact and lightweight. As described next, embodiments of the electrically conductive tapered projections20further facilitate providing a compact and lightweight broadband RF aperture. FIG.6shows a side sectional view of one illustrative embodiment in which each electrically conductive tapered projection20is fabricated as a dielectric tapered projection70with an electrically conductive layer72disposed on a surface of the dielectric tapered projection70. The dielectric tapered projections may, for example, be made of an electrically insulating plastic or ceramic material, such as acrylonitrile butadiene styrene (ABS), polycarbonate, or so forth, and may be manufactured by injection molding, three-dimensional (3D) printing, or other suitable techniques. The electrically conductive layer72may be any suitable electrically conductive material such as copper, a copper alloy, silver, a silver alloy, gold, a gold alloy, aluminum, an aluminum alloy, or so forth, or may include a layered stack of different electrically conductive materials, and may be coated onto the dielectric tapered projection70by vacuum evaporation, RF sputtering, or any other vacuum deposition technique.FIG.6shows an example in which solder points74are used to electrically connect the electrically conductive layer72of each dielectric tapered projection20with its corresponding electrical feedthrough32passing through the i-PCB10.FIG.6also shows the illustrative connection of the balanced port PB of one chip balun30between two adjacent electrically conductive tapered projections20via solder points76. FIGS.7and8show an exploded side-sectional view and a perspective view, respectively, of an embodiment in which the dielectric tapered projections70are integrally included in a dielectric plate80. The electrically conductive layer72coats each dielectric tapered projection70but has isolation gaps82that provide galvanic isolation between the neighboring dielectric tapered projections20. The isolation gaps82can be formed after coating the electrically conductive layer72by, after the coating, etching the coating away from the plate80between the electrically conductive tapered projections20to galvanically isolate the electrically conductive tapered projections from one another. Alternatively, the isolation gaps82can be defined before the coating by, before the coating, depositing a mask material (not shown) on the plate80between the electrically conductive tapered projections20so that the coating does not coat the plate in the isolation gaps82between the electrically conductive tapered projections whereby the electrically conductive tapered projections are galvanically isolated from one another. As seen in the perspective view ofFIG.8, the result is that the dielectric plate80covers (and therefore occludes) the surface of the i-PCB10, with the electrically conductive tapered projections20extending away from the dielectric plate80. With particular reference toFIG.7, in one approach for the electrical interconnection, through-holes82pass through the illustrative plate80and the underlying i-PCB10, and rivets, screws, or other electrically conductive fasteners32′ pass through the through-holes82(note thatFIG.7is an exploded view) and when thusly installed form the electrical feedthroughs32′ passing through the i-PCB10. (Note, the perspective view ofFIG.8is simplified, and does not depict the fasteners32′). The use of the dielectric plate80with integral dielectric tapered projections70and the combined fastener/feedthroughs32′ advantageously allows the electrically conductive tapered projections20to be installed with precise positioning and without soldering. In the embodiments ofFIGS.6-8, the electrically conductive coating72is disposed on the outer surfaces of the dielectric tapered projections70. In this case, the dielectric tapered projections70may be either hollow or solid. With reference toFIGS.9and10, as the dielectric material is substantially transparent to the RF radiation, the electrically conductive coating72may instead be coated on inner surfaces of the (hollow) dielectric tapered projections70.FIG.9shows a side sectional view of such an embodiment, whileFIG.10shows a perspective view. The embodiment ofFIGS.9and10again employs a dielectric plate80including the dielectric tapered projections70. As seen inFIG.10, by coating the electrically conductive coatings72on the inner surfaces of the hollow dielectric tapered projections70, this results in the electrically conductive coating72being protected from contact from the outside by the dielectric plate80including the integral dielectric tapered projections70. This can be useful in environments in which weathering may be a problem. It is to be appreciated that the various disclosed aspects are illustrative examples, and that the disclosed features may be variously combined or omitted in specific embodiments. For example, one of the illustrative examples of the electrically conductive tapered projections20or a variant thereof may be employed without the QUAD subassembly circuitry configuration ofFIGS.2-5. Conversely the QUAD subassembly circuitry configuration ofFIGS.2-5or a variant thereof may be employed without the dielectric/coating configuration for the electrically conductive tapered projections20. Likewise, the chip baluns30may or may not be used in a specific embodiment; and/or so forth. The RF aperture designs ofFIGS.1-10employ the illustrative planar i-PCB10. This design is generally limited to about a 180° (solid) angular field of view (FOV) or less. To obtain a larger (solid) angular FOV, two or more such planar RF apertures may be arranged at different directions, e.g. three planar DSAs oriented at 120° azimuth angle intervals can provide angular coverage potentially up to 360°. Likewise, four planar DSAs at 90° azimuth angles (e.g. forming a square) can similarly cover 360°. Such approaches may have difficulty at high elevation, however. Additionally, these arrangements can be bulky, and it is anticipated that coverage quality may exhibit non-uniform behavior at the overlaps between the FOV of angularly neighboring planar DSAs. With reference toFIGS.11-17, a compact omni-directional DSA100is described. The illustrative omni-directional DSA100has non-limiting illustrative dimensions indicated—these are merely examples, and the omni-directional DSA100can more generally have any aspect ratio and size.FIG.11shows a perspective view of the omni-directional DSA100housed in a cosmetic and/or protective housing or enclosure101. The DSA100includes a cylindrical array of electrically conductive tapered projections (CADSA)102for low elevation coupling, and a top array of electrically conductive tapered projections (TADSA)104for high elevation coupling.FIG.11also illustrates a mounting support (e.g. pole)106and external ports108to enable polarization-independent operation and/or multiple input/multiple output (MIMO) RF transmit and/or receive operation.FIG.12shows a perspective view of the DSA100ofFIG.11with the housing or enclosure101omitted, so as to reveal the cylindrical RF coupling surface of the CADSA102and the planar RF coupling surface of the TADSA104. These surfaces include arrays of electrically conductive tapered projections20embodiments of which have already been described herein. FIG.13diagrammatically shows a top view of the CADSA102(with the TADSA104omitted). For ease of manufacturability, the illustrative cylindrical CADSA102is constructed as two semi-cylinder segments102H(that is, the cylinder of the CADSA102is divided lengthwise) which are bonded together by lengthwise bonds110(also indicated by dashed lines inFIG.11). The illustrative bonds110include spacer elements, but it is contemplated for the bonds to be adhesive bonds, clips or other fasteners, or so forth.FIG.14shows a side view of one semi-cylinder segment102Hof the CADSA102.FIG.15shows a top view of the TADSA104. The omni-directional DSA100is made of three sections: the two semi-cylinder segments102Hthat can be connected as shown to form the CADSA102providing a complete (360°) azimuthally omni-directional RF aperture, and the top circular TADSA104for high elevation (i.e. high altitude) RF aperture coverage extending up to the zenith. The illustrative TADSA104is a planar DSA, with the cylinder axis of the CADSA102being perpendicular to the plane of the TADSA104(i.e., the cylinder axis of the CADSA102is parallel with the surface normal of the plane of the TADSA104). Although perpendicularity provides advantageous design symmetry, some deviation from perpendicularity is contemplated. In one variant embodiment, the TADSA104is omitted, and the resulting DSA including only the two semi-cylinder segments102Hconnected to form the CADSA102. If mounted vertically (that is, with the cylinder axis of the CADSA102oriented vertically), this DSA provides a complete (360°) azimuthally omni-directional RF aperture, but with reduced or eliminated sensitivity at higher elevations (e.g. at the zenith) due to omission of the TADSA104. Such a design omitting the TADSA104may be appropriate if the application is not expected to involve receiving and/or sending RF signals from and/or to high elevation sources and/or targets. In a further variant (not shown), the planar TADSA104may be replaced by an equivalent component with a curved, e.g. hemispherical, surface bearing the top array of electrically conductive tapered projections20. However, the illustrative planar TADSA104is advantageously convenient for manufacturing and provide acceptable high elevation RF aperture for most applications. It is also noted that while the illustrative top array of electrically conductive tapered projections20has a rectilinear array with a square perimeter (seeFIG.15), other array configurations may be employed. FIG.16shows more detailed diagrammatic top view of one semi-cylinder segment102Hof the CADSA102(with the TADSA omitted). Inset A shows a perspective view of one of the electrically conductive tapered projections20(which in this example is conical tapering to a tip, but more generally could assume any of the other electrically conductive tapered projection designs disclosed herein). As shown in the main drawing ofFIG.16, in the illustrative embodiment the electrically conductive tapered projections20are mounted in a semi-circular hollow shell120, with the bases of the projections20secured to an inner circumference surface122and the apexes of the projections20secured to an outer circumference surface124. However, other mounting configurations are contemplated, e.g. the apexes may be freestanding (i.e. unsupported) in some alternative embodiments, or the electrically conductive tapered projections20may be solid elements mounted by their bases using screws or other fasteners engaging threaded openings in the bases, or the electrically conductive tapered projections20may employ electrically conductive plates mounted on dielectric formers, or so forth. The illustrative semi-cylinder segment102Hfurther includes a planar printed circuit board126which roughly corresponds to the i-PCB10of the planar designs ofFIGS.1-10insofar as it supports chip baluns130. However, unlike the case of the i-PCB10, the planar printed circuit board126does not support the electrically conductive tapered projections20(which are instead here supported by the hollow shell120). Hence, to provide electrical connections between the balanced ports of the chip baluns130and the electrically conductive tapered projections20, coaxial cables132run from the terminals of the balanced ports of the chip baluns130to the electrically conductive tapered projections20. Inset B shows a diagrammatic view of one coaxial cable132, which has a first differential connector134that connects with the unbalanced port of the chip balun130, and an opposite second differential connector136that connects two neighboring sides138of two neighboring electrically conductive tapered projections20(see Inset C). The second differential connector136can thus be seen to serve a function similar to the pair of feedthroughs32shown in the embodiment ofFIG.6, for example. In the illustrative design, the second differential connector136connects between the neighboring sides138of two neighboring projections20, and the coax shielding of the coaxial cable132is not connected to either projection (or to the differential connector136). More generally, other RF shielded electrical cable configurations are also contemplated. The illustrative coaxial cables132are all of the same length; however, this is not required, and it is contemplated to alternatively use shorter cables for connections closer to the junction between the semi-cylindrical shell120and the printed circuit board126(where the distances to be spanned by the cable are shorter). The illustrative printed circuit board126is planar, hence the coaxial cables132are provided to span the distances between the chip baluns130on the printed circuit board126and the projections20mounted in the semi-cylindrical shell120. However, other configurations are contemplated, such as employing a flexible printed circuit board that is positioned inside and conformal with the inner surface122of the shell120, and on which the chip baluns are then mounted in close proximity to the connected projections. With continuing reference toFIG.16, the illustrative semi-cylinder segment102Hfurther includes a second printed circuit board140that provides further real estate for mounting additional electronics. Hence, the second printed circuit board140is seen to perform a role analogous to the SC-PCB50shown inFIG.2. As already discussed, if the main PCB126has sufficient real estate then the second PCB140may optionally be omitted; conversely, if two PCBs is insufficient then it is contemplated to add a third (or more) PCBs (not shown) to provide additional real estate. In the illustrative example ofFIG.16, the semi-cylindrical shell120provides the standoffs separating the two PCBs126,140, thus serving the role of the standoffs54of the embodiment ofFIG.2. Other assembly configurations are also contemplated. The various electronics144may, for example, be analogous to those of the embodiment ofFIGS.2and3. FIG.17shows a more detailed diagrammatic side view of the TADSA104. The electronics are configured similarly to the design of the semi-cylinder segment102H, and include the two PCBs126,140, chip baluns130on the first PCB126connecting with the projections20via the differential connectors136, and differential connectors134connecting with the balanced ports of the baluns130, and various other electronics144. Due to the close proximity of the projections20of the planar array of electrically conductive tapered projections20of the TADSA104, the coaxial cables132of the semi-cylinder segment102Hcan be replaced by feedthroughs142(e.g. differential feedthroughs, or paired single-ended feedthroughs). The electronics and the projections20are optionally enclosed in a housing or enclosure150. The use of the illustrative physical design for the TADSA104shown inFIG.17, which is similar to the physical design of the semi-cylinder segment102Hshown inFIG.16, advantageously facilitates manufacturability through use of many of the same parts (e.g. the connectors134,136, potentially the same circuit boards126and/or140, and/or et cetera). However, it is alternatively contemplated to construct the TADSA104using, for example, a physical design similar to that of the embodiment ofFIG.2(for example, with the planar array of electrically conductive tapered projections20of the TADSA being mounted directly to a circuit board that also has the chip baluns mounted on its backside). In the following, some principles for RF design of the omni-directional DSA100ofFIGS.11-17are described. A square, flat, aperture plane such as that of the embodiments ofFIGS.1-10results in a beam pattern that is directional in nature. An estimate of the beam width (in radians) of the square, flat, aperture DSA is given by the following equation: Beamwidth(rad)=2·cos-1(1-λ22πAeff)(1) where λ is the wavelength of the RF signal, and Aeffis the effective area of the RF aperture. As the effective area (Aeff) increases, the beamwidth decreases resulting in higher gain on bore sight. At the low-end of the frequency range, the beam width pattern could approach 180 degrees (nearly hemispherical). RF modeling has shown that a curved (e.g. cylindrical) aperture plane of the CADSA102together with the TADSA104provides hemispherical (omni-directional in azimuth plus high elevation to zenith coverage) transceiver functionality. Typically, for grazing low angles (terrestrial links) the predominate mode of propagation is the vertically polarized electric field since the horizontal polarized electric field tends to attenuate more quickly, depending on the ground electrical characteristics. That being the case, the vertical dimension may need additional pyramidal sensing elements and be the primary polarization. However, the pyramidal sensing elements could also be connected across the horizontal direction for cross polarization implementation. More generally, the semi-cylindrical segments102Hof the CADSA102provide the option to implement both polarizations with higher sensitivity assigned to vertical polarizations. The top segment (that is, the TADSA104) is configured in the illustrative example as a square DSA responsive to both orthogonal polarizations and therefore, polarization independent. This segment provides high-elevation and overhead (near-zenith) coverage. As previously noted, the TADSA104may be omitted for applications in which high elevation coverage is of low importance. Likewise, using only one semi-cylindrical segment102H(with or without the TADSA) is contemplated with a wide azimuthal angle (but less than 360°) is desired. Moreover, while the illustrative CADSA102is cylindrical with a circular cross-section, in other embodiments the curvature of the surface may be different from a circular cross-section. For example, the curved surface of the segments102Hcould be manufactured to be conformal with a curved surface of the fuselage of an aircraft or unmanned aerial vehicle (UAV), or to be conformal with the hull of an ocean-going ship or submarine, or to be conformal with a surface of a round or cylindrical orbiting satellite, or so forth. Moreover, as previously noted, while an omni-directional RF aperture is described, the design could analogously be applied to an acoustic aperture or to a magnetic aperture. With reference now toFIG.18, another cylindrical array of electrically conductive tapered projections (CADSA) embodiment is shown. In this embodiment, the electrically conductive tapered projections20are mounted on a cylindrical support160(e.g., a dielectric cylinder made of a plastic or another electrically non-conductive material) which forms the structural support for the RF aperture. The illustrative projections20are freestanding in this embodiment, and have their bases mounted on the cylindrical support160. For example, the electrically conductive tapered projections20may be solid projections with threaded openings in their bases that are secured to the cylindrical support160by screws or other suitable threaded fasteners; or, the electrically conductive tapered projections20may be hollow projections secured via central posts inside the hollow projections; or the electrically conductive tapered projections20may be hollow projections whose bases are defined by base edges that are soldered or otherwise secured to the cylindrical support160; or so forth. This is merely an illustrative example of a suitable cylindrical support; as another example, the cylindrical support may be such as the pair of semi-circular hollow shells120with the projections20supported between the inner and outer circumferential surfaces122,124of the shells120, as previously described with reference toFIG.16. In the embodiment ofFIG.18, the planar printed circuit boards126,140of the embodiment ofFIG.16are replaced by a set of radially oriented perpendicular printed circuit boards162whose planes lie parallel with radial lines extending outward from the cylinder axis of the cylindrical support160. One edge of each radially oriented printed circuit board162is proximate to, and in some embodiments secured with, the inside surface of the cylindrical support160. Each radially oriented perpendicular printed circuit board162is oriented perpendicular to the cylindrical support160at the edge proximate to the cylindrical support160. A collector printed circuit board164is disposed inside the cylindrical support160and electrically coupled with the radially oriented perpendicular printed circuit boards162. In a receive mode, RF signals captured by the projections20are conveyed via RF circuitry disposed on the radially oriented perpendicular printed circuit boards162to the collector printed circuit board164, where they are ported off the RF aperture. In a transmit mode, an RF signal to be transmitted is delivered from the collector printed circuit board164to the projections20via the radially oriented perpendicular printed circuit boards162. (It will be appreciated that a given RF aperture according to the design ofFIG.18may be configured to operate as an RF receiver, or as an RF transmitter, or as an RF transceiver capable of both receive and transmit functionality). The electrical connections between the radially oriented perpendicular printed circuit boards162and the collector board164may be via coaxial cables (such as the coaxial cable132previously mentioned in reference toFIG.16), or by electrical connectors or the like. It will also be appreciated that there may be one, two, or more collector boards164, with more than one collector board being employed if needed to accommodate the RF circuitry. Furthermore, the radially oriented perpendicular printed circuit boards162may optionally be secured with the collector board(s)164to enhance structural support; having two or more collector boards164may be beneficial for enhanced structural support. Although not shown inFIG.18, the top array of electrically conductive tapered projections (TADSA)104ofFIG.17may optionally be used in conjunction with the embodiment ofFIG.18for high elevation coupling. One advantage of the design ofFIG.18is that the radially oriented perpendicular printed circuit boards162are oriented perpendicularly to the cylindrical support160on which the electrically conductive tapered projections20are disposed. It is recognized herein that this configuration has an advantage as follows. The printed circuit boards that support the RF circuitry typically include ground planes, i.e. an electrically conductive sheet (e.g., a copper sheet) disposed inside or on a bottom of the printed circuit board. Such a ground plane is well known to have substantial benefits in RF circuitry performance. However, it is recognized herein that if the ground plane underlies the electrically conductive tapered projections20, for example by being oriented parallel or close to parallel with the cylindrical support160, then the ground plane can produce undesirable RF reflections that can interfere with performance of the RF aperture. By arranging the radially oriented perpendicular printed circuit boards162perpendicular to the cylindrical support160, the ground planes of the radially oriented perpendicular printed circuit boards162are not underlying the projections20. A further benefit of the arrangement ofFIG.18is that, as seen inFIG.18, the edge of each radially oriented perpendicular printed circuit board162contacting the cylindrical support160is positioned between two adjacent rows of electrically conductive tapered projections20. This facilitates electrically connecting the two adjacent projections20in a differential manner (e.g. using the balanced port of a balun30, as shown in Section S-S ofFIG.18) without lengthy coaxial cables132as are used in the embodiment ofFIG.16. With reference toFIG.19, another cylindrical array of electrically conductive tapered projections (CADSA) embodiment which employs perpendicular printed circuit boards is shown. The embodiment ofFIG.19includes electrically conductive tapered projections20mounted to the cylindrical support160as already described with reference toFIG.18. However, in the embodiment ofFIG.19, the radially oriented perpendicular printed circuit boards162and collector board(s)164of the embodiment ofFIG.18are replaced by a set of perpendicular circular printed circuit boards172, which are disposed concentrically inside the cylindrical support160and have circular perimeters174(i.e., circular edges174; see View V-V ofFIG.19) that are proximate to, and in some embodiments secured with, the inside surface of the cylindrical support160. The cylinder axis of the cylindrical support160is perpendicular to the circular printed circuit boards172. This allows contact with the inside surface of the cylindrical support160around the entire 360° circular perimeter of the perpendicular circular printed circuit board172, which facilitates structural robustness. Moreover, the circular perimeter of each perpendicular circular printed circuit board172is oriented perpendicularly to the cylindrical support160at the contact, which again mitigates the potential for the ground planes of the perpendicular circular printed circuit boards172to introduce RF reflections that might potentially produce RF interference during operation of the RF aperture ofFIG.19. By positioning each perpendicular circular printed circuit board172between two rings of projections20, as seen inFIG.19, differential electrical connection of two adjacent projections20is again facilitated, e.g. using the balanced ports of baluns30(shown diagrammatically in View V-V ofFIG.19). This again avoids the use of lengthy coaxial cables132as are used in the embodiment ofFIG.16. Although not shown inFIG.19, the top array of electrically conductive tapered projections (TADSA)104ofFIG.17may optionally be used in conjunction with the embodiment ofFIG.19for high elevation coupling. The preferred embodiments have been illustrated and described. Obviously, modifications and alterations will occur to others upon reading and understanding the preceding detailed description. It is intended that the invention be construed as including all such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof. | 40,520 |
11942689 | BRIEF SUMMARY The following presents a simplified summary of the disclosure in order to provide a basic understanding of some aspects of the disclosure. It is not intended to identify key or critical elements of the embodiments or to delineate the scope of the embodiments. The following summary merely presents some concepts of the disclosure in a simplified form as a prelude to the more detailed description provided below. In an embodiment, the present disclosure provides a RADAR antenna system comprising a base, and first and second antennas configured to transmit independent first and second antenna beams, respectively. The first and second antennas are each coupled to the base so as to provide a common rotational axis for the first and second antennas. The system further comprises an antenna position controller configured to independently control first and second transmission positions associated with the first and second antennas, respectively. In an example embodiment, the antenna position controller and the first and second antennas cooperate to transmit the first and second antenna beams in opposite directions such that the first antenna beam is decoupled from the second antenna beam. In an example embodiment, the antenna position controller and the first and second antennas cooperate to transmit the first and second antenna beams in different directions. In an example embodiment, the antenna position controller and the first and second antennas cooperate to transmit the first and second antenna beams in opposite directions. In an example embodiment, the antenna position controller is configured to independently control first and second elevations associated with the first and second antennas, respectively, to transmit the first and second antenna beams at different heights. In an example embodiment, the antenna position controller and the first and second antennas cooperate to transmit the first and second antenna beams in opposite directions such that the first antenna beam is decoupled from the second antenna beam. In an example embodiment, the antenna position controller comprises: a first actuator configured to move the first antenna in elevation; and a second actuator configured to move the second antenna in elevation. In an example embodiment, the first and second actuators each comprise a linear actuator. In an example embodiment, the first and second actuators each comprise a hydraulic actuator. In an example embodiment, the system further comprises: a first actuator antenna connector configured to couple the first actuator to the first antenna; a first actuator base connector configured to couple the first actuator to the base; a second actuator antenna connector configured to couple the second actuator to the second antenna; and a second actuator base connector configured to couple the second actuator to the base. In an example embodiment, the first antenna defines a plurality of actuator engagement points for coupling with at which the first plate connector is couplable to the first antenna. In an example embodiment, the plurality of actuator engagement points are provided at different heights along a vertical axis of the first antenna when the first antenna is in an upright position. In an example embodiment, the system further comprises: a first antenna base connector configured to couple the first antenna to the base; and a second antenna base connector configured to couple the second antenna to the base. In an example embodiment, the first and second antenna base connectors comprise first and second fixed hinges configured to hingeably couple the first and second antennas to the base. In an example embodiment, the system further comprises at least one base engagement member configured to facilitate engagement of the first and second antenna base connectors to the base. In an example embodiment, the first and second antenna base connectors comprise first and second pairs of ball bearing carriages configured to slidably couple the first and second antennas to the base, and the at least one base engagement member system further comprises: first and second linear slide rails provided on the base, the first and second slide rails configured to receive the first and second ball bearing carriages and to enable the slideable coupling of the first and second antennas to the base. In an example embodiment, the system further comprises telescoping slide rails configured to enable slideable movement in elevation of the first and second antennas. In an example embodiment, the telescoping slide rails comprise first and second telescoping slide rails coupled to the first and second actuators, respectively, to receive the first and second actuator antenna connectors. In an example embodiment, the first and second antennas operate at different first and second antenna beam frequencies to provide a dual band RADAR. In an example embodiment, the first and second antennas operate at different first and second antenna beam frequencies to provide the dual band RADAR operating at C-band and at X-band. In an example embodiment, the system further comprises an enclosure coupled to the base, the first and second antennas being coupled to the enclosure so as to provide indirect coupling of the first and second antennas to the base. In an example embodiment, the enclosure is shaped and profiled substantially similar to the first and second antennas, the enclosure being configured to reduce radiative coupling between the first antenna and the second antenna. In an example embodiment, the enclosure is coupled to the base via an enclosure base connector. In an example embodiment, the system further comprises a first antenna mounting connector configured to couple the first antenna to the enclosure, and a second antenna mounting connector configured to couple the second antenna to the enclosure. In an example embodiment, the position controller further comprises a first actuator configured to move the first antenna in at least one of position or elevation, and a second actuator configured to move the second antenna in at least one of position or elevation. In an example embodiment the first and second actuators each comprise a linear actuator. In an example embodiment the first and second actuators each comprise a hydraulic actuator. In an example embodiment the system further comprises a first actuator antenna connector configured to couple the first actuator to the first antenna; a first actuator enclosure connector configured to couple the first actuator to the enclosure; a second actuator antenna connector configured to couple the second actuator to the second antenna, and a second actuator enclosure connector configured to couple the second actuator to the enclosure. In an example embodiment, each of the first and second antennas are moveable anywhere between: a vertical operating position in which the first and second antennas are substantially orthogonal to the base, and a tilted operational position in which inner surfaces of the first and second antennas are at an acute angle relative to the base. In an example embodiment, the first antenna is provided at the tilted operational position and the acute angle relative to the base is 70 degrees, and the second antenna is provided at the vertical operating position substantially orthogonal to the base. In an example embodiment, each of the first and second antennas are moveable anywhere between a vertical operating position in which the first and second antennas are substantially orthogonal to the base, and a horizontal operating position in which the first and second antennas are substantially parallel to the base. In an example embodiment, the first and second antenna mounting connectors comprise first and second hinges configured to maintain a top of the first and second antennas at substantially the same height when moved from a first operating position to a second operating position. In an example embodiment the enclosure houses an azimuth rotator operating at a rotation rate, and wherein the system operates at a scan rate SR2 that is higher than the rotation rate RR. In an example embodiment the enclosure houses at least one transceiver communicatively coupled to the first and second antennas. In an example embodiment, each of the first and second antennas is moveable between a plurality of operational positions. In an example embodiment, each of the first and second antennas is moveable between: a vertical operational position in which the first and second antennas are substantially orthogonal to the base, and a tilted operational position in which inner surfaces of the first and second antennas are at an acute angle with reference to a center of the base. In an example embodiment, each of the first and second antennas is moveable between: a vertical operational position in which the first and second antennas are substantially orthogonal to the base, and a horizontal operational position in which the first and second antennas are substantially parallel to the base. In an example embodiment, each of the first and second antennas is moveable between: a vertical outward facing operating position defined by +90 degrees tilt with respect to the base; a horizontal operating position parallel with the base; and a vertical inward facing operating position defined by −90 degrees tilt with respect to the base. In an example embodiment, each of the first and second antennas is moveable between: a horizontal upward facing operating position defined by +90 degrees tilt with respect to a vertical axis; a vertical operating position parallel with the vertical axis; and a horizontal downward facing operating position defined by −90 degrees tilt with respect to the vertical axis. In an example embodiment, each of the first and second antennas comprises a slotted array antenna. In an example embodiment, the slotted array antenna has a generally circular shape. In an example embodiment, the slotted array antenna has a generally annular shape with two opposing flat edges. In an example embodiment, the first antenna has a first antenna type different from a second antenna type of the second antenna. In an example embodiment, the first antenna is configured to provide a communications function and the second antenna is configured to provide a tracking function. In an example embodiment, the base comprises an azimuth rotator operating at a rotation rate, and wherein the system operates at a scan rate SR2 that is higher than the rotation rate RR. In an example embodiment, the scan rate SR2 at which the system providing the first and second antenna beams operates is higher than an original scan rate SR1 for a similar system that produces only one antenna beam. In an example embodiment, the RADAR antenna system comprises a solid state RADAR antenna system, and the first antenna is configured to produce long pulses and the second antenna is configured to produce short pulses. In an example embodiment, the first and second antennas are configured to substantially simultaneously propagate the long pulses and the short pulses, respectively. In an example embodiment, the system further comprises a processor configured to perform post-processing for the first and second antennas to align the post-processing results from the first and second antennas. In another embodiment, the present disclosure provides a RADAR antenna system comprising a base and a plurality of antennas configured to transmit at least two independent antenna beams. The plurality of antennas are each coupled to the base so as to provide a common rotational axis. The system further comprises an antenna position controller configured to independently control a transmission position associated with each of the plurality of antennas. In an example embodiment, the plurality of antennas are configured to produce an independent antenna beam for each of the plurality of antennas. In an example embodiment, the antenna position controller is configured to independently control an elevation associated with each of the plurality of antennas, to transmit the independent antenna beams of each of the plurality of antennas at different heights. In an example embodiment, the antenna position controller and the plurality of antennas cooperate to transmit the plurality of independent antenna beams such that each antenna beam is decoupled from each of the other antenna beams in the plurality of antenna beams. In an example embodiment, the antenna position controller and the plurality of antennas cooperate to transmit the plurality of independent antenna beams in different directions. In an example embodiment, the antenna position controller and the plurality of antennas cooperate to transmit the plurality of independent antenna beams in opposite directions. In an example embodiment, the plurality of antennas comprises four slotted array antennas having a pyramidal hexagon shape. In an example embodiment, the plurality of antennas comprises four slotted array antennas having an isosceles trapezoid shape. In an example embodiment, the plurality of antennas comprises four slotted array antennas having a substantially square or diamond shape. In an example embodiment, the plurality of antennas comprises four antennas, and wherein the independent antenna beams for each of the four antennas each have a different beam frequency. In an example embodiment, wherein the four different beam frequencies are operated concurrently. In an example embodiment, the plurality of antennas comprises four antennas, and wherein the independent antenna beams for each of the four antennas each have the same beam frequency. In an example embodiment, the system further comprises: a plurality of RADAR transceivers equal in number to the plurality of antennas, each of the plurality of RADAR transceivers being uniquely associated with one of the plurality of transceivers; and a RADAR signal processor configured to perform post-processing for the plurality of antennas to align the post-processing results from the associated RADAR transceivers. In an example embodiment, each of the plurality of RADAR transceivers comprises: a transmitter; a receiver; a circulator in communication with the associated antenna and with the transmitter and the receiver; an analog/digital converter (ADC) in communication with the transmitter; and a digital/analog converter (DAC) in communication with the receiver. The RADAR signal processor is in communication with each of the ADCs and with each of the DACs. In an example embodiment, the RADAR antenna system comprises a solid state RADAR antenna system, and first and second RADAR transceivers of the plurality of RADAR transceivers are configured to produce long pulses at a first antenna and to produce short pulses at a second antenna, respectively. In an example embodiment, the first and second antennas are configured to substantially simultaneously transmit the long pulses and the short pulses, respectively. In further example embodiments, the RADAR antenna system comprises combinations of features and sub-features recited herein. Such additional example embodiments include all reasonable combinations of features or sub-features that are described or illustrated herein, whether or not explicitly provided in such combinations of features or sub-features, and include all operable combinations as understood by one of ordinary skill in the art. DETAILED DESCRIPTION A RADAR antenna system and method are provided. In an implementation, the system includes a base and first and second antennas configured to transmit independent first and second antenna beams, respectively. The first and second antennas are each coupled to the base so as to provide a common rotational axis for the first and second antennas. An antenna position controller is configured to independently control first and second transmission positions associated with the first and second antennas, respectively. Two different antenna technologies can be used, for example one for providing communications capability and the other for providing tracking capability. Other implementations include four or more antennas configured to transmit beams at similar or different frequencies. Improvements in scan rate proportional to the number of antennas are achieved compared to that achievable with a single beam, without an increase in the rotation rate of the antenna system. For simplicity and clarity of illustration, reference numerals may be repeated among the figures to indicate corresponding or analogous elements. Numerous details are set forth to provide an understanding of the embodiments described herein. The embodiments may be practiced without these details. In other instances, well-known methods, procedures, and components have not been described in detail to avoid obscuring the embodiments described. FIG.1is a block diagram illustrating a RADAR antenna system100according to an embodiment of the present disclosure. The RADAR antenna system100comprises a base110, a first antenna120and a second antenna130. The first and second antennas120and130are configured to transmit independent first and second antenna beams, respectively. The first and second antennas120and130are each coupled to the base110so as to provide a common rotational axis for the first and second antennas. The system100also comprises an antenna position controller140configured to independently control first and second transmission positions associated with the first and second antennas120and130, respectively. The different transmission positions advantageously enable transmission of the first and second antenna beams, for example in different directions, so that the first antenna beam is decoupled from the second antenna beam. For example, positioning the first and second antenna beams at different elevation angles enables the RADAR to scan the surrounding environment at twice the speed of a conventional antenna system. In another embodiment that will be described later, a fourfold increase in the scan rate can be achieved through the use of four antennas. Use of two antennas in the RADAR enables different environments to be scanned with potentially two different operating frequencies. In an example embodiment, the antenna position controller140is configured to independently control first and second elevations associated with the first and second antennas120and130, respectively, to enable transmission of the first and second antenna beams at different heights. In an embodiment, the antenna position controller140and the first and second antennas120and130cooperate to transmit the first and second antenna beams in opposite directions such that the first antenna beam is decoupled from the second antenna beam. In an implementation, the first and second antennas120and130operate at different first and second antenna beam frequencies to provide a dual band RADAR, for example a dual band RADAR operating at C-band and at X-band. Such a system can enable improved long range weather sensitivity at C-band, while achieving high resolution short range sensitivity at X-band. In another implementation, the first and second antennas120and130operate at substantially similar first and second antenna beam frequencies. In an example implementation, the base110comprises an azimuth rotator (not shown) operating at a rotation rate, and the system100according to an embodiment of the present disclosure operates at a scan rate that is higher than the rotation rate. In an example implementation, the scan rate SR2 at which the system100providing the first and second antenna beams operates is higher than a conventional scan rate SR1 for a known similar system that produces only one antenna beam. FIG.2illustrates a top perspective view of a RADAR antenna system200according to an embodiment of the present disclosure having two antennas shown in a tilted position. The RADAR antenna system200comprises a base210, a first antenna220and a second antenna230. In the example embodiment shown inFIG.2, each of the first and second antennas220and230comprises a slotted array antenna, for example a slotted flat plate antenna having a generally circular shape, and in an embodiment having two opposing flat edges. The system200can be implemented or used as a monopulse RADAR. In an implementation, three feeds are used to generate two beams, and the system can track a target and mechanically servo the antenna, following a target. In an embodiment according to monopulse operation, the first antenna220is used to track an incoming target while the second antenna230is tilted to the horizontal plane to enable a communication channel to be established to convey target information to a remote site. In an embodiment having a weather RADAR application, monopulse RADAR enables the RADAR to track severe weather such as a tornado and also monitor the atmospheric conditions vertically above the RADAR. In another embodiment, the first and second antennas220and230comprise dual polar antennas. In a dual polar implementation, one polarization is vertical, and one is horizontal. An implementation running dual polar antennas on both antennas provides an advantage, such as reducing cross-polarization. In another dual polar implementation, one pole is run from the first antenna and the other pole is run from the second antenna. The first and second antennas220and230are configured to transmit independent first and second antenna beams, respectively. The first and second antennas220and230are each coupled to the base210so as to provide a common rotational axis for the first and second antennas. In an embodiment, the system200comprises a first base antenna connector configured to couple the first antenna to the base, and a second base antenna connector configured to couple the second antenna to the base. In an example embodiment, the first and second base antenna connectors and comprise first and second pairs of ball bearing carriages252and254, respectively, configured to couple the first and second antennas220and230to the base210. In an example embodiment, the system200comprises at least one base engagement member, for example a horizontal track, configured to facilitate engagement of the antenna base connectors to the base. In an example embodiment, the at least one base engagement member comprises first and second pairs of linear slide rails256and258provided on the base210. Both of the linear slide rails258are visible inFIG.2, and both of the linear slide rails256are visible inFIG.3. The first and second pairs of slide rails, or horizontal tracks,256and258are configured to receive the first and second pairs of ball bearing carriages252and254and to enable the adjustable coupling of the first and second antennas220and230to the base210. FIG.3illustrates the system ofFIG.2with the two antennas220and230shown in an upright or vertical position. In a system according to an example embodiment of the present disclosure, each of the first and second antennas220and230is moveable between a plurality of operational positions. In an implementation, each of the first and second antennas is moveable between: a vertical operational position in which the first and second antennas are substantially orthogonal to the base (as shown inFIGS.3and5), and a tilted operational position in which inner surfaces of the first and second antennas are at an acute angle of elevation with reference to a center of the base (as shown inFIGS.2and4). WhileFIG.2throughFIG.5show the first and second antennas in upright and tilted positions of about 45 degrees, in an embodiment the first and second antennas are moveable between operational positions anywhere between 0 degrees and 90 degrees, or anywhere between upright and horizontal. FIG.4illustrates a side view of the system ofFIG.2in which additional system components are visible. The system200comprises an antenna position controller. As shown inFIGS.4and5, in an example embodiment the antenna position controller comprises a first actuator240configured to move the first antenna220in position or elevation, or both; and a second actuator (not visible inFIGS.4and5) configured to move the second antenna230in position or elevation, or both. In an implementation, one or both of the first and second actuators comprise a linear actuator. In an implementation, one or both of the first and second actuators comprise a hydraulic actuator. In an example embodiment, the system200further comprises: a first actuator antenna connector262configured to couple the first actuator240to the first antenna220, and a first actuator base connector264configured to couple the first actuator to the base. A second actuator antenna connector266is configured to couple the second actuator (obscured inFIGS.4and5by the first actuator) to the second antenna230, while a second actuator base connector (not visible inFIGS.4and5) is configured to couple the second actuator to the base. As shown inFIG.5, when the first and second antennas220and230are in a vertical operating position, the first and second base plate connectors252and254engage with the slide rails at a position that is substantially collinear with the actuator base connectors. In an example embodiment, the system200further comprises telescoping slide rails configured to enable slideable movement of the first and second antennas. In an example embodiment, first and second telescoping slide rails268are coupled to the first and second actuators, respectively, to receive the first and second actuator antenna connectors262and266. FIG.6illustrates a top perspective view of a RADAR antenna system300according to an embodiment of the present disclosure having two antennas and showing one antenna in a tilted position and one antenna in an upright position. The RADAR antenna system300comprises a base310, a first antenna320and a second antenna330. In the example embodiment shown inFIG.6, each of the first and second antennas320and330comprises a solid flat plate antenna, for example a slotted waveguide. In another embodiment, the first and second antennas comprise a planar antenna or a patch antenna. In a further embodiment, the first antenna is of a different antenna type than the second antenna, and can have a different purpose, e.g. communications versus tracking. The first and second antennas320and330are each coupled to the base310so as to provide a common rotational axis for the first and second antennas. In an example embodiment, the first and second antennas320and330are configured to transmit independent first and second antenna beams, respectively. In another embodiment employing active antennas, each active antenna320and330can itself have 4 beams, generating 8 beams in total, which can increase performance by 16 times. Embodiments of the present disclosure provide advantages over known approaches, regardless of the type of antenna is used. The system300comprises an enclosure. In an example embodiment, the enclosure is a RADAR transceiver enclosure370as illustrated inFIGS.6-9. The RADAR transceiver enclosure370houses RADAR electronics, including a RADAR transceiver, and couples to the base310. In an example embodiment, the RADAR transceiver enclosure370houses the RADAR electronics and the azimuth rotator. In the example embodiment ofFIG.6, the first and second antennas320and330are coupled to the RADAR transceiver enclosure370so as to provide indirect coupling to the base310. This is in contrast to the embodiment ofFIG.2throughFIG.5in which the first and second antennas are coupled to the base using an antenna base connector, such as the horizontal track(s). In an example embodiment, the RADAR transceiver enclosure370is indirectly coupled to the base310, such as via a transceiver enclosure base connector372. In an embodiment, the azimuth rotator is housed underneath the RADAR transceiver enclosure370, for example under the transceiver enclosure base connector372, or elsewhere under the base310. In the embodiment ofFIG.6, the first and second antennas320and330are not coupled directly to the base310. FIG.7illustrates a front view ofFIG.6. As shown inFIG.7, in an example embodiment the RADAR transceiver enclosure370has a physical shape and profile similar to the shape and profile of the first and second antennas320and330. In an example embodiment, the physical shape and profile of the RADAR transceiver enclosure370enables a reduction in the radiative coupling between the first and second antennas320and330. The reduced radiative coupling, or increased electromagnetic isolation, provided by the RADAR transceiver enclosure370is helpful, for example when one antenna is in transmit mode and the other antenna is in receive mode. In an example implementation of a monopulse system, one antenna will look up and the other will perform the tracking. In those cases, the hinges will provide full range of motion, rather than the restricted motion shown inFIGS.6and7. In an example embodiment, the two antennas operate in completely different bands. In an example embodiment, the two antennas have two different antenna technologies, e.g. one providing communications capability and the other providing tracking capability. In an example embodiment, a dual polar implementation is used for a weather RADAR. FIG.8illustrates a top view ofFIG.6in which additional system components are visible. In an embodiment, one or more first antenna mounting connectors382are configured to couple the first antenna320to the RADAR transceiver enclosure370. In the example embodiment ofFIG.8, a pair of first antenna mounting connectors382are configured to couple the first antenna320to the RADAR transceiver enclosure370. In an embodiment, one or more second antenna mounting connectors384are configured to couple the second antenna330to the RADAR transceiver enclosure370. In the example embodiment ofFIG.8, a pair of second antenna mounting connectors384are configured to couple the second antenna330to the RADAR transceiver enclosure370, for example by means of a hinge. FIG.9illustrates a side view ofFIG.6in which additional system components are visible. The system300comprises an antenna position controller. As shown inFIG.9, in an example embodiment the antenna position controller comprises a first actuator342configured to move the first antenna320in position or elevation, or both; and a second actuator344configured to move the second antenna330in position or elevation, or both. In an implementation, one or both of the first and second actuators comprise a linear actuator. In an implementation, one or both of the first and second actuators comprise a hydraulic actuator. In an example embodiment, the system300further comprises: a first actuator antenna connector362configured to couple the first actuator342to the first antenna320, and a first actuator enclosure connector364configured to couple the first actuator to the RADAR transceiver enclosure370. A second actuator antenna connector366is configured to couple the second actuator344to the second antenna330, while a second actuator enclosure connector368is configured to couple the second actuator to the RADAR transceiver enclosure370. As shown inFIG.9, the first antenna320is in a tilted operating position and the second antenna320is in an upright or vertical operating position. While the example embodiment ofFIG.9illustrates the first antenna320in a tilted operating position of an angle of about 70 degrees from the base, and the second antenna is in a vertical operating position substantially perpendicular to the base, in other embodiments the first and second antennas320and330are in other operating positions anywhere from perpendicular to the base to parallel to the base. In the example embodiment ofFIG.6throughFIG.9, the first and second antennas320and330are coupled to the RADAR transceiver enclosure370by means of a hinge. An antenna elevation, or antenna height, associated with the first and second antennas320and330is substantially unchanged when the antennas are moved from a first operating position to a second operating position, since the hinges382and384maintain the tops of the first and second antennas at substantially the same height. This is in contrast to the embodiment ofFIG.2throughFIG.5in which the first and second antennas are coupled to the base and to the actuator by way of slide rails or similar elements permitting a change in the elevation of the first and second antennas and translation of the first and second antennas during such change in elevation. The example embodiments of the present disclosure have thus far described a RADAR antenna system comprising first and second antennas and a base. In another embodiment, the present disclosure provides a RADAR antenna system comprising a base and a plurality of antennas configured to transmit at least two independent antenna beams. The plurality of antennas are each coupled to the base so as to provide a common rotational axis. An antenna position controller is configured to independently control a transmission position associated with each of the plurality of antennas. FIG.10illustrates a top perspective view of a RADAR antenna system400according to an embodiment of the present disclosure having four antennas shown in a tilted position. In an embodiment having four antennas, four antenna beams of the same or different frequencies can be transmitted. In an implementation using substantially identical beam frequencies, the scan rate will increase four fold over that achievable with a single beam. It is also an advantage of embodiments of the present disclosure that the four fold scan rate is achieved without an increase in the rotational rate of the antenna. This has advantage in terms of rotator reliability as a system can be operated at a one quarter the speed of a single beam system. In addition, the rotational rate of the antenna can introduce ground clutter at frequencies associated with the rotational rate of the antenna. Reduction in the antenna rotation speed lowers the Doppler frequency associated with the ground clutter improving the RADAR sensitivity to slow moving targets. In the example embodiment ofFIG.10, the four antennas420,425,430and435each have a pyramidal hexagon shape, though other shapes can be used. Compared to the standard circular antenna shape, the pyramidal hexagon shape of the embodiment ofFIG.10can be advantageous with respect to side lobe reduction. The pyramidal hexagon antenna shape inFIG.10also provides additional surface area and increased number of slots when compared to a circular antenna, and the flat edges of the antenna engage with each other in a closed position, making efficient use of antenna real estate. The isosceles trapezoidal antenna shape of the embodiment inFIG.15, to be described in detail later, has similar advantages. In an embodiment, at least one of antennas defines a plurality of actuator engagement points at which an antenna connector can be coupled, or is couplable, to the antenna. In the example embodiment ofFIG.10, the second antenna425defines a plurality of actuator engagement points442at which a second actuator antenna connector can be coupled, or is couplable, to the second antenna425. In an example embodiment, the plurality of actuator engagement points are provided at different heights along a vertical axis of the second antenna when the second antenna is in an upright position. In the example embodiment ofFIG.10, a radome (radar dome) mounting plate415is provided to facilitate mounting of a radome, which is an enclosure for protecting a radar antenna. A radome is typically constructed of a material that has minimal signal attenuation and protects the antenna from weather and other undesirable disturbance that may affect proper antenna operation. An antenna mounting plate410is provided on which the antennas are to be mounted. In the example embodiment ofFIG.10, the antenna mounting plate410defines slots to control the side lobes of the antenna beam, which are communication paths into the radar. In the example embodiment ofFIG.10, the system400comprises a plurality of base antenna connectors452configured to couple each of each of the antennas420,425,430and435to the base or antenna mounting plate410. In an example embodiment, the antenna mounting plate410and the radome mounting plate415spin relative to each other. In an example embodiment, the base antenna connectors452connect the antennas to the base410with a fixed hinge such that the antenna is moveable in inclination, or tilt, without changing position with respect to the connection position on the base. FIGS.11and12illustrate top and side views, respectively, ofFIG.10with the antennas in a tilted position.FIGS.13and14illustrate top and side views, respectively, of the system ofFIG.10with the four antennas in an upright position. As shown inFIGS.11and13, in an example embodiment, the system400further comprises actuator antenna connectors462configured to couple an actuator440to each antenna, such as antenna420. Actuator base connectors464are configured to couple the actuator440to the base. The antenna base connectors452are also seen inFIGS.12,13and14. In the example embodiment ofFIG.10throughFIG.14, the antennas420,425,430and435are coupled to the base with a fixed hinge and to the respective actuators with a fixed hinge. An antenna elevation, or antenna height, associated with the antennas420,425,430and435is substantially unchanged when the antennas are moved from a first operating position to a second operating position, since the antenna base connectors452maintain the antennas coupled to the same connection positions on the base410. FIG.15illustrates a top perspective view of a RADAR antenna system500according to another embodiment of the present disclosure having four antennas shown in a tilted position. In the example embodiment ofFIG.15, the four antennas520,525,530and535each have an isosceles trapezoidal shape, though other shapes can be used. The antenna shapes used in embodiments of the present disclosure, including the shape inFIG.15, are primarily used to allow maximum tilt angle and maximum antenna physical aperture. In some embodiments, such antennas will also provide increased side lobe suppression. In an embodiment, at least one of antennas defines a plurality of actuator engagement points at which an antenna connector is couplable to the antenna. In the example embodiment ofFIG.15, the second antenna525defines a plurality of actuator engagement points542at which a second antenna connector is couplable to the second antenna525. In an example embodiment, the plurality of actuator engagement points are provided at different heights along a vertical axis of the second antenna when the second antenna is in an upright position. Similar toFIG.10, in the example embodiment ofFIG.15, a radome mounting plate515is provided to facilitate mounting of a radome, while the antennas are mounted on the antenna mounting plate510, or base. In the example embodiment ofFIG.15, the system500comprises a plurality of base antenna connectors552configured to couple each of the antennas520,525,530and535to the base or antenna mounting plate510. In an example embodiment, the base antenna connectors552connect the antennas to the base using a hinge such that the antenna is moveable in inclination without changing the connection position on the base. FIGS.16and17illustrate top and side views, respectively, ofFIG.15with the antennas in a tilted position.FIGS.18and19illustrate top and side views, respectively, of the system ofFIG.15with the four antennas in an upright position. As shown inFIGS.16and18, in an example embodiment, the system500further comprises actuator antenna connectors562configured to couple an actuator540to each antenna, such as antenna520. Actuator base connectors564are configured to couple the actuator540to the base. The antenna base connectors552are also seen inFIGS.17,18and19. In the example embodiment ofFIG.15throughFIG.19, the antennas520,525,530and535are coupled to the base using a fixed hinge and to the respective actuators using a fixed hinge. An antenna elevation, or antenna height, associated with the antennas520,525,530and535is substantially unchanged when the antennas are moved from a first operating position to a second operating position. This is similar to the embodiment inFIG.6throughFIG.9and the embodiment inFIG.10throughFIG.15, and in contrast to the embodiment ofFIG.2throughFIG.5in which the first and second antennas are coupled to the base and to the actuator by way of slide rails or similar elements permitting a change in the elevation of the first and second antennas and translation of the first and second antennas during such change in elevation. FIG.20throughFIG.24illustrate an additional embodiment showing a quad plate folding antenna. In an example embodiment, the quad flat folding implementation maximizes tilt angle and range while providing an added advantage of the antenna folding away to a flat storable geometry. FIG.20illustrates a top perspective view of a RADAR antenna system600according to another embodiment of the present disclosure having four antennas shown in a vertical position. In the example embodiment ofFIG.20, the four antennas620,625,630and635each have diamond or square shape, with one corner cut off as shown, though other shapes can be used. In an embodiment, at least one of antennas defines a plurality of actuator engagement points at which an antenna connector is couplable to the antenna. In the example embodiment ofFIG.20, the second antenna625defines a plurality of actuator engagement points642at which a second antenna connector is couplable to the second antenna625. In an example embodiment, the plurality of actuator engagement points are provided at different heights along a vertical axis of the second antenna when the second antenna is in an upright position. Similar toFIGS.10and15, in the example embodiment ofFIG.20, a radome mounting plate615is provided to facilitate mounting of a radome, while the antennas are mounted on the antenna mounting plate610, or base. In the example embodiment ofFIG.20, the system600comprises a plurality of base antenna connectors652configured to couple each of each of the antennas620,625,630and635to the base or antenna mounting plate610, for example using a hinge. In an example embodiment, the base antenna connectors652connect the antennas to the base such that the antenna is moveable in inclination without changing position with respect to the connection position on the base. As shown inFIG.20, the plurality of actuator base connectors664are configured to adjustably couple the actuators640to the base. In an example embodiment, the actuator base connectors comprise ball bearing carriages. In an example embodiment, the system600comprises a plurality of base engagement members656, for example a horizontal track, configured to facilitate adjustable engagement of the actuator base connectors to the base610. In an example embodiment, the base engagement members656comprise a plurality of linear slide rails configured to receive the plurality of actuator base connectors664, for example a plurality of ball bearing carriages. InFIG.20, the actuator base connectors664enable adjustable engagement of the actuators640with the base610, for example on slide rails, while the base antenna connectors652enable fixed engagement with the base, for example using a hinge. This is in contrast toFIG.4in which the base antenna connectors252and254are configured to facilitate adjustable engagement of the antennas220and230with the base210, for example on slide rails, while the actuator base connectors264enable fixed engagement with the base, for example using a hinge. FIGS.21and22illustrate top and side views, respectively, ofFIG.20with the antennas in an upright or vertical position.FIGS.23and24illustrate top and side views, respectively, of the system ofFIG.20with the four antennas in a horizontal or flat position. As shown inFIGS.21and23, in an example embodiment, the system600further comprises actuator antenna connectors662configured to couple an actuator640to each antenna, such as antenna620. Actuator base connectors664are configured to couple the actuator640to the base. The antenna base connectors652are also seen inFIGS.21,22and23. In the example embodiment ofFIG.20throughFIG.24, the antennas620,625,630and635are moveable between a fully vertical operating position and a fully horizontal operating position, such that in the fully horizontal operating position shown inFIG.23andFIG.24, the system600is easily folded away and stored in a configuration that takes up a small amount of space compared to other implementations. FIG.25illustrates a top perspective view of the system ofFIG.20with the four antennas shown in a negative declination position.FIG.26andFIG.27are top and side views, respectively, ofFIG.25. In the embodiment ofFIG.25, the operating elevation range is adjusted over greater than 90 degrees. Various implementations enable both declination and elevation to allow the RADAR to view above and below the horizontal axis. This adds flexibility to the RADAR platform. In the embodiment shown inFIG.25, the antenna position controller for each antenna comprises a single actuator640, and the antenna base connectors652comprise a hinge configured to enable both declination and elevation. In the embodiment ofFIG.25, each of antennas620,625,630and635is moveable between a horizontal upward facing operating position (90 degrees relative the vertical axis) and a vertical operating position (0 degrees relative the vertical axis), and also at angles up to and including a horizontal downward facing operating position (−90 degrees relative to the vertical axis). The horizontally upward facing operating position, vertical operating position, and horizontally downward facing operating position, may also be defined respectively at positions of 0 degrees, 90 degrees, and 180 degrees, relative to the horizontal. FIG.28is a block diagram illustrating a RADAR antenna system700according to another embodiment of the present disclosure. In contrast to the embodiments ofFIG.1throughFIG.27which illustrate mechanical elements of the system and their interrelationship, the embodiment ofFIG.28illustrates electrical elements of the system700and their interrelationship. The embodiment ofFIG.28illustrates a plurality of antennas701,702,703and704. While the example embodiment ofFIG.28illustrates four RADAR antennas, other embodiments include two RADAR antennas, or other numbers of RADAR antennas. Each RADAR antenna701,702,703,704is in communication with a respective RADAR transceiver710,720,730,740. In an embodiment, the first RADAR transceiver710comprises a circulator711in communication with both a transmitter712and a receiver714. An analog/digital converter (ADC)716is in communication with the transmitter712, and a digital/analog converter (DAC)718is in communication with the receiver714. Similarly, the second RADAR transceiver720comprises: a circulator721in communication with both a transmitter722and a receiver724; an ADC726in communication with the transmitter722; and a DAC728in communication with the receiver724. The third RADAR transceiver730comprises: a circulator731in communication with both a transmitter732and a receiver734; an ADC736in communication with the transmitter732; and a DAC738in communication with the receiver734. The fourth RADAR transceiver740comprises: a circulator741in communication with both a transmitter742and a receiver744; an ADC746in communication with the transmitter742; and a DAC748in communication with the receiver744. The system further comprises a processor unit750, such as a baseband RADAR signal processor unit, in communication with each of the ADCs716,726,736and746and with each of the DACs718,728,738and748. In an example implementation, the processor unit750is configured to perform post-processing for the plurality of antennas701,702,703and704to align the post-processing results from the plurality of antennas. Antennas in a RADAR system according to an embodiment of the present disclosure, such as the system700shown inFIG.28, may comprise antennas which transmit antenna beams comprising a pulse train or series of repeated signal pulses. A signal pulse from a solid state RADAR system may achieve comparable transmitted energy as, for example, a travelling wave tube transmitter. The transmitted energy of a signal pulse equals the pulse duration (or transmit period) multiplied by the transmitted power. FIG.29illustrates a timing diagram800for pulses sent by a conventional RADAR.FIG.29represents a conventional approach to resolving targets positioned in the blind range of a solid state RADAR antenna system, where the blind range is outside an unambiguous range of distances within which the RADAR can unambiguously resolve a target. This approach appends a second signal pulse or short pulse812, to the first signal pulse or long pulse810where the short pulse812has a pulse duration less than the long pulse810. FIG.30illustrates a timing diagram for pulses sent by a RADAR antenna system according to an embodiment of the present disclosure.FIG.30illustrates a first pulse diagram801and a second pulse diagram802associated with pulses transmitted from first and second antennas, respectively. First pulse diagram801illustrates a first antenna beam transmitting a first pulse810repeating every long pulse repetition interval (or first transmission repetition interval) corresponding to a maximum or desired scan range for a solid state RADAR antenna system. Second pulse diagram802illustrates a second antenna beam transmitting a second pulse820decoupled from first pulse810. Decoupling, without limitation, may include separating, isolating, or otherwise lowering cross-contamination between first pulse810and second pulse820. In embodiments described herein, decoupling primarily comprises physical decoupling. In other embodiments, decoupling instead or additionally comprises frequency decoupling and orthogonal polarization. FIG.31illustrates a timing diagram for pulses sent by a RADAR antenna system according to another embodiment of the present disclosure.FIG.31illustrates a first pulse diagram901, second pulse diagram902, third pulse diagram903, and fourth pulse diagram904, corresponding to first, second, third, and fourth antenna beams, respectively, as transmitted from a solid state RADAR antenna system according to an embodiment as disclosed herein. In an example embodiment, the pulse diagrams901,902,903,904are associated with pulses transmitted from first, second, third and fourth antennas, respectively. Each antenna beam is decoupled from each other antenna beam by at least one of physical decoupling, frequency decoupling, and orthogonal polarization. In an embodiment, each antenna beam corresponds to a separate antenna, thus each of first pulse110, second pulse120, third pulse130, and fourth pulse140is physically decoupled from all pulses. However, other embodiments may implement one or more systems for decoupling. In another embodiment, first pulse110and second pulse120may transmit from a first antenna which implements frequency decoupling or orthogonal polarization to decouple first pulse110from second pulse120. A second antenna transmitting third pulse130and fourth pulse140may also implement frequency decoupling or orthogonal polarization to decouple third pulse130from fourth pulse140, the first and second antennas physically decoupled such that the eradiated power from either antenna does no impinge on the other antenna during transmission. Additional implementation details regarding the pulse diagrams and antenna beam transmissions illustrated inFIG.29throughFIG.31are found in co-pending patent application having the same inventors as the present application and entitled “SYSTEM AND METHOD FOR IMPROVED RADAR SENSITIVITY” filed of even date herewith, which is incorporated herein by reference. Embodiments of the present disclosure address the problems of scanning speed and blind range in the RADAR system through implementation of two or more antenna plates which achieve two independent antenna beams. Independent control of the antenna plate elevation enables two beams at different heights which in turn allows the same volume space to be scanned in half the time as compared with a single flat plate. In an example embodiment, a slotted array antenna is used, which enables the size of the resultant antenna system to be minimized in contrast with reflect array type antenna systems which require a boom arm to support the radiating elements. Embodiments of the present disclosure can be scaled to 4 or more antennae. In the case of 4 antennae, four beams of the same or different frequencies can be implemented. In the case of identical beam frequencies the scan rate will increase four fold over that achievable with a single beam. It is also an advantage of embodiments of the disclosure that the four fold scan rate is achieved without an increase in the rotational rate of the antenna. This has advantage in terms of rotator reliability as a system can be operated at a one quarter the speed of a single beam system. In addition, the rotational rate of the antenna can introduce ground clutter at frequencies associated with the rotational rate of the antenna. In an implementation, each antenna is optimized and operated at a different frequency. For example, the system can operate as a true dual band RADAR operating at C-band and X-band. Such a system would enable improved long range weather sensitivity at C-band whilst achieving high resolution short range sensitivity at X-band. In the case of four antennae system four different frequencies could be operated concurrently. If a four antenna plate configuration is used the close-in sensitivity of the RADAR can be further improved through provision of four different optimal pulse durations for achieving a required sensitivity within each blind range. In the preceding description, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the embodiments. However, it will be apparent to one skilled in the art that these specific details are not required. In other instances, well-known electrical structures and circuits are shown in block diagram form in order not to obscure the understanding. For example, specific details are not provided as to whether the embodiments described herein are implemented as a software routine, hardware circuit, firmware, or a combination thereof. Embodiments of the disclosure can be represented as a computer program product stored in a machine-readable medium (also referred to as a computer-readable medium, a processor-readable medium, or a computer usable medium having a computer-readable program code embodied therein). The machine-readable medium can be any suitable tangible, non-transitory medium, including magnetic, optical, or electrical storage medium including a diskette, compact disk read only memory (CD-ROM), memory device (volatile or non-volatile), or similar storage mechanism. The machine-readable medium can contain various sets of instructions, code sequences, configuration information, or other data, which, when executed, cause a processor to perform steps in a method according to an embodiment of the disclosure. Those of ordinary skill in the art will appreciate that other instructions and operations necessary to implement the described implementations can also be stored on the machine-readable medium. The instructions stored on the machine-readable medium can be executed by a processor or other suitable processing device, and can interface with circuitry to perform the described tasks. The above-described embodiments are intended to be examples only. Alterations, modifications and variations can be effected to the particular embodiments by those of skill in the art without departing from the scope, which is defined solely by the claims appended hereto. | 56,339 |
11942690 | DETAILED DESCRIPTION FIG.1is a block diagram illustrating an example electronic device in a network environment according to an embodiment of the disclosure. Referring toFIG.1, an electronic device101in a network environment100may communicate with an electronic device102via a first network198(e.g., a short-range wireless communication network), or an electronic device104or a server108via a second network199(e.g., a long-range wireless communication network). The electronic device101may communicate with the electronic device104via the server108. The electronic device101includes a processor120, memory130, an input device150, an audio output device155, a display device160, an audio module170, a sensor module176, an interface177, a haptic module179, a camera module180, a power management module188, a battery189, a communication module190, a subscriber identification module (SIM)196, or an antenna module197. In some embodiments, at least one (e.g., the display device160or the camera module180) of the components may be omitted from the electronic device101, or one or more other components may be added in the electronic device101. In some embodiments, some of the components may be implemented as single integrated circuitry. For example, the sensor module176(e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented as embedded in the display device160(e.g., a display). The processor120may execute, for example, software (e.g., a program140) to control at least one other component (e.g., a hardware or software component) of the electronic device101coupled with the processor120, and may perform various data processing or computation. As at least part of the data processing or computation, the processor120may load a command or data received from another component (e.g., the sensor module176or the communication module190) in volatile memory132, process the command or the data stored in the volatile memory132, and store resulting data in non-volatile memory134. The processor120may include a main processor121(e.g., a central processing unit (CPU) or an application processor (AP)), and an auxiliary processor123(e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor121. Additionally or alternatively, the auxiliary processor123may be adapted to consume less power than the main processor121, or to be specific to a specified function. The auxiliary processor123may be implemented as separate from, or as part of the main processor121. The auxiliary processor123may control at least some of functions or states related to at least one component (e.g., the display device160, the sensor module176, or the communication module190) among the components of the electronic device101, instead of the main processor121while the main processor121is in an inactive (e.g., sleep) state, or together with the main processor121while the main processor121is in an active state (e.g., executing an application). The auxiliary processor123(e.g., an ISP or a CP) may be implemented as part of another component (e.g., the camera module180or the communication module190) functionally related to the auxiliary processor123. The memory130may store various data used by at least one component (e.g., the processor120or the sensor module176) of the electronic device101. The various data may include, for example, software (e.g., the program140) and input data or output data for a command related thereto. The memory130may include the volatile memory132or the non-volatile memory134. The program140may be stored in the memory130as software, and may include, for example, an operating system (OS)142, middleware144, or an application146. The input device150may receive a command or data to be used by other component (e.g., the processor120) of the electronic device101, from the outside (e.g., a user) of the electronic device101. The input device150may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus pen). The audio output device155may output sound signals to the outside of the electronic device101. The audio output device155may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing record, and the receiver may be used for an incoming calls. The receiver may be implemented as separate from, or as part of the speaker. The display device160may visually provide information to the outside (e.g., a user) of the electronic device101. The display device160may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector. The display device160may include touch circuitry adapted to detect a touch, or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of force incurred by the touch. The audio module170may convert a sound into an electrical signal and vice versa. The audio module170may obtain the sound via the input device150, or output the sound via the audio output device155or a headphone of an external electronic device (e.g., an electronic device102) directly (e.g., wiredly) or wirelessly coupled with the electronic device101. The sensor module176may detect an operational state (e.g., power or temperature) of the electronic device101or an environmental state (e.g., a state of a user) external to the electronic device101, and then generate an electrical signal or data value corresponding to the detected state. The sensor module176may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor. The interface177may support one or more specified protocols to be used for the electronic device101to be coupled with the external electronic device (e.g., the electronic device102) directly (e.g., wiredly) or wirelessly. The interface177may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface. A connection terminal178may include a connector via which the electronic device101may be physically connected with the external electronic device (e.g., the electronic device102). The connection terminal178may include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector). The haptic module179may convert an electrical signal into a mechanical stimulus (e.g., a vibration or a movement) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. The haptic module179may include, for example, a motor, a piezoelectric element, or an electric stimulator. The camera module180may capture a still image or moving images. The camera module180may include one or more lenses, image sensors, image signal processors, or flashes. The power management module188may manage power supplied to the electronic device101. The power management module188may be implemented as at least part of, for example, a power management integrated circuit (PMIC). The battery189may supply power to at least one component of the electronic device101. The battery189may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell. The communication module190may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device101and the external electronic device (e.g., the electronic device102, the electronic device104, or the server108) and performing communication via the established communication channel. The communication module190may include one or more communication processors that are operable independently from the processor120(e.g., the AP) and supports a direct (e.g., wired) communication or a wireless communication. The communication module190may include a wireless communication module192(e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module194(e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device via the first network198(e.g., a short-range communication network, such as Bluetooth™, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network199(e.g., a long-range communication network, such as a cellular network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.g., multi chips) separate from each other. The wireless communication module192may identify and authenticate the electronic device101in a communication network, such as the first network198or the second network199, using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the SIM196. The antenna module197may transmit or receive a signal or power to or from the outside (e.g., the external electronic device) of the electronic device101. The antenna module197may include an antenna including a radiating element composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). The antenna module197may include a plurality of antennas. In such a case, at least one antenna appropriate for a communication scheme used in the communication network, such as the first network198or the second network199, may be selected, for example, by the communication module190(e.g., the wireless communication module192) from the plurality of antennas. The signal or the power may then be transmitted or received between the communication module190and the external electronic device via the selected at least one antenna. Another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module197. At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)). Commands or data may be transmitted or received between the electronic device101and the external electronic device104via the server108coupled with the second network199. Each of the electronic devices102and104may be a device of a same type as, or a different type, from the electronic device101. All or some of operations to be executed at the electronic device101may be executed at one or more of the external electronic devices102,104, or108. For example, if the electronic device101should perform a function or a service automatically, or in response to a request from a user or another device, the electronic device101, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device101. The electronic device101may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, or client-server computing technology may be used, for example. An electronic device according to an embodiment may be one of various types of electronic devices. The electronic device may include, for example, and without limitation, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. However, the electronic device is not limited to any of those described above. Various embodiments of the disclosure and the terms used herein are not intended to limit the technological features set forth herein to particular embodiments and include various changes, equivalents, or replacements for a corresponding embodiment. With regard to the description of the drawings, similar reference numerals may be used to refer to similar or related elements. A singular form of a noun corresponding to an item may include one or more of the things, unless the relevant context clearly indicates otherwise. As used herein, each of such phrases as “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B, or C”, “at least one of A, B, and C”, and “at least one of A, B, or C” may include any one of, or all possible combinations of the items enumerated together in a corresponding one of the phrases. As used herein, such terms as “1st” and “2nd”, or “first” and “second” may be used to simply distinguish a corresponding component from another, and does not limit the components in other aspect (e.g., importance or order). If an element (e.g., a first element) is referred to, with or without the term “operatively” or “communicatively”, as “coupled with”, “coupled to”, “connected with”, or “connected to” another element (e.g., a second element), the element may be coupled with the other element directly (e.g., wiredly), wirelessly, or via a third element. The term “module” may include a unit implemented in hardware, software, or firmware, or any combination thereof, and may interchangeably be used with other terms, for example, “logic”, “logic block”, “part”, or “circuitry”. A module may be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module may be implemented in a form of an application-specific integrated circuit (ASIC). Various embodiments as set forth herein may be implemented as software (e.g., the program140) including one or more instructions that are stored in a storage medium (e.g., internal memory136or external memory138) that is readable by a machine (e.g., the electronic device101). For example, a processor (e.g., the processor120) of the machine (e.g., the electronic device101) may invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using one or more other components under the control of the processor. This allows the machine to be operated to perform at least one function according to the at least one instruction invoked. The one or more instructions may include a code generated by a complier or a code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Wherein, the “non-transitory” storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium. A method according to an embodiment of the disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., PlayStore™), or between two user devices (e.g., smart phones) directly. If distributed online, at least part of the computer program product may be temporarily generated or at least temporarily stored in the machine-readable storage medium, such as memory of the manufacturer's server, a server of the application store, or a relay server. Each component (e.g., a module or a program) of the above-described components may include a single entity or multiple entities. One or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they are performed by a corresponding one of the plurality of components before the integration. Operations performed by the module, the program, or another component may be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order or omitted, or one or more other operations may be added. FIG.2is a block diagram illustrating an example electronic device for supporting legacy network communication and 5G network communication according to various embodiments of the disclosure. Referring toFIG.2, the electronic device101may include a first communication processor (e.g., including processing circuitry)212, second communication processor (e.g., including processing circuitry)214, first radio frequency integrated circuit (RFIC)222, second RFIC224, third RFIC226, fourth RFIC228, first radio frequency front end (RFFE)232, second RFFE234, first antenna module242, second antenna module244, and antenna248. The electronic device101may include a processor120and a memory130. A second network199may include a first cellular network292and a second cellular network294. According to another embodiment, the electronic device101may further include at least one of the components described with reference toFIG.1, and the second network199may further include at least one other network. According to an example embodiment, the first communication processor212, second communication processor214, first RFIC222, second RFIC224, fourth RFIC228, first RFFE232, and second RFFE234may form at least part of the wireless communication module192. According to another embodiment, the fourth RFIC228may be omitted or included as part of the third RFIC226. The first communication processor212may establish a communication channel of a band to be used for wireless communication with the first cellular network292and support legacy network communication through the established communication channel. According to various embodiments, the first cellular network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network. The second communication processor214may establish a communication channel corresponding to a designated band (e.g., about 6 GHz to about 60 GHz) of bands to be used for wireless communication with the second cellular network294, and support 5G network communication through the established communication channel. According to various embodiments, the second cellular network294may be a 5G network defined in 3GPP. Additionally, according to an embodiment, the first communication processor212or the second communication processor214may establish a communication channel corresponding to another designated band (e.g., about 6 GHz or less) of bands to be used for wireless communication with the second cellular network294and support 5G network communication through the established communication channel. According to an example embodiment, the first communication processor212and the second communication processor214may be implemented in a single chip or a single package. According to various embodiments, the first communication processor212or the second communication processor214may be formed in a single chip or a single package with the processor120, the auxiliary processor123, or the communication module190. Upon transmission, the first RFIC222may convert a baseband signal generated by the first communication processor212to a radio frequency (RF) signal of about 700 MHz to about 3 GHz used in the first cellular network292(e.g., legacy network). Upon reception, an RF signal may be obtained from the first cellular network292(e.g., legacy network) through an antenna (e.g., the first antenna module242) and be preprocessed through an RFFE (e.g., the first RFFE232). The first RFIC222may convert the preprocessed RF signal to a baseband signal to be processed by the first communication processor212. Upon transmission, the second RFIC224may convert a baseband signal generated by the first communication processor212or the second communication processor214to an RF signal (hereinafter, 5G Sub6 RF signal) of a Sub6 band (e.g., 6 GHz or less) to be used in the second cellular network294(e.g., 5G network). Upon reception, a 5G Sub6 RF signal may be obtained from the second cellular network294(e.g., 5G network) through an antenna (e.g., the second antenna module244) and be pretreated through an RFFE (e.g., the second RFFE234). The second RFIC224may convert the preprocessed 5G Sub6 RF signal to a baseband signal so as to be processed by a corresponding communication processor of the first communication processor212or the second communication processor214. The third RFIC226may convert a baseband signal generated by the second communication processor214to an RF signal (hereinafter, 5G Above6 RF signal) of a 5G Above6 band (e.g., about 6 GHz to about 60 GHz) to be used in the second cellular network294(e.g., 5G network). Upon reception, a 5G Above6 RF signal may be obtained from the second cellular network294(e.g., 5G network) through an antenna (e.g., the antenna248) and be preprocessed through the third RFFE236. The third RFIC226may convert the preprocessed 5G Above6 RF signal to a baseband signal to be processed by the second communication processor214. According to an example embodiment, the third RFFE236may be formed as part of the third RFIC226. According to an embodiment, the electronic device101may include a fourth RFIC228separately from the third RFIC226or as at least part of the third RFIC226. In this case, the fourth RFIC228may convert a baseband signal generated by the second communication processor214to an RF signal (hereinafter, an intermediate frequency (IF) signal) of an intermediate frequency band (e.g., about 9 GHz to about 11 GHz) and transfer the IF signal to the third RFIC226. The third RFIC226may convert the IF signal to a 5G Above 6RF signal. Upon reception, the 5G Above 6RF signal may be received from the second cellular network294(e.g., a 5G network) through an antenna (e.g., the antenna248) and be converted to an IF signal by the third RFIC226. The fourth RFIC228may convert an IF signal to a baseband signal to be processed by the second communication processor214. According to an example embodiment, the first RFIC222and the second RFIC224may be implemented into at least part of a single package or a single chip. According to an example embodiment, the first RFFE232and the second RFFE234may be implemented into at least part of a single package or a single chip. According to an example embodiment, at least one of the first antenna module242or the second antenna module244may be omitted or may be combined with another antenna module to process RF signals of a corresponding plurality of bands. According to an example embodiment, the third RFIC226and the antenna248may be disposed at the same substrate to form a third antenna module246. For example, the wireless communication module192or the processor120may be disposed at a first substrate (e.g., main PCB). In this case, the third RFIC226is disposed in a partial area (e.g., lower surface) of the first substrate and a separate second substrate (e.g., sub PCB), and the antenna248is disposed in another partial area (e.g., upper surface) thereof; thus, the third antenna module246may be formed. By disposing the third RFIC226and the antenna248in the same substrate, a length of a transmission line therebetween can be reduced. This may reduce, for example, a loss (e.g., attenuation) of a signal of a high frequency band (e.g., about 6 GHz to about 60 GHz) to be used in 5G network communication by a transmission line. Therefore, the electronic device101may improve a quality or speed of communication with the second cellular network294(e.g., 5G network). According to an example embodiment, the antenna248may be formed in an antenna array including a plurality of antenna elements that may be used for beamforming. In this case, the third RFIC226may include a plurality of phase shifters238corresponding to a plurality of antenna elements, for example, as part of the third RFFE236. Upon transmission, each of the plurality of phase shifters238may convert a phase of a 5G Above6 RF signal to be transmitted to the outside (e.g., a base station of a 5G network) of the electronic device101through a corresponding antenna element. Upon reception, each of the plurality of phase shifters238may convert a phase of the 5G Above6 RF signal received from the outside to the same phase or substantially the same phase through a corresponding antenna element. This enables transmission or reception through beamforming between the electronic device101and the outside. The second cellular network294(e.g., 5G network) may operate (e.g., stand-alone (SA)) independently of the first cellular network292(e.g., legacy network) or may be operated (e.g., non-stand alone (NSA)) in connection with the first cellular network292. For example, the 5G network may have only an access network (e.g., 5G radio access network (RAN) or a next generation (NG) RAN and have no core network (e.g., next generation core (NGC)). In this case, after accessing to the access network of the 5G network, the electronic device101may access to an external network (e.g., Internet) under the control of a core network (e.g., an evolved packed core (EPC)) of the legacy network. Protocol information (e.g., LTE protocol information) for communication with a legacy network or protocol information (e.g., new radio (NR) protocol information) for communication with a 5G network may be stored in the memory130to be accessed by other components (e.g., the processor120, the first communication processor212, or the second communication processor214). FIG.3Ais a front perspective view illustrating an example mobile electronic device300according to various embodiments of the disclosure. FIG.3Bis a rear perspective view illustrating an example mobile electronic device300according to various embodiments of the disclosure. Referring toFIGS.3A and3B, the mobile electronic device300(e.g., the electronic device101ofFIG.1) according to various embodiments may include a housing310including a first surface (or front surface)310A, a second surface (or rear surface)310B, and a side surface310C enclosing a space between the first surface310A and the second surface310B. In an example embodiment (not illustrated), the housing may refer to a structure forming some of the first surface310A, the second surface310B, and the side surface310C. According to an example embodiment, the first surface310A may be formed by an at least partially substantially transparent front plate302(e.g., a polymer plate or a glass plate including various coating layers). The second surface310B may be formed by a substantially opaque rear plate311. The rear plate311may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surface310C may be coupled to the front plate302and the rear plate311and be formed by a side bezel structure (or “side member” or “side housing”)318including a metal and/or a polymer. In some embodiments, the rear plate311and the side bezel structure318may be integrally formed and include the same material (e.g., metal material such as aluminum). In the illustrated embodiment, the front plate302may include two first regions310D bent and extending seamlessly from the first surface310A toward the rear plate311at both ends of a long edge of the front plate302. In the illustrated embodiment (seeFIG.3B), the rear plate311may include two second regions310E bent and extending seamlessly from the second surface310B towards the front plate302at both ends of a long edge. In some embodiments, the front plate302(or the rear plate311) may include only one of the first regions310D (or the second regions310E). In an example embodiment, a portion of the first regions310D or the second regions310E may not be included. In the above embodiments, when viewed from the side surface of the mobile electronic device300, the side bezel structure318may have a first thickness (or width) at a side surface in which the first region310D or the second region310E is not included and have a second thickness smaller than the first thickness at a side surface including the first region310D or the second region310E. According to an example embodiment, the mobile electronic device300may include at least one of a display301; audio modules303,307, and314; sensor modules304,316, and319; camera modules305,312, and313; key input device317; light emitting element306; and connector holes308and309. In some embodiments, the mobile electronic device300may omit at least one (e.g., the key input device317or the light emitting element306) of the components or may further include other components. The display301may be exposed through, for example, a substantial portion of the front plate302. In some embodiments, at least part of the display301may be exposed through the front plate302forming the first region310D of the side surface310C and the first surface310A. In some embodiments, an edge of the display301may be formed to be substantially the same as an adjacent outer edge shape of the front plate302. In an example embodiment (not illustrated), in order to enlarge an area where the display301is exposed, a distance between an outer edge of the display301and an outer edge of the front plate302may be formed to be substantially the same. In an embodiment (not illustrated), in a portion of a screen display area of the display301, a recess or an opening may be formed, and at least one of the audio module314and the sensor module304, the camera module305, and the light emitting element306aligned with the recess or the opening may be included. In an example embodiment (not illustrated), at a rear surface of a screen display area of the display301, at least one of the audio module314, the sensor module304, the camera module305, the fingerprint sensor module316, and the light emitting element306may be included. In an example embodiment (not illustrated), the display301may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring intensity (pressure) of the touch, and/or a digitizer for detecting a stylus pen of a magnetic field method. In some embodiments, at least part of the sensor modules304and319and/or at least part of the key input device317may be disposed in a first region310D and/or a second region310E. The audio modules303,307, and314may include a microphone hole303and speaker holes307and314. The microphone hole303may dispose a microphone for obtaining an external sound therein; and, in some embodiments, a plurality of microphones may be disposed to detect a direction of a sound. The speaker holes307and314may include an external speaker hole307and a call receiver hole314. In some embodiments, the speaker holes307and314and the microphone hole303may be implemented into one hole, or the speaker may be included without the speaker holes307and314(e.g., piezo speaker). The sensor modules304,316, and319may generate an electrical signal or a data value corresponding to an operating state inside the mobile electronic device300or an environment state outside the mobile electronic device300. The sensor modules304,316, and319may include, for example, a first sensor module304(e.g., proximity sensor) and/or a second sensor module (not illustrated) (e.g., fingerprint sensor), disposed at the first surface310A of the housing310, and/or a third sensor module319(e.g., a heart rate monitor (HRM) sensor) and/or a fourth sensor module316(e.g., fingerprint sensor), disposed at the second surface310B of the housing310. The fingerprint sensor may be disposed at the second surface310B as well as the first surface310A (e.g., the display301) of the housing310. The mobile electronic device300may further include a sensor module (not illustrated), for example, at least one of a gesture sensor, gyro sensor, air pressure sensor, magnetic sensor, acceleration sensor, grip sensor, color sensor, IR sensor, biometric sensor, temperature sensor, humidity sensor, and illumination sensor304. The camera modules305,312, and313may include a first camera device305disposed at the first surface310A of the mobile electronic device300, a second camera device312disposed at the second surface310B thereof, and/or a flash313. The camera modules305and312may include one or a plurality of lenses, an image sensor, and/or an image signal processor. The flash313may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide angle and telephoto lens) and image sensors may be disposed at one surface of the mobile electronic device300. The key input device317may be disposed at the side surface310C of the housing310. In an example embodiment, the mobile electronic device300may not include some or all of the above-described key input devices317, and the key input device317that is not included may be implemented in other forms such as a soft key on the display301. In some embodiments, the key input device317may include a sensor module316disposed at the second surface310B of the housing310. The light emitting element306may be disposed at, for example, the first surface310A of the housing310. The light emitting element306may provide, for example, status information of the mobile electronic device300in an optical form. In an example embodiment, the light emitting element306may provide, for example, a light source interworking with an operation of the camera module305. The light emitting element306may include, for example, a light emitting diode (LED), an IR LED, and a xenon lamp. The connector ports308and309may include a first connector port308that may receive a connector (e.g., a USB connector) for transmitting and receiving power and/or data to and from an external electronic device and/or a second connector hole (e.g., earphone jack)309that can receive a connector for transmitting and receiving audio signals to and from an external electronic device. FIG.3Cis an exploded perspective view illustrating an example mobile electronic device according to various embodiments of the disclosure. Referring toFIG.3C, the mobile electronic device320(e.g., the mobile electronic device300ofFIG.3A) may include a side bezel structure321, first support member3211(e.g., bracket), front plate322, display323, printed circuit board324, battery325, second support member326(e.g., rear case), antenna327, and rear plate328. In some embodiments, the electronic device320may omit at least one (e.g., the first support member3211or the second support member326) of the components or may further include other components. At least one of the components of the electronic device320may be the same as or similar to at least one of the components of the mobile electronic device300ofFIG.3A or3Band a duplicated description may not be repeated below. The first support member3211may be disposed inside the electronic device320to be connected to the side bezel structure321or may be integrally formed with the side bezel structure321. The first support member3211may be made of, for example, a metal material and/or a non-metal (e.g., polymer) material. In the first support member3211, the display323may be coupled to one surface thereof, and the printed circuit board324may be coupled to the other surface thereof. In the printed circuit board324, a processor, a memory, and/or an interface may be mounted. The processor may include, for example, one or more of a central processing unit, application processor, graphic processing unit, image signal processor, sensor hub processor, or communication processor. The memory may include, for example, a volatile memory or a nonvolatile memory. The interface may include, for example, a HDMI, USB interface, SD card interface, and/or audio interface. The interface may, for example, electrically or physically connect the electronic device320to an external electronic device and include a USB connector, an SD card/multimedia card (MMC) connector, or an audio connector. The battery325is a device for supplying power to at least one component of the electronic device320and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least part of the battery325may be disposed, for example, on substantially the same plane as that of the printed circuit board324. The battery325may be integrally disposed inside the electronic device320or may be detachably disposed in the electronic device320. The antenna327may be disposed between the rear plate328and the battery325. The antenna327may include, for example, a near field communication (NFC) antenna, wireless charging antenna, and/or magnetic secure transmission (MST) antenna. The antenna327may perform, for example, short range communication with an external device or may wirelessly transmit and receive power required for charging. In an example embodiment, an antenna structure may be formed by some or a combination of the side bezel structure321and/or the first support member3211. FIG.4Ais diagram illustrating an example structure of a third antenna module described with reference toFIG.2according to various embodiments of the disclosure. FIG.4A(a) is a perspective view illustrating the third antenna module246viewed from one side, andFIG.4A(b) is a perspective view illustrating the third antenna module246viewed from the other side.FIG.4A(c) is a cross-sectional view illustrating the third antenna module246taken along line X-X′ ofFIG.4A. With reference toFIG.4A, in an example embodiment, the third antenna module246may include a printed circuit board410, an antenna array430, a RFIC452, and a PMIC454. The third antenna module246may further include a shield member (e.g., a shield can)490. In other embodiments, at least one of the above-described components may be omitted or at least two of the components may be integrally formed. The printed circuit board410may include a plurality of conductive layers and a plurality of non-conductive layers stacked alternately with the conductive layers. The printed circuit board410may provide electrical connections between the printed circuit board410and/or various electronic components disposed outside using wirings and conductive vias formed in the conductive layer. The antenna array430(e.g.,248ofFIG.2) may include a plurality of antenna elements (e.g., at least one antenna)432,434,436, or438disposed to form a directional beam. As illustrated, the antenna elements432,434,436, or438may be formed at a first surface of the printed circuit board410. According to another embodiment, the antenna array430may be formed inside the printed circuit board410. According to the embodiment, the antenna array430may include the same or a different shape or kind of a plurality of antenna arrays (e.g., dipole antenna array and/or patch antenna array). The RFIC452(e.g., the third RFIC226ofFIG.2) may be disposed at another area (e.g., a second surface opposite to the first surface) of the printed circuit board410spaced apart from the antenna array. The RFIC452is configured to process signals of a selected frequency band transmitted/received through the antenna array430. According to an example embodiment, upon transmission, the RFIC452may convert a baseband signal obtained from a communication processor (not shown) to an RF signal of a designated band. Upon reception, the RFIC452may convert an RF signal received through the antenna array430to a baseband signal and transfer the baseband signal to the communication processor. According to another embodiment, upon transmission, the RFIC452may up-convert an IF signal (e.g., about 9 GHz to about 11 GHz) obtained from an intermediate frequency integrate circuit (IFIC) (e.g.,228ofFIG.2) to an RF signal of a selected band. Upon reception, the RFIC452may down-convert the RF signal obtained through the antenna array430, convert the RF signal to an IF signal, and transfer the IF signal to the IFIC. The PMIC454may be disposed in another partial area (e.g., the second surface) of the printed circuit board410spaced apart from the antenna array430. The PMIC454may receive a voltage from a main PCB (not illustrated) to provide power necessary for various components (e.g., the RFIC452) on the antenna module. The shielding member490may be disposed at a portion (e.g., the second surface) of the printed circuit board410to electromagnetically shield at least one of the RFIC452or the PMIC454. According to an example embodiment, the shield member490may include, for example, and without limitation, a shield can. Although not shown, in various embodiments, the third antenna module246may be electrically connected to another printed circuit board (e.g., main circuit board) through a module interface. The module interface may include a connecting member, for example, a coaxial cable connector, board to board connector, interposer, or flexible printed circuit board (FPCB). The RFIC452and/or the PMIC454of the antenna module may be electrically connected to the printed circuit board through the connection member. FIG.4Bis a cross-sectional view illustrating the example third antenna module246taken along line Y-Y′ ofFIG.4A(a) according to various embodiments of the disclosure. The printed circuit board410of the illustrated embodiment may include an antenna layer411and a network layer413. With reference toFIG.4B, the antenna layer411may include at least one dielectric layer437-1, and an antenna element436and/or a power feeding portion425formed on or inside an outer surface of a dielectric layer. The power feeding portion425may include a power feeding point427and/or a power feeding line429. The network layer413may include at least one dielectric layer437-2, at least one ground layer433, at least one conductive via435, a transmission line423, and/or a power feeding line429formed on or inside an outer surface of the dielectric layer. Further, in the illustrated embodiment, the RFIC452(e.g., the third RFIC226ofFIG.2) ofFIG.4A(c) may be electrically connected to the network layer413through, for example, first and second solder bumps440-1and440-2. In other embodiments, various connection structures (e.g., solder or ball grid array (BGA)) instead of the solder bumps may be used. The RFIC452may be electrically connected to the antenna element436through the first solder bump440-1, the transmission line423, and the power feeding portion425. The RFIC452may also be electrically connected to the ground layer433through the second solder bump440-2and the conductive via435. Although not illustrated, the RFIC452may also be electrically connected to the above-described module interface through the power feeding line429. FIG.5is a sectional view illustrating various parts of an example electronic device500according to various embodiments of the disclosure. The electronic device500ofFIG.5is at least partially similar to the electronic device101ofFIG.1or the electronic device300ofFIG.3Aor may include other embodiments of the electronic device. Referring toFIG.5, the electronic device500may include a housing510, including a first plate511facing a first direction (e.g., direction {circle around (1)}) (e.g., the z direction ofFIG.3A), a second plate512facing a second direction (e.g., direction {circle around (2)}) (e.g., the −z direction ofFIG.3A) opposite the first plate511, and a side member (e.g., a side housing or bezel)513surrounding the space514between the first plate511and the second plate512. According to an example embodiment, the first plate511may include a planar part5111and a curved part5112bent from the planar part5111and extending up to the side member513. Although not illustrated, the second plate512may include a planar part and a curved part bent from the planar part and extending up to the side member513. According to an example embodiment, the electronic device500may include a display530positioned in the internal space514. According to an example embodiment, the display530may include a touch screen display. According to an example embodiment, the display530may be positioned so that it is seen from the outside through at least some area of the first plate511. According to an example embodiment, the display530may include a conductive plate531positioned for the purpose of noise shielding and insulation. According to an example embodiment, the conductive plate530may include a Cu sheet having an attachable film form. According to an example embodiment, when the first plate511is viewed from above, the edge532of the display530may have a gap “g” from the first portion520of the side member513. According to an example embodiment, the gap “g” may be covered by the peripheral portion540of the first plate511. According to an example embodiment, the peripheral portion540of the first plate511may include the curved part5112or may include a part of the planar part5111and the curved part5112together. According to various embodiments, the side member513may include an external metal part521at least formed in the first portion520and an internal polymer part522(e.g., a non-conductive part or a non-conductive area) extending from the external metal part521. According to an example embodiment, the external metal part521and the internal polymer part522may be integrated as a part of the side member513made of a conductive material through, for example, dual injection or insert injection. According to an example embodiment, the external metal part521may include a first face5211facing the outside of the electronic device500and a second face5212facing the internal space514of the electronic device500. According to an example embodiment, the internal polymer part522may include a third face5221contacting the second face5212and a fourth face5222facing the internal space514. According to various embodiments, the electronic device500may include an antenna module550positioned in the internal space514. According to an example embodiment, the antenna module550may include an antenna structure551positioned in the internal space514of the electronic device500. According to an example embodiment, the antenna structure551may include a substrate552, a printed circuit board (PCB)554spaced apart from the substrate552, and a conductive cable555(e.g., a flexible printed circuit board (FPCB)) positioned to electrically connect the substrate552and the PCB554. According to an example embodiment, the PCB554may include a plurality of conductive patches (e.g., conductive patches5542,5542-1, and5542-2ofFIG.6) to be described in greater detail below. According to an example embodiment, the PCB554may include a wireless communication circuitry5541positioned on at least one surface thereof. According to an example embodiment, the wireless communication circuitry5541may be configured to transmit and/or receive a radio frequency of about a 3 GHz˜100 GHz range through the antenna structure551. According to various embodiments, the antenna module550may be supported through a support member560positioned in the internal space514of the electronic device500. According to an example embodiment, the support member560may be made of a dielectric material (e.g., PC) and may be formed in various manners depending on an arrangement structure of the antenna structure551. According to an example embodiment, the antenna structure551may help the improvement of radiation performance by providing a separation distance from a conductive electronic part570(e.g., a speaker device or the microphone device), positioned on the periphery, through the dielectric. According to an example embodiment, the support member560may include a first support561supporting the substrate552and a second support562supporting the PCB554. According to an example embodiment, the first support561and the second support562may be integrated. The first support561may be formed in a shape to determine an angle θ between the substrate552and the display530. According to various embodiments, the substrate552may include a fifth face5521facing the side member513and a sixth face5522facing a direction opposite the fifth face5521. According to an example embodiment, the substrate552may be positioned so that the fifth face5521is substantially parallel to the second face5212. According to an example embodiment, the substrate552may be positioned so that the sixth face5522substantially has a given angle θ to the display530. According to an example embodiment, the angle θ may include a right angle. According to an example embodiment, the angle θ may include an acute angle. According to an example embodiment, the substrate552may include a rigid PCB or FPCB. According to an example embodiment, the substrate552may include at least one conductive pattern553positioned in the space between the fifth face5521and the sixth face5522. In another embodiment, the at least one conductive pattern553may be positioned on the fifth face5521and/or the sixth face5522. According to an example embodiment, when the first plate511is viewed from above, the at least one conductive pattern553may be positioned at a location overlapping at least part of the peripheral portion540of the first plate511. According to an example embodiment, when the side member513is viewed from above (e.g., direction {circle around (3)}), the at least one conductive pattern553may be positioned at a location overlapping at least part of the internal polymer part522of the first portion520. According to an example embodiment, if a plurality of conductive patches (e.g., the conductive patches5542,5542-1, and5542-2ofFIG.6) are not included in the PCB554, the antenna structure551may include only the substrate552including the at least one conductive pattern553. According to various embodiments, the wireless communication circuitry5541is electrically connected to the at least one conductive pattern553through the conductive cable555, thus being capable of forming a directivity beam at least partially. According to an example embodiment, the wireless communication circuitry5541may form beam coverage in a direction including the direction (e.g., direction {circle around (1)}) toward which at least the front plate511is directed through the at least one conductive pattern553. FIG.6is a perspective view illustrating the example antenna module550ofFIG.5according to various embodiments of the disclosure. The antenna module550ofFIG.6is at least partially similar to the third antenna module246ofFIG.2or may include other embodiments of the antenna module. Referring toFIG.6, the antenna module550may include the antenna structure551. According to an example embodiment, the antenna structure551may include the substrate552, the PCB554spaced apart from the substrate552, and the conductive cable555(e.g., FPCB) positioned to electrically connect the PCB554and the antenna structure551. According to an example embodiment, the PCB554may include the wireless communication circuitry5541positioned on at least one surface thereof. According to various embodiments, the substrate552may include a plurality of conductive patterns553,553-1, and553-2disposed in the space between the fifth face5521and the sixth face5522. According to an example embodiment, the conductive patterns553,553-1, and553-2may include, for example, dipole antennas disposed symmetrically on the left and right sides of a virtual center line. According to an example embodiment, the substrate552may include pairs of conductive patches556,556-1, and556-2separated and positioned with the conductive patterns553,553-1, and553-2forming pairs interposed therebetween in the space between the fifth face5521and the sixth face5522. According to an example embodiment, each of the pairs of conductive patches556,556-1, and556-2may have one side fed with power and the other side (−) fed with power or electrically connected to the ground, thus being capable of operating as a patch antenna. Accordingly, the plurality of conductive patterns553,553-1, and553-2that form pairs and the plurality of conductive patches556,556-1, and556-2disposed at locations corresponding to the conductive patterns553,553-1, and553-2and forming pairs may form beam patterns in the same direction. According to an example embodiment, an antenna disposed in the substrate552may operate as a dual polarization antenna, including the conductive patterns553,553-1, and553-2forming horizontal polarization and the conductive patches556,556-1, and556-2forming vertical polarization. According to an example embodiment, the wireless communication circuitry5541may be configured to transmit and/or receive a radio frequency of about a 3 GHz˜100 GHz range through the conductive patterns553,553-1, and553-2and/or the conductive patches556,556-1, and556-2. According to various embodiments, the PCB554may include a first face554aand a second face554bfacing a direction opposite the first face554a. According to an example embodiment, the wireless communication circuitry5541may be positioned in the second face554b. According to an example embodiment, the PCB554may include a plurality of conductive patches5542,5542-1, and5542-2disposed in the first face554a. According to an example embodiment, the wireless communication circuitry5541may be configured to transmit and/or receive a radio frequency of about a 3 GHz˜100 GHz range through the conductive patch5542. According to various embodiments, the antenna module550electrically connects the substrate552and the PCB554through the conductive cable555having flexibility, and thus the degree of freedom of mounting can be secured. According to an example embodiment, the antenna module550may be positioned so that the directions of beam patterns formed by the conductive patches5542,5542-1, and5542-3of the PCB554and the conductive patterns553,553-1, and553-2of the substrate552through the conductive cable555are different. According to an example embodiment, the PCB554may be positioned so that a beam pattern is formed in a direction (e.g., the direction {circle around (2)} ofFIG.5) toward which the rear plate (e.g., the second plate512ofFIG.5) of the electronic device is directed, for example, in the internal space (e.g., the internal space514ofFIG.5) of an electronic device (e.g., the electronic device500ofFIG.5). According to an example embodiment, the substrate552may be positioned so that a beam pattern is formed in a direction (e.g., the direction {circle around (1)} ofFIG.5) toward which the front plate (e.g., the first plate511ofFIG.5) of an electronic device (e.g., the electronic device500ofFIG.5) is directed, for example, in the internal space (e.g., the internal space514ofFIG.5) of the electronic device. Although not illustrated, in the wireless communication circuitry5541, the conductive patches5542,5542-1, and5542-2, the conductive patterns553,553-1, and553-2forming pairs and/or the conductive patch556,556-1, and556-2forming pairs may be dually fed with power. According to various embodiments, the conductive patterns553,553-1, and553-2forming pairs, the conductive patches556,556-1, and556-2forming pairs, and the conductive patches5542,5542-1, and5542-2may be 2 or 4 or more in number. FIG.7is a perspective view illustrating an example antenna module700according to various embodiments of the disclosure. The antenna module700ofFIG.7is at least partially similar to the third antenna module246ofFIG.2or may include other embodiments of the antenna module. Referring toFIG.7, the antenna module700may include a substrate710, including a first face7101and a second face7102facing a direction opposite the first face7101. According to an example embodiment, the antenna module700may include at least one of conductive patterns720,720-1, and720-2(e.g., the conductive patterns553,553-1, and553-2ofFIG.6) disposed in the space between the first face7101and the second face7102and conductive patches730,730-1, and730-2forming pairs (e.g., the conductive patches556,556-1, and556-2forming pairs inFIG.6) disposed with the conductive patterns720,720-1, and720-2forming pairs interposed therebetween in at least part of the edge area of the substrate710. For another example, the antenna module700may include conductive patches740,740-1, and740-2disposed inside or within the first face7101of the substrate710. According to an example embodiment, the antenna module700may include a wireless communication circuitry750positioned in the second face7102of the substrate710. According to an example embodiment, the wireless communication circuitry750may be configured to transmit and/or receive a radio frequency of about a 3 GHz˜100 GHz range through the conductive patterns720,720-1, and720-2forming pairs, the conductive patches730,730-1, and730-2forming pairs and/or the conductive patches740,740-1, and740-2. According to various embodiments, unlike in the case ofFIG.6, the conductive patches740,740-1, and740-2of the antenna module700may be disposed in a single substrate710along with the conductive patterns720,720-1, and720-2without a separate conductive cable. The antenna module700may be substituted with the antenna module550positioned in the internal space of the electronic device500ofFIG.5. According to various embodiments, the conductive patterns720,720-1, and720-2forming pairs, the conductive patches730,730-1, and730-2forming pairs, and the conductive patches740,740-1, and740-2may be 2 or 4 or more in number. FIG.8is a diagram illustrating an example arrangement relation of an antenna structure in the electronic device500according to various embodiments of the disclosure. Referring toFIG.8, when the side member513is viewed from above, the electronic device500may include an overlap area A3in which at least part of an arrangement area A1having an internal polymer part (e.g., the internal polymer part522ofFIG.5) positioned therein overlaps at least part of an arrangement area A2having a substrate (e.g., the substrate552ofFIG.5) positioned therein. According to an example embodiment, when the side member513is viewed from above, a substrate (e.g., the substrate552ofFIG.5) may be positioned so that at least one conductive pattern (e.g., the conductive pattern553ofFIG.5) is included in the overlap area A3. Accordingly, the substrate (e.g., the substrate552ofFIG.5) is positioned so that a separation distance from the external metal part521of the side member513is increased by the internal polymer part (e.g., the internal polymer part522ofFIG.5). Accordingly, a beam pattern can be formed in a direction (e.g., the direction {circle around (1)} ofFIG.5) toward which the front plate511is directed through the first peripheral portion540. FIG.9is a sectional view illustrating an example electronic device900according to various embodiments of the disclosure. The electronic device900ofFIG.9is at least partially similar to the electronic device101ofFIG.1, the electronic device300ofFIG.3Aor the electronic device500ofFIG.5or may include other embodiments of the electronic device. Referring toFIG.9, the electronic device900may include a housing910, including a first plate911facing a first direction (e.g., direction {circle around (1)}), a second plate912facing a second direction (e.g., direction {circle around (2)}) opposite the first plate911, and a side member913surrounding a space914between the first plate911and the second plate912. According to an example embodiment, the electronic device900may include a display930positioned in the internal space914. According to an example embodiment, the display930may include a conductive plate931positioned for the purpose of noise shielding and insulation. According to an example embodiment, the electronic device900may include at least one electronic part970positioned in the internal space914. According to various embodiments, the electronic device900may include an antenna module950positioned in the internal space914. According to an example embodiment, the antenna module950may include an antenna structure951positioned in the internal space914. According to an example embodiment, the antenna structure951may include a substrate952, a PCB954spaced apart from the substrate952, and a conductive cable955electrically connecting the substrate952and the PCB954. According to an example embodiment, the side member913may include an external metal part921and an internal polymer part922extending from the external metal part921. According to an embodiment of the disclosure, the arrangement relation of the substrate952for the internal polymer part922is substantially the same as the arrangement relation ofFIG.5, and thus a detailed description thereof will not be repeated here. According to various embodiments, the antenna module950may have varying performance when the thickness “t” of the internal polymer part922is changed in a direction parallel to the first plate911in the state in which a distance “d” between the at least one conductive pattern953of the substrate952and the internal polymer part922has been determined. FIG.10is a diagram illustrating an example radiation pattern of the antenna module900according to a change in the thickness “t” of the polymer member922in the electronic device ofFIG.9according to various embodiments of the disclosure. As illustrated inFIG.10, beam coverage performance of the antenna module900in a front plate direction (e.g., direction {circle around (1)}) becomes excellent as the thickness of the internal polymer part922is thicker. FIG.11is a perspective view illustrating an example arrangement relation of an antenna structure1131in an electronic device1100according to various embodiments of the disclosure. The electronic device1100ofFIG.11is at least partially similar to the electronic device101ofFIG.1or the electronic device300ofFIG.3Aor may include other embodiments of the electronic device. Referring toFIG.11, the electronic device1100may include a first plate1110and a display1120including a conductive plate1121positioned in the first plate1110. According to an example embodiment, the electronic device1100may include an antenna module1130positioned in an internal space1101. According to an example embodiment, the antenna module1130may include the antenna structure1131. According to an example embodiment, the antenna structure1131may include a substrate1132positioned on the periphery of the display1120and a PCB1133spaced apart from the substrate1132at a given interval and electrically connected thereto by a conductive cable1134. According to an example embodiment, the PCB1133may include a wireless communication circuitry1135. According to an example embodiment, the location of the antenna module1130may be fixed through a support member1150made of a dielectric material and positioned in the internal space1101of the electronic device1100. The support member1150may include a first support1152and/or a second support1151. According to an example embodiment, the substrate1132may be positioned to have a given angle θ to the display1120through the structural shape of the first support1152. According to an example embodiment, the PCB1133may be positioned to face the first plate1110through the structural shape of the second support1151of the support member1150. According to an example embodiment, a beam pattern can be formed around the display1120through the first plate1110because the substrate1132is positioned to have an acute angle to the first plate1110. FIG.12is a sectional view illustrating an example electronic device1200according to various embodiments of the disclosure. The electronic device1200ofFIG.12is at least partially similar to the electronic device101ofFIG.1, the electronic device300ofFIG.3Aor the electronic device1100ofFIG.11or may include other embodiments of the electronic device. Referring toFIG.12, the electronic device1200may include a housing1210, including a first plate1211facing a first direction (e.g., direction {circle around (1)}), a second plate1212facing a second direction (e.g., direction {circle around (2)}) opposite the first plate1211, and a side member1213surrounding a space1214between the first plate1211and the second plate1212. According to an example embodiment, the first plate1211may include a planar part1211aand a curved part1211bextending from the planar part1211ato the side member1213. According to an example embodiment, the electronic device1200may include a display1230positioned in an internal space1214. According to an example embodiment, the display1230may be positioned so that it can be seen from the outside through at least some area of the first plate1211. According to an example embodiment, the display1230may include a conductive plate1231positioned for the purpose of noise shielding and insulation. According to an example embodiment, the electronic device1210may include at least one electronic part1250positioned in the internal space1214. According to various embodiments, the electronic device1200may include an antenna module1240positioned in the internal space1214. According to an example embodiment, the antenna module1240may include an antenna structure1241positioned in the internal space1214of the electronic device1200. According to an example embodiment, the antenna structure1241may include a substrate1242, a PCB1244spaced apart from the substrate1242at a given interval, and a conductive cable1246electrically connecting the substrate1242and the PCB1244. According to an example embodiment, the substrate1242may be positioned slantly at a given angle θ to the first plate1211. According to an example embodiment, a part1220that belongs to the side member1213and that comes in contact with the first plate1211may be omitted by a given height “h” in a direction (e.g., direction {circle around (2)}) toward which the second plate1212is directed. In such a case, the curved part1211bof the first plate1211may be extended up to the side member1213in such a way to cover the omitted part1220. In this case, there may be an effect in that the arrangement area of the display1230of the electronic device1200is extended. According to various embodiments, the antenna module1240may have varying beam coverage when the height “h” of the part1220omitted in the direction (e.g., direction {circle around (2)}) toward which the second plate1212is directed is changed in the state in which the distance between at least one conductive pattern1243of the substrate1242and the side member1213has been determined. FIG.13is a diagram illustrating an example radiation pattern of the antenna module1240according to the omission area1220of the side member1213in the electronic device1200ofFIG.12according to various embodiments of the disclosure. As illustrated inFIG.13, beam coverage performance of the antenna module1240in the direction (e.g., direction {circle around (1)}) toward which the front plate1211is directed becomes excellent as the height “h” of the omission part1220of the side member1213increases. FIG.14Ais a perspective view illustrating various parts of an example electronic device1400according to various embodiments of the disclosure.FIG.14Bis a sectional diagram illustrating an arrangement relation between an antenna structure1450and display1430ofFIG.14Aaccording to various embodiments of the disclosure. The electronic device1400ofFIG.14Ais at least partially similar to the electronic device101ofFIG.1, the electronic device300ofFIG.3A, the electronic device500ofFIG.5or the electronic device900ofFIG.9or may include other embodiments of the electronic device. According to an example embodiment, according to the demands for a larger screen of the display1430positioned through the front plate1411(e.g., the first plate) of the electronic device1400, the distance between the display1430and a side member1413is gradually narrowed. Accordingly, the arrangement location of the substrate1451of the antenna structure1450may be gradually narrowed. According to an embodiment of the disclosure, although the arrangement area of the display1430is extended in the internal space1414of the electronic device1400, the mounting space of the substrate1451can be secured. Referring toFIGS.14A and14B, the electronic device1400may include a housing1410, including the first plate1411and the side member1413in which the first plate1411is positioned. According to an example embodiment, the side member1413may include an external metal part1420and an internal polymer part1421. According to an example embodiment, the electronic device1400may include the display1430including a conductive plate1431positioned in the first plate1411in the internal space1414. According to an example embodiment, the electronic device1400may include the antenna structure1450including at least one conductive pattern1452positioned in the internal space1414and formed through the substrate1451. According to an example embodiment, the substrate1451may be positioned to be supported through a support member1460that is positioned to avoid a surrounding conductive electronic part1470. According to an example embodiment, the substrate1451may be positioned so that the at least one conductive pattern1452overlaps at least some area of the internal polymer part1421when the side member1413is viewed from above (e.g., direction {circle around (3)}). According to various embodiments, the display1430may include a cutting part1432from which at least part of an area (e.g., an area B ofFIG.14B) overlapping the at least one conductive pattern1452is omitted when the first plate1411is viewed from above. According to an example embodiment, the cutting part1432may be formed so that at least one of the conductive plate1431of the display1430and/or a display panel (not shown) is cut. According to an example embodiment, the cutting part1432may be included in the black matrix (BM) area of the display1430. Accordingly, the at least one conductive pattern1452of the substrate1451may form a beam pattern in a direction (e.g., direction {circle around (1)}) toward which the first plate1411of the electronic device1400is directed through the cutting part1432of the display1430. FIG.15Ais a perspective view illustrating an example first antenna module1500according to various embodiments of the disclosure.FIG.15Bis a perspective view illustrating an example second antenna module1530according to various embodiments of the disclosure. The first antenna module1500ofFIG.15Ais at least partially similar to the third antenna module246ofFIG.2or may include other embodiments of the antenna module. The second antenna module1530ofFIG.15Bis at least partially similar to the third antenna module246ofFIG.2or may include other embodiments of the antenna module. Referring toFIG.15A, the first antenna module1500may include an antenna structure1501. According to an example embodiment, the antenna structure1501may include a substrate1510, a PCB1520spaced apart from the substrate1510, and a conductive cable1531(e.g., FPCB) positioned to electrically connect the PCB1520and the substrate1510. According to various embodiments, the substrate1510may include a ground area G electrically connected thereto through the conductive cable and a peel-cut area F (e.g., non-conductive area) neighboring the ground area. According to an example embodiment, the substrate1510may include a first antenna array AR1in which a plurality of antenna elements R1, R2, R3, and R4is disposed at given intervals through the peel-cut area F. According to an example embodiment, the first antenna array AR1may include a first antenna element R1, a second antenna element R2, a third antenna element R3and/or a fourth antenna element R4. According to an example embodiment, the first antenna element R1may include a first conductive pattern1511. The second antenna element R2may include a second conductive pattern1512. The third antenna element R3may include a third conductive pattern1513. The fourth antenna element R4may include a fourth conductive pattern1514. According to an example embodiment, the first conductive pattern1511, the second conductive pattern1512, the third conductive pattern1513and the fourth conductive pattern1514may include a dipole radiator. According to an example embodiment, each of the first conductive pattern1511, the second conductive pattern1512, the third conductive pattern1513and the fourth conductive pattern1514may be at least partially similar to a pair of conductive patterns ofFIG.6(e.g., the conductive pattern553ofFIG.6). According to an example embodiment, although not illustrated, the first antenna array AR1may further include a pair of conductive patches illustrated inFIG.6(e.g., the pair of conductive patches556ofFIG.6). According to an example embodiment, the substrate1510may include the first antenna array AR1in which the antenna elements R1, R2, R3, and R4having a 1×4 array structure are disposed. In another embodiment, the substrate1510may include antenna arrays in which various numbers of antenna elements are disposed in various forms. According to various embodiments, the PCB1520may include a first face1525and a second face1526facing a direction opposite the first face1525. According to an example embodiment, the PCB1520may include a second antenna array AR2in which a plurality of antenna elements R5, R6, R7, and R8is disposed at given intervals on or within the first face1525. According to an example embodiment, the second antenna array AR2may include a fifth antenna element R5, a sixth antenna element R6, a seventh antenna element R7and/or an eighth antenna element R8. According to an example embodiment, the fifth antenna element R5may include a first conductive patch1521. The sixth antenna element R6may include a second conductive patch1522. The seventh antenna element R7may include a third conductive patch1523. The eighth antenna element R8may include a fourth conductive patch1524. According to an example embodiment, the first conductive patch1521, the second conductive patch1522, the third conductive patch1523and the fourth conductive patch1524may be at least partially similar to a conductive patch ofFIG.7(e.g., the conductive patch740ofFIG.7). According to an example embodiment, the PCB1520may include the second antenna array AR2in which the antenna elements R5, R6, R7, and R8having a 1×4 array structure are disposed. In another embodiment, the PCB1520may include antenna arrays in which various numbers of antenna elements are disposed in various forms. In another embodiment, the number of antenna elements of the first antenna array AR1positioned in the substrate1510and the number of antenna elements of second antenna array AR2positioned in the PCB1520may be different. According to various embodiments, the antenna module1500may include a wireless communication circuitry1527positioned in the second face1526of the PCB1520. According to an example embodiment, the wireless communication circuitry1527may be electrically connected to the substrate1510by the conductive cable1531. According to an example embodiment, the wireless communication circuitry1527may be configured to transmit and/or receive a radio frequency of about a 3 GHz˜100 GHz range through the first antenna array AR1and/or the second antenna array AR2. Referring toFIG.15B, unlike in the first antenna module1500, in the second antenna module1530, the first antenna array AR1and the second antenna array AR2may be positioned together on or within the first face1525of the PCB1520. FIG.16is a diagram illustrating an arrangement relation in which the antenna modules1500and1530ofFIGS.15A and15Bare positioned in an electronic device1600according to various embodiments of the disclosure. Referring toFIG.16, the electronic device1600may include a side member1610. According to an example embodiment, the side member1610may include a first side1611having a first length, a second side1612extending in a vertical direction from the first side1611and having a second length shorter than the first length, a third side1613extending in a direction parallel to the first side1611from the second side1612and having the first length, and a fourth side1614extending in a direction parallel to the second side1612from the third side1613and having the second length. According to an example embodiment, the electronic device1600may include a device substrate1620positioned in an internal space1601in such a way as to avoid the battery1640and to overlap the battery1640at least partially. According to an example embodiment, the first antenna module1500ofFIG.15Aand the second antenna modules1530ofFIG.15Bmay be positioned in various directions in the internal space1601, and may be electrically connected to the device substrate1620. According to various embodiments, the first antenna module1500may be positioned near the second side1612. According to an example embodiment, a plurality of the second antenna modules1530may be disposed. For example, the second antenna modules1530may be disposed near the first side1611, near the third side1613and/or the fourth side1614. According to an example embodiment, the first antenna array AR1of the second antenna module1530positioned near the first side1611may form a beam pattern in a direction (e.g., direction {circle around (4)}) toward which the first side1611is directed through a first non-conductive area1611apartially formed in the first side1611. The second antenna array AR2of the second antenna module1530positioned near the first side1611may form a beam pattern in a direction (e.g., the −z direction ofFIG.3B) toward which the rear plate of the electronic device1600(e.g., the rear plate311ofFIG.3B) is directed. According to an example embodiment, the first antenna array AR1of the second antenna module1530positioned near the third side1613may form a beam pattern in a direction (e.g., direction {circle around (5)}) toward which the third side1613is directed through a second non-conductive area1613apartially formed in the third side1613. The second antenna array AR2of the second antenna module1530positioned near the third side1613may form a beam pattern in a direction (e.g., the −z direction ofFIG.3B) toward which the rear plate of the electronic device1600(e.g., the rear plate311ofFIG.3B) is directed. According to an example embodiment, the first antenna array AR1of the second antenna module1530positioned near the fourth side1614may form a beam pattern in a direction (e.g., direction {circle around (6)}) toward which the fourth side1614is directed through a third non-conductive area1614apartially formed in the fourth side1614. The second antenna array AR2of the second antenna module1530positioned near the fourth side1614may form a beam pattern in a direction (e.g., the −z direction ofFIG.3B) toward which the rear plate (e.g., the rear plate311ofFIG.3B) of the electronic device1600is directed. According to various embodiments, unlike in the second antenna module1530, the first antenna array AR1of the first antenna module1500positioned near the second side1612may form a beam pattern in a direction (e.g., the z direction ofFIG.3A) toward which the front plate (e.g., the front plate302ofFIG.3A) of an electronic device (e.g., the electronic device300ofFIG.3A) is directed. The second antenna array AR2of the first antenna module1500positioned near the second side1612may form a beam pattern in a direction (e.g., the −z direction ofFIG.3B) toward which the rear plate (e.g., the rear plate311ofFIG.3B) of the electronic device1600is directed. In such a case, the first antenna array AR1is positioned at least partially similar to the arrangement structure of the substrate ofFIG.5(e.g., the substrate552ofFIG.5). Accordingly, beam coverage in the direction (e.g., the z direction ofFIG.3A) toward which the front plate is directed can be secured. FIG.17is a graph illustrating an example cumulative distribution function (CDF) according to an arrangement relation between antenna modules disposed in an electronic device according to various embodiments of the disclosure. FIG.17is a graph illustrating a comparison between the CDF of an antenna module having a horizontal arrangement structure (e.g., the arrangement structure of the second antenna module1530ofFIG.16) and the CDF of an antenna module having a horizontal+vertical arrangement structure (e.g., the arrangement structure of the first antenna module1500ofFIG.16). The antenna module having the horizontal+vertical arrangement structure may form beam coverage in a section having a relatively high gain, compared to the antenna module having the horizontal arrangement structure. For example, in a CDF 20% section, the antenna module having the horizontal arrangement structure is covered in about 1.6 dBi or less, whereas the antenna module having the horizontal+vertical arrangement structure may be covered in relatively high 3.8 dBi or less. This may mean that the antenna module having the horizontal+vertical arrangement structure form a relatively uniform beam pattern. FIG.18Ais a diagram illustrating an example comparison between pieces of beam coverage according to an arrangement relation between antenna modules disposed in an electronic device (e.g., the electronic device1600ofFIG.16) according to various embodiments of the disclosure.FIG.18Bis a diagram illustrating an example comparison between pieces of beam coverage according to an arrangement relation between antenna modules disposed in an electronic device (e.g., the electronic device1600ofFIG.16) according to various embodiments of the disclosure. It can be seen that beam coverage in the front plate area FR2 ofFIG.18Bis better than that in the front plate area FR1 ofFIG.18Aif an antenna module (e.g., the second antenna module1530ofFIG.15B) having a horizontal arrangement structure and an antenna module (e.g., the first antenna module1500ofFIG.15A) having a horizontal+vertical arrangement structure are positioned at the same location (e.g., near the second side1612ofFIG.16). FIG.19is a sectional view illustrating various parts of the example electronic device1600ofFIG.16according to various embodiments of the disclosure. The electronic device1600ofFIG.19is at least partially similar to the electronic device101ofFIG.1or the electronic device300ofFIG.3Aor may include other embodiments of the electronic device. FIG.19is a sectional view of the second antenna module1530positioned near the second side1612ofFIG.16. The electronic device1600may include a housing1610′, including a first plate1611, a second plate (e.g., the second plate311ofFIG.3B) facing a direction opposite the first plate1611, and a side member1610surrounding a space1601between the first plate1611and the second plate. According to an example embodiment, the electronic device1600may include the device substrate1620positioned in the internal space1601and the second antenna module1530positioned through a dielectric structure1650having a given shape. According to an example embodiment, the separation distance between the second antenna module1530and the side member1610made of a conductive material increases as the depth d2of a polymer member1615is increased in a side member direction in the state in which a distance d1between the first antenna array AR1and the side member1610has been determined. Accordingly, matching can be improved, and thus a gain in the direction of the first plate1611can be improved. FIG.20is a diagram illustrating an example side member1213in which a non-conductive area1213bis formed in the electronic device1200ofFIG.12according to various embodiments of the disclosure. Referring toFIG.20, the electronic device1200may include an external metal part1213aand a non-conductive area1213bformed in at least some area of the external metal part1213a. According to an example embodiment, a part1220coming in contact with the first plate1211may be omitted by a given height “h” from the side member1213in a direction (e.g., direction {circle around (2)}) toward which the second plate1212is directed. A part of the upper side of the side member1213is formed to additionally include the non-conductive area1213b. Accordingly, additional beam coverage of the antenna module1240can be extended. In such a case, the non-conductive area1213bmay be filled with the internal polymer part or may be formed of an air area from which a corresponding area has been deleted. FIG.21is a sectional view illustrating various parts of the example electronic device1200according to various embodiments of the disclosure. FIG.21is a diagram illustrating the state in which the conductive cable1246including a conductive pattern arrangement area2101is directly positioned without a substrate in the electronic device1200ofFIG.20. Referring toFIG.21, the electronic device1200may include an external metal part1213aand a non-conductive area1213bformed in at least some area of the external metal part1213a. According to an example embodiment, a part1220coming in contact with the first plate1211may be omitted from the side member1213by a given height “h” in a direction (e.g., direction {circle around (2)}) toward which the second plate1212is directed. A part of the upper side of the side member1213is formed to additionally include the non-conductive area1213b. Accordingly, additional beam coverage of the antenna module1240can be extended. In such a case, the non-conductive area1213bmay be filled with the internal polymer part or may be formed of an air area from which a corresponding area has been deleted. According to various embodiments, the antenna module1240may include the conductive cable1246extending from the PCB1244and positioned at a given angle θ to the first plate1211. According to an example embodiment, the conductive cable1246may include an FPCB. In such a case, the conductive cable1246may be positioned to be supported through at least part of a separate support member (e.g., the support member1150ofFIG.11). According to an example embodiment, the antenna module1240may include the conductive pattern arrangement area2101positioned at the end of the conductive cable1246. According to an example embodiment, when the side member1213is viewed from above, in the conductive pattern arrangement area2101, at least an additional non-conductive area1213band/or the side member1213may be positioned at a location overlapping the part1220coming in contact with the first plate1211. In an electronic device according to various embodiments of the disclosure, beam coverage performance in a given direction (e.g., the front direction of the electronic device) can be improved because at least part of a conductive member (e.g., side member) positioned near a display is omitted and the arrangement structure of an antenna is changed. According to various example embodiments, an electronic device (e.g., the electronic device500ofFIG.5) includes a housing (e.g., the housing510ofFIG.5) including a first glass plate (e.g., the first plate511ofFIG.5) facing a first direction (e.g., the first direction (e.g., direction {circle around (1)}) ofFIG.5)), a second plate (e.g., the second plate512ofFIG.5) facing a second direction (e.g., the second direction (e.g., direction {circle around (2)}) ofFIG.5)) opposite the first direction, and a side housing (e.g., the side member513ofFIG.5) surrounding a space (e.g., the space514ofFIG.5) between the first glass plate and the second plate, wherein the side housing includes a first portion, including an external metal part (e.g., the external metal part521ofFIG.5) having a first face (e.g., the first face5211ofFIG.5) facing an outside and a second face (e.g., the first face5212ofFIG.5) facing the space and an internal polymer part (e.g., the internal polymer part522ofFIG.5) having a third face (e.g., the third face5221ofFIG.5) contacting the second face and a fourth face (e.g., the fourth face5222ofFIG.5) facing the space; a touch screen display (e.g., the display530ofFIG.5) positioned within the space to be seen through the first glass plate, wherein an edge (e.g., the edge532ofFIG.5) of the touch screen display is spaced apart from (e.g., the gap “g” ofFIG.5) from the first portion of the side member and when the first glass plate is viewed from above, the gap is covered by a peripheral portion (e.g., the peripheral portion540ofFIG.5) of the first glass plate; an antenna structure comprising at least one antenna and (e.g., the antenna structure551ofFIG.5) including a substrate (e.g., the substrate552ofFIG.5) having a fifth face (e.g., the fifth face5521ofFIG.5) substantially parallel to the second face and a sixth face (e.g., the sixth face5522ofFIG.5) facing a direction opposite the fifth face and at least one conductive pattern (e.g., the conductive pattern553ofFIG.5) positioned between the fifth face and the sixth face extending toward the peripheral portion of the first glass plate; and wireless communication circuitry (e.g., the wireless communication circuitry5541ofFIG.5) operatively connected to the at least one conductive pattern and configured to form a directivity beam using at least some of the at least one conductive pattern. According to various example embodiments, the sixth face may be substantially vertical to the touch screen display. According to various example embodiments, the sixth face may form an acute angle with the touch screen display. According to various example embodiments, the first glass plate (e.g., the first plate511ofFIG.5) may include a planar portion (e.g., the planar part5111ofFIG.5). The peripheral portion of the first glass plate may be bent from the planar portion (e.g., the curved part5112ofFIG.5). According to various example embodiments, the at least one conductive pattern may be positioned at least partially within the gap. According to various example embodiments, at least part of the at least one conductive pattern may be positioned at a location overlapping the internal polymer part when the side member is viewed from above. According to various embodiments, when the first glass plate is viewed from above, the conductive pattern may be positioned at a location overlapping at least some area of the touch screen display. The substrate may form an acute angle along with the touch screen display to be directed toward the gap. According to various example embodiments, the display further may include a cutting portion (e.g., the cutting part1432ofFIG.14A) from which an area overlapping the conductive pattern is omitted when the first glass plate is viewed from above. According to various example embodiments, the cutting portion may be positioned in a black matrix (BM) area of the touch screen display. According to various example embodiments, the electronic device may further include a printed circuit board (PCB) (e.g., the PCB554ofFIG.5) positioned in the space and spaced apart from the substrate and a conductive cable (e.g., the conductive cable555ofFIG.5) configured to electrically connect the PCB and the at least one conductive pattern of the substrate. According to various example embodiments, the wireless communication circuitry may be positioned in the PCB. According to various example embodiments, the electronic device may further include at least one conductive patch (e.g., the conductive patch5542ofFIG.6) positioned on one side of the PCB. The wireless communication circuitry may form a directivity beam having a direction different from the direction of the conductive pattern using the conductive patch. According to various example embodiments, the wireless communication circuitry may be configured to form a directivity beam in a direction which the first glass plate is facing through the conductive pattern and to form a directivity beam in a direction which the second plate is facing through the conductive patch. According to various example embodiments, the wireless communication circuitry may be configured to transmit and/or receive a radio frequency of about a 3 GHz˜100 GHz range through the at least one conductive patch. According to various example embodiments, the electronic device may further include a support member (e.g., the support member560ofFIG.5) positioned to support the PCB and/or the substrate within the space. According to various example embodiments, the support member may include a dielectric material. According to various example embodiments, the electronic device may further include at least one conductive electronic portion (e.g., the electronic part570ofFIG.5) within the space. The support member may be positioned between the conductive electronic part and the PCB and/or the substrate. According to various example embodiments, the support member may include a first support (e.g., the first support561ofFIG.5) configured to support the substrate and a second support (e.g., the second support562ofFIG.5) extending from the first support and configured to support the PCB. An angle (e.g., the angle θ ofFIG.5) between the substrate (e.g., the substrate552ofFIG.5) and the touch screen display (e.g., the display530ofFIG.5) may be determined by a shape of the first support. According to various example embodiments, the substrate (e.g., the substrate552ofFIG.5) may include a flexible printed circuit board (FPCB) positioned to be supported by the first support. According to various example embodiments, the wireless communication circuitry may be configured to transmit and/or receive a radio frequency of about a 3 GHz˜100 GHz range through the at least one conductive pattern. Various example embodiments illustrated and disclosed in this disclosure and drawings are merely examples provided to aid in description of the technological contents according to the embodiments of the disclosure and to aid in understanding of the embodiments of the disclosure, but are not intended to limit the scope of the embodiments of the disclosure. Accordingly, the scope of disclosure should be understood as including all changes or modified forms derived based on the technical spirit of various example embodiments of the disclosure in addition to the disclosed example embodiments. | 95,532 |
11942691 | DESCRIPTION OF EMBODIMENTS In conventional techniques, placing an external device may lead to an increase in antenna size. The present disclosure relates to providing an antenna, an array antenna, a wireless communication module, and a wireless communication device that are novel. Embodiments of the present disclosure will be described below. As illustrated inFIGS.1and2, an antenna10includes a base20, a radiation conductor30, a ground conductor40, a first feeding line51, a second feeding line52a, a connecting conductor60, and a circuit board70. The base20is in contact with the radiation conductor30, the ground conductor40, the first feeding line51, the second feeding line52, and the connecting conductor60. The radiation conductor30, the ground conductor40, the first feeding line51, the second feeding line52, and the connecting conductor60are configured to function as an antenna element11. The antenna10is configured to oscillate at a predetermined resonance frequency and radiate electromagnetic waves. The base20may include any one of a ceramic material and a resin material as its composition. Examples of the ceramic material include, but are not limited to, sintered aluminum oxide, sintered aluminum nitride, sintered mullite, sintered glass ceramics, crystallized glass including a crystalline component deposited in a glass base material, sintered fine crystals such as mica or aluminum titanate, etc. Examples of the resin material include, but are not limited to, those obtained by curing uncured products such as epoxy resins, polyester resins, polyimide resins, polyamide-imide resins, polyetherimide resins, and liquid crystal polymers. The radiation conductor30and the ground conductor40may include any of a metallic material, an alloy of a metallic material, a cured material of metal paste, and a conductive polymer as a composition. The radiation conductor30and the ground conductor40may be made of all the same materials. The radiation conductor30and the ground conductor40may be made of all the different materials. The radiation conductor30and the ground conductor40may include any combination of the same materials. Examples of the metal material include, but are not limited to, copper, silver, palladium, gold, platinum, aluminum, chromium, nickel, cadmium, lead, selenium, manganese, tin, vanadium, lithium, cobalt, titanium, etc. The alloy includes a plurality of metal materials. Examples of the metal paste include, but are not limited to, those obtained by mixing powder of a metal material with an organic solvent and a binder. Examples of the binder include, but are not limited to, epoxy resins, polyester resins, polyimide resins, polyamide-imide resins, polyetherimide resins, etc. Examples of the conductive polymer include, but are not limited to, polythiophene-based polymers, polyacethylene-based polymers, polyaniline-based polymers, polypyrrole-based polymers, etc. The radiation conductor30is configured to function as a resonator. The radiation conductor30may be configured as a patch-type resonator. In an example, the radiation conductor30is positioned on the base20. In an example, the radiation conductor30is positioned at an end of the base20in a z direction. In an example, the radiation conductor30may be positioned in the base20. A part of the radiation conductor30may be positioned inside the base20and another part thereof may be positioned outside the base20. The surface of a part of the radiation conductor30may face the outside of the base20. In an example of a plurality of embodiments, the radiation conductor30extends along a first plane. Ends of the radiation conductor30are along a first direction and a second direction. The first direction and the second direction intersect each other. The first direction may be orthogonal to the second direction. In the present disclosure, the first direction (first axis) is denoted as an x direction. In the present disclosure, the second direction (second axis) is denoted as a y direction. In the present disclosure, a third direction (third axis) is denoted as the z direction. In the present disclosure, the first plane is denoted as an xy plane. In the present disclosure, a second plane is denoted as a yz plane. In the present disclosure, a third plane is denoted as a zx plane. These planes are planes in a coordinate space, and are not intended to indicate a particular plate or a particular surface. In the present disclosure, a surface integral in the xy plane may be referred to as first surface integral. In the present disclosure, a surface integral in the yz plane may be referred to as second surface integral. In the present disclosure, a surface integral in the zx plane may be referred to as third surface integral. The surface integral is represented by a unit such as square meter. In the present disclosure, a length in the x direction may be simply referred to as “length”. In the present disclosure, a length in the y direction may be simply referred to as “width”. In the present disclosure, a length in the z direction may be simply referred to as “height”. In an example of a plurality of embodiments, the ground conductor40may be configured to function as the ground of the antenna element11. In an example of a plurality of embodiments, the ground conductor40extends along the first plane. The ground conductor40faces the radiation conductor30in the z direction. Each of the first feeding line51and the second feeding line52may be configured to supply an electrical signal from the outside to the antenna element11. Each of the first feeding line51and the second feeding line52may be configured to supply an electrical signal from the antenna element11to the outside. Each of the first feeding line51and the second feeding line52is electrically connected to the radiation conductor30. Each of the first feeding line51and the second feeding line52only needs to be electromagnetically connected to the radiation conductor30. In the present disclosure, “electromagnetic connection” includes electrical connection and magnetic connection. The first feeding line51and the second feeding line52are in contact with different positions of the radiation conductor30. As illustrated inFIG.2, the ground conductor40has a plurality of openings40a. The first feeding line51and the second feeding line52individually pass through the openings40aof the ground conductor40. The first feeding line51is configured to contribute at least to supply of an electrical signal when the radiation conductor30resonates in the x direction. The second feeding line52is configured to contribute at least to supply of an electrical signal when the radiation conductor30resonates in the y direction. The first feeding line51and the second feeding line52are configured to excite the radiation conductor30in different directions. With the first feeding line51and the second feeding line52, the antenna10can reduce the excitation of the radiation conductor30in one direction during the excitation of the radiation conductor30in the other direction. The connecting conductor60is configured to electrically connect the radiation conductor30and the ground conductor40. A connection point between the radiation conductor30and the connecting conductor60serves as a potential reference of the radiation conductor30during resonance. The connecting conductor60extends along the z direction. As illustrated inFIG.4, the connecting conductor60is positioned apart from a center O of the radiation conductor30in the xy plane. The connecting conductor60is connected to a point different from the center O of the radiation conductor30in planar view of the xy plane. If the connecting conductor60is positioned at the center O of the radiation conductor30, a change in current distribution due to the connection of the connecting conductor60is extremely small. In contrast, connecting the connecting conductor60to the point different from the center O of the radiation conductor30changes the potential reference. The current distribution changes by the change in potential reference. When the current distribution changes, a radiation pattern changes. With the connecting conductor60connected to the point different from the center O of the radiation conductor30, the antenna10can change the radiation pattern. The connecting conductor60is spaced apart from the first feeding line51by a first distance d1. For example, the point where the connecting conductor60is connected to the radiation conductor30is spaced apart from a point where the first feeding line51is connected to the radiation conductor30by the first distance d1. The connecting conductor60is spaced apart from the second feeding line52by a second distance d2. For example, the point where the connecting conductor60is connected to the radiation conductor30is spaced apart from a point where the second feeding line52is connected to the radiation conductor30by the second distance d2. The first distance d1is substantially equal to the second distance d2. The connecting conductor60may be spaced apart from the first feeding line51by a distance of ¼ of an effective wavelength2, in the x direction. The connecting conductor60may be spaced apart from the second feeding line52by a distance of ¼ of the effective wavelength in the y direction. The radiation conductor30may include a symmetry axis S that passes through the center O. The symmetry axis S passes through the center O and extends in a direction intersecting the x direction and the y direction. When the radiation conductor30is a square substantially parallel to the xy plane, the symmetry axis S may extend along a direction inclined at 45 degrees from a y-axis positive direction to an x-axis positive direction. The first feeding line51and the second feeding line52are symmetric with respect to the symmetry axis S. For example, the point where the first feeding line51is connected to the radiation conductor30and the point where the second feeding line52is connected to the radiation conductor30may be line-symmetric with respect to the symmetry axis S. The connecting conductor60is positioned on the symmetry axis S. With the connecting conductor60positioned on the symmetry axis S, a change in a resonance direction of the radiation conductor30can be reduced. An effective adjustment range by the connecting conductor60may be a range in which a resonant electromagnetic field of ½ of the effective wavelength can be maintained. A direction connecting the first feeding line51and the connecting conductor60is inclined with respect to the x direction. Because the first feeding line51and the connecting conductor60are arranged to be inclined with respect to the x direction, the first feeding line51and the connecting conductor60can excite the radiation conductor30in the y direction as well. A direction connecting the second feeding line52and the connecting conductor60is inclined with respect to the y direction. Because the second feeding line52and the connecting conductor60are arranged to be inclined with respect to the y direction, the second feeding line52and the connecting conductor60can excite the radiation conductor30in the x direction as well. The excitation of the radiation conductor30in the two excitation directions causes impedance components in the respective directions to act on the feeding lines. The antenna10may decrease an impedance at the time of input by canceling impedance components in the respective directions. By decreasing the impedance at the time of input, the antenna10may enhance isolation between two polarization directions. As illustrated inFIG.3, the circuit board70includes a first feeding circuit71and a second feeding circuit72. The circuit board70may include any one of the first feeding circuit71and the second feeding circuit72. The first feeding circuit71is configured to be electrically connected to the first feeding line51. The second feeding circuit72is configured to be electrically connected to the second feeding line52. As illustrated inFIG.5, an array antenna12includes a plurality of antenna elements11. The antenna elements11may be aligned along the x direction. The antenna elements11may be arranged in the x direction. The antenna elements11may be aligned along the y direction. The antenna elements11may be arranged in the y direction. The array antenna12includes at least one circuit board70. The circuit board70includes at least one first feeding circuit71and at least one second feeding circuit72. The array antenna12includes at least one first feeding circuit71and at least one second feeding circuit72. The first feeding circuit71may be connected to one or more antenna elements11. The first feeding circuit71may be configured to supply the same signal to all the antenna elements11in feeding power to the antenna elements11. The first feeding circuit71may be configured to supply the same signal to the first feeding lines51of the respective antenna elements11in feeding power to the antenna elements11. The first feeding circuit71may be configured to supply signals of different phases to the first feeding lines51of the respective antenna elements11in feeding power to the antenna elements11. The second feeding circuit72may be connected to one or more antenna elements11. The second feeding circuit72may be configured to supply the same signal to all the antenna elements11in feeding power to the antenna elements11. The second feeding circuit72may be configured to supply the same signal to the second feeding lines52of the respective antenna elements11in feeding power to the antenna elements11. The second feeding circuit72may be configured to supply signals of different phases to the second feeding lines52of the respective antenna elements11in feeding power to the antenna elements11. As illustrated inFIG.6, a wireless communication module80includes a drive circuit81. The drive circuit81is configured to drive the antenna element11. The drive circuit81may be configured to feed a transmission signal to at least one of the first feeding circuit71and the second feeding circuit72. The drive circuit81may be configured to receive a reception signal fed from at least one of the first feeding circuit71and the second feeding circuit72. The drive circuit81may be configured to be directly or indirectly connected to each of the first feeding line51and the second feeding line52. The drive circuit81may be configured to feed a transmission signal to at least one of the first feeding line51and the second feeding line52. The drive circuit81may be configured to receive a reception signal fed from at least one of the first feeding line51and the second feeding line52. The drive circuit81may be configured to feed a transmission signal to the first feeding line51and receive a reception signal fed from the second feeding line52. As illustrated inFIG.7, a wireless communication device90may include the wireless communication module80, a sensor91, and a battery92. The sensor91is configured to perform sensing. The battery92is configured to supply power to any part of the wireless communication device90. When configured to supply power to the drive circuit81of the wireless communication module80, the battery92may be a power source configured to drive the drive circuit81. As illustrated inFIG.8, a wireless communication system95includes the wireless communication device90and a second wireless communication device96. The second wireless communication device96is configured to perform wireless communication with the wireless communication device90. The configuration according to the present disclosure is not limited to some embodiments described above, and various modifications and changes can be made. For example, the functions included in the components may be rearranged without logical contradiction, and a plurality of components may be combined into one or may be divided. The drawings that illustrate the configurations according to the present disclosure are schematic. The dimensional ratios and the like on the drawings do not necessarily match the actual ones. In some embodiments described above, the patch antenna is employed as the antenna element11. However, the antenna to be employed as the antenna element11is not limited to the patch antenna. Other antennas may be employed as the antenna element11. In the array antenna12, the antenna elements11may be arranged in the same orientation. In the array antenna12, two adjacent antenna elements11may be arranged in different orientations. When the two adjacent antenna elements11are arranged in different orientations, the antenna elements11are excited in the same direction. In the present disclosure, the terms “first”, “second”, “third” and so on are examples of identifiers meant to distinguish the configurations from each other. In the present disclosure, regarding the configurations distinguished by the terms “first” and “second”, the respective identifying numbers can be reciprocally replaced with each other. For example, regarding the first feeding line and the second feeding line, the identifiers “first” and “second” can be reciprocally exchanged. The exchange of identifiers is performed simultaneously. Even after exchanging the identifiers, the configurations remain distinguished from each other. Identifiers may be removed. The configurations from which the identifiers are removed are still distinguishable by the reference numerals. For example, the first feeding line51may be denoted as feeding line51. In the present disclosure, the terms “first”, “second” and so on of the identifiers should not be used in the interpretation of the order of the configurations, or should not be used as the basis for having identifiers with low numbers, or should not be used as the basis for having identifiers with high numbers. The present disclosure includes a configuration in which the circuit board70includes the second feeding circuit72but does not include the first feeding circuit71. | 18,006 |
11942692 | DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT The present disclosure may be modified in various ways and implemented by various exemplary embodiments, so that specific exemplary embodiments are shown in the drawings and will be described in detail herein. However, it is to be understood that the present disclosure is not limited to the specific exemplary embodiments, but includes all modifications, equivalents, and substitutions included in the spirit and the scope of the present disclosure. Similar reference numerals are assigned to similar components in the following description of drawings. It is to be understood that when one element is referred to as being “connected to” or “coupled to” another element, it may be connected directly to or coupled directly to another element or be connected to or coupled to another element, having the other element intervening therebetween. On the other hand, it should be understood that when one element is referred to as being “connected directly to” or “coupled directly to” another element, it may be connected to or coupled to another element without the other element intervening therebetween. Terms used in the present specification are used only to describe specific exemplary embodiments rather than limiting the present disclosure. Singular forms are intended to include plural forms unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” or “have” used in this specification, specify the presence of stated features, numerals, steps, operations, components, parts, or a combination thereof, but do not preclude the presence or addition of one or more other features, numerals, steps, operations, components, parts, or a combination thereof. Unless defined otherwise, it is to be understood that all the terms used in the specification including technical and scientific terms have the same meaning as those that are understood by those who are skilled in the art. It will be further understood that terms such as terms defined in common dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein. Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. FIG.1is a plan view showing a MIMO antenna according to an embodiment of the present disclosure,FIG.2is a plan view showing a MIMO antenna according to another embodiment of the present disclosure,FIG.3is a plan view showing a MIMO antenna according to still another embodiment of the present disclosure,FIG.4is a plan view showing a power supplier according to an embodiment of the present disclosure,FIG.5is a conceptual view showing an array of a MIMO antenna according to an embodiment of the present disclosure, andFIG.6is a conceptual view showing a transceiver according to an embodiment of the present disclosure. Referring toFIG.1, a MIMO antenna100according to an embodiment of the present disclosure, which is an antenna for simultaneously transmitting and receiving information using a frequency in the same band, may include a substrate110and transmission and reception antenna elements122and124. The substrate110is a dielectric substrate110made of a dielectric element in a flat plate structure, and the permittivity, length, width, and thickness may be differently set in accordance with setting by a user. The material of the dielectric substrate110may include all of materials of a dielectric substrate110that are generally used in this field such as epoxy, Duroid, Teflon, bakelite, high-resistance silicon, glass, alumina, LTCC, and air foam. According to an embodiment, the substrate110is exemplified as a square, but the shape and size of the substrate110are not limited thereto and the substrate110may be formed in various shapes such as a circle, a rectangle, and a polygon. In the substrate110, transmission and reception antenna elements122and124may be disposed on a first plane and a grounding plate (not shown) may be disposed on a second plane. The first plane and the second plane are the top or the bottom of the substrate110. The transmission and reception antenna elements122and124include transmission antenna elements122and reception antenna elements124and may be separately coaxially disposed on the same plane of the substrate110. The plane in this case is the top that is the first plane of the substrate110. That is, the transmission antenna element122and the reception antenna element124are used as a single module type antenna, the transmission and reception antenna elements122and124are integrated within one substrate110and the interference therebetween should be minimized. Accordingly, in the present embodiment, the transmission antenna elements122and the reception antenna elements124were coaxially disposed to be physically separated and reduce influence between transmission and reception signals. The transmission antenna elements122may be disposed outside from the center of the coaxial structure and the reception antenna elements124may be disposed inside, but, depending on use, the reception antenna elements124may be disposed outside and the transmission antenna elements122may be disposed inside. For the convenience of description of the present disclosure, an embodiment in which the transmission antenna elements122are disposed outside the coaxial structure and the reception antenna elements124are disposed inside is described. The transmission antenna elements122may have a first polarization characteristic and the reception antenna elements124may have a second polarization characteristic different from the first polarization characteristic. That is, the antenna elements each have opposite polarization characteristics. Polarization of antennas is classified into circular polarization (CP) and linear polarization (LP) in a broad meaning, the circular polarization is classified into right-handed circular polarization (RHCP) and left-handed circular polarization (LHCP), and the linear polarization is classified into vertical polarization (VP) and horizontal polarization (HP). The antenna elements122and124of the present embodiment may have a first polarization characteristic and a second polarization characteristic of the circular polarization. In detail, the first polarization characteristic may correspond to any one polarization of right-handed circular polarization (RHCP) and left-handed circular polarization (LHCP), and the second polarization characteristic may correspond to the other polarization except for any one polarization corresponding to the first polarization characteristic. For example, referring toFIGS.1and2, the transmission antenna elements122disposed outside the coaxial structure may have an RHCP characteristic and the reception antenna elements124disposed inside the coaxial structure may have an LHCP characteristic. For reference, the polarization characteristics are not limited to circular polarization and may have a linear polarization characteristic. The number of the antenna elements disposed inside the coaxial structure may be the same as or smaller than the number of the antenna elements disposed outside, and in the present embodiments, the antenna elements are each provided as four pieces. The antenna elements disposed outside the coaxial structure may include two pairs of antenna elements diagonally symmetric to each other. In detail, when the transmission antenna elements122are disposed outside the coaxial structure, the transmission antenna elements122may be disposed close to corners, respectively, and elements diagonally facing each other may be symmetric. For example, a pair of transmission antenna elements Tx2and Tx4disposed in the first quadrant and the third quadrant of the substrate110may be inclined left and symmetric to each other, and another pair of transmission antenna elements Tx1and Tx3disposed in the second quadrant and the fourth quadrant of the substrate110may be inclined right and symmetric to each other. The antenna elements disposed inside the coaxial structure may include two pairs of antenna elements vertically and horizontally symmetric to each other. In detail, when the reception antenna elements124are disposed inside the coaxial structure, the reception antenna elements124may entirely make a cross shape and may be disposed between the transmission antenna elements122, and the reception antenna elements124facing each other in a straight line may be symmetric. As an embodiment, as shown inFIG.1, a pair of reception antenna elements Rx1and Rx3disposed at the upper portion and the lower portion on the substrate110may be inclined right and symmetric to each other, and another pair of reception antenna elements Rx2and Rx4disposed at the left portion and the right portion on the substrate110may be inclined left and symmetric to each other. As another embodiment, as shown inFIG.2, a pair of reception antenna elements Rx1and Rx3disposed at the upper portion and the lower portion on the substrate110may be straight up and down and symmetric to each other, and another pair of reception antenna elements Rx2and Rx4disposed at the left portion and the right portion on the substrate110may be straight left and right and symmetric to each other. The transmission antenna elements122and the reception antenna elements124are each formed in a hexagonal shape in the embodiments shown inFIGS.1and2, but they are not limited thereto and may be formed in a circular shape or other various shapes, as shown inFIG.3. The transmission antenna element122and the reception antenna element124may have a power supply hole (not shown) for supplying power. As shown inFIG.4, the power supply hole is a region formed through the substrate110to receive a power line for supplying power to the transmission and reception antenna elements122and124, and in this case, the power supply hole may receive the internal conductor of a coaxial cable. Referring toFIG.5A to5C, the MIMO antenna of the present disclosure may have an array structure composed of several modules by expanding a single module type antenna. The number, shape, and polarization characteristic of the antenna elements constituting the antenna of each module may be varied. Referring toFIG.6, a transceiver according to an embodiment of the present disclosure may include a MIMO antenna100, an RF switch200, and a distributor300. The MIMO antenna100is a single module type antenna composed of the transmission and reception antenna elements122and124and the relevant detailed description is as the above. The RF switch200, which is a component for changing the polarization of polarization characteristics of the MIMO antenna, may be connected to an end of the power supplier. That is, the RF switch200may change the different polarization characteristics of the transmission and reception antenna elements122and124to transmit and receive signals. For example, when the transmission antenna element122has an RHCP characteristic and the reception antenna element124has an LHCP characteristic, the RF switch200may switch a reception signal having an RHCP characteristic to an LHCP characteristic and switch a transmission signal having an RHCP characteristic to an LHCP characteristic. The RF switch200of the present embodiment may be a single double-pole-double-throw (DPDT) switch or may be composed of several single-pole-double-throw (SPDT) switches. That is, the RF switch200may be one DPDT switch or may be composed of several SPDT switches that can be operated as a DPDT switch. The distributor300may distribute power of the transmission antenna element122and the reception antenna element124such that the phase of a signal transmitted from the MIMO antenna100is controlled. For example, referring toFIGS.1and2, it is possible to distribute power to respective antenna elements such that the phases of Tx1, Tx2, Tx3, and Tx4that are the transmission antenna elements122are controlled to 0°, 90°, 180°, and 270°, respectively, and the phases of Rx1, Rx2, Rx3, and Rx4that are reception antenna elements124are controlled to 0°, 90°, 180°, and 270°, respectively. Accordingly, the transmission and reception antenna elements122and124may have different polarization characteristics. For reference, the distributor300may be replaced with a delay line for transmission and reception signals in the present disclosure. The transceiver of the present disclosure may further include a beamformer (not shown) that forms a beam pattern in a specific direction, depending on the phases controlled as described above. FIG.7Ais a graph showing a reflection characteristic according to an embodiment of the present disclosure andFIG.7Bis a graph showing a reflection characteristic according to another embodiment of the present disclosure. In order to examine a reflection characteristic, the transmission and reception antenna elements were designed on a substrate having a size of 1.47λ0(19 mm)×1.47λ0(19 mm) to have a central frequency of 24 GHz in the present disclosure. Referring toFIGS.7A and7B, the port 1 (black) of the S-parameter shows the reflection characteristic of the transmission antennal elements and the port 2 (red) of the S-parameter shows the reflection characteristic of the reception antenna elements. As shown in the graphs, it can be seen that impedance matching between transmission and reception antenna elements was good and that the isolation between transmission and reception signal was high (S2.1) in the operation band. FIG.8Ais a graph comparing the results of simulating radiation characteristics on an xz-plane and a yz-plane according to an embodiment of the present disclosure andFIG.8Bis a graph comparing the results of simulating radiation characteristics on an xz-plane and a yz-plane according to another embodiment of the present disclosure. The parameters of the MIMO antenna used to compare radiation characteristics are the same as the parameters of the MIMO antenna used to examine the reflection characteristic described above. Referring toFIGS.8A and8B, it was found that half power beamwidths (HPBW) 25 degrees or more and gains 11.5 dBi or more were obtained from transmission antenna elements and HPBWs 43 degrees or more and gains 9.2 dBi or more were obtained from reception antenna elements in both of the MIMO antennas according to an embodiment and another embodiment of the present disclosure. Therefore, according to the present disclosure, since individual antenna elements having opposite polarizations are coaxially disposed and then, if necessary, signals are transmitted and received using a DPDT switch, high isolation is satisfied and modularization into a single antenna is possible, so there is an effect that it is easy to expand to a desired array size. The above description merely explains the spirit of the present disclosure and the present disclosure may be changed and modified in various ways without departing from the spirit of the present disclosure by those skilled in the art. Accordingly, the embodiments described herein are provided merely not to limit, but to explain the spirit of the present disclosure, and the spirit of the present disclosure is not limited by the embodiments. The protective range of the present disclosure should be construed by the following claims and the scope and spirit of the present disclosure should be construed as being included in the patent right of the present disclosure. | 15,682 |
11942693 | REFERENCE NUMERALS 1waveguide11first substrate12waveguide cavity13signal output terminal2power divider21second substrate22probe23metal ground electrode of power divider24wiring3phase shifting unit31third substrate32fourth substrate33metal ground electrode of phase shifting unit34metal delay line of phase shifting unit35liquid crystal layer36second alignment film37first alignment film4active amplifying unit41fifth substrate42active amplifying circuit43second female head45via hole46metal wire47radio frequency signal input terminal48radio frequency signal output terminal5microwave connection unit51first female head52second male head6first patch structure61sixth substrate62first metal pattern63first male head7second patch structure71seventh substrate72second metal pattern8insulating spacer9radiation unit10power division and transmission unit. DETAILED DESCRIPTION To make technical problems to be solved, technical solutions and advantages of embodiments of the present disclosure clearer, a detailed description of the present disclosure will be given below in conjunction with drawings and the embodiments of the present disclosure. Embodiments of the present disclosure provide an antenna, a method of manufacturing the antenna, and an antenna system, which may increase a gain-to-noise temperature ratio. Embodiments of the present disclosure provide an antenna, as shown inFIG.1, The antenna includes: a radiation unit9, configured to receive a microwave signal from the outside and/or send a microwave signal to the outside; an active amplifying unit4, configured to receive a plurality of microwave signals inputted by the radiation unit9in a plurality of paths and amplify the plurality of microwave signals; a phase shifting unit3, configured to receive a plurality of amplified microwave signals outputted by the active amplifying unit4in the plurality of microwave signals and perform phase adjustment on the plurality of amplified microwave signals; and a power division and transmission unit10, configured to combine a plurality of phase-adjusted microwave signals outputted by the phase shifting unit3into a microwave signal and output the microwave signal. In the embodiments, after the radiation unit receives a microwave signal from the outside and before transmitting the microwave signal to the phase shifting unit, the active amplifying unit is configured to amplify the microwave signal, which can compensate for loss of the microwave signal after entering the phase shifting unit, and can effectively increase a gain of an antenna, thereby increasing the gain-to-noise temperature ratio of the antenna and improving performance of the antenna. If the microwave signal collected by the radiation unit9is transmitted to the active amplifying unit4through spatial coupling, there will be transmission loss, and alignment accuracies between the radiation unit9and the active amplifying unit4are relatively high. In some embodiments, in order to reduce the transmission loss and alignment errors, as shown inFIG.1, the antenna further includes: a microwave connection unit5, located between the radiation unit9and the active amplifying unit4and configured to transmit the plurality of microwave signals outputted by the radiation unit9to the active amplifying unit4through a conductor. The microwave connection unit5can reliably input, to the active amplifying unit4, the microwave signal collected by the radiation unit9, which can reduce transmission loss and alignment errors, and the microwave connection unit5can also provide support for the radiation unit9. The radiation unit9includes at least one patch structure. The radiation unit9may include one patch structure or a plurality of patch structures. When the radiation unit9includes a plurality of patch structures, the gain of the antenna can be increased, and a bandwidth of the antenna can be expanded, but at the same time this will increase structural complexity and a cost of the antenna. In some embodiments, as shown inFIG.1, the radiation unit9may include two patch structures, i.e., a first patch structure and a second patch structure, where the second patch structure is located on an outermost side of the antenna. Each of the at least one patch structure includes a substrate and a plurality of metal patch arrays disposed on a surface of the substrate at one side, and each of the plurality of metal patch arrays includes a plurality of metal patterns disposed in an array. As shown inFIG.2, a second patch structure7includes a seventh substrate71and a plurality of metal patch arrays arranged in an array on the seventh substrate71, and each metal patch array includes a plurality of second metal pattern72arranged in an array, where the seventh substrate71may be a PCB board, and a thickness of the seventh substrate may be 0.5 mm to 6.4 mm. The second metal patterns72may be made of a metal with good electrical conductivity, such as copper, aluminum, etc., and a thickness of the second metal pattern72may be 17 um, 35 um, 50 um, 70 um, etc. In some embodiments, a metal patch array may be approximately square, and the second metal pattern72may also be approximately square. In order to avoid mutual interference between adjacent metal patch arrays, a distance between adjacent metal patch arrays is not less than 0.5λ, where λ is a width of each of the plurality of metal patch arrays. As shown inFIG.3, a first patch structure6includes a sixth substrate61and a plurality of metal patch arrays arranged in an array on the sixth substrate61. Metal patch arrays of the first patch structure6can correspond to metal patch arrays of the second patch structure7in a one-to-one manner. Each metal patch array includes a plurality of first metal patterns62arranged in an array. The sixth substrate61may be a PCB board, and a thickness of the sixth substrate may be 0.5 mm to 6.4 mm. The first metal pattern62may be made of metals with good electrical conductivity, such as copper, aluminum, etc., and a thickness of the first metal pattern62may be 17 um, 35 um, 50 um, 70 um, etc. In some embodiments, metal patch arrays may be approximately square, and the first metal pattern62may also be approximately square. In order to avoid mutual interference between adjacent metal patch arrays, a distance between adjacent metal patch arrays is not less than 0.5λ, where λ is a width of each of the plurality of metal patch arrays. In the embodiments, the plurality of first metal patterns62correspond to the plurality of second metal patterns72in a one to one manner, and an orthographic projection of a center of a first metal pattern62on a substrate of the second patch structure7coincides with a center of a corresponding second metal pattern. In the embodiments, the first metal pattern62and the second metal pattern72can be a square or a square with a notch on a side. By adjusting shapes of the first metal pattern62and the second metal pattern72, and adjusting distances between the first patch structure6and the second patch structure7, a receiving frequency of the antenna can be adjusted. When the sixth substrate61and the seventh substrate71are both PCB boards, since the PCB boards are opaque, alignment holes need to be provided on the sixth substrate61and the seventh substrate71to position and fix the patch structures. The first patch structure6close to the active amplifying unit4further includes at least one power divider, and each of the at least one power divider corresponds to at least one metal patch array. A power divider is connected to the first metal pattern62in the corresponding metal patch array, and collects and output, to a signal output terminal, microwave signals collected by a connected first metal pattern62, and each power divider corresponds to a signal output terminal. As shown inFIG.3, the signal output terminal may be a first male head63. When the radiation unit9includes a plurality of patch structures, the plurality of patch structures are stacked, and adjacent patch structures are connected by prepregs. Optionally, as shown inFIG.4, the first patch structure6and the second patch structure7can be connected by an adhesive insulating spacer8. The insulating spacer8may be made of an adhesive glue with a certain hardness after curing, such as an optical glue OCA. Specifically, a distance between the first patch structure6and the second patch structure7can be adjusted according to a designed receiving frequency of the antenna. The first patch structure6inFIG.4is in a schematic cross-sectional view of the first patch structure6shown inFIG.3in a BB direction; the second patch structure7inFIG.4is in a schematic cross-sectional view of the second patch structure7shown inFIG.2in an AA direction. As shown inFIG.4, the first male head63extends to a side of the sixth substrate61away from the seventh substrate71through a via hole penetrating through the sixth substrate61. The via hole may be a metalized via hole, that is, a sidewall of the via hole is plated with metal, such as copper. The sidewall can be first chemically plated with copper with a thickness of 300 nm to 1000 nm, and then thickened by electroplating, so that a thickness of copper after the thickening can reach 5 um to 25 um. In a specific example, the second patch structure7may include an array of 32×32 metal patches, the first patch structure6may include an array of 32×32 metal patches, and the power divider of the first patch structure6a is T-type or Wilkinson-type 16-in-1 power divider, that is, each power divider is connected to an array of 4×4 metal patches, so that the first patch structure6will output 8×8 microwave signals through the first male head63of64power dividers. The microwave connection unit includes a plurality of microwave connectors, each microwave connector includes a second male head52and a first female head51that are connected to each other. A structure of the first female head51is shown inFIG.5, the first female head51is connected to the first male head63of the power divider of the first patch structure6in a one-to-one correspondence. The structure of the second male head52is shown inFIG.6, the second male head is connected to the active amplifier unit4. When the first patch structure6includes 64 first male heads63and outputs 8×8 microwave signals, the microwave connection unit5includes 8×8 microwave connectors. As shown inFIG.7, the active amplifying unit4includes a fifth substrate41and a plurality of active amplifying circuits42arranged in an array on the fifth substrate41, and the active amplifying circuits42correspond with the microwave connectors in a one to one manner. Each active amplifying circuit includes: a radio frequency signal input terminal47, configured to receive a microwave signal; a filter, connected to the radio frequency signal input terminal and configured to filter noise of an input microwave signal; at least one amplifier, connected to the filter and configured to amplify an intensity of the microwave signal; at least one attenuator, connected to the amplifier and configured to attenuate an intensity of the microwave signal; a radio frequency signal output terminal48, connected to the attenuator and configured to transmit the microwave signal to the phase shifting unit3in a spatial coupling manner. In some embodiments, each active amplifying circuit includes two stages of low noise amplifiers and several stages of attenuators. By adjusting amplification coefficients of the amplifiers and attenuation coefficients of the attenuators, an intensity of the microwave signal outputted by a radio frequency signal output terminal48can be controlled. Optionally, intensities of microwave signals outputted by all the radio frequency signal output terminals48are basically the same. When the microwave connection unit5includes 8×8 microwave connectors, correspondingly, the active amplifying unit4includes 8×8 active amplifying circuits. As shown inFIG.7, the active amplifying circuit42includes a second female head43, the second female head43is connected to the second male head52in a one-to-one correspondence, receives a microwave signal outputted by the second male head52, and transmits the microwave signal to the radio frequency signal input terminal47through a metal wire. After the active amplifier circuit42amplifies the microwave signal, an amplified microwave signal is outputted through the radio frequency signal output terminal48. The microwave signal outputted from the radio frequency signal output terminal48is led out by the metal wire46. The metal wire46extends to a back surface of the fifth substrate41through a via hole45penetrating through the fifth substrate41. FIG.8is a circuit schematic diagram of an active amplifier circuit42, where Vdd is a direct current supply voltage; R1, R2are matching resistances; La, Lm, Ls, and Lg are matching inductances; C1, C2, C3are matching capacitors; M1, M2, M3are microwave transistors; M2and M3are amplifiers, La, Lm, and Ls are attenuators, and Lg and C1form a filter. The fifth substrate41may be a PCB board, and the second female head43, the above-mentioned capacitors, inductors, resistors and other components may be welded on the PCB board by a reflow soldering process. In some embodiments, the phase shifting unit3may be a liquid crystal phase shifter. As shown inFIG.9, the liquid crystal phase shifter includes a third substrate31and a fourth substrate32disposed oppositely, a metal ground electrode33of the liquid crystal phase shifter is provided on a surface of the third substrate31facing the fourth substrate32, and a metal delay line34of the liquid crystal phase shifter is provided on a surface of the fourth substrate32facing the third substrate31. The liquid crystal phase shifter further includes a first alignment film37disposed on a surface of the third substrate31facing the fourth substrate32, a second alignment film36disposed on a surface of the fourth substrate32facing the third substrate31and a liquid crystal layer35located between the first alignment film37and the second alignment film36. A coupling groove of the metal ground electrode33can be rectangular, H-shaped, bone-shaped, etc., and a thickness of the metal ground electrode33can be 0.5 um to 5 um; the metal delay line34can be made of copper and arranged in a serpentine winding manner, a line width of the metal delay line is 100 um to 250 um, a line distance is 150 um to 400 um, and a thickness is 0.5 um to 5 um. Further, the liquid crystal phase shifter includes a bias line layer, which can be made of ITO, a line width of the bias line layer is 3 um to 20 um, and a thickness of the bias line layer is 30 nm to 150 nm. As shown inFIG.9, the metal wire46is used as a coupling transmission line, and spatial coupling of a waveform signal is implemented by the metal delay line34and a coupling groove (an area defined by the metal ground electrode33) on the liquid crystal phase shifter. The active amplifying circuit42inFIG.9is shown as a schematic cross-sectional view of the active amplifying circuit inFIG.7in a CC direction. In order to ensure transmission of the microwave signal, an orthographic projection of the metal wire46on the third substrate31falls within an orthographic projection of the coupling groove of the metal ground electrode33on the third substrate31, and an orthographic projection of a central axis of the metal wire46on the third substrate31coincides with an orthographic projection of a central axis of the coupling groove of the metal ground electrode33on the third substrate31. In the embodiments, a microwave signal outputted by the first patch structure6passes through a connection between the first male head63and the first female head51, a connection between the first female head51and the second male head52, and a connection between the second male head52and the second female connector43, and enters into the radio frequency signal input terminal47, and is amplified by the active amplifier circuit. An amplified microwave signal is transmitted to the metal wire46on the back side of the fifth substrate41through the radio frequency signal output terminal48, and coupling of the microwave signal is implemented from the metal wire46to the metal delay line34in the phase shift unit3below. The microwave signal passes through the fourth substrate32, the metal ground electrode33and a liquid crystal in a spatial coupling manner, and reaches the metal delay line34. In the embodiment, feeding between the active amplifier circuit42and the liquid crystal phase shifter are implemented in a coupling manner, which can avoid complicated processes such as punching and copper-filling processes on a substrate of the liquid crystal phase shifter, simplify a manufacturing process and reduce process complexity. In the embodiment, the phase shifting unit3corresponds to the active amplifying circuit42in a one-to-one manner. When the active amplifying unit4includes 8×8 active amplifying circuits, the antenna includes 8×8 phase shifting units3. In some embodiments, as shown inFIG.1, the power division and transmission unit includes: a power divider2, configured to combine, into N microwave signals, M phase-adjusted microwave signals outputted by M phase shifting units, and output the N microwave signals to a waveguide, wherein M and N are integers greater than 1, and M is greater than N; a waveguide1, configured to combine the N microwave signals into one microwave signal and output the microwave signal. In a specific embodiment, when there are 8×8 phase shifting units3, the power divider2can adopt a 16-in-1 power divider design. Specifically, the power divider2can adopt a Wilkinson-type or a T-type power divider. The 64 microwave signals are combined into 2×2 microwave signals. Specifically, as shown inFIG.10andFIG.12, the power divider2includes a metal ground electrodes23corresponding to the phase shifting unit in a one to one manner. The metal ground electrode is located on the second substrate21, and the metal ground electrode23is further provided with a coupling groove, a microwave signal is coupled between the phase shifting unit3and the coupling groove. The M metal ground electrodes23are divided into N groups, and the metal ground electrodes23in each group are connected to a probe22through wirings24to collect M/N microwave signals to the probe22; the probe22extends to a side of the second substrate21away from the phase shifting unit3through a via hole penetrating through the second substrate21. The via hole may be a metalized via hole, that is, a sidewall of the via hole is plated with metal, such as copper. The sidewall can be first chemically plated with copper having a thickness of 300 nm to 1000 nm, and then thickened by electroplating copper, so that a thickness of the copper can reach 5 um to 25 um. A power divider2inFIG.12is in a schematic cross-sectional view of the power divider2inFIG.10in a DD direction. The second substrate21of the power divider2can be a PCB board, a line width of the wiring24can be 80 um to 400 um, a thickness of the wiring24can be 17 um, a thickness of the metal ground electrode23can be 17 um, and an available form of the coupling groove can be rectangular, H type, bone type, etc. When the antenna includes 8×8 phase shift units3and the power divider2adopts a 16-in-1 power divider design, the power divider1includes a total of four probes22for feeding the waveguide1. Specifically, as shown inFIG.11andFIG.12, the waveguide1includes N hollow waveguide cavities12corresponding to the probes22in a one-to-one manner, a probe22is inserted into a corresponding waveguide cavity12, the N hollow waveguide cavities12are communicated to form an integrated structure, and the integrated structure is provided with an opening, and a signal output terminal13is disposed at the opening. The signal output terminal13can output microwave signals. A waveguide1inFIG.12is in a schematic cross-sectional view of a waveguide1inFIG.11in an EE direction. When the power splitter1includes four probes22in total, the waveguide1can combine four microwave signals into one microwave signal for output. In some embodiments, the waveguide maybe an aluminum waveguide. In the embodiment, the power divider transmission unit adopts a design including a PCB power divider and an aluminum waveguide, which combines an advantage of the PCB power divider in respect of easily-implemented planar processing and a characteristic of the aluminum waveguide in respect of an extremely low transmission loss, and can overcome a shortcoming of a single PCB power divider in respect of a high insertion loss and a shortcoming of a single aluminum waveguide in respect of difficult processes and high costs. Embodiments of the present disclosure further provide an antenna system including the above-mentioned antenna. The antenna system can be used in a communication equipment. Embodiments of the present disclosure further provide a method of manufacturing an antenna which is used to manufacture the above antenna. The method includes: providing a radiation unit, the radiation unit being configured to receive a microwave signal from the outside and/or send a microwave signal to the outside; providing an active amplifying unit, the active amplifying unit being configured to receive a plurality of microwave signals inputted by the radiation unit in a plurality of paths, and amplify the plurality of microwave signals; providing a phase shifting unit, the phase shifting unit being configured to receive a plurality of amplified microwave signals outputted by the active amplifying unit in a plurality of paths, and perform phase adjustment on the plurality of amplified microwave signals; and providing a power division and transmission unit, the power division and transmission unit being configured to combine, into a microwave signal, a plurality of phase-adjusted microwave signals outputted by the phase shifting unit and output the microwave signal; assembling the radiation unit, the active amplifying unit, the phase shifting unit and the power division and transmission unit together in sequence. In the embodiments, after the radiation unit receives a microwave signal from the outside and before transmitting the microwave signal to the phase shifting unit, the active amplifying unit is configured to amplify the microwave signal, which can compensate for loss of the microwave signal after the microwave signal enters the phase shifting unit, thereby effectively increasing the gain of the antenna, increasing the gain-to-noise temperature ratio of the antenna and improving the performance of the antenna. If the microwave signal collected by the radiation unit is transmitted to the active amplifying unit through spatial coupling, there will be transmission loss, and alignment accuracies between the radiation unit and the active amplifying unit are relatively high. In some embodiments, in order to reduce the transmission loss and alignment errors. In some embodiments, the method further includes: forming a microwave connection unit between the radiation unit and the active amplifying unit, wherein the microwave connection unit is configured to transmit, to the active amplifying unit through a conductor, the plurality of microwave signals outputted by the radiation unit. Taking manufacturing of the antenna shown inFIG.1toFIG.12as an example, the method of manufacturing the antenna of the present disclosure specifically includes the following steps: Step 1: making a second patch structure7. A PCB board with a thickness of 0.5 mm to 6.4 mm is taken as the seventh substrate71, and the PCB board is pre-processed to form a copper layer with a thickness of 17 um, 35 um, 50 um or 70 um on the PCB board. After film-lamination, a photoresist is coated on the copper layer, and after exposing the photoresist, the photoresist is developed. K2CO3solution can be used to develop the photoresist to obtain a photoresist pattern. The copper layer is etched using the photoresist pattern as a mask, and the copper layer can be etched with a CuCl2solution to obtain a plurality of second metal patterns72on the seventh substrate71to form a metal patch array. Subsequently, a mechanical punching method can be used to form alignment holes on the seventh substrate71for positioning and fixing a patch structure. Step 2: making a first patch structure6. A PCB board with a thickness of 0.5 mm to 6.4 mm is taken as the sixth substrate61, and the PCB board is pre-processed to form a copper layer with a thickness of 17 um, 35 um, 50 um or 70 um on the PCB board. After film lamination, a photoresist is coated on the copper layer, and after exposing the photoresist, the photoresist is developed. K2CO3solution can be used to develop the photoresist to obtain a photoresist pattern. The copper layer is etched using the photoresist pattern as a mask, and the copper layer can be etched with a CuCl2solution to obtain a plurality of first metal patterns62and a power divider on the sixth substrate61, the plurality of first metal pattern62form a metal patch array. Subsequently, a mechanical punching method can be used to form alignment holes on the sixth substrate61for positioning and fixing the patch structure. The sixth substrate61is further provided with a via hole, the via hole is a metalized via hole, and the first male head63extends to a side of the sixth substrate61away from the seventh substrate71through the metalized via hole. When making the metalized via hole, the sixth substrate61is drilled mechanically or by laser first, then burrs in the hole are removed, and then slags in the hole are removed. Subsequently, copper is plated on a sidewalls of the via hole by a chemical method, a thickness of the copper is 300 nm to 1000 nm, and then the copper is thickened by electroplating, so that the thickness of the copper reaches 5 um to 25 um. In a specific example, the second patch structure7may include an array of 32×32 metal patches, the first patch structure6may include an array of 32×32 metal patches, and the power divider of the first patch structure6is T-type or Wilkinson-type 16-in-1 power divider design, that is, each power divider is connected to a 4×4 metal patch array, so that the first patch structure6will output 8×8 microwave signals through the 64 first male heads63. Step 3: filling a prepreg between the first patch structure6and the second patch structure7, using an alignment hole to align the first patch structure6and the second patch structure7, and performing lamination and hot-lamination processes to fasten together the first patch structure6and the second patch structure7. Step 4: welding a first female head51of the microwave connector on a side of the first patch structure6away from the second patch structure7. The first female head51corresponds to the first male head63in a one-to-one manner, and is welded together with the corresponding first male head63. Step 5: fabricating the active amplifier unit, and welding the second female head43of the active amplifier unit and the second male head52of the microwave connector together. The active amplifying unit4includes a fifth substrate41and a plurality of active amplifying circuits42arranged in an array on the fifth substrate41, and the active amplifying circuits42correspond with the microwave connectors in a one-to-one manner. Each active amplifying circuit includes: a radio frequency signal input terminal47, configured to receive a microwave signal; a filter, connected to the radio frequency signal input terminal and configured to filter noise of an inputted microwave signal; at least one amplifier, connected to the filter and configured to amplify an intensity of an microwave signal; at least one attenuator, connected to an amplifier and configured to attenuate an intensity of the microwave signal; a radio frequency signal output terminal48, connected to the attenuator and configured to transmit a microwave signal to the phase shifting unit3in a spatial coupling manner. FIG.8is a circuit diagram of an active amplifier circuit42, where Vdd is a direct-current supply voltage; R1, R2are matching resistances; La, Lm, Ls, and Lg are matching inductances; C1, C2, C3are matching capacitors; M1, M2, M3are microwave transistors. The fifth substrate41may be a PCB board; the second female head43, the above-mentioned capacitors, inductors, resistors and other components may be welded on the PCB board by a reflow soldering process to form an active amplifier unit4, and metal wires may be formed on the PCB board by a patterning process. The microwave signal outputted from the radio frequency signal output terminal48is led out by the metal wire46. The fifth substrate41is further provided with a via hole45. The metal wire46extends to a back surface of the fifth substrate41through a via hole45penetrating through the fifth substrate41, and then the microwave signal is coupled between the metal delay line34and a coupling groove on the liquid crystal phase shifter. The via hole45is a metalized via hole. When making the metalized via hole, the fifth substrate41is drilled mechanically or by laser first, then burrs in the hole are removed, and then slags in the hole are removed. Subsequently, copper is plated on a sidewall of the via hole by a chemical method, a thickness of the copper is 300 nm to 1000 nm, and then the copper is thickened by electroplating, so that the thickness of the copper reaches Sum to 25 um. Step 6: fabricating the phase shifting unit3, and aligning the phase shifting unit3and the active amplifying unit4together. The phase shifting unit3may be a liquid crystal phase shifter. The liquid crystal phase shifter includes a third substrate31and a fourth substrate32disposed oppositely, a metal ground electrode33of the liquid crystal phase shifter is provided on a surface of the third substrate31facing the fourth substrate32, and a metal delay line34of the liquid crystal phase shifter is provided on a surface of the fourth substrate32facing the third substrate31. The manufacturing method of the liquid crystal phase shifter further includes: forming a first alignment film on a surface of the third substrate31facing the fourth substrate32, forming a second alignment film37on a surface of the fourth substrate32facing the third substrate31and forming a liquid crystal layer35between the first alignment film37and the second alignment film36. A coupling groove of the metal ground electrode33can be rectangular, H-shaped, bone-shaped, etc., and a thickness of the metal ground electrode33can be 0.5 um to 5 um; the metal delay line34can be made of copper and arranged in a serpentine winding manner. The line width of the metal delay line is 100 um to 250 um, the line distance is 150 um to 400 um, and a thickness is 0.5 um to 5 um. Further, the liquid crystal phase shifter includes a bias line layer, which can be made of ITO, a line width of the bias line layer is 3 um to 20 um, and a thickness is 30 nm to 150 nm. Specifically, the phase shifting unit3and the active amplifying unit4can be bonded together by a frame-sealing glue. Step 7: making the power divider2and the waveguide1, and fixing the power divider2and the waveguide1together by screws to form the power division and transmission unit10. A PCB board with a thickness of 0.5 mm to 6.4 mm is taken as the second substrate21, and the PCB board is pre-processed to form a copper layer with a thickness of 17 um, 35 um, 50 um or 70 um on the PCB board. After film lamination, a photoresist is coated on the copper layer, and after exposing the photoresist, the photoresist is developed. K2CO3solution can be used to develop the photoresist to obtain a photoresist pattern. The copper layer is etched using the photoresist pattern as a mask, and the copper layer can be etched with a CuCl2solution to obtain a wiring24. The metal ground electrode23can be formed on the other side of the second substrate21using the same patterning method. A line width of the wiring24can be 80 um to 400 um, a thickness of the wiring can be 17 um, and a thickness of the metal ground electrode23can be 17 um. The metal ground pole23is provided with a coupling groove, and an available form of the coupling groove can be rectangular, H type, bone type, etc. The M metal ground electrodes23are divided into N groups, and the metal ground electrodes23in each group are connected to a probe22through a wiring to collect the M/N microwave signals to the probe22; the probe22extends to a side of the second substrate21away from the phase shifting unit3through the via hole penetrating through the second substrate21. The via hole may be a metalized via. When making the metalized via hole, the second substrate21is drilled mechanically or by laser first, then burrs in the hole are removed, and then slags in the hole are removed. Subsequently, copper is plated on a sidewall of the via hole by a chemical method, a thickness of the copper is 300 nm to 1000 nm, and then the copper is thickened by electroplating, so that the thickness of the copper reaches Sum to 25 um. The waveguide1can be made by electromechanical processing and welding methods. As shown inFIG.11andFIG.12, the waveguide1includes N hollow waveguide cavities12corresponding to the probes22in a one-to-one manner, the probe22is inserted into a corresponding waveguide cavity12, the N hollow waveguide cavities12are communicated to form an integrated structure, and the integrated structure is provided with an opening, and a signal output terminal13is disposed at the opening. The signal output terminal13can output microwave signals. Step 8: aligning and bonding the power division and transmission unit10and the phase shift unit3together, where the power division transmission unit10is located on a side of the phase shift unit3away from the active amplifying unit4. Specifically, the power division and transmission unit10and the phase shifting unit3subject to the step 6 can be aligned and bonded together by a frame sealing glue. The antenna of the embodiment can be obtained after the above steps. In the embodiments, after the patch structure receives a microwave signal from the outside and before transmitting the microwave signal to the phase shifting unit, the active amplifying unit is configured to amplify the microwave signal, which can compensate for loss of the microwave signal after entering the phase shifting unit. It can effectively increase the gain of the antenna, thereby increasing the gain-to-noise temperature ratio of the antenna and improving the performance of the antenna. A plurality of microwave signals outputted by the patch structure is transmitted to the active amplifying unit through the microwave connection unit, which can reduce the transmission loss and reduce the alignment error. In the embodiment, feeding between the active amplifier circuit and the liquid crystal phase shifter is implemented in a coupling manner, which can avoid complicated processes such as punching and copper-filling on a substrate of the liquid crystal phase shifter, simplify the manufacturing process and reduce process complexity. The power divider transmission unit adopts a design of a PCB power divider and an aluminum waveguide, which combines an advantage of the PCB power divider in respect of easily-implemented planar processing and a characteristic of the aluminum waveguide in respect of an extremely low transmission loss, and can overcome a shortcoming of a single PCB power divider in respect of a high insertion loss and a shortcoming of a single aluminum waveguide in respect of difficult processes and high costs. In each method embodiment of the present disclosure, numbers of the steps cannot be used to limit a sequence of the steps. For those ordinary skilled in the art, without paying creative work, a change in the sequence of the steps is also within the protection scope of the present disclosure. Unless otherwise defined, technical or scientific terms used in the present disclosure shall have ordinary meanings understood by those of ordinary skill in the art to which the present disclosure belongs. The terms “first”, “second”, and the like used in this disclosure do not indicate any order, quantity, or importance, but are only used to distinguish different components. The terms “include”, “have” or any variations thereof are intended to mean that an element or article preceding such a term encompasses an element or article following such a term, or equivalents thereof, without precluding other elements or articles. Expressions such as “connection” or “connected” are not limited to physical or mechanical connections, but may include electrical connections, whether direct connection or indirect connection. Terms “Up”, “down”, “left”, “right”, etc. are only used to indicate relative position relationship. When an absolute position of the described object changes, the relative position relationship may change accordingly. It will be understood that when an element, such as a layer, film, area or substrate, is referred to as being “on” or “under” another element, it can be directly on or directly under the other element, or intervening elements may also be present. Specific features, structures, materials or characteristics in the description of forgoing implementations may be combined in any one or more embodiments or examples in a proper manner. The above descriptions merely describe specific implementations of the present disclosure, and the scope of the present disclosure is not limited thereto. Any modifications or substitutions easily occurring to a person of ordinary skill in the art without departing from the principle of the present disclosure shall fall within the scope of the present disclosure. Therefore, the protection scope of the present disclosure is defined by the protection scope of the claims. | 38,004 |
11942694 | DETAILED DESCRIPTION The embodiments set forth below represent information to enable those skilled in the art to practice the embodiments and illustrate the best mode of practicing the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of the disclosure and the accompanying claims. FIG.1illustrates an example embodiment of a transceiver10that provides self-calibration for an antenna array of the transceiver10according to embodiments of the present disclosure. In some preferred embodiments, the transceiver10is an analog beamforming transceiver and, as such, the transceiver10is sometimes referred to herein as an analog beamforming transceiver10. However, it should be appreciated that, in some other embodiments, the transceiver10may, e.g., be partly digital. The analog beamforming transceiver10may be, for example, a radio access node in a cellular communications network (e.g., a Third Generation Partnership Project (3GPP) Long Term Evolution (LTE) or Fifth Generation (5G) New Radio (NR) network), an access point in a local wireless network (e.g., an access point in a WiFi network), a wireless communication device (e.g., a User Equipment device (UE) in a 3GPP LTE or Third Generation (3G) NR network), or the like. As illustrated, the analog beamforming transceiver10includes a baseband processing system12, one or more transmitters14and one or more receivers16coupled to the baseband processing system12, gain and phase adjustment circuitry18, and an antenna array that, in this example, is implemented as one or more Advanced Antenna Systems (AASs)20. The baseband processing system12is implemented in hardware or a combination of hardware and software. For example, the baseband processing system12may include one or more processors (e.g., Central Processing Units (CPUs), Digital Signal Processors (DSPs), Application Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs), and/or the like). In some embodiments, at least some of the functionality of the baseband processing system12described herein is implemented in software that is executed by the processor(s). The antenna array implemented by the one or more AASs20includes multiple antenna elements and, in some implementations, many antenna elements (e.g., tens or hundreds of antenna elements). When an antenna element is used for transmission from the transmitter(s)14, the antenna element is referred to herein as a Transmit (Tx) antenna element. Likewise when an antenna element is used for reception via the receiver(s)16, the antenna element is referred to herein as a Receive (Rx) antenna element. In some implementations, a single antenna element may operate as both a Tx antenna element and a Rx antenna element. Due to various parameters (e.g., manufacturing tolerances of the various components in the transmit and receive paths, temperature, etc.), there may be variations in gain and/or phase between different Tx antenna elements and/or variations in gain and/or phase between different Rx antenna elements. In particular, the gain and phase of a first transmit path from the output of the baseband processing system12to a first Tx antenna element may differ from that of a second transmit path from the output of the baseband processing system12to a second Tx antenna element. Likewise, the gain and phase of a first receive path from a first Rx antenna element to the input of the baseband processing system12may differ from that of a second receive path from a second Rx antenna element to the input of the baseband processing system12. The baseband processing system12includes a self-calibration subsystem22that operates to provide self-calibration at the analog beamforming transceiver10for the variations in gain and/or phase for different Tx and/or Rx antenna elements. The self-calibration subsystem22is implemented in hardware or a combination of hardware and software. For example, the self-calibration subsystem22may include one or more processors (e.g., CPUs, DSPs, ASICs, FPGAs, and/or the like). In some embodiments, at least some of the functionality of the self-calibration subsystem22described herein is implemented in software that is executed by the processor(s). In this example, the self-calibration subsystem22includes a signal generator24, a measurement function26, and a post-processing function28, the operation of which is described below in detail. Note that, in some embodiments, some or all of the components used for self-calibration can be dedicated for that purpose (i.e., not used for transmission or reception of normal uplink and downlink signals). Coupling between the antenna elements is generally asymmetrical. Specifically, for a particular Tx antenna element, the coupling between the Tx antenna element and some Rx antenna elements is symmetrical whereas the coupling between the Tx antenna element and some other Rx antenna elements is asymmetrical. Likewise, for a particular Rx antenna element, the coupling between the Rx antenna element and some Tx antenna elements is symmetrical whereas the coupling between the Rx antenna element and some other Tx antenna elements is asymmetrical. As discussed below, embodiments of the present disclosure provide self-calibration at the analog beamforming transceiver10based on measurements between pairs of Tx antenna elements and pairs of Rx antenna elements having symmetrical coupling properties with respect to one another. The measurement arrangement for obtaining the measurements used for the self-calibration process may vary. As illustrated inFIG.2A, in some example embodiments, measurements can be performed between individual Tx antenna elements and individual Rx antenna elements between two AASs20in a same unit with the same or different polarization.FIG.2Billustrates an example in which measurements can be performed between individual Tx antenna elements and individual Rx antenna elements on different Radio Frequency Integrated Circuits (RFICs) of a same AAS20. However, in this case, the polarization should be different because of analog beamforming setup where a Tx antenna element and a Rx antenna element of the same polarization are using the same channel in Time Domain Duplexing (TDD).FIG.2Cillustrates an example in which any Tx antenna element and Rx antenna element can be selected for measurement if there is scope to operate the Tx antenna element in Horizontal polarization and the Rx antenna element in Vertical polarization and vice versa. This is one preferred measurement scenario as the Tx antenna element and the Rx antenna element are in proximity and differences in coupling values will be minimal with better symmetry. However, note thatFIGS.2A through2Care only examples. FIG.3is a flow chart that illustrates the operation of the analog beamforming transceiver10, and in particular the self-calibration subsystem22of the analog beamforming transceiver10, to perform self-calibration of the antenna array formed by the one or more AASs20according to some embodiments of the present disclosure. In operation, the analog beamforming transceiver10, and in particular the measurement function26of the self-calibration subsystem22, performs a self-calibration procedure (step100). In particular, the analog beamforming transceiver10performs pair-by-pair gain and phase measurements for all pairs of Tx and Rx antenna elements in the antenna array formed by the one or more AASs20and stores the resulting measurements (step100A). In other words, for each pair of Tx and Rx antenna elements Txiand Rx1where I=1 . . . NTXand j=1 . . . NRXand NTXis the number of Tx antenna elements in the antenna array and NRXis the number of Rx antenna elements in the antenna array, the analog beamforming transceiver10performs a gain measurement (GMTxiRxj) and a phase measurement (ϕMTxiRxj) The details of how the gain and phase measurements GMTxiRxjand ϕMTxiRxjare performed is provided below with respect toFIG.4. However, in general, an IQ signal (e.g., a pseudo-random IQ signal having a desired bandwidth for the measurement) is generated by the signal generator24and provided to the transmitter(s)14for transmission via the Tx antenna element Txi. The measurement function26measures the gain and phase of a received signal that is received via the receiver(s)16and the Rx antenna element Rx1during transmission of the IQ signal from the Tx antenna element Txi. The measured gain and phase are the gain and phase measurement values GMTxiRxjand ϕMTxiRxj. This process is performed for each pair of Tx and Rx antenna elements. The analog beamforming transceiver10, and in particular the post-processing function28of the self-calibration subsystem22, performs post-processing of the gain and phase measurements GMTxiRxjand ϕMTxiRxjfor all i and j to compute gain and phase calibration values for the Tx and Rx antenna elements of the antenna array (step100B). The details of step100B are provided below with respect toFIGS.5A and5BandFIGS.7A and7B. In general, the post-processing function28computes the gain and phase calibration values based on the gain and phase measurements GMTxiRxjand ϕMTxiRxjand combinations of Tx and Rx antenna elements having symmetrical coupling properties. The combinations of Tx and Rx antenna elements having symmetrical coupling properties are, e.g., predefined or predetermined based on, e.g., a known layout of the antenna elements in the antenna array or computed by the analog beamforming transceiver10based on, e.g., a known layout of the antenna elements in the antenna array. The analog beamforming transceiver10applies the computed gain and phase calibration values at the analog beamforming transceiver10to thereby compensate for gain and phase variations between the different Tx antenna elements (referred to herein as Tx calibration) and between the different Rx antenna elements (referred to herein as Rx calibration) (step102). The gain and phase calibration values are applied by the gain and phase adjustment circuitry18. FIG.4illustrates step100A ofFIG.3in more detail according to some embodiments of the present disclosure. As illustrated, the self-calibration subsystem22initiates measurement for self-calibration (step200). The self-calibration subsystem22sets a frequency channel for the measurements (step202). The signal generator24generates a pseudo-random IQ signal of a desired bandwidth for the measurements (step204). The measurement function26selects the AAS(s)20for calibration (step206), selects a TX polarization (step208), and selects an RX polarization (step210). For the first iteration, the measurement function26initializes a Rx antenna element counter i and a Rx antenna element counter j to, in this example, a value of 0. The measurement function26increments (i.e., counts) the Rx antenna element counter j and then determines whether the Rx antenna element counter j is less than or equal to the total number of Rx antenna elements in the antenna array (step212). If not, the measurement process ends (not shown). If the Rx antenna element counter j is less than or equal to the total number of Rx antenna elements in the antenna array, the measurement function26selects and enables the j-th Rx antenna element Rxj(step214). For the first iteration, j=1. The Rx antenna element counter j is incremented in subsequent iterations. The measurement function26increments (i.e., counts) the Tx antenna element counter i and then determines whether the Tx antenna element counter i is less than or equal to the total number of Tx antenna elements in the antenna array (step216). If the Tx antenna element counter i is less than or equal to the total number of Tx antenna elements in the antenna array, the measurement function26selects and enables the i-th Tx antenna element Txi(step218). For the first iteration, i=1. The Tx antenna element counter i is incremented in subsequent iterations. The measurement function26causes the baseband processing system12to send the IQ signal generated by the signal generator24in step204to the transmitter(s)14for transmission via the enabled Tx antenna element Txiand reception via the enabled Rx antenna element Rxj(step220). The resulting received signal received by the baseband processing system12via the enabled Rx antenna element Rxjis measured by the measurement function26. More specifically, the measurement function26cross-correlates the transmitted IQ signal and the received IQ signal (step222) and divides (or subtracts in dB scale) the transmitted IQ signal by the cross-correlated received IQ signal (step224). In other words, the relative phase measurement can be obtained from the cross-correlation (e.g., by looking for the peak in the cross-correlation to determine the relative delay, or phase, between the Tx IQ signal and the Rx IQ signal. The relative gain measurement can be obtained by division in normal scale or by subtraction in dB scale. The relative phase and relative gain for this measurement are stored as a relative phase measurement ϕMTxiRxjand a relative gain measurement for GMTxiRxjfor the Tx antenna element Txirelative to the Rx antenna element Rxj(step226). The measurement function26then disables the Tx antenna element Txi(step228), and the process returns to step216such that gain and phase measurements are performed for all Tx antenna elements relative to the Rx antenna element Rxj. Once gain and phase measurements are performed for all Tx antenna elements relative to the Rx antenna element Rxj, the measurement function26disables the Rx antenna element Rxj(not shown), and the process returns to step212to be repeated for the next Rx antenna element. Once phase and gain measurements have been performed (and stored) for all Tx, Rx antenna element pairs, the measurement process ends. FIGS.5A and5Billustrate step100B ofFIG.3in more detail according to some embodiments of the present disclosure. In particular,FIG.5Aillustrates the operation of the post-processing function28to compute gain and phase calibration values for Tx calibration, andFIG.5Billustrates the operation of the post-processing function28to compute gain and phase calibration for Rx calibration. In some embodiments, both Tx and Rx calibration are performed. However, in some other embodiments, only Tx calibration or only Rx calibration may be performed. First, as shown inFIG.5A, the post-processing function28selects a pair of Tx antenna elements, Txiand Txkwhere i≠k (step300). The post-processing function28determines a pair of Rx antenna elements, Rxnand Rxmwhere n≠m, having symmetrical coupling properties with respect to the selected pair of Tx antenna elements Txiand Txk(step302). In some embodiments, pairs of Rx antenna elements that have symmetrical coupling properties with respect to the pair of Tx antenna elements Txiand Txkare known (e.g., predefined or predetermined based on, e.g., the layout of the Tx and Rx antenna elements in the antenna array and, e.g., stored in a Look Up Table (LUT), computed based on, e.g., the layout of the Tx and Rx antenna elements in the antenna array, or the like). For Tx calibration, the pair of Rx antenna elements Rxnand Rxmthat have symmetrical coupling properties with respect to the pair of Tx antenna elements Txiand Txksatisfy either or both of the following two symmetrical coupling scenarios:1. CTxiRxn→CTxkRxnand CTxiRxm→CTxkRxm2. CTxiRxn→CTxkRxmand CTxiRxm→CTxkRxn where CTxiRxnis the coupling between Tx antenna element Txiand Rx antenna element Rxn, CTxiRxmis the coupling between Tx antenna element Txiand Rx antenna element Rxm, CTxkRxnis the coupling between Tx antenna element Txkand Rx antenna element Rxn, and CTxkRxmis the coupling between Tx antenna element Txkand Rx antenna element Rxm. Further, in this context, the symbol “→” means “approximately equal to” or “approaches.” Thus, coupling scenario (1) is where: (a) the coupling between Tx antenna element Txiand Rx antenna element Rxnis approximately equal to the coupling between Tx antenna element Txkand Rx antenna element Rxnand the coupling between Tx antenna element Txiand Rx antenna element Rxmis approximately equal to the coupling between Tx antenna element Txkand Rx antenna element Rxm. Similarly, coupling scenario (2) is where: (a) the coupling between Tx antenna element Txiand Rx antenna element Rxnis approximately equal to the coupling between Tx antenna element Txkand Rx antenna element Rxmand the coupling between Tx antenna element Txiand Rx antenna element Rxmis approximately equal to the coupling between Tx antenna element Txkand Rx antenna element Rxn. The post-processing function28computes a relative gain value(s) and a relative phase value (s) between the pair of Tx antenna elements Txiand Txkfor the applicable symmetrical coupling scenario(s) based on the gain and phase measurements obtained in step100A (step304). Specifically, for the pair of Tx antenna elements Txiand Txkand the pair of Rx antenna elements Rxnand Rxmhaving symmetrical coupling properties, the gain measurements previously obtained are GMTxiRxn, GMTxiRxm, GMTxkRxn, and GMTxkRxm, and the phase measurements previously obtained are ϕMTxiRxn, ϕMTxiRxm, ϕMTxkRxn, and ϕMTxkRxm. The gain measurements may be defined as follows: GMTxiRxn=GTxi+GCTxiRxn+GRxn(1a) GMTxiRxm=GTxi+GCTxiRxm+GRxm(1b) GMTxkRxn=GTxk+GCTxkRxn+GRxn(1c) GMTxkRxm=GTxk+GCTxkRxm+GRxm(1d) where GTxiis a gain of the i-th transmit branch (i.e., a gain for the path from an output of the baseband processing system12to the Tx antenna element Txi, GTxkis a gain of the k-th transmit branch (i.e., a gain for the path from an output of the baseband processing system12to the Tx antenna element Txk, GRxnis a gain of the n-th receive branch (i.e., a gain for the path from the Rx antenna element Rxnto an input of the baseband processing system12, GRxmis a gain of the m-th receive branch (i.e., a gain for the path from the Rx antenna element Rxmto an input of the baseband processing system12, GCTxiRxnis a gain resulting from coupling between the Tx antenna element Txiand the Rx antenna element Rxn, GCTxiRxmis a gain resulting from coupling between the Tx antenna element Txiand the Rx antenna element Rxm, GCTxkRxnis a gain resulting from coupling between the Tx antenna element Txkand the Rx antenna element Rxn, and GCTxkRxmis a gain resulting from coupling between the Tx antenna element Txkand the Rx antenna element Rxm. Note that for all of the equations provided herein, gain is represented in decibels (dB) (i.e., GdB=20 log10(GLINEAR). As one of skill in the art will appreciate upon reading this disclosure, the equations can easily be rewritten in terms of linear gain. Based on symmetrical coupling scenario (1) for Tx calibration given above, a first relative gain value ΔGTxiTxk(1) for the gain of Txirelative to the gain of Txkcan be computed as: ΔGTxiTxk(1)=(GMTxiRxn-GMTxkRxn)+(GMTxiRxm-GMTxkRxm)2(2) By substituting Equations (1a) through (1d) above into Equation (2), it can be seen that: (GMTxiRxn-GMTxkRxn)+(GMTxiRxm-GMTxkRxm)2=(GTxi-GTxk)+eCG,Tx(1)(3) where eCG,Tx(1) is an error term defined as: eCG,Tx=(GCTxiRxn-GCTxkRxn)2+(GCTxiRxm-GCTxkRxm)2.(4) Note that, due to the symmetrical coupling properties, the error term eCG,Tx(1) is small. In other words, the term (GCTxiRxn−GCTxkRxn) will be small since CTxiRxn→CTxkRxn, and the term (GCTxiRxm−GCTxkRxm) will be small since CTxiRxm→CTxkRxm. However, there is still some error. As discussed below, this error is mitigated by averaging the computed relative gain values across multiple different pairs of Rx antenna elements having symmetrical coupling properties with respect to the same pair of Tx antenna elements. Based on symmetrical coupling scenario (2) for Tx calibration given above, a second relative gain value ΔGTxiTxk(2) for the gain of Txirelative to the gain of Txkcan be computed as: ΔGTxiTxk(2)=(GMTxiRxn-GMTxkRxm)+(GMTxiRxm-GMTxkRxn)2(5) By substituting Equations (1a) through (1d) above into Equation (5), it can be seen that: (GMTxiRxn-GMTxkRxm)+(GMTxiRxm-GMTxkRxn)2=(GTxi-GTxk)+eCG,Tx(2)(6) where eCG,Tx(2) is an error term defined as: eCG,Tx(2)=(GCTxiRxn-GCTxkRxm)2+(GCTxiRxm-GCTxkRxn)2.(7) Note that, due to the symmetrical coupling properties, the error term eCG,Tx(2) is small. In other words, the term (GCTxiRxn−GCTxkRxm) will be small since CTxiRxn→CTxkRxm, and the term (GCTxiRxm−GCTxkRxn) will be small since CTxiRxm→CTxkRxn. However, there is still some error. Again, as discussed below, this error is mitigated by averaging the computed relative gain values across multiple different pairs of Rx antenna elements having symmetrical coupling properties with respect to the same pair of Tx antenna elements. In a similar manner, the phase measurements may be defined as follows: ϕMTxiRxn=ϕTxi+ϕCTxiRxn+ϕRxn(8a) ϕMTxiRxm=ϕTxi+ϕCTxiRxm+ϕRxm(8b) ϕMTxkRxn=ϕTxk+ϕCTxkRxn+ϕRxn(8c) ϕMTxkRxm=ϕTxk+ϕCTxkRxm+ϕRxm(8d) where ϕTxiis a phase of the i-th transmit branch (i.e., a phase for the path from an output of the baseband processing system12to the Tx antenna element Txi, ϕTxkis a phase of the k-th transmit branch (i.e., a phase for the path from an output of the baseband processing system12to the Tx antenna element Txk, ϕRxnis a phase of the n-th receive branch (i.e., a phase for the path from the Rx antenna element Rxnto an input of the baseband processing system12, ϕRxmis a phase of the m-th receive branch (i.e., a phase for the path from the Rx antenna element Rxmto an input of the baseband processing system12, ϕCTxiRxnis a phase resulting from coupling between the Tx antenna element Txiand the Rx antenna element Rxn, ϕCTxiRxmis a phase resulting from coupling between the Tx antenna element Txiand the Rx antenna element Rxm, ϕCTxkRxnis a phase resulting from coupling between the Tx antenna element Txkand the Rx antenna element Rxn, and ϕCTxkRxmis a phase resulting from coupling between the Tx antenna element Txkand the Rx antenna element Rxm. Based on symmetrical coupling scenario (1) for Tx calibration given above, a first relative phase value ΔϕTxiTxk(1) for the phase of Txirelative to the phase of Txkcan be computed as: ΔϕTxiTxk(1)=(ϕMTxiRxn-ϕMTxkRxn)+(ϕMTxiRxm-ϕMTxkRxm)2.(9) Note that in the term ΔϕTxiTxk(1) and similar terms described herein, the parenthetical “(x)” is used to refer to coupling scenario “x” (e.g., ΔϕTxiTxk(1) refers to a relative phase value computed for coupling scenario (1) whereas ΔϕTxiTxk(2) refers to a relative phase value computed for coupling scenario (2)). By substituting Equations (8a) through (8d) above into Equation (9), it can be seen that: (ϕMTxiRxn-ϕMTxkRxn)+(ϕMTxiRxm-ϕMTxkRxm)2=(ϕTxi-ϕTxk)+eCϕ,Tx(1)(10) where eCϕ,Tx(1) is an error term defined as: eCϕ,Tx(1)=(ϕCTxiRxn-ϕCTxkRxn)2+(ϕCTxiRxm-ϕCTxkRxm)2.(11) Note that, due to the symmetrical coupling properties, the error term eCϕ,Tx(1) is small. In other words, the term (ϕCTxiRxn→ϕCTxkRxn) will be small since CTxiRxn→CTxkRxn, and the term (ϕCTxiRxm−ϕCTxkRxm) will be small since CTxiRxm→CTxkRxm. However, there is still some error. As discussed below, this error is mitigated by averaging the computed relative phase values across multiple different pairs of Rx antenna elements having symmetrical coupling properties with respect to the same pair of Tx antenna elements. Based on symmetrical coupling scenario (2) for Tx calibration given above, a second relative phase value ΔϕTxiTxk(2) for the phase of Txirelative to the phase of Txkcan be computed as: ΔϕTxiTxk(2)=(ϕMTxiRxn-ϕMTxkRxm)+(ϕMTxiRxm-ϕMTxkRxn)2.(12) By substituting Equations (8a) through (8d) above into Equation (12), it can be seen that: (ϕMTxiRxn-ϕMTxkRxm)+(ϕMTxiRxm-ϕMTxkRxn)2=(ϕTxi-ϕTxk)+eCϕ,Tx(2)(13) where eCϕ,Tx(2) is an error term defined as: eCϕ,Tx(2)=(ϕCTxiRxn-ϕCTxkRxm)2+(ϕCTxiRxm-ϕCTxkRxn)2.(14) Note that, due to the symmetrical coupling properties, the error term eCϕ,Tx(2) is small. In other words, the term (ϕCTxiRxn−ϕCTxkRxm) will be small since CTxiRxn→CTxkRxm, and the term (ϕCTxiRxm−ϕCTxkRxn) will be small since CTxiRxm→CTxkRxn. However, there is still some error. Again, as discussed below, this error is mitigated by averaging the computed relative phase values across multiple different pairs of Rx antenna elements having symmetrical coupling properties with respect to the same pair of Tx antenna elements. The post-processing function28determines whether there are more Rx pairs that have symmetrical coupling properties with respect to the selected pair of Tx antenna elements Txiand Txk(step306). Preferably, there are two or more different Rx pairs that have symmetrical coupling properties with respect to the same pair of Tx antenna elements Txiand Txksuch that, for each pair of Rx antenna elements, separate gain and phase values are computed in accordance with Equations (2), (5), (9), and (12) above. In this manner, multiple relative gain values ΔGTxiTxk(1, p) and ΔGTxiTxk(2, p) and multiple relative phase values ΔϕTxiTxk(1, p) and ΔϕTxiTxk(2, p) are determined for the same pair of Tx antenna elements Txiand Txk, where “p” is an index for the Rx pair such that p=1 for the first Rx pair. Thus, for example, ΔGTxiTxk(1, p) is the relative gain value ΔGTxiTxk(1) for the p-th Rx pair. The post-processing function28averages the relative gain values ΔGTxiTxk(1, p) and ΔGTxiTxk(2, p) for the pair of Tx antenna elements Txiand Txkacross all pairs of Rx antenna elements Rxn, Rxmhaving symmetrical coupling properties with respect to the pair of Tx antenna elements Txiand Txkto provide an average relative gain valueΔGTxiTxkfor the pair of Tx antenna elements Txiand Txk. Similarly, the post-processing function28averages the relative phase values ΔϕTxiTxk(1, p) and ΔϕTxiTxk(2, p) for the pair of Tx antenna elements Txiand Txkacross all pairs of Rx antenna elements Rxn, Rxmhaving symmetrical coupling properties with respect to the pair of Tx antenna elements Txiand Txkto provide an average relative phase valueΔϕTxiTxkfor the pair of Tx antenna elements Txiand Txk(step308). The average values are stored. In some embodiments, the average values are computed as linear average values. However, in some other embodiments, the average values are computed as weighted average values. As one example implementation of weighted averaging, the larger the (average) distance of Rx elements from Tx elements (in Tx calibration), the smaller the weight. In other words, the weight (W1) applied to the measurement for a particular pair of Tx antenna elements Txiand Txkis inversely proportional to the distance (e.g., average distance) of the corresponding Rx antenna elements Rxnand Rxmfrom the Tx antenna elements Txiand Txk. As another example implementation, the closer the Rx elements Rxnand Rxmto the center of the AAS, the higher the weighting factor. In other words, the weight (W2) applied to the measurement for a particular pair of Tx antenna elements Txiand Txkis inversely proportional to the distance (e.g., average distance) of the corresponding Rx antenna elements Rxnand Rxmfrom the center of the AAS. In some embodiments, the weight applied to the measurement for a particular pair of Tx antenna elements Txiand Txkis equal to W1*W2. In some other embodiments, a statistical distribution analysis may be used in lieu of averaging. More specifically, in some embodiments, a statistical distribution analysis is performed on the gain and phase values for the pairs of Tx antenna elements such that extreme results are filtered out and the remaining values are averaged (linear or weighted average). As an example, the extreme results may be gain values that are more than a defined threshold amount from the mean of all of the gain values and phase values that are more than a defined threshold amount from the mean of all of the phase values. The post-processing function28determines whether there are more TX antenna element pairs to be processed (step310). If so, the process returns to step300and is repeated for the next Tx antenna element pair. Once all of the Tx antenna element pairs have been processed, the post-processing function28normalizes the average relative gain valuesΔGTxiTxkand the average relative phase value ΔϕTxiTxkwith respect to a single Tx antenna element, which is referred to as a reference Tx antenna element (step312). The normalized gain values are the gain calibration values GTxi, and the normalized phase values are the phase calibration values ϕTxi. It is important to note that, in the example above, it is assumed that all Rx pairs for all Tx pairs satisfy both symmetrical coupling scenario (1) and symmetrical coupling scenario (2) and that both ΔGTxiTxk(1) and ΔGTxiTxk(2) and ΔϕTxiTxk(1) and ΔϕTxiTxk(2) are computed for each Rx pair. However, the present disclosure is not limited thereto. In some alternative embodiments, for a particular Tx pair Txiand Txk, each Rx pair having symmetrical coupling properties with respect to the Tx pair Txiand Txkmay satisfy only symmetrical coupling scenario (1) in which case only ΔGTxiTxk(1) and ΔϕTxiTxk(1) are computed for that Rx pair, satisfy only symmetrical coupling scenario (2) in which case only ΔGTxiTxk(2) and ΔϕTxiTxk(2) are computed for that Rx pair, or satisfy both symmetrical coupling scenarios (1) and (2) in which both ΔGTxiTxk(1) and ΔϕTxiTxk(1) and GTxiTxk(2) and ΔϕTxiTxk(2) are computed for that Rx pair. In some other alternative embodiments, the post-processing function28may consider only symmetrical coupling scenario (1) in which case only ΔGTxiTxk(1) and ΔϕTxiTxk(1) are computed. In some other alternative embodiments, the post-processing function28may consider only symmetrical coupling scenario (2) in which case only ΔGTxiTxk(2) and ΔϕTxiTxk(2) are computed. FIG.5Billustrates the operation of the post-processing function28to compute gain and phase calibration for Rx calibration according to some embodiments of the present disclosure. First, the post-processing function28selects a pair of Rx antenna elements, Rxnand Rxmwhere n≠m (step400). The post-processing function28determines a pair of Tx antenna elements, Txiand Txkwhere i≠k, having symmetrical coupling properties with respect to the selected pair of Rx antenna elements Rxnand Rxm(step402). In some embodiments, pairs of Tx antenna elements that have symmetrical coupling properties with respect to the pair of Rx antenna elements Rxnand Rxmare known (e.g., predefined or predetermined based on, e.g., the layout of the Tx and Rx antenna elements in the antenna array and, e.g., stored in a LUT, computed based on, e.g., the layout of the Tx and Rx antenna elements in the antenna array, or the like). For Rx calibration, the pair of Tx antenna elements Txiand Txkthat have symmetrical coupling properties with respect to the pair of Rx antenna elements Rxnand Rxmsatisfy either or both of the following two symmetrical coupling scenarios:3. CTxiRxn→CTxiRxmand CTxkRxn→CTxkRxm4. CTxiRxn→CTxkRxmand CTxiRxm→CTxkRxn where CTxiRxnis the coupling between Tx antenna element Txiand Rx antenna element Rxn, CTxiRxmis the coupling between Tx antenna element Txiand Rx antenna element Rxm, CTxkRxnis the coupling between Tx antenna element Txkand Rx antenna element Rxn, and CTxkRxmis the coupling between Tx antenna element Txkand Rx antenna element Rxm. Further, in this context, the symbol “4” means “approximately equal to” or “approaches.” Thus, coupling scenario (3) is where: (a) the coupling between Tx antenna element Txiand Rx antenna element Rxnis approximately equal to the coupling between Tx antenna element Txiand Rx antenna element Rxmand the coupling between Tx antenna element Txkand Rx antenna element Rxnis approximately equal to the coupling between Tx antenna element Txkand Rx antenna element Rxm. Similarly, coupling scenario (4) is where: (a) the coupling between Tx antenna element Txiand Rx antenna element Rxnis approximately equal to the coupling between Tx antenna element Txkand Rx antenna element Rxmand the coupling between Tx antenna element Txiand Rx antenna element Rxmis approximately equal to the coupling between Tx antenna element Txkand Rx antenna element Rxn. Note that coupling scenario (4) is the same as coupling scenario (2) above. The post-processing function28computes a relative gain value(s) and a relative phase value(s) between the pair of Rx antenna elements Rxnand Rxmfor the applicable symmetrical coupling scenario(s) based on the gain and phase measurements obtained in step100A (step404). Specifically, for the pair of Rx antenna elements Rxnand Rxmand the pair of Tx antenna elements Txiand Txkhaving symmetrical coupling properties, the gain measurements previously obtained are GMTxiRxn, GMTxiRxm, GMTxkRxn, and GMTxkRxm, and the phase measurements previously obtained are ϕMTxiRxn, ϕMTxiRxm, ϕMTxkRxn, and ϕMTxkRxm. The gain measurements may be defined as follows: GMTxiRxn=GTxi+GCTxiRxn+GRxn(15a) GMTxiRxm=GTxi+GCTxiRxm+GRxm(15b) GMTxkRxn=GTxk+GCTxkRxn+GRxn(15c) GMTxkRxm=GTxk+GCTxkRxm+GRxm(15d) where GTxiis a gain of the i-th transmit branch (i.e., a gain for the path from an output of the baseband processing system12to the Tx antenna element Txi, GTxkis a gain of the k-th transmit branch (i.e., a gain for the path from an output of the baseband processing system12to the Tx antenna element Txk, GRxnis a gain of the n-th receive branch (i.e., a gain for the path from the Rx antenna element Rxnto an input of the baseband processing system12, GRxmis a gain of the m-th receive branch (i.e., a gain for the path from the Rx antenna element Rxmto an input of the baseband processing system12, GCTxiRxnis a gain resulting from coupling between the Tx antenna element Txiand the Rx antenna element Rxn, GCTxiRxmis a gain resulting from coupling between the Tx antenna element Txiand the Rx antenna element Rxm, GCTxkRxnis a gain resulting from coupling between the Tx antenna element Txkand the Rx antenna element Rxn, and GCTxkRxmis a gain resulting from coupling between the Tx antenna element Txkand the Rx antenna element Rxm. Note that for all of the equations provided herein, gain is represented in dB. As one of skill in the art will appreciate upon reading this disclosure, the equations can easily be rewritten in terms of linear gain. Based on symmetrical coupling scenario (3) for Rx calibration given above, a first relative gain value ΔGRxnRxm(3) for the gain of Rxnrelative to the gain of Rxmcan be computed as: ΔGRxnRxm(3)=(GMTxiRxn-GMTxiRxm)+(GMTxkRxn-GMTxkRxm)2(16) By substituting Equations (15a) through (15d) above into Equation (16), it can be seen that: (GMTxiRxn-GMTxiRxm)+(GMTxkRxn-GMTxkRxm)2=(GRxn-GRxm)+eCG,Rx(3)(17) where eCG,Rx(3) is an error term defined as: eCG,Rx(3)=(GCTxiRxn-GCTxiRxm)2+(GCTxkRxn-GCTxkRxm)2.(18) Note that, due to the symmetrical coupling properties, the error term eCG,Rx(3) is small. In other words, the term (GCTxiRxn−GCTxkRxm) will be small since CTxiRxn→CTxiRxm, and the term (GCTxkRxn→GCTxkRxm) will be small since CTxkRxn→CTxkRxm. However, there is still some error. As discussed below, this error is mitigated by averaging the computed relative gain values across multiple different pairs of Tx antenna elements having symmetrical coupling properties with respect to the same pair of Rx antenna elements. Based on symmetrical coupling scenario (4) for Rx calibration given above, a second relative gain value ΔGRxnRxm(4) for the gain of Rxnrelative to the gain of Rxmcan be computed as: ΔGRxnRxm(4)=(GMTxiRxn-GMTxkRxm)+(GMTxiRxm-GMTxkRxn)2(19) By substituting Equations (15a) through (15d) above into Equation (19), it can be seen that: (GMTxiRxn-GMTxkRxm)+(GMTxiRxm-GMTxkRxn)2=(GRxn-GRxm)+eCG,Rx(4)(20) where eCG,Rx(4) is an error term defined as: eCG,Rx(4)=(GCTxiRxn-GCTxkRxm)2+(GCTxiRxm-GCTxkRxn)2.(21) Note that, due to the symmetrical coupling properties, the error term eCG,Rx(4) is small. In other words, the term (GCTxiRxn−GCTxkRxm) will be small since CTxiRxn→CTxkRxm, and the term (GCTxkRxm−GCTxkRxn) will be small since CTxiRxm→CTxkRxn. However, there is still some error. Again, as discussed below, this error is mitigated by averaging the computed relative gain values across multiple different pairs of Tx antenna elements having symmetrical coupling properties with respect to the same pair of Rx antenna elements. In a similar manner, the phase measurements may be defined as follows: ϕMTxiRxn=ϕTxi+ϕCTxiRxn+ϕRxn(22a) ϕMTxiRxm=ϕTxi+ϕCTxiRxm+ϕRxm(22b) ϕMTxkRxn=ϕTxk+ϕCTxkRxn+ϕRxn(22c) ϕMTxkRxm=ϕTxk+ϕCTxkRxm+ϕRxm(22d) where ϕTxiis a phase of the i-th transmit branch (i.e., a phase for the path from an output of the baseband processing system12to the Tx antenna element Txi, ϕTxkis a phase of the k-th transmit branch (i.e., a phase for the path from an output of the baseband processing system12to the Tx antenna element Txk, ϕRxnis a phase of the n-th receive branch (i.e., a phase for the path from the Rx antenna element Rxnto an input of the baseband processing system12, ϕRxmis a phase of the m-th receive branch (i.e., a phase for the path from the Rx antenna element Rxmto an input of the baseband processing system12, ϕCTxiRxnis a phase resulting from coupling between the Tx antenna element Txiand the Rx antenna element Rxn, ϕCTxiRxmis a phase resulting from coupling between the Tx antenna element Txiand the Rx antenna element Rxm, ϕCTxkRxnis a phase resulting from coupling between the Tx antenna element Txkand the Rx antenna element Rxn, and ϕCTxkRxmis a phase resulting from coupling between the Tx antenna element Txkand the Rx antenna element Rxm. Based on symmetrical coupling scenario (3) for Rx calibration given above, a first relative phase value ΔϕRxnRxm(3) for the phase of Rxnrelative to the phase of Rxmcan be computed as: ΔϕRxnRxm(3)=(ϕMTxiRxn-ϕMTxiRxm)+(ϕMTxkRxn-ϕMTxkRxm)2(23) By substituting Equations (22a) through (22d) above into Equation (23), it can be seen that: (ϕMTxiRxn-ϕMTxiRxm)+(ϕMTxkRxn-ϕMTxkRxm)2=(ϕRxn-ϕRxm)+eCϕ,Rx(3)(24) where eCϕ,Rx(3) is an error term defined as: eCϕ,Rx(3)=(ϕCTxiRxn-ϕCTxiRxm)2+(ϕCTxkRxn-ϕCTxkRxm)2.(25) Note that, due to the symmetrical coupling properties, the error term eCϕ,Rx(3) is small. In other words, the term (ϕCTxiRxn−ϕCTxiRxm) will be small since CTxiRxn→CTxiRxm, and the term (ϕCTxkRxn−ϕCTxkRxm) will be small since CTxkRxn→CTxkRxm. However, there is still some error. As discussed below, this error is mitigated by averaging the computed relative phase values across multiple different pairs of Tx antenna elements having symmetrical coupling properties with respect to the same pair of Rx antenna elements. Based on symmetrical coupling scenario (4) for Rx calibration given above, a second relative phase value ΔϕRxnRxm(4) for the phase of Rxnrelative to the phase of Rxmcan be computed as: ΔϕRxnRxm(4)=(ϕMTxiRxn-ϕMTxkRxm)+(ϕMTxiRxm-ϕMTxkRxn)2(26) By substituting Equations (22a) through (22d) above into Equation (26), it can be seen that: (ϕMTxiRxn-ϕMTxkRxm)+(ϕMTxiRxm-ϕMTxkRxn)2=(ϕRxn-ϕRxm)+eCϕ,Rx(4)(27) where eCϕ,Rx(4) is an error term defined as: eCϕ,Rx(4)=(ϕCTxiRxn-ϕCTxkRxm)2+(ϕCTxiRxm-ϕCTxkRxn)2.(28) Note that, due to the symmetrical coupling properties, the error term eCϕ,Rx(4) is small. In other words, the term (ϕCTxiRxn−ϕCTxiRxn) will be small since CTxiRxn→CTxkRxm, and the term (ϕCTxiRxm−ϕCTxkRxn) will be small since CTxiRxm→CTxkRxn. However, there is still some error. Again, as discussed below, this error is mitigated by averaging the computed relative phase values across multiple different pairs of Tx antenna elements having symmetrical coupling properties with respect to the same pair of Rx antenna elements. The post-processing function28determines whether there are more Tx pairs that have symmetrical coupling properties with respect to the selected pair of Rx antenna elements Rxnand Rxm(step406). Preferably, there are two or more different Tx pairs that have symmetrical coupling properties with respect to the same pair of Rx antenna elements Rxnand Rxmsuch that, for each pair of Tx antenna elements, separate gain and phase values are computed in accordance with Equations (16), (19), (23), and (26) above. In this manner, multiple relative gain values ΔGRxnRxm(3, p) and ΔGRxnRxm(4, p) and multiple relative phase values ΔϕRxiRxm(3, p) and ΔϕRxnRxm(4, p) for the same pair of Rx antenna elements Rxnand Rxm, where “p” is an index for the Tx pair such that p=1 for the first Tx pair, p=2 for the second Tx pair, and so on. Thus, for example, ΔGRxnRxm(3, p) is the relative gain value ΔGRxnRxm(3) for the p-th Tx pair. The post-processing function28averages the relative gain values ΔGRxnRxm(3, p) and ΔGRxnRxm(4, p) for the pair of Rx antenna elements Rxnand Rxmacross all pairs of Tx antenna elements Txi, Txkhaving symmetrical coupling properties with respect to the pair of Rx antenna elements Rxnand Rxmto provide an average relative gain valueΔGRxnRxmfor the pair of Rx antenna elements Rxnand Rxm. Similarly, the post-processing function28averages the relative phase values ΔϕRxnRxm(3, p) and ΔϕRxnRxm(4, p) for the pair of Rx antenna elements Rxnand Rxmacross all pairs of Tx antenna elements Txi, Txkhaving symmetrical coupling properties with respect to the pair of Rx antenna elements Rxnand Rxmto provide an average relative phase valueΔϕRxnRxmfor the pair of Rx antenna elements Rxnand Rxm(step408). The average values are stored. In some embodiments, the average values are computed as linear average values. However, in some other embodiments, the average values are computed as weighted average values. As one example implementation of weighted averaging, the larger the (average) distance of Rx elements from Tx elements, the smaller the weight. In other words, the weight (W1) applied to the measurement for a particular pair of Rx antenna elements Rxnand Rxmis inversely proportional to the distance (e.g., average distance) of the corresponding Tx antenna elements Txiand Txkfrom the Rx antenna elements Rxnand Rxm. As another example implementation, the closer the Rx elements Rxnand Rxmto the center of the AAS, the higher the weighting factor. In other words, the weight (W2) applied to the measurement for a particular pair of Rx antenna elements Rxnand Rxmis inversely proportional to the distance (e.g., average distance) of the Rx antenna elements Rxnand Rxmfrom the center of the AAS. In some embodiments, the weight applied to the measurement for a particular pair of Rx antenna elements Rxnand Rxmis equal to W1*W2. In some other embodiments, a statistical distribution analysis may be used in lieu of averaging. More specifically, in some embodiments, a statistical distribution analysis is performed on the gain and phase values for the pairs of Rx antenna elements such that extreme results are filtered out and the remaining values are averaged (linear or weighted average). As an example, the extreme results may be gain values that are more than a defined threshold amount from the mean of all of the gain values and phase values that are more than a defined threshold amount from the mean of all of the phase values. The post-processing function28determines whether there are more Rx antenna element pairs to be processed (step410). If so, the processes returns to step400and is repeated for the next Rx antenna pair. Once all of the Rx antenna element pairs have been processed, the post-processing function28normalizes the average relative gain valuesΔGRxnRxmand the average relative phase valueΔϕRxnRxmwith respect to a single Rx antenna element, which is referred to as a reference Rx antenna element (step412). The normalized gain values are the gain calibration values GRxn, and the normalized phase values are the phase calibration values ϕRxn. It is important to note that, in the example above, it is assumed that all Tx pairs for all Rx pairs satisfy both symmetrical coupling scenario (3) and symmetrical coupling scenario (4) and that both ΔGRxnRxm(3) and ΔϕRxnRxm(3) and ΔGRxnRxm(4) and ΔϕRxnRxm(4) are computed for each Tx pair. However, the present disclosure is not limited thereto. In some alternative embodiments, for a particular Rx pair Rxnand Rxm, each Tx pair having symmetrical coupling properties with respect to the Rx pair Rxnand Rxmmay satisfy only symmetrical coupling scenario (3) in which case only ΔGRxnRxm(3) and ΔϕRxnRxm(3) are computed for that Tx pair, satisfy only symmetrical coupling scenario (4) in which case only ΔGRxnRxm(4) and ΔϕRxnRxm(4) are computed for that Tx pair, or satisfy both symmetrical coupling scenario (3) and (4) in which case both ΔGRxnRxm(3) and ΔϕRxnRxm(3) and GRxnRxm(4) and ΔϕRxnRxm(4) are computed for that Tx pair. In some other alternative embodiments, the post-processing function28may consider only symmetrical coupling scenario (3) in which case only ΔGRxnRxm(3) and ΔϕRxnRxm(3) are computed. In some other alternative embodiments, the post-processing function28may consider only symmetrical coupling scenario (4) in which case only ΔGRxnRxm(4) and ΔϕRxnRxm(4) are computed. Note that in addition to or as an alternative to computing and storing the phase calibration values ϕTxiand the gain calibration values GTxifor Tx calibration and the phase calibration values ϕRxnand the gain calibration values GRxnfor Rx calibration, the self-calibration subsystem22may compute and store a coupling matrix. The coupling matrix stores the phase coupling value ϕCTxiRxjand gain GcTxtRxifor each pair of Tx and Rx antenna elements Txiand Rx1. Specifically, the values ϕTxiand GTxiare known from Tx calibration and the values ϕRxjand GRxjare known from Rx calibration as performed above. Then, the coupling values ϕTxiRxjand GCTxiRxjcan be computed as: ϕCTxiRxj=ϕMTxiRxj−ϕTxi−ϕRxj GCTxiRxj=GMTxiRxj−GTxi−GRxj These coupling values can be stored and thereafter used by the transceiver10for, e.g., self-calibration. FIGS.6A and6Billustrate one example of multiple different Rx pairs having symmetrical coupling properties with respect to a particular Tx antenna element pair that can be used for Tx calibration in accordance with the process ofFIG.5A. In a similar manner, multiple different Tx pairs having symmetrical coupling properties with respect to a particular Rx antenna element pair that can be used for Rx calibration in accordance with the process ofFIG.5Bcan be determined. While any suitable process can be used to determine pairs of antenna elements having symmetrical coupling properties, one example is as follows. For Tx calibration, assume a square array of antenna elements where all antenna elements are the same distance from their neighboring antenna elements in the x and y direction. Let Txibe at a known position a on the x-axis and b on the y-axis (referred to as position (ax,by)). Let Txkbe at a known position c on the x-axis and don the y-axis (referred to as position (cx,dy)). If Rxnis at a known position p on the x-axis and q on the y-axis (referred to as position (px,qy)), then the position for Rxm(referred to as rx, sy) to provide symmetrical coupling properties can be computed as: rx=cx+ax−px, sy=dy+by−qy where rx is the position of Rxmon the x-axis and sy is the position of Rxmon the y-axis and all values of x and y should be within the range of possible values considering the square array of antenna elements. Additional Rx pairs for the same Tx pair can be computed by first selecting a new position for Rxnand then computing the position for Rxm. Note that the example above considers distance between a pair of Tx antenna elements and a pair of Rx antenna elements when determining a pair of Rx antenna elements having symmetrical coupling properties with respect to a pair of Tx antenna elements (and vice versa). However, in some embodiments, other factors may additionally or alternatively be considered. For example, for co-polarized coupling, the coupling is stronger in one direction than the other and the coupling in the diagonal direction is low. As another example, for cross-polarization, the coupling in the diagonal direction is stronger than for co-polarized coupling. FIGS.7A and7Bare example implementations of the processes ofFIGS.5A and5B, respectively. As illustrated inFIG.7A, for Tx calibration, the self-calibration subsystem22initiates measurement for self-calibration, e.g., selects a subarray of the antenna array (step500). The self-calibration subsystem22gets a frequency channel, AAS(s)20, and TX polarization to calibrate (steps502through506). For the first iteration, the post-processing function28initializes a first Tx antenna element counter i and a second Tx antenna element counter k to, in this example, a value of 0. The post-processing function28increments (i.e., counts) the first Tx antenna element counter i and then determines whether the first Tx antenna element counter i is less than or equal to the total number of Tx antenna elements in the antenna array (step508). If not, the process proceeds to step528, as discussed below. If the first Tx antenna element counter i is less than or equal to the total number of Tx antenna elements in the antenna array, the post-processing function28gets the i-th Tx antenna element Txiand reads the gain measurements GMTxiRxjand the phase measurements ϕMTxiRxjfor the i-th Tx antenna element Txifor all Rx antenna elements Rxj(for j∈1 . . . NRxwhere NRxis the number of Rx antenna elements) (steps510and512). The post-processing function28increments (i.e., counts) the second Tx antenna element counter k and then determines whether the second Tx antenna element counter k is less than or equal to the total number of Tx antenna elements in the antenna array (step514). If not, the process returns to step508where the first Tx antenna element counter i is incremented and the process is repeated. If the second Tx antenna element counter k is less than or equal to the total number of Tx antenna elements in the antenna array, the post-processing function28gets the k-th Tx antenna element Txkand reads the gain measurements GMTxkRxjand the phase measurements ϕMTxkRxjfor the k-th Tx antenna element Txkfor all Rx antenna elements Rxj(for j∈1 . . . NRxwhere NRxis the number of Rx antenna elements) (steps516and518). The post-processing function28then finds, or determines, one or more pairs of Rx antenna elements Rxnand Rxm, but preferably multiple pairs of Rx antenna elements Rxnand Rxm, having symmetrical coupling properties with respect to the pair of Tx antenna elements Txiand Txk, as discussed above (step520). As discussed above, for Tx calibration, the pairs(s) of Rx antenna elements Rxnand Rxmhaving symmetrical coupling properties are those Rx antenna pairs for which one or both of the following coupling scenarios are satisfied:CTxiRxn→CTxkRxnand CTxiRxm→CTxkRxm(referred to as coupling scenario (1) above)CTxiRxn→CTxkRxmand CTxiRxm→CTxkRxn(referred to as coupling scenario (2) above). As discussed above, for each determined pair of Rx antenna elements Rxnand Rxm, the post-processing function28computes:relative gain value ΔGTxiTxk(1) in accordance with Equation (2) above and/or relative gain value ΔGTxiTxk(2) in accordance with Equation (5) above, andrelative phase value ΔϕTxiTxk(1) in accordance with Equation (9) above and/or relative phase value ΔϕTxiTxk(2) in accordance with Equation (12) above, assuming both gain and phase Tx calibration (step522). As also discussed above, the post-processing function28performs averaging of the relative gain values and the relative phase values for the pair of Tx antenna elements Txiand Txkacross all of the determined pairs of Rx antenna elements Rxnand Rxm(step524). By doing so, the post-processing function28computes an average relative gainΔGTxiTxkfor the gain of Tx antenna element Txirelative to the gain of the Tx antenna element Txkand an average relative phase valueΔϕTxiTxkfor phase of the Tx antenna element Txirelative to the Tx antenna element Txk. The post-processing function28saves the average relative gainΔGTxiTxkand the average relative phase value ΔϕTxiTxkfor the Tx antenna element Txirelative to the gain of the Tx antenna element Txk(step526). At this point, the process returns to step514where the second Tx antenna element counter k is incremented and the process is repeated. In this manner, average relative gainΔGTxiTxkand average relative phaseΔϕTxiTxkvalues are computed for the Tx antenna element Txirelative to all other Tx antenna elements (i.e., for all Txkfor k≠i). Once this is done, the process returns to step508and is repeated where the first Tx antenna element counter i is incremented and the process is repeated. In this manner, average relative gainΔGTxiTxkand average relative phaseΔϕTxiTxkvalues are computed for all Tx antenna element combinations. Once average relative gainΔGTxiTxkand average relative phaseΔϕTxiTxkvalues are computed for all Tx antenna element combinations, the post-processing function28normalizes the average relative gainΔGTxiTxkand the average relative phaseΔϕTxiTxkvalues relative to a single reference Tx antenna element (step528). Normalization results in the gain calibration values GTxiand the phase calibration values ϕTxifor each Tx antenna element Txi(for all i∈1 . . . NTx). As illustrated inFIG.7B, for Rx calibration, the self-calibration subsystem22initiates measurement for self-calibration (step600). The self-calibration subsystem22gets a frequency channel, AAS(s)20, and TX polarization to calibrate (steps602through606). For the first iteration, the post-processing function28initializes a first Rx antenna element counter n and a second Rx antenna element counter m to, in this example, a value of 0. The post-processing function28increments (i.e., counts) the first Rx antenna element counter n and then determines whether the first Rx antenna element counter n is less than or equal to the total number of Rx antenna elements in the antenna array (step608). If not, the process proceeds to step628, as discussed below. If the first Rx antenna element counter n is less than or equal to the total number of Rx antenna elements in the antenna array, the post-processing function28gets the n-th Rx antenna element Rxnand reads the gain measurements GMTxiRxnand the phase measurements ϕMTxiRxnfor the n-th Rx antenna element Rxnfor all Tx antenna elements Txi(for i∈1 . . . NTxwhere NTxis the number of Tx antenna elements) (steps610and612). The post-processing function28increments (i.e., counts) the second Rx antenna element counter m and then determines whether the second Rx antenna element counter m is less than or equal to the total number of Rx antenna elements in the antenna array (step614). If not, the process returns to step608where the first Rx antenna element counter n is incremented and the process is repeated. If the second Rx antenna element counter m is less than or equal to the total number of Rx antenna elements in the antenna array, the post-processing function28gets the m-th Rx antenna element Rxmand reads the gain measurements GMTxiRxmand the phase measurements ϕMTxiRxmfor the m-th Rx antenna element Rxmfor all Tx antenna elements Txi(for i∈1 . . . NTxwhere NTxis the number of Tx antenna elements) (steps616and618). The post-processing function28then finds, or determines, one or more pairs of Tx antenna elements Txiand Txk, but preferably multiple pairs of Tx antenna elements Txiand Txk, having symmetrical coupling properties with respect to the pair of Rx antenna elements Rxnand Rxm, as discussed above (step620). As discussed above, for Rx calibration, the pairs(s) of Tx antenna elements Txiand Txkhaving symmetrical coupling properties are those Tx antenna pairs for which one or both of the following coupling scenarios are satisfied:CTxiRxn→CTxiRxmand CTxkRxn→CTxkRxm(referred to as coupling scenario (3) above)CTxiRxn→CTxkRxmand CTxiRxm→CTxkRxn(referred to as coupling scenario (4) above). As discussed above, for each determined pair of Tx antenna elements Txiand Txk, the post-processing function28computes:relative gain value ΔGRxnRxm(3) in accordance with Equation (16) above and/or relative gain value ΔGRxnRxm(4) in accordance with Equation (19) above, andrelative phase value ΔϕRxnRxm(3) in accordance with Equation (23) above and/or relative phase value ΔϕRxnRxm(4) in accordance with Equation (26) above, assuming both gain and phase Rx calibration (step622). As also discussed above, the post-processing function28performs averaging of the relative gain values and the relative phase values for the Rx antenna elements Rxnand Rxmacross all of the determined pairs of Tx antenna element Txiand Txk(step624). By doing so, the post-processing function28computes an average relative gainΔGRxnRxmfor the gain of Rx antenna element Rxnrelative to the gain of the Rx antenna element Rxmand an average relative phase valueΔϕRxnRxmfor phase of the Rx antenna element Rxnrelative to the Rx antenna element Rxm. The post-processing function28saves the average relative gainΔGRxnRxmand the average relative phase valueΔϕRxnRxmfor the Rx antenna element Rxnrelative to the gain of the Rx antenna element Rxm(step626). At this point, the process returns to step614where the second Rx antenna element counter m is incremented and the process is repeated. In this manner, average relative gain ΔGRxnRxmand average relative phase ΔϕRxnRxmvalues are computed for the Rx antenna element Rxnrelative to all other Rx antenna elements (i.e., for all Rxmfor m≠n). Once this is done, the process returns to step608and is repeated where the first Rx antenna element counter n is incremented and the process is repeated. In this manner, average relative gainΔGRxnRxmand average relative phaseΔϕRxnRxmvalues are computed for all Rx antenna element combinations. Once average relative gainΔGRxnRxmand average relative phaseΔϕRxnRxmvalues are computed for all Rx antenna element combinations, the post-processing function28normalizes the average relative gainΔGRxnRxmand the average relative phaseΔϕRxnRxmvalues relative to a single reference Rx antenna element (step628). Normalization results in the gain calibration values GRxnand the phase calibration values ϕRxnfor each Rx antenna element Rxn(for all n∈1 . . . NRx). FIG.8illustrates the operation of the transceiver10, and in particular the self-calibration subsystem22, to configure the gain and phase adjustment circuitry18according to some embodiments of the present disclosure. More specifically, upon computing the gain and phase calibration values as described above, the self-calibration subsystem22configures the gain and phase adjustment circuitry18to provide the corresponding gain and phase adjustments. In some embodiments, the self-calibration subsystem22configures the gain and phase adjustment circuitry18by configuring registers with values that provide the computed gain and phase calibration adjustments. However, in order to do this, the computed gain and phase values must be mapped to the corresponding register values. In this regard,FIG.8illustrates a process by which the transceiver10, and in particular the self-calibration subsystem22, maps the computed gain and phase calibration values to the corresponding register values and configures the gain and phase adjustment circuitry18with those register values. More specifically, the self-calibration subsystem22gets, or obtains, the frequency channel for which calibration is desired (step700) and determines whether a mapping of the computed gain and phase calibration values for the frequency channel to corresponding register values is available, e.g., in a LUT, in this example (step702). If available, the self-calibration subsystem22gets the register values corresponding to the computed gain and phase calibration values for the Tx and Rx antenna elements from the LUT (step704). The self-calibration subsystem22then configures the gain and phase adjustment circuitry18by, in this example, setting respective registers to the register values obtained from the LUT (step706). Returning to step702, if a mapping of the computed gain and phase calibration values for the desired frequency channel to register values is not available, the self-calibration subsystem22performs a procedure to determine the mapping between the computed gain and phase calibration values and the corresponding register values. More specifically, in step708, the self-calibration subsystem22selects any Tx element Txj, selects any Rx element Rxm, and measures ϕMTxjRxm(1)=ϕTxj(1)+ϕCTxjRxm+ϕRxm. The self-calibration subsystem22changes the phase of Tx gradually to get new measurements by changing the phase register value (when there is no prior knowledge of register delta phase relation) ϕMTxjRxm(ni)=ϕTxj(ni)+ϕCTxiRxm+ϕRxm. The self-calibration subsystem22compares ϕMTxjRxm(1)−ϕMTxjRxm(ni) to ϕTxj,REF, which is the desired phase calibration value for Txj. When ϕMTxjRxm(1)−ϕMTxjRxm(ni)==ϕTxj,REF, the self-calibration subsystem22stops changing the phase register value, gets the phase register value, and stores the phase register value (step710). In a similar manner, in step708, the self-calibration subsystem22measures GMTxjRxm(1)=GTxj(1)+GCTxjRxm+GRxm. The self-calibration subsystem22changes the gain of Tx gradually to get new measurements by changing the gain resistor value (when there is no prior knowledge of resistor delta gain relation) GMTxjRxm(ni)=GTxj(ni)+GCTxjRxm+GRxm. The self-calibration subsystem22compares GMTxjRxm(1) GMTxjRxm(ni) to GTxj,REF, which is the computed gain adjustment value for Txj. When GMTxjRxm(1)−GMTxjRxm(ni)==GTxj,REF, the self-calibration subsystem22stops changing the gain register value, gets the gain register value, and stores the gain register value (step710). The process of steps708and710is repeated to compute the gain and phase register values for each Tx and each Rx antenna element. The self-calibration subsystem22then configures the gain and phase adjustment circuitry18by, in this example, setting respective register values to the values determined in steps710and712(step708). FIG.9illustrates the analog beamforming transceiver10according to some other embodiments of the present disclosure. In this embodiment, the analog beamforming transceiver10includes a number of modules30that operate to provide self-calibration according to any one of the embodiments described herein. In this particular example, the modules30include a signal generating module30-1that operates to provide the functionality of the signal generator24as described herein, a measuring module30-2that operates to provide the functionality of the measurement function26as described herein, and a post-processing module30-3that operates to provide the functionality of the post-processing function28as described herein. Each of the modules30is implemented in software. In the embodiments above, the post-processing of gain and phase measurements is performed locally at the analog beamforming transceiver10. However, in some alternative embodiments, the post-processing of the measurements is performed remotely by some other processing system. In this regard,FIG.10illustrates a system including the transceiver10and a remote processing system32according to some other embodiments of the present disclosure. The transceiver10is the same as that described above other than the post-processing function28. In this embodiment, the post-processing function28is implemented at the remote processing system32. The remote processing system32is implemented in a combination of hardware and software. For example, the remote processing system32may include one or more processors (e.g., CPUs, DSPs, ASICs, FPGAs, and/or the like) and memory storing software executed by the processor(s) whereby the remote processing system32operates to provide the functionality of the post-processing function28as described herein. The remote processing system32includes a communication interface (e.g., a wired or wireless network interface) that communicatively couples to the transceiver10. As one example, the transceiver10may be part of a radio access node (e.g., a base station) in a cellular communications system, and the remote processing system32may be, e.g., another network node such as, e.g., a core network node in a core network of the cellular communications system. FIG.11is a flow chart that illustrates the operation of the remote processing system32and, in particular, the post-processing function28ofFIG.10according to some embodiments of the present disclosure. In general, when implemented at the remote processing system32, the post-processing function28operates in the same manner as described above other than having to obtain the gain and phase measurements from the transceiver10via a remote connection and returning the gain and phase calibration values to the transceiver via the remote connection. More specifically, as illustrated inFIG.11, the remote processing system32, and in particular the post-processing function28implemented at the remote processing system32, obtains pair-by-pair gain and phase measurements for all pairs of Tx and Rx antenna elements in the antenna array formed by the one or more AASs20at the transceiver10and stores the resulting measurements (step800A). In other words, for each pair of Tx and Rx antenna elements Txiand Rx1where l=1 . . . NTXand j=1 . . . NRXand NTXis the number of Tx antenna elements in the antenna array and NRXis the number of Rx antenna elements in the antenna array, the post-processing function28obtains a gain measurement (GMTxiRxj) and a phase measurement (ϕMTxiRxj) from the transceiver10. As discussed above, these gain and phase measurements are performed by the measurement function26at the transceiver10. The details of how the gain and phase measurements GMTxiRxjand ϕMTxiRxjare performed by the measurement function26are provided above with respect toFIG.4. The post-processing function28performs post-processing of the gain and phase measurements GMTxiRxjand ϕMTxiRxjfor all i and j to compute gain and phase calibration values for the Tx and Rx antenna elements of the antenna array (step800B), as described above. The details of step800B are provided above with respect toFIGS.5A and5BandFIGS.7A and7B. In general, the post-processing function28computes the gain and phase calibration values based on the gain and phase measurements GMTxiRxjand ϕMTxiRxjand combinations of Tx and Rx antenna elements having symmetrical coupling properties. The combinations of Tx and Rx antenna elements having symmetrical coupling properties are, e.g., predefined or predetermined based on, e.g., a known layout of the antenna elements in the antenna array or computed by the post-processing function28based on, e.g., a known layout of the antenna elements in the antenna array. The post-processing function28provides the computed gain and phase calibration values to the transceiver10(step802), where the computed gain and phase calibration values are applied at the transceiver10as described above. As discussed above, in addition or alternatively, the post-processing function28may compute a coupling matrix and provide the coupling matrix to the transceiver10. The following acronyms are used throughout this disclosure. 3GThird Generation3GPPThird Generation Partnership Project5GFifth GenerationAASAdvanced Antenna SystemASICApplication Specific Integrated CircuitCPUCentral Processing UnitdBDecibelDSPDigital Signal ProcessorFPGAField Programmable Gate ArrayLTELong Term EvolutionLUTLook Up TableNRNew RadioRFICRadio Frequency Integrated CircuitRxReceiveTDDTime Division DuplexingTxTransmitUEUser Equipment Those skilled in the art will recognize improvements and modifications to the embodiments of the present disclosure. All such improvements and modifications are considered within the scope of the concepts disclosed herein. | 68,208 |
11942695 | DETAILED DESCRIPTION The present disclosure now will be described more fully hereinafter with reference to the accompanying drawings, in which various exemplary implementations are shown. The invention may, however, be embodied in many different forms and should not be construed as limited to the exemplary implementations set forth herein. These example implementations are just that—examples—and many implementations and variations are possible that do not require the details provided herein. It should also be emphasized that the disclosure provides details of alternative examples, but such listing of alternatives is not exhaustive. Furthermore, any consistency of detail between various examples should not be interpreted as requiring such detail—it is impractical to list every possible variation for every feature described herein. The language of the claims should be referenced in determining the requirements of the invention. An apparatus comprising a digital processor, such as an FPGA (field-programmable gate array), phase modulators, a laser, an optical processor, electronic conditioning circuitry, and synchronization circuitry may be utilized to coherently align the phases of multiple optical channels. Coherent phase alignment of optical channels proves to be a challenge due to the nature of minor environmental acoustic and thermal perturbations in fiber optic cables inducing a phase change in the optical signal carried by the cable. An apparatus may provide a way to compensate for those environmental acoustic and thermal perturbations. In U.S. Patent Pub. No. 2012/0014699, published on Jan. 12, 2012, an example method is disclosed wherein an FPGA is used to determine phase errors and compensation values for each respective optical channel. As illustrated inFIG.1A, which represents a conventional system and method, output101of an optical source101ais split into two paths, one path referred to as the reference path102, and the other referred to as the carrier path103. The reference path is phase modulated by reference phase modulator104using a periodic right-triangle (sawtooth) voltage function105a, as shown for example in FIG. 2 of U.S. Patent Pub. No. 2012/0014699 or in the top panel ofFIG.1C. The modulating function is generated by the synchronizer105, which may be a synchronizer circuit. Synchronizer105is controlled by the FPGA116. That is, the FPGA will send a control signal (shown by the arrow105c) to the synchronizer105to cause the synchronizer to transmit the voltage function105ato the reference phase modulator104. Thus, the system ofFIG.1Ais set up to only allow for using one FPGA, which limits the system capabilities. The carrier path is further split as in106and propagated into multiple phase modulators107. Each phase modulator may heterodyne the carrier signal with an RF signal to encode data into the optical domain. The phase-modulator outputs108, and the modulated reference signal109are recombined in an optical processor110to create combined optical signals111, each combined optical signal corresponding to a phase modulator of107. The combined optical signals111are each an optical waveform that is synthesized through interference between the output109of the reference phase modulator104and the outputs108of the phase modulators107. Each combined optical signal111may be described as an interference signal. The combined optical signals111are then converted into electrical currents113by photodiodes of the photodiode array112such that each phase modulator has a corresponding electrical current that carries optical phase information in the form of the phase of the sinusoidally varying photocurrent. Examples of these signals can be seen in U.S. Patent Pub. No. 2012/0014699, FIGS. 3A-3E, and FIG. 4, top sinusoidal signal. For example, in U.S. Patent Pub. No. 2012/0014699, FIG. 3A shows an example sawtooth voltage function, FIG. 3B shows an example modulated reference signal109, FIG. 3C shows an example phase-modulator output108,FIG.3Dshows a combined signal (combining modulated reference signal109with a phase-modulator output108), andFIG.3Eshows just the interference pattern resulting from the combined signal (e.g., a sinusoidal signal). FIGS. 3A-3E of U.S. Patent Pub. No. 2012/0014699 are optical signals. The electrical signals, or electrical currents113are conditioned, or converted in conditioning circuitry114using transimpedance amplifiers and comparators (e.g., as depicted in FIG. 5 of U.S. Patent Pub. No. 2012/0014699) to yield conditioned waveforms115such that the photocurrent is converted to a voltage, and inflection points are converted to rising and falling edges of a square wave pattern, which can be considered a digital signal, converted from analog. For example, in FIG. 4 of U.S. Patent Pub. No. 2012/0014699, the lower square wave depicts an electrical signal, after being converted by photodiode array112, for example, from the optical signals input to photodiode array112, and being further processed by conditioning circuitry114. Embodiments of this conditioning circuitry may entail those listed in U.S. Patent Pub. No. 2012/0014699. An example conditioning process is illustrated inFIG.1B, where the left panel represents the photocurrent at the output of a photodiode113, the middle panel represents the voltage at the output of a transimpedance amplifier, and the right panel represents the output of a comparator. Equivalently, the comparator may be thought of as converting the continuous sine wave to a discretized, two-level waveform, and other embodiments of this invention may use a 1-bit analog-to-digital converter (ADC). By virtue of having discretized outputs, a digital processor such as an FPGA116can now sample the data and interpret the inflection points as a change of state from a “zero” to a “one” on the rising-edge inflection points, or vice-versa for the falling inflection points. The timing of the rising/falling edges is then correlated in the FPGA with a global counter associated with a data-sampling clock, and the counter resets for every cycle at the falling edge132of the sawtooth function driving the reference phase modulator104, as illustrated inFIG.1C, where the Ref. Sawtooth represents the synchronizer output105adriving the reference phase modulator104, the Counter Reset133represents the start of a new periodic cycle of the sawtooth, the Comparator Output134represents a conditioned waveform115from the combination of the reference and an individual carrier channel, the Global Counter135illustrates digital clock cycles to measure the timing of the inflection points of the Comparator Output134, the Offset1136and Offset2137variables correspond to latched values of Global Counter, and Edge Type138corresponds to whether the Comparator Output134had an initial rising or falling edge. By virtue of resetting the phase counter with every cycle of the sawtooth, the phase error and compensation values of each carrier channel of the array can be extracted in a way that is analogous to that explained in U.S. Patent Pub. No. 2012/0014699 and corrected for with an error voltage adjustment in the carriers' phase modulators107. This error voltage is obtained by pipelining a calculation between the global phase counter and the inflection points of each carrier channel input115into the FPGA, whose calculation data path is illustrated inFIG.1D. An FPGA implements this calculation data path. For example, as shown inFIGS.1C and1D, the average between Offset2137and Offset1136is taken, and a 180 degree phase shift is either added or is not added, depending on the Edge Type138. The Edge Type138is determined by whether Comparator Output134had an initial rising edge or an initial falling edge. The resultant value of the addition, or lack thereof, is compared to a setpoint and proportionally multiplied to calculate an appropriate error voltage117per channel. This error voltage may be shifted by an equivalent error voltage resulting in a 360 degree phase shift either in the positive or negative direction in order to remain within the same range, or ranges to maintain the error voltages117within 360 degrees of range, or any integer multiple of 360 degrees, depending on the supply voltage of the error voltage applied to the phase modulator.FIG.2illustrates the digital calculation data path of the discretized channel input. Conditioning circuitry114feeds a phase detector that calculates the Offset1136and Offset2137values ofFIG.1C, a bias calculation block203, whose function is illustrated inFIG.1D, and a parallel DAC output204that drives a digital state machine for high-speed control of multiple voltage-output DACs205to supply a bias based on the calculated compensation values to each individual phase modulator for fine-grain phase control. More generally, if the start (e.g., falling edge) of the sawtooth is synchronized with the counter reset pulse, and the global counter is counting an amount of time between the counter reset and the time at which the comparator output signal changes from 0 to 1 and from 1 to 0, then a point of maximum and minimum interference in the signals111can be determined, and so a phase shift needed to make the reference signal in reference path102and the signal106going into each phase modulator107be in phase with other, and to make the reference signal in reference path102and the signal108coming out of each phase modulator107be in phase with each other or have a pre-set phase relationship with or phase difference from each other that remains constant over time, can be determined. Accordingly, the voltage-output DACs provide error voltages117, shown inFIG.1A, that bias phase modulators107to adjust the phase of signals108output from phase modulators107. Further details of this calculation and data path according to some examples are disclosed in U.S. Patent Pub. No. 2012/0014699 and may be used to implement aspects of the present invention. With the stated description of the prior art, an embodiment of this invention is now presented such that the phases of each optical phase modulator can be controlled in real-time such that their phase errors can be locked or discretely phase shifted and then locked to realize a known phase offset of each optical channel with respect to a sawtooth voltage function. This optical phase lock is implemented with a closed-loop optoelectronic network including a plurality of digital processors, such as FPGAs, all controlled by a separate digital processor, described as a synchronization controller. The synchronization controller acts independently and is not under the control of an FPGA such as FPGA116ofFIG.1A. Contrary to the conventional art where a digital processor controls its own timing as well as the timing of a synchronizer, the synchronization controller according to embodiments of the present invention sends control signals to a plurality of digital processors, to control those digital processors simultaneously. Further details are described in connection withFIG.3and later figures, as discussed below. FIG.3illustrates a schematic overview of a system for synchronizing phase of multiple optical signals, according to an example embodiment. As illustrated inFIG.3, a system300includes an optical source301a, a splitter301b, a plurality of phase modulators307organized in phase modulator groups307(1)-307(N), a reference phase modulator304, a synchronization controller305, an optical processor310, a conversion circuit312, and a plurality of digital processors316(1)-316(N). As is traditional in the field of the disclosed technology, features and embodiments are described, and illustrated in the drawings, in terms of functional blocks, units and/or modules. Those skilled in the art will appreciate that these blocks, units and/or modules are physically implemented by electronic (or optical) circuits such as logic circuits, discrete components, microprocessors, hard-wired circuits, memory elements, wiring connections, and the like, which may be formed using semiconductor-based fabrication techniques or other manufacturing technologies. In the case of the blocks, units and/or modules being implemented by microprocessors or similar, they may be programmed using software (e.g., microcode) to perform various functions discussed herein and may optionally be driven by firmware and/or software. Alternatively, each block, unit and/or module may be implemented by dedicated hardware, or as a combination of dedicated hardware to perform some functions and a processor (e.g., one or more programmed microprocessors and associated circuitry) to perform other functions. Also, each block, unit and/or module of the embodiments may be physically separated into two or more interacting and discrete blocks, units and/or modules without departing from the scope of the inventive concepts. Further, the blocks, units and/or modules of the embodiments may be physically combined into more complex blocks, units and/or modules without departing from the scope of the inventive concepts. The optical source301amay be, for example, a laser or another light source, which may output an optical source signal301, which may be a laser light, or other light having a particular frequency. The splitter301bmay be any known optical splitter (e.g., a partially reflective glass, a glass prism or cube, or a fiber splitter, or a fiber directional coupler, etc.), connected and configured to split the optical source signal301into multiple signals. For example, one signal output from the splitter301bis a reference signal302, and another signal output from the splitter301bis a carrier signal303. Reference signal302may be input to a reference phase modulator304. Carrier signal303may be further split into a plurality of signals306, which may be input into phase modulators307. The combination of splitter301band additional splitters for forming a plurality of carrier signals input into the phase modulators307may be described together as a splitter, which splits the optical source signal301into a plurality of signals306including a plurality of phase modulator input signals including the carrier signal, each of which may be described as a carrier signal, and a reference signal. The carrier signals and the reference signal may be synchronized to initially have the same frequency and phase. Reference phase modulator304is connected to receive reference signal302from optical source301aas well as a signal305afrom synchronization controller305, and to output a modulated reference signal309. For example, the signal305amay be a voltage function, which may have a periodic pattern, such as a sawtooth pattern such as discussed previously in connection withFIG.1C. The voltage function may represent phase versus time. In operation, reference phase modulator304receives a voltage function305aand reference signal302, and modulates the reference signal using the voltage function, as discussed for example, in connection withFIG.1C. The modulated reference signal309is transmitted to an optical processor310. For example, the voltage function305amay be a signal that causes the phase of the modulated reference signal, to linearly vary by a particular amount (e.g., 1 degree) over time (e.g., at each clock cycle or step of the voltage function). Therefore, at a first time, the phase of the modulated reference signal309, which initially has the same frequency as the reference signal302and the carrier signal303, may be shifted by one degree in phase in a particular direction, at a second time, the phase of the modulated reference signal309may be shifted by two degrees in phase in the same direction, etc. Synchronization controller305is connected to transmit the signal305a(e.g., a voltage function) to reference phase modulator304and is connected to transmit a signal305bto a plurality of digital processors316(1)-316(N). The signal305bmay be, for example, a voltage function start indicator signal, that includes, for example, a pulse that indicates the start of the voltage function being transmitted as signal305ato the reference phase modulator. The start may be, for example, a value that causes the phase of the modulated reference signal309to be shifted 0 degrees with respect to the reference signal302. The voltage function start indicator signal may be described as a heartbeat signal, or a periodic pulse signal. Different from prior art systems such as discussed previously, the heartbeat signal305bis transmitted from synchronization controller305to the digital processors316(1)-316(N). The heartbeat signal305bmay therefore control the digital processors316(1)-316(N) in a manner to be described in more detail below. The heartbeat signal305bmay be a similar signal to that described in connection withFIG.1C(signal133) above, and may be a counter reset signal that resets a counter that begins counting at the beginning of a cycle of the voltage function305a. Synchronization controller305may be, for example, a digital processor such as an FPGA. The heartbeat signal305bmay be transmitted simultaneously and synchronously to each digital processor316. Phase modulators307may be organized into groups, such as a first group307(1), a second group307(2), and additional groups up to an Nth group307(N). In some embodiments, N may be an integer having a value from 2 to 16. However, N is not limited as such, and may be greater than 16 (e.g., 32, 64, or higher). In one embodiment, each phase modulator group307(1)-307(N) includes 64 phase modulators, and each phase modulator is connected to receive a carrier signal as an input and outputs a signal308described as a phase modulator output signal or phase modulator output, or alternatively described as an optical input signal. Phase modulator output signals308may be grouped into groups308(1)-308(N), which correspond to the phase modulator groups307(1)-307(N). Each phase modulator307may receive as input a carrier signal and an information signal (not shown), and converts the information signal to the optical domain using the carrier signal. For example, the information signal may be an RF signal, or other signal. As an example, each phase modulator307may heterodyne the carrier signal306with an RF signal or other information signal to encode data into the optical domain. Each phase modulator307may be configured to perform phase adjustment of the carrier signal and modulation of the information signal using the phase-adjusted carrier signal. Each information signal may include, for example, a plurality of bits of information, encoded in the RF or other domain, or may be an analog signal having information encoded therein. Each phase modulator307may also receive a respective adjustment signal317. The adjustment signals317may similarly be organized into a plurality of groups317(1)-317(N). Each adjustment signal317may be used along with a respective information signal and carrier signal to output a phase modulator output signal308. The adjustment signals are output from the digital processors316(1)-316(N), and are described in greater detail below. Optical processor310is connected to receive the modulated reference signal309and the phase modulator output signals308, and is configured to, for each phase modulator output signal308, combine the phase modulator output signal308with the modulated reference signal309. For each phase modulator output signal308combined with the modulated reference signal309, a respective interference signal311is generated. The interference signal311reflects whether the modulated reference signal309is in phase with the respective phase modulator output signal308, and may be a periodic signal (e.g., sine wave) having the same frequency as the frequency of a sawtooth voltage function. For example, the magnitude of the interference signal311may change for each degree of variation in the voltage function305a, to have the same frequency as the voltage function305a. An example of this can be seen in FIG. 3E of U.S. Patent Pub. No. 2012/0014699. Each phase modulator output signal308input to optical processor310(e.g., optical input signal) may therefore have a corresponding respective interference signal311output from the optical processor310(e.g., optical output signal). The interference signals may vary depending on differences in the phase of the different phase modulator output signals308. The phase differences may be pre-set by a predetermined offset for some phase modulators307, but may additionally include a component due to environmental factors that is not intended. The phase of the phase modulator output signals308can be further adjusted by phase modulators307, as will be described below. Conversion circuit312is connected to receive the interference signals311, which in one embodiment are analog optical signals, and convert each interference signal311to the digital electrical domain. For example, conversion circuit312may include a plurality of photodiodes formed in a photodiode array, and may include one or more comparators. For example, conversion circuit312may include components such as depicted in FIG. 5 of U.S. Patent Pub. No. 2012/0014699. As a result of the optical-to-electrical conversion, and analog-to-digital conversion, in one embodiment, for each interference signal, a square wave is generated, which has rising and falling edges that correspond to zero crossings of the interference signal. This signal is then output from the conversion circuit312and is input to a digital processor316. This is only one example, however. The rising and falling edges need not correspond to the zero crossing if a different type of circuit is used to convert from analog to digital. For example, another circuit could be used that causes the rising and falling edges of the square wave to correspond to a peak and valley of the interference signal. As shown inFIG.3, the conversion circuit312can receive interference signals from the optical processor310as N groups of interference signals311(1)-311(N), and can respectively output converted signals as N groups of converted signals (e.g., resulting digital signals)315(1)-315(N). Each group of converted signals can then be input into a single respective digital processor316from among digital processors316(1)-316(N). Digital processors316may be, for example FPGAs, where each FPGA is connected to receive a group of converted signals315from groups315(1)-315(N) and to output a group of adjustment signals317from adjustment signal groups317(1)-317(N). However, digital processors316can be other types of processors, such as complex programmable logic devices (CPLDs), digital signal processors (DSPs), or application-specific integrated circuits (ASICs). A method is now disclosed such that multiple digital processors, such as FPGAs, may be operated in parallel to overcome the limitations of a single electronic system. This method is illustrated inFIG.3, where compared toFIG.1, a photodiode array112and conditioning circuitry114is replaced is with a conversion circuit312, which may be a photodiode array and breakout module, which distributes a group of photocurrents (e.g., digital signals that correspond to outputs from optical processor310) to each individual digital processor (e.g., FPGA module). Each digital processor316is now responsible for its own subset, or group, of phase modulators307. In one embodiment, each group of phase modulators307may include 64 phase modulators. The synchronization controller305is now utilized to generate a reference heartbeat304to be distributed and delay-matched to each digital processor316for synchronicity. Each digital processor316now implements its own closed control loop algorithm similar to the one illustrated inFIG.2. As discussed previously, a plurality of adjustment signals317may be sent from each digital processor316to each group of phase modulators307(1)-307(N), and each phase modulator307can use the received adjustment signal317to shift the phase of the output signal to result in a phase modulator output signal308. Thus, each phase modulator307includes a circuit configured to change the phase of the output signal308by an amount corresponding to the adjustment signal317. Each phase modulator307may initially be set, for example by a digital processor316, so that the phase modulator output signal308has a pre-set phase relationship to the initial carrier signal303. For example, the pre-set phase relationship could be that the two signals are in phase, or can be that the two signals have a predetermined phase difference between them, described as a predetermined offset. In some applications, the plurality of digital processors316can be configured to cause the plurality of phase modulator output signals308to have pre-set phase relationships with respect to each other that may not be in phase (e.g., a blazed phase profile, or a parabolic phase profile). The adjustment signal317can be set by the digital processors to result in this phase profile for the phase modulators307. Each adjustment signal may be, for example, a voltage that biases the phase modulator307to adjust the phase of the signal being output. The adjustment signals317may be generated by the digital processors316, for example, using hardware and/or software that calculates a voltage according to an equation such as shown and discussed in connection withFIG.1D, where offsets1and2, a global counter and edge type information, and a setpoint (Set[n]) are used as inputs, and a control signal (e.g., adjustment signal317, which may be a voltage value) is output. The adjustment signal317may therefore be based on both a set point, which for each phase modulator307may correspond to a pre-set phase relationship between the carrier signal303and the phase modulator output signal308, and offsets that may result from environmental factors. In one embodiment, the plurality of digital processors316are configured to repeat the process of outputting the adjustment signals317over time, in order to control the phase of the respective phase modulator outputs308(1)-308(N) so that the plurality of phase modulator outputs are in phase with each other or so that relative phase offsets between different phase modulator outputs are maintained to be the same, and thus remain stable, over time. This can lock the phase relationship between the phase modulator outputs over time, and allows for predictable processing of the plurality of phase modulator outputs, even while environmental factors may be changing over time. According to some embodiments described herein, a digital processor may calculate a compensational voltage to shift the phase of each phase modulator of a plurality of phase modulators independently. A plurality of digital processors may be used to shift the phase of a plurality of groups of phase modulators, and the plurality of digital processors may be controlled by a single controller. This may happen in real-time to create a “phase-lock”, as well as tune individual phase modulators to a specific phase to remain locked in a predetermined relationship with other phase modulators. A unit module according to some embodiments is shown inFIG.4. The individual unit module, allows for sampling and synchronizing the phases of 64 individual optical channels using a single FPGA, pictured inFIG.5. The phase-control functionality of a 64-channel unit module of this apparatus can be expanded into multiple unit modules316, as illustrated inFIG.3, where modules are denoted as FPGA (1) to FPGA (N). By increasing the number of optical carriers and the width of the reference source109, one may scale to as many channels as can be optically processed. A photodiode array should be capable of converting as many channels as an optical processor can provide into electrical currents, at which point the system size is limited only by the circuit board footprint limit, and the limit of optical-component sizes. Given that one may make a PCB as large as 3×3 ft in a standard fabrication order or by combining multiple PCBs, a PCB may create a very large footprint for a photodiode array, potentially capable of supporting many thousands of channels. Given that free-space optics can be made as large as one may like, limitations on the optical processing channel count are removed. By having a single lightweight master microcontroller, which may be a digital processor such as an FPGA module, generate and control the sawtooth and a global phase “counter reset” pulse to all other digital processors, which may also be FPGA modules, which FPGA modules are sampling and correcting channels, one may use as many 64-channel modules as needed to sample, correct, and control all the optical phases. Synchronous application of the phase counter reset results in a ubiquitous, modular approach, where each FPGA module only knows its own realm of 64 channels and the system can be scaled to an unlimited number of channels. A scaled implementation having 384 channels according to one embodiment is now described. According to one embodiment of this invention, to control the optical phases of 384 different channels, the system was implemented with 6 Analog-to-Digital Phase Error Correction (APEC) tiles.FIG.6shows a “motherboard” (e.g., a printed circuit board) with a single APEC tile to its right. Arrow60shows how the APEC tile connects to the “motherboard.” Each APEC tile consists of an iWave G28M System-on-Module as a digital processor, an entry point for photocurrents or a photodiode array, and photocurrent conditioning circuitry (e.g., conversion circuitry), and a means of applying phase error correction signals to Digital-to-Analog converters for phase modulator interfacing.FIG.7demonstrates an APEC tile702fitted into said motherboard701. The motherboard provides a structure that “fans-out” the input channels into groups of 64, for each APEC tile to individually process.FIG.8illustrates a fully integrated 6-APEC Tile array to ultimately process 384 optical channels. Each APEC tile feeds its processed values to a phase distribution board over a data cable, as shown inFIG.4. This board will then apply those error voltages into phase modulators to individually lock and control the phases of every optical channel fed to the motherboard. The motherboard may include the synchronization controller mounted thereon, separately from the APEC Tiles, such as a digital processor. In one embodiment, the synchronization controller is mounted on the backside of the motherboard (not seen inFIGS.6-8). This system theoretically has an ability to control an unlimited number of optical channels using a low-cost, low-SWAP (Size, Weight, and Power) implementation. The method described here has been proven to work for as many channels as one can supply to the APEC tiles. For example, 64*N input channels may be processed, where N is the number of APEC tiles. This invention may be used to synchronize phases both within a system and external to the system. The synchronized “counter reset” pulse may be distributed to as many APEC tiles, or systems, as one may need. Multiple systems can be synchronized to one effective heartbeat, resulting in widespread synchronicity. Terms such as “the same” or phrases such as “maintained to be the same” are intended to include minor variations that do not otherwise affect the operation of the system. The term “substantial” or “substantially” may be used to reflect this meaning. The following publications also are incorporated by reference in their entirety and provide details of systems and methods in which this invention may also be implemented:Dillon, Thomas E., et al. “Passive millimeter wave imaging using a distributed aperture and optical upconversion.” Millimetre Wave and Terahertz Sensors and Technology III. Vol. 7837. International Society for Optics and Photonics, 2010.C. A. Schuetz, J. Murakowski, G. J. Schneider and D. W. Prather, “Radiometric Millimeter-wave detection via optical upconversion and carrier suppression,” in IEEE Transactions on Microwave Theory and Techniques, vol. 53, no. 5, pp. 1732-1738, May 2005, doi: 10.1109/TMTT.2005.847106. | 32,191 |
11942696 | It should be noted that the foregoing figures and the elements depicted therein are not necessarily drawn to consistent scale or to any scale. Unless the context otherwise suggests, like elements are indicated by like numerals. The drawings are primarily for illustrative purposes and are not intended to limit the scope of the inventive subject matter described herein. DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS Definitions. As used in this description and the accompanying claims, the following terms shall have the meanings indicated, unless the context otherwise requires: A “set” includes one or more members. A “beam forming element” (sometimes referred to simply as an “element” or “radiating element”) is an element that is used to transmit and/or receive a signal for beam forming. Different types of beam forming elements can be used for different beam forming applications. For example, the beam forming elements may be radio frequency (RF) antennas for RF applications (e.g., radar, wireless communication system such as applications, satellite communications, etc.), ultrasonic transducers for ultrasound applications, optical transducers for optical applications, microphones and/or speakers for audio applications, etc. Typically, the signal provided to or from each beam forming element is independently adjustable, e.g., as to gain/amplitude and phase. A “beam-formed signal” is a signal produced by or from a plurality of beam forming elements. In the context of the present invention, there is no requirement that a beam-formed signal have any particular characteristics such as directionality or coherency. A “phased array system” is a system that includes a plurality of beam forming elements and related control logic for producing and adapting beam-formed signals. A phased array system may be referred to herein as a “phased array antenna” or “active electronically steered antenna” or simply as a “phased array.” For convenience, the term “beam forming” is sometimes abbreviated herein as “BF.” Various embodiments are described herein in the context of active electronically steered antenna (AESA) systems also called Active Antenna, although the present invention is in no way limited to AESA systems. AESA systems form electronically steerable beams that can be used for a wide variety of applications. Although certain details of various embodiments of an AESA system are discussed below, those skilled in the art can apply some embodiments to other AESA systems. Accordingly, discussion of an AESA system does not necessarily limit certain other embodiments. FIG.1schematically shows an active electronically steered antenna system (“AESA system10”) configured in accordance with certain illustrative embodiments of the invention and communicating with an orbiting satellite12. A phased array (discussed in more detail below and referenced as phased array10A) implements the primary functionality of the AESA system10. Specifically, as known by those skilled in the art, the phased array forms one or more of a plurality of electronically steerable beams that can be used for a wide variety of applications. As a satellite communication system, for example, the AESA system10, preferably is configured operate at one or more satellite frequencies. Among others, those frequencies may include the Ka-band, Ku-band, and/or X-band. Of course, as satellite communication technology progresses, future implementations may modify the frequency bands to communicate using new satellite frequencies. FIG.2schematically shows an AESA system10configured in accordance with certain illustrative embodiments of the invention and implemented as a radar system in which a beam-formed signal may be directed toward an aircraft or other object in the sky (e.g., to detect or track position of the object). FIG.3schematically shows an AESA system10configured in accordance with certain illustrative embodiments of the invention and implemented as a wireless communication system (e.g., 5G) in which a beam-formed signal may be directed toward a particular user (e.g., to increase the effective transmit range of the AESA system or to allow for greater frequency reuse across adjacent or nearby cells). Of course, other implementations may include other types of wireless communication systems. Of course, those skilled in the art use AESA systems10and other phased array systems in a wide variety of other applications, such as RF communication, optics, sonar, ultrasound, etc. Accordingly, discussion of satellite, radar, and wireless communication systems are not intended to limit all embodiments of the invention. The satellite communication system may be part of a cellular network operating under a known cellular protocol, such as the 3G, 4G (e.g., LTE), or 5G protocols. Accordingly, in addition to communicating with satellites, the system may communicate with earth-bound devices, such as smartphones or other mobile devices, using any of the 3G, 4G, or 5G protocols. As another example, the satellite communication system may transmit/receive information between aircraft and air traffic control systems. Of course, those skilled in the art may use the AESA system10in a wide variety of other applications, such as broadcasting, optics, radar, etc. Some embodiments may be configured for non-satellite communications and instead communicate with other devices, such as smartphones (e.g., using 4G or 5G protocols). Accordingly, discussion of communication with orbiting satellites12is not intended to limit all embodiments of the invention. The AESA system10typically includes a number of integrated circuits for generating transmit signals and/or processing receive signals. For convenience, such integrated circuits used in RF applications may be referred to herein generally as RFICs. In certain exemplary embodiments, the AESA system10includes X beam forming RF integrated circuits (BFICs), with each BFIC supporting Y beam forming elements (e.g., 2 or 4 beam forming elements per BFIC, although not limited to 2 or 4). Thus, such a phased array generally includes (X*Y) beam forming elements. FIG.4is a schematic diagram showing a plan view of a portion10A of an AESA system10in which each beam forming integrated circuit14(labeled “BFIC” or “B”) is connected to four beam forming elements18, in accordance with illustrative embodiments of the invention. Each BFIC14aggregates signals to/from its connected beam forming elements18as part of a common beam forming signal25. In certain exemplary embodiments, the beam forming elements18may be implemented as patch antennas that are formed on one side of a laminar printed circuit board, although it should be noted that the present invention is not limited to patch antennas or to a laminar printed circuit board. Preferably, the AESA system10A ofFIG.4is implemented as a laminar phased array having a laminated printed circuit board16acting as the substrate supporting the above noted plurality of beam forming elements18and beam forming integrated circuits14. The elements18preferably are formed as a plurality of square or rectangular patch antennas oriented in a patch array configuration with the beam forming elements18that are physically or logically arranged in rows and columns (e.g., the element in row 0 column 0 is labeled El_00, the element in row 0 column 1 is labeled El_01, etc.), and this type of arrangement will be used below as a frame of reference in discussing various exemplary embodiments. However, it should be noted that other embodiments may use other patch configurations, such as a triangular configuration in which each integrated circuit is connected to three elements18, a pentagonal configuration in which each integrated circuit is connected to five elements18, or a hexagonal configuration in which each integrated circuit is connected to six elements18. Like other similar phased arrays, the printed circuit board16also may have a ground plane (not shown) that electrically and magnetically cooperates with the elements18to facilitate operation. In exemplary embodiments, the BFICs are mounted to a back side of the printed circuit board opposite the side containing the patch antennas (e.g., with through-PCB vias and traces that connect to the elements18, with such connections typically made using impedance controlled lines and transitions), although in alternative embodiments, the BFICs may be mounted to the same side of the printed circuit board as the patch antennas. As a patch array, the elements18have a low profile. Specifically, as known by those skilled in the art, a patch antenna (i.e., the element18) typically is mounted on a flat surface and includes a flat rectangular sheet of metal (known as the patch and noted above) mounted over a larger sheet of metal known as a “ground plane.” A dielectric layer between the two metal regions electrically isolates the two sheets to prevent direct conduction. When energized, the patch and ground plane together produce a radiating electric field. Illustrative embodiments may form the patch antennas using conventional semiconductor fabrication processes, such as by depositing one or more successive metal layers on the printed circuit board16. Accordingly, using such fabrication processes, each element18in the phased array10A should have a very low profile. It should be noted that embodiments of the present invention are not limited to rectangular-shaped elements18but instead any appropriate shape such as circular patches, ring resonator patches, or other shape patches may be used in other particular embodiments. The phased array10A can be configured for transmit-only, receive-only, or dual-mode (i.e., transmit and receive) operation. In a dual mode configuration, the phased array10A generally will be in either a transmit mode or a receive mode at any given time, although technically it may be possible to have different portions of the phased array10A operating in different modes at the same time. The AESA system10has a plurality of the above noted beam forming integrated circuits14for controlling operation of the elements18. Those skilled in the art sometimes refer to these integrated circuits14as “beam steering integrated circuits.” Each integrated circuit14preferably is configured with at least the minimum number of functions to accomplish the desired effect. Indeed, integrated circuits14for dual mode (transmit and receive) elements18are expected to have some different functionality than that of the integrated circuits14for transmit-only operation or receive-only operation. Accordingly, integrated circuits14for such non-dual-mode elements18may have a smaller footprint than the integrated circuits14that control the dual-mode elements18. Despite that, some or all types of integrated circuits14fabricated for the phased array10A can be modified to have a smaller footprint. As an example, depending on its role in the phased array10A, each integrated circuit14may include some or all of the following functions:phase shifting,amplitude controlling/beam weighting,switching between transmit mode and receive mode,output amplification to amplify output signals to the elements18,input amplification for received RF signals (e.g., signals received from the satellite12), andpower combining/summing and splitting between elements18. Indeed, some embodiments of the integrated circuits14may have additional or different functionality, although illustrative embodiments are expected to operate satisfactorily with the above noted functions. Those skilled in the art can configure the integrated circuits14in any of a wide variety of manners to perform those functions. For example, the input amplification may be performed by a low noise amplifier, the phase shifting may use conventional active phase shifters, and the switching functionality may be implemented using conventional transistor-based switches. Additional details of the structure and functionality of integrated circuits14are discussed below. In illustrative embodiments, each integrated circuit14supports multiple elements18, thus reducing the required total number of integrated circuits14in a given AESA system10. This reduced number of integrated circuits14correspondingly reduces the cost of the AESA system10. In addition, more surface area on the printed circuit board16may be dedicated to the elements18and/or to other components. To that end, each integrated circuit14preferably operates on at least one element18in the array and typically operates on a plurality of elements18. For example, as discussed above, one integrated circuit14can operate on two, three, four, five, six, or more different elements18. Of course, those skilled in the art can adjust the number of elements18sharing an integrated circuit14based upon the application. For example, a single integrated circuit14can control two elements18, three elements18, four elements18, five elements18, six elements18, seven elements18, eight elements18, etc., or some range of elements18. Sharing the integrated circuits14between multiple elements18in this manner reduces the required total number of integrated circuits14, which can correspondingly reduce the required size of the printed circuit board16and cost of the system. As noted above, in certain embodiments, the phased array10A may alternately and selectively operate in a transmit mode or a receive mode. To that end, the integrated circuits14may generate time division diplex or duplex waveforms so that a single aperture or phased array10A can be used for both transmitting and receiving. In a similar manner, some embodiments may eliminate a commonly included transmit/receive switch in the side arms of the integrated circuit14. Instead, such embodiments may duplex at the elements18. This process can be performed by isolating one of the elements18between transmit and receive by an orthogonal feed connection. Such a feed connection may eliminate about a 0.8 dB switch loss and improve G/T (i.e., the ratio of the gain or directivity to the noise temperature) by about 1.3 dB for some implementations. Generally speaking, RF interconnect and/or beam forming lines (not shown inFIG.4) electrically connect each integrated circuit14to its respective elements18. Illustrative embodiments mount the integrated circuits14as close to their respective elements18as possible in order to reduce or minimize feed loss through these connections. Specifically, this close proximity preferably reduces RF interconnect line lengths, reducing the feed loss. To that end, each integrated circuit14preferably is packaged either in a flip chip, chip scale package (e.g., FC-CSP), wafer level chip scale package (WLCSP), or other configuration such as extended wafer level ball-grid-array (eWLB) that supports flip chip, or a traditional package, such as quad flat no-leads package (QFN package). It should be reiterated that althoughFIG.4shows an exemplary phased array10A with some specificity (e.g., specific layouts of the elements18and integrated circuits14), those skilled in the art may apply illustrative embodiments to other implementations. For example, each integrated circuit14can connect to more or fewer elements18, or the lattice configuration can be different. Accordingly, discussion of the specific configurations of the AESA system10shown inFIG.4is for convenience only and not intended to limit all embodiments. FIG.5is a schematic diagram showing relevant components of a BFIC chip configured to support four beam forming elements18, in accordance with one exemplary embodiment. The BFIC chip here includes a common port and four RF ports. In this exemplary embodiment, the BFIC chip supports both transmit and receive modes, which can be controlled via various switches (SW). Specifically, each RF port is associated with a transmit signal path including a transmit gain/phase control circuit and a receive signal path including a receive gain/phase control circuit. The transmit and receive gain/phase control circuits can be switched into and out of the common beam forming signal25via the switches. The transmit gain/phase control circuit typically includes a variable gain amplifier (VGA), an adjustable phase circuit (Ø), and a power amplifier (PA) stage. The receive gain/phase control circuit typically includes a low noise amplifier (LNA) stage, an adjustable phase circuit (Ø), and a variable gain amplifier (VGA). In the transmit mode, common transmit signals25presented on the common port are distributed to the transmit gain/phase control circuits, which output transmit signals to their respective RF ports (e.g., to beam forming elements18). In the receive mode, receive signals from the RF ports (e.g., from beam forming elements18) are processed by the respective receive gain/phase control circuits and are combined to output combined receive signals25on the common port. Certain exemplary embodiments can include other types of RFICs. For example, in certain exemplary embodiments, signals to/from a number of BFIC chips can be aggregated by a conditioning integrated circuit (CDIC) chip or an interface integrated circuit (IFIC) chip, and signals to/from a number of CDIC chips (if included) can be aggregated by an interface integrated circuit (IFIC) chip. In certain exemplary embodiments, each BFIC chip supports four beam forming elements (i.e., each BFIC includes a common port and four RF ports), although alternative embodiments can support other numbers of beam forming elements (e.g., two, four, eight, etc.). Signals to/from groups of BFIC chips can be aggregated to a single IFIC chip optionally through a network of interconnected CDIC chips. In certain exemplary embodiments, each CDIC chip supports connections to two BFIC chips or other to two other CDIC chips (i.e., each CDIC chip includes a common port and two RF ports), although alternative embodiments can support other numbers of connections (e.g., four, eight, etc.). In certain exemplary embodiments, each IFIC chip supports a single RF connection (i.e., each IFIC chip includes a common port and single RF port), although alternative embodiments can support other numbers of connections (e.g., two, four, eight, etc.). The BFIC chips, CDIC chips, and/or IFIC chips can be used to create different sized arrays and sub-arrays (e.g., having 64 beam forming elements or having 256 beam forming elements), and in some embodiments multiple sub-arrays are used to form larger arrays. In certain exemplary embodiments, IFIC chips perform frequency translation (e.g., up/down conversion) between an intermediate frequency (IF) used on a common port and higher frequencies used on an RF port. For example, the IFIC chip may include a 4× multiplier using a 5.65 GHz reference signal for up/down converting the signals by approximately 22.6 GHz. When the IFIC chip is in the transmit mode, the transmit signal from the IF side is up-converted to a higher frequency range used by the RF side, and when the IFIC chip is in the receive mode, the receive signal from the RF side is down-converted to the lower-frequency range used by the IF side. In certain exemplary embodiments, the IF side operates in approximately the 4.875-5.725 GHz frequency range, while the RF side operates in approximately the 27.5-28.35 GHz frequency range. In certain exemplary embodiments, CDIC chips perform signal conditioning and distribution, which, among other things, can provide scalability to larger arrays, provide flexibility to adjust gain distribution to optimize RF parameters, can allow for relaxation of gain requirements on the BFIC chips in order to lower risk of ripple and oscillation, and can allow for phase adjustment across sub-arrays. Thus, one exemplary embodiment includes a chipset including BFIC chips, CDIC chips, and/or IFIC chips that can be used in various combinations in order to produce various array and sub-array configurations. In exemplary embodiments, the three types of chips (CDIC, BFIC and IFIC) can be combined in a modular fashion and in combination they can create arbitrary arrays of any form factor and size. Some or all of the BFIC, IFIC, and/or CDIC functions also can be combined into a single IC. In typical situations, there are many antenna elements and thus many BFICs, but only a small number of CDIC and/or IFIC chips. The ability to form arbitrary arrays is very useful for 5G arrays such as those used for base station, consumer premise equipment, and user equipment (such cell phones). It should be noted that each type of RFIC can include a transmit signal path and/or a receive signal path to allow for transmit-only, receive-only, or dual-mode configurations. It also should be noted that one or more of the RFIC types may include temperature compensation (Temp Comp) circuitry to adjust the gain of the transmit and receive signals as a function of temperature based on inputs from a temperature sensor. For example, temperature compensation circuitry may include a digital attenuator that is controlled based on the sensed temperature such that when temperature decreases such that the gain would increase, attenuation is increased in order provide the desired amount of gain, and when temperature increases such that gain would decrease, attenuation is decreased in order to provide the desired amount of gain.FIG.5is a schematic diagram showing how temperature compensation circuitry might be used in a BFIC chip for performing temperature compensation on the transmit signal prior to distribution to the four RF signal paths during transmit mode and for performing temperature compensation on the combined receive signal from the four RF signal paths during receive mode. CDIC and/or IFIC chips can include similar temperature compensation circuitry. Temperature compensation can be performed, for example, using variable attenuators (e.g., digital attenuators) that are controlled based on the sensed temperature or by adjusting the gain of the transmit and receive RF amplifiers based on the sensed temperature. Generally, each RFIC includes a set of registers for controlling operational parameters such as gain and phase parameters (sometimes referred to as “beam weights” or “complex beam weights”). In certain exemplary embodiments, the common port and each RF port of each RFIC may be configured for two or more RF channels, e.g., to support multiple transmit/receive signals or polarizations. In this case, the set of registers generally includes operational parameters for each of the RF channels. The AESA system10generally includes a controller that configures the operational parameters of the RFICs. For example, each dual transmit/receive integrated circuit may have separate transmit and receive interfaces for each element it controls. For example, if a given integrated circuit controls two elements, it may have a first pair of transmit and receive interfaces for the first element and a second pair of transmit and receive interfaces for the second element. Each transmit interface and receive interface on an integrated circuit respectively couples to corresponding transmit and receive interfaces on one of the elements. To provide signal isolation, the two interfaces on each element may be polarized out of phase with each other. For example, a given element's transmit interface may be about 90 degrees out of phase with its receive interface. In certain embodiments, RFICs include on-chip circuitry to perform element swapping, channel swapping, and/or phase rotation as necessary or desirable for a given implementation or product through a simple configuration interface. As discussed below, inclusion of such circuitry can greatly simplify configuration and control of the RFICs in the phase array system. Some exemplary embodiments are now described with reference to the configuration shown inFIG.6, which is a schematic diagram of a BFIC controlled over a digital communication bus by a controller, in accordance with one exemplary embodiment. The controller can be, for example, a microcontroller, a CPU, a Field Programmable Gate Array (FPGA), or an Application-Specific IC (ASIC). The communication bus can be any digital interface such as, for example, a synchronous peripheral interface (SPI) bus, an Inter-IC Communication (I2C) bus, a General Purpose I/O (GPIO) bus, or other communication interface. In this example, the BFIC14includes two signal channels (labeled A and B) such as for horizontal and vertical polarizations per element18(labeled h and v, respectively). The arrangement and orientation of the BFIC chip and antennas shown inFIG.6relative to the nominal 0° position is used as a frame of reference for further discussion below, e.g., with element El_00 associated with element RF ports3A/3B, element El_01 associated with element RF ports2A/2B, element El_10 associated with element RF ports4A/4B, and element El_11 associated with element RF ports1A/1B. BFIC14also includes two common RF ports labelled A and B, with common RF port A typically coupled to the “A” element RF ports (i.e., element RF ports1A,2A,3A,4A) and with common RF port B typically coupled to the “B” element RF interfaces (i.e., element RF ports1B,2B,3B,4B).FIG.7is a schematic diagram of inner circuitry of the BFIC chip ofFIG.6along with a representation of a set of addressable registers with fields for controlling gain and phase parameters for each BFIC signal path, in accordance with one exemplary embodiment. As shown, in this example, each element RF port is associated with gain/phase circuitry and corresponding gain and phase registers. FIG.8is a schematic diagram showing a conceptual arrangement of BFIC chips and antennas in a phased array in accordance with the arrangement and orientation shown inFIG.6. In this example, all of the BFIC chips are oriented the same way (i.e., the nominal 0° orientation), which can complicate routing of the signals to/from the BFIC chips. It should be noted that in some situations, it may be necessary to add a 180 degree phase rotation on a per-element or per-port basis such as, for example, to orient polarization feeds in the same direction or when an antenna element or BFIC chip is physically rotated 180 degrees on the PCB. In the example shown inFIG.8, each dual-polarized antenna has two ports (labeled “h” for horizontal polarization and “v” for vertical polarization) feeding two orthogonal elements. Generally speaking, all elements of one polarization in a phased array must be physically oriented in the same direction and fed in the same direction.FIG.8includes a legend showing the nominal horizontal and vertical polarization orientation/feed directions for this exemplary embodiment, i.e., the horizontal elements are to be fed from left-to-right and the vertical elements are to be fed from top-to-bottom. As can be seen, for example, with reference to BFIC_00, the feeds for horizontal elements El_00 and El_10 are physically from right-to-left and the feeds for vertical elements El_00 and El_01 are physically from bottom-to-top, i.e., these feeds are reversed by 180 degrees from the nominal orientation/feed directions. Therefore, in this exemplary embodiment, each element/port includes a separate programmable (in or out) 180 degree phase shifter that is controllable through an element rotation (El_Rot) parameter, which, for example, may be a one bit “on/off” value for each element/port.FIG.14is a schematic diagram showing 180 degree phase shifter circuitry, in accordance with one exemplary embodiment. Here, the El_Rot parameter is an 8-bit register or value, with each bit corresponding to the El_Rot parameter for a different element/port. Because the physical orientation and connections of the BFICs are fixed, the El_Rot parameters generally only need to be configured once, e.g., at power-on. It should be noted that the El_Rot parameters can be provided in any of a number of ways, such as, for example and without limitation, written to a register by the controller, pre-stored in a non-volatile memory (e.g., during product manufacture), read from signal lines on the printed circuit board, encoded in or associated with a model number or board layout identifier (e.g., a set of El_Rot parameters for each of a number of different product models), etc. It also should be noted that the 180 degree phase shift instead could be combined with the digital phase shifter as opposed to being a separate circuit, e.g., the 180 degree phase shift could be computed by an on-chip circuit or controller based on the configured phase parameter. One potential issue with the arrangement shown inFIG.8is that it can complicate routing of the signals to/from the BFIC chips. Therefore, in typical embodiments, BFIC chips are oriented in different ways (e.g., rotated relative to the reference orientation shown inFIG.6) and also interconnected in different ways, which can simplify PCB layout (e.g., routing of signals to/from the BFICs) such as by avoiding vias and crossovers in the critical RF routing paths and avoiding the need to do extra length matching of traces. FIG.9is a schematic diagram showing an alternative arrangement of the BFIC chips and antennas ofFIG.8in which the BFIC chips are rotated to simplify PCB layout, in accordance with one exemplary embodiment. Specifically, in this example, the BFIC chips identified as BFIC_00 and BFIC_10 are rotated by −90° and the BFIC chips identified as BFIC_01 and BFIC_11 are rotated by +90° relative to the reference orientation shown inFIG.6. As can be seen, the rotation of the BFICs changes both the physical and logical positions of the various ports. For convenience, the physical positions of the ports (i.e., common ports A and B as well as RF ports1A/1B,2A/2B,3A/3B, and4A/4C) are identified in black, while the logical positions of the ports are identified in green (or gray if the drawings are rendered in grayscale). For example, with reference to the BFIC chip identified as BFIC_00, element EL_00 is now associated with physical RF ports2A and2B (which logically map to reference RF ports3B and3A, respectively), element El_01 is now associated with physical RF ports1A and1B (which logically map to reference RF ports2B and2A, respectively), element EL_10 is now associated with physical RF ports3A and3B (which map to reference RF ports4B and4A, respectively), and element El_11 is now associated with physical RF ports4A and4B (which map to reference RF ports1B and1A, respectively). The BFIC chip identified as BFIC_10 has a similar translation relative to elements El_20, El_21, El_30, and El_31. Similarly, with reference to the BFIC chip identified as BFIC_01, element EL 02 is now associated with physical RF ports4A and4B (which logically map to reference RF ports3B and3A, respectively), element El_03 is now associated with physical RF ports3A and3B (which logically map to reference RF ports2B and2A, respectively), element EL_12 is now associated with physical RF ports1A and1B (which map to reference RF ports4B and4A, respectively), and element El_13 is now associated with physical RF ports2A and2B (which map to reference RF ports1B and1A, respectively). The BFIC chip identified as BFIC_11 has a similar translation relative to elements El_22, El_23, El_32, and El_33. Thus, compared to the reference orientation, the alternative arrangement shown inFIG.9includes aspects of channel swapping (i.e., a channel A port maps to a channel B port, and vice versa) as well as element swapping (i.e., each physical port number maps to a different logical port number). Because of these types of translations, different sets of parameters generally need to be calculated for different BFICs, which can be time-consuming, error-prone, and difficult to validate. Therefore, certain exemplary embodiments include on-chip channel swapping circuitry to physical or logically swap the A/B channels. Channel swapping can be controlled through a single register and can be accomplished using digital switching or RF switching. FIG.10is a schematic diagram showing digital channel swapping circuitry, in accordance with one exemplary embodiment. This channel swapping circuitry performs switching such that, for each RF port, channel A parameters are routed to channel B and channel B parameters are routed to channel A based on a channel swap (Chan_Swap) parameter. In this exemplary embodiment, the channel swapping circuitry generally would include one switch for each A/B parameter pair, e.g., a switch for Gain_1A/Gain_1B, a switch for Phase_1A/Phase_1B, a switch for Gain_2A/Gain_2B, a switch for Phase_2A/Phase_2B, a switch for Gain_3A/Gain_3B, a switch for Phase_3A/Phase_3B, a switch for Gain_4A/Gain_4B, and a switch for Phase_4A/Phase_4B for a configuration of the type shown inFIG.7. FIG.11is a schematic diagram showing RF channel swapping circuitry, in accordance with one exemplary embodiment. This channel swapping circuitry includes a switch that is used to physically switch the channel A and channel B signal paths under control of the Chan_Swap parameter. Generally speaking, the Chan_Swap parameter for each BFIC would only have to be configured once, e.g., at startup, based on the arrangement and orientation of the BFICs. The Chan_Swap parameter may be a one bit “on/off” value for the BFIC. It should be noted that the Chan_Swap parameter can be provided in any of a number of ways, such as, for example and without limitation, written to a register by the controller, pre-stored in a non-volatile memory (e.g., during product manufacture), read from signal lines on the printed circuit board, encoded in or associated with a model number or board layout identifier (e.g., a Chan_Swap parameter for each of a number of different product models), etc. Certain exemplary embodiments additionally or alternatively include on-chip element swapping circuitry. Element swapping can be controlled through a single register and can be accomplished using digital switching. FIG.12is a schematic diagram showing digital element swapping circuitry, in accordance with one exemplary embodiment. This element swapping circuitry performs switching such that each set of corresponding parameters (e.g., Gain_xA, Phase_xA, Gain_xB, and Phase_xB for a configuration of the type shown inFIG.7, where x=1 to 4) is switched based on a port mapping under control of an element swap (El_Swap) parameter. In this exemplary embodiment, the element swapping circuitry generally would include one switch for each parameter set, i.e., four switches for a configuration of the type shown inFIG.7as depicted inFIG.12. It should be noted that the port mapping can be configurable or selectable. In the example shown inFIG.12, port1parameters are switched to port4, port2parameters are switched to port1, port3parameters are switched to port2, and port4parameters are switched to port3, which would be an appropriate port mapping for BFIC_00 and BFIC_10 shown inFIG.9. However, the port mapping for BFIC_01 and BFIC_11 shown inFIG.9would map port1parameters to port2, port2parameters to port3, port3parameters to port4, and port4parameters to port1. Programmable switches could be used in order to have common element swapping circuitry that supports multiple port mappings, which then could be configurable or selectable (e.g., having a number of preconfigured port mappings selectable using the El_Swap parameter (e.g., El_Swap=00 for a first port mapping, El_Swap=01 for a second port mapping, etc.). Generally speaking, the El_Swap parameter for each BFIC would only have to be configured once, e.g., at startup, based on the arrangement and orientation of the BFICs. The El_Swap parameter may be a one bit “on/off” value for the BFIC. It should be noted that the El_Swap parameter can be provided in any of a number of ways, such as, for example and without limitation, written to a register by the controller, pre-stored in a non-volatile memory (e.g., during product manufacture), read from signal lines on the printed circuit board, encoded in or associated with a model number or board layout identifier (e.g., an El_Swap parameter for each of a number of different product models), etc. Of course, certain exemplary embodiments can include both channel swapping circuitry and element swapping circuitry of the types discussed above. FIG.13is a schematic diagram showing combined element swapping and channel swapping circuitry, in accordance with one exemplary embodiment. Here, element swapping is selectively performed under control of the El_Swap parameter, and channel swapping is selectively performed under control of the Chan_Swap parameter. For convenience, this example only shows channel swapping circuitry for one A/B parameter pair post element swapping (i.e., Gain_1A/Gain_1B output by the corresponding element swapping switches), although the channel swapping circuitry generally would include one switch for each A/B parameter pair, e.g., a switch for Gain_1A/Gain_1B, a switch for Phase_1A/Phase_1B, a switch for Gain_2A/Gain_2B, a switch for Phase_2A/Phase_2B, a switch for Gain_3A/Gain_3B, a switch for Phase_3A/Phase_3B, a switch for Gain_4A/Gain_4B, and a switch for Phase_4A/Phase_4B in this exemplary embodiment. Assuming both element swapping and channel swapping are enabled, the result in this example would be for the Gain_2A parameter to be mapped through element swapping followed by channel swapping to physical Gain_1B and for the Gain_2B parameter to be mapped through element swapping followed by channel swapping to physical Gain_1A. Of course, RF switching could be used in lieu of digital switching for the channel swapping, e.g., with the RF channel swapping performed before element swapping. One advantage of using element swapping and/or channel swapping is that a common set of parameters can be programmed into a number of BFICs and then translated on-chip based on the orientation of the BFICs relative to the reference orientation. For example, gain and phase parameters could be computed for the nominal orientation and programmed into the BFICs, and then each BFIC could be programmed as to element swapping and/or channel swapping based on the orientation of the BFIC relative to the reference orientation so that each BFIC performs any necessary translations on-chip based on the configurations. It should be noted that while the examples presented above are based on the 0° orientation as a frame of reference, the present invention is not limited to using the 0° orientation as a frame of reference and instead another orientation (e.g., one of the rotated BFICs) can be used as a frame of reference. Thus, for example, with reference again toFIG.9, BFIC_01 and BFIC_11 can be used as frames of references, in which case BFIC_00 and BFIC_01 would be rotated 180° from those reference orientations, and the on-chip element swapping circuitry could be configured to translate this 180° rotation as opposed to translating +90° and −90° rotations. It is contemplated that a single “orientation” parameter could be used to control both element swapping and channel swapping in certain exemplary embodiments based on the orientation of the BFIC relative to the orientation used to generate the parameters. For example, an “orientation” parameter could be used to select from, say, 0°, +90°, 180°, and −90° orientations, and the BFIC element swapping and channel swapping circuitry could be configured based on the “orientation” parameter (e.g., whether or not element swapping is enabled and if so optionally including a port mapping configuration, and whether or not channel swapping is enabled). It should be noted that while exemplary embodiments are described above with reference to gain and phase parameters for each RF signal path, alternative embodiments can use the same mechanisms to support different and/or additional parameters such as, for example, separate calibration parameters for each RF signal path. It should be noted that some calibration parameters might be element swapped while other calibration parameters are not element swapped. Similarly, it should be noted that some calibration parameters might be channel swapped while other calibration parameters are not channel swapped. Of course, embodiments can include any combination of element swapping circuitry, channel swapping circuitry, and element rotation circuitry. It is envisioned that certain exemplary embodiments of the types described herein can allow common software and common parameter configurations to be used across multiple products having different BFIC and element arrangements and configurations simply by providing appropriate El_Swap, Chan_Swap, and El_Rot parameters to the BFICs in a given product. While exemplary embodiments are described above with reference to element swapping, channel swapping, and phase rotation in a BFIC, it should be noted that the disclosed concepts and circuitry can be applied to RFICs generally, e.g., including element swapping, channel swapping, and/or phase rotation in CDICs and/or IFICs of the types described herein. It should be noted that element and/or channel swapping can be applied to other types of on-chip circuitry such as, for example, temperature compensation circuitry of the type described above with reference toFIG.5and power detection circuitry that may be included in certain RFICs. For one example, each channel or element signal path may include temperature compensation circuitry having a temperature sensor that writes sensed temperature values into a corresponding temperature compensation register, e.g., temperature compensation circuitry in the common port A signal path that writes sensed temperature values to a channel A temperature compensation register and temperature compensation circuitry in the common port B signal path that writes sensed temperature values to a channel B temperature compensation register. In this case, the RFIC may include switching circuitry to selectively swap the channel A and channel B temperature compensation registers, e.g., based on the Chan_Swap parameter. Thus, for example, if the channels A and B are swapped in the PCB layout, the temperature compensation registers also could be swapped accordingly. Such switching circuitry could be physically or logically placed either before or after the temperature compensation registers, e.g., the channel A temperature compensation circuitry could write the sensed temperature values into the channel A temperature compensation register which is subsequently switched to channel B circuitry and vice versa, or the channel A temperature compensation circuitry could write a sensed temperature value that is switched to the channel B temperature compensation register and vice versa. If temperature compensation circuitry is included on the element signal paths, then this switching could be performed on an element-by-element basis, for example, similar to channel swapping shown and described with reference toFIGS.10and11. For another example, each channel or element signal path may include power detection circuitry that writes sensed power values into a corresponding power detection register, e.g., power compensation circuitry in the element1A signal path that writes sensed power values to an element1A power detection register, power compensation circuitry in the element1B signal path that writes sensed power values to an element1B power detection register, power compensation circuitry in the element2A signal path that writes sensed power values to an element2A power detection register, and so on. In this case, the RFIC may include switching circuitry to selectively swap the power compensation registers. Thus, for example, if elements A and B are swapped for a particular port, the power compensation registers for that port also could be swapped accordingly, and if ports are swapped (e.g., port1switched to port4), the power compensation registers also could be swapped accordingly. Such switching circuitry could be physically or logically placed either before or after the power compensation registers, e.g., the port A power compensation circuitry could write the sensed power values into the element A power compensation register which is subsequently switched to element B and vice versa, or the element A power compensation circuitry could write a sensed power value that is switched to element B power compensation register and vice versa. If power compensation circuitry is included on the common port signal paths, then this switching could be performed on a channel basis, e.g., based on the Chan_Swap parameter. It should be noted that the channel and element swapping concepts described herein can be performed using physical and/or logical switching. Some examples of physical and logical switching are described herein, although it should be noted that embodiments are not limited thereby. While various inventive embodiments have been described and illustrated herein, those of ordinary skill in the art will readily envision a variety of other means and/or structures for performing the function and/or obtaining the results and/or one or more of the advantages described herein, and each of such variations and/or modifications is deemed to be within the scope of the inventive embodiments described herein. More generally, those skilled in the art will readily appreciate that all parameters, dimensions, materials, and configurations described herein are meant to be exemplary and that the actual parameters, dimensions, materials, and/or configurations will depend upon the specific application or applications for which the inventive teachings is/are used. Those skilled in the art will recognize, or be able to ascertain using no more than routine experimentation, many equivalents to the specific inventive embodiments described herein. It is, therefore, to be understood that the foregoing embodiments are presented by way of example only and that, within the scope of the appended claims and equivalents thereto, inventive embodiments may be practiced otherwise than as specifically described and claimed. Inventive embodiments of the present disclosure are directed to each individual feature, system, article, material, kit, and/or method described herein. In addition, any combination of two or more such features, systems, articles, materials, kits, and/or methods, if such features, systems, articles, materials, kits, and/or methods are not mutually inconsistent, is included within the inventive scope of the present disclosure. Various inventive concepts may be embodied as one or more methods, of which examples have been provided. The acts performed as part of the method may be ordered in any suitable way. Accordingly, embodiments may be constructed in which acts are performed in an order different than illustrated, which may include performing some acts simultaneously, even though shown as sequential acts in illustrative embodiments. All definitions, as defined and used herein, should be understood to control over dictionary definitions, definitions in documents incorporated by reference, and/or ordinary meanings of the defined terms. The indefinite articles “a” and “an,” as used herein in the specification and in the claims, unless clearly indicated to the contrary, should be understood to mean “at least one.” The phrase “and/or,” as used herein in the specification and in the claims, should be understood to mean “either or both” of the elements so conjoined, i.e., elements that are conjunctively present in some cases and disjunctively present in other cases. Multiple elements listed with “and/or” should be construed in the same fashion, i.e., “one or more” of the elements so conjoined. Other elements may optionally be present other than the elements specifically identified by the “and/or” clause, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, a reference to “A and/or B”, when used in conjunction with open-ended language such as “comprising” can refer, in one embodiment, to A only (optionally including elements other than B); in another embodiment, to B only (optionally including elements other than A); in yet another embodiment, to both A and B (optionally including other elements); etc. As used herein in the specification and in the claims, “or” should be understood to have the same meaning as “and/or” as defined above. For example, when separating items in a list, “or” or “and/or” shall be interpreted as being inclusive, i.e., the inclusion of at least one, but also including more than one, of a number or list of elements, and, optionally, additional unlisted items. Only terms clearly indicated to the contrary, such as “only one of” or “exactly one of,” or, when used in the claims, “consisting of,” will refer to the inclusion of exactly one element of a number or list of elements. In general, the term “or” as used herein shall only be interpreted as indicating exclusive alternatives (i.e., “one or the other but not both”) when preceded by terms of exclusivity, such as “either,” “one of,” “only one of,” or “exactly one of.” “Consisting essentially of,” when used in the claims, shall have its ordinary meaning as used in the field of patent law. As used herein in the specification and in the claims, the phrase “at least one,” in reference to a list of one or more elements, should be understood to mean at least one element selected from any one or more of the elements in the list of elements, but not necessarily including at least one of each and every element specifically listed within the list of elements and not excluding any combinations of elements in the list of elements. This definition also allows that elements may optionally be present other than the elements specifically identified within the list of elements to which the phrase “at least one” refers, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, “at least one of A and B” (or, equivalently, “at least one of A or B,” or, equivalently “at least one of A and/or B”) can refer, in one embodiment, to at least one, optionally including more than one, A, with no B present (and optionally including elements other than B); in another embodiment, to at least one, optionally including more than one, B, with no A present (and optionally including elements other than A); in yet another embodiment, to at least one, optionally including more than one, A, and at least one, optionally including more than one, B (and optionally including other elements); etc. In the claims, as well as in the specification above, all transitional phrases such as “comprising,” “including,” “carrying,” “having,” “containing,” “involving,” “holding,” “composed of,” and the like are to be understood to be open-ended, i.e., to mean including but not limited to. Only the transitional phrases “consisting of” and “consisting essentially of” shall be closed or semi-closed transitional phrases, respectively, as set forth in the United States Patent Office Manual of Patent Examining Procedures, Section 2111.03. Various embodiments of the present invention may be characterized by the potential claims listed in the paragraphs following this paragraph (and before the actual claims provided at the end of the application). These potential claims form a part of the written description of the application. Accordingly, subject matter of the following potential claims may be presented as actual claims in later proceedings involving this application or any application claiming priority based on this application. Inclusion of such potential claims should not be construed to mean that the actual claims do not cover the subject matter of the potential claims. Thus, a decision to not present these potential claims in later proceedings should not be construed as a donation of the subject matter to the public. Nor are these potential claims intended to limit various pursued claims. Without limitation, potential subject matter that may be claimed (prefaced with the letter “P” so as to avoid confusion with the actual claims presented below) includes: P1. An RFIC chip comprising programmable channel swapping circuitry. P2. The RFIC chip of claim P1, wherein the channel swapping circuitry is configured to digitally control which software parameters are applied to which channel groups. P3. The RFIC chip of claim P1, wherein the channel swapping circuitry is configured to swap RF signal path inputs or outputs. P4. An RFIC chip comprising programmable element swapping circuitry. P5. The RFIC chip of claim P4, wherein the element swapping circuitry is configured to digitally control which software parameters are applied to which signal paths. P6. An RFIC chip comprising programmable phase rotation circuitry allowing 180 degree phase rotation to be selected for each of a number of ports or elements based on an orientation-based parameter. P7. An RFIC chip including one or more of programmable element swapping circuitry, programmable channel swapping circuitry, and programmable phase rotation circuitry. P8. An RFIC chip according any of claims P1 to P7, wherein the RFIC is a beam forming integrated circuit. Although the above discussion discloses various exemplary embodiments of the invention, it should be apparent that those skilled in the art can make various modifications that will achieve some of the advantages of the invention without departing from the true scope of the invention. Any references to the “invention” are intended to refer to exemplary embodiments of the invention and should not be construed to refer to all embodiments of the invention unless the context otherwise requires. The described embodiments are to be considered in all respects only as illustrative and not restrictive. | 53,985 |
11942697 | DESCRIPTION OF EMBODIMENTS Exemplary embodiments of the present invention will be described below with reference to the drawings. In the drawings, the same elements are denoted by the same reference numerals, and thus a repeated description is omitted as needed. First Exemplary Embodiment A phase control device according to a first exemplary embodiment will be described.FIG.1schematically illustrates a phase control device100according to the first exemplary embodiment. The phase control device100includes a phase control lens10and a control circuit20. The phase control lens10includes two metamaterial boards11and12. The metamaterial boards11and12are configured to have a so-called metasurface. A principal surface of each of the metamaterial boards11and12is parallel to the X-Y plane inFIG.1. The X-axis extends along a direction normal to a plane ofFIG.1or a direction from the front to the back ofFIG.1. The Y-axis is perpendicular to the X-axis and extends along the horizontal (or lateral) direction ofFIG.1. The Z-axis is perpendicular to the X-axis and the Y-axis and extends along the vertical (or longitudinal) direction ofFIG.1. Thus, a center axis of the metamaterial board11and a center axis of the metamaterial board12are parallel to the Z-axis direction inFIG.1. The metamaterial boards11and12are arranged in series in the Z-axis direction in such a manner that the axes of metamaterial boards11and12are aligned with the central axis CA. Further, as illustrated inFIG.1, the metamaterial boards11and12are stacked along the Z-axis direction to be separated from each other by air spacers13. The phase control device100is configured to control a phase of electromagnetic wave emitted from an antenna101in the Z-axis direction while the electromagnetic wave passes through the phase control lens10. As illustrated inFIG.1, one surface of the phase control device10, i.e. a surface11A of the metamaterial board11, faces the antenna101. The phase control device100and the antenna101constitute an antenna system. When the antenna101is not a directional antenna, the antenna101isotropically emits the electromagnetic wave. Various types of antennas such as a horn antenna, a dipole antenna, and a patch antenna can be used as the antenna101. Therefore, when the electromagnetic wave reaches the surface11A of the phase control lens10facing the antenna101, the phase of the electromagnetic wave is not uniform on this surface of the phase control device100. InFIG.1, a plane and a rounded surface on which the phase of the electromagnetic wave is equal are represented by lines PL. FIG.2schematically illustrates the phase control lens10viewed from the antenna101along the Z-axis direction. As illustrated inFIG.2, on the surface11A of the metamaterial board11facing the antenna101, the farther from the center point CP, the more the phase of the electromagnetic wave delays. InFIG.2, a part11B of the surface11A is expanded and illustrated for convenience. As illustrated inFIG.1, the phase control lens10includes two metamaterial boards11and12. Each of the metamaterial boards11and12provides a half of the phase shift from 0 to 360 degrees. It is easier to design a metamaterial board capable of covering the half of the 360-degree phase shift (also referred to as a half range) than to design a metamaterial board covering the all of the 360-degree phase shift (also referred to as a full range). Since the coverage of the phase shift due to one metamaterial board can be decreased from the full range (360 degrees) to the half range (180 degrees), a critical resonant condition of each metamaterial board can be avoided so that a wider bandwidth can be achieved. Since the metamaterial board11and12are arranged in series along the center axis CA, the phase control lens10can provide any phase shift amount from 0 to 360 degrees by summing up the phase shifts of the metamaterial boards11and12. Note that the metamaterial boards11and12may be arranged to be mirror symmetric with respect to the X-Y plane so as to reduce a coupling micro current caused by the electromagnetic field. Thus, in the present exemplary embodiment, the phase control device100controls the phase of the electromagnetic wave to emit the electromagnetic wave having the phase plane PL perpendicular to the transmission direction (the Z-axis direction). In other words, the phase plane PL is parallel to the X-Y plane perpendicular to the Z-axis direction. Note that the number of serially arranged metamaterial boards of the phase control lens may not be limited to two and may be three or more. Thus, the phase shift coverage of each metamaterial board is not limited to the half range (0 to 180 degrees). The phase shift coverage of each metamaterial board may cover any phase shift range within the full range (0 to 360 degrees) as long as the phase control lens can cover the full phase shift range from 0 to 360 degrees. For example, when the phase control lens includes N metamaterial boards, the coverage of the phase shift of each metamaterial board may be a range from 0 to 360/N degrees, where N is an integer more than two. FIG.3schematically illustrates a part of the metamaterial boards11and12. The metamaterial boards11and13include a plurality of three-dimensional units. In the present exemplary embodiment, a cube unit is used as the three-dimensional unit. The metamaterial board11includes a plurality of cube units1. The cube units1are arranged in a matrix manner in the X-Y plane. In other words, the cube units1are arranged to constitute a two-dimensional array of cube units. The metamaterial board12has a configuration similar to that of the metamaterial board11. The metamaterial board12includes a plurality of cube units2that correspond to the cube units1of the metamaterial board11. The cube units2are arranged in a matrix manner in the X-Y plane. In other words, the cube units2are arranged to constitute a two-dimensional array of cube units. As illustrated inFIG.3, all of the cube units1and2have the same structure. Further, in the present configuration, one cube unit1and one corresponding cube unit2are arranged in the Z-axis direction and constitute a cube unit pair PA.FIG.4schematically illustrates the cube unit pair PA including one cube unit1and one corresponding cube unit2that are arranged in the Z-axis direction. Note that the shape of the three-dimensional unit is not limited to the cube. As long as the three-dimensional units can be densely arranged without any space, other shapes such as a cuboid and a hexagonal column can be adopted as the shape of the three-dimensional unit. The control circuit20can control a state of each cube unit in order to control a phase delay amount provided to the electromagnetic wave by each cube unit. In this case, the state of each cube unit can be switched to a first state or a second state so that the phase delay amount provided to the electromagnetic wave by each cube unit can be changed into a first phase delay amount or a second phase delay amount. The state switching may be realized by active components in each cube unit connected to the control circuit20. The active component may be a PIN (p-intrinsic-n) diode. In the present exemplary embodiment, a phase delay amount difference between the first and second states is 90 degrees. Thus, the cube unit pair PA aligned along the Z-axis direction of the phase control lens10can be in any one of three equivalent states determined by the control circuit20as described below. First Equivalent State When both of the cube units1and2are in the first state, the cube unit pair PA is in a first equivalent state. Second Equivalent State When one of the cube units1and2is in the first state and the other of the cube units1and2is in the second state, the cube unit pair PA is in a second equivalent state. Third Equivalent State When both of the cube units1and2are in the second state, the cube unit pair PA is in a third equivalent state. In the present configuration, the control circuit20can switch the equivalent state of each cube unit pair PA in the phase control lens10among the first to third equivalent states described above. Thus, the phase delay amount difference between the first equivalent state and the second equivalent state is 90 degrees. The phase delay amount difference between the second equivalent state and the third equivalent state is 90 degrees. The phase delay amount difference between the first equivalent state and the third equivalent state is 180 degrees. In the present configuration, by switching of the equivalent state of each cube unit pair PA, it is possible to reduce a phase delay error caused by the difference between a required phase delay amount determined by calculation and an actual phase delay amount achieved by the cube units that are controlled by the control circuit20. A basic cube structure of the cube unit will be described. The cube units1and2have the same basic cube structure. The basic cube structure includes a plurality of metal layers stacked in the perpendicular direction (the Z-axis direction) to the surface of the phase control device100(the X-Y plane).FIG.5schematically illustrates an example of the basic cube structure includes two active metal layers AM and one passive metal layer PM. Each active metal layer AM includes at least one active component and a metal pattern. The active component is an electronic component such as a PIN diode. The state of the active component can be switched between at least two states by the control circuit20. Thus, the admittance of the active metal layers can be switched into any of two or more values by the control circuit20. In contrast, the passive metal layer PM includes only one metal pattern. InFIG.5, the active metal layer AM and the passive metal layer PM have a square shape. The active metal layer AM and passive metal layer PM adjacent to each other are insulated by a dielectric layer. For simplification, the dielectric layer is not illustrated inFIG.5and the following drawings. Therefore, the active metal layers, the passive metal layers and the dielectric layers are stacked in the Z-axis direction. The shape of the active metal layer and the passive metal layer are not limited to the square shape. Another shape such as a rectangle and a round shape can be adopted. Further, the number of active metal layers, the number of passive metal layers and the number of the dielectric layers are not limited to those in the example ofFIG.5. Thus, the number of the metal layers as a sum of active metal layers and passive metal layers may be any plural number and the number of the dielectric layers may be any number corresponding to the number of the metal layers. Thus, n metal layers M1to Mn and (n−1) dielectric layers may be alternately stacked in the cube basic structure, where n is an integer equal to or more than two. The metal layer and the dielectric layer can be formed by various manufacturing method such as vacuum deposition including chemical vapor deposition, plating and spin coating, for example. FIG.6schematically illustrates an equivalent circuit of the cube basic structure including n metal layers and (n−1) dielectric layers alternately stacked in the Z-axis direction. InFIG.6, Yjis admittance of a j-th metal layer, βkis a phase constant of a k-th dielectric layer Dk, and h is a thickness of the dielectric layer, where j is an integer equal to or less than n and k is an integer equal to or less than n−1. An ABCD-matrix of the cube unit can be calculated using the equivalent circuit illustrated inFIG.6. The ABCD-matrix can be expressed by the expression illustrated inFIG.7, where η1to ηn−1are wave impedances of dielectric layers D1to Dn−1 and is wave impedance of an external environment, for example, air. Thus, the ABCD-matrix of the cube unit including n metal layers can be calculated and be transformed into S-parameters as expressed by the following expression. Therefore, transmittance and a phase of transmission coefficient of the present configuration can be derived. Based on these expressions, it is possible to calculate desired admittance of each metal layer which is determined by the metal patterns. Thus, it is possible to achieve an arbitrary phase shift of the electromagnetic wave passing through the cube unit by achieving desired admittance determined by the metal patterns in the passive metal layers or by the metal patterns and the active components in the active metal layers. Further, no power can be theoretically reflected by designing the cube unit to have the same impedance as the external environment, for example, air. FIG.8schematically illustrates an example of the active metal layer included in the cube units. As illustrated inFIG.8, the active metal layer includes two metal pads MP and a PIN diode PD. When a magnetic field B appears in the X-axis direction and an electric field E appears along the Y-axis direction, the metal pads MP are equivalent to inductors and gaps between metal parts separated from each other can be equivalent to capacitors. Further, the metal pads MP are connected to the control circuit20, so that the state of the PIN diode PD can be determined by the control circuit20. When the PIN diode PD is forward-biased by the control circuit, the PIN diode PD is equivalent to a series circuit of an on-resistor and an inductor. When the PIN diode PD is reverse-biased by the control circuit, the PIN diode PD is equivalent to a parallel circuit of an off-resistor and a capacitor. Thus, the control circuit20can adjust the admittance of the active metal layer to a desired value. FIG.9schematically illustrates an example of one passive metal layer included in the cube units. As illustrated inFIG.9, the passive metal layer includes a metal frame MF and a metal square MS. The metal frame MF is configured as a metal closed-loop along a perimeter of the shape of the metal layer. The metal square MS is placed in an area surrounded by the metal frame MF to be insulated from the metal frame MF. Note that widths of the metal frames MF and sizes of the metal squares MS of the metal layers disposed in cube units1and2may be different from each other or the same. In this configuration, the combination of the metal frame MF and the metal square MS can be regarded as a combination of inductors L and capacitors C. Here, it should be appreciated that, when metal patterns included in adjacent two cube units are formed on the same plane, the metal patterns may be continuously formed across the border. When a magnetic field B occurs in an X-axis direction and an electric field E appears along a Y-axis direction, metal parts in a ring shape are equivalent to inductors and gaps between metal parts separated from each other can be equivalent to capacitors. Accordingly, by designing the metal frame MF and the metal square MS, inductance and capacitance can be adjusted. FIG.10illustrates simulation results of the cube units having the configurations illustrated inFIGS.8and9. Phase delay amount indicates the phase difference of electromagnetic wave transmitting through the cube unit having the configurations illustrated inFIGS.8and9. The solid line illustrates the phase delay amount of the cube unit at a frequency range in an ON state, which means the PIN diodes PD on the active metal layers AM are forward-biased by the control circuit20. The dotted line illustrates the phase delay amount of the cube unit at a frequency range in an OFF state, which means the PIN diodes PD on the active metal layers AM are reverse-biased by the control circuit20. It is illustrated inFIG.10that the phase delay amount difference between the solid line and the dotted line is 90 degrees in the frequency range. That is to say, the cube unit operates in either of the two states decided by the control circuit20. Thus, the phase delay amount difference of 90 degrees can be provided by the state of the cube unit between the above-described two states. As a result, it is possible to achieve the phase delay amount difference of 90 degrees with high efficiency by appropriately design the active metal layers and passive metal layers illustratedFIGS.8and9. Therefore, as described above, the serially arranged cube units can cover the all of the phase shift range from 0 to 360 degrees by appropriately switching the state of each cube unit among the three states by the control circuit. As described above, according to the present configuration, it is possible to realize the phase control device capable of achieving the arbitrary phase shift with high efficiency by serially arranged cube units to double the phase delay amount range. FIG.11schematically illustrates angular dependency of gains of the antenna system according to the first exemplary embodiment and a comparative antenna system. InFIG.11, the longitudinal axis represents a beam scan angle with respect to the Z-axis direction. The solid line indicates the gain of the antenna system including the phase control device100according to the first exemplary embodiment. The dotted line indicates the gain of the comparative antenna system including a comparative phase control device. The comparative phase control device includes a phase control lens that includes only single metamaterial board. In the comparative antenna system, the single metamaterial board can be in the first state or the second state so that the control circuit20can switch the state of the phase control lens into one of two states. In this case, the phase delay amount difference between the two states is 180 degrees. Therefore, as illustrated inFIG.11, the gain of the present configuration is higher than that of the comparative antenna system in a wide angular range. As illustrated inFIGS.2and3, a reference point located at a center of each cube unit in the X-Y plane is indicated by RP. Note that, for simplification, the reference point RP of only one cube unit of each metamaterial board is illustrated inFIG.3. In this case, as described above, as the distance L from the center point CP to the reference point RP (illustrated inFIG.2) increases, the phase of the electromagnetic wave reaching the cube unit from the antenna101delays. The control circuit20determines the phase delay amount of each cube unit one by one. Therefore, the phase control lens10in the phase control device100is configured in such a manner that the phase delay amount of the cube unit decreases as the distance L from the center point CP to the reference point RP increases in order to uniform the phase of the electromagnetic wave emitted from the surface of the phase control unit100not facing the antenna101. In other words, the phase control device100can focus the electromagnetic wave emitted from the antenna101like a convex lens, and the radiation pattern of the main beam is perpendicular to the X-Y plane. Note that the phase of the emitted electromagnetic wave after the phase control device100illustrated inFIG.1is merely an example.FIG.12schematically illustrates a radiation pattern of the main beam tilted from the Z-axis direction. As illustrated inFIG.12, the phase delay amount of each cube unit can be controlled in such a manner that the radiation pattern of the main beam is tilted from the Z-axis direction to a specified direction BD. Therefore, the phase control device100can dynamically sweep the radiation pattern of the main beam over a wide range by switching the equivalent states to cause each cube unit to provide the electromagnetic wave with an appropriate phase delay amount. Note that the phase control described above with reference toFIG.1is merely an example. The phase control device may be configured in such a manner that a phase delay amount of the cube unit determined by the control circuit20increases as the distance L from the center point CP to the reference point RP increases. In this case, the phase control device may be configured to diffuse the electromagnetic wave like a concave lens according to usage of the electromagnetic wave by appropriately designing the cube units serving as the three-dimensional units. Further, the transmission direction of the electromagnetic wave emitted from the antenna and reaching the phase control device is not limited to the direction (the Z-axis direction) perpendicular to the surface (the X-Y plane) of the phase control device. The transmission direction of the electromagnetic wave emitted from the antenna and reaching the phase control device may be tilted with respect to the direction (the Z-axis direction) perpendicular to the surface (the X-Y plane) of the phase control device. Additionally, the transmission direction of the electromagnetic wave emitted from the phase control device is not limited to the direction (the Z-axis direction) perpendicular to the surface (the X-Y plane) of the phase control device. The transmission direction of the electromagnetic wave emitted from the phase control device may be tilted with respect to the direction (the Z-axis direction) perpendicular to the surface (the X-Y plane) of the phase control device by appropriately designing the cube units serving as the three-dimensional units. Other Embodiment Note that the present invention is not limited to the above exemplary embodiments and can be modified as appropriate without departing from the scope of the invention. For example, the shapes of the three-dimensional units arranged in the phase control device are not limited to one shape. Thus, as long as the three-dimensional units can be densely arranged without any spaces and desired phase control can be achieved, various shapes such as the hexagonal column and the triangular column described above, a cube, and a cuboid can be combined to constitute the array of the three-dimensional units. The metal layer may be formed by any metal and the dielectric layer may be formed by any dielectric material. In the exemplary embodiment described above, two metamaterial boards have been cascaded in a phase control lens. However, it is merely an example. Therefore, three or more structures can be combined to constitute the phase control lens assembly. In the exemplary embodiment described above, the phase control device has been configured as a board-like shape device. However, the shape of the phase control device is not limited to this. For example, the phase control device may be configured as a disk-like shape device other than the board-like shape device. While the present invention has been described above with reference to exemplary embodiments, the present invention is not limited to the above exemplary embodiments. The configuration and details of the present invention can be modified in various ways which can be understood by those skilled in the art within the scope of the invention. REFERENCE SIGNS LIST AM ACTIVE METAL LAYERCA CENTRAL AXISCP CENTER POINTRP REFERENCE POINTD1TO DN−1 DIELECTRIC LAYERSM, M1TO MN METAL LAYERSMF METAL FRAMEMS SQUARE METALPA CUBE UNIT PAIRPM PASSIVE METAL LAYERS1,2CUBE UNITS10PHASE CONTROL LENS11,12METAMATERIAL BOARDS13AIR SPACER20CONTROL CIRCUIT100PHASE CONTROL DEVICES101ANTENNA | 23,223 |
11942698 | In the drawings, like numerals indicate like parts throughout the several embodiments described herein. DETAILED DESCRIPTION Referring now toFIGS.1-2b, the first embodiment of the present invention is an electrically small, planar, horizontally polarized, dual-band omnidirectional antenna20that is in the form of a miniaturized, microstrip antenna. The antenna20consists of an electrically small (ES) loop22and an Alford loop24both of which are segmented, printed on the bottom and top faces of a substrate26respectively. The substrate26has a permittivity of εr, a thickness of hs, and a radius of rg. The ES loop22is equally divided into four segments22aby four interlaced coupling slots28that provide capacitive loadings. Each interlaced coupling slot28has a substantially Π shape. The currents on the ES loop22that are segmented can remain uniform because of the capacitive loadings and thus give an omnidirectional radiation pattern. With reference toFIG.2a, the ES loop22is excited by four radial strips22bthat are connected to a central circular patch22c. The four segments22aare centrosymmetric around the central circular patch22c. The radial strips22bare separated from each other angularly by 90° and the symmetric configuration of the radial strips22bhelps reduce the gain variation of the ES loop22in the azimuthal plane. The central circular patch22care concentric with the circle formed by the four segments22a. FIG.2bbest shows the Alford loop24printed on the top surface of the substrate26. The Alford loop24is excited by four radial arms24a, which are connected to the feeding probe30at the center of the Alford loop24. Each radial arm24ais introduced a meander structure24cthat is folded to obtain another loop mode for broadening the bandwidth. The four radial arms24aare separated from each other angularly by 90°, and the four meander structures24ctogether form a square shape. An angular parasitic strip32is placed next to each angular strip24bof the Alford loop24to reduce the gain variation in the azimuthal plane. Each parasitic strip32has a subtended angle of α4. One can see that in the antenna20an electrically small lower-band radiator (i.e., the ES loop22) is directly combined with an upper-band radiator (i.e. the Alford loop24). By suppressing the higher-order mode of the lower-band radiator the omnidirectional radiation pattern of the upper-band radiator can be maintained and primarily controlled by upper-band radiator. On the other hand, since the fundamental mode of upper-band radiator is not close to the lower band, its effects on the fundamental mode of the lower-band radiator is small. As a result, the two radiators are practically independent of each other although they are very close to each other. Now turning to simulation results of the antenna20described above.FIG.3shows the current distributions on the antenna20at the center frequency of the 2.4 GHz band which is 2.44 GHz. The currents mainly concentrate on the ES loop22, and the currents are in phase and uniform. Similar current distributions are observed on the Alford loop24, but the current is much weaker, showing that their effects on the ES loop22are small. With reference toFIG.4, the currents on the Alford loop24become much stronger at the center frequency of the 5 GHz band which is 5.5 GHz, because it is around the resonance of the Alford loop24. Considerable currents are also observed on the ES loop22but since these currents are almost uniform and in phase, they basically do not contribute to the gain variation in the azimuthal plane. The simulation results show that the ES loop22and Alford loop24can be operated independently, which greatly facilitates the dual-band design of the antenna20. Based on the preceding analysis, a flexible frequency ratio can be obtained for the antenna20. A small frequency ratio (FR<2) can be easily achieved by increasing the size of the Alford loop24or decreasing the size of the ES loop22. Therefore, the focus here is on the larger FR case.FIG.5shows the result of increasing the frequency ratio of the antenna20in three different exemplary cases. In Case 1 α4=43.4°, ws0=3 mm, ls1=8.5 mm, w1=2.35 mm (see the annotations inFIGS.2a-2b). In Case 2 α4=36°, ws0=2 mm, ls1=7.4 mm, w1=2.35 mm. In Case 3 α4=30°, ws0=2.7 mm, ls1=7 mm, w1=2 mm. It can be observed fromFIG.5that when the upper band is adjusted to higher frequencies by tuning the parameters of the Alford loop24, the 2.4-GHz band is virtually not affected, as desired. The largest frequency ratio inFIG.5is 3.75, with the gain variation kept below 2 dB in the azimuthal plane. A prototype (not shown) of the antenna20inFIGS.1-2bwas fabricated and measured to verify the simulation. The prototype was fabricated on a small substrate with a dielectric constant of εr=4.4, loss tangent of 0.0025, and thickness of hs=1.6 mm. For the prototype, the reflection coefficient was measured using an Agilent 4-port network analyzer E5071C, whereas the radiation pattern and antenna gain were measured using a Satimo Starlab system. An RF choke was added to the outer conductor of the feeding coaxial cable to suppress stray radiation from the cable.FIG.6shows the simulated and measured reflection coefficients. With reference toFIG.6, reasonable agreement between the simulated and measured results is obtained. The measured −10-dB impedance bandwidths of the lower- and upper bands are 4.08% (2.4-2.5 GHz) and 14.37% (5.1-5.9 GHz), respectively, entirely covering the 2.4- and 5-GHz Wi-Fi bands. The resonant mode at 2.4 GHz is caused by the ES loop22, whereas the two resonant modes at 5.2 GHz and 5.8 GHz are due to the modified Alford loop24. It should be mentioned that no other resonant modes are found between the two bands (|S11|>−0.3 dB from 3 GHz to 4 GHz). This is highly desirable because it can effectively reduce the interference with 5G devices operating in 3.5-GHz band. FIG.7shows the simulated and measured antenna gains at ϕ=90°, θ=90°. The measured gain is 0.5-1.28 dBi in the 2.4-GHz band. It is lower in the 5-GHz band, being −0.6-0 dBi. It is because the beamwidth in the elevation plane becomes wider in the 5-GHz band. Also shown inFIG.7are the simulated and measured total efficiencies that have taken impedance mismatch into account. The measured efficiency was obtained by using the Satimo SatEnv software. High measured total efficiencies of ˜90% are obtained within the two operating bands. This is because the loop current of the antenna20is mainly in phase. In contrast, some conventional designs have considerable out-of-phase currents that can dissipate power and thus, reduce the efficiency. FIGS.8a-8cshow the simulated and measured normalized radiation patterns of the antenna20at 2.44, 5.2, and 5.8 GHz respectively. Both the simulated and measured results show a null at θ=0° (z-direction), which is desirable for azimuthal omnidirectional radiation patterns. The 3-dB beamwidths in the elevation plane (ϕ=90° are 98°, 128° and 129° at 2.44 GHz, 5.2 GHz and 5.8 GHz, respectively. In the azimuthal plane, the co-polarized fields are generally stronger than the cross-polarized counterparts by 22, 18, and 19 dB at 2.44, 5.2, and 5.8 GHz, respectively. It was found that the radiation patterns are very stable at other passband frequencies, but the results are not included here for brevity. FIG.9shows the simulated and measured gain variation of the antenna20in the azimuthal plane across the two passbands. As can be observed fromFIG.9, the gain variations are not large. In the 2.4-GHz band, the simulated and measured peak variations are 0.058 dB and 0.5 dB, respectively. In the 5-GHz band, the simulated and measured peak variations increase to 0.7 dB and 1 dB, respectively. These results verify that the radiation fields of the antenna20are uniform. TABLE 1COMPARISON OF EMBODIMENT-1 WITH PRIOR ART HORIZONTALLYPOLARIZED OMNIDIRECTIONAL ANTENNASFrequencyGain variationratio(azimuthalRef.Frequency band(fh/fl)Sizeplane)PlanarEfficiencyPower divider[5]S (1.76-2.68 GHz)1.520.59 × 0.59λ024Y83%N[6]S (2.17-2.97 GHz)1.360.38 × 0.38λ02—Y~90%N[9]D (2.45, 3.9 GHz)1.590.40 × 0.40λ02—Y—N[14]S (1.19-2.00 GHz)1.680.34 × 0.34λ022.8N—4-way PD[15]S (1.67-2.73 GHz)1.630.67 × 0.67λ022.5Y—3-way PD[16]S (1.70-3.54 GHz)2.080.85 × 0.85λ021.5Y~80%12-way PD[17]S (0.78-2.69 GHz)3.441.15 × 1.15λ021.9N55%-85%4 16-way PDs[18]S (1.58-3.88 GHz)2.450.63 × 0.63λ022.2Y—4-way PDEmbodiment-D (2.4-2.5 GHz),2.460.296 × 0.296λ021Y90%N1(5.1-5.9 GHz)S: Single band, D: Dual band, fh: Highest operating frequency, fl: Lowest operating frequency, λ0: Wavelength in air at lowest operating frequency, PD: Power divider. Table 1 above compares the antenna20(Embodiment-1) with a number of prior art horizontally polarized omnidirectional antennas. With reference to Table 1, only few reported designs have a frequency ratio of FR>2. Although relatively large frequency ratios of 2.08, 3.44, and 2.45 have been obtained [16]-[18], the corresponding antenna sizes are as large as 0.85×0.85λ02, 1.15×1.15λ02, and 0.63×0.63λ02. In contrast, antenna20has a large FR of 2.46 and also an electrically small size of 0.296×0.296λ02. Further, it has a high total antenna efficiency of ˜90%. It is worth mentioning that the frequency ratio can be easily extended to 3.75 by using the method provided herein. While Embodiment-1 has the smallest size in the table, its gain variation (<1 dB) in the azimuthal plane is also smallest among the different designs. It implies that the radiation patterns of Embodiment-1 are most uniform and stable. Moreover, no power dividers are needed in Embodiment-1. Turning toFIGS.10aand10b, which show a prior art antenna120for the purpose of performance comparison with specific embodiments of the invention that are described herein. The reference antenna120is a single ES segmented loop antenna containing an ES loop122that is fed via two parallel printed lines122b, which are connected to an inner conductor134and an outer conductor136of a coaxial cable. The ES loop122is formed on the bottom layer (seeFIG.10a) of a substrate126, but there is no antenna loop on the top layer (seeFIG.10b) of the substrate126. This prior art antenna120is a single-band loop antenna, and its fundamental mode at 2.4 GHz has a good omnidirectional radiation pattern. However, its omnidirectional radiation pattern will deteriorate as the frequency significantly increases to 5.5 GHz. Its reflection coefficient, current distribution, and radiation patterns at 5.5 GHz are respectively shown inFIG.19,FIG.11andFIG.12. It can be observed from these figures that for the prior art antenna120ahigher-order mode appears in 5-GHz band, causing the radiation pattern to deteriorate. FIGS.13aand13bshow a dual-band antenna220according to another embodiment of the invention. Compared to the antenna shown inFIGS.1-2b(hereinafter Embodiment-1), the antenna220inFIGS.13a-13b(hereinafter Embodiment-2) similarly contains two antenna loops on opposite sides of a substate226. The two antenna loops contain an ES loop222on a bottom side of the substrate226, and an Alford loop224on the top side of substrate226. Like the case inFIG.10a, the ES loop222is fed via two parallel printed lines222b. Nonetheless, the ES loop222contains interlaced coupling slot228similar to those inFIGS.1-2a. It can be seen fromFIG.13athat only the outer conductor236of the coaxial cable is used to excite the ES loop222, whereas the inner conductor234is reserved for exciting the Alford loop224. Since the single-sided Alford loop224does not have complement arms on the other side of the substrate226to form a complete loop, four parasitic strips224aare introduced to the blank space to reduce the gain variation in the azimuthal plane. The Alford loop224also contains angular parasitic strip232placed next to each angular strip224bof the Alford loop224. The fundamental mode of the Alford loop224at 5.5 GHz is shown inFIG.18. This mode is sensitive to the dimensions of the Alford loop224only. In 5-GHz band, the loading effect of the Alford loop224significantly changes the current distribution of the ES loop222. As shown inFIGS.14a-14b, the current flows in different directions along the ES loop222at 5.5 GHz when there is no Alford loop224. After the Alford loop224is added, the current of the ES loop222now flows along one angular direction only. This current distribution is similar to that of the ES loop222excited in the fundamental mode (2.4 GHz).FIG.15shows the radiation pattern of the antenna220at 5.5 GHz. As a comparison between the prior art antenna inFIG.12and the antenna220inFIG.15, the higher-order mode of the prior art antenna has an irregular radiation pattern, but the antenna220has an azimuthally omnidirectional radiation pattern at the same frequency, as expected. Since the higher-order mode of the ES loop222is effectively suppressed, it will not affect the omnidirectional radiation pattern in the upper band. It should be mentioned that inFIG.18, the radiation mode of antenna220at 5.5 GHz was found to be dominant by the Alford loop mode. Therefore, the lower- and upper-band are practically controlled by the ES loop222and Alford loop224, respectively. FIGS.16aand16bshow a dual-band antenna320according to another embodiment of the invention (hereinafter Embodiment-3). For the sake of brevity, similar structures and features of the antenna320as compared to those of the antenna inFIGS.13a-13bwill not be described herein again, but only their differences will be described. The ES loop322on the bottom side of the substrate326has a similar structure as the ES loop in the antenna inFIGS.13a-13b. On the other hand, the parasitic strips324awhich are radial feeding lines of the Alford loop324are each folded to form a meander structures324cin a way similar to those inFIGS.1and2b. By the meander structures324c, as compared to the antenna inFIGS.13a-13b(i.e., Embodiment-2), the original 5.5-GHz resonant mode is shifted downwards to 5.2 GHz in Embodiment-3. Also, a new resonant mode is excited at 5.8 GHz, which is a higher-order mode of the Alford loop324. The impedance bandwidth is now improved from 3% to 15.8% (5.06-5.93 GHz) in Embodiment-3. By optimizing the length of the folded part, the anti-phase currents can concentrate on the radial feedlines only. Thus, the currents on the Alford loop324(angular arms) can be in phase, radiating omnidirectional fields. The normalized radiation patterns are shown inFIG.17. It can be seen from the figure that the gain variation in the azimuthal plane (0=)90° is reduced from 3.6 dB (Embodiment-2) to 2.9 dB (Embodiment-3) at 2.44 GHz, while it is improved from 6 dB to 3 dB at 5.5 GHz. By comparing Embodiment-1, Embodiment-2 and Embodiment-3 as described above, it can be observed that the feeding of the 5-GHz Alford loop in Embodiment-3 is symmetrical, which should not give such a large gain variation in the azimuthal plane. However, the feeding of the 2.4-GHz ES loop in Embodiment-3 is asymmetrical, which may lead to non-uniform current distributions on the ES loop and thus the large gain variation. To further improve the gain variation in the azimuthal plane, the feeding of the ES loop in Embodiment-3 can be modified to have four symmetrical radial strips like those in Embodiment-1.FIG.18shows the comparison results between the prior art antenna inFIGS.10a-10a-10b, and Embodiments 1-3 as described above. As can be seen fromFIG.18, the resonance frequency of Embodiment-1 can be maintained at 2.4-GHz and 5-GHz Wi-Fi bands by slightly tuning its dimensions. In addition, it can be observed fromFIG.17that the gain variation of the azimuthal plane in Embodiment-1 is significantly reduced, being only 0.05 dB and 0.57 dB at 2.44 and 5.5 GHz, respectively. The uniform radiation field in the azimuthal plane is very desirable for the wireless access of mobile ends. Turning now toFIG.19which shows the configuration of a 2×2 MIMO antenna440for Wi-Fi applications which incorporates four identical electrically small, planar, horizontally polarized, dual-band omnidirectional antenna420a-420deach being similar to that shown inFIGS.1-2b. Each of the four dual-band antennas420a-420dis called an element of the 2×2 MIMO antenna440. In The distance between two adjacent elements is d. To begin, the effects of d on the coupling between the antenna elements are investigated.FIG.20shows the simulated S-parameters of the MIMO antenna440. With reference toFIG.20, when d is larger than 70 mm, the isolations between the elements is generally higher than 15 dB and 26 dB for 2.4- and 5-GHz bands, respectively.FIG.21shows the effects of d on the gain variation in the azimuthal plane. As can be observed fromFIG.21, as d increases from 70 to 90 mm, the gain variation in the azimuthal plane decreases from 3 dB to 1.9 dB and from 4 dB to 2.7 dB for 2.4-GHz and 5-GHz bands, respectively. One can see that better MIMO performance can be obtained by using a larger d, at the cost of increasing the antenna size. Therefore, a compromise between the MIMO performance and antenna size is needed. In one implementation, a compromised value of d=80 mm (0.64λ0at 2.4 GHz) was chosen. At this value of d, the isolation between the elements is higher than 17.5 dB and 29 dB for the 2.4- and 5-GHz bands, respectively, whereas the respective gain variations are smaller than 2.42 dB and 2.9 dB in the azimuthal plane. The overall size of the MIMO antenna is 117×117 mm2, which is 0.93×0.93λ02at 2.4 GHz. To verify the above design, a prototype (not shown) of the dual-band omnidirectional MIMO antenna440was fabricated and measured. In the measurement, the elements of the MIMO antenna were supported by a 3D-printed holder (not shown), which is not needed in actual applications. In the S-parameter measurements, the 4 ports of the MIMO antenna440were simultaneously connected to those of a 4-port network analyzer. Since the Satimo Starlab system has only one port for the antenna under test, other ports of the prototype of the MIMO antenna440were terminated with matched loads.FIGS.22a-22bshow the simulated and measured S-parameters, antenna gains, and total efficiencies of the prototype of the MIMO antenna440. As can be observed fromFIG.22(a), reasonable agreement between the simulated and measured results is observed. For the omnidirectional antenna420ainFIG.19, the measured −10-dB impedance bandwidths of the two bands are 3.9% (2.4-2.495 GHz) and 14.2% (5.1-5.88 GHz). It should be mentioned that the results are close to those ofFIGS.6-7for the single antenna element, meaning that the coupling effect is not very strong. This can also be seen from the high isolation between the four elements; the measured mutual couplings are lower than −16 dB and −24.5 dB for the lower- and upper-bands, respectively. Similar results were obtained for omnidirectional antennas420b,420cand420ddue to the symmetric structure and the results are therefore not included here for brevity. With reference toFIG.22b, the measured gain at ϕ=90°, θ=90° is 0.67-1.23 dBi and −0.59-1 dBi for 2.4- and 5-GHz bands, respectively.FIG.22balso shows the simulated and measured total efficiencies of the omnidirectional antenna420ain the prototype of the MIMO antenna440. With reference toFIG.22b, the measured efficiencies of the two bands are ˜85%, being lower than those (˜90%) of the single element. The reduction in the efficiency is due to the tolerance of a separate fabrication in addition to the loss caused by the power absorption of the remaining three antenna elements. FIG.23a,FIG.23bandFIG.23cshow the simulated and measured radiation patterns of the omnidirectional antenna420ain the prototype of the MIMO antenna440at 2.44 GHz, 5.2 GHz, and 5.8 GHz respectively. As can be observed fromFIGS.23a-23c, the simulated and measured results agree reasonably well with each other. Symmetric omnidirectional radiation patterns are obtained, as expected. The radiation patterns at other frequencies were simulated and found to be very stable across the two passbands. In the azimuthal plane, the measured gain variation is less than 3.2 dB at the three frequencies. The radiation patterns of other elements were found to be similar to those of the omnidirectional antenna420a, as expected. FIG.24shows the simulated and measured envelope correlation coefficients (ECCs) ρe, which is a performance index for a MIMO antenna. The simulated and measured ECCs were obtained from the radiation fields. With reference toFIG.24, both the simulated and measured ECCs between different elements are generally lower than −7.2 and −18 dB for the lower and upper bands, respectively, which are desirably much lower than the criteria of ρe<−3 dB. TABLE 2COMPARISON BETWEEN PROPOSED MIMO ANTENNA WITH REPORTEDHORIZONTALLY POLARIZED OMNIDIRECTIONAL MIMO ANTENNASFrequencyNumberIsolationAzimuthallyStableGainRefbandof Ant.(dB)PolarizationSizeomnidirectionalpatternsvariationEfficiency[31]#D (2.25-3 GHz),89HP0.49 × 0.49λ02NN>2060%-80%(4-5.3 GHz)[12]S (3.78-4.07 GHz)217VP + HP1.26 × 1.26λ02YY——[24]S (2.29-2.57 GHz)210HP0.92 × 0.92λ02YY3.450-75%[32]D (2.4, 5.5 GHz)310HP1.60 × 1.60λ02YY4.3—ProposedD (2.4-2.49 GHz),416HP0.93 × 0.93λ02YY3.285%MIMO(5.1-5.88 GHz)S: Single band, D: Dual band, λ0: Wavelength in air at lowest operating frequency.#The impedance bandwidth in [31] was found using |S11| ≤ −6 dB instead of |S11| ≤ −10 dB. Table 2 summarizes the results of the MIMO antenna440(which is referred as the “proposed MIMO” in Table 2) and other HP omnidirectional MIMO antennas available in the art. As can be observed from Table 2, a small MIMO design with 8 elements has been reported in [31], but its radiation patterns are not omnidirectional in the azimuthal plane. Also, they are not stable across the operation bands. As compared with the omnidirectional MIMO antennas [12], [24], [32], the MIMO antenna440has the largest number of antenna elements and also the highest efficiency, with its size comparable to or even smaller than those of prior art designs. One can see that according to one embodiment, the electrically small, planar, dual-band, horizontally polarized omnidirectional antenna with FR>2 has been designed. The antenna has combined a 2.4-GHz ES loop and a 5-GHz Alford loop on a single substrate. It has been shown that the two loops can work in their individual band independently, greatly facilitating the dual-band design. Four symmetrical radial strips have been used to excite the ES loop to reduce the gain variation in the azimuthal plane. To verify the simulation, a 2.4/5-GHz prototype for Wi-Fi applications was fabricated and tested. It has been found that the peak gain variations in the azimuthal plane are 0.5 dB and 1 dB in the lower band (2.4-2.5 GHz) and upper band (5.1-5.9 GHz), respectively. Although the dual-band antenna has a small diameter of 0.296λ0, it has a high total efficiency of ˜90%. It has been found that the FR can be easily extended to 3.75 with the maximum gain variation in the azimuthal plane being 2 dB. According to another embodiment of the invention, a 2×2 MIMO antenna has been obtained for Wi-Fi applications. The 4-element dual-band MIMO antenna has a compact size of 117×117 mm2(0.93×0.93)λ02at 2.4 GHz). A prototype was also fabricated and measured. It has been found that the measured impedance bandwidths of the two bands are 3.9% (2.4-2.495 GHz) and 14.2% (5.1-5.88 GHz), covering the 2.4- and 5-GHz Wi-Fi bands. The measured isolations of the lower and upper bands are higher than 16 dB and 24.5 dB, respectively. It has been observed that the omnidirectional radiation patterns are stable across the two passbands. A gain variation of less than 3.2 dB has been found in the azimuthal plane. The ECCs of the two bands have been simulated and measured. It has been found that the measured ECCs, obtained from the radiation fields, are lower than −7.2 and −18 dB for the lower and upper passband, respectively. The exemplary embodiments are thus fully described. Although the description referred to particular embodiments, it will be clear to one skilled in the art that the invention may be practiced with variation of these specific details. Hence this invention should not be construed as limited to the embodiments set forth herein. While the embodiments have been illustrated and described in detail in the drawings and foregoing description, the same is to be considered as illustrative and not restrictive in character, it being understood that only exemplary embodiments have been shown and described and do not limit the scope of the invention in any manner. It can be appreciated that any of the features described herein may be used with any embodiment. The illustrative embodiments are not exclusive of each other or of other embodiments not recited herein. Accordingly, the invention also provides embodiments that comprise combinations of one or more of the illustrative embodiments described above. Modifications and variations of the invention as herein set forth can be made without departing from the spirit and scope thereof, and, therefore, only such limitations should be imposed as are indicated by the appended claims. | 25,212 |
11942699 | DETAILED DESCRIPTION Reference will now be made in detail to the present embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts. Reference is made toFIGS.1-5.FIG.1illustrates a schematic view of an antenna device100, and the antenna device100includes a first insulation layer110, a defected metal layer130, a second insulation layer150, and a plurality of radiators170.FIG.2illustrates a top view of the antenna device100.FIG.3illustrates a schematic view of the first insulation layer110and the defected metal layer130of the antenna device100.FIG.4illustrates an enlarged view of the dotted square E inFIG.3.FIG.5illustrates a positional relationship about the defected metal layer130and the radiators170of the antenna device100from a top view, and the second insulation layer150is neglected. In some embodiments of the present invention, the defected metal layer130is located on the first insulation layer110, and the defected metal layer130has a plurality of recession features131which are arranged with uniform pitches. In addition, the second insulation layer150is located on the first insulation layer110and the defected metal layer130, and the radiators170are located on the second insulation layer150. Each radiator170includes a feeding portion171and a grounding portion173. The defected metal layer130is configured to influence a current path of the radiators170and prevent the radiators170from being affected by each other or any metallic conductor around the radiators170such that the antenna device100can operate in multiple frequency bands. The present invention is not limited in this respect. Specifically, the first insulation layer110and the second insulation layer150include an insulation material such as epoxy and or glass fiber, and the present invention is not limited in this respect. In addition, the defected metal layer130and the radiators170includes metallic material such as copper and copper alloy. The defected metal layer130can be manufactured by a laser cutting process, an etching process, or a machining process, and the radiators170are antennas with F-shaped metal planar structures. The present invention is not limited in this respect. In some embodiments of the present invention, the recess features131of the defected metal layer130includes a plurality of first recesses131awhich are linear and a plurality of second recesses131bwhich are linear, and the first recesses131awhich are spaced apart from each other straightly extend along a first axial direction X, in which the first recesses131aare equally spaced apart. The second recesses131bwhich are spaced apart from each other straightly extend along a second axial direction Y which is perpendicular to the first axial direction X, and the second recesses131bare equally spaced, in which the first recesses131aand the second recesses131bare intersected to form cross lattice patterns. In some embodiments of the present invention, the feeding portion171of each radiator170is electrically connected to a signal feed-in source, and the grounding portion173of each radiator170is electrically connected to a grounding source. Reference is made toFIG.6which illustrates a cross section view taken from a cross section line6-6inFIG.1. The grounding portions173of the radiators170extend through the first recesses131aand/or the second recesses131b. For instance, the grounding portions of the radiators170are respectively disposed at intersections wherein the first recesses131acrossing the second recesses respectively, and the grounding portions173of the radiators170penetrate the first insulation layer110and the second insulation layer150to be in contact with the grounding metal layer190. In some embodiments of the present invention, each first recess131ahas a first width W1, and each second recess131bhas a second width W2. The first width W1is greater than the second width W2, and a ratio of the first width W1to the second width W2ranges from 1 to 5. In embodiments of the present invention, a ratio of the first width W1to the second width W2ranges from 1.5 to 3.5. For instance, a ratio of the first width W1to the second width W2is 2. In some embodiments of the present invention, the first width W1ranges from 0.15 millimeters to 0.25 millimeters, and the second width W2ranges from 0.05 millimeters to 0.15 millimeters. In some embodiments of the present invention, the first width W1is about 0.2 millimeters, and the second width W2is about 0.1 millimeters. The present invention is not limited in this respect. In some embodiments of the present invention, the radiators170includes four F-shaped radiators170, and each F-shaped radiator170includes a free end175. Two of the free ends175of the F-shaped radiators170and another two of the free ends175of the F-shaped radiators175respectively face towards opposite directions in the first axial direction. In addition, two of the F-shaped radiators170are aligned with each other along the first axial direction X, and another two of the radiators170are aligned with each other along the second axial direction Y. Therefore, four of the F-shaped radiators170are in a mirror symmetry, and the present invention is not limited in this respect. Specifically, the feeding portion171and the grounding portion173of the radiators170extends toward the same direction, and the free end175faces towards a different direction from the direction toward which the feeding portion171and the grounding portion173extend. For instance, the free end175face towards a direction perpendicular to the direction toward which the feeding portion171and the grounding portion173extend. In some embodiments of the present invention, the antenna device100further includes the grounding metal layer190, and the grounding metal layer190is disposed beneath the first insulation layer110. The grounding metal layer190is electrically connected to the radiators170to provide a grounding function. In addition, the antenna device100includes a conductive path which is in the first insulation layer110and the second insulation layer150, and the conductive path can include a metal conductive wire such as copper conductive wire. The metal conductive wire penetrates the first insulation layer110and the second insulation layer150such that the grounding portion173of the F-shaped radiators170is in contact with the conductive path and connected to the grounding metal layer190via the conductive path. Specifically, the grounding metal layer190is a flat metal foil, and the grounding metal layer190includes a metallic material such as copper and copper alloy. The present invention is not limited in this respect. Reference is made toFIGS.7-8.FIG.7illustrates a schematic view of the antenna device100.FIG.8illustrates a positional relationship between the defected metal layer130and the radiators170, andFIG.8neglects the second insulation layer150. In some embodiments of the present invention, the radiators170includes four first F-shaped radiators170aand four second F-shaped radiators170b, and the first F-shaped radiators170aare located between two and another two of the second F-shaped radiators170b, in which the second F-shaped radiators170bsurround the first F-shaped radiators170a. In addition, two free ends175of two of the first F-shaped radiators170aand two free ends175of another two of the first F-shaped radiators170arespectively face toward opposite directions in the first axial direction X. The second F-shaped radiators170bfurther include free ends175, and the free ends175of two of the second F-shaped radiators170band the free ends175of another two of the second F-shaped radiators170brespectively face toward opposite directions in the second axial direction Y. The present invention is not limited in this respect. In some embodiments of the present invention, two of the four first F-shaped radiators170aare aligned along the first axial direction X, and two of the four first F-shaped radiators170aare aligned along the second axial direction Y such that the four first F-shaped radiators170aare in mirror symmetry. In addition, two of the four second F-shaped radiators170bare aligned along the first axial direction X, and two of the four second F-shaped radiators170bare aligned along the second axial direction Y such that the four second F-shaped radiators170bare in mirror symmetry. Specifically, the four first F-shaped radiators170aand the four second F-shaped radiators170bare also in mirror symmetry. Reference is made toFIG.9.FIG.9illustrates a return loss diagram regarding the antenna device100inFIGS.7-8, and a curved line51and a curved line S2respectively represent the first F-shaped radiators170aand the second F-shaped radiators170b. As known fromFIG.9, the antenna device100is well applied in 3.5 Ghz of frequency band. In addition, the isolation between the first F-shaped radiators170aand the second F-shaped radiators170bis about −15 dB, so the first F-shaped radiators170aand the second F-shaped radiators170bdo not negatively affect each other, so as to prevent the antenna device100from being affecting and interfering by a metal conductor around the antenna device100. In embodiments of the present invention, isolations between radiators of the antenna device in the present invention is outstanding. For instance, the isolation among the radiators is at least −15 dB, so the antenna device can be used in 3.5 Ghz of frequency band. In addition, a defected metal layer can prevent the radiators from being affected by metal conductors around the radiators, so the antenna device can operate in multiple frequency bands under various circumstances. Although the present invention has been described in considerable detail with reference to certain embodiments thereof, other embodiments are possible. Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein. It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims. | 10,467 |
11942700 | DESCRIPTION OF EMBODIMENTS Further imparting of higher functions and further downsizing are being promoted with respect to wireless communication apparatuses. Due to the promotion of such imparting of higher functions and downsizing with respect to wireless communication apparatuses, spaces for providing an antenna apparatus inside the wireless communication apparatuses are becoming ever smaller. Therefore, a small-sized antenna apparatus capable of operating at a plurality of frequencies is desired. An object of an aspect of the disclosed technique is to provide an antenna apparatus which is capable of operating at a plurality of frequencies and which can be manufactured in a small size and a wireless communication apparatus which is mounted with the antenna apparatus. Hereinafter, an embodiment will be described. It is to be understood that configurations of the embodiment described below are illustrative and that the disclosed technique is not limited to the configurations of the embodiment. For example, an antenna apparatus according to the present embodiment is configured as described below. The antenna apparatus according to the present embodiment includes:a ground substrate;a feeding point provided on the ground substrate;a first loop antenna of which one end is electrically connected to the feeding point and of which another end is electrically connected to the ground substrate and moreover which operates at a first frequency; anda second loop antenna of which both ends are respectively connected to a first end point and a second end point of the first loop antenna and which operates at a second frequency, whereina space between the first end point and the second end point forms a gap with a range in which the first loop antenna is capable of resonating at the first frequency. The ground substrate is a grounded substrate. The first loop antenna is grounded by being electrically connected to the ground substrate. A gap is formed between the first end point and the second end point on the first loop antenna and an interval of the gap is set to a range in which the first loop antenna is capable of resonating at the first frequency. Setting the gap in this manner enables the first loop antenna to operate at the first frequency regardless of the presence of the gap. In addition, both ends of the second loop antenna are respectively connected to the first end point and the second end point. Forming the second loop antenna in this manner enables the second loop antenna to operate at the second frequency which differs from the first frequency. Note that the space between the first end point and the second end point is preferably a gap that is 1/50 of the first frequency. In addition, the first end point and the second end point are preferably provided in a range of ¼ or less of the first frequency from the feeding point. The present antenna apparatus may further include the following feature. A capacitor or an inductor is provided on an electric path between the first loop antenna and the ground substrate. The antenna apparatus with such a feature can change a frequency at which the first loop antenna resonates by appropriately adjusting a capacitance of the capacitor or an inductance of the inductor without changing physical lengths of the first loop antenna and the second loop antenna. The present antenna apparatus may further include the following feature. The first loop antenna and the ground substrate are electrically connected to each other by a spring contact. Adopting a spring contact more reliably realizes the electric connection between the first loop antenna and the ground substrate. The present antenna apparatus may further include the following feature. The first loop antenna is further electrically connected to the ground substrate at one or more locations on the first loop antenna. The antenna apparatus with such a feature enables a larger number of half-wavelength loop antennas to be provided inside the antenna apparatus. The present antenna apparatus may further include the following feature. The first loop antenna is provided with two or more second loop antennas which are operated by radio waves with frequencies that differ from each other. With such a feature, radio waves at which the antenna apparatuses resonate can be increased while keeping a size of an entire antenna apparatus to around ½ wavelength of a wavelength of a radio wave with the first frequency. The present antenna apparatus may further include the following feature. The antenna apparatus is mounted to a mobile terminal apparatus and at least a part of the first loop antenna is formed of a metal frame which constitutes an exterior of the mobile terminal apparatus. Examples of the mobile terminal apparatus include a mobile phone, a smartphone, a tablet computer, and a wearable computer. By using a metal external frame which constitutes an exterior of the mobile terminal apparatus as at least a part of the first loop antenna, the antenna apparatus with such a feature can reduce an area occupied by the antenna apparatus in a region defined by the metal frame. Therefore, the antenna apparatus with such a feature enables the mobile terminal apparatus to be downsized or enables a larger number of electronic components to be mounted to the mobile terminal apparatus. In addition, at least a part of the second loop antenna may be formed using Laser Direct Structuring (LDS) or a flexible substrate. The present antenna apparatus may further include the following feature. The antenna apparatus further includes a first conductor device of which one end is connected to a connecting point of the first loop antenna and which is parallel to the ground substrate, wherein a length from a contact point which connects the other end of the first loop antenna and the ground substrate to another end of the first conductor device via the first loop antenna is ¼ wavelength of a third frequency. The antenna apparatus with such a feature is capable of causing the first conductor device to operate as a monopole antenna. In addition, the disclosed technique may be a wireless communication apparatus mounted with an antenna apparatus having any of the features described above. Hereinafter, an embodiment will be further described with reference to the drawings.FIG.1is a diagram showing an example of an antenna according to the embodiment. An antenna1illustrated inFIG.1includes a first loop antenna101, a second loop antenna201, and a ground substrate3. Hereinafter, in the present specification, a right-hand side when facingFIG.1will be referred to as a +X direction, a left-hand side when facingFIG.1will be referred to as a −X direction, above when facingFIG.1will be referred to as a +Y direction, and below when facingFIG.1will be referred to as a −Y direction. The ground substrate3has a grounded ground surface3a. For example, the ground substrate3may be a printed substrate to which various electronic components are to be mounted. The ground substrate3also includes a feeding point2for feeding power to the antenna1. An entire surface of the ground substrate3may constitute the ground surface3a. The first loop antenna101is a loop antenna which includes a feed line11, a first conductor device12, and a second conductor device13and which operates at a first frequency f1. While the first loop antenna101is formed in a rectangular shape inFIG.1, the shape of the first loop antenna101is not limited to a rectangular shape. The first conductor device12is a conductor device which extends approximately parallel to the ground surface3aof the ground substrate3at a position separated by a predetermined distance from the ground substrate3. A +X-side end of the first conductor device12is electrically connected to the feeding point2by the feed line11. InFIG.1, the first conductor device12and the feed line11are approximately orthogonal to each other. The second conductor device13is a conductor device which electrically connects a −X-side end of the first conductor device12and the ground surface3aof the ground substrate3to each other. The second conductor device13is approximately orthogonal to the first conductor device12and the ground surface3a. A +Y-side end of the second conductor device13is electrically connected to the first conductor device12and a −Y-side end of the second conductor device13is electrically connected to the ground surface3a. Hereinafter, in the present specification, a portion where the second conductor device13connects to the ground surface3awill be referred to as a ground31for the sake of convenience. The second conductor device13may be a spring contact. The feed line11is a conductor device which electrically connects the +X-side end of the first conductor device12and the feeding point2to each other. The feed line11is approximately orthogonal to the first conductor device12and the ground surface3a. A +Y-side end of the feed line11is electrically connected to the first conductor device12and a −Y-side end of the feed line11is electrically connected to the feeding point2. The feed line11includes a feed line11aand a feed line11b. A −Y-side end of the feed line11ais electrically connected to the feeding point2and a +Y-side end of the feed line11aconstitutes a first end point111. A −Y-side end of the feed line11bconstitutes a second end point112and a +Y-side end of the feed line11bis electrically connected to the +X-side end of the first conductor device12. A gap D with a range in which the first loop antenna101is capable of resonating at the first frequency f1is formed between the first end point111and the second end point112. A distance between the first end point111and the second end point112(a size of the gap D) is, for example, 1/50 of the first frequency f1. For example, the first end point111and the second end point112are provided in a range of ¼ or less of the first frequency f1from the feeding point2. The second loop antenna201is a loop antenna which includes a first connecting device21, a second connecting device22, and a flexed device23and which operates at a second frequency f2. The first connecting device21is a conductor device which is parallel to the ground surface3aof the ground substrate3and of which a −X-side end is connected to the first end point111of the feed line11. The second connecting device22is a conductor device which is parallel to the ground surface3aand of which a −X-side end is connected to the second end point112of the feed line11. The flexed device23is a conductor device which connects, in a loop shape, the +X-side end of the first connecting device21and a +X-side end of the second connecting device22to each other. While the flexed device23is formed in a rectangular shape inFIG.1, the flexed device23may be formed by smooth curves. In addition, the first connecting device21and the second connecting device22may be omitted and the first end point111and the second end point112of the feed line11may be connected by the flexed device23. While the first connecting device21and the second connecting device22are parallel to the ground surface3aof the ground substrate3inFIG.1, the first connecting device21and the second connecting device22are not limited to being parallel to the ground surface3a. FIG.2is a diagram schematically illustrating a first loop antenna and a second loop antenna which are included in the antenna according to the embodiment. The first loop antenna101is a loop antenna of half wavelength and a path length from the feeding point2to the ground31via the feed line11, the first conductor device12, and the second conductor device13is approximately equal to ½ of a wavelength at the first frequency f1. The second loop antenna201is a loop antenna of 1 wavelength which is formed by a path from the first end point111to the second end point112via the first connecting device21, the flexed device23, and the second connecting device22. An antenna length of the second loop antenna201is approximately equal to a wavelength at the second frequency f2. In this case, as is evident from reference toFIG.2, the antenna length of the first loop antenna101is longer than the antenna length of the second loop antenna201. Therefore, a relationship between the frequency f1and the frequency f2is expressed as (frequency f2)>(frequency f1). Working Effects of Embodiment The antenna1according to the embodiment includes the first loop antenna101and the second loop antenna201. The second loop antenna is connected to the first end point111and the second end point112of the first loop antenna101. In this case, an interval of the gap D (an interval between the first end point111and the second end point112) is set to a range in which the first loop antenna101is capable of resonating at the first frequency f1. Therefore, the first loop antenna101can be used as a loop antenna of half wavelength which operates at the first frequency f1. On the other hand, by setting a path length from the first end point111to the second end point112via the first connecting device21, the flexed device23, and the second connecting device22approximately equal to the wavelength at the second frequency f2, the second loop antenna201can be used as a loop antenna of 1 wavelength which operates at the second frequency f2. First Modification While the second loop antenna201is provided outside of a region defined by the first loop antenna101in the embodiment, alternatively, the second loop antenna201may be provided inside the region defined by the first loop antenna101.FIG.3is a diagram showing an example of an antenna according to a first modification. In an antenna1aaccording to the first modification, a first connecting device21ais a conductor device which is parallel to the ground surface3aof the ground substrate3and of which a +X-side end is connected to the first end point111of the feed line11. A second connecting device22ais a conductor device which is parallel to the ground surface3aand of which a +X-side end is connected to the second end point112of the feed line11. A flexed device23ais a conductor device which connects, in a loop shape, a −X-side end of the first connecting device21aand a −X-side end of the second connecting device22ato each other. According to such a configuration, a second loop antenna201ais provided inside the region defined by the first loop antenna101. Adopting such a configuration enables the antenna1aaccording to the first modification to be more downsized than the antenna1according to the embodiment. Second Modification FIG.4is a diagram showing an example of an antenna according to a second modification. An antenna1billustrated inFIG.4differs from the antenna1according to the embodiment in that a branch point12abetween the −X-side end and the +X-side end of the first conductor device12and the ground surface3aare electrically connected to each other by a third conductor device13a. Hereinafter, in the present specification, a portion where the third conductor device13aand the ground surface3aare connected to each other will be referred to as a ground32for the sake of convenience. FIG.5is a diagram schematically showing a loop antenna which operates on the antenna according to the second modification. As is evident from reference toFIG.5, the antenna1baccording to the second modification has loop antennas101aand101bin addition to the loop antennas101and201. The loop antenna101ais a half-wavelength loop antenna which is formed by a path from the feeding point2to the ground32via the feed line11, the first conductor device12, the branch point12a, and the third conductor device13a. In addition, the loop antenna101bis a half-wavelength loop antenna which is formed by a path from the ground32to the ground31via the branch point12a, the first conductor device12, and the second conductor device13. Appropriately determining a position of the branch point12aenables antenna lengths of the loop antennas101aand101bto be set and, by extension, enables a frequency of a radio wave at which the loop antennas101aand101bresonate to be set. While the first conductor device12is electrically connected to the ground surface3aby the third conductor device13afrom the branch point12aat one location provided between the −X-side end and the +X-side end of the first conductor device12inFIGS.4and5, alternatively, branch points may be provided in plurality and each of the branch points provided in plurality and the ground surface3amay be electrically connected to each other by a conductor device. Adopting such a design enables loop antennas which operate on the antenna1bto be further increased. Third Modification FIG.6is a diagram showing an example of an antenna according to a third modification. An antenna1cillustrated inFIG.6differs from the antenna1according to the embodiment in that the antenna1cfurther includes a fourth conductor device14. The fourth conductor device14is a device which is parallel to the ground surface3aand of which a −X-side end is connected to the −X-side end of the first conductor device12. A length of the fourth conductor device14from the ground31to the −X-side end of the fourth conductor device14via the second conductor device13is set equal to ¼ of a frequency at which the fourth conductor device14resonates. FIG.7is a diagram schematically showing a loop antenna and a monopole antenna which operate on the antenna according to the third modification. As is evident from reference toFIG.7, the antenna1caccording to the third modification has a monopole antenna301in addition to the loop antennas101and201. The monopole antenna301is a monopole antenna of ¼ wavelength which is formed by a path from the ground31to the −X-side end of the fourth conductor device14via the second conductor device13. Fourth Modification FIG.8is a diagram showing an example of an antenna according to a fourth modification. An antenna1dillustrated inFIG.8is provided with a capacitor41between the second conductor device13and the ground31. For example, the capacitor41is a reduction capacitor. Appropriately setting a capacitance of the capacitor41enables, for example, an electric antenna length of the loop antenna101to be reduced. In other words, by providing the capacitor41between the second conductor device13and the ground31, a frequency at which the loop antenna101resonates can be made higher than the frequency f1. Fifth Modification FIG.9is a diagram showing an example of an antenna according to a fifth modification. An antenna1eillustrated inFIG.9is provided with an inductor42between the second conductor device13and the ground31. For example, the inductor42is an extension coil. Appropriately setting an inductance of the inductor42enables, for example, the electric antenna length of the loop antenna101to be extended. Specifically, by providing the inductor42between the second conductor device13and the ground31, a frequency at which the loop antenna101resonates can be made lower than the frequency f1. Sixth Modification FIG.10is a partial view of an example of an antenna according to a sixth modification.FIG.10illustrates a vicinity of the feeding point2of an antenna if according to the sixth modification. In the antenna1f, the capacitor41and the inductor42are connected in parallel between the feed line11aand the feeding point2and a switch device43for switching between the capacitor41and the inductor42is provided. By switching the switch device43, switching between the capacitor41and the inductor42can be performed and, by extension, a frequency at which the loop antenna101resonates can be changed. Note that portions other than the switch device43of the antenna if are similar to those of the antenna1according to the embodiment. Seventh Modification Antennas including a single second loop antenna201have been described in the embodiment and the modifications explained above. In a seventh modification, an antenna including two or more second loop antennas will be described. FIG.11is a diagram showing an example of the antenna according to the seventh modification. In an antenna1gillustrated inFIG.11, in addition to the second loop antenna201, a second loop antenna201bis provided midway along a path of the first loop antenna101. The second loop antenna201bis formed by connecting a flexed device23bvia the first connecting device21aand the second connecting device22aat each of a first end point111aand a second end point112a. A gap D between the first end point111aand the second end point112ais formed so that the first loop antenna101can resonate at the first frequency f1in a similar manner to the gap D between the first end point111and the second end point112. FIG.12is a diagram schematically illustrating a loop antenna included in the antenna according to the seventh modification. The second loop antenna201bis a loop antenna of 1 wavelength which is formed by a path from the first end point111ato the second end point112avia the first connecting device21a, the flexed device23b, and the second connecting device22a. An antenna length of the second loop antenna201bis approximately equal to a wavelength of a radio wave which causes the second loop antenna201bto operate. Note thatFIGS.11and12illustrate an antenna including two second loop antennas201and201b. However, the number of second loop antennas included in the antenna1gaccording to the seventh modification is not limited to two. In the antenna1g, two or more second loop antennas which operate at frequencies that differ from each other may be provided midway along the path of the first loop antenna101. By providing the second loop antenna in plurality, the antenna according to the seventh modification is capable of increasing radio waves which enable the antenna to resonate while keeping a size of the entire antenna to around ½ wavelength of a wavelength of a radio wave with the first frequency. Application Example FIG.13is a diagram showing an application example. The application example illustrated inFIG.13represents an example in which an antenna1hcombining the second modification and the third modification is applied to a smartphone500.FIG.13illustrates a state where a display-side case of the smartphone500has been opened. The smartphone500is a portable information processing apparatus which includes a processor, a memory, and the like. The smartphone500performs radio communication with an external apparatus using the antenna1h. In the smartphone500, a side surface (periphery) thereof is surrounded by a frame-like metal frame51. The metal frame51is an exterior which covers the side surface of the smartphone500. Corners of the metal frame51are formed in round arc shapes. The ground substrate3is housed in a region defined by the metal frame51. In the smartphone500, a speaker used for communication by telephone is provided on an upper side (+Y side) and a microphone used for communication by telephone is provided on a lower side (−Y side). In the smartphone500, a part of the metal frame51is used as the antenna1h. InFIG.13, the antenna1his provided on a lower side of the smartphone500. As illustrated inFIG.13, a space between a region used as the antenna1hand another region among the metal frame51is provided with slits511and512. A first conductor device12is electrically separated by the slit511from the region not used as the antenna1hamong the metal frame51. A third conductor device14ais electrically separated by the slit512from the region not used as the antenna1hamong the metal frame51. In the smartphone500, a portion of a corner formed on an arc in the metal frame51is used as the first conductor device12. In this manner, by also using the metal frame51as a conductor device of the antenna1h, an area occupied by the antenna1hin a region defined by the metal frame51can be reduced. The flexed device23used as the second loop antenna of the antenna1his formed on the ground substrate3using, for example, Laser Direct Structuring (LDS) or a flexible substrate. One end of the flexed device23is electrically connected to the feeding point2and another end thereof is electrically connected to the +Y-side end of the first conductor device12. A branch point12cis provided at the −X-side end of the first conductor device12. In addition, a branch point12bis provided in a range of the branch point12cand the +X-side end of the first conductor device12. The branch point12band the ground substrate3are electrically connected by a third conductor device13b. In addition, the branch point12cand the ground substrate3are electrically connected by a third conductor device13c. A range from the branch point12cto the slit512in the −X direction is used as the fourth conductor device14. The branch points12band12cmay be spring contacts. Hereinafter, in the present specification, a portion where the third conductor device13band the ground surface3aare connected to each other will be referred to as a ground31afor the sake of convenience. In a similar manner, a portion where the third conductor device13cand the ground surface3aare connected to each other will be referred to as a ground31b. FIG.14is a diagram of a region near an antenna having been excerpted from a smartphone according to the application example. The antenna1hincludes loop antennas101g,101h,101k, and201gand the monopole antenna301. The loop antenna101goperates as a loop antenna for a frequency f71by setting a length from the feeding point2to the ground31bvia the flexed device23, the first conductor device12, the branch point12c, and the third conductor device13cso as to equal ½ wavelength of a wavelength of the frequency f71. For example, the frequency f71is 700 MHz. The loop antenna101hoperates as a loop antenna for a frequency f72by setting a length from the feeding point2to the ground31avia the flexed device23, the first conductor device12, the branch point12b, and the third conductor device13bso as to equal ½ wavelength of a wavelength of the frequency f72. For example, the frequency f72is 900 MHz. The loop antenna101koperates as a loop antenna for a frequency f73by setting a length from the ground31ato the ground31bvia the third conductor device13b, the branch point12b, the first conductor device12, the branch point12c, and the third conductor device13cso as to equal ½ wavelength of a wavelength of the frequency f73. For example, the frequency f73is 4500 MHz. The loop antenna201goperates as a loop antenna for a frequency f74by setting a length from the feeding point2to the second end point112via the flexed device23so as to equal 1 wavelength of the frequency f74. For example, the frequency f74is 2000 MHz. The monopole antenna301operates as a loop antenna for a frequency f75by setting a length from the ground31bto the −X-side end of the fourth conductor device14via the third conductor device13cand the branch point12cso as to equal ¼ wavelength of a wavelength of the frequency f75. For example, the frequency f75is 5000 MHz. The antenna1hwith such a feature can be used at four frequencies which differ from each other. FIG.15is a diagram illustrating total efficiency of the antenna used in the application example. An ordinate inFIG.15illustrates total efficiency (dB) while an abscissa illustrates frequency (MHz). With reference toFIG.15, given that the graph peaks near the frequency f71, near the frequency f72, near the frequency f73, near the frequency f74, and near the frequency f75, it can be understood that total efficiency is high. Evaluation of Gap D An evaluation of a variation of S11 of the antenna1gwhen changing an interval of the gap D has been carried out and will now be explained.FIG.16is a diagram illustrating a variation of S11 when changing the gap D. An ordinate inFIG.16illustrates S11 (dB) while an abscissa illustrates frequency (MHz). In the present evaluation, the frequency f71at which the loop antenna101gis operated is set to 700 MHz and the frequency f74at which the loop antenna201gis operated is set to 2000 MHz. In the evaluation illustrated inFIG.16, a case where the interval of the gap D is set to four gaps, namely, λ71/137, λ71/65, λ71/50, and λ71/42.6 is evaluated. In the present evaluation, relative permittivity of each conductor device is set to 3.0. As is evident from reference toFIG.16, by setting the gap D to 1/50 or less of the wavelength of the frequency f71used by the loop antenna101h, a value (S11 of 6 dB or lower) that is preferable as an antenna for a smartphone can be realized with respect to any of the frequency f71and the frequency f74. The embodiment and the modifications disclosed above can be combined with each other. The disclosed technique can provide an antenna apparatus which is capable of operating at a plurality of frequencies and which can be manufactured in a small size and a wireless communication apparatus which is mounted with the antenna apparatus. All examples and conditional language provided herein are intended for the pedagogical purposes of aiding the reader in understanding the invention and the concepts contributed by the inventor to further the art, and are not to be construed as limitations to such specifically recited examples and conditions, nor does the organization of such examples in the specification relate to a showing of the superiority and inferiority of the invention. Although one or more embodiments of the present invention have been described in detail, it should be understood that the various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the invention. | 29,620 |
11942701 | DETAILED DESCRIPTION OF VARIOUS EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First Embodiment FIG.1is an exploded perspective view of a module substrate according to the present embodiment, andFIG.2shows plan views illustrating antenna patterns forming the module substrate according to the present embodiment. As shown inFIG.1, a module substrate1includes a stack2of a plurality of (four in the present embodiment) insulating layers3to6, an IC mounting insulating layer9located on the uppermost layer of the stack2, and an insulating layer11located on the lowermost layer of the stack2. The insulating layers3to6are made of, for example, a non-magnetic material composed of a non-magnetic ferrite, and the stack2is formed by stacking the insulating layers3to6. For example, Zn ferrite powder can be used as a main component of the non-magnetic material, and the composition ratio of the components is preferably as follows: Fe2O3: 40.0 to 50.0 mol %, ZnO: 35.0 to 50.0 mol %, and CuO: 5 to 20 mol %. Although the thickness of each insulating layer3to6is not particularly limited, the thickness of each insulating layer3to6is preferably 20 μm to 100 μm when a multilayer ceramic technique using green sheets is performed. As shown inFIG.1, the IC mounting insulating layer9is located on an IC mounting surface of the uppermost insulating layer3of the stack2, and IC mounting electrodes12are located on an outer surface9aof the insulating layer9. Like the insulating layers3to6described above, the insulating layer9can be made of, for example, a non-magnetic material composed of a non-magnetic ferrite. As shown inFIG.1, a first antenna coil pattern3a, a second antenna coil pattern5a, a third antenna coil pattern4a, and a fourth antenna coil pattern6aare provided on the surfaces of the plurality of insulating layers3to6, respectively. The first to fourth antenna coil patterns3ato6aare made of an electrically conductive material, and are formed by an antenna pattern wound into a rectangular spiral shape. As shown inFIG.1, a first coil7is formed by the first antenna coil pattern3aand the second antenna coil pattern5a, and the first antenna coil pattern3aand the second antenna coil pattern5aare interlayer-connected in series. Similarly, a second coil8is formed by the third antenna coil pattern4aand the fourth antenna coil pattern6a, and the third antenna coil pattern4aand the fourth antenna coil pattern6aare interlayer-connected in series. As shown inFIG.1, the first coil7and the second coil8are connected in parallel. As shown inFIG.1, the present embodiment is characterized in that the first to fourth antenna coil patterns3ato6aare arranged in order of the first antenna coil pattern3a, the third antenna coil pattern4a, the second antenna coil pattern5a, and the fourth antenna coil pattern6ain the stack2. Therefore, the third antenna coil pattern4ais located between the first antenna coil pattern3aand the second antenna coil pattern5a, and the second antenna coil pattern5ais located between the third antenna coil pattern4aand the fourth antenna coil pattern6a. Since a layer of another series coil is thus interposed between the layers of a series coil, the distance between the layers of the series coil can be doubled. As a result, the parasitic capacitance of one series coil can be reduced to ½. Therefore, the combined inductance of the first and second coils7,8connected in parallel can be increased. As shown inFIG.1, the insulating layer11for a routing wire is located on the lowermost insulating layer6of the stack2. A routing wire16for connecting an end of the first coil7and an end of the second coil8in parallel and connecting the first coil7and the second coil8to the IC mounting electrodes12via through holes is located on the surface of the insulating layer11. Like the insulating layers3to6described above, the insulating layer11can be made of, for example, a non-magnetic material composed of a non-magnetic ferrite. The material forming the routing wire16is not particularly limited, but for example, an electrically conductive material that forms the antenna coil patterns3ato6adescribed above can be used. The insulating layers3to6are provided with interlayer connection conductors12a,12bextending through the insulating layers3to6in the thickness direction. The first antenna coil pattern3aand the second antenna coil pattern5aare electrically connected via the interlayer connection conductor12a, and the third antenna coil pattern4aand the fourth antenna coil pattern6aare electrically connected via the interlayer connection conductor12b. The insulating layers3to6and the insulating layers9,11are provided with an interlayer connection conductor22aextending through the insulating layers3to6and the insulating layers9,11in the thickness direction. The routing wire16is electrically connected to the IC mounting electrode12via the interlayer connection conductor22a. The first antenna coil pattern3aand the third antenna coil pattern4aare electrically connected to the IC mounting electrode12via the interlayer connection conductor22b, and the second antenna coil pattern5aand the fourth antenna coil pattern6aare electrically connected to the routing wire16via interlayer connection conductors22c,22d. The materials forming the first to fourth antenna coil patterns3ato6aand the interlayer connection conductors12a,12b,20ato20dare not particularly limited, but for example, silver, copper, etc. can be used. In the present embodiment, as described above, the first antenna coil pattern3aand the second antenna coil pattern5aare interlayer-connected in series, and the third antenna coil pattern4aand the fourth antenna coil pattern6aare interlayer-connected in series. However, since the end layers of the series coils (that is, the first antenna coil pattern3aand the third antenna coil pattern4a; and the second antenna coil pattern5aand the fourth antenna coil pattern6a) are located close to each other, the routing wire16for connecting the first coil7and the second coil8in parallel can be shortened, as shown inFIG.1. Therefore, the parasitic capacitance generated in the connection wires can be reduced. As shown inFIG.2, the first to fourth antenna coil patterns3ato6aare wound so that the directions of a current flowing through the first to fourth antenna coil patterns3ato6a(directions of arrows in the figure) are all the same direction (that is, all clockwise) with respect to the axis of the coil, are wound so that the directions of a current in the first and third antenna coil patterns3a,4aare the same direction (that is, from inside to outside as viewed in plan) with respect to the radial direction of the coil, and are wound so that the directions of a current in the second and fourth antenna coil patterns5a,6aare the opposite direction to the direction of a current in the first and third antenna coil patterns3a,4a(that is, from outside to inside as viewed in plan) with respect to the radial direction of the coil. Accordingly, the magnetic fields generated from each coil pattern do not interfere with each other. The inductance is therefore not reduced, and the communication sensitivity of an antenna can be increased. Second Embodiment Next, a second embodiment of the present invention will be described.FIG.3is an exploded perspective view of a module substrate according to a second embodiment of the present invention. Components similar to those of the first embodiment are denoted by the same reference characters, and description thereof will be omitted. As shown inFIG.3, a module substrate20of the present embodiment is characterized in that the module substrate20includes pluralities of the first and second coils7,8(in this example, two each), each formed by arranging the first antenna coil pattern3a, the third antenna coil pattern4a, the second antenna coil pattern5a, and the fourth antenna coil pattern6in this order. With such a configuration, the following effects can be obtained in addition to the effects described above in the first embodiment. That is, the first coils7are composed of the repetition of the first antenna coil pattern3aand the second antenna coil pattern5athat are interlayer-connected in series, and the second coils8are composed of the repetition of the third antenna coil pattern4aand the fourth antenna coil pattern6athat are interlayer-connected in series. Therefore, as shown inFIG.3, a winding start3bof the first antenna coil pattern3aand a winding end5bof the second antenna coil pattern5acan be aligned, and a winding start4bof the third antenna coil pattern4aand a winding end6bof the fourth antenna coil pattern6acan be aligned. Since the wireable range can be used to the maximum extent possible in the insulating layers3to6, the number of turns of the first to fourth antenna coil patterns3ato6acan be increased, and as a result, the combined inductance of the first and second coils7,8connected in parallel can be increased. Since the winding start3bof the first antenna coil pattern3aand the winding end5bof the second antenna coil pattern5acan be aligned and the winding start4bof the third antenna coil pattern4aand the winding end6bof the fourth antenna coil pattern6acan be aligned, the interlayer connection conductors12a,12bcan be shortened. As a result, the parasitic capacitance generated in the interlayer connection conductors12a,12bcan be reduced. The expression “the winding start3bof the first antenna coil pattern3aand the winding end5bof the second antenna coil pattern5aare aligned” refers to the state in which a part of a winding start region3cof the first antenna coil pattern3aand a part of a winding end region5cof the second antenna coil pattern5aoverlap each other as viewed in plan shown inFIGS.4and5, and is not limited to the state in which the winding start3bof the first antenna coil pattern3aand the winding end5bof the second antenna coil pattern5aoverlap each other as viewed in plan. The length of the winding start region3cand the length of the winding end region5cin the axis of the coil is not particularly limited, but is preferably ¼ or less of the length of one turn of the coil. Like the above expression “the winding start3bof the first antenna coil pattern3aand the winding end5bof the second antenna coil pattern5aare aligned,” the expression “the winding start4bof the third antenna coil pattern4aand the winding end6bof the fourth antenna coil pattern6aare aligned” also refers to the state in which a part of a winding start region of the third antenna coil pattern4aand a part of a winding end region of the fourth antenna coil pattern6aoverlap each other as viewed in plan, and is not limited to the state in which the winding start4bof the third antenna coil pattern4aand the winding end6bof the fourth antenna coil pattern6aoverlap each other as viewed in plan. Third Embodiment Next, a third embodiment of the present invention will be described.FIG.6is an exploded perspective view of a module substrate according to a third embodiment of the present invention. Components similar to those of the above embodiments are denoted by the same reference characters, and description thereof will be omitted. As shown inFIG.6, a module substrate30of the present embodiment includes a third coil15composed of a fifth antenna coil pattern13aand a sixth antenna coil pattern14a, in addition to the first coil7and the second coil8of the first embodiment described above. More specifically, an insulating layer13is located between the insulating layers4,5, and the fifth antenna coil pattern13ais located on a surface of the insulating layer13. An insulating layer14is located between the insulating layer6and the insulating layer11, and the sixth antenna coil pattern14ais located on a surface of the insulating layer14. The insulating layers13,14are made of, for example, the above non-magnetic material composed of a non-magnetic ferrite. Like the first to fourth antenna coil patterns3ato6adescribed above, the fifth and sixth antenna coil patterns13a,14aare made of an electrically conductive material, and are formed by an antenna pattern wound into a rectangular spiral shape. The module substrate30includes a stack2of a plurality of (six in the present embodiment) insulating layers3to6,13, and14, and the third coil15is connected in parallel with the first and second coils7,8. As shown inFIG.6, the present embodiment is characterized in that the first antenna coil pattern3a, the third antenna coil pattern4a, the fifth antenna coil pattern13a, the second antenna coil pattern5a, the fourth antenna coil pattern6a, and the sixth antenna coil pattern14aare arranged in this order in the stack2. Therefore, the third antenna coil pattern4aand the fifth antenna coil pattern13aare located between the first antenna coil pattern3aand the second antenna coil pattern5a. The fifth antenna coil pattern13aand the second antenna coil pattern5aare located between the third antenna coil pattern4aand the fourth antenna coil pattern6a. The second antenna coil pattern5aand the fourth antenna coil pattern6aare located between the fifth antenna coil pattern13aand the sixth antenna coil pattern14a. Layers of other series coils are thus interposed between the layers of a series coil. Accordingly, the distance between the layers of the series coil can be tripled, and the parasitic capacitance of one series coil can therefore be reduced to ⅓. As a result, the combined inductance of the first, second, and third coils7,8,15connected in parallel can be increased. The stack2is provided with an interlayer connection conductor12c, and the fifth antenna coil pattern13aand the sixth antenna coil pattern14aare electrically connected via the interlayer connection conductor12c. The module substrate30is provided with an interlayer connection conductor22e, and the sixth antenna coil pattern14ais electrically connected to the routing wire16via the interlayer connection conductor22e. The materials forming the antenna coil patterns13a,14aand the interlayer connection conductors22d,22eare not particularly limited, but for example, silver, copper, etc. can be used. In the present embodiment, as described above, the first antenna coil pattern3aand the second antenna coil pattern5aare interlayer-connected in series, the third antenna coil pattern4aand the fourth antenna coil pattern6aare interlayer-connected in series, and the fifth antenna coil pattern13aand the sixth antenna coil pattern14aare interlayer-connected in series. However, since the end layers of the series coils (that is, the first antenna coil pattern3a, the third antenna coil pattern4a, and the fifth antenna coil pattern13a; and the second antenna coil pattern5a, the fourth antenna coil pattern6a, and the sixth antenna coil pattern14a) are located close to each other, the routing wire16for connecting the first coil7, the second coil8, and the third coil15in parallel can be shortened, as shown inFIG.6. Therefore, the parasitic capacitance generated in the connection wires can be reduced. As shown inFIGS.2and7, the first to sixth antenna coil patterns3ato6a,13a, and14aare wound so that the directions of a current flowing through the first to sixth antenna coil patterns3ato6a,13a, and14a(directions of arrows in the figures) are all the same direction (that is, all clockwise) with respect to the axis of the coil, are wound so that the directions of a current in the first, third, and fifth antenna coil patterns3a,4a, and13aare the same direction (that is, from inside to outside as viewed in plan) with respect to the radial direction of the coil, and are wound so that the directions of a current in the second, fourth, and sixth antenna coil patterns5a,6a, and14aare the opposite direction to the direction of a current in the first, third, and fifth antenna coil patterns3a,4a, and13a(that is, from outside to inside as viewed in plan) with respect to the radial direction of the coil. Accordingly, the magnetic fields generated from each coil pattern do not interfere with each other. The inductance is therefore not reduced, and the communication sensitivity of an antenna can be increased. Fourth Embodiment Next, a fourth embodiment of the present invention will be described.FIG.8is an exploded perspective view of a module substrate according to a fourth embodiment of the present invention. Components similar to those of the above embodiments are denoted by the same reference characters, and description thereof will be omitted. As shown inFIG.8, a module substrate50of the present embodiment includes a fourth coil19composed of a seventh antenna coil pattern17aand an eighth antenna coil pattern18a, in addition to the first to third coils7,8, and15of the third embodiment described above. More specifically, an insulating layer17is located between the insulating layers13,5, and the seventh antenna coil pattern17ais located on a surface of the insulating layer17. An insulating layer18is located between the insulating layer14and the insulating layer11, and the eighth antenna coil pattern18ais located on a surface of the insulating layer18. The insulating layers17,18are made of, for example, the non-magnetic material composed of a non-magnetic ferrite. Like the first to sixth antenna coil patterns3ato6a,13a, and14adescribed above, the seventh and eighth antenna coil patterns17a,18aare made of an electrically conductive material, and are formed by an antenna pattern wound into a rectangular spiral shape. The module substrate50includes a stack2of a plurality of (eight in the present embodiment) insulating layers3to6,13,14,17, and18, and the fourth coil19is connected in parallel with the first and second coils7,8and the third coil15. As shown inFIG.8, the present embodiment is characterized in that the first antenna coil pattern3a, the third antenna coil pattern4a, the fifth antenna coil pattern13a, the seventh antenna coil pattern17a, the second antenna coil pattern5a, the fourth antenna coil pattern6a, the sixth antenna coil pattern14a, and the eighth antenna coil pattern18aare arranged in this order in the stack2. Therefore, the third antenna coil pattern4a, the fifth antenna coil pattern13a, and the seventh antenna coil pattern17aare located between the first antenna coil pattern3aand the second antenna coil pattern5a. The fifth antenna coil pattern13a, the seventh antenna coil pattern17a, and the second antenna coil pattern5aare located between the third antenna coil pattern4aand the fourth antenna coil pattern6a. The seventh antenna coil pattern17a, the second antenna coil pattern5a, and the fourth antenna coil pattern6aare located between the fifth antenna coil pattern13aand the sixth antenna coil pattern14a. The second antenna coil pattern5a, the fourth antenna coil pattern6a, and the sixth antenna coil pattern14aare located between the seventh antenna coil pattern17aand the eighth antenna coil pattern18a. Layers of other series coils are thus interposed between the layers of a series coil. Accordingly, the distance between the layers of the series coil can be quadrupled, and the parasitic capacitance of one series coil can therefore be reduced to ¼. As a result, the combined inductance of the first, second, and third, and fourth coils7,8,15, and19connected in parallel can be increased. The stack2is provided with an interlayer connection conductor12d, and the seventh antenna coil pattern17aand the eighth antenna coil pattern18aare electrically connected via the interlayer connection conductor12d. The eighth antenna coil pattern18ais electrically connected to the routing wire16via the interlayer connection conductor22e. The material forming the antenna coil patterns17a,18ais not particularly limited, but for example, silver, copper, etc. can be used. In the present embodiment, as described above, the first antenna coil pattern3aand the second antenna coil pattern5aare interlayer-connected in series, the third antenna coil pattern4aand the fourth antenna coil pattern6aare interlayer-connected in series, the fifth antenna coil pattern13aand the sixth antenna coil pattern14aare interlayer-connected in series, and the seventh antenna coil pattern17aand the eighth antenna coil pattern18aare interlayer-connected in series. However, since the end layers of the series coils (that is, the first antenna coil pattern3a, the third antenna coil pattern4a, the fifth antenna coil pattern13a, and the seventh antenna coil pattern17a; and the second antenna coil pattern5a, the fourth antenna coil pattern6a, the sixth antenna coil pattern14a, and the eighth antenna coil pattern18a) are located close to each other, the routing wire16for connecting the first coil7, the second coil8, the third coil15, and the fourth coil19in parallel can be shortened, as shown inFIG.8. Therefore, the parasitic capacitance generated in the connection wires can be reduced. As shown inFIGS.2,7, and9, the first to eighth antenna coil patterns3ato6a,13a,14a,17a, and18aare wound so that the directions of a current flowing through the first to eighth antenna coil patterns3ato6a,13a,14a,17a, and18a(directions of arrows in the figures) are all the same direction (that is, all clockwise) with respect to the axis of the coil, are wound so that the directions of a current in the first, third, fifth, and seventh antenna coil patterns3a,4a,13a, and17aare the same direction (that is, from inside to outside as viewed in plan) with respect to the radial direction of the coil, and are wound so that the directions of a current in the second, fourth, sixth, and eighth antenna coil patterns5a,6a,14a, and18aare the opposite direction to the direction of a current in the first, third, fifth, and seventh antenna coil patterns3a,4a,13a, and17a(that is, from outside to inside as viewed in plan) with respect to the radial direction of the coil. Accordingly, the magnetic fields generated from each coil pattern do not interfere with each other. The inductance is therefore not reduced, and the communication sensitivity of an antenna can be increased. The above embodiments may be modified as follows. In the second embodiment (FIG.3), the pluralities of first and second coils7,8(two each) are provided. However, as in a module substrate40shown inFIG.10, the two layers (insulating layers5,6) on the insulating layer11side may be removed from the module substrate20shown inFIG.3. In such a configuration as well, effects similar to those of the above module substrate20can be obtained. The module substrates antennas including the first to fourth coils are illustrated in the above embodiments. In the module substrate antenna of the present invention, however, the number of coils is not particularly limited, and five or more coils may be connected in parallel. As in the case ofFIG.3, pluralities of the first to third coils7,8, and15shown inFIG.6, each formed by arranging the first antenna coil pattern3a, the third antenna coil pattern4a, the fifth antenna coil pattern13a, the second antenna coil pattern5a, the fourth antenna coil pattern6a, and the sixth antenna coil pattern14ain this order, may be provided. Similarly, pluralities of the first to fourth coils7,8,15, and19shown inFIG.8, each formed by arranging the first antenna coil pattern3a, the third antenna coil pattern4a, the fifth antenna coil pattern13a, the seventh antenna coil pattern17a, the second antenna coil pattern5a, the fourth antenna coil pattern6a, the sixth antenna coil pattern14a, and the eighth antenna coil pattern18ain this order, may be provided. With such a configuration, effects similar to those of the module substrate20shown inFIG.3that includes the pluralities of first and second coils7,8can be obtained. The module substrate of the present invention can be effectively used as a module substrate on which an IC chip etc. is mounted and which includes a built-in multilayer coil component (dynamic tag) functioning as an antenna for wireless communication. | 24,107 |
11942702 | DESCRIPTION OF EMBODIMENTS In a wireless communication apparatus which uses a part of a metal frame constituting an exterior as an antenna, a portion used as the antenna and a portion not used as the antenna are electrically separated from each other by a gap. When such a wireless communication apparatus is gripped by a hand, the hand electrically connects the gap and changes an antenna length and, as a result, a resonant frequency of the antenna may vary. Therefore, there is a concern that performance of the antenna at a desired frequency may decline. One aspect of the disclosed technique is to suppress, in a wireless communication apparatus which uses a metal frame constituting an exterior as an antenna, a decline in antenna performance due to a hand coming into contact with the metal frame. Embodiment Hereinafter, an embodiment will be described. It is to be understood that configurations of the embodiment described below are illustrative and that the disclosed technique is not limited to the configurations of the embodiment. A wireless communication apparatus according to the embodiment includes:a metal frame which encloses a side surface of a main body portion formed in a plate shape; anda ground plate which is housed in the main body portion, whereinthe metal frame includes:a monopole antenna which is electrically connected to a feeding point at an intermediate portion of a first frame defined by a first gap and a second gap provided on the metal frame and which resonates with a radio wave at a first frequency defined by the intermediate portion and the second gap;a first conductive portion which is defined by the second gap and a third gap provided on the metal frame and which is insulated from the ground plate; anda second conductive portion which is defined by the first gap and the third gap and of which at least an end on the third gap side is electrically connected to the ground plate,a length combining the monopole antenna and the first conductive portion being a length enabling the monopole antenna and the first conductive portion to resonate with a radio wave at the first frequency as a loop antenna. In the present wireless communication apparatus, the ground plate is a grounded member. The ground plate may be a substrate being mounted with components or a metal plate not being mounted with components. In the wireless communication apparatus which uses a part of the metal frame as a monopole antenna, the monopole antenna is electrically separated from other regions of the metal frame by the first gap and the second gap. Since the metal frame encloses the side surface of the main body portion of the wireless communication apparatus, when the wireless communication apparatus is gripped by a hand, capacitive coupling of the first gap and the second gap by the hand may cause the monopole antenna to become electrically connected to other regions of the metal frame. When the monopole antenna is electrically connected to other regions of the metal frame, a change in an antenna length causes a resonant frequency of the monopole antenna to change. As a result, antenna performance at the first frequency declines. In the wireless communication apparatus according to the present embodiment, the first conductive portion defined by the second gap and the third gap is not connected to the ground plate and a third gap-side of the second conductive portion is electrically connected to the ground plate. In addition, a length combining the monopole antenna and the first conductive portion is a length enabling the monopole antenna and the first conductive portion to resonate with a radio wave at the first frequency as a loop antenna. According to such a configuration, for example, even when each of the second gap and the third gap is capacitively coupled due to the present wireless communication apparatus being gripped by a hand, the wireless communication apparatus enables the monopole antenna and the first conductive portion to communicate as a loop antenna capable of resonating at the first frequency. Therefore, a decline in antenna performance with respect to a radio wave at the first frequency due to a hand coming into contact with the metal frame is suppressed. It may be noted that the metal frame may be formed in a rectangular shape and the first gap and the second gap may be formed on opposing long sides of the metal frame being formed in a rectangular shape. Examples of the wireless communication apparatus include a smartphone, a feature phone, a tablet computer, a notebook computer, and a wearable computer. The wireless communication apparatus according to the embodiment may include the following feature. A length of the first conductive portion may be ¼ of a wavelength of a radio wave at the first frequency. In order to enable the monopole antenna and the first conductive portion to operate as a loop antenna capable of resonating at the first frequency, a length of the first conductive portion need be an odd multiple of ¼ of the wavelength of a radio wave at the first frequency. It is conceivable that, since the first conductive portion is separated from the ground plate, extending the first conductive portion makes the metal frame vulnerable with respect to external force. Making the first conductive portion equal to ¼ of the wavelength of a radio wave at the first frequency enables the second conductive portion which is capable of coming into contact with the ground plate to be extended as much as possible and enables a decline in strength of the metal frame to be suppressed. The wireless communication apparatus according to the embodiment may include the following feature. A second feeding point which differs from the feeding point is connected to the first conductive portion, and a selection circuit is interposed between the first conductive portion and the second feeding point, the selection circuit separating the first conductive portion and the second feeding point from each other when power is being fed to the monopole antenna at the first frequency and connecting the first conductive portion and the second feeding point to each other when power is not being fed to the monopole antenna at the first frequency. By having such a feature, the first conductive portion can be used as an antenna which resonates at a frequency that differs from the first frequency. The selection circuit may include an LC parallel circuit which opens at the first frequency. In addition, the selection circuit may include a switch which separates the first conductive portion from the second feeding point when power is being fed to the monopole antenna from the feeding point and which connects the first conductive portion to the second feeding point when power is not being fed to the monopole antenna from the feeding point. Hereinafter, the embodiment will be further described with reference to the drawings.FIG.1is a diagram showing an example of a smartphone according to the embodiment.FIG.1illustrates a state where a front surface-side cover of a smartphone1according to the embodiment has been opened. The smartphone1includes a frame-like side surface frame100and a ground plate210and a printed substrate220which are housed inside a main body portion200being defined by the side surface frame100. The smartphone1has a plate shape formed in an approximately rectangular shape as a whole. Hereinafter, in the present specification, a +Y direction will also be referred to as an upward direction, a −Y direction will also be referred to as a downward direction, a +X direction will also be referred to as a rightward direction, and a −X direction will also be referred to as a leftward direction. In addition, inFIG.1, a direction toward a near side is assumed to be a forward direction and a direction toward a far side is assumed to be a rearward direction. The smartphone1is an example of the “wireless communication apparatus”. The smartphone1is a portable wireless communication apparatus. In the smartphone1, various electronic components including a Central Processing Unit (CPU), a main storage portion, and an auxiliary storage portion are housed inside the main body portion200being defined by front and rear covers and the side surface frame100. The side surface frame100is a cover which encloses the side surface of the smartphone1. The side surface frame100can also be described as a cover which encloses the side surface of the main body portion200. For example, the side surface frame100is formed by a conductor made of metal or the like. The side surface frame100has an approximately rectangular shape in order to enclose the side surface of the smartphone1with an approximately rectangular shape. The side surface frame100is provided with a plurality of slits101,102, and103. The slits101and102are provided in lower parts of long sides that oppose each other among the side surface frame100. The slit103is provided above the slit102on the same long side on which the slit102is provided among the side surface frame100. For example, each of the slits101,102, and103may be filled with resin. The side surface frame100is an example of the “metal frame”. The slit101is an example of the “first gap”. The slit102is an example of the “second gap”. The slit103is an example of the “third gap”. The printed substrate220is a substrate that can be mounted with various electronic components. For example, the printed substrate220is arranged in a lower part inside the main body portion200. The printed substrate220has a feeding point221. A lower frame110is a region defined by the slits101and102among the side surface frame100. The lower frame110is electrically connected to the feeding point221at an intermediate portion111thereof. A region defined by the intermediate portion111and the slit102among the lower frame110constitutes an antenna device112. The antenna device112is an antenna device to which power is fed from the feeding point221. The intermediate portion111is an example of the “intermediate portion”. The feeding point221is an example of the “feeding point”. The lower frame110is an example of the “first frame”. The antenna device112is a monopole antenna which resonates with a radio wave at the first frequency. For example, a length of the antenna device112is ¼ of a wavelength of a radio wave at the first frequency. For example, the first frequency is 2.2 GHz. The antenna device112is an example of the “monopole antenna”. A side surface conductor device120is a region defined by the slits102and103among the side surface frame100. The side surface conductor device120is a conductor device which does not come into contact with the ground plate210. In other words, the side surface conductor device120is an ungrounded conductor device. For example, a length of the side surface conductor device120is ¼ of a wavelength of a radio wave at the first frequency. The side surface conductor device120is an example of the “first conductive portion”. An upper frame130is a region defined by the slits101and103among the side surface frame100. The ground plate210is a grounded metal plate, a mounting substrate, or the like. For example, the ground plate210is arranged in an upper part inside the main body portion200. For example, by coming into contact with an inside of the upper frame130among the side surface frame100, the ground plate210grounds the upper frame130and, at the same time, increases strength of the upper frame130. The upper frame130is an example of the “second conductive portion”. Among the side surface frame100, at least the antenna device112and the side surface conductor device120are separated from the ground plate210. In other words, the antenna device112and the side surface conductor device120are not electrically connected to the ground plate210. The ground plate210is an example of the “ground plate”. FIGS.2and3are diagrams schematically showing a portion enclosed by a rectangle R1inFIG.1.FIG.2illustrates a state where a finger is not in contact with the side surface frame100andFIG.3illustrates a state where a finger is in contact with the side surface frame100. InFIG.2, since neither the slit102nor the slit103is electrically connected, the antenna device112is a monopole antenna which operates with a radio wave at the first frequency. FIG.3illustrates a state where a user of the smartphone1grips the smartphone1with a hand. As a result, the hand (for example, a thumb F1) of the user electrically connects the slit102due to capacitive coupling and, at the same time, electrically connects the slit103due to capacitive coupling. In the present embodiment, at least an end on the side of the slit103of the upper frame130is grounded by being electrically connected to the ground plate. Therefore, when each of the slits102and103is capacitively coupled, a loop antenna is formed from the intermediate portion111being electrically connected to the feeding point221via the antenna device112and the side surface conductor device120to ground from the end on the side of the slit103of the upper frame130. In this case, since the length of the antenna device112is ¼ of the wavelength of the radio wave at the first frequency and the length of the side surface conductor device120is ¼ of the wavelength of the radio wave at the first frequency, the length of the formed loop antenna is ½ of the wavelength of the radio wave at the first frequency. In other words, the formed loop antenna is a loop antenna which resonates at the first frequency. Therefore, the smartphone1enables communication to be performed using the monopole antenna that resonates at ¼ of the wavelength of the radio wave at the first frequency in a state where the smartphone1is not gripped by a hand and enables communication to be performed using the loop antenna that resonates at ½ of the wavelength of the radio wave at the first frequency in a state where the smartphone1is being gripped by a hand. In other words, with the smartphone1, the frequency at which an antenna resonates does not vary significantly between before and after gripping the smartphone1with a hand. That is, the smartphone1enables communication to be performed in an efficient manner with a radio wave at the first frequency in both a state where the smartphone1is being gripped by a hand and a state where the smartphone1is not gripped by a hand. The length of the side surface conductor device120will now be considered.FIG.4is a diagram illustrating radiation efficiency of an antenna of the smartphone according to the embodiment.FIG.4illustrates radiation efficiency with respect to a radio wave at a frequency of 2.2 GHz when the length of the side surface conductor device120is varied by fixing a position of the slit102but moving a position of the slit103. An ordinate inFIG.4illustrates radiation efficiency (dB) and an abscissa inFIG.4illustrates a position (mm) of the slit103relative to the slit102. In other words, the abscissa illustrates the length of the side surface conductor device120.FIG.4illustrates both radiation efficiency in a case (with thumb) where both slits102and103are capacitively coupled by the thumb F1and radiation efficiency in a case (free space) where neither of the slits102and103is capacitively coupled. In addition,FIG.4illustrates an indication (indication of free space) of radiation efficiency in a free space and a standard (indication with thumb) of radiation efficiency with a thumb. In this case, relative permittivity of the thumb F1is assumed to be 40.0 and specific electric conductivity is assumed to be 1.40 Sim. Referring toFIG.4, it can be understood that the length of the side surface conductor device120which causes the radiation efficiency in a free space to exceed the indication of free space and the radiation efficiency with a thumb to exceed the indication with a thumb ranges from 30 mm to 40 mm and from 100 mm to 110 mm. The range from 30 mm to 40 mm corresponds to ¼ of a wavelength of 2.2 GHz and the range from 100 mm to 110 mm corresponds to ¾ of the wavelength of 2.2 GHz. Accordingly, it can be understood that the length of the side surface conductor device120is preferably an odd multiple of ¼ of a wavelength of a radio wave at which the antenna device112resonates. As described above, preferable radiation efficiency can be realized when the length of the side surface conductor device120is an odd multiple of ¼ of a wavelength of a radio wave at which the antenna device112resonates. However, since the side surface conductor device120does not come into contact with the ground plate210, extending the length of the side surface conductor device120creates a risk of reducing the strength of the side surface frame100. In addition, extending the length of the side surface conductor device120is disadvantageous in terms of downsizing the smartphone1. In consideration thereof, the length of the side surface conductor device120is preferably ¼ of a wavelength of a radio wave at the first frequency. First Comparative Example Comparative examples will now be explained.FIG.5is a diagram showing an example of a smartphone according to a first comparative example.FIG.5illustrates a state where a front surface-side cover of a smartphone500according to the first comparative example has been opened. Hereinafter, the smartphone500according to the first comparative example will be explained with reference to the drawings. A side surface frame100adiffers from the side surface frame100in that the side surface frame100adoes not include the slit103. A ground plate210adiffers from the ground plate210in that the ground plate210acomes into contact with an inside of the side surface frame100aeven in a portion corresponding to the side surface conductor device120according to the embodiment. An upper frame130ais an upper-side region of a region defined by the slits101and102among the side surface frame100a. As is evident from reference toFIG.5, an end on the side of the slit102of the upper frame130ais grounded. FIGS.6and7are diagrams schematically showing a portion enclosed by a rectangle R2inFIG.5.FIG.6illustrates a state where a finger is not in contact with the side surface frame100aandFIG.7illustrates a state where a finger is in contact with the side surface frame100a. InFIG.6, since the slit102is not electrically connected, the antenna device112is a monopole antenna which operates with a radio wave at the first frequency. FIG.7illustrates a state where a user of the smartphone500grips the smartphone500with a hand. As a result, the hand (for example, the thumb F1) of the user electrically connects the slit102due to capacitive coupling. In the first comparative example, at least an end on the side of the slit102of the upper frame130ais grounded by being electrically connected to the ground plate. Therefore, when the slit102is capacitively coupled, a connection to ground is established from the end on the side of the slit102of the upper frame130avia the antenna device112from the intermediate portion111being electrically connected to the feeding point. In other words, due to grounding of an open end of the antenna device112which is a monopole antenna, a resonant frequency of the antenna device112ends up significantly varying from the first frequency. Second Comparative Example Next, a second comparative example will be explained.FIG.8is a diagram showing an example of a smartphone according to the second comparative example.FIG.8illustrates a state where a front surface-side cover of a smartphone600according to the second comparative example has been opened. The smartphone600according to the second comparative example differs from the smartphone1according to the embodiment in that the smartphone600does not have a slit103on a side surface frame100b. Even in the smartphone600according to the second comparative example, the side surface frame100bis electrically connected to the ground plate210at at least a slit-corresponding position103awhich corresponds to the slit103on the smartphone1. When the smartphone600according to the second comparative example is gripped by a hand, a loop antenna that resonates with a radio wave at the first frequency can be formed in a similar manner to the smartphone1according to the embodiment. Comparison Among First Comparative Example, Second Comparative Example, and Embodiment FIG.9is a diagram comparing radiation efficiencies of the first comparative example, the second comparative example, and the embodiment.FIG.9illustrates radiation efficiency of a radio wave at a frequency of 2.2 GHz and assumes relative permittivity of the thumb F1to be 40.0 and specific electric conductivity to be 1.40 S/m. Referring toFIG.9, with the smartphone500according to the first comparative example, radiation efficiency in free space is −1.4 dB, radiation efficiency with thumb is −16.9 dB, and an amount of deterioration of the radiation efficiency with thumb relative to free space is −15.5 dB. With the smartphone600according to the second comparative example, radiation efficiency in free space is −13.4 dB, radiation efficiency with thumb is −9.3 dB, and an amount of deterioration of the radiation efficiency with thumb relative to free space is +4.1 dB. With the smartphone1according to the embodiment, radiation efficiency in free space is −1.3 dB, radiation efficiency with thumb is −11.3 dB, and an amount of deterioration of the radiation efficiency with thumb relative to free space is −10.0 dB. In other words, with the smartphone500according to the first comparative example, it can be understood that radiation efficiency is lower than the smartphone1according to the embodiment in both free space and with thumb. On the other hand, with the smartphone600according to the second comparative example, it can be understood that while radiation efficiency with thumb is slightly improved from the smartphone1according to the embodiment, radiation efficiency in free space is significantly poor. With the smartphone1according to the embodiment, it can be understood that radiation efficiency in free space is higher than both the first comparative example and the second comparative example and that radiation efficiency comparable to that of the second comparative example can be realized with thumb. Other Comparative Examples Furthermore, other comparative examples which correspond to a decline in radiation efficiency of an antenna when the slit102is capacitively coupled will be considered.FIG.10is a diagram showing an example of a smartphone according to a third comparative example.FIG.10illustrates a state where a front surface-side cover of a smartphone700according to the third comparative example has been opened. The smartphone700includes, in addition to the antenna device112, an antenna712in an upper part inside the main body portion200. When the smartphone700detects capacitive coupling of the slit102by the thumb F1or the like, the smartphone700uses a Dual Pole Dual Throw (DPDT)713to switch an antenna used for communication from the antenna device112to the antenna712. For example, various electronic components such as a camera and a speaker are often mounted in an upper part inside the main body portion200. Therefore, an antenna length of the antenna712is often reduced in the upper part inside the main body portion200. Furthermore, since the electronic components described above are present around the antenna712in addition to the reduced antenna length, performance of the antenna712tends to become lower than that of the antenna device112and a frequency band in which the antenna712can resonate tends to become narrower. Therefore, there is a possibility that switching from the antenna device112to the antenna712may end up reducing antenna performance of the smartphone700. FIG.11is a diagram showing an example of a smartphone according to a fourth comparative example.FIG.11illustrates a state where a front surface-side cover of a smartphone800according to the fourth comparative example has been opened. In the smartphone800, two slits801and802are provided on a lower side of a side surface frame100cformed in an approximately rectangular shape. In the smartphone800, a section from the intermediate portion111to an end on a side of the slit802constitutes an antenna device812. By providing the slits801and802at these positions, since a hand such as the thumb F1less readily comes into contact with the slits801and802even when the smartphone800is gripped by the hand, the slits801and802are less likely to be capacitively coupled. Therefore, with the smartphone800, deterioration in performance of the antenna device812when the smartphone800is gripped by a hand is conceivably suppressed. Let us now consider providing the smartphone800with a plurality of antennas in order to accommodate a plurality of frequencies. A size of the smartphone800is set so as to be 150 mm in a longitudinal direction (V direction) and 75 mm in a width direction (X direction), and the slits are assumed to be filled by a resin with relative permittivity of 3.0. In this case, ¼ wavelength of a radio wave at a frequency of 850 MHz is 51 mm, ¼ wavelength of a radio wave at 1.5 GHz is 29 mm, and ¼ wavelength of a radio wave at 2.2 GHz is 20 mm. FIG.12is a diagram schematically showing a case where the smartphone according to the fourth comparative example is provided with antennas for a plurality of frequencies. Referring toFIG.12, it can be understood that when attempting to provide the smartphone800with an antenna for 850 MHz, an antenna for 1.5 GHz, and an antenna for 2.2 GHz, it turns out that it is difficult to mount the antennas to the smartphone800because the length of the antennas exceeds the width direction dimension of 75 mm. FIG.13is a diagram schematically showing a case where the smartphone according to the embodiment is provided with antennas for a plurality of frequencies. In the smartphone1according to the embodiment, since the slits101and102are provided in lower parts of opposing long sides among the side surface frame100, it can be understood that appropriately determining the positions of the slits101and102enables an antenna length of each antenna for the frequencies of 850 MHz, 1.5 GHz, and 2.2 GHz to be secured. It can also be understood that providing a slit101aof around 1 mm between the antenna for 850 MHz and the antenna for 1.5 GHz enables the antenna for 850 MHz and the antenna for 1.5 GHz to be insulated from each other. In other words, the smartphone1according to the embodiment is also advantageous for enabling mounted antennas to accommodate a plurality of frequency bands. First Modification The smartphone according to the embodiment can be modified in various ways.FIG.14is a diagram showing an example of a smartphone according to a first modification.FIG.14illustrates a state where a front surface-side cover of a smartphone1aaccording to the first modification has been opened. In the smartphone1a, a feeding point221bis connected to the side surface conductor device120via a selection circuit190. The selection circuit190separates the side surface conductor device120from the feeding point221bwhen communication by a radio wave at the first frequency is being performed but connects the side surface conductor device120to the feeding point221bwhen communication by a radio wave at a second frequency is to be performed. Such an implementation enables the smartphone1ato use the side surface conductor device120as an antenna which resonates with a radio wave at the second frequency when communication is not being performed at the first frequency. The selection circuit190is an example of the “selection circuit”. The feeding point221bis an example of the “second feeding point”. FIG.15is a diagram showing another example of a selection circuit.FIG.15also illustrates the antenna device112and the side surface conductor device120. In the selection circuit190illustrated inFIG.15, a switch195is interposed between a matching circuit191and the side surface conductor device120. The switch195separates the side surface conductor device120from the feeding point221bwhen communication at the first frequency is being performed (for example, when power is being fed by the feeding point221). In addition, the switch195connects the feeding point221band the side surface conductor device120to each other when communication at the first frequency is not being performed (for example, when power is not being fed by the feeding point221). Even such an implementation enables the smartphone1ato communicate using the antenna device112at the first frequency and to communicate using the side surface conductor device120as an antenna at the second frequency. A portion of the selection circuit190can also be configured to switch frequencies using a circuit other than a switch.FIG.16is a diagram showing an example of a modification thereof.FIG.16also illustrates the antenna device112and the side surface conductor device120. In the selection circuit190illustrated inFIG.16, an LC parallel circuit192in which a coil193and a capacitor194are connected in parallel is interposed between the matching circuit191and the side surface conductor device120. By causing the LC parallel circuit192to resonate at the first frequency at which the antenna device112resonates, the LC parallel circuit192can be set to high impedance at the first frequency. In other words, when communication at the first frequency is being performed, the side surface conductor device120can be separated from the feeding point221bat a high frequency. In addition, at the second frequency which differs from the first frequency, since the LC parallel circuit192operates as a part of the matching circuit, communication can be performed by using the side surface conductor device120as an antenna. While the side surface frame100is formed in a rectangular shape in the embodiment and the modifications described above, the side surface frame100may be formed in other shapes such as a square shape, a circular shape, and a rhombic shape. In this case, the positions of the slits101,102, and103need only be determined so that the length of the antenna device112is a length that enables the antenna device112to resonate at the first frequency and the length of the side surface conductor device120is an odd multiple of ¼ of a wavelength of a radio wave at the first frequency. The embodiment and the modifications disclosed above can be combined with each other. The disclosed technique enables, in a wireless communication apparatus which uses a metal frame constituting an exterior as an antenna, a decline in antenna performance due to a hand coming into contact with the metal frame to be suppressed. All examples and conditional language provided herein are intended for the pedagogical purposes of aiding the reader in understanding the invention and the concepts contributed by the inventor to further the art, and are not to be construed as limitations to such specifically recited examples and conditions, nor does the organization of such examples in the specification relate to a showing of the superiority and inferiority of the invention. Although one or more embodiments of the present invention have been described in detail, it should be understood that the various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the invention. | 31,449 |
11942703 | DETAILED DESCRIPTION As discussed above, filters are connected to antennas in RF systems to reject interference outside of the band of interest. Since antennas do not provide the required selectivity in most situations, antennas and filters are designed separately and then interconnected to achieve the required functionality. Filters are typically designed as an interconnection of resonators which are appropriately coupled to operate in the desired band while providing adequate selectivity, and proper passband impedance match. Phased array antennas include several antenna elements where each antenna element is connected to a filter. Often in conventional systems, the grid spacing of the antenna elements is such that each filter cannot be positioned adjacent to the corresponding antenna element. As a result, the connection between the filter and the antenna element may include a wire, microstrip, stripline, conductive trace, or other conductive connection that introduces signal loss. In addition, in conventional systems, the filters and the antenna elements are typically implemented separately requiring impedance matching networks to be interposed between the filter and antenna element. This may result in additional loss and a decrease in scan volume. In phased arrays, the active impedance seen by the antenna changes with the scan angle, thus the impedance matching networks must offer a compromise between the different active impedances seen by the antenna in order to achieve a certain return loss level for all angles within the scan volume. In accordance with the examples discussed herein, each antenna element of the phased array antenna comprises an antenna apparatus which is a radiating structure having the same intrinsic behavior as a filter. As a result, the filter is part of each antenna element and the phased array antenna provides filtering. Each integrated filter antenna apparatus forming the antenna element can be implemented to accommodate much smaller grid spacing than those possible with conventional techniques where the filters are implemented within the grid spacing. As a result, lossy connections between the radiators and filters are eliminated while scan volume is increased with smaller grid spacing as compared to conventional antennas. The design methodology of filters is applied in order to create a radiating structure (antenna) that has the same intrinsic behavior as a filter to implement an antenna apparatus forming an antenna element. For example, signals that fall within a limited passband are transmitted and received while signals outside the passband are rejected (or at least significantly attenuated). As a result, both functionalities (radiation and filtering) are combined in a single structure. Although conventional antennas may have inherent filtering characteristics where some frequencies are attenuated, the examples of the antenna apparatus discussed herein are designed to have a particular desired filter transfer function by selecting dimensions of the resonators, radiator and the overall structure, as well as selecting dimensions related to the relationship between the radiator and the rest of the structure. Therefore, the structure is configured to obtain the desired overall frequency response by taking into account the interaction between the radiator and the other components including the filter components. In addition, interconnects can be eliminated, reducing ohmic losses to form a compact structure. The compact structure may be beneficial in many circumstances both for a standalone single antenna system and for a multiple element antenna array. As discussed above, the compact structure of the antenna apparatus allows for implementing the antenna apparatus as each antenna element within a phased array antenna where the grid spacing is half a wavelength or less. The phased array antenna, therefore, includes filtering functionality. The resulting phased array structure with integrated filtering has a design characteristic where the design parameters of the filter determine, among other performance characteristics, the scan volume. Since the dimensions of the radiating element of each antenna element are at least partially limited by the dimensions of the components of the resonators of the antenna apparatus, selection of the resonator dimensions limits the dimensions of the grid spacing of the phased array antenna. The scan volume is at least partially determined by the grid spacing and, therefore, is dependent on at least one dimension of one of the resonators in the antenna apparatuses. In some examples discussed below, an antenna apparatus includes a number of metallic patch resonators that are enclosed within metallic cavities, vertically stacked and mutually coupled. With one technique, the coupling between the metallic patches is achieved with precisely shaped openings in the ground plane, or irises. In other situations, interlayer electrical connections using metal posts, sometimes referred to as vias, are used to couple the metallic patches. One advantage of the discussed structure is the use of one of the resonators (radiating resonator) as a radiator. The radiating resonator is not completely enclosed, allowing the structure to radiate into free space and act as an antenna. Through dimensional control in all three space dimensions and coupling to both free space and the resonator below, a filter which radiates into free space is formed. Therefore, the filtering transfer function of the antenna apparatus is at least partially based on the distance between the radiator element (resonator element exposed to free space) and another component of the antenna apparatus such as ground patch between the radiator element and another resonator metallic patch. FIG.1Ais a block diagram of a phased array antenna10including a plurality of antenna elements12where each antenna element includes an antenna apparatus14with an integrated filter. For the example, the plurality of antenna elements12are secured in a frame or other assembly (not shown) such that the antenna elements12remain fixed in position relative to the other antenna elements. In some situations, the entire phased array structure can be moved and directed as a single unit. In typical implementations, each antenna element is connected to other circuitry such that the phase of transmitted and/or received signals can be manipulated to change the direction and/or shape of the antenna beam formed by the phase array antenna. The antenna elements are separated from each other by a grid spacing where the dimensions of the antenna elements12typically determine the grid spacing. Since the antenna elements are not necessarily square, the grid spacing16in a first dimension (e.g., width)18may be different from the grid spacing20in a second dimension (e.g., length)22of the phased array grid. The phased array antenna may include any number of antenna elements. For the example inFIG.1A, a four by four array is shown including black dots to indicate that additional antenna elements may be included in both dimensions18,22. An array may include any number of elements where typical numbers range from 16 to thousands. The number of antenna elements and grid spacing in each orientation typically depend on the particular application of the antenna array. For base stations operating in accordance with 5G specifications, antenna arrays typically have 64 elements arranged in an 8 by 8 configuration. Multiple antennas can also be operated together to form bigger arrays, for instance of 128, 256, 512, 1024 element or other configurations. For indoor applications and mobile devices, the array sizes are smaller, typically having 16 elements configured in 4×4 or 2×8 arrays. In some circumstances, scan volume is greater in the horizontal dimension than in the vertical dimension where an example of a suitable grid spacing in terms of wavelength (lambda) is about 0.45 lambda by 0.65 lambda. For the examples herein, the grid spacing is uniform along a dimension such that spacings16along the first dimension18are the same and the spacings20along the second dimension22are the same, although the first dimension spacings16may not be the same 3 as the second dimension spacings20. In some situations, however, the grid spacings along at least one of the dimensions18,22may not be uniform. FIG.1Bis a block diagram of an example of one of the plurality antenna elements12within the phased array antenna10ofFIG.1A. Each of the antenna elements12for the examples herein is an antenna apparatus14that is an integrated structure including at least two resonators24,26coupled to each where one of the resonators is a radiating element24. The at least one other resonator26is enclosed within a metal enclosure28. FIG.1Cis a block diagram of an antenna apparatus100with an integrated filter. The antenna apparatus100is a radiating filter where at least two resonators are coupled to each other and one of the resonators is a radiator. The antenna apparatus may be used for transmission, reception, or both depending on the specific implementation. The antenna apparatus100, therefore, is an example of the antenna apparatus14ofFIG.1AandFIG.1B. For the example ofFIG.1C, the antenna apparatus100includes an input resonator102, an intermediate resonator104, and an output resonator106that forms the radiator. As discussed below, the antenna apparatus100may include several intermediate resonators104. For the examples herein, each non-radiating resonator102,104is formed with a metallic resonator element108,110positioned within a cavity112,114of a metallic enclosure116,118. The metallic enclosure116,118forms an electromagnetic enclosure at the operating frequencies and, therefore, may not include continuous metal walls void of any openings. As discussed below, for example, a series of metal posts (vias) between two planar conductive patches may form the side walls of the metallic enclosure where the two planar conductive patches form the top and bottom of the metallic enclosure. In another example, metallic screen can be used to form the metallic enclosure. A dielectric (not shown inFIG.1C) other than air is used within each cavity for the examples. A portion of one metallic enclosure may form a portion of another metallic enclosure. For example, where the resonators are implemented with planar conductive patches positioned between ground plane layers, the ground plane layer between two adjacent resonators may form the top of a lower metallic enclosure and the bottom of an upper metallic enclosure. The resonator elements in the resonators are coupled to each other through couplings120,122. Each coupling120,122may be formed with conductive elements such as posts or screws or may be implemented with an opening within a ground plane separating the resonator elements. As discussed below, for example, a coupling can be formed with an iris within the ground plane separating two adjacent resonator elements. Couplings120,122may also be formed between non-adjacent resonator elements. Therefore, a coupling120,122may be any mechanism that couples electromagnetic energy between any two resonator elements. The input resonator102has an input port124that can be connected to a signal source or to a receiver. The input port124, therefore, provides an interface to other devices, components and circuits. A transfer function126of the antenna apparatus100from the input port124through the output resonator (radiator)106is determined a least by the properties of the non-radiating resonators102,104, the couplings120,122, and the radiating resonator106and the position of the radiator relative to the other components. In most situations, the transfer function126also depends on the characteristics of the input port124. The transfer function126, therefore, can be adapted or configured to meet specific criteria by selecting dimensions of the resonators102,104,106and the couplings120,122and relative position of the radiator106within the structure. For example, in implementations where the resonators are stacked resonator elements within ground plane enclosures and the couplings are formed with irises in the ground plane, the transfer function depends at least on the shape and size of the irises, the distance between the resonator elements, the dimensions of the resonators, the distance between the last resonator (radiator) and the adjacent ground plane, and the size of the input strip. The design of the antenna apparatus, therefore, takes into account the properties of the output resonator and the interaction of the output resonator with the other components within the antenna apparatus structure. As a result, in addition to other design parameters, the separation (distance) between the radiator106and the adjacent ground (underneath in the figures) is selected to realize the desired overall filter transfer function. Accordingly, the distance (D1)128between the radiator106and the adjacent resonator element110and the distance (D2)130between the radiator106and the ground plane of the enclosure are selected to provide the desired output coupling and transfer function. For the examples herein, the output coupling is adjusted by adjusting D1128and D2130. Also, if D1128is changed without changing D2130, the selectivity is changed without changing the output coupling. Therefore, the filter transfer function is typically adjusted by adjusting the distances D1128and D2130. As a result, in addition to other design parameters, the separation (distance) between the radiator106and the adjacent resonator element110is selected to realize the desired overall filter transfer function126. More specifically, the distance (D1)128between the radiator106and the adjacent resonator element110impacts the selectivity129of the filter response of the filter transfer function126and the distance (D2)130between the radiator106and the adjacent ground plane132impacts the output coupling to free space. In the examples, the dimensions of the iris122impact selectivity similarly to changes in D1. For the examples discussed herein, the adjacent ground plane132is formed by the portion of the enclosure118that is adjacent to the output resonator element106. As discussed herein, the selectivity129of the filter transfer function126is the shape of the filter response of attenuation over frequency. The selectivity129, therefore, includes parameters such at the bandwidths of the passband(s) and stopband(s) and the characteristics of the transitions between passband(s) and stopband(s). Accordingly, at least the distance (D1)128between the radiator106and the adjacent resonator element110and the distance (D2)130between the radiator106and the ground plane of the enclosure are selected to provide the desired output coupling and filter response. As discussed below, the filter transfer function is also based on the dimensions of the resonator elements106,108,110, and the dimensions of the structures that form the coupling between the resonators. For the discussions herein, there is reciprocity between the antenna apparatus as a transmission device and as a reception device. Therefore, the receive and transmit properties of the antenna apparatus are identical for the examples. The characteristics, deign parameters, and configuration of the antenna apparatus discussed with reference to transmission may be applied to the antenna apparatus when used as a receiving device. Therefore, the radiator captures signals and provides an output at the input port when the antenna apparatus is used for receiving signals. More specifically, since the antenna apparatus100is a linear passive structure, the reciprocity theorem applies to its operation as a transmitter and receiver. Thus, the antenna apparatus100behaves exactly the same in transmission as in reception. In transmit mode, a signal at the input port124of the antenna apparatus100induces currents on the radiator106that result in transmission of electromagnetic fields to free space. In receive mode, an electromagnetic wave in free space that reaches the antenna apparatus100induces currents in the radiator106which, in turn, produce a signal at the input port124of the antenna. FIG.2Ais an illustration of an exploded perspective view and of an example of an antenna apparatus200including planar resonator elements between ground planes where the ground planes are connected with vias and where openings in the ground planes provide coupling between the resonator elements.FIG.2Bis an illustration of a cross sectional side view along A-A ofFIG.1Cof the antenna apparatus200.FIG.2Cis an illustration of a perspective view of the antenna apparatus200showing an outer enclosure201as transparent.FIG.2A,FIG.2BandFIG.2Care not necessarily to scale and are not intended to be more than general illustrations showing the relative positioning of elements. For the examples discussed herein, an outer enclosure201surrounds the antenna apparatus structure expect for openings for the input port(s) and the radiator. In addition to providing additional shielding and ground connectivity, the outer enclosure201provides structural stability. Examples of suitable techniques for forming the outer enclosure201include using metal sheets, metallic vias and combinations of the two. The outer enclosure201, however, can be omitted in some situations. The antenna apparatus200for the example ofFIG.2AandFIG.2Bincludes an input resonator202, two intermediate resonators204,206, and an output resonator (radiator)208. The antenna apparatus200ofFIG.2, therefore, is an example of the antenna apparatus100discussed above with reference toFIG.1C. The resonator enclosures210,212,214for the resonators202,204,206are formed by two ground planes connected to each other with a set of vias216,218,220. Other than the output resonator element222forming the radiator, each radiator element224,226,228is enclosed within an enclosure formed by two ground planes and a set of vias216,218,220connected between the two ground planes. The two interior ground planes230,232each form a portion of two resonator enclosures210,212. For example, the lower intermediate ground plane230forms the top of the input resonator enclosure210for the input resonator202and also forms the bottom of the lower intermediate enclosure212for the lower intermediate resonator204. The upper intermediate ground plane232forms the top of the lower intermediate enclosure212of the lower intermediate resonator204and forms the bottom of the upper intermediate resonator214of the upper intermediate resonator206. For the example, the metallic patch structure forming the resonators is enclosed in an outer enclosure201with only the radiator exposed to free space and an opening providing access to the input port. The outer enclosure201is not shown inFIG.2AandFIG.2B. Other than the bottom (lower) ground plane234, the ground planes230,232,236include openings238,240,242that provide coupling between adjacent resonator elements. In other examples discussed below, the bottom ground plane may include an opening that provides coupling to a resonant cavity below the bottom ground plane. As discussed above, an opening in the ground plane that provides coupling can be referred to as an iris. The dimensions and shape of the iris dictate characteristics of the coupling. The filter transfer function of the antenna apparatus can be established, therefore, at least partially with selection of the shape and dimensions of the irises. In addition, the shape orientation of the irises and resonators determines the polarization of the antenna apparatus radiation pattern. As discussed below, the antenna apparatus can be designed to have single polarization, dual polarization, or circular polarization. The selection of the dimensions and shapes of the irises, therefore, can be used to obtain a desired filter transfer function and polarization radiation pattern. The resonator elements and ground planes are separated from each other by a dielectric material (not shown inFIG.2A). In one example, printed circuit board (PCB) techniques are used to form the antenna apparatus. Therefore, the ground planes and resonator elements can be formed with metallic sheets laminated on dielectric material substrates246. For the examples discussed herein, a dielectric material having a dielectric constant greater than the dielectric constant of air is used and is illustrated as crosshatched sections in some of the figures. The figures with exploded views do not show the dielectric in the interest of clarity. For the examples, the dielectric material is uniform within the structures although, in some situations, different dielectric materials may be used. The plurality of vias between a pair of ground planes form the side walls of each resonator enclosure. The input port is formed with section of stripline247that extends though the lower enclosure. The input may be formed using other techniques. In another example, the input port is formed by a metal post or via that extends through the lower enclosure. When the antenna apparatus200is used for transmitting signals, a transmitter is connected to the input port and radio frequency (RF) signals are fed to the antenna apparatus through the input port. The RF signals are filtered by the antenna apparatus and the filtered signals radiate from the radiating element. The dimensions of the resonating element determine the resonant frequency of the resonator. For the example ofFIG.2AandFIG.2B, each resonator element is a rectangular metallic patch and the resonator elements are slightly different in size. Although the resonators have similar sizes, the different loading of each resonator results in a difference in size. The dimension of the rectangular metallic patch that determines the resonance of the resonator is the distance that extends from the side of the input to the opposite side. For the example ofFIG.2A, therefore, the distances250,252,254,256determine the resonant frequencies of the resonators. The desired filter response is achieved by selecting the dielectric, the length of metallic patches, the length of the irises, the spacing between the ground planes and the resonator elements, the spacing between adjacent resonator elements, and the spacing, D2,130between last resonator (radiator)106and the adjacent ground plane132, which is the ground directly underneath the radiator in the figures. As discussed above, the distance (D1)128between the radiator106and the adjacent resonator element110impacts the selectivity129of the filter response of the filter transfer function126and the distance (D2)130between the radiator106and the adjacent ground plane132impacts the output coupling to free space. For the example ofFIG.2AandFIG.2B, therefore, the distance248between the metallic patch forming the radiator222and the metallic patch forming the upper intermediate resonator element228partially determines the selectivity of the filter response. The output coupling to free space is at least partially dependent on the distance258between the metallic patch radiator222and the ground plane236. Therefore, the distance248between the metallic patch radiator222and the metallic patch resonator element228is an example of the distance (D1)128between the radiator106and the adjacent resonator element110inFIG.1C. The distance258between the metallic patch radiator222and the ground plane236is an example of the distance (D2)130between the radiator106and the ground plane132inFIG.1C. The antenna apparatus200is constructed to have a desired filter transfer function126from the input stripline247to free space by selecting dimensions of the resonators202,204,206,208the characteristics of the structures forming couplings between the resonators, and the spacing between components of the resonators, as well as the dimensions of the radiator222, the characteristics of the structure forming the coupling to the radiator222, and the relative position of the radiator222to the other antenna apparatus200components. As discussed below in further detail, one of the advantages of the antenna apparatus includes the ability to implement the filter and antenna in a package that is less than half wavelength (λ/2) along any side of the radiating plane. Although the antenna apparatuses can be implemented in areas with different shapes and larger sizes, it is advantageous to limit the size to less than a half wavelength (λ/2) on any side in some situations. For the example ofFIG.2C, the plane of the outer enclosure201where the radiator is positioned has a width248and length250that are less than a half wavelength (λ/2). In other situations, multiple antenna apparatuses are disposed in a single outer enclosure where each radiator is within an area less than λ/2 on each side. In still other situations, the dimensions of the outer enclosure201are such that the apparatus fits within a grid spacing that is less than λ/2 in only one orientation of an array. FIG.3Ais a perspective view illustration of the antenna apparatus200showing modeling labels for an example of coupling matrix modeling.FIG.3Bis an illustration of the coupling matrix modeling relationship for the structure ofFIG.3A. One technique for simulating filter circuits and designing filters includes a coupling matrix model which is an example of a technique that can be applied to designing an antenna apparatus in accordance with the discussions herein. At microwave and millimeter wave frequencies, bandpass filters are frequently constructed by interconnecting (i.e. coupling) resonators. Resonators can be coupled in a cascaded connection (i.e. between adjacent resonators), which produce all-pole frequency responses, or include couplings between non-adjacent resonators, which lead to more complex frequency responses that may include transmission zeros. These filters can be modeled with a simple lumped element circuit. For a general 2-port model of a synchronous direct-coupled-resonator filter, direct-couplings (between adjacent couplings) and cross-couplings (between non-adjacent resonators) can be represented. A circuit simulator can be used to simulate the circuit response including all possible couplings (adjacent and non-adjacent) and may include synchronous resonators (formed by capacitors and inductors), admittance inverters and frequency independent admittances. An example of a suitable circuit simulator includes the NI AWR Microwave Office and Ansys Designer circuit simulator. Once the center frequency and bandwidth of the filter are defined, the filter circuit can be expressed in matrix form, known as coupling matrix. The various entries of the coupling matrix M represent the different components of the circuit. Diagonal elements represent the imaginary part of the frequency independent admittances, whereas non diagonal entries represent couplings between resonators (ie. inversion constants). This modeling and design methodology are used for simulating and designing bandpass direct-coupled-resonator filters and is one example of a technique that can be used to design the examples of the antenna apparatus discussed herein. For the example ofFIG.3A, the resonators are coupled in a cascaded connection where adjacent resonators are coupled to form an all-pole frequency response. The model can also be applied to the coupling to the radiator and from the radiator to free space. In accordance with one example, the center frequency of the filter, bandwidth, passband equiripple return loss level and location of the transmission zero are selected. With these parameters, a coupling matrix that synthesizes this response can be analytically computed. The coupling matrix is transformed into a real implementation by identifying the features of the physical geometry that control the various elements of the coupling matrix. Generally, for example, the size of a resonator can be altered to change its resonant frequency (ie, the corresponding diagonal element of the coupling matrix) and the size of openings created between resonators can control the amount of coupling between them. Different methodologies can be used to extract geometrical values from a circuit mode where typically the design procedure begins with obtaining an initial set of dimensions. Procedures may include looking at the input group delay, or splitting the structure into simpler blocks and comparing EM simulations with circuit simulations of equivalent blocks. After the initial dimensions are established, an optimization design procedure is applied. Therefore, the design of the antenna apparatus includes synthesizing a coupling matrix that provides the adequate passband response and out-of-band rejection needed. In order to synthesize this coupling matrix, the number of resonators (N), center frequency (f0), bandwidth (BW) and desired passband equi-ripple return loss value are determined in order to satisfy a certain rejection characteristic. For the example ofFIGS.3A and3B, nine geometrical dimensions are manipulated to realize the desired filter response where the geometrical dimensions include the lengths of the four metallic patches forming the resonator elements, the widths of the three openings forming the coupling between the metallic patches, the distance from the metallic patch radiator to the ground plane, and the width of the input tap. The coupling model ofFIG.3Bpairs each geometric dimension with an entry of the coupling matrix. The input tap width302of the input stripline247controls MS1. The length304of the input resonator element224controls M11. The length306of the metallic patch forming the first intermediate resonator element226controls M22. The length308of the metallic patch forming the second intermediate resonator element228controls M33. The length310of the metallic patch forming the radiator element222controls M44. The length312of the opening238controls M12. The length314of the opening240controls M23. The length316of the opening242controls M34. The distance250between the metallic patch radiator222and the ground plane236controls M4L. By adjusting and optimizing the coupling matrix elements, including the matrix elements corresponding to the radiator characteristics, the desired transfer function of the integrated antenna apparatus that includes a filter and an antenna can be achieved. The technique discussed above can be applied to other implementations of the antenna apparatus100. As discussed below, other examples of the antenna apparatus100include implementations having dual polarization and multiple ports, implementations having circular polarization, and implementations having transmission zeros in the frequency response. By appropriately modifying and applying the design technique discussed above for a particular structure, these examples as well as other implementations can be simulated and optimized. FIG.4Ais an illustration of an exploded perspective view of an example of an antenna apparatus400with dual polarization.FIG.4Bis a cross-sectional top view of the antenna apparatus400taken along line B-B inFIG.4A. The antenna apparatus400ofFIG.4AandFIG.4B, therefore, is another example of the antenna apparatus100discussed above with reference toFIG.1C. For the example ofFIG.4AandFIG.4B, the antenna apparatus400has two inputs ports402,404including a horizontal polarization input port402and a vertical polarization input port404. Dual orientation is achieved by adjusting the dimensions of the same set of resonators and radiator and adjusting the shaping of the irises. Each iris406,408,410is a combination of two rectangular irises412,414where the iris with the longer dimension that is perpendicular to the direction of an input port couples the signals from that input. Coupling from irises that have their longest dimension parallel to the direction of an input port is significantly less providing isolation between the two input ports and signals. Therefore, the first rectangular portion412of the iris having the length416perpendicular to the direction418of the horizontal input port402couples signals received at the horizontal input port402. The second rectangular portion414of the iris having a length420perpendicular to the direction422of the vertical input port404couples signals received at the vertical input port404. Each set of rectangular portions having the same orientation, the resonators, and radiator function as described with reference toFIG.2A,FIG.2B,FIG.3A, andFIG.3B. FIG.5is an illustration of an exploded perspective view of an example of an antenna apparatus500with dual polarization and a resonating cavity (supplementary resonator)502generating a transmission zero in the transfer function for both polarizations. For the example ofFIG.5, the resonating cavity (supplementary resonator)502is formed with a metallic resonating patch504enclosed by the input resonator ground plane506, another ground plane508and vias510connecting to the two ground planes506,508. The supplementary resonator is positioned on the opposite side of the input resonator512from the other resonators. The metallic resonating patch504is coupled to the input resonator resonating element514through an iris516in the input resonator ground plane506. For the example, the iris516has the same shape an orientation as the other irises. Form one perspective, the additional resonating cavity502provides a mechanism for eliminating the transmission of energy at and near a particular frequency. The metallic resonating patch504in resonating cavity502is singly coupled to the input resonator. This differs from the other resonators which are, at least doubly coupled, either to other resonators or the input and output of the structure. As a result, the energy at the resonant frequency of patch504is contained within the resonating cavity502and cannot continue towards the radiator to be radiated into free space. This is similar to the performance of extracted-pole filters, where singly coupled resonators are located at different stages of a filter to create transmission zeros in the frequency response. FIG.6Ais an exploded perspective view illustration of an example of an antenna apparatus600having circular polarization. The antenna apparatus600ofFIG.6Ais an example of the antenna apparatus100discussed above with reference toFIG.1Cwhere the intermediate cavity and the input cavity are a single cavity. Accordingly, the antenna apparatus600includes an input element supporting two resonances within the passband of the antenna and a radiator, also supporting two resonances within the passband of the antenna apparatus. For the example ofFIG.6A, therefore, the antenna apparatus includes a single cavity602and a radiator604. The resonator element606and the radiator element604each have notches in corners that are diagonally opposite each other to provide coupling between the two resonances contained in each patch. The notched corners608,610of the radiator element604are positioned above the corners612,614of the resonator element606that are not notched. Accordingly, the two notched corners616,618of the resonator element606are positioned directly below the corners620,622of the radiator element604that are not notched. For the example ofFIG.6A, the iris624has an orientation such that the longer dimension is parallel to the direction of the input port626. Circular polarization can be achieved by feeding two orthogonal linear polarizations with a 90° phase difference. This can be achieved with the structure shown inFIG.6A, where the radiating patch sustains two linear polarizations. The insets in the corners provide coupling between the two resonances sustained by each patch. The 90° phase difference between polarizations and input matching in the desired passband is achieved by properly choosing the dimensions and location of the input pad, the dimensions of the two patches, the size of the insets, the size of the iris and the relative positions of the insets between both patches. With this configuration, a circularly polarized antenna with the same matching bandwidth as axial ratio bandwidth can be implemented. FIG.6Bis a perspective view illustration of the antenna apparatus600showing modeling labels for an example of coupling matrix modeling.FIG.6Cis an illustration of the coupling matrix modeling relationship for the structure ofFIG.6B. As discussed above a coupling matrix model is an example of a technique that can be applied to designing an antenna apparatus in accordance with the discussions herein. For the example, MS1is at least partially based on the width650of the input port626. MS1can also be controlled by the length651of input port “step”. In an example of a design technique, the width650is increased until the maximum input coupling is achieved. The length651is subsequently increased until the desired input coupling is achieved. M11and M22are based on the length652and width654of the resonator element606, respectively. M23and M14are based on the length656and width658of the iris624, respectively. M44and M33are based on the length660and width662of the radiator element604, respectively. M12is based on the size664of the notched corners616and622of the resonator element606. M34is based on the size666of the notched corners608and610of the radiator element604. M4V is based on the distance668between the radiator element and the adjacent ground. FIG.7is an illustration of a cross sectional side view of an example of an antenna apparatus700including planar resonator elements between ground planes where the ground planes are connected with vias and where vias through the ground planes provide coupling between the resonator elements. The structure and operation of the antenna apparatus700ofFIG.7is similar to the antenna apparatus200discussed above except that the couplings are formed with vias702,704,706instead of irises. The input resonator element224is coupled to the first intermediate resonator element226by a metallic post or via702that passes through an opening708within the ground plane230between the two resonator elements224,226. The first intermediate resonator element226is coupled to the second intermediate resonator element228by a metallic post or via704that passes through an opening710within the ground plane232between the two resonator elements226,228. The second intermediate resonator element228is coupled to the radiator element222by a metallic post or via706that passes through an opening712within the ground plane236between the resonator elements228and the radiator element222. The modeling and design techniques discusses above can be used for the antenna apparatus700where the vias are represented with the appropriate coupling characteristics. For the example ofFIG.7, the location and dimensions of the vias control the coupling between adjacent resonators. FIG.8Ais an illustration of an exploded perspective view and of an example of an antenna apparatus800including planar resonator elements between ground planes where the ground planes are connected with vias and where non-adjacent resonator elements are coupled through a dumbbell coupler.FIG.8Bis an illustration of a cross sectional side view of the antenna apparatus800. The structure and operation of the antenna apparatus800are similar to the antenna apparatus400discussed above except that a dumbbell802coupler couples the input resonator element804to the second intermediate resonator element806. The dumbbell coupler802may be formed with a metallic post or via808connected between to patches810,812. For the example ofFIG.8, the via808passes through the iris814in the ground plane816, through an opening818in the first resonator element820and through the iris822in the ground plane824. Therefore, the non-adjacent coupling due to the dumbbell coupler is in addition to the coupling through the irises. Non-adjacent coupling allows for generating a transmission zero in the transfer function providing more flexibility in designing the antenna apparatus. FIG.9is an illustration of a cross sectional side view of an example of an antenna apparatus900with non-adjacent cross-coupling. The structure and operation of the antenna apparatus900are similar to the antenna apparatus200discussed above except that striplines and vias are used to couple non-adjacent resonators. For the example, the ground planes902,904,906,908are connected to each other with a plurality of vias910,912and the lower ground plane902is connected to the upper ground plane908with a plurality of vias914. The vias910,912,914are shown as sidewalls inFIG.9although they may contain multiple staggered rows of vias. For the example, striplines connect two non-adjacent metallic resonator patches forming the resonator elements to vias that connect the striplines, thereby coupling the two resonator elements. A stripline916connects the input resonator metallic patch resonator918to a via920and a stripline922connects the second intermediate metallic patch resonator924to the via920. As a result, the input resonator metallic patch resonator918is coupled to the second intermediate metallic patch resonator924. In order to further shield the via920, the lower ground plane902is connected to the vias914. For the example, the lower ground plane902is connected to the vias914through a metal plane926and the upper ground plane908is coupled to the vias914through another metal plane928. In addition to the coupling between non-adjacent resonator elements918,924, the exemplary structure ofFIG.9includes coupling between adjacent resonators as discussed above in other examples. The input resonator element902is coupled to the first intermediate resonator element930through an iris932. The first intermediate resonator element930is coupled to the second intermediate resonator element924through an iris934. The second intermediate resonator element924is coupled to the radiator element936through an iris938. Therefore, by properly selecting dimensions of couplings and patches and the distance between the radiator and the adjacent resonator, the antenna apparatus can be designed to function as a direct coupled resonator filter and antenna. Transmission zeros can be introduced to the transfer function by implementing non-adjacent coupling using vias, dumbbell probes or an additional resonator adjacent to the input resonator and opposite the other resonators. The integrated structure allows for the filter and antenna to be implemented in a compact format that has significant implications in at least some implementations. For example, an antenna apparatus having the appropriate filter characteristics and antenna radiation pattern and polarization can be implemented within an area having dimensions less than a half wavelength across at the operating frequency. FIG.10Ais an illustration of a perspective view andFIG.10Bis an illustration of a top view of an example of a phased array antenna1000and associated scan volume of the antenna1002.FIG.10Cis an illustration of a top view,FIG.10Dis an illustration of a front view, andFIG.10Eis an illustration of a side view of a portion of the phased array antenna1000. The scan volume1002represents the portion of space where the antenna1000can orient its radiated energy. The phased array antenna1000includes a plurality of antenna elements where each antenna element is an antenna apparatus with an integrated filter. Accordingly, the phased array antenna1000is an example of the phased array antenna10discussed above. For the example ofFIG.10AandFIG.10B, the phased array antenna1000has a first grid spacing in a first orientation1004and second grid spacing in a second orientation1006where the second grid spacing1006is greater than the first grid spacing1004. The scan angle of a phased array antenna is the maximum angle from the bore sight1007for a selected signal strength or antenna gain. Since the maximum scan angle is at least partially dictated by the grid spacing, the scan angle (α)1008in the first orientation1004is greater than the scan angle (β)1010in the second orientation1006and the scan volume1002is elliptical. In examples where the grid spacing is the same in both orientations, the antenna pattern1002may be circular. Phased array antennas are composed of several antennas which can be independently controlled. Working together, the individual antennas, or elements, can be connected to individual transmitters and receivers or groups or transmitters and receivers. The electromagnetic waves radiated by each individual antenna combine and superpose, constructively interfering (adding together) to enhance the power radiated in desired directions, and destructively interfering (cancelling) to reduce the power radiated in other directions. When used for receiving, the separate electromagnetic currents from the individual antenna elements combine in the receiver with the correct phase relationship to enhance signals received from the desired directions and cancel signals from undesired directions. Phased arrays contain components to control the amplitude and phase of each element to enable “phased” steering. In other words, the array is mechanically stationary while the electromagnetic waves are electronically steered. Active Electronically Phased Array (AESA) include active elements placed within the phased array. The phased nature and subsequent coupling of the antenna elements place additional requirements of active impedance control to the antenna elements. The requirements for phased steering determine the element spacing and are typically around a half-wavelength at the upper end of the operational spectrum. Phased array antennas allow for more efficient use of frequency spectrum and help meet the demands of conventional communication systems. Conventional techniques, however, are limited in that the required filtering on each antenna element within the array cannot be achieved while meeting other requirements related to parameters such as sidelobe level, active return loss, efficiency, array gain, and scan volume. The antenna apparatus and techniques described herein, however, enable the implementation of phased array antennas that meet these requirements. One example of a suitable technique for designing the phased array antenna includes using a circuit simulator application where one or more dimensions are selected to obtain a particular characteristic and systematically setting other dimensions to adjust and compensate other characteristics. In an example of a suitable technique for designing an antenna array, design begins from the filter specifications and the required scan volume. From the scan volume, the grid spacings in azimuth and elevation are determined, along with the maximum distance between the radiator patch and the planar metallic ground. From these values, the maximum output coupling of the filter is computed, and a circuit model based on the coupling, a coupling matrix is synthesized to fulfill the filter specifications under the constraint of a maximum output coupling value. From this circuit model, the dimensions of the structure are obtained as described above in reference to design of an individual antenna element (antenna apparatus). Clearly, other embodiments and modifications of this invention will occur readily to those of ordinary skill in the art in view of these teachings. The above description is illustrative and not restrictive. This invention is to be limited only by the following claims, which include all such embodiments and modifications when viewed in conjunction with the above specification and accompanying drawings. The scope of the invention should, therefore, be determined not with reference to the above description, but instead should be determined with reference to the appended claims along with their full scope of equivalents. | 47,930 |
11942704 | The same reference numerals are used to represent the same elements throughout the drawings. MODE FOR DISCLOSURE The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of various embodiments of the disclosure as defined by the claims and their equivalents. It includes various specific details to assist in that understanding but these are to be regarded as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the various embodiments described herein can be made without departing from the scope and spirit of the disclosure. In addition, descriptions of well-known functions and constructions may be omitted for clarity and conciseness. The terms and words used in the following description and claims are not limited to the bibliographical meanings, but, are merely used by the inventor to enable a clear and consistent understanding of the disclosure. Accordingly, it should be apparent to those skilled in the art that the following description of various embodiments of the disclosure is provided for illustration purpose only and not for the purpose of limiting the disclosure as defined by the appended claims and their equivalents. It is to be understood that the singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to “a component surface” includes reference to one or more of such surfaces. FIG.1illustrates an electronic device in a network environment according to an embodiment of the disclosure. Referring toFIG.1, an electronic device101in a network environment100may communicate with an electronic device102via a first network198(e.g., a short-range wireless communication network), or an electronic device104or a server108via a second network199(e.g., a long-range wireless communication network). The electronic device101may communicate with the electronic device104via the server108. The electronic device101includes a processor120, memory130, an input module150, an sound output module155, a display device160, an audio module170, a sensor module176, an interface177, a haptic module179, a camera module180, a power management module188, a battery189, a communication module190, a subscriber identification module (SIM)196, or an antenna module197. In some embodiments, at least one (e.g., the display device160or the camera module180) of the components may be omitted from the electronic device101, or one or more other components may be added in the electronic device101. In some embodiments, some of the components may be implemented as single integrated circuitry. For example, the sensor module176(e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented as embedded in the display device160(e.g., a display). The processor120may execute, for example, software (e.g., a program140) to control at least one other component (e.g., a hardware or software component) of the electronic device101coupled with the processor120, and may perform various data processing or computation. As at least part of the data processing or computation, the processor120may load a command or data received from another component (e.g., the sensor module176or the communication module190) in volatile memory132, process the command or the data stored in the volatile memory132, and store resulting data in non-volatile memory134. The processor120may include a main processor121(e.g., a central processing unit (CPU) or an application processor (AP)), and an auxiliary processor123(e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor121. Additionally or alternatively, the auxiliary processor123may be adapted to consume less power than the main processor121, or to be specific to a specified function. The auxiliary processor123may be implemented as separate from, or as part of the main processor121. The auxiliary processor123may control at least some of functions or states related to at least one component (e.g., the display device160, the sensor module176, or the communication module190) among the components of the electronic device101, instead of the main processor121while the main processor121is in an inactive (e.g., sleep) state, or together with the main processor121while the main processor121is in an active state (e.g., executing an application). The auxiliary processor123(e.g., an ISP or a CP) may be implemented as part of another component (e.g., the camera module180or the communication module190) functionally related to the auxiliary processor123. The memory130may store various data used by at least one component (e.g., the processor120or the sensor module176) of the electronic device101. The various data may include, for example, software (e.g., the program140) and input data or output data for a command related thereto. The memory130may include the volatile memory132or the non-volatile memory134. The non-volatile memory134may include an internal memory136and an external memory138 The program140may be stored in the memory130as software, and may include, for example, an operating system (OS)142, middleware144, or an application146. The input module150may receive a command or data to be used by another component (e.g., the processor120) of the electronic device101, from the outside (e.g., a user) of the electronic device101. The input module150may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus pen). The sound output module155may output sound signals to the outside of the electronic device101. The sound output module155may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing record, and the receiver may be used for an incoming call. The receiver may be implemented as separate from, or as part of the speaker. The display device160may visually provide information to the outside (e.g., a user) of the electronic device101. The display device160may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector. The display device160may include touch circuitry adapted to detect a touch, or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of force incurred by the touch. The audio module170may convert a sound into an electrical signal and vice versa. The audio module170may obtain the sound via the input module150, or output the sound via the sound output module155or a headphone of an external electronic device (e.g., an electronic device102) directly (e.g., wiredly) or wirelessly coupled with the electronic device101. The sensor module176may detect an operational state (e.g., power or temperature) of the electronic device101or an environmental state (e.g., a state of a user) external to the electronic device101, and then generate an electrical signal or data value corresponding to the detected state. The sensor module176may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor. The interface177may support one or more specified protocols to be used for the electronic device101to be coupled with the external electronic device (e.g., the electronic device102) directly (e.g., wiredly) or wirelessly. The interface177may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface. A connection terminal178may include a connector via which the electronic device101may be physically connected with the external electronic device (e.g., the electronic device102). The connection terminal178may include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector). The haptic module179may convert an electrical signal into a mechanical stimulus (e.g., a vibration or a movement) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. The haptic module179may include, for example, a motor, a piezoelectric element, or an electric stimulator. The camera module180may capture an image or moving images. The camera module180may include one or more lenses, image sensors, image signal processors, or flashes. The power management module188may manage power supplied to the electronic device101. The power management module188may be implemented as at least part of, for example, a power management integrated circuit (PMIC). The battery189may supply power to at least one component of the electronic device101. The battery189may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell. The communication module190may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device101and the external electronic device (e.g., the electronic device102, the electronic device104, or the server108) and performing communication via the established communication channel. The communication module190may include one or more communication processors that are operable independently from the processor120(e.g., the AP) and supports a direct (e.g., wired) communication or a wireless communication. The communication module190may include a wireless communication module192(e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module194(e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device via the first network198(e.g., a short-range communication network, such as Bluetooth™, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network199(e.g., a long-range communication network, such as a cellular network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.g., multi chips) separate from each other. The wireless communication module192may identify and authenticate the electronic device101in a communication network, such as the first network198or the second network199, using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the SIM196. The wireless communication module192may support a 5G network, after a 4G network, and next-generation communication technology, e.g., new radio (NR) access technology. The NR access technology may support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable and low-latency communications (URLLC). The wireless communication module192may support a high-frequency band (e.g., the mmWave band) to achieve, e.g., a high data transmission rate. The wireless communication module192may support various technologies for securing performance on a high-frequency band, such as, e.g., beamforming, massive multiple-input and multiple-output (massive MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module192may support various requirements specified in the electronic device101, an external electronic device (e.g., the electronic device104), or a network system (e.g., the second network199). According to an embodiment, the wireless communication module192may support a peak data rate (e.g., 20 Gbps or more) for implementing eMBB, loss coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or a round trip of 1 ms or less) for implementing URLLC. The antenna module197may transmit or receive a signal or power to or from the outside (e.g., the external electronic device) of the electronic device101. According to an embodiment, the antenna module197may include an antenna including a radiating element composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module197may include a plurality of antennas (e.g., array antennas). In such a case, at least one antenna appropriate for a communication scheme used in the communication network, such as the first network198or the second network199, may be selected, for example, by the communication module190(e.g., the wireless communication module192) from the plurality of antennas. The signal or the power may then be transmitted or received between the communication module190and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module197. According to various embodiments, the antenna module197may form a mmWave antenna module. According to an embodiment, the mmWave antenna module may include a printed circuit board, a RFIC disposed on a first surface (e.g., the bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., the top or a side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the designated high-frequency band. At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)). According to an embodiment, commands or data may be transmitted or received between the electronic device101and the external electronic device104via the server108coupled with the second network199. Each of the electronic devices102or104may be a device of a same type as, or a different type, from the electronic device101. According to an embodiment, all or some of operations to be executed at the electronic device101may be executed at one or more of the external electronic devices102,104, or108. For example, if the electronic device101should perform a function or a service automatically, or in response to a request from a user or another device, the electronic device101, instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device101. The electronic device101may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device101may provide ultra low-latency services using, e.g., distributed computing or mobile edge computing. In another embodiment, the external electronic device104may include an internet-of-things (IoT) device. The server108may be an intelligent server using machine learning and/or a neural network. According to an embodiment, the external electronic device104or the server108may be included in the second network199. The electronic device101may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology. FIG.2is a block diagram illustrating an electronic device in a network environment200including a plurality of cellular networks according to an embodiment of the disclosure. Referring toFIG.2, the electronic device101may include a first communication processor212, second communication processor214, first RFIC222, second RFIC224, third RFIC226, fourth RFIC228, first radio frequency front end (RFFE)232, second RFFE234, first antenna module242, second antenna module244, and antenna248. The electronic device101may include a processor120and a memory130. A second network199may include a first cellular network292and a second cellular network294. According to another embodiment, the electronic device101may further include at least one of the components described with reference toFIG.1, and the second network199may further include at least one other network. According to one embodiment, the first communication processor212, second communication processor214, first RFIC222, second RFIC224, fourth RFIC228, first RFFE232, and second RFFE234may form at least part of the wireless communication module192. According to another embodiment, the fourth RFIC228may be omitted or included as part of the third RFIC226. The first communication processor212may establish a communication channel of a band to be used for wireless communication with the first cellular network292and support legacy network communication through the established communication channel. According to various embodiments, the first cellular network may be a legacy network including a second generation (2G), 3rd generation (3G), 4G, or long term evolution (LTE) network. The second communication processor214may establish a communication channel corresponding to a designated band (e.g., about 6 GHz to about 60 GHz) of bands to be used for wireless communication with the second cellular network294, and support 5G network communication through the established communication channel. According to various embodiments, the second cellular network294may be a 5G network defined in 3GPP. Additionally, according to an embodiment, the first communication processor212or the second communication processor214may establish a communication channel corresponding to another designated band (e.g., about 6 GHz or less) of bands to be used for wireless communication with the second cellular network294and support 5G network communication through the established communication channel. According to one embodiment, the first communication processor212and the second communication processor214may be implemented in a single chip or a single package. According to various embodiments, the first communication processor212or the second communication processor214may be formed in a single chip or a single package with the processor120, the auxiliary processor123, or the communication module190. Upon transmission, the first RFIC222may convert a baseband signal generated by the first communication processor212to a radio frequency (RF) signal of about 700 MHz to about 3 GHz used in the first cellular network292(e.g., legacy network). Upon reception, an RF signal may be obtained from the first cellular network292(e.g., legacy network) through an antenna (e.g., the first antenna module242) and be preprocessed through an RFFE (e.g., the first RFFE232). The first RFIC222may convert the preprocessed RF signal to a baseband signal so as to be processed by the first communication processor212. Upon transmission, the second RFIC224may convert a baseband signal generated by the first communication processor212or the second communication processor214to an RF signal (hereinafter, 5G Sub6 RF signal) of a Sub6 band (e.g., 6 GHz or less) to be used in the second cellular network294(e.g., 5G network). Upon reception, a 5G Sub6 RF signal may be obtained from the second cellular network294(e.g., 5G network) through an antenna (e.g., the second antenna module244) and be pretreated through an RFFE (e.g., the second RFFE234). The second RFIC224may convert the preprocessed 5G Sub6 RF signal to a baseband signal so as to be processed by a corresponding communication processor of the first communication processor212or the second communication processor214. The third RFIC226may convert a baseband signal generated by the second communication processor214to an RF signal (hereinafter, 5G Above6 RF signal) of a 5G Above6 band (e.g., about 6 GHz to about 60 GHz) to be used in the second cellular network294(e.g., 5G network). Upon reception, a 5G Above6 RF signal may be obtained from the second cellular network294(e.g., 5G network) through an antenna (e.g., the antenna248) and be preprocessed through the third RFFE236. The third RFIC226may convert the preprocessed 5G Above6 RF signal to a baseband signal so as to be processed by the second communication processor214. According to one embodiment, the third RFFE236may be formed as part of the third RFIC226. According to an embodiment, the electronic device101may include a fourth RFIC228separately from the third RFIC226or as at least part of the third RFIC226. In this case, the fourth RFIC228may convert a baseband signal generated by the second communication processor214to an RF signal (hereinafter, an intermediate frequency (IF) signal) of an intermediate frequency band (e.g., about 9 GHz to about 11 GHz) and transfer the IF signal to the third RFIC226. The third RFIC226may convert the IF signal to a 5G Above6RF signal. Upon reception, the 5G Above6RF signal may be received from the second cellular network294(e.g., a 5G network) through an antenna (e.g., the antenna248) and be converted to an IF signal by the third RFIC226. The fourth RFIC228may convert an IF signal to a baseband signal so as to be processed by the second communication processor214. According to one embodiment, the first RFIC222and the second RFIC224may be implemented into at least part of a single package or a single chip. According to one embodiment, the first RFFE232and the second RFFE234may be implemented into at least part of a single package or a single chip. According to one embodiment, at least one of the first antenna module242or the second antenna module244may be omitted or may be combined with another antenna module to process RF signals of a corresponding plurality of bands. According to one embodiment, the third RFIC226and the antenna248may be disposed at the same substrate to form a third antenna module246. For example, the wireless communication module192or the processor120may be disposed at a first substrate (e.g., main PCB). In this case, the third RFIC226is disposed in a partial area (e.g., lower surface) of the first substrate and a separate second substrate (e.g., sub PCB), and the antenna248is disposed in another partial area (e.g., upper surface) thereof; thus, the third antenna module246may be formed. By disposing the third RFIC226and the antenna248in the same substrate, a length of a transmission line therebetween can be reduced. This may reduce, for example, a loss (e.g., attenuation) of a signal of a high frequency band (e.g., about 6 GHz to about 60 GHz) to be used in 5G network communication by a transmission line. Therefore, the electronic device101may improve a quality or speed of communication with the second cellular network294(e.g., 5G network). According to one embodiment, the antenna248may be formed in an antenna array including a plurality of antenna elements that may be used for beamforming. In this case, the third RFIC226may include a plurality of phase shifters238corresponding to a plurality of antenna elements, for example, as part of the third RFFE236. Upon transmission, each of the plurality of phase shifters238may convert a phase of a 5G Above6 RF signal to be transmitted to the outside (e.g., a base station of a 5G network) of the electronic device101through a corresponding antenna element. Upon reception, each of the plurality of phase shifters238may convert a phase of the 5G Above6 RF signal received from the outside to the same phase or substantially the same phase through a corresponding antenna element. This enables transmission or reception through beamforming between the electronic device101and the outside. The second cellular network294(e.g., 5G network) may operate (e.g., stand-alone (SA)) independently of the first cellular network292(e.g., legacy network) or may be operated (e.g., non-stand alone (NSA)) in connection with the first cellular network292. For example, the 5G network may have only an access network (e.g., 5G radio access network (RAN) or a next generation (NG) RAN and have no core network (e.g., next generation core (NGC)). In this case, after accessing to the access network of the 5G network, the electronic device101may access to an external network (e.g., Internet) under the control of a core network (e.g., an evolved packed core (EPC)) of the legacy network. Protocol information (e.g., LTE protocol information) for communication with a legacy network or protocol information (e.g., new radio (NR) protocol information) for communication with a 5G network may be stored in the memory130to be accessed by other components (e.g., the processor120, the first communication processor212, or the second communication processor214). FIG.3Aillustrates a perspective view showing a front surface of a mobile electronic device according to an embodiment of the disclosure, andFIG.3Billustrates a perspective view showing a rear surface of the mobile electronic device shown inFIG.3Aaccording to an embodiment of the disclosure. The electronic device300inFIGS.3A and3Bmay be at least partially similar to the electronic device101inFIG.1or may further include other embodiments. Referring toFIGS.3A and3B, a mobile electronic device300may include a housing310that includes a first surface (or front surface)310A, a second surface (or rear surface)310B, and a lateral surface310C that surrounds a space between the first surface310A and the second surface310B. The housing310may refer to a structure that forms a part of the first surface310A, the second surface310B, and the lateral surface310C. The first surface310A may be formed of a front plate302(e.g., a glass plate or polymer plate coated with a variety of coating layers) at least a part of which is substantially transparent. The second surface310B may be formed of a rear plate311which is substantially opaque. The rear plate311may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or any combination thereof. The lateral surface310C may be formed of a lateral bezel structure (or “lateral member”)318which is combined with the front plate302and the rear plate311and includes a metal and/or polymer. The rear plate311and the lateral bezel structure318may be integrally formed and may be of the same material (e.g., a metallic material such as aluminum). The front plate302may include two first regions310D disposed at long edges thereof, respectively, and bent and extended seamlessly from the first surface310A toward the rear plate311. Similarly, the rear plate311may include two second regions310E disposed at long edges thereof, respectively, and bent and extended seamlessly from the second surface310B toward the front plate302. The front plate302(or the rear plate311) may include only one of the first regions310D (or of the second regions310E). The first regions310D or the second regions310E may be omitted in part. When viewed from a lateral side of the mobile electronic device300, the lateral bezel structure318may have a first thickness (or width) on a lateral side where the first region310D or the second region310E is not included, and may have a second thickness, being less than the first thickness, on another lateral side where the first region310D or the second region310E is included. The mobile electronic device300may include at least one of a display301, audio modules303,307and314, sensor modules304and319, camera modules305,312and313, a key input device317, a light emitting device, and connector holes308and309. The mobile electronic device300may omit at least one (e.g., the key input device317or the light emitting device) of the above components, or may further include other components. The display301may be exposed through a substantial portion of the front plate302, for example. At least a part of the display301may be exposed through the front plate302that forms the first surface310A and the first region310D of the lateral surface310C. Outlines (i.e., edges and corners) of the display301may have substantially the same form as those of the front plate302. The spacing between the outline of the display301and the outline of the front plate302may be substantially unchanged in order to enlarge the exposed area of the display301. A recess or opening may be formed in a portion of a display area of the display301to accommodate at least one of the audio module314, the sensor module304, the camera module305, and the light emitting device. At least one of the audio module314, the sensor module304, the camera module305, a fingerprint sensor (not shown), and the light emitting element may be disposed on the back of the display area of the display301. The display301may be combined with, or adjacent to, a touch sensing circuit, a pressure sensor capable of measuring the touch strength (pressure), and/or a digitizer for detecting a stylus pen. At least a part of the sensor modules304and319and/or at least a part of the key input device317may be disposed in the first region310D and/or the second region310E. The input module303may include microphone303. The microphone hole303may contain a microphone disposed therein for acquiring external sounds and, in a case, contain a plurality of microphones to sense a sound direction. The speaker holes307and314may be classified into an external speaker hole307and a call speaker hole314. The microphone hole303and the speaker holes307and314may be implemented as a single hole, or a speaker (e.g., a piezo speaker) may be provided without the speaker holes307and314. The sensor modules304and319may generate electrical signals or data corresponding to an internal operating state of the mobile electronic device300or to an external environmental condition. The sensor modules304and319may include a first sensor module304(e.g., a proximity sensor) and/or a second sensor module (e.g., a fingerprint sensor) disposed on the first surface310A of the housing310, and/or a third sensor module319(e.g., a heart rate monitor (HRM) sensor) and/or a fourth sensor module (e.g., a fingerprint sensor) disposed on the second surface310B of the housing310. The fingerprint sensor may be disposed on the second surface310B as well as the first surface310A (e.g., the display301) of the housing310. The electronic device300may further include at least one of a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor. The camera modules305,312and313may include a first camera device305disposed on the first surface310A of the electronic device300, and a second camera module312and/or a flash313disposed on the second surface310B. The camera module305or the camera module312may include one or more lenses, an image sensor, and/or an image signal processor. The flash313may include, for example, a light emitting diode or a xenon lamp. Two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device300. The key input device317may be disposed on the lateral surface310C of the housing310. The mobile electronic device300may not include some or all of the key input device317described above, and the key input device317which is not included may be implemented in another form such as a soft key on the display301. The key input device317may include the sensor module disposed on the second surface310B of the housing310. The light emitting device may be disposed on the first surface310A of the housing310. For example, the light emitting device may provide status information of the electronic device300in an optical form. The light emitting device may provide a light source associated with the operation of the camera module305. The light emitting device may include, for example, a light emitting diode (LED), an IR LED, or a xenon lamp. The connector holes308and309may include a first connector hole308adapted for a connector (e.g., a universal serial bus (USB) connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or a second connector hole309adapted for a connector (e.g., an earphone jack) for transmitting and receiving an audio signal to and from an external electronic device. Some modules305of camera modules305and312, some sensor modules304of sensor modules304and319, or an indicator may be arranged to be exposed through a display301. For example, the camera module305, the sensor module304, or the indicator may be arranged in the internal space of an electronic device300so as to be brought into contact with an external environment through an opening of the display301, which is perforated up to a front plate302. In another embodiment, some sensor modules304may be arranged to perform their functions without being visually exposed through the front plate302in the internal space of the electronic device. For example, in this case, an area of the display301facing the sensor module may not require a perforated opening. FIG.3Cillustrates an exploded perspective view showing a mobile electronic device shown inFIG.3Aaccording to an embodiment of the disclosure. Referring toFIG.3Ca mobile electronic device300may include a lateral bezel structure320, a first support member3211(e.g., a bracket), a front plate302, a display301, an electromagnetic induction panel (not shown), a printed circuit board (PCB)340, a battery350, a second support member360(e.g., a rear case), an antenna370, and a rear plate311. The mobile electronic device300may omit at least one (e.g., the first support member3211or the second support member360) of the above components or may further include another component. Some components of the electronic device300may be the same as or similar to those of the mobile electronic device101shown inFIG.1orFIG.2, thus, descriptions thereof are omitted below. The first support member3211is disposed inside the mobile electronic device300and may be connected to, or integrated with, the lateral bezel structure320. The first support member3211may be formed of, for example, a metallic material and/or a non-metal (e.g., polymer) material. The first support member3211may be combined with the display301at one side thereof and also combined with the printed circuit board (PCB)340at the other side thereof. On the PCB340, a processor, a memory, and/or an interface may be mounted. The processor may include, for example, one or more of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communications processor (CP). The memory may include, for example, one or more of a volatile memory and a non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a USB interface, a secure digital (SD) card interface, and/or an audio interface. The interface may electrically or physically connect the mobile electronic device300with an external electronic device and may include a USB connector, an SD card/multimedia card (MMC) connector, or an audio connector. The battery350is a device for supplying power to at least one component of the mobile electronic device300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a part of the battery350may be disposed on substantially the same plane as the PCB340. The battery350may be integrally disposed within the mobile electronic device300, and may be detachably disposed from the mobile electronic device300. The antenna370may be disposed between the rear plate311and the battery350. The antenna370may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna370may perform short-range communication with an external device, or transmit and receive power required for charging wirelessly. An antenna structure may be formed by a part or combination of the lateral bezel structure320and/or the first support member3111. FIG.4Ais a diagram illustrating a structure of, for example, a third antenna module described with reference toFIG.2according to an embodiment of the disclosure. Referring to part (a) ofFIG.4Ais a perspective view illustrating the third antenna module246viewed from one side, and part (b) ofFIG.4Ais a perspective view illustrating the third antenna module246viewed from the other side. Part (c) ofFIG.4Ais a cross-sectional view illustrating the third antenna module246taken along line X-X′ ofFIG.4A. Referring toFIG.4A, in one embodiment, the third antenna module246may include a printed circuit board410, an antenna array430, a RFIC452, and a PMIC454. Alternatively, the third antenna module246may further include a shield member490. In other embodiments, at least one of the above-described components may be omitted or at least two of the components may be integrally formed. The printed circuit board410may include a plurality of conductive layers and a plurality of non-conductive layers stacked alternately with the conductive layers. The printed circuit board410may provide electrical connections between the printed circuit board410and/or various electronic components disposed outside using wirings and conductive vias formed in the conductive layer. The antenna array430(e.g.,248ofFIG.2) may include a plurality of antenna elements432,434,436, or438disposed to form a directional beam. As illustrated, the antenna elements432,434,436, or438may be formed at a first surface of the printed circuit board410. According to another embodiment, the antenna array430may be formed inside the printed circuit board410. According to the embodiment, the antenna array430may include the same or a different shape or kind of a plurality of antenna arrays (e.g., dipole antenna array and/or patch antenna array). The RFIC452(e.g., the third RFIC226ofFIG.2) may be disposed at another area (e.g., a second surface opposite to the first surface) of the printed circuit board410spaced apart from the antenna array. The RFIC452is configured to process signals of a selected frequency band transmitted/received through the antenna array430. According to one embodiment, upon transmission, the RFIC452may convert a baseband signal obtained from a communication processor (not shown) to an RF signal of a designated band. Upon reception, the RFIC452may convert an RF signal received through the antenna array430to a baseband signal and transfer the baseband signal to the communication processor. According to another embodiment, upon transmission, the RFIC452may up-convert an IF signal (e.g., about 9 GHz to about 11 GHz) obtained from an intermediate frequency integrate circuit (IFIC) (e.g.,228ofFIG.2) to an RF signal of a selected band. Upon reception, the RFIC452may down-convert the RF signal obtained through the antenna array430, convert the RF signal to an IF signal, and transfer the IF signal to the IFIC. The PMIC454may be disposed in another partial area (e.g., the second surface) of the printed circuit board410spaced apart from the antenna array430. The PMIC454may receive a voltage from a main PCB (not illustrated) to provide power necessary for various components (e.g., the RFIC452) on the antenna module. The shielding member490may be disposed at a portion (e.g., the second surface) of the printed circuit board410so as to electromagnetically shield at least one of the RFIC452or the PMIC454. According to one embodiment, the shield member490may include a shield can. Although not shown, in various embodiments, the third antenna module246may be electrically connected to another printed circuit board (e.g., main circuit board) through a module interface. The module interface may include a connecting member, for example, a coaxial cable connector, board to board connector, interposer, or flexible printed circuit board (FPCB). The RFIC452and/or the PMIC454of the antenna module may be electrically connected to the printed circuit board through the connection member. FIG.4Bis a cross-sectional view illustrating the third antenna module246taken along line Y-Y′ of part (a) ofFIG.4Aaccording to an embodiment of the disclosure. The printed circuit board410of the illustrated embodiment may include an antenna layer411and a network layer413. Referring toFIG.4B, the antenna layer411may include at least one dielectric layer437-1, and an antenna element436and/or a power feeding portion425formed on or inside an outer surface of a dielectric layer. The power feeding portion425may include a power feeding point427and/or a power feeding line429. The network layer413may include at least one dielectric layer437-2, at least one ground layer433, at least one conductive via435, a transmission line423, and/or a power feeding line429formed on or inside an outer surface of the dielectric layer. Further, in the illustrated embodiment, the RFIC452(e.g., the third RFIC226ofFIG.2) of part (c) ofFIG.4Amay be electrically connected to the network layer413through, for example, first and second solder bumps440-1and440-2. In other embodiments, various connection structures (e.g., solder or ball grid array (BGA)) instead of the solder bumps may be used. The RFIC452may be electrically connected to the antenna element436through the first solder bump440-1, the transmission line423, and the power feeding portion425. The RFIC452may also be electrically connected to the ground layer433through the second solder bump440-2and the conductive via435. Although not illustrated, the RFIC452may also be electrically connected to the above-described module interface through the power feeding line429. FIG.5Ais a partially cutaway perspective view illustrating an electronic device in which an antenna structure and a key button device are disposed according to an embodiment of the disclosure. FIG.5Bis a top view illustrating the electronic device shown inFIG.5Aaccording to an embodiment of the disclosure. The electronic device300shown inFIGS.5A and5Bmay be similar, at least in part, to the electronic device101inFIG.1or the electronic device300inFIG.3A, or may include other embodiments of the electronic device. The antenna structure500(e.g., an antenna or antenna module) shown inFIGS.5A and5Bmay be similar, at least in part, to the antenna module197inFIG.1or the third RFIC226inFIG.2, or may include other embodiments of the antenna structure. The key button device600shown inFIGS.5A and5Bmay be similar, at least in part, to the input module150inFIG.1or the key input device317inFIG.3A, or may include other embodiments of the key button device. Referring toFIGS.5A and5B, the electronic device300(e.g., the electronic device101inFIG.1or the electronic device300inFIG.3A) may include a housing310including a side member320, the antenna structure500(e.g., an antenna or an antenna module) disposed in an inner space of the housing310, and the key button device600facing at least in part the antenna structure500and exposed to be visible from the outside through at least a portion of the housing. According to an embodiment, the side member320may be formed as at least a portion of a side surface (e.g., the lateral surface310C inFIG.3A) of the electronic device300and may be disposed to be at least partially visible from the outside. According to an embodiment, the side member320may include a support member3211(e.g., a support structure) that extends at least in part into the inner space of the electronic device300. According to various embodiments, the antenna structure500may include a substrate590and conductive patches510and520as antenna elements disposed on the substrate590. According to an embodiment, the antenna structure500may operate as an array antenna through the conductive patches510and520. According to an embodiment, the substrate590may have a first substrate surface5901facing toward first direction (direction {circle around (1)}), a second substrate surface5902facing toward a direction opposite to the first substrate surface5901, and a substrate side surface5903surrounding a space between the first substrate surface5901and the second substrate surface5902. According to an embodiment, the electronic device300may include a wireless communication circuit (e.g., the wireless communication module192inFIG.1, the RFIC452inFIG.4B, or the wireless communication circuit595inFIG.6A) electrically connected to the conductive patches510and520of the antenna structure500. According to an embodiment, the wireless communication circuit595may be disposed on the second substrate surface5902. In some embodiments, the wireless communication circuit595may be electrically connected to the conductive patches510and520disposed in the substrate590through an electrical connection member (e.g., an electrical connection member597inFIG.17) spaced apart from the substrate590in the inner space of the electronic device300. According to an embodiment, the conductive patches510and520may include a first conductive patch510and a second conductive patch520spaced apart from each other at a predetermined interval. In some embodiments, the conductive patches510and520may be replaced with a single conductive patch. In some embodiments, the conductive patches510and520may be replaced with three or more conductive patches spaced apart from each other at predetermined intervals. According to an embodiment, the wireless communication circuit595may be configured to transmit and/or receive a radio signal in a range of about 3 GHz to 100 GHz through the conductive patches510and520. According to various embodiments, the substrate590of the antenna structure500may be disposed in a manner to face the side member320in the inner space of the electronic device300. For example, in the inner space of the electronic device300, the substrate590may be disposed in order for the first substrate surface5901to face the side member320, thereby inducing a beam pattern of the antenna structure500to be formed in the first direction (the direction {circle around (1)}) toward which the side member320faces. According to an embodiment, the substrate590may be disposed on a mounting portion3212provided through a structural shape of the support member3211. According to an embodiment, the substrate590may be fixed to the mounting portion3212via a conductive plate550for supporting the substrate side surface5903and/or the second substrate surface5902. For example, the substrate590may be fixed to the conductive plate550by taping or bonding, and the conductive plate550may be fixed to the mounting portion3212or the side member320through a fastening member such as a screw (S). According to various embodiments, the key button device600may include a key button610and key modules620and630. The key button610is exposed to be visible from the outside at least partially through an opening321formed in the side member320and has pressing protrusions611and612protruding in a substrate direction (a negative x-axis direction). The key modules620and630are disposed on the first substrate surface5901to be switched in response to a pressing operation of the key button610. According to an embodiment, the key button610is disposed to be visible to the outside of the electronic device300and allows at least one function of the electronic device300to be performed through a user manipulation (e.g., press or touch). According to an embodiment, the at least one function may include various functions such as a volume up/down function, a wakeup function, a sleep function, or a power on/off function. According to an embodiment, when the first substrate surface5901is viewed from above, the key modules620and630may include a first key module620that overlaps with the first conductive patch510at least in part, and a second key module630that overlaps with the second conductive patch520at least in part. In some embodiments, when the antenna structure500includes three or more conductive patches, at least one conductive patch may be disposed at a position that does not correspond to the key modules620and630. According to an embodiment, the pressing protrusions611and612of the key button610may include a first pressing protrusion611for pressing the first key module620and a second pressing protrusion612for pressing the second key module630. According to an embodiment, the first pressing protrusion611and the second pressing protrusion612may be integrally formed with the key button610, or may be provided separately and structurally combined with the key button610. According to various embodiments, the first key module620may include a first button substrate621(e.g., a key pad) disposed on the first substrate surface5901, and a first conductive contact622(e.g., a metal dome) disposed on the first button substrate621and adjacent to or in contact with the first pressing protrusion611. For example, when the first pressing protrusion611presses the first conductive contact622through the pressing of the key button610, a switching operation may be performed through a circuit structure configured in the first button substrate621. In some embodiments, when the first conductive contact622has a metal dome, a carbon contact, which is a circuit structure disposed above and spaced apart from the first button substrate621, may be electrically connected through the deformation of the metal dome by the pressing of the first pressing protrusion611, and thereby the switching operation may be performed. In some embodiments, when the key button610and the first pressing protrusion611are formed at least in part of a conductive material, the first button substrate621may perform the switching operation by detecting a change in capacitance by a user's touch. According to an embodiment, the second key module630may include a second button substrate631(e.g., a key pad) disposed on the first substrate surface5901, and a second conductive contact632(e.g., a metal dome) disposed on the second button substrate631and adjacent to or in contact with the second pressing protrusion612. According to an embodiment, the second key module630may be disposed on the first substrate surface5901in substantially the same manner as that of the first key module620. Although the key button device600according to an embodiment of the disclosure includes one key button610for pressing the key modules620and630through the pressing protrusions611and612spaced apart from each other at a specified interval, this is not construed as a limitation. For example, the key button device600may include two key buttons respectively disposed at positions corresponding to the pressing protrusions611and612. In some embodiments, when three or more conductive patches are disposed in the antenna structure500, the key button device600may include three or more key modules and at least one key button for pressing the key modules. In some embodiments, the key button device600may be replaced with at least one other electronic component. For example, the at least one other electronic component may include a sensor module (e.g., the sensor module319inFIG.3B), a camera module (e.g., the camera module312inFIG.3B), a speaker device (e.g., the external speaker307inFIG.3A), a microphone device (e.g., the microphone303inFIG.3A), or a connector port (e.g., the connector hole308inFIG.3A). In some embodiments, the at least one other electronic component may be disposed to correspond to the outside of the electronic device300through the structural shape of the housing310. In some embodiments, the substrate590of the antenna structure500may be disposed to face a rear cover (e.g., the rear plate311inFIG.3B) of the electronic device300such that a beam pattern is formed in a direction (e.g., the negative z-axis direction inFIG.3B) toward which the rear surface faces. In this case, the key button610of the key button device600may be exposed to be seen from the outside on the rear surface (e.g., the rear surface310B inFIG.3B) of the electronic device300. According to various embodiments, the antenna structure500may include an electrical connection structure for electrically connecting the key button device600disposed on the first substrate surface5901of the substrate590to the main board (e.g., the printed circuit board340inFIG.3C) of the electronic device300. According to an embodiment, the electrical connection structure may be disposed through an internal structure of the substrate, and a detailed description will be given below. The electronic device300according to embodiments of the disclosure includes the antenna structure500and the key button device600disposed to overlap at least in part with the antenna structure500, and has a mutual arrangement structure to reduce the radiation performance degradation caused by the key button device600, thereby realizing an efficient use of a component mounting space without affecting the radiation performance. FIG.6Ais a cross-sectional view partially illustrating an antenna structure including a key button device according to an embodiment of the disclosure. FIG.6Bis a perspective view schematically illustrating an arrangement relationship between a key button device and a conductive patch according to an embodiment of the disclosure. FIGS.6A and6Bmerely illustrate the arrangement relationship between the first key module620of the key button device600and the first conductive patch510of the antenna structure500, but the arrangement relationship between the second key module630and the second conductive patch520of the antenna structure500may also be substantially the same. In some embodiments, as shown inFIGS.6A and6B, the electronic device300may include the antenna structure500having a single conductive patch510corresponding to the key button device600having a single key module620. Referring toFIGS.6A and6B, the electronic device (e.g., the electronic device300inFIG.5A) may include the antenna structure500and the key button device600disposed to overlap at least in part with the antenna structure500. According to an embodiment, the antenna structure500may include the substrate590having the first substrate surface5901facing toward the first direction (direction {circle around (1)}) and the second substrate surface5902facing toward a direction opposite to the first substrate surface5901, and the first conductive patch510(hereinafter, referred to as the ‘conductive patch’) disposed between the first substrate surface5901and the second substrate surface5902. According to an embodiment, the conductive patch510may be disposed in an insulating layer591between the first and second substrate surfaces5901and5902or disposed to be exposed through at least a portion of the first substrate surface. According to an embodiment, the substrate590may include a ground layer592. According to an embodiment, the conductive patch510may be disposed between the ground layer592and the first substrate surface5901in the insulating layer591. According to an embodiment, the antenna structure500may include a power feeder511disposed to penetrate at least in part vertically through the insulating layer591and having one end electrically connected to at least a portion of the conductive patch510. According to an embodiment, the other end of the power feeder511may be electrically connected to the wireless communication circuit595disposed on the second substrate surface5902through a first wiring structure5931(e.g., an electrical wiring) disposed in the insulating layer591between the ground layer592and the second substrate surface5902. According to an embodiment, the power feeder511may include a conductive via disposed to at least partially pass through a first through-hole5921formed in the ground layer592. According to various embodiments, the key button device600may be disposed on the first substrate surface5901of the antenna structure500. According to an embodiment, the key button device600may include the first key module620(hereinafter, the ‘key module’) disposed on the first substrate surface5901, and the key button610for operating the key module620through a user's manipulation. According to an embodiment, at least a portion of the key button610may be exposed through an opening (e.g., the opening321inFIG.5A) formed in at least a portion of the side member (e.g., the side member320inFIG.5A) so as to be visible from the outside and be manipulatable. According to an embodiment, the key button610may include the first pressing protrusion611(hereinafter, the ‘pressing protrusion’) that is extended to be in contact with or close to the key module620. According to an embodiment, the first key module620may include the first button substrate621(e.g., a key pad) disposed on the first substrate surface5901, and the first conductive contact622(hereinafter, the ‘conductive contact’) disposed on the first button substrate621(hereinafter, the ‘button substrate’). According to an embodiment, the conductive contact622may include a metal dome that is pressed through the pressing protrusion611. According to various embodiments, the antenna structure500may include at least a part of an electrical connection structure for connecting the key button device600to the main board (e.g., the printed circuit board340inFIG.3C) of the electronic device (e.g., the electronic device300inFIG.5A). According to an embodiment, the electrical connection structure may include one or more conductive vias623and624disposed to penetrate at least in part the substrate590. According to an embodiment, the one or more conductive vias623and624may include a first conductive via623(e.g., a signal via) disposed in the insulating layer591of the substrate590so as to pass through a second through-hole5101formed in the conductive patch510and a third through-hole5922formed in the ground layer592from the key module620, and a second conductive via624(e.g., a ground via) disposed to penetrate the conductive patch510from the key module620and electrically connected to the ground layer592. According to an embodiment, the first conductive via623may be disposed to remain electrically isolated from the conductive patch510and the ground layer592. According to an embodiment, the second conductive via624may remain electrically isolated from the conductive patch510. In another embodiment, the second conductive via624may be connected to the ground layer592while being electrically connected to the conductive patch510. According to an embodiment, the first conductive via623may be electrically connected to a connector596(e.g., a B2B connector) for the key button device disposed on the second substrate surface5902through a second wiring structure5932(e.g., an electrical wiring) disposed in the insulating layer591between the ground layer592and the second substrate surface5902. In some embodiments, the conductive patch510and/or the wireless communication circuit595may be electrically connected to the main board (e.g., the printed circuit board340inFIG.3C) through another electrical connection member (e.g., FRC; flexible printed circuit board (FPCB) type RF cable, or a coaxial cable) that is extended from the substrate590and provided separately from the connector596. In some embodiments, when the wireless communication circuit595is disposed at a location other than the substrate590in the inner space of the electronic device (e.g., the electronic device300inFIG.5A), the first wiring structure5931may also be electrically connected to the connector596, and thereby an RF signal of the conductive patch510and a key input signal of the key module620may be transmitted to the main board (e.g., the printed circuit board340inFIG.3C) through the connector596. In some embodiments, although the wireless communication circuit595is disposed on the second substrate surface5902, the RF signal of the conductive patch510and the key input signal of the key module620may be transmitted to the main board (e.g., the printed circuit board340inFIG.3C) through the connector596. FIG.6Cis a cross-sectional view partially illustrating an antenna structure including a key button device according to various embodiments of the disclosure. Compared to the configuration shown inFIG.6A, the antenna structure500may further include at least one conductive dummy patch5111disposed in the insulating layer591between the first substrate surface5901and the conductive patch510. According to an embodiment, the dummy patch5111may be spaced apart from the conductive patch510at a predetermined interval so as to be capacitively coupled to the conductive patch510. According to an embodiment, the dummy patch5111may have a smaller size than the conductive patch510. In some embodiments, the dummy patch5111may have a size substantially the same as or larger than the conductive patch510. According to an embodiment, the dummy patch5111may help to expand the bandwidth of the operating frequency band of the antenna structure500without degrading the radiation performance. FIGS.7A and7Bare views illustrating the arrangement structure of conductive vias according to various embodiments of the disclosure. FIGS.7A and7Bare top views of the substrate590of the antenna structure500. In order to explain the arrangement positions of the conductive vias623and624connected to the key module620, the key button (e.g., the key button610inFIG.6A) is not depicted. Referring toFIG.7A, the antenna structure500may include the conductive vias623and624disposed in the substrate590and electrically connected to the key module620. According to an embodiment, the conductive vias623and624may include the first conductive via623that transmits the key input signal of the key module620, and the second conductive via624that connects the key module620and the ground layer (e.g., the ground layer592inFIG.6A). According to an embodiment, as the conductive vias623and624are disposed in a region overlapping with the center C of the conductive patch510or a position close to the center C when the substrate590is viewed from above, it may be advantageous in reducing the radiation performance degradation of the antenna structure500. For example, a patch antenna including the conductive patch510has an electric field distribution that is symmetrical on the left and right with respect to the vertical direction of the operating polarized wave, and thereby it may have, at the center C of the conductive patch510, a virtual ground plane (a virtual short plane or e-plane) where the electric field becomes zero in the vertical direction of the polarized wave. Therefore, at that location, because there is no electric field between the conductive patch510and the ground layer (e.g., the ground layer592inFIG.6A), the radiation performance degradation of the antenna structure500can be reduced even if the conductive vias623and624are disposed. In another example, because the patch antenna including the conductive patch510has a stronger electric field from the center C to edge portions, a metal structure (e.g., the conductive vias623and624) positioned at the center of the conductive patch510may relatively less affect the radiation performance than positioned in the edge portions. According to various embodiments, using the structural characteristics of the patch antenna including the conductive patch510, the conductive vias623and624according to embodiments of the disclosure may be disposed to overlap with a point close to the center C of the conductive patch510when the substrate590is viewed from above. According to an embodiment, when the substrate590is viewed from above, the first conductive via623and the second conductive via624may be disposed at positions that overlap with points symmetrical to each other with respect to the center C of the conductive patch510. Although the two conductive vias623and624are illustrated as being spaced apart from each other with respect to the center C for convenience of description, this is not construed as a limitation. For example, the two conductive vias623and624may be disposed to be in contact with each other with respect to the center C. With respect toFIG.7B, one (e.g., the second conductive via624) of the two conductive vias623and624may be disposed at a position overlapping with the center C of the conductive patch510when the substrate590is viewed from above. For example, the second conductive via624connecting the key module620to the ground layer (e.g., the ground layer592inFIG.6A) of the substrate590may be disposed at a position overlapping with the center C. In an embodiment, because the first conductive via623is more advantageous as it is disposed closer to the center C, it may be disposed at a position in contact with the second conductive via624. In another embodiment, the first conductive via623may be disposed at a position overlapping with the center C, and the second conductive via624may be disposed at a position closest to the first conductive via623as much as possible. FIGS.7C and7Dare views illustrating the arrangement structure of power feeders according to various embodiments of the disclosure. Referring toFIG.7C, an antenna structure500-1may include two power feeders511and512disposed in the conductive patch510, thereby operating to have dual polarization. In this case, when the substrate590is viewed from above, the antenna structure500-1may include a first power feeder511disposed on a first virtual line L1passing through the center C, and a second power feeder512disposed on a second virtual line L2passing through the center C and crossing the first virtual line L1at a specified angle. According to an embodiment, the specified angle may include 90 degrees. According to an embodiment, the antenna structure500-1that includes the two power feeders511and512and supports the dual polarization may also include the conductive vias623and624disposed at positions overlapping with points close to the center C when the substrate590is viewed from above. According to an embodiment, the conductive vias623and624may be symmetrically disposed with respect to the center C, or alternatively one conductive via624may be disposed at a position overlapping with the center C, and the other conductive via623may be disposed to be in close proximity to the conductive via624. In an embodiment, the conductive vias623and624may be disposed at positions overlapping with points close to the center C without overlapping with the first and second virtual lines L1and L2. This is because, when the antenna structure500-1supports polarization diversity, the conductive patch510generates two perpendicular polarized waves, the virtual ground planes where the electric field becomes zero become perpendicular to each other at the center C of the conductive patch510, and thereby the center C of the conductive patch510operates as a virtual GND point. In some embodiments, the conductive vias623and624may be arranged in a direction perpendicular to the illustrated arrangement direction. Referring toFIG.7D, an antenna structure500-2may operate as a dual-feed dual-polarization antenna that further includes a third power feeder513disposed on the first virtual line L1to be symmetrical with the first power feeder511with respect to the center C of the conductive patch510and a fourth power feeder514disposed on the second virtual line L2to be symmetrical with the second power feeder512with respect to the center C. Even in this case, the conductive vias623and624may be disposed in the substrate590at positions overlapping with points close to the center C, thereby not only reducing deterioration in radiation performance of the antenna structure500-2, but also helping to implement an improved arrangement structure of the key button device (e.g., the key button device600inFIG.6A). FIG.8is a graph illustrating the radiation performance of an antenna structure depending on the presence or absence of a key button device in the configuration ofFIG.7Caccording to an embodiment of the disclosure. Referring toFIG.8, it can be seen that, in the antenna structure500-1ofFIG.7Csupporting dual polarization, the gains of vertical polarization (graph801) and horizontal polarization (graph802) when the key button device (e.g., the key button device600inFIG.6A) is disposed on the substrate (e.g., the substrate590inFIG.7C) through the arrangement structure of two conductive vias (e.g., the conductive vias623and624inFIG.7C) do not change significantly enough to affect the radiation performance in an operating frequency band810(e.g., about 28 GHz) compared to the gains of vertical polarization (graph803) and horizontal polarization (graph804) when the key button device600is not disposed on the substrate590. This means that, even if the conductive patch510of the antenna structure500-1and the key button device600are disposed to overlap with each other, the radiation performance of the antenna structure500-1is not substantially deteriorated through the two conductive vias623and624are arranged at the center C or close to the center C. FIG.9is a diagram illustrating the arrangement structure of conductive vias according to an embodiment of the disclosure. Referring toFIG.9, the antenna structure500may include the conductive vias623and624disposed in the substrate590and electrically connected to the key module620. According to an embodiment, the conductive vias623and624may include the first conductive via623that transmits the key input signal of the key module620, and the second conductive via624that connects the key module620and the ground layer (e.g., the ground layer592inFIG.6A). According to an embodiment, when the substrate590is viewed from above, the antenna structure500may include the second conductive via624disposed at a position overlapping with the center C of the conductive patch510, and the first conductive via623disposed at a position having a specified separation distance D1from the second conductive via624. According to an embodiment, when the substrate590is viewed from above, the first conductive via623may be disposed within a distance of about 30% of a linear distance (D) from the second conductive via624disposed at the center C of the conductive patch510to the end of the conductive patch510. According to an embodiment, even when both the first conductive via623and the second conductive via624are disposed in a region that does not overlap with the center C of the conductive patch510, each of the first and second conductive vias623and624may be disposed such that each separation distance D1from the center C is within a distance of 30% of the linear distance D between the center C of the conductive patch510and the end of the conductive patch. FIG.10is a graph illustrating the radiation performance of an antenna structure depending on a separation distance between two conductive vias ofFIG.9according to an embodiment of the disclosure. Referring toFIG.10, it can be seen that the gain of the antenna structure (e.g., the antenna structure500inFIG.9) decreases in the operating frequency band1010(e.g., about 28 GHz band) when the separation distance (e.g., the separation distance D1inFIG.9) of the first conductive via (e.g., the first conductive via623inFIG.9) from the second conductive via (e.g., the second conductive via624inFIG.9) disposed at a position overlapping with the center (e.g., the center C inFIG.9) of the conductive patch (e.g., the conductive patch510inFIG.9) toward the edge portion increases gradually. For example, when the first conductive via623is positioned at about a 30% point (e.g., a 28% point) where the separation distance D1is about 0.4 mm from the second conductive via (e.g., the center C of the conductive patch510), it was found that the gain decreased by about 1 dB. Also, when the separation distance (D1) is changed to about 0.6 mm corresponding to about a 50% point (e.g., a 42% point), it was found that the gain decreased by more than 2 dB. From this result, it can be seen that, when the first conductive via623and/or the second conductive via624are positioned based on the center C within about 30% of the linear distance D from the center C to the edge portion of the conductive patch510, the antenna structure500can be used without significant performance degradation. However, in case of being disposed at the separation distance D1that is farther than the above from the center C, it may be difficult to use due to deterioration in performance. FIG.11is a diagram illustrating the arrangement structure of conductive pads included in an electronic component according to an embodiment of the disclosure. Referring toFIG.11, the key module620may include a surface mount device (SMD) pad625disposed between the first substrate surface (e.g., the first substrate surface5901inFIG.6A) of the substrate (e.g., the substrate590inFIG.6A) and the button substrate621. According to an embodiment, the SMD pad625may include a conductive pad6251for electrical connection to the first conductive via623(e.g., a signal via) exposed to the first substrate surface (e.g., first substrate surface5901inFIG.6A) of the substrate (e.g., the substrate590inFIG.6A), and a connection part6252for electrical connection to the second conductive via624(e.g., a ground via). According to an embodiment, the conductive pad6251and the connection part6252may be selectively electrically connected to each other through the conductive contact (e.g., the conductive contact622inFIG.6A) of the key button device (e.g., the key button device600inFIG.6A). According to an embodiment, the conductive pad6251and the connection part6252are disposed at positions overlapping with the first conductive via623and the second conductive via624exposed on the first substrate surface5901when the substrate590is viewed from above, so that they can be electrically connected to each other merely by an operation in which the key module620is mounted on the first substrate surface5901. According to an embodiment, the conductive pad6251and the connection part6252may be electrically connected to the first conductive via623and the second conductive via624, respectively, through at least one of soldering, conductive taping, conductive bonding, and/or electrical connection member (e.g., conductive contact spring). According to various embodiments, depending on the arrangement position of the key button610and/or a design of the key module620(e.g., the arrangement position of the conductive contact622), the conductive pad6251may be eccentrically disposed to have a certain separation distance from the center C of the conductive patch (e.g., the conductive patch510inFIG.6A) rather than corresponds to the first conductive via623. In this case, the conductive pad6251is formed to have an elongated shape, so that the conductive contact (e.g., the conductive contact622inFIG.6A) of the key module may be electrically connected at a first point P1of the conductive pad6251, and the first conductive via623may be electrically connected at a second point P2of the conductive pad6251closer to the center C of the conductive patch510than the first point P1. Accordingly, by forming the conductive pad6251to have an elongated shape and allowing the first conductive via623closer to the center C, it is possible to reduce the deterioration in radiation performance of the antenna structure (e.g., the antenna structure500inFIG.6A). In some embodiments, the connection pad6251may also be electrically connected to the second conductive via624in substantially the same manner. In some embodiments, the conductive pad6251and the connection part6252of the SMD pad625may be formed directly on the button substrate (e.g., the button substrate621inFIG.6A). In some embodiments, the SMD pad625including the conductive pad6251and the connection part6252may be replaced with the dummy patch5111inFIG.6C. FIGS.12A to12Care diagrams illustrating the configuration of an antenna structure including a key button device according to various embodiments of the disclosure. Referring toFIG.12A, an antenna structure700may include the substrate590and also include, as a plurality of antenna elements arranged side by side at a specified interval on the substrate590, a first conductive patch710, a second conductive patch720, a third conductive patch730, and/or a fourth conductive patch740. In an embodiment, although not shown, each of the conductive patches710,720,730, and740may have the power feed structure ofFIG.7A(e.g., a single feed structure), the power feed structure ofFIG.7C(a dual-polarization feed structure), or the power feed structure ofFIG.7D(a dual-feed dual-polarization feed structure). For example, the antenna structure700may operate as an array antenna having a 1×4 structure. According to various embodiments, the key button device600may be disposed at a position that overlaps at least in part with the substrate590when the substrate590is viewed from above. According to an embodiment, the key button device600may include the key button610and also include, to generate key input signals through manipulation of the key button610, the first key module620having the first button substrate621and the first conductive contact622and the second key module630having the second button substrate631and the second conductive contact632. According to an embodiment, the first key module620may be disposed at a position overlapping with the first conductive patch710when the substrate590is viewed from above. According to an embodiment, the second key module630may be disposed at a position overlapping with the fourth conductive patch740when the substrate590is viewed from above. In another embodiment, the key modules620and630may be disposed at positions overlapping with the second conductive patch720and/or the third conductive patch730. In some embodiments, the key button device600may have two key buttons arranged to be manipulatable through the two key modules620and630. In describing the antenna structure700and the key button device600shown inFIG.12B, the same reference numerals are assigned to substantially the same components as those of the antenna structure700and the key button device600shown inFIG.12A, and a detailed description may be omitted. Referring toFIG.12B, the first key module620of the key button device600may be disposed at a position overlapping with the first conductive patch710when the substrate590is viewed from above. According to an embodiment, the second key module630of the key button device600may be disposed to overlap with a space between the third conductive patch730and the fourth conductive patch740when the substrate590is viewed from above. This arrangement structure may be determined depending on the size of the key button610of the key button device600and/or the arrangement positions of the pressing protrusions (e.g., the pressing protrusions611and612inFIG.5A) formed on the key button610. In describing the key button device600shown inFIG.12C, the same reference numerals are assigned to substantially the same components as those of the key button device600shown inFIG.12A, and a detailed description may be omitted. Referring toFIG.12C, an antenna structure750may include the substrate590and also include, as a plurality of antenna elements disposed on the substrate590, and a first conductive patch751, a second conductive patch752disposed side by side with the first conductive patch751in a second direction (direction {circle around (2)}), a third conductive patch753disposed side by side with the first conductive patch751in a third direction (direction {circle around (3)}) perpendicular to the second direction (direction {circle around (2)}), and a fourth conductive patch754disposed side by side with the second conductive patch752in the third direction (direction {circle around (3)}). According to an embodiment, the fourth conductive patch754may be disposed side by side with the third conductive patch753in the second direction (direction {circle around (2)}). For example, the antenna structure750may operate as an array antenna having a 2×2 structure. According to various embodiments, the key button device600may include the first key module620disposed at a position overlapping with the first conductive patch751and the second key module630disposed at a position overlapping with the third conductive patch753when the substrate590is viewed from above. According to an embodiment, when the substrate590is viewed from above, the key button610may be disposed at a position that overlaps at least in part with the first and third conductive patches751and753. In another embodiment, the first key module620and/or the second key module630may be disposed at a position overlapping with the second conductive patch752and/or the third conductive patch753when the substrate590is viewed from above. In this case, the arrangement position and/or shape of the key button610may be changed. In some embodiments, the key button device600may have two key buttons arranged to be manipulatable through the two key modules620and630. Although each of the antenna structure700and750shown inFIGS.12A to12Cinclude the two key modules620and630, this is not construed as a limitation. For example, each of the antenna structure700and750may include one key module or three or more key modules disposed on the substrate590. FIG.13is a diagram illustrating the configuration of an antenna structure including a key button device according to an embodiment of the disclosure. Referring toFIG.13, an antenna structure800may include the substrate590and also include, as a plurality of antenna elements arranged side by side at a predetermined interval on the substrate590, a first conductive patch810, a second conductive patch820, a third conductive patch830, a fourth conductive patch840, and/or a fifth conductive patch850. According to an embodiment, although not shown, each of the conductive patches810,820,830,840, and850may have the power feed structure ofFIG.7C(a dual-polarization feed structure). In some embodiments, each of the conductive patches810,820,830,840, and850may be replaced with the power feed structure ofFIG.7A(a single feed structure) or the power feed structure ofFIG.7D(a dual-feed dual-polarization feeding structure). For example, the antenna structure800may operate as an array antenna having a 1×5 structure. According to various embodiments, the key button device600may be disposed at a position that overlaps at least in part with the substrate590when the substrate590is viewed from above. According to an embodiment, the key button device600may include the key button610and also include, to generate key input signals through manipulation of the key button610, the first key module620having the first button substrate621and the first conductive contact622and the second key module630having the second button substrate631and the second conductive contact632. According to an embodiment, the first key module620may be disposed at a position overlapping with the first conductive patch810when the substrate590is viewed from above. According to an embodiment, the second key module630may be disposed at a position overlapping with the fourth conductive patch840when the substrate590is viewed from above. In some embodiments, the key modules620and630may be symmetrically disposed with respect to the third conductive patch830. For example, based on the third conductive patch830, the first key module620may be disposed on the second conductive patch820, and the second key module630may be disposed on the fourth conductive patch840. In another example, based on the third conductive patch830, the first key module620may be disposed on the first conductive patch810, and the second key module630may be disposed on the fifth conductive patch850. In some embodiments, the key modules620and630may be asymmetrically disposed on any two conductive patches of the conductive patches810,820,830,840, and850. In some embodiments, the key button device600may have two key buttons arranged to be manipulatable through the two key modules620and630. FIG.14is a graph illustrating the radiation performance of an antenna structure depending on the presence or absence of a key button device in the configuration ofFIG.13according to an embodiment of the disclosure. Referring toFIG.14, it can be seen that, in the antenna structure800ofFIG.13supporting dual polarization and including the conductive patches (e.g., the conductive patches810,820,830,840, and850inFIG.13) with a 1×5 array structure, the gains of vertical polarization (graph1401) and horizontal polarization (graph1402) when the key modules (e.g., the key modules620and630inFIG.13) of the key button device (e.g., the key button device600inFIG.13) are disposed to overlap with some conductive patches810and840among the conductive patches810,820,830,840, and850do not change significantly enough to affect the radiation performance in an operating frequency band1410(e.g., about 28 GHz) compared to the gains of vertical polarization (graph1403) and horizontal polarization (graph1404) when the key button device600is not disposed. This means that, even if the conductive patches810,820,830,840, and850have an array arrangement structure and the key modules620and630are disposed to overlap with some conductive patches810and840among the conductive patches810,820,830,840, and850, the radiation performance of the antenna structure800is not substantially deteriorated. FIG.15is a diagram illustrating the configuration of an antenna structure including key modules according to an embodiment of the disclosure. In describing the antenna structure800shown inFIG.15, the same reference numerals are assigned to substantially the same components as those of the antenna structure800shown inFIG.13, and a detailed description may be omitted. Referring toFIG.15, the first key module620may be disposed at a position overlapping at least in part with the first conductive patch810when the substrate590is viewed from above. According to an embodiment, while such a partial overlap with the first conductive patch810is maintained, the center of the first key module620may be shifted from the center of the first conductive patch810rightwards by a first distance t1along a second direction (direction {circle around (2)}) parallel to a long side590aof the substrate590and downwards by a second distance t2along a third direction (direction {circle around (3)}) parallel to a short side590bof the substrate590. According to an embodiment, while a partial overlap with the fifth conductive patch850is maintained, the center of the second key module630may be shifted from the center of the fifth conductive patch850leftwards by the first distance t1along the second direction (direction {circle around (2)}) parallel to the long side590aof the substrate590and downwards by the second distance t2along the third direction (direction {circle around (3)}) parallel to the short side590bof the substrate590. In this case, each of the first and second key modules620and630may be changed in shape to have the conductive pad6251as shown inFIG.11, and the first conductive via (e.g., the first conductive via623inFIG.11) of the substrate590may be formed to be electrically connected at a position close to the center of the conductive patch810or850. FIGS.16A and16Bare graphs illustrating the radiation performance of an antenna structure depending on the movement arrangement of key modules in the configuration ofFIG.15according to various embodiments of the disclosure. Referring toFIGS.16A and16B, graphs show the gains of horizontal polarization and vertical polarization of the antenna structure800when each of the first and second key modules620and630is disposed at the center of each of the first and fifth conductive patches810and850, when shifted from the center by the first shift distance t1(e.g., about 6 mm) along the second direction (direction {circle around (2)}) parallel to the long side590aof the substrate590, when shifted from the center by the second shift distance t2(e.g., about 6 mm) along the third direction ({circle around (3)} direction) parallel to the short side590bof the substrate590, or when shifted by both the first shift distance t1and the second shift distance t2, in the configuration ofFIG.15, when the substrate590is viewed from above. It can be seen that the gain change is not large enough to affect the radiation performance in an operating frequency band1601or1602(e.g., about 28 GHz). This means that, even if the key modules620and630are eccentrically disposed while overlapping at least in part with the conductive patches810and850, the radiation performance of the antenna structure800is not substantially deteriorated. FIG.17is a diagram illustrating the configuration of an antenna structure including key modules according to an embodiment of the disclosure. Referring toFIG.17, an electronic device (e.g., the electronic device300inFIG.5A) may include an antenna structure1700including the substrate590and a plurality of conductive patches1710,1720,1730, and1740disposed on the substrate590, and the key button device600including the first key module620and/or the second key module630disposed to overlap with some conductive patches1710and1740among the conductive patches1710,1720,1730, and1740when the substrate590is viewed from above. According to an embodiment, the antenna structure1700may include an electrical connection member597which extends from the substrate590and on which a wireless communication circuit598(e.g., the wireless communication circuit595inFIG.6A) (e.g., RFIC) is disposed. According to an embodiment, the electrical connection member597may include a flexible printed circuit board (FPCB) type RF cable (FRC) or a coaxial cable. According to various embodiments, the electrical connection member597may be electrically connected to the main board (e.g., the printed circuit board340inFIG.3C) of the electronic device (e.g., the electronic device300inFIG.5A) through a connector (not shown). Accordingly, the antenna structure1700may be electrically connected to the main board (e.g., the printed circuit board340inFIG.3C) through the electrical connection member597. In some embodiments, the wireless communication circuit598may be disposed on the main board (e.g., the printed circuit board340inFIG.3C). According to an embodiment, the key button device600may be disposed on the substrate590and electrically connected to the electrical connection member597through an electrical connection structure including a conductive via (e.g., the first conductive via623inFIG.6A) connected to the key modules620and630. FIG.18Ais a partially cutaway perspective view illustrating an electronic device in which a key button device is disposed in a housing according to an embodiment of the disclosure. FIG.18Bis a cross-sectional view partially illustrating the electronic device taken along line18b-18bofFIG.18Aaccording to an embodiment of the disclosure. Referring toFIGS.18A and18B, the electronic device300may include the housing310including the side member320, the antenna structure500disposed in the inner space of the housing310to form a beam pattern in a first direction (direction {circle around (1)}) toward which the side member320faces, and the key button device600that faces at least in part the antenna structure500and is disposed to be at least partially visible from the outside and be manipulatable through the side member320. According to an embodiment, when the side member320is viewed from the outside, at least a portion of the key button device600may be disposed to overlap with the antenna structure500. According to various embodiments, the key button device600may include the key button610at least partially protruded or exposed to the outside through the opening321formed in the side member320, and the first key module620or the second key module630disposed between the key button610and the substrate590of the antenna structure500. According to an embodiment, the first key module620may include the first button substrate621disposed on the substrate590and the first conductive contact622disposed on the first button substrate621. The second key module630may include the second button substrate631and the second conductive contact632. According to various embodiments, the side member320may include a conductive material320aof the electronic device300. According to an embodiment, the side member320may include a non-conductive material320binsert-injected into the conductive material320a. According to an embodiment, the opening321may be formed in the conductive material320a. In this case, the antenna structure500may be disposed such that a beam pattern is formed through the opening321in the first direction (direction {circle around (1)}) toward which the key button610disposed to overlap with the substrate590faces. To allow smooth formation of the beam pattern, the key button610may be formed of a non-conductive material (e.g., injection material). FIGS.19A to19Eare diagrams illustrating the configuration of a key button or a housing for radiation of an antenna structure according to various embodiments of the disclosure. Referring toFIG.19A, the key button device600may include the key button610including a pair of pressing protrusions611and612, and the key modules620and630disposed respectively at positions corresponding to the pair of pressing protrusions611and612. According to an embodiment, the key modules620and630may be disposed on the substrate590of the antenna structure500as described above. According to various embodiments, the antenna structure500may be disposed such that a beam pattern is formed in the first direction (direction {circle around (1)}) toward which the key button610faces. In this case, the key button610disposed to overlap at least in part with the direction of the beam pattern may have the conductive material610a(e.g., metal) and/or the non-conductive material610b(e.g., polymer). For example, the key button610may be formed of at least partially segmented conductive material610athrough insert injection of the non-conductive material610b. According to an embodiment, in the key button610, the non-conductive material610bmay be disposed between (e.g., in a middle of) the pair of pressing protrusions611and612. Referring toFIG.19B, because the key button610includes the pressing protrusions611and612formed of the non-conductive material610bin the configuration ofFIG.19A, it can reduce interference when the antenna structure500forms a beam pattern. Referring toFIG.19C, the key button610may be exposed or protruded from the opening321of the side member320to be visible from the outside. According to an embodiment, in the exposed portion when the side member320is viewed from the outside, the key button may be formed of the conductive material610adisposed centrally and the non-conductive material610bsurrounding at least a portion of the edge of the conductive material610a. For example, the non-conductive material610bmay be disposed in a closed loop shape along the edge of the conductive material610aor alternatively in an open loop shape in which the conductive material610ais at least partially interposed. Referring toFIG.19D, the opening321may have the conductive material320aor the non-conductive material320bof the side member320. In this case, the non-conductive material320bmay be exposed to the outside through the opening321or disposed at a position facing the key button610protruded. For example, the non-conductive material320bmay form the entire inner rim of the opening321or may form a partial inner rim of the opening321through the intervention of the conductive material320a. Referring toFIG.19E, when the opening321is viewed from the outside, the key button610of the key button device600may be disposed to overlap at least in part with the first and second key modules620and630disposed on the antenna structure500. According to an embodiment, the key button610may be formed of a conductive material. In this case, the key button610may be formed to have a second width TH2smaller than a first width TH1of the opening321. Accordingly, the beam pattern formed by the antenna structure500may be transmitted to the outside through a space between the opening321and the key button610. In some embodiments, when the first width TH1and the second width TH2are formed to be substantially the same, the beam pattern of the antenna structure500may be transmitted to the outside through a non-conductive portion formed in the side member (e.g., the side member320inFIG.19D) near the key button610. According to various embodiments, an electronic device (e.g., the electronic device300inFIG.5A) may include a housing (e.g., the housing310inFIG.5A); an antenna structure (e.g., the antenna structure500inFIG.5A) disposed in an inner space of the housing and including a substrate (e.g., the substrate590inFIG.6A) having a first substrate surface (e.g., the first substrate surface5901inFIG.5A) facing toward a first direction (e.g., the first direction (direction {circle around (1)}) inFIG.5A), a second substrate surface (e.g., the second substrate surface5902inFIG.5A) facing toward a direction opposite to the first substrate surface, and a ground layer (e.g., the ground layer592inFIG.6A) disposed in a space between the first substrate surface and the second substrate surface, at least one conductive patch (e.g., the conductive patch510inFIG.6A) disposed between the ground layer and the first substrate surface or to be exposed to the first substrate surface, at least one power feeder (e.g., the power feeder511inFIG.6A) disposed at a position of the at least one conductive patch, and at least one electrical connection structure disposed at the substrate including: a first conductive via (e.g., the first conductive via623inFIG.6A) disposed to pass through the at least one conductive patch and the ground layer, and a second conductive via (e.g., the second conductive via624inFIG.6A) passing through the at least one conductive patch and electrically connected to the ground layer; an electronic component (e.g., the key button device600inFIG.6A) disposed on the first substrate surface and disposed to overlap at least in part with the at least one conductive patch when the first substrate surface is viewed from above, the electronic component being electrically connected to a main board (e.g., the printed circuit board340inFIG.3C) through the at least one electrical connection structure; and a wireless communication circuit (e.g., the wireless communication circuit595inFIG.6A) disposed in the inner space, electrically connected to the at least one power feeder, and configured to form a beam pattern in the first direction through the at least one conductive patch According to various embodiments, the at least one power feeder may include: a first power feeder disposed on a first line passing through a center of the at least one conductive patch, and a second power feeder disposed on a second line passing through the center and perpendicular to the first line. According to various embodiments, when the at least one conductive patch is viewed from above, the first conductive via and the second conductive via may be symmetrically disposed with respect to the center. According to various embodiments, the first conductive via and the second conductive via may be disposed within a distance of 30% of a linear distance from the center to an end of the at least one conductive patch. According to various embodiments, when the at least one conductive patch is viewed from above, the second conductive via may be disposed at a position overlapping with the center. According to various embodiments, the first conductive via may be disposed within a distance of 30% of a linear distance from the center to an end of the at least one conductive patch. According to various embodiments, the electronic device may further include a connector disposed on the second substrate surface of the substrate and electrically connected to the first conductive via, and the connector may be electrically connected to the main board. According to various embodiments, the electronic device may further include a surface mount device (SMD) pad disposed between the electronic component and the first substrate surface, and the SMD pad may include a first conductive pad electrically connected to the first conductive via exposed on the first substrate surface. According to various embodiments, the first conductive pad may be formed to have an elongated shape outward from the center when the first substrate surface is viewed from above, the electronic component may be electrically connected at a first point of the first conductive pad, and the first conductive via may be electrically connected at a second point of the first conductive pad closer to the center than the first point. According to various embodiments, the SMD pad may include a second conductive pad electrically connected to the second conductive via exposed on the first substrate surface, the second conductive pad may be formed to have an elongated shape outward from the center when the first substrate surface is viewed from above, the electronic component may be electrically connected at a first point of the second conductive pad, and the second conductive via may be electrically connected at a second point of the second conductive pad closer to the center than the first point. According to various embodiments, radiation performance of the antenna structure may be determined through a separation distance from the center to the second conductive via when the first substrate surface is viewed from above. According to various embodiments, the electronic component may include a key button device having at least one key button exposed at least in part to the outside through an opening formed in a conductive portion disposed at least partially in the housing. According to various embodiments, a non-conductive portion may be formed along an edge of the opening. According to various embodiments, when the first substrate surface is viewed from above, the at least one key button may be disposed to overlap at least in part with the at least one conductive patch. According to various embodiments, the at least one key button may be formed of a non-conductive material. According to various embodiments, the at least one key button may have at least two conductive portions segmented through at least one non-conductive portion. According to various embodiments, the at least one conductive patch may include a plurality of conductive patches disposed at predetermined intervals. According to various embodiments, the key button device may include key modules disposed respectively to overlap with two or more of the plurality of conductive patches, and the at least one electrical connection structure may be disposed on each of the key modules. According to various embodiments, the key modules may be symmetrically disposed in the plurality of conductive patches. According to various embodiments, the at least one key button may include one key button accommodating the key modules together or two or more key buttons individually accommodating at least two key modules among the key modules. According to various embodiments, the antenna structure may further include at least one additional conductive patch disposed between the ground layer and the first substrate surface or to be exposed to the first substrate surface, and at least one additional power feeder disposed at a position of the at least one additional conductive patch. The wireless communication circuit may be electrically connected to the at least one additional power feeder, and may be configured to form the beam pattern in the first direction additionally through the at least one additional conductive patch. The electronic component may not be disposed to overlap at least in part with the at least one additional conductive patch when the first substrate surface is viewed from above. According to various embodiments, the at least one conductive patch and the at least one additional conductive patch may be disposed at predetermined intervals. According to various embodiments, the antenna structure may further include at least one conductive dummy patch disposed between the ground layer and the first substrate surface or to be exposed to the first substrate surface. The at least one conductive dummy patch may be spaced apart from the at least one conductive patch so as to be capacitively coupled to the at least one conductive patch. The at least one conductive dummy patch may not be electrically connected to the wireless communication circuit. According to various embodiments, the electronic component may not be disposed to overlap at least in part with the at least one conductive dummy patch when the first substrate surface is viewed from above. While the disclosure has been shown and described with reference with various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents. | 106,683 |
11942706 | DESCRIPTION OF EMBODIMENTS At least the following matters are made clear from the following description and the drawings. Disclosed is an antenna including: a dielectric layer including a first main surface and a second main surface opposite to the first main surface; a conductive ground layer formed on the first main surface; a first radiation element that is formed on the second main surface and is conductive; and a second radiation element that is formed side by side with the first radiation element on the second main surface and is conductive, wherein the first radiation element includes a first non-uniform width part having a width in a direction parallel to a first side in a linear shape opposed to a first vertex part, the width of the first non-uniform width part gradually decreasing in a direction from the first side to the first vertex part, and the second radiation element includes a second non-uniform width part having a width in a direction parallel to a second side in a linear shape opposed to a second vertex part, the width of the second non-uniform width part gradually decreasing in a direction from the second side to the second vertex part. In this way, since the first radiation element including the first non-uniform width part and the second radiation element including the second non-uniform width part are arranged side by side, it is possible to widen a range of a radiation direction in which the antenna can strongly transmit and receive a radio wave. The first non-uniform width part includes the first vertex part, the first radiation element includes a first uniform width part continuous from the first non-uniform width part toward the first side, the first uniform width part includes the first side, and a width of the first uniform width part is uniform in the direction parallel to the first side, the second non-uniform width part includes the second vertex part, the second radiation element includes a second uniform width part continuous from the second non-uniform width part toward the second side, and the second uniform width part includes the second side, and a width of the second uniform width part is uniform in the direction parallel to the second side. With this configuration, since the first radiation element includes the first non-uniform width part and the first uniform width part, and the second radiation element next to the first radiation element includes the second non-uniform width part and the second uniform width part, it is possible to further widen a range of a radiation direction in which the antenna can strongly transmit and receive a radio wave. A side of both side parts of the first non-uniform width part may be formed in a linear shape, and a side of both side parts of the second non-uniform width part may be formed in a linear shape. Sides of the first non-uniform width part in both side parts may be formed in a curved shape, and sides of the second non-uniform width part in both side parts may be formed in a curved shape. The first radiation element may have a shape that is line symmetric with respect to a perpendicular line from the first vertex part to the first side, and the second radiation element may have a shape that is line symmetric with respect to a perpendicular line from the second vertex part to the second side. The second side and the first side may be arranged on a straight line. The first radiation element and the second radiation element may be symmetrical with respect to a symmetry line located between the first radiation element and the second radiation element and perpendicular to the first side. The antenna may further include: a first feed line that is formed on the second main surface, extends from the first vertex part, and is conductive; a second feed line that is formed on the second main surface, extends from the second vertex part, is electrically connected to an end portion of the first feed line distal from the first radiation element, and is conductive; and a transmission line that extends from the end portion of the first feed line distal from the first radiation element and an end portion of the second feed line distal from the second radiation element, and is conductive. The transmission line may extend perpendicularly to the first side from the end portion of the first feed line distal from the first radiation element and the end portion of the second feed line distal from the second radiation element in a direction from the first side to the first vertex part, and the first radiation element and the second radiation element may be line symmetrical with respect to a center line of the transmission line, and the first feed line and the second feed line may be line symmetrical with respect to the center line of the transmission line. EMBODIMENTS Embodiments of the present disclosure are described below with reference to the drawings. Note that, although various limitations that are technically preferable for carrying out the present disclosure are imposed on the embodiments to be described below, the scope of the present disclosure is not to be limited to the embodiments and illustrated examples below. First Embodiment FIG.1is a perspective view of an antenna1. The antenna1is used for transmitting, receiving, or both transmitting and receiving a radio wave in a frequency band of a microwave or a millimeter wave. The antenna1is a microstrip antenna. The antenna1includes a dielectric layer10, a conductive pattern layer20formed on one of main surfaces of the dielectric layer10, and a conductive ground layer30formed on the other main surface of the dielectric layer10. Here, main surfaces of a layer refer to a surface on a front side of the layer and a surface on an opposite side to the front side. Note that a protective dielectric layer may be formed on one of the main surfaces of the dielectric layer10so as to cover the conductive pattern layer20, and in addition to this or instead of this, a protective dielectric layer may cover the conductive ground layer30. The dielectric layer10is formed of a resin (e.g., a liquid crystal polymer or a polyimide), a fiber-reinforced resin (e.g., a glass fiber-reinforced epoxy resin, a glass-cloth base material epoxy resin, or a glass-cloth base material polyphenylene ether resin), a fluoropolymer, or a ceramic. The dielectric layer10may be a single layer body, or may be a layered body. The dielectric layer10may be flexible, or may be rigid. The conductive pattern layer20and the conductive ground layer30are formed of a conductive metal material such as copper. FIG.2is a plan view of the conductive pattern layer20.FIG.2illustrates, as auxiliary lines or symbols representing directions, an X axis, a Y axis, and a Z axis orthogonal to each other. The Z axis is parallel to a thickness direction of the dielectric layer10, and is perpendicular to a radiation surface (one of the main surfaces of the dielectric layer10on which the conductive pattern layer20is formed) of the antenna1. The conductive pattern layer20is shape-processed (patterned) by a subtractive method, an additive method, or the like, for example. In this way, a first feed line22, a second feed line23, a transmission line24, a first radiation element25, and a second radiation element26are formed in the conductive pattern layer20. The first radiation element25is formed in a pentagon symmetrical with respect to a symmetry line25uparallel to the Y axis through a vertex25j. The symmetry line25uis also a perpendicular line from the vertex25jto an opposite side25a. Hereinafter, the vertex25jis also referred to as a first vertex25j, and the side25aopposite to the first vertex25jis also referred to as a first side25a. All of sides25a,25b,25c,25d, and25eof the first radiation element25are straight lines. The first side25aopposite to the first vertex25jis parallel to the X axis, the sides25band25crespectively extending from both ends of the first side25aare parallel to the Y axis, and the sides25band25chave lengths equal to each other. Since the sides25band25care parallel to each other, a width W1in an X-axis direction of a region25sof the first radiation element25sandwiched between the sides25band25cis uniform from vertexes25fand25gto vertexes25hand25i. Hereinafter, the region25sis referred to as a first uniform width part25s. An interior angle at the vertexes25fand25gat both ends of the first side25ais a right angle. An interior angle at the vertex25hopposite to the vertex25fwith respect to the side25bis an obtuse angle, an interior angle at the vertex25iopposite to the vertex25gwith respect to the side25cis an obtuse angle, and the interior angle at the vertex25hand the interior angle at the vertex25iare equal to each other. A length of the side25dextending from the vertex25hto the first vertex25jand a length of the side25eextending from the vertex25ito the first vertex25jare equal to each other. The sides25dand25eare inclined to the first side25aso as to come closer to each other toward the first vertex25j. Thus, a width W2in the X-axis direction of a region25tof the first radiation element25sandwiched between the sides25dand25egradually decreases in a direction from the first side25ato the first vertex25j, and a maximum width in the region25tis equal to the width W1of the first uniform width part25s. Hereinafter, the region25tis referred to as a first non-uniform width part25t. An interior angle at the first vertex25jis an acute angle. However, an interior angle at the first vertex25jmay be a right angle or an obtuse angle. The first radiation element25and the second radiation element26are arranged in a row in the X-axis direction. Since a shape of the second radiation element26and a shape of the first radiation element25are symmetrical with respect to a symmetry line27that is parallel to the symmetry line25uand is located between the first radiation element25and the second radiation element26, the shape of the second radiation element26and the shape of the first radiation element25are congruent. Therefore, the second radiation element26is formed in a pentagon symmetrical with respect to a symmetry line26uparallel to the Y axis through a vertex26j. The symmetry line26uis also a perpendicular line from the vertex26jto a side26aopposite to the vertex26j. Hereinafter, the vertex26jis also referred to as a second vertex26j, and the side26aopposite to the second vertex26jis also referred to as a second side26a. The second side26ais parallel to the X axis, and the second side26aand the first side25aare arranged on a straight line. Sides26band26crespectively extending from both ends of the second side26aare parallel to the Y axis, and the sides26band26chave lengths equal to each other. Because the sides26band26care parallel to each other, a width W3in the X-axis direction of a region26sof the second radiation element26sandwiched between the sides26band26cis uniform from vertexes26fand26gto vertexes26hand26i. Hereinafter, the region26sis referred to as a second uniform width part26s. An interior angle at the vertexes26fand26gat both ends of the second side26ais a right angle. An interior angle at the vertex26hopposite to the vertex26fwith respect to the side26bis an obtuse angle, an interior angle at the vertex26iopposite to the vertex26gwith respect to the side26cis an obtuse angle, and the interior angle at the vertex26hand the interior angle at the vertex26iare equal to each other. A length of a side26dextending from the vertex26hto the second vertex26jand a length of a side26eextending from the vertex26ito the second vertex26jare equal to each other. The sides26dand26eare inclined with respect to the second side26aso as to come closer to each other toward the second vertex26j. Thus, a width W4in the X-axis direction of a region26tof the second radiation element26sandwiched between the sides26dand26egradually decreases in a direction from the second side26ato the second vertex26j, and a maximum width in the region26tis equal to the width W3of the second uniform width part26s. Hereinafter, the region26tis referred to as a second non-uniform width part26t. An interior angle at the second vertex26jis an acute angle. However, an interior angle at the second vertex26jmay be a right angle or an obtuse angle. The side25bof the first radiation element25and the side26cof the second radiation element26adjacent to each other are parallel to each other, and an interval D1between the sides25band26cis uniform from the vertexes25fand26gto the vertexes25hand26i. Because the widths W2and W4of the non-uniform width parts25tand26tof the radiation elements25and26in the X-axis direction gradually decrease in the direction from the sides25aand26ato the vertexes25jand26j, an interval D2between the side25dof the first radiation element25and the side26eof the second radiation element26adjacent to each other gradually increases in the direction from the first side25ato the first vertex25j. A proximal end portion of the first feed line22having an L shape is electrically connected to the first vertex25jof the first radiation element25. The first feed line22linearly extends in a negative Y-axis direction from the first vertex25jof the first radiation element25, is then bent 90°, and linearly extends in a positive X-axis direction, and an end portion of the first feed line22distal from the first radiation element25is electrically connected to one end portion24bof the transmission line24. In other words, the first feed line22includes a first feed line part22alinearly extending in the negative Y-axis direction from the first vertex25jof the first radiation element25, and a second feed line part22blinearly extending in the positive X-axis direction from an end portion of the first feed line part22adistal from the first radiation element25to one end portion24bof the transmission line24. A proximal end portion of the second feed line23having an L shape is electrically connected to the second vertex26jof the second radiation element26. The second feed line23linearly extends in the negative Y-axis direction from the second vertex26jof the second radiation element26, is then bent 90°, and linearly extends in a negative X-axis direction, and an end portion of the second feed line23distal from the second radiation element26is electrically connected to one end portion24bof the transmission line24. In other words, the second feed line23includes a third feed line part23alinearly extending in the negative Y-axis direction from the second vertex26jof the second radiation element26, and a fourth feed line part23blinearly extending in the negative X-axis direction from an end portion of the third feed line part23adistal from the second radiation element26to one end portion24bof the transmission line24. A physical length of the first feed line22and a physical length of the second feed line23are equal to each other. A physical length of the first feed line part22aof the first feed line22and a physical length of the third feed line part23aof the second feed line23are equal to each other, and a physical length of the second feed line part22bof the first feed line22and a physical length of the fourth feed line part23bof the second feed line23are equal to each other. A shape of the second feed line23and a shape of the first feed line22are symmetrical with respect to the symmetry line27. The transmission line24linearly extends in the negative Y-axis direction from the end portions of the feed lines22and23distal from the radiation elements25and26. A center line of the transmission line24coincides with the symmetry line27. Another end portion24aof the transmission line24is a feed point. In other words, the end portion24aof the transmission line24is connected to a terminal of a radio frequency integrated circuit (RFIC), which is not illustrated. The RFIC is a transmitter, a receiver, or a transceiver. Note that the transmission line24may function as a transformer that achieves impedance matching for the terminal of the RFIC and the feed lines22and23. The radiation elements25and26having the shapes as described above are arranged in a row, and thus a range of a radiation direction in which the antenna1can strongly transmit and receive a radio wave is wide. Note that, as illustrated inFIG.3, notches25kand25kmade by being cut from the first vertex25jtoward the inside of the first radiation element25in parallel with the first feed line part22amay be formed at the first vertex25jof the first radiation element25on both sides of the first feed line part22a. Thus, the first feed line part22ais extended from the first vertex25jof the first radiation element25to the inside of the first radiation element25, and is electrically connected to the first radiation element25via an extended part22c. Since such notches25kand25kare formed, impedance matching is achieved between the first feed line22and the first radiation element25. Similarly, notches26kand26kmade by being cut from the second vertex26jtoward the inside of the second radiation element26in parallel with the third feed line part23amay be formed at the second vertex26jof the second radiation element26on both sides of the third feed line part23a, and the third feed line part23amay be extended from the second vertex26jof the second radiation element26to the inside of the second radiation element26, and be electrically connected to the second radiation element26via an extended part23c. The extended parts22cand23chave lengths equal to each other. Second Embodiment FIG.4is a plan view of a conductive pattern layer20of an antenna according to a second embodiment. Hereinafter, a difference between the antenna according to the second embodiment and the antenna according to the modified example (refer toFIG.3) of the first embodiment will be described. A corresponding portion between the antenna according to the second embodiment and the antenna according to the modified example of the first embodiment is provided with the same reference sign. In the modified example of the first embodiment, all of the sides25a,25b,25c,25d, and25eof the first radiation element25are straight lines. In contrast, in the second embodiment, sides25dand25ebeing both side parts of a first non-uniform width part25tof a first radiation element25are formed in a curved convex shape Similarly, sides26dand26ebeing both side parts of a second non-uniform width part26tof a second radiation element26are formed in a curved convex shape. Even when the sides25dand25ehave a curved shape, a width W2of the first non-uniform width part25tin the X-axis direction gradually decreases in a direction from a first side25ato a first vertex25j. Even when the sides26dand26ehave a curved shape, a width W4of the second non-uniform width part26tin the X-axis direction gradually decreases in a direction from a second side26ato a second vertex26j. The corresponding portion between the antenna according to the second embodiment and the antenna1according to the modified example of the first embodiment is similarly provided except for the point described above. The radiation elements25and26having the shapes as described above are arranged in a row, and thus a range of a radiation direction in which the antenna according to the second embodiment can strongly transmit and receive a radio wave is wide. Third Embodiment FIG.5is a plan view of a conductive pattern layer20of an antenna according to a third embodiment. Hereinafter, a difference between the antenna according to the third embodiment and the antenna according to the modified example (refer toFIG.3) of the first embodiment will be described. In the modified example of the first embodiment, the first radiation element25and the second radiation element26are formed in a pentagon. In contrast, in the third embodiment, a first radiation element125and a second radiation element126are formed in a semicircle, a semi-ellipse, or a shape close to the semicircle or the semi-ellipse. Hereinafter, shapes of the first radiation element125and the second radiation element126will be described in detail. The first radiation element125includes a first vertex part125j, and a first side125aopposite to the first vertex part125j. A perpendicular line from the first vertex part125jto the first side125ais a symmetry line125u, and the first radiation element125is formed in a semicircle, a semi-ellipse, or a shape close to the semicircle or the semi-ellipse symmetrical with respect to the symmetry line125u. The first side125ais formed linearly in parallel to the X axis. A side125dextends from one end125fof the first side125ato the first vertex part125jand is curved, and a side125eextends from another end125gof the side125ato the first vertex part125jand is curved. The sides125dand125eare formed in a curved convex shape. Thus, the first radiation element125is formed of only a first non-uniform width part125t, and a width W2of the first non-uniform width part125tin the X-axis direction gradually decreases in a direction from the first side125ato the first vertex part125j. The first radiation element125and the second radiation element126are arranged in a row in the X-axis direction. Because a shape of the second radiation element126and a shape of the first radiation element125are symmetrical with respect to a symmetry line127that is parallel to the symmetry line125uand is located between the first radiation element125and the second radiation element126, the shape of the second radiation element126and the shape of the first radiation element125are congruent. Therefore, the second radiation element126has a shape symmetrical with respect to a symmetry line126uparallel to the Y axis and goes through a vertex part126j. The symmetry line126uis also a perpendicular line from the second vertex part126jto a second side126aopposite to the second vertex part126j. A side126dextending from one end126fof the second side126ato the second vertex part126jis formed in a curved convex shape. A side126eextending from another end126gof the second side126ato the second vertex part126jis formed in a curved convex shape. Thus, the second radiation element126is formed of only a second non-uniform width part126t, and a width W4of the second non-uniform width part126tin the X-axis direction gradually decreases in a direction from the second side126ato the second vertex part126j. An interval D2between the side125dof the first radiation element125and the side126eof the second radiation element126adjacent to each other gradually increases in the direction from the first side125ato the first vertex part125j. A proximal end portion of a first feed line22having an L shape is electrically connected to the first vertex part125jof the first radiation element125, and a proximal end portion of a second feed line23having an L shape is electrically connected to the second vertex part126jof the second radiation element126. Because shapes of the first feed line22, the second feed line23, and a transmission line24are the same as those in the modified example of the first embodiment, detailed description thereof will be omitted. Notches125kand125kmade by being cut from the first vertex part125jtoward the inside of the first radiation element in parallel with a first feed line part22aare formed at the first vertex part125jof the first radiation element125on both sides of the first feed line part22aof the first feed line22. Similarly, notches126kand126kmade by being cut in parallel with a third feed line part23aare also formed on both sides of the third feed line part23aof the second feed line23. The radiation elements125and126having the shapes as described above are arranged in a row, and thus a range of a radiation direction in which the antenna according to the third embodiment can strongly transmit and receive a radio wave is wide. Comparative Example FIG.6is a plan view of a conductive pattern layer220of an antenna according to a comparative example. As illustrated inFIG.6, in the comparative example, a shape of radiation elements225and226arranged in a row in the X-axis direction is a rectangular shape. Sides225aand225jof the first radiation element225parallel to each other are parallel to the X axis, other sides225band225cparallel to each other are parallel to the Y axis, and a width W5of the first radiation element225in the X-axis direction is uniform. Sides226aand226jof the second radiation element226parallel to each other are parallel to the X axis, other sides226band226cparallel to each other are parallel to the Y axis, and a width W6of the second radiation element226in the X-axis direction is uniform. An interval D5between the first radiation element225and the second radiation element226is uniform. A radiation range of the antenna according to the first to third embodiments is wider than that of the antenna in the comparative example. Hereinafter, a radiation range of the antenna according to the first to third embodiments being wider and a radiation range of the antenna according to the comparative example being narrower are verified by a simulation. <Verification> FIG.7is a graph illustrating a simulation result of a relationship between a reflection coefficient and a frequency of the antenna1according to the modified example of the first embodiment. As illustrated inFIG.7, the antenna according to the modified example of the first embodiment has a frequency characteristic such that a reflection coefficient S11of an S parameter takes a minimum value at a frequency of 28 [GHz]. FIG.8is a graph illustrating a simulation result of directivity of a radio wave at 28 [GHz] radiated by the antenna according to the modified example of the first embodiment. A horizontal axis indicates an angle with reference to the Z axis on a YZ plane, and a vertical axis indicates a gain. As illustrated inFIG.8, a radiation direction achieving a maximum gain of 7.14 [dBi] is −30 [degree], and a range of a radiation direction in which a gain is within −3.00 [dBi] from the maximum gain is from −49.15 to +71.54 [degree]. FIG.9is a graph illustrating a simulation result of a relationship between a reflection coefficient and a frequency of the antenna according to the second embodiment. As illustrated inFIG.9, the antenna according to the second embodiment has a frequency characteristic such that a reflection coefficient S11of an S parameter takes a minimum value near a frequency of 28 [GHz]. FIG.10is a graph illustrating a simulation result of directivity of a radio wave at 28 [GHz] radiated by the antenna according to the second embodiment. A horizontal axis indicates an angle with reference to the Z axis on the YZ plane, and a vertical axis indicates a gain. As illustrated inFIG.10, a radiation direction achieving a maximum gain of 6.92 [dBi] is 8 [degree], and a range of a radiation direction in which a gain is within −3.00 [dBi] from the maximum gain is from −45.12 to +68.47 [degree]. FIG.11is a graph illustrating a simulation result of a relationship between a reflection coefficient and a frequency of the antenna according to the third embodiment. As illustrated inFIG.11, the antenna according to the third embodiment has a frequency characteristic such that a reflection coefficient S11of an S parameter takes a minimum value near a frequency of 28 [GHz]. FIG.12is a graph illustrating a simulation result of directivity of a radio wave at 28 [GHz] radiated by the antenna according to the third embodiment. A horizontal axis indicates an angle with reference to the Z axis on the YZ plane, and a vertical axis indicates a gain. As illustrated inFIG.11, a radiation direction achieving a maximum gain of 7.55 [dBi] is 2 [degree], and a range of a radiation direction in which a gain is within −3.00 [dBi] from the maximum gain is from −45.38 to +65.45 [degree]. FIG.13is a graph illustrating a simulation result of a relationship between a reflection coefficient and a frequency of the antenna according to the comparative example. As illustrated inFIG.13, the antenna according to the comparative example has a frequency characteristic such that a reflection coefficient S11of an S parameter takes a minimum value near a frequency of 28 [GHz]. FIG.14is a graph illustrating a simulation result of directivity of a radio wave at 28 [GHz] radiated by the antenna according to the comparative example. A horizontal axis indicates an angle with reference to the Z axis on the YZ plane, and a vertical axis indicates a gain. As illustrated inFIG.14, a radiation direction achieving a maximum gain of 8.34 [dBi] is 2 [degree], and a range of a radiation direction in which a gain is within −3.00 [dBi] from the maximum gain is from −43.22 to +53.66 [degree]. It is clear from the simulation result above that a range of the radiation direction of the antenna1according to the modified example of the first embodiment is the widest. It is clear that a range of the radiation direction of the antenna according to the second embodiment is the second widest. It is clear that a range of the radiation direction of the antenna according to the third embodiment is the third widest. It is clear that a range of the radiation direction of the antenna according to the comparative example is the narrowest. REFERENCE SIGNS LIST 1: Antenna;10: Dielectric layer;22: First feed line;23: Second feed line;24: Transmission line;25: First radiation element;25a: Side;25j: Vertex;25s: First uniform width part;25t: First non-uniform width part;26: Second radiation element;26a: Side;26j: Vertex;26s: Second uniform width part;26t: Second non-uniform width part;30: Conductive ground layer;125: First radiation element;125a: Side;125j: Vertex part;125t: First non-uniform width part;126: Second radiation element;126a: Side;126j: Vertex part;126t: Second non-uniform width part. | 29,909 |
11942707 | DETAILED DESCRIPTION In the following description, antennas, array antennas, array antenna arrangements and the likes are set forth as preferred examples. It will be apparent to those skilled in the art that modifications, including additions and/or substitutions may be made without departing from the scope and spirit of the invention. Specific details may be omitted so as not to obscure the invention; however, the disclosure is written to enable one skilled in the art to practice the teachings herein without undue experimentation. In accordance with a first aspect of the present invention, there is provided a differentially-fed dual-polarized antenna. In accordance with one embodiment of the present invention, the deferentially-fed dual-polarized antenna100as shown inFIGS.1to3includes an upper substrate110, a bonding film120, a ground plane130, a lower substrate140, a parasitic patch arrangement150, first and second L-shaped structures160,165, third and fourth L-shaped structures170,175, first and second feed lines180,185, third and fourth feed lines190,195, and an impedance matching arrangement199. The feed lines180,185,190,195in this embodiment are respective microstrip lines. The upper substrate110, the bonding film120, the ground plane130and the lower substrate140are arranged at respective planes perpendicular to a vertically extending central axis (marked by ‘AA’ only inFIG.2) and are arranged such that the central axis extends through respective centers of the upper substrate110, the bonding film120, the ground plane130and the lower substrate140. The bonding film is120is arranged between the upper substrate110and the lower substrate140, and bonds the upper substrate110to the lower substrate140. Further, the ground plane130is arranged between the bonding film120and the lower substrate140. That is, the upper substrate110and the lower substrate140, together with the ground plane130, are bonded together by the bonding film120. The bonding film120and the ground plane130are thus sandwiched between the upper substrate110and the lower substrate140. The upper substrate110has an upper surface111and a lower surface112opposite to the upper surface111. The parasitic patch arrangement150is arranged on the upper surface111of the upper substrate110and includes four square parasitic patches151-154. In this embodiment, the parasitic patches151-154are identical in dimensions and are arranged in a matrix formation. Thus, respective centers of the parasitic patches151-154are arranged equidistantly and equiangularly with respect to a reference point of the upper surface111of the upper substrate110. In this embodiment, the reference point of the upper surface111intersects the central axis and serves as a center point of the matrix formation of the parasitic patches151-154. The first and second L-shaped structures160,165include first and second radiator arms161,166, respectively. The first and second radiator arms161,166are arranged on the upper surface111of the upper substrate110, are operably coupled with the parasitic patch arrangement150, are spaced apart by an elongated first gap (marked by BB′), and are responsive to a first differential signal to emit a first radio frequency signal having a first polarization characteristic. More particularly, the first and second radiator arms161,166are responsive respectively to complementary positive and negative components of the first differential signal to cooperatively emit the first radio frequency signal. That is, the complementary components of the first differential signal have the same amplitude and are out of phase (i.e., having a phase difference of 180°) with respect to each other. The third and fourth L-shaped structures170,175include third and fourth radiator arms171,176, respectively. The third and fourth radiator arms171,176are arranged on the upper surface111of the upper substrate110, are operably coupled with the parasitic patch arrangement150, are spaced apart by an elongated second gap (marked by ‘CC’) intersecting the first gap, and are responsive to a second differential signal to emit a second radio frequency signal having a second polarization characteristic orthogonal to the first polarization characteristic. More particularly, the third and fourth radiator arms171,176are responsive respectively to complementary positive and negative components of the second differential signal to cooperatively emit the second radio frequency signal. That is, the complementary components of the second differential signal have the same amplitude and are out of phase (i.e., having a phase difference of 180°) with respect to each other. The first to fourth radiator arms161,166,171,176are elongated in shape, are arranged equidistantly and equiangularly with respect to the reference point of the upper surface111(i.e., the center point of the matrix formation of the parasitic patches151-154), and extend radially and outwardly with respect to the reference point of the upper surface111. Each of the first to fourth radiator arms161,166,171,176is substantially interposed between a respective adjacent pair of the parasitic patches151-154, and extends longitudinally beyond the respective adjacent pair of the parasitic patches151-154in a radial direction away from the reference point of the upper surface111of the upper substrate110. The first and second L-shaped structures160,165further include first and second vias162,167, respectively. Each of the first and second vias162,167extends vertically with respect to and through the upper substrate110, the bonding film120, the ground plane130and the lower substrate140, and has a respective upper end1621,1671connected electrically to a distal end1611,1661of the corresponding radiator arm161,166, with the distal end1611,1661of the corresponding radiator arm161,166being distal from the reference point of the upper surface111. That is, the distal end1611of the first radiator arm161is arranged distal from the second radiator arm166, and the distal end1661of the second radiator arm166is arranged distal from the first radiator arm161. Each of the first and second vias162,167further has a lower end1622,1672opposite to the upper end1621,1671, and an intermediate section1623,1673between the upper end1621,1671and the lower end1622,1672. The first and second vias162,167are respective through holes in this embodiment. The third and fourth L-shaped structures170,175further include third and fourth vias172,177, respectively. Each of the third and fourth vias172,177extends vertically with respect to and through the upper substrate110, the bonding film120, the ground plane130and the lower substrate140, and has a respective upper end1721,1771connected electrically to a distal end1711,1761of the corresponding radiator arm171,176, with the distal end1711,1761of the corresponding radiator arm171,176being distal from the reference point of the upper surface111. That is, the distal end1711of the third radiator arm171is arranged distal from the fourth radiator arm176, and the distal end1761of the fourth radiator arm176is arranged distal from the third radiator arm171. Each of the third and fourth vias172,177further has a lower end1722,1772, and an intermediate section (not labelled) between the upper end1721,1771and the lower end1722,1772. The third and fourth vias172,177are respective through holes in this embodiment. With such a configuration, the third and fourth vias172,177extend from the upper surface111of the upper substrate110to a lower surface142of the lower substrate140, with the lower surface142being opposite to an upper surface141of the lower substrate140. The upper substrate110has a square cross section, and has opposite first and second peripheral edges113,114corresponding to the first and second L-shaped structures160,165, respectively, and opposite third and fourth peripheral edges115,116corresponding to the third and fourth L-shaped structures170,175, respectively. The lower substrate140has a square cross section, and has opposite first and second peripheral edges143,144corresponding to the first and second L-shaped structures160,165, respectively, and opposite third and fourth peripheral edges145,146corresponding to the third and fourth L-shaped structures170,175, respectively. With such an arrangement, the third and fourth peripheral edges145,146of the lower substrate140extend perpendicularly with respect to the first and second peripheral edges113,114of the upper substrate110. The first and second feed lines180,185are arranged on the lower surface112of the upper substrate110, are connected electrically and respectively to the first and second vias162,167, and are adapted to receive the complementary components of the first differential signal. In this embodiment, each of the first and second feed lines180,185extends inwardly and perpendicularly from the corresponding peripheral edge113,114of the upper substrate110toward a reference point of the lower surface112, has a proximal end181,186connected electrically to the intermediate section1623,1673of the corresponding via162,167, and has a distal end182,187adapted to receive the respective complementary component of the first differential signal. In particular, the distal end182,187is adapted to be associated operatively with a respective port for receiving the respective complementary component of the first differential signal. The reference point of the lower surface112intersects the central axis. In this embodiment, the port of the first feed line180is a negative port (Port 1−) for receiving the negative component of the first differential signal, and that of the second feed lines185is a positive port (Port 1+) for receiving the positive component of the first differential signal. With such a configuration, the first and second radiator arms161,166are configured to cooperatively emit the first radio frequency signal having the first polarization characteristic in response to the respective components of the first differential signal respectively received by the first and second radiator arms161,166via the first and second vias162,167through the first and second feed lines180,185. The third and fourth feed lines190,195are arranged on the lower surface142of the lower substrate140, are connected electrically and respectively to the third and fourth vias172,177, and are adapted to receive the complementary components of the second differential signal. In this embodiment, each of the third and fourth feed lines190,195extends inwardly and perpendicularly from the corresponding peripheral edge145,146of the lower substrate140toward a reference point of the lower surface142, has a proximal end191,196connected electrically to the lower end1722,1772of the corresponding via172,177, and has a distal end192,197adapted to receive the respective complementary component of the second differential signal. In particular, the distal end192,197is adapted to be associated operatively with a respective port for receiving the respective complementary component of the second differential signal. The reference point of the lower substrate142intersects the central axis. In this embodiment, the port of the third feed line190is a positive port (Port 2+) for receiving the positive component of the second differential signal, and that of the fourth feed lines195is a negative port (Port 2−) for receiving the negative component of the second differential signal. With such a configuration, the third and fourth radiator arms171,176are configured to cooperatively emit the second radio frequency signal having the second polarization characteristic in response to the respective components of the second differential signal respectively received by the third and fourth radiator arms171,176via the third and fourth vias172,177through the third and fourth feed lines190,195. The ground plane130is formed with four holes131-134which corresponds respectively in position and size to the vias162,167,172,177and through which the vias162,167,172,177respectively extend. The ground plane130serves as a reflector to improve the front to back ratio, thereby improving broad side radiation patterns. The impedance matching arrangement199includes a pair of impedance matching pads1991,1992arranged on the lower surface142of the lower substrate140and operably associated with the third and fourth feed lines190,195. In this embodiment, the upper substrate110is implemented using RT/duroid5880laminates made by Rogers Corporation, and has a thickness of 0.787 mm, a dielectric constant of 2.2, and a loss tangent of 0.0009. The lower substrate140is implemented using an RT/duroid5880laminates made by Rogers Corporation and has a thickness of 0.127 mm. The bonding film120is implemented using a piece of RO4450F made by Rogers Corporation and has a thickness of 0.01 mm. The thickness of the upper substrate110corresponds substantially to one-eighth of a wavelength of the upper substrate110, g. This configuration is useful in achieving an improved bandwidth performance.FIG.4shows simulated S-parameter and gain performances of the antenna100in response to each of the first and second differential signals, with the first and second differential signals corresponding to first and second polarizations, respectively. These results are obtained through a full-wave electromagnetic simulation using Ansys HFSS. InFIG.4. Within this figure, “Port 1” marks simulated results of the antenna100in respect of a first polarization in response to the first differential signal being fed through the first feed lines180,185, with lines401,402labelling the gain and S-parameter performances in association with the first differential signal, respectively “Port 2” marks simulated results of the antenna100in respect of a second polarization in response to the second differential signal being fed through the second feed lines190,195, with lines403,404labelling the gain and S-parameter performances in association with the second differential signal, respectively. FIGS.5ato5cshow radiation patterns of the antenna100at 24 GHz, 27.5 GHz and 31 GHz, respectively, in response to the first differential signal being fed through the first feed lines180,185.FIGS.5dto5fshow radiation patterns of the antenna100at 24 GHz, 27.5 GHz and 31 GHz, respectively, in response to the second differential signal being fed through the second feed lines190,195. It can be understood fromFIGS.5ato5fthat the antenna100is able to achieve stable radiation patterns with low cross-polarization in response to each differential signal in respect of the corresponding polarization. Moreover, instead of being formed only from the upper surface111to the lower surface112of the upper surface110, the first and second vias162,167in this embodiment are formed from the upper surface111of the upper substrate110to the lower surface142of the lower substrate140, more particularly through the upper substrate110, the bonding film120, the ground plane130and the lower substrate140. This advantageously reduces the risk of blind holes being inadvertently formed, which improves the fabrication process and the fabrication success rate. The antenna100is advantageous in a number of ways. By virtue of the arrangement of the L-shaped structures160,165,170,175with respect to the parasitic patches151-154, the antenna100is able to achieve a wide bandwidth. Further, with the antenna100being adapted to receive the first and second differential signals, cross-polarization is reduced, thus facilitating integration or operable association of the antenna100with a radio frequency (RF) circuit. The utilization of the first differential signal makes the vertial current components cancel out each other, which allows the horizontal current components of the first and second L-shaped structures160,165and parasitic patches151-154to become dominant. Moreover, the position arrangement of the feed lines180,185,190,195together with the differential nature of the differential signals provide a synergy which facilitates implementation of the antenna100in a low-profile device as well as in a compact array. Cross polarization is reduced by the arrangement of the feed lines180,185,190,195, where the first and second feed lines180,185are separated from the third and fourth feed lines190,195by the ground plane130. In addition, this particular arrangements can be adopted to construct an array antenna. In addition, with the bonding film120being utilized as a part of the upper substrate110on which the first and second feed lines180,185are placed, the antenna100has a thickness of only about 0.087λ0, where λ0is one wavelength at the center frequency of 26 GHz. Furthermore, the ground plane130serves to isolate the first and second feed lines180,185from the third and fourth feed lines190,195. This isolation arrangement, together with the differential signal arrangement, helps to improve antenna signal-to-noise ratio performances and to achieve broad side radiation patterns. In accordance with a second aspect of the present invention, there is provided a differentially-fed dual-polarized array antenna. In accordance with one embodiment of the present invention, the differentially-fed dual-polarized array antenna600as shown inFIGS.6aand6bincludes an upper substrate610, a bonding film620, a ground plane630, a lower substrate640, a plurality of antenna portions650, and a feed network690. The feed network690includes first to fourth feed network segments692,694,696,698. Each of the antenna portions650includes a parasitic patch arrangement660, first to fourth L-shaped structures670,675,680,685. The upper substrate610, the bonding film620, the ground plane630, and the lower substrate640of this embodiment are similar in configuration to the upper substrate110, the bonding film120, the ground plane130, and the lower substrate140of the embodiment ofFIGS.1to3. Thus, they are omitted from description for the sake of brevity. For each of the antenna portion650, the parasitic patch arrangement660and the first to fourth L-shaped structures670,675,680,685are similar to those150,160,165,170,175of the embodiment ofFIGS.1to3, with one exception being the arrangement of the reference point with respect to which the components150,170,175,180,185. Specifically, in the present embodiment, for each antenna portion650, the respective components660,670,675,680,685are arranged with respect to a respective reference point (marked by ‘DD’ inFIG.6b) of an upper surface611of the upper substrate610that does not intersect a central vertical axis of the antenna600. FIG.6cdepicts an enlarged partially transparent view of the array antenna ofFIG.6a, showing some of the antenna portions650and a portion of the feed network690. The view ofFIG.6ccorresponds to a section of the array antenna600marked by dashed square ‘FF’ inFIG.6a. FIG.6ddepicts an enlarged partially transparent view of the array antenna ofFIG.6a, showing a feed line692aand a feed via692bof the first feed network segment692of the feed network690. The feed via692bis adapted to electrically connect the feed line692ato another feed line692c(e.g., an external feed line). The array antenna600of this embodiment has a 4×4 antenna array. Therefore, the reference points of the upper surface611and thus the respective antenna portions650are thus arranged in a 4×4 matrix formation in this embodiment. The first and second feed network segments692,694are arranged on a lower surface612of the upper substrate610, are connected electrically and respectively to the first and second vias651,652of each antenna portion650, and are adapted to respectively receive complementary components of a first differential signal. The first and second feed network segments692,694include respective feed lines693,695adapted to receive the respective complementary components of the first differential signal. The third and fourth feed network segments696,698are arranged on a lower surface642of the lower substrate640, are connected electrically and respectively to the third and fourth vias653,654of each antenna portion650, and are adapted to respectively receive complementary components of a second differential signal. The third and fourth feed network segments696,698include respective feed lines697,699adapted to receive the respective complementary components of the second differential signal. The feed lines697,699are aligned in a second direction perpendicular to a first direction in which the feed lines693,695are aligned. FIG.7shows simulated and measured S-parameter and gain performances of the array antenna600in response to each of the first and second differential signals, where lines701,702respectively represent measured and simulated gain performances of the array antenna600in response to the first differential signal, where lines703,704respectively represent measured and simulated gain performances of the array antenna600in response to the second differential signal, where lines705,706respectively represent measured and simulated S-parameter performances of the array antenna600in response to the first differential signal, and where lines707,708respectively represent measured and simulated S-parameter performances of the array antenna600in response to the second differential signal. FIG.8shows mutual coupling performances of the array antenna600, where lines801,802respectively represent measured and simulated results. FIG.9ashows simulated and measured co-planar and cross-planar radiation patterns of the array antenna600in response to the first differential signal at 24 GHz, 26.5 GHz and 29 GHz in respect of a first polarization (E-plane).FIG.9bshows simulated and measured co-planar and cross-planar radiation patterns of the array antenna600in response to the first differential signal at 24 GHz, 26.5 GHz and 29 GHz in respect of a second polarization (H-plane)FIG.9cshows simulated and measured co-planar and cross-planar radiation patterns of the array antenna600in response to the second differential signal at 24 GHz, 26.5 GHz and 29 GHz in respect of the first polarization.FIG.9dshows simulated and measured co-planar and cross-planar radiation patterns of the array antenna600in response to the second differential signal at 24 GHz, 26.5 GHz and 29 GHz in respect of the second polarization. For the array antenna600, the bandwidth in one polarization overlaps that in the other polarization by 23.2% (23.2 GHz to 29.3 GHz) in the simulated results, and by 25.4% (23 GHz to 29.7 GHz) in the measured results. The feed line693,695are isolated from the feed lines697,699by 18 dB. Moreover, the antenna portions650occupy a small total area of 3.28λ0×3.28λ0×0.087λ0, where λ0represents a wavelength at a center frequency of the array antenna600(or at a center frequency of the antenna portions650). The array antenna600of this embodiment is advantageously configured to utilize mutual coupling to achieve a shared aperture effect, which is described in further detail below with reference to a 1×2 differentially-fed dual-polarized array antenna1000of another embodiment depicted inFIG.10. The array antenna1000is similar to the array antenna600in configuration, with the exception of the array antenna1000having no antenna portions other than left and right antenna portions1050,1050′. The left and right antenna portions1050,1050′ are similar in configuration to any neighboring pair of the antenna portions650of the array antenna600in either direction. The array antenna1000has a substrate surface1011. Each antenna portion1050,1050′ includes a parasitic patch arrangement1060,1060′, a first radiator arm1071,1071′, a second radiator arm1076,1076, a third radiator arm1081,1081′, and a fourth radiator arm1086,1086′. Each parasitic patch arrangement1060,1060′ includes a first parasitic patch1061,1061′, a second parasitic patch1062,1062′, a third parasitic patch1063,1063′, and a fourth parasitic patch1064,1064′ The first radiator arm1071of the left antenna portion1050is responsive to a first one (in this embodiment, a negative component) of complementary components of a first differential signal, and the second radiator arm1076′ of the right antenna portion1050′ is responsive to a second one (in this embodiment, a positive component) of the complementary components of the first differential signal. The first radiator arm1071of the left antenna portion1050and the second radiator arm1076′ of the right antenna portion1050′ are arranged proximate to and operably coupled with each other, and are responsive to the respective complementary components of the first differential signal to cooperatively emit a first radio frequency signal having a first polarization characteristic. In such a manner, the first antenna arm1071and the first and the fourth parasitic patches1061,1064of die left antenna portion1050, together with the second antenna arm1076′ and the second and third parasitic patches1062′,1063′ of the right antenna portion1050′ cooperate to provide or serve as a further antenna portion1050″. The further antenna portion1050″ corresponds to an aperture portion characterized by mutual coupling between the left and right antenna portions1050,1050′. By configuring the antenna portions1050,1050′ in the manner described above, said mutual coupling is utilized to realize the shared-aperture effect. That is, with the antenna array1000, the antenna portions1050,1050′ are arranged sufficiently close to each other to utilize mutual coupling therebetween to achieve the shared-aperture effect. By virtue of the proximity in placement of the antenna portions1050,1050′, the antenna array1000is thus advantageous in that the antenna portions1050,1050′ occupy a small total area of 0.64λ0while gain is largely maintained. In contrast with a similar array antenna1100shown inFIG.11whose left and right antenna portions1150,1150′ have respective center points spaced apart by a greater distance of 0.92λ0(for avoiding severe mutual coupling), the array antenna1000whose left and right portions1050,1050′ have respective center points spaced apart by a smaller distance of 0.71λ0is able to achieve a better S-parameter performance, as shown inFIG.12. InFIG.12, first, second and third lines1201,1202,1203show gain performances of the array antenna1000, the array antenna1100and a non-array antenna (i.e., having a single antenna portion, similar to the embodiment ofFIG.1to3), respectively; and fourth and fifth lines1204,1205show S-parameter performances of the array antenna1000and the array antenna1100, respectively. It can be seen that, despite the distance between the center points of the antenna portions1050,1050′ being significantly smaller, the array antenna1000is able to achieve gain and S-parameter performances similar to those achieved by the array antenna1100. Moreover, the array antenna1000is shown to achieve an improvement of 3 dB in gain performance relative to the non-array antenna. FIG.13shows in-phase current distribution measurements of the array antenna1000at 24 GHz and 29 GHz in respect of two time points, namely t=0 and t=T/4, where T represents one period of time-harmonic excitation. The effect of mutual coupling in the array antenna1000can be observed in this figure. FIG.14shows a side-by-side comparison between two array area1400,1405occupied by respective 4×4 arrays, with the array of the lower area1400implemented according to the arrangement ofFIG.10and with the array of the upper area1405implemented according to the arrangement ofFIG.11. As can be seen fromFIG.14, the upper array area1405is significantly larger than the lower array area1400. It can thus be understood that mutual coupling can be utilized in the manner of the array antenna1000to achieve a significantly reduced array size yet maintained gain. Each of the array areas1400,1405is shown to be surrounded by a respective peripheral area1401,1406, which marks a border between the respective array and an adjacent array for ensuring optimal antenna performance of both arrays. A width of the peripheral area1401,1406(marked by ‘EE’) can be adjusted to improve performances of the respective array. FIG.15shows simulated array gain results of the array antennas of the array areas1400,1405, respectively, where first and second connected lines1501,1502correspond to the array antennas of the array areas1400,1405, respectively. It can be seen that the array antennas of the array areas1400,1405have similar gain performances, especially across the frequencies from 24 GHz to 31 GHz. Yet, the array occupying the lower array area1400is 36% smaller in size than that occupying the upper array area1405. It can be understood that the 4×4 array antenna600is an expanded version of the 1×2 array antenna1000, with each adjacent pair of the antenna portions650in either direction being configured in accordance with the arrangement of the 1×2 array antenna1000to achieve a respective shared aperture effect. Advantageously, the differentially-fed dual-polarized antenna100and the differentially-fed dual-polarized array antennas600,1000are able to achieve wide bandwidths, stable radiation patterns and gains, low cross-polarization levels and low profiles (or array areas, only 0.073λ0). In addition, by employing a feed configuration similar to that of the antenna100(i.e., the vias162,167,172,177, the feed lines180,185on the lower surface112, and the feed lines190,195on the lower surface142), the antenna portions650of the array antenna600can be tightly arranged. Moreover, the array antennas600,1000utilize mutual coupling between neighboring pairs of the antenna portions650,1050,1050′ together with the differentially-fed (or differentially-driven) arrangement, contributes to a compact design of, for example, 3.28λ0×3.28λ0×0.08λ0(λ0representing the wavelength in free space at 26.3 GHz) with an overlapped bandwidth of 25%, a peak gain of about 19.8 dBi, a good port (or feed line)isolation, and largely maintains gain. The antenna100and the array antennas600,1000are thus suitable for use in 5G communications systems and other such systems requiring low-profile, compact antenna designs. Additionally, the differentially-fed arrangement makes the antennas100,600,100suitable for RF circuit integration. Other alternative arrangements are described below. In some alternative embodiments similar to the embodiment ofFIGS.1to3, the first and second vias162,167of the first and second L-shaped structures160,165extend through only the upper substrate110, from the upper surface111to the lower surface112. That is, the first and second vias162,167do not extend beyond the upper substrate110. In some alternative embodiments, each radiator arm is arranged with respect to the respective via in a T-shaped configuration. That is, the respective via is connected electrically to a middle section of the radiator arm. In some alternative embodiments, the bonding film may be otherwise configured (e.g., with different materials), provided that the thickness of the bonding film is suitable, that the bonding film has a suitable dielectric constant, and that the feed lines do not exceed predetermined processing limitations. The foregoing description of the present invention has been provided for the purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Many modifications and variations will be apparent to the practitioner skilled in the art. The embodiments were chosen and described in order to best explain the principles of the invention and its practical application, thereby enabling others skilled in the art to understand the invention for various embodiments and with various modifications that are suited to the particular use contemplated. | 31,852 |
11942708 | DETAILED DESCRIPTION In the following detailed description, for purpose of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing. One object of the present disclosure is to provide a crimp terminal-equipped flexible printed circuit board capable of making stable electrical connection while holding strength and a method for manufacturing the crimp terminal-equipped flexible printed circuit board. A crimp terminal-equipped flexible printed circuit board according to one aspect of the present disclosure includes: a first flexible printed circuit board having a base film and a circuit provided on a surface of the base film and made of metal foil; multiple crimp terminals including crimp pieces crimped to penetrate the first flexible printed circuit board and bent to bite into part of the circuit; and an insulating reinforcing film partially integrally provided on an area of the base film where the multiple crimp pieces penetrate. According to a first aspect of the present disclosure, the insulating reinforcing film is integrally provided on the base film. With this configuration, even when the crimp terminals are attached, the strength of the first flexible printed circuit board and the crimp terminal can be enhanced in the vicinity of the crimp pieces provided at the first flexible printed circuit board. The insulating reinforcing film is partially provided. With this configuration, an increase in the weight of the first flexible printed circuit board can be suppressed, and degradation of the bendability of the first flexible printed circuit board can be also reduced. In the first aspect according to the present disclosure, the base film of the first flexible printed circuit board may be a single-sided copper-clad laminate made of polyimide, polyethylene naphthalate, or polyethylene terephthalate. In the first aspect according to the present disclosure, the first flexible printed circuit board may have a cover film bonded to the base film to sandwich the circuit, in a partial area of the first flexible printed circuit board, part of the circuit may be exposed without the cover film being provided, and in the partial area, at least some of the multiple crimp pieces may bite into the part of the circuit without penetrating the cover film. With this configuration, the area of contact between the crimp terminal and the circuit can be expanded. A method for manufacturing a crimp terminal-equipped flexible printed circuit board according to a second aspect of the present disclosure includes: bonding an insulating reinforcing film to a predetermined area of a base film included in a first flexible printed circuit board; and swaging multiple crimp pieces included in crimp terminals to an area where the insulating reinforcing film is provided, thereby attaching the crimp terminals to the first flexible printed circuit board. As described above, according to one aspect of the present disclosure, the crimp terminal-equipped flexible printed circuit board capable of making the stable electrical connection while holding the strength and the method for manufacturing the crimp terminal-equipped flexible printed circuit board can be provided. Hereinafter, embodiments of the technique of the present disclosure will be exemplarily described in detail based on examples with reference to the drawings. Note that unless otherwise specified, the dimensions, materials, shapes, relative arrangement and the like of components described in these embodiments are not intended to limit the technical scope of the present disclosure to these dimensions, materials, shapes, relative arrangement and the like. First Embodiment A crimp terminal-equipped flexible printed circuit board according to a first embodiment of the present disclosure will be described with reference toFIGS.1A,1B,2A.2B,3A, and3B.FIGS.1A and1Bare schematic views of the configuration of the crimp terminal-equipped flexible primed circuit board according to the first embodiment of the present disclosure.FIG.1Ashows part of a plan view of the crimp terminal-equipped flexible printed circuit hoard.FIG.1Bshows part of a side view of the crimp terminal-equipped flexible printed circuit board.FIGS.2A and2Bare schematic views of the configuration of the crimp terminal-equipped flexible printed circuit board according to the first embodiment of the present disclosure,FIG.2Ashows part of a back view of the crimp terminal-equipped flexible printed circuit board.FIG.2Bis a schematic sectional view of the crimp terminal-equipped flexible printed circuit board, and is a sectional view (not showing box portions of the crimp terminals) along an AA line inFIG.1A.FIGS.3A and3Bare schematic views of the configuration of the crimp terminal according to the first embodiment of the present disclosure.FIG.3Ashows a state in which the crimp terminal is viewed from a back end.FIG.3Bshows a side view of the crimp terminal. Note thatFIGS.3A and3Bshow a state before the crimp terminal is crimped. On the other hand,FIGS.1A,1B,2A, and2Bshow a state after the crimp terminals have been crimped. <Crimp Terminal-Equipped Flexible Printed Circuit Board> The configuration of the crimp terminal-equipped flexible printed circuit board (hereinafter referred to as a “terminal-equipped FPC10” as necessary) according to the present embodiment will be described. The terminal-equipped FPC10includes a flexible printed circuit board (equivalent to a first flexible printed circuit board, and hereinafter referred to as an “FPC100”) and crimp terminals200attached to the FPC100. The FPC100has a base film110, a circuit120provided on a surface of the base film110and made of metal foil (e.g., copper foil), and a cover film130bonded to the base film110to sandwich the circuit120. Note that an adhesive layer140for bonding the base film110and the cover film130to each other is formed between these films. The FPC100according to the present embodiment includes an insulating reinforcing film150. The insulating reinforcing film150is partially integrally provided on a predetermined area of the base film110. The base film110is, for example, made of polyimide, polyethylene naphthalate, or polyethylene terephthalate. The FPC100configured as described above is called a single-sided copper-clad laminate in a case where the circuit120is made of copper foil. The crimp terminals200are attached to the FPC100by a not-shown crimping tool or crimping equipment. In the example described in the present embodiment, four crimp terminals200are attached to the FPC100, Note that the number of crimp terminals200to be attached to the FPC100varies depending on a product, needless to say. In the present embodiment, a case where the crimp terminals200are female terminals is described. The crimp terminal200as the female terminal includes a box portion210into which a tip end portion of a male terminal is to be inserted and a tongue piece portion211for elastically sandwiching the tip end portion of the male terminal. Moreover, the crimp terminal200according to the present embodiment includes multiple crimp pieces221,222, The multiple crimp pieces221,222are alternately arranged on both sides in a width direction (a direction perpendicular to a direction from a terminal tip end to a terminal back end). Note that in the configuration described in the present embodiment, four crimp pieces221,222are provided. On this point, the number of crimp pieces221,222can be set as necessary. The crimp pieces221,222are crimped to penetrate the FPC100and bent to bite into part of the circuit120. In the present embodiment, the crimp terminal200is attached to the FPC100such that the crimp pieces221,222pierce the FPC100from an insulating reinforcing film150side to a cover film130side. Note that in the present embodiment, various well-known crimp terminals each including these crimp pieces221,222as described above can be employed as the crimp terminal200. Moreover, in the present embodiment, a case where the crimp terminal is the female terminal is described. On this point, the crimp terminal200in the embodiment of the present disclosure can be also applied to a male terminal including similar crimp pieces. <Method for Manufacturing Crimp Terminal-Equipped FPC> Regarding the method for manufacturing the terminal-equipped FPC10including the crimp terminals200, manufacturing steps will be sequentially described. First, the circuit120is formed in such a manner that part of metal foil provided on the surface of the base film110, such as copper foil, is removed by etching. Next, the cover film130is provided after an adhesive has been applied to the base film110. Thereafter, the insulating reinforcing film150is bonded onto the predetermined area of the base film110. Then, the crimp terminals200are attached to the FPC100in such a manner that the multiple crimp pieces221,222of the crimp terminals200are swaged to the area of the base film110where the insulating reinforcing film150is provided. It can be said that in the terminal-equipped FPC10manufactured as described above, the insulating reinforcing film150is partially integrally provided on the area of the base film110where the multiple crimp pieces221,222penetrate. <Advantages of Crimp Terminal-Equipped Flexible Printed Circuit Board According to Present Embodiment> According to the terminal-equipped FPC10of the present embodiment, the insulating reinforcing film150is integrally provided on the base film110. With this configuration, the stiffness of a location of the FPC100where the insulating reinforcing film150is provided can be enhanced. Moreover, the crimp terminals200are attached to the location of the FPC100where the insulating reinforcing film150is provided. Thus, in the vicinity of the crimp pieces221,222in the FPC100, the strength of the FPC100and the crimp terminals200can be enhanced, and deformation thereof can be reduced. Consequently, stable electrical connection can be made. The insulating reinforcing film150is partially provided, and therefore, an increase in the weight of the FPC100can be suppressed, and degradation of the bendability of the FPC100can be also reduced. Note that according to the terminal-equipped FPC10of the present embodiment, the structure of the crimp terminal200does not need to be a complicated structure as in a technique disclosed in Japanese Patent No. 4889027 or Japanese Patent No. 5465579. Thus, the terminal-equipped FPC10according to the present embodiment can be applied to a wide variety of types of connectors, can be highly versatile, and can suppress a cost increase. Second Embodiment FIGS.4A,4B,5A, and5Bshow a second embodiment of the present disclosure. In the configuration described in the first embodiment, the crimp terminals are attached to the FPC such that the crimp pieces pierce the FPC from the insulating reinforcing film side to the cover film side. On the other hand, in a configuration described in the present embodiment, crimp terminals are attached to an FPC such that crimp pieces pierce the FPC from a cover film side to an insulating reinforcing film side. The configuration of the FPC itself and the configuration of the crimp terminal itself are the same as those of the first embodiment, and therefore, the same reference numerals are used to represent the same components and description thereof will be omitted as necessary. FIGS.4A and4Bare schematic views of the configuration of the crimp terminal-equipped flexible printed circuit board according to the second embodiment of the present disclosure.FIG.4Ashows part of a back view of the crimp terminal-equipped flexible printed circuit board.FIG.4Bshows part of a side view of the crimp terminal-equipped flexible printed circuit board.FIGS.5A and5Bare schematic views of the configuration of the crimp terminal-equipped flexible printed circuit board according to the second embodiment of the present disclosure.FIG.5Ashows part of a plan view of the crimp terminal-equipped flexible printed circuit board.FIG.5Bis a schematic sectional view of the crimp terminal-equipped flexible printed circuit board, and is a sectional view (not showing box portions of the crimp terminals) along a BB line inFIG.4A. The configuration of the crimp terminal-equipped flexible printed circuit board (hereinafter referred to as a “terminal-equipped FPC10X” as necessary) according to the present embodiment will be described. The terminal-equipped FPC10X includes a flexible printed circuit board (equivalent to a first flexible printed circuit board, and hereinafter referred to as an “FPC100”) and crimp terminals200attached to the FPC100. The configuration of the FPC100itself and the configuration of the crimp terminal200itself are as described in the first embodiment. In the present embodiment, the crimp terminals200are attached to the FPC100such that crimp pieces221,222pierce the FPC100from a cover film130side to an insulating reinforcing film150side. Note that the method for manufacturing the terminal-equipped FPC10X according to the present embodiment is also similar to that of the first embodiment. With the terminal-equipped FPC10X of the present embodiment configured as described above, advantageous effects similar to those of the first embodiment can be obtained. Third Embodiment FIGS.6A,6B,7A, and7Bshow a third embodiment of the present disclosure. In the configurations described in the first and second embodiments, the cover film is entirely provided on the opposite side of the circuit from the base film in the FPC. On the other hand, in a configuration described in the present embodiment, no cover film is provided on the area of an FPC where crimp terminals are provided. Other basic configurations are the same as those of the first embodiment, and therefore, the same reference numerals are used to represent the same components and description thereof will be omitted as necessary. FIGS.6A and6Bare schematic views of the configuration of the crimp terminal-equipped flexible printed circuit board according to the third embodiment of the present disclosure.FIG.6Ashows part of a plan view of the crimp terminal-equipped flexible printed circuit hoard.FIG.6Bshows part of a side view of the crimp terminal-equipped flexible printed circuit board.FIGS.7A and7Bare schematic views of the configuration of the crimp terminal-equipped flexible printed circuit board according to the third embodiment of the present disclosure,FIG.7Ashows part of a back view of the crimp terminal-equipped flexible printed circuit board.FIG.7Bis a schematic sectional view of the crimp terminal-equipped flexible printed circuit board, and is a sectional view (not showing box portion of the crimp terminals) along a CC line inFIG.6A. The configuration of the crimp terminal-equipped flexible printed circuit board (hereinafter referred to as a “terminal-equipped FPC10Y” as necessary) according to the present embodiment will be described. The terminal-equipped FPC10Y includes a flexible printed circuit board (equivalent to a first flexible printed circuit board, and hereinafter referred to as an “FPC100”) and crimp terminals200attached to the FPC100. The configuration of the crimp terminal200is as described in the first embodiment. The FPC100has a base film110, a circuit120provided on a surface of the base film110and made of metal foil (e.g., copper foil), and a cover film130bonded to the base film110to sandwich the circuit120. Note that an adhesive layer140for bonding the base film110and the cover film130to each other is firmed between these films. The FPC100according to the present embodiment includes an insulating reinforcing film150. The insulating reinforcing film150is partially integrally provided on a predetermined area of the base film110. The base film110is, for example, made of polyimide, polyethylene naphthalate, or polyethylene terephthalate. The FPC100configured as described above is called a single-sided copper-clad laminate in a case where the circuit120is made of copper foil. Moreover, in a partial area of the FPC100according to the present embodiment, part of the circuit120is exposed without the cover film130being provided. Crimp pieces221,222of the crimp terminal200are crimped to penetrate the FPC100and bent to bite into part of the circuit120. In the present embodiment, no cover film130is provided in the area of the FPC100where the crimp pieces221,222are crimped. Moreover, in the present embodiment, the crimp terminal200is attached to the FPC100such that the crimp pieces221,222pierce the FPC100from an insulating reinforcing film150side to a base film110side. Note that in the present embodiment, various well-known crimp terminals each including the crimp pieces221,222as described above can be employed as the crimp terminal200, Moreover, in the present embodiment, a case where the crimp terminal is a female terminal is described. On this point, the crimp terminal in the embodiment of the present disclosure can be also applied to a male terminal including similar crimp pieces. Moreover, the method for manufacturing the terminal-equipped FPC10Y according to the present embodiment is similar to that of the first embodiment. With the terminal-equipped FPC10Y of the present embodiment configured as described above, advantageous effects similar to those of the first embodiment can be also obtained. Moreover, according to the terminal-equipped FPC10Y of the present embodiment, all of the crimp pieces221,222are configured to bite into the exposed part of the circuit120without penetrating the cover film130, Thus, the area of contact between the crimp piece221,222and the circuit120can be expanded. That is, in a case where the crimp pieces221,222bite into part of the circuit120in a state in which the crimp pieces221,222penetrate the cover film130, part of the cover film130easily enters the vicinity of a connection portion between the crimp piece221,222and the circuit120. For this reason, the area of contact between the crimp piece221,222and the circuit120tends to be small. On the other hand, by employing the configuration in which the crimp pieces221,222bite into the exposed part of the circuit120, the area of contact between the crimp piece221,222and the circuit120can be expanded. Thus, electrical connection can be much more stably made. Moreover, the base film110and the insulating reinforcing film150are provided at crimped portions, and therefore, the strength thereof is also ensured. Thus, the stable electrical connection can be made while the strength is held. Note that in the configuration described in the present embodiment, all of the crimp pieces221,222bite into the exposed part of the circuit120without penetrating the cover film130. However, the area of the FPC100where no cover film130is provided may be set such that some of the crimp pieces221,222penetrate the cover film130. That is, arrangement of the crimp pieces in the area where the circuit120is exposed and the crimp pieces in the area where the cover film130is provided may be set according to, e.g., use environment, considering balance between the strength and the electrical connection stability. Fourth Embodiment FIGS.8A,8B,9A, and9Bshow a fourth embodiment of the present disclosure. In the configuration described in the third embodiment, the crimp terminals are attached to the FPC such that the crimp pieces pierce the FPC from the insulating reinforcing film side to the base film side. On the other hand, in a configuration described in the present embodiment, crimp terminals are attached to an FPC such that crimp pieces pierce the FPC from a base film side to an insulating reinforcing film side. The configuration of the FPC itself is the same as that of the third embodiment, and the configuration of the crimp terminal itself is the same as that of the first embodiment. Thus, the same reference numerals are used to represent the same components, and description thereof will be omitted as necessary. FIGS.8A and8Bare schematic views of the configuration of the crimp terminal-equipped flexible printed circuit board according to the fourth embodiment of the present disclosure.FIG.8Ashows part of a back view of the crimp terminal-equipped flexible printed circuit hoard.FIG.8Bshows part of a side view of the crimp terminal-equipped flexible printed circuit board.FIGS.9A and9Bare schematic views of the configuration of the crimp terminal-equipped flexible printed circuit board according to the fourth embodiment of the present disclosure.FIG.9Ashows part of a plan view of the crimp terminal-equipped flexible printed circuit board.FIG.9Bis a schematic sectional view of the crimp terminal-equipped flexible printed circuit board, and is a sectional view (not showing box portions of the crimp terminals) along a DD line inFIG.8A. The configuration of the crimp terminal-equipped flexible printed circuit hoard (hereinafter referred to as a “terminal-equipped FPC10Z” as necessary) according to the present embodiment will be described. The terminal-equipped FPC10Z includes a flexible printed circuit board (equivalent to a first flexible printed circuit board, and hereinafter referred to as an “FPC100”) and crimp terminals200attached to the FPC100. The configuration of the FPC100itself is as described in the third embodiment, and the configuration of the crimp terminal200itself is as described in the first embodiment. In the present embodiment, the crimp terminals200are attached to the FPC100such that crimp pieces221,222pierce the FPC100from a base film110side to an insulating reinforcing film150side. Note that the method for manufacturing the terminal-equipped FPC10Z according to the present embodiment is also similar to that of the first embodiment. With the terminal-equipped FPC10Z of the present embodiment configured as described above, advantageous effects similar to those of the third embodiment can be obtained. Note that as in the third embodiment, the area of the FPC100where no cover film130is provided may be set such that some of the crimp pieces221,222penetrate the cover film130. The crimp terminal-equipped flexible printed circuit board according to each embodiment of the present disclosure may be configured as follows. That is, the crimp terminal-equipped flexible printed circuit board is a crimp terminal-equipped flexible printed circuit board including a flexible printed circuit board (a first flexible printed circuit board) having a base film and a circuit provided on a surface of the base film and made of metal foil and multiple crimp terminals having crimp pieces crimped to penetrate the flexible printed circuit board and bent to bite into part of the circuit, an insulating reinforcing film being partially integrally provided on the area of the base film where the multiple crimp pieces penetrate. The foregoing detailed description has been presented for the purposes of illustration and description. Many modifications and variations are possible in light of the above teaching. It is not intended to be exhaustive or to limit the subject matter described herein to the precise form disclosed. Although the subject matter has been described in language specific to structural features and/or methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as example forms of implementing the claims appended hereto. | 23,861 |
11942709 | DETAILED DESCRIPTION FIG.1illustrates an example of a steering assembly, referred to generally as a steering assembly10herein. The steering assembly10is shown disposed within a vehicle12inFIG.1. The steering assembly10may assist in converting user inputs from a steering wheel16to direct movement of the vehicle12. In this example, the vehicle12is a car, however, it is contemplated that the steering assembly10may be used to assist in steering other types of vehicles such as trucks, boats, aircraft, or other similar vehicles without departing from the scope of the present disclosure. The steering assembly10may include the steering wheel16or other steering input device secured to an electric power steering assembly18for rotation. The electric power steering assembly18may be operatively connected to a rack and pinion assembly20. The steering wheel16, the electric power steering assembly18, and the rack and pinion assembly20may be arranged with one another to direct movement of a front set of wheels24(only one wheel of the front set of wheels24is shown inFIG.1) of the vehicle12based on a driver's input. For example, the rack and pinion assembly20may be operatively connected to each of the front set of wheels24via knuckles and tie rods to convey driver input from the steering wheel16for movement of each of the front set of wheels24. The steering assembly10may be in communication with a controller29. The controller29may include programming to direct operation of components of the steering assembly10and/or to direct operation of other vehicle12components. The programming, for example, may output vehicle operation commands based on received signals and/or detected vehicle conditions. Optionally, the steering assembly10may be in communication with a self-steering mechanism30, such as an advanced driver assistance system or the like. The self-steering mechanism30may include programming to direct movement of the vehicle12without driver input to the steering wheel16. FIGS.2and3illustrate an example of a header assembly, referred to generally as a header assembly100herein. The header assembly100may be mounted and operatively connected to a portion of a steering system, such as the rack and pinion assembly20described in relation toFIG.1. The header assembly100may include components to facilitate electrical communication between a control board and the portion of the steering system. The header assembly100may include a housing104and a pair of terminal blades108. The housing104may be structured to support a portion of each of the pair of terminal blades108. For example, the housing104may define a pair of apertures112and a pair of support brackets114. Each of the pair of apertures112may be sized to receive an end of a terminal blade as further described herein. Each of the pair of support brackets114may be sized to support a portion of a terminal blade. FIGS.4A and4Billustrate further detail of one of the pair of terminal blades108.FIG.4Ais a perspective view of one of the pair of terminal blades108andFIG.4Bis a top, plan view of one of the pair of terminal blades108. Each of the pair of terminal blades108may include a first end120, a second end122, a step portion123, and a bridge portion124extending between the first end120and the second end122. The first end may define a first axis119and the second end may define a second axis121. The first axis119and the second axis121may be oriented substantially perpendicular with one another. A portion of each of the first ends120may be sized for extending into a housing of a header assembly. For example, a portion of each of the first ends120may be sized for extending into one of the pair of apertures112of the housing104. Portions of each of the pair of terminal blades108may be coated with various materials for protection and to promote a robust connection between each of the pair of terminal blades108and the housing104. An adhesion region125may be a region in which silicone126is applied to secure a respective terminal blade108to the housing104when the silicone hardens. This adhesion region125may be spaced from a seal region130. The seal region130may be reflective of a portion of the terminal blade108that extends into the housing104and a portion of the terminal blade108for coating with an anti-tarnish material. The adhesion region125may be spaced from the seal region130to prevent or mitigate contact between the silicone and the anti-tarnish material. Portions of each of the pair of terminal blades108may be coated with materials to assist in promoting adhesion between the first end120of a respective terminal blade108, the housing104, and silicone introduced to join the respective terminal blade108and the housing104to one another. Each of the pair of terminal blades may be of a copper material and coated with a material such as silver or tin. Anti-tarnish materials may also be applied to the terminal blades to protect the metal material. However, certain anti-tarnish materials have a coefficient of friction within a lower coefficient range that impedes adhesion with the silicone. In one example, Tarniban51may be an anti-tarnish material with a coefficient of friction within an acceptable range. A header assembly including this type of anti-tarnish material will likely have difficulty in securing the terminal blade to the housing. As such, adhesion between the components of the header assembly may be improved by selecting the materials that join with one another based on specific properties and/or selectively applying the coatings to the components. With regard to a selection of the materials based on specific properties, three material selections are relevant as related to promoting a robust connection between each of the pair of terminal blades108and the housing104. The three material selections relate to a type of metal of each of the pair of terminal blades, a type of anti-tarnish coating, and a type of silicone. Terminal blades are typically a copper component plated with another metal such as tin or silver. Portions of the tin or silver plating may be coated with an anti-tarnish material for protection. The type of this anti-tarnish material may present adhesion difficulties in securing the terminal blade108to the housing104. For example, materials having a coefficient of friction within a low range are more likely to have failures when attempting to join with silicone materials. One example of the low range is a coefficient of friction value substantially equal to between 0.04 and 0.2. With regard to selectively applying the coatings to the components, if a desired anti-tarnish material does not have an acceptable coefficient of friction, an adhesive region, such as the adhesion region125, may be located such that the silicone applied to the adhesion region125does not or will have minimal contact with an anti-tarnish coating applied to the first end120of the terminal blade108. FIG.5illustrates an example of the header assembly100secured to a control board150. The second ends122of each of the pair of terminal blades108may be prong shaped to facilitate and electrical connection with the control board150. The header assembly100and the control board150may be located within a portion of a steering assembly, such as the rack and pinion assembly20as described in relation toFIG.1. While aspects of the invention have been described in detail in connection with only a limited number of embodiments, it should be readily understood that the invention is not limited to such disclosed embodiments. Rather, the invention can be modified to incorporate any number of variations, alterations, substitutions or equivalent arrangements not heretofore described, but which are commensurate with the spirit and scope of the disclosure. Additionally, while various embodiments of the invention have been described, it is to be understood that aspects of the invention may include only some of the described embodiments. Accordingly, the invention is not to be seen as limited by the foregoing description. | 8,065 |
11942711 | DETAILED DESCRIPTION In the following detailed description, for purpose of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing. With a demand for reduction in the weight, thickness, and length of electronic equipment such as a smartphone, a mobile phone, and a mobile information terminal, components used for such electronic equipment have been recently reduced in size and thickness. With enhancement of the function of the electronic equipment, tendency shows, however, that current used for such electronic equipment also increases. In many cases, a rechargeable battery is, as a power supply, generally used for the electronic equipment. However, charging time reduction has been also demanded for the rechargeable battery. In the case of using the rechargeable battery, high current flows in a small connector in some cases. The present disclosure has been made for solving the above-described problems. An object of the present disclosure is to provide a connector satisfying a demand for reduction in the weight, thickness, and length of electronic equipment, suppressing a connector conductive terminal resistance low, and configured adaptable to a higher current flowing in a connector conductive terminal. The above-described object of the present disclosure and other objects and new features of the present disclosure will be apparent from description of the present specification and the attached drawings. Among embodiments disclosed in the present application, the summary of a representative embodiment will be briefly described as follows. A connector according to the embodiments of the present disclosure includes: an insulating housing; and a conductive terminal, in which the terminal is fixed to the housing, and includes a mounting portion connected to a board and a contact portion protruding from the mounting portion in a fitting direction, and a thickness of the contact portion is greater than a thickness of the mounting portion in a direction perpendicular to the board. Among the embodiments disclosed in the present application, advantageous effects obtained by the representative embodiment will be briefly described as follows. (1) The thickness t1of the contact portion is greater so that the conductor resistance of the terminal can be decreased. Accordingly, a greater amount of current can be applied to the terminal. (2) The metal volume of the terminal is increased so that the strength of the connector can be improved. (3) The thickness t2of the mounting portion is less than the thickness t1of the contact portion so that reduction in the height of the connector can be achieved. Hereinafter, the embodiments of the present disclosure will be described in detail based on the drawings. Note that in all figures for describing the embodiments, the same reference numerals are used to represent the same members in principle and repeated description thereof will be omitted. When required in the following embodiments for the sake of convenience, multiple sections or multiple embodiments will be dividedly described. Unless otherwise specified, these sections or embodiments are not independent of one another. One of the embodiments is in a relationship with some or all of the other embodiments, such as variations, details, or supplementary explanation. In a case where the following embodiments refer to, e.g., the number of elements (including the number of pieces, numerical values, amounts, ranges, and the like), such a number is not limited to a specific number and may be equal to or greater than or equal to or less than the specific number, unless otherwise specified or limited clearly to the specific number in principle. First Embodiment FIG.1is a perspective view showing the configuration of a connector (a plug connector) according to a first embodiment of the present disclosure, andFIG.2is a front view.FIG.3is a sectional view along an A-A cut plane ofFIG.2.FIG.4is a perspective view showing, except for a housing portion, only terminals in the connector ofFIG.1.FIG.5is a perspective view showing a first terminal configuration.FIG.6is a side view showing the first terminal configuration ofFIG.5.FIG.7is a perspective view showing a second terminal configuration.FIG.8is a side view showing the second terminal configuration ofFIG.7. First, the configuration of the connector according to the first embodiment will be described with reference toFIGS.1to4. The connector of the first embodiment is a plug connector100mounted on a board500such as a printed circuit board. The plug connector100includes an insulating housing110, four conductive first terminals120(120ato120d) fixed to the housing110, and two conductive second terminals130(130ato130b) fixed to the housing110. The four first terminals120ato120dhave the same shape. The two second terminals130ato130bhave the same shape. The second terminals130ato130bare arranged on both end sides of the first terminals120ato120din a longitudinal direction (an X1X2 direction). The present embodiment describes a case where the four first terminals120and the two second terminals130are provided, but the present disclosure is not limited to such a case and the number of terminals may be any number. The first terminals120and the second terminals130are mainly used as signal terminals or power supply terminals, but the terminals are not limited to above and may be used for other purposes such as a reinforcing metal fitting, a frame, or a shield. For example, a rechargeable battery for a mobile phone or a mobile information terminal, a control circuit thereof, and the like are connected to the board500. The housing110is made of, e.g., insulating resin. The first terminal120and the second terminal130are made of conductive metal such as copper alloy. For example, the plug connector100is formed by a method in which resin is injected to form the housing110after the first terminals120and the second terminals130have been arranged in a die, such as integral molding or insert molding. The housing110includes, for example, a bottom wall111forming a bottom surface of a fitting recessed portion101of the connector, a side wall112standing on the bottom wall111to fill a portion between adjacent ones of the terminals, and a terminal fixing portion113formed to cover part of the first and second terminals120,130. The terminal fixing portion113is formed in such a manner that a recessed portion123between a mounting portion121and a contact portion122at each first terminal120and a recessed portion134between a mounting portion131,132and a contact portion133at each second terminal130are filled with part of the housing110. As shown inFIGS.4to6, each first terminal120has the mounting portion121to be connected to the board500such as the printed circuit board and the contact portion122extending to protrude from the mounting portion121in a fitting direction (a Z1 direction). The mounting portions121of the first terminals120are arrayed at positions facing each other in a Y1Y2 direction. Moreover, the first terminal120has a greater thickness t1of the contact portion122in a direction (the Y1Y2 direction) parallel with the board500than the thickness t2of the mounting portion121in a direction (a Z1Z2 direction) perpendicular to the board500. For example, the thickness t1of the contact portion122is equal to or greater than twice as much as the thickness t2of the mounting portion121. The inside (a lower portion of a fitting surface126(a Z2 direction)) of the contact portion122, i.e., the inside of the fitting surface126of the contact portion122at a tip end thereof, is filled with conductive metal. The fitting surface126of the contact portion122at the tip end thereof (the Z1 direction) is rounded. Of the mounting portion121of the first terminal120, part of a fitting-side (the Z1 direction) surface is covered with part (the terminal fixing portion113) of the housing110. The first terminal120has the recessed portion123between the mounting portion121and the contact portion122, and the inside of the recessed portion123is filled with part of the housing110. With this configuration, the first terminal120is fixed to the housing110, and detachment of the first terminal120from the housing110is reduced. Moreover, two side surfaces124,125of the contact portion122facing each other in the longitudinal direction (the X1X2 direction) closely contact part (the side wall112) of the housing110. The first terminals120are arranged at positions facing each other in a width direction (the Y1Y2 direction) of the connector. The mounting portion121extends outwardly from below the bottom wall111in the width direction (the Y1Y2 direction), and a thickness direction (the Z1Z2 direction) thereof is a direction crossing a surface (an XY plane) of the board500. The mounting portions121are each soldered to separate circuit patterns on the board500upon mounting. As shown inFIGS.4,7, and8, each second terminal130has the two mounting portions131,132to be connected to the board500such as the printed circuit board and the contact portion133extending to protrude from the mounting portions131,132in the fitting direction (the Z1 direction). The contact portion133extends in the direction (the XY plane) parallel with the board500, and electrically connects the mounting portion131and the mounting portion132to each other. The mounting portion131and the mounting portion132of the second terminal130are arranged at positions facing each other in the Y1Y2 direction. Moreover, the second terminal130has a greater thickness t1of the contact portion133in the direction (the Y1Y2 direction) parallel with the board500than the thickness t2of the mounting portion131,132in the direction (the Z1Z2 direction) perpendicular to the board500. For example, the thickness t1of the contact portion133is equal to or greater than twice as much as the thickness t2of the mounting portion131,132. A fitting surface137of the contact portion133at a tip end thereof (the Z1 direction) is rounded. The inside (a lower portion of the fitting surface137(the Z2 direction)) of the contact portion133, i.e., the inside of the fitting surface137of the contact portion133at the tip end thereof, is filled with conductive metal. Of the mounting portion131,132of the second terminal130, part of a fitting-side (the Z1 direction) surface is covered with part (the terminal fixing portion113) of the housing110. The second terminal130has the recessed portion134between the mounting portion131,132and the contact portion133, and the inside of the recessed portion134is filled with part of the housing110. With this configuration, the second terminal130is fixed to the housing110, and detachment of the second terminal130from the housing110is reduced. Moreover, two side surfaces135,136of the contact portion133in the same direction, i.e., the longitudinal direction (the X1X2 direction), closely contact part (the side wall112) of the housing110. The two second terminals130are arranged on both sides of the first terminals120, and have a U-shape as viewed from the fitting direction (the Z1 direction). In the present embodiment, the second terminal130includes the two mounting portions131,132, but the number of mounting portions is not limited to two. The number of mounting portions at one second terminal may be one or three or more. The mounting portions131,132are arranged apart from each other in the width direction (the Y1Y2 direction) of the connector and extend outwardly from below the bottom wall111in the width direction (the Y1Y2 direction), and a thickness direction (the Z1Z2 direction) thereof is a direction crossing the surface (the XY plane) of the board500. The mounting portions131,132are each soldered to separate circuit patterns on the board500upon mounting. Of each second terminal130, a portion which is to contact a terminal of a receptacle connector as a partner connector is formed longer in the longitudinal direction (the X1X2 direction) so that high current can be applied to the terminal. Thus, a sufficient contact area between the terminals is ensured. In the present embodiment, the first terminals120a,120bare arranged adjacent to each other in the longitudinal direction (the X1X2 direction), and are arranged between the second terminal130aand the second terminal130b. Similarly, the first terminals120c,120dare arranged adjacent to each other in the longitudinal direction (the X1X2 direction), and are arranged between the second terminal130aand the second terminal130b. For example, the first terminals120are used as signal terminals, and the second terminals130are used as power supply terminals. Next, the method for manufacturing the connector (the plug connector) according to the first embodiment of the present disclosure will be described with reference toFIGS.9to14.FIGS.9to14are perspective views showing the steps of manufacturing the first terminals120and the second terminal130of the plug connector100. First, as shown inFIG.9, a thick portion141is formed at a metal plate140by forging. The thickness of the thick portion141is equivalent to the thickness t1of the contact portion122,133. Moreover, the thickness of the metal plate140is equivalent to the thickness t2of the mounting portion121,131,132. Next, as shown inFIG.10, the metal plate140is punched out such that a portion142to be terminals and leads143remain. Next, as shown inFIG.11, tip end portions144of the terminals are rounded by crushing (curved surfaces are formed). The tip end portions144are to be the fitting surfaces126,137. Next, as shown inFIG.12, thick portions145are bent about 90 degrees to form the contact portions122,133. At this point, there is a step between the thick portion145and a surface of the lead143, and therefore, the recessed portions123,134are formed inside the bent portions. Next, as shown inFIG.13, part of the lead143is punched out, and the mounting portion132is separated from the lead143. Next, as shown inFIG.14, the thick portion145is bent in a U-shape to form the contact portion133of the second terminal130. At this point, two first terminals120and one second terminal130are formed. Subsequently, the same terminals as the two first terminals120and the one second terminal130as shown inFIG.14are arranged rotated 180 degrees, and are fitted in, e.g., the die. Then, resin is injected into the die, and integral molding is performed. Finally, the leads143are cut to complete the connector. Second Embodiment FIG.15is a perspective view showing the configuration of a connector (a plug connector) according to a second embodiment of the present disclosure, andFIG.16is a front view.FIG.17is a sectional view along a B-B cut plane ofFIG.16. In the second embodiment of the present disclosure, no recessed portion filled with part of a housing210is present between a contact portion233and a mounting portion231,232at each of first terminals220and second terminals230, as compared to the first embodiment. Instead of the recessed portion, part (a terminal fixing portion213) of the housing210covers in close contact with surfaces of the mounting portions231,232in a fitting direction (a Z1 direction) so that detachment of the first terminals220and the second terminals230can be reduced. The configuration of other portions is the same as that of the first embodiment, and therefore, overlapping description thereof will be omitted. The connector of the second embodiment is a plug connector200mounted on a board500such as a printed circuit board. The plug connector200includes the insulating housing210, the four conductive first terminals220fixed to the housing210, and the two conductive second terminals230. Moreover, the first terminal220has a greater thickness t1of a contact portion222in a direction (a Y1Y2 direction) parallel with the board500than the thickness t2of a mounting portion221in a direction (a Z1Z2 direction) perpendicular to the board500. For example, the thickness t1of the contact portion is equal to or greater than twice as much as the thickness t2of the mounting portion. Moreover, the second terminal230has a greater thickness t1of the contact portion233in the direction (the Y1Y2 direction) parallel with the board500than the thickness t2of the mounting portion231,232in the direction (the Z1Z2 direction) perpendicular to the board500. For example, the thickness t1of the contact portion233is equal to or greater than twice as much as the thickness t2of the mounting portion231,232. At a tip end portion of the contact portion222, a lock portion223for reducing detachment from a partner connector is provided. The housing210includes, for example, a bottom wall211forming a bottom surface of a fitting recessed portion201of the connector, a side wall212standing on the bottom wall211to fill a portion between adjacent ones of the terminals, and the terminal fixing portion213formed to cover in close contact with part of the first and second terminals220,230. For manufacturing the plug connector200, a thick portion141is formed on the back side of a metal plate140at the forging step ofFIG.9described in the first embodiment. Subsequent steps are the same as those of the first embodiment. At the bending step ofFIG.12, the thick portion141is present on the back side, i.e., the outside of the bent portion. Since the inside of the bent portion is flat, no recessed portion is formed. Third Embodiment FIG.18is a perspective view showing the configuration of a connector (a receptacle connector) according to a third embodiment of the present disclosure.FIG.19is a perspective view showing only a terminal configuration except for a housing portion.FIG.20is a perspective view showing the terminal configuration, andFIG.21is a side view. Terminals ofFIGS.20and21are also used as reinforcing metal fittings. In the third embodiment, the present disclosure is applied to the receptacle connector. Such a receptacle connector is the same as a normal receptacle connector, except for second terminals330(reinforcing metal fittings). The connector of the third embodiment is a receptacle connector300mounted on a board500such as a printed circuit board. The receptacle connector300includes an insulating housing310, four conductive first terminals320fixed to the housing310, the four conductive second terminals330, and two metal third terminals340. For example, the first terminals320are used as signal terminals, the second terminals330are used as power supply terminals, and the third terminals340are used as grounding (GND) terminals, power supply terminals, or reinforcing metal fittings. The housing310has a side wall311surrounding the first terminals320, the second terminals330, and the third terminals340. The strength of the connector is increased by the third terminals340filled with metal. As shown inFIGS.20and21, each third terminal340has mounting portions331,332,333to be connected to the board500such as the printed circuit board and a contact portion334extending to protrude from the mounting portions331,332,333in a fitting direction (a Z1 direction). The third terminal340has a greater thickness t1of the contact portion334in a direction (a Y1Y2 direction) parallel with the board500than the thickness t2of the mounting portion331,332,333in a direction (a Z1Z2 direction) perpendicular to the board500. For example, the thickness t1of the contact portion334is equal to or greater than twice as much as the thickness t2of the mounting portion331,332,333. Fourth Embodiment FIG.22is a perspective view showing the configuration of a connector (a plug connector) according to a fourth embodiment of the present disclosure,FIG.23is a perspective view showing a terminal configuration except for a housing portion, andFIG.24is a side view showing the terminal configuration. In the fourth embodiment, the present disclosure is applied to a plug connector to be fitted in a direction parallel with a board. The fitting direction in the present embodiment is not a Z1 direction as in the first to third embodiments, but is a direction (an X2 direction) parallel with a board500. The connector of the fourth embodiment is a plug connector400mounted on the board500such as a printed circuit board. The plug connector400includes an insulating housing410and three conductive terminals420fixed to the housing410. As shown inFIG.24, the terminal420has a greater thickness t1of a contact portion422in a direction (a Z1Z2 direction) perpendicular to the board500than the thickness t2of a mounting portion221in the direction (the Z1Z2 direction) perpendicular to the board500. For example, the thickness t1of the contact portion422is equal to or greater than twice as much as the thickness t2of the mounting portion221. For example, the terminals420are used as signal terminals or power supply terminals. As described above, the terminals of the first to fourth embodiments are not those configured such that contact portions are formed by bending of plate-shaped metal as in a typical case, but those configured such that the inside of contact portions is filled with metal. Thus, according to the connectors of the first to fourth embodiments, the thickness t1of the contact portion is greater so that the conductor resistance of the terminal can be decreased. Accordingly, a greater amount of current can be applied to the terminal. Moreover, the metal volume of the terminal is increased so that the strength of the connector can be improved. Further, the thickness t2of the mounting portion is less than the thickness t1of the contact portion so that reduction in the height of the connector can be achieved. The invention made by the present inventor(s) has been specifically described above with reference to the embodiments. However, the present disclosure is not limited to the above-described embodiments and various changes can be made without departing from the gist of the present disclosure, needless to say. The first to fourth embodiments may be combined as necessary. In the first to fourth embodiments, the connector mounted on the board has been described. However, the present disclosure is not limited to such a connector, and can be applied to other connectors. The connectors according to the first to fourth embodiments can be broadly utilized for industrial, business, and domestic purposes. The foregoing detailed description has been presented for the purposes of illustration and description. Many modifications and variations are possible in light of the above teaching. It is not intended to be exhaustive or to limit the subject matter described herein to the precise form disclosed. Although the subject matter has been described in language specific to structural features and/or methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as example forms of implementing the claims appended hereto. | 23,330 |
11942712 | DESCRIPTION OF EMBODIMENTS A specific embodiment of the presently disclosed subject matter will be described below with reference to the drawings. By a method of manufacturing a substrate unit according to the present embodiment, a substrate unit1A (a second substrate unit) to be mounted on a vehicle having a high-grade specification (a second specification) and a substrate unit1B (a first substrate unit) to be mounted on a vehicle having a standard specification (a first specification) are manufactured. First, the substrate unit1A having a high-grade specification will be described with reference toFIGS.1to5. As shown inFIG.2and the like, the substrate unit1A having a high-grade specification includes a base substrate2for operating a standard electrical device (not shown), an extended substrate3for operating an extended electrical device (not shown), a connecting unit4for electrically connecting the base substrate2and the extended substrate3, and a case5for accommodating the base substrate2and the extended substrate3. The standard electrical device is an electrical device (for example, an air conditioner unit, a power window unit, or the like) that is attached in common to a vehicle having a high-grade specification and a vehicle having a standard specification. The extended electrical device is an electrical device that is selectively attached according to a specification of a vehicle. As shown inFIGS.2to4, a connector (a first connector)21and the like are mounted on the base substrate2. As shown inFIGS.3and4, the connector21includes terminals (first terminals)22and a housing (first housing)23that accommodates the terminals. In the present embodiment, as shown inFIG.4and the like, the terminal22is formed in a substantially L shape, one end thereof extending along a thickness direction D1of the base substrate2is connected to the base substrate2, and the other end thereof extending parallel to the base substrate2is accommodated in the housing23. The other end of the terminal22is configured as, for example, a male terminal, and protrudes from the housing23. The housing23is provided with locking projections231to be locked to a housing33of an extended connector31to be described later. The locking projections231(first locking portions) are provided on outer surfaces of the housing23facing in a direction orthogonal to both the thickness direction D1and a direction along which the other end of the terminal22extends. The connector21is to be connected to an external connector (not shown) provided at an end of a wire harness. The wire harness is connected to a central ECU (host control device), a standard electrical device, and an extended electrical device (not shown). As shown inFIG.5, a control circuit24, a power supply circuit25, a communication interface (I/F)26, and the like are mounted on the base substrate2. The control circuit24includes, for example, a microcomputer having a CPU. The control circuit24communicates with the central ECU and controls the standard electrical device and the extended electrical device according to instructions from the central ECU. The power supply circuit25generates power for the control circuit24from power supplied via an external connector. The communication I/F26is a circuit that modulates and demodulates communication signals transmitted and received between the central ECU and the control circuit24. Various circuits are mounted on the base substrate2according to a type of the standard electrical device, and the various circuits are connected to the control circuit24. In the example shown inFIG.5, two input I/Fs27(input units) and three output drives (DRVs)28(output units) are mounted on the base substrate2. For example, when the standard electrical device is a device, that inputs ON/OFF information or the like to the control circuit24, such as a detection switch, the input I/F27is mounted with respect to the standard electrical device. Further, when the standard electrical device is a device, that operates based on an output from the control circuit24, such as a motor or a lamp, the output DRV28is mounted with respect to the standard electrical device. The power supply circuit25, the communication I/F26, the input I/Fs27, and the output DRVs28are connected to the terminals22, and when an external connector is connected to the terminals22, the power supply circuit25, the communication I/F26, the input I/Fs27, and the output DRVs28are connected to the central ECU and/or the standard electrical device. As shown inFIGS.2to4, the base substrate2and the extended substrate3are stacked along the thickness direction D1. An extended connector (a second connector)31and the like are mounted on the extended substrate3. The extended connector31includes terminals (second terminals)32and a housing (a second housing)33that accommodates the terminals32. In the present embodiment, as shown inFIG.4, the terminal32is formed in a substantially L shape, one end thereof extending along the thickness direction D1is connected to the extended substrate3, and the other end thereof extending parallel to the extended substrate3is accommodated in the housing33. The other end of the terminal32is configured as, for example, a male terminal, and protrudes from the housing33. The housing33is provided with locking portions331(second locking portions) to be locked to the housing23of the connector21. The locking portions331are provided to protrude toward the connector21and extend from outer surfaces of the housing33facing in a direction orthogonal to both the thickness direction D1and the other end of the terminal32. Further, the locking portion331is provided with a locking hole332into which the locking projection231is to be inserted. When the base substrate2and the extended substrate3are stacked along the thickness direction D1and the housing23and the housing33are disposed adjacently with each other along the thickness direction D1, the locking projections231are inserted into the locking holes332, and the housing23and the housing33get locked. Therefore, the housing23and the housing33can be integrated with each other, and the connector21and the extended connector31can together form one connector configured to be connected to an external connector. Further, as shown inFIG.5, various circuits are mounted on the extended substrate3according to a type of the extended electrical device, similarly to the base substrate2. In the example shown inFIG.5, three input I/Fs34(extended input units) and two output DRVs35(extended output units) are mounted. The input I/Fs34and the output DRVs35are connected to the terminals32, and when an external connector is connected to the terminals32, the input I/Fs34and the output DRVs35are connected to the extended electrical device. In the present embodiment, as shown inFIGS.2and3, a pin header including a plurality of terminals41extending orthogonal to the base substrate2and the extended substrate3and a resin holder42for holding the plurality of terminals41is used as the connecting unit4. Both ends of each of the terminals41protrude from the holder42. One end of each of the terminals41is connected to the base substrate2, and the other end of each of the terminals41is connected to the extended substrate3. As shown inFIG.5, the input I/Fs34and the output DRVs35are connected to the control circuit24via the terminals41of the connecting unit4. As shown inFIG.2, the case5includes a box-shaped case main body51that is opened toward a front side, and a front cover52configured to close the front opening of the case main body51. The front cover52is provided with one opening521through which an external connector is to be fitted. The base substrate2and the extended substrate3are accommodated into the case main body51from the front opening of the case main body51. Thereafter, when the front opening of the case main body51is closed by the front cover52, as shown inFIG.1, the terminals22and the terminals32are disposed to face the opening521and are exposed from the one opening521. Therefore, the external connector can be inserted through the opening521and connected to the connectors21and the connectors31. Next, the substrate unit1B having a standard specification will be described with reference toFIGS.6and7. As shown inFIGS.6and7, the substrate unit1B having a standard specification includes the base substrate2for operating a standard electrical device and a case5for accommodating the base substrate2, and does not include the extended substrate3and the connecting unit4. The base substrate2and the case5are the same as the base substrate2and the case5provided in the substrate unit1A. When the base substrate2is accommodated in the case5, the terminals22are disposed to face the opening521and are exposed from the opening521. Next, a method of manufacturing the substrate units1A and1B will be described. First, the base substrate2on which the connector21is mounted and the extended substrate3on which the extended connector31is mounted are prepared. As the extended substrate3, a plurality of types of substrates having different numbers of input I/Fs34and output DRVs35may be prepared. In a case of a high-grade specification (a second specification), the extended substrate3corresponding to the specification is selected. Next, the base substrate2and the extended substrate3are stacked, and the housing23and the housing33are locked. Further, the base substrate2and the extended substrate3are connected to each other by using the connecting unit4. Thereafter, the base substrate2and the extended substrate3are accommodated in the case5such that the terminals22and the terminals32face the opening521provided in the case5, and the substrate unit1A is manufactured. According to the substrate unit1A having a high-grade specification, the connector21and the extended connector31are mounted on the base substrate2and the extended substrate3, respectively. Therefore, the input I/Fs34and the output DRVs35mounted on the extended substrate3do not have to be connected to the terminals22of the connector21mounted on the base substrate2, so that the number of connections between the base substrate2and the extended substrate3can be reduced. Further, the housing23of the connector21mounted on the base substrate2and the housing33of the extended connector31mounted on the extended substrate3are locked to each other. The terminals22and the terminals32are disposed to face the opening521provided in the case5. Therefore, the connector21and the extended connector31can be coupled as one connector configured to be connected to an external connector, and the work of coupling the connector21and the extended connector31respectively provided on the base substrate2and the extended substrate3to the external connector can be reduced. According to the substrate unit1A, the base substrate2and the extended substrate3are stacked in the thickness direction D1, and the housing23and the housing33are disposed adjacently with each other in the thickness direction D1. Therefore, space saving can be achieved. In a case of a standard specification (a first specification), the substrate unit1B is manufactured by accommodating only the base substrate2in the case5such that the terminals22face the opening521provided in the case5. According to the substrate unit1B having a standard specification, the input I/Fs34and the output DRVs35that do not need to be used are not mounted on a vehicle having a standard specification. When the substrate is desired to be extended, the housing33of the extended connector31mounted on the extended substrate3can be locked to the locking projections231of the connector21. While the presently disclosed subject matter has been described with reference to certain exemplary embodiments thereof, the scope of the presently disclosed subject matter is not limited to the exemplary embodiments described above, and it will be understood by those skilled in the art that various changes and modifications may be made therein without departing from the scope of the presently disclosed subject matter as defined by the appended claims. According to the above-described embodiment, the base substrate2and the extended substrate3are stacked along the thickness direction D1, but the presently disclosed subject matter is not limited thereto. The base substrate2and the extended substrate3may be disposed adjacently with each other along a width direction or a length direction of the base substrate2. According to the above-described embodiment, the base substrate2and the extended substrate3are electrically connected by the connecting unit4, but the presently disclosed subject matter is not limited thereto. If the extended substrate3is provided with a control circuit, the base substrate2and the extended substrate3may not be electrically connected to each other. Further, according to the above-described embodiment, the case5is used for both the standard specification and the high-grade specification, but the presently disclosed subject matter is not limited thereto. A case5having a small opening521may be used for the standard specification, and a case5having a large opening521may be used for the high-grade specification. According to an aspect of the embodiments described above, a substrate unit (1A) includes a first connector (21) including a first terminal (22) and a first housing (23) accommodating the first terminal (22), and configured to be connected to an external connector, a first substrate (2) on which the first connector (21) is mounted, a second connector (31) including a second terminal (32) and a second housing (33) accommodating the second terminal (32), and configured to be connected to the external connector, a second substrate (3) on which the second connector (31) is mounted and a case (5) accommodating the first substrate (2) and the second substrate (3). The first housing (23) is provided with a first locking portion (231). The second housing (33) is provided with a second locking portion (331). The first locking portion (231) and the second locking portion (331) are locked to each other. The first terminal (22) and the second terminal (32) are disposed to face an opening (521) provided in the case (5) through which the external connector is to be connected to the first connector (21) and the second connector (31). According to the substrate unit having the above configuration, the first locking portion of the first housing and the second locking portion of the second housing are locked to each other, and the first terminal and the second terminal are disposed to face the opening provided in the case for fitting the external connector. Therefore, the first connector and the second connector can be coupled as one connector to be connected to the external connector, and the work of coupling the first connector mounted on the first substrate, the second connector mounted on the second substrate, and the external connector can be reduced. The first substrate (2) and the second substrate (3) may be stacked on each other along a thickness direction (D1) of the substrate unit (1A), and the first housing (23) and the second housing (33) may be disposed adjacently with each other along the thickness direction (D1). With this configuration, since the first substrate and the second substrate can be stacked on each other in the thickness direction and accommodated in the case, space saving can be achieved. The substrate unit (1A) may further include a connecting unit (4) configured to connect the first substrate (2) and the second substrate (3) to each other. The first substrate (2) may include a control circuit (24) and an input unit (27) or an output unit (28) connected to the control circuit (24). The first terminal (22) may be connected to the input unit (27) or the output unit (28). The second substrate (3) may include an extended input unit (34) or an extended output unit (35). The second terminal (32) may be connected to the extended input unit (34) or the extended output unit (35). The control circuit (24) may be connected to the extended input unit (34) or the extended output unit (35) via the connecting unit (4). With this configuration, by connecting the first substrate and the second substrate, the extended input unit or the extended output unit can be connected to the control circuit. Thus, the input unit or the output unit can be extended. According to another aspect of the embodiments described above, a substrate unit (1B) includes a first connector (21) including a first terminal (22) and a first housing (23) accommodating the first terminal (22), and configured to be connected to an external connector, a first substrate (2) on which the first connector (21) is mounted and a case (5) accommodating the first substrate (2). The first housing (23) is provided with a first locking portion (231) configured to be locked to a second housing (33) of a second connector (31) mounted on a second substrate (3). The first terminal (22) is disposed to face an opening (521) provided in the case (5) through which the external connector is to be connected to the first connector (21). According to the substrate unit having the above configuration, when it is desired to extend the substrate, the second housing of the second connector mounted on the second substrate can be locked to the first locking portion of the first connector. Therefore, the first connector and the second connector can be coupled as one connector to be connected to the external connector, and the work of coupling the first connector provided on the first substrate, the second connector provided on the second substrate, and the external connector can be reduced. According to yet another aspect of the embodiments described above, a manufacturing method for manufacturing a substrate unit (I A,1B), in which the substrate unit (1A,1B) is either of a first substrate unit (1B) or a second substrate unit (1A), includes preparing a first substrate (2) on which a first connector (21) is mounted, the first connector (21) including a first terminal (22) and a first housing (23) accommodating the first terminal (22), the first housing (23) being provided with a first locking portion (231), the first connector (21) being configured to be connected to an external connector and a second substrate (3) on which a second connector (31) is mounted, the second connector (31) including a second terminal (32) and a second housing (33) accommodating the second terminal (32), the second housing (33) being provided with a second locking portion (331), the second connector (31) being configured to be connected to the external connector and manufacturing the first substrate unit (1B) or the second substrate unit (1A) selectively according to which of a first specification or a second specification is selected. When the first specification is selected, the first substrate unit (1B) is to be manufactured and the manufacturing of the first substrate unit (1B) includes accommodating only the first substrate (2) into the case (5) such that the first terminal (22) faces an opening (521) provided in the case (5) through which the external connector is to be connected to the first connector (21) and when the second specification is selected, the second substrate unit (1A) is to be manufactured and the manufacturing of the second substrate unit (1A) includes locking the first locking portion (231) and the second locking portion (331) with each other and accommodating both the first substrate (2) and the second substrate (3) into the case (5) such that the first terminal (22) and the second terminal (32) face the opening (521) provided in the case (5) through which the external connector is to be connected to the first connector (21) and the second connector (31). According to the method of manufacturing a substrate unit having the above configuration, in a case of a first specification, only the first substrate is accommodated in the case, and a substrate that is not used does not have to be accommodated in the case. In a case of a second specification, both the first substrate and the second substrate are accommodated in the case. At this time, the first housing of the first connector mounted on the first substrate and the second housing of the second connector mounted on the second substrate are locked to each other, and the first terminal and the second terminal are disposed to face the opening of the case. Therefore, the first connector and the second connector can be coupled as one connector which is to be connected to the external connector, and the work of coupling the first connector provided on the first substrate, the second connector provided on the second substrate, and the external connector can be reduced. | 20,829 |
11942713 | DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT(S) Hereinafter, an embodiment(s) of an electrical connector as disclosed in the present application will be explained in detail with reference to the accompanying drawings. Additionally, this invention is not limited by an embodiment(s) as illustrated below. An aspect of an embodiment aims to provide an electrical connector that is capable of executing electromagnetic shielding of a signal transmission path well. 1. Outline of Electrical Connector An outline of an electrical connector according to an embodiment will be explained with reference toFIG.1toFIG.3. An electrical connector1according to an embodiment is packaged on a principal surface M of a wiring substrate2that is mounted on an electrical instrument or the like by soldering or the like as illustrated inFIG.1andFIG.2, and electrically connects the wiring substrate2and a signal transmission medium3. The signal transmission medium3is a flat wiring member that is formed into a plate shape, and is, for example, a flexible printed circuit (FPC), a flexible flat cable (FFC), or the like. A plurality of signal electrically conducting paths91and a ground electrically conducting path92are provided on the signal transmission medium3. Furthermore, cut parts94are formed on a tip part3aof the signal transmission medium3at one end and another end thereof in an array direction of the plurality of signal electrically conducting paths91. As illustrated inFIG.3, the electrical connector1includes a housing10with an insulation property, a plurality of signal contacts20with an electrically conductive property that are arrayed on the housing10, a shell30with an electrically conductive property, and a pair of fixing brackets40,50. In a state as illustrated inFIG.1, the plurality of signal contacts20are electrically connected to corresponding signal electrically conducting paths among a plurality of signal electrically conducting paths (non-illustrated) that are formed on the wiring substrate2, respectively. As illustrated inFIG.1, an opening part39where the signal transmission medium3is inserted thereto is formed on an upper part of the shell30. As the tip part3aof the signal transmission medium3is inserted into an inside of the electrical connector1through such an opening part39, a state as illustrated inFIG.2is provided where the wiring substrate2and the signal transmission medium3are electrically connected by the electrical connector1. Specifically, the plurality of signal contacts20of the electrical connector1are provided in a state where a corresponding signal electrically conducting path(s)91among the plurality of signal electrically conducting paths91and a corresponding signal electrically conducting path(s) among a plurality of signal electrically conducting paths (not-illustrated) that are formed on the wiring substrate2are connected respectively. Furthermore, the shell30is provided in a state where the ground electrically conducting path92(seeFIG.1) and a ground electrically conducting path (not-illustrated) that is formed on the wiring substrate2are connected. In a state as illustrated inFIG.2, a pair of cut parts94(seeFIG.1) that is provided at a tip of the signal transmission medium3is locked by the fixing brackets40,50. Thereby, even in a case where an unintended force is exerted on the signal transmission medium3, it is possible to prevent or reduce removing of the signal transmission medium3from the electrical connector1. Furthermore, a pair of operation parts13b,14bis provided on the housing10of the electrical connector1. In a case where such a pair of operation parts13b,14bis operated so as to move to a direction toward the signal transmission medium3in a direction of an X-axis, locking between the fixing brackets40,50and the cut parts94of the signal transmission medium3is released, so that it is possible to remove the signal transmission medium3from the electrical connector1. The shell30of the electrical connector1is attached to the housing10in a state where each of a plurality of outer surfaces of the housing10that exclude an outer surface that faces the wiring substrate2is covered thereby. Thereby, it is possible for the electrical connector1to execute electromagnetic shielding of a signal transmission path better than, for example, an electrical connector that includes an actuator that has a shield member. 2. Detail of Configuration of Electrical Connector1 Next, a configuration of an electrical connector1will be explained specifically with reference toFIG.4toFIG.16. Additionally, hereinafter, for convenience of explanation, array directions of a plurality of signal contacts20are provided as “leftward and rightward directions” (directions of an X-axis), a direction where a signal transmission medium3is inserted into the electrical connector1is provided as a “downward direction” (a negative direction of a Z-axis), a direction where the signal transmission medium3is removed from the electrical connector1is provided as an “upward direction” (a positive direction of a Z-axis), and directions (directions of an Y-axis) that are orthogonal to each of the “leftward and downward directions” and “upward and downward directions” are provided as “forward and backward directions”. The electrical connector1according to an embodiment includes a housing10where the plurality of signal contacts20are arrayed, a shell30, and a pair of fixing brackets40,50, as described above. The plurality of signal contacts20, the shell30, and the fixing brackets40,50are formed by, for example, applying punching and folding processes to a metal plate material. First, the housing10will be explained. As illustrated inFIG.4andFIG.5, an opening part16that faces an opening part39(seeFIG.1) of the shell30in upward and downward directions where a tip part3a(seeFIG.1) of the signal transmission medium3is inserted thereto is formed on an upper part of the housing10. Additionally, in a case where the signal transmission medium3is inserted through the opening part16, the plurality of signal contacts20that are held by the housing10are provided at positions that face a plurality of signal electrically conducting paths91that are formed on the tip part3aof the signal transmission medium3. The housing10includes a front wall part11that extends in leftward and rightward directions, a back wall part12that is positioned behind the front wall part11and extends in leftward and rightward directions, a side wall part13that extends in frontward and backward directions and joins one end of the front wall part11and one end of the back wall part12in leftward and rightward directions, and a side wall part14that extends in frontward and backward directions and joins another end of the front wall part11and another end of the back wall part12in leftward and rightward directions. Additionally, the opening part16as described above is formed at a position that is surrounded by each of the front wall part11, the back wall part12, the side wall part13, and the side wall part14. A plurality of groove parts11bwhere the plurality of signal contacts20are press-fitted are formed on the front wall part11. Furthermore, a plurality of recess parts11afor fixing the shell30are formed on the front wall part11at an interval(s) in leftward and rightward directions. Similarly, a plurality of recess parts12afor fixing the shell30are formed on the back wall part12at an interval(s) in leftward and rightward directions. The side wall part13has a containment part13athat contains a part of a fixing bracket40, and an operation part13bas described above. Similarly, the side wall part14has a containment part14athat contains a part of a fixing bracket50, and an operation part14bas described above. A plurality of outer surfaces15a,15b,15c,15d,15eof the housing10that exclude an outer surface15fthat faces a wiring substrate2are covered by the shell30. The outer surface15fis a surface that includes a lower surface of the front wall part11, a lower surface of the back wall part12, a lower surface of the side wall part13, and a lower surface of the side wall part14. The outer surface15ais a front surface of the housing10and includes a front surface of the front wall part11and front surfaces of the side wall parts13,14. The outer surface15bis a back surface of the housing10and includes a back surface of the back wall part12and back surfaces of the side wall parts13,14. The outer surface15cis a side surface of the side wall part13and the outer surface15dis a side surface of the side wall part14. The outer surface15eincludes an upper surface of the front wall part11, an upper surface of the back wall part12, an upper surface of the side wall part13, and an upper surface of the side wall part14. Next, the shell30will be explained. As illustrated inFIG.6andFIG.7, the shell30includes a front cover part31that extends in leftward and rightward directions, a back cover part32that extends in leftward and rightward directions, a side cover part33that extends in frontward and backward directions and is formed between one end part of the front cover part31and one end part of the back cover part32in leftward and rightward directions, and a side cover part34that is formed between another end part of the front cover part31and another end part of the back cover part32in leftward and rightward directions. Furthermore, the shell30includes a folding part35that is continuous with an upper end of the front cover part31, and extends backward and subsequently is folded downward, and a folding part36that is continuous with an upper end of the back cover part32, and extends frontward and subsequently is folded downward. The folding part35and the folding part36face through the opening part39. The front cover part31covers the outer surface15aof the housing10, the back cover part32covers the outer surface15bof the housing10, the side cover part33covers the outer surface15c, and the side cover part34covers the outer surface15d. Furthermore, the folding part35and the folding part36cover the outer surface15e. Thus, the shell30covers the plurality of outer surfaces15a,15b,15c,15d,15eof the housing10that exclude the outer surface15f. Hence, it is possible for the shell30to execute electromagnetic shielding of a signal transmission path well. As illustrated inFIG.6andFIG.11, the front cover part31has a principal surface part31athat covers a part of the outer surface15aof the housing10that extends in leftward and rightward directions and an extension-out part31bthat extends out from the principal surface part31afrontward and obliquely downward. A plurality of fixation parts60that extend from an upper end part of the principal surface part31abackward and obliquely downward in a cantilever shape and subsequently extend downward are formed thereon. The plurality of fixation parts60are arranged at an interval(s) in leftward and rightward directions. Each fixation part60has elasticity and one end part thereof is fixed on the housing10. Specifically, one end part of the fixation part60is inserted into a recess part11a(seeFIG.5) that is formed on an upper end part of the front wall part11, so that the front cover part31is fixed on the housing10. Furthermore, a ground connection part61is formed on a lower end part of the extension-out part31b. Such a ground connection part61has a plurality of connection terminal parts61athat are connected to a non-illustrated ground electrically conducting path that is formed on the wiring substrate2and a plurality of cut parts61bthat are arranged at an interval(s) in leftward and rightward directions. The connection terminal parts61aand the cut parts61bare alternately arranged in leftward and rightward directions. A length of a cut part61bin leftward and rightward directions is set at, for example, an interval not to pass an electromagnetic wave(s) that has/have a frequency that is identical to a frequency of a signal that is propagated by a signal contact20. The back cover part32has a plurality of fixation parts32athat extend from an upper end part thereof frontward and obliquely downward in a cantilever shape and subsequently extend downward. Such a plurality of fixation parts32aare arranged at an interval(s) in leftward and rightward directions. Each fixation part32ahas elasticity and one end part thereof is fixed on the housing10. Specifically, one end part of a fixation part32ais inserted into a recess part12a(seeFIG.5) that is formed on an upper end part of the back wall part12, so that the back cover part32is fixed on the housing10. Furthermore, as illustrated inFIG.7, a ground connection part32bis formed on a lower end part of the back cover part32. Such a ground connection part32bhas a plurality of connection terminal parts71that are connected to a non-illustrated ground electrically conducting path that is formed on the wiring substrate2and a plurality of cut parts72that are arranged at an interval(s) in leftward and rightward directions. The connection terminal parts71and the cut parts72are alternately arranged in leftward and rightward directions. A length of a cut part72in leftward and rightward directions is set at, for example, an interval not to pass an electromagnetic wave(s) that has/have a frequency that is identical to a frequency of a signal that is propagated by a signal contact20. As illustrated inFIG.6, the side cover part33has a top cover part33aand a bottom cover part33b. The top cover part33ajoins a top of one end of the front cover part31and a top of one end of the back cover part32in leftward and rightward directions. The bottom cover part33bis formed so as to extend in frontward and backward directions from a bottom of one end of the front cover part31and a bottom of one end of the back cover part32in leftward and rightward directions, and covers a bottom of the outer surface15cof the housing10. As illustrated inFIG.7, the side cover part34has a top cover part34aand a bottom cover part34b. The top cover part34ajoins a top of another end of the front cover part31and a top of another end of the back cover part32in leftward and rightward directions. The bottom cover part34bis formed so as to extend in frontward and backward directions from a bottom of another end of the front cover part31and a bottom of another end of the back cover part32in leftward and rightward directions, and covers a bottom of the outer surface15dof the housing10. As illustrated inFIG.7andFIG.13, the folding part35has a base part35athat is provided with one end that is continuous with an upper end of the front cover part31and extends backward, a plurality of drooping parts35bthat are continuous with another end of the base part35aand extend downward, and a plurality of contact parts35cthat are respectively arranged between adjacent drooping parts35bin mutually different combinations and extend backward and obliquely downward. The plurality of drooping parts35bare arranged at an interval(s) in leftward and rightward directions. Similarly, the plurality of contact parts35care arranged at an interval(s) in leftward and rightward directions. The folding part36has a base part36athat is provided with one end that is continuous with an upper end of the back cover part32and extends forward, and a contact part36bthat is continuous with another end of the base part36aand extends downward. Next, the fixing brackets40,50will be explained. As illustrated inFIG.8andFIG.9, a fixing bracket40has a base part41that is formed into a U-shape in a plan view thereof, and ground connection parts42,43that extend frontward and backward respectively from a lower end of the base part41and are connected to a non-illustrated ground electrically conducing path that is formed on the wiring substrate2. Furthermore, the fixing bracket40has a folding part44with a proximal end that is continuous with an upper end of the base part41, a fixation part45that faces the folding part44in frontward and backward directions and is fixed on the housing10, and an extension part46that is continuous with an upper end of the base part41and extends upward. A locking part44awith a protrusion shape that protrudes toward the fixation part45is formed on a tip part of the folding part44. In a case where the signal transmission medium3is connected to the electrical connector1, such a locking part44ais inserted into a cut part94of the signal transmission medium3and has a function to lock a state of connection between the electrical connector1and the signal transmission medium3. Furthermore, a protrusion part44bthat is inclined and protrudes in a direction away from the fixation part45is formed on a middle part of the folding part44. In a case where such a protrusion part44bis pushed by the operation part13b, a tip part of the folding part44moves to a direction away from the fixation part45. Thereby, the locking part44ais removed from the cut part94, so that a state of locking between the electrical connector1and the signal transmission medium3is released. The extension part46has elasticity in leftward and rightward directions and is inserted into an attachment hole of the operation part13b. Thereby, after the operation part13bis operated by an operator in a direction where the protrusion part44bis pushed, it is possible to return the operation part13bto a non-operation position thereof. The fixing bracket50has a shape that is mutually reflection-symmetric with the fixing bracket40(or plane-symmetric in a ZY-plane). Such a fixing bracket50has a folding part54, a fixation part55, and an extension part56that correspond to the folding part44, the fixation part45, and the extension part46of the fixing bracket40, as described later. Next, a relationship among the housing10, the signal contact(s)20, and the shell30will be explained. As illustrated inFIG.11, the outer surface15aof the housing10is covered by the front cover part31. The front cover part31has the extension-out part31bthat extends out in a frontward direction that is a direction away from the outer surface15a, from the principal surface part31athat covers a part of the outer surface15a, and is inclined downward. Hence, as illustrated inFIG.11, the shell30faces a connection part(s)20athat is/are connected to a non-illustrated signal electrically conducting path that is formed on the wiring substrate2, on the signal contact(s)20, with a gap(s)85with a distance D1. Thereby, it is possible to execute wiring in a region of the wiring substrate2that faces the gap(s)85, that is, a region with a range as indicated by a distance D1. Furthermore, it is possible for the shell30to shield an electromagnetic wave(s) that is/are generated by a signal that flows through a wiring that is formed in a region with a range as indicated by a distance D1. Therefore, it is possible to execute electromagnetic shielding of a signal transmission path well. Furthermore, as illustrated inFIG.11, the front wall part11and the back wall part12in the housing10are arranged at intervals from the principal surface part31aof the front cover part31of the shell30. Specifically, the front wall part11faces the principal surface part31athrough a gap with a distance D2and the back wall part12faces the back cover part32through a gap with a distance D3. Then, an upper end part of the front wall part11is supported on the front wall part11by the fixation part60that has elasticity and an upper end part of the back wall part12is supported on the back wall part12by the fixation part32athat has elasticity. Hence, an upper end part of the front wall part11and an upper end part of the back wall part12are capable of moving in frontward and backward directions. As illustrated inFIG.13, in a state where the signal transmission medium3is connected to the electrical connector1, the tip part3aof the signal transmission medium3is interposed between a contact part36bof the folding part36of the shell30and a contact part(s)35cof the folding part35of the shell30. In a state as illustrated inFIG.13, a ground electrically conducting path92of the signal transmission medium3contacts the contact part(s)35cof the folding part35of the shell30and a ground electrically conducting path93of the signal transmission medium3contacts the contact part36bof the folding part36. Furthermore, in a state as illustrated inFIG.13, a signal electrically conducting path(s)91of the signal transmission medium3contact(s) a contact part(s)20bof the signal contact(s)20. As the signal transmission medium3is tilted in one direction among frontward and backward directions (a positive direction of a Y-axis) as illustrated inFIG.14from a state as illustrated inFIG.13, an upper end part of the front wall part11and an upper end part of the back wall part12are moved in one direction (a positive direction of a Y-axis) by the fixation part60and the fixation part32athat have elasticity, so that the folding parts35,36are moved in one direction (a positive direction of a Y-axis). Furthermore, as the signal transmission medium3is tilted in another direction among frontward and backward directions (a negative direction of a Y-axis) as illustrated inFIG.14from a state as illustrated inFIG.13, an upper end part of the front wall part11and an upper end part of the back wall part12are moved in another direction (a negative direction of a Y-axis) by the fixation part60and the fixation part32athat have elasticity, so that the folding parts35,36are moved in another direction (a negative direction of a Y-axis). Hence, even in a case where the signal transmission medium3that is connected to the electrical connector1is tilted, contact between the contact part(s)35cof the folding part35and the ground electrically conducting path92is maintained and contact between the contact part36bof the folding part36and the ground electrically conducting path93is maintained. Thereby, it is possible to stabilize a state of contact of the shell30with the ground electrically conducting paths92,93. Furthermore, the plurality of cut parts61b(seeFIG.6) are formed on the ground connection part61of the shell30. Hence, as illustrated inFIG.15, connection parts20aof the plurality of signal contacts20are exposed through the plurality of cut parts61bin frontward and backward directions. Hence, after the electrical connector1is attached to the wiring substrate2, it is possible to readily confirm connection between a non-illustrated ground electrically conducting path that is formed on the wiring substrate2and a connection part(s)20a. Additionally, for connection between a ground electrically conducting path of the wiring substrate2and the connection part(s)20aof the signal contact(s)20, it is possible to determine connection between the ground electrically conducting path of the wiring substrate2and the connection part(s)20aof the signal contact(s)20automatically by, for example, capturing an image of the electrical connector1from a position that faces the front cover part31of the shell30in frontward and backward directions and image-analyzing such a result of image capturing. Furthermore, as illustrated inFIG.16, a height H1of the bottom cover part34bof the side cover part34in the shell30from the wiring substrate2is greater than a height(s) H2of the contact part(s)20bof the signal contact(s)20that contact(s) the signal electrically conducting path(s)91of the non-illustrated signal transmission medium3that is inserted into the opening part39. Furthermore, a height of the bottom cover part33bof the side cover part30in the shell30from the wiring substrate2is also greater than a height(s) H2of the contact part(s)20bof the signal contact(s)20although illustration thereof is not provided. Current does not flow through a part(s) above the contact part(s)20bof the signal contact(s)20, so that it is possible for the side cover parts33,34to well shield an electromagnetic wave(s) that is/are generated by a signal(s) that flow(s) through the signal contact(s)20. Additionally,FIG.16does not illustrate the housing10for convenience of explanation. 3. Locking of State of Connection Between Electrical Connector1and Signal Transmission Medium3and Release of Locking Thereof Next, a configuration to lock a state of connection between an electrical connector1and a signal transmission medium3and to release locking between the electrical connector1and the signal transmission medium3by operations of operation parts13b,14bthat are provided on a housing10will be explained specifically, with reference toFIG.17toFIG.22. As illustrated inFIG.20, in a state where the operation parts13b,14bare not operated so as to move in a direction toward the signal transmission medium3in leftward and rightward directions (directions of an X-axis), a locking part44ais inserted into one of cut parts94of the signal transmission medium3and a locking part54ais inserted into another of the cut parts94of the signal transmission medium3. Hence, the signal transmission medium3is locked by fixing brackets40,50that are fixed on the housing10, so that the signal transmission medium3is locked by the electrical connector1in a state where it is connected to the electrical connector1. In a case where the operation parts13b,14bare operated so as to move in a direction toward the signal transmission medium3in leftward and rightward directions (directions of an X-axis) by an operator or the like from a state as illustrated inFIG.19andFIG.20, the electrical connector1is provided in a state ofFIG.21andFIG.22. As an operation part13bis operated, the operation part13bpushes a protrusion part44b, so that the locking part44ais separated from one of the cut parts94of the signal transmission medium3. Furthermore, as an operation part14bis operated so as to move in a direction toward the signal transmission medium3in leftward and rightward directions (directions of an X-axis), the operation part14bpushes a protrusion part54b, so that the locking part54ais separated from another of the cut parts94of the signal transmission medium3. Thereby, a state of locking of the signal transmission medium3by the electrical connector1is released. Additionally, as illustrated inFIG.22, extension parts46,56are inserted into attachment holes81,82of the operation parts13b,14b. Hence, in a case where the operation parts13b,14bare not operated from a state ofFIG.21andFIG.22, the operation parts13b,14breturn to positions as illustrated inFIG.19andFIG.20. Additionally, as illustrated inFIG.9, the locking part44ahas a shape that is inclined downward. Furthermore, similarly, the locking part54aalso has a shape that is inclined downward. Hence, when the signal transmission medium3is inserted into the electrical connector1, the locking parts44a,54aare pushed, and the cut parts94of the signal transmission medium3are inserted into the locking parts44a,54ain a case where they are provided at positions to face the locking parts44a,54a. Furthermore, although the electrical connector1as described above is configured in such a manner that a direction where the signal transmission medium3is inserted is a downward direction, such a configuration is not limiting. It is sufficient that the electrical connector1is configured in such a manner that the signal transmission medium3is inserted from a direction that intersects with a principal surface M of the wiring substrate2, and a configuration may be provided, for example, in such a manner that a direction where the signal transmission medium3is inserted is a frontward and obliquely downward direction or a backward and obliquely downward direction. As described above, an electrical connector1according to an embodiment is an electrical connector that electrically connects a signal transmission medium3with a plate shape and a wiring substrate2, and includes a plurality of signal contacts20with an electrically conductive property, a housing10with an insulation property, and a shell30with an electrically conductive property. The plurality of signal contacts20are arrayed along leftward and rightward directions (an example of a first direction) of the electrical connector1, and electrically connect a corresponding signal electrically conducting path(s)91among a plurality of signal electrically conducting paths91that are provided on the signal transmission medium3to a corresponding signal electrically conducting path(s) among a plurality of signal electrically conducting paths (non-illustrated) that are provided on the wiring substrate2, respectively. The housing10holds the plurality of signal contacts20. The shell30has an opening part39where the signal transmission medium3is inserted thereto from a direction that intersects with a principal surface M of the wiring substrate2, and electrically connects a ground electrical conducting path(s)92,93that is/are provided on the signal transmission medium3to a ground electrically conducting path(s) (non-illustrated) that is/are provided on the wiring substrate2. The shell30covers each of a plurality of outer surfaces15a,15b,15c,15d,15eof the housing10that exclude an outer surface15fthat faces the principal surface M of the wiring substrate2. Hence, it is possible for a shell30to execute electromagnetic shielding of a signal transmission path well. Furthermore, the shell30faces a connection part(s)20athat is/are connected to the wiring substrate2on an outer surface15aof the housing10and the plurality of signal contacts20, with a gap(s)85, in frontward and backward directions (an example of a second direction) that is/are a direction(s) along the principal surface M of the wiring substrate2and is/are orthogonal to the leftward and rightward directions. Hence, for example, it is possible to execute wiring in a region with a range that is indicated by a distance D1as illustrated inFIG.11. Furthermore, it is possible for a shell30to shield an electromagnetic wave(s) that is/are generated by a signal that flows through a wiring that is formed in a region with a range that is indicated by a distance D1. Therefore, it is possible to execute electromagnetic shielding of a signal transmission path better. Furthermore, the shell30has a principal surface part31athat covers a part of an outer surface15aof the housing10that extends in the leftward and rightward directions, and an extension-out part31bthat extends out from the principal surface part31ain a direction that is a frontward direction (an example of a second direction) and is away from the housing10, and faces the connection part(s)20awith a gap(s)85in the forward direction. Thereby, it is possible to prevent an electrical connector1from being wholly upsized as compared with a case where a principal surface part31ain addition to an extension-out part31bis configured to extend out from an outer surface15ain a direction away from a housing10. Furthermore, the extension-our part31bhas a ground connection part61that is connected to the ground electrically conducting path (non-illustrated) that is provided on the wiring substrate2. Thereby, it is possible to improve a shield effect of an extension-out part31b. Furthermore, the ground connection part61has a plurality of cut parts61bthat are arrayed at an interval(s) in the leftward and rightward directions, and the connection part(s)20aof the plurality of signal contacts20is/are visible from a facing position(s) in the frontward and backward directions through the plurality of cut parts61b. Thereby, after a wiring substrate2is attached to an electrical connector1, it is possible to readily confirm connection between a non-illustrated ground electrically conducting path that is formed on the wiring substrate2and a connection part(s)20a. The shell30has a fixation part(s)32a,60with one end that is fixed on the housing10, and the fixation part(s)32a,60has/have elasticity. Thereby, even in a case where a signal transmission medium3that is connected to an electrical connector1is tilted, it is possible to move a shell30so as to follow it. Hence, for example, it is possible to stabilize a state of contact of the shell30with a ground electrically conducting path(s)92,93. Furthermore, the fixation part(s)32a,60has/have elasticity in the forward and backward directions, and the shell30faces an outer surface(s)15a,15bof the housing10that extend(s) in the leftward and rightward directions with a gap(s) in the frontward and backward directions in a state where the one end(s) of the fixation part(s)32a,60is/are fixed on the housing10. Thereby, even in a case where a signal transmission medium3is tilted in frontward and backward directions, it is possible to move a shell30so as to follow it. Furthermore, the shell30has a pair of side cover parts33,34that face in the leftward and rightward directions through the housing10, and such a pair of side cover parts33,34has a part(s) that is/are higher than a height(s) H2of a contact part(s)20bthat contact(s) the plurality of signal electrically conducting paths91on the plurality of signal contacts20. Thereby, it is possible for a side cover part(s)33,34to well shield an electromagnetic wave(s) that is/are generated by a signal(s) that flow(s) through a signal contact(s)20. A pair of side cover parts33,34is an example of a pair of members. According to an aspect of an embodiment, it is possible to provide an electrical connector that is capable of executing electromagnetic shielding of a signal transmission path well. It is possible for a person(s) skilled in the art to readily derive an additional effect(s) and/or variation(s). Hence, a broader aspect(s) of the present invention is/are not limited to a specific detail(s) and a representative embodiment(s) as illustrated and described above. Therefore, various modifications are possible without departing from the spirit or scope of a general inventive concept that is defined by the appended claim(s) and an equivalent(s) thereof. | 33,942 |
11942714 | DETAILED DESCRIPTION OF THE EMBODIMENTS Embodiments of the present invention will be described using examples with reference to the drawings. First Embodiment FIGS.3A to3Dillustrate a socket contact according to a first embodiment.FIG.3Ais a front view,FIG.3Bis a side view,FIG.3Cis a perspective view, andFIG.3Dis a sectional view. A socket contact30includes a spring component40, a base portion50, and a sleeve60.FIG.4illustrates the state in which the sleeve60has been removed from the socket contact30.FIG.5Aillustrates the spring component40andFIG.5Billustrates the base portion50. The spring component40includes four cantilever-shaped spring pieces41and an annular joint portion42. The four spring pieces41are arranged in rotational symmetry with respect to the central line of the annular joint portion42as a symmetric axis. In the example inFIG.5A, the four spring pieces41are arranged in fourfold symmetry positions on the circumference at regular angular intervals of 90 degrees. These spring pieces41are integrated with each other with one ends (fixed ends) thereof joined to and supported by the joint portion42. Each of the spring pieces41has a shape that extends from a fixed end41asupported by the joint portion42along the central line of the joint portion42, is slightly bent outside, and extends so that the bent end is turned back inside and returned to the vicinity of the fixed end41a(seeFIG.3D). The turnback portion of the spring piece41is a free end41b. A bent portion41cis provided in the portion that is turned back from the free end41band extends to the vicinity of the fixed end41a, and a V-shape projecting inside is formed by the bent portion41cin the portion extending to the vicinity of the fixed end41a. It should be noted that a front end41dof the spring piece41is slightly bent inside. The base portion50is cylindrical and one end side thereof is provided with projecting portions51recessed toward the inner peripheral side and projecting from the inner peripheral surface. The two projecting portions51are provided in each of four positions arranged at intervals of 90 degrees on the inner peripheral surface and the spacing between the two projecting portions51arranged along the central line of the base portion50matches the width along the central line of the joint portion42of the spring component40. The spring components40are mounted to the base portion50as illustrated inFIG.4by inserting the joint portion42into the base portion50from one end side on which the projecting portions51of the base portion50are formed and fitting the joint portion42between the two projecting portions51arranged along the central line of the base portion50in the four positions. The sleeve60has a cylindrical shape that is one size larger than the base portion50. The socket contact30illustrated inFIGS.3A to3Dis formed by mounting the sleeve60onto the base portion50. The central line of the sleeve60matches the central line of the base portion50. Accordingly, the four spring pieces41are arranged in rotational symmetry with respect to the central line of the sleeve60as a symmetric axis. In this socket contact30, the sleeve60is movable with respect to the base portion50. When the sleeve60is moved, the sleeve60covers the free ends41bof the four spring pieces41and elastically deforms the four spring pieces41so that the free ends41bcome close to each other. That is, coverage with the sleeve60reduces the dimension of the inner diameter surrounded by the free ends41bof the four spring pieces41. It should be noted thatFIGS.3A to3Dillustrate the state in which the sleeve60does not cover the free ends41bof the spring pieces41. The material of the spring component40may be, for example, a phosphor bronze plate and the material of the base portion50and the sleeve60may be, for example, stainless steel. Regarding the spring component40, the joint portion42may be fixed to the base portion50by welding after the joint portion42is fitted between the projecting portions51of the base portion50. As illustrated inFIG.3D, the dimension of the inner diameter surrounded by the free ends41bof the four spring pieces41is assumed to be d1and the dimension of the inner diameter surrounded by the bent portions41clocated among the free ends41band the fixed ends41aof the four spring pieces41is assumed to be d2. FIGS.6A to6Dillustrate the state in which a counterpart pin contact70is being connected to the socket contact30described above.FIG.6Ais a side view,FIG.6Bis a rear view,FIG.6Cis a perspective view, andFIG.6Dis a sectional view.FIGS.7A to7Cillustrate the state in which the pin contact70has been connected to the socket contact30.FIG.7Ais a side view,FIG.7Bis a perspective view, andFIG.7Cis a sectional view. The pin contact70is shaped like a cylinder having a tapered front end and the base end is provided with a block portion71. Here, the outer dimension (dimension of the outer diameter) of the pin contact70is assumed to be D. The dimension d1of the inner diameter surrounded by the free ends41bof the four spring pieces41, the dimension d2of the inner diameter surrounded by the bent portions41c, and the outer dimension (dimension of the outer diameter) D of the pin contact70have the following relationship. D<d2<d1 Accordingly, the pin contact70can be inserted among the four spring pieces41with no insertion force in this example. That is, the pin contact70can be inserted with zero insertion force (ZIF). Alternatively, d2may be slightly less than D when D is set to be less than d1. Also in this case, the pin contact70can be inserted with a slight insertion force. That is, the pin contact70can be inserted with low insertion force (LIF). FIGS.6A to6Dillustrate the state in which the pin contact70has been inserted among the four spring pieces41. When the sleeve60is moved toward a base end of the pin contact70from the state inFIGS.6A to6Dand the pin contact70has been connected to the socket contact30, the state inFIGS.7A to7Cis reached. InFIGS.7A to7C, when the sleeve60covers the free ends41bof the four spring pieces41, the free ends41bare displaced toward the pin contact70. The displacement of the free ends41bpushes the bent portions41cagainst the pin contact70, sandwiches and holds the pin contact70by the bent portions41cof the four spring pieces41, and makes an electric connection. It should be noted that the turned back front ends41dof the spring pieces41make contact with the portions (portions of the fixed ends41aside of the spring pieces41) of the spring pieces41located outside, as illustrated inFIGS.7A to7C. When the fixed ends41a, the free ends41b, and the bent portions41cof the spring pieces41are assumed to be the fulcrums, the points of force, and the points of application of a lever, since the bent portions41care located between the free ends41band the fixed ends41a, the bent portions41ccan be brought into contact with the pin contact70with a force larger than the force for displacing the free ends41bbased on the principle of a lever. Accordingly, a large contact force and a large retaining force can be obtained with a relatively small force for displacing the free ends41b. In addition, the front ends41dof the spring pieces41make contact with the spring pieces41in this example, as described above. Accordingly, the bent portions41ccan hold the pin contact70using both of the force applied to the free ends41band the force applied to the front ends41d. Accordingly, it is possible to obtain the socket contact30that has better connection reliability and better connection operability and can be connected to the pin contact70with a low operational force. FIG.8andFIG.9illustrate a two-contact connector100having two socket contacts30described above and a two-contact counterpart connector200having two pin contacts70. The connector100includes the two socket contacts30, a housing110which is made of resin and houses the socket contacts30, and a slider120which is made of resin and is slidably mounted to the housing110. The front end surface of a fitting portion111of the housing110is provided with two openings112and the spring pieces41of the socket contacts30are disposed in the openings112. Reference numeral300inFIG.8andFIG.9represents cables connected to the socket contacts30. The counterpart connector200includes the two pin contacts70and a housing210which is made of resin and houses the pin contacts70. The housing210is provided with a fitting hole211to which the fitting portion111of the connector100is fitted and the two pin contacts70are disposed in this fitting hole211. In this example, the counterpart connector200also has screwing holes212used for screwing to the cabinet. Although not illustrated in detail, the pin contacts70may have a shape that allows crimp terminals crimped to cables to be screwed from the lower surface side of the housing210. In the connector100, the sleeves60of the two socket contacts30may be moved in conjunction with the sliding movement of the slider120. The sleeves60of the socket contacts30are provided with projections61as illustrated inFIG.10and the slider120is provided with holes121into which the projections61are inserted.FIGS.11A and11Billustrate the state in which the projections61provided on the sleeves60have been inserted into the holes121of the slider120. In such a structure, the sleeves60are moved in conjunction with the sliding movement of the slider120. Accordingly, the spring pieces41can be elastically deformed by pressing the free ends41bvia the sliding movement of the slider120. The slider120is provided with the two holes121corresponding to the two socket contacts30. The housing110is provided with slits (not illustrated inFIG.8andFIG.9because they are hidden by the slider120) that enable the projections61to be engaged with the slider120and the projection61to be moved. It should be noted that the projections61may be made of metal and may be mounted to the sleeves60by, for example, welding. FIG.12is a perspective view illustrating the state in which the fitting portion111of the connector100is being fitted and connected to the fitting hole211of the counterpart connector200.FIG.13is a perspective view illustrating the state in which the connector100has been connected to the counterpart connector200by sliding the slider120toward the counterpart connector200. When, for example, the connector having the socket contact30is a one-contact connector, the sleeve60may be moved by directly operating the projection61provided on the sleeve60as illustrated inFIG.10without providing the slider120. Second Embodiment FIGS.14A to14Dillustrate a socket contact according to a second embodiment.FIG.14Ais a front view,FIG.14Bis a side view,FIG.14Cis a perspective view, andFIG.14Dis a sectional view. Components corresponding to those in the first embodiment are denoted by the same reference characters and detailed descriptions thereof are omitted. The socket contact in the second embodiment has a contact component80obtained by integrally forming the spring component40and the base portion50in the first embodiment. That is, a socket contact30′ includes the contact component80and the sleeve60. The contact component80may have a shape as illustrated inFIGS.15A and15B. In this example, the contact component80has the shape in which the four spring pieces41are extended from four side surface portions52of a base portion50′ that is a quadratic prism having a substantially rectangular cross section. The spring pieces41may have the same shape as the spring pieces41in the first embodiment. The sleeve60is mounted onto the base portion50′ so as to movable with respect to the base portion50′. The spring pieces41are arranged in rotational symmetry with respect to the central line of the sleeve60as a symmetric axis, as in the first embodiment. In this example, the spring pieces41are arranged in fourfold symmetry positions on the circumference at regular angular intervals of 90 degrees. The material of the contact component80may be, for example, a phosphor bronze plate and the contact component80may be formed by bending the phosphor bronze plate. FIGS.16A to16DandFIGS.17A to17Ccorrespond toFIGS.6A to6DandFIGS.7A to7Cin the first embodiment.FIGS.16A to16Dillustrate the state in which the counterpart pin contact70is being connected to the socket contact30′.FIG.16Ais a side view,FIG.16Bis a rear view,FIG.16Cis a perspective view, andFIG.16Dis a sectional view.FIGS.17A to17Cillustrate the state in which the pin contact70has been connected to the socket contact30′.FIG.17Ais a side view,FIG.17Bis a perspective view, andFIG.17Cis a sectional view. Since this socket contact30′ also has the four spring pieces41and the sleeve60as the socket contact30according to the first embodiment, the connection reliability and connection operability have good characteristics. It should be noted that the shape of the sleeve60is not limited to a cylinder and may be a hollow column having a polygonal cross section. In addition, the outer shape of the sleeve60may be asymmetric. In addition, although the socket contacts30and30′ in the first embodiment and the second embodiment have the four spring pieces41, the number of spring pieces41is not limited to four. For example, the two spring pieces41may be arranged in twofold symmetry positions or the three spring pieces41may be arranged in threefold symmetry positions with respect to the central line of the sleeve60as a symmetric axis. The outer shape of the pin contact70is not limited to a cylinder and may be a column having a polygonal cross section. Third Embodiment FIG.18illustrates the socket contact according to a third embodiment together with a counterpart pin contact. A pin contact75is planar in this example. A socket contact30″ is connected to the pin contact75. The socket contact30″ has a contact component90and a sleeve65.FIG.19is a perspective view illustrating the contact component90. The contact component90has one spring piece41similar to the spring piece41in the first embodiment. The contact component90includes the cantilever-shaped spring piece41, a base portion91to which the fixed end41aof the spring piece41is fixed, and an opposed portion92extended from the base portion91. The opposed portion92is opposed to the spring piece41. The base portion91is shaped like a flat column with a substantially rectangular cross section and the spring piece41is extended from an upper surface portion91athereof. It should be noted that an extension piece93is extended from the upper surface portion91aon the side of the upper surface portion91aopposite to the spring piece41. The opposed portion92is extended from a lower surface portion91bof the base portion91. Side wall portions94and95are provided on both sides in the width direction of the opposed portion92. The side wall portions94and95are formed by extending side surface portions91cand91dof the base portion91. The sleeve65is shaped like a flat column with a substantially rectangular cross section one size larger than in the base portion91. The sleeve65is mounted to the outside of the base portion91so as to be movable with respect to the base portion91. The sleeve65elastically deforms the spring piece41when the sleeve65moves and covers the free end41bof the spring piece41, as the sleeve60in the first embodiment. At this time, the spring piece41is elastically deformed so that the free end41bcomes close to the opposed portion92. The material of the contact component90may be, for example, a phosphor bronze plate and the contact component90may be formed by bending the phosphor bronze plate. The material of the sleeve65may be, for example, stainless steel. FIGS.20A to20DandFIGS.21A to21Ccorrespond toFIGS.6A to6DandFIGS.7A to7Cin the first embodiment.FIGS.20A to20Dillustrate the state in which the counterpart pin contact75is being connected to the socket contact30″.FIG.20Ais a side view,FIG.20Bis a rear view,FIG.20Cis a perspective view, andFIG.20Dis a sectional view.FIGS.21A to21Cillustrate the state in which the pin contact75has been connected to the socket contact30″.FIG.21Ais a side view,FIG.21Bis a perspective view, andFIG.21Cis a sectional view. In the socket contact30″, the spacing between the free end41bof the spring piece41and the opposed portion92is assumed to be d3, the spacing between the opposed portion92and the bent portion41clocated between the free end41band the fixed end41aof the spring piece41is assumed to be d4, and the outer dimension of the pin contact75inserted into the spacings d3and d4is assumed to be T. When the following relationship is met among d3, d4, and T, the pin contact75can also be inserted without an insertion force in the third embodiment. T<d4<d3 Alternatively, d4may be equal to or slightly less than T when T is set to be less than d3. It should be noted that T, d3, and d4are indicated inFIG.20Dby assuming that T is equal to d4. When the sleeve65is moved, the spring piece41is elastically deformed and the free end41bcomes close to the opposed portion92. The pin contact75inserted between the spring piece41and the opposed portion92is sandwiched and held by the bent portion41cof the elastically deformed spring piece41and the opposed portion92as illustrated inFIG.21Cand electrically connected. Since the spring piece41in the socket contact30″ also functions as the spring piece41in the first embodiment, the connection reliability and connection operability have good characteristics. Although the spring piece of the socket contact suitably has a shape that is turned back inside from the free end41bso that the front end41dis returned to the fixed end41aas described above, the shape of the spring piece41is not limited to this. A shape other than this may have a certain level of effects. For example, the spring piece may have a shape in which a turnback is not present at the free end, the free end is the front end, and the bent portion in contact with the pin contact is provided between the free end and the fixed end. In this case, a V-shape projecting toward the pin contact by the bent portion may be formed by the whole spring piece41. The foregoing description of the embodiments of the invention has been presented for the purpose of illustration and description. It is not intended to be exhaustive and to limit the invention to the precise form disclosed. Modifications or variations are possible in light of the above teaching. The embodiment was chosen and described to provide the best illustration of the principles of the invention and its practical application, and to enable one of ordinary skill in the art to utilize the invention in various embodiments and with various modifications as are suited to the particular use contemplated. All such modifications and variations are within the scope of the invention as determined by the appended claims when interpreted in accordance with the breadth to which they are fairly, legally, and equitably entitled. | 18,969 |
11942715 | DETAILED DESCRIPTION In the following description, numerous specific details are set forth. However, it is understood that embodiments of the invention may be practiced without these specific details. In other instances, well-known circuits, structures and techniques have not been shown in detail in order not to obscure the understanding of this description. References in the specification to “one embodiment,” “an embodiment,” “an example embodiment,” etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to affect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described. For the purposes of the present disclosure, the phrase “A and/or B” means (A), (B), or (A and B). For the purposes of the present disclosure, the phrase “A, B, and/or C” means (A), (B), (C), (A and B), (A and C), (B and C), or (A, B and C). In the connector assembly of the present disclosure, the TPA device3is installed on a pre-installed position of a first connector2. The first connector2is illustrated as a male connector for containing male terminal(s), but this invention is not limited to this. The on-site assembly of the connector is accomplished by first inserting a terminal (e.g., male terminal) into a first connector, pushing the TPA device to the end, and then inserting a mating connector into the first connector from the other side. TPA device3and the insulated housing of the first connector3may be made of plastic and adopts a rigid structure. The plastic housing of the first connector may adopt a design of through hole structure, and the corresponding TPA device is not required to be detached from the first connector. FIG.1is a schematic diagram illustrating an example connector assembly1according to an embodiment. As shown inFIG.1, the connector assembly1is assembled from a first connector2and a terminal position assurance (TPA) device3. The TPA device3may be used to lock the terminal, and the number of TPA device3can be one or two. In the case of two TPA devices3, as shown inFIG.2A, these two TPA devices3can be mounted on both sides of the first connector2in a centrally symmetric manner with respect to the axis of the first connector2. The TPA device3of the present disclosure is not required to adopt a flexible structure of a conventional TPA device in the form of cantilever beam, and the deformation generated during use is small, and the failure problem due to yielding can be avoided. The case of two TPA devices3is taken as an example to illustrate. In the example shown inFIG.1, the TPA device3is installed on the housing of the first connector2and is in a pre-installed position, and a product can be delivered in such state without detaching the TPA device3from the first connector2. When in use, the on-site assembly of the connector can be accomplished by firstly inserting the terminal (not shown, e.g., male terminal) into a hollow portion21of the housing of the first connector2along the negative X-axis direction in the pre-installed state, pressing the two TPA devices3to the end (that is, pressing to the fully installed position from the pre-installed position), and then inserting the mating connector (not shown) into the hollow portion21of the first connector2along the positive X-axis direction from the other side. Upon assembly, the female terminal and male terminal in two connectors can form an effective electrical connection. The TPA device3includes a main body composed of a main board31, an upper board32and a lower board33. The upper board32and the lower board33are substantially perpendicular to the main board31and are located on the same side of the main board31(in the figure, it is shown as the side in the positive Y-axis direction). The upper board32and the lower board33each extends in a direction away from the main board31and they have distal ends321,331respectively. The distal end321may be further provided with an upper engaging portion322, and the distal end331may be provided with a lower engaging portion332. The upper engaging portion322and the lower engaging portion332are elongated and protrude from the outer surfaces of the upper board32and the lower board33respectively, and their length direction is parallel to an extension direction of a boundary between the upper board32(lower board33) and the main board31, i.e., the X-axis direction. The upper engaging portion322and the lower engaging portion332assist to stably maintain the TPA device3in a pre-installed position and a fully installed position. Specifically, the upper engaging portion322is engaged with a positioning groove22aof the first connector2when the TPA device3is in the pre-installed position and is engaged with a positioning groove22bof the first connector2when the TPA device3is in the fully installed position. The lower engaging portion332is similar to the upper engaging portion322and is engaged with the corresponding positioning groove (not shown inFIG.1) at the lower portion of the first connector2when the TPA device3is in the pre-installed position and the fully installed position, respectively. Another TPA device (not shown) is also installed in the same manner where its upper engaging portion or lower engaging portion is engaged with the positioning groove22cor the positioning groove22bof the first connector2in the pre-installed position or the fully installed position, respectively. In some embodiments, the TPA device3may have only one of the upper engaging portion322and the lower engaging portion332. In this situation, part of the positioning grooves on the first connector2may be omitted to improve the strength of the first connector2. For example, in the case of only one TPA device3, only two positioning grooves may be provided on the corresponding upper or lower portions of the first connector2to define the pre-installed position and the fully installed position. In the case of two TPA devices3, depending on whether the TPA device installed in a centrally symmetric manner on the other side has an upper engaging portion or a lower engaging portion, only two positioning grooves (the upper two positioning grooves and the lower two positioning grooves are arranged in a centrally symmetric manner) are provided on the upper and lower portions of the first connector2respectively, or three positioning grooves are arranged on only one side. It is certainly possible to provide three positioning grooves on the upper and lower portions respectively, as described in the present embodiment. As shown inFIGS.12B and4B, the TPA device3also includes an extension arm34. The extension arm34further extends from the distal end of the upper board32in a direction (positive Y-axis direction) substantially perpendicular to the main board31. In other words, the extension arm34is located on the same side of the main board31as the upper board32and the lower board33. As shown inFIG.1, a stopper35extends from the outer edge of the extension arm34(the outer edge corresponds to the negative X-axis direction inFIG.1) such that the stopper35goes beyond the main body. In some embodiments, the stopper35is located at the distal end of the extension arm34. With reference toFIGS.2A-2B and3A-3B, the stopper35is used to block a passage in the hollow portion21of the housing of the first connector2(e.g., male connector) into which the mating connector (e.g., female connector) enters, so that the mating female connector cannot be pushed to the end to connect with electrical contacts within the first connector2when the TPA device3is in the pre-installed position. Referring toFIGS.4A-4B and5A-5B, when the TPA device3is in the fully installed position, the stopper35extends further into the hollow portion21and is positioned outside the passage in the hollow portion21into which the female connector enters, so that the mating female connector can further axially (i.e., in X-axis direction) enter into the hollow portion21to form an electrical connection with the electrical contacts within the male connector2. In some embodiments, the stopper35extends in a direction substantially perpendicular to the extension arm34and parallel to the plane of the upper board32. The upper engaging portion322and the stopper35of the TPA device3are located on both sides of the main body of the TPA device3in the X-direction so as not to interfere with each other. Referring toFIG.4B, the upper engaging portion322and the lower engaging portion332do not overlap with each other in the extension direction (i.e., X-direction) of the stopper35, thereby allowing the upper engaging portion322and the lower engaging portion332of these two TPA devices3to engage with the middle positioning groove22bof the three positioning grooves22a,22b, and22csimultaneously when both of the TPA devices3are in the fully installed position. Otherwise, the upper engaging portion322(lower engaging portion332) of the TPA device3in the fully installed position will cause interference with the lower engaging portion (upper engaging portion) of the corresponding TPA device that is installed in a centrally symmetric manner and also in the fully installed position. Further, since the stopper35extends to the side (the negative X-axis direction) beyond the main body, the stopper35, the upper engaging portion322and the lower engaging portion332do not overlap with each other in the extension direction (i.e., X-axis direction) of the stopper35. In some embodiments, as shown inFIG.1, the main board31of the TPA device3may further include a TPA device limiting portion36(the other side is not shown). The TPA device limiting portion36is used for mating with the housing limiting portion26on the housing of the first connector2(the other side is not shown) when the TPA device3is in the fully installed position, thereby limiting the movement of the TPA device3on the plane (X-Z plane) of the main board31. Therefore, the position of the housing limiting portion26in the Y-axis direction should be set to enable at least partially mating with the limiting portion36when the TPA device3is pushed to the end (pushed to the fully installed position). In an exemplary embodiment, the TPA device limiting portion36may be a through hole or a recess, and the housing limiting portion26may be a bump. In another exemplary embodiment, the TPA device limiting portion36may be a bump, and the limiting portion26may be a through hole or a recess. When the TPA device3is in the pre-installed position, the housing limiting portion26and TPA device limiting portion36may be partially (pre)-mated or not be mated. In some embodiments, the main board31may further include a detaching part37. The detaching part37may be a bump extending from the edge of the main board31to provide a force bearing point when detaching the TPA device3from the fully installed position. For example, the upper engaging portion322and the lower engaging portion332can be pushed out from the positioning grooves22a,22b,22cto be released from the locked state by hand or a tool, and then the TPA device3can be pulled out to the pre-installed position by means of the detaching part37. The first connector2has a hollow connector housing20. When the first connector2is a male connector, the connector housing20allows the mating female connector and the male terminal to insert from its both ends. Three positioning grooves22a,22b,22care provided in parallel on an inner side of the upper portion of the connector housing20, and three corresponding positioning grooves are provided in parallel on an inner side of the lower portion. The positioning grooves22a,22b,22cextend to the end edge along the insertion direction (positive X-axis direction) of the female connector. The positioning grooves22a,22b, and22care used for fixing the position of the TPA device3by mating with the upper engaging portion322and the lower engaging portion332described above. The positioning groove22bin the middle is used to implement positioning of the fully installed position. The positioning grooves22a,22con both sides are used to implement positioning of the pre-installed position. The positioning grooves22a,22b,22care provided on the inner side of the connector housing20so as to face the upper engaging portion322and the lower engaging portion332. In some embodiments, the positioning grooves22a,22b,22cmay penetrate the upper portion or lower portion of the housing20where they are located to form slits, as shown inFIG.1. Since only three positioning grooves are required, the main body between the positioning grooves has sufficient thickness, so that the positioning grooves can be designed to extend to the end edge without the concern about strength. As a result, the positioning grooves can be directly formed when the connector housing20is molded without adding additional sliders. On the contrary, if the number of positioning grooves is increased, the thickness of the main body portion between the positioning grooves will be narrowed. In order to ensure the strength of the connector housing20, the positioning grooves have to be shortened as positioning holes, and additional sliders are required for molding in this situation. Therefore, the first connector2of the present embodiment can save the number of sliders during molding. There are openings27communicating with the hollow portion21of the connector housing20on both sides of the housing20, respectively. The opening27communicating with the hollow portion21enables the upper board32, the lower board33, the extension arm34and the stopper35of the TPA device3to enter into the hollow portion21through the opening27. The opening27can also accommodate the main board31of the TPA device3. The housing limiting portion26described above is provided in the opening27. Such sharing design can save space, reduce the volume of the hollow portion21, and ensure the strength of the connector housing20. FIG.3BandFIG.5Bare cross-sectional views along line A-A of the connector assembly3shown inFIG.1, whereinFIG.3Bshows a pre-installed state, andFIG.5Bshows the fully installed state. In the pre-installed state shown inFIG.3B, TPA device3and TPA device3′ are not completely pushed into the first connector2in the lateral direction (Y-axis direction), while the extension arms34enter the hollow portion21through the openings27on both sides of the connector housing20. At this time, the stoppers35,35′ block the passage (in other words, they are within the passage) in the hollow portion21of the first connector2into which the mating connector enters. Therefore, the mating connector is blocked by the stoppers35,35′ so that it cannot further extend into the hollow portion21to form an electrical connection. If the TPA device3and TPA device3′ are further pressed inward such that the respective upper engaging portion322and the lower engaging portion332are respectively mated with the positioning groove22bof the three positioning grooves22a,22b,22cof the connector housing20that is located in the middle, the stoppers35,35′ will extend further into the hollow portion21and are positioned out of the passage (in other words, they leave the passage) in the hollow portion21into which the mating connector enters, so that the mating connector can further axially (i.e., in X-axis direction) enters into the hollow portion21to form an electrical connection with the electrical contacts inside the first connector2, as shown inFIGS.2A and2B. FIGS.6A and6Bare a cross-sectional views of the connector assembly1shown inFIG.1along line B-B, showing a pre-installed state. As shown inFIG.6B, the TPA device3further includes a terminal locking portion38extending substantially perpendicular to the main board31from the inner side of the main board31. In the pre-installed state, the terminal locking portion38is located outside the passage in the hollow portion21into which the male terminal enters, thereby allowing the male terminal to be inserted into the hollow portion21of the first connector2. There is a recess on both sides of the male terminal, which is used for engaging with the terminal locking portion38of the TPA device3in a fully installed state, so that the male terminal cannot be pulled out, thereby ensuring the electrical connection between the male terminal and the female connector4inserted subsequently. If the male terminal is not fully extended into the hollow portion21, the terminal locking portion38of the TPA device3will be blocked as it cannot enter into the recess on both sides of the male terminal. In this situation, the TPA device3cannot be further pushed inward and the female connector on the other side will be blocked by the stopper35. As a result, the electrical connection with the male terminal cannot be formed. Only when the male terminal is pushed into the correct position can the TPA device3be pushed to the end, and then the female connector4can be pushed to the end to complete the electrical connection, thereby realizing the error-proof function of the TPA device3. According to the embodiment, the TPA device3can form a pre-installed positional relationship and a fully installed positional relationship with the first connector2to realize the electrical disconnection and the electrical connection between the male terminal in the first connector and the female terminal in mating connector. The TPA device is not required to be completely detached from the first connector2, and can adopt a rigid design, avoiding the risk of failure due to material yielding. In addition, it will be less possible for the TPA device to be deformed during actual use, so the TPA device can be used repeatedly. In the above, the embodiment of the invention is described by taking the male connector as an example. It should be appreciated that the present invention is not limited by the type of terminal mounted in the connector. Therefore, the present invention is not limited to the TPA device of the male connector, and a similar structure can also be applied to the TPA device of the female connector. The preferred embodiments of the present invention have been described above in detail. However, it should be understood that various embodiments and modifications may be employed in the present invention without departing from its broad spirit and scope. Those skilled in the art can make many modifications and changes according to the concept of the present invention without creative work. Therefore, all those technical schemes that the skilled in the art can obtain through logical analysis, reasoning, or limited experiment on the basis of prior art according to conception of the present invention should be within the protection range determined by the claims of the present invention. While this invention has been described in terms of the preferred embodiments thereof, it is not intended to be so limited, but rather only to the extent set forth in the claims that follow. For example, the above-described embodiments (and/or aspects thereof) may be used in combination with each other. In addition, many modifications may be made to configure a particular situation or material to the teachings of the invention without departing from its scope. Dimensions, types of materials, orientations of the various components, and the number and positions of the various components described herein are intended to define parameters of certain embodiments and are by no means limiting and are merely prototypical embodiments. Many other embodiments and modifications within the spirit and scope of the claims will be apparent to those of skill in the art upon reviewing the above description. The scope of the invention should, therefore, be determined with reference to the following claims, along with the full scope of equivalents to which such claims are entitled. As used herein, ‘one or more’ includes a function being performed by one element, a function being performed by more than one element, e.g., in a distributed fashion, several functions being performed by one element, several functions being performed by several elements, or any combination of the above. It will also be understood that, although the terms first, second, etc. are, in some instances, used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first contact could be termed a second contact, and, similarly, a second contact could be termed a first contact, without departing from the scope of the various described embodiments. The first contact and the second contact are both contacts, but they are not the same contact. The terminology used in the description of the various described embodiments herein is for the purpose of describing embodiments only and is not intended to be limiting. As used in the description of the various described embodiments and the appended claims, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the term “and/or” as used herein refers to and encompasses all possible combinations of one or more of the associated listed items. It will be further understood that the terms “includes,” “including,” “comprises,” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term “if” is, optionally, construed to mean “when” or “upon” or “in response to determining” or “in response to detecting,” depending on the context. Similarly, the phrase “if it is determined” or “if [a stated condition or event] is detected” is, optionally, construed to mean “upon determining” or “in response to determining” or “upon detecting [the stated condition or event]” or “in response to detecting [the stated condition or event],” depending on the context. Additionally, while terms of ordinance or orientation may be used herein these elements should not be limited by these terms. All terms of ordinance or orientation, unless stated otherwise, are used for purposes distinguishing one element from another, and do not denote any order of arrangement, order of operations, direction or orientation unless stated otherwise. | 22,913 |
11942716 | The accompanying drawings include the following reference numerals: 100, insulating housing;102, conductor installation groove;110, first segment;120, second segment;130, slot;131, main opening;132, branch opening;200, conductor;211, first signal conductor;212, first ground conductor;220, second signal conductor;300, member. DETAILED DESCRIPTION The inventors have recognized and appreciated designs for a connector that may he readily configured to operate according to multiple standards. A first version, for example, may support communication at a first data rate such as may be required for a first version of a standard. A second version, which may be economically manufactured using the tooling from which the first version is manufactured, may support communication at a second, higher data rate. Connector versions suitable for use in connection with a PCIe 4.0 or a PCIe 5.0 standard, for example, may be constructed in this way. The electrical connector may include a plurality of conductors held by a housing. Contact tails of the plurality of conductors may extend from a mounting face of the housing therethrough. The mounting face of the housing may include a slot. In some embodiments, the slot may expose portions of ground conductors of the connector and receive a member coupled with the exposed portions of the ground conductors such that the electrical connector can meet high performance requirements. The member may be inserted into or molded in the slot. In some embodiments, the slot may or may not receive a member that is insulative when the electrical connector does not need to meet the high performance requirements. Such a configuration enables the same connector to be compatible with multiple performance protocols. In some embodiments, when the first signal conductors of the electrical connector do not need to transmit high-frequency and high-speed signals, there may be no member arranged in the slot or may be a predetermined member (such as an insulating member) arranged in the slot. When the electrical connector needs to transmit high-frequency and high-speed signals, the slot may receive another predetermined member (such as a conductive plastic member), such that the electrical connector can meet high performance requirements. Accordingly, the insulating housings that meet the two performance requirements may have the same structure, such that the insulating housings may be made with the same mold, which greatly reduces the production costs of electrical connectors. In addition, because the insulating housings of the two electrical connectors have the same structure, there is no need to reserve respective insulating housings for the two electrical connectors during manufacturing, which can reduce the inventory and management costs of the electrical connectors. Based on this, the present electrical connector can be reasonably configured according to an electronic system to which the electrical connector is applied, such that both its cost and performance can meet the needs of users, and the electrical connector has high market competitiveness. In the following description, numerous details are provided to enable a thorough understanding of the present disclosure. However, a person skilled in the art may understand that the following description only exemplarily shows the preferred embodiments of the present disclosure, and the present disclosure may be implemented without one or more such details. In addition, in order to avoid confusion with the present disclosure, some technical features known in the art have not been described in detail. As shown inFIGS.1-5, an electrical connector is provided according to an aspect of the disclosure. The electrical connector may include a card edge connector and the like. The card edge connector may be used to connect an electronic card such as a memory card. In the embodiment shown in the figures, the electrical connector is a plug electrical connector. The plug electrical connector may be inserted into a socket electrical connector, such that signals may be transmitted between multiple electronic devices. In other embodiments not shown in the figures, the electrical connector may also be a socket electrical connector. A plug electrical connector may be inserted into the socket electrical connector, such that signals may be transmitted between multiple electronic devices. The electrical connector may include an insulating housing100and a plurality of conductors200. The plurality of conductors200may be arranged in the insulating housing100. The plurality of conductors200may be spaced apart from one another to ensure that the conductors200are electrically insulated from one another. A front side of the insulating housing100may expose portions of the plurality of conductors200including, for example, front ends of the conductors200. Thus, when the electrical connector is engaged with an adapted electrical connector (not shown), the conductors200may be electrically coupled with conductors in the adapted electrical connector. When the electrical connector is configured as a plug electrical connector, the front ends of the plurality of conductors200protrude from the front side of the insulating housing100so as to be inserted into a socket electrical connector and coupled with conductors therein. When the electrical connector is configured as a socket electrical connector, the front side of the insulating housing100may be provided with a receiving groove, and a side wall of the receiving groove may expose the front ends of the conductors200. The receiving groove may receive an adapted plug electrical connector or receive an adapted electronic card. Thus, optionally, the electrical connector may also be engaged with other electronic device directly, not by means of an adapted electrical connector. A back side of the insulating housing100may expose rear ends of the plurality of conductors200, such that the plurality of conductors200are electrically coupled with conductors on a circuit board (not shown) when the electrical connector is mounted on the circuit board. The plurality of conductors200may be arranged along a longitudinal direction (that is, a length direction of the electrical connector). In the figures, X represents the longitudinal direction: Y represents a transverse direction (that is, a width direction of the electrical connector); and the longitudinal direction X is perpendicular to the transverse direction Y. In some embodiments, the plurality of conductors200may include a plurality of first signal conductors211and a plurality of first ground conductors212. The plurality of first signal conductors211may be interspersed with the plurality of first ground conductors212. In the embodiment shown in the figures, a pair of adjacent first signal conductors211may be used to transmit a differential signal, and adjacent pairs of first signal conductors211may be spaced apart by a first ground conductor212. It should be appreciated that the plurality of first signal conductors211and the plurality of first ground conductors212may be arranged in any other pattern to apply to different types of electrical connectors. The back side of the insulating housing100may be provided with a slot130. The slot130may expose the plurality of first ground conductors212. The slot130may have any suitable shape, as long as it can expose the plurality of first ground conductors212. The slot130is used to receive a member300. The member300will be described in detail below. The plurality of conductors200may be fabricated separately from the insulating housing100, and then mounted in a plurality of conductor installation grooves102in the insulating housing100in one-to-one correspondence, as shown inFIGS.5and7. The signal conductors and the ground conductors may have a substantially uniform size. The plurality of conductor installation grooves102may have a uniform size. In this case, the slat130may also expose the plurality of first signal conductors211. Specifically, a side wall of the slot130may expose each of the plurality of first signal conductors211and the plurality of first ground conductors212. In this way, the structure of the slot130can be simplified as much as possible, for example, the slot130may have a regular shape, such as a rectangle. Thus, the slot130is simple in structure and easy to fabricate. In addition, the plurality of first signal conductors211and the plurality of first ground conductors212may be arranged in any pattern without changing the structure of the insulating housing100. The insulating housing100has strong versatility. This can reduce types of molds to reduce production costs. In some embodiments, as shown inFIGS.6and7, the slot130may include a main opening131and a plurality of branch openings132. The main opening131is of an elongated shape extending along the longitudinal direction X. The plurality of branch openings132extends from a side of the main opening131along the transverse direction Y. Each branch opening132corresponds to a conductor installation groove102. For the slot130to expose the plurality of first signal conductors211and the plurality of first ground conductors212, the plurality of branch openings132may communicate with the plurality of conductor installation grooves102in one-to-one correspondence. The plurality of branch openings132may expose the plurality of first signal conductors211and the plurality of first ground conductors212, respectively. That is, each branch opening132may expose a first signal conductor211or a first ground conductor212. Such arrangement may enable the member300to have a small size, which reduces the material for making the member300and lower the cost of manufacturing the electrical connector. The small opening area of the slot130enable the insulating housing100to have high structural strength without changing the size of the insulating housing100. In some embodiments, the slot130may include an elongated main opening131and a plurality of branch openings131extending from a side of the main opening131along the transverse direction Y. The plurality of branch openings132may expose the plurality of first ground conductors212, respectively. In some embodiments, the plurality of first signal conductors211are not exposed. In some embodiments, the member may be electrically coupled with the plurality of first ground conductors212. The member may be in any suitable types that have been known in the art or may appear in the future, as long as they can be electrically coupled with the plurality of first ground conductors212. After the plurality of first ground conductors212are electrically coupled with the member, signals transmitted by the electrical connector are tested. The inventors find that the electrical connector is more stable when transmitting the signals at a high frequency and a high speed, and can better meet users' requirements. In some embodiments, the member may be made of a lossy material. Any suitable lossy material may be used for these and other structures that are “lossy.” Materials that conduct, but with some loss, or material which by another physical mechanism absorbs electromagnetic energy over the frequency range of interest are referred to herein generally as “lossy” materials. Electrically lossy materials can be formed from lossy dielectric and/or poorly conductive and/or lossy magnetic materials. Magnetically lossy material can be formed, for example, from materials traditionally regarded as ferromagnetic materials, such as those that have a magnetic loss tangent greater than approximately 0.05 in the frequency range of interest. The “magnetic loss tangent” is the ratio of the imaginary part to the real part of the complex electrical permeability of the material. Practical lossy magnetic materials or mixtures containing lossy magnetic materials may also exhibit useful amounts of dielectric loss or conductive loss effects over portions of the frequency range of interest. Electrically lossy material can be formed from material traditionally regarded as dielectric materials, such as those that have an electric loss tangent greater than approximately 0.05 in the frequency range of interest. The “electric loss tangent” is the ratio of the imaginary part to the real part of the complex electrical permittivity of the material. Electrically lossy materials can also be formed from materials that are generally thought of as conductors, but are either relatively poor conductors over the frequency range of interest, contain conductive particles or regions that are sufficiently dispersed that they do not provide high conductivity or otherwise are prepared with properties that lead to a relatively weak bulk conductivity compared to a good conductor such as copper over the frequency range of interest. Electrically lossy materials typically have a bulk conductivity of about 1 Siemen/meter to about 10,000 Siemens/meter and preferably about 1 Siemen/meter to about 5,000 Siemens/meter. In some embodiments, material with a bulk conductivity of between about 10 Siemens/meter and about 200 Siemens/meter may he used. As a specific example, material with a conductivity of about 50 Siemens/meter may be used. However, it should be appreciated that the conductivity of the material may be selected empirically or through electrical simulation using known simulation tools to determine a suitable conductivity that provides a suitably low crosstalk with a suitably low signal path attenuation or insertion loss. Electrically lossy materials may be partially conductive materials, such as those that have a surface resistivity between 1Ω/square and 100,000Ω/square. In some embodiments, the electrically lossy material has a surface resistivity between 10Ω/square and 1000Ω/square. As a specific example, the material may have a surface resistivity of between about 20Ω/square and 80Ω/square. In some embodiments, electrically lossy material is formed by adding to a binder a filler that contains conductive particles. In such an embodiment, a lossy member may be formed by molding or otherwise shaping the binder with filler into a desired form. Examples of conductive particles that may be used as a tiller to form an electrically lossy material include carbon or graphite formed as fibers, flakes, nanoparticles, or other types of particles. Metal in the form of powder, flakes, fibers or other particles may also be used to provide suitable electrically lossy properties. Alternatively, combinations of fillers may be used. For example, metal plated carbon particles may be used. Silver and nickel are suitable metal plating for fibers. Coated particles may be used alone or in combination with other fillers, such as carbon flake. The binder or matrix may be any material that will set, cure, or can otherwise be used to position the filler material. In some embodiments, the binder may be a thermoplastic material traditionally used in the manufacture of electrical connectors to facilitate the molding of the electrically lossy material into the desired shapes and locations as part of the manufacture of the electrical connector. Examples of such materials include liquid crystal polymer (LCP) and nylon. However, many alternative forms of binder materials may be used. Curable materials, such as epoxies, may serve as a binder. Alternatively, materials such as thermosetting resins or adhesives may be used. Also, while the above-described binder materials may be used to create an electrically lossy material by forming a binder around conducting particle fillers, the invention is not so limited. For example, conducting particles may be impregnated into a formed matrix material or may be coated onto a formed matrix material, such as by applying a conductive coating to a plastic component or a metal component. As used herein, the term “binder” encompasses a material that encapsulates the filler, is impregnated with the filler or otherwise serves as a substrate to hold the filler. In some embodiments, the fillers will be present in a sufficient volume percentage to allow conducting paths to be created from particle to particle. For example, when metal fiber is used, the fiber may be present in about 3% to 40% by volume. The amount of filler may impact the conducting properties of the material. Filled materials may be purchased commercially, such as materials sold under the trade name Celestran® by Celanese Corporation which can be filled with carbon fibers or stainless steel filaments. A lossy material, such as lossy conductive carbon filled adhesive preform, such as those sold by Techfilm of Billerica, Mass., US may also be used. This preform can include an epoxy binder filled with carbon fibers and/or other carbon particles. The binder surrounds carbon particles, which act as a reinforcement for the preform. Such a preform may be inserted in a connector wafer to form all or part of the housing. In some embodiments, the preform may adhere through the adhesive in the preform, which may be cured in a heat treating process. In some embodiments, the adhesive may take the form of a separate conductive or non-conductive adhesive layer. In some embodiments, the adhesive in the preform alternatively or additionally may be used to secure one or more conductive elements, such as foil strips, to the lossy material. Various forms of reinforcing fiber, in woven or non-woven form, coated or non-coated may be used. Non-woven carbon fiber is one suitable material. Other suitable materials, such as custom blends as sold by RTP Company, can be employed, as the present disclosure is not limited in this respect. In some embodiments, a lossy portion may be manufactured by stamping a preform or sheet of lossy material. For example, a lossy portion may be formed by stamping a preform as described above with an appropriate pattern of openings. However, other materials may be used instead of or in addition to such a preform. A sheet of ferromagnetic material, for example, may be used. However, lossy portions also may be formed in other ways. In some embodiments, a lossy portion may be termed by interleaving layers of lossy and conductive material such as metal foil. These layers may be rigidly attached to one another, such as through the use of epoxy or other adhesive, or may be held together in any other suitable way. The layers may be of the desired shape before being secured to one another or may be stamped or otherwise shaped after they are held together. As a further alternative, lossy portions may be formed by plating plastic or other insulative material with a lossy coating, such as a diffuse metal coating. The member may effectively suppress resonance in the ground conductors, which may interfere with signals. Suppressing resonance can improve signal integrity. The electrical connector using the conductive plastic member may improve the integrity of high-frequency signals, and the signals are hardly distorted when passing through the electrical connector, such that an electronic system using the electrical connector can have higher operational stability. The electrical connector using the conductive plastic member may meet the requirements of PCI GEN 5 (Peripheral Component Interconnect Generation 5) for performance. In some embodiments, the member may be made of an insulating material. The member may abut against the plurality of first ground conductors212. The member may be in various types that have been known in the art or may appear in the future, as long as insulation can be created among the plurality of first ground conductors212abutted against the insulating member. On some embodiments, the member may be made of the same material as the insulating housing100. This can reduce the types of materials for the electrical connector and reduce the difficulty of manufacturing. The electrical connector using the member may meet the requirements of PCI GEN 4 (Peripheral Component Interconnect Generation 4) for performance. For example, if the performance of the PCI GEN 5 is not required, the member of the insulating material may be mounted in the slot130of the insulating housing100, or no member is mounted therein. In some embodiments, when the first signal conductors211of the electrical connector do not need to transmit high-frequency and high-speed signals, there may be no member300arranged in the slot130or may be a predetermined member300(such as an insulating member) arranged in the slot130. In some embodiments, when the electrical connector needs to transmit high-frequency and high-speed signals, the slot130may receive another predetermined member300(e.g., a conductive plastic member), such that the electrical connector can meet high performance requirements. Accordingly, the insulating housings100that meet the two performance requirements may have the same structure, such that the insulating housings100may be made with the same mold, which greatly reduces the production costs of electrical connectors. In addition, because the insulating housings100of the two electrical connectors have the same structure, there is no need to reserve respective insulating housings for the two electrical connectors during manufacturing, which can reduce the inventory and management costs of the electrical connectors. Based on this, the present electrical connector can be reasonably configured according to an electronic system to which the electrical connector is applied, such that both its cost and performance can meet the needs of users, and the electrical connector has high market competitiveness. It could be appreciated that when there is no need to transmit high-frequency and high-speed signals by the electrical connector, the insulating housing100may not be provided with the slot130. Then, the cost of the electrical connector may be further lowered. Of course, in a case where the cost and other factors are not considered, even if the electrical connector is not used to transmit high-frequency and high-speed signals, the slot130may also be provided, and the conductive plastic member is arranged in the slot130. In some embodiments, the plurality of conductors200may be not uniformly arranged at equal intervals along their entire longitudinal direction. As required by physical structure, data transmission and the like of an electrical connector, the plurality of conductors200may be divided into several piles along the longitudinal direction X of the electrical connector, and each pile is referred to as a segment herein. There are conductors200arranged in each segment, and in each segment, these conductors may be substantially uniformly arranged at equal intervals along the longitudinal direction. The conductor spacing between the adjacent segments may be relatively larger. Exemplarily, as shown inFIGS.1-5, the insulating housing100may have a first segment110and a second segment120. The first segment110and the second segment120may be spaced apart along the longitudinal direction X. The longitudinal dimensions of the first segment110and the second segment120may be the same or different. In the embodiment shown in the figures, the longitudinal dimension of the first segment110is greater than the longitudinal dimension of the second segment120. In other embodiments not shown, the longitudinal dimension of the first segment110may be equal to or smaller than the longitudinal dimension of the second segment120. Further, the numbers of the first segment(s)110and the second segment(s)120are not limited to those shown in the figures. The plurality of first signal conductors211, the plurality of first ground conductors212and the slot130may be located in the first segment110. The plurality of conductors200may also include a plurality of second signal conductors220. The plurality of second signal conductors220and the plurality of first signal conductors211may be the same or different. The plurality of second signal conductors220may be located in the second segment120. With this arrangement, the first signal conductors211in the first segment110may be used to transmit high-frequency and high-speed signals. The second signal conductors220in the second segment120may be used to transmit signals having low requirements for transmission rate and frequency. Therefore, when multiple kinds of signals need to be transmitted, the electrical connector may be configured to meet performance requirements and lower costs, such that the market competitiveness of the electrical connector is further improved. It should be appreciated that the electrical connector may not include the second segment120but includes one or more first segments110, when the electrical connector only needs to transmit high-frequency and high-speed signals. In some embodiments, as shown inFIGS.4and5, the plurality of conductors200may be arranged in two columns extending along the longitudinal direction X. The two columns may be separated along the transverse direction Y. The slot130may be located between the two columns along the transverse direction Y. Referring toFIG.5, the two columns may be offset from each other by a predetermined distance d along the longitudinal direction X. It is found by the inventors that the transmission performance of the electrical connector can be improved when the two columns of conductors200are offset from each other certain distance along the longitudinal direction X. Further, as shown inFIG.5, the predetermined distance d may be substantially equal to half of the spacing P between the longitudinally adjacent conductors in the first segment110. This spacing P may also be referred to as a pitch. As a result, the transmission performance of the electrical connector is better. According to another aspect of the disclosure, an electrical connector is further provided. The electrical connector may include an insulating housing100, a plurality of conductors200, and a conductive plastic member. The insulating housing100may have a first segment110and a second segment120. The first segment110and the second segment120may be spaced apart along a longitudinal direction X. The plurality of conductors200may be arranged in the insulating housing100. The plurality of conductors200may be arranged along the longitudinal direction X. The plurality of conductors200may include a plurality of first signal conductors211, a plurality of first ground conductors212, and a plurality of second signal conductors220. The plurality of first signal conductors211and the plurality of first ground conductors may be located in the first segment110. The plurality of second signal conductors220may be located in the second segment120. A front side of the insulating housing100exposes the plurality of conductors200. The conductive plastic member may be arranged in the first segment110. The conductive plastic member may be electrically coupled with the plurality of first ground conductors212. Thus, an electronic system using the electrical connector is more stable when transmitting high-frequency and high-speed signals, and can better meet needs of users. Moreover, for electronic systems having different signal transmission requirements, the electrical connector can be reasonably configured to meet performance requirements and lower costs, such that the market competitiveness of the electrical connector is improved. In some embodiments, the insulating housing100may be provided with a slot130as described above, and the conductive plastic member is mounted in the insulating housing100by mounting into the slot130. In some embodiments, the conductive plastic member may be embedded inside the insulating housing100, not exposed. For example, the conductive plastic member may be formed in the insulating housing100by means of injection molding. It should be appreciated that the disclosure does not limit the processing and installation means of the conductive plastic member. Therefore, the present disclosure has been described in way of the above several embodiments. It should be understood that a person skilled in the art can make more variations, modifications and improvements based on the teachings of the present disclosure, and these variations, modifications and improvements shall fall within the spirit and the protection scope of the present disclosure. The protection scope of the present disclosure is defined by the appended claims and their equivalent scopes. The foregoing embodiments are only for the purpose of illustration and description, and are not intended to limit the present disclosure to the scope of the described embodiments. Various changes may be made to the illustrative structures shown and described herein. For example, the electrical connector may be any suitable electrical connector, such as card edge connecter, backplane connector, daughter card connector, stacking connector, Mezzanine connector, I/O connector, chip socket, Gen Z connector, etc. The principle of the present disclosure can be adopted, when these connectors are used to transmit signals. Furthermore, although many inventive aspects are shown and described with reference to a vertical connector, it should be appreciated that aspects of the present disclosure is not limited in this regard. As mentioned, any of the inventive concepts, whether alone or in combination with one or more other inventive concepts, may be used in other types of electrical connectors, such as right angle connectors, coplanar electrical connectors, etc. In the description of the present disclosure, it needs to be understood that the orientation or positional relationship indicated by the orientation terms such as “front”, “rear”, “upper”, “lower”, “left”, “right”, “transverse”, “vertical”, “perpendicular”, “horizontal”, “top”, “bottom”, etc. is usually based on the orientation shown in the drawings, and is only for the convenience of describing the present disclosure and simplifying the description. These orientation terms do not indicate or imply that the device or element has to have a specific orientation or be constructed and operated in a specific orientation, except as otherwise noted. Therefore, they cannot be understood as a limitation on the scope of the present disclosure, The orientation terms, “inside” and “outside”, refer to the inside and outside relative to the contour of each component itself. For ease of description, spatial terms, such as “above”, “on”, etc., can be used herein to describe the spatial relationship between one or more components or features shown in the drawings and other components or features. It should be understood that the spatial terms not only include the orientation of the components shown in the drawings, but also include other orientations in use or operation. For example, if the components in the drawings are inverted as a whole, a component “above other components or features” becomes to the component “below other a components or structures”. Thus, the exemplary term “above” can include both orientations “above” and “below”. In addition, these components or features can also be positioned at other different angles (for example, rotated by 90 degrees or other angles), and this disclosure intends to cover all of these situations. It should be noted that the terms used herein are only for describing specific implementations, and are not intended to limit to the exemplary implementations according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form, In addition, the use of “including”, “comprising”, “haying”, “containing”, or “involving”, and variations thereof herein, is meant to encompass the items listed thereafter (or equivalents thereof) and/or as additional items. It should be noted that the terms “first” and “second” in the description, the claims and the drawings of the application are used to distinguish similar objects, and are not necessarily used to describe a specific sequence. It should be understood that numbers used in this way can be interchanged under appropriate circumstances such that the embodiments of the present disclosure described herein can be implemented in a sequence other than those illustrated or described herein. | 32,355 |
11942717 | DESCRIPTION OF THE EMBODIMENTS FIG.1is a schematic perspective view of a connection port module according to a first embodiment of the disclosure.FIG.2is a front view of the connection port module ofFIG.1.FIG.3is an exploded view of the connection port module ofFIG.1. With reference toFIG.1,FIG.2, andFIG.3, a connection port module100of this embodiment is configured to be mounted on portable electronic devices such as smart phones, tablet computers, or notebook computers. The connection port module100includes a fixed frame110and a connection port120. The connection port120is connected to the fixed frame110, for example, by assembly. In other words, the connection port120and the fixed frame110are a two-piece structure, and the connection port120is adapted to be assembled on the fixed frame110. In other embodiments, the connection port is integrally connected to the fixed frame. In other words, the connection port and the fixed frame are an integrally formed one-piece. In this embodiment, the fixed frame110includes a main body portion111, a first holding portion112, a second holding portion113, and a notch114. The first holding portion112is connected to one side of the main body portion111, and the second holding portion113is connected to the other side of the main body portion111. In other words, the first holding portion112and the second holding portion113are respectively connected to opposite sides of the main body portion111. The first holding portion112includes a first holding surface112a, the second holding portion113includes a second holding surface113a, and the first holding surface112afaces the second holding surface113a. The notch114is located between the first holding surface112aof the first holding portion112and the second holding surface113aof the second holding portion113. The connection port120is disposed in the fixed frame110and located in the notch114, and the connection port120is located between the first holding surface112aand the second holding surface113a, such that the notch114of the fixed frame110exposes opposite surfaces of the connection port120. An external connector50is adapted to be inserted into the connection port120. In addition, when the connector50is inserted into the connection port120, the first holding surface112aand the second holding surface113aare adapted to abut against opposite sides of the connector50to fix the connector50on the fixed frame110. Accordingly, in the connection port module100, since the connector50can be fixed through the first holding portion112and the second holding portion113located on the opposite sides of the main body portion111, it is possible to not only firmly fix the external connector50, but also achieve a relatively small thickness at the same time, helping the thinning of the portable electronic device to which the connection port module100is applied. FIG.4A,FIG.4B, andFIG.4Care schematic views showing engagement of the connection port module ofFIG.1. With reference toFIG.1,FIG.4A,FIG.4B, andFIG.4C, the first holding surface112aand the second holding surface113aare adapted to abut against four corners of the connector50. In this embodiment, the first holding surface112aand the second holding surface113aare each a curved surface. The four corners of the connector50are each a curved surface. In addition, the four corners of the connector50are adapted to abut against the curved surface of the first holding surface112aand the curved surface of the second holding surface113a. When a curvature R1of the first holding surface112aand the second holding surface113ais the same as a curvature R2of the four corners of the connector50as shown inFIG.4A, projections of centers of circle of the first holding surface112aand the second holding surface113aand projections of corresponding centers of circles of the four corners of the connector50on a virtual plane are overlapped with each other. When the curvature R1of the first holding surface112aand the second holding surface113ais greater than the curvature R2of the four corners of the connector50as shown inFIG.4Bor is less than the curvature R2of the four corners of the connector50as shown inFIG.4C, projections of the centers of circle of the first holding surface112aand the second holding surface113aand the projections of the corresponding centers of circle of the four corners on the virtual plane are non-overlapped with each other. With reference toFIG.1,FIG.2, andFIG.3, the connection port module100further includes a plurality of first conductive members130and a plurality of second conductive members140. The first conductive members130are connected to the connection port120. The second conductive members140are respectively disposed on and pass through the first holding portion112and the second holding portion113. The second conductive members140are connected to the first conductive members130, such that the connection port120is electrically connected to the portable electronic device to which the connection port120is applied through the first conductive members130and the second conductive members140. In this embodiment, the second conductive members140disposed on the first holding portion112are flush with a first outer surface112bof the first holding portion112, and the second conductive members140disposed on the second holding portion113are flush with a second outer surface113bof the second holding portion113. In other embodiments, the second conductive members disposed on the first holding portion protrude from the first outer surface of the first holding portion, and the second conductive members disposed on the second holding portion protrude from the second outer surface of the second holding portion. In this embodiment, each second conductive member140includes a front end141and a rear end142opposite to the front end141. The front end141disposed on the first holding portion112passes through and protrudes from the first holding surface112a, and the front end141disposed on the second holding portion113passes through and protrudes from the second holding surface113a. The rear end142disposed on the first holding portion112and the rear end142disposed on the second holding portion113pass through the fixed frame110and are connected to the first conductive members130. FIG.5is a schematic view of a connection port module according to a second embodiment of the disclosure.FIG.6A,FIG.6B, andFIG.6Care schematic views of a concave-convex structure according to other embodiments of the disclosure. With reference toFIG.5, in a connection port module200ofFIG.5, a first holding surface212aand a second holding surface213aeach include a concave-convex structure215.FIG.6A,FIG.6B, andFIG.6Cshow the concave-convex structures215of other embodiments. FIG.7is a schematic view of a connection port module according to a third embodiment of the disclosure. With reference toFIG.7, in a connection port module300of this embodiment, a first holding surface312aand a second holding surface313aeach include a planar region316and two inclined regions317. The two inclined regions317are located on opposite sides of the corresponding planar region316. The two inclined regions317of the first holding surface312aand the two inclined regions317of the second holding surface313aare adapted to abut against four corners of a connector. FIG.8is a schematic view of a connection port module according to a fourth embodiment of the disclosure. With reference toFIG.8, in a connection port module400of this embodiment, a first holding surface412aand a second holding surface413aeach include a planar region416and two curved regions418protruding toward a main body portion411. The two curved regions418are located on opposite sides of the planar region416. The two curved regions418of the first holding surface412aand the two curved regions418of the second holding surface413aare adapted to abut against four corners of a connector. FIG.9is a schematic view of a connection port module according to a fifth embodiment of the disclosure. With reference toFIG.9, in a connection port module500of this embodiment, a fixed frame510includes an insertion inlet519opposite to a main body portion511. The shortest distance between a first holding surface512aand a second holding surface513ais gradually reduced from the insertion inlet519toward the main body portion511. Accordingly, as the connector50is inserted into the connection port module500, a first holding portion512and a second holding portion513provide a gradually increased clamping force. In other words, as shown inFIG.9, the shortest distance between the first holding surface and the second holding surface of the embodiments shown inFIG.2,FIG.5,FIG.7, andFIG.8may also be gradually reduced from the insertion inlet toward the main body portion. FIG.10AandFIG.10Bare schematic views of a connection port module according to a sixth embodiment of the disclosure. With reference toFIG.10AandFIG.10B, a connection port module600further includes a plurality of fixed engagement protrusions650to reinforce the structural strength of the assembly of the connection port module600to the portable electronic device10, thereby preventing the connection port module600from falling or being detached from the portable electronic device10on which the connection port module600is mounted because of multiple times of insertions and removals of the connector. The fixed engagement protrusions650are respectively disposed on a first holding portion612and a second holding portion613, and the fixed engagement protrusions650respectively protrude from the first holding portion612and the second holding portion613. In particular,FIG.10Bschematically shows the fixed engagement protrusion650on a single upper side, but the position and quantity of the fixed engagement protrusions650are not limited by the disclosure, but should be determined as required. In other embodiments, the fixed engagement protrusion650may only be disposed on a single lower side. In other embodiments, the fixed engagement protrusion650may be disposed on both the upper and lower sides at the same time. FIG.11is a schematic view of a connection port module according to a seventh embodiment of the disclosure.FIG.12AandFIG.12Bare schematic views of a connection port module according to an eighth embodiment of the disclosure.FIG.13is a schematic view of a connection port module according to a ninth embodiment of the disclosure. With reference toFIG.11,FIG.12A, andFIG.12B, these views show the fixed engagement protrusions650of other embodiments. In other words, as shown inFIG.10A,FIG.10B,FIG.11,FIG.12A, andFIG.12B, the first holding portion and the second holding portion of the embodiments shown inFIG.2,FIG.5,FIG.7, andFIG.8may also be provided with fixed engagement protrusions. In summary of the foregoing, in the connection port module of the disclosure, the fixed frame includes the main body portion, the first holding portion, and the second holding portion. The first holding portion and the second holding portion are respectively connected to opposite sides of the main body portion. The first holding portion includes the first holding surface. The second holding portion includes the second holding surface. The first holding surface faces the second holding surface. The connection port is disposed in the fixed frame, and is located between the first holding surface and the second holding surface. A connector is adapted to be inserted into the connection port. The first holding surface and the second holding surface are adapted to abut against the connector to fix the connector on the fixed frame. Accordingly, in the connection port module, since the connector can be fixed through the first holding portion and the second holding portion located on the opposite sides of the main body portion, it is possible to not only firmly fix the external connector, but also achieve a relatively small thickness at the same time, helping the thinning of the portable electronic device to which the connection port module is applied. It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed embodiments without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the disclosure covers modifications and variations provided that they fall within the scope of the following claims and their equivalents. | 12,460 |
11942718 | REFERENCE NUMERALS INCLUDE first electrical wire1, second electrical wire2, male connector3, first assembly part31, first assembling portion311, first connecting portion312, first cylindrical portion313, first clamping portion314, accommodating chamber315, limiting hole316, first locating slot317, annular clamping portion318, second assembly part32, first buckling position321, first conductive terminal group33, plugging end331, first conductive terminal332, second conductive terminal333, first pointed convex portion334, first cavity34, first sealing member35, first protective shell36, first annular platform portion361, second protrusion362, first protrusion37, female connector4, third assembly part41, second assembling portion411, second connecting portion412, second cylindrical portion413, second clamping portion414, mounting portion415, mounting hole416, locking thread417, second locating slot418, fourth assembly part42, second buckling position422, second conductive terminal43, contact end431, third conductive terminal432, fourth conductive terminal433, second pointed convex portion434, second cavity44, second sealing member45, second protective shell46, second annular platform portion461, fourth protrusion462, third protrusion47, locking nut5, third annular platform portion51, wire slot6, first waterproof ring7, second waterproof ring8, locating block9, third locating slot10, and a sealing ring11. DETAILED DESCRIPTION OF THE EMBODIMENTS The present disclosure is described in detail below in combination ofFIG.1-FIG.13. The present disclosure provides an assembled type waterproof male and female plug for string light connection, including a first electrical wire1and a second electrical wire2. The electrical wires are double-core wires. The first electrical wire1is provided with a male connector3. The second electrical wire2is provided with a female connector4. The male connector3and the female connector4can be plugged to each other. The male connector3includes a first assembly part31and a second assembly part32. The first assembly part31is provided with a first conductive terminal group33. The first conductive terminal group33is provided with at least two plugging ends331for connecting the female connector4. The first assembly part31and the second assembly part32are spliced with each other to form a first cavity34. The first electrical wire1extends into the first cavity34. The first electrical wire1is electrically connected to the first conductive terminal group33. The female connector4includes a third assembly part41and a fourth assembly part42. The third assembly part41is provided with a second conductive terminal group43. The second conductive terminal group43is provided with contact ends431electrically connected to the plugging ends331. The third assembly part41and the fourth assembly part42are spliced with each other to form a second cavity44. The second electrical wire2extends into the second cavity44. The second electrical wire2is electrically connected with the second conductive terminal group43. The present disclosure is mainly applied to connection between string lights. Steps for assembling the male connector3includes: electrically connecting the first electrical wire1to the first conductive terminal group33inside the first assembly part31, and then splicing the second assembly part32and the first assembly part31to complete the assembling. Steps for assembling the female connector4includes: electrically connecting the second electrical wire2to the second conductive terminal group43inside the third assembly part41, and then splicing the fourth assembly42and the third assembly part41to complete the assembling. The male connector3and the female connector4can be plugged to each other for use after assembling. In order to further improve the stability of assembling, wire slots6are formed inside the second assembly part32and the fourth assembly part42, and are used for placing the electrical wires to prevent the wires from moving in a use process. Compared with a traditional male and female plug, the present disclosure has the following advantages: 1. The male and female plug is of an assembled type structure, so that it is not necessary to use specific injection molding equipment to produce male and female plugs, which simplifies the production flow and effectively reduces the production cost. 2. The male and female plug is high in waterproof performance, which greatly improves the safety and stability of a product. 3. The male and female plug is simple in structure and high in assembling efficiency, can be assembled manually or automatically on a large scale, without being limited by environments, and is more convenient to use. Preferably, first sealing members35are arranged at end portions of the first assembly part31and the second assembly part32. The first sealing members35can prevent external water from entering the first assembly part31and the second assembly part32, to overall improve the waterproof performance of the male connector3. During assembling, the first sealing members35are first sleeved into a wire. The first sealing members35are sleeved after the first assembly part31and the second assembly32are assembled. On the other hand, a first protective shell36further sleeves the first assembly part31and the second assembly part32. A first annular platform portion361for fixing the first sealing members35is arranged at a bottom of the first protective shell36. After the first sealing members35assembled, the first protective shell is sleeved from one ends of the first sealing members35. The first annular platform portion361resists against the first sealing members35. Therefore, the first protective shell36further has a function of fixing the first sealing members35. In this technical solution, a plurality of first protrusions37are arranged outside each of the first assembly part31and the second assembly part32. A plurality of second protrusions362are arranged inside the first protective shell36. The first protrusions37and the second protrusions362are clamped to each other. The first protective shell36is connected to the first assembly part31and the second assembly part32in a clamped manner, so that the structure is simple and the assembling is convenient. As another embodiment, second sealing members45are arranged at end portions of the third assembly part41and the fourth assembly part42. A second protective shell46further sleeves the third assembly part41and the fourth assembly part42. A second annular platform portion461for fixing the second sealing members45is arranged at a bottom of the second protective shell46. The function of the second sealing members45is the same as the function of the first sealing members35, and the function of the second protective shell46is also the same as the function of the first protective shell36. On the other hand, a plurality of third protrusions47are arranged outside each of the third assembly part41and the fourth assembly part42. A plurality of fourth protrusions462are arranged inside the second protective shell46. The third protrusions47and the fourth protrusions462are clamped to each other. The second protective shell46is connected to the third assembly part41and the fourth assembly part42in a clamped manner, so that the structure is simple and the assembling is convenient. In the present disclosure, the first assembly part31includes a first assembling portion311, a first connecting portion312and a first cylindrical portion313which are connected in sequence. First clamping portions314are arranged on two sides of the first assembling portion311. The second assembly part32is provided with first buckling portions321clamped to the first clamping portions314. During assembling, the first buckling positions321on the second assembly part32are aligned with the first clamping portions314and are pushed forward from an end of the first assembling portion311. The first assembly part31and the second assembly part32are spliced, so that the structure is simple, and the assembling is convenient. The first cylindrical portion313is provided with an accommodating chamber315. Limiting holes316for mounting the plugging ends331are formed inside the accommodating chamber315. The limiting holes316are used for limiting positions of the plugging ends331, to realize a locating function. In this technical solution, a first waterproof ring7is arranged between the first assembling portion311and the first connecting portion312. The second assembly part32is only matched with the first assembling portion311. After assembling, there may be a space between the position of the second assembly part32and the position of the first connecting portion312. Therefore, the inventor has designed the first waterproof ring7here to prevent water from entering the first cavity34, to prolong the service life of a product. As one embodiment, the first conductive terminal group33includes a first conductive terminal332and a second conductive terminal333. One end of each of the first conductive terminal332and the second conductive terminal333is provided with a first pointed convex portion334for being electrically connected to the first electrical wire1. The first pointed convex portion334is arranged at the first assembly part311. In order to better locate the first pointed convex portions334, first locating slots317for locating the first pointed convex portions334are arranged inside the first assembling portion311. In this technical solution, the first pointed convex portion334of the first conductive terminal332punctures through one core of the first electrical wire1and is used as a positive electrode of a loop. The first pointed convex portion334of the second conductive terminal333punctures through the other core of the first electrical wire1and is used as a negative electrode of the loop, to ensure that a circuit can be used normally. Plugging ends331are arranged at the other ends of the first conductive terminal332and the second conductive terminal333. The plugging ends331pass through the first connecting portion312and are mounted in the limiting holes316. As mentioned above, the plugging end331of the first conductive terminal332is used as a positive electrode, and the plugging end331of the second conductive terminal333is used as a negative electrode. In this technical solution, the third assembly part41includes a second assembling portion411, a second connecting portion412and a second cylindrical portion413which are connected in sequence. Second clamping portions414are arranged on two sides of the second assembling portion411. The fourth assembly part42is provided with second buckling portions422clamped to the second clamping portions414. During assembling, the second buckling positions422on the fourth assembly part42are aligned with the second clamping portions414and are pushed forward from an end of the second assembling portion411. The third assembly part41and the fourth assembly part42are spliced, so that the structure is simple, and the assembling is convenient. The second cylindrical portion413is internally provided with a mounting portion415matched with the accommodating chamber315. Mounting holes416for mounting the plugging ends431are formed in the mounting portion415. When the female connector4and the male connector3are plugged to each other, the entire first cylindrical portion313is plugged into the second cylindrical portion413, and the entire mounting portion415of the second cylindrical portion413is plugged into the accommodating chamber315of the first cylindrical portion313. The two plugging ends331are respectively plugged to the mounting holes416, and finally the plugging ends331are electrically connected to the contact ends431, to turn on the circuit. Similarly, a second waterproof ring8is arranged between the second assembling portion411and the second connecting portion412. The fourth assembly part42is only matched with the second assembling portion411. After assembling, there may be a space between the position of the fourth assembly part42and the position of the second connecting portion412. Therefore, the inventor has designed the second waterproof ring8here to prevent water from entering the second cavity44, to prolong the service life of a product. As another embodiment, the second conductive terminal group43includes a third conductive terminal432and a fourth conductive terminal433. One end of each of the third conductive terminal432and the fourth conductive terminal433is provided with a second pointed convex portion434for being electrically connected to the second electrical wire2. The second pointed convex portion434is arranged at the second assembly part411. Second locating slots418for mounting the second pointed convex portions434are correspondingly arranged inside the second assembling portion411. The other end of each of the third conductive terminal432and the fourth conductive terminal433is provided with each contact end431. The contact ends431pass through the second connecting portion412and are mounted in the mounting holes416. After the male connector3and the female connector4are plugged, the plugging ends331of the male connector3and the contact ends431of the female connector4resist against each other to form an electrical loop. Because a circuit needs to strictly distinguish positive and negative electrodes, the inventor has designed a locating block9inside the containment chamber315. The mounting portion415of the second cylindrical portion413is correspondingly provided with third locating slots10. When the male connector3and the female connector4are plugged, the locating block9can be used to quickly distinguish the positive and negative electrodes of the circuit, to prevent a short circuit caused by reverse connection of the positive and negative electrodes. Preferably, the assembled waterproof male and female plug for lamp string connection further includes a locking nut5for fixedly connecting the male connector3to the female connector4. A locking thread417is formed outside the second cylindrical portion413. The locking thread417is in threaded connection with the locking nut5. One end of the locking nut5is provided with a third annular platform portion51. When in use, after the male connector3is connected to the female connector4, the locking nut5is sleeved from one end of the male connector3, so that the third annular platform portion51resists against the annular clamping portion318arranged outside the first connecting portion312, and finally the locking nut5is in threaded connection with the locking thread417on the second cylindrical portion413, to further strengthen the connection between the male connector3and the female connector4. At the same time, in order to further improve the waterproof function of the male and female plug, a sealing ring11is arranged between the first cylindrical portion313and the first connecting portion312. The above contents are only preferred embodiments of the present disclosure. Those of ordinary skill in the art can make changes to the specific implementations and application scopes according to the idea of the present disclosure, and the contents of this specification shall not be understood as restrictions to the present disclosure. | 15,316 |
11942719 | DETAILED DESCRIPTION OF INVENTION The drive to reduce overall lifecycle costs, both capital expenditure (CAPEX) and operational expenditure (OPEX), associated with new deep-water oil and gas developments means that improvements to existing designs, manufacturing processes and operation are desirable. Subsea connector systems are desired that have a lower cost, can be relatively quickly and easily installed and that have reduced maintenance requirements, or need for intervention which affects the systems to which they are connected throughout their working life. Thus, connectors which continue to perform without degradation, over a longer period of time, are desirable. Typically, connectors for different applications may be single or multi-way connectors. For example, a 4-way connector may be used for delivering power, or a 12-way connector for data transfer via a suitable subsea instrumentation interface standard. This may be level1, for analogue devices, level2for digital serial devices, e.g CANopen, or level3. using Ethernet TCP/IP. Other data connectors, include optical fibre connectors. Wet mateable controls connectors typically have large numbers of thin conductor pins, in order that multiple control signals to different parts of a product can be included in a single control cable. For example, multiple subsea sensors on different pieces of equipment, such as flow sensors, temperature sensors, or pressure sensors each need to have a separate communication path, so that they can be interrogated, monitored and if necessary actuators can be energised, for example to open or close a valve, or to start or stop a pump. Power transmission may be required for the purpose of supplying power to subsea equipment to enable it to operate, for example to close a valve, or drive a pump. Wet mateable power connectors may have a single pin and socket arrangement, or may be multi-way connectors, but typically with fewer, larger, pins than a control or communications connector. In a subsea wetmate connector comprising a plug and a receptacle in which the receptacle is mounted to already installed equipment or cable, the mating is typically carried out by an ROV or diver, subsea, bringing the plug into contact with the receptacle. With many connector options, such as ROV, diver, or stab wet mateable connectors, each with variations in the bodywork design and interfaces for ancillary components, it is not possible to build to a connector level without knowing the customer's full requirements. If a customer requirement changes, such as the connector type changing, this may result in a rebuild as it may not be possible to configure a fixed ROV connector into a Stab plate connector, for example. With the restrictions imposed by such a design, alterations can be costly and impact delivery schedules as well as product costs. Conventionally, as illustrated inFIGS.1a,1b,2a,2b,3a,3b, there are three main types of wet mate system, ROV mates, stab mates, or diver mates. As can be seen inFIG.1a, a wet mate connector plug1, in this example, an ROV flying plug, comprises a plug body2having a shaped front end, or bullnose, in this example, effectively a pair of back to back truncated cones and a third cone in series. The largest diameters of the two truncated cones of the pair are adjacent to one another forming a bullnose surface3, with a smooth transition across the join. The smallest diameter of one cone defines a front surface4of the front end of the plug and the smallest diameter of the other cone defines one side of a radial groove5or notch in the body, the other side of which is defined by the third cone, the smallest diameter of the third cone being adjacent to the smallest diameter of the other cone which defines the groove5. Rearward of the groove, the diameter expands, so that a rear end6of the plug body has a substantially uniform circumference. Toward the rear of the plug body rear end6, a snap ring7is mounted on the plug body. Behind that a latch indicator8is mounted and a front plate9, with adjacent backshell10, closer to the handle11. FIG.1bshows the corresponding receptacle14, typically already installed subsea, with a backshell15within the subsea equipment (not shown) and a mounting flange16to mount the receptacle to the equipment. An ROV capture cone or shroud17provided with an orientation indicator18guides the plug into the receptacle, over a lead-in chamfer19on an inner surface of the receptacle front end21. The receptacle rear end22is held in the mounting flange16. As can be seen from the cutaway section ofFIG.1b, a keyway20is provided in an inner surface of the receptacle front end21, aligned with the orientation indicator18, to receive a key12formed on an outer surface of the plug body rear end6. The capture shroud17, bullnose surface3and lead-in chamfer provide coarse alignment. The key12and keyway20provide fine alignment. FIG.2aillustrates an example of a stab mate plug29. In the stab mate example, a front end30of a plug body32comprises a lead in chamfer31from a front face33of the plug. The plug body32has a substantially constant diameter along most of its length. At a rear end34of the plug body32, a mounting flange35is provided, to fit the plug to a stab plate (not shown). Behind the mounting flange is a backshell36of the plug. The corresponding receptacle37is shown inFIG.2b. At a front end38of the receptacle body39, on an inside surface of the receptacle, a lead-in chamfer40is provided, to guide the plug front end30and behind that chamfer, a keyway41is formed into to receive a key45which is formed on the plug body32. FIG.3ashows an example of diver mate plug50. At a front end51of a plug body52, a lead-in chamfer is provided. The diameter of the plug body is otherwise substantially uniform along its length. At a rear end54of the plug body52, a locking mechanism55is mounted. Behind the locking mechanism, a backshell56is provided. In a diver mate receptacle60, a lead-in chamfer61is provided and a keyway62formed, in an inner surface at a front end63of the receptacle body64. During mating, a key65formed on and protruding from the plug surface cooperates with the keyway62for fine alignment. A mounting plate68is provided on a rear end of the receptacle body64and behind that a receptacle backshell69. A locking mechanism66on the receptacle60cooperates with the locking mechanism55on the plug to lock the plug and receptacle together when mated. Cost pressures on suppliers of subsea connector systems to produce connectors which deliver the same, or better, operational capabilities, at a reduced cost for each product, have largely been addressed to date, by finding a balance between maintaining enough stock to fulfil orders, without overstocking which can result in a large number of components requiring rework if necessary changes are made to a part design. With many variants of connectors available, and with multiple mating methods, for example, the ROV, diver and stab types described above, overheads are kept to a minimum by keeping stock levels relatively low for connector bodies and ancillary components, but as a result, it is difficult to reduce the manufacturing cost per part, as few are made in each batch. As described above, each type of wet mate connector, ROV, stab and diver, has a different body and different parts on those bodies. For example, a latch indicator8is provided on an ROV body6, so that the completeness of the mate can be checked remotely. However, a latch is not needed on a stab plate, as this type of mate cannot be only partially mated because the connectors are positioned on the Stab plate at the correct height so that when the plates are mated, the connectors mate fully. With a diver mate, the plug body has a threaded ring to lock to the receptacle because for a 12 way variant, the accumulative spring force makes it more difficult to mate by hand in the manner that an ROV would. It is also important to control a demate, so that the diver is not injured during the operation. The threaded ring makes the mate easier as well as controlling the demate. ROV and stab mates do not need the threaded ring because ROVs are able to mate with greater force, and there is no risk to personnel during a demate. STAB mate and demate is controlled by the coming together of the plates. The plates are fixed together, and subsequently the connectors cannot move until the plates are parted. The consequence of all these different variants in the components that make up each type of mate body is that it is costly to have all the components in stock, to cover all the options. The present invention aims to reduce costs and stocking levels, as well as simplifying the supply chain. This problem is addressed by amalgamating all the required features into a single body which can be used by any mate type. As can be better understood from the description hereinafter, a universal interface body for plug and receptacle, having a single front end for all mate types and the same housing body form, or metalwork, is provided. This universal interface may then be customised by adding features to the standard body, if required. This is illustrated in the examples ofFIGS.4aand4b. A standard plug front end according to the invention is illustrated inFIG.4a. The plug70comprises a coarse alignment feature in the form of a bullnose71. The bullnose comprises a series of three truncated cones, the first and third of the cones comprising substantially congruent faces120,122, the first and second cones being joined at their maximum diameter124and the second and third cones being joined at their minimum diameter123. In addition to the bullnose71in a front section72of the plug body75, there is a mount key locator74in a rear section73of the plug body. The bullnose71tapers to a front surface76of the plug front end72and to a groove77behind the bullnose. The bullnose provides coarse alignment as the plug is inserted into the receptacle. Fine alignment may be provided by a keyway78, formed in an outer surface of the plug body75. One or more water ports79are provided in the body, towards the rear end73of the body.FIG.4billustrates the corresponding receptacle80in which a receptacle body81comprises a front section86and a rear section88. In the front section, a lead-in chamfer83on the inner surface at the front face is provided to guide the plug front end. Further into the receptacle body81, a snap ring groove84is formed and, where required e.g. for ROV and diver mates, a snap ring91is mounted in the groove, to latch with a groove behind the bullnose of the plug when the plug is inserted. An opening90is formed in the receptacle front section86through which a key82may be inserted to cooperate with the keyway78of the plug, during mating. Toward the rear of the front section86of the receptacle body81, water ports are provided to allow water to be forced out by the movement of the plug70into the receptacle, during mating. In the rear section88of the receptacle, mount key positions87are formed to allow a suitable mount to be attached, according to the application, i.e. ROV, stab or diver type mate. Thus, the design provides a standardised plug front end70and receptacle front end80, which are adapted to be configured to the different mate types. The single plug and receptacle bodies incorporate the features needed by any of the mate types, rather than the conventional arrangement of having type specific bodies with only type specific features. The bullnose feature71, previously only used for an ROV mate is provided as standard for all three connector types as is the fitting for a latch, previously not used for a stab mate. A key and keyway, as well as a mount location towards the rear end of each of the plug and receptacle bodies are provided as standard. For the stab mate, the latch would not be fitted, during assembly, as it is not needed, although the standardised housing is able to take a latch. This avoids unnecessary increases in the part count for the stab mate. Grooves, opening and screws are all put in the same specific places for all mate types. The diameters of various parts of the bodies may be standardised, rather than there being diver, stab and ROV specific body diameters. Although some aspects of the manufacturing may appear to increase costs, the standardisation allows economies of scale that were not possible with the type specific bodies, leading to an overall cost reduction across all the mate types. The connectors typically comprise a corrosion resistant alloy, suitable for subsea applications, such as stainless steel, super duplex or titanium. Titanium is the most expensive of these. Super duplex has greater mechanical strength than stainless steel, so wall thickness can be reduced relative to a stainless connector or plastics. Typically, the alloy is machined to the desired shape, as the components have tight tolerances, which can be achieved by machining without the need for secondary steps, with their associated delay and cost. Methods such as casting require secondary operations to bring the parts to the required specification, which adds costs to the manufacturing process that are only recovered in high volume products. Production of subsea suitable components is relatively low volume compared to engineering products in general. For both plug and receptacle, the backend may also be standardised. As illustrated inFIGS.4aand4b, seals89are provided on the plug back end and seals92on the receptacle back end. These seals may, for example, be seals with sufficiently thick walls to take full differential pressure. The mount keys allow a mount to be fitted if needed between the body and seals of the plug or the receptacle. Conventionally, the different mate types had different flanges, with different types of seals, different shapes of flange and different interfaces. The standardised body allows the flanges of whichever type to be joined on using the same connection locators, i.e. the mount keys74,87and it is no longer necessary to machine an integral flange into the body for the case where a bulkhead mounting is used. Where a compliant mount was used, conventionally the mount was fitted one way for a plug and the opposite way for a receptacle, with markings, but this could result in errors in fitting. Now the mounts themselves are standardised, it is possible to always fit these the same way around, so this reduces errors in assembly. Conventionally, for bulkhead mounted connectors, the backshell has been sealed to the plug or receptacle using a face seal and a barrel seal, but it is now possible to have two barrel seals to deal with full differential pressure, or only a single seal if full differential pressure is not an issue. FIGS.5aand5billustrate an example of an ROV flying plug connector108and ROV bulkhead receptacle connector109more fully, setting the plug and receptacle housings70,80of the present invention in context. An ROV handle connects into an ROV flying backend assembly115which receives a cable or hose113connected to an optional mount section111with ROV plug ancillaries117and through a plug body110in the plug front end housing70having data and power contacts12,6to receive corresponding data and power pins from a receptacle. Alternatively, the backend115and front end housing body110may be connected directly, without the optional mount section, for example, if there are no ancillaries to add, or if those ancillaries can be mounted directly to the front end housing body. This further reduces the part count and manufacturing steps, reducing cost. The corresponding ROV bulkhead receptacle connector80includes ROV receptacle ancillaries118in a front section and bulkhead back end116behind the mounting section112. Conductors from a cable termination114into the back end116connect with conductor pins in the receptacle body (not shown). When mated the receptacle pins and plug contacts are in electrical contact. FIG.6illustrates a method of assembling a wet mate connector using the standardised plug and receptacle housings of the present invention. In a first step, the desired mating type, e.g. ROV, diver, or stab mate is determined and standard plug and receptacle housings70,80are selected100from stock. A plug body110and the appropriate mount111for the chosen mate type are fitted101to the plug housing. A receptacle body (not shown) and the appropriate mount (112) for the chosen mate type are fitted102to the receptacle housing, for example using screws, bolts or pins in the through holes87. In some of the mounting plates, feature74is used to orientate the connector in the mount. To the rear of this hole are grub screw holes, typically blind holes, in this example four grub screw holes. Backshells etc may be fixed to the body using grub screws, whereas often the mount is captivated between the backshell and the raised portion of the connector forward of orientation hole74. Electrical conductors in a hose or cable (113,114) are connected103to the back of each of the plug and receptacle bodies and back end housings (115,116) are fitted104to the seals89,92in the seal sections of each of the plug housing and receptacle housing. By providing a universal interface, and combining the features of ROV, stab plate, and diver mated connectors into one connector housing, components can be purchased in significantly larger quantities than before. By purchasing larger part quantities, price breaks can be met, and the overall connector cost is reduced. By offering a standard interface for the connector bodywork, changes can be accommodated more easily and the impact on lead times can be reduced. A single change to the bodywork, no longer requires updates to multiple assemblies, drawings and associated documentation. A further simplification is to choose the connector size to house a maximum number of contacts, typically 12 contacts, rather than having series variants of different sizes, such as smaller bodies for 4way, or 7way, than for 12way options. Only as many contacts as are required in the application are used, but each housing can accommodate a body of a size suitable for the maximum number of contacts. Ancillary components may be chosen to fit to the standard bodies, such as latch indicators or ROV cones and flying backshells for ROV Connectors, or stab mounting plates for STAB connectors, enabling the body to be configured in the same way as in any of the existing connector types. By reducing the number of front end assemblies to the minimum required, larger quantities of the connector body metalwork can be stocked, which reduces per item material cost. Reducing variation and standardizing the front ends across the product range, reduces lead times by streamlining processes and optimizing jigs and fixtures. While the present invention has been described above by reference to various embodiments, it should be understood that many changes and modifications can be made to the described embodiments. It is therefore intended that the foregoing description be regarded as illustrative rather than limiting, and that it be understood that all equivalents and/or combinations of embodiments are intended to be included in this description. The foregoing examples have been provided merely for the purpose of explanation and are in no way to be construed as limiting of the present invention disclosed herein. While the invention has been described with reference to various embodiments, it is understood that the words, which have been used herein, are words of description and illustration, rather than words of limitation. Further, although the invention has been described herein with reference to particular means, materials, and embodiments, the invention is not intended to be limited to the particulars disclosed herein; rather, the invention extends to all functionally equivalent structures, methods and uses, such as are within the scope of the appended claims. Those skilled in the art, having the benefit of the teachings of this specification, may affect numerous modifications thereto and changes may be made without departing from the scope of the invention in its aspects. It should be noted that the term “comprising” does not exclude other elements or steps and “a” or “an” does not exclude a plurality. Elements described in association with different embodiments may be combined. It should also be noted that reference signs in the claims should not be construed as limiting the scope of the claims. Although the invention is illustrated and described in detail by the preferred embodiments, the invention is not limited by the examples disclosed, and other variations can be derived therefrom by a person skilled in the art without departing from the scope of the invention. | 20,838 |
11942720 | DETAILED DESCRIPTION OF INVENTION The drive to reduce overall lifecycle costs, both capital expenditure (CAPEX) and operational expenditure (OPEX), associated with new deep-water oil and gas developments means that improvements to existing designs, manufacturing processes and operation are desirable. Subsea connector systems are desired that have a lower cost, can be relatively quickly and easily installed and that have reduced maintenance requirements, or need for intervention which affects the systems to which they are connected throughout their working life. Thus, connectors which continue to perform without degradation, over a longer period of time, are desirable. Typically, connectors for different applications may be single or multi-way connectors. For example, a 4-way connector may be used for delivering power, or a 12-way connector for data transfer via a suitable subsea instrumentation interface standard. This may be level 1, for analogue devices, level 2 for digital serial devices, e.g CANopen, or level 3. using Ethernet TCP/IP. Other data connectors, include optical fibre connectors. Wet mateable controls connectors typically have large numbers of thin conductor pins, in order that multiple control signals to different parts of a product can be included in a single control cable. For example, multiple subsea sensors on different pieces of equipment, such as flow sensors, temperature sensors, or pressure sensors each need to have a separate communication path, so that they can be interrogated, monitored and if necessary, actuators can be energized, for example to open or close a valve, or to start or stop a pump. Power transmission may be required for the purpose of supplying power to subsea equipment to enable it to operate, for example to close a valve, or drive a pump. Wet mateable power connectors may have a single pin and socket arrangement, or may be multi-way connectors, but typically with fewer, larger, pins than a control or communications connector. Conventionally, connections between conductive cores of a data communications cable and contacts of a connector back end have involved soldering of electrical connections and potting of the cable for retention. The present invention addresses this problem by providing a compact quick communications connection, in particular for termination of a multi-core communications cable, such as an ethernet cable, or other suitable subsea cable, into the back of a controls connector. By incorporating an overmoulded sealing or cable management housing, beneath an electrical screening cap component, a termination is provided which can be pushed into the back end of a matching controls connector. The connector parts comprise a plug with plug backend and receptacle with receptacle backend, the plug backend being a mirror image of the receptacle back end, shown in the examples. This design of cable management has benefits of convenience, termination speed, cable sealing and earth screen management. A cable is coupled to a termination connection by a dry mate on the termination end of the cable, so that the complete cable and connection combination can be plugged onto the back end of the wet mate connector, either the plug or receptacle part. A typical ethernet data cable has eight cores and these have to break out of the cable to make electrical connections with contacts in the plug or receptacle front end, each conductor core connecting separately with each contact. A face seal between the housing and the back end and cone seals formed in extensions of the housing, seal to each contact in the back end, so that the whole cable assembly is sealed. Data communication cables are typically screened to reduce electrical crosstalk and twisted pairs, rather than straight line cables are preferred to reduce pick up of noise and interference. In making the dry mate connection on the cable, it is important to minimize disturbance of the twisted pairs of the cable. This is done by reducing the length of untwisted cable, so there is less interference from straight lines picking up noise. The amount of untwisting needed in the design is about ⅓ to ½ the amount that would normally be required for a soldered connection. Having been fitted into the connector back end, the cone seals around the conductor cores may be compressed when located, to seal against sea water ingress. The cable is provided with an earth screen around the outside of all of the cable cores and an extension electrical earth screen may be fitted outside the connection termination housing, so as to ensure earth screen electrical continuity. An additional shield may be swaged on between them. To produce a high speed data connector it is necessary that impedance, measured at any position along the length of the connector and termination to the cables, is consistent and matched to the cable value. Typically for the Ethernet standard, an impedance of 100Ω is chosen, but for other types of data cable, this may be different. The impedance occurring at any position through the connector and cable is typically related to capacitance and inductance, which should stay as near as possible uniform themselves, to achieve uniformity of impedance. In subsea operation, this can be a challenge, so subsea connectors are designed to avoid step changes of impedance inside the connector and hence minimize insertion losses and return losses, which may degrade the quality and strength of data reaching the receiving end of a system. As can be understood from the connector design hereinbefore described, the plug and receptacle inserts are designed with careful pin spacing, controlled dielectric and uniformity in distance from an earth screen. Subsea connectors may have relatively large gaps between inserts, so these gap regions are configured to perform sealing and compensating functions whilst maintaining impedance matching. A combination of features contribute to effective impedance matching, including minimizing the extent to which the twisted pairs are untwisted by reducing the length of breakout, setting the pairs of cables to have an orthogonal pitch and reducing the overall connector length. A cable termination for terminating communications or data conductors in the back of a controls connector is described in these examples. The connector may comprise data connectors only, or be a hybrid connector, containing dedicated data conductors, such as Ethernet, as well as power conductors. The data connector typically comprises at least 4 data conductors, more typically 8 data conductors, but may have as many as 12 data conductors. A hybrid power and data connector typically comprises up to 4 power conductors in addition to the up to 8 data conductors, but the precise number of power and data conductors needed depends upon the protocol used and whether single or three phase power is used, so the invention is not limited to such a combination. Improvements to a conductor connector include reduced cost and lead time, as well as improved communications performance, such as improved data bandwidth. FIG.1shows an example of a dry mate cable connection40according to the present invention in context with a partially mated plug/receptacle pair. The cable connection is illustrated as it is brought into contact with a back end45of the receptacle2for attachment to a partially mated plug1and receptacle2. The connection comprises a data cable4onto which a break out termination housing (not shown) supports individual cable conductors23and is provided with an outer electrical earth shield5, to extend the shielding provided around the outside of the cable4. A further earth shield may be provided around the data cluster20, which extends into the receptacle body10. In the back end45of the receptacle2, contacts12coat the inside of openings in the receptacle pins (not shown). A plug back end44, which is a mirror image of the receptacle back end45can be seen at the far end of the plug part1. FIG.2show more detail of the contacts in the receptacle back end45. In this example of a hybrid communications and power connector, the contacts12are arranged in pairs, each pair being orthogonal to an adjacent pair, the four pairs shown, forming a data cluster20. Individually power conductors6, in this example four conductors, comprise an insulating layer7. The power conductors6are spaced from one another and from the data cluster20in the receptacle body10. The spacing also helps to protect the data conductors from interference from the power conductors. FIG.3provides a section through the cable connection40and the receptacle body10. The cable4typically comprises an outer insulating layer and an outer earth screen, the space between the insulating layer and earth screen being filled with a gel. The gel is typically an electrical insulator, although its primary purpose is to exclude water. Beneath the earth screen layer, an inner insulating sheath surrounds a plurality of twisted pair data cores, each being individually insulated from one other by an insulating layer or coating. The cable connection comprises a moulded body43with openings acting as guide holes for each individual core. The guide holes are formed in an arrangement that corresponds with a layout of openings of a data cluster in the receptacle (or plug) back end. This arrangement is designed to pair the individual cores and also locate each pair such that they are orthogonal with an adjacent pair of cores. Optionally, there may be inner guide holes and outer guide grooves, whereby half of the cores, typically, one of each twisted pair for an Ethernet cable, are led by grooves on top of the overmoulded body43to guide holes at the edge of the body, rather than all being fed directly down through the guide holes. This helps to increase the separation of individual cores to get them to be substantially parallel as they exit the body, as well as preventing pairs from overlapping one another. The overmoulded body may be formed with either left handed or right handed curvature for the grooves, to enable use with either plug or receptacle. The moulding of this body includes extension seals, or cone seals,42on the other side of the guide holes, formed to support the cable conductor cores23separately and substantially parallel to one another after they have been broken out from the cable pairs and straightened to fit through the openings. The cone seals42in combination with the silicone overmoulding top or side surfaces convey a seal from the cable outer jacket underneath an earth shield cap5onto the back of the receptacle body data cluster. The cables sit inside this umbrella. The earth shield cap5surrounds the overmoulded body and its separated cable cores. The electrical earth screen5is connected to the earth screen15of the cable4via a conductive swage support or continuity bush41. Typically, the housing can be slid over the stripped cables and sits in contact with the outer insulating layer of each wire of the twisted pair cable, when fitted. FIG.4illustrates the cable connection40with the earth shield cap5removed, showing the cable routing from the break out of the cable4to the individual conductor cores23ready to be inserted in the receptacle body back end. The extent of the untwisting and separation of each pair, one from the other, is kept to a minimum by retaining a degree of rotation from their original relative location within the cable. The present invention provides a dry mate cable connection comprising a data cable and a cable termination housing. The data cable comprises a plurality of electrical conductors and at least one electrically insulating outer layer surrounding each data conductor. The insulating layer or layers ensure that the data conductors are electrically insulated from one another, along all of their length and the outermost layers of insulation are in contact with the outermost layer of an adjacent conductor. At a termination end of the cable, each conductor is spaced out by the cable termination housing, so that the outer layers at the termination end are not in direct physical contact. Instead, the electrical conductors at the termination end are physically separated from one another by the cable termination housing, which is an electrically insulating overmoulded cable termination housing, fitted over each electrically insulating layer. The housing is mounted, such that at its mounting point, the housing is in contact with the electrically insulating layer of each wire, rather than any part of the electrical conductor that is exposed when the electrical insulation is stripped from the ends of the wires. Parts of the housing that are not in direct contact with the electrical insulation may extend further. This cable termination housing with the individual cable conductors mounted therein makes solderless connection of the conductor cores to electrical contacts in the back end of a plug or receptacle part of a wet mate connector possible. Assembly costs are reduced by deskilling the connection step, compared to soldering. Thus, termination of a data cable into the back of a controls connector can be done more quickly and easily. Cables with terminations can be pre-prepared and taken from stock as needed. The terminations can be done on site, rather than having to be done in a factory, because all the testing of the parts is done as part of the assembly process and the final step of crimp free, solder free, termination of the cable can be completed without further testing. The cable termination housing may comprise individual extensions, extending, at least partially, over the electrically insulating layer of each physically separated conductor in the termination end and sealingly engaged with an outer surface of the insulating layer. For example, the extensions may be cone shaped such that they make a cone seal when mated to the back of the connector. The entry to the backend of each conductor12on the plug or receptacle is a mis-matched cone which seals against the extensions when mated. The electrically insulated conductors in the cable are typically surrounded by an electrical screening layer, except at the termination end. This screening layer may be extended over the termination housing to the plug or receptacle back end in various ways, to provide electrical continuity. The cable connection may further comprise an electrical screen bridging the cable termination housing and the cable behind its termination end to assist with earth screen management. Each electrical conductor in the cable is paired with an adjacent electrical conductor, typically as a twisted pair and only at the termination end are these conductors separated from one another. The distance over which the pairs are separated is kept as small as possible by using the termination housing, so rather than the twisted pairs being unwound by about 60 mm to make a solder connection, the conductors may only be separated over a distance of 20 mm to 30 mm. The data cable may comprise at least two and more particularly, four twisted pair cables, for example an Ethernet data cable. The data cable may be gel filled. Each conductor pair is arranged to be located orthogonal to an adjacent conductor pair and all the orthogonal pairs form a data cluster to correspond to an arrangement of conductor contacts of a data cluster in a plug or receptacle back end of a subsea connector to which the cable is to be connected. In this way, the electrical conductors from each twisted pair in the cable are separated out and arranged to mirror the location of electrical contacts in a plug or receptacle back end, so that the cable connection can be simply push fit into the plug or receptacle back end, with no further opening out or rearrangement. This cable management arrangement allows for faster termination and assists with cable sealing. The cable termination housing may comprise a face seal for sealing against a corresponding sealing surface of a data cluster housing in the back end of the plug or receptacle of the connector. The housing seals use flat seals in compression and cones to seal the gel filled cable from the connector plug or receptacle backend. The cable termination housing manages conductor routing and preserves pair twist for as long as possible before the critical break out region. The examples have been described with respect to a plug or receptacle back end, and the conductor routing may be left-hand or right-hand conductor routing, i.e., for plug or receptacle laterally inverted arrangements. The cable termination design has provision to manage earth screening of the break-out region to reduce induced electrical noise, whilst achieving a simple dry mate push in arrangement, which can make eight simultaneous connections, for an 8 core cable. Wiring or configuring the cable and cable termination is done outside of the connector backend, simplifying the activity. It would be possible to create two back to back identical connector harnesses (i.e., not laterally inverted, plug/plug, rec./rec. conductor routing using the cable termination housing of the present invention, but it is less than ideal as 2 pairs of conductors have to cross over each other in the break out region, in the backend of one connector. In practice, this requirement may be met by incorporating a non-standard wiring configuration in one of the connectors. While the present invention has been described above by reference to various embodiments, it should be understood that many changes and modifications can be made to the described embodiments. It is therefore intended that the foregoing description be regarded as illustrative rather than limiting, and that it be understood that all equivalents and/or combinations of embodiments are intended to be included in this description. The foregoing examples have been provided merely for the purpose of explanation and are in no way to be construed as limiting of the present invention disclosed herein. While the invention has been described with reference to various embodiments, it is understood that the words, which have been used herein, are words of description and illustration, rather than words of limitation. Further, although the invention has been described herein with reference to particular means, materials, and embodiments, the invention is not intended to be limited to the particulars disclosed herein; rather, the invention extends to all functionally equivalent structures, methods and uses, such as are within the scope of the appended claims. Those skilled in the art, having the benefit of the teachings of this specification, may affect numerous modifications thereto and changes may be made without departing from the scope of the invention in its aspects. It should be noted that the term “comprising” does not exclude other elements or steps and “a” or “an” does not exclude a plurality. Elements described in association with different embodiments may be combined. It should also be noted that reference signs in the claims should not be construed as limiting the scope of the claims. Although the invention is illustrated and described in detail by the preferred embodiments, the invention is not limited by the examples disclosed, and other variations can be derived therefrom by a person skilled in the art without departing from the scope of the invention. | 19,455 |
11942721 | The embodiments of the present disclosure are detailed below with reference to the listed Figures. DETAILED DESCRIPTION OF THE EMBODIMENTS Before explaining the present disclosure in detail, it is to be understood that the disclosure is not limited to the specifics of particular embodiments as described and that it can be practiced, constructed, or carried out in various ways. While embodiments of the disclosure have been shown and described, modifications thereof can be made by one skilled in the art without departing from the spirit and teachings of the disclosure. The embodiments described herein are exemplary only, and are not intended to be limiting. Specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a basis of the claims and as a representative basis for teaching persons having ordinary skill in the art to variously employ the present embodiments. Many variations and modifications of embodiments disclosed herein are possible and are within the scope of the present disclosure. Where numerical ranges or limitations are expressly stated, such express ranges or limitations should be understood to include iterative ranges or limitations of like magnitude falling within the expressly stated ranges or limitations. The use of the word “a” or “an” when used in conjunction with the term “comprising” in the specification may mean “one,” but it is also consistent with the meaning of “one or more,” “at least one,” and “one or more than one.” The word “about”, when referring to values, means plus or minus 5% of the stated number. The use of the term “optionally” with respect to any element of a claim is intended to mean that the subject element is required, or alternatively, is not required. Both alternatives are intended to be within the scope of the claim. Use of broader terms such as comprises, includes, having, etc. should be understood to provide support for narrower terms such as consisting of, consisting essentially of, comprised substantially of, and the like. When methods are disclosed or discussed, the order of the steps is not intended to be limiting, but merely exemplary unless otherwise stated. Accordingly, the scope of protection is not limited by the description herein, but is only limited by the claims which follow, encompassing all equivalents of the subject matter of the claims. Each and every claim is hereby incorporated into the specification as an embodiment of the present disclosure. Thus, the claims are a further description and are an addition to the embodiments of the present disclosure. The inclusion or discussion of a reference is not an admission that it is prior art to the present disclosure, especially any reference that may have a publication date after the priority date of this application. The disclosures of all patents, patent applications, and publications cited herein are hereby incorporated by reference, to the extent they provide background knowledge; or exemplary, procedural or other details supplementary to those set forth herein. The embodiments of the present disclosure generally relate to a protective cover for a connector at the end of a cord. The protective cover is functional whether or not the cord is in use. The protective cover for a connector can have a top cover having a top cover connector end and a top cover cord end, a bottom cover pivotally connected to the top cover having a bottom cover connector end and a bottom cover cord end, a bias applying a force to cause the top cover cord end to abut the bottom cover cord end, and a connector void disposed on the bottom cover for receiving a connector adjacent a connector tray for supporting the connector. In embodiments the top cover and/or bottom cover can each have a seal for making the cover water resistant as well as protecting items that the cord plugs into. In embodiments, a removable cord grip can be added to the device in order to prevent the protective cover from sliding down or falling off the cord. The removable cord grip can be sized and shaped to fit into the bottom cover. The top cover can have an ornamental shape for desirable cosmetic appearance. For example, it can be shaped to resemble an animal or animal head, a musical instrument, a geometric shape, a character, a toy, and the like. The bottom cover can have a connector tray or ledge to support the connector end of the cord when not in use. A bias can be utilized to force the top cover to abut the bottom cover. The bias can be any bias known to persons having ordinary skill in the art. Exemplary biases can include a spring, a deformable plastic, a compressible rubber or polymer, pneumatic or hydraulic elements, and the like. A cord with a connector can be inserted into the protective cover through the bottom cover. The cord can be inserted through the cord void and the connector can be inserted through the connector void. The protective cover can then be displaced slightly to allow the connector to rest on the connector tray. The cord and connector are enclosed within the protective cover for a connector and are not accessible to pets and/or children. Further, in embodiments with seals, the cord and connector are protected from spills and/or moisture. A cord grip can be placed on the cord to hold the protective cover for a connector in place on the cord and connector. The cord grip not only prevents the protective cover for a connector from sliding along a cord, but also prevents the connector from falling out of the protective cover for a connector. To plug the connector into a device or an outlet, a user can press the cord ends of the top cover and the bottom cover to overcome the bias and create a gap between the top cover and the bottom cover. The connector can then be plugged into a device (such as a phone) and the top and bottom covers can grip the device. When the user releases pressure on the cord ends of the top cover and the bottom cover. In instances where the device is too thick, the device is of irregular shape, or the cord is being plugged into an outlet, the protective cover for a connector can simply be slid down the cord slightly to allow the connector to be plugged in. Turning now to the Figures,FIG.1depicts a perspective view of an embodiment of the protective cover for a connector in the closed position. Shown here is an embodiment of a protective cover for a connector100having a top cover200and a bottom cover300. A bias (not shown) can force the top cover connector end210to abut the bottom cover connector end310. A user can apply pressure to the top cover cord end220and bottom cover cord end320and cause the protective cover for a connector100to open, thereby allowing the user to plug the cord into a device or an outlet. FIG.2depicts a perspective view of an embodiment of the top cover. The top cover200can have a top cover connector end210and a top cover cord end220. In the embodiment shown, top cover200has holes250to pivotally connect to a bottom cover. A top seal230can be included on at least a portion of the perimeter to make the protective cover for a connector water resistant. In embodiments the seal can also serve to protect electronics, such as tablets or personal phones, from being scratched as a cord is removed. FIG.3depicts a bottom view of an embodiment of the top cover. The top cover200can have a top cover connector end210and a top cover cord end220. A slot240can be formed in top cover200to allow a cord to pass through. In embodiments a grip235can be included to hold a cord connector in place within the protective cover for a connector. FIG.4depicts a perspective view of an embodiment of the top cover. The top cover200can have a top cover connector end210and a top cover cord end220. In embodiments, grip235can be frictionally held in place as shown here. FIG.5depicts a perspective view of an embodiment of the bottom cover. The bottom cover300can have a bottom cover connector end310and a bottom cover cord end320. The bottom cover can have a cord void340to receive a cord and a connector void360to receive a connector at the end of a cord. Bias400can press against the top cover. In embodiments, the connector void can be later than the cord void. FIG.6depicts a perspective view of an embodiment of the bottom cover. The bottom cover can have a bottom cover connector end310and a bottom cover cord end320. The bottom cover can have a connector tray370to house and support a connector at the end of a cord. In this embodiment, bottom cover300has pegs350to fit the holes in top cover and pivotally connect to it. Bottom seal330can be included on at least a portion of the perimeter to make the protective cover for a connector water resistant. Bias400is shown here as a deformable plastic applying a force. However, any bias known to persons having ordinary skill in the art can be used. An embodiment of a cord grip500is inserted here to cover the cord void and connector void. FIG.7depicts a perspective view of an embodiment of the cord grip. The cord grip500can prevent the protective cover for a connector from sliding on the cord. Cord grip500can have cord void section520to fit into the cord void of the bottom cover and connector void section530to fit into the connector void of the bottom cover. In embodiments, cord grip500can have a raised portion540to position a cord connector and make it easier to grasp for a user when attempting to plug it into a device. In embodiments, cord grip500can have extensions510to grasp the cord. FIG.8depicts a perspective view of an embodiment of the protective cover for a connector in the open position as used with a smartphone. Shown here is an embodiment of a protective cover for a connector100in an open position when a cord700is plugged into a device, shown here as phone600. The top cover200and bottom cover300can grip the phone. The top seal and bottom seal shown above can act to protect the phone600from being scratched by the protective cover for a connector100. In instances where the phone is too thick for the protective cover for a connector100to grasp, the protective cover can simply be slid back along cord700. While the present disclosure emphasizes the presented embodiments and Figures, it should be understood that within the scope of the appended claims, the disclosure might be embodied other than as specifically enabled herein | 10,439 |
11942722 | DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS FIG.1illustrates an electronic system that can be improved by the incorporation of an embodiment of the present invention. This figure, as with the other included figures, is shown for illustrative purposes and does not limit either the possible embodiments of the present invention or the claims. This figure illustrates an electronic device300including connector receptacle100. Electronic device300can include bottom enclosure301encasing connector receptacle100. Electronic device300can further include top enclosure302over bottom enclosure301. Top enclosure302can house a screen or monitor, or other electronic components (not shown.) Bottom enclosure301can house a keyboard, processor, battery, or other electronic components (not shown.) The electronic components in top enclosure302and bottom enclosure301can receive and provide power and data using connector receptacle100. In one example, the electronic components in top enclosure302and bottom enclosure301can receive power via connector receptacle100and can provide data regarding a charging status of a battery (not shown) of electronic device300via connector receptacle100. Connector receptacle100can include shield170having tabs172. Tabs172can be inserted into and soldered to openings (not shown) in a printed circuit board (not shown) in bottom enclosure301of electronic device300. Connector insert200can be plugged into or mated with connector receptacle100. Connector insert200can include passage202for a cable (not shown.) In this example, electronic device300can be a laptop or portable computer. In these and other embodiments of the present invention, electronic device300can instead be another portable computing device, tablet computer, desktop computer, all-in-one computer, wearable-computing device, smart phone, storage device, portable media player, navigation system, monitor, power supply, video delivery system, adapter, remote control device, charger, or other device. Examples of connector receptacles100and connector inserts200are shown in the following figures. FIG.2illustrates a connector receptacle according to an embodiment of the present invention. Connector receptacle100can include mesa112supporting contacting surfaces122of contacts120(shown inFIG.4.) Mesa112can emerge through opening182in faceplate180. Contacts120can terminate in through-hole contacting portions124. In these and other embodiments of the present invention, contacts120can terminate in surface-mount contacting portions (not shown.) Housing130can include posts136. Shield170can include tabs172. Through-hole contacting portions124, posts136, and tabs172can be inserted into corresponding openings in a printed circuit board, flexible circuit board, or other appropriate substrate620(shown inFIG.6.) Housing130can further include tab132that can fit an opening192of shield190. Shield170can be attached to shield190at points191by spot or laser-welding or other technique. Bracket160can be used to secure connector receptacle100in place in electronic device300(shown inFIG.1) as shown further below. FIG.3illustrates the connector receptacle ofFIG.2. Brackets160can emerge through the openings194in shield190. Shield170can include tabs172. Contacts120(shown inFIG.4) can terminate in through-hole contacting portions124. Housing130can include posts136. Through-hole contacting portions124, posts136, and tabs172can be fit in corresponding openings in a printed circuit board, flexible circuit board, or other appropriate substrate620(shown inFIG.6.) Brackets160can be used secure connector receptacle100in place in electronic device300(shown inFIG.1.) FIG.4is an exploded view of the connector receptacle ofFIG.2. Contacts120can be supported by contact housing110. Contact housing110can terminate in mesa112. Contacts120can include contacting surfaces122on mesa112and through-hole contacting portions124. Mesa112can emerge from opening182in faceplate180. Faceplate180can protect magnet array150. Faceplate180can be formed of a soft magnetic alloy to optimize the attachment force between magnet array150and attraction plate250(shown inFIG.8.) For example, faceplate180can be formed of a soft magnetic alloy or other magnetically conductive material, such as martensitic stainless steel, ferritic stainless steel, low-carbon steel, iron-cobalt, an iron-silicon or nickel-iron alloy, or other ferro-magnetic material, or other material. Magnet array150can be positioned around contact housing110. Contact housing110can pass through an opening168in magnet array150. Magnet array150can include pole piece152, pole piece154a, pole piece154b, pole piece156a, pole piece156b, and pole piece158. Magnet array150can include magnet151, magnet153a, magnet153b, magnet155a, magnet155b, magnet157a, magnet157b, and magnet159. Each of pole piece can be formed of a soft magnetic alloy or other magnetically conductive material, such as martensitic stainless steel, ferritic stainless steel, low-carbon steel, iron-cobalt, an iron-silicon or nickel-iron alloy, or other ferro-magnetic material, or other material. Each of these pole pieces can be abutted by two or more magnets. For example, pole piece152can be abutted by magnet151, magnet153a, and magnet153b. Pole piece152can guide field lines of magnet151, magnet153a, and magnet153b. For example, magnet151, magnet153a, and magnet153bcan have their north pole adjacent to pole piece152and their south pole away from pole piece152, such that pole piece152can guide field lines from their north poles. Alternatively, magnet151, magnet153a, and magnet153bcan have their south pole adjacent to pole piece152and their north pole away from pole piece152, such that pole piece152can guide field lines to their south poles. Pole piece152, pole piece154a, pole piece154b, pole piece156a, pole piece156b, and pole piece158can guide field lines of alternating polarities. For example, pole piece152, pole piece156a, and pole piece156bcan guide field lines of a first polarity, while pole piece154a, pole piece154b, and pole piece158can guide field lines of a second polarity. Additional magnet167and additional magnet169can be included in magnet array150. For example, additional magnet167can be adjacent to pole piece152. In the example where magnet151, magnet153a, and magnet153bhave their north poles adjacent to pole piece152, additional magnet167can also have its north pole adjacent to pole piece152while the south pole of additional magnet167can face away from pole piece152. Additional magnet167and additional magnet169can further increase a magnetic attraction provided at a face of connector receptacle100. Further details of magnet array150can be found inFIG.21andFIG.22below. Contact housing110can further be supported by housing130and lock140. Contact housing110can be positioned between housing130and lock140. Housing130can include post136, tabs132, and tabs134. Tab132can fit in opening192of shield190. Tab134can fit in opening174of shield170. Shield170can further include tabs172. Lock140can include posts142, which can fit in corresponding notches (not shown) in housing130. Brackets160can fit in openings194of shield190. In these and other embodiments of the present invention, brackets160can be replaced with a single bracket, such as bracket2360(shown inFIG.23.) In these and other embodiments of the present invention, connector receptacle100can be located in an electronic device that also includes speakers, haptic components, actuators, or other components. These can cause vibrations in nearby components, such as connector receptacle100, that can result in audible noise. Similarly, the magnetic field generated by magnet array150interacting with variable current flowing through contacts120can also induce vibrations resulting in audible noise. Accordingly, embodiments of the present invention can provide dampeners that can reduce the tendency of connector receptacle100to generate vibrational noise. These dampeners can also protect magnet array150from cracking, chipping, or other damage. For example, foam pieces, adhesives, silicone, plastic insulators, elastomers, and other materials or structures can be placed or formed between or among portions of connector receptacle100. These can be formed of epoxy, room-temperature-vulcanizing silicone or other silicone or other elastomeric material, or other material. For example, dampeners can be placed between magnet array150and shield170, between magnet array150and shield190, between magnet array150and faceplate180, between contact housing110and magnet array150, or elsewhere in connector receptacle100. Silicone, such as a room-temperature-vulcanizing silicone, can be placed between contact housing110and magnet array150. For example, silicone can be placed or formed along sides of contact housing110, along top and bottom sides of contact housing110, or a combination thereof. The silicone or other material can be formed ahead of time and placed in the desired location. The silicone or other material can instead be injected between contact housing110and magnet array150and cured in place. In this example, silicone can be injected between sides of contact housing110and pole piece152, and between contact housing110and pole piece158to form dampener117and dampener119, respectively. Dampener117can be formed between a left side (as seen from a front of contact receptacle100) of contact housing110and pole piece152, while dampener119can be formed between a right side of contact housing110and pole piece158. The silicone for dampener117and dampener119can be injected using a needle placed between contact housing110and magnet array150from a back side (not shown) of magnet array150before housing130and lock140are attached. Alternatively, dampener117and dampener119can be formed as pieces of silicon, foam, or other material ahead of time and inserted or otherwise placed between contact housing110and magnet array150. For example, dampener117and dampener119can be inserted between contact housing110and magnet array150from a back side of magnet array150before housing130and lock140are attached. Alternatively, dampener117and dampener119can be attached to sides of contact housing110, and then magnet array150can be formed around contact housing110, dampener117, and dampener119. It can be desirable to accurately align mesa112and contacting surfaces122to an opening in bottom enclosure301of electronic device300(shown inFIG.1.) Connector receptacle100can be positioned on a surface of or associated with bottom enclosure301. This can help to provide an accurate alignment. However, various manufacturing tolerances can remain. Accordingly, it can be desirable to be able to adjust a connection between connector receptacle100and bottom enclosure301in at least one direction. An example is shown in the following figure. FIG.5illustrates a cutaway side view of the connector receptacle ofFIG.2. A bottom surface101of connector receptacle100can be placed near a printed circuit board, enclosure surface, or other appropriate substrate620(shown inFIG.6.) Brackets160can be used to secure connector receptacle100to substrate620. To improve alignment of connector receptacle100to an opening in bottom enclosure301(shown inFIG.1), it can be desirable that bracket160be able to move in at least one direction relative to the other portions of connector receptacle100. Accordingly, bracket160can be positioned in slot135in housing130. In this way, tab162of bracket160can slide vertically in slot135. This can allow bracket160to move relative to the remainder of connector receptacle100. This relative movement can allow connector receptacle100to be adjusted relative to substrate620and allow connector receptacle100and mesa112(shown inFIG.4) to be accurately positioned in the opening in bottom enclosure301. In this example bracket160can be capable of moving up board until tab162hits a top137of slot135. Also or instead, the upward travel can be limited by an edge197at a top of opening194in shield190. Also or instead, the upward travel can be limited by edge139of housing130engaging bracket160. Bracket160can be capable of moving downward until bracket160hits bottom edge195of opening194. This arrangement can allow bracket160to move vertically relative to a remaining portion of connector receptacle100. In this example, mesa112can be located in recess113. In these and other embodiments of the present invention, brackets160can be replaced with a single bracket, or with three or more than three brackets. A single bracket, such as bracket2360(shown inFIG.23) can be used. This single bracket2360can be adjustable in a similar manner as brackets160, or single bracket2360can be fixed in place to shield190. FIG.6illustrates a side view of the connector receptacle ofFIG.2in a device enclosure according to an embodiment of the present invention. In this example, connector receptacle100can be attached to substrate620via bracket160. Substrate620can be a printed circuit board, portion of bottom enclosure301(shown inFIG.1), or other appropriate substrate. Substrate620can include fastener opening630to accept fastener610. Fastener610can pass through opening164in bracket160to secure bracket160and connector receptacle100to substrate620. Again, tab162of bracket160can move vertically in slot135of housing130. Fastener610can pass through opening194in shield190. When a bracket, such as bracket2360(shown inFIG.23) is fixed to shield190, or other structure such as magnetic element2210and magnetic element2220(shown inFIG.22), bracket2360can be pre-biased (that is, sloped relative to substrate620in the illustrated plane) as it extends away from shield190and slot135. This slope can be either towards or away from substrate620. As fastener610is inserted into fastener opening630in substrate620, for example by turning a screw used as fastener610into a threaded fastener opening630, bracket2360can flatten (that is, become parallel to substrate620.) This change can provide a range through which mesa112of connector receptacle100can be positioned in recess113(shown inFIG.5.) FIG.7AandFIG.7Billustrate portions of the connector receptacle ofFIG.2. Housing130can include slot135for accepting bracket160. Bracket160can include tab162and opening164. FIG.8illustrates a connector insert according to an embodiment of the present invention. Connector insert200can be arranged to mate with connector receptacle100, as shown inFIG.1. Connector insert200can be at a first end of cable290. Connector insert200can include an attraction plate250that can be magnetically attracted to magnet array150(shown inFIG.4.) Attraction plate250can include opening251for accepting mesa112(shown inFIG.2) of connector receptacle100. Attraction plate250can fit in recess113of connector receptacle100(both shown inFIG.5.) Contacting surfaces122of contacts120(shown inFIG.2) can form electrical connections at contacting surfaces812of spring-loaded contacts800. FIG.9illustrates a spring-loaded contact according to an embodiment of the present invention. Spring-loaded contact800can include plunger810. Plunger810can include contacting surface812. Plunger810can emerge from front opening822in barrel820. As contact is made between spring-loaded contact800and a corresponding contact, such as contacting surface122of contact120(shown inFIG.4), the biased plunger810can be depressed. Spring860(shown inFIG.10) in spring-loaded contact800can apply a force between plunger810and the corresponding contact thereby forming an electrical connection. Typically, current in the electrical connection can flow through the plunger and barrel820. But in some configurations, as plunger810is depressed, contact between plunger810and the barrel820can be broken. In this circumstance, current can flow through spring860. If spring-loaded contact800is a power supply contact, such as a contact providing a power supply voltage or ground, the current can damage or destroy spring860thereby rendering the contact inoperable. Accordingly, an illustrative embodiment of the present invention can provide spring-biased contacts that include an intermediate object between plunger810and spring860or other biasing structure. Examples are shown in the following figures. FIG.10illustrates a transparent side view of the spring-loaded contact ofFIG.9. Plunger810can include contacting surface812. Plunger810can further include neck816leading to body818. Body818can be retained inside barrel820by front opening822. Plunger810can include backside814. Backside814can contact intermediate object850. Intermediate object850can be positioned between plunger810and spring860. Spring860can act to push plunger810out of barrel820and can be compliant such that plunger810can be depressed into barrel820of spring-loaded contact800when mated with a corresponding contacting surface122(shown inFIG.2.) FIG.11illustrates a cutaway side view of the spring-loaded contact ofFIG.9. Spring-loaded contact800can include intermediate object850in barrel820. Intermediate object850can be positioned between plunger810and spring860. Intermediate object850can contact backside814of plunger810. Plunger810can further have tip or contacting surface812. Spring860can push intermediate object850against backside814of plunger810. FIG.12is a more detailed view of an intermediate object that can be used in the spring-loaded contact ofFIG.9. Intermediate object850can be positioned between plunger810and spring860. Intermediate object850can encounter backside814of plunger810as well as spring860. Intermediate object850can provide multiple paths for currents in spring-loaded contact800. For example, current can flow though plunger810into intermediate object850and through first location852to barrel820. Current can also flow though plunger810into intermediate object850and through second location854to barrel820. These current paths can help to limit current through spring860. The currents in barrel820can then flow through other conduits that are connected to barrel820, such as wires, board traces, or others (not shown.) Intermediate object850can have a first length L1that is greater than an inner diameter D1of barrel820. Intermediate object850can be between a backside814of plunger810and spring860, where intermediate object850simultaneously contacts an inside surface of barrel at first location852and second location854. First location852and second location854can be on opposite sides of intermediate object850. First location852can be a first distance (not shown) from front opening822of barrel820and second location854can be a second distance (not shown) from front opening822, the first distance different than the second distance. In these and other embodiments of the present invention, an inside surface of barrel820can provide a first force along a first force vector F1against intermediate object850at first location852. The inside surface of barrel820can provide a second force along a second force vector F2against intermediate object850at second location854. The first force vector F1and the second force vector F2can be parallel and non-overlapping. Backside814of plunger810can provide third force vector F3to intermediate object850at location858. Spring860can provide fourth force vector F4to intermediate object850at location856. FIG.13illustrates an intermediate object according to an embodiment of the present invention. Intermediate object850can have various shapes. For example, intermediate object850can have a capsule shape. Intermediate object850can have a stadium-of-rotation shape. Intermediate object850can have a spherocylinder shape. Intermediate object850can have a shape defined by two hemispheres1310and1312separated by cylinder1314. FIG.14is a more detailed view of a plunger for the spring-loaded contact ofFIG.9. Plunger810can include contacting surface812. Plunger810can further include neck816leading to body818. Plunger810can include backside814. Backside814can be sloped. Backside814can have a conical indentation. Backside814can have a conical surface. Backside814can have an off-center conical surface. Backside814can have a sloped off-center conical surface. The conical indention can have an apex at point815. Plunger810can be used as the other plungers shown herein or otherwise provided by embodiments of the present invention. FIG.15illustrates another spring-loaded contact according to an embodiment of the present invention. Spring-loaded contact1500can be used as spring-loaded contact800(shown inFIG.8.) Spring-loaded contact1500can include plunger1510, intermediate object1570, piston1580, and spring1560. At least a portion of plunger1510, intermediate object1570, piston1580, and spring1560can be housed in barrel1520. Piston1580can include head1582and tail1584. Some of spring1560can encircle tail1584of piston1580, thereby keeping piston1580aligned to spring1560. Spring1560can apply force against head1582of piston1580, thereby pushing head1582of piston1580into intermediate object1570. Intermediate object1570can push against a backside1514of piston1580. As spring-loaded contact1500engages a corresponding contact, such as contacting surface122of contacts120(shown inFIG.4), plunger1510can be depressed into barrel1520. This can compress spring1560. In this way, spring1560can continue to apply a force pushing plunger1510against contacting surface122when the contacts are mated. FIG.16illustrates a close-up view of a portion of the spring-loaded contactFIG.15. Spring1560can push against head1582of piston1580. Some of spring1560can encircle tail1584of piston1580. Spring1560can provide force F1at location1574to intermediate object1570through head1582of piston1580. This force can be resisted by force F2applied to location1572of intermediate object1570by backside1514of plunger1510. These forces can push intermediate object1570into barrel1520at location1576with force F3. In these and other embodiments of the present invention, intermediate object1570can be formed of a conductive material, while piston1580can be formed of a nonconductive or insulating material. This arrangement can provide current flow through spring-loaded contact1500while protecting spring1560from excessive currents. Plunger1510can contact intermediate object1570at location1572. Currents can flow through this location through intermediate object1570and to barrel1520at location1576. When piston1580is nonconductive, current does not flow through intermediate object1570to piston1580via location1574. This can protect spring1560from seeing excessive current. When piston1580is conductive, currents can flow through intermediate object1570to piston1580via location1574. Piston1580can be can then contact inside surface of barrel1520providing and other current path to protect spring1560. FIG.17illustrates another spring-loaded contact according to an embodiment of the present invention. Spring-loaded contact1700can be used as spring-loaded contact800(shown inFIG.8.) Spring-loaded contact1700can include plunger1710, intermediate object1750, and spring1760. At least portion1716of plunger1710, intermediate object1750, and spring1760can be housed in barrel1720. Tip1712of plunger1710can extend beyond opening1722of barrel1720. An end of barrel1720can be sealed by seal1724. Spring1760can apply force against intermediate object1750, thereby pushing intermediate object1750against a backside1714of plunger1710. As spring-loaded contact1700engages a corresponding contact, such as contacting surface122of contacts120(shown inFIG.4), plunger1710can be depressed into barrel1720. This can compress spring1760. In this way, spring1760can continue to apply a force pushing tip1712of plunger1510against contacting surface122when the contacts are mated. In these and other embodiments of the present invention, intermediate object1750can be formed of a conductive material. When spring-loaded contact1700is mated with a corresponding contact, plunger1710can contact intermediate object1750at its backside1714. Current can flow through plunger1710and through this location to intermediate object1750and then to barrel1720at location1756. Plunger1710can tilt in barrel1720making contact with barrel1720at location1715and location1719. As a result, current can also flow through plunger1710to barrel1720at location1715and location1719. In these and other embodiments of the present invention, backside1714of plunger1710, and the other backsides of the other plungers shown here, can have various contours. For example, they can be flat, sloped, or otherwise curved, they can be conical or have conical indentations or other non-uniform surfaces. Backside1714of plunger1710can have an off-center conical surface. The backside of the plunger can have a sloped off-center conical surface. FIG.18AandFIG.18Billustrate another spring-loaded contact according to an embodiment of the present invention. Spring-loaded contact1800can be used as spring-loaded contact800(shown inFIG.8.) Spring-loaded contact1800can include plunger1810, piston1850, and spring1860. At least some of plunger1810including wide portion1816, narrow portion1815, and wide portion1813, piston1850, and spring1860can be housed in barrel1820. Tip1812of plunger1810can extend through opening1822of barrel1820. Plunger1810can include narrow portion1815between wide portion1813and wide portion1816. Barrel1820can be sealed with seal1824. Piston1850can include head1852and tail1854. Some of spring1860can encircle tail1854of piston1850, thereby keeping piston1850aligned to spring1860. Spring1860can apply force against head1852of piston1850, thereby pushing head1852of piston1850into backside1814of plunger1810. As spring-loaded contact1800engages a corresponding contact, such as contacting surface122of contacts120(shown inFIG.4), plunger1810can be depressed into barrel1820. This can compress spring1860. In this way, spring1860can continue to apply a force pushing tip1812of plunger1810against contacting surface122when the contacts are mated. In these and other embodiments of the present invention, piston1850can be formed of a conductive material. When spring-loaded contact1800is mated with a corresponding contact, plunger1810can contact piston1850at its backside1814. Current can flow through plunger1810and through this location to piston1850and to barrel1820at location1856. Plunger1810can tilt in barrel1820making contact with barrel1820at location1811of wide portion1816and location1819of wide portion1813. As a result, current can also flow through plunger1810to barrel1820at location1811and location1819. The inclusion of wide portion1816and wide portion1813can help to improve the connection between plunger1810and barrel1820, thereby reducing an impedance of spring-loaded contact1800. In these and other embodiments of the present invention, backside1814of plunger1810, and the other backsides of the other plungers shown here, can have various contours. For example, they can be flat, sloped, or otherwise curved, they can be conical or have conical indentations or other non-uniform surfaces. Backside1814of plunger1810can have an off-center conical surface. The backside of the plunger can have a sloped off-center conical surface. FIG.19illustrates another spring-loaded contact according to an embodiment of the present invention. Spring-loaded contact1900can be used as spring-loaded contact800(shown inFIG.8.) Spring-loaded contact1900can include plunger1910, piston1950, and spring1960. At least a portion1916of plunger1910, piston1950, and spring1960can be housed in barrel1920. Tip1912of plunger1910can extend through opening1922of barrel1920. Barrel1920can be sealed by back portion1980. Back portion1980can include sleeve1982that can fit in barrel1920. Piston1950can include head1952and tail1954. Some of spring1960can encircle tail1954of piston1950, thereby keeping piston1950aligned to spring1960. Spring1960can apply force against piston1950, thereby pushing head1952of piston1950into backside1914of plunger1910. As spring-loaded contact1900engages a corresponding contact, such as contacting surface122of contacts120(shown inFIG.4), plunger1910can be depressed into barrel1920. This can compress spring1960. In this way, spring1960can continue to apply a force pushing tip1912of plunger1910against contacting surface122when the contacts are mated. In these and other embodiments of the present invention, piston1950can be formed of a conductive material. When spring-loaded contact1900is mated with a corresponding contact, plunger1910can contact piston1950at its backside1914. Current can flow through plunger1910and through this location to piston1950and to barrel1920at location1956. Plunger1910can tilt in barrel1920making contact with barrel1920at location1915and location1919of portion1916of plunger1910. As a result, current can also flow through plunger1910to barrel1920at location1911and location1919. In these and other embodiments of the present invention, backside1914of plunger1910, and the other backsides of the other plungers shown here, can have various contours. For example, they can be flat, sloped, or otherwise curved, they can be conical or have conical indentations or other non-uniform surfaces. Backside1914of plunger1910can have an off-center conical surface. The backside of the plunger can have a sloped off-center conical surface. While piston1950can be conductive, it can still be desirable to protect spring1960from current. Accordingly, a portion of piston1950can be insulated or nonconductive. An example is shown in the following figure. FIG.20is an exploded view of the spring-loaded contact ofFIG.19. Spring-loaded contact1900can include plunger1910. Plunger1910can include tip1912, which can extend through opening1922of barrel1920and portion1916, which can be housed in barrel1920. Barrel1920can be sealed by back portion1980. Back portion1980can include sleeve1982, which can be fit inside barrel1920and can be fixed in place, for example by soldering or laser or spot-welding. Barrel can house piston1950. Piston1950can include head1952that can contact backside1914of plunger1910. Piston1950can include tail1954, which can be partially encircled by spring1960. Spring1960can bias piston1950and plunger1910. Insulating piece1958can help to prevent piston1950from electrically contacting spring1960, thereby protecting spring1960. Insulating piece1958can be tape, molded plastic, or other insulating material. Insulating piece1958can be die cut, molded, or formed in other ways. Connector receptacle100(shown inFIG.4) can be employed in a side surface of electronic device300(shown inFIG.1.) When electronic device300is thin or has a low-z height (that is, it has a low profile), it can be difficult for connector receptacle100to provide enough magnetic hold force to secure connector insert200(shown inFIG.8) in place. Accordingly, these and other embodiments of the present invention can provide a connector system having an improved magnetic circuit. This magnetic circuit can provide a magnet array arranged to provide a strong attachment that allows the use of a low-profile connector receptacle and connector insert. The magnet array can include magnets and magnetic elements, where the magnetic elements can be magnetically conductive pole pieces and the magnets can be permanent magnets. Each pole piece can have magnets at two of its sides. The magnets can be arranged in an alternating manner such that the field lines guided by the pole pieces provide a strong magnetic attachment to a magnetically conductive attraction plate of a connector insert at a connecting face. The magnetic circuit can further include an attraction plate arranged to be attracted to the connecting face of the magnet array and to fit in a connector housing the magnet array. Examples are shown in the following figures. FIG.21illustrates a magnet array according to an embodiment of the present invention. Magnet array150can be positioned around contact housing110(shown inFIG.4.) Magnet array150can have connecting face2100adjacent to faceplate180(shown inFIG.4.) Contact housing110can pass through opening168in magnet array150. Magnet array150can include pole piece152, pole piece154a, pole piece154b, pole piece156a, pole piece156b, and pole piece158. Magnet array150can include magnet151, magnet153a, magnet153b, magnet155a, magnet155b, magnet157a, magnet157b, and magnet159. Additional magnets including additional magnet167and additional magnet169can also be included. Each pole piece can be abutted by two or more magnets. In general, each pole piece can have magnets at two or more surfaces. Each pole piece can direct or guide the magnetic field provided by poles of two or more magnets at its surfaces. A pole piece can have two or more magnets oriented with their north poles at surfaces of the pole piece and their south poles away from the surfaces of the pole piece, and the pole piece can direct the magnetic field from the magnet's north poles to connecting face2100of magnet array150. Another pole piece can have magnets oriented with their south poles at surfaces of the pole piece and their north poles away from the surfaces of the pole piece, and the pole piece can direct the magnetic field to the magnet's south poles from connecting face2100of magnet array150. For example, pole piece152can be abutted by a north pole of magnet151, a north pole of magnet153a, and a north pole of magnet153b. Pole piece152can guide magnetic field lines from the north pole of magnet151, the north pole of magnet153a, and the north pole of magnet153bto connecting face2100. (Pole piece152can be labeled “N” in this figure to indicate that magnetic field lines are directed from north poles of magnet151, magnet153a, and magnet153bto connecting face2100. It should be noted that pole piece152, and the other pole pieces, are magnetically soft and do not have an intrinsic polarity.) Accordingly, magnet151, magnet153a, and magnet153bcan have their north pole adjacent to pole piece152and their south pole away from pole piece152. More specifically, pole piece152can have the north pole of magnet151at first surface2110, and the north poles of magnet153aand magnet153bat second surface2130, where first surface2110and second surface2130are opposing surfaces. Pole piece152can further have additional magnet167at third surface2120, where third surface2120is adjacent to first surface2110and adjacent to second surface2130. Additional magnet167can have its north pole adjacent to third surface2120. Pole piece154acan have a south pole of magnet153aat fourth surface2140and a south pole of magnet155aat fifth surface2150, where fourth surface2140and fifth surface2150are opposing surfaces. (Pole piece154acan be labeled “S” in this figure to indicate that magnetic field lines are directed to south poles of magnet153aand magnet153bfrom connecting face2100.) Similarly, pole piece154bcan have a south pole of magnet153band a south pole of magnet155bat opposing surfaces. Pole piece156acan have a north pole of magnet155aand a north pole of magnet157aat opposing surfaces. Pole piece156bcan have a north pole of magnet155band a north pole of magnet157bat opposing surfaces. Pole piece158can have a south pole of magnet157aand a south pole of magnet157bat a surface that opposes a surface adjacent to a south pole of magnet159. Alternatively, pole piece152can have a south pole of magnet151at first surface2110and a south pole of magnet153aand a south pole of magnet153bat second surface2130, where first surface2110and second surface2130are opposing surfaces. Pole piece152can also have a south pole of additional magnet167at third surface2120, where third surface2120is adjacent to first surface2110and adjacent to second surface2130. Pole piece154acan have a north pole of magnet153aat fourth surface2140and a north pole of magnet155aat fifth surface2150, where fourth surface2140and fifth surface2150are opposing surfaces. Similarly, pole piece154bcan have a north pole of magnet153band a north pole of magnet155bat opposing surfaces. Pole piece156acan have a south pole of magnet155aand a south pole of magnet157aat opposing surfaces. Pole piece156bcan have a south pole of magnet155band a south pole of magnet157bat opposing surfaces. Pole piece158can have a north pole of magnet157aand a north pole of magnet157bat a surface that opposes a surface adjacent to a north pole of magnet159. Pole piece152, pole piece154a, pole piece154b, pole piece156a, pole piece156b, and pole piece158can guide field lines having alternating polarities. For example, pole piece152, pole piece156a, and pole piece156bcan guide field lines of a first polarity, while pole piece154a, pole piece154b, and pole piece158can guide field lines of a second polarity. That is, pole piece152can guide field lines from north poles of magnet151, magnet153a, and magnet153b, pole piece154acan guide field lines to south poles of magnet153aand magnet155a, pole piece154bcan guide field lines to south poles of magnet153band magnet155b, pole piece156acan guide field lines from north poles of magnet155aand magnet157a, pole piece156bcan guide field lines from north poles of magnet155band magnet157b, and pole piece158can guide field lines to south poles of magnet157a, magnet157b, and magnet159. Additional magnet167and additional magnet169can be included. For example, additional magnet167can be adjacent to pole piece152. In the example where magnet151, magnet153a, and magnet153bhave their north poles adjacent to pole piece152, additional magnet167can also have its north pole adjacent to pole piece152while the south pole of additional magnet167can face away from pole piece152. Additional magnet169can have its south pole adjacent to pole piece158, while its north pole faces away from pole piece158. Additional magnet167and additional magnet169can further increase a magnetic field at connecting face2100. Each pole piece, such as pole piece152, pole piece154a, pole piece154b, pole piece156a, pole piece156b, and pole piece158, as well as magnetic element2210and magnetic element2212(both shown inFIG.22) and faceplate180(shown inFIG.4) can be formed of a magnetically conductive material, for example a soft magnetic alloy or other magnetically conductive material, such as martensitic stainless steel, ferritic stainless steel, low-carbon steel, iron-cobalt, an iron-silicon or nickel-iron alloy, or other ferro-magnetic material, or other type of material. Each magnet, such as magnet151, magnet153a, magnet153b, magnet155a, magnet155b, magnet157a, magnet157b, and magnet159, as well as additional magnets including additional magnet167, additional magnet169, additional magnet2240a, and additional magnet2242a(both shown inFIG.22), as well as additional magnet2240band additional magnet2242b(not shown) can be a permanent magnet formed of recycled rare-earth magnets, or other rare-earth or other ferro-magnetic material, such as neodymium, neodymium iron boron or nickel-cobalt, or other material. FIG.22illustrates a magnetic circuit according to an embodiment of the present invention. Magnetic flux generated by magnet array150can be guided by one or more magnetic elements. In this example, the magnetic flux generated by magnet array150can be guided by magnetic element2210and magnetic element2220. In these and other embodiments, magnetic element2210and magnetic element2220can be combined into a single magnetic element, or separated into still further magnetic elements. Magnetic element2210and magnetic element2220can be positioned along a backside2230of magnet array150and to the sides2232of magnet array150. These or other magnetic elements can be positioned above or below magnet array150, or they can be omitted to reduce a thickness of the magnetic circuit. Magnetic element2210and magnetic element2220can guide field lines of magnetic flux from magnet array150to attraction plate250. Magnetic element2210and magnetic element2220can reduce the reluctance of magnet array150. That is, magnetic element2210and magnetic element2220can increase and concentrate the magnetic flux of magnet array150into attraction plate250. Contacting surfaces122of contacts120(both shown inFIG.4) can be available at a connecting face2100of magnet array150to form electrical connections with contacting surfaces812in opening251(both shown inFIG.8) of attraction plate250of connector insert200(shown inFIG.8.) In this configuration, magnet151, magnet153a, magnet153b(shown inFIG.21), magnet155a, magnet155b(shown inFIG.21), magnet157a, magnet157b(shown in FIG.21), and magnet159can be positioned to provide flux into pole piece152, pole piece154a, pole piece154b(shown inFIG.21), pole piece156a, pole piece156b(shown inFIG.21), and pole piece158. The interface between each magnet and pole piece, such as first surface2110(shown inFIG.21) can be increased in area, as can the thickness of each magnet. Strong rare-earth magnets can be used to further increase the flux provided by magnet array150, thereby increasing the magnetic attraction between magnet array150and attraction plate250. Additional magnets including additional magnet167and additional magnet169can also be positioned at, and coincident with, rear surfaces of pole piece152and pole piece158, respectively. Further additional magnets including additional magnet2240a, additional magnet2240b(not shown), additional magnet2242a, and additional magnet2242b(not shown) can be positioned at, and coincident with, rear surfaces of pole piece154a, pole piece154b, pole piece156a, and pole piece156b, respectively. These further additional magnets can increase the magnetic flux in pole piece154a, pole piece154b, pole piece156a, and pole piece156b, thereby increasing the attraction force of magnet array150. Magnetic element2210and magnetic element2220can be formed of various materials. For example, magnetic element2210and magnetic element2220can be formed of a magnetically conductive material, for example a soft magnetic alloy or other magnetically conductive material, such as martensitic stainless steel, ferritic stainless steel, low-carbon steel, iron-cobalt, an iron-silicon or nickel-iron alloy, or other ferro-magnetic material, or other type of material. The configuration of this magnetic circuit including magnet array150can vary in these and other embodiments of the present invention. For example, attraction plate250can be formed of a pole piece and magnet assembly similar to magnet array150. Different numbers of pole pieces and magnets can be used. For example, one, two, or more than two permanent magnets can be used. Additional magnet167, additional magnet169, additional magnet2240a, additional magnet2240b, additional magnet2242a, and additional magnet2242bcan be included or omitted, as can magnetic element2210and magnetic element2220. Also, the relative thickness and dimensions of the pole pieces and magnets can vary. For example, pole piece154a, pole piece154b, pole piece156a, and pole piece156bcan be narrower or shorter than magnet153a, magnet153b, magnet155a, magnet155b, magnet157a, and magnet157b. Alternatively, magnet153a, magnet153b, magnet155a, magnet155b, magnet157a, and magnet157bcan be narrower or shorter than pole piece154a, pole piece154b, pole piece156a, and pole piece156b. The same can be true for pole piece152and pole piece158as compared to magnet151and magnet159. The addition of magnetic element2210and magnetic element2220can increase the size of connector receptacle100. Accordingly these and other embodiments of the present invention can employ alternative structures to reduce a size of connector receptacle100. An example is shown in the following figure. FIG.23illustrates an alternative exploded view of the connector receptacle ofFIG.2. Connector receptacle2300can be used as connector receptacle100(shown inFIG.2.) Connector receptacle2300can include magnet array2350. Magnet array2350can be the same or similar to magnet array150(shown inFIG.21), and can include or omit additional magnet additional magnet2240a, additional magnet2240b, additional magnet2242a, and additional magnet2242b(shown inFIG.22.) Connector receptacle2300can further include magnetic element2210and magnetic element2220. Magnetic element2210and magnetic element2220can have backside2230and sides2232around magnet array2350. Connector receptacle2300can include connector housing2310around contacts2320. Connector housing2310can include mesa2312. Contacts2320can include contacting surfaces2322on mesa2312. Contact housing2310and contacts2320can be the same or similar to contact housing110and contacts120(both shown inFIG.4.) Contacts2320can be further supported by housing2330. Contacts2320can pass through openings2334in housing2330. Housing2330can include posts2332, which can fit in openings (not shown) in substrate620(shown inFIG.6.) Connector receptacle2300can include brackets and associated structures, such as brackets160, slots135, and openings194as shown inFIG.5above. When housing2330includes posts2332, the adjustment provided by brackets160can be omitted. Instead, a single bracket2360can include vertical portion2364that can be attached to backside2230of magnetic element2210and magnetic element2220, for example by spot or laser welding. Bracket2360can include openings2362for fasteners610(shown inFIG.6) to secure connector receptacle2300to substrate620(shown inFIG.6.) Bracket2360can be pre-biased (that is, sloped relative to substrate620) as it extends away from magnetic element2210and magnetic element2220. The slope can be either towards or away from substrate620. As fastener610is inserted into fastener opening630(shown inFIG.6) in substrate620, for example by turning a screw used as fastener610into a threaded fastener opening630, bracket2360can flatten (that is, become parallel to substrate620.) This change can provide a range through which mesa2312of connector receptacle2300can be positioned in recess113(shown inFIG.5.) Connector receptacle2300can include further include faceplate2380. Faceplate2380can include opening2382, which can provide a passage for contact housing2310. Mesa2312can be adjacent to faceplate2380. Faceplate2380can be the same or similar to faceplate180(shown inFIG.4.) Connector receptacle2300can be shielded by top cover2370and bottom cover2375. Top cover2370and bottom cover2375can be formed of stainless steel or other shielding material. Various structures and materials can be used to provide further support for contacts2320. For example, an adhesive, epoxy, silicone, or other material can be formed or otherwise inserted around portions of contacts2320. For example, a room-temperature-vulcanizing silicone or other silicone can form dampener2390, which can be inserted or formed between magnet array2350, housing2330, contact housing2310, magnetic element2210, and magnetic element2220. Dampener2390can reduce a vibration of contacts2320that can be caused by speakers, haptic components, actuators, or other components in or near electronic device300housing connector receptacle2300, or by the magnetic field generated by magnet array2350interacting with variable current flowing through contacts2320. The silicone for dampener2390can be injected through opening2372in top cover2370. Alternatively, dampener2390can be formed ahead of time and slid over contacts2320. Other dampeners can be utilized for noise reduction and the protection of magnet array2350. For example, silicone strips2392,2394, and2396can be positioned between a top surface2352of magnet array2350and top cover2370. Top cover2370and bottom cover2375can attach to magnetic element2210and magnetic element2220, for example using spot or laser welding. Silicone strips2392,2394, and2396can be used to consume the vertical space between top cover2370and bottom cover2375that is not used by magnet array2350. Silicone strips2392,2394, and2396can prevent vibration between top cover2370and magnet array2350, and between bottom cover2375and magnet array2350. Silicone strips2392,2394, and2396can be formed ahead of time and placed on top surface of magnet array2350and then covered by top cover2370, or silicone in the pattern of silicone strips2392,2394, and2396can be dispensed on top surface2352of magnet array2350and then covered by top cover2370during assembly. Alternatively, silicone strips2392,2394, and2396can be formed ahead of time and placed on top cover2370, which can then be placed against top surface2352of magnet array2350, or silicone in the pattern of silicone strips2392,2394, and2396can be dispensed on top cover2370, which can then be placed against top surface2352of magnet array2350during assembly. Additional dampers (not shown) can be located between magnet array150and bottom cover2375. As before dampeners can be positioned between contact housing2310and magnet array2350to protect magnet array2350and to reduce vibration. For example, silicone can be placed or formed along sides of contact housing2310to form dampeners, such as dampener117and dampener119(shown inFIG.4.) Additional dampeners (not shown) can be include along top and bottom sides of contact housing2310. The silicone or other material for dampener117and dampener119can be formed ahead of time and placed in the desired location. The silicone or other material for dampener117and dampener119can instead be injected between contact housing2310and magnet array2350and cured in place. While embodiments of the present invention can provide connector inserts and connector receptacles for delivering power, these and other embodiments of the present invention can be used as connector receptacles in other types of connector systems, such as connector systems that can be used to convey power, data, or both. In various embodiments of the present invention, contacts, shields, plungers, springs, pistons, intermediate objects, barrels, and other conductive portions of a connector receptacle or connector insert can be formed by stamping, metal-injection molding, machining, micro-machining, CNC machining, 3-D printing, or other manufacturing process. The conductive portions can be formed of stainless steel, steel, copper, copper titanium, phosphor bronze, or other material or combination of materials. They can be plated or coated with nickel, gold, or other material. The springs can be coated with parylene. The nonconductive portions, such as housings, locks, pistons, and other structures can be formed using injection or other molding, 3-D printing, machining, or other manufacturing process. The nonconductive portions can be formed of silicon or silicone, rubber, hard rubber, plastic, nylon, glass-filled nylon, liquid-crystal polymers (LCPs), ceramics, or other nonconductive material or combination of materials. The printed circuit boards or other boards used can be formed of FR-4 or other material. Embodiments of the present invention can provide connector receptacles and connector inserts that can be located in, and can connect to, various types of devices such as portable computing devices, tablet computers, desktop computers, laptops, all-in-one computers, wearable computing devices, smart phones, storage devices, portable media players, navigation systems, monitors, power supplies, video delivery systems, adapters, remote control devices, chargers, and other devices. These connector receptacles and connector inserts can provide interconnect pathways for signals that are compliant with various standards such as one of the Universal Serial Bus (USB) standards including USB Type-C, High-Definition Multimedia Interface® (HDMI), Digital Visual Interface (DVI), Ethernet, DisplayPort, Thunderbolt™, Lightning™ Joint Test Action Group (JTAG), test-access-port (TAP), Peripheral Component Interconnect express, Directed Automated Random Testing (DART), universal asynchronous receiver/transmitters (UARTs), clock signals, power signals, and other types of standard, non-standard, and proprietary interfaces and combinations thereof that have been developed, are being developed, or will be developed in the future. Other embodiments of the present invention can provide connector receptacles and connector inserts that can be used to provide a reduced set of functions for one or more of these standards. In various embodiments of the present invention, these interconnect paths provided by these connector receptacles and connector inserts can be used to convey power, ground, signals, test points, and other voltage, current, data, or other information. It is well understood that the use of personally identifiable information should follow privacy policies and practices that are generally recognized as meeting or exceeding industry or governmental requirements for maintaining the privacy of users. In particular, personally identifiable information data should be managed and handled so as to minimize risks of unintentional or unauthorized access or use, and the nature of authorized use should be clearly indicated to users. The above description of embodiments of the invention has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form described, and many modifications and variations are possible in light of the teaching above. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications to thereby enable others skilled in the art to best utilize the invention in various embodiments and with various modifications as are suited to the particular use contemplated. Thus, it will be appreciated that the invention is intended to cover all modifications and equivalents within the scope of the following claims. | 53,781 |
11942723 | It is emphasized that, in the drawings, various features are not drawn to scale. In fact, in the drawings, the dimensions of the various features have been arbitrarily increased or reduced for clarity of discussion. DETAILED DESCRIPTION The following detailed description refers to the accompanying drawings. Wherever possible, same reference numbers are used in the drawings and the following description to refer to the same or similar parts. It is to be expressly understood that the drawings are for the purpose of illustration and description only. While several examples are described in this document, modifications, adaptations, and other implementations are possible. Accordingly, the following detailed description does not limit disclosed examples. Instead, the proper scope of the disclosed examples may be defined by the appended claims. The terminology used herein is for the purpose of describing particular examples and is not intended to be limiting. As used herein, the singular forms “a” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. The term “another,” as used herein, is defined as at least a second or more. The term “coupled,” as used herein, is defined as connected, whether directly without any intervening elements or indirectly with at least one intervening element, unless indicated otherwise. For example, two elements may be coupled mechanically, electrically, magnetically, or communicatively linked through a communication channel, pathway, network, or system. Further, the term “and/or” as used herein refers to and encompasses any and all possible combinations of the associated listed items. It will also be understood that, although the terms first, second, third, fourth, fifth, sixth, seventh, eighth, etc. may be used herein to describe various elements, these elements should not be limited by these terms, as these terms are only used to distinguish one element from another unless stated otherwise or the context indicates otherwise. As used herein, the term “includes” means includes but not limited to, the term “including” means including but not limited to. The term “based on” means based at least in part on. Computing systems, for example, storage systems, servers, edge-computing systems, and the like, may include several electronic devices that are installed on a motherboard. The motherboard may include a printed circuit board having several electronic devices (e.g., integrated circuits, resistors, capacitors, transistors, diodes) disposed thereon. Further, the motherboard may also include certain receiving connectors/sockets to receive any additional electronic devices. For example, electronic devices such as, but not limited to, additional integrated circuits, power supply modules, and storage modules having one or more storage devices may be removably coupled to the motherboard via the receiving connectors. Moreover, modern-day computing systems offer increased modularity to accept variety of electronic devices to be removably connected to the motherboards via certain industry standard connectors. A device capable of being removably coupled to the motherboard may typically include a connector to couple the device with a corresponding receiving counterpart (e.g., a receiving connector or socket) disposed on the motherboard. Further, certain devices that are removably coupled to the motherboard may be housed in a metallic or plastic body that houses the several electronic components. For example, a storage module may include one or more storage devices (e.g., hard drives) housed within an enclosure/housing. During manufacturing of such devices, there may exist certain tolerances in the dimensions of the enclosures and/or the connector through which the device can be coupled to the corresponding receiving counterpart on the motherboard. In the field of operation, some devices may be manually installed on the motherboard, where in certain instances, the tolerances in the dimensions of the enclosure and/or the connector may cause faulty installation of the device on the motherboards due to any misalignment. Moreover, in some cases, due to such misalignment, several efforts may be made to re-install the device on the motherboard. The misalignments and such several unsuccessful attempts to install the device may cause wear and tear, and in some instances, damages, to the connector and/or the corresponding counterpart on the motherboard. The damages, wear and tear may lead to costly replacement of the parts, in some instances. Further, due to advances in the technology, clock speeds at which modern-day electronic devices are operating have also increased. Accordingly, height (or length) of connecting fingers on connectors and the receptacles on the counterpart have reduced drastically (e.g., up-to 1.2 mm or less). Such a low height of the connecting fingers may cause the connector to decouple from the counterpart on the motherboard. Alternatively, to avoid such decoupling, the connectors may include fasteners (e.g., screws) to couple the connector with the counterpart. Such installation may require tools to enable a mechanical coupling between the connector and the counterpart while still being susceptible to damages, wear and tear caused due to any misalignment. Examples disclosed herein address these technological issues by disposing a connector in a connector housing that is movable with respect to a body of connecting device and by using a biasing member and to retain the connector in contact with a receiving structure when the connecting device is connected to a receiving device. For example, the connector assembly as presented herein may include a connector connectible with a corresponding receiving structure on a receiving device separate from the connecting device. Further, the connector assembly may include connector housing enclosing the connector. The connector housing may include a mounting lever engaged with a body of the connecting device to secure the connector housing with the connecting device and allow the connector housing to move relative to the body of the connecting device. The connector assembly may also include a biasing member disposed within the connector housing to bias the connector toward the receiving structure on the receiving device. The connector may be disposed in the connector housing that is movable relative to the body of the connecting device. Such connector housing may provide certain degree of freedom (e.g., movement in an X-Y direction) to adjust a seating position of the connector which can reduce any wear and tear or damages to the connector and/or the receiving structure on the receiving device (e.g., motherboard). Additionally, use of the biasing member may ensure a tight coupling between the connector and the receiving structure when the connecting device is installed in the receiving device. As such, the biasing member may provide a biasing force in a Z-direction (perpendicular to the X and Y directions). Accordingly, use of the connector assembly enables the connector to be connected to the receiving structure without requiring a separate manual connection of the connector. Moreover, use of the connector assembly enables a tool less secure coupling of the connector. Referring now to the drawings, inFIG.1, a perspective view of a system100is depicted, in accordance with an example. The system100may be a computing system or any other electronic system that may be capable of storing data, processing data, and/or communicating data with external devices. Non-limiting examples of the system100may include, but are not limited to, a server, a storage device, a composable infrastructure with compute, storage, and/or networking resources, a network switch, a router, a mobile communication device, a desktop computer, a portable computer, a networked resource enclosure, an edge-computing device, or a WLAN access point. The server may be a blade server, for example. The storage device may be a storage blade, for example. In some examples, the system100may include a receiving device102and a connecting device104. The receiving device102may include a printed circuit assembly alternatively referred to as a motherboard106. The motherboard106may include several electronic components and modules108that are either permanently attached (e.g., soldered) or removably attached to the motherboard106. The term “removably attached” or “removably coupled” as used herein may refer to a coupling arrangement between two components that allows the coupled components to be decoupled and coupled again when desired. In some implementations, certain electronic components, such as resistors, diodes, transistors, integrated circuits, may be permanently soldered to the motherboard106. However, certain devices, for example, memory modules such as random access memory (RAM) chips may be removably coupled on the motherboard106on a respective chip socket. Moreover, the connecting device104may refer to a device that can be removably coupled to the motherboard106to enhance various capabilities of the system100. By way of example, the connecting device104may be a storage module, a compute module, a networking module, a communication module, power supply module, a cooling module, and the like. In some other examples, the connecting device104may be any electronic device capable of being coupled to the receiving device102. The connecting device104may be able to establish data and/or power transfer with the motherboard106when coupled to the motherboard106. In the description hereinafter, for illustration purposes, the connecting device104is described as a storage module including a plurality of storage devices109(e.g., hard disk drives, solid-state drives, etc.). Additional details of the connecting device104are described in conjunction withFIG.3. In some examples, the connecting device104may be coupled to the motherboard106such that electrical and/or data communication may be established between the receiving device102and the connecting device104. For example, if the connecting device104is a storage module, when the connecting device104is coupled to the motherboard106, electrical and/or data communication may be established between any compute resource (e.g., processor, not shown) disposed on the motherboard106and one or more storage devices109of the storage module. The electrical and/or data communication between the receiving device102and the connecting device104may be established via connectors. For example, the connecting device104may be equipped with a connector (seeFIG.4) and the receiving device102may include corresponding receiving structure (seeFIG.2). In accordance with aspects of the present disclosure, the connecting device104may include a connector assembly110that may house the connector and facilitate electrical and/or data communication between the receiving device102and the connecting device104while reducing wear and tear or damages to the connector and/or the receiving structure on the receiving device102. Moreover, the connector assembly110may also facilitate a tool less secure coupling between the receiving device102and the connecting device104without use of extra fixtures (e.g., screws). Additional details of the connector assembly110will be described in conjunction withFIGS.3-11. Referring now toFIG.2, a perspective view200of a portion111of the receiving device102of the system100ofFIG.1is depicted, in accordance with an example. As depicted inFIG.2, in the portion111of the receiving device102may be a region of the motherboard106that receives the connecting device104. The connecting device104may be disposed on the motherboard106so that the electrical and/or data communication may be established between the receiving device102and the connecting device104. By way of example, the motherboard106may include a receiving structure112to which the connector assembly110may be coupled to when the connecting device104may be disposed on the motherboard106. Accordingly, a position of the connector assembly110on the connecting device104may be arranged so that the connector assembly110is aligned with a position of the receiving structure112on the motherboard106, and vice-versa. In some examples, a profile of the receiving structure112may be selected so that when the connecting device104is disposed on the motherboard106, the connector (seeFIG.4) of the connector assembly110may be engaged with the receiving structure112. For example, if the connector of the connector assembly110is a male-type plug, the receiving structure112may be a corresponding female-type receiver socket. For illustration purposes, in the example ofFIG.2, the receiving structure112is shown to be a TA-1002 female-type receiver socket. In some examples, the receiving structure112may include a plurality of receptacles that may contact corresponding connecting fingers (described later) on the connector of the connector assembly110. Moving now toFIG.3, a perspective view300of the connecting device104having the connector assembly110is depicted, in accordance with an example. Further,FIGS.4-8depicting additional features of the connector assembly110are also described concurrently with the description ofFIG.3for ease of illustration. As depicted inFIG.3, the connecting device104may include a body114. The body114of the connecting device104, in some examples, may serve as a housing for several components (e.g., circuit boards, storage devices109, electronic components, etc.) of the connecting device104. In certain examples, the body114may include several openings, holes, or a mesh-profile to aid in cooling of the components disposed inside the body114. Further, in some examples, the connecting device104may include a backplane printed circuit assembly (RCA)116that may interconnect one or more of the components of the connecting device104and/or provide connections of some of the components of the connecting device104with external devices (e.g., the motherboard). By way of example, the backplane RCA116may include at least one port, such as a port118that provide access to the components, for example, one or more storage devices of the connecting device104. In some examples, the connector assembly110may be electrically coupled to the port118via a cable126. The connector assembly110may, in-turn, couple the port118of the connecting device104with the motherboard106so that components (e.g., the computing resources) disposed on the motherboard106can access the components (e.g., the one or more storage devices) in the connecting device104. In some examples, the connector assembly110may include a connector120. A detailed perspective view400of the connector120is depicted inFIG.4, in accordance with one example. The connector120may be connectible with the corresponding receiving structure112on the receiving device102. For example, the connector120may be selected so that when the connecting device104is disposed on the motherboard106, the connector120may be engaged with the receiving structure112. By way of example, the connector120of the connector assembly110may be a male-type plug if the corresponding the receiving structure112is a female-type receiver socket. Further, if the connecting device104is a storage module having a plurality of storage devices109(seeFIG.1), the connector120may be coupled to at least one storage device of the plurality of storage devices to facilitate data transfer for the at least one storage device. For illustration purposes, in the example ofFIGS.3and4, the connector120is shown to be a TA-1002 type male plug. Although, the connector120is described as being an electrical connector, the connector120may as well be an optical connector or any other type of connector without limiting the scope of the present disclosure. In some examples, as depicted inFIG.4, the connector120may include a connector body122and a plurality of connecting fingers124that may contact the corresponding receptacle in the receiving structure112when the connecting device104is disposed on the receiving device102. In some examples, the connector body122may be formed of an electrically insulating material (e.g., plastic) and the connecting fingers124may be formed of an electrically conductive material (e.g., metal). Further, in some examples, connector assembly110may include the connecting cable126that couples the connector120with the port118. In particular, the connecting cable126may cause electrical coupling between the port and the connecting fingers124in the connector120. Referring toFIGS.3,5, and6in some examples, the connector assembly110may include a connector housing130. The connector housing130may enclose the connector120. The connector housing130may be movably coupled to the body114of the connecting device104. The term “movably coupled” or “movable coupling” may refer to a coupling between two components that allows one component to move relative to another component. For example, the connector housing130may be coupled to the body114such that the connector housing130may move relative to the body114while being in engagement with the body114. To establish such movable coupling, the connector housing130may include a mounting lever132. The mounting lever132may be engaged with the body114of the connecting device104to secure the connector housing130with the body114of the connecting device104such that the connector housing130can move relative to the body114. More particularly, the mounting lever132may be engaged with the body114at an anchor location134on the body114and is able to move relative to the anchor location134(seeFIG.6). In some examples, the mounting lever132(seeFIGS.5-9) may include an end section136that is movably coupled with the body114of the connecting device104. For example, in perspective views500,700, and900depicted respectively inFIGS.5,7, and9, the end section of the mounting lever132may be a cylindrical end section136. Further, the body114may also have a cylindrical groove138at the anchor location134. The connector housing130may be coupled to the body114by inserting the cylindrical end section136into the cylindrical groove138. Such engagement of the cylindrical end section136with the cylindrical groove138may allow an angular movement of the connector housing130with respect to a central axis139of the cylindrical end section136. In certain examples, the cylindrical end section136and the cylindrical groove138may be dimensioned so that the connector housing130may be able to rotate with respect to the central axis139of the cylindrical end section136. For instance, an outer diameter of the cylindrical end section136may be smaller than an inner diameter of the cylindrical groove138. By way of example,FIG.7depicts one such perspective view700of the connecting device104where the connector assembly110is shown as rotated in comparison to a position of the connector assembly110depicted inFIG.3. Further, inFIG.6, the perspective view600showing the connecting device104disposed in the system100ofFIG.1is depicted, in accordance with an example. For example, the perspective view600depicts a detailed view showing engagement between the mounting lever132and the groove138in the body114of the connecting device. In accordance with the aspects of the present application, the mounting lever132may be engaged with the body114of the connecting device104such that the mounting lever132can move back and forth, for example, along directions145and147that are opposite to each other and perpendicular to the central axis139of the end section136. In particular, the groove138and/or the end section136may be dimensioned such that such movement of the end section136along the directions145and147may be allowable. In one example, to allow such movement of the section136, the groove138may be dimensioned to have an inner diameter greater than a diameter of the section136, More particularly, the groove138may be dimensioned so that there exists some space inside the groove138for the end section136to travel along the directions145and147. Advantageously, such connector housing130having the mounting lever132engaged in the groove138may provide certain degree of freedom (e.g., movement in an X-Y direction) to adjust a seating position of the connector120which can reduce any wear and tear or damages to the connector120and/or the receiving structure112on the motherboard106. Further, in some examples, an opening137(e.g., mouth) of the groove138defined by faces141and143is dimensioned such that the mounting lever132is retained in the groove138. In particular, in some examples, a distance between the faces141and143(e.g., width of the opening) may be kept smaller than the diameter of the end section136. Hence, the mounting lever132may be stopped from being drifted or pulled away in a direction perpendicular to the central axis139of the end section136. In an alternative implementation, the end section136of the mounting lever132may include an opening (not shown). In such an implementation, the end section136may be coupled to the body114of the connecting device104using a fixture passing through the opening in the end section136and reaching into the body114of the connecting device104. By way of example, the fixture may be a pin or a nail with a head section and an elongated body having a tail section. The head section may have larger cross-sectional area than the rest of the body of the pin. The pin may be inserted in the opening formed in the end section136such that the tail section of the fixture is inserted into and secured with the body114at the anchor location134. Once the fixture is installed as described hereinabove, the head section of the fixture may restrict an axial movement of the mounting lever132along the central axis139of the end section136. Further, an outer diameter of the elongated body of the fixture may be smaller than an inner diameter of the opening formed in the end section136so that when the fixture is inserted in the opening, the connector housing130may have angular movement with respect to the fixture. Referring back toFIGS.3and5, in some examples, the connector housing130may include a latch lever140. The latch lever140may be located on an opposite side of the mounting lever132. The latch lever140may be removably snap-fitted to the body114of the connecting device104to facilitate additional securing of the connector assembly110with the body114. In some examples, to aid in such snap fitting, the latch lever140may include a latch opening142. Further, the body114may also be provisioned with a latch protrusion144(also shown inFIG.7). In one example, the latch protrusion144may be formed via an extended part of the body114. In another example, the latch protrusion144may be a screw inserted into the body114that aligns with the latch opening142when the connector assembly110is brought closure to the latch protrusion144by rotating the connector housing130. Further, when a force is applied on the connector housing130in a direction146, the latch lever140may be snap-fitted to the body114of the connecting device104, as depicted inFIG.3. Additionally, as depicted in a perspective view800ofFIG.8and the perspective view700ofFIG.7, the connecting device104may be provisioned to have a locking arrangement to stop the connector assembly110from being drifted away from the groove138, for example along the central axis139in the direction149. To effect such locking, the body114of the connecting device104may include a locking protrusion162and the connector housing130may include an opening164that may align with the locking protrusion162when the latch lever140engages with the latch protrusion144(seeFIG.8). Accordingly, when the latch lever140engages with the latch protrusion144, the locking protrusion162may be inserted into the opening164. Such engagement of the locking protrusion162with the opening164may minimize the movement of the connector assembly110in the direction149such that the mounting lever132remains engaged with the groove138and the body114of the connecting device. Furthermore, in some examples, the connector assembly110may include a biasing member148to bias the connector120toward the receiving structure112when the connecting device104is disposed on the receiving device102.FIGS.9,10A-10B, and9respectively depict perspective views900,1000A,1000B, and1100depicting arrangement of the biasing member148in the connector assembly110, in accordance with some examples. For ease of illustration,FIGS.9-11are referenced concurrently in the description hereinafter. Further, to depict a placement of the biasing member148, a portion of the connector housing130is not shown in the perspective view900ofFIG.9. Such portion of the connector housing that is missing or not shown inFIG.9is depicted as a connector housing portion154inFIGS.10A and10B. Examples of the biasing member148may include, but are not limited to, coil springs, one or more bent wires, rubber blocks, or combinations thereof. For illustration purposes, inFIGS.9-11, the connector assembly110is shown to include a bent-wire element as the biasing member148. It may be noted that other types of elastic elements, such as, the coil springs, rubber locks may also be employed in the connector assembly110as the biasing member148without limiting the scope of the present application. Moreover, while the biasing member148is shown to be a u-shaped bent-wire element, the bent-wire element may be in any suitable configuration capable of applying the biasing force on the connector120. In some examples, the connector housing130may include a retaining structure150(seeFIGS.10A and10B) formed in the connector housing portion154to restrict a movement of the biasing member148. The retaining structure150may be a protruding wall within the connector housing130. Referring now toFIGS.10A and10B, the connector housing portion154may include internal guideways151to retain the biasing member148inside the connector housing130. The internal guideways151may be formed adjacent to the retaining structure150. In one example, the internal guideways151are formed such that the internal guideways151terminate at the retaining structure150. In particular, the biasing member148is disposed in the connector housing130via the internal guideways151such that ends152of the biasing member148face the retaining structure150. For example, the biasing member148may be inserted into the connector housing portion154by sliding the biasing member148into the internal guideways151in a direction153. Upon insertion into the internal guideways151, the biasing member148may be compressed at side edges155due to contact with a surface of the internal guideways151. Further, due to its spring action, the biasing member148may also apply an outward force on the surface of the internal guideways151through the side edges155. In particular, such contact forces between the biasing member148and the internal guideways may aid in retaining the biasing member148in the connector housing130. Further, the biasing member148may be inserted into the guideways151such that the ends152may face/touch the retaining structure150upon insertion and a portion156of the biasing member148may remain outside of the guideways151, thereby resulting in an assembly depicted inFIG.10B. Referring now toFIG.11, an internal cross-sectional perspective view1100of the connector assembly110showing the positioning arrangement of the biasing member148is depicted, in accordance with one example. In the cross-sectional perspective view1100ofFIG.11, the connector housing portion154is not shown for aiding better visibility of positioning of the biasing member148with respect to the connector body122. The biasing member148may be disposed in the connector assembly110such that a biasing force exerted by the biasing member148is applied on the connector120in a direction toward the receiving structure112when the connecting device104is installed on the motherboard106. The biasing member148may be disposed in such a way that the portion156of the biasing member148may contact the connector body122and apply the biasing force on the connector body122when the connecting device104is installed on the motherboard106. In particular, when the connecting device104is installed on the motherboard106, the connector body122may tend to move upward thereby compressing the biasing member148. The ends152of the biasing member148in-turn receive a force from the retaining structure150when the biasing member is compressed via the connector body122. Consequently, a biasing force may be applied back on the connector body122by the biasing member148via the portion156thereby keeping the connector body122forced toward the receiving structure112on the motherboard106. In some examples, in order to minimize or avoid excessive force being applied on the receiving structure112by the connector120and to retain the connector body122within the connector housing130, the connector housing130may include movement limiter slot158that restricts the movement of the connector120toward the receiving structure112caused due to the biasing force applied by the biasing member148. Further, to aid in such feature of limiting the movement of the connector120, the connector120may also include a protruded wall section160. The protruded wall section160may be formed on the connector body122. The protruded wall section160may encounter the movement limiter slot158and movement of the connector120beyond the movement limiter slot158may be restricted. Referring now toFIG.12, a flow diagram of a method1200for forming a connector assembly, such as the connector assembly110is presented, in accordance with one example. For ease of illustration, the method1200ofFIG.12will be described in conjunction with the precedingFIGS.1-11. At block1202, a connector housing such as the connector housing130may be provided. As previously noted, the connector housing130may include the mounting lever132that is engageable with the body114of the connecting device104to secure the connector housing130with the connecting device104and allow the connector housing130to move relative to the body114of the connecting device104. Moreover, at block1204, a biasing member such as the biasing member148may be disposed in the connector housing130. In some examples, disposing the biasing member148may include sliding the biasing member148into the internal guideways151formed in the connector housing130such that ends152of the biasing member148face the retaining structure150formed in the connector housing130(seeFIG.10B) and the portion156of the biasing member148may remain outside the internal guideways151. Further, at block1206, a connector such as the connector120may be disposed in the connector housing130. The connector120is connectible with the corresponding receiving structure112on the receiving device102. In some examples, the connector120may be disposed in the connector housing130by inserting the connector body122in a cavity defined by the connector housing130. In some examples, the connector120and the biasing member148are positioned such that the connector120is biased toward the receiving structure112on the receiving device102when the connecting device104is installed on the motherboard106of the receiving device102. The connector assembly110, in accordance with various aspects of the present disclosure, is movable relative to the body114of the connecting device104that can reduce any wear and tear or damages to the connector120and/or the receiving structure112on the receiving device102. Additionally, use of the biasing member148may ensure a tight coupling between the connector120and the receiving structure112when the connecting device104is installed in the receiving device102. Further, as will be appreciated, use of the connector assembly110enables the connector120to be connected to the receiving structure112without requiring a separate manual connection of the connector120. Moreover, use of the connector assembly110may enable tool less secure coupling of the connector120with the receiving structure112. While certain implementations have been shown and described above, various changes in form and details may be made. For example, some features and/or functions that have been described in relation to one implementation and/or process may be related to other implementations. In other words, processes, features, components, and/or properties described in relation to one implementation may be useful in other implementations. Furthermore, it should be appreciated that the systems and methods described herein may include various combinations and/or sub-combinations of the components and/or features of the different implementations described. In the foregoing description, numerous details are set forth to provide an understanding of the subject matter disclosed herein. However, implementation may be practiced without some or all of these details. Other implementations may include modifications, combinations, and variations from the details discussed above. It is intended that the following claims cover such modifications and variations. | 33,214 |
11942724 | DETAILED DESCRIPTION The inventor has recognized and appreciated various design techniques for electrical connectors that enable an electrical connector (e.g., a receptacle connector) to connect with a mating connector (e.g., a plug connector) such that the mated pair occupies a small volume while providing reliable operation for high-integrity signal interconnects. Although the electrical connector may be relatively compact in size, proper connection of the electrical connector with the mating connector may be made easily and reliably by a user due to design features that make the electrical connector robust and user-friendly as well as compact. The robustness and ease of use of the electrical connectors according to various embodiments of the present invention may provide users with a level of assurance that routine mating operations will be unlikely to cause damage. For example, in some embodiments, features of the electrical connector may minimize or prevent misalignment and/or may enable users to easily ascertain that the electrical connector is properly aligned before a mating force is applied to seat the electrical connector and the mating connector in a mated position. The inventor has further recognized and appreciated that compact electrical connectors may be more likely to be damaged by some forces than other forces as a result of their miniaturized size. For example, in mating a plug connector with a receptacle connector, although it may be preferred to have a force be applied in a direction parallel to an axial direction of the receptacle connector, in practice, however, a user may not pay special attention to an angle at which the plug connector is oriented with respect to the receptacle connector, or the location of the receptacle connector may be such that user may not be able to see whether the angle at which the plug connector is oriented is aligned with the axial direction of the receptacle connector. Thus, the receptacle connector may be subjected to an applied external force that is not parallel to the axial direction of the receptacle connector. Such off-axis forces can impact the receptacle connector in ways that impact the integrity of signals passing through the receptacle connector. Off-axis forces, for example, may cause the receptacle connector to tilt. In some situations, an off-axis force may be sufficient to break solder joints connecting metal terminals of the receptacle connector to a PCB. In other scenarios, an off-axis force may deform the metal terminals, shift their positions, or otherwise alter their signal paths through the receptacle connector in ways that degrade the integrity of signals passing through the receptacle connector. Damage may also result if a user attempts to press the plug connector into the receptacle connector with the wrong orientation or with the plug connector misaligned (e.g., laterally shifted) with respect to the receptacle connector. For example, when a user attempts to insert a misaligned plug connector, the receptacle connector may be subjected to a large force, such as 55 N or more. In addition to the potential damage to the solder connections of the metal terminals, discussed above, the force may be sufficient to deform or break one or more portions of an insulating body of the receptacle connector, including a portion bounding a receiving portion in which the plug connector is to be seated when properly mated with the receptacle connector. The receptacle connector may then cease to be able to hold the plug connector snugly and reliably, thus creating the possibility of intermittent disconnection between the plug and receptacle connectors. Consequently, the receptacle connector may lose its functionality and, in turn, normal operation of an electronic device employing the receptacle connector may cease. The above-noted risks of damage are greater for compact connectors, such as those with metal terminals spaced, center to center, at 0.6 mm or less, such as connectors with a terminal spacing of 0.5 mm or less, or 0.4 mm or less, or 0.35 mm or less. Some aspects of the present technology described herein may reduce or eliminate the possibility of improper orientation of a plug connector during a mating operation with a receptacle connector. Some aspects may reduce or eliminate the possibility of misalignment between the plug and receptacle connectors. Some aspects may minimize or eliminate the application of damaging forces during a mating operation. The inventor has recognized that at times an electrical connector may need to be reliably and securely connected to some mating connectors in any of two reversible orientations and at other times the electrical connector may need to be reliably and securely connected to some other mating connectors in only a single orientation. For example, the electrical connector may be connected to a first type of mating connector with a front surface of the first type of mating connector facing frontward or facing rearward, and the same electrical connector may be connected to a second type of mating connector with only a front surface of the second type of mating connector facing frontward. Turning now to the drawings,FIG.1shows a top rear perspective view of an electrical connector1according to some embodiments of the present invention. In some embodiments, the electrical connector1may be a receptacle connector configured to mate with a plug connector. For example, the electrical connector1may be a board connector configured to be mounted on or fixed to a printed circuit board (“PCB”) and to electrically connect a plug connector to the PCB. InFIG.1, the electrical connector1is a vertical-type connector configured to be mated in a vertical direction (e.g., with a mating force applied downward from above the electrical connector1).FIG.5shows a side elevational view of a plug connector600useable with the electrical connector1, according to some embodiments. InFIG.5, the plug connector600and the electrical connector1are in alignment for mating, and the double-headed arrow shows a vertical direction in which these connectors may be brought towards each other to mate.FIGS.6A,6B, and6Cshow a bottom side perspective view, a bottom front perspective view, and a side rear perspective view, respectively, of the plug connector600. FIG.2shows a top front perspective view of the electrical connector1in a partially disassembled state, according to some embodiments of the present invention.FIG.3shows a top plan view of the electrical connector1according to some embodiments of the present invention. The electrical connector1may be comprised of a housing2, an insulating body3, and a terminal set4. To facilitate an explanation of various elements of the electrical connector1, bottom left areas of the housing2, the insulating body3, and the terminal set4inFIG.2will be described as front areas; top right areas of the housing2, the insulating body3, and the terminal set4inFIG.2will be described as rear areas; areas toward the left of the housing2, the insulating body3, and the terminal set4inFIG.2will be described as left areas; and areas toward the right of the housing2, the insulating body3, and the terminal set4inFIG.2will be described as right areas. As will be appreciated, these designations of “front” and “rear” and “left” and “right” are used herein to provide points of reference for the sake of clarity in the following discussions and are not intended to be absolute designations of what must be or should be the front, rear, left, and right of the electrical connector1. Further, although the electrical connector1is depicted inFIGS.1to5to be a vertical-type connector (e.g., a vertical-type board connector), the scope of the present invention encompasses other embodiments in which connectors may be horizontal-type connectors, or sunken or sink-type connectors, or the like. Referring toFIGS.1to3, the housing2of the electrical connector1may be comprised of an assembly space26in which the insulating body3may be positioned. In some embodiments of the present invention, the housing2may be comprised of walls configured to encircle the insulating body3. The housing2may be comprised of at least one docking hole20located in each of a front wall and a rear wall of the housing2, as shown inFIG.2. In some embodiments of the present invention, the at least one docking hole20in the front wall of the housing2and the at least one docking hole20in the rear wall of the housing2may be located at symmetrical positions with respect to each other. Such symmetry may be understood with reference toFIGS.3,4A, and4B. FIG.3shows a midplane P of the housing2. As will be appreciated, the midplane P is not a physical structure of the electrical connector1but is an imaginary plane located midway between the front and rear walls of the housing2. In some embodiments of the present invention, the midplane P may be considered to bisect the housing2in a lengthwise direction.FIG.4Ashows the midplane P in a top front perspective view of the housing2. According to some embodiments, symmetry of the docking holes20is such that a left docking hole20in the front wall of the housing2and a left docking hole20in the rear wall of the housing2are both centered about an imaginary line L that extends orthogonally from the midplane P, and such that a right docking hole20in the front wall of the housing2and a right docking hole20in the rear wall of the housing2are both centered about an imaginary line R that extends orthogonally from the midplane P. According to some embodiments of the present invention, symmetry of the docking holes20is such that, when the housing2is rotated 180° about a central vertical axis C, the docking holes20in the front wall are rotated to the locations of the docking holes20in the rear wall prior to the rotation, and the docking holes20in the rear wall are rotated to the locations of the docking holes20in the front wall prior to the rotation. FIG.4Bshows a front elevational view of the housing2. According to some embodiments of the present invention, symmetry of the docking holes20is such that a distance D extends from a left wall of the housing2to a closest edge of a closest docking hole20(i.e., the left docking hole20in the view ofFIG.4B), and a same distance D extends from a right wall of the housing2to a closest edge of a closest docking hole20(i.e., the right docking hole20in the view ofFIG.4B). Although not shown in the drawings, the distance D may describe a distance from the left wall and right walls of the housing2to a closest edge of a closest docking hole20on the rear wall of the housing2. Each of the docking holes20may be in communication with the assembly space26. In some embodiments, the docking holes20may be configured to engage with protrusions on a mating connector such that, when the electrical connector1is in a mated position with the mating connector, the protrusions on the mating connector extend into and are lodged in the docking holes20, such that a position of the mating connector relative to the electrical connector1may be set. For example, the docking holes20may be configured to engage with protruding bumps602on docking legs604,606of the plug connector600. The housing2may be comprised of at least one first snap-fit part21provided at the front wall or at the rear wall of the housing2. InFIG.2, two first snap-fit parts21are shown on the front wall of the housing2, although in other embodiments of the present invention there may be only one first snap-fit part21or more than two first snap-fit parts21. In some embodiments, each first snap-fit part21may be comprised of a plate body structure configured to engage with a corresponding snap-fit structure (e.g., a hole or a recess) of the insulating body3. For example, the plate body structure may be a plate-like portion of the housing2that is bent to protrude inward to engage with the insulating body3when the housing2and the insulating body3are assembled together, to fix a position of the housing2relative to the insulating body3. Alternatively, in some other embodiments, each first snap-fit part21of the housing2may be comprised of an opening or a recess configured to engage with a corresponding snap-fit structure (e.g., a protruding bump) of the insulating structure3. The housing2may be comprised of at least one first guide part23and at least one second guide part24provided at the front wall and/or at the rear wall of the housing2. In some embodiments of the present invention, the first and second guide parts23,24may be located at top end portions of the front wall and/or top end portions of the rear wall of the housing2. InFIG.2, each of the front and rear walls of the housing2is comprised of a pair of first guide parts23separated by one second guide part24, which form the top end portions of the wall. As will be appreciated, in other embodiments there may be different numbers of the first and second guide parts23,24on the front wall and/or the rear wall of the housing2. In some embodiments, the housing2may be provided with the first and second guide parts23,24at the front wall only or at the rear wall only. The housing2may be comprised of at least one second snap-fit part22provided at a left wall and/or a right wall of the housing2. InFIG.2, each of the left and right walls of the housing2is provided with one second snap-fit part22. As will be appreciated, in some embodiments of the present invention there may be a different number of the second snap-fit part22. In some embodiments, each second snap-fit part22may be comprised of a plate body structure configured to engage with a corresponding snap-fit structure (e.g., a hole or a recess) of the insulating body3. Alternatively, in some other embodiments, each second snap-fit part22of the housing2may be comprised of an opening or a recess configured to engage with a corresponding snap-fit structure (e.g., a protruding bump) of the insulating body3. In some embodiments, each second snap-fit part22may be bisected by the midplane P, as shown inFIG.4A. The housing2may be comprised of at least one third guide part25provided at the left wall and/or the right wall of the housing2. In some embodiments of the present invention, one or more third guide part(s)25may be located at a top end portion of the left wall and/or a top end portion of the right wall of the housing2. InFIG.2, each of the left and right walls of the housing2is comprised one third guide part25forming the top end portion of the wall. As will be appreciated, in other embodiments there may be a different number of the third guide part25on the left wall and/or the right wall of the housing2. Each of the first, second, and third guide parts23,24,25may be comprised of a top edge portion of the housing2that is bent or formed to curve outwards or away from the assembly space26. Such curvature of the first, second, and third guide parts23,24,25may guide a user in a mating operation of the electrical connector1with a mating connector. For example, during a blind vertical mating operation, the user may be able to feel the curvature of one or more of the first, second, and third guide parts23,24,25and use the curvature to guide a downward sliding movement of the mating connector relative to the electrical connector1to achieve a proper engaged or mated position. In some embodiments of the present invention, a central region of the front wall of the housing2may be shorter in height than left and right end regions of the front wall, such that in a front elevational view the central region may appear sunken relative to the left and right regions of the front wall. Similarly, in some embodiments, a central region of the rear wall of the housing2may be shorter in height than left and right ends regions of the rear wall, such that in a rear elevational view the central region may appear sunken relative to the left and right regions of the rear wall. As shown inFIG.2, the left and right regions may have a first height27and the central region may have a second height28different from the first height27, with each height being a vertical distance from a bottom end of the housing2to a top end of the housing2at the region of interest. More specifically, at each of the left and right regions of the front wall of the housing2, the first height27may be measured as a vertical distance from a top edge of the first guide part23to the bottom end of the front wall of the housing2. Similarly, at the central region of the front wall of the housing2, the second height28may be measured as a vertical distance from a top edge of the second guide part24to the bottom end of the front wall of the housing2. In various embodiments described above and shown inFIG.2, the first height27may be greater than the second height28at the front wall and the rear wall of the housing2. Alternatively, in some other embodiments, the front wall of the housing2and/or the rear wall of the housing2may have a uniform height (e.g., the first height27or the second height28) without any sunken central region, or the front wall of the housing2and/or the rear wall of the housing2may have more than two different heights. According to some embodiments of the present invention, the insulating body3may be configured to fit into the assembly space26of the housing2, as depicted inFIGS.1to3. The insulating body3may be comprised of a plug-in port34provided at a top side of the insulating body3. The plug-in port34may be comprised of surfaces (e.g., walls) in communication with an accommodating space30. In some embodiments, the plug-in port34and the accommodating space30may be configured to receive a terminal docking end of a mating connector (e.g., the plug connector600) by a sliding movement in which a user causes the terminal docking end to slide downward into the accommodating space30along the surfaces of the plug-in port34. For example, as depicted inFIG.5, during a mating operation the mating connector (e.g., the plug connector600) may slide downward along the surfaces of the plug-in port34into the accommodating space30of the insulating body3to mate with the electrical connector1. When the terminal docking end of the mating connector is seated in a mated position in the accommodating space30, the electrical connector1and the mating connector may form an electrical connection that enables transmission of signals and/or power between these connectors. According to some embodiments of the present invention, when the insulating body3is fitted into the assembly space of the housing2, portions of external or outward-facing surfaces of a front wall and a rear wall of the insulating body3may be spaced apart from portions of inward facing surfaces of the front wall and the rear wall of the housing2, respectively, so as to form a docking slot35on front and rear sides of the electrical connector1. The docking holes20in the front wall of the housing2may be in communication with the docking slot35on the front side of the electrical connector1, and the docking holes20in the rear wall of the housing2may be in communication with the docking slot35on the rear side of the electrical connector1. According to some embodiments of the present invention, the front wall of the insulating body3may be comprised of a plurality of first protrusions extending outward from the front wall, and the rear wall of the insulating body3may be comprised of a plurality of second protrusions extending outward from the rear wall. A perimeter of the docking slot35on the front side of the electrical connector1may be defined by the front wall of the insulating body3, the first protrusions, and the front wall of the housing2. Similarly, a perimeter of the docking slot35on the rear side of the electrical connector1may be defined by the rear wall of the insulating body3, the second protrusions, and the rear wall of the housing2. In some embodiments of the present invention, the docking slot35on the front side of the electrical connector1may have a dimension that is different from that of the docking slot35on the rear side of the electrical connector1. For example, as shown inFIG.3, the docking slot35on the front side may have a first dimension351in a lengthwise direction, and the docking slot35on the rear side may have a second dimension352greater than the first dimension351. The first dimension351may be a distance separating left and right first protrusions projecting outward from the front wall of the insulating body3, and the second dimension352may be a distance separating left and right second protrusions projecting outward from the rear wall of the insulating body3. The first dimension351may be measured from opposing surfaces of the left and right front protrusions of the front wall of the insulating body3, and the second dimension352may be measured from opposing surfaces of the left and right rear protrusions of the rear wall of the insulating body3. Alternatively, in some embodiments, the second dimension352may be greater than the first dimension351. In some other alternative embodiments, the first and second dimensions351,352may be the same. The docking slots35on the front and rear sides of the electrical connector1may be configured to receive therein docking legs of a mating connector. For example, the docking slot35on the front side of the electrical connector1may be configured to receive a front docking leg604of the plug connector600, and the docking slot35on the rear side of the electrical connector1may be configured to receive a rear docking leg606of the plug connector600. When the first and second dimensions351,352are different from each other, a user may use the different dimensions to determine proper front and rear orientations of a mating connector and thus avoid mating-operation mistakes, which may damage the electrical connector and/or the mating connector. For example, if the docking slot35on the front side of the electrical connector1is dimensionally smaller than the docking slot35on the rear side of the electrical connector1, the user may use this difference to easily ascertain that the smaller docking leg of the mating connector should be inserted in the front docking slot35and the larger docking leg of the mating connector should be inserted in the rear docking slot35. The size differences may be used advantageous to prevent errors in mating operations. Alternatively, in some embodiments of the present invention, when the first and second dimensions351,352are the same, the user may easily ascertain that there is no orientation restriction for properly connecting a mating connector to the electrical connector1(e.g., the mating connector may be reversible and may be properly connected in two different orientations). In some other alternative embodiments of the present invention, when the first and second dimensions351,352of the electrical connector1are different, but a mating connector has docking legs sized to fit in the docking slots35in either of two reversible orientations, the mating connector may be mated to the electrical connector1in either of the two orientations. As will be appreciated, in order for reversible orientations to be possible, symmetrically located protrusions on the docking legs of the mating connector are configured to align with the symmetrically located docking holes20on the front and rear sides of the electrical connector1. The insulating body3may be comprised of at least one third snap-fit part31configured to engage with the at least one first snap-fit part21of the housing2. InFIG.2, the insulating body3is shown to have two third snap-fit parts31, one on each of the first protrusions extending from the front wall of the insulating body3. In some embodiments of the present invention, the number of third snap-fit parts31may be different from what is shown inFIG.2. Further, although not specifically shown inFIGS.1to3, the insulating body3may be comprised of at least one third snap-fit part31provided on the rear wall (e.g., on the second protrusions extending from the rear wall of the insulating body3), according to some embodiments. In some embodiments, each third snap-fit part31may have a slot structure or may be a recess configured to receive and engage with a protrusion forming a corresponding first snap-fit part21of the housing2. As described above, each first snap-fit part21of the housing2may be comprised of a plate body structure configured to engage with the slot structure or the recess forming a corresponding third snap-fit part31. In some alternative embodiments, each third snap-fit part31of the insulating body3may be comprised of plate body structure configured to engage with a slot structure or a recess forming a corresponding first snap-fit part21of the housing2. Corresponding first and third snap-fit parts21,31may work together to fix a position of the insulating body3in the assembly space26of the housing2. According to some embodiments of the present invention, the insulating body3may be comprised of at least one fourth snap-fit part32provided on a left wall and a right wall of the insulating body3, as shown inFIGS.1and2. Each fourth snap-fit part32may be configured to engage with a corresponding second snap-fit part22of the housing2. In some embodiments, the fourth snap-fit part32may be a protruding structure that extends outward to engage with a hole or a recess forming a corresponding second snap-fit part22. In some alternative embodiments, each fourth snap-fit part32may be comprised of a hole or a recess configured to engage with a protruding structure forming a corresponding second snap-fit part22. Corresponding second and fourth snap-fit parts22,32may work together to fix a position of the insulating body3in the assembly space26of the housing2. As shown inFIGS.1and2, a terminal holding part33may be disposed in the accommodating space30of the insulating body3, in some embodiments of the present invention. For example, the terminal holding part33may be an island that protrudes into the accommodating space from a base of the insulating body3. The terminal holding part33may be comprised of at least one terminal holding space330configured to receive the terminal set4therein. As will be appreciated, the insulating body3may have a form other than what is shown inFIGS.1to3. For example, in some embodiments, the insulating body3may be comprised of multiple plug-in ports34and multiple accommodating spaces30. The terminal set4may be comprised of a plurality of metal terminals41, as shown inFIG.2. Each of the metal terminals41may be used to transmit electrical power or signals, or may be used as a ground connection, as discussed below. According to some embodiments of the present invention, in an assembled state the terminal set4may be disposed in the terminal holding space330of the insulating body3such that top portions of the metal terminals41may be exposed to the accommodating space30through openings in the terminal holding part33. Such exposure may enable each of the metal terminals41to make electrical contact with corresponding terminals of a mating connector (e.g., the plug connector600). In some embodiments, the terminal set4may be positioned in the terminal holding space330by extending into the insulating body3from a bottom end of the terminal holding part33. Bottom portions of the metal terminals41may be configured to be electrically connected to a circuit board (e.g., a PCB) such that each metal terminal may provide an electrical connection between the circuit board and a corresponding metal terminal of a mating connector to which the electrical connector1is mated. For example, one or more of the metal terminals41may be a signal terminal that transmits electrical signals to or from the circuit board, one or more of the metal terminals41may be a power terminal that transmits power to or from the circuit board, and one or more of the metal terminals41may be a ground terminal configured to be grounded via a ground line of the circuit board. In some alternative embodiments, the electrical connector1may be structured to be a wired connector that, instead of being configured to be mounted to a circuit board, may be configured to be connected to one or more wired transmission lines. For example, one or more transmission lines may be electrically connected to the bottom portions of one or more of the metal terminals41. In some embodiments of the present invention, the terminal set4may be provided with a terminal fixing seat43and at least one terminal base42. In some embodiments, such as shown inFIG.2, the terminal set4may be comprised of two terminal bases42configured to sandwich the terminal fixing seat43. Each terminal base42may be provided with at least one base-positioning space420and at least one base-positioning unit421. The terminal fixing seat43may be provided with at least one fixing-seat-positioning space430and at least one fixing-seat-positioning unit431. In some embodiments, each base-positioning unit421of each terminal base42may be configured to extend into a corresponding fixing-seat-positioning space430of the terminal fixing seat43, and each fixing-seat-positioning unit431of the terminal fixing seat43may be configured to extend into a corresponding base-positioning space420of the terminal bases42. With such an arrangement, each terminal base42and the terminal fixing seat43may be snap-fitted together to form the terminal set4. As shown inFIGS.2and3, the terminal set4may be comprised of multiple rows of the metal terminals41. According to some embodiments of the present invention, respective groups of the metal terminals41may be fixed in corresponding terminal bases42such that the top portions of the metal terminals41of a group may extend from one surface of the corresponding terminal base42and bottom portions of the metal terminals41of the group may extend from another surface of the corresponding terminal base42, as shown inFIG.2. In other embodiments, the metal terminals41may be directly snap-fitted into place in the terminal holding space330. In some alternative embodiments of the present invention, the electrical connector may be comprised of two terminal sets4disposed in the accommodating space30of the insulating body3. For example, one terminal set4may be arranged closer to the front side of the insulating body3, and the other terminal set4may be arranged closer to the rear side of the insulating body3. In other alternative embodiments, the insulating body may be comprised of multiple accommodating spaces30each configured to hold a terminal set4therein. Thus, it should be understood that the electrical connector1is not limited to the embodiments shown in the drawings but may be comprised of multiple terminal sets4arranged in multiple accommodating spaces30. In summary, it should be understood from the foregoing descriptions and the accompanying drawings that an electrical connector according to various embodiments of the present invention (e.g., the electrical connector1) may be connected with a mating connector (e.g., the plug connector600) by aligning the electrical connector's docking holes (e.g., the docking holes20) with protrusions (e.g., the bumps602) or other types of structures projecting from docking legs (e.g., the docking legs604,606) of the mating connector. According to some embodiments of the present technology, when the docking holes are symmetrically situated on opposite sides of the electrical connector, the mating connector may be snap-fit mated with the electrical connector in two different orientations (e.g., a normal orientation and a reversed orientation that is a 180° rotation from the normal orientation), provided that the mating connector has docking legs that are sized to fit in the docking slots35in both orientations. Thus, electrical connectors according to various embodiments of the present invention may be useable with various different mating connectors, some of which may be reversibly mated (e.g., by having docking legs604,606that are dimensioned to fit in the docking slots35in two different orientations) and some of which may be mated in only a single orientation (e.g., by having docking legs604,606that are differently dimensioned to fit the different dimensions351,352of the docking slots35in one orientation). It is to be understood that the foregoing features may be used, separately or together in any combination, in any of the embodiments discussed herein. Further, although advantages of the present technology may be indicated, it should be appreciated that not every embodiment of the present technology may include every described advantage. Some embodiments may not implement any feature described herein as advantageous. Accordingly, the foregoing description and attached drawings are by way of example only. Variations of the disclosed embodiments are possible. For example, various aspects of the present technology may be used alone, in combination, or in a variety of arrangements not specifically discussed in the embodiments described in the foregoing, and therefore they are not limited in application to the details and arrangements of components set forth in the foregoing description or illustrated in the drawings. Aspects described in one embodiment may be combined in any manner with aspects described in other embodiments. Use of ordinal terms such as “first,” “second,” “third,” etc., in the description and the claims to modify an element does not by itself connote any priority, precedence, or order of one element over another, or the temporal order in which acts of a method are performed, but are used merely as labels to distinguish one element or act having a certain name from another element or act having a same name (but for use of the ordinal term) to distinguish the elements or acts. All definitions, as defined and used herein, should be understood to control over dictionary definitions, definitions in documents incorporated by reference, and/or ordinary meanings of the defined terms. The indefinite articles “a” and “an,” as used herein in the specification and in the claims, unless clearly indicated to the contrary, should be understood to mean “at least one.” As used herein in the specification and in the claims, the phrase “at least one,” in reference to a list of one or more elements, should be understood to mean at least one element selected from any one or more of the elements in the list of elements, but not necessarily including at least one of each and every element specifically listed within the list of elements and not excluding any combinations of elements in the list of elements. This definition also allows that elements may optionally be present other than the elements specifically identified within the list of elements to which the phrase “at least one” refers, whether related or unrelated to those elements specifically identified. As used herein in the specification and in the claims, the term “equal” or “the same” in reference to two values (e.g., distances, widths, etc.) means that two values are the same within manufacturing tolerances. Thus, two values being equal, or the same, may mean that the two values are different from one another by ±5%. The phrase “and/or,” as used herein in the specification and in the claims, should be understood to mean “either or both” of the elements so conjoined, i.e., elements that are conjunctively present in some cases and disjunctively present in other cases. Multiple elements listed with “and/or” should be construed in the same fashion, i.e., “one or more” of the elements so conjoined. Other elements may optionally be present other than the elements specifically identified by the “and/or” clause, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, a reference to “A and/or B”, when used in conjunction with open-ended language such as “comprising” can refer, in one embodiment, to A only (optionally including elements other than B); in another embodiment, to B only (optionally including elements other than A); in yet another embodiment, to both A and B (optionally including other elements); etc. As used herein in the specification and in the claims, “or” should be understood to have the same meaning as “and/or” as defined above. For example, when separating items in a list, “or” or “and/or” shall be interpreted as being inclusive, i.e., the inclusion of at least one, but also including more than one, of a number or list of elements, and, optionally, additional unlisted items. Only terms clearly indicated to the contrary, such as “only one of” or “exactly one of,” or, when used in the claims, “consisting of,” will refer to the inclusion of exactly one element of a number or list of elements. In general, the term “or” as used herein shall only be interpreted as indicating exclusive alternatives (i.e., “one or the other but not both”) when preceded by terms of exclusivity, such as “either,” “one of,” “only one of,” or “exactly one of.” Finally, it is to be understood that the scope of the present invention is not limited to claims recited below or the embodiments described herein and shown in the drawings. It is to be understood that the scope of the invention and the claims includes equivalent modifications and variations that can be conceived by one of ordinary skill in the art based on the disclosure of the present technology. For convenience, the following is a key to reference characters used herein and in the drawings for the electrical connector1:2: housing20: docking hole21: first snap-fit part22: second snap-fit part23: first guide part24: second guide part25: third guide part26: assembly space27: first height28: second height3: insulating body30: accommodating space31: third snap-fit part32: fourth snap-fit part33: terminal holding part330: terminal holding space34: plug-in port35: docking slot351: first distance352: second distance4: terminal set41: metal terminal42: terminal base420: base-positioning space421: base-positioning unit43: terminal fixing seat430: fixing-seat-positioning space431: fixing-seat-positioning unit | 38,266 |
11942725 | DETAILED DESCRIPTION This disclosure, its aspects and implementations, are not limited to the specific material types, components, methods, or other examples disclosed herein. Many additional material types, components, methods, and procedures known in the art are contemplated for use with particular implementations from this disclosure. Accordingly, for example, although particular implementations are disclosed, such implementations and implementing components may comprise any components, models, types, materials, versions, quantities, and/or the like as is known in the art for such systems and implementing components, consistent with the intended operation. The word “exemplary,” “example,” or various forms thereof are used herein to mean serving as an example, instance, or illustration. Any aspect or design described herein as “exemplary” or as an “example” is not necessarily to be construed as preferred or advantageous over other aspects or designs. Furthermore, examples are provided solely for purposes of clarity and understanding and are not meant to limit or restrict the disclosed subject matter or relevant portions of this disclosure in any manner. It is to be appreciated that a myriad of additional or alternate examples of varying scope could have been presented, but have been omitted for purposes of brevity. While this disclosure includes a number of implementations in many different forms, there is shown in the drawings and will herein be described in detail particular implementations with the understanding that the present disclosure is to be considered as an exemplification of the principles of the disclosed methods and systems, and is not intended to limit the broad aspect of the disclosed concepts to the implementations illustrated. The present disclosure concerns a tamper-resistant night light. This tamper-resistant night light provides a night light which is trapped by the electrical wall plate to restrict a child from unplugging it. A variety of different implementations of the tamper-resistant night light are discussed below. Generally, these implementations may comprise a night light and a locking element. It should be understood that the components depicted and discussed are non-limiting examples, and that the contemplated components may be combined with any of the other components in other implementations. FIGS.1-6show various views of an aspect of a tamper resistant nightlight50.FIG.6shows an exploded perspective view of the nightlight50, comprising a housing or nightlight housing60and a body or nightlight body70. The nightlight50may be coupled to an electrical wall plate, faceplate, or cover10, such as a duplex electrical receptacle wall plate and a receptacle or electrical receptacle30, such as a duplex receptacle.FIGS.1-6illustrate an implementation in which the housing60(which comprises the locking element61) covers the front or cover78of the night light70and has a flange or lip62around an edge or perimeter of the nightlight70. FIG.1shows a top view of an outlet40comprising the wall plate10and the receptacle30. The wall plate10is shown coupled to the receptacle30, the wall plate10comprising a front surface or first surface16oriented away from a wall and oriented towards an open space or passerby. The wall plate10also comprises a rear surface or second surface18oriented towards a wall and oriented away from an open space or passerby.FIG.1also shows the nightlight50plugged into the receptacle30. The wall plate10may be formed of rubbers (synthetic and/or natural) and/or other like materials; glasses (such as fiberglass), carbon-fiber, aramid-fiber, any combination therefore, and/or other like materials; elastomers and/or other like materials; polymers such as thermoplastics (such as ABS, fluoropolymers, polyacetal, polyamide, polycarbonate, polyethylene, polysulfone, and/or the like, thermosets (such as epoxy, phenolic resin, polyimide, polyurethane, and/or the like), and/or other like materials, plastics and/or other like materials; composites and/or other like materials, metals, such as zinc, magnesium, titanium, copper, iron, steel, carbon steel, alloy steel, tool steel, stainless steel, spring steel, aluminum, and/or other like materials, ceramic, stone, wood, cellulose, or other natural material, and/or any combination or composite of the foregoing. The wall plate10may be made by, with, or involve 3-D printing, extrusion, pultrusion, vacuum forming, injection molding, blow molding, resin transfer molding, casting, forging, cold rolling, milling, drilling, reaming, turning, grinding, stamping, cutting, carving, bending, welding, soldering, hardening, riveting, punching, plating, and/or the like. The wall plate10may be a standard off the shelf wall plate, as well as a custom plate, the tamper resistant nightlight being compatible with both. FIG.2shows a front view of the wall plate10coupled to the receptacle30, and the nightlight50coupled to the wall plate10and the receptacle30. The view ofFIG.2is perpendicular or orthogonal to the view shown inFIG.1. The view ofFIG.2presents the wall plate10, the receptacle30, and the nightlight50as would be seen from an open space or by a passerby. The nightlight50is shown coupled to the upper face32of the receptacle30, the lower face32of the receptacle being visible or exposed. A user could couple one or more nightlights to any corresponding number of faces32, whatever the desired arraignment of receptacles30and faces32.FIG.2also shows a receptacle opening12, or opening12in wall plate10for receptacle face32. The receptacle opening12includes an edge or perimeter13. The faces32comprise openings34for plug blades80and openings or openings for a ground36. A screw opening or threaded fastener opening14in wall plate10is also shown between, and vertically offset from upper receptacle opening12and lower receptacle opening12, which can receive a threaded fastener for coupling the wall plate10to the receptacle30. FIG.3shows a side view of the wall plate10coupled to the receptacle30, and the nightlight50coupled to the wall plate10and the receptacle30. The view ofFIG.3is perpendicular or orthogonal to the views shown inFIGS.1and2. The view ofFIG.2presents the wall plate10, the receptacle30, and the nightlight50as would be seen if wall20did not obscure a view of the receptacle30that would be disposed within the wall20. The nightlight50is shown coupled to the upper face32of the receptacle30, the lower face32of the receptacle being visible or exposed. FIG.4shows a cross-sectional side view of the wall plate10, the receptacle and the nightlight50(similar toFIG.3), the view inFIG.4being taken along the section line4shown inFIG.2.FIG.4provides additional detail of the tamper resistant nightlight50, including portions of the internal structure of the nightlight50. The tamper resistant nightlight50comprises a body or nightlight body70. The body70further comprises a base72that is configured to be disposed over a face32of the receptacle30. The body70may comprise a structural element or substrate. The body70further comprises at least one circuit74disposed over the base72, the at least one circuit74comprising at least one light or light emitting diode (LED)76. The body70further comprises a cover78that is aligned with, and is disposed over, the at least one LED76, the cover78being configured to be visible when the nightlight50is plugged into the receptacle30. Plug blades80extend from the body70and are coupled to the at least one circuit74and the light or LED76, the plug blades80being configured to electrically couple with contacts within the receptacle30. The housing60may be coupled to the body70, the housing60comprising a locking element62configured to restrict a child (including a toddler) from removing the nightlight50, which may lead to the nightlight70being lost, misplaced, broken, or unavailable to provide light when desired. Unwanted removal of the nightlight50by a child may also expose the openings34in the receptacle face32to the child, introducing an opportunity for a child to place foreign or unwanted objects within the openings34of the receptacle30, thereby creating an increased safety risk. The locking element61may be configured as a flange, lip, tab, ridge, or protrusion62that extends away from the body70such that a distal edge63of the flange62is configured to be positioned behind a rear surface18of a wall plate10to prevent the tamper resistant nightlight50nfrom being removed from the receptacle30while the wall plate10is coupled to the receptacle30. Because the wall plate10will usually be coupled to the receptacle32with a threaded fastener through opening14, the nightlight50will be more difficult to remove than a conventional friction fit or press fit nightlight. Rather than simply pulling on the nightlight50so that the blades80are pulled from openings34of the receptacle32, the wall plate10will first need to be removed, such as with a screwdriver, which prevents a significant barrier for a child to remove the nightlight50from the receptacle30. The body70, and particularly the base72and the cover80of the body, as well as the housing60, may be formed entirely or partially of rubbers (synthetic and/or natural) and/or other like materials, glasses (such as fiberglass), carbon-fiber, aramid-fiber, any combination therefore, and/or other like materials; elastomers and/or other like materials, polymers such as thermoplastics (such as ABS, fluoropolymers, polyacetal, polyamide, polycarbonate, polyethylene, polysulfone, and/or the like, thermosets (such as epoxy, phenolic resin, polyimide, polyurethane, and/or the like), and/or other like materials, plastics and/or other like materials, composites and/or other like materials; metals, such as zinc, magnesium, titanium, copper, iron, steel, carbon steel, alloy steel, tool steel, stainless steel, spring steel, aluminum, and/or other like materials, ceramic, stone, wood, cellulose, or other natural materials, and/or any combination or composite of the foregoing. The housing60and the body70may be formed by, made by, made with, or involve 3-D printing, extrusion, pultrusion, vacuum forming, injection molding, blow molding, resin transfer molding, casting, forging, cold rolling, milling, drilling, reaming, turning, grinding, stamping, cutting, carving, bending, welding, soldering, hardening, riveting, punching, plating, and/or the like. Because the locking element60in the implementation shown inFIGS.1-6covers the front of the body70and the light76, the housing60may comprise or be made of a transparent or translucent material to allow light or illumination from the light76to shine or pass through the housing60. In some instances, an entirety of the housing60may be formed of a translucent material. In other instances, a portion or at least a portion of the housing60, such as the front face64or a portion of the front face64may comprise or be formed of translucent material. In any event, the face64of the housing60may cover the body70, preventing the nightlight body70from being removed from the receptacle30while the housing60covers the body70and the locking element61of housing60is coupled to the wall plate10, such as a rear surface18of the wall plate10. FIG.5shows a close-up view of the portion ofFIG.4shown in the section-line or circle5fromFIG.4.FIG.5shows an enlargement of approximately 2 times, or at twice the scale, of what was shown inFIG.4. As shown inFIG.5, the nightlight70may have a footprint of form factor that is less than, or substantially equal to, a footprint or form factor of the face32of the receptacle30. As such, the nightlight70may be contained within the housing60when coupled to the receptacle30. When the housing60is installed, being disposed around and encompassing the nightlight70, the flange62of the housing60is disposed or sits behind the back surface18of the wall plate10and restricts the locking element from being removed without first removing the wall plate10. The base72may be configured to contact, and be adjacent to, the face32of the receptacle30. As noted above,FIG.6shows an exploded perspective view of the nightlight comprising a housing60with a locking element61that can be couple to, or integrally or unitarily formed with, the nightlight body70. The nightlight50may be coupled to electrical outlet40, so as to be tamper resistant and to not be undesirably removed by a child. FIGS.7-12illustrate another implementation of a tamper resistant nightlight51similar to the tamper resistant nightlight50fromFIGS.1-6, in which like numbers represent like features. Nightlight51comprises a body or nightlight body70that may be integrally or unitarily formed with, or separately formed and releasably coupled to, a housing60. The housing60of nightlight51comprises a locking element61that comprising a flange, lip, tab, ridge, or protrusion62as a first or rear flange, similar to the flange62of nightlight50. Nightlight51differs from nightlight50by further comprising a second or front flange, lip, tab, ridge, or protrusion65that is disposed away from, or opposite, the first flange62. In some instances, the flange65may extend to the cover78of the body70without being disposed over an entirety of the cover78of the body70. In some instances, the housing may contact or cover an entire side of the body70, and may contact, cover, or be disposed over only a portion or no part of the cover78of the body70, unlike the nightlight50shown inFIGS.1-6. In other instances, the flange65of the nightlight51may extend to, and mateably couple with, a shoulder, ridge, tab, or protrusion79formed on the body70. When the flange65is coupled to the shoulder79, the housing60may not extend to the cover78, housing60, and the flange65, the housing60extending a distance less than an entirety of the distance to the cover78, thereby contacting or covering less than an entire side of the body70. Stated another way, in some instances the locking element61or flange62of the housing60does not cover the entire nightlight body70, the cover78, or the front of the cover78, but covers only the sides or portions of the sides of the body70, such as shoulder79. FIGS.13-21illustrate another implementation of a tamper resistant nightlight52similar to the tamper resistant nightlight50fromFIGS.1-6and the tamper resistant nightlight51fromFIGS.7-12, in which like numbers represent like features. Nightlight52is similar to nightlights50and51in that nightlight52comprises the housing60that further comprises the locking element61that couples with the back side or rear surface18of the wall plate10. As shown, nightlight52comprises an implementation in which the housing60is disposed between the receptacle30and the base or rear surface72of the nightlight body70. A such, the base72of the body70may be releasably coupled with the front face64of the housing60, rather than being in contact with the face32of the receptacle30as shown in the preceding FIGs. As illustrated more specifically inFIGS.20-21, the nightlight body70or a portion thereof, such as base72, may be releasably coupled with a portion of the housing60, such as the front face64. Base70may be coupled to housing60with any desirable number of connectors or keyhole connectors66, which may comprise mateably coupling elements66aand66b. First or male connectors66amay be formed as protrusions, knobs, or keys. Second or female connectors66bmay be formed as one or more corresponding slots, openings, sockets, or keyholes. While first connectors66aare shown on nightlight body70and second connectors66bare shown in housing60, the relative arrangement of the first connectors66aand the second connectors66bmay be reversed, with the first connectors66aon or coupled with housing60and the and second connectors66bin or with nightlight body70. In some instances, a portion of the first connectors66amay be formed on the housing60with another portion of the first connectors66abeing formed on the nightlight body70, while corresponding portions of second connectors66bmay be formed on the housing60and the nightlight body70to mateably couple with the first connectors66a. FIGS.18and19show exploded perspective views, from opposite sides, of the nightlight body70and the housing60, with interlocking keyhole connectors66.FIG.20shows a plan view of a front of the body70with the cover78removed so that ends82of the plug blades80are visible, together with first connectors66ainserted within, and couple to, second connectors66b.FIG.21shows a plan view of a rear of the body70, opposite the view shown inFIG.20, with opposite ends of the plug blades80and the second connectors or slots66bbeing visible. Coupling of the nightlight body70to the wall plate40may occur with the housing60coupled to the wall plate10with locking element61, and the nightlight body70being coupled to the housing60when the one or more knobs66aon the nightlight body70interlock with slots66bon the housing60. However, the housing60and nightlight body70may be removably coupled in another manner with other suitable connectors66. Further, and as noted above with respect to the previous FIGs., the locking element61may have a lip62around its edge which, when installed with the electrical outlet40, sits behind the wall plate10and makes it difficult to tamper with or remove the housing60without also removing the wall plate10. When the additional keyhole connectors66are included with the housing60disposed between the base72or body70and the receptacle30or receptacle face32, the nightlight body70may be removed without removing the wall plate10, by uncoupling the nightlight body70from the housing60while leaving the housing60coupled to the wall plate10. Because the wall plate10comprises openings67for plug blades80, the receptacle30can still be used even when the housing is coupled to the wall plate10and the nightlight body70has been removed. Additionally, when the nightlight body70is on and electrically coupled to the receptacle30, the keyhole connectors66help prevent children from removing the nightlight body70, and undesirably exposing the openings34of the receptacle30. FIGS.22-26illustrate another implementation of a tamper resistant nightlight53similar to the tamper resistant nightlight50fromFIGS.1-6and the tamper resistant nightlight51fromFIGS.7-12, in which like numbers represent like features. Nightlight53is similar to nightlights50and51in that nightlight52comprises the housing60or locking element61that couples with the back side or rear surface18of the wall plate10.FIGS.22-26show the housing being integrally formed with, or being one continuous piece or the same unitary structure as the nightlight body70. Stated another way, the locking element61may be coupled to the nightlight body70(when the nightlight body70comprises the housing60). As described above, the locking element61may be formed as a flange, lip, tab, ridge, or protrusion that sits behind the wall plate10when installed as part of the electrical outlet40, making it difficult to remove the nightlight50and the body70from the receptacle30or outlet40, without removing the wall plate10. The implementations of the tamper-resistant nightlights50,51,52, and53described herein are configured for a typical wall outlet40that utilizes a wall plate10. However, other implementations are also intended within this disclosure. For example, the locking element61may be configured for ground-fault circuit interrupter (GFCI) outlets or decorator devices as well. The implementations which have a nightlight that is separable from the locking element may be used in any electrical device because the locking element may be set aside during use. In addition, tamper-resistant nightlight implementations may include a dusk-to-dawn photosensor98and photosensor circuit, as well as a selector switch90as discussed below, and as disclosed in U.S. Provisional Patent Application 62/795,805, the disclosure of which is incorporated by reference. FIGS.28-34show various views of a nightlight body70that may be used or incorporated with any of the implementations shown and described herewith. The photosensor98and the photosensor circuit may detect the ambient light, providing power to the nightlight and the light76when limited, reduced, or no ambient light detected; and turning the light76off when there is more or sufficient ambient light. As illustrated inFIGS.32and34, the selector switch90allows the night light user to switch between different modes: 1) a first position or “on” position92of the selector90in which the light76remains on at all times, 2) a second position or “auto” position94to enable the photosensor circuit, thus turning the night light on when the area is dark and turning it off when there is ambient light, and 3) a third position or “off” position96of the selector90in which the night light remains off. The nightlight body70may advantageously be made with a small profile, making it difficult for a child to grip and therefore remove from the receptacle30. The footprint or area of the nightlight body70may be small, and fit or be contained within the footprint or area of the face32of the receptacle30. As such, a housing60and a locking element61may be coupled to the nightlight body70, allowing the locking element61to be configured as a flange, lip, tab, ridge, or protrusion62that may comprise a thickness in a range of 0.5 millimeters-4 millimeters (mm) and be disposed in a gap or space between the wall plate10and the receptacle face32, such as along the edge or perimeter13of the opening12. While the selector switch90is shown on the rear or back surface of the nightlight body70, the selector switch may be positioned or disposed on any suitable surface, including on a side or other surface. In particular embodiments of a nightlight body70described in relation to any of the variousFIGS.1-34, herein, a front surface of the cover78(FIG.6) may be configured to be touch-sensitive to operate the nightlight. In the specific embodiment described and shown with relation toFIGS.32and34, a selector switch90is included to allow a user to switch the nightlight between different modes of operation. In that example, the modes of operation include: 1) a first position or “on” position92of the selector90in which the light76remains on at all times, 2) a second position or “auto” position94to enable the photosensor circuit, thus turning the night light on when the area is dark and turning it off when there is ambient light, and 3) a third position or “off” position96of the selector90in which the night light remains off. As an alternative to or in addition to a selector switch90, the front surface of the cover78, or some other portion of the nightlight body70may be configured to be touch-sensitive so that a user can alternate between desired modes of operation by merely touching a portion of the body70. In this way, the selector switch may be implemented not as a sliding selector switch90as shown inFIGS.32and34, but as a different form of touch-sensitive switch. The touch to the nightlight body70may activate the selector switch through a push-button switch on the surface that toggles the selector switch through its modes of operation, or through a touch-sensitive surface or area, such as by capacitive sensing, such as through inclusion of a capacitive plate below the surface to interact with the user's finger to form a capacitive circuit, or conductive sensing, such as inclusion of a titanium oxide or other conductive layer on the surface to conduct a small amount of electricity like with touch-screen technology, to toggle the selector switch through its modes of operation. The modes of operation identified in relation to selector90above, or other modes may be implemented. Use of a touch-sensitive surface on the nightlight body70simplifies use of the device, allows the selector switch to be changed without removal of the nightlight body70, and increases functionality and usability of the nightlight. It will be understood that implementations of this tamper-resistant night light are not limited to the specific components disclosed herein, as virtually any components consistent with the intended operation of various tamper-resistant night lights may be utilized. Accordingly, for example, it should be understood that, while the drawings and accompanying text show and describe particular tamper-resistant night light implementations, any such implementation may comprise any shape, size, style, type, model, version, class, grade, measurement, concentration, material, weight, quantity, and/or the like consistent with the intended operation of tamper-resistant night lights. The concepts disclosed herein are not limited to the specific tamper-resistant night lights shown herein. For example, it is specifically contemplated that the components included in particular tamper-resistant night lights may be formed of any of many different types of materials or combinations that can readily be formed into shaped objects and that are consistent with the intended operation of the tamper-resistant night light. For example, the components may be formed of: rubbers (synthetic and/or natural) and/or other like materials; glasses (such as fiberglass), carbon-fiber, aramid-fiber, any combination therefore, and/or other like materials; elastomers and/or other like materials; polymers such as thermoplastics (such as ABS, fluoropolymers, polyacetal, polyamide, polycarbonate, polyethylene, polysulfone, and/or the like, thermosets (such as epoxy, phenolic resin, polyimide, polyurethane, and/or the like), and/or other like materials; plastics and/or other like materials; composites and/or other like materials; metals, such as zinc, magnesium, titanium, copper, iron, steel, carbon steel, alloy steel, tool steel, stainless steel, spring steel, aluminum, and/or other like materials; and/or any combination of the foregoing. Furthermore, tamper-resistant night lights may be manufactured separately and then assembled together, or any or all of the components may be manufactured simultaneously and integrally joined with one another. Manufacture of these components separately or simultaneously, as understood by those of ordinary skill in the art, may involve 3-D printing, extrusion, pultrusion, vacuum forming, injection molding, blow molding, resin transfer molding, casting, forging, cold rolling, milling, drilling, reaming, turning, grinding, stamping, cutting, bending, welding, soldering, hardening, riveting, punching, plating, and/or the like. If any of the components are manufactured separately, they may then be coupled or removably coupled with one another in any manner, such as with adhesive, a weld, a fastener, any combination thereof, and/or the like for example, depending on, among other considerations, the particular material(s) forming the components. In places where the description above refers to particular tamper-resistant night light implementations, it should be readily apparent that a number of modifications may be made without departing from the spirit thereof and that these implementations may be applied to other implementations disclosed or undisclosed. The presently disclosed tamper-resistant night lights are, therefore, to be considered in all respects as illustrative and not restrictive. | 27,343 |
11942726 | DETAILED DESCRIPTION FIG.1is a perspective view of heated hose assembly10including electrical connector system12. Heated hose assembly10includes first heated hose14, second heated hose16, and electrical connector system12. In some examples, heated hose assembly10can be used with multiple component dispensing systems that receive separate inert material components, mix the components according to a predetermined ratio, and then dispense the components as an activated compound. Heated hose assembly10includes electrically heated hoses that are configured to increase the temperature of the material components flowing through each hose, ensuring a proper activated mixture is achieved. More specifically, first heated hose14and second heated hose16are configured to transfer a first fluid component and a second fluid component, respectively, the first and second fluid components can be different from each other. First heated hose14and second heated hose16are independently heated hoses that receive separate electrical power (e.g. electrical current) at the heating elements (e.g. wires) of each heated hose14,16to heat each hose independently from the other hose. In some examples, the heating elements can be one or more copper wires wrapped around each of first heated hose14and second heated hose16. Independently heating first heated hose14and second heated hose16allows a greater power density to be achieved, providing increased heating capabilities for each of first heated hose14and second heated hose16. Electrical connector system12is coupled to first heated hose14and second heated hose16. Electrical connector system12is configured to electrically couple the heating elements of each heated hose segment to an electrical power source. Electrical connector system12includes first electrical connector18, second electrical connector20, third electrical connector22, and fourth electrical connector24. First electrical connector18is electrically coupled to heating elements14aof first heated hose14. Second electrical connector20is electrically coupled to heating elements14aof first heated hose14. Third electrical connector22is electrically coupled to heating elements16aof second heated hose16. Fourth electrical connector24is electrically coupled to heating elements16aof second heated hose16. In some examples, first electrical connector18, second electrical connector20, and heating elements14acan be referred to as the first sub-assembly of heated hose assembly10. Further, in some examples, third electrical connector22, fourth electrical connector24, and heating elements16acan be referred to as the second sub-assembly of heated hose assembly10. The first and second sub-assemblies of heated hose assembly10are configured to increase the temperature of the fluid components flowing through first heated hose14and second heated hose16, respectively. First electrical connector18is a male connector and second electrical connector20is a female connector, and first electrical connector18is configured to mate and connect with second electrical connector20. Third electrical connector22is a male connector and fourth electrical connector24is a female connector, and third electrical connector22is configured to mate and connect with fourth electrical connector24. More specifically, both first electrical connector18and second electrical connector20include dual male/female connections. First electrical connector18includes an inner female connector positioned at a central axis of first electrical connector18and an outer male connector positioned radially outward from the inner female connector. Second electrical connector20includes an inner male connector positioned at a central axis of second electrical connector20and an outer female connector positioned radially outward from the inner male connector. As such, the inner female connector of first electrical connector18is configured to mate with the inner male connector of second electrical connector20. The outer male connector of first electrical connector18is configured to mate with the outer female connector of second electrical connector20. In some examples, the first male/female connection can be structural (e.g., inner male connector of second electrical connector20and inner female connector of first electrical connector18) and the second male/female connection can be electrical (e.g., outer female connector of second electrical connector20and outer male connector of first electrical connector18). Likewise, both third electrical connector22and fourth electrical connector24include dual male/female connections. Third electrical connector22includes an inner female connector positioned at a central axis of third electrical connector22and an outer male connector positioned radially outward from the inner female connector. Fourth electrical connector24includes an inner male connector positioned at a central axis of fourth electrical connector24and an outer female connector positioned radially outward from the inner male connector. As such, the inner female connector of third electrical connector22is configured to mate with the inner male connector of fourth electrical connector24. The outer male connector of third electrical connector22is configured to mate with the outer female connector of fourth electrical connector24. In some examples, the third male/female connection can be structural (e.g., outer female connector of fourth electrical connector24and outer male connector of third electrical connector22) and the fourth male/female connection can be electrical (e.g., inner male connector of fourth electrical connector24and inner female connector of third electrical connector22). In the embodiment shown, first heated hose14includes two of each of first electrical connector18and second electrical connector20. Likewise, second heated hose16includes two of each of third electrical connector22and fourth electrical connector24. In another embodiment, heated hoses14,16can include more or less than two of each of electrical connectors18,20,22, and24. Each of the electrical connectors18,20,22, and24are configured to be coupled to a mating connector to transfer electrical current from a power source to either first heated hose14or second heated hose16. As shown inFIG.1, heated hose assembly10can include a plurality of heated hose segments that are connected to increase the overall length of first heated hose14and second heated hose16. This allows a user to dispense the activated fluid component mixture at a location remote from the fluid component containers. Each of first heated hose14and second heated hose16includes fluid connectors at the distal ends of each hose14,16, fluidly coupling each hose segment to another hose segment to provide a flow path for the first fluid component and the second fluid component. Further, each of first heated hose14and second heated hose16include electrical connectors18,20,22, and24, electrically coupling each hose segment to another hose segment to allow electric current to transfer through each of the hose segments. More specifically, one segment of first heated hose14includes first electrical connector18and another segment of first heated hose14includes second electrical connector20. First electrical connector18and second electrical connector20are configured to mate and electrically connect, allowing electric current to transfer from one segment of first heated hose14to another segment of first heated hose14. Similarly, one segment of second heated hose16includes third electrical connector22and another segment of second heated hose16includes fourth electrical connector24. Third electrical connector22and fourth electrical connector24are configured to mate and electrically connect, allowing electric current to transfer from one segment of second heated hose16to another segment of second heated hose16. As such, electrical connectors18,20,22, and24ensure electric current is transferred to each segment of first heated hose14and second heated hose16to increase the temperature of first heated hose14and second heated hose16. FIG.2Ais a perspective view of first electrical connector18.FIG.2Bis a front view of first electrical connector18.FIG.3Ais a perspective view of second electrical connector20.FIG.3Bis a front view of second electrical connector20.FIG.4Ais a cross-sectional view of first electrical connector18and second electrical connector20disconnected.FIG.4Bis a cross-sectional view of first electrical connector18and second electrical connector20connected.FIGS.2A-4Bwill be discussed together. Referring toFIGS.2A-2B, first electrical connector18includes first body30, first flange32, first key34, first threaded insert36, second threaded insert38, first end face40, first seal42, first metallic connector44, and first aperture46. First body30is the main body portion of first electrical connector18that the other components of first electrical connector18are coupled. First flange32is positioned adjacent first body30and first flange32extends radially outward from first body30. First flange32includes apertures extending through first flange32, in which first threaded insert36and second threaded insert38are positioned. First threaded insert36and second threaded insert38are configured to accept and mate with fasteners, discussed further below. First threaded insert36is positioned 180 degrees from second threaded insert38about first axis48. In some examples, first threaded insert36and second threaded insert38can be molded into first flange32during manufacturing of first electrical connector18. In other examples, first threaded insert36and second threaded insert38can be coupled to first flange32after manufacturing of first electrical connector18. First key34is positioned adjacent first flange32and first key34extends axially outward from first flange32and first body30, with respect to first axis48extending through a center of first flange32and first body30. First key34is generally cylindrical in shape and includes first cutout50and second cutout52extending from first end face40of first key34to first flange32. In the example shown, first cutout50and second cutout52include an arc or partial circle shaped cutout extending into the cylindrically shaped first key34. In another example, first cutout50and second cutout52can have any desired shape, as long as first cutout50and second cutout52have identical shaped geometry. First cutout50is positioned 180 degrees from second cutout52about first axis48. First end face40of first key34is positioned at a distal end of first key34. First seal42is positioned adjacent the location in which first key34interfaces with first flange32and first seal42surrounds a circumference of first key34. First seal42is configured to prevent debris from entering first electrical connector18when first electrical connector18is connected to second electrical connector20. In the example shown, first seal42is an O-ring seal, but in another example, first seal42can be any component that prevents debris from entering first electrical connector18when first electrical connector18is connected to second electrical connector20. First end face40is configured to cover first metallic connector44, preventing a user from touching first metallic connector44. First metallic connector44is a female connector positioned within first body30and first key34of first electrical connector18. First metallic connector44is the component that electrically couples first electrical connector18to second electrical connector20, allowing electric current to transfer between each connector18,20. A user touching first metallic connector44and second metallic connector64of second electrical connector20at the same time can result in an electrical circuit being completed, which could shock or harm the user. As such, first end face40is configured to prevent the user from touching first metallic connector44and harming themselves during connecting or disconnecting of first electrical connector18and second electrical connector20. First aperture46is axially aligned with first axis48and first aperture46extends through first end face40. First aperture46allows access to first metallic connector44, allowing second metallic connector64of second electrical connector20to interface with first metallic connector44, discussed further below. First electrical connector18is configured to mate with second electrical connector20to complete an electrical circuit, allowing electric current to transfer from first electrical connector18to second electrical connector20. Further, first electrical connector18is symmetric about a plane extending through a center axis of first threaded insert36and a center axis of second threaded insert38, allowing first electrical connector18to be rotated 180 degrees about first axis48and still mate and couple with second electrical connector20. Referring toFIGS.3A-3B, second electrical connector20includes second body54, second flange56, second key58, first fastener60, second fastener62, second metallic connector64, and second aperture66. Second body54is the main body portion of second electrical connector20that the other components of second electrical connector20are coupled. Second flange56is positioned adjacent second body54and second flange56extends radially outward from second body54. Second flange56includes apertures extending through second flange56, in which first fastener60and second fastener62are positioned. First fastener60and second fastener62are configured to mate with first threaded insert36and second threaded insert38of first electrical connector18, respectively. First fastener60is positioned 180 degrees from second fastener62about second axis68. Second key58is positioned within second flange56and second body54. More specifically, second key58extends axially inward into second flange56and second body54, with respect to second axis68extending through a center of second flange56and second body54. Second key58is generally cylindrical in shape and includes first protrusion70and second protrusion72extending inward toward second axis68. In the example shown, first protrusion70and second protrusion72include an arc or partial circle shaped protrusion extending inward from the cylindrically shaped second key58. In another example, first protrusion70and second protrusion72can have any desired shape, as long as first protrusion70and second protrusion72have identical shaped geometry. First protrusion70is positioned 180 degrees from second protrusion72about second axis68. Second aperture66is axially aligned with second axis68and second aperture66extends into second body54. Second aperture66provides a location in which second metallic connector64can be coupled. Second metallic connector64is a male connector positioned within second aperture66of second body54and second key58of second electrical connector20. Second metallic connector64is the component that electrically couples second electrical connector20to first electrical connector18, allowing electric current to transfer between each connector. More specifically, second metallic connector64of second electrical connector20is inserted into first metallic connector44of first electrical connector18to complete an electric circuit and to transfer electric current between first electrical connector18and second electrical connector20. Second electrical connector20is configured to mate with and be coupled to first electrical connector18during operation of heated hose assembly10, discussed further below. Further, second electrical connector20is symmetric about a plane extending through a center axis of first fastener60and a center axis of second fastener62, allowing second electrical connector20to be rotated 180 degrees about second axis68and still mate and couple with first electrical connector18. Referring toFIGS.4A-4B, first electrical connector18is shown disconnected from second electrical connector20(FIG.4A) and first electrical connector18is shown connected to second electrical connector20(FIG.4B). When first electrical connector18is disconnected from second electrical connector20, the features and/or components of first electrical connector18are separated from second electrical connector20such that no electrical current is transferring between the connectors. When first electrical connector18is connected to second electrical connector20, the features and/or components of first electrical connector18are contacting the features and/or components of second electrical connector20such that electrical current can transfer between the connectors. More specifically, when first electrical connector18and second electrical connector20are connected, first flange32is adjacent and abuts second flange56. First fastener60is inserted into and secured to first threaded insert36and second fastener62is inserted into and secured to second threaded insert38. Securing fasteners60,62to threaded inserts36,38ensures that first electrical connector18and second electrical connector20will remain secured together during operation of heated hose assembly10. First seal42is positioned and compressed between first flange32and second flange56, producing a force that pushes first flange32and second flange56away from each other. The force produced by first seal42causes first fastener60and second fastener62to become tensioned, ensuring first fastener60and second fastener62remain secured to first threaded insert36and second threaded insert38, respectively. Further, when first electrical connector18and second electrical connector20are connected, first metallic connector44slides over and engages second metallic connector64such that first metallic connector44encompasses second metallic connector64. The engagement of first metallic connector44and second metallic connector64creates an electric path, allowing electric current to transfer from first electrical connector18to second electrical connector20, or vice versa. To ensure first electrical connector18is properly connected to second electrical connector20, first key34is shaped to mate with second key58and first key34is inserted into second key58. More specifically, first cutout50of first electrical connector18is shaped to accept first protrusion70of second electrical connector20. Likewise, second cutout52of first electrical connector18is shaped to accept second protrusion72of second electrical connector20. The geometry of first cutout50is identical to second cutout52and the geometry of first protrusion70is identical to second protrusion72. As such, first electrical connector18can be rotated 180 degrees about first axis48and first electrical connector18and second electrical connector20can still mate and connect. In this configuration, first cutout50of first electrical connector18can accept second protrusion72of second electrical connector20and second cutout52of first electrical connector18can accept first protrusion70of second electrical connector20. First key34and second key58have mating first cutout50, second cutout52, first protrusion70, and second protrusion72, ensuring that first electrical connector18and second electrical connector20are correctly connected to each other and the full amount of electrical current can transfer through connectors18,20. FIG.5Ais a perspective view of third electrical connector22.FIG.5Bis a front view of third electrical connector22.FIG.6Ais a perspective view of fourth electrical connector24.FIG.6Bis a front view of fourth electrical connector24.FIG.7Ais a cross-sectional view of third electrical connector22and fourth electrical connector24disconnected.FIG.7Bis a cross-sectional view of third electrical connector22and fourth electrical connector24connected.FIGS.5A-7Bwill be discussed together. Referring toFIGS.5A-5B, third electrical connector22includes third body74, third flange76, third key78, third threaded insert80, fourth threaded insert82, third end face84, second seal86, third metallic connector88, and third aperture90. Third body74is the main body portion of third electrical connector22that the other components of third electrical connector22are coupled. Third flange76is positioned adjacent third body74and third flange76extends radially outward from third body74. Third flange76includes apertures extending through third flange76, in which third threaded insert80and fourth threaded insert82are positioned. Third threaded insert80and fourth threaded insert82are configured to accept and mate with fasteners, discussed further below. Third threaded insert80is positioned 180 degrees from fourth threaded insert82about third axis92. In some examples, third threaded insert80and fourth threaded insert82can be molded into third flange76during manufacturing of third electrical connector22. In other examples, third threaded insert80and fourth threaded insert82can be coupled to third flange76after manufacturing of third electrical connector22. Third key78is positioned adjacent third flange76and third key78extends axially outward from third flange76and third body74, with respect to third axis92extending through a center of third flange76and third body74. Third key78is generally cylindrical in shape and includes third cutout94and fourth cutout96extending from third end face84of third key78to third flange76. In the example shown, third cutout94and fourth cutout96include a generally triangular shaped cutout extending into the cylindrically shaped third key78. In another example, third cutout94and fourth cutout96can have any desired shape, as long as third cutout94and fourth cutout96have identical shaped geometry. Third cutout94is positioned 180 degrees from fourth cutout96about third axis92. Third end face84of third key78is positioned at a distal end of third key78. Second seal86is positioned adjacent the location in which third key78interfaces with third flange76and second seal86surrounds a circumference of third key78. Second seal86is configured to prevent debris from entering third electrical connector22when third electrical connector22is connected to fourth electrical connector24. In the example shown, second seal86is an O-ring seal, but in another example, second seal86can be any component that prevents debris from entering third electrical connector22when third electrical connector22is connected to fourth electrical connector24. Third end face84is configured to cover third metallic connector88, preventing a user from touching third metallic connector88. Third metallic connector88is a female connector positioned within third body74and third key78of third electrical connector22. Third metallic connector88is the component that electrically couples third electrical connector22to fourth electrical connector24, allowing electric current to transfer between each connector. A user touching third metallic connector88and fourth metallic connector108of fourth electrical connector24at the same time can result in an electrical circuit being completed, which could shock or harm the user. As such, third end face84is configured to prevent the user from touching third metallic connector88and harming themselves during connecting or disconnecting of third electrical connector22and fourth electrical connector24. Third aperture90is axially aligned with third axis92and third aperture90extends through third end face84. Third aperture90allows access to third metallic connector88, allowing fourth metallic connector108of fourth electrical connector24to interface with third metallic connector88, discussed further below. Third electrical connector22is configured to mate with fourth electrical connector24to complete an electrical circuit, allowing electric current to transfer from third electrical connector22to fourth electrical connector24. Further, third electrical connector22is symmetric about a plane extending through a center axis of third threaded insert80and a center axis of fourth threaded insert82, allowing third electrical connector22to be rotated 180 degrees about third axis92and still mate and couple with fourth electrical connector24. Referring toFIGS.6A-6B, fourth electrical connector24includes fourth body98, fourth flange100, fourth key102, third fastener104, fourth fastener106, fourth metallic connector108, and fourth aperture110. Fourth body98is the main body portion of fourth electrical connector24that the other components of fourth electrical connector24are coupled. Fourth flange100is positioned adjacent fourth body98and fourth flange100extends radially outward from fourth body98. Fourth flange100includes apertures extending through fourth flange100, in which third fastener104and fourth fastener106are positioned. Third fastener104and fourth fastener106are configured to mate with third threaded insert80and fourth threaded insert82of third electrical connector22, respectively. Third fastener104is positioned 180 degrees from fourth fastener106about fourth axis112. Fourth key102is positioned within fourth flange100and fourth body98. More specifically, fourth key102extends axially inward into fourth flange100and fourth body98, with respect to fourth axis112extending through a center of fourth flange100and fourth body98. Fourth key102is generally cylindrical in shape and includes third protrusion114and fourth protrusion116extending inward toward fourth axis112. In the example shown, third protrusion114and fourth protrusion116include a generally triangular shaped protrusion extending inward from the cylindrically shaped fourth key102. In another example, third protrusion114and fourth protrusion116can have any desired shape, as long as third protrusion114and fourth protrusion116have identical shaped geometry. Third protrusion114is positioned 180 degrees from fourth protrusion116about fourth axis112. Fourth aperture110is axially aligned with fourth axis112and fourth aperture110extends into fourth body98. Fourth aperture110provides a location in which fourth metallic connector108can be coupled. Fourth metallic connector108is a male connector positioned within fourth aperture110of fourth body98and fourth key102of fourth electrical connector24. Fourth metallic connector108is the component that electrically couples fourth electrical connector24to third electrical connector22, allowing electric current to transfer between each connector. More specifically, fourth metallic connector108of fourth electrical connector24is inserted into third metallic connector88of third electrical connector22to complete an electric circuit and to transfer electric current between third electrical connector22and fourth electrical connector24. Fourth electrical connector24is configured to mate with and be coupled to third electrical connector22during operation of heated hose assembly10, discussed further below. Further, fourth electrical connector24is symmetric about a plane extending through a center axis of third fastener104and a center axis of fourth fastener106, allowing fourth electrical connector24to be rotated 180 degrees about fourth axis112and still mate and couple with third electrical connector22. Referring toFIGS.7A-7B, third electrical connector22is shown disconnected from fourth electrical connector24(FIG.7A) and third electrical connector22is shown connected to fourth electrical connector24(FIG.7B). When third electrical connector22is disconnected from fourth electrical connector24, the features and/or components of third electrical connector22are separated from fourth electrical connector24such that no electrical current is transferring between the connectors. When third electrical connector22is connected to fourth electrical connector24, the features and/or components of third electrical connector22are contacting the features and/or components of fourth electrical connector24such that electrical current can transfer between the connectors. More specifically, when third electrical connector22and fourth electrical connector24are connected, third flange76is adjacent and abuts fourth flange100. Third fastener104is inserted into and secured to third threaded insert80and fourth fastener106is inserted into and secured to fourth threaded insert82. Securing fasteners60,62to threaded inserts36,38ensures that third electrical connector22and fourth electrical connector24will remain secured together during operation of heated hose assembly10. Second seal86is positioned and compressed between third flange76and fourth flange100, producing a force that pushes third flange76and fourth flange100away from each other. The force produced by second seal86causes third fastener104and fourth fastener106to become tensioned, ensuring third fastener104and fourth fastener106remain secured to third threaded insert80and fourth threaded insert82, respectively. Further, when third electrical connector22and fourth electrical connector24are connected, third metallic connector88slides over and engages fourth metallic connector108such that third metallic connector88encompasses fourth metallic connector108. The engagement of third metallic connector88and fourth metallic connector108creates an electric path, allowing electric current to transfer from third electrical connector22to fourth electrical connector24, or vice versa. To ensure third electrical connector22is properly connected to fourth electrical connector24, third key78is shaped to mate with fourth key102and third key78is inserted into fourth key102. More specifically, third cutout94of third electrical connector22is shaped to accept third protrusion114of fourth electrical connector24. Likewise, fourth cutout96of third electrical connector22is shaped to accept fourth protrusion116of fourth electrical connector24. The geometry of third cutout94is identical to fourth cutout96and the geometry of third protrusion114is identical to fourth protrusion116. As such, third electrical connector22can be rotated 180 degrees about third axis92and third electrical connector22and fourth electrical connector24can still mate and connect. In this configuration, third cutout94of third electrical connector22can accept fourth protrusion116of fourth electrical connector24and fourth cutout96of third electrical connector22can accept third protrusion114of fourth electrical connector24. Third key78and fourth key102have mating third cutout94, fourth cutout96, third protrusion114, and fourth protrusion116, ensuring that third electrical connector22and fourth electrical connector24are correctly connected to each other and the full amount of electrical current can flow through connectors22,24. As discussed, first key34of first electrical connector18is configured to mate with second key58of second electrical connector20. More specifically, first cutout50and second cutout52of first electrical connector18are shaped to mate with first protrusion70and second protrusion72of second electrical connector20. Likewise, third key78of third electrical connector22is configured to mate with fourth key102of fourth electrical connector24. More specifically, third cutout94and fourth cutout96of third electrical connector22are shaped to mate with third protrusion114and fourth protrusion116of fourth electrical connector24. Therefore, first key34, second key58, third key78, and fourth key102ensure first electrical connector18and second electrical connector20are correctly connected, and ensure third electrical connector22and fourth electrical connector24are correctly connected. Further, first key34, second key58, third key78, and fourth key102prevent first electrical connector18from connecting with fourth electrical connector24, and prevent third electrical connector22from connecting with second electrical connector20. First electrical connector18includes first key34with a geometry that differs from the geometry of third key78of third electrical connector22. Further, first electrical connector18includes first key34with a geometry that cannot mate with the geometry of fourth key102of fourth electrical connector24. More specifically, first cutout50and second cutout52of first electrical connector18include a geometry that does not conform and mate with third protrusion114and fourth protrusion116of fourth electrical connector24. As such, first key34and fourth key102cannot be connected, preventing first electrical connector18and fourth electrical connector24from being electrically coupled. Similarly, third electrical connector22includes third key78with a geometry that differs from the geometry of first key34of first electrical connector18. Further, third electrical connector22includes third key78with a geometry that cannot mate with the geometry of second key58of second electrical connector20. More specifically, third cutout94and fourth cutout96of third electrical connector22include a geometry that does not conform and mate with first protrusion70and second protrusion72of second electrical connector20. As such, third key78and second key58cannot be connected, preventing third electrical connector22and second electrical connector20from being electrically coupled. Electrical connectors18,20,22, and24including keys34,58,78, and102, respectively, ensure that electrical connector system12of heated hose assembly10is connected correctly. In turn, this ensure that electrical current and power is supplied to sufficiently heat first heated hose14and second heated hose16. The geometry of keys34,58,78, and102allows a user to easily and repeatedly connect electrical connectors18,20,22, and24. Further, first end face40and third end face84prevent a user from touching first metallic connector44and third electrical connector22, preventing a user from completing the electrical circuit and electrocuting themselves or others. Additionally, first threaded insert36, second threaded insert38, first fastener60, and second fastener62ensure connectors18,20,22, and24remain secured together during operation of heated hose assembly10, providing electric current to first heated hose14and second heated hose16. Electrical connectors18,20,22, and24can be constructed from one or more of a glass filled nylon, a glass filled plastic, and other composite materials, to meet nationally recognized safety and sustainability standards. Electrical connectors18,20,22, and24include keys34,58,78, and102, respectively, including different mating geometries, ensuring connectors18,20,22, and24can only be connected in the correct configuration to provide the requisite electrical current and power to the independently heated first heated hose14and second heated hose16. Heated hose assembly10utilizes electrical connector system12to increase the temperature of the first fluid component and the second fluid component flowing through the conduits of first heated hose14and second heated hose16, respectively. An example method of operating heated hose assembly10can include providing first heated hose14configured to transfer a first fluid component, first heated hose14comprising first electrical connector18and second electrical connector20each electrically coupled to heating elements of first heated hose14. Providing second heated hose16configured to transfer a second fluid component, second heated hose16comprising third electrical connector22and fourth electrical connector24each electrically coupled to heating elements of second heated hose16. Electrically coupling first electrical connector18to second electrical connector20such that first key34of first electrical connector18mates with second key58of second electrical connector20. Electrically coupling third electrical connector22to fourth electrical connector24such that third key78of third electrical connector22mates with fourth key102of fourth electrical connector24. Supplying a first electric current through first electrical connector18and second electrical connector20to increase a temperature of the first fluid component transferring through first heated hose14. Supplying a second electric current through third electrical connector22and fourth electrical connector24to increase a temperature of the second fluid component transferring through second heated hose16. The method can further include providing first threaded insert36and second threaded insert38within first flange32of first electrical connector18. Providing first fastener60and second fastener62extending through second flange56of second electrical connector20. Threading first fastener60and second fastener62into first threaded insert36and second threaded insert38, respectively, to couple first electrical connector18to second electrical connector20. Providing third threaded insert80and fourth threaded insert82within third flange76of third electrical connector22. Providing third fastener104and fourth fastener106extending through fourth flange100of fourth electrical connector24. Threading third fastener104and fourth fastener106into third threaded insert80and fourth threaded insert82, respectively, to couple third electrical connector22to fourth electrical connector24. It is to be understood that the preceding method steps for increasing the temperature of first heated hose14and second heated hose16are only example steps and the method can include other steps not specifically described. Discussion of Non-Exclusive Examples The following are non-exclusive descriptions of possible examples of the present invention. An electrical connector system comprising: a first electrical connector comprising a first key; a second electrical connector comprising a second key shaped to mate with the first key; a third electrical connector comprising a third key; and a fourth electrical connector comprising a fourth key shaped to mate with the third key; wherein a geometry of the first key differs from a geometry of the third key, and wherein a geometry of the second key differs from a geometry of the fourth key. The electrical connector system of the preceding paragraph can optionally include, additionally and/or alternatively, any one or more of the following features, configurations and/or additional components: The first electrical connector is a male connector and the second electrical connector is a female connector, and wherein the first electrical connector is configured to mate and connect with the second electrical connector. The third electrical connector is a male connector and the fourth electrical connector is a female connector, and wherein the third electrical connector is configured to mate and connect with the fourth electrical connector. The first electrical connector further comprises a first body and a first flange extending radially outward from the first body; and the second electrical connector further comprises a second body and a second flange extending radially outward from the second body. A first threaded insert and a second threaded insert are positioned within the first flange of the first electrical connector; and a first fastener and a second fastener are positioned within and extend through the second flange of the second electrical connector. The first threaded insert is coupled to the first fastener when the first electrical connector and the second electrical connector are connected; and the second threaded insert is coupled to the second fastener when the first electrical connector and the second electrical connector are connected. The third electrical connector further comprises a third body and a third flange extending radially outward from the third body; and the fourth electrical connector further comprises a fourth body and a fourth flange extending radially outward from the fourth body. A third threaded insert and a fourth threaded insert are positioned within the third flange of the third electrical connector; and a third fastener and a fourth fastener are positioned within and extend through the fourth flange of the fourth electrical connector. The third threaded insert is coupled to the third fastener when the third electrical connector and the fourth electrical connector are connected; and the fourth threaded insert is coupled to the fourth fastener when the third electrical connector and the fourth electrical connector are connected. The first key comprises a first cutout and a second cutout extending from a first end face of the first electrical connector to a first flange of the first electrical connector; and the second key comprises a first protrusion and a second protrusion extending into a second aperture of a second body of the second electrical connector. The first cutout is positioned 180 degrees from the second cutout about a first axis extending through a first aperture of the first electrical connector; and the first protrusion is positioned 180 degrees from the second protrusion about a second axis extending through the second aperture of the second electrical connector. The first cutout includes a geometry identical to the second cutout; the first protrusion includes a geometry identical to the second protrusion; the first cutout is shaped to accept the first protrusion and the second cutout is shaped to accept the second protrusion; and the first cutout is shaped to accept the second protrusion and the second cutout is shaped to accept the first protrusion. The third key comprises a third cutout and a fourth cutout extending from a third end face of the third electrical connector to a third flange of the third electrical connector; and the fourth key comprises a third protrusion and a fourth protrusion extending into a fourth aperture of a fourth body of the fourth electrical connector. The third cutout is positioned 180 degrees from the fourth cutout about a third axis extending through a third aperture of the third electrical connector; and the third protrusion is positioned 180 degrees from the fourth protrusion about a fourth axis extending through the fourth aperture of the fourth electrical connector. The third cutout includes a geometry identical to the fourth cutout; the third protrusion includes a geometry identical to the fourth protrusion; the third cutout is shaped to accept the third protrusion and the fourth cutout is shaped to accept the fourth protrusion; and the third cutout is shaped to accept the fourth protrusion and the fourth cutout is shaped to accept the third protrusion. The geometry of the first cutout differs from the third cutout and the fourth cutout; the geometry of the second cutout differs from the third cutout and the fourth cutout; the geometry of the first protrusion differs from the third protrusion and the fourth protrusion; and the geometry of the second protrusion differs from the third protrusion and the fourth protrusion. The following are further non-exclusive descriptions of possible examples of the present invention. A heated hose assembly comprising: a first heated hose configured to transfer a first fluid component; a second heated hose configured to transfer a second fluid component; a first electrical connector electrically coupled to heating elements of the first heated hose, the first electrical connector comprising a first key; a second electrical connector electrically coupled to heating elements of the first heated hose, the second electrical connector comprising a second key shaped to mate with the first key; a third electrical connector electrically coupled to heating elements of the second heated hose, the third electrical connector comprising a third key; a fourth electrical connector electrically coupled to heating elements of the second heated hose, the fourth electrical connector comprising a fourth key shaped to mate with the third key. The heated hose assembly of the preceding paragraph can optionally include, additionally and/or alternatively, any one or more of the following features, configurations and/or additional components: The first electrical connector further comprises a first body, a first flange extending radially outward from the first body, a first threaded insert positioned within the first flange, and a second threaded insert positioned within the flange; and the second electrical connector further comprises a second body, a second flange extending radially outward from the second body, a first fastener extending through the second flange, and a second fastener extending through the second flange. The first electrical connector is symmetric about a plane extending through a center axis of the first threaded insert and a center axis of the second threaded insert; and the second electrical connector is symmetric about a plane extending through a center axis of the first fastener and a center axis of the second fastener. The first key of the first electrical connector comprises a first cutout and a second cutout having identical geometry; the second key of the second electrical connector comprises a first protrusion and a second protrusion having identical geometry; the third key of the third electrical connector comprises a third cutout and a fourth cutout having identical geometry; the fourth key of the fourth electrical connector comprises a third protrusion and a fourth protrusion having identical geometry; the first cutout is shaped to accept the first protrusion and the second cutout is shaped to accept the second protrusion; the third cutout is shaped to accept the third protrusion and the fourth cutout is shaped to accept the fourth protrusion; the geometry of the first cutout differs from the geometry of the third cutout and the geometry of fourth cutout; and the geometry of the first protrusion differs from the geometry of the third protrusion and the geometry of the fourth protrusion. The following are further non-exclusive descriptions of possible examples of the present invention. A method of operating a heated hose assembly, the method comprising: providing a first heated hose configured to transfer a first fluid component, the first heated hose comprising a first electrical connector and a second electrical connector each electrically coupled to heating elements of the first heated hose; providing a second heated hose configured to transfer a second fluid component, the second heated hose comprising a third electrical connector and a fourth electrical connector each electrically coupled to heating elements of the second heated hose; electrically coupling the first electrical connector to the second electrical connector such that a first key of the first electrical connector mates with a second key of the second electrical connector; electrically coupling the third electrical connector to the fourth electrical connector such that a third key of the third electrical connector mates with a fourth key of the fourth electrical connector; supplying a first electric current through the first electrical connector and the second electrical connector to increase a temperature of the first fluid component transferring through the first heated hose; and supplying a second electric current through the third electrical connector and the fourth electrical connector to increase a temperature of the second fluid component transferring through the second heated hose. The method of the preceding paragraph can optionally include, additionally and/or alternatively, any one or more of the following features, configurations and/or additional components: Providing a first threaded insert and a second threaded insert within a first flange of the first electrical connector; providing a first fastener and a second fastener extending through a second flange of the second electrical connector; threading the first fastener and the second fastener into the first threaded insert and the second threaded insert, respectively, to couple the first electrical connector to the second electrical connector; providing a third threaded insert and a fourth threaded insert within a third flange of the third electrical connector; providing a third fastener and a fourth fastener extending through a fourth flange of the fourth electrical connector; and threading the third fastener and the fourth fastener into the third threaded insert and the fourth threaded insert, respectively, to couple the third electrical connector to the fourth electrical connector. While the invention has been described with reference to an exemplary embodiment(s), it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment(s) disclosed, but that the invention will include all embodiments falling within the scope of the appended claims. | 48,872 |
11942728 | DETAILED DESCRIPTION The detailed description that follows describes exemplary embodiments and is not intended to be limited to the expressly disclosed combination(s). Therefore, unless otherwise noted, features disclosed herein may be combined to form additional variations that were not otherwise shown for purposes of brevity. While the preferred embodiment of the disclosure has been shown and described, it will be apparent to those skilled in the art that changes and modifications may be made therein without departing from the spirit of the disclosure, the scope of which is defined by the appended claims. Like members are designated by like reference characters. The term, “Connected Car” is an umbrella term used to encompass many elements of in-car connectivity from infotainment to assisted vehicle technology and full autonomy. Additional uses include vehicles that communicate with each other and the associated outside infrastructure combined with the growing use of mobile devices and other new driver-assistance technologies. The use of high-speed connectivity joins together all the electronics systems of the car, including the instrument cluster, the infotainment and the telematics systems. Directional terms such as front, rear, horizontal, vertical and the like are used for ease in explanation, and do not denote a required orientation in use. A connector system20is disclosed for an in-vehicle networking system, which may be an in-vehicle Ethernet networking system. The connector system20includes an electrical connector22having an insulating housing24that retains a terminal module26having a plurality of electrically conductive signal terminals28a-f,128a-fand configured to mate with a second connector (not shown) having an intermating insulating housing that retains a corresponding plurality of electrically conductive terminals configured to mate with the signal terminals28a-f,128a-fin the electrical connector22along a mating direction M. The electrical connector22is configured to mate with a component30. In an embodiment as shown inFIG.1, the component30is a printed circuit board and the signal terminals28a-f,128a-fare surface mounted or through mounted to the circuit board in a known manner. In another embodiment, the component30are wires (not shown) to which the signal terminals28a-f,128a-fare wire bonded in a known manner. The housing24includes a rear connector mating end32, an opposite front end34and a passageway36extending therebetween. The terminal module26seats partially within the passageway36and extends forwardly from the front end34for connection to the component30. The housing24may engage with circuit board in a known manner. In a first embodiment, as best shown inFIGS.1-24, the terminal module26includes an upper terminal block38and a lower terminal block138which are stacked on top of each other in a stacked arrangement and are engaged with each other, an upper insulative insert40operatively coupled to the terminal blocks38,138, a lower insulative insert140operatively coupled to the terminal blocks38,138, a rear insulative housing42engaged with the terminal blocks38,138, and an electrically conductive shield44which secures the terminal blocks38,138, the inserts40,140and the rear housing42together. The upper and lower inserts40,140are interengaged and sandwich the signal terminals28a-f,128a-ftherebetween as described herein. The inserts40,140allows dielectric material to be positioned in areas between the signal terminals28a-f,128a-f, therefore adjusting dielectric constants between the signal terminals28a-f,128a-fand terminal pairs. The upper terminal block38includes the signal terminals28a-fand an insulative housing46disposed therearound. The signal terminals28a-fare spaced apart from each other and form an upper row in the stacked arrangement. The lower terminal block138includes the signal terminals128a-fand an insulative housing146disposed therearound. The signal terminals128a-fare spaced apart from each other and form a lower row in the stacked arrangement. As best shown inFIGS.4-6, each signal terminal28a-f,128a-fsequentially includes a rear mating interface section48,148, an intermediate section50,150, and a front tail section52,152. The mating interface section48,148is configured to be mechanically and electrically connected to the second connector (not shown). In the embodiment as shown, the mating interface section48,148of each signal terminal28a-f,128a-fincludes a pair of cantilevered beams54,56,154,156which can be flexed away from each other to receive the second connector therebetween. The intermediate section50,152of each signal terminal28a-f,128a-fis a flat horizontal member which extends from a rear end of the mating interface section48,148. The tail section52,152of each signal terminal28a-f,128a-fis configured to engage with the component30. If the component30is a circuit board as shown, the tail sections52,152are mechanically and electrically connected thereto in a known manner, such as by soldering. In other embodiments, the tail sections52,152are wire bonded to cables in a known manner. Other known structures for terminating the tail sections52,152to components30are within the scope of the present disclosure. The upper housing46has rear and front surfaces46a,46b, top, bottom and side surfaces46c,46d,46e,46fextending between the surfaces46a,46b, and a plurality of laterally spaced apart passageways58extending between the surfaces46a,46b, seeFIG.8. The passageways58form a row. The intermediate section50of each signal terminal28a-fextend through one of the passageways58, with the mating interface section48extending rearwardly from the rear surface46a, and the tail section52extending forwardly from the front surface46b, seeFIGS.8and9. As a result, rear spaces60,FIG.9, are defined between the mating interface sections48of the respective signal terminals28a-f, and front spaces62,FIG.9, are defined between the tail sections52of the respective signal terminals28a-f. In an embodiment, the upper housing46is formed by insert molding material around the intermediate sections50of the signal terminals28a-f. A lead frame (not shown) may be formed on which the signal terminals28a-fare stamped and formed and held together by a carrier (not shown). The housing46is then molded over or around the intermediate sections50of the signal terminals28a-f. In another embodiment, the upper housing46may be separately formed and the signal terminals28a-fare positioned through the passageways58. The lower housing146has rear and front surfaces146a,146b, top, bottom and side surfaces146c,146d,146e,146fextending between the surfaces146a,146b, and a plurality of laterally spaced apart passageways158extending between the surfaces146a,146b, seeFIG.14. The passageways158form a row. The intermediate section150of each signal terminal128a-fextend through one of the passageways158, with the mating interface section148extending rearwardly from the rear surface146a, and the tad section152extending forwardly from the front surface146b, seeFIGS.14and15. As a result, rear spaces160, seeFIG.15, are defined between the mating interface sections148of the respective signal terminals128a-f, and front spaces162, seeFIG.15, are defined between the tail sections152of the respective signal terminals128a-f. In an embodiment, the lower housing146is formed by insert molding material around the intermediate sections150of the signal terminals128a-f. A lead frame (not shown) may be formed on which the signal terminals128a-fare stamped and formed and held together by a carrier (not shown). The housing146is then molded over or around the intermediate sections150of the signal terminals128a-f. In another embodiment, the lower housing146may be separately formed and the signal terminals128a-fare positioned through the passageways158. The signal terminals28a-f,128a-fare arranged in differential pairs within each row in the housings46,146. In the upper terminal block38, signal terminals28a,28bform a first differential pair which are side-by-side in the row, signal terminals28c,28dform a second differential pair which are side-by-side in the row, and signal terminals28e,28fform a third differential pair which are side-by-side in the row. In the lower terminal block138, signal terminals128a,128bform a first differential pair which are side-by-side in the row, signal terminals128c,128dform a second differential pair which are side-by-side in the row, and signal terminals128e,128fform a third differential pair which are side-by-side in the row. While three differential pairs are shown in each of the terminal blocks38,138, more or fewer differential pairs may be provided. Each signal terminal28a-f,128a-fincludes a specific spacing within the housing46,146and geometry, including but not limited to varying cross-sections, cut-outs, radii and spacing gaps. Each geometrical configuration and position of the signal terminal28a-f,128a-fis specifically arranged within the respective housing46,146to optimize the signal integrity (SI) performance of each differential signal pair. Examples of optimized SI tuning includes adjusting the spacing between the mating interface sections148of the signal terminals28a-f,128a-fto increase impedance. Notches may be formed along the signal terminals28a-f,128a-fto match impedance and create a balanced signal transmission. Further, the housings46,146may also be specifically formed to tune the SI performance of each terminal block38,138. For example, the housings46,146may include cross-holes and apertures that interact with the specific geometry of each signal terminal28a-f,128a-for terminal pair to affect the optimized SI performance. Accordingly, portions of each signal terminal28a-f,128a-fmay be exposed to air or totally enclosed by the insulative material of the housing46,146with additional adjustments to material thickness by either increasing or decreasing the insulative material in specific areas or regions. The dielectric constants of the insulative housings46,146and air are strategically employed to further enhance the SI performance of the signal terminals28a-f,128a-f. As shown inFIG.7. The upper terminal block38is stacked on top of the lower terminal block138to form the stacked arrangement. The bottom surface46dof the upper housing46sits on the top surface146cof the lower housing146. The mating interface sections48,148extend rearwardly from the housings46,146such that an upper row of mating interface sections48is formed by the upper terminal block38and a lower row of mating interface sections148is formed by the lower terminal block138, and the tail sections52,152extend forwardly from the housings46.146such that an upper row of tail sections52is formed is formed by the upper terminal block38and a lower row of tail sections152is formed is formed by the lower terminal block138. The upper and lower housings46,146may include interengagements for coupling the housings46,146together. For example and as shown inFIGS.9and15, the lower housing146includes a projection164extending from the top surface146cthereof which engages with an opening66on the bottom surface46dof the upper housing46, and includes an opening166in the top surface146cthereof which engages with a projection68extending from the bottom surface46dof the upper housing46. This ensures the correct orientation of the housings46,146relative to each other, and thus the terminal blocks38,138, while interlocking the housings46,146together. The upper insert40is operatively coupled to the terminal blocks38,138as described herein. The upper insert40is formed of a plastic material having dielectric constant (Dk) greater than 1 (air/vacuum). In a preferred embodiment, the dielectric constant of the plastic material of the upper insert40(dielectric constant, relative permittivity) is greater than 4.5. In an embodiment, the upper insert40is formed of a plastic resin having a glass content of 15%-30%. The upper insert40includes a base70and a plurality of spaced apart teeth72extending from a first side thereof which define a plurality of spaced apart channels74. In an embodiment, a plurality of spaced apart fins76extend from the opposite side of the base70which define a plurality of spaced apart channels78. The outermost teeth form end walls80,82. The lower insert140is operatively coupled to the terminal blocks38,138as described herein. The lower insert140is formed of a plastic material having dielectric constant (Dk) greater than 1 (air/vacuum). In a preferred embodiment, the dielectric constant of the plastic material of the lower insert140(dielectric constant, relative permittivity) is greater than 4.5. In an embodiment, the lower insert140is formed of a plastic resin having a glass content of 15%-30%. The lower insert140includes a base170and a plurality of spaced apart teeth172extending a first side thereof which define a plurality of spaced apart channels174. In an embodiment, a plurality of spaced apart fins176extend from the opposite side of the base170which define a plurality of spaced apart channels178. The outermost teeth form end walls180,182. The upper and lower inserts40,140are attached to the tail sections52,152of the signal terminals28a-f,128a-f. The teeth72of the upper insert40pass through the spaces62between the tail sections52of the signal terminals28a-fof the upper terminal block38and seat within the channels174of the lower insert140. The teeth172of the lower insert140pass through the spaces162between the tail sections152of the signal terminals128a-fof the lower terminal block138and seat within the channels74of the upper insert40. As shown inFIG.21, the teeth72of the upper insert40are laterally offset from the teeth172of the lower insert140. Ends182of the teeth172of the lower insert140face the tail sections52of the signal terminals28a-fand the tail sections52of the signal terminals28a-fare positioned between the ends182of the teeth172of the lower insert140and the base70of the upper insert40. This forms an upper row of laterally spaced apart passageways84, seeFIG.21, between the base70, the teeth72and the teeth172. The passageways84may be larger than the tail sections152such that an air gap is provided around the tail section152in each passageway84. Ends82of the teeth72of the upper insert40face the tail sections152of the signal terminals128a-fand the tail sections152of the signal terminals128a-fare positioned between the ends82of the teeth72of the upper insert40and the base170of the lower insert140. This forms a lower row of passageways184, seeFIG.21, between the base170, the teeth172and the teeth72. The passageways184may be larger than the tail sections52such that an air gap is provided around the tail section52in each passageway184. In effect, the teeth72,172form an interengaging comb structure. In an embodiment and as best shown inFIG.21, portions86,88of the side walls of the teeth72extending from the end82are tapered to provide lead-in surfaces for the teeth72to easily enter into the channels174with the remainder of the sides walls of the teeth72being straight, and portions186,188of the side walls of the teeth172extending from the end182are tapered to provide lead-in surfaces for the teeth172to easily enter into the channels74with the remainder of the sides walls of the teeth72being straight. Alternatively, the remainder of the side walls may have features which enable the teeth72to engage with the teeth172to prevent relative movement between the teeth72,172. Ends of the end walls80,180may abut against each other, and ends of the end walls82,182may abut against each other to ensure proper spacing between the teeth72and the base170for the tail sections52, and between the teeth172and the base70for the tail sections152. As a result, the tail sections52,152are separated from each other by the mated inserts40,140. The mated inserts40,140provide for decreased impedance between the differential signal pairs of the signal terminals28a-f,128a-f, and further tune the SI performance of each differential signal pair of signal terminals28a-f,128a-f. Thus the depicted design allows for tuning of the impedance of the terminals while ensuring the overall dielectric constant is kept low due to the significant use of air. In an embodiment and as shown in the drawings, each signal terminal28a-f,128a-fis a right-angle terminal such that each tail section52,152has a horizontal portion90,190and a vertical portion92,192joined together at a 90-degree bend94,194, seeFIG.6. In this embodiment, the horizontal portions90of the upper terminals28a-fare longer than the horizontal portions190of the lower terminals128a-f, and the vertical portions92of the upper terminals28a-fare longer than the vertical portions192of the lower terminals128a-f. With this embodiment, the base70of the upper insert40is L-shaped with a horizontal portion96and a vertical portion98joined together at a bend100, and each tooth72is L-shaped with a horizontal portion102extending from the horizontal portion96of the base70and ending at an end104, and a vertical portion106extending from the vertical portion98of the base70and ending at an end108. The ends104,108thus form an L-shape. This forms a horizontal portion110of the channel74and a vertical portion112of the channel74. The fins76can likewise be L-shaped and have a horizontal portion114extending from the horizontal portion96of the base70and a vertical portion116extending from the vertical portion98of the base70. Further with this embodiment, the base170of the lower insert140is L-shaped with a horizontal portion196and a vertical portion198joined together at a bend200, and each tooth172is L-shaped with a horizontal portion202extending from the horizontal portion196of the base170and ending at an end204, and a vertical portion206extending from the vertical portion198of the base170and ending at an end208. The ends204,208thus form an L-shape. This forms a horizontal portion210of the channel174and a vertical portion212of the channel174. The fins176can likewise be L-shaped and have a horizontal portion214extending from the horizontal portion196of the base170and a vertical portion216extending from the vertical portion198of the base170. With the right-angle embodiment, the upper and lower inserts40,140are attached to the tail sections52,152of the signal terminals28a-f,128a-f. The horizontal portions102of the teeth72of the upper insert40pass between the horizontal portions90of the tail sections52of the signal terminals28a-fof the upper terminal block38and seat within the horizontal portions210of the channels174of the lower insert140. The vertical portions106of the teeth72of the upper insert40pass between the vertical portions92of the tail sections52of the signal terminals28a-fof the upper terminal block38and seat within the vertical portions212of the channels174of the lower insert140. The horizontal portions202of the teeth172of the lower insert140pass between the horizontal portions190of the tail sections152of the signal terminals128a-fof the lower terminal block138and seat within the horizontal portions110of the channels74of the upper insert40. The vertical portions206of the teeth172of the lower insert140pass between the vertical portions192of the tail sections152of the signal terminals128a-fof the lower terminal block138and seat within the vertical portions112of the channels74of the upper insert40. As such, the horizontal portion96of the base70is above the horizontal portion196of the base170and the vertical portion98of the base70is forward of the vertical portion198of the base170 The ends204,208of the teeth172of the lower insert140face the horizontal and vertical portions90,92of the tail sections52of the signal terminals28a-fand the horizontal and vertical portions90,92of the tail sections52of the signal terminals28a-fare positioned between the ends204,208of the teeth172of the lower insert140and the base70of the upper insert40. This forms horizontal and vertical portions of the upper row of passageways84which may be larger than the horizontal and vertical portions190,192of the tail sections152such that an air gap is provided. The ends104,108of the teeth72of the upper insert40face the horizontal and vertical portions190,192of the tail sections152of the signal terminals128a-fand the horizontal and vertical portions190,192of the tail sections152of the signal terminals128a-fare positioned between the ends104,108of the teeth72of the upper insert40and the base170of the lower insert140. This forms horizontal and vertical portions of the passageways184which may be larger than the horizontal and vertical portions90,92of the tail sections52such that an air gap is provided. In an embodiment, side walls of the horizontal and vertical portions102,106of the teeth72extending from the ends104,108are tapered to provide lead-in surfaces for the teeth72to easily enter into the horizontal and vertical portions210,212of the channels174, and side walls of the horizontal and vertical portions202,206of the teeth172extending from the ends204,208are tapered to provide lead-in surfaces for the teeth172to easily enter into the horizontal and vertical portions110,112of the channels74. In effect, the teeth72,172form an interengaging comb structure. As a result, the tail sections52,152are separated from each other by the mated inserts40,140. The mated inserts40,140provide for decreased impedance between the differential signal pairs of the signal terminals28a-f,128a-f, and further tune the SI performance of each differential signal pair of signal terminals28a-f,128a-fversus only providing air gaps between the tail portions52,152. While each tail section52,152is shown as L-shaped in the drawings, it is to be understood that each tail section52,152can be straight. In such an embodiment the connector would be configured for vertical engagement instead of the depicted right angle engagement but otherwise the internal design can be substantially the same. In an embodiment, the space between the signal terminals28a-f,128a-fand the inserts40,140is filled with curable adhesive (such as an ultra violet curable adhesive) to remove all air gaps which, in certain embodiments may be useful to tune the overall performance of the connector system because of the evacuation of nearly all air and the curable adhesive being in close contact with the signal terminals28a-f,128a-f. In an embodiment, the inserts40,140have locking features which lock the inserts40,140together. As shown inFIG.3, the rear housing42includes a rear connector mating end220, an opposite front end222and a plurality of passageways224extending therebetween. The passageways224are provided in an array of rows and columns to correspond to the positions of the signal terminals28a-f,128f. The rear housing42may include engaging features226which seat within recesses228in the housings46,146to secure the rear housing42to the stacked terminal blocks38,138. The signal terminals28a-f,128fextend into the passageways224for connection to the component30. As shown inFIG.3, the shield44may be formed of an upper cover230and a lower base232which mate together and surround the terminal blocks38,138, the inserts40,140and the housings46,146to form a rear mating end236and a front component mount end238. The cover230and the base232are U-shaped and interlock together to completely enclose the terminal blocks38,138, the inserts40,140and the rear housing42, other than at the rear mating end236and at the front component mount end238. The rear mating end236is configured to engage a cooperating portion of the second connector. The cover230may include downwardly extending tails240configured to be inserted into and secured within plated through holes in a circuit board. The shield44may include locking structure for retaining the terminal blocks38,138, the inserts40,140and the rear housing42therewithin. Top surfaces114aof the horizontal portions114of the fins76engage with the cover230and bottom surfaces216aof the vertical portions216of the fins176engage with the base232. In an embodiment, seeFIGS.26and27, crush ribs242are provided on one or more the top surfaces114aof the fins76and on one or more of the bottom surfaces216aof the fins176(or if the fins76,176are eliminated then on the surface that engages with the cover230and the base232of the shield44). In an alternative embodiment, the crush ribs are formed on the cover230and the base232. When the cover230and base232are mated with the inserts40,140, the crush ribs242are crushed between the cover230and the fins76and the base232and the fins176to restrict movement and twist in all directions, as well as reference the assembled inserts40,140to the shield44. This further aids in the assembly and assists in controlling position. This maintains the position of the shield44to the terminals blocks38,138and to the inserts40,140, further improving the electrical characteristics of the electrical connector22. In an embodiment, each signal terminals28a-fhas a widened portion246, seeFIGS.5and28, which forms wings on the signal terminals28a-f. This provides for the signal terminals28a-fto be closer together in this region to improve electrical properties. In some embodiments, each signal terminals128a-falso has a widened portion. The provision of the fins76,176further assists in improving electrical properties. In an embodiment, in addition to the differential pairs of signal terminals28a-f,128a-f, power terminals248,250, seeFIG.29, are provided in the terminal module26. The power terminal248extends through another passageway58through the housing46of the terminal block38, and the power terminal250extends through another passageway158through the housing146of the terminal block138. The inserts40,140may, or may not, extend around the power terminals248,250. The power terminal248may be provided at any point along the row of signal terminals28a-f, and the power terminal250may be provided at any point along the row of signal terminals128a-f. If the power terminals248,250are not provided at an end of the housings46,146, and the power terminals248,250are not surrounded by the inserts40,140, each insert40,140may be provided as two separate pieces. Another embodiment of the electrical connector1022is shown inFIGS.30and31. The electrical connector1022can be formed similar to the electrical connector22but may omit the inserts1040,1140. Therefore, the specifics of the stacked upper and lower terminal blocks38,138, the rear insulative housing42engaged with the terminal blocks38,138, and the electrically conductive shield44which secures the terminal blocks38,138, the inserts1040,1140and the rear housing42together are not described. The insert1040is insert molded between the row of the signal terminals28a-fand the row of the signal terminals128a-f. When the insert1040is insert molded, a base1070is formed between the row of the signal terminals28a-fand the row of the signal terminals128a-f, a plurality of spaced apart teeth1072extending from a first side thereof which define a plurality of spaced apart channels1074in which the tail sections52of the signal terminals28a-fare seated as a result of the insert molding, and a plurality of spaced apart teeth1172extending from a second side thereof which define a plurality of spaced apart channels1174in which the tail sections152of the signal terminals128a-fare seated as a result of the insert molding. Thereafter, the insert1140is insert molded around a portion of the tail sections52of the signal terminals28a-f, around a portion of the tail sections152of the signal terminals128a-f, and around the insert1040and form passageways in which the tail sections52,152are positioned. The insert1140may be insert molded around all but one of the sides of the insert1040. As such, the inserts1040,1140sandwich the signal terminals28a-f,128a-ftherebetween. A portion of each tail section152extends outward of the passageways for connection to the other component30. The inserts1040,1140are formed of a plastic material having dielectric constant (Dk) greater than 1 (air/vacuum). In an embodiment the dielectric constant of the plastic material of the inserts1040,1140(dielectric constant, relative permittivity) is greater than 4.5. In an embodiment, the inserts1040,1140is formed of a plastic resin having a glass content of 15%-30%. The inserts1040,1140allows dielectric material to be positioned in areas between the signal terminals28a-f,128a-f, therefore adjusting dielectric constants between the signal terminals28a-f,128a-fand terminal pairs. As shown, each tail section52.152is L-shaped such that a right-angle electrical connector1022is formed. Alternatively, as discussed above, each tail section52,152may be straight so as to provide a vertical connector instead of the depicted right angle connector. The disclosure provided herein describes features in terms of preferred and exemplary embodiments thereof. Numerous other embodiments, modifications and variations within the scope and spirit of the appended claims will occur to persons of ordinary skill in the art from a review of this disclosure. | 29,155 |
11942729 | DETAILED DESCRIPTION TO EXECUTE THE INVENTION Description of Embodiments of Present Disclosure First, embodiments of the present disclosure are listed and described. [1] The shield connector of the present disclosure includes a housing, a shield shell for covering the housing from outside, a terminal to be accommodated into the housing and electrically connected to a mating device, and an inner conductor for electrically connecting the terminal and a wire, wherein high radiation portions having at least a higher radiation rate than a core of the wire are provided on at least some of a surface of the housing, a surface of the shield shell, a surface of the terminal and a surface of the inner conductor. According to the above mode, heat generated in the terminal and the inner conductor in association with energization can be actively dissipated from the housing and the shield shell by including the high radiation portions having a higher radiation rate than the core of the wire. Thus, heat dissipation can be improved without enlargement. [2] Preferably, the shield shell includes a low radiation portion having a lower radiation rate than the high radiation portions on at least a part of an outer surface of the shield shell. According to this mode, since the low radiation portion having a lower radiation rate than the high radiation portions is provided on at least the part of the outer surface of the shield shell, the influence of heat by a heat source can be suppressed in the low radiation portion, for example, if the heat source is present outside. [3] Preferably, the low radiation portion is provided at a position facing an external heat source on the outer surface of the shield shell. According to this mode, the influence of heat by the external heat source can be suppressed by providing the low radiation portion at the position facing the external heat source on the outer surface of the shield shell. Details of Embodiment of Present Disclosure Hereinafter, a specific example of a shield connector is described with reference to the drawings. Note that the present invention is not limited to these illustrations and is intended to be represented by claims and include all changes in the scope of claims and in the meaning and scope of equivalents. Further, in figures, a part of a configuration may be shown in an exaggerated or simplified manner for the convenience of description. As shown inFIGS.1to3, a shield connector10of this embodiment is, for example, mounted on a case C of a device such as an inverter or motor of a hybrid vehicle, electric vehicle or the like. An unillustrated device-side connector is disposed inside the case C. The shield connector10is connectable to the device-side connector. Note that, in the following description, a vertical direction is based on a vertical direction ofFIG.4. Further, a front-rear direction is based on a lateral direction ofFIG.4, wherein a leftward direction (connecting direction to the device-side connector) inFIG.4is referred to as a forward direction and a rightward direction (separating direction from the device-side connector) inFIG.4is referred to as a rearward direction. As shown inFIGS.1to4, the shield connector10includes housings11made of synthetic resin, a shield shell12for covering the housings11, inner conductive members13provided inside the housings11, and connection terminals14for electrically connecting the inner conductive members13and terminals of the mating connector. The housing11is, for example, made of synthetic resin and substantially L-shaped as a whole. One end of the housing11projects forward, and the other end projects downward. The device-side connector is connected to a front end part of the housing11, and an end of a wire W is introduced into a lower end part of the housing11. In other words, the wire W is pulled out from the bottom of the housing11. As shown inFIG.4, the housing11includes a rear member21, a front member22and a cover member23. The rear member21includes a first tube portion24extending in the front-rear direction and a second tube portion25extending downward from a rear side of the first tube portion24, and is substantially L-shaped. The first tube portion24includes openings24a,24bin both ends in the front-rear direction. The cover member23is detachably provided in the opening24aon a rear side of the first tube portion24. The front member22is mounted in the opening24bon a front side of the first tube portion24. The front member22is, for example, formed into a tubular shape. The inner conductive member13includes a first conductive member31to be connected to a core W1of the wire W, a second conductive member32to be connected to the first conductive member31and a third conductive member33for connecting the second conductive member32and the connection terminal14. The first conductive member31includes a barrel portion31ato be connected to the core W1of the wire W and a terminal portion31bthrough which a fixing screw N1is inserted. The first conductive member31of this embodiment is configured by arranging the barrel portion31aand the terminal portion31bin the vertical direction. The barrel portion31aof the first conductive member31and the core W1of the wire W are accommodated in the second tube portion25. Further, the terminal portion31bof the first conductive member31is accommodated in the first tube portion24. Note that the core W1of the wire W and the barrel portion31aare possibly connected, for example, by crimping or welding. However, without limitation to this, a known connection method may be used for connection. The second conductive member32is connected to an upper end part of the first conductive member31extending in the vertical direction and connected to a rear end part of the third conductive member33extending in the front-rear direction. That is, the second conductive member32is for relaying the first and third conductive members31,33, extending directions of which are orthogonal, and a substantially L-shaped conductive member can be, for example, adopted as such. The second conductive member32of this embodiment is fastened to the terminal portion31bof the first conductive member31by the fixing screw N1. Here, by removing the cover member23from the rear opening24aof the first tube portion24described above, a fastening operation by the fixing screw N1is possible, using the opening24a. The third conductive member33is a flexible conductive member. A braided wire can be adopted as an example of the third conductive member33, but there is no limitation to this. The third conductive member33is roughly provided in front of and near the first tube portion24of the rear member21of the housing11. The connection terminal14is a conductive member to be attached to the front end of the third conductive member33. The connection terminal14is, for example, configured such that a rectangular tube portion internally including a resilient contact piece for resiliently contacting a standby terminal of the device and a barrel portion to be connected to the third conductive member33by crimping or welding are arranged in the front-rear direction. The connection terminal14is accommodated in an accommodation space in the front member22of the housing11. As shown inFIG.4, the housing11of this embodiment is covered by the shield shell12made of conductive metal. As shown inFIGS.1,3and4, the shield shell12is configured by assembling a lower member41and an upper member42with each other. The lower member41is formed by press-working a metal plate material of aluminum, aluminum alloy or the like, and the upper member42is made of metal such as aluminum or aluminum alloy and formed by die casting. The lower member41and the upper member42are fixed to the housing11by being fastened together by a fixing screw N2. The upper member42is fixed to the housing11by a fixing screw N3. The shield connector10of this embodiment includes high radiation portions51on a surface14aof the connection terminal14, a surface13aof the inner conductive member13, a surface11aof the housing11and an inner surface12aof the shield shell12. The high radiation portion51has, for example, a higher radiation rate than the core W1(copper) of the wire W. For example, the core W1made of copper has a higher radiation rate, for example, by being oxidized. The radiation rate mentioned here means a radiation rate before oxidation. Further, the radiation rate of the high radiation portion51is preferably, for example, 0.7 or more. The entire high radiation portion51may have the same radiation rate or may have varying radiation rates. A formation method by plating or painting can be, for example, adopted for the high radiation portion51of the connection terminal14, the high radiation portion51of the inner conductive member13and the high radiation portion51of the shield shell12. Further, the high radiation portion51of the housing11may be formed, for example, using a resin material colored in advance or may be formed on the surface11aof the housing11by painting or the like. As shown inFIG.5, an outer surface12bof the shield shell12includes a low radiation portion52entirely having a lower radiation rate than the high radiation portion51. The low radiation portion52is, for example, the outer surface12bof the shield shell12itself. That is, the radiation rate of the low radiation portion52is that of the outer surface12bof the shield shell12. The shield shell12is made of the conductive metal material (aluminum, aluminum alloy or the like as an example) as described above. The radiation rate in this case is, for example, 0.3 or less. The entire low radiation portion52may have the same radiation rate or may have varying radiation rates. Functions of this embodiment are described. In the shield connector10of this embodiment, the core W1of the wire W is connected to the inner conductive member13and the inner conductive member13is connected to the connection terminal14. The connection terminal14is, for example, connected to the terminal of the device-side connector of the mating device. In this way, a current can be supplied between the wire W (core W1) and the mating device. Further, the high radiation portions51having a higher radiation rate than the core W1of the wire W are provided on the surface14aof the connection terminal14, the surface13aof the inner conductive member13, the surface11aof the housing11and the inner surface12aof the shield shell12. Here, in the shield connector10, heat is generated, for example, in the inner conductive member13and the connection terminal14connecting the mating connector and the wire W in the case of supplying a current between the device-side connector and the wire W. Part of the heat generated in the inner conductive member13and the connection terminal14is transferred to the housing11having the high radiation portion51via an air layer. At least part of the heat transferred to the housing11is transferred to the shield shell12having the high radiation portion51. The heat transferred to the shield shell12is dissipated to outside. At this time, since the outer surface12bof the shield shell12has the low radiation portion52, the transfer of the dissipated heat from the outer surface12bof the shield shell12to the inside again is suppressed. Further, even if another heat source is located outside, the influence of heat by the external heat source can be suppressed since the outer surface12bof the shield shell12has the low radiation portion52. Effects of this embodiment are described. (1) Since heat generated in the connection terminal14and the inner conductive member13in association with energization can be actively dissipated from the housing11and the shield shell12by having the high radiation portions51having a higher radiation rate than the wire W1of the wire W, heat dissipation can be improved without enlargement. (2) The low radiation portion52having a lower radiation rate than the high radiation portions51is provided on at least a part of the outer surface12bof the shield shell12. Thus, for example, if a heat source is present outside, the influence of heat by the heat source can be suppressed in the low radiation portion52. Particularly, in the shield connector for connecting the motor or inverter as in this embodiment, the motor or inverter itself tends to become an external heat source and the influence thereof is large. Therefore, a configuration for providing the low radiation portion52on the outer surface12bof the shield shell12located on an outermost side can suitably suppress the influence of heat by the heat source. Note that the above embodiment can be modified and carried out as follows. The above embodiment and the following modifications can be carried out in combination without technically contradicting each other.Although the low radiation portion52is provided on the entire outer surface12bof the shield shell12in the above embodiment, there is no limitation to this. As shown inFIG.6, the low radiation portion52may be provided on a part of the outer surface12b. In this case, the high radiation portion51is provided on the remaining part of the outer surface12b. As shown inFIG.6, the low radiation portion52may be provided in a part12cfacing an external heat source H on the outer surface12b. By providing the low radiation portion52in the part12cfacing the external heat source H, the influence of heat by the external heat source H can be effectively suppressed. Particularly, since the shield connector10is often proximate to a vehicle drive source (motor) or inverter, the shield connector10is easily affected by heat of the heat source H and the provision of the low radiation portion as described above can suitably suppress the influence of heat by the heat source H. In a configuration shown inFIG.6, the high radiation portion51may be provided in a part (e.g. rear surface12d) not facing the external heat source H on the outer surface12b. Further, the high radiation portion51may be provided on the outer surface12bof the shield shell12by omitting the low radiation portion52. That is, the high radiation portions51may be provided on the inner surface12aand the outer surface12bof the shield shell12.Although the housing11is composed of the rear member21, the front member22and the cover member23in the above embodiment, there is no limitation to this. For example, the rear member21and the front member22may be integrally formed in advance. Further, the housing11may be composed of two or less members or four or more members.Although the shield shell12is composed of the lower member41and the upper member42in the above embodiment, there is no limitation to this. For example, a lower member and an upper member may be integrally formed in advance. The shield shell12may be composed of three or more members.Although the lower member41and the upper member42are fastened together to configure the shield shell12in the above embodiment, a shield shell may be configured by separately fastening an upper member and a lower member to the housing11by screws.Although the L-shaped housing11from which the wire W is pulled out downward is used in the above embodiment, there is no limitation to this. For example, an I-shaped (linear) housing from which the wire W is pulled out rearward may be used.Although the inner conductive member13for connecting the wire W and the connection terminal14is composed of three members including the first, second and third conductive members31,32and33in the above embodiment, there is no limitation to this. The number of components of an inner conductive member for connecting the wire W and the connection terminal14can be changed as appropriate.The housing11and the inner conductive member13, and the housing11and the connection terminal14may be facing each other via an air layer.Although not particularly mentioned in the above embodiment, a high radiation portion may be similarly provided on another member if this member is arranged, for example, between the housing11and the inner conductive member13or between the housing11and the connection terminal14.In several implementation examples of the present disclosure, the high radiation portions51may be radiation rate improving films configured to increase radiation rates of base materials at least for infrared rays (e.g. near infrared rays, far infrared rays) having a predetermined wavelength by being held in close contact with the base material (e.g. synthetic resin) of the housing11, the base material (e.g. conductive metal) of the shield shell12, the base material (e.g. conductive metal) of the connection terminal14and the base material (e.g. conductive metal) of the inner conductive member13.In several implementation examples of the present disclosure, some or all of the plurality of high radiation portions51can be formed of materials same as or different from the respective base materials of the housing11, the shield shell12, the connection terminal14and the inner conductive member13.In several implementation examples of the present disclosure, the base material of the shield shell12, the base material of the connection terminal14and the base material of the inner conductive member13may be formed of a first metal base material mainly containing a first metal element (e.g. aluminum), and the high radiation portions51may be plating films containing a second metal element (e.g. nickel or chromium) different from the first metal element or resin films and may contain pigments or colorants. [Addendum 1] A shield connector according to one aspect of the present disclosure includes a housing, a shield shell for covering the housing from outside, a terminal to be accommodated into the housing and electrically connected to a mating device, and an inner conductor for electrically connecting the terminal and the wire, wherein high radiation portions made of a second material having at least a higher radiation rate than a first material constituting a core of the wire are provided on at least some of a surface of the housing, a surface of the shield shell, a surface of the terminal and a surface of the inner conductor. LIST OF REFERENCE NUMERALS 10shield connector11housing11asurface12shield shell12ainner surface12bouter surface12cpart13inner conductive member (inner conductor)13asurface14connection terminal (terminal)14asurface21rear member22front member23cover member24first tube portion24aopening24bopening25second tube portion31first conductive member31abarrel portion31bterminal portion32second conductive member33third conductive member41lower member42upper member51high radiation portion52low radiation portionC caseH heat sourceN1fixing screwN2fixing screwN3fixing screwW wireW1core | 18,768 |
11942730 | DETAILED DESCRIPTION While specific embodiments are given in the drawings and the following description, keep in mind that they do not limit the disclosure. On the contrary, they provide the foundation for one of ordinary skill to discern the alternative forms, equivalents, and modifications that are encompassed in the scope of the appended claims. FIG.1shows an illustrative network such as might be found in a data processing center, with multiple server racks102-106each containing multiple servers110and a pair of switches112. The switches112may be termed “top of rack” (TOR) switches, each of which are connected to aggregator switches for interconnectivity and connection to the regional network and internet. (As used herein, the term “switch” includes not just traditional network switches, but also routers and network bridges.) Each of the servers110is connected to the TOR switches112by redundant Y-cables120, which preferably provide high speed differential communications compatible with the Ethernet standard. Unlike a conventional breakout cable, redundant Y-cables120provide redundant connections to the switches112, such that each cable connector can support the full data stream bandwidth. As described in further detail below, each cable couples the server network port to a selected one of the switch ports and, if a fault associated with the selected switch port is detected, the cable instead couples the network port to the other connected switch port, maintaining connectivity even in the presence of such faults and providing an opportunity for the fault to be corrected without disrupting communication between the server and the network. In the event of a TOR switch failure, the cables120can automatically redirect the data stream traffic to the other TOR switch. Alternatively, a network configuration manager can configure the cables to direct traffic as desired, e.g., in preparation for maintenance or replacement of a TOR switch. FIG.2is an isometric view of an illustrative redundant Y-cable having a first, non-redundant connector201connected to a second and third redundant connectors202,203by a cord206containing electrical conductors. Each of the connectors has electrical contacts that couple to matching contacts in a network port of a server, switch, or other network node. Electronic circuitry may be packaged within each of the connectors as indicated inFIG.3. In the illustrated cable ofFIG.3, each of the first, second, and third connectors201,202,203includes a data recovery and remodulation (DRR) device. DRR1couples eight bidirectional data lanes from connector201to sixteen bidirectional data lanes as discussed below. DRR2and DRR3are optional, but if included they each couple eight of the sixteen bidirectional data lanes to respective data lanes of connectors202,203. Though the illustrated example presumes the full data stream bandwidth is carried by eight bidirectional lanes, the bandwidth and associated number of data lanes of the cable design can vary. The DRR devices may be implemented as integrated circuit devices that each mount with optional supporting components to a small printed circuit board (aka “paddle card”) in the respective connector. The printed circuit board electrically couples the DRR device contacts to the cable conductors and to the contacts of the network port connectors. The DRR device operation may be understood with reference toFIG.4, though we note here that further details are available in co-owned U.S. application Ser. No. 16/932,988 filed 2020 Jul. 20 and titled “Active Ethernet Cable with Broadcasting and Multiplexing for Data Path Redundancy”, which is hereby incorporated by reference herein in its entirety.FIG.4uses the ISO/IEC Model for Open Systems Interconnection (See ISO/IEC 7498-1:1994.1) to represent part of a communication link architecture for communications over a physical medium such as the electrical conductors within cord206. The interconnection reference model employs a hierarchy of layers with defined functions and interfaces to facilitate the design and implementation of compatible systems by different teams or vendors. While it is not a requirement, it is expected that the higher layers in the hierarchy will be implemented primarily by software or firmware operating on programmable processors while the lower layers will be implemented as application-specific hardware. The Application Layer402is the uppermost layer in the model, and it represents the user applications or other software operating a server or other system that needs a facility for communicating messages or data. The Presentation Layer404provides such applications with a set of application programming interfaces (APIs) that provide formal syntax along with services for data transformations (e.g., compression), establishing communication sessions, selecting a connectionless communication mode, and performing negotiation to enable the application software to identify the available service options and select therefrom. The Session Layer406provides services for coordinating data exchange including: session synchronization, token management, full- or half-duplex mode implementation, and establishing, managing, and releasing a session connection. In the connectionless mode, the Session Layer may merely map between session addresses and transport addresses. The Transport Layer408provides services for multiplexing, end-to-end sequence control, error detection, segmenting, blocking, concatenation, flow control on individual connections (including suspend/resume) and implementing end-to-end service quality specifications. The focus of the Transport Layer408is end-to-end performance/behavior. The Network Layer410provides a routing service, determining the links used to make the end-to-end connection and when necessary acting as a relay service to couple together such links. The Data link layer412serves as the interface to physical connections, providing delimiting, synchronization, sequence and flow control across the physical connection. It may also perform packet integrity verification to detect and optionally correct packet errors that occur across the physical connection. The Physical layer414provides the mechanical, electrical, functional, and procedural means to activate, maintain, and deactivate communication channels, and to use those channels for transmission of bits across the physical media. The Data Link Layer412and Physical Layer414are subdivided and modified slightly by IEEE Std 802.3-2015, which provides a Media Access Control (MAC) Sublayer413in the Data Link Layer412to define the interface with the Physical Layer414, including a frame structure and transfer syntax. Within the Physical Layer414, the standard provides a variety of possible subdivisions such as the one illustrated, which includes a Physical Coding Sublayer (PCS)416, a Forward Error Correction (FEC) Sublayer418, a Physical Media Attachment (PMA) Sublayer420, and a Physical Medium Dependent (PMD) Sublayer422. The PCS Sublayer416provides scrambling/descrambling, data encoding/decoding (with a transmission code that enables clock recovery and bit error detection), block and symbol redistribution, PCS alignment marker insertion/removal, and block-level lane synchronization and deskew. To enable bit error rate estimation by components of the Physical Layer414, the PCS alignment markers typically include Bit-Interleaved-Parity (BIP) values derived from the preceding bits in the lane up to and including the preceding PCS alignment marker. The FEC Sublayer418provides, e.g., Reed-Solomon coding/decoding that distributes data blocks with controlled redundancy across the lanes to enable error correction. In some embodiments (e.g., in accordance with Article91or proposed Article134for the IEEE Std 802.3), the FEC Sublayer418modifies the number of data lanes. The PMA Sublayer420provides lane remapping, symbol encoding/decoding, framing, and octet/symbol synchronization. In some embodiments, the PMA Sublayer420co-opts portions of the PCS alignment markers to implement a hidden backchannel as described in co-owned U.S. Pat. No. 10,212,260 “SerDes architecture with a hidden backchannel protocol”. The backchannel can be used for training information as well as to convey command and status info among the DRR devices in the cable connectors. The PMD Sublayer422specifies the transceiver conversions between transmitted/received channel signals and the corresponding bit (or digital symbol) streams. Typically, the PMD Sublayer422implements a channel training phase and optionally an auto-negotiation phase before entering a normal operating phase. The auto-negotiation phase enables the end nodes to exchange information about their capabilities, and the training phase enables the end nodes to each adapt transmit-side and receive-side equalization filters in a fashion that combats the channel non-idealities. A port connector receptacle424is also shown as part of the PMD sublayer422to represent the physical network interface port. Various contemplated embodiments of the DRR devices implement the functionality of the PMD, PMA, and FEC Sublayers. See, e.g., co-owned U.S. application Ser. No. 16/793,746 “Parallel Channel Skew for Enhanced Error Correction”, filed 2020 Feb. 18 and hereby incorporated herein by reference. More information regarding the operation of the sublayers, as well as the electrical and physical specifications of the connections to the communications medium (e.g., pin layouts, line impedances, signal voltages & timing), and the electrical and physical specifications for the communications medium itself (e.g., conductor arrangements in copper cable, limitations on attenuation, propagation delay, signal skew), can in many cases be found in the current Ethernet standard. FIG.4further shows an illustrative non-redundant connector201having a plug that mates with network port receptacle424. Non-redundant connector201includes a DRR device with a set of SerDes modules to implement the host facing PMD and PMA sublayers430, and sets of SerDes modules implementing the PMD, PMA sublayers439A,439B for communicating with redundant connectors202,203via conductors in cord206(FIGS.2-3). Optionally, the DRR device may further implement host-facing FEC, PCS, and MAC sublayers432, as well as cable-facing FEC, PCS, and MAC sublayers438A,438B for respectively communicating with redundant connectors202,203. A set of first-in first-out (FIFO) buffers434A buffer the bidirectional multi-lane data streams between the host-facing sublayers430-432and the sublayers438A-439A for communicating with the first redundant connector202. A second set of FIFO buffers does the same between the host-facing sublayers430-432and sublayers438B-439B for communicating with the second redundant connector203. The multi-lane data stream received by the host-facing sublayers430-432from the server110is (after error correction and packet integrity checking by optional sublayers432) broadcast to both FIFO buffer sets434A,434B for communication to both of the redundant connectors202,203. The buffered multi-lane data streams from each of the redundant connectors are provided from both FIFO buffer sets434A,434B to a multiplexer436, which selects one of the two multi-lane data streams for communication to the host-facing PMD, PMA sublayers430(after packet checksum generation and error correction coding by optional sublayers432). Though communications from both FIFO buffer sets are provided to the multiplexer and communications to both FIFO buffer sets are provided from the host-facing sublayers, the multiplexer state enables only one complete communications link; if the multiplexer selects the multi-lane data stream from FIFO buffer set434A, the communications link between connectors201and202is enabled. Otherwise, when FIFO buffer set434B is selected, the communications link between connectors201and203is enabled. Multiple implementations of the illustrated broadcast/multiplex approach are possible for introducing redundancy into the cable design, as described in co-owned U.S. application Ser. No. 16/932,988 filed 2020 Jul. 20 and titled “Active Ethernet Cable with Broadcasting and Multiplexing for Data Path Redundancy”. Note that in any case, redundant connectors202,203(and thus circuitry DRR2, DRR3) need not perform broadcast and multiplexing functions, and hence need not duplicate cable facing sublayers438,439. Accordingly, the power requirements of the circuitry DRR2, DRR3in redundant connectors202,203will be lower than that of the circuitry DRR1in non-redundant connector201. FIG.5is a schematic of power domains in a first illustrative active redundant Y-cable that does not employ power sharing; i.e., each connector's circuitry is powered solely by the port to which it is connected. For example, connector201is shown having circuitry divided into different voltage domains, a 3.3V voltage domain, a 1.8V voltage domain, a 1.3V voltage domain, and a 0.8V voltage domain. It is expected, though not required, that the different voltage domains correspond to integrated circuit devices manufactured with different process technologies. These voltage domains are illustrative and should be expected to change for different implementations of the circuitry, using more or fewer domains with possibly different supply voltages that need not all be distinct from each other. The 3.3V voltage domain is shown including, potentially in addition to other circuit components, three DC voltage converters DVC1, DVC2, DVC3, each of which converts the 3.3V from the connector into a supply voltage for one of the other voltage domains. Converter DVC1steps the 3.3V supply voltage to a 0.8V supply voltage; converter DVC2steps the 3.3V supply voltage to a 1.3V supply voltage; and DVC3steps the 3.3V supply voltage down to a 1.8V supply voltage. The various voltage domains (and each of the connectors) share a common ground connection. The plug of connector201includes electrical contacts for receiving power from matching contacts of the network port connector receptacle. At least one of the receptacle contacts provides a 3.3V supply voltage relative to the one or more ground contacts of the receptacle. However, most network and switch port manufacturers limit the current draw from their network ports to around 1 to 1.5 amps, corresponding to a power limit of between roughly 3.5 and 5 watts. In one illustrative implementation, the power requirements of DRR2, DRR3may be approximately 2.5 W, and the power requirements of DRR1may be, say, 4.5 W. In the absence of power sharing, the non-redundant connector201could only be used with those network ports that support higher power draws. FIG.6is a schematic showing a second illustrative active redundant Y-cable having power sharing. Each of the redundant connectors202,203includes a diodic component602,603in a connection path that couples a supply voltage to a voltage node601in the non-redundant connector. The diodic components602,603, may be diodes, transistors, or other components that prevent reverse current flow, thereby enabling continued operation of the other connectors if one of the switch ports for connectors202,203loses power. InFIG.6, the diodic components are shown as ideal diodes, which are integrated circuit devices designed to permit forward current flow with a minimal voltage drop while efficiently preventing reverse current flow. Such devices are commercially available as discrete devices from, e.g., Texas Instruments as LM66100 or as LM74700-Q1 (the latter being an ideal diode controller for a discrete MOSFET). However, the function of such devices could also be subsumed into a integrated circuit device providing other functions such as a controller. The diodic connection paths further include resistances604,605, which may represent the resistance of the electrical conductors in cord206or may represent discrete resistors. Resistances604,605are approximately equal to provide inexpensive current balancing when both redundant connectors are supplying power. The resistances will depend on various design considerations, but are expected to be in the range of 0.05 to 0.5 ohms. At least one component of the circuitry in connector201draws power from voltage node601. InFIG.6, that component is one of the DC voltage converters (DVC2) which, rather than drawing power from plug contacts of connector201, instead draws power from voltage node601, which is powered so long as at least one of the redundant connectors is powered. Allocating each voltage domain to one of the available power sources (either voltage node601or the plug contact(s) of connector201) is an efficient way to draw power from multiple power sources, as it minimizes complexity and cost in terms of additional circuit components. The optimal allocation depends on the power requirements of each domain. The voltage supplied by the redundant connectors is shown being provided from their 3.3V voltage domains, as supplying it from one of the lower voltage domains would necessitate more current and would increase power dissipation. However, there may be countervailing considerations (perhaps layout limitations or reduced complexity achieved by eliminating one of the voltage converters in the non-redundant connector201) that would make it desirable to supply the voltage from one of the lower voltage domains. Conversely, the redundant connectors may employ step-up voltage converters to raise the supplied voltage and further reduce current and associated power dissipation in the conductors. The DC voltage converter receiving power from voltage node601would correspondingly step the voltage down from the chosen supply voltage. With power sharing in the previous example (DRR2, DRR3power requirements of 2.5 W, DRR1power requirements of 4.5 W), the total power draw from each network port can be limited to no more than 3.5 W. Non-redundant connector201could draw 3.5 W locally and draw 1 W remotely, with the remote demand being split between the redundant connectors. FIG.7is a schematic showing a first alternative diodic connection configuration. In the configuration ofFIG.7, the diodic components702are located in non-redundant connector201rather than in the redundant connectors, and each diodic connection path includes a discrete resistor704to provide current balancing. FIG.8is a schematic showing a second alternative diodic connection configuration. In the configuration ofFIG.8, the redundant connectors202,203each include a step-up DC voltage converter DC4that doubles the supply voltage to 6.6V. The diodic components are shown as diodes802,803which may be discrete components but are more preferably part of an integrated circuit device in connectors202,203. With the stepped up voltage, the higher voltage drop for current flow may be better tolerated thus enabling a less expensive diodic component implementation to be used. Current-balancing resistances804represent resistance of the electrical conductors which are sized to provide the desired resistance. We note here that when the primary communications link between connectors201,202is active (selected), it is possible for the secondary communications link between connectors201,203to experience multiple outages without affecting the traffic on the primary link. In the event of any power failure at connector203, connector202continues to supply power to voltage node601to power components of connector201. The diodic connections prevent reverse current flow from node601to connector203. If, due to a hardware or software failure, the primary link goes down, the data stream received via the non-redundant connector201is still broadcast to the redundant connector203, and any data received via connector203is conveyed to the multiplexer, which can select that data for transmission via connector201. The DRR device or an external controller can detect the link failure and change the state of the multiplexer. The transition between states is fast, i.e., on the order of a few nanoseconds. The secondary communications link status remains stable during the transition, supplying power from connector203to node601. The diodic connection between connectors201and202prevents any reverse current flow from node601to connector202in the event connector202loses power. Although the link status can generally tolerate a truncated packet or two such as might be caused by an unsynchronized transition of the multiplexer, the DRR device can readily arrange for a synchronized transition. The physical layer interface may monitor the packet header information, enabling a transition to begin after the end of a packet from the primary communications link, and to complete when a packet from the secondary communications link begins. An idle pattern may be used to maintain the link during the transition interval. The transition may be associated with an error code or alert signal in the DRR devices internal registers, causing the DRR device to convey an alert message to a network management service, which can in turn alert appropriate service personnel. Because the secondary communications link is operable, the cable connection continues to function while service personnel have time to diagnose and address the cause of the primary communications link failure. When the primary communications link becomes operable, that condition may be detected by the cable-facing module438A, and the DRR device can return the multiplexer to its original state to resume using the primary communications link. As before, the state transition is fast, on the order of a few nanoseconds. The shared supply of power to voltage node601is restored automatically via the diodic connections. FIG.9is a flow diagram of an illustrative power sharing method which may be implemented by the foregoing cable design. In block902, the cable defaults to an active state in which non-redundant connector201receives power from its host as well as power via voltage node601, which in turn is supplied via diodic connections from redundant connectors202,203. The DRR1circuitry of connector201receives data via the non-redundant connector plug and copies that data to both redundant connectors202,203. The DRR1circuitry provides data from redundant connector202via the non-redundant connector plug to the host port. In block903, the DRR1circuitry checks for a fault, and if one is detected, the DRR1circuitry optionally sends an alert in block904to initiate correction of the fault, and transitions to block906. Otherwise, the DRR1circuitry determines whether an instruction has been received to change the operating mode. If not, blocks903and905are repeated until a fault is detected or a mode change instruction is received, at which point, the DRR device transitions to block906. In block906, the DRR1circuitry transitions to an unbalanced supply state, with voltage node601being supplied from whichever of the redundant connectors is still powered. The data received via the non-redundant connector201is copied to both the redundant connectors202,203, and the data transmitted from the non-redundant connector201is received via the secondary redundant connector203(or, in case of a fault in the secondary communications path, from redundant connector202). In block907, the DRR device checks for a fault in the current communications path, and if one is detected, the DRR device optionally sends an alert in block904before transitioning back to block906and switching to the alternative communications path. Otherwise, the DRR device determines whether a mode change instruction has been received in block908. If so, the DRR1circuitry transitions back to block902. Otherwise, blocks907and908are repeated until a mode change instruction is received or a fault is detected. The state transitions are expected to be fast, preserving the stability of each data path. The foregoing embodiments are expected to facilitate practical and economic realization of path redundancies. Numerous alternative forms, equivalents, and modifications will become apparent to those skilled in the art once the above disclosure is fully appreciated. For example, the embodiments described above provide redundancy in the form of a single secondary redundant connector, but those of ordinary skill would recognize that the disclosed principles can be readily extended to provide multiple secondary redundant connectors to further increase the redundancy. It is intended that the claims be interpreted to embrace all such alternative forms, equivalents, and modifications that are encompassed in the scope of the appended claims. | 24,711 |
11942731 | DETAILED DESCRIPTION Techniques described herein are directed to methods and apparatus for verification of interchangeable connectors. A connector may refer to one part of a connection assembly, such as a plug or a receptacle, while a connection assembly may refer to both a plug and an associated receptacle. When a connection assembly is connected, or connecting the connectors, may refer to the plug and receptacle being physically engaged and electrically connected to one another. The correct electrical connection between a plug connector and receptacle connector may be referred to as a correct connection. A plug connector and receptacle connector that make a correct electrical connection may be referred to as corresponding connectors. The components may be connected to conductors in a vehicle harness using connector assemblies that may include a plug and a receptacle. In order for the vehicle to operate properly, each of the components should be connected to the correct conductors in the vehicle harness. In some instances, a vehicle may have hundreds of connector assemblies and some of these connector assemblies may be located in close proximity to one another in the vehicle. In order to avoid connecting a component to the wrong connector in the harness, some harnesses and components may include connectors that are “keyed” such that they are only physically connectable to a corresponding keyed connector that has the same key and can only be connected in one orientation. Alternatively, different connectors may have different pin configurations, sizes, shapes, etc. Such systems may prevent a component from being connected to the wrong conductors in the vehicle harness. However, these system require large numbers of different connectors having different configurations which may be cost ineffective in large, complex systems such as electric vehicles. In some circumstances it may be beneficial to have a vehicle harness that uses connectors that are physically common. Physically common connectors may be interchangeable, in other words, one or more common plug may be physically connected to one or more common receptacle. Common connectors may be connectors that have the same configuration as one another. For example, a common connector plug may be connected to any one of a number of common connector receptacles; and a common connector receptacle may be connected to any one of a number of common connector plugs. An example of a common plug and receptacle may be an RJ45 Ethernet plug and an RJ45 Ethernet jack (receptacle) because any of these plugs may be physically connected to any of these jacks. The types of common connectors may be referred to as interchangeable. In some applications, there may be hundreds or thousands of connections in a wiring harness. For some wiring harnesses, it may be advantageous to use common connectors wherever practical so that the inventory of different parts that need to be stocked may be reduced. Using common connectors may also provide cost efficiencies in buying connectors at scale. Conventional systems may have used different configurations of connectors to avoid incorrect connection, however in systems with large numbers of connectors may be inefficient to have different configurations for each combination of connectors. Common connectors may be connectors that have the same configuration. For example, a common connector plug may be connected to any one of a number of common connector receptacles; and a common connector receptacle may be connected to any one of a number of common connector plugs. Using common connectors may reduce costs and complexity since multiple different special connectors may not have to be designed and ordered. In addition, using common connectors may eliminate the need for coordination between the manufacturer of components and the manufacturer of the wiring harness on the type and configuration of the connector to be used. A vehicle may include one or more harnesses and some of the harnesses may be sub-harnesses that may connect to another harness. In some instances, when common connectors are used, there may be a need to identify which connectors need to be connected together for proper functionality of the vehicle electrical systems when the vehicle is assembled. Connecting the wrong connectors may result in one or more vehicle electrical systems not working properly, or in some instances may result in damage to one or more vehicle electrical components. In addition, during conventional manufacture of the vehicle, finding a misconnected connection assembly may require the application of testing equipment and may be time consuming. These electrical components may include processing units, sensors, motors, communication devices, and/or other vehicle components that use electricity. In some implementations, verifying interchangeable connectors may involve a verification system that includes applying an identification tag to one or more connector in a vehicle electrical system and associating identifiers of the identification tags for connectors that make correct electrical connections with one another. In some examples, the identification tag of a connector may be enabled when the connector is connected. In some examples, the identification tag may be a radio-frequency identification (RFID) tag, visually identifiable tag (e.g., a bar code tag), or other. In some examples, the identification tag may be mechanically coupled to the one or more connector. In some examples the mechanical coupling may involve the use of an adhesive or other technique to apply or affix the identification tag permanently or temporarily to the one or more connector. In some implementations, an identification tag may be applied to a plug connector and another identification tag may be applied to a receptacle connector. In some examples, one or both of the identification tags may be applied to the connectors during manufacture of the vehicle. In some examples, one or both of the identification tags may be applied to the connectors during manufacture of a wiring harness for the vehicle and/or during manufacture of an electrical component of the vehicle. In some examples, the identification tags may be applied as an operational matter, such as during an incoming quality check. In some examples, the identification tags may be applied, and the connection checked during prototyping of the vehicle. Each of the identification tags may have an identifier which may include one or more words, letters, numbers, and/or symbols. The identification tag identifier for the plug connector may be the same or may be different than the identification tag identifier for the corresponding receptacle connector. The verification system may include associating the identification tag identifier of the plug connector with the identification tag identifier of the corresponding receptacle connector. The verification system may include one or more database to store the associated identifiers. In some examples, the associated identifiers may be stored along with a description of the use of the connection assembly of the connectors. In some examples, the description of the use may include a name of an electrical component and/or wiring harness. During the manufacture of the vehicle, the wiring harness(s) may be installed separately from various electrical components. In some implementations, the verification system may include an identification tag reader for reading the identification tags. In some examples, the identification tag identifiers of the connectors may be read before and/or after the connectors are connected to verify that the connectors correspond so that the connection is a correct connection. In some examples, after the identifiers are read, the verification system may access the database to determine if the identifiers are associated with one another. Determination that the identifiers are associated with one another may indicate that the connectors correspond and that the correct electrical connection is verified as correct. The verification system may indicate to a user that the connection is verified. In some examples, when the verification system accesses the database, and the system determines that the identifiers are not associated with one another then the verification system may indicate that the connection is incorrect. The system may indicate the verification or lack of verification of the connection using a visual, audio, haptic and/or other indication to notify the user. If the connection is not verified, then the user may disconnect the connectors and may try another combination of connectors having identification tags. In some examples, verifying that the connections are correct may be used in debugging problems with the wiring harness without the need for powering the harness or the use of expensive testing equipment. In some examples, it is advantageous to be able to verify that connections are correct without power the wiring harness because the wiring harness is not yet connected to a power source and/or a power source may not be conveniently available. In some examples, the identification tag may be an RFID tag that may be applied to the connector. The RFID tag may be applied to the connector using an adhesive or other method. In some examples, the part or all of the RFID tag may be between a portion of each of the connectors when they are connected. In some examples, the RFID tag may be at least partially inside a recessed portion of a receptacle connector. In some examples, the RFID tag may be at least partially on an outside surface of a plug connector. When the connectors are connected, the RFID tag may be partially or fully hidden, or may be exposed. In some implementations, the identification tag identifiers may be enabled when the connectors are physically connected. In examples in which the identification tag is an RFID tag, the tag may include a chip and an antenna, and the tag may be enabled by electrically connecting the antenna to the chip when the connectors are connected. In some examples, the RFID tag may be a passive type tag that receives power from a source, such as the reader, and in response transmits the identifier. In some examples, the antenna may be connected to one of the connectors and the chip connected the other of the connectors, and when the connectors are connected, the chip and antenna are electrically connected so that the RFID tag is enabled. In some implementations, the identification tag may be connected to a harness side of a connection assembly and an antenna may be on a bulkhead side of the connection assembly. Enabling the RFID tag may include causing the tag to be able to receive RF power and/or to transmit the identifier. In some examples in which the identification tag is an RFID tag, the tag may include a pressure activated switch which may be pressed when the connectors are connected to enable the RFID tag. In some examples, the pressure activated switch may be a mechanical, pressure-sensitive coupling. In some examples, the pressure activated switch may electrically connect the antenna and the chip to enable the RFID tag. In some examples, the identification tag may be enabled using a change or property related to capacitance, inductance, resistance, conductance, or other property which may enable the operation of an electrical circuit. In some examples, the identification tag may be enabled using a magnetic field. In some implementations, enabling the identification tag when the connectors are physically connected allows the verification system to distinguish the identifiers from other identifiers that may already be enabled. By knowing which identifiers are already enabled, the verification system may identify which identifiers are newly enabled by the connection of two connectors. The identifiers that are enabled by the connection may be read and checked against the database to see if the identifiers are associated to verify that the connectors correspond. In some examples, associated connectors may both have the same identifier, and then when reading the identification tags there may be two identification tags giving the same identifier every time that a physical connection is made. RFID tags having different frequency ranges may be used. In some examples, the frequency range may be selected to minimize the number of RFID tags that may be read at a given time while still allowing the reader enough range to read the RFID tags on the connection to be verified. In some examples, the range on the identification tag reader may be such that the RFID tags may be read without being within line-of-sight of the reader. In some implementations, the identifiers of the RFID tags may be programmable, and the identifier may be programmed into the RFID tag before or after the RFID tag is applied to the connector. In some examples, the identifiers of the RFID tags may not be programmable, may be unique and may be entered into a database based on the connector to which the tag is connected. In some examples, the identification tag may be a bar code. In some examples the bar code may be a one dimensional code, and in some examples, the bar code may be a two dimensional bar code, such as a QR code. In implementations in which the identification tag is a bar code, the identification tag reader may be a bar code reader and may include a laser that may scan the bar code(s) at a distance. In some examples, the bar code may be applied to the connectors such that the identification tag reader is able to read the identification tags on both connectors after they are connected to one another. In some implementations, a unique identifier may be associated with corresponding connectors, and may be used for the same corresponding connectors for more than one vehicle. For example, the same identifier may be used for a connection between a wiring harness and a particular vehicle component for more than one vehicle. In some examples, the identifier used for a specific combination of corresponding connectors may not be used or re-purposed for other corresponding connectors. This may allow the verification of the connection after manufacturing, such as during maintenance, and/or during replacement of a connected component. In some implementations, the identifiers may be part of the schematics of the vehicle, which may allow technicians to verify the connections during or after manufacture of the vehicle. In some examples, the identifiers may be based in part on a version of the vehicle. In some implementations, the identifiers of the identification tags may be entered into a database for a particular version of a vehicle. The identification tags may be applied to the correct connectors of the wiring harness and/or vehicle components. The wiring harness and/or vehicle components may be installed in the particular version of the vehicle and the plugs and receptacles of the wiring harness and/or vehicle components may be connected. The vehicle systems may be tested, which may include verifying the connections. The results of the testing may be stored in a database. In some examples, the testing may involve the use of a computer that may be connected to an identification tag reader. The database may be used to map identifiers to connectors. In some examples, the verification system may include reading the identifier from the identification tag, accessing the database to find the identifier that was read, and finding a description of what corresponds to the identifier that was read from the database. FIG.1is a diagrammatic view of a verification system100that may be used to verify that electrical connectors are correctly connected in a vehicle102. The vehicle102, as shown in this example, includes four wheels104connected to a body106with suspension108. Vehicle102is shown as an electric vehicle and may include drive motors110for driving the wheels104. Each of the drive motors110may be connected to a motor controller112using an electrical cable114and connector116. The motor controller112may include a corresponding connector118that corresponds to each connector116. The vehicle102may also include a battery assembly120for providing electrical energy to the drive motors110through the motor controller112and for other vehicle systems. The battery assembly120may be connected to the motor controller112using one or more cable assembly122and a connector assembly124. The vehicle102may include a vehicle computing device130which can include one or more system controller, such as propulsion controller132for controlling propulsion of the vehicle102through the motor controller112; and a perception controller134which may be used to control perception systems of the vehicle102, such as sensors136and138. The vehicle computing device130may include other system controllers, such as a safety system controller140, for example. The motor controller112includes cables142,144and plug connectors146,148, and vehicle computing device130includes receptacle connectors150,152for electrically connecting the motor controller112to the propulsion controller132of the vehicle computing device130. Identification tags156and158are attached to plug connectors146and148, respectively, and identification tags160and162are attached to receptacle connectors150and152, respectively. Sensor136includes a cable166and a plug connector168, and vehicle computing device130includes a receptacle connector170for connecting sensor136to the perception controller134. Sensor138includes a cable172and a plug connector174, and vehicle computing device130includes a receptacle connector176for connecting sensor138to the perception controller134. Identification tags180and182are attached to plug connectors168and174, respectively, and identification tags184and186are attached to receptacle connectors170and176, respectively. The vehicle computing device130includes receptacle connectors190and192for connection to safety system controller140. Receptacle connectors190and192include identification tags194and196, respectively. The safety system controller140is not shown connected to any safety system devices inFIG.1. The cables142,144,166,172,114, and122may be grouped in one or more wiring harness or sub-harness, which may include other cables. Each cable142,144,166,172,114and122may have a single or multiple conductors. In the example shown inFIG.1, plug connectors146,148,168and174are common connectors that have the same configuration as one another. Also, in the example shown inFIG.1, receptacle connectors150,152,170,176,190and192are common connectors that have the same configuration as one another. In addition, the connectors116for the drive motors110are common connectors that have the same configuration as one another, and the connectors118are common connectors that have the same configuration as one another. The verification system100shown inFIG.1includes an identification tag reader200and a computing device202that may be connected to the tag reader200wirelessly or using a cable204, as shown. The computing device202may include one or more processor206and one or more memory device208, which may be or may include non-volatile computer readable memory. The memory device208includes a database210which may be displayed on a display212of the verification system100. In examples in which the identification tags are RFID tags, the verification system100may transmit a radio frequency electromagnetic radiation, (such as by the tag reader200), represented by dashed line214that may be used to energize identification tags that are within a distance, represented by dashed line216. In response to the energization, each RFID tag may then transmit an identifier which is received by the tag reader200. The identification tags shown inFIG.1are for purposes of illustration, so all of the identification tags are shown a visible when the connections between the plugs and receptacles are made. However, the identification tags do not have to be visible either before or after connection when the identification tags are RFID tags. In some examples, such as illustrated by connectors116and118, the electrical system may include multiples of the same type of component, (e.g., drive motors110), but each of the components may have to be connected to a particular connector for proper operation of the system. For example, identification tag218may be associated with identification tag220, tag222may be associated with tag224, tag226may be associated with tag228, tag230may be associated with tag232, and tag234may be associated with tag236. In this example, the tags may be bar codes and the verification system100may include a bar code reader. The connection assembly124may include one or more ring connector and stud and/or other high current capacity connectors. The connectors116may be ring terminals or other connectors capable of high current capacity, the connectors118may be electrical studs, and the cables114may carry a high current to the drive motors110. FIG.2illustrates an example of a flow diagram250for a method of verifying correct connections of associated connector assemblies, according to one or more examples. At252an identification tag is attached to at least one plug and at least one receptacle of an electrical system of a vehicle. In the examples shown inFIG.1, identification tags156,158,180and182are attached to plugs146,148,168and174, respectively; and identification tags160,162,184,186,194and196are attached to receptacles150,152,170,176,190and192, respectively. At254, the identifiers of the plugs may be associated with the identifiers of the correct receptacles with which the plugs are to be connected in the electrical system. In the examples shown inFIG.1, the identifiers of identification tags156,158,180and182may be associated with the identifiers of identification tags160,162,184and186, respectively. The associated identifiers may be stored in database210in memory208. At step256, one of the tagged plugs is connected with one of the tagged receptacles. In the examples shown inFIG.1, plug146is connected to receptacle150. At step258, the identifier of the connected plug and receptacle may be read. In the examples show inFIG.1, the identifier of identification tag156that is attached to plug146, and the identifier of identification tag160of receptacle150are read, such as by using tag reader200. At260, a determination is made as to whether the identifiers that were read are associated with one another to verify that the connected plug and receptacle are correct. In the examples shown inFIG.1, the verification system100may access the database210to see if the identifiers are associated with one another. In the example shown inFIG.1, since the identifier of the identification tag160and the identifier of the identification tag156are associated with one another, then the connected plug and receptacle are correct, and the connection is verified. If on the other hand, plug146were physically connected to receptacle176and the verification system100checked to determine if there was an association of the identifier of identification tag156and the identifier of identification tag186, then the connected plug146and receptacle176would not be correct and the connection would not be verified. Since, in the example shown inFIG.1, the plugs146,148,168and174are common connectors with one another, and the receptacles150,152,170,176,190and192are common receptacles with one another, then it is physically possible to connect any one of the plugs with any one of the receptacles even though each plug has only one correct electrical connection with one receptacle. In some examples, each time a plug and receptacle are connected the identification tags may be read and verified. In some examples, when the identification tags are read, the identifiers are checked against identifiers that are expected. In some examples, when the connectors are connected and the identification tags are read, other identification tags for connectors that are already verified may also be read. In this situation, the system may ignore the verified connections and may only show the identifiers for the newly connected connectors. Thus, during manufacturing or debugging, the disclosed techniques may be used with a corresponding database that may include a list of corresponding connectors that may be read in a time ordered manner to validate correct connections. FIG.3shows a diagrammatic view of an electrical connector assembly300having a receptacle connector302and a plug connector304that are physically and electrically connectable to one another. Receptacle connector302includes three electrically conductive pins306which are electrically connected to three electrical conductors308. Plug connector304includes three electrically conductive sleeves310that are electrically connected to three conductors312. When connector302and connector304are physically connected an extended portion314of plug connector304is inserted in a recessed portion316of receptacle connector304and the conductors308are electrically connected to the conductors312. In the example shown inFIG.3, the connector304includes an RF identification tag320which includes a chip322, an antenna324, and a pressure switch326. When the connector302and connector304are physically connected the pressure switch326may be compressed between the recessed portion316of connector302and the extended portion314of connector304. Compressing the pressure switch326may close an electrical circuit in the identification tag320which may enable the tag to operate. In some examples, compressing the pressure switch326completes an electrical circuit in the antenna324which allows the identification tag320to receive power from the tag reader. In some examples, the completed electrical circuit may be in another part of the RFID tag320and may be associated with operation of the chip322. In the example shown inFIG.3, the connector302includes an RFID tag330which includes a chip332and an antenna portion324. In this example, another portion of the RFID tag antenna may be connected to the extended portion314of the plug connector302such that, when the connector302and connector304are physically connected, the antenna is electrically connected and operable so that the RFID tag330is enabled. In the example shown, the other portion of the antenna would be positioned on an opposite side of the extended portion314from the RFID tag320. In this example, the identification tag may be considered to be on the connector302. Each of the chips322and/or332may be a programmable chip in which an identifier may be programmed, or the chip may not be programmable and may have a set identifier. In some examples, a vehicle component and a vehicle wiring harness may each include one or more receptacle and/or plug and each receptacle and plug may have an attached RFID tag. In some examples, one or more of the component plugs may by physically connectable to more than one harness receptacles and/or one or more of the component receptacles may be physically connectable to more than one harness plug. In some examples, the RFID tags may be configured such that when a plug is inserted into a first receptacle a first signal is emitted, and when the plug is inserted into a second receptacle a second, different signal is emitted. In some examples, the first and second emitted signals may be indicative of whether a plug is connected to the correct receptacle. In some examples, the tag reader may use one frequency of electromagnetic radiation to energize an RFID tag attached to the plug and may use a different frequency of electromagnetic radiation to energize an RFID tag attached to a corresponding receptacle. In some examples, the verification system may include reading one RFID tag identifier attached to a connector and then reading another RFID tag identifier attached to a corresponding connector. In some examples, the identification tag, such as the RFID tag, may emit a first signal when a plug connector is connected to the correct receptacle connector, and may emit a second, different signal when the plug connector is connected to a wrong receptacle connector. In some examples, the signal that is emitted may include an identifier that may be related to a resistor-capacitor (RC) time constant. In some examples, the connection of the connectors may activate the identification tag and may electrically connect the resistor and capacitor. In some examples, the resistor may have a resistance value that, when combined with the capacitor, produce an emitted frequency that is indicative of whether a plug is connected to a correct receptacle. In some examples, the capacitor may have a capacitance value that, when combined with the resistor, produce an emitted frequency that is indicative of whether a plug is connected to a correct receptacle. In some examples, the connectors may each have an identification tag attached that includes one or more coil having an inductance. In some examples, an inductance may be used in generating a signal with an identifier that is indicative of whether a plug is connected to a correct receptacle. In some examples, a coil may be positioned on one of the plug and receptacle and a magnetic core may be position on the other of the plug and receptacle, and the coil and core may be aligned when the plug and receptacle are connected and may be used in generating a signal with an identifier that is indicative of whether a plug is connected to a correct receptacle. In some examples, that signal may be a frequency. In some examples, the coil and core may be positioned on their respective connector such that they align when the correct plug and receptacle are connected. In some examples, the identification tags may include one or more coils that only resonate at an assigned frequency when the correct connectors are in proximity or are physically joined with one another. In some examples, an identification tag may be attached to each of the plug and receptacle and each of the identification tags may be individually activated when read by the tag reader. In some examples, each of the identification tags may have a corresponding frequency that may be used to indicate whether the plug is connected to the correct receptacle. In some examples, an identification frequency may be read each time a plug is connected to a receptacle. In some examples the frequency may be or may include a frequency pattern that may be used for identification of the connection. In some examples, an identification tag attached to one of the plug and receptacle may include a component for producing an identifier based at least in part on another component attached to the other of the plug and receptacle. In some examples, an identification tag attached to one of the plug and receptacle may include an analog-to-digital (A/D) converter, and the component attached to the other of the plug and receptacle may be a resistor. In this example, physically connecting the plug and receptacle may electrically connect the resistor to the A/D converter which may produce a digital value based on a resistance of the resistor. In some examples, the digital value may be emitted with a signal and may be indicative of whether the plug is connected to the correct receptacle. In some examples, the electrical connection may be using electrical connection pads as discussed below. In some examples, a digital signal may pass through a corresponding bit shifter or similar component which may output a unique digital signal for a connector pair from among the available connections. This modification may be selectable such that a common component may be configured to modify digital signals in different ways. In some examples, a delay or repetition frequency may be implemented with a digital or analog signal emitted from an RFID tag wherein each pair may have a different delay (e.g., from when a corresponding activation signal is received from a passive RFID tag reader) or repetition frequency. In some examples two RFID tags may be used that each emit a different signal when two connectors are physically coupled together. In some examples, these two signals may operate on a similar or same frequency but different periodicities such that, together, they appear to be a single unique signal with unique time components. In some examples, an antenna or coil may be formed from the physical arrangement of a coupling of two connectors and their respective tag placements to modify a change, frequency, etc. of an RFID tag. In some examples, the disclosed techniques can be used to modify an RFID tag's ability to receive a signal from an RFID reader (e.g., the reader may cycle through different frequencies wherein an RFID tag may respond to a corresponding frequency. In some examples, a correct connection of a plug and a receptacle may produce a unique identifier, while an incorrection connection of one of the plug or receptacle may produce no identifier or a different identifier. In some examples, this may be accomplished using one or more coil, resistor, capacitor. FIG.4shows a diagrammatic view of a connector assembly400and an RFID tag that may be enabled by connection of a receptacle connector402and a plug connector404, as part of a verification system. The receptacle connector402is show partially cut away to show a part of a recessed portion of the connector with an inner surface406. An RFID tag408is attached to the inner surface406of the receptacle connector portion402. The RFID tag408includes a chip410, which has an identifier, and electrical connection pads412and414. The plug connector404shows an outer surface416of an extended portion of the plug connector. When the receptacle connector and plug connector are physically connected the extended portion is positioned in the recessed portion of the receptacle connector and the outer surface416faces the inner surface406. An antenna418is attached to the plug connector404and the antenna includes electrical connection pads420and422. When the receptacle connector and plug connector are physically connected, the electrical connection pads412and422contact one another and electrical connection pads414and420contact one another and the antenna418is electrically connected to the chip410to enable the RFID tag408. In some examples, the plug and/or receptacle may include an RFID tag that is enabled only when the correct plug and receptacle are physically connected. In some examples, the connection pads could be positioned such that the antenna connection pads only align with the chip connection pads for connectors that are correctly connected. In some examples, the connection pads of the chip and antenna may have a spacing that only connect for a corresponding plug and receptacle. In some examples, the connection pads of the chip and antenna may be shifted toward one side or the other, and/or the front or back of the connector to which they are attached so that they only connect for a corresponding plug and receptacle. In some examples, the connection pads may be arranged such that one pad is closer to the front or back of the connector than the other. The back of the connector may refer to a side of the connector that is closer to the wires that enter the connector, and the front of the connector may refer to a side of the connector that is opposite of the back of the connector. In some examples, the connection pads of the chip and antenna may be on different sides of the connector, which may be on opposite sides or adjacent sides. In some examples, the chip may be connected to a coil on one of the plug and receptacle and the antenna may be connected to another coil on the other of the plug and receptacle, and the coils may be inductively coupled when the plug and receptacle are connected to one another. In some examples, the coils may be selected so that the identification tag emits an identifier that is indicative of whether the plug is connected to the correct receptacle. FIG.5shows a diagrammatic view of a connector assembly500and an identification tag502that may be used as part of a verification system. The connector assembly500includes a receptacle connector504and a plug connector506that are physically and electrically connected to one another. In the example shown inFIG.5, the identification tag502is a QR code tag. A first portion508of the identification tag502may be attached to the receptacle connector504, and a second portion510of the identification tag502may be attached to the plug connector504. When the receptacle connector504and a plug connector506are connected to one another the identification tag502may be completed and may be read by an identification tag reader. Although shown as a QR code, the identification tag may be another form of bar code and the identification tag reader may include a laser for scanning the bar code. In some examples, each of the receptacle connector504and a plug connector506may have a separate bar code that may be read separately from one another. FIG.6depicts a block diagram of an example vehicle system600on which the verification system100(FIG.1) may be used to verify that electrical connectors are correctly connected in a vehicle602. In some instances, the vehicle602may be an autonomous vehicle configured to operate according to a Level5classification issued by the U.S. National Highway Traffic Safety Administration, which describes a vehicle capable of performing all safety-critical functions for the entire trip, with the driver (or occupant) not being expected to control the vehicle at any time. However, in other examples, the autonomous vehicle602may be a fully or partially autonomous vehicle having any other level or classification. Moreover, in some instances, the techniques described herein may be usable by non-autonomous vehicles as well. The vehicle602may include computing device(s)604, one or more sensor system(s)606, one or more emitter(s)608, one or more communication connection(s)610(also referred to as communication devices and/or modems), at least one direct connection612(e.g., for physically coupling with the vehicle602to exchange data and/or to provide power), and one or more drive system(s)614. The drive system(s)614also include communication connection(s) that enable communication by the respective drive module with other local or remote computing device(s). In at least some examples, the sensor system(s)606may include thermal sensors (e.g., LWIR sensors), time-of-flight sensors, location sensors (e.g., GPS, compass, etc.), inertial sensors (e.g., inertial measurement units (IMUs), accelerometers, magnetometers, gyroscopes, etc.), lidar sensors, radar sensors, sonar sensors, infrared sensors, cameras (e.g., visible, RGB, IR, intensity, depth, etc.), microphone sensors, environmental sensors, (e.g., temperature sensors, humidity sensors, light sensors, pressure sensors, etc.), ultrasonic transducers, wheel encoders, etc. In some examples, the sensor system(s)606may include multiple instances of each type of sensors. For instance, time-of-flight sensors may include individual time-of-flight sensors located at the corners, front, back, sides, and/or top of the vehicle602. As another example, camera sensors may include multiple cameras disposed at various locations about the exterior and/or interior of the vehicle602. In some cases, the sensor system(s)606may provide input to the computing device(s)604. In some examples the sensor systems606may include common connectors that have the same configuration as one another. The vehicle602may also include one or more emitter(s)608for emitting light and/or sound. The one or more emitter(s)608in this example include interior audio and visual emitters to communicate with passengers of the vehicle602. By way of example and not limitation, interior emitters can include speakers, lights, signs, display screens, touch screens, haptic emitters (e.g., vibration and/or force feedback), mechanical actuators (e.g., seatbelt tensioners, seat positioners, headrest positioners, etc.), and the like. The one or more emitter(s)608in this example also include exterior emitters. By way of example and not limitation, the exterior emitters in this example include lights to signal a direction of travel or other indicators of vehicle action (e.g., indicator lights, signs, light arrays, etc.), and one or more audio emitters (e.g., speakers, speaker arrays, horns, etc.) to audibly communicate with pedestrians or other nearby vehicles, one or more of which may comprise acoustic beam steering technology. In some examples the emitter(s)608may include common connectors that have the same configuration as one another. The vehicle602can also include one or more communication connection(s)610that enable communication between the vehicle602and one or more other local or remote computing device(s) (e.g., a remote teleoperations computing device) or remote services. For instance, the communication connection(s)610can facilitate communication with other local computing device(s) on the vehicle602and/or the drive system(s)614. Also, the communication connection(s)510may allow the vehicle602to communicate with other nearby computing device(s) (e.g., other nearby vehicles, traffic signals, etc.). In some examples the communication connection(s)610may include common connectors that have the same configuration as one another. The communications connection(s)610may include physical and/or logical interfaces for connecting the computing device(s)604to another computing device or one or more external network(s)630(e.g., the Internet). For example, the communications connection(s)610can enable Wi-Fi-based communication such as via frequencies defined by the IEEE 802.11 standards, short range wireless frequencies such as Bluetooth, cellular communication (e.g., 2G, 3G, 4G, 4G LTE, 5G, etc.), satellite communication, dedicated short-range communications (DSRC), or any suitable wired or wireless communications protocol that enables the respective computing device to interface with the other computing device(s). In at least some examples, the communication connection(s)610may comprise the one or more modems as described in detail above. In at least one example, the vehicle602may include one or more drive system(s)614. In some examples, the vehicle602may have a single drive system614. In at least one example, if the vehicle602has multiple drive systems614, individual drive systems614may be positioned on opposite ends of the vehicle602(e.g., the front and the rear, etc.). In at least one example, the drive system(s)614can include one or more sensor system(s)606to detect conditions of the drive system(s)614and/or the surroundings of the vehicle602. By way of example and not limitation, the sensor system(s)606can include one or more wheel encoders (e.g., rotary encoders) to sense rotation of the wheels of the drive systems, inertial sensors (e.g., inertial measurement units, accelerometers, gyroscopes, magnetometers, etc.) to measure orientation and acceleration of the drive system, cameras or other image sensors, ultrasonic sensors to acoustically detect objects in the surroundings of the drive system, lidar sensors, radar sensors, etc. Some sensors, such as the wheel encoders may be unique to the drive system(s)614. In some cases, the sensor system(s)606on the drive system(s)614can overlap or supplement corresponding systems of the vehicle602(e.g., sensor system(s)606). The drive system(s)614can include many of the vehicle systems, including a high voltage battery, a motor to propel the vehicle, an inverter to convert direct current from the battery into alternating current for use by other vehicle systems, a steering system including a steering motor and steering rack (which can be electric), a braking system including hydraulic or electric actuators, a suspension system including hydraulic and/or pneumatic components, a stability control system for distributing brake forces to mitigate loss of traction and maintain control, an HVAC system, lighting (e.g., lighting such as head/tail lights to illuminate an exterior surrounding of the vehicle), and one or more other systems (e.g., cooling system, safety systems, onboard charging system, other electrical components such as a DC/DC converter, a high voltage junction, a high voltage cable, charging system, charge port, etc.). Additionally, the drive system(s)614can include a drive system controller which may receive and preprocess data from the sensor system(s)606and to control operation of the various vehicle systems. In some examples, the drive system controller can include one or more processor(s) and memory communicatively coupled with the one or more processor(s). The memory can store one or more modules to perform various functionalities of the drive system(s)614. Furthermore, the drive system(s)614also include one or more communication connection(s) that enable communication by the respective drive system with one or more other local or remote computing device(s). In at least some examples, the drive system(s)614may common connectors that have the same configuration as one another. The computing device(s)604, such as computing device202, may include one or more processors616, such as one or more processors206, and one or more memories618, such as memory(s)208, communicatively coupled with the processor(s)616. In the illustrated example, the memory618of the computing device(s)604may include localization system(s)620, perception systems(s)622, prediction systems(s)624, planning system626as well as one or more system controller(s)628. The memory620may also store data captured or collected by the one or more sensors systems606, map data and environment data. In at least one example, the computing device(s)604may store one or more and/or system controllers628, which may be configured to control steering, propulsion, braking, safety, emitters, communication, and other systems of the vehicle602. The system controllers628may communicate with and/or control corresponding systems of the drive system(s)614and/or other components of the vehicle602, which may be configured to operate in accordance with a route provided from a planning system. In some examples the system controllers628may include common connectors that have the same configuration as one another. In some implementations, the vehicle602may connect to computing device(s)632via the network(s)630. For example, the computing device(s)632may generate and provide map data and/or environment data to the vehicle602. The computing device632may include one or more processor(s)634and memory640communicatively coupled with the one or more processor(s)634. In at least one instance, the processor(s)634may be similar to the processor(s)616and the memory640may be similar to the memory618. The processor(s)616of the computing device(s)604and the processor(s)634of the computing device(s)632may be any suitable processor capable of executing instructions to process data and perform operations as described herein. By way of example and not limitation, the processor(s)616and634can comprise one or more Central Processing Units (CPUs), Graphics Processing Units (GPUs), or any other device or portion of a device that processes electronic data to transform that electronic data into other electronic data that can be stored in registers and/or memory. In some examples, integrated circuits (e.g., ASICs, etc.), gate arrays (e.g., FPGAs, etc.), and other hardware devices can also be considered processors in so far as they are configured to implement encoded instructions. The memory618of the computing device(s)604and the memory640of the computing device(s)632are examples of non-transitory computer-readable media. The memory618and640can store an operating system and one or more software applications, instructions, programs, and/or data to implement the methods described herein and the functions attributed to the various systems. In various implementations, the memory618and640can be implemented using any suitable memory technology, such as static random access memory (SRAM), synchronous dynamic RAM (SDRAM), nonvolatile/Flash-type memory, or any other type of memory capable of storing information. The architectures, systems, and individual elements described herein can include many other logical, programmatic, and physical components, of which those shown in the accompanying figures are merely examples that are related to the discussion herein. In some instances, aspects of some or all of the components discussed herein can include any models, algorithms, and/or machine learning algorithms. For example, in some instances, the components in the memory618and640can be implemented as a neural network which may include a machine learning model644and a training component642. While one or more examples of the techniques described herein have been described, various alterations, additions, permutations and equivalents thereof are included within the scope of the techniques described herein. As can be understood, the components discussed herein are described as divided for illustrative purposes. However, the operations performed by the various components can be combined or performed in any other component. It should also be understood that components or steps discussed with respect to one example or implementation may be used in conjunction with components or steps of other examples. In the description of examples, reference is made to the accompanying drawings that form a part hereof, which show by way of illustration specific examples of the claimed subject matter. It is to be understood that other examples can be used and that changes or alterations, such as structural changes, can be made. Such examples, changes or alterations are not necessarily departures from the scope with respect to the intended claimed subject matter. While the steps herein may be presented in a certain order, in some cases the ordering may be changed so that certain inputs are provided at different times or in a different order without changing the function of the systems and methods described. The disclosed procedures could also be executed in different orders. Additionally, various computations that are herein need not be performed in the order disclosed, and other examples using alternative orderings of the computations could be readily implemented. In addition to being reordered, the computations could also be decomposed into sub-computations with the same results. Example Clauses A. A system comprising:a vehicle component having a first and second receptacle, wherein:the first receptacle is mechanically coupled to a first radio-frequency identification (RFID) tag component; andthe second receptacle is mechanically coupled to a second RFID tag component;a vehicle harness having a plug mechanically coupled to a third RFID tag component, wherein the plug is physically connectable to either the first or second receptacle; andwherein the first, second, and third RFID tag components are configured such that:when the plug is inserted into the first receptacle, the first and third RFID tag components are coupled and emit a first signal; andwhen the plug is inserted into the second receptacle, the second and third RFID tag components are coupled and emit a second signal, different from the first signal and wherein the first and second emitted signals are indicative of whether the plug is connected to first or second receptacle. B. The system of clause A, wherein the third RFID tag component is configured differently when coupled to the first or the second RFID tag component by modifying a resistance-capacitance (RC) value of the third RFID component. C. The system of clause A, wherein the first RFID tag component and the second RFID tag component differently modify an antenna portion of the third RFID tag component. D. The system of any of clauses A-C, wherein first, second, and third RFID tag components are removable coupled to the first receptacle, second receptacle, or the plug. E. The system of any of clauses A-D, wherein the first emitted signal is generated using a first combination of inductances, and the second emitted signal is generated using a second combination of inductances. F. The system of clause A, wherein the third RFID tag component is configured to emit the first signal in response to a mechanical, pressure-sensitive coupling to the first RFID tag component and to emit the second signal in response to a different mechanical, pressure-sensitive coupling to the second RFID tag component. G. A method for verifying connections of associated connector assemblies in an electrical system, the method comprising:connecting an electrical plug to corresponding first electrical receptacle, wherein the electrical plug is coupled to a first tag component and the electrical receptacle is coupled to a second tag component and wherein the electrical system includes at least one other second electrical receptacle with a third tag component that the electrical plug is mechanically compatible with;reading a first identifier when the electrical plug is connected with the first electrical receptacle and a different second identifier is available when the electrical plug is connected to the second electrical receptacle; anddetermining, based on the first identifier, that the plug is inserted into the first electrical receptacle. H. The method as defined in clause G, wherein the first, second, and third tag components form radio-frequency identification (RFID) tags and the reading the first identifier includes receiving a signal at a distance from the RFID tags using electromagnetic waves. I. The method as defined in clause H, further comprising enabling the operation of the RFID tags to emit a corresponding signal by connecting the electrical plug to a corresponding receptacle. J. The method as defined in any of clauses G-I, wherein the RFID tags are enabled to transmit or received a signal by completing a circuit of the corresponding one of the RFID tags when the plug is connected to a corresponding tagged receptacle. K. The method as defined in any of clauses G-J, wherein the completing the circuit includes completing an antenna configured to receive or transmit radio-frequency signals. L. The method as defined in any of clauses G-I, wherein the RFID tags are enabled using a pressure switch when the plug is connected to a corresponding tagged receptacle. M. The method as defined in any of clauses G, wherein the first, second, and third tag components each includes at least part of a visually identifiable bar code and the reading the first identifier includes scanning a bar code. N. The method as defined in clause M, wherein the first tag component and the third tag component together form a unique visually identifiable bar code when the electrical plug is inserted into the first electrical receptacle. O. The method as defined in any of clauses M-N, wherein the second electrical receptacle and the third electrical receptacle are keyed differently such that the bar code of the plug aligns differently with a bar code of the first electrical receptacle and a bar code of the second electrical receptacle. P. The method as defined in any of clauses G-O, wherein the first tag component or the third tag component is removably coupled to the first electrical receptacle or the electrical plug. Q. A system for verifying correct electrical connections of associated connector assemblies in an electrical system having multiple connector assemblies that each include a plug and a receptacle, the system comprising:a first identification tag attached to an electrical plug;a second identification tag attached to a first electrical receptacle;a third identification tag attached to a second electrical receptacle, the third identification tag different from the third identification tag;non-volatile computer readable medium storing instruction which when executed by one or more processor cause the system to perform the acts comprising:receiving a first identifier associated with the electrical plug being coupled the first electrical receptacle, the first identifier associated with the first and second identification tags, wherein the first identifier is different from a second identifier associated with the second and third identification tags; anddetermining that the electrical plug is coupled to the first electrical receptacle based at least in part on receiving the first identifier. R. The system of clause Q, wherein the first, second, and third identification tags are RFID tag components. S. The system of clause R, wherein the combination of the first identification tag and the second identification tag is enabled as an RFID tag when the electrical plug is physically connected to the first electrical receptacle. T. The system of any of clauses R-S, wherein the RFID tag is a passive RFID tag. | 57,191 |
11942732 | DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENT Reference will now be made to the drawing figures to describe the embodiments of the present disclosure in detail. In the following description, the same drawing reference numerals are used for the same elements in different drawings. Referring toFIG.1, the present disclosure relates to an electrical connector assembly900comprising at least one electrical connector, and the electrical connector is a temperature sensing connector. As shown inFIG.1, the electrical connector assembly900comprises a plurality of temperature sensing connectors, each temperature sensing connector comprises an insulative housing1, a pair of contacts2and a temperature sensing element3electrically connected with the contacts2. The electrical connector assembly900further has a plurality of connecting elements5electrically connected in correspondence with the temperature sensing connectors. Referring toFIGS.2to9, the electrical connector in a preferred embodiment and a connecting element5are shown, and a detailed illustration is as follow. The insulative housing1defines a base portion11and a receiving portion12extending forwards from the base portion11, the receiving portion12is provided with a cavity120opening towards one side thereof. Specially, the receiving portion12has a partition121located in the cavity120and a pair of restriction slots123arranged on both sides of the partition121. Each restriction slot123is formed by the partition121and a projection124located on an outside of the partition121at intervals. The base portion11has an open portion112opening outward and towards one side in a height direction thereof, specially, the base portion11comprises a pair of side walls113opposite to each other and a bottom wall114connecting the pair of side walls113, the pair of side walls113are connected with the bottom wall114to form the open portion112, and the open portion112is opening towards a rear side of the base portion11. Each side wall113has a pair of engaging slots1131recessing outwardly from an inner surface thereof and a first latching slot1132communicated with the engaging slot1131on a front side. The base portion11further has a separating wall115protruding upwards from the bottom wall114, and the separating wall115is located between the pair of side walls113in a transverse direction. The separating wall115defines an upper segment1151and a lower segment1152, the lower segment1152has a greater width in the transverse direction than the upper segment1151in the transverse direction. The lower segment1152has a recessed portion1153recessing forward from a rear end surface thereof and an upper wall1154immediately adjacent to the recessed portion1153. The insulative housing1has a pair of receiving slots13for receiving the corresponding contacts2and a pair of mounting slots14communicated with corresponding receiving slots13, the insulative housing1further has a pair of second latching slots15on an upper side of relative mounting slot14, each second latching slot15is recessed in corresponding side wall113and extending forward from a rear surface of the insulative housing1. Each contact2has a retaining portion21held in the base portion11, a contacting arm23provided at one end of the retaining portion21and protruding into the cavity120, and a mating arm24provided at the opposite end of the retaining portion21, the mating arm24defines a mating portion241protruding downwards. In addition, each contact2further defines an abutting arm25extending in a reversed direction from the mating arm24, thus the abutting arm25is located on an upper side of the mating arm24and connected with the mating arm24to form a U-shape configuration. When a cover4covering the open portion112from an upper side thereof, the cover4is abutting against the abutting arm25and therefore the mating portion241of the mating arm24having a tendency to move downwards. Moreover, each contact2further has a clamping arm26extending from the retaining portion21, the clamping arm26extends rearwardly from the retaining portion21and is curved and elastic, the mating arm24is also curved and elastic. Furthermore, in this embodiment, the retaining portion21is of U-shaped, and comprises a pair of retaining plates212spaced apart from each other and opposite to each other along the height direction, the mating arm24and the clamping arm26are extending backwards from the corresponding retaining plates212. In this way, the connecting element5is sandwiched between the clamping arm26and the mating arm24, and clamped at an upper side and a lower side thereof by means of elastic clamping forces to ensure the reliability of an electrical connection of the connecting element5. The retaining portion21is provided with a closed side on one side and an open side on the other side in the transverse direction, and each retaining plate212defines a plurality of barbs2121on the open side thereof, and the barbs2121are interfering with the insulative housing1. In further, the clamping arm26has a clamping portion261arched upwards to give it elastic deformability, and the clamping portion261presses against the connecting element5on the lower side thereof when the connecting element5is inserted into the insulative housing1. The clamping arm26further has a tail portion262located at a rear end and a limiting portion263protruding from the tail portion262in the transverse direction, the limiting portion263of one clamping arm26extends into the recessed portion1153in the separating wall115, and the limiting portion263of the other clamping arm26extends into a recessed portion in one side wall113. Referring toFIGS.3-5, and conjunction withFIG.9, the temperature sensing element3is at least partially accommodated in the cavity120and connected to the contacting arms23of the contacts2within the cavity120. Further, the temperature sensing element3has a pair of pins31confined in corresponding restriction slots123to be soldered with corresponding contacting arms23. Please referring toFIGS.2,4-7andFIGS.9-10, the electrical connector further has the cover4assembled to the open portion112, the cover4at least partially covers the contacts2. The cover4has a main portion41and a plurality of stopping blocks42provided at edges of the main portion41, each stopping block42extends downwardly from the edge of the main portion41to make its bottom surface be located on an underside of a bottom surface of the main portion41. Furthermore, the stopping blocks42are disposed on both sides of the cover4in the transverse direction, and held in corresponding engaging slots1131. Each side of the stopping blocks42comprise at least one side stopping portion421facing downwards. The cover4further has a rear stopping portion43protruding downwardly from a rear edge of the main portion41, the rear stopping portion43extends downwards beyond the bottom surface of the main portion41. In the present invention, the cover4is locked with the insulative housing1, the cover4and the insulative housing1cover and secure the contacts2on both sides. In a preferable embodiment of the present invention, the cover4is assembled to the insulative housing1along the height direction and fastened to the side walls113of the base portion11by means of locking portions45on both sides thereof. At least one of the stopping blocks42on each side of the cover4in the transverse direction has a first locking portion451, in the illustrated embodiment, the first locking portion451is provided on an outside of the stopping block42located at the front. The main portion41has a pair of second locking portions452on both sides thereof in the transverse direction, the pair of second locking portions452are arranged on a rear side of the stopping blocks42which are located at the back, and a protruding length of each second locking portion452toward outwards in the transverse direction is shorter than a protruding length of the adjacent stopping block42toward outwards in the transverse direction, so that an outer surface of the stopping block42is far away from a lateral surface of the main portion41in comparison to the second locking portion452. The first and second locking portions451,452are collectively referred to as the locking portions45, the first locking portions451are latched in the first latching slots1132to avoid relative movement of the cover4in the height direction on the front side, and the second locking portions452is positioned in the second latching slots15to avoid relative movement of the cover4in the height direction on the rear side. The cover4further has a pair of positioning walls46protruding downwards from the main portion41, the pair of positioning walls46are spaced apart from each other in the transverse direction and located in a central position of the cover4, each positioning wall46extends in a front-and-back direction. The separating wall115is located in a space formed between the pair of positioning walls46for alignment and placement. The electrical connector further has an insulator (not shown) accommodated in the insulative housing1and enclosing on the temperature sensing element3, the insulator is enclosing on a conjunction area between the temperature sensing element3and the contacts2. In this embodiment, the temperature sensing element3is completely received in the cavity120, the pair of pins31are connected with the contacting arms23of the contact2, the insulator is filled in the cavity120and enclosing the temperature sensing element3and connection parts of the contacting arms23therein. The connecting element5is electrically connected to the mating arm24of the electrical connector, when connected, the connecting element5is inserted into the mounting slots14along a back-to-front direction and abutting against the mating portion241of the mating arm24. In the present invention, the connecting element5has a pair of mating tongues51arranged side by side in the transverse direction and electrically connected with corresponding contacts2. The mating tongues51are inserted into corresponding mounting slots14and separated from each other by the separating wall115in the base portion11, the mating tongues51are abutting against between the insulative housing1and the contacts2. Each mating tongues51defines a first protruding portion512and a second protruding portion513disposed on one side in the transverse direction, the second protruding portion513is located behind the first protruding portion512, the side stopping portion421of the stopping blocks42on a front side restricts the first protruding portion512from an upper side thereof, the second protruding portion513is accommodated in a concave portion423and stopped by the side stopping portion421on a same side, the concave portion423is formed at a bottom side of the stopping block42on a rear side. The connecting element5further has a tabulate portion52behind the pair of mating tongues51, the tabulate portion52is provided with a fixing hole521penetrating through it in the height direction, the rear stopping portion43extends downwardly into the fixing hole521to achieve a fixation on a rear side of the mating tongues51. As shown inFIG.7, the temperature sensing element3is placed in a direction D1parallel to an insertion direction D2of the connecting element5. Specifically, the placement direction D1of the temperature sensing element3is parallel to a plane in which the pair of pins31located, and is in a front-to-back direction of the electrical connector, the insertion direction D2is also in the back-to-front direction of the electrical connector. Next referring toFIGS.11to13, description will be made of an electrical connector according to another embodiment of the present invention. The electrical connector is substantially similar to the electrical connector in aforementioned embodiment, and also comprises an insulative housing1′, a pair of contacts2′, a temperature sensing element (not shown) electrically connected with the contacts2′ and a cover4′ assembled to the insulative housing1′. The difference is only detailed structure of the cover4′ and an engagement between the cover4′ and the insulative housing1′, and detailed description for the difference is as follows. In this embodiment, the cover4′ is slidingly assembled to the insulative housing1′ in a front-and-back direction, one of the cover4′ and the insulative housing1′ has at least one sliding groove15′ extending in a front-to-back direction, the other one has at least one sliding protrusion45′ which can be inserted into the sliding groove15′ and sliding along the sliding groove15′. Preferably, the insulative housing1′ has a pair of sliding grooves15′ on both sides thereof, the cover4′ has a pair of sliding protrusions45′ on both sides correspondingly. Each sliding protrusion45′ is protruding outwards from a main portion41′ of the cover4′ and has a locking portion451′ protruding on its outer side. Each side wall113′ of the insulative housing1′ defines a locking slot116′ to accommodate the corresponding locking portion451′, the locking portion451′ is stopped at its rear end by a stopping surface1161′ which confines the locking slot116′. Referring toFIG.14, another electrical connector is an alternative embodiment of the temperature sensing connector, and the electrical connector is substantially similar to the electrical connector in aforementioned embodiment, and also comprises an insulative housing1″, a pair of contacts2″, a temperature sensing element3″ electrically connected with the contacts2″ and a cover (not shown) assembled to the insulative housing1″. A connecting element5″ is electrically connected with the contacts2″, and the difference is: The temperature sensing element3″ is placed in a direction D1″ perpendicular to an insertion direction D2″ of the connecting element5″. Specifically, a plane in which a pair of pins31″ of temperature sensing element3″ located is a vertical plane, the insertion direction D2″ of the connecting element5″ is perpendicular to the vertical plane. As shown inFIGS.1and15-16, the electrical connector assembly900further has a substrate6connected with the connecting elements5, each temperature sensing connector is connected to one side of the substrate6by the connecting element5, each temperature sensing connector and the substrate6are connected to opposite ends of the corresponding connecting element5. Every temperature sensing connector is attached to a side of the substrate6or at least partially received in a cutout62formed in a side portion of the substrate6. Specifically, as shown inFIG.1, in a first embodiment of the electrical connector assembly, the cutout62is formed on one side of the substrate6, and the cutout62is opening towards one side in a plane in which the substrate6is located, that is to say, the cutout62is formed by walls of the substrate6, and the walls are adjacent to each other and connected in a U-shape, one of the temperature sensing connectors is received in the cutout62. As shown inFIG.15, in a second embodiment of the electrical connector assembly, a substrate6defines a cutout62on one side thereof, the cutout62is opening towards two sides in a plane which the substrate6is located, that is to say, the cutout62is formed by walls of the substrate6which are adjacent to each other and connected in an L-shape, and one of the temperature sensing connectors is received in the cutout62. Referring toFIGS.1and15, in the first and second embodiments of the electrical connector assembly, the connecting element5is extending integrally outwards from a side edge601of the substrate6, specially, the substrate6can be a printed circuit board (PCB), a flexible circuit board (FPC) or a flexible flat cable (FFC), the connecting element5and the substrate6are of a one-piece structure. As shown inFIG.16, in a third embodiment of the electrical connector assembly, a substrate6defines a cutout62on one side thereof, and the cutout62is opening towards one side in a plane in which the substrate6is located, one of the temperature sensing connectors and relative connecting element5are received in the cutout62. Specially, the connecting element5is mechanically and electrically connected with the substrate6, that is to say, the connecting element5and the substrate6are of a two-piece construction, and detachably connected to each other. In further, the connecting element5is flexible and can be a flexible circuit board (FPC) or a flexible flat cable (FFC), and the substrate6can be a printed circuit board (PCB), a flexible circuit board (FPC) or a flexible flat cable (FFC). Similarly, other connecting elements5connected with other temperature sensing connector can be also removably connected to the substrate6and will not be described here. As aforementioned, the substrate6of the electrical connector assembly900is connected with a plurality of temperature sensing connectors, as shown inFIG.1, placement directions D1of some temperature sensing elements3are parallel to the insertion directions D2of its corresponding connection element5; placement directions D3of other temperature sensing elements3are perpendicular to the insertion directions D2of its corresponding connection element5. In the electrical connector and electrical connector assembly900, the temperature sensing element3is at least partially received in the cavity120of the insulative housing1, and connecting with the contacting arm23of the contact2in the cavity120, thereby facilitating disassembly and replacement of the faulty temperature sensing element3. It is to be understood, however, that even though numerous characteristics and advantages of preferred and exemplary embodiments have been set out in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only; and that changes may be made in detail within the principles of present disclosure to the full extent indicated by the broadest general meaning of the terms in which the appended claims are expressed. | 18,081 |
11942733 | DETAILED DESCRIPTION The present disclosure is directed to preventing serious injury or death by electrocution due to contact with a power source, such as an alternating current (AC) voltage source. The main cause of such serious injury or death by electrocution, besides the electric current passing through the body, is the fact that the victim often cannot separate or “let go”, from the electrocuting wire or surface. The duration of an electrical shock to a victim is a significant factor. Methods and apparatus consistent with the present disclosure may controllably provide an electrical voltage to an electrical conductor for a period of time and then remove that voltage from the electrical conductor before providing the electrical voltage to the electrical conductor a second time. By initially connecting the electrical voltage to the conductor and then removing that electrical voltage from the conductor before re-connecting that electrical voltage to the conductor, methods and apparatus consistent with the present disclosure allow a person to let go of the conductor before the person is seriously injured or killed by an electrical shock in an instance where the body of the person is in physical contact with the electrical conductor. FIG.1illustrates an exemplary control circuit that may be used to control the distribution of a voltage to a receptacle.FIG.1includes alternating current (AC) neutral input110, AC live input120, receptacle130, current sensor140, controllable switch150, controller160, and interface170. Interface170may be device that sends a command to controller160that instructs controller160to energize receptacle130. Interface170may itself include a switch. Interface170may be communicatively coupled to controller160by means that include a direct electrical connection, a digital communication bus, or a wireless communication interface. When controller160receives the command to energize receptacle130, controller160may engage (turn-on) controllable switch150for a first time period (one or more milliseconds or microseconds, for example) while the controller receives sensor data from current sensor140. When the controller identifies that there is no electrical current detected based on data received data from current sensor140, the controller160may de-energize receptacle130. The presence of no current through the receptacle may indicate that an electrical load has failed (e.g. a light bulb has burnt out) or may indicate that no load is connected to or inserted into receptacle130. The energizing of a receptacle when no load is connected to that receptacle may be considered as a potentially dangerous condition as a person could potentially contact an energized contact included in receptacle130. As such, controller160may prevent receptacle130from being energized when it is not connected to a load. The fact that electrical power is not provided to a receptacle or outlet when no load is attached to that receptacle or outlet is not important because that receptacle or outlet is not currently connected to a working load. Note that controller160is connected to current sensor140and to controllable switch150. Using these connections controller160may control whether an electrical voltage is applied to receptacle130through current sensor140based on action of controllable switch150, and controller160may receive sensor data from current sensor140. Controllable switch150may be any form of switch known in the art and may include be or include a transistor, a field effect transistor (FET), a solid state relay, or a mechanical-inductive relay, for example. Controller160may be or include any form of control logic known in the art. As such controller160may include a processor and a memory, programmable logic, digital logic, or a field programmable gate array (FPGA). Controller160may include any of digital inputs, digital outputs, analog inputs, analog outputs, or a wireless communication device that may be used to perform a control function, that may be used to receive commands, or that may receive signals/data. Current sensor140may include or be any form of current sensor known in the art (analog or digital sensor). Current sensor140may include a resistor that drops a voltage that controller160may sense. In an instance where controller160identifies that current is flowing during the first period of time based on received sensor data, controller160may turn off (de-energize) receptacle130after a second period of time (e.g. one or more seconds) before turning on (energizing) receptacle160again, this process could allow a person to let go of a energize-able electrical contact. The control circuit ofFIG.1thus may provide two different types of protection function: a first protection function that prevents an electrical receptacle or outlet from being energized when no load is attached to that receptacle/outlet, and a second protection function that allows a person to “let-go” of an energize-able wire, a contact, or a surface during or after a shock event. Apparatus consistent with the present disclosure solves a problem associated with the fact that electrical or electronic circuits have no way of identifying whether current is being provided to power an apparatus or that is currently being provide to shock a human person. This may be especially true when an impedance of a load is similar to the impedance of a human person. FIG.2illustrates exemplary switch circuits that may be directly coupled to a controller. A first switch circuit ofFIG.2includes AC neutral input205, AC Live210input, switch215, receptacle220, controller input225, controller output230, and resistor235. When switch215is closed, a microcontroller may receive a low voltage AC signal dropped over resistor235via controller input225. The microcontroller may use this low voltage AC signal to identify that the switch has been closed. The microcontroller may then use controller output230to de-energize and then re-energize receptacle230using a solid state relay or a switching device that may be included inside of receptacle220, for example. In certain instances the low voltage AC signal provided to controller input225may be electrically isolated. For example, an optical isolator (not illustrated) may be used to electrically isolate the AC signal dropped across resistor235from an input pin on the controller. FIG.2includes a second exemplary circuit in a direct current (DC) circuit configuration that may be coupled to a controller. The DC circuit inFIG.2includes DC power supply240, resistor245, switch255, and controller input250that may be provided to an input of a controller. Note that a positive output of DC power supply240is electrically coupled to resistor245. Note also that a negative output of DC power supply240is electrically coupled to ground260and to switch255. When switch255is closed, a voltage at controller input250changes from a voltage equal to the DC power supply240voltage to a low voltage of zero volts. A microcontroller or a control circuit coupled to controller input250may use this change in voltage to trigger operations consistent with the present disclosure. When this voltage changes from the DC supply voltage240to ground potential, an electrical receptacle could be energized and de-energized. To prevent any transients or glitches that may appear on controller input250, this DC circuit could include a capacitor across (not illustrated) switch255that filters out electrical noise that may appear on controller input250. Alternatively or additionally the controller may require that the voltage on controller input250be maintained for a period of time before the controller reacts to a change in voltage on controller input250. FIG.3illustrates a second exemplary control circuit that may be used to control the distribution of a voltage to a receptacle.FIG.3includes AC neutral input310, AC Live input320, current sensor340, receptacle330, controller360, and interface370. The circuit ofFIG.3may operation in a similar manner to the circuit ofFIG.1even though these two circuits have slightly different interconnection configurations. Note that controllable switch350is coupled directly to receptacle330and that current sensor340is coupled between receptacle330and AC neutral input310. Current sensor340is also coupled to controller360and controller360is coupled to controllable switch350via one or more connections. A command from interface370may be used to instruct controller360to energize receptacle330in a manner consistent with one or more safety features described above in respect toFIG.1. Interface370may be device that sends a command to controller360that instructs controller360to energize receptacle330. Interface370may itself include or be a switch. Switch370may also be a momentary switch that provides a pulse when it is depressed. Interface370may be communicatively coupled to controller360by means that include a direct electrical connection, a digital communication bus, or a wireless communication interface. FIG.4illustrates a series of steps that may be performed by a controller consistent with the present disclosure.FIG.4begins with determination step410that identifies whether a light switch has been closed, when the switch has not been closed flow of the method may move back to step410, where the controller may once again identify whether the light switch has been closed. When step410identifies that the light switch has been closed, the flow of the method may move to step420where the receptacle is allowed to be energized for a first period of time. In step430, the controller may identify whether current is flowing to a load during this first period of time. This identification may be performed by the controller receiving input or data from a sensor (whether that sensor be an analog or a digital sensor). When determination step430has identified that current is not flowing to a load during the first period of time, the method may move to step440where the receptacle is de-energized, after which flow of the method may move back to step420ofFIG.4. When determination step430identifies that current is flowing to the load, the flow of the method may move to step450where the receptacle is de-energized for a second period of time. After step450, the receptacle may be re-energized in step460ofFIG.4. The de-energizing of the receptacle in step450ofFIG.4may allow for a person that has received a shock from an energized conductor, wire, or surface to let go of that conductor, wire, or surface before that person is electrocuted. Methods consistent with the present disclosure may include additional steps where the controller monitors information from a current sensor over time. In an instance where that current drops to zero amps, the controller may de-energize the receptacle based on the load no longer drawing current. The controller may additionally or alternatively monitor the current provided to the load and may de-energize the receptacle when a load current increases above a threshold level. Such an increase in load current may indicate a short circuit or a damaged load. FIG.5illustrates an exemplary simplified circuit and timing diagram consistent with a controller of the present disclosure. The circuit diagram ofFIG.5illustrates that embodiments of the present invention may be implemented with discrete parts. The circuit diagram ofFIG.5includes a command CMD510input, a current (I) sensed signal520input, timer530, comparator or logic540, timer550, flip flop560, AND gate570, OR gate580, OR gate output590(energize receptacle), AC live input voltage595A, and a connector595B that may electrically connect to a pin of a receptacle when solid state relay597is commanded to conduct by a high state associated with OR gate output590. Note that command input510is coupled to an input of timer530. Note also that an output of timer530is coupled to a D (560D) input of flip flop560, an input of OR gate580, an input of comparator/logic540, and an input of timer550. Comparator/logic540includes two inputs one coupled to the output of timer530and another connected to current sensed signal520. Comparator/logic540also includes an output coupled to a clock input C (560C) of flip flop560. AND gate570has a first input coupled to output Q (560Q) of flip flop560and a second input coupled to timer550. An output of AND gate570is coupled to an input of OR gate580. Note that output590of OR gate580will transition to a high state when either an input from timer530or the input from AND gate570transitions to a high state. When OR gate output590transitions to a high state, switch597will close and an electrical voltage on AC live input595A will be electrically coupled to connector595B, energizing a receptacle consistent with the present disclosure. The timing diagram ofFIG.5illustrates how the circuit ofFIG.5operates. The timing diagram ofFIG.5illustrates a logic low (or zero “0”) as signal at a low relative level and a logic high (or one, “1”) when a signal is at a high level. This timing diagram also includes some, yet not all of the relationships that cause certain signals to change state in the timing diagram ofFIG.5. A rising edge510R of CMD510causes an output of timer530to transition to a high state (logic 1) for a period of time. When the output of timer530output is in a high state the receptacle will be energized as controlled by OR gate output590according to the equation: 506Q*550+530 which at this time corresponds to a logic 1 at least because timer output530is set at a logic 1. The output of comparator or logic540transitions to a logic 1 state when both a current is sensed flowing to the receptacle and when the output of timer530is in a logic 1 state. The transitioning of output of comparator/logic540from a logic 0 state to a logic 1 state (as indicated by arrow540R) causes the output of flip flop560Q to transition to a logic 1 state. After a first period of time, an output of timer530transitions to a logic 0 state, this transition causes an output of timer550to transition from a logic 1 state to a logic 0 state as indicated by arrow510F, resulting in the receptacle being de-energized based on the formula560Q*550+530=1*0+0=0. Then after a time period associated with timer550, the output associated with timer550transitions back to the logic 1 state causing the receptacle to be energized again according to the formula560Q*550+5303=1*1+0=1. While not illustrated inFIG.5, control circuits consistent with the present disclosure may include additional components or logic that may cause the receptacle to be de-energized when current (I) sensed520transitions to a logic 0 state indicating that the load has either been turned off or has failed. Note that timers consistent with the present disclosure may be implemented by any means known in the art. As such, timer530and timer550may be “555” timing devices (e.g. 555 timers) known in the art or be or include digital logic or analog timing components that may include resistors, capacitors, or inductors, for example. FIG.6illustrates a computing system that may be used to implement an embodiment of the present invention. The computing system600ofFIG.6includes one or more processors610and main memory620. Main memory620stores, in part, instructions and data for execution by processor610. Main memory620can store the executable code when in operation. The system600ofFIG.6further includes a mass storage device630, portable storage medium drive(s)640, output devices650, user input devices660, a graphics display670, peripheral devices680, and network interface695. The components shown inFIG.6are depicted as being connected via a single bus690. However, the components may be connected through one or more data transport means. For example, processor unit610and main memory620may be connected via a local microprocessor bus, and the mass storage device630, peripheral device(s)680, portable storage device640, and display system670may be connected via one or more input/output (I/O) buses. Mass storage device630, which may be implemented with a magnetic disk drive or an optical disk drive, is a non-volatile storage device for storing data and instructions for use by processor unit610. Mass storage device630can store the system software for implementing embodiments of the present invention for purposes of loading that software into main memory620. Portable storage device640operates in conjunction with a portable non-volatile storage medium, such as a FLASH memory, compact disk or Digital video disc, to input and output data and code to and from the computer system600ofFIG.6. The system software for implementing embodiments of the present invention may be stored on such a portable medium and input to the computer system600via the portable storage device640. Input devices660provide a portion of a user interface. Input devices660may include an alpha-numeric keypad, such as a keyboard, for inputting alpha-numeric and other information, or a pointing device, such as a mouse, a trackball, stylus, or cursor direction keys. Additionally, the system600as shown inFIG.6includes output devices650. Examples of suitable output devices include speakers, printers, network interfaces, and monitors. Alternatively or additionally input devices660may include a digital input bus or an analog to digital converter coupled to a sensor. Display system670may include a liquid crystal display (LCD), a plasma display, an organic light-emitting diode (OLED) display, an electronic ink display, a projector-based display, a holographic display, or another suitable display device. Display system670receives textual and graphical information, and processes the information for output to the display device. The display system670may include multiple-touch touchscreen input capabilities, such as capacitive touch detection, resistive touch detection, surface acoustic wave touch detection, or infrared touch detection. Such touchscreen input capabilities may or may not allow for variable pressure or force detection. Peripherals680may include any type of computer support device to add additional functionality to the computer system. For example, peripheral device(s)680may include a modem or a router. Network interface695may include any form of computer interface of a computer, whether that be a wired network or a wireless interface. As such, network interface695may be an Ethernet network interface, a BlueTooth™ wireless interface, an 802.11 interface, or a cellular phone interface. The components contained in the computer system600ofFIG.6are those typically found in computer systems that may be suitable for use with embodiments of the present invention and are intended to represent a broad category of such computer components that are well known in the art. Thus, the computer system600ofFIG.6can be a personal computer, a hand held computing device, a telephone (“smart” or otherwise), a mobile computing device, a workstation, a server (on a server rack or otherwise), a minicomputer, a mainframe computer, a tablet computing device, a wearable device (such as a watch, a ring, a pair of glasses, or another type of jewelry/clothing/accessory), a video game console (portable or otherwise), an e-book reader, a media player device (portable or otherwise), a vehicle-based computer, some combination thereof, or any other computing device. The computer can also include different bus configurations, networked platforms, multi-processor platforms, etc. The computer system600may in some cases be a virtual computer system executed by another computer system. Various operating systems can be used including Unix, Linux, Windows, Macintosh OS, Palm OS, Android, iOS, and other suitable operating systems. The present invention may be implemented in an application that may be operable using a variety of devices. Non-transitory computer-readable storage media refer to any medium or media that participate in providing instructions to a central processing unit (CPU) for execution. Such media can take many forms, including, but not limited to, non-volatile and volatile media such as optical or magnetic disks and dynamic memory, respectively. Common forms of non-transitory computer-readable media include, for example, FLASH memory, a flexible disk, a hard disk, magnetic tape, any other magnetic medium, a CD-ROM disk, digital video disk (DVD), any other optical medium, RAM, PROM, EPROM, a FLASH EPROM, and any other memory chip or cartridge. When a timer is implemented by a processor executing instructions out of a memory, a first number of clock cycles of a timing crystal associated with the processor may correspond to the first time based on the processor executing a instructions in a program loop that includes X number of loops. Similarly, a second number of clock cycles of the timing crystal associated with the processor may correspond to the second time based on the processor executing instructions in a program loop that includes Y number of loops. FIG.7illustrates several electrical receptacles controlled by a controller consistent with the present disclosure.FIG.7includes controller710coupled to each of a plurality of receptacle circuits that each include a AC Neutral input, an AC Live input, a current sensor, a receptacle, and a controllable switch.FIG.7illustrates different receptacle circuits that include current sensors740-A through750-N, controllable switches760-A through760-N, receptacles750-A through750-N may be controlled by controller710. The AC Live inputs are identified as AC Live720-A through720-N and AC neutral inputs ofFIG.7are identified as AC Neutral730-A through730-N. Each of these respective receptacle circuits may also be coupled to an on-off switch, such as the switches like those illustrated in respect toFIG.2. A respective receptacle may be powered on or powered off according to the timing diagram ofFIG.4or according to the flow chart ofFIG.4. The present invention may be implemented in an application that may be operable using a variety of devices. Non-transitory computer-readable storage media refer to any medium or media that participate in providing instructions to a central processing unit (CPU) for execution. Such media can take many forms, including, but not limited to, non-volatile and volatile media such as optical or magnetic disks and dynamic memory, respectively. Common forms of non-transitory computer-readable media include, for example, a floppy disk, a flexible disk, a hard disk, magnetic tape, any other magnetic medium, a CD-ROM disk, digital video disk (DVD), any other optical medium, RAM, PROM, EPROM, a FLASH EPROM, and any other memory chip or cartridge. While various flow diagrams provided and described above may show a particular order of operations performed by certain embodiments of the invention, it should be understood that such order is exemplary (e.g., alternative embodiments can perform the operations in a different order, combine certain operations, overlap certain operations, etc.). The foregoing detailed description of the technology herein has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the technology to the precise form disclosed. Many modifications and variations are possible in light of the above teaching. The described embodiments were chosen in order to best explain the principles of the technology and its practical application to thereby enable others skilled in the art to best utilize the technology in various embodiments and with various modifications as are suited to the particular use contemplated. It is intended that the scope of the technology be defined by the claim. | 23,756 |
11942734 | The previous summary and the following detailed description are to be read in view of the drawings, which illustrate some (but not all) embodiments of the presently disclosed subject matter. DETAILED DESCRIPTION The presently disclosed subject matter is introduced with sufficient details to provide an understanding of one or more particular embodiments of broader inventive subject matters. The descriptions expound upon and exemplify features of those embodiments without limiting the inventive subject matters to the explicitly described embodiments and features. Considerations in view of these descriptions will likely give rise to additional and similar embodiments and features without departing from the scope of the presently disclosed subject matter. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood to one of ordinary skill in the art to which the presently disclosed subject matter pertains. Although any methods, devices, and materials similar or equivalent to those described herein can be used in the practice or testing of the presently disclosed subject matter, representative methods, devices, and materials are now described. Following long-standing patent law convention, the terms “a”, “an”, and “the” refer to “one or more” when used in the subject specification, including the claims. Thus, for example, reference to “a device” can include a plurality of such devices, and so forth. Unless otherwise indicated, all numbers expressing quantities of components, conditions, and so forth used in the specification and claims are to be understood as being modified in all instances by the term “about”. Accordingly, unless indicated to the contrary, the numerical parameters set forth in the instant specification and attached claims are approximations that can vary depending upon the desired properties sought to be obtained by the presently disclosed subject matter. As used herein, the term “about”, when referring to a value or to an amount of mass, weight, time, volume, concentration, and/or percentage can encompass variations of, in some embodiments +/−0.1-20% from the specified amount, as such variations are appropriate in the disclosed packages and methods. The presently disclosed subject matter is generally directed to an improved outlet assembly that provides electrical power with at least one standard electrical socket in addition to one or more retractable USB charging cables. As illustrated inFIG.1a, assembly5includes a conventional outlet with a series of sockets10. The term “socket” refers to an electronic component having interconnection elements suitable for making electrical connection to another electronic component, such as through a plug. Sockets10therefore provide electrical power to a corresponding device requiring AC input via a plug that is inserted into the socket (e.g., lamp, television, blender, etc.). Most homes and buildings currently use wall outlets having only AC sockets. Advantageously, assembly5also includes access to one or more retractable charging cables20(e.g., USB charging cables) FIG.1bis an exploded view of the assembly ofFIG.1showing faceplate25, that provides an aesthetic appearance to the assembly, hiding at least a portion of the electrical components from view. The assembly also includes socket10, which can be a duplex receptacle, single receptacle, triple receptacle, etc. Housing30is also included, configured to accommodate at least one charging cable spool insert15. Additional components can be included, such as (but not limited to) printed circuit board assembly16. The term “printed circuit board assembly” refers broadly to a sandwich structure of conducting and insulative layers that function to affix electronic components in designated locations on the outer layers and provide reliable electrical connections between the terminals of the components in a controlled manner. In some embodiments the assembly can further include AC/DC converter17as illustrated inFIG.1b. The term “AC/DC converter” refers to a device that converts input AC into DC and then outputs it. The assembly can also include housing lid18that can be configured in any suitable size and/or shape. The lid shields the interior components of the assembly to ensure that the wiring, etc. are not exposed in full contact with the support wall upon which the assembly in mounted in accordance with fire safety regulations. As described in detail herein below, each charging cable20is operably connected to a port configured on the interior of the assembly (e.g., a USB charging cable can be connected to a USB port on a phone although any type of charging cable/port can be used). Assembly5therefore allows attachment of a conventional AC plug, as well as conveniently provides one or more retractable cables that allow a variety of mobile devices to be charged. Advantageously, the user does not need a separate charging cable, adapter, charger, and/or power supply. Rather, integrated charging cable20mates directly to the device of a user for charging. Assembly5can be mounted in a predetermined location on wall21(e.g., the wall of a home or business) as shown inFIGS.2aand2b. For example, wall21can be a location that has wired connections to the building's AC power grid, a generator, a transformer, or the like. The wall provides the support structure for assembly5, and functions to hide most or all of the assembly components. Wall21can be a structural portion of a building or can be a section of equipment, such as a power supply. As shown inFIG.2a, aperture22is formed in wall21to accept the disclosed outlet assembly. The building's AC wiring is connected to the outlet at corresponding connection terminals, as would be known in the art. Once installed, the assembly is flush with wall21, such that only faceplate25is visible, as illustrated inFIG.2b. The electrical sockets and USB cable charging ends are also visible, as discussed below. The remainder of the assembly is configured within aperture22on the interior of the wall. FIG.3aillustrates one embodiment of housing30that retains the various components of assembly5. The term “housing” refers to any structure that can structurally support and/or conceal one or more members of the disclosed outlet assembly. As shown, housing30includes one or more walls that surround interior31. The walls create first and second compartments32aand32b. The first and second compartments can be sized and shaped to include one or more sockets10and inserts15, respectively. It should be appreciated that the first compartment (e.g., a socket module) can be sized and shaped to accommodate a single socket, two sockets, three sockets, or more. Similarly, the second compartment can be sized and shaped to accommodate at least one spool insert15(e.g., a single spool, two spools, more than two spools). The front face of the housing releasably attaches to faceplate25comprising one or more openings. One example of a faceplate is shown inFIGS.3band3c. As shown, the faceplate can include at least one socket opening35asized and shaped to accommodate an electrical socket. In addition, the faceplate can include a plurality of insert openings35bthat are sized and shaped to accommodate insert15, as described below. Typically, faceplate25is held in place with screw26or any other fastener capable of mounting the faceplate to housing30(e.g., magnets, snap-fit, pressure-fit, and the like). The faceplate is visible and accessible on wall21, while the assembly housing is configured behind the faceplate within the interior of the wall. The faceplate and concealed housing therefore give the assembly a flush front surface relative to the corresponding wall and a pleasing overall appearance, while also protecting the components of the disclosed assembly. The faceplate can have any desired length and/or width. For example, the faceplate can include length27and/or width28of about 3-8 inches (e.g., at least/no more than about 3, 3.5, 4, 4.5, 5, 5.5, 6, 6.5, 7, 7.5, or 8 inches). The term “length” refers to the longest horizontal distance of the faceplate. The term “width” refers to the longest vertical distance of the faceplate, such as in the use position. Faceplate25can also include thickness29of about 0.1-0.4 inches (e.g., at least/no more than about 0.1, 0.2, 0.3, or 0.4 inches). The term “thickness” refers to the distance between the front and opposed rear faces2,3of the faceplate, as shown inFIG.2c. However, the faceplate is not limited and can have any desired dimensions. Faceplate25can be constructed from any desired material, such as (but not limited to) plastic, metal, glass, stone, ceramics, and the like. Optionally, the faceplate can include one or more aesthetically pleasing features. For example, front face2of the faceplate (e.g., the surface that the user sees and interacts with) can have any desired color, pattern, decorative shape, or combinations thereof. A shown inFIG.3d, bottom face32of the housing includes one or more supports33that provide a foundational surface for at least one insert. In addition, channels34are formed between adjacent supports. The channels act as passageways, allowing the first end of a charging cable to reach a corresponding device port, as described below. Channels34and/or supports33can have any desired size and/or shape. While configured as rectangular in shape, housing30can have any desired configuration. The housing can be constructed from any durable material, such as (but not limited to) plastic, metal, wood, or combinations thereof. The assembly housing typically includes a mounting bracket (or some other attachment element) that allows the housing to be attached to the supporting wall. However, this is not required. FIG.4aillustrates one embodiment of an electrical receptacle40comprising one or more sockets, adapted to be mounted within housing30. The socket module provides one or more AC (alternating current) receptacles10accessible via faceplate opening35a. The AC receptacles are conventional connectors that accept the prongs of inserted plugs and deliver current to AC powered equipment. Power is supplied to the electrical socket module via a standard connection to a power grid (such as being hard wired to a building electrical circuit). In some embodiments, the rear face of the housing includes at least one aperture4that allows wiring to run from the power grid to attach to the terminals of the socket. In some embodiments, wiring can be connected to the AC/DC converter, and then to the socket and/or charging cable20, thereby providing power. The wiring is secured to the terminals of the socket, as would be known in the art.FIG.4billustrates one embodiment of the rear face of the housing comprising apertures4. Each aperture can include removable cut-out11that can be easily punctured to expose the aperture so that wiring can pass into/from the housing, as shown. The electrical housings are therefore retained within first compartment. For safety, receptacle10can optionally include a grounded conductor to reduce the risk of injury or death by electric shock. In some embodiments, each receptacle10can provide up to 15 amperes and 125 volts of electricity to inserted plugs. However, the presently disclosed subject matter is not limited and each receptacle can provide greater or less than about 125 volts of electricity. AlthoughFIG.4aillustrates a North American 15 A/125 V (NEMA-5) grounded AC electrical receptacle, it should be noted that any AC electrical plug configuration can be utilized. Further, the type of electrical receptacle can be dictated by the country and national standards legislation present therein. For example, suitable AC electrical plug configuration can be NEMA-1, JIS C 8303, Class II, CEE 7/16, CEE 7/17, BS 4573, BS 546, or any other AC electrical plug configuration capable of providing AC electricity. As shown inFIG.4a, receptacle40can include front face50(adjacent to faceplate25) and opposed rear face51. The outlet can further include sidewalls52, and top and bottom faces53,54. Further, any type of connector55can be used to permanently or releasably attach the receptacle to the housing. Such mechanisms are well known in the art. In addition to receptacle40, the interior of housing30also includes one or more inserts15positioned therein. One embodiment of insert15is illustrated inFIGS.5a-5c. As shown, each insert includes outer cover61that protects the insert interior components. The term “cover” includes any element that reels, encloses, and/or protects an interior spool and cable. The cover includes front face62that is accessible through housing aperture35b. The front face of the cover includes opening63defined by slot64through which the connective end of a USB cable (or any other desired cable) is extended. The cover also include interior configured to retain a spool of cable as described below. In some embodiments, insert15is permanently configured within the housing. However, the insert can be configured to be removably positioned within the housing using conventional mechanisms such as magnets, clips, fasteners, snap-fit attachment, pressure-fit attachment, and the like. For example, clip65can be used to slide insert15into the interior of the housing and retain it in place. When desired, a user can apply light pressure to remove the insert from the housing. In this way, a user can therefore replace the insert if desired. For example, a second insert with a different length of charger wiring can replace a first insert. Alternatively, a different style charger insert can be used to accommodate a new phone or device with different charging requirements. Each insert can have length66of about 0.5-3 inches (e.g., at least/no more than about 1, 1.25, 1.25, 1.75, 2, 2.25, 2.5, 2.75, or 3 inches). The insert can include width67of about 2-5 inches (e.g., at least/no more than about 2, 2.5, 3, 3.5, 4, 4.5, or 5 inches). Insert15can further includes thickness68of about 1-5 inches (e.g., at least/no more than about 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, or 5 inches). It should be appreciated that the dimensions of inserts15are not limited and have any desired length, width, and/or thickness. FIG.5dillustrates one embodiment of a holder that can be configured on the front face62of the insert. The holder can be configured to releasably retain the charging end of a cable. The holder can have any desired configuration, such as an indentation7that allows the charging end to be releasably attached. However, any mechanism can be used, such as (but not limited to) clips, fasteners, VELCRO®, ties, magnets, and the like. For example, the holder can include opening3in fluid connection to channel4sized and shaped to allow a cord to pass through from the spool and then be retained within the channel, as shown inFIG.5e. The charging end2can be retained in holder main body6which includes an indentation or other mechanism to hold the charging end. FIGS.6aand6billustrate one embodiment of representative charging cable20. As shown, the cable can be configured as a micro-USB Type B cable comprising connector70(power only) and cord length71. Connector70can be releasably attached to a device (e.g., a phone), providing charging capabilities. Length71can be stored within insert15when the cable is not in use. However, length71can be removed from the insert interior through slot64as needed by the user. The slot therefore allows a length of charging cable20to slide through the wall and out to the exterior environment so that the cable can be accessed by a user. However, the slot is small enough that connector70cannot fit through the slot and is maintained external to cover31. The USB cable is therefore both externally accessed and internally stored. The size of slot64can be designed according to the size of a corresponding cable and connector70. In some embodiments, the cover can include a mount to protect connector70from freely swinging and becoming damaged. It should be appreciated that any desired cable can be used. For example,FIG.6cillustrates one embodiment of a 2-pin female connector75(e.g., of the type manufactured by JST Sales of America, Model XHP-2). The cable can include 2 jumper lead wires76(22 AWG) socket to socket ends. The lead wires can connect cables to only two terminals directly next to each other on either the left or right side of the 4-pin female connector77. FIG.6dillustrates an embodiment of cable20with stripped ends78and a pair of jumper lead wires79(22 AWG) socket to socket (of the type manufactured by JST Sales America, Model No. ASXZHSXH22K203). As shown at80no wire is installed in the center connector slot. The cable includes a 3-pin female connector81. FIGS.6eand6fillustrate one embodiment of cable20configured with USB type C connector82and tinned magnet wires83. The cable can include insulation resistance of about 10 MOhm/300 VDC. In some embodiments, the minimum number of pins may be preferred to for the USB Type C connector to allow for power transfer and to reduce costs. The cable can include first conductor83connected to power (which can be red in some embodiments) and second conductor84connected to ground (GND) (which can be black in some embodiments). Thus, cable20can be configured as a USB (Universal Serial Bus) port, mini-USB port, micro-USB port, micro USB-C, lightning connector, etc. The term “USB port” refers to an industry standard interface port. Mini and Micro-USB ports are smaller than conventional USB ports. The term “lightning connector” refers to a computer bus and power connector used to connect Apple® mobile devices (e.g., iPhones®, iPads®, iPods®, etc. to host computers, external monitors, camera, USB battery chargers, and other peripherals). Each receiving port operates independently from the electrical socket module and from adjacent receiving ports. Each receiving port therefore functionally includes its own power supply and can be configured to supply about 1-5 volts, providing constant and isolated power as requested by a connected device. However, it should be appreciated that the receiving port can supply greater than 5 volts of electricity in some embodiments. Within the interior of cover31, a length of cable20is wound around spool85positioned within the interior of insert15. The spool can retain any desired amount of cable, such as about 1 foot, 5 feet, 10 feet, or more. The term “spool” refers to a cylinder around which a cable can be wound (e.g., a reel). Spool85can have any desired configuration. For example, the spool can include inner cylinder90and two opposing ends95with a diameter larger than the cylinder to enable a length of cable to be wound around the cylinder, as shown in the embodiment ofFIGS.7a-7c. However, the presently disclosed subject matter is not limited and the spool can have any configuration. In some embodiments, spool85can include diameter100of about 1-5 inches (e.g., at least/no more than about 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, or 5 inches). The spool can also include thickness105(e.g., the distances between the two opposing ends95) of about 0.25-2 inches (e.g., at least/no more than about 0.25, 0.5, 0.75, 1, 1.25, 1.5, 1.75, 2 inches). However, the spool can be configured with any desired diameter and/or thickness. Cable20is wound around the spool and can be stored until use, with the connector end maintained external to the insert cover and extending through slot64. The plug end of cable20(at the end opposing the connector end) extends through a notch in the cover and travels through channel34to access a port or power supply in the wall or a separate power supply (such as a converter) or battery. Thus, one end of a power cord can be coupled to the converter via an opening in the rear face of the housing. The opposite end of the charging cord includes a plug that is configured to be inserted into a device for charging. In some embodiments, cable20is retractable. The term “retractable” refers to the ability of the cable to extend from spool85upon stretch (e.g., a pulling force from a user) and retract back onto the spool upon release. Any known retractable mechanism can be used. For example, spool85can include a spiral spring that provides a retraction force for rotating the spool. In this way, extended cable20can be retracted back into the insert interior (e.g., rewound around the spool). Thus, the retracting mechanism allows cable20to be unwound from spool85when the cable is pulled or extended away from housing30through slot64. When a desired length of cable has been extended away from the housing, the retracting mechanism can be locked into place. For example, if a user needs 2 feet of length of cable, 2 feet can be unwound from spool85and locked into place. In some embodiments, the spool can lock when a user stops pulling cable20from the housing. A user can unlock the retracting mechanism by pulling cable20beyond the locked position and releasing the tension caused by pulling the cable beyond the locked position. A spring or tension mechanism can be used to retract the cable into the interior of insert15(e.g., around spool70) for storage and concealment. For example, the retracting mechanism can include a wheel with one or more teeth positioned around at least a portion of the wheel circumference. The wheel can be positioned around the axle of spool85. A locking component can engage with the teeth to lock the wheel into place (and thus retract cable20). The wheel in combination with a coiled spring or any other tension mechanism can allow the cable to be locked into a desired position. It should be appreciated that the presently disclosed subject matter is not limited to configurations that include a wheel and spring. Rather, any known elements that can retract and/or lock cable20can be used. Insert15is positioned within housing30using any known mechanism, such as (but not limited to) clip65. For example, magnets, hook-and-loop closure, pressure fit attachment, snap-fit attachment, and/or the use of mechanical elements (clips, fasteners, screws, bolts, etc.) can be used. In this way, replacement of the insert components (e.g., spools and cables) can be easily accomplished. As mentioned above, in some embodiments the insert can be removed from housing30and interchanged with a different insert (e.g., one with a different spool). Alternatively, spool85can be removed from the insert or housing and replaced with a corresponding replacement spool. The replacement spool can include the same type of charging cable or can differ from the original cable with regard to length, type, and the like. Assembly5can include any number of inserts (and thus any number of cables20), such as about 1-10. For example, an assembly that includes 2 inserts will allow a user to charge two devices at the same time. It should be appreciated that the presently disclosed subject matter is not limited and assembly5can have greater than 10 inserts, depending on market requirements. In use, assembly5can be customized by providing one or more inserts and/or socket receptacles as desired by the user. One or more desired inserts15can be added to housing30. Specifically, each insert can include any suitable charging cable to accommodate a desired device (e.g., an iPhone®, Android®, gaming assembly, tablet, PDA, etc). The plug end of the cable exits each insert15and is connected to a receiving port located in the wall or in a converter via channel34. The housing can then be recessed into wall21. Connector75of each cable extends through cover slot65of the insert to allow access by a user. Faceplate25can then be added over the housing to create a flush appearance to wall21. One or more connective charging ends of the assembly are therefore available and accessible by the user when needed. In addition, sockets10are also available when electrical connection is needed (e.g., by plugging the prongs of an electrical device into the outlet). For example, when the USB charging cable is in use, the cable connector can be grasped by the user and a light pressure is applied, as shown in step120ofFIG.8. In response to the pressure, a length of the cable is unwound from spool85. After a desired amount of cable has been extended from the housing, the user ceases pressure to lock the cable in position. The connector can then be releasably attached to a device to be charged at steps121and122. After a desired amount of time, the user can detach the connector from the associated device. The cable can then retract around spool85to the storage position, leaving the connector accessible for later charging at step123. The steps can be repeated as needed to charge multiple devices. The disclosed assembly offers many advantages over prior art systems. For example, because an electronic assembly can be charged via one or more cables20, no separate chargers are required. Accordingly, users are no longer required to carry around bulky chargers when they travel or leave home. The disclosed assembly can be customized by a user, such as by replacing each charging insert with a different type of charging cable. Assembly5therefore eliminates the need for all external accessories for charging a device. The user does not need a separate cable because the circuitry included within the disclosed assembly can charge any combination of devices, such as phones, tablets, gaming devices, and the like. The disclosed wall outlet with integrated charge circuitry is therefore capable of charging most devices sold today. The cable can be easily retracted into the wall assembly for storage when not in use. If a user forgets or loses a charger, the corresponding device can still be easily and conveniently charged using assembly5. Assembly5can be easily retrofitted to existing outlet designs. For some examples, wall aperture22can be enlarged as needed to fit the assembly. Further, the disclosed assembly can be customized to accommodate two (or more) different charging mechanisms. For example, the assembly can be customized to include a first spool of cable suitable to charge an iPad® and a second spool of cable suitable to charge an Android® phone. Assembly5provides a streamlined look to a surrounding environment, eliminating the cluttered look of adaptors and cords. The presently disclosed subject matter is not limited to the embodiments set forth herein. It will be understood that modifications and variations are encompassed within the spirit and scope of the invention. Accordingly, the invention is limited only by the following claims. | 26,679 |
11942735 | DETAILED DESCRIPTION The present invention is described with reference to the accompanying drawings, in which certain embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments that are pictured and described herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. It will also be appreciated that the embodiments disclosed herein can be combined in any way and/or combination to provide many additional embodiments. Unless otherwise defined, all technical and scientific terms that are used in this disclosure have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the below description is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this disclosure, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that when an element (e.g., a device, circuit, etc.) is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present. Referring now to the drawings, an assembly of ganged connectors, designated broadly at100, is shown inFIG.1. The assembly100comprises an equipment connector assembly105having five connectors (not shown inFIG.1—seeFIGS.2and9) mating with a cable connector assembly140having five connectors150contained within a shell160. As shown inFIG.1, the equipment connector assembly105is maintained in a mating configuration with the cable connector assembly140via a toggle assembly85that includes a latch86. The shell160, connectors150and toggle assembly85are discussed in detail in U.S. Patent Publication No. 2019/0363481, supra, and need not be discussed in detail herein. The cable connector assembly140includes five cables in a cruciform arrangement, four of which (designated at142) are of a larger size (e.g., a ⅜ inch cable) than a fifth cable142a(e.g., a ¼ inch cable). The cable142ais located at the center or intersection of the “cross” formed by the cables142,142a. The five connectors150are also arranged in a cruciform arrangement: four of the connectors (designated150) are attached to the larger cables142, and one of the connectors (designated150a) is shorter in overall length and is attached to the smaller cable142a. The smaller cable142aand smaller connector150amay be employed in the center port position, and is typically used for calibration purposes. The cable connector assembly140includes a multi-piece strain relief boot170. As shown inFIGS.2-12, the strain relief boot170includes two cover pieces171,172and two inner braces173,174. These are described in greater detail below. Referring now toFIGS.5and6, the cover piece171includes two adjacent arced sections175that meet at a wall176. At their free ends, the arced sections175include latches177. The inner surface of the wall176includes a curved surface178, and a cutout179is present below the curved surface178to form a shoulder178a. Ridges199extend radially inwardly from the upper edges of the arced sections175. Referring now toFIG.7, the cover piece172is similar to the cover piece171, with the exception that it lacks the latches177; instead, the cover piece172has recesses180positioned to receive the latches177, and further includes slots181that receive the hooks of the latches177. Also,FIG.7shows that each of the arced sections175of the cover piece172have recesses182that extend over much of the inner surface of the arced sections175near their lower ends (such recesses are also present in the cover piece171and are visible inFIG.5). Referring now toFIGS.3and4, each of the braces173,174(which in the illustrated embodiment are identical) has a four-sided base183, wherein one of the sides has a flat wall184, two of the sides have opposed concave walls185, and the fourth side opposed to the flat wall184has a concave wall186that also includes wings188. Each brace173,174also includes a concave capture section187that extends from a respective one of the concave walls185; each of the capture sections187is offset radially outwardly from its underlying concave wall185. Each capture section187includes a cutout189on its side edge above the flat wall184. As can be envisioned fromFIGS.2and8-12, the strain relief boot170is assembled on the cables142,142a, connectors150,150aand shell160such that the braces173,174are positioned on opposite sides of the central cable142a, and the cover pieces171,172come together to be positioned on opposite sides of the cables142. More specifically, each of the braces173,174is positioned with its concave wall186engaging the central cable142aand its concave walls185adjacent a respective cable142. One end of each brace173,174contacts a flange151on each of the connectors150(seeFIG.9). At its opposite end, the capture sections187of each brace173,174engage and capture the jacket of a respective cable142(FIG.9). Each of the wings188of the braces173,174confronts a wing188of the other brace174,173(FIG.8). Once the braces173,174are in position, the cover pieces171,172are brought together to form an outer shell for the strain relief boot170. As can be envisioned by reference toFIGS.1and2, the cover pieces171,172are positioned on opposite sides of the cables142,142aand aligned so that the latches177of the cover piece171slide into the recesses180of the cover piece172until the hooks of the latches177reach and enter the slots181. In this position, each of the arced sections175of the cover pieces171,172partially surrounds a respective cable142. The shoulder178aof each cover piece171,172engages the ends of the adjacent wings188of the braces173,174, thereby maintaining the braces173,174in position (seeFIG.11). Also, a radially-outward projection144of each connector142is captured within the recesses182of the cover pieces171,172, which prevents the attached cover pieces171,172from being separated from the connectors150,150aby sliding movement along the cables142,142a(seeFIG.12). Further, the ridges199of the cover pieces171,172overlie the upper edges of the capture sections187of the braces173,174and fit within the cutouts189, and are also positioned to engage the jackets of the cables142. The configuration illustrated and described herein provides a protective structure over the cable/connector interfaces while enabling each of the connectors150,150ato “float” axially relative to the strain relief boot170, and to do so independently of the other connectors150,150a. As can be seen inFIG.8, the central connector150ais free to float axially relative to the concave walls185and wings188. The remaining connectors150are free to float axially relative to the cover pieces171,172and braces173,174because each projection144is free to move axially within the recesses182(seeFIG.12). Thus, the cable connector assembly140can permit axial float for each of the connectors150,150a(which are already configured to float axially relative to the shell160) while still providing its protective function. In addition, the strain relief boot170is configured such that the stress experienced in one of the cables142,142adue to movement of one of the connectors150,150arelative to the shell160is absorbed by the adjacent cables142,142a(as opposed to either the shell160or the individual port connector bodies, as in a typical cable strain relief). It may be impractical, costly and complex to attach combine the strain relief and the shell160, passing the strain to the individual port connector bodies may result in an unstable interface. The cover pieces171,172and braces173,174may be formed of a number of suitable materials. In some embodiments, these components comprise a relatively rigid polymeric material, such as glass-filled Nylon 6,6. The foregoing is illustrative of the present invention and is not to be construed as limiting thereof. Although a few exemplary embodiments of this invention have been described, those skilled in the art will readily appreciate that many modifications are possible in the exemplary embodiments without materially departing from the novel teachings and advantages of this invention. Accordingly, all such modifications are intended to be included within the scope of this invention as defined in the claims. The invention is defined by the following claims, with equivalents of the claims to be included therein. | 8,875 |
11942736 | DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, appropriate embodiments of the present disclosure will be described with reference to the drawings. The drawing to be used is for convenience of description. In addition, the embodiments which will be described below do not inappropriately limit the contents of the present disclosure described in the claims. In addition, not all of the configurations which will be described below are necessarily essential components of the disclosure. 1. Present Embodiment 1-1. Schematic Configuration of Printing System FIG.1is a view illustrating a schematic configuration of a printing system1according to the present embodiment. The printing system1is used in a store, for example, and has a function of performing accounting according to products and services purchased by a customer, a function of informing the customer of information related to accounting, and a function of issuing a receipt according to the accounting. For example, the printing system1is an example of a point of sale (POS) system. The printing system1includes a printing apparatus2, a smart device3a, a customer display3b, and a handy scanner3c. The printing system1may have a configuration in which some of these elements are omitted or changed, or other elements are added. The printing apparatus2is supplied with electric power by being coupled to, for example, a commercial AC power source (not illustrated) via a power cable5. The printing apparatus2to which the electric power is supplied performs printing on a medium P, and the medium P is discharged from a medium discharge port13. In other words, the printed recording part of the medium P is discharged from the medium discharge port13. The smart device3a, the customer display3b, and the handy scanner3care examples of external devices that can be coupled to the printing apparatus2via a USB interface60included in the printing apparatus2, as will be described later. Specifically, the smart device3ais coupled to the printing apparatus2via a USB cable4a, the customer display3bis coupled to the printing apparatus2via a USB cable4b, and the handy scanner3cis coupled to the printing apparatus2via a USB cable4c. AlthoughFIG.1illustrates an example in which the smart device3a, the customer display3b, and the handy scanner3care coupled to the printing apparatus2, the number of external devices that can be coupled to the printing apparatus2is not limited to three. For example, the number of external devices that can be coupled to the printing apparatus2depends on the USB standard. According to the USB standard, the maximum number of external devices that can be coupled is 127, and thus the maximum number of external devices that can be coupled to the printing apparatus2is 127. The smart device3ais a terminal that can be carried by the user. For example, the smart device3ais a tablet terminal or a smartphone, and the smart device3aincludes a communication section that performs data communication according to a predetermined communication standard, and communicates with the printing apparatus2via this communication section. Here, unless otherwise specified, the user refers to a salesclerk who provides products or services to customers, or a trader who installs the printing system1in the store, and sets external devices such as the printing apparatus2and the smart device3a. The smart device3aincludes a battery and operates by the electric power charged in the battery. The smart device3ais supplied with electric power from the printing apparatus2to charge the battery. Further, the smart device3ais equipped with various applications for generating commands, print data, and the like for controlling the printing apparatus2. For example, the application mounted on such the smart device3ais an application corresponding to the POS system. The smart device3atransmits a command related to control and a command related to printing to the printing apparatus2. Upon receiving these commands, the printing apparatus2stores these commands in a receiver buffer (not illustrated). The control-related command includes, for example, a setting command for instructing format setting and a status request command for instructing a request for information related to the state of the printing apparatus2. In response to this status request command, for example, the printing apparatus2transmits information indicating that printing is completed to the smart device3a. The command related to printing includes, for example, a print command for instructing printing, a line feed command for instructing line feed, a line stack command for instructing line stack, a cutter command for instructing to cut the medium P, and the like. The command related to printing includes a command for instructing drive to any of a thermal head21, a transport section23, and a cutting section24illustrated inFIG.2. The smart device3agenerates print data such as letters and images to be printed by the printing apparatus2. The smart device3atransmits a print command including the generated print data to the printing apparatus2according to a predetermined communication standard. The printing apparatus2executes a print command and prints letters, images, and the like on the medium P based on the print data. The customer display3bcan be used, for example, by placing the customer display3bon a counter table in a store. The customer who purchased the product at the store can confirm the price displayed on the customer display3band recognize the payment amount. Further, the customer display3bmay display the product name purchased by the customer, the payment method, the date and time of purchase, the name of the store where the customer purchased, and the like. For example, when accounting and payment of purchased items by the customer himself or herself, such as a so-called self-checkout, the salesclerk who is the user may omit the customer display3bfrom the printing system1. In this case, it is preferable that the content displayed on the customer display3bbe displayed on the smart device3a. For example, it is preferable that the product name purchased by the customer, the payment method, the date and time of purchase, the name of the store where the customer purchased, and the like be displayed on the smart device3a. In this manner, the salesclerk who is the user can reduce the power consumption of the printing system1by omitting the customer display3band reducing the number of external devices depending on the situation, and can simplify the configuration of the printing system1. The handy scanner3coperates by receiving electric power supplied from the printing apparatus2. The printing apparatus2inputs information related to the image scanned by the handy scanner3c. For example, the user scans a barcode attached to the product using the handy scanner3c. Information related to the scanned image is output to the smart device3avia the printing apparatus2. The smart device3acan acquire information related to a product, information related to the price, and the like. Further, for example, a salesclerk who is a user scans a barcode presented by a customer by a smartphone or the like using the handy scanner3c. Information related to the scanned image is output to the smart device3avia the printing apparatus2. The smart device3acan acquire information related to a payment method, information related to the payment amount, and the like. Based on these pieces of information, the smart device3amay complete the payment of the fee via the online payment service and display the information related to the payment completion on the customer display3bvia the printing apparatus2. Accordingly, the customer to confirm that the payment is completed. 1-2. Function of Printing System The functional configuration of the printing system1will be described with reference toFIG.2.FIG.2is a block diagram of the printing system1. The printing system1includes an external device10a, an external device10b, an external device10c, an external device10d, an external device10e, and the printing apparatus2. The smart device3a, the customer display3b, and the handy scanner3cdescribed above are examples of the external device10a, the external device10b, the external device10c, the external device10d, and the external device10e. The printing apparatus2includes a display section11, a power supply circuit12, a medium discharge port13, a printing section20, and a control section30. The display section11includes, for example, a plurality of LEDs. The display section11is electrically coupled to the control section30and is controlled by the control section30. The display section11displays, for example, information related to the state of the printing apparatus2by blinking the LED. The display section11may be a liquid crystal display device. The power supply circuit12can supply electric power to the display section11, the printing section20, and the control section30. The power supply circuit12is coupled to, for example, a commercial AC power source, and can convert the electric power supplied from the commercial AC power source into appropriate electric power and supply the converted electric power to each section. The power supply circuit12includes, for example, a DC-DC converter, a resistance element, a switching element, a transistor, and the like. The power supply circuit12can supply electric power to the external device10a, the external device10b, the external device10c, the external device10d, and the external device10eelectrically coupled to the printing apparatus2via the USB interface60. For example, the power supply circuit12can supply electric power to the smart device3a, the customer display3b, and the handy scanner3c. The printing section20includes the thermal head21and a printing head driving section22. Further, the printing section20is electrically coupled to the transport section23and the cutting section24. The transport section23has a transport roller (not illustrated), and the cutting section24has a cutter including a first blade and a second blade. The first blade is a movable blade that moves between the standby position and the cutting position, and the second blade is a fixed blade that engages with the first blade that moves to the cutting position to cut the recording paper. The printing section20is electrically coupled to the power supply circuit12and operates by receiving electric power supplied from the power supply circuit12. Further, the printing section20is controlled by the control section30. Further, the printing section20performs printing on the medium P based on the print data output from the smart device3a, which is an example of the external device, for example. As described above, an example of an electronic device including the printing section20that performs printing on the medium P is the printing apparatus2. The thermal head21has a large number of heat generating elements25. A large number of heat generating elements25are arranged in a direction orthogonal to the transport direction of thermosensitive roll paper26which is the medium P. The heat generating element25is energized to apply heat to the printed surface of the thermosensitive roll paper26. Accordingly, the thermal head21can print letters, images, and the like on the thermosensitive roll paper26. The part drawn out from the thermosensitive roll paper26may be described as recording paper. Further, the printing section20is not limited to printing by the thermal head21, and may perform printing by an ink jet method, an impact dot matrix method, or a laser method. The medium P is not limited to the thermosensitive roll paper26, but may be a sheet paper, a label paper, or the like. The printing head driving section22is controlled by the control section30to control the energization of the thermal head21to the heat generating element25. The transport section23is controlled by the control section30to rotate the transport roller to transport the thermosensitive roll paper26. The cutting section24is controlled by the control section30and drives the first blade to slide toward the second blade to cut the thermosensitive roll paper26. FIG.3is a block diagram of the control section30of the printing apparatus2. As illustrated inFIG.3, the control section30includes a central processing unit (CPU)31, a random access memory (RAM)32, a read only memory (ROM)33, a USB controller34, a non-volatile memory35, a wireless communication section36, a USB communication section50, a BUS-IF37, a device IF38, and an image processing section39. The CPU31is an example of a control circuit. Although the CPU is exemplified as an example of the control circuit, the control circuit may be configured to include hardware such as field programmable gate array (FPGA) in place of the CPU or in addition to the CPU. The CPU31performs the main control of the printing apparatus2. The CPU31is electrically coupled to the RAM32, the ROM33, the USB controller34, the non-volatile memory35, the wireless communication section36, the USB communication section50, and the BUS-IF37via a system bus41. The RAM32is a memory that can be read and written at any time to provide a work area of the CPU31. The RAM32can also be used as an image memory for temporarily storing image data. The ROM33is a boot ROM and stores a boot program of the system. The non-volatile memory35stores system software, set value data, and the like that need to be retained even after the power supply of the printing apparatus2is cut off. The USB controller34controls the USB interface60via the system bus41. In other words, the USB controller34controls the external device10a, the external device10b, the external device10c, the external device10d, and the external device10ecoupled to the USB interface60. For example, the USB controller34may be configured to include hardware such as a system on a chip (SoC). The wireless communication section36can be coupled to an external device by using wireless communication. The wireless communication section36can communicate with an external device according to a standard such as Wi-Fi (registered trademark) or Bluetooth (registered trademark). The BUS-IF37is an interface that electrically couples the system bus41and an image bus42. The BUS-IF37can operate as a bus bridge that transforms the data structure. In addition to the BUS-IF37, the device IF38and the image processing section39are electrically coupled to the image bus42. The device IF38is an interface that couples the control section30, the printing section20, and the display section11. The device IF38can perform data synchronous and asynchronous conversion. The image processing section39can execute predetermined processing on the data related to printing output to the printing section20. 1-3. USB Interface FIG.4is a block diagram of the USB communication section50and the USB interface60.FIGS.5to9are views illustrating each interface included in the USB interface60. As illustrated inFIG.4, the USB communication section50includes the USB interface60, a USB hub53, and a PD controller54. The USB hub53is electrically coupled to the USB interface60. Further, the USB hub53receives an instruction from the USB controller34via the system bus41and operates between the USB controller34and the USB interface60. For example, the USB hub53may be configured to include hardware such as an integrated circuit. Further, the USB hub53serves as a line concentrator or a relay device in the USB network. The PD controller54performs a control to supply electric power corresponding to the USB power delivery (PD) standard described later to the external device10acoupled to a USB-Type-C interface60a. Further, the USB interface60includes USB-Type-C interfaces60aand60b, USB-Type-A interfaces60cand60d, and a USB-Type-B interface60e. InFIG.4, an example in which the USB-Type-C interface60ais coupled to the external device10a, the USB-Type-C interface60bis coupled to the external device10b, the USB-Type-A interface60cis coupled to the external device10c, the USB-Type-A interface60dis coupled to the external device10d, and the USB-Type-B interface60eis coupled to the external device10eis illustrated, but the present disclosure is not limited thereto. The USB interface60may include a USB interface of another standard such as mini-USB-Type-A or micro-USB-Type-A. The power supply circuit12illustrated inFIG.3has a first power supply circuit12aand a second power supply circuit12b. The first power supply circuit12asupplies electric power to the USB-Type-C interface60b, the USB-Type-A interfaces60cand60d, and the USB-Type-B interface60e. The first power supply circuit12amay be configured to supply electric power to the USB hub53. Further, the first power supply circuit12amay be configured not to supply electric power to the USB-Type-B interface60e. On the other hand, the second power supply circuit12bsupplies electric power to the USB-Type-C interface60a. The second power supply circuit12bmay be configured to supply electric power to the PD controller54. The USB-Type-C interface60awill be described with reference toFIG.5.FIG.5is a block diagram of the USB controller34and the USB-Type-C interface60a. The USB controller34includes a device controller341, a host controller342, and a dual role port (DRP) controller343. The USB-Type-C interface60ais controlled by the DRP controller343and the PD controller54of the USB controller34via the system bus41. The USB-Type-C interface60aincludes a VBUS terminal61a, a D+/D− terminal62a, and a configuration channel (CC) terminal63a. The DRP controller343controls data transmission/reception from the external device10acoupled to the USB-Type-C interface60a. The DRP controller343performs the data transmission control for transmitting data such as commands related to printing to the CPU31via the system bus41. The DRP controller343mediates mutual communication performed between the USB controller34and the USB interface60, for example, in synchronous serial communication or the like. The synchronous serial communication may be, for example, inter-integrated circuit (I2C) communication. The PD controller54can retain electric power profile setting information indicating the amount of electric power that can be supplied by the printing apparatus2. The PD controller54can execute step-up processing or step-down processing on the electric power supplied from the second power supply circuit12bbased on the setting information of the electric power profile by using a regulator (not illustrated). Accordingly, the printing apparatus2can supply a desired voltage to the external device10avia the VBUS terminal61a. The VBUS terminal61ais a so-called power input/output terminal. The VBUS terminal61ais a terminal for transmitting and receiving electric power to and from the external device10a. Therefore, electric power can be received between the printing apparatus2and the external device10a. The D+/D− terminal62ais a so-called data transmission/reception terminal. The D+/D− terminal62is a terminal for transmitting/receiving a data signal to and from the external device10a. Therefore, data signals can be transmitted and received between the printing apparatus2and the external device10a. The CC terminal63ais a so-called state identification terminal. The CC terminal63ais a terminal that identifies whether the D+/D− terminal62ais in a state where the data signal can be received from the external device10aor is in a state where the data signal can be transmitted to the external device10a. For example, the CC terminal63ais a terminal that identifies whether the VBUS terminal61ais in a state where electric power can be supplied from the external device10aor is in a state where electric power can be supplied to the external device10a. Therefore, the USB controller34can identify the state of the external device10a. Power delivery in the USB-Type-C interface60ais a standard defined by USB Power Delivery. Hereinafter, USB Power Delivery will be abbreviated as USB PD. The second power supply circuit12bcan supply the electric power corresponding to the USB PD standard to the USB-Type-C interface60a. For example, the second power supply circuit12bgenerates a voltage different from 5 V, 9 V, and 12 V, and supplies a plurality of different voltages to the external device10a. The second power supply circuit12bmay be configured to supply a constant current regardless of the voltage supplied to the external device10a, or may be configured to supply a different current depending on the supplied voltage. The USB-Type-C interface60atransmits information related to electric power, direction, and function to be supplied or received between the printing apparatus2and the external device10abefore starting the USB PD. With USB PD, electric power can be supplied or received based on the contact between coupled devices. The port that supplies electric power is a source, and the port that receives electric power is a sink. The device that functions as a source is a provider, and the device that functions as a sink is a consumer. The USB-Type-C interface60acan change the amount of electric power supplied according to the situation, and can change the supply or reception of electric power. For example, when the printing apparatus2is a source, the external device10acoupled to the USB-Type-C interface60ais a sink. In addition, when the printing apparatus2is a sink, the external device10acoupled to the USB-Type-C interface60ais a source. Next, an example of the power delivery processing in the USB-Type-C interface60awill be described. The source checks the ID of the USB-Type-C cable coupled to the USB-Type-C interface60ato confirm whether a current exceeding3A can flow. The source informs the sink of the available electric power profiles. The sink requests the desired profile by number from the available electric power profiles notified by the source. The source informs that the requested electric power profile is available. After this, the source turns on the VBUS terminal61aand starts supplying electric power to the sink. Next, the USB-Type-C interface60bwill be described with reference toFIG.6.FIG.6is a block diagram of the USB controller34and the USB-Type-C interface60b. The USB-Type-C interface60bincludes a VBUS terminal61b, a D+/D−terminal62b, and a CC terminal63b. The configuration of the USB-Type-C interface60bis the same as the configuration of the USB-Type-C interface60adescribed above. However, unlike the USB-Type-C interface60a, the USB-Type-C interface60bis supplied with electric power not from the second power supply circuit12bbut from the first power supply circuit12a. Since the USB-Type-C interface60bhas the CC terminal63blike the USB-Type-C interface60a, it is possible to identify the state of the external device10bcoupled to the USB-Type-C interface60b. Therefore, the USB-Type-C interface60bcan identify the state of the external device10b, and can transfer electric power and transmit/receive data. However, unlike the USB-Type-C interface60a, the USB-Type-C interface60bis supplied with electric power from the first power supply circuit12aand is not controlled by the PD controller54. Therefore, the electric power corresponding to the USB PD standard cannot be supplied to the external device10bcoupled to the USB-Type-C interface60b. Further, the voltage that the first power supply circuit12acan supply to the external device10bvia the USB-Type-C interface60bis one type. For example, the first power supply circuit12agenerates a voltage of 5 V and supplies the generated voltage to the external device10b. The first power supply circuit12amay be configured to supply a constant current to the external device10b, or may be configured to supply a different current depending on the external device10bcoupled to the USB-Type-C interface60b. The electric power that can be supplied from the first power supply circuit12ais smaller than that of the second power supply circuit12b. Since the USB-Type-C interface60bsupplies less electric power than the USB-Type-C interface60a, for example, when an external device that corresponds to a certain USB PD is coupled to the USB-Type-C interface60b, the external device operates in accordance with the electric power supplied from the USB-Type-C interface60b. Therefore, it is preferable that the external device10bcoupled to the USB-Type-C interface60bbe a device that does not correspond to the USB PD. The first power supply circuit12ahas advantages that the power consumption is small and the heat generation amount is small as compared with the second power supply circuit12bthat supplies electric power to the USB-Type-C interface60acorresponding to the USB PD standard. Considering the power consumption and functions of an external device that may be coupled to the printing apparatus2, it is preferable that at least one of the first power supply circuit12aand the second power supply circuit12bcorrespond to USB PD. In other words, it is preferable that at least one of USB-Type-C receptacle connectors320aand320bcorrespond to the USB PD. When there are a plurality of receptacle connectors that correspond to USB-Type-C, it is preferable that at least one of the plurality of receptacle connectors correspond to the USB PD. Further, it is preferable that at least one of the first power supply circuit12aand the second power supply circuit12bnot correspond to the USB PD. It is preferable that at least one of the USB-Type-C receptacle connectors320aand320bnot correspond to the USB PD. For example, the first power supply circuit12athat does not correspond to the USB PD may supply electric power to, for example, the USB-Type-C receptacle connector320band USB-Type-A receptacle connectors320cand320d. In such a configuration, since the first power supply circuit12athat does not correspond to the USB PD supplies electric power to a plurality of types of receptacle connectors, the power supply circuit that supplies electric power to the receptacle connectors that do not correspond to USB PD can be commonly used. Accordingly, it is not necessary to increase the number of power supply circuits mounted on the substrate300illustrated inFIG.17, and thus the configuration of the substrate300can be simplified. Further, by simplifying the configuration of the substrate300, there is an effect that the heat generation amount in the substrate300is reduced. For example, when accounting is performed according to a product or service purchased by a customer, the salesclerk may operate the external device10aand the customer may operate the external device10b. In general, the customer needs fewer operations than the salesclerk, such as selecting a payment method, and thus it is preferable that the customer operate an external device having a simpler function than the salesclerk. In other words, it is preferable that the customer operate the external device10band the salesclerk operate the external device10athat consumes more power than the external device10b. Next, the USB-Type-A interface60cwill be described with reference toFIG.7.FIG.7is a block diagram of the USB controller34and the USB-Type-A interface60c. The USB-Type-A interface60cincludes the VBUS terminal61cand a D+/D−terminal62c. Unlike the above-described USB-Type-C interfaces60aand60b, the CC terminals63aand63bare omitted. Therefore, the USB-Type-A interface60cdoes not have a function of identifying the state of the coupled external device10c. The USB-Type-A interface60cis supplied with electric power from the first power supply circuit12a, and supplies electric power to the external device10cvia the VBUS terminal61c. For example, the voltage supplied to the USB-Type-A interface60cby the first power supply circuit12ais 5 V. Further, the USB-Type-A interface60ctransmits a signal to the external device10cvia the D+/D−terminal62c. The USB hub53electrically coupled to the USB-Type-A interface60cis controlled by the host controller342of the USB controller34via the system bus41. In other words, the USB-Type-A interface60cis controlled by the host controller342. Since the USB-Type-A interface60dillustrated inFIG.8has the same configuration as the USB-Type-A interface60cillustrated inFIG.7, the description thereof will be omitted. Next, the USB-Type-B interface60ewill be described with reference toFIG.9.FIG.9is a block diagram of the USB controller34and the USB-Type-B interface60e. The USB-Type-B interface60eincludes a VBUS terminal61eand a D+/D− terminal62e. Unlike the above-described USB-Type-C interfaces60aand60b, the CC terminals63aand63bare omitted. Therefore, the USB-Type-B interface60edoes not have a function of identifying the state of the coupled external device10e. The USB-Type-B interface60eis supplied with electric power from the first power supply circuit12a, and supplies electric power to the external device10evia the VBUS terminal61e. For example, the voltage supplied to the USB-Type-B interface60eby the first power supply circuit12ais 5 V. Further, the USB-Type-B interface60etransmits a signal to the external device10evia the D+/D−terminal62e. The USB-Type-B interface60eis controlled by the device controller341of the USB controller34via the system bus41. In other words, unlike the USB-Type-A interfaces60cand60d, the USB-Type-B interface60eis controlled from the USB controller34without going through the USB hub53. The USB-Type-B interface60emay be configured to be controlled from the USB controller34via the USB hub53. 1-4. Printing Apparatus A schematic configuration of the printing apparatus2will be described with reference toFIGS.10to12. InFIGS.10to12, the +X direction is the front direction of the printing apparatus2, the −X direction is the rear direction of the printing apparatus2, the +Y direction is the right direction of the printing apparatus2, the −Y direction is the left direction of the printing apparatus2, the +Z direction is the upward direction of the printing apparatus2, and the −Z direction is the downward direction of the printing apparatus2. The printing apparatus2is, for example, a thermal printer. As illustrated inFIG.10, the printing apparatus2has a main body case200having a rectangular parallelepiped shape as a whole, excluding uneven portions such as buttons. As illustrated inFIG.12, a bottom cover241and a back cover246of the printing apparatus2are attachable and detachable, and the main body frame208is covered with the bottom cover241and the back cover246. Inside the main body case200, a printing section20illustrated inFIG.2, a medium storage section210for storing the medium P, and a connector section220are provided. When the opening/closing door203is closed, the printed medium P is discharged from the medium discharge port13via a transport path formed between the opening/closing door203and the main body case200. The opening/closing door203constitutes the first case surface200aof the main body case200, and is coupled to be openable/closable behind the main body case200. InFIG.10, the first case surface200ais the front surface of the main body case200. The opening/closing door203is provided with, for example, a transport roller at the front end portion, and the transport roller is arranged to face the thermal head21provided in the main body case200when the opening/closing door203is closed. When the opening/closing door203is closed, the transport roller and the thermal head21are in a state of sandwiching the medium P, the medium P is transported by the rotation of the transport roller, and printing is performed on the printed surface of the medium P by the thermal head21. The display section11, the medium discharge port13, a power switch201, an opening/closing lever202, and a feed switch204are provided on the first case surface200aof the main body case200. In other words, the display section11, the medium discharge port13, the power switch201, the opening/closing lever202, and the feed switch204are arranged on the first case surface200aof the main body case200. Further, the connector section220is provided on a routing section215formed between a third case surface200cand a first main body frame surface205, facing a third case surface200cof the main body case200. InFIG.10, the third case surface200cis the bottom surface of the main body case200. As will be described later, the connector section220includes a substrate300provided with various receptacle connectors. The substrate300is parallel to the third case surface200cof the main body case200. For example, the substrate300is coupled to the main substrate accommodated inside the main body case200and is arranged to be parallel to the third case surface200cof the main body case200. The power switch201is a switch for turning on or off the power of the printing apparatus2. As illustrated inFIG.1, the printing apparatus2is coupled to a commercial AC power source via the power cable5and is supplied with electric power. The printing apparatus2performs printing on the medium P and communicates with an external device such as the smart device3awhile the power is on. The opening/closing lever202is for opening and closing the opening/closing door203. The user operates the opening/closing lever202to open the opening/closing door203, and stores the thermosensitive roll paper26, which is the medium P, in the medium storage section210provided in the main body case200. The opening/closing door203seals the medium storage section210from above. The feed switch204is a switch for feeding the thermosensitive roll paper26which is the medium P stored in the medium storage section210. Specifically, the user can feed the thermosensitive roll paper26to a desired position by operating the feed switch204. For example, the roll paper may be transported when the user is pressing the feed switch204, and the transport of the roll paper may be stopped while the user is not pressing the feed switch204. The display section11may display, for example, information related to the communication state, information for prompting the replenishment of the medium P, and the like. Since the display section11has a role of notifying the user of the state of the printing apparatus2, it is preferable that the display section11be provided at a position where the user easily visually recognizes the display section11. For example, when the printing apparatus2is arranged such that a second case surface200bof the main body case200faces the front surface, the user can easily visually recognize the display section11and the medium discharge port13. The medium discharge port13discharges, for example, the medium P on which letters, images, and the like are printed based on print data. As described above, for example, when the user is in the front direction of the printing apparatus2and the printing apparatus2is arranged such that the second case surface200bof the main body case200faces the front surface, the printed surface of the medium P faces the user, and thus the user can confirm the content printed on the medium P while observing how the medium P is discharged from the medium discharge port13. Therefore, the user can confirm the printed contents without waiting for the completion of the discharge of the medium P from the medium discharge port13. Therefore, it is preferable that the medium discharge port13be provided at a position where the user can easily visually recognize the medium discharge port13, like the display section11. Furthermore, it is more preferable that the medium discharge port13be provided near the display section11such that the user can visually recognize the medium discharge port13at the same time as the display section11. Specifically, it is preferable that the medium discharge port13and the display section11be provided side by side on the first case surface200aof the main body case200, and the longitudinal direction of the medium discharge port13and the display section11be the Y direction which is the width direction of the main body case200. As illustrated inFIG.11, the bottom cover241constituting the third case surface200cof the main body case200is attachable and detachable and covers the routing section215. The bottom cover241has a substantially rectangular shape. The bottom cover241has a plurality of elastic members251that serve as legs of the printing apparatus2. Further, the bottom cover241has a plurality of holes252. The hole252discharges water droplets that have entered the inside of the main body case200to the outside of the main body case200. Further, the printing apparatus2can be used by hanging the printing apparatus2on a wall in addition to using by placing the printing apparatus2on a table, a floor, or the like. At this time, the hole252engages with a wall-hanging member (not illustrated), and the printing apparatus2is hung on the wall. As a result, the printing apparatus2can be used in a so-called wall-hanging state, and the table or floor can be widely used. As illustrated inFIG.11, the back cover246constituting a fourth case surface200dof the main body case200is attachable and detachable and covers a second main body frame surface206. InFIG.10, the fourth case surface200dis the back surface of the main body case200. The back cover246has a substantially rectangular shape. The back cover246covers the main body frame208from the back. The back cover246has a cable draw-out port255for drawing out various cables coupling the printing apparatus2and various external devices. As illustrated inFIG.12, a fifth case surface200eand a sixth case surface200fof the main body case200are provided with a first attaching section271for mounting the bottom cover241. InFIG.10, the fifth case surface200eis the left side surface of the main body case200, and the sixth case surface200fis the right side surface of the main body case200. Similarly, the fifth case surface200eand the sixth case surface200fof the main body case200are provided with a second attaching section276for mounting the back cover246. The first attaching section271is formed at the lower end portions of the fifth case surface200eand the sixth case surface200fof the main body case200. The first attaching section271is provided with a case-side engaging section272. The bottom cover241is mounted to the main body case200by engaging the case-side engaging section272and a cover-side engaging section242provided on the bottom cover241. The second attaching section276is formed at the rear end portions of the fifth case surface200eand the sixth case surface200fof the main body case200. The second attaching section276is provided with a case-side engaging section277. The back cover246is mounted to the main body case200by engaging the case-side engaging section277and a cover-side engaging section247provided on the back cover246. Further, circular notch sections261and262are provided at the corners where the first attaching section271and the second attaching section276provided on the fifth case surface200eand the sixth case surface200fof the main body case200intersect with each other. Further, the notch sections261and262communicate with the routing section215. The routing section215is a space between the third case surface200cof the main body case200and the first main body frame surface205, and further, is a space defined by the fourth case surface200d, the fifth case surface200e, the sixth case surface200f, and the connector section220of the main body case200. The routing section215is defined with reference to the X direction, the Y direction, and the Z direction illustrated inFIGS.10to12. The X direction is defined as a direction from the back cover246to the first connector surface221and the second connector surface222of the connector section220, the Y direction is defined as a direction from the fifth case surface200eto the sixth case surface200fof the main body case200, and the Z direction is defined as a direction from the bottom cover241to the first main body frame surface205. The first connector surface221or the second connector surface222is a flat plate surface, and is, for example, sheet metal. The flat plate surface is not limited to a flat plate made of metal such as sheet metal, and may be a flat plate made of resin or the like. Various cables coupled to the connector section220are routed in the routing section215. Then, various cables coupled to the connector section220are drawn out to the outside of the main body case200via the notch sections261and262or the cable draw-out port255provided in the back cover246. The printing apparatus2can be installed in the first posture in which the medium discharge port13of the medium P faces upward, or in the second posture in which the medium discharge port13of the medium P faces forward. In other words, in the first posture, the printed medium P is discharged from the medium discharge port13in the +Z direction, and in the second posture, the printed medium P is discharged from the medium discharge port13in the +X direction. Further, in the first posture, the first case surface200ais the upper surface of the main body case200, and in the second posture, the first case surface200ais the front surface of the main body case200. Specifically, in the first posture, the connector section220is covered with the bottom cover241while in the second posture, the connector section220is covered with the back cover246. In both the first posture and the second posture, a plurality of elastic members251serving as legs of the printing apparatus2are arranged on the bottom surface of the printing apparatus2, and thus the printing apparatus2can be stably installed. Further, since the plurality of elastic members251are not arranged on the back surface of the printing apparatus2, the appearance of the printing apparatus2does not deteriorate. In a simpler configuration, only one of the bottom cover241and the back cover246that covers the connector section220may be attachable and detachable, and the other cover may be integrated with the main body case200. In this case, in the first posture, the cover covering the connector section220is the bottom surface, and in the second posture, the cover covering the connector section220is the back surface. As illustrated inFIG.12, the connector section220has the first connector surface221and the second connector surface222. The connector section220having the first connector surface221and the second connector surface222is formed of a flat plate, and the outer surface and the inner surface of the first connector surface221and the second connector surface222are formed to be flat. Here, unless otherwise specified, the flat plate is a sheet metal made of metal. The first connector surface221is formed with openings220a,220b,220c, and220d, and the second connector surface222is formed with openings220e,220f, and220g. As illustrated inFIG.13, openings corresponding to the USB-Type-C receptacle connector320aand320b, the USB-Type-A receptacle connector320cand320d, a USB-Type-B receptacle connector320e, a power supply connector320f, and a drawer kick (DK) receptacle connector320g, which are mounted on the mounting surface301of the substrate300, are formed on the first connector surface221and the second connector surface222. The opening220gmay correspond to a local area network (LAN) receptacle connector. The USB-Type-C receptacle connector320ais electrically coupled to the external device10aand can cause the external device10ato communicate with the control section30. Further, the USB-Type-C receptacle connector320ais provided on the substrate300, and the USB-Type-C receptacle connector320ais mounted on the substrate300such that the outer circumference of the insertion port coincides with the inner circumference of the opening220a. Accordingly, the concern that foreign matter such as dust and insects will enter the inside of the connector section220is reduced. The insertion port of the USB-Type-C receptacle connector320ais arranged along the first connector surface221. The USB-Type-C receptacle connector320bis electrically coupled to the external device10band can cause the external device10bto communicate with the control section30. Further, the USB-Type-C receptacle connector320bis provided on the substrate300, and the USB-Type-C receptacle connector320bis mounted on the substrate300such that the outer circumference of the insertion port coincides with the inner circumference of the opening220b. Accordingly, the concern that foreign matter such as dust and insects will enter the inside of the connector section220is reduced. The insertion port of the USB-Type-C receptacle connector320bis arranged along the first connector surface221. Further, the USB-Type-C receptacle connector320band the USB-Type-C receptacle connector320aare arranged next to each other. The USB-Type-C receptacle connectors320aand320bare provided with CC terminals, and unlike other USB standards, the master and the slave are not clearly fixed between the printing apparatus2and the external device10aand10bcoupled to the printing apparatus2. In other words, the printing apparatus2may receive a command from the external devices10aand10bto be operated, or may give a command to the external devices10aand10bto operate the external devices10aand10b. For example, the printing apparatus2may supply electric power to the external devices10aand10b. As described above, in the USB-Type-C standard, there is a possibility that the printing apparatus2may operate on either the master or the slave, and there is a possibility that the printing apparatus2operate as a master and a slave at the same time by providing a plurality of USB-Type-C receptacle connectors320aand320b, and thus the convenience of the user who uses the printing apparatus2is improved. The USB-Type-A receptacle connector320cis electrically coupled to the external device10cand can cause the external device10cto communicate with the control section30. Further, the USB-Type-A receptacle connector320cis provided on the substrate300, and the USB-Type-A receptacle connector320cis mounted on the substrate300such that the outer circumference of the insertion port coincides with the inner circumference of the opening220c. Accordingly, the concern that foreign matter such as dust and insects will enter the inside of the connector section220is reduced. The insertion port of the USB-Type-A receptacle connector320cis arranged along the first connector surface221. The USB-Type-A receptacle connector320dis electrically coupled to the external device10dand can cause the external device10dto communicate with the control section30. Further, the USB-Type-A receptacle connector320dis provided on the substrate300, and the USB-Type-A receptacle connector320dis mounted on the substrate300such that the outer circumference of the insertion port coincides with the inner circumference of the opening220d. Accordingly, the concern that foreign matter such as dust and insects will enter the inside of the connector section220is reduced. The insertion port of the USB-Type-A receptacle connector320dis arranged along the first connector surface221. The USB-Type-B receptacle connector320eis electrically coupled to the external device10eand can cause the external device10eto communicate with the control section30. Further, the USB-Type-B receptacle connector320eis provided on the substrate300, and the USB-Type-B receptacle connector320eis mounted on the substrate300such that the outer circumference of the insertion port coincides with the inner circumference of the opening220e. Accordingly, the concern that foreign matter such as dust and insects will enter the inside of the connector section220is reduced. The insertion port of the USB-Type-B receptacle connector320eis arranged along the second connector surface222which is different from the first connector surface221. The power supply connector320fis coupled to a commercial AC power source (not illustrated) to supply electric power to the control section30. Further, the power supply connector320fis provided on the substrate300, and the power supply connector320fis mounted on the substrate300such that the outer circumference of the insertion port coincides with the inner circumference of the opening220f. Accordingly, the concern that foreign matter such as dust and insects will enter the inside of the connector section220can be reduced. The insertion port of the power supply connector320fis arranged along the second connector surface222which is different from the first connector surface221. The DK receptacle connector320gis, for example, electrically coupled to a cash drawer270and causes the cash drawer270to communicate with the control section30. Further, the DK receptacle connector320gis provided on the substrate300, and the DK receptacle connector320gis mounted on the substrate300such that the outer circumference of the insertion port coincides with the inner circumference of the opening220g. Accordingly, the concern that foreign matter such as dust and insects will enter the inside of the connector section220can be reduced. The insertion port of the DK receptacle connector320gis arranged along the second connector surface222which is different from the first connector surface221. The inner circumferences of the openings220aand220b, the openings220cand220d, the openings220e, the openings220f, and the opening220gare respectively designed to coincide with outer circumferences of the USB-Type-C receptacle connectors320aand320b, the USB-Type-A receptacle connectors320cand320d, the USB-Type-B receptacle connector320e, the power supply connector320f, and the DK receptacle connector320g. Therefore, the outer circumference of the insertion port and the inner circumference of the opening coincide with each other, respectively. However, when an error occurs due to manufacturing, the inner circumferences of each opening and the outer circumferences of the connectors corresponding to the openings will substantially coincide with each other, but since it is not an error due to the design, the above-mentioned substantial coincidence will be included in the coincidence. The opening220aformed on the first connector surface221corresponds to the USB-Type-C receptacle connector320a, the opening220bformed on the first connector surface221corresponds to the USB-Type-C receptacle connector320b, the opening220cformed on the first connector surface221corresponds to the USB-Type-A receptacle connector320c, and the opening220dformed on the first connector surface221corresponds to the USB-Type-A receptacle connector320d. The opening220eformed on the second connector surface222corresponds to the USB-Type-B receptacle connector320e, the opening220fformed on the second connector surface222corresponds to the power supply connector320f, and the opening220gformed on the second connector surface222corresponds to the DK receptacle connector320g. Further, the connector section220is provided on the first main body frame surface205inside the third case surface200cconstituting the bottom surface of the main body case200. On the other hand, the medium discharge port13is provided on the first case surface200aconstituting the upper surface of the main body case200. As described above, since the connector section220is provided inside the bottom cover241constituting the bottom surface of the main body case200, which is the surface opposite to the upper surface of the main body case200in which the medium discharge port13is provided, the user cannot be visually recognized the medium P discharged upward from the medium storage section of the main body case200and the connector section220at the same time. In other words, the user cannot visually recognize the medium discharge port13and the connector section220at the same time. In other words, in a state where the user can visually recognize the medium discharge port13, the user cannot visually recognize the USB-Type-C receptacle connector320aand320b, the USB-Type-A receptacle connector320cand320d, the USB-Type-B receptacle connector320e, the power supply connector320f, and the DK receptacle connector320g. In other words, the user cannot visually recognize the medium discharge port13and the first connector surface221and the second connector surface222at the same time. When the normal printing apparatus2is used, the first main body frame surface205is often covered with the bottom cover241, the connector section220is not exposed to the outside, and the user cannot visually recognize the connector section220. However, when the bottom cover241is removed from the main body case200, the connector section220is exposed to the outside, and the user can visually recognize the connector section220. 1-5. Countermeasures Against Incorrect Insertion When the user uses, for example, a USB-Type-C cable400aillustrated inFIG.18and couples the external device10ato the printing apparatus2, the user removes the bottom cover241, and while visually recognizing the first connector surface221and the second connector surface222, by inserting a plug401aof the USB-Type-C cable400ainto the opening220aof the first connector surface221, the printing apparatus2is coupled to the external device10a. Specifically, the user puts the printing apparatus2in the second posture in which the first case surface200ais the front surface of the main body case200, then rotates the printing apparatus2to make the third case surface200cface the user. Then, the user removes the cover of the printing apparatus2, exposes the connector section220, and couples the USB-Type-C cable400ato the printing apparatus2. In such a case, since the connector section220faces the routing section215, the connector section220faces a direction orthogonal to the line of sight of the user, and it is difficult for the user to visually recognize the opening220aof the first connector surface221. As a result, the user inserts the cable into another opening, causing erroneous insertion. Further, the user may couple the USB-Type-C cable400billustrated inFIG.18to the connector section220with the second case surface200bof the printing apparatus2facing the user. In such a case, for example, another external device10bmay be newly coupled when the printing apparatus2is being used after the installation and initial setting of the printing apparatus2are completed. In this case, the second case surface200bof the printing apparatus2faces the user, and the user cannot visually recognize the first connector surface221and the second connector surface222. Therefore, the user confirms the position of each connector while touching the first connector surface221and the second connector surface222by hand. In other words, the user couples each cable to the connector section220in a so-called fumbling state without visually observing the connector section220. As a result, the user inserts the cable into another opening, causing erroneous insertion. Since the connector section220has the first connector surface221and the second connector surface222different from the first connector surface221, which are parallel to each other, even in a state where it is difficult for the user to visually recognize or in a fumbling state, the user can recognize the first connector surface221and the second connector surface222as different surfaces. FIG.13is a plan view of the first connector surface221and the second connector surface222of the connector section220. With reference toFIG.13, the erroneous insertion that may occur when coupling each cable to the connector section220in a state where it is difficult for the user to visually recognize or in a fumbling state, and countermeasures thereof will be described. The plugs401aand401bof the USB-Type-C cables400aand400bcan be inserted into the USB-Type-C receptacle connectors320aand320b, whereby the printing apparatus2is coupled to cause the external devices10aand10bto communicate with each other. Further, the plugs401aand401bof the USB-Type-C cables400aand400bcan be inserted into the USB-Type-A receptacle connectors320cand320d, but the printing apparatus2cannot cause the external devices10aand10bto communicate with each other. In other words, the shapes of the plugs401aand401bof the USB-Type-C cables400aand400bare different from the shapes of the USB-Type-A receptacle connectors320cand320d, but the printing apparatus2can be physically coupled to the external devices10aand10bby using the USB-Type-C cables400aand400b. However, the printing apparatus2and the external devices10aand10bare not coupled to communicate with each other. Further, the plugs401aand401bof the USB-Type-C cables400aand400bcan be inserted into the USB-Type-B receptacle connector320e, but the printing apparatus2cannot cause the external device10aor the external device10bto communicate with each other. In other words, the printing apparatus2can be physically coupled to the external device10aor the external device10bby using the USB-Type-C cables400aand400b, but the external devices10aand10bare not coupled to communicate with the printing apparatus2. As described above, since the shapes of the insertion ports are different, a state of being physically coupled and fixed is a state where the plugs401aand401bof the USB-Type-C cables400aand400bare erroneously inserted into the connector section220. Such erroneous insertion may occur, for example, in the USB-Type-A receptacle connectors320cand320d, the USB-Type-B receptacle connector320e, and the DK receptacle connector320g. When an erroneous insertion occurs, there is a concern about malfunction of the physically coupled external device, and failure or damage of the physically coupled external device. Similarly, there is a concern about malfunction, failure, and damage of the printing apparatus2to which these external devices are physically coupled. Furthermore, since there is a concern about damage to the receptacle connector into which the plugs401aand401bof the USB-Type-C cables400aand400bare erroneously inserted, the countermeasures described below will be taken. Further, it is considered that there is a high possibility of occurrence of such an erroneous insertion in a receptacle connector larger than the insertion port of the USB-Type-C receptacle connectors320aand320b. Although depending on the shape of the insertion port of the receptacle connector, the larger the insertion port, the higher the concern about erroneous insertion. The insertion port of the USB-Type-B receptacle connector320eis smaller than the insertion port of the DK receptacle connector320g. In addition, the insertion ports of the USB-Type-A receptacle connectors320cand320dare smaller than the insertion port of the DK receptacle connector320g. In other words, since the insertion port of the USB-Type-B receptacle connector320eis smaller than the insertion port of the DK receptacle connector320g, the concern about erroneous insertion into the USB-Type-B receptacle connector320eis relatively smaller than the concern in the DK receptacle connector320g. Further, since the insertion ports of the USB-Type-A receptacle connectors320cand320dare smaller than the insertion port of the DK receptacle connector320gor the USB-Type-B receptacle connector320e, the concern about erroneous insertion into the USB-Type-A receptacle connector320cand320dis relatively smaller than the concern in the DK receptacle connector320gor the USB-Type-B receptacle connector320e. The USB-Type-B receptacle connector320eis arranged between the USB-Type-C receptacle connectors320aand320band the DK receptacle connector320g. The concern about erroneous insertion into the USB-Type-B receptacle connector320eis smaller than the concern about erroneous insertion into the DK receptacle connector320g. In this manner, by arranging the USB-Type-B receptacle connector320ewith less concern about erroneous insertion between the USB-Type-C receptacle connectors320aand320band the DK receptacle connector320g, the concern about erroneous insertion into the DK receptacle connector320gis reduced. In addition, the USB-Type-A receptacle connectors320cand320dare arranged between the USB-Type-C receptacle connectors320aand320band the DK receptacle connector320g. The concern about erroneous insertion into the USB-Type-A receptacle connectors320cand320dis smaller than the concern about erroneous insertion into the DK receptacle connector320g. In this manner, by arranging the USB-Type-A receptacle connectors320cand320dwith less concern about erroneous insertion between the USB-Type-C receptacle connectors320aand320band the DK receptacle connector320g, the concern about erroneous insertion into the DK receptacle connector320gis reduced. In addition, the USB-Type-A receptacle connectors320cand320dare arranged between the USB-Type-C receptacle connectors320aand320band the USB-Type-B receptacle connector320e. The concern about erroneous insertion into the USB-Type-A receptacle connectors320cand320dis smaller than the concern about erroneous insertion into the USB-Type-B receptacle connector320e. In this manner, by arranging the USB-Type-A receptacle connectors320cand320dwith less concern about erroneous insertion between the USB-Type-C receptacle connectors320aand320band the USB-Type-B receptacle connector320e, the concern about erroneous insertion into the USB-Type-B receptacle connector320eis reduced. In other words, by arranging a receptacle connector with less concern about erroneous insertion between the USB-Type-C receptacle connectors320aand320band the receptacle connector with a concern about erroneous insertion of the plugs401aand401bof the USB-Type-C cables400aand400b, it is possible to reduce the concern of erroneous insertion of the plugs401aand401bof the USB-Type-C cables400aand400bby the user. Furthermore, it is preferable to arrange the power supply connector320fwhich cannot be erroneously inserted, between the USB-Type-C receptacle connectors320aand320band the receptacle connector with a concern about erroneous insertion of the plugs401aand401bof the USB-Type-C cables400aand400b. Further, the long side X of the insertion port of the USB-Type-C receptacle connectors320aand320band the long side Y of the insertion port of the USB-Type-A receptacle connectors320cand320dhave different directions from each other. In other words, the extending direction of the long side X of the USB-Type-C receptacle connectors320aand320bis different from the extending direction of the long side Y of the USB-Type-A receptacle connectors320cand320d. When the extending direction of the long side X of the USB-Type-C receptacle connectors320aand320bis the same as the extending direction of the long side Y of the USB-Type-A receptacle connectors320cand320d, since the long side Y is longer than the long side X and the short side y is longer than the short side x, the plugs401aand401bof the USB-Type-C cables400aand400bcan be inserted into the USB-Type-A receptacle connectors320cand320d, and there is a high concern about erroneous insertion. The long side X forming the insertion port of the USB-Type-C receptacle connectors320aand320bis a side extending in a direction parallel to the mounting surface301of the substrate300, and the short side x is an arcuate side extending in the direction intersecting with the long side X. The extending direction of the long side X of the USB-Type-C receptacle connectors320aand320bis different from the extending direction of the long side Y of the USB-Type-A receptacle connectors320cand320d, and accordingly, the concern about erroneous insertion is reduced. However, since there is a concern that the connector section220becomes large, it is desirable that the short side y of the USB-Type-A receptacle connectors320cand320dbe arranged on the mounting surface301of the substrate300, and the extending direction of the long side X of the USB-Type-C receptacle connectors320aand320band the extending direction of the long side Y of the USB-Type-A receptacle connectors320cand320dbe orthogonal to each other. In addition, a relationship in which the extending direction of the long side X of the USB-Type-C receptacle connectors320aand320band the extending direction of the long side Y of the USB-Type-A receptacle connectors320cand320dintersect with each other may be employed. In other words, it is desirable that the extending direction of the short side x of the USB-Type-C receptacle connectors320aand320band the extending direction of the short side y of the USB-Type-A receptacle connectors320cand320dbe orthogonal to each other or intersect with each other. Accordingly, the concern about erroneous insertion is greatly reduced. The short side y of the USB-Type-A receptacle connectors320cand320dis shorter than the long side X of the USB-Type-C receptacle connectors320aand320b. Therefore, when the plugs401aand401bof the USB-Type-C cables400aand400bare at an angle that can be inserted into the USB-Type-C receptacle connectors320aand320b, that is, in a state where the longitudinal direction of the plugs401aand401bis parallel to the substrate300, the concern about erroneous insertion into the USB-Type-A receptacle connectors320cand320dis extremely small. Further, compared to a case where the USB-Type-C receptacle connectors320aand320bare mounted on the substrate300such that the long side X is in contact with the mounting surface301and mounted on the substrate300such that the short side x is in contact with the mounting surface301, the USB-Type-C receptacle connectors320aand320bhave a larger area in contact with the mounting surface301of the substrate300. Therefore, the USB-Type-C receptacle connectors320aand320bare firmly fixed to the substrate300. Therefore, the strength of the USB-Type-C receptacle connectors320aand320bagainst prying is increased. In the connector section220illustrated inFIG.13, the USB-Type-C receptacle connectors320aand320bare arranged, as it is said, to be horizontally placed with respect to the mounting surface301, and the USB-Type-A receptacle connectors320cand320dare arranged, as it is said, to be vertically placed with respect to the mounting surface301. By arranging the connectors to be horizontally placed, the USB-Type-C receptacle connectors320aand320bare firmly fixed to the substrate300as described above. Further, by arranging the connectors to be vertically placed, the USB-Type-A receptacle connectors320cand320dcan narrow the distance between the respective receptacle connectors as described above, such that the connector section220can be downsized. On the contrary, plugs401cand401dof USB-Type-A cables400cand400dand a plug401eof a USB-Type-B cable400eare larger than the insertion ports of the USB-Type-C receptacle connectors320aand320b. Therefore, the plugs401cand401dof the USB-Type-A cables400cand400dand the plug401eof the USB-Type-B cable400ecannot be physically inserted into the USB-Type-C receptacle connectors320aand320b. In view of these, as illustrated inFIG.13, among the plurality of receptacle connectors provided in the connector section220, it is preferable that the USB-Type-C receptacle connectors320aand320bhaving a small insertion port be arranged at the end portion Z of the plurality of connectors provided in the connector section220. In other words, by arranging the USB-Type-C receptacle connectors320aand320bcorresponding to the plugs401aand401bof the USB-Type-C cables400aand400bwith a concern about erroneous insertion into a plurality of other receptacle connectors at the end portion Z of the first connector surface221, even in a state where it is difficult for the user to visually recognize or in a fumbling state, the user can correctly recognize the positions of the USB-Type-C receptacle connectors320aand320b, and the concern about erroneous insertion is reduced. The end portion Z is an end portion in the −Y direction in the present embodiment. The insertion port of the power supply connector320fis circular, and the USB-Type-C receptacle connectors320aand320b, the USB-Type-A receptacle connectors320cand320d, the USB-Type-B receptacle connector320e, and the DK receptacle connector320gare rectangular. Here, it is assumed that the power supply connector320fis circular, while the other receptacle connectors are rectangular because the others have corners. Since the insertion port of the power supply connector320fis circular, even in a state where it is difficult for the user to visually recognize or in a fumbling state, the user can correctly recognize the position of the power supply connector320f. Further, since the shape of the unevenness of the insertion port of the power supply connector320fis different from that of other receptacle connectors, the user can easily recognize the power supply connector320f. In other words, even in a state where it is difficult to visually recognize or in a fumbling state, the user can correctly recognize the position of the power supply connector320f, such that it becomes easy to recognize the position of each receptacle connector. Further, the insertion port of the power supply connector320fhas a structure in which a plurality of recess portions for inserting the pins are provided according to the plurality of pins of the power cable5, and the recess portions are sufficiently small, and thus each cable cannot be inserted into the insertion port of the power supply connector320f. Therefore, even when each cable is inserted at the position of the power supply connector320fby mistake, each cable is not inserted, and thus the user can recognize erroneous insertion. A circular connector is not arranged on the first connector surface221and a rectangular connector is arranged on the second connector surface222. The circular power supply connector320fis arranged not on the first connector surface221, but on the second connector surface222. The rectangular USB-Type-C receptacle connectors320aand320band the USB-Type-A receptacle connectors320cand320dare arranged on the first connector surface221. By providing the power supply connector320fthat is easy for the user to recognize on the second connector surface222, even in a state where it is difficult to visually recognize or in a fumbling state, the first connector surface221provided with the USB-Type-C receptacle connectors320aand320bcan be recognized. Therefore, the concern about erroneous insertion is reduced. For example, when the power supply connector320fis arranged between the USB-Type-C receptacle connectors320aand320band the DK receptacle connector320g, the user can correctly recognize the position of the power supply connector320f, and thus the concern about erroneous insertion into the DK receptacle connector320gis reduced. FIGS.14and15are perspective views of the cash drawer270.FIG.14is a perspective view of a drawer tray273of the cash drawer270in a closed state, andFIG.15is a perspective view of the drawer tray273of the cash drawer270in an open state. Further,FIG.16is a perspective view of a buzzer280. As illustrated inFIGS.14and15, the cash drawer270includes a drawer tray273and a drawer kick cable275. The drawer tray273is attached to the cash drawer270to be openable/closable. Cash and the like are stored in the drawer tray273. Further, the inside of the drawer tray273is divided by the partition plates274a,274b,274c,274d, and274e. For example, the partition plates274a,274b,274c,274d, and274emay be removable. In this case, the internal division of the drawer tray273can be changed. The drawer kick cable275is coupled to the DK receptacle connector320gof the connector section220. In other words, the cash drawer270is electrically coupled to the printing apparatus2via the drawer kick cable275, and the cash drawer270can communicate with the control section30of the printing apparatus2. The cash drawer270coupled to the printing apparatus2is controlled by the printing apparatus2. The printing apparatus2can control operations such as opening/closing and locking of the drawer tray273. On the other hand, the user may be configured to close the drawer tray273, operate a keyhole274, and manually lock the drawer tray273. Further, the buzzer280illustrated inFIG.16can be coupled to the DK receptacle connector320gof the connector section220. The buzzer280includes a volume control knob281, a speaker283, and a drawer kick cable285. The buzzer280is electrically coupled to the printing apparatus2via the drawer kick cable285, and the buzzer280can communicate with the control section30of the printing apparatus2. Accordingly, for example, a sound is output from the speaker283at the time of printing by the printing apparatus2, and the user can be notified that printing is in progress. The volume of the speaker283can be adjusted by the volume control knob281. For example, the user can operate the volume control knob281to set an appropriate volume according to the surrounding environment. Further, the buzzer280may be set to play a melody as well as a buzzer sound. Further, the DK receptacle connector320gof the connector section220can be replaced with a LAN receptacle connector. In this case, a LAN cable can be coupled to the LAN receptacle connector, and the printing apparatus2can be coupled to a network device such as a network hub or a router. The DK receptacle connector320gis an example of the LAN or DK receptacle connectors. 1-6. Substrate The substrate300will be described with reference toFIG.17.FIG.17is a view illustrating the substrate300. The substrate300includes the USB-Type-C receptacle connector320aand320b, the USB-Type-A receptacle connector320cand320d, the USB-Type-B receptacle connector320e, the power supply connector320f, the DK receptacle connector320g, the first power supply circuit12a, the second power supply circuit12b, a first locking member331, and a second locking member332. Further, the substrate300has a first side311, a second side312, and a third side313facing the inner surfaces of the first connector surface221and the second connector surface222of the connector section220. Specifically, the substrate300faces the inner surfaces of the first connector surface221and the second connector surface222, and the inner surfaces of the first connector surface221and the second connector surface222are orthogonal to the substrate300. The USB-Type-C receptacle connectors320aand320bare provided along the first side311of the substrate300. Further, the USB-Type-C receptacle connectors320aand320bcan be coupled to the plugs401aand401bof the USB-Type-C cables400aand400bvia the openings220aand220bprovided on the first connector surface221of the connector section220. The USB-Type-A receptacle connectors320cand320dare provided along the second side312of the substrate300. Further, the USB-Type-A receptacle connectors320cand320dcan be coupled to the plugs401cand401dof the USB-Type-A cables400cand400dvia the openings220cand220dprovided on the first connector surface221of the connector section220. The USB-Type-B receptacle connector320eis provided along the third side313of the substrate300. Further, the USB-Type-B receptacle connector320ecan be coupled to the plug401eof the USB-Type-B cable400evia the opening220eprovided on the second connector surface222of the connector section220. The power supply connector320fis provided along the third side313of the substrate300. Further, the power supply connector320fcan be coupled to the power cable5via the opening220fprovided on the second connector surface222of the connector section220. In other words, the power supply connector320fis a connector that supplies electric power to the control section30of the printing apparatus2. The DK receptacle connector320gis provided along the third side313of the substrate300. Further, the DK receptacle connector320gcan be coupled to the drawer kick cable275and285via the opening220gprovided on the second connector surface222of the connector section220. The first power supply circuit12aincludes a first coil121aand a first integrated circuit122a. The first integrated circuit122aincludes, for example, a DC-DC converter, a resistance element, a switching element, a transistor, and the like. The first power supply circuit12aconverts the electric power supplied from the power supply connector320finto appropriate electric power, and supplies electric power to the USB-Type-A receptacle connectors320cand320d, the USB-Type-B receptacle connector320e, and the USB-Type-C receptacle connector320b. In other words, the first coil121asupplies the first electric power to the USB-Type-A receptacle connectors320cand320d, the USB-Type-B receptacle connector320e, and the USB-Type-C receptacle connector320b. The first electric power is, for example, a constant electric power and a 5 V voltage electric power. The second power supply circuit12bincludes a second coil121band a second integrated circuit122b. The second integrated circuit122bincludes, for example, a DC-DC converter, a resistance element, a switching element, a transistor, and the like. The second power supply circuit12bconverts the electric power supplied from the power supply connector320finto appropriate electric power, and supplies the electric power to the USB-Type-C receptacle connector320a. In other words, the second coil121bsupplies the USB-Type-C receptacle connector320awith second electric power equal to or higher than the first electric power. The second electric power is, for example, variable power and is electric power having a voltage of 5 V, 9 V, or 12 V. As described above, the USB hub53operates between the USB controller34and the USB interface60, and is arranged between the first power supply circuit12aand the second power supply circuit12bon the substrate300. In other words, the USB hub53is arranged between the first coil121aand the second coil121b. In other words, the USB hub53is arranged between the first power supply circuit12ahaving a large heat generation amount and the second power supply circuit12b. In other words, the USB hub53is arranged in the substrate300at a position where the influence of heat generation of the first power supply circuit12aand the second power supply circuit12bis small. Further, the USB hub53controls the USB-Type-C receptacle connector320band the USB-Type-A receptacle connectors320cand320daccording to the instruction of the USB controller34. Further, the USB hub53serves as a line concentrator and a relay device for the USB-Type-C receptacle connector320band the USB-Type-A receptacle connectors320cand320d. The first locking member331and the second locking member332are members for fixing the substrate300to the main body frame208inside the main body case200. The first locking member331and the second locking member332engage with the engaged section of the main body frame208(not illustrated) through the holes331aand332aprovided on the substrate300. As a result, the connector section220accommodating the substrate300is fixed to the main body frame208. For example, the first locking member331and the second locking member332are metal screws, and the substrate300is screwed to the main body frame208. It is preferable that the holes331aand332abe provided in the vicinity of the first coil121aand the second coil121b, respectively. The substrate300screwed to the main body frame208dissipates heat to the main body frame208via the screws which are the first locking member331and the second locking member332, and heat is also dissipated from the screw head of the screws which are the first locking member331and the second locking member332. Therefore, the first locking member331and the second locking member332are preferably screws having a large screw head. For example, it is preferable that the first locking member331and the second locking member332be round screws rather than so-called countersunk head screws. Among the components mounted on the mounting surface301of the substrate300, the heat generation amount of the first coil121aand the second coil121bis large, and thus it is preferable that the substrate300be screwed to the main body frame208in the vicinity of the first coil121aand the second coil121b. Further, since the substrate300is fixed to the metal main body frame208by the metal screws which are the first locking member331and the second locking member332, there is an effect of eliminating static electricity charged on the substrate300and further, there is also an effect of fixing the potential of the substrate300. With reference toFIG.17, the positional relationship of the components mounted on the substrate300will be described. In the description, the distances L1to L7are defined as follows. Unless otherwise specified, the distances L1to L7are the shortest distances between members, respectively. The distance L1is a distance from the first locking member331to the first coil121a. A distance L2is a distance from the first locking member331to the USB-Type-C receptacle connector320b. A distance L3is a distance from the second locking member332to the second coil121b. A distance L4is a distance from the second locking member332to the USB-Type-C receptacle connector320a. A distance L5is a distance from the first coil121ato the USB-Type-C receptacle connector320b. A distance L6is a distance from the second coil121bto the USB-Type-C receptacle connector320a. The distance L7is a distance from the first coil121ato the second coil121b. The distance L1from the first locking member331to the first coil121ais shorter than the distance L2from the first locking member331to the USB-Type-C receptacle connector320b. The heat generation amount of the first coil121ais larger than the heat generation amount of the USB-Type-C receptacle connector320b. Therefore, by arranging the first coil121aat a position closer to the first locking member331than the USB-Type-C receptacle connector320b, there is an effect of heat dissipation of the substrate300. The distance L3from the second locking member332to the second coil121bis shorter than the distance L4from the second locking member332to the USB-Type-C receptacle connector320a. The heat generation amount of the second coil121bis larger than the heat generation amount of the USB-Type-C receptacle connector320a. Therefore, by arranging the second coil121bat a position closer to the second locking member332than the USB-Type-C receptacle connector320a, there is an effect of heat dissipation of the substrate300. The distance L1is shorter than the distance L5from the first coil121ato the USB-Type-C receptacle connector320b. As a result, the first locking member331dissipates more heat generated by the first coil121aarranged closer than the heat generated by the USB-Type-C receptacle connector320b. By arranging the first coil121a, which generates a large heat generation amount, near the first locking member331, the efficiency of heat dissipation of the substrate300is enhanced. When the distance L5is shorter than the distance L1, the heat generated by the first coil121a, which is a heat source, and the USB-Type-C receptacle connector320bwill be dissipated by the first locking member331, and thus there is a concern that the efficiency of heat dissipation of the substrate300deteriorates. The distance L3is shorter than the distance L6from the second coil121bto the USB-Type-C receptacle connector320a. As a result, the second locking member332dissipates more heat generated by the second coil121barranged closer than the heat generated by the USB-Type-C receptacle connector320a. By arranging the second coil121b, which generates a heat generation amount, near the second locking member332, the efficiency of heat dissipation of the substrate300is enhanced. When the distance L6is shorter than the distance L3, the heat generated by the second coil121b, which is a heat source, and the USB-Type-C receptacle connector320awill be dissipated by the second locking member332, and thus there is a concern that the efficiency of heat dissipation of the substrate300deteriorates. Further, the distance L6is shorter than the distance L5. As described above, the USB-Type-C receptacle connector320acorresponds to USB PD, and the USB-Type-C receptacle connector320bdoes not correspond to USB PD. In other words, the power consumption of the second power supply circuit12bis larger than the power consumption of the first power supply circuit12a. Therefore, it is preferable that the distance L6from the second coil121bincluded in the second power supply circuit12bto the USB-Type-C receptacle connector320abe shorter than the distance L5from the first coil121aincluded in the first power supply circuit12ato the USB-Type-C receptacle connector320b. When electric power is supplied from the second power supply circuit12bto the USB-Type-C receptacle connector320a, the loss of electric power supplied from the second power supply circuit12bis suppressed. Further, the distance L4is shorter than the distance L2. As mentioned above, the USB-Type-C receptacle connector320acorresponds to USB PD, and the USB-Type-C receptacle connector320bdoes not correspond to USB PD, and thus the heat generation amount of the USB-Type-C receptacle connector320ais larger than the heat generation amount of the USB-Type-C receptacle connector320b. Therefore, it is preferable that the distance L4from the second locking member332to the USB-Type-C receptacle connector320abe shorter than the distance L2from the first locking member331to the USB-Type-C receptacle connector320b, and the USB-Type-C receptacle connector320ahaving a large heat generation amount, be arranged on the limited mounting surface301of the substrate300to more easily dissipate heat. As a result, there is an effect of heat dissipation of the entire substrate300. Further, the distance L1is shorter than the distance L7. Therefore, the first locking member331can efficiently dissipate the heat generated by the first coil121awhile suppressing the influence of the heat generated by the second coil121bon the USB hub53. Further, the distance L3is shorter than the distance L7. Therefore, the second locking member332can efficiently dissipate the heat generated by the second coil121bwhile suppressing the influence of the heat generated by the first coil121aon the USB hub53. When the distance L7is set to be large, that is, by separating the first coil121aand the second coil121b, which generate a large heat generation amount, among the components mounted on the substrate300, the heat generation points on the substrate300are can be dispersed, and the efficiency of heat dissipation can be enhanced. 1-7. USB Cable With reference toFIG.18, how the USB-Type-C cables400aand400b, the USB-Type-A cables400cand400d, and the USB-Type-B cable400eare being coupled to the connector section220will be described.FIG.18is a view illustrating the USB-Type-C cable400aand400b, the USB-Type-A cable400cand400d, the USB-Type-B cable400e, and the connector section220. The USB-Type-C cable400aincludes the plug401a, a covering section402a, and a coupling cable407a. The plug401ais electrically coupled to the coupling cable407a, and the coupling part thereof is covered with the covering section402a. The plug401ais exposed from the end portion403aof the covering section402aand is coupled to the USB-Type-C receptacle connector320a. Specifically, the plug401aof the USB-Type-C cable400ais inserted into the USB-Type-C receptacle connector320avia the opening220a. The USB-Type-C cable400bincludes the plug401b, a covering section402b, and a coupling cable407b. The plug401bis electrically coupled to the coupling cable407b, and the coupling part thereof is covered with the covering section402b. The plug401bis exposed from the end portion403bof the covering section402band is coupled to the USB-Type-C receptacle connector320b. Specifically, the plug401bof the USB-Type-C cable400bis inserted into the USB-Type-C receptacle connector320bvia the opening220b. The USB-Type-A cable400cincludes the plug401c, a covering section402c, and a coupling cable407c. The plug401cis electrically coupled to the coupling cable407c, and the coupling part thereof is covered with the covering section402c. The plug401cis exposed from the end portion403cof the covering section402cand is coupled to the USB-Type-A receptacle connector320c. Specifically, the plug401cof the USB-Type-A cable400cis inserted into the USB-Type-A receptacle connector320cvia the opening220c. The USB-Type-A cable400dincludes the plug401d, a covering section402d, and a coupling cable407d. The plug401dis electrically coupled to the coupling cable407d, and the coupling part thereof is covered with the covering section402d. The plug401dis exposed from the end portion403dof the covering section402dand is coupled to the USB-Type-A receptacle connector320d. Specifically, the plug401dof the USB-Type-A cable400dis inserted into the USB-Type-A receptacle connector320dvia the opening220d. The USB-Type-B cable400eincludes the plug401e, a covering section402e, and a coupling cable407e. The plug401eis electrically coupled to the coupling cable407e, and the coupling part thereof is covered with the covering section402e. The plug401eis exposed from the end portion403eof the covering section402eand is coupled to the USB-Type-B receptacle connector320e. Specifically, the plug401eof the USB-Type-B cable400eis inserted into the USB-Type-B receptacle connector320evia the opening220e. A length Xc of the exposed part of the plugs401aand401bof the USB-Type-C cables400aand400bis shorter than a length Xa of the exposed part of the plugs401cand401dof the USB-Type-A cables400cand400d. For example, when the USB-Type-A receptacle connectors320cand320dand the USB-Type-C receptacle connectors320aand320bare provided side by side along the same side, and the USB-Type-A receptacle connectors320cand320dare inserted into the USB-Type-A cables400cand400d, when the end portions403cand403dof the USB-Type-A cables400cand400dare in contact with the first connector surface221, there is a concern that the plugs401aand401bof the USB-Type-C cables400aand400bcannot be inserted into the USB-Type-C receptacle connectors320aand320b. This is because the length Xc of the exposed part of the plugs401aand401bof the USB-Type-C cables400aand400bis shorter and shorter than the length Xa of the exposed part of the plugs401cand401dof the USB-Type-A cables400cand400d, and due to this, the plugs401aand401bof the USB-Type-C cables400aand400bcannot be inserted into the USB-Type-C receptacle connectors320aand320b. In other words, there is a concern that the USB-Type-C cables400aand400bare in a so-called half-inserted state. In order to reduce the possibility of the above-described half-inserted state, the USB-Type-C receptacle connectors320aand320bare arranged to be closer to the first connector surface221than the USB-Type-A receptacle connectors320cand320d. Specifically, the USB-Type-C receptacle connectors320aand320bare arranged along the first side311of the substrate300, and the USB-Type-A receptacle connectors320cand320dare arranged along the second side312of the substrate300. When there is no step A between the first side311and the second side312of the substrate300, the USB-Type-A receptacle connectors320cand320dare arranged at a position further from the first connector surface221than the USB-Type-C receptacle connectors320aand320b. In this case, a gap is created between the openings220cand220dand the USB-Type-A receptacle connectors320cand320d, and there is a concern that foreign matter such as dust and insects enters the connector section220through the gap and adheres onto the mounting surface301of the substrate300. By providing the step A between the first side311and the second side312of the substrate300, the gap between the openings220cand220dand the USB-Type-A receptacle connectors320cand320dis reduced, and the insertion ports of the openings220cand220dand the USB-Type-A receptacle connectors320cand320dcoincide with each other. Accordingly, the concern about adhesion on the mounting surface301of the substrate300is reduced. With reference toFIGS.19and20, a case where the USB-Type-C cables400aand400band the USB-Type-A cables400cand400dare inserted into the connector section220will be described.FIG.19illustrates a first state andFIG.20illustrates a second state. In addition, a direction in which the USB-Type-C cables400aand400band the USB-Type-A cables400cand400dare inserted into the connector section220is set as a first direction. In describingFIGS.19and20, distances D1to D4are defined as follows. Unless otherwise specified, the distances D1to D4are the shortest distance therebetween. The distance D1is a distance from the first side311of the substrate300to the inner surface of the first connector surface221. The distance D2is a distance from the second side312of the substrate300to the inner surface of the first connector surface221. The distance D3is a distance from the insertion port of the USB-Type-C receptacle connectors320aand320bto the end portions403aand403bof the USB-Type-C cables400aand400b. The distance D4is a distance from the insertion port of the USB-Type-A receptacle connectors320cand320dto the end portions403cand403dof the USB-Type-A cables400cand400d. As illustrated inFIG.19, in the first state, the distance D1from the inner surface of the first connector surface221to the first side311is shorter than the distance D2from the inner surface of the first connector surface221to the second side312, and the difference between the distance D2and the distance D1is equal to or greater than the difference between the distance D4and the distance D3. Condition 1 is the relationship between the distances D1, D2, D3, and D4. In order to satisfy this condition 1, when the USB-Type-C receptacle connectors320aand320band the USB-Type-A receptacle connectors320cand320dare arranged side by side, the concern about the above-described half-inserted state is reduced. Further, as illustrated inFIG.20, in the second state, the substrate300may be arranged to face the first connector surface221such that the first side311is in contact with the inner surface of the first connector surface221. In this case, in addition to reducing the concern about the above-described half-inserted state, the alignment of the substrate300and the first connector surface221with reference to the first side311becomes easy. Further, even when the end portions403aand403bof the USB-Type-C cables400aand400band the end portions403cand403dof the USB-Type-A cables400cand400dmay be in contact with the outer surface of the first connector surface221. In this case, in addition to reducing the concern about the above-described half-inserted state, by inserting the USB-Type-C cables400aand400band the USB-Type-A cables400cand400dinto the connector section220, the gaps between the openings220aand220band the openings220cand220dare reduced, and thus the concern about foreign matter such as dust or insects entering the connector section220is reduced. In the second state, the distance D1from the inner surface of the first connector surface221to the first side311is zero, the difference between the distance D4and the distance D3is zero, and thus the difference between the distance D2and the distance D1is equal to or greater than the difference between the distance D4and the distance D3. Since the second state also satisfies the first condition, the same effect as that of the first state can be obtained. Since the USB-Type-C receptacle connectors320aand320bare smaller than other receptacle connectors such as the USB-Type-A receptacle connectors320cand320d, the ground contact area with the mounting surface301of the substrate300is also smaller than that of the USB-Type-A receptacle connectors320cand320d. Therefore, it is preferable that the entire USB-Type-C receptacle connectors320aand320bbe arranged on the mounting surface301of the substrate300. For example, when the USB-Type-C receptacle connectors320aand320bare arranged to protrude from the substrate300, a sufficient ground contact area with the mounting surface301of the substrate300cannot be secured, and the USB-Type-C receptacle connectors320aand320bare vulnerable to an external force load due to prying or the like of the plugs401aand401bof the USB-Type-C cables400aand400b. As illustrated inFIGS.18to20, the insertion port of the USB-Type-C receptacle connectors320aand320bare arranged along the first side311of the substrate300, and accordingly, the ground contact area between the USB-Type-C receptacle connectors320aand320band the mounting surface301of the substrate300can be sufficiently secured. Therefore, by providing the step A between the first side311and the second side312of the substrate300, and arranging the USB-Type-C receptacle connectors320aand320balong the first side311protruding from the second side312, the USB-Type-C receptacle connectors320aand320bcan shorten the distance between the insertion port and the first connector surface221while securing the ground contact area with the mounting surface301of the substrate300, and as a result, the concern about the above-described state where the plugs401aand401bof the USB-Type-C cables400aand400bwill be half-inserted into the USB-Type-C receptacle connectors320aand320bcan be suppressed. 1-8. Fixing USB-Type-C Receptacle Connector The USB-Type-C receptacle connector320awill be described with reference toFIG.21.FIG.21is a perspective view of the USB-Type-C receptacle connector320a. The USB-Type-C receptacle connector320bwill be described with reference toFIG.22.FIG.22is a perspective view of the USB-Type-C receptacle connector320b. The USB-Type-C receptacle connector320bhas the same configuration as that of the USB-Type-C receptacle connector320a. The USB-Type-C receptacle connector320aincludes a first part322a, a second part323a, coupling parts324aand325a, and projection portions327aand328a. The first part322ais formed in a planar shape and constitutes the bottom surface of the USB-Type-C receptacle connector320a. Further, the second part323ais formed in a planar shape, faces the first part322a, and constitutes the upper surface of the USB-Type-C receptacle connector320a. The coupling parts324aand325aare curved and couple the first part322aand the second part323a, respectively. Further, the coupling parts324aand325aform the side surface of the USB-Type-C receptacle connector320a. Similar to the USB-Type-C receptacle connector320a, the USB-Type-C receptacle connector320bincludes a third part322b, a fourth part323b, coupling parts324band325b, and projection portions327band328b. The third part322bis formed in a planar shape and constitutes the bottom surface of the USB-Type-C receptacle connector320b. Further, the fourth part323bis formed in a planar shape, faces the third part322b, and constitutes the upper surface of the USB-Type-C receptacle connector320b. The coupling parts324band325bare curved and couple the third part322band the fourth part323b, respectively. Further, the coupling parts324band325bform the side surface of the USB-Type-C receptacle connector320b. When the USB-Type-C receptacle connector320ais mounted on the substrate300, the first part322aconstituting the bottom surface is in contact with the mounting surface301of the substrate300, the second part323aconstituting the upper surface is pressed by a prevention section340aillustrated inFIG.23, and the USB-Type-C receptacle connector320ais fixed not to be peeled off from the mounting surface301. When the USB-Type-C receptacle connector320bis mounted on the substrate300, the third part322bconstituting the bottom surface is in contact with the mounting surface301of the substrate300, the fourth part323bconstituting the upper surface is pressed by a prevention section340billustrated inFIG.23, and the USB-Type-C receptacle connector320bis fixed not to be peeled off from the mounting surface301. Further, the USB-Type-C receptacle connector320ahas an opening321aand a back surface326a. The plug401aof the USB-Type-C cable400ais inserted through the opening321aand is in contact with a pin (not illustrated) provided inside the USB-Type-C receptacle connector320a. This pin is provided on the back surface326a, for example, and is electrically coupled to and controlled by the USB controller34. As a result, the external device10acoupled to the printing apparatus2by the USB-Type-C cable400aand the printing apparatus2can communicate with each other. The projection portions327aand328afix the USB-Type-C receptacle connector320ato the mounting surface301of the substrate300. For example, when the USB-Type-C receptacle connector320ais mounted on the mounting surface301of the substrate300, the first part322aconstituting the bottom surface and the mounting surface301may be fixed by a bonding agent such as an adhesive. However, the two projection portions327aand328amay be fixed by piercing the substrate300. As a result, the USB-Type-C receptacle connector320ais fixed to the substrate300, and the concern about peeling from the substrate300is reduced. The USB-Type-C receptacle connector320apreferably has a plurality of projection portions. By having a plurality of projection portions included in the USB-Type-C receptacle connector320apierce the mounting surface301, the concern that the USB-Type-C receptacle connector320awill be peeled off from the substrate300is further reduced. The projection portions327aand328aare examples of the plurality of projection portions. The prevention sections340aand340bwill be described with reference toFIGS.23and24. FIG.23is a view illustrating the prevention sections340aand340bwhen the first connector surface221is viewed in a plan view.FIG.24is an exploded perspective view of the prevention section340aand the USB-Type-C receptacle connector320a. As illustrated inFIG.23, the prevention sections340aand340bare accommodated inside the connector section220, and press and fix the USB-Type-C receptacle connectors320aand320b, respectively. Further, the projection portions327aand328aof the USB-Type-C receptacle connector320apierce into the substrate300, and accordingly, the USB-Type-C receptacle connector320ais fixed to the substrate300. The prevention section340ais an example of the first prevention section, and the prevention section340bis an example of the second prevention section. The prevention sections340aand340binclude metal right angle members450aand450band conductive soft gaskets500aand500b. The right angle members450aand450bare made of metal and are fixed to the first connector surface221by screws350aand350b. In other words, the right angle members450aand450bare screwed to the first connector surface221. As a result, the potentials of the prevention sections340aand340bare fixed, and for example, there are the effect of removing static electricity charged on the USB-Type-C receptacle connectors320aand320b, and the effect of protecting the USB-Type-C receptacle connectors320aand320bfrom electromagnetic noise. The right angle member450ais an example of a first right angle member, and the right angle member450ais an example of a second right angle member. The soft gaskets500aand500bare stretchable members such as sponges, and are bonded to the right angle members450aand450bby a bonding agent such as double-sided tape. The soft gaskets500aand500billustrated inFIG.23block between the right angle members450aand450band the USB-Type-C receptacle connectors320aand320b. In other words, the soft gaskets500aand500bare sandwiched between the right angle members450aand450band the USB-Type-C receptacle connectors320aand320b, and are contracted more than in the normal state. The soft gasket500ais an example of the first soft gasket, and the soft gasket500bis an example of the second soft gasket. Therefore, among the members included in the prevention sections340aand340b, the soft gaskets500aand500bpress the USB-Type-C receptacle connectors320aand320b, and accordingly, the prevention sections340aand340bfix the USB-Type-C receptacle connectors320aand320b. Since the soft gasket500ais a stretchable member, the USB-Type-C receptacle connector320acan be installed without being damaged when the USB-Type-C receptacle connector320ais pressed. FIG.24is an exploded perspective view of the prevention section340aand the USB-Type-C receptacle connector320a. Since the right angle member450bhas the same structure as that of the right angle member450a, the description of the right angle member450awill be used instead. The right angle member450ahas a bonding surface451a, a screw hole452a, side surfaces453aand454a, an upper surface455a, and a back surface456a. The bonding surface451aand the upper surface455aare formed in a plate shape and form a right angle to each other. The screw hole452ais provided on the bonding surface451a, and the right angle member450ais fixed to the first connector surface221by engaging the screw hole452awith the screw350a. In other words, the metal right angle member450ais screwed to the first connector surface221. As described above, the soft gasket500ahas conductivity, and when the metal right angle member450ais screwed to the first connector surface221, the soft gasket500ahas the same potential as that of the first connector surface221. Therefore, the potential of the USB-Type-C receptacle connector320apressed against the soft gasket500ais stable and becomes strong against noise and static electricity. In a state where the right angle member450ais fixed to the first connector surface221, the upper surface455ais parallel to the mounting surface301of the substrate300. In other words, the upper surface455ais parallel to the first part322aconstituting the bottom surface and the second part323aconstituting the upper surface of the USB-Type-C receptacle connector320a. The soft gasket500ais fitted into a space S defined by the side surfaces453aand454a, the upper surface455a, and the back surface456aof the right angle member450a. As illustrated inFIG.24, the size of the space S is approximately a width W, a depth D, and a height H. Among the members included in the prevention section340a, the soft gasket500apresses the second part323aconstituting the upper surface of the USB-Type-C receptacle connector320a, and accordingly, the prevention section340afixes the USB-Type-C receptacle connector320a. Therefore, it is preferable that the soft gasket500abe brought into contact with the second part323aconstituting the upper surface of the USB-Type-C receptacle connector320ato increase the contact area. In other words, it is preferable that the soft gasket500anot have a gap as much as possible between the soft gasket500aand the second part323aconstituting the upper surface of the USB-Type-C receptacle connector320a. Specifically, it is preferable that the width Wa of the soft gasket500abe larger than the width W of the space S, and the soft gasket500abe compressed by the side surfaces453aand454aof the right angle member450a. By increasing the area in which the soft gasket500apresses the second part323aconstituting the upper surface of the USB-Type-C receptacle connector320ain the width Wa direction, the soft gasket500afirmly fixes the USB-Type-C receptacle connector320ato the substrate300. Further, it is preferable that a height Ha of the soft gasket500abe larger than the height H, and specifically, be in contact with at least the second part323aconstituting the upper surface of the USB-Type-C receptacle connector320a. Since the soft gasket500acontracts, it is preferable to increase the height Ha of the soft gasket500asuch that the soft gasket500acan press the second part323aconstituting the upper surface of the USB-Type-C receptacle connector320a. It is preferable that a depth Da of the soft gasket500anot become extremely large. When the depth Da of the soft gasket500ais increased, the area where the soft gasket500apresses the second part323aconstituting the upper surface of the USB-Type-C receptacle connector320acan be increased in the depth Da direction. However, when the depth Da of the soft gasket500abecomes extremely large, there is a concern that the compressed soft gasket500areaches the vicinity of the opening321aof the USB-Type-C receptacle connector320a, and thus it is preferable that the depth Da of the soft gasket500abecome as large as the depth D. More preferably, the soft gasket500ahas a size that fits in the space S. In a state where the compressed soft gasket500areaches the vicinity of the opening321aof the USB-Type-C receptacle connector320a, there is a concern that the plug401aof the USB-Type-C cable400acomes into contact with the compressed soft gasket500a. Since the potential of the plug401aof the USB-Type-C cable400aand the potential of the compressed soft gasket500aare not always the same, for example, there is a concern about malfunction or failure of the external device10acoupled by the USB-Type-C cable400a. 2. Modification Example 2-1. Modification Example 1 Modification Example 1 of the connector section220of the present embodiment will be described with reference toFIG.25. A configuration example of a connector section2201in Modification Example 1 will be described. In describing Modification Example 1, the same configurations as those in the present embodiment will be given the same reference numerals, and the description thereof will be omitted or simplified.FIG.25is a plan view of the first connector surface221and the second connector surface222of the connector section220of Modification Example 2. The arrangement of the plurality of connectors provided on the second connector surface222of the connector section2201of Modification Example 1 is different from that of the present embodiment, and the positions of the USB-Type-B receptacle connector320eand the power supply connector320fare different. Specifically, in the present embodiment, the power supply connector320fis arranged between the DK receptacle connector320gand the USB-Type-B receptacle connector320e. In Modification Example 1, the USB-Type-B receptacle connector320eis arranged between the DK receptacle connector320gand the power supply connector320f. Since the USB-Type-B receptacle connector320ehas less concern about erroneous insertion than the DK receptacle connector320g, and thus such an arrangement may be used. In other words, even in a state where it is difficult to visually recognize or in a fumbling state, the user can correctly recognize the position of the USB-Type-B receptacle connector320e, and thus there is less concern about erroneous insertion into the DK receptacle connector320g. 2-2. Modification Example 2 Modification Example 2 of the substrate300of the present embodiment will be described with reference toFIG.26. A configuration example of a substrate300ain Modification Example 2 will be described. In describing Modification Example 2, the same configurations as those in the present embodiment will be given the same reference numerals, and the description thereof will be omitted or simplified.FIG.26is a schematic view of the substrate300aof Modification Example 2. Unlike the present embodiment, the substrate300aof Modification Example 2 is provided with a slot320h. Specifically, on the substrate300of the present embodiment, the USB-Type-C receptacle connector320ais arranged, but the substrate300aof Modification Example 2 has the slot320hinto which a memory card can be inserted instead of the USB-Type-C receptacle connector320a. The slot320his controlled by the CPU31via the system bus41, and the data on the memory card is rewritten. For example, the slot320hcorresponds to an SD card, a micro SD card, or the like. By operating the smart device3acoupled to the USB-Type-C interface60a, the user can store the accounting information in the memory card. Further, the smart device3acan cause the printing apparatus2to execute printing based on the data stored in the memory card. For example, the printing apparatus2can print accounting information and the like stored in a memory card. Further, unlike the present embodiment, the second power supply circuit12bmay supply electric power to the USB-Type-C receptacle connector320b. In this case, the USB-Type-C receptacle connector320bcan also be used as a connector that correspond to USB PD. 3. Electronic Device An electronic device500according to the present embodiment will be described with reference toFIG.27.FIG.27is a functional block diagram illustrating a schematic configuration of the electronic device500of the present embodiment. The electronic device500may include a semiconductor integrated circuit505, a CPU510, an operation section520, a ROM530, a RAM540, a communication section550, a display section560, and an audio output section570. The electronic device500may have a configuration in which some of these elements are omitted or changed, or other elements are added. The semiconductor integrated circuit505performs various processing in response to a command from the CPU510. For example, the semiconductor integrated circuit505corrects the input data or converts the data format in response to a command from the CPU510. The CPU510performs various arithmetic processing and control processing using data and the like supplied from the semiconductor integrated circuit505according to a program stored in the ROM530and the like. For example, the CPU510performs various data processing according to the operation signal supplied from the operation section520, controls the communication section550for data communication with the outside, generates an image signal for displaying various images on the display section560, and generates an audio signal for outputting various audio to the audio output section570. The operation section520is, for example, an input device including an operation key, a button switch, and the like, and outputs an operation signal corresponding to the operation by the user to the CPU510. The ROM530stores programs, data, and the like for the CPU510to perform various arithmetic processing and control processing. Further, the RAM540is used as a work area of the CPU510, and temporarily stores programs and data read from the ROM530, data input using the operation section520, calculation results obtained by the CPU510executing the program, and the like. The communication section550is composed of, for example, an analog circuit and a digital circuit, and performs data communication between the CPU510and the external device. The display section560includes, for example, a liquid crystal display (LCD) and displays various types of information based on a display signal supplied from the CPU510. Further, the audio output section570includes, for example, a speaker and the like, and outputs audio based on an audio signal supplied from the CPU510. As described above, the electronic device500may be, for example, a printing apparatus provided with the printing section20that performs printing on the medium P. Further, for example, the electronic device500includes a projector, an electronic dictionary, an electronic game device, a mobile terminal such as a mobile phone, a digital still camera, a digital video camera, a television, a recorder, a security monitor, a head mount display, a personal computer, a network device, a car navigation device, a measuring device, a medical device (for example, an electronic thermometer, a blood pressure manometer, a blood glucose monitoring system, an electrocardiogram measuring device, an ultrasonic diagnostic device, and an electronic endoscope), and the like. The USB-Type-C receptacle connector320bis an example of a first receptacle connector. The external device10bis an example of the first external device. The USB-Type-C receptacle connector320ais an example of the second receptacle connector. The USB-Type-A receptacle connector320cis an example of the third receptacle connector. The USB-Type-B receptacle connector320eis an example of the fourth receptacle connector. The plug401bof the USB-Type-C cable400bis an example of the first plug of the first cable. The plug401aof the USB-Type-C cable400ais an example of the second plug of the second cable. The plug401cof the USB-Type-A cable400cis an example of the third plug of the third cable. The plug401eof the USB-Type-B cable400eis an example of the fourth plug of the fourth cable. The embodiments and the modification examples have been described above, but the present disclosure is not limited to the embodiments, and can be implemented in various aspects without departing from the gist thereof. For example, the above-described embodiments can also be appropriately combined with each other. The present disclosure includes substantially the same configurations (for example, configurations having the same functions, methods, and results, or configurations having the same objects and effects) as the configurations described in the embodiments. Further, the present disclosure includes configurations in which non-essential parts of the configuration described in the embodiments are replaced. In addition, the present disclosure includes configurations that achieve the same operational effects or configurations that can achieve the same objects as those of the configurations described in the embodiment. Further, the present disclosure includes configurations in which a known technology is added to the configurations described in the embodiments. The following contents are derived from the above-described embodiments and modification examples. According to an aspect, there is provided an electronic device including: a substrate; a main body case; and a first locking member and a second locking member for fixing the substrate and the main body case, in which the substrate includes a first receptacle connector configured to be coupled to a first plug of a first cable, a second receptacle connector configured to be coupled to a second plug of a second cable, a first coil that supplies electric power to the first receptacle connector, and a second coil that supplies electric power to the second receptacle connector, the first receptacle connector is a first USB-Type-C receptacle connector, the second receptacle connector is a second USB-Type-C receptacle connector, the first cable is a first USB-Type-C cable, the second cable is a second USB-Type-C cable, a distance L1from the first locking member to the first coil is shorter than a distance L2from the first locking member to the first receptacle connector, and a distance L3from the second locking member to the second coil is shorter than a distance L4from the second locking member to the second receptacle connector. According to this electronic device, the heat generation amount of the first coil is larger than the heat generation amount of the first receptacle connector. Therefore, by arranging the first coil at a position closer to the first locking member than the second receptacle connector, the effect of heat dissipation of the substrate can be enhanced. Similarly, the heat generation amount of the second coil is larger than the heat generation amount of the second receptacle connector. Therefore, by arranging the second coil at a position closer to the second locking member than the first receptacle connector, the effect of heat dissipation of the substrate can be enhanced. In the electronic device according to the aspect, the distance L1may be shorter than a distance L5from the first coil to the first receptacle connector, and the distance L3may be shorter than a distance L6from the second coil to the second receptacle connector. According to this electronic device, the first locking member dissipates more heat generated by the first coil arranged closer than the heat generated by the second receptacle connector. Further, since the second receptacle connector320is arranged on the other side of the first coil when viewed from the first locking member, the heat generated by the second receptacle connector has a small influence on the first locking member. By arranging the first coil, which generates a large amount of heat, near the first locking member, the efficiency of heat dissipation of the substrate can be enhanced. Similarly, the second locking member dissipates more heat generated by the second coil arranged closer than the heat generated by the first receptacle connector. Further, since the first receptacle connector is arranged on the other side of the second coil when viewed from the second locking member332, the heat generated by the first receptacle connector has a small influence on the second locking member. By arranging the second coil, which generates a large amount of heat, near the second locking member, the efficiency of heat dissipation of the substrate is enhanced. In the electronic device according to the aspect, the first coil may supply a constant electric power to the first receptacle connector, the second coil may supply variable power to the second receptacle connector, and the distance L6may be shorter than the distance L5. According to this electronic device, the first power supply circuit does not correspond to USB PD, and the first coil included in the first power supply circuit supplies a constant electric power to the second receptacle connector. Since the second power supply circuit corresponds to USB PD, the second coil included in the second power supply circuit supplies variable power to the first receptacle connector. Similarly, since the first receptacle connector consumes more power and generates more heat than the second receptacle connector, by arranging the second coil that supplies electric power to the first receptacle connector closer to the first receptacle connector than the second receptacle connector, the efficiency of electric power transmission can be enhanced. In the electronic device according to the aspect, a USB hub that controls the first receptacle connector may further be provided, and the USB hub may be arranged between the first coil and the second coil. According to this electronic device, the USB hub is arranged between the first power supply circuit including the first coil having a large heat generation amount and the second power supply circuit including the second coil. Accordingly, the influence of heat generation of the first power supply circuit and the second power supply circuit on the USB hub can be reduced. In the electronic device according to the aspect, a third receptacle connector configured to be coupled to a third plug of a third cable may further be provided, the third receptacle connector may be a USB-Type-A receptacle connector, the third cable may be a USB-Type-A cable, and the first coil may supply electric power to the third receptacle connector. According to this electronic device, the first power supply circuit including the first coil supplies electric power not only to the first receptacle connector but also to the third receptacle connector. As a result, the power supply circuit can be commonly used, and the configuration of the components mounted on the substrate can be simplified. In the electronic device according to the aspect, a fourth receptacle connector configured to be coupled to a fourth plug of a fourth cable may further be provided, the fourth receptacle connector may be a USB-Type-B receptacle connector, and the first coil may supply electric power to the fourth receptacle connector. According to this electronic device, the first power supply circuit including the first coil supplies electric power not only to the first receptacle connector but also to the fourth receptacle connector. As a result, the power supply circuit can be commonly used, and the configuration of the components mounted on the substrate can be simplified. In the electronic device according to the aspect, the USB hub may control the first receptacle connector, the third receptacle connector, and the fourth receptacle connector. According to this electronic device, the USB hub can collectively control the first receptacle connector, the third receptacle connector, and the fourth receptacle connector. In other words, since one USB hub controls a plurality of receptacle connectors that do not correspond to USB PD, it is possible to simplify the configuration of components mounted on the substrate. In the electronic device according to the aspect, a printing section that performs printing on the medium may further be provided. According to this electronic device, since the printing section is provided, the electronic device can be used as a printing apparatus. | 124,764 |
11942737 | DETAILED DESCRIPTION TO EXECUTE THE INVENTION Description of Embodiments of Present Disclosure First, embodiments of the present disclosure are listed and described. (1) The present disclosure relates to a joint connector for connecting a plurality of wires, the joint connector including a lower housing, an upper cover assembled with the lower housing, a plurality of terminals respectively connected to front end parts in an extending direction of the plurality of wires, and a busbar connected to the plurality of terminals, wherein the busbar disposed in the lower housing includes a plurality of tabs, each of the plurality of terminals disposed in the lower housing includes a tube portion, each of the plurality of tabs being inserted into the tube portion, a sandwiching portion extending along the extending direction and configured to sandwich one of the plurality of wires, and a sliding portion disposed outside the sandwiching portion, movable along the extending direction and including a pressurizing portion configured to pressurize the sandwiching portion toward the wire with the one of the plurality of wires sandwiched by the sandwiching portion, and a terminal holding portion projecting downward from the upper cover is engaged with the terminals. According to the present disclosure, a core of the wire and the terminal can be electrically connected without using a relatively large-scale jig by pushing the sliding portion forward with a relatively small jig. In this way, the manufacturing cost of the joint connector can be reduced. Further, by applying the terminals according to the present disclosure to the joint connector, the manufacturing cost of the joint connector can be reduced. According to the present disclosure, the terminals can be retained and held in the lower housing not to come out upward by inserting the busbar into the tube portions. Since a structure for retaining and holding the terminals becomes unnecessary in this way, the structure of the joint connector can be simplified. As a result, the manufacturing cost of the joint connector can be reduced. (2) Preferably, the sliding portion is movable with respect to the sandwiching portion between a partial locking position where the pressurizing portion is separated from the sandwiching portion and a full locking position where the pressurizing portion presses the sandwiching portion toward the wire, and the terminal holding portion is engaged with the sliding portions located at the full locking position with respect to the sandwiching portions. By assembling the upper cover with the lower housing, the terminal holding portion provided on the upper cover is locked to the sliding portions, wherefore movements of the sliding portions to the full locking position can be confirmed. (3) Preferably, the lower housing includes a rear wall located behind the plurality of terminals in the extending direction, and the rear wall includes a plurality of wire insertion holes penetrating in the extending direction, the plurality of wires being respectively inserted through the wire insertion holes, and the sandwiching portions are disposed in front of the wire insertion holes in the extending direction. If the wire is inserted from behind the wire insertion hole, the wire moves toward the sandwiching portion located in front of the wire insertion hole. Since the wire is guided to the sandwiching portion by the wire insertion hole, the manufacturing efficiency of the joint connector can be improved. (4) Preferably, a cross-sectional area of the wire insertion hole orthogonal to the extending direction is smaller than that of the sliding portion orthogonal to the extending direction. Since the cross-sectional area of the wire insertion hole is smaller than that of the sliding portion, the escape of the sliding portion to the outside of the lower housing through the wire insertion hole is suppressed. In this way, the terminal having the sliding portion held at the partial locking position can be held in the lower housing. Details of Embodiment of Present Disclosure Hereinafter, an embodiment of the present disclosure is described. The present invention is not limited to these illustrations and is intended to be represented by claims and include all changes in the scope of claims and in the meaning and scope of equivalents. Embodiment One embodiment of the present disclosure is described with reference to FIGS.1to13. A joint connector10according to this embodiment electrically connects a plurality of wires11. In the following description, a direction indicated by an arrow Z is referred to as an upward direction, a direction indicated by an arrow Y is referred to as a forward direction, and a direction indicated by an arrow X is referred to as a leftward direction. Note that, for a plurality of identical members, only some members may be denoted by a reference sign and the other members may not be denoted by the reference sign. As shown inFIG.1, the joint connector10according to this embodiment includes a plurality of terminals12to be respectively connected to front end parts in an extending direction (direction indicated by the arrow Y) of the plurality of wires11, a busbar50to be connected to the plurality of terminals12, a lower housing30for accommodating the plurality of terminals12and the busbar50inside and an upper cover60to be mounted on an upper part of the lower housing30. [Wires11] As shown inFIG.1, the plurality of wires11are disposed to extend in a front-rear direction (an example of the extending direction). The wire11is such that the outer periphery of a core13is surrounded by an insulation coating14made of insulating synthetic resin. The core13according to this embodiment is composed of one metal wire. Note that the core13may be a stranded wire formed by twisting a plurality of metal thin wires. An arbitrary metal such as copper, copper alloy, aluminum or aluminum alloy can be appropriately selected as a metal constituting the core13if necessary. The core13according to this embodiment is made of copper or copper alloy. [Lower Housing30] As shown inFIG.2, the lower housing30is in the form of a rectangular parallelepiped flat in a vertical direction. The lower housing30is formed by injection-molding a material containing an insulating synthetic resin. A plurality of (four in this embodiment) cavities29extending in the front-rear direction are arranged in a lateral direction in the lower housing30. The cavities29are open upward and the terminals12are inserted into the cavities29from above. As shown inFIGS.1and2, the cavities29are open forward in a front end part of the lower housing30and these openings serve as busbar insertion holes51through which the busbar50is inserted into the cavities29from front. A plurality of (four in this embodiment) wire insertion holes37into which the wires11are inserted as shown inFIG.1are provided side by side in the lateral direction to penetrate through a rear wall31of the lower housing30in the front-rear direction. The wire insertion holes37are provided at positions corresponding to the cavities29of the lower housing30. An inner diameter of the wire insertion hole37is set to be equal to or somewhat larger than an outer diameter of the insulation coating14of the wire11. [Upper Cover60] As shown inFIG.1, the upper part of the lower housing30is covered by the upper cover60assembled from above. Although not shown in detail, the lower housing30and the upper cover60are integrally assembled by a known locking structure. The upper cover60is formed by injection-molding an insulating synthetic resin. As shown inFIG.3, the upper cover60includes an upper wall61and two side walls62extending downward from both left and right sides of the upper wall61. A plurality of (four in this embodiment) terminal holding portions63projecting downward extend in the front-rear direction on the lower surface of the upper wall61. The terminal holding portion63includes a front terminal holding portion63F located on a front side and a rear terminal holding portion63R located behind the front terminal holding portion63F. The rear terminal holding portion63R projects further downward than the front terminal holding portion63F. An arcuate groove64is formed in the lower surface of the rear terminal holding portion63R. The inner shape of the groove64is the same as or somewhat larger than the outer shape of the wire11. By disposing the wire11in the groove64, the wire11is held in the cavity29while extending in the front-rear direction. [Busbar50] As shown inFIG.4, the busbar50is formed by press-working a metal plate material into a predetermined shape. An arbitrary metal such as copper or copper alloy can be appropriately selected as the metal plate material. The busbar50includes a plurality of (four in this embodiment) tabs52extending rearward and a coupling portion54coupling front end parts of the tabs52via relay portions53. The tab52is in the form of a plate flat in the lateral direction. The coupling portion54is in the form of a plate flat in the vertical direction. The relay portions53are formed to extend rearward from the coupling portion54. The right edge of the relay portion53is bent downward and connected to the tab52. As shown inFIG.4, a plurality of (three in this embodiment) locking holes56arranged while being spaced apart in the lateral direction penetrate through the coupling portion54. When viewed from above, the locking holes56have a rectangular shape. As shown inFIG.10, with the busbar50inserted in the cavities29, locking claws35projecting from the housing30toward the coupling portion54are accommodated in the respective locking holes56. Front hole edge parts of the locking holes56contact the locking claws35from front, thereby suppressing a forward movement of the busbar50. [Terminals12] As shown inFIG.5, the terminal12includes a terminal body15made of metal and a sliding portion16relatively slidable with respect to the terminal body15. [Terminal Bodies15] The terminal body15is formed into a predetermined shape by a known method such as press-working, cutting or casting. An arbitrary metal such as copper, copper alloy, aluminum, aluminum alloy or stainless steel can be appropriately selected as a metal constituting the terminal body15if necessary. The terminal body15according to this embodiment is made of copper or copper alloy. A plating layer may be formed on the surface of the terminal body15. An arbitrary metal such as tin, nickel or silver can be appropriately selected as a metal constituting the plating layer if necessary. Tin plating is applied to the terminal body15according to this embodiment. As shown inFIG.5, the terminal body15includes a tube portion17, into which the tab52is insertable, and a wire connecting portion20located behind the tube portion17and to be connected to the wire11. The wire connecting portion20includes an upper sandwiching portion18A and a lower sandwiching portion18B extending rearward. As shown inFIG.5, the tube portion17is in the form of a rectangular tube extending in the front-rear direction. The front end of the tube portion17is open so that the tab52is insertable. As shown inFIG.6, a resiliently deformable resilient contact piece19is disposed inside the tube portion17. The resilient contact piece19extends inward from the inner wall of the tube portion17. The tab52inserted into the tube portion17presses and resiliently deforms the resilient contact piece19. The tab52is sandwiched between the inner wall of the tube portion17and the resilient contact piece19by a resilient force of the resiliently deformed resilient contact piece19. In this way, the tab52and the terminal12are electrically connected. As shown inFIG.6, the wire connecting portion20in the form of a rectangular tube is provided behind the tube portion17. The upper sandwiching portion18A (an example of a sandwiching portion) is provided to extend rearward on a rear end part of the upper wall of the wire connecting portion20, and the lower sandwiching portion18B (an example of the sandwiching portion) is provided to extend rearward on a rear end part of the lower wall of the wire connecting portion20. The upper and lower sandwiching portions18A,18B have a shape elongated in the front-rear direction. Lengths in the front-rear direction of the upper and lower sandwiching portions18A,18B are substantially equal. An upper holding protrusion23A projecting downward is provided at a position forward of a rear end part on the lower surface of the upper sandwiching portion18A. A lower holding protrusion23B projecting upward is provided on a rear end part on the upper surface of the lower sandwiching portion18B. The lower and upper holding protrusions23B,23A are provided at positions shifted in the front-rear direction. The lower surface of the upper sandwiching portion18A and the upper surface of the lower sandwiching portion18B bite into an oxide film formed on the surface of the core13to peel off the oxide film, thereby exposing the metal surface of the core13. By the contact of this metal surface and the upper and lower sandwiching portions18A,18B, the core13and the terminal body15are electrically connected. [Sliding Portions16] As shown inFIG.5, the sliding portion16is in the form of a rectangular tube extending in the front-rear direction. The sliding portion16is formed into a predetermined shape by a known method such as cutting, casting or press-working. An arbitrary metal such as copper, copper alloy, aluminum, aluminum alloy or stainless steel can be appropriately selected as a metal constituting the sliding portion16if necessary. Although not particularly limited, the sliding portion16according to this embodiment is made of stainless steel. A plating layer may be formed on the surface of the sliding portion16. An arbitrary metal such as tin, nickel or silver can be appropriately selected as a metal constituting the plating layer if necessary. A cross-sectional shape of the sliding portion16is the same as or somewhat larger than that of a region of the terminal body15where the upper and lower sandwiching portions18A,18B are provided. In this way, the sliding portion16is disposed outside the region of the terminal body15where the upper and lower sandwiching portions18A,18B are provided. A cross-sectional area of the wire insertion hole37orthogonal to the front-rear direction is smaller than that of the sliding portion16orthogonal to the front-rear direction. In this way, the sliding portion16cannot pass through the wire insertion hole37in the front-rear direction. As shown inFIG.6, an upper pressurizing portion25A (an example of a pressurizing portion) projecting downward is provided on the lower surface of the upper wall of the sliding portion16. A lower pressurizing portion25B (an example of the pressurizing portion) projecting upward is provided on the upper surface of the lower wall of the sliding portion16. As shown inFIG.5, a partial lock receiving portion26is open at a position near a front end part in the front-rear direction in a side wall of the sliding portion16. Further, a full lock receiving portion27is open at a position behind the partial lock receiving portion26in the side wall of the sliding portion16. The partial lock receiving portion26and the full lock receiving portion27are resiliently lockable to a locking projection28provided on a side wall of the terminal body15. With the locking projection28of the terminal body15and the partial lock receiving portion26of the sliding portion16locked, the sliding portion16is held at a partial locking position with respect to the terminal body15(seeFIG.12). In this state, the upper and lower pressurizing portions25A,25B of the sliding portion16are separated rearward from the rear end edges of the upper and lower sandwiching portions18A,18B of the terminal body15. Further, in this state, an interval between the upper and lower sandwiching portions18A,18B is set to be larger than a diameter of the core13. A state where the locking projection28of the terminal body15and the full lock receiving portion27of the sliding portion16are locked is a state where the sliding portion16is locked at a full locking position with respect to the terminal body15. As shown inFIG.1, in this state, the upper pressurizing portion25A of the sliding portion16is in contact with the upper sandwiching portion18A from above the upper sandwiching portion18A. Further, the lower pressurizing portion25B of the sliding portion16is in contact with the lower sandwiching portion18B from below the lower sandwiching portion18B. As described above, the sliding portion16is slidable between the partial locking position and the full locking position while being externally fit to the region of the terminal body15where the upper and lower sandwiching portions18A,18B are provided. As shown inFIG.1, with the sliding portion16held at the full locking position with respect to the terminal body15, the upper pressurizing portion25A presses the upper sandwiching portion18A from above, whereby the upper sandwiching portion18A is deformed downward. Further, the lower pressurizing portion25B presses the lower sandwiching portion18B from below, whereby the lower sandwiching portion18B is deformed upward. In this way, with the core13disposed to extend in the front-rear direction (extending direction) in a space between the upper and lower sandwiching portions18A and18B and the sliding portion16held at the full locking position with respect to the terminal body15, the core13is sandwiched in the vertical direction by the resiliently deformed upper and lower sandwiching portions18A,18B. That is, the upper sandwiching portion18A is pressed downward by the upper pressurizing portion25A, thereby contacting the core13from above, and the lower sandwiching portion18B is pressed upward by the lower pressurizing portion25B, thereby contacting the core13from below. As shown inFIG.1, with the sliding portion16held at the full locking position with respect to the terminal body15, the upper holding protrusion23A of the upper sandwiching portion18A presses the core13from above and the lower holding protrusion23B of the lower sandwiching portion18B presses the core13from below. In this way, the core13is pressed from above by the upper holding protrusion23A and pressed from below by the lower holding protrusion23B disposed at the position shifted from the upper holding protrusion23A in the front-rear direction, thereby being held in a state bent in the vertical direction (an example of a direction intersecting the extending direction). The core13and the terminal12are electrically connected also by the upper and lower holding protrusions23A,23B. As shown inFIG.7, a jig contact portion46projecting upward from the upper wall is provided on a front end part of the sliding portion16. By bringing a jig45into contact with the jig contact portion46from behind and pressing the sliding portion16forward by this jig45, the sliding portion16is movable forward. Note that the jig45is relatively smaller in size than a mold and a facility for operating this mold. Thus, a cost increase due to the jig45is suppressed. As shown inFIG.6, a pair of guiding portions47projecting inwardly of the sliding portion16are provided at positions near a rear end part of the sliding portion16on both left and right side walls. The guiding portions47are formed to become narrower from a rear side toward a front side. The core13is guided into the sliding portion16by the sliding contact of the core13with the inner surfaces of the guiding portions47. [Assembling Process of Joint Connector10] Next, an example of an assembling process of the joint connector10according to this embodiment is described. The assembling process of the joint connector10is not limited to the one described below. The terminal body15and the sliding portion16are formed by a known method. The sliding portion16is assembled with the terminal body15from behind. The front end edge of the sliding portion16comes into contact with the locking projection28of the terminal body15from behind, thereby expanding and deforming the side wall of the sliding portion16. If the sliding portion16is further pushed, the side wall of the sliding portion16is restored and the partial lock receiving portion26of the sliding portion16is locked to the locking projection28of the terminal body15. In this way, the sliding portion16is held at the partial locking position with respect to the terminal body15(seeFIG.5). In this way, the terminal12is obtained. By injection-molding the synthetic resin, the lower housing30and the upper cover60are formed. As shown inFIG.8, the terminal12having the sliding portion16held at the partial locking position with respect to the terminal body15is inserted into the cavity29of the lower housing30from above. A rear end part of the sliding portion16is located in front of the rear wall31of the lower housing30, and a front end part of the terminal holding portion17of the terminal body15is located behind the front wall of the lower housing30. In this way, the terminal12is held in the cavity29while being positioned in the front-rear direction. As shown inFIG.9, the busbar50is inserted into the busbar insertion holes51of the lower housing30from front. By inserting the locking claws35of the lower housing30into the locking holes56of the busbar50, the busbar50is retained and held in the lower housing30(seeFIG.10). The tabs52of the busbar50are inserted into the tube portions17of the terminals12. By the contact of the tabs52and the resilient contact piece19, the tabs52and the terminals12are electrically connected. In this way, the plurality of terminals12are electrically connected via the busbar50. As shown inFIG.11, the tab52inserted into the terminal holding portion17contacts the inner wall of the terminal holding portion17, whereby the terminal12is retained and held in the cavity29not to come out upward. The core13of the wire11is exposed by stripping the insulation coating14by a known method. As shown inFIG.12, the front end part of the core13is inserted from behind into the wire insertion hole37provided in the rear wall31. If the wire11is further pushed forward, the front end part of the core13is introduced into the sliding portion16from the rear end part of the sliding portion16. The core13is guided into the sliding portion16by coming into contact with the guiding portions47of the sliding portion16. If the wire11is further pushed forward, the front end part of the core13enters the terminal body15and reaches the space between the upper and lower sandwiching portions18A,18B. As shown inFIG.12, with the sliding portion16held at the partial locking position with respect to the terminal body15, the interval between the upper and lower sandwiching portions18A,18B is set to be larger than an outer diameter of the core13. Subsequently, as shown inFIG.7, the jig45is brought into contact with the jig contact portion46from behind and the sliding portion16is slid forward. The sliding portion16is moved relatively forward with respect to the terminal body15. At this time, locking between the locking projection28of the terminal body15and the partial lock receiving portion26of the sliding portion16is released and the side wall of the sliding portion16rides on the locking projection28to be expanded and deformed. When the sliding portion16is moved forward, the side wall of the sliding portion16is restored and the locking projection28of the terminal body15and the full lock receiving portion27of the sliding portion16are resiliently locked. In this way, the sliding portion16is held at the full locking position with respect to the terminal body15. With the sliding portion16held at the full locking position with respect to the terminal body15, the upper pressurizing portion25A of the sliding portion16comes into contact with the upper sandwiching portion18A of the terminal body15from above to press the upper sandwiching portion18A downward. Further, the lower pressurizing portion25B of the sliding portion16comes into contact with the lower sandwiching portion18B of the terminal body15from below to press the lower sandwiching portion18A upward. In this way, the core13is sandwiched from upper and lower sides by the upper and lower sandwiching portions18A,18B (seeFIG.12). As shown inFIG.7, the core13is sandwiched by the lower surface of the upper sandwiching portion18A and the upper surface of the lower sandwiching portion18B, whereby the oxide film formed on the surface of the core13is peeled off to expose the metal surface constituting the core13. By the contact of this metal surface and the upper and lower sandwiching portions18A,18B, the wire11and the terminal12are electrically connected. In this way, the plurality of wires11are electrically connected via the terminals12and the busbar50(seeFIG.13). With the core13sandwiched from upper and lower sides by the upper and lower sandwiching portions18A,18B, the core13extends in the front-rear direction and is held in the state bent in the vertical direction by being sandwiched by the upper holding protrusion23A of the upper sandwiching portion18A and the lower holding protrusion23B of the lower sandwiching portion18B. Since the core13can be firmly held in this way, a holding force of the wire11and the terminal12can be enhanced when a pulling force is applied to the wire11. As shown inFIG.1, the upper cover60is assembled with the lower housing30from above the lower housing30. With the lower housing30and the upper cover60assembled, front end parts of the front terminal holding portions63F of the upper cover60are located behind the jig contact portions46of the sliding portions16. By the contact of the front end parts of the front terminal holding portions63F with the sliding portions16from behind, rearward movements of the sliding portions16are suppressed. With the lower housing30and the upper cover60assembled, the front terminal holding portions63F are locked to cover the sliding portions16from above. In this way, the terminals12are retained and held in the cavities29not to come out upward. With the lower housing30and the upper cover60assembled, the rear terminal holding portions63R are located behind the sliding portions16. By the contact of the rear terminal holding portions63R with the sliding portions16from behind, the terminals12are retained and held in the cavities29not to come out rearward. In this way, the joint connector10is completed. Functions and Effects of Embodiment Next, functions and effects of this embodiment are described. The joint connector10according to this embodiment is the joint connector10for connecting the plurality of wires11and includes the lower housing30, the upper cover60assembled with the lower housing30, the plurality of terminals12respectively connected to the front end parts in the extending direction of the plurality of wires11and the busbar50connected to the plurality of terminals12. The busbar50disposed in the lower housing30includes the plurality of tabs52. Each of the plurality of terminals12disposed in the lower housing30includes the tube portion17, each of the plurality of tabs52being inserted into the tube portion17, the upper and lower sandwiching portions18A,18B extending along the extending direction and configured to sandwich one of the plurality of wires11, and the sliding portion16disposed outside the upper and lower sandwiching portions18A,18B, movable along the front-rear direction and including the upper and lower pressurizing portions25A,25B for pressurizing the upper and lower sandwiching portions18A,18B toward the wire11with the one of the plurality of wires11sandwiched by the upper and lower sandwiching portions18A,18B. The terminal holding portions63projecting downward from the upper cover60are engaged with the terminals12. According to this embodiment, the core13of the wire11and the terminal12can be electrically connected without using a relatively large-scale jig by pushing the sliding portion16forward with the relatively small jig45. In this way, the manufacturing cost of the joint connector10can be reduced. Further, by applying the terminals12according to this embodiment to the joint connector10, the manufacturing cost of the joint connector10can be reduced. According to this embodiment, the terminals12can be retained and held in the lower housing30not to come out upward by inserting the busbar50into the tube portions17. Since a structure for retaining and holding the terminals12becomes unnecessary in this way, the structure of the joint connector10can be simplified. As a result, the manufacturing cost of the joint connector10can be reduced. The sliding portion16is movable with respect to the upper and lower sandwiching portions18A,18B between the partial locking position where the upper and lower pressurizing portions25A,25B are separated from the upper and lower sandwiching portions18A,18B and the full locking position where the upper and lower pressurizing portions25A,25B press the upper and lower sandwiching portions18A,18B toward the wire11, and the terminal holding portion63is locked to the sliding portion16at the full locking position with respect to the upper and lower sandwiching portions18A,18B. With the lower housing30and the upper cover60assembled, the front terminal holding portions63F are locked to cover the sliding portions16from above. In this way, the terminals12are retained and held in the cavities29not to come out upward. With the lower housing30and the upper cover60assembled, the rear terminal holding portions63R are located behind the sliding portions16. By locking the rear terminal holding portions63R to the sliding portions16from behind, the terminals12are retained and held in the cavities29not to come out rearward. By assembling the upper cover60with the lower housing30, the terminal holding portions63(front and rear terminal holding portions63F,63R) provided on the upper cover60as described above are locked to the sliding portions16as described above. Thus, it can be confirmed that the sliding portions16have moved to the full locking position. According to this embodiment, the lower housing30includes the rear wall31located behind the plurality of terminals12in the extending direction, the rear wall31includes the plurality of wire insertion holes37penetrating in the extending direction, the plurality of wires11being respectively inserted into the wire insertion holes37, and the upper and lower sandwiching portions18A,18B are disposed in front of the wire insertion holes37. If the wire11is inserted from behind the wire insertion hole37, the wire11enters between the upper and lower sandwiching portions18A,18B located in front of the wire insertion hole37. Since the wire11is guided into between the upper and lower sandwiching portions18A,18B by the wire insertion hole37, the manufacturing efficiency of the joint connector10can be improved. According to this embodiment, the cross-sectional area of the wire insertion hole37orthogonal to the front-rear direction is smaller than that of the sliding portion16orthogonal to the front-rear direction. Since the cross-sectional area of the wire insertion hole37is smaller than that of the sliding portion16, the escape of the sliding portion16to the outside of the lower housing30through the wire insertion hole37is suppressed. In this way, the terminal12having the sliding portion16held at the partial locking position can be held in the lower housing30. Other Embodiments The present disclosure is not limited to the above described and illustrated embodiment. For example, the following embodiments are also included in the technical scope of the technique disclosed in this specification. (1) Two, three, five or more terminals12may be disposed in the lower housing30. (2) The upper cover60and the lower housing30may be integrated by a hinge or the like. (3) The terminal12may include one, three or more sandwiching portions. LIST OF REFERENCE NUMERALS 10: joint connector11: wire12: terminal13: core14: insulation coating15: terminal body16: sliding portion17: tube portion18A: upper sandwiching portion18B: lower sandwiching portion19: resilient contact piece20: wire connecting portion23A: upper holding protrusion23B: lower holding protrusion25A: upper pressurizing portion25B: lower pressurizing portion26: partial lock receiving portion27: full lock receiving portion28: locking projection29: cavity30: lower housing31: rear wall35: locking claw36: rear wall37: wire insertion hole39: insertion hole45: jig46: jig contact portion47: guiding portion50: busbar51: busbar insertion hole52: tab53: relay portion54: coupling portion56: locking hole60: upper cover61: upper wall62: side wall63: terminal holding portion63F: front terminal holding portion63R: rear terminal holding portion64: groove | 33,006 |
11942738 | DETAILED DESCRIPTION Before explaining one or more embodiments of the disclosure in detail, it is to be understood that the embodiments are not limited in their application to the details of construction and the arrangement of the components or steps or methodologies set forth in the following description or illustrated in the drawings. In the following detailed description of embodiments, numerous specific details may be set forth in order to provide a more thorough understanding of the disclosure. However, it will be apparent to one of ordinary skill in the art having the benefit of the instant disclosure that the embodiments disclosed herein may be practiced without some of these specific details. In other instances, well-known features may not be described in detail to avoid unnecessarily complicating the instant disclosure. As used herein a letter following a reference numeral is intended to reference an embodiment of the feature or element that may be similar, but not necessarily identical, to a previously described element or feature bearing the same reference numeral (e.g.,1,1a,1b). Such shorthand notations are used for purposes of convenience only and should not be construed to limit the disclosure in any way unless expressly stated to the contrary. Further, unless expressly stated to the contrary, “or” refers to an inclusive or and not to an exclusive or. For example, a condition A or B is satisfied by anyone of the following: A is true (or present) and B is false (or not present), A is false (or not present) and B is true (or present), and both A and B are true (or present). In addition, use of “a” or “an” may be employed to describe elements and components of embodiments disclosed herein. This is done merely for convenience and “a” and “an” are intended to include “one” or “at least one,” and the singular also includes the plural unless it is obvious that it is meant otherwise. Finally, as used herein any reference to “one embodiment” or “some embodiments” means that a particular element, feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment disclosed herein. The appearances of the phrase “in some embodiments” in various places in the specification are not necessarily all referring to the same embodiment, and embodiments may include one or more of the features expressly described or inherently present herein, or any combination of sub-combination of two or more such features, along with any other features which may not necessarily be expressly described or inherently present in the instant disclosure. A structural connector system for providing an electrical connection between electronic componentry is disclosed. The structural connector system may be configured as a component of a structural chassis for an electronic device that provides a protective construction for the electronic componentry within the device and an anchor point for the electronic components as well as providing electrical connectivity between two or more electronic components within or associated with the electronic device. The structural chassis may comprise a single structural connector system, more than one structural connector system, or may be constructed entirely of structural connector systems. The mechanical and electrical coupling of electronic components by the structural connector system increases the packing density of components (e.g., less need for wires). The structural connector system also eases and or simplifies the mechanical assembly of electronic components, leading to decreased cost, deceased weight, and/or decreased weight for device assembly and/or use. FIG.1Aillustrates a structural connector system100, in accordance with one or more embodiments of the disclosure. In some embodiments, the structural connector system includes a first structural member105. The first structural member105may be of any shape known in the art for constructing electronic devices. For example, the first structural member105may have a cuboid shape. For instance, the first structural member105may be configured as a right rectangular prism (e.g., as indicated inFIG.1A). In another example, the first structural member105may be configured as a hexagonal prism. In another example, the first structural member105may be configured as a triangular prism. In another example, the first structural member may be configured as an octagonal prism. In another example, the first structural member may be configured as a half or quarter cylinder (e.g., having one or more straight length sides and one curved length side). In another example, the first structural member may be configured as a shape having one or more rounded corners (e.g., the corner at the intersection between two planes of the shape). In another example, the first structural member105may be shaped with grooves or slits that allow interlocking with other first structural members105. The first structural member105may be of any size. For example, the first structural member105may have a length, height and/or width corresponding to the size requirements of a line replaceable unit (LRU). For instance, the length of the first structural member105may be approximately 19.3 cm (i.e., approximately the standard height dimension for an ARINC-600 standardized LRU). In another instance, the length of the first structural member105may be approximately 31.8 cm (e.g., approximately the standard length for an LRU. In another example, the first structural member105may have a length, height, or width corresponding to the size of a multi-chip module (e.g., the first structural member105providing mechanical support and electrical coupling to one or more integrated circuit packages). For instance, the first structural member may have a length ranging from one cm to 10 cm. In some embodiments, the first structural member105includes an insulating matrix110. The insulating matrix110is configured to electrically insulate one or more areas of the first structural member105from any electrical routes that are provided on or under the surface of the first structural member105. The insulating matrix110may include any type of electrically insulating material including but not limited to plastics, ceramics, glass, polymers, rubber. The first structural member105may also include any non-electrically insulating material (e.g., metal) that is itself electrically insulated from any electrical routes. In some embodiments, the first structural member105includes a first end surface115, a second end surface120(i.e., the top and bottom faces), and a first component engaging surface125. The first component engaging surface125may be any surface of the first structural member105(e.g., one of the sides of the first structural member105, the first end surface115, or the second end surface120). For example, the first component engaging surface125may be configured adjacent to at least one of the first end surface115or the second end surface120. The first component engaging surface125is configured to mechanically couple and/or electrically couple to a first electronic component of an electronic device and/or a first chassis component. The first component may be any type of componentry used for an electronic device including but not limited to printed circuit boards (PCB), printed wiring boards (PWB), expansion cards, electronic packages, motherboards, backplanes, riser cards, expansion slots, connector sockets, and batteries. The first chassis component may include any structural element including but not limited to a chassis frame section, a backplane, an air transport rack ATR) section, or a another first structural member105). In some embodiments, the first structural member105includes at least one second component engaging surface130. The second component engaging surface130may be any surface of the first structural member105(e.g., one of the sides of the first structural member105, the first end surface115, or the second end surface120). For example, the second component engaging surface130may be configured adjacent to at least one of the first end surface115or the second end surface120. The second component engaging surface130is configured to mechanically couple and electrically couple to a second component of an electronic device. The second component may be any type of componentry used for an electronic device including but not limited to printed circuit boards (PCB), printed wiring boards (PWB), expansion cards, electronic packages, motherboards, backplanes, riser cards, expansion slots, connector sockets, and batteries. The first component and the second component may comprise the same component. For example, an expansion card may be configured to mechanically couple and electrically couple to the first component engaging surface125and mechanically couple and/or electrically couple to the second component engaging surface130(i.e., mechanically coupling a component to more than one surface may increase stability of the component. The second component engaging surface130may be disposed on a side of the first structural member105adjacent to the first component engaging surface125(e.g., as shown inFIG.1A). In some embodiments, the second component engaging surface may be disposed on a side of the first structural member105nonadjacent to the first component engaging surface125. (e.g., the opposite side of the first component engaging surface125). Therefore, any side of the first structural member105and any number of sides of the first structural member105may be configured as a second component engaging surface130. For example, the first end surface115and/or the second end surface may be configured as a second component engaging surface130. In embodiments, the first component engaging surface125and the second component engaging surface130include one or more mechanical couplers135a,135b(e.g., one or more first mechanical couplers for the first component engaging surface125and one or more second mechanical couplers for the second component engaging surface130). The mechanical couplers135a,135bare configured to couple the first structural member105to the first component of the electronic device, the second component of the electronic device, a first chassis component, or a second chassis component (e.g., the first chassis component or second chassis component may be configured as a second structural member). The mechanical couplers135a,135bmay be configured as any type of coupling device or fastener that includes but are not limited to clamps, locks (e.g., friction locks), coupling nuts, rivets (e.g., Christmas tree rivets), and screws. For example, the mechanical coupler135a,135bmay comprise a threaded bore on the first structural member105configured to receive a threaded screw. Once received, threaded screw is then configured to enter through to the opposite side of the first structural member105, toward the first component of the device configured with a similarly threaded bore. Further insertion of threaded screw engaged the threaded bore on the first component, mechanically coupling the first component to the first structural member105. Thus, the mechanical couplers135a,135bmay be configured to mechanically attach an electronic component to a side of the first structural member105that faces inside an electronic chassis while accessing the side of the first structural member105that faces the outside of the electronic chassis. In another example, the mechanical couplers135a,135bmay include clearance holes. The clearance holes may be configured as oversized holes that allow the fasteners to move slightly to account for tolerance stackup. The clearance holes may also enable easy access of a screwdriver to engage and tighten the threaded screw, further tightening the first component to the first structural member105. In embodiments, the first component engaging surface125and the second component engaging surface130include one or more electrical couplers140a,140bconfigured to electrically couple with one or more electronic components (e.g., a first electronic component and/or a second electronic component) or with one or more chassis components (e.g., a first chassis component and/or a second chassis component). The one or more electrical couplers140a,140bmay couple an electronic component in tandem with the mechanical coupling of the same electronic component via the one or more mechanical couplers135a,135b. For example, as a first electronic component is tightened against the first structural member105via one of the one or more mechanical couplers135a, the electrical coupler140amay come into contact with an electrical contact of the first electronic component. The one or more mechanical couplers135a,135b, may also mechanically couple to a first electronic component without electrically coupling (e.g., the one or more electric couplers140a,140bare not used for purely mechanical couplings). In another example, the one or more electrical couplers140a,140b, may also both electrically couple and mechanically couple the first structural member105to the first electronic component. For example, the electrical coupler may be configured as a metallic screw configured to be received by a threaded borehole disposed within the first structural member105and configured to be received by a metallic threaded receiver on the first electronic component, wherein tightening of the screw secures the first electronic component to the first structural member105and provides a conductive path from the first structural member to the electronic component. In other words, the mechanical coupler135a,135b, such as a fastener, may be integrated into an electrical circuit. Alternatively, the fastener may be electrically isolated from the electrical circuit. It should be understood that electrical coupling may include either the contact of two or more electrically conducting elements or the contact and mechanical coupling of two or more electrically conducting elements. In embodiments, the first structural member105further includes a third electrical coupler configured to electrically couple the first electronic component, the first chassis component, the second electronic component, the second chassis component, a third electronic component, or a third chassis component to a third end of the electrically conducting path155(i.e., the electrically conducting path155configured as a branched path, having multiple ends). For example, the third electrical coupler may be disposed on a third component engaging surface. For instance, the third electrical coupler may be disposed on a third component engaging surface along with a third mechanical coupler. In this manner, the first structural member105may have any number of component engaging surfaces, electrical couplers140, mechanical couplers135, and electrically conducting paths155, with any number of the electrically conducing paths branched with any number of ends. Therefore, the above description should not be interpreted as a limitation of the present disclosure, but as an illustration. FIG.1Billustrates a close-up view of the structural connector system100as shown inFIG.1A, in accordance with one or more embodiments of the disclosure. The close-up view demonstrates a first conducting element145and a second conducting element150of the electrical coupler140a, which are electrically coupled via an electrically conducting path155(i.e., the electrically conducting path155, the first conducting element, and the second conducting element comprise the electric coupler140a, permitting the electric coupler140ato receive and transmit an electric impulses). For example, the first conducting element145may receive electric impulses from a first electronic component and transmit the impulses to a second electronic component via the second conducting element150. In another example, the first conducting element145and the second conducting element150are configured as a combined conducting element that is embedded within the electrically insulating matrix110(e.g., along the electrically conducting path155). The electrically conducting path155may be formed of the same or different material as the first conducting element and the second conducting element. For example, the electrical coupler140a, including the electrically conducting path, the first conducting element, and the second conducting element, may be configured as a copper wire than has been inserted into a borehole within the first structural element. The electrical coupler140amay also be formed of other compressible electrical contacts such as fuzz buttons or pogo pins. The electrical coupler140amay configured preinstalled within the first structural member105, or may require installment into the first structural member105. For example, the first structural member105may have a shaft155predrilled through the first component engaging surface125and the second component engaging surface130, forming a first aperture and a second aperture that permits the introduction of the electrically conducting path155(e.g., a fuzz button) into the shaft155. Any orientation and/or placement of the first conducting element145and the second conducting element150are possible. For example, the first conducting element145may be configured as protruding the first component engaging surface125, with the second conducting element145protruding the second component engaging surface130(e.g., an adjacent side), the first conducting element145and the second conducting element electrically coupled via the electrically conducting path155(e.g., the electrically coupled path disposed with the first structural member105, as inFIG.1B. In another example, the first conducting element145and the second conducting element150may be disposed on the same side of the first structural member105. In another example, the first conducting element145and the second conducting element150may be disposed on non-adjacent sides of the first structural member105(e.g., opposite sides). In another example, the first conducting element145may be disposed on the first component engaging surface125while the second conducting element may be disposed on an adjacent first end surface115. Thus, the electronic coupler140provides an electrically conducting path between two adjacent or nonadjacent faces of the first structural member105, with the electrical coupler providing a first conducting element145and a second conducting element150providing an electrical contact for one or more electronic components. It should be understood that an electric coupler140(e.g., a first electric coupler) having a first conducting element145disposed on the first component engaging surface125and a second conducting element150disposed on the second component engaging surface130may also be considered as an electric coupler140(e.g., a second electric coupler) having a first conducting element145dispose on the second component engaging surface130and a second conducting element150dispose on the first component engaging surface125(i.e., both the first component engaging surface125and the second engaging surface130‘claiming’ the same electric coupler). Therefore, the above description should not be interpreted as a limitation of the present disclosure, but as an illustration. In embodiments, the electrically conducting path155may be disposed on the one or more surfaces of the first structural member105.FIG.1Cillustrates a first structural member105with several electrical couplers140, each having an externally laid electrically conductive path155that connect first conducting elements145with second conducting elements150. For example, the electrically conductive path155may be configured as one or more traces160deposited on the first component engaging surface125, the second component engaging surface130, and/or other surfaces on the first structural member105(e.g., the one or more traces160disposed on the external surface of the first structural member). The first conducting elements145and second conducting elements150may be deposited along with the electrically conductive path, or may be configured as compliant connectors that are linked to the one or more traces160. In embodiments, one or more surfaces of the first structural member105may be curved to facilitate the process of connecting the first conductive elements145and second conductive elements150. For example, the curved surfaces may reduce stress concentrations that may occur at corners. The electrically conductive path155may be deposited onto one or more surfaces of the first structural member via any method known including but not limited to vapor deposition, plating processes, or printing. The first conductive element145and the second conductive element150also may be formed via any method known including but not limited to vapor deposition, plating processes, or printing. The first conductive element and second conductive element may be oriented so as to increase the contact of the electrical coupler140with the electronic component.FIG.1Dillustrates a section of the first structural member105configured with electrical couplers140a,140chaving first conducting elements145a,145c, and second conducting elements150a,150cthat are angled relative to the face of the side that the elements project. For example, the first conducting element145aprojects outward from the first component engaging surface125at approximately 45° relative to the plane of the first component engaging surface125. The corresponding second conducting element150aprojects outward from the second component engaging surface130at approximately 45° relative to the plane of the second component engaging surface. In another example, the first conducting element145cprojects outward from the first component engaging surface125at approximately 45° relative to the plane of the first component engaging surface125. The corresponding second conducting element150cprojects outward from the first end surface115, at approximately 45° relative to the plane of the second component engaging surface. Any angle or orientation of the first conducting element145or second conducting element150are possible. It should be understood that the first conducting element145and the second conducting element150may be combined as a single component that is threaded through insulating matrix110of the first structural member105(e.g., via the electrically conducting path155). It should also be understood that the first conducting element145and the second conducting elements150may be configured as separate elements inserted into the holes within the insulating matrix110. Any configuration of first conducting elements145and second conducting elements are possible. Therefore, the above description should not be interpreted as a limitation of the present disclosure, but as an illustration. In embodiments, the first structural member105may attach to other members within a chassis.FIG.2Aillustrates a portion of a chassis framework200that includes the first structural member105with a second structural member205and a third structural member210, in accordance with one or more embodiments of the disclosure. An end of each of the first structural member105, the second structural member205, and the third structural member210are mechanically coupled via the mechanical coupler135or other coupling mechanism to form a corner. Various mechanical couplers135and electrical couplers140located along the first structural member105, the second structural member205, and the third structural member210may be configured to mechanically couple and/or electrically couple to multiple electronic components and/or chassis components (i.e., similar to the first structural member). Electrical couplers140disposed on the first end surface115of the first structural member and/or the second structural member205, along with an electrical coupler140on the third structural member may also be electrically coupled, allowing current to be conducted through multiple structural members. In some embodiments, at least one of the first mechanical coupler135aor the second mechanical coupler135bis electrically coupled to the electrically conductive path155and at least one of the first electronic component or the second electronic component.” FIG.2Billustrates an electronic chassis250formed from12first structural members105a-l, in accordance with one or more embodiments of the disclosure. Mechanical couplers135and electrical couplers140distributed along the first structural members105a-lmay be used to mechanically couple and electrically couple electronic components to the electronic chassis250. The electronic chassis250may be of any type of structure and should not be limited to the cube shape as shown inFIG.2B. For example, the electronic chassis250may be formed as a rectangular prism (e.g., with dimensions associated with LRUs). In another example, the electronic chassis250may be configured as an icosahedron. The electronic chassis250may also be configured as a module for an electronic chassis system, wherein multiple electronic chassis250are coupled together via one of more mechanical couplers135and are electrically coupled via one or more electrical couplers140. It is inferred first structural members105a-lact as part of the circuitry within the electronic chassis250and electronic components. Removal of one or more of the first structural members105a-lmay interrupt an electrical circuit within the electronic components, causing the electronic components to cease function. In some embodiments, the electrical coupler140may include any passive electronic element including but not limited to resistors, capacitors, and inductors. For example, the electrically conductive path155of the electric coupler140may include a resistor configured to limit current flow. In another example, the first conducting element145may include a capacitor configured to store electric charge as well as a conducting surface configured to electrically couple to an electronic component. In some embodiments, the electrical coupler140may include active electronic elements including but not limited to transistor, diodes, visible status annunciators, line drivers, and integrated circuits. For example, the electric coupler140may include a status annunciator configured to emit a light signal upon the detection of current. In another example, the electrically conductive path155of the electric coupler140may include a diode configured to control current flow through the electrically conductive path155. It is to be understood that embodiments of the methods disclosed herein may include one or more of the steps described herein. Further, such steps may be carried out in any desired order and two or more of the steps may be carried out simultaneously with one another. Two or more of the steps disclosed herein may be combined in a single step, and in some embodiments, one or more of the steps may be carried out as two or more sub-steps. Further, other steps or sub-steps may be carried in addition to, or as substitutes to one or more of the steps disclosed herein. Although inventive concepts have been described with reference to the embodiments illustrated in the attached drawing figures, equivalents may be employed and substitutions made herein without departing from the scope of the claims. Components illustrated and described herein are merely examples of a system/device and components that may be used to implement embodiments of the inventive concepts and may be replaced with other devices and components without departing from the scope of the claims. Furthermore, any dimensions, degrees, and/or numerical ranges provided herein are to be understood as non-limiting examples unless otherwise specified in the claims. | 27,890 |
11942739 | DETAILED DESCRIPTION Referring more specifically to the drawings, for illustrative purposes the subject technology is embodied in the system generally shown inFIGS.1through4. It will be appreciated that the subject slip ring assembly may vary as to configuration and as to details of the components, and that the method of utilizing the subject technology may vary as to the specific steps and sequence of operation, without departing from the basic concepts as disclosed herein. Generally, the subject technology comprises a high RPM-capable slip ring assembly for use in a selected application. Frequently the selected application is a system that utilizes a CR motor or equivalent, for transferring electricity between a stationary exterior environment and a rotating interior environment. The flow of electricity may be reversed when the slip ring assembly is utilized in conjunction with a generator or like device. For exemplary purposes only, and not by way of limitation, the below description will be applicable to a CR motor application. As seen inFIGS.1and2, the subject slip ring assembly5includes a non-rotating electrical power member (left side component ofFIG.1) for receiving incoming electricity and a rotating electrical power member for moving outgoing electricity to the selected rotating application (often a CR motor or the equivalent). Comprising the non-rotating electrical power member is an electrically non-conductive spindle8having an electrically non-conductive spindle head10with a generally planar and exposed contacting surface and an attached support member14. The generally planar and exposed contacting surface is formed with a set of concentric channels or grooves into which a set of concentric electrically conducting power transmission cylinders20,21, and22are mated, thereby exposing the non-conducting spindle material11,12, and13between the electrically conducting power transmission cylinders20,21, and22. The concentric electrically conducting power transmission cylinders20,21, and22have inside and outside surfaces. The top portion of each electrically conducting power transmission cylinder20,21, and22is exposed and slides over a mated partner power transmission cylinder25,26, and27in the rotating electrical power member, in which outer-to-inner surfaces contact is achieved. A set of electrical wires30(three for exemplary purposes only) run through a central opening38in the support member14and are connected to the transmission cylinders (one wire to each transmission cylinder20,21, and22). The non-conductive spindle head10may be fabricated from suitably rigid materials such as Delrin, Nylon, other polymeric compositions, ceramics, glass, and equivalent non-conductive substances. Likewise, the support member14may be fabricated from similar materials and may be created as an extension of the spindle head10as a single unit. Also, as seen inFIGS.1and2, the subject slip ring assembly5includes a rotating output electrical power member (right side component ofFIG.1) for transferring electricity to or from the selected rotating application (often a CR motor or the equivalent). Comprising the rotating electrical power member is an electrically non-conductive spindle9having an electrically non-conductive spindle head15with a generally planar and exposed contacting surface and an attached support member19. The generally planar and exposed contacting surface is formed with a set of concentric channels or grooves into which a set of concentric electrically conducting power transmission cylinders25,26, and27are mated, thereby exposing the non-conducting spindle material15,16,17, and18between the electrically conducting power transmission cylinders25,26, and27. The concentric electrically conducting power transmission cylinders25,26, and27each have inside and outside surfaces. The top portion of each electrically conducting power transmission cylinder25,26, and27is exposed and slides over a mated partner power transmission cylinder20,21, and22in the non-rotating electrical power member. The two sets of cylinders slide within each other to produce outer-to-inner surfaces contact. A set of electrical wires35(three for exemplary purposes only) run through a hollow center39of the support member19and are connected to the transmission cylinders (one wire to each transmission cylinder25,26, and27). The non-conductive spindle head15may be fabricated from suitably rigid materials such as Delrin, Nylon, other polymeric compositions, ceramics, glass, and equivalent non-conductive substances. Likewise, the support member19may be fabricated from similar materials and may be created as an extension of the spindle head15as a single unit. FIG.2shows that when the non-rotating and rotating electrical power members10and15rotationally mate to one another the transmission cylinders align next to one another40.45, and46or one cylinder is inside its partner (in this example:20inside25,21inside26, and22inside27). FIG.3shows a housing formed from mated halves50and55surrounds the spindle heads10and15and at least a portion of the support members14and19. The two halves50and55may be releasably (or permanently if desired) secured to one another standard means such as threading, clips, and the like. Within the housing is resilient means65for urging the sliding inside and outside surfaces (20to25,21to26, and22to27in the example) to contact one another to maintain electrical contact during rotation. The resilient means65may be springs, compressible foam, and the like. Bearing60and65mounted in one frame half55permit the rotating electrical power member (15and19) to rotate. Additionally, the two sets of cylinders may each have a slight conical form (angled-in sides) so that the resilient means65pushes one cylinder's outside surface into the inner surface of its surrounding cylinder (as noted:20inside25,21inside26, and22inside27). The two sets electrically conductive power transmission cylinders20,21, and22and25,26, and27are fabricated from a variety of possible materials with the limitation that at least one cylinder in each slip-mated pair is formed from a porous/sintered material that contains a lubricant of desired viscosity and is exemplified by the readily and commercially available copper or steel Oilite™ material. Preferred porous/sintered electrically conducting material are fabricated from a metal, metal alloy, of the equivalent and preferably a brass alloy for efficient electrical conductivity and impregnated with an oil lubricant such as the commonly available Oilite™ material. Again, it is noted that Oilite™ is a porous/sintered bronze, brass, iron alloy, or other electrically conducting metal or non-metal material commonly holding an oil lubricant and readily available from numerous commercial suppliers. Sintered brass or bronze, with absorbed lubricant, is a preferred exemplary material utilized for these components and conducts electricity very efficiently. The oil lubricant may be natural or synthetic. The porous/sintered bands or tracks (such as commercially available Oilite™) are often formed using powder metallurgy so that tiny pores are present in the metal. The pores are then vacuum impregnated with an oil to improve the materials bearing ability. The material holds approximately 20% oil by volume. A common lubricant is SAE30oil or other equivalents. Other equivalent materials to Oilite™ may be utilized with the subject technology. Both of the two sets of electrically conductive power transmission cylinders20,21, and22and25,26, and27may be fabricated from lubricated porous/sintered metal (exemplary Oilite™) or one set may be formed from the lubricated porous/sintered metal and the other set may be a metal such as brass, bronze, copper, steel, metal alloy, carbon, carbon composites, synthetic electrically conductive polymers, other suitable conductive metals and non-metals, and the like. Clearly, these paired combinations may be mixed between cylinders in either electrical power member as long as one of the cylinder mated pairs is made of a lubricated porous/sintered substance. FIG.3shows a volume75within the surrounding housing50and55and it may be filled with additional lubricant to facilitate rotation. FIG.4is a perspective view of the subject slip ring assembly, without the surrounding housing, and, in particular, shows the outer most non-rotating cylinder20mated within the outer most rotating cylinder25. From the description herein, it will be appreciated that the present disclosure encompasses multiple embodiments which include, but are not limited to, the following: a slip ring assembly for use in a selected application for transferring electrical power between an exterior environment and a rotating interior environment, comprising: a first electrically non-conductive spindle having a generally planar contacting surface; a first set of concentric channels formed in the first electrically non-conductive spindle planar contacting surface; a first set of concentric electrically conducting power transmission cylinders, with each having inside and outside surfaces, wherein each power transmission cylinder within the set fits within a separate channel of the first set of concentric channels and extends out past the generally planar surface; a set of first electrical wires with each member within the first wire set connected to one the electrically conducting power transmission cylinder and extending from the non-rotating electrical power member; a rotating electrical power member, comprising: a second electrically non-conductive spindle having a generally planar contacting surface; a second series of concentric channels formed in the second electrically non-conductive spindle planar contacting surface; a second set of concentric electrically conducting power transmission cylinders, with each having inside and outside surfaces, wherein each power transmission band within the set fits within a separate channel of the second set of concentric channels and extends out past the generally planar surface, wherein when rotationally mated with the first set of concentric electrically conducting power transmission cylinders paired power transmission cylinders result with the inside surface of one cylinder sliding over the outside surface of another cylinder; a set of second electrical wires with each member within the second wire set connected to one the electrically conducting power transmission cylinders and exiting from the rotating electrical power member; and a housing that surrounds both the non-rotating electrical power member and the rotating electrical power member to align the first set of concentric electrically conducting power transmission cylinders and the second set of concentric electrically conducting power transmission cylinders to slide over one another on their the inside and outside surfaces during rotationally operation of the slip ring assembly. An additional embodiment further comprises a resilient member within the housing that urges the first set of concentric electrically conducting power transmission cylinders and the second set of concentric electrically conducting power transmission cylinders towards one another. Also, the first and second sets of concentric electrically conducting power transmission cylinders may have a gradual conical form that, within the housing, urges the inside and outside surfaces to contact one another during rotation. Another embodiment includes either the first set of concentric electrically conducting power transmission cylinders or the second set of concentric electrically conducting power transmission being fabricated from a lubricated sintered metallic material and the other is an electrically conducting metal or metal containing material and either the first set of concentric electrically conducting power transmission cylinders or the second set of concentric electrically conducting power transmission cylinders may be fabricated from lubricated Oilite™ and the other is an electrically conducting metal or metal containing material. Further, either the first set of concentric electrically conducting power transmission cylinders or the second set of concentric electrically conducting power transmission cylinders is fabricated from lubricated Oilite™ and the other is copper or a copper containing alloy. Yet an additional embodiment has both the first set of concentric electrically conducting power transmission cylinders and the second set of concentric electrically conducting power transmission cylinders fabricated from a lubricated porous/sintered metallic material. Finally, both the first set of concentric electrically conducting power transmission cylinders and the second set of concentric electrically conducting power transmission cylinders are fabricated from lubricated Oilite™. Embodiments of the present technology may be described herein with reference to flowchart illustrations of methods and systems according to embodiments of the technology, and/or procedures, algorithms, steps, operations, formulae, or other computational depictions, which may also be implemented as computer program products. In this regard, each block or step of a flowchart, and combinations of blocks (and/or steps) in a flowchart, as well as any procedure, algorithm, step, operation, formula, or computational depiction can be implemented by various means, such as hardware, firmware, and/or software including one or more computer program instructions embodied in computer-readable program code. As will be appreciated, any such computer program instructions may be executed by one or more computer processors, including without limitation a general purpose computer or special purpose computer, or other programmable processing apparatus to produce a machine, such that the computer program instructions which execute on the computer processor(s) or other programmable processing apparatus create means for implementing the function(s) specified. Accordingly, blocks of the flowcharts, and procedures, algorithms, steps, operations, formulae, or computational depictions described herein support combinations of means for performing the specified function(s), combinations of steps for performing the specified function(s), and computer program instructions, such as embodied in computer-readable program code logic means, for performing the specified function(s). It will also be understood that each block of the flowchart illustrations, as well as any procedures, algorithms, steps, operations, formulae, or computational depictions and combinations thereof described herein, can be implemented by special purpose hardware-based computer systems which perform the specified function(s) or step(s), or combinations of special purpose hardware and computer-readable program code. Furthermore, these computer program instructions, such as embodied in computer-readable program code, may also be stored in one or more computer-readable memory or memory devices that can direct a computer processor or other programmable processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory or memory devices produce an article of manufacture including instruction means which implement the function specified in the block(s) of the flowchart(s). The computer program instructions may also be executed by a computer processor or other programmable processing apparatus to cause a series of operational steps to be performed on the computer processor or other programmable processing apparatus to produce a computer-implemented process such that the instructions which execute on the computer processor or other programmable processing apparatus provide steps for implementing the functions specified in the block(s) of the flowchart(s), procedure (s) algorithm(s), step(s), operation(s), formula(e), or computational depiction(s). It will further be appreciated that the terms “programming” or “program executable” as used herein refer to one or more instructions that can be executed by one or more computer processors to perform one or more functions as described herein. The instructions can be embodied in software, in firmware, or in a combination of software and firmware. The instructions can be stored local to the device in non-transitory media, or can be stored remotely such as on a server, or all or a portion of the instructions can be stored locally and remotely. Instructions stored remotely can be downloaded (pushed) to the device by user initiation, or automatically based on one or more factors. It will further be appreciated that as used herein, that the terms processor, hardware processor, computer processor, central processing unit (CPU), and computer are used synonymously to denote a device capable of executing the instructions and communicating with input/output interfaces and/or peripheral devices, and that the terms processor, hardware processor, computer processor, CPU, and computer are intended to encompass single or multiple devices, single core and multicore devices, and variations thereof. From the description herein, it will be appreciated that the present disclosure encompasses multiple embodiments which include, but are not limited to, the following: 1. A slip ring assembly for use in a selected application for transferring electrical power between a stationary exterior environment and a rotating interior environment, comprising: (a) a non-rotating electrical power member, comprising: (i) a first electrically non-conductive spindle having a generally planar contacting surface; (ii) a first set of concentric channels formed in said first electrically non-conductive spindle planar contacting surface; (iii) a first set of concentric electrically conducting power transmission cylinders, with each having inside and outside surfaces, wherein each power transmission cylinder within said set fits within a separate channel of said first set of concentric channels and extends out past said generally planar surface; (iv) a set of first electrical wires with each member within said first wire set connected to one said electrically conducting power transmission cylinder and extending from said non-rotating electrical power member; (b) a rotating electrical power member, comprising: (i) a second electrically non-conductive spindle having a generally planar contacting surface; (ii) a second series of concentric channels formed in said second electrically non-conductive spindle planar contacting surface; (iii) a second set of concentric electrically conducting power transmission cylinders, with each having inside and outside surfaces, wherein each power transmission band within said set fits within a separate channel of said second set of concentric channels and extends out past said generally planar surface, wherein when rotationally mated with said first set of concentric electrically conducting power transmission cylinders paired power transmission cylinders result with the inside surface of one cylinder sliding over the outside surface of another cylinder; (iv) a set of second electrical wires with each member within said second wire set connected to one said electrically conducting power transmission cylinder and exiting from said rotating electrical power member; and (c) a housing that surrounds both said non-rotating electrical power member and said rotating electrical power member to align said first set of concentric electrically conducting power transmission cylinders and said second set of concentric electrically conducting power transmission cylinders to slide over one another on their said inside and outside surfaces during rotationally operation of the slip ring assembly. 2. The slip ring assembly according to any preceding or following embodiment, further comprising a resilient member within said housing that urges said first set of concentric electrically conducting power transmission cylinders and said second set of concentric electrically conducting power transmission cylinders towards one another. 3. The slip ring assembly according to any preceding or following embodiment, wherein said first and second sets of concentric electrically conducting power transmission cylinders have a gradual conical form that, within said housing, urges said inside and outside surfaces to contact one another during rotation. 4. The slip ring assembly according to any preceding or following embodiment, wherein either said first set of concentric electrically conducting power transmission cylinders or said second set of concentric electrically conducting power transmission is fabricated from a lubricated sintered metallic material and the other is an electrically conducting metal or metal containing material. 5. The slip ring assembly according to any preceding or following embodiment, wherein either said first set of concentric electrically conducting power transmission cylinders or said second set of concentric electrically conducting power transmission cylinders is fabricated from lubricated Oilite™ and the other is an electrically conducting metal or metal containing material. 6. The slip ring assembly according to any preceding or following embodiment, wherein either said first set of concentric electrically conducting power transmission cylinders or said second set of concentric electrically conducting power transmission cylinders is fabricated from lubricated Oilite™ and the other is copper or a copper containing alloy. 7. The slip ring assembly according to any preceding or following embodiment, wherein both said first set of concentric electrically conducting power transmission cylinders and said second set of concentric electrically conducting power transmission cylinders are fabricated from a lubricated porous/sintered metallic material. 8. The slip ring assembly according to any preceding or following embodiment, wherein both said first set of concentric electrically conducting power transmission cylinders and said second set of concentric electrically conducting power transmission cylinders are fabricated from lubricated Oilite™. As used herein, the singular terms “a,” “an,” and “the” may include plural referents unless the context clearly dictates otherwise. Reference to an object in the singular is not intended to mean “one and only one” unless explicitly so stated, but rather “one or more.” As used herein, the term “set” refers to a collection of one or more objects. Thus, for example, a set of objects can include a single object or multiple objects. As used herein, the terms “substantially” and “about” are used to describe and account for small variations. When used in conjunction with an event or circumstance, the terms can refer to instances in which the event or circumstance occurs precisely as well as instances in which the event or circumstance occurs to a close approximation. When used in conjunction with a numerical value, the terms can refer to a range of variation of less than or equal to ±10% of that numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, “substantially” aligned can refer to a range of angular variation of less than or equal to ±10°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°. Additionally, amounts, ratios, and other numerical values may sometimes be presented herein in a range format. It is to be understood that such range format is used for convenience and brevity and should be understood flexibly to include numerical values explicitly specified as limits of a range, but also to include all individual numerical values or sub-ranges encompassed within that range as if each numerical value and sub-range is explicitly specified. For example, a ratio in the range of about 1 to about 200 should be understood to include the explicitly recited limits of about 1 and about 200, but also to include individual ratios such as about 2, about 3, and about 4, and sub-ranges such as about 10 to about 50, about 20 to about 100, and so forth. Although the description herein contains many details, these should not be construed as limiting the scope of the disclosure but as merely providing illustrations of some of the presently preferred embodiments. Therefore, it will be appreciated that the scope of the disclosure fully encompasses other embodiments which may become obvious to those skilled in the art. All structural and functional equivalents to the elements of the disclosed embodiments that are known to those of ordinary skill in the art are expressly incorporated herein by reference and are intended to be encompassed by the present claims. Furthermore, no element, component, or method step in the present disclosure is intended to be dedicated to the public regardless of whether the element, component, or method step is explicitly recited in the claims. No claim element herein is to be construed as a “means plus function” element unless the element is expressly recited using the phrase “means for”. No claim element herein is to be construed as a “step plus function” element unless the element is expressly recited using the phrase “step for”. | 25,609 |
11942740 | DETAILED DESCRIPTION Hereinafter, a motor according to one embodiment of the present disclosure will be described. In the following description, a direction parallel to a rotation axis of the motor may be referred to as a rotation axis direction of the motor. Further, the rotation axis direction may be referred to as a front-rear direction (a direction in which the bracket is provided as viewed from a frame of the motor is a rear direction). In addition, a specific direction (specifically, described later) in a direction (a radial direction) perpendicular to the rotation axis of the motor may be referred to as an upper-lower direction, and a direction perpendicular to the front-rear direction and the upper-lower direction may be referred to as a left-right direction. The terms “front-rear”, “upper-lower”, “right-left”, or the like are used herein for convenience in a case where only the motor is focused on, and are not intended to limit a direction of a device on which the motor is mounted or a posture in which the motor is used. Embodiment FIG.1is a sectional view showing a motor according to one embodiment of the present disclosure.FIG.2is a view schematically showing a cross section taken along a line A-A inFIG.1. A cross section shown inFIG.1is a cross section taken along a line B-B inFIG.2. Here, some constituent members are schematically shown (for example, a brush unit20cwhich will be described later is indicated by a two-dot chain line). In the following drawings, an arrow A1indicates a rotation axis direction, that is, the front-rear direction. An arrow A2indicates the left-right direction (inFIG.2, left indicates a left direction). An arrow A3indicates the upper-lower direction (inFIG.2, upper indicates an upper direction). A motor1includes a frame assembly1aand an armature assembly1brotatable with respect to the frame assembly1a. The motor1is a small-sized motor having a width of 10 millimeters or less. Here, the width of the motor1may be, for example, a distance between a pair of planar portions11facing each other across a rotation axis2, a dimension in the upper-lower direction or the left-right direction of the motor1, or a maximum outer diameter of the motor1. The armature assembly1bincludes the rotation axis (shaft2), an armature4attached to the rotation axis2, and a commutator6attached to the rotation axis2, for example. The armature4is attached to the rotation axis2. The armature4includes an armature core5having a plurality of salient poles protruding in a radial direction, a winding (not shown) wound around each of the salient poles, for example. The commutator6is provided near one end portion of the rotation axis2. The commutator6includes a plurality of commutator segments7lined in a circumferential direction. Each of the plurality of commutator segments7is electrically connected to the winding. The frame assembly1aincludes a frame (motor case)10, a bracket30, a plate40, and a magnet50, for example. The frame10includes amend portion in a front side, an end portion in a rear side, a surface (cap) closing the end portion in the front side, and a tubular portion. That is, in the frame10, the end portion in the rear side has a cup shape serving as an opening portion. The opening portion on the end portion in the rear side of the frame10(a right end portion inFIG.1) is blocked by the plate40. The armature4, the commutator6, or the like of the armature assembly1bare accommodated in a housing configured by the frame10and the plate40. The frame10is formed using a magnetic material. As shown inFIG.2, the frame10includes a plurality of corner portions12and the planar portions11. Each of the planar portions11is disposed between two adjacent corner portions12. Specifically, the frame10has an outer shape having four planar portions11and four corner portions12. The two planar portions11adjacent in the peripheral direction are connected to each other via one corner portion12. One of the two planar portions11adjacent in the peripheral direction is substantially perpendicular to the other. The corner portion12has a rounded shape (R shape). The frame10has a substantially square cross section perpendicular to the rotation axis2. The frame10is formed in a square shape as a whole. That is, the motor1is a square small-sized motor. Incidentally, in the following description, the upper-lower direction is a direction perpendicular to one pair of planar portions11positioned so as to interpose the rotation axis2, and the left-right direction is a direction perpendicular to the other pair of planar portions11positioned so as to interpose the rotation axis2. Returning toFIG.1, the bracket30is disposed at an inner side of the plate40. The bracket30is provided at the frame10. Two brush units20b,20c(hereinafter, sometimes referred to as a brush unit20without distinguishing between the two brush units20b,20c) are attached to the bracket30. Each brush unit20includes a brush25having an outer surface and comes into contact with the commutator6, a terminal portion28to which a current is externally supplied, and a metal support portion (an example of an elastic member)21which electrically connects the brush25and the terminal portion28. The terminal portion28is attached to the bracket30. That is, the support portion21supports the brush25to the bracket30. The support portion21is formed of an elastic member having elasticity, and holds the brush25to the bracket in a state where the commutator6comes into contact with the outer surface of the brush25. The rotation axis2penetrates through a front surface of the frame10. That is, an end portion in a front side of the rotation axis2protrudes from the frame10to the outside of the frame10, and another portion of the rotation axis2is housed inside the frame10. A bearing holding portion10gis provided at a central portion of the front surface of the frame10, and a bearing18is held in the bearing holding portion10g. In addition, a bearing19is held on a central portion of the plate40. A thrust washer19bis disposed behind the bearing19. The rotation axis2is rotatably supported with respect to the frame10by the bearings18,19at two positions and the thrust washer19b. As shown inFIG.2, in the present embodiment, one annular magnet50is provided. In other words, the magnet50is formed in a tubular shape. The magnet50is disposed inside the frame10. The frame assembly1ahas a cross-sectional structure in which an outer peripheral surface50aof the magnet50is surrounded by the frame10. An outer peripheral surface of the frame10is an outer peripheral surface of the motor1. Here, a plurality of magnets each having a magnetic pole element may be used. The frame10has a substantially uniform thickness. That is, an inner surface10bof the frame10is formed by connecting a plurality of flat portions by the planar portions11and rounded portions by the corner portions12, and is formed in a square shape. The magnet50is a bonded magnet formed by using a known rare earth material and a known resin material, for example. Here, the magnet50is not limited to the bonded magnet, and may be, for example, a sintered magnet. The magnet50includes a magnetic pole element61(N pole61a, S pole61b, N pole61c, and S pole61d). That is, the magnet50includes the same number of the magnetic pole elements61as the number of the corner portions12of the motor1. The magnetic pole elements61are disposed such that polarities are alternately disposed in the peripheral direction. The four magnetic pole elements61are disposed at the four corner portions12of the frame10such that the magnetic pole elements61face each other. The magnet50has the outer peripheral surface50ahaving a rounded shape along the inner surface10bof the frame10at each of the corner portions12. In addition, the magnet50has an inner peripheral surface50bhaving a cylindrical surface shape. An air gap is slightly provided between the inner peripheral surface50bof the magnet50and the armature core5. In the present embodiment, the magnet50is fixed to the frame10by using an adhesive59. That is, the adhesive59is applied between an end portion in a rear side of the magnet50and the inner surface10bof the frame10. In an assembling process of the motor1, the magnet50is accommodated from the opening portion on a rear side of the frame10to an inside of the frame10. Further, the adhesive59is applied between the end portion in a rear side of the magnet50and the inner surface10bof the frame10, so that the magnet50is fixed to the frame10. Thereafter, the armature assembly1bis attached to the frame10, and the bracket30and the plate40are attached to the frame10, so that the motor1is assembled. FIG.3is a front view of the brush unit20b.FIG.4is a side view of the brush unit20b. FIG.3shows a view of the brush unit20bviewed from the front, andFIG.4shows a view of the brush unit20bviewed from the right. In the two brush units20b,20c, the brush unit20bis disposed on a left side of the motor1, and the brush unit20cis disposed on a right side of the motor1. The brush unit20con the left side is symmetrical with the brush unit20bon the right side. As shown inFIGS.3and4, the brush unit20bis configured by respectively connecting the brush25and the terminal portion28to the support portion21. In the present embodiment, the support portion21is formed by molding a single metal wire. The support portion21includes a first extending portion22extending toward the terminal portion28, a coil portion23, and a second extending portion24extending toward the coil portion23. The first extending portion22is fixed to the terminal portion28by welding, soldering, for example. The coil portion23is provided between the first extending portion22and the second extending portion24. The coil portion23is formed by winding a metal wire in a coil shape. Since the coil portion23is provided, the second extending portion24can be displaced with respect to the first extending portion22while twisting the coil portion23around a central axis of the coil portion23. That is, the support portion21is a torsion coil spring in which the second extending portion24is twisted with respect to the first extending portion22. The central axis of the coil portion23is perpendicular to a paper surface inFIG.3, and is parallel to the front-rear direction in the motor1. Each of the first extending portion22and the second extending portion24extends in a direction perpendicular to the central axis of the coil portion23. The second extending portion24includes an intermediate portion24bat a coil portion23side and an attachment portion24cat a tip end side. A bent portion24dpositioned at an intermediate portion of the second extending portion24is interposed between the intermediate portion24band the attachment portion24c. The intermediate portion24band the attachment portion24cextend substantially linearly. The attachment portion24cis bent at the bent portion24dwith respect to the intermediate portion24bso that a tip end portion of the attachment portion24cis apart from the first extending portion22. In this way, since the second extending portion24has a bent structure, even in the small-sized motor1, a length of an arm of the second extending portion24can be ensured to be longer, and the brush25can come into contact with the commutator6at an appropriate angle. The bent portion24dis positioned within or on a circumference formed by the plurality of commutator segments7from a center of the commutator6, in a state where the brush25does not come into contact with the commutator6. The brush25is a carbon brush formed of carbon. Since the brush25is made of carbon, the brush25is softer than a member forming the commutator6. That is, the member forming the commutator6is harder than a member forming the brush25. The brush25has a columnar shape. More specifically, the brush25has a cylindrical shape and has a cylindrical outer peripheral surface. The brush25is attached to the attachment portion24cof the second extending portion24. The attachment portion24cpenetrates through a central portion of the brush25in a height direction of the columnar brush25. That is, at least a part of the support portion21is inside the brush25and further passes through the inside of the brush25. Here, an end portion of the support portion21may not pass through the inside of the brush25and be disposed outside the brush25, and may be, for example, inside the brush25. InFIG.3, a two-dot chain line indicates the commutator6and the brush unit20bin a state where the commutator6comes into contact with an outer peripheral surface of the brush25. In the present embodiment, a height dimension (a dimension D1inFIG.3) of the columnar brush25is equal to or smaller than a peripheral dimension (a dimension D2inFIG.3) of the commutator segment7that comes into contact with the brush25. That is, in the peripheral direction, a width (the dimension D1) of the outer peripheral surface of the brush25is equal to or smaller than a width (the dimension D2) of the commutator segment7. The terminal portion28is configured by, for example, a metal plate. The terminal portion28has a connection portion28bto which the first extending portion22of the support portion21is connected, and a tip end portion28cextending rearward from the connection portion28b. The tip end portion28cis provided with an engaging portion such as a pawl, a recess or a protrusion which engage with the bracket30, for example. The tip end portion28cis a portion protruding rearward from the plate40in the motor1. By electrically connecting a lead wire and a connection terminal of an external device, for example, to the tip end portion28c, electric power can be supplied to the motor1. The brush unit20bis attached to the bracket30in a state where the terminal portion28passes through an attachment hole of the bracket30. The brush unit20bis disposed at the bracket30such that the tip end portion28cis inserted into the attachment hole formed in the bracket30from the front of the bracket30. By engaging the pawl, the recess, the protrusion, or the like provided at the tip end portion28cwith an engaged portion provided at the bracket30, the terminal portion28is fixed to the bracket30. Accordingly, the brush25is supported to the bracket30by the support portion21. When the brush unit20bis attached to the bracket30, a protruding portion34(indicated by a broken line inFIG.3) formed on the bracket30is inserted into the inside of the coil portion23. Since the coil portion23is twisted in a state where the central axis of the coil portion23is positioned by the protruding portion34, a state where the outer peripheral surface of the brush25comes into contact with the commutator6is stably maintained. FIG.5is a rear view of the motor1.FIG.6is a front view showing the bracket30to which the brush unit20is attached. InFIG.5, for the sake of explanation, the plate40, the bearing19, or the like are not shown. InFIG.6, the brush unit20in a state where the commutator6is attached is shown, and a position of the commutator6is indicated by a two-dot chain line. As shown inFIGS.5and6, the bracket30is disposed so as to close the opening portion of the frame10of the motor1. The bracket30has an outer peripheral portion31which is fitted inside the frame10, and a recess32which is inside the outer peripheral portion31and recessed rearward. A rear side of the bracket30is closed by a plane perpendicular to the rotation axis direction, and an opening portion36through which the rotation axis2passes is formed in the plane. The bracket30includes four protruding portions33which are formed on a rear surface, support portions30cwhich are formed on the left and right of the rear side and respectively support the terminal portion28, and protruding portions30bwhich are provided at upper and lower portions of the outer peripheral portion31and respectively protruding in a radial direction. Each of the protruding portions33is disposed so as to penetrate the plate40. In a state where the plate40is attached to the bracket30, the plate40can be engaged with the bracket30by crushing end portions of the protruding portions33. The tip end portions28cof the left and right brush units20are respectively inserted into the support portions30cfrom the front to the rear. The tip end portion28cprotrudes rearward from each of the support portions30c. The protruding portions30bfit into depressions formed in the end portion in a rear side of the frame10. A position in the front-rear direction of the bracket30with respect to the frame10is determined by the protruding portions30band the frame10. Further, the recess32of the bracket30is provided with left and right protruding portions34, and provided with wall portions35provided at inner sides of the terminal portions28of the left and right brush units20, respectively. Each of the protruding portions34is, for example, a cylindrical protruding portion and protrudes forward from a bottom of the recess32(the rear surface of the bracket30). The protruding portions34are fitted inside the coil portions23of the left and right brush units20to position the coil portions23, respectively. Each of the wall portions35is a protruding portion protruding forward from the bottom of the recess32, and has a surface facing an inner peripheral surface of the outer peripheral portion31across the terminal portion28and a surface facing the brush25of the brush unit20, for example. Since each of the wall portions35is provided between the brush25attached to the second extending portion24and the terminal portion28to which the first extending portion22is attached, the support portion21is prevented from being greatly deformed and being damaged. FIG.7is a side view of the bracket30. As shown inFIG.7, ribs39are provided at an outer peripheral surface of the outer peripheral portion31of the bracket30. Two ribs39are formed on each of an upper surface, a lower surface, a left side surface, and a right side surface in the outer peripheral surface of the outer peripheral portion31. The ribs39protrude radially from the outer peripheral surface of the outer peripheral portion31. Each of the ribs39has a long side in the front-rear direction. In the outer peripheral surface of the outer peripheral portion31, the two ribs39are provided side by side in the peripheral direction on each of the upper surface, the lower surface, the left side surface, and the right side surface. As shown inFIG.5, each of the ribs39comes into contact with the inner surface of the frame10. A stress is generated in the frame10by the contact of the rib39. Therefore, abnormal noise due to propagation of vibration generated in the brush unit20to the frame10can be suppressed from being generated. In addition, the frame10is suppressed from vibrating for a relatively long time at a low frequency. As shown inFIG.5, in the present embodiment, a shape (planar shape) of an end edge portion of the opening portion36is a shape (oval shape or oblong shape) formed by connecting end portions of two semicircular arcs and two mutually parallel line segments having an identical length. In the present embodiment, a dimension in the upper-lower direction of the opening portion36is longer than a dimension in the left-right direction. That is, the opening portion36has the planar shape having a long side (upper-lower direction) and a short side (left-right direction). The opening potion36faces the brushes25in the rotation axis direction. That is, the brushes25are also exposed to the rear side of the bracket30through the opening portion36. As shown inFIG.1, the commutator6is disposed at an inner side of the opening portion36. Therefore, as shown inFIG.5, a part of the opening portion36facing the brushes25, the commutator6, and other part of the opening portion36are disposed side by side from a lower side to an upper side of the opening portion36. That is, at the inner side of the opening portion36, the part of the opening portion36facing the brushes25, the commutator6, and the other part of the opening portion36are disposed side by side in the radial direction perpendicular to the rotation axis direction. Since the opening portion36has the oval shape, the armature assembly1bis accommodated inside the frame10as follows. Firstly, the armature assembly1bis inserted into the inside of the frame10. Then, the bracket30to which the brush units20b,20care attached is attached to the end portion in a rear side of the frame10from behind the armature assembly1b. At this time, the rotation axis2and the commutator6can adjust positions of the frame10and the armature assembly1bwith respect to the bracket30so that the commutator6comes into contact with the brushes25, after passing through the upper portion of the opening portion36which does not face the brushes25. Therefore, the motor1can be easily assembled. In a state where the commutator6comes into contact with the two brushes25, the two brushes25are positioned at a predetermined angle G in the peripheral direction of the rotation axis2. For example, the angle G is about 90 degrees. FIG.8is a view showing a first state of the bracket30to which the brush unit20is attached.FIG.9is a sectional side view ofFIG.8.FIG.10is a view showing a second state of the bracket30to which the brush unit20is attached.FIG.11is a sectional side view ofFIG.10. InFIGS.9and11, a cross section of the bracket30is shown, and the brush unit20is shown from a lower side rather than a cross section. As shown inFIG.8, in the present embodiment, one brush25of the two brush units20b,20cis configured to come into contact with the other brush25. In addition, one support portion21of the two brush units20b,20cis configured to intersect with the other support portion21when viewed from the rotation axis direction. When the two brush units20b,20care attached to the bracket30, one (for example, the left side) brush unit20bis disposed on the bracket30, and then the other (for example, the right side) brush unit20cis disposed on the bracket30. When the commutator6or the like does not come into contact with the brushes25, that is, when no force is applied to the support portions21in the radial direction of the motor1, the support portions21of the two brush units20b,20cintersect with each other when viewed from the front-rear direction. In the present embodiment, as shown inFIGS.8and9, the brushes25overlap each other in the front-rear direction. Thereafter, by displacing both the brushes25outward in the radial direction of the motor1by using a jig or the like, a state where the two brushes25overlap each other in the front-rear direction can be released, so that the attachment portions24cat the tip end sides of the brushes25can overlap each other in the front-rear direction, as shown inFIGS.10and11. When the attachment portions24coverlap each other in the front-rear direction in this manner, a process of smoothly deforming the support portions21of the two brush units20b,20cand bringing the commutator6into contact with both the brushes25can be efficiently performed. In the present embodiment, a position of one brush25of the two brushes25is different from a position of the other brush25in the rotation axis direction of the motor. Specifically, the brush25of the brush unit20con the right side is positioned on the front side of the brush25of the brush unit20bon the left side. In the rotation axis direction, the two brushes25may be at the same position. FIG.12is a view for explaining a positional relationship between the two brushes25and the commutator6in the front-rear direction. InFIG.12, for the purpose of explanation, a portion of the commutator6is developed on a plane in the peripheral direction, and the positional relationship between the two brushes25and the commutator6is schematically shown. An arrow A4indicates a peripheral direction of the commutator6. As shown inFIG.12, in the present embodiment, the brush25of the brush unit20con the right side is slightly located on a front side of the brush25of the brush unit20bon the left side. Therefore, in the front-rear direction, a region (inFIG.12, a region indicated by left-upward hatching) of the commutator6which comes into contact with the brush25on the right side and a region (inFIG.12, a region indicated by right-upward hatching) of the commutator6which comes into contact with the brush25on the left side are shifted in the front-rear direction. A portion where the two regions overlap is narrower in area than that in a case where both brushes25are at the same position in the front-rear direction. Therefore, even if the brushes25are worn by the rotation of motor1, the abrasion powder is dispersed in a relatively wide area, so that the abrasion powder is less likely to be accumulated between the adjacent commutator segments7, and a problem such as a short circuit is less likely to occur. As described above, in the present embodiment, since the columnar brushes25are used, a structure in which the commutator6appropriately come into contact with the brushes25can be achieved even in the motor1in which a width of the frame10is 10 millimeters or less. Since each of the support portions21forms a torsion spring and a length of the second extending portion24can be ensured to be relatively long, a force for bringing the brush25into contact with the commutator6can be stably ensured. An amount by which the force of bringing the brushes25into contact with the commutator6changes with the wear of the brushes25can be reduced. Since each of the brushes25is the carbon brush and can come into contact with the commutator6without using a liquid lubricant, the motor1can be used even in a low-temperature environment. The annular magnet50is used. Therefore, a variation in torque can be reduced as compared with a motor in which four magnets are disposed at four corners of the frame. In addition, in a case where a large current flows through the brushes25to the commutator6, resonance can be prevented from being occurred, and generation of the abnormal noise can be reduced. [Others] In the above-described embodiment, some of the features may not be provided, or some of the features may be configured in another aspect. An outer peripheral shape of the motor may not be a square shape as in the above-described embodiment. For example, a brush unit as described above may be used in a small-sized motor having a so-called elliptic (an oval shape formed by connecting two left and right circular arcs and two straight lines) cross section, or a brush unit as described above may also be used in a small-sized motor having a round cross section. In the motor, the number of brush units and the number of brushes are not limited to two, and may be more than two. One brush of a plurality of brushes is the brush as described above, and others may be another form of brush. A motor includes a frame having an inner surface; a plurality of magnets attached to the inner surface of the frame; a bracket provided at the frame; a columnar brush formed of carbon and having an outer peripheral surface; a commutator which comes into contact with the outer peripheral surface of the brush; and an elastic member which supports the brush to the bracket. The magnets of the plurality of magnets are disposed side by side in a peripheral direction, and the elastic member is inside the brush. In applications requiring high torque, the motor is required to be reduced in size. In order to output a drive force for the high torque in a small-sized motor, a large current can flow through the motor. In addition, since an interval between the adjacent commutators is relatively narrow, occurrence of a short circuit due to accumulation of abrasion powder of the brush between the adjacent commutators can be suppressed. A motor includes a frame having an inner surface; a magnet attached to the inner surface of the frame; a bracket provided at the frame, a plurality of columnar brushes formed of carbon, each of the brushes having an outer peripheral surface; a commutator which comes into contact with at least one outer peripheral surface of the brushes, and an elastic member which supports the brushes to the bracket. The elastic member is inside the brush, and a position of one of the brushes is different from positions of other brushes in a rotation axis direction. Accordingly, since an interval between the adjacent commutators is relatively narrow, occurrence of a short circuit due to accumulation of abrasion powder of the brush between the adjacent commutators can be suppressed. When the first extending portion of the support portion is fixed to the terminal portion, in a case where it is difficult to join a member forming the first extending portion and a member forming the terminal portion by welding, soldering may be used for fixing the members. When it is difficult to fix a small-sized motor having a width of, for example, 10 millimeters or less, by welding, the motor may be fixed by soldering. In particular, in a case where a high current is applied to the motor to obtain a high torque, a contact resistance at a joined portion joined by welding may be relatively high. Therefore, it may be difficult to obtain a high torque even when a high current is applied. In this case, by soldering, the contact resistance at the jointed portion decreases, which may result in obtaining a desired high torque. Therefore, the support portion having the first extending portion and the terminal portion may be fixed by soldering, or the brush and the metal wire forming the coil portion may also be fixed by soldering. The number of turns of the metal wire forming the coil portion needs to be determined by considering contact pressure generated by contact between the commutator and the brush. In the present embodiment, the number of turns of the metal wire is four, but is not limited thereto, it may be increased or decreased, and can be appropriately determined by considering the contact pressure, the length of the extending portion, and a thickness of the metal wire. The coil portion is press-fitted into the protruding portion provided at the bracket, so that the coil portion may be positioned in a winding direction of the metal wire. The coil portion is positioned by the protruding portion in the winding direction of the metal wire, so that the contact pressure between the commutator and the brush can be adjusted. For example, in a case where a space cannot be ensured within the motor, in a case where the number of turns of the metal wire cannot be increased, or in a case where the thickness of the metal wire cannot be increased, such that the total height of the motor cannot be increased in the rotation axis direction, the contact pressure between the commutator and the brush can be adjusted by positioning the coil portion. In addition, an angle of the bent portion of the support portion can be adjusted by increasing or decreasing the angle of the bent portion, if necessary. Alternatively, by setting a position of the bent portion of the support portion closer to the brush with respect to an intermediate position having the same length from both end portions of the support portion, or closer to the coil portion, the contact pressure can be adjusted by changing a spring constant of the support portion. The motor configured as described above can be used in various applications. For example, the present disclosure may be applied to electronic equipment, or may be used for applications mounted on various vehicles. It should be understood that the above-described embodiments are merely illustrated in all respect and not restrictive. The scope of the present disclosure is defined by the claims rather than the description described above, and is intended to include all modifications within the scope and meaning equivalent to the claims. | 31,897 |
11942741 | DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS The present invention is directed to a meter jaw and termination connector assembly that may be used as an electrical connector of a meter socket. While the present invention will be described in detail below with reference to various exemplary embodiments, it should be understood that the invention is not limited to the specific configurations of these embodiments. In addition, although the exemplary embodiments are described as embodying several different inventive features, one skilled in the art will appreciate that any one of these features could be implemented without the others in accordance with the present invention. I. Exemplary Embodiments FIGS.2-6show a single-phase power system comprising an electric watt-hour meter100installed within a meter socket200in accordance with an exemplary embodiment of the present invention. Meter socket200is a “ringless” meter socket and has a standardized form to allow the interchangeability of meters from various manufacturers without removing any wires or cables. While meter socket200may be employed for meters capable of continuous full load currents of 20 to 400 amperes, it is most typically utilized for residential applications of 200 amperes. Of course, other types of meter sockets may also be used, such as a “ring-type” meter socket. In this exemplary embodiment, meter100is an AMI (advanced metering infrastructure) meter that communicates with the electric power utility over an existing communication network, although other types of meters may also be used. The configuration of meter100is shown in greater detail inFIG.2. As can be seen, meter100includes a cylindrical cover102that is made of glass, transparent plastic (e.g., polycarbonate), or any other suitable material. Cover102is secured to a meter base104so as to enclose various electronic components within the meter. These electronic components are well known to those skilled in the art. Preferably, a seal (not shown) is used to provide a tight connection between cover102and meter base104and thereby protect the electronic components from environmental elements. An annular flange116extends radially outward from base104and includes a front rim116a(shown inFIG.4) that provides a mounting connection to a meter socket. Meter100also includes two upper connector blades106(only one of which can be seen inFIG.2) and two lower connector blades108(only one of which can be seen inFIG.2) that extend outward from the back side of meter base104. As described below, connector blades106and108are positioned to snap into the upper and lower meter jaws, respectively, of meter jaw block assemblies (such as of the meter jaw block assemblies250and252shown inFIG.5, described below). A blade110also extends outward from the back side of meter base104and is positioned to engage an electrical connector used as a neutral reference for certain types of service. Two upper legs112(only one of which can be seen inFIG.2) and two lower legs114(only one of which can be seen inFIG.2) are also provided that protect blades106,108and110when meter100is not installed. Referring toFIG.3, meter socket200includes an enclosure202having a front wall or cover204with a raised embossment206surrounding a circular opening through which meter100extends. As shown inFIG.4, raised embossment206engages front rim116aof annular flange116on meter100(also shown inFIG.2) when cover204is latched to thereby retain meter100against the meter supports268and270(shown inFIG.5) of meter socket200, as described below. Thus, it can be appreciated that meter100can only be removed from meter socket200if cover204is removed from meter socket enclosure202. As shown inFIGS.5and6, meter socket enclosure202also includes a back wall208, a pair of laterally spaced side walls210and212, a top wall214, and a bottom wall216. Side walls210and212are integral with back wall208and are formed by bending side portions of an enclosure blank. Top and bottom walls214and216are formed as separate members and are secured to back wall208and side walls210and212by any suitable attachment means, such as by spot welding, fasteners, or the like. Of course, top and bottom walls214and216could alternatively be formed integral with back wall208. Top wall214is provided with an opening218to receive the power supply conductors (not shown) from the electric power utility. Bottom wall216and lower portions of side walls210and212and back wall208are provided with knock-outs220a-220f, which may be selectively opened to enable the power load conductors (not shown) to exit enclosure202for routing to a customer premises. Back wall208is provided with preformed holes222a-222cthat receive fasteners to secure enclosure202to a supporting wall. To accommodate cover204, side walls210and212include inset edges224and226, respectively, while top and bottom walls214and216include top and bottom flanges228and230, respectively. The upper edge of cover204fits under top flange228and the inturned side edges of cover204overlap inset edges224and226. Bottom flange230underlies the bottom edge of cover204. Bottom flange230is provided with a slotted tab232that engages a latch234rotationally fixed by a rivet to cover204(shown inFIG.3). Electric power utility personnel use a custom tool to secure latch234on tab232and prevent unauthorized removal of cover204(and thus meter100) from meter socket200. As best shown inFIG.6, meter socket enclosure202includes a riser structure236that is formed by embossing or stamping back wall208between a set of appropriately shaped dies during manufacture of enclosure202. Riser structure236has a pair of laterally spaced risers238and240separated by a recessed wall242. Each of risers238and240includes a planar front wall244(only the front wall of riser238can be seen inFIG.6) spaced forward of back wall208. The spacing of each front wall244from back wall208is chosen to properly position two meter jaw block assemblies250and252(shown inFIG.5) in relation to back wall208. Each front wall244is also provided with holes246aand246b(only the holes of front wall244can be seen inFIG.6) to receive respective mounting screws to thereby secure meter jaw block assemblies250and252to front walls244of risers238and240. Recessed wall242forms a separation between risers238and240and includes holes (not shown) to receive a ground conductor connector248. Recessed wall242is positioned in a recessed plane located between the plane of back wall208and the plane of front walls244of risers238and240. One skilled in the art will appreciate that other types of riser structures may also be used in accordance with the present invention. For example, a riser structure could be configured with a single riser (instead of risers238and240and recessed wall242) of sufficient width for proper spacing of meter jaw block assemblies250and252. Also, a separate riser structure could be provided that is secured to back wall208. Further, a riser structure could be used that mounts three or more meter jaw block assemblies, such as for use with a three-phase system. Referring toFIG.5, meter socket200includes a first meter jaw block assembly250secured to the front wall of riser238and a second meter jaw block assembly252secured to the front wall of riser240. Meter jaw block assembly250includes a top electrical connector254and a bottom electrical connector256each of which is mounted to an insulating mounting block258. Similarly, meter jaw block assembly252includes a top electrical connector260and a bottom electrical connector262each of which is mounted to an insulating mounting block264. It can be appreciated that electric utility power is provided at top electrical connectors254and260and customer power is provided at bottom electrical connectors256and262. Mounting blocks258and264function to insulate top electrical connectors254and260and bottom electrical connectors256and262from enclosure202. Optionally, a fifth electrical connector may be mounted within an opening in the center of mounting block264and used as a neutral reference for certain types of service. Meter jaw block assemblies250and252also include meter supports268and270that provide a mounting surface and transient suppression ground terminal for meter100. Referring toFIGS.7-10, the configuration of meter jaw block assembly250(with meter support268removed) will now be described in greater detail. One skilled in the art will appreciate that the configuration of meter jaw block assembly252mirrors that of meter jaw block assembly250and will not be separately described herein. As just described, meter jaw block assembly250includes an insulating mounting block258with top electrical connector254and bottom electrical connector256secured thereto. Meter jaw block assembly250includes mounting screws (not shown) that extend through mounting holes292and294formed in mounting block258. After passing through mounting block258, the mounting screws are received within holes246aand246bprovided in front wall244of riser238(shown inFIG.6) to secure meter jaw block assembly250to enclosure202. Also, as shown inFIG.8, mounting block258includes two slots296and298located on its right/back side that are positioned to retain meter support268(shown inFIG.5) in the appropriate position for mounting meter100. As best shown inFIG.10, top electrical connector254includes a termination connector272comprising a U-shaped connector body274having a connector tab276with an opening278formed therein, as well as a slide nut280and threaded slide screw282. Electrical connector254also includes a meter jaw284with a boss286projecting therefrom. It will be seen that boss286is positioned within the opening278and secured to connector tab276so as to mechanically, electrically and thermally connect meter jaw284to termination connector272. Similarly, bottom electrical connector256includes a termination connector288comprising a U-shaped connector body290having a connector tab292with an opening294formed therein, as well as a slide nut296and threaded slide screw298. Electrical connector also includes a meter jaw300with a boss302projecting therefrom. It will be seen that boss302is positioned within the opening294and secured to connector tab292so as to mechanically, electrically and thermally connect meter jaw300to termination connector288. Top electrical connector254and bottom electrical connector256may each be attached to mounting block258using any type of attachment mechanism known in the art, such as a fastener (e.g., bolt, screw, etc.) or an interlocking snap fit mechanism that does not require the use of fasteners. Referring toFIG.11, the configuration of termination connector272(i.e., connector body274, slide nut276, and threaded slide screw278) of top electrical connector254will now be described in greater detail. One skilled in the art will appreciate that termination connector288of bottom electrical connector256has the same configuration as that of top electrical connector254and will not be separately described herein. Connector body274includes two spaced apart, generally parallel legs304and306connected by a curved bight section308that define a channel for receiving an end portion of one of the power supply conductors. The bight section308includes grooves that protrude slightly inward from its inner surface so as to grip the conductor. In this embodiment, connector tab276extends outward from the top outer surface of leg304. Of course, other types of termination connectors may have a connector tab located in a different position with respect to connector body274. As can be seen, connector tab276has an inner wall309that defines the opening278formed therein. Legs304and306of connector body274include slide nut grooves310and312formed in their inner surfaces in spaced relation to bight section308so as to slideably receive slide nut280. Slide nut280has a threaded aperture314formed therethrough to receive threaded slide screw282, which is illustrated as an Allen type screw. When slide screw282is torqued to a specified torque value, slide screw282(which may incorporate a ball, cone or flat point) applies direct pressure to the power supply conductor placed within connector body274in order to force the power supply conductor toward bight section308. One skilled in the art will appreciate that the present invention is not limited to the structural configuration of termination connector272. Various alternative embodiments showing termination connectors with other structural configurations are described below in connection withFIGS.12and13. FIG.12shows an alternative embodiment of a pivoting style termination connector1100that may be used in place of the termination connectors of the exemplary embodiment described above. Termination connector1100includes a C-shaped lower connector body1102and a C-shaped upper connector body1104that define a channel for receiving an end portion of one of the power supply conductors or power load conductors. Lower connector body1102has two spaced apart end sections1106and1108connected by a curved lower bight section1110. A pivot body groove1112is formed in the inner surface of end section1106. Extending from the outer surface of end section1106is a connector tab1114with an opening1116formed therein to enable attachment of termination connector1100to meter jaw284. End section1108has an extension1118with a threaded opening formed therein, as discussed below. Upper connector body1104has two spaced apart end sections1122and1124connected by a curved upper bight section1126. End section1122is received in pivot body groove1112of lower connector body1102. Alternatively, the pivot action may be accomplished by utilizing a metal pin that is secured by either upper connector body1104or lower connector body1102. End section1124has an extension1128with an opening formed therein, as discussed below. A pivot screw1132projects through the opening of extension1128of upper connector body1104and is received in the threaded opening of extension1118of lower connector body1102. Pivot screw1132is configured to cause upper connector body1104to pivot with respect to lower connector body1102and clamp the power supply conductor or power load conductor within termination connector1100. FIG.13shows another alternative embodiment of a pivoting style termination connector1200that may be used in place of the termination connectors of the exemplary embodiment described above. Termination connector1200includes a U-shaped connector body1202and a pivot body1204that define a channel for receiving an end portion of one of the power supply conductors or power load conductors. Connector body1202includes two spaced apart legs1206and1208connected by a bight section1210. A pivot body groove1212is formed in the inner surface of leg1206. Extending from the outer surface of leg1206is a connector tab1214with an opening1216formed therein to enable attachment of termination connector1200to meter jaw284. Leg1208has an extension1218with a threaded opening formed therein, as discussed below. Pivot body1204has a first end section1224received in the pivot body groove1212of connector body1202. A second end section1226of pivot body1204has an opening formed therein, as discussed below. A pivot screw1230projects through the opening of second end section1226of pivot body1204and is received in the threaded opening of extension1218of connector body1202. Pivot screw1230is configured to cause pivot body1204to pivot with respect to connector body1202and clamp the power supply conductor or power load conductor within termination connector1200. In each of the termination connectors272,1100and1200described above, the connector bodies are made of extruded aluminum plated with tin, while the slide nut and slide screw or pivot screw are each made of steel or aluminum. Of course, one skilled in the art will understand that other materials that are strong and durable may also be used in accordance with the present invention. For example, suitable materials include aluminum alloys known by the standard designations6061,6063or6101alloys. Termination connectors272,1100and1200may be formed by any suitable manufacturing process that is appropriate for the selected material and provides the desired material characteristics for the various elements of the connectors. For example, in some embodiments, an extrusion process is used in which the cross-sectional shape of a connector body is extruded. The extrusion may be cut to selected lengths for convenient handling, as well as treated for desired material characteristics, including desired strength, hardness, stiffness, elasticity, and the like. Such treatments may include heat treating. The treated extrusion lengths are then cut or sliced into the individual connector bodies. Finally, surfaces of the connector bodies are finished, which may include deburring, polishing, chemical cleaning, and tinning or plating with other metals. By using an extrusion process, it is possible to economically vary the thickness and shape of the connector bodies, permitting better mechanical, electrical and thermal performance. Each of the termination connectors described above is preferably configured to receive and terminate conductors having a diameter in a range from about 2.052 millimeters (12 AWG) to about 19.67 millimeters (600 kcmil), and preferably in a range from about 5.189 millimeters (4 AWG) to about 15.03 millimeters (350 kcmil). The conductors typically comprise stranded copper or aluminum wires surrounded by insulation having an industry standard thickness (THHN, THWN), although other types of stranded or solid wire may also be received and terminated using the termination connectors disclosed herein. Each of the termination connectors is used to terminate a conductor in which the insulation at the end of the conductor has been stripped prior to laying the conductor in the connector body. Of course, the termination connectors could alternatively have insulation-piercing capabilities, such as those described in U.S. Pat. No. 10,886,638. Referring toFIGS.14and15, the configuration of meter jaw284of top electrical connector254will now be described in greater detail. One skilled in the art will appreciate that meter jaw300of bottom electrical connector256has the same configuration as that of top electrical connector254and will not be separately described herein. Meter jaw284includes a base316with a pair of resilient meter jaw contacts318and320extending from the side edges of base316. Meter jaw contacts318and320define a space therebetween for receiving the top right connector blade106of meter100(shown inFIG.2). As best shown inFIG.15, meter jaw284includes a cylindrical boss286that extends between a first end286aproximal to base316and a second end286bdistal to base316. Boss286may be formed integrally with base316or may be joined to base316in any suitable manner. The dimensions of the first end286aof boss286are substantially the same as the dimensions of the second end286bof boss286prior to the assembly of meter jaw284and termination connector272; however, it will be seen that boss286is deformed during the assembly of meter jaw284and termination connector272so as to create a tapered cylinder in which the dimensions of the second end286bof boss286are larger than the dimensions of the first end286aof boss286. In the exemplary embodiment, meter jaw284is made of copper or a copper alloy. Of course, other materials may also be used within the scope of the present invention, provided that the material is both conductive and ductile so as to enable deformation of at least a portion of boss286during the assembly of meter jaw284and termination connector272. Meter jaw284may be formed by any suitable manufacturing process that is appropriate for the selected material and provides the desired material characteristics. For example, meter jaw284may be formed in a progressive die or multi-slide tooling. Boss286comprises an extruded hole that is formed by creating a small (e.g., 0.062 inch) pilot hole followed by a rounded punch that extrudes the material into a hole in the die, as known to one skilled in the art. One skilled in the art will appreciate that the present invention is not limited to the structural configuration of meter jaw284and that other meter jaws may be used within the scope of the present invention. A method of making electrical connector254in accordance with an exemplary embodiment of the present invention will now be described with reference toFIGS.16A-16C,FIGS.17A-17C, andFIGS.18A-18C. In this embodiment, a punch400is used to secure meter jaw284to termination connector272. Punch400extends between a first end402and a second end404and is tapered such that the diameter of the first end402is less than the diameter of the second end404. Punch400has an octagonal cross-section so as to form eight flat sides406on the outer surface of punch400, wherein each of sides406extends longitudinally between the first end402and the second end404. Punch400is made of tool steel, although other materials may be used within the scope of the present invention. It can be appreciated that punch400is part of a punch tool that is used to manufacture the meter jaw and termination connector assembly of the present invention using manufacturing techniques known to one skilled in the art. FIGS.16A-16Cshow meter jaw284and connector body274of termination connector272prior to the insertion of punch400in the direction of arrow A. As best shown inFIGS.16B and16C, boss286of meter jaw284is inserted through the opening278of connector tab276until the bottom surface of the meter jaw's base316abuts the top surface of connector tab276. In this embodiment, the height of boss286is slightly greater than the height of the opening278so that a small portion of boss286extends beyond the bottom surface of connector tab276. Of course, in other embodiments, boss286may not protrude through opening278. Also, the outside diameter of boss286is slightly less than the diameter of the opening278to enable the insertion of boss286through the opening278(wherein the difference between the diameters is so small that it cannot be seen inFIGS.16A-16C). FIGS.17A-17Cshow meter jaw284and connector body274of termination connector272during the insertion of punch400into boss286. The first end402of punch400has a diameter that is slightly less than the inside diameter of boss286to enable the insertion of a portion of punch400through boss286. Because punch400tapers outwardly from the first end402toward the second end404, a portion of the outer surface of punch400will contact and cause expansion of boss286as punch400travels through boss286, thereby deforming boss286in a conical fashion. This expansion causes boss286and the inner wall309of connector tab276to be swaged together. Thus, boss286is secured to the inner wall309of connector tab276so as to mechanically, electrically and thermally connect meter jaw284to termination connector272. It should be understood that the force used to insert punch400into boss286should be selected to achieve a good connection between boss286and connector tab276while not breaking the respective parts. FIGS.18A-18Cshow meter jaw284and connector body274of termination connector272after removal of punch400in the direction of arrow A. As best shown inFIG.18C, boss286now forms a tapered cylinder (created by the tapered configuration of punch400) in which at least a portion of boss286engages the inner wall309of connector tab276to create an interference fit therebetween, thereby preventing longitudinal movement of meter jaw284relative to termination connector272. It can also be seen that boss286now includes deformations322(created by the eight sides on the outer surface of punch400) that translate through to the inner wall309of connector tab276to rotationally lock boss286to connector tab276, thereby preventing rotational movement of meter jaw284relative to termination connector272. A method of making electrical connector254in accordance with an alternative embodiment of the present invention will now be described with reference toFIGS.19A-19C,FIGS.20A-20C, andFIGS.21A-21C. In this embodiment, a punch500is used to secure meter jaw284to termination connector272. Punch500extends between a first end502comprising a rounded head and a second end504and is tapered such that the diameter of the first end502is less than the diameter of the second end504. Punch500has eight facets506on the outer surface of punch500, as shown. Punch500is made of tool steel, although other materials may be used within the scope of the present invention. It can be appreciated that punch500is part of a punch tool that is used to manufacture the meter jaw and termination connector assembly of the present invention using manufacturing techniques known to one skilled in the art. FIGS.19A-19Cshow meter jaw284and connector body274of termination connector272prior to the insertion of punch500in the direction of arrow A. As best shown inFIGS.19B and19C, boss286of meter jaw284is inserted through the opening278of connector tab276until the bottom surface of the meter jaw's base316abuts the top surface of connector tab276. In this embodiment, the height of boss286is slightly greater than the height of the opening278so that a small portion of boss286extends beyond the bottom surface of connector tab276. Of course, in other embodiments, boss286may not protrude through opening278. Also, the outside diameter of boss286is slightly less than the diameter of the opening278to enable the insertion of boss286through the opening278(wherein the difference between the diameters is so small that it cannot be seen inFIGS.19A-19C). FIGS.20A-20Cshow meter jaw284and connector body274of termination connector272during the insertion of punch500into boss286. The first end502of punch500has a diameter that is slightly less than the inside diameter of boss286to enable the insertion of a portion of punch500through boss286. Because punch500tapers outwardly from the first end502toward the second end504, a portion of the outer surface of punch500will contact and cause expansion of boss286as punch400travels through boss286, thereby deforming boss286in a conical fashion. This expansion causes boss286and the inner wall309of connector tab276to be swaged together. Thus, boss286is secured to the inner wall309of connector tab276so as to mechanically, electrically and thermally connect meter jaw284to termination connector272. It should be understood that the force used to insert punch500into boss286should be selected to achieve a good connection between boss286and connector tab276while not breaking the respective parts. FIGS.21A-21Cshow meter jaw284and connector body274of termination connector272after removal of punch500in the direction of arrow A. As best shown inFIG.21C, boss286now forms a tapered cylinder (created by the tapered configuration of punch500) in which at least a portion of boss286engages the inner wall309of connector tab276to create an interference fit therebetween, thereby preventing longitudinal movement of meter jaw284relative to termination connector272. It can also be seen that boss286now includes deformations324(created by the eight facets on the outer surface of punch500) that translate through to the inner wall309of connector tab276to rotationally lock boss286to connector tab276, thereby preventing rotational movement of meter jaw284relative to termination connector272. One skilled in the art will appreciate that the present invention is not limited to the structural configuration of punch400and punch500and the resultant structural configuration of boss286of meter jaw284as shown inFIGS.18A-18CandFIGS.21A-21C, respectively. For example, a punch could be used that has a tapered configuration with a smooth outer surface, which creates a corresponding tapered configuration in boss286of meter jaw284. In this case, the tapered configuration of boss286would prevent longitudinal movement of meter jaw284relative to termination connector272. Also, the outer surface of the punch could have other features that cause corresponding deformations in boss286of meter jaw284to prevent rotational movement of meter jaw284relative to termination connector272. Of course, other punch configurations will become apparent to one skilled in the art. In all of the embodiments described above, one skilled in the art will appreciate that additional fasteners (such as a bolt and/or jaw nut) are not required to secure the meter jaw to the termination connector, which reduces material and labor costs for manufacture of the assembly. The structural configuration of the electrical connector also provides improved performance characteristics, e.g., the direct connection between the meter jaw and termination connector connection offers good electrical conductivity and thermal conductivity, which results in a lower temperature rise and higher performance of the electrical connector. The performance of the new electrical connector described in detail above in connection withFIGS.11,14-15,16A-16C,17A-17C and18A-18Cwas tested and compared to the performance of the standard electrical connector shown inFIG.1using a Keysight34420A multimeter available from Keysight Technologies, Inc. of Santa Rosa, California. Fourteen samples of the new electrical connector were tested, each of which comprised a meter jaw made from copper alloy secured to a termination connector made from aluminum. Fourteen samples of the standard electrical connector were also tested, each of which comprised a meter jaw made from copper alloy secured to a termination connector made from aluminum. For each of the samples, one lead of the multimeter was clamped to one of the resilient contacts of the meter jaw and the other lead of the multimeter was clamped to one of the legs of the U-shaped connector body of the termination connector, and then the resistance between them was measured in micro-ohms (pLQ). The results of the resistance tests are shown in Table 1 below: TABLE 1Standard ConnectorNew Connector(Micro-Ohms (μΩ))(Micro-Ohms (μΩ))4436394046364436473749374937474148385237513851385137513847.8 (average)37.6 (average) As can be seen, the average resistance for the samples of the new electrical connector was about 21% lower than the average resistance for the samples of the standard electrical connector. This demonstrates that the new electrical connector provides a meter jaw-termination connector connection with improved electrical conductivity, which results in a lower temperature rise and higher performance of the electrical connector. II. General The description set forth above provides several exemplary embodiments of the inventive subject matter. Although each exemplary embodiment represents a single combination of inventive elements, the inventive subject matter is considered to include all possible combinations of the disclosed elements. Thus, if one embodiment comprises elements A, B, and C, and a second embodiment comprises elements B and D, then the inventive subject matter is also considered to include other remaining combinations of A, B, C, or D, even if not explicitly disclosed. The use of any and all examples or exemplary language provided with respect to certain embodiments is intended merely to better describe the present invention and does not pose a limitation on the scope of the invention. No language in the description should be construed as indicating any non-claimed element essential to the practice of the present invention. The use of relative relational terms, such as first and second, top and bottom, and left and right, are used solely to distinguish one unit or action from another unit or action without necessarily requiring or implying any actual such relationship or order between such units or actions. The use of the terms “comprises,” “comprising,” or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a system or method that comprises a list of elements does not include only those elements, but may include other elements not expressly listed or inherent to such system or method. While the present invention has been described and illustrated hereinabove with reference to several exemplary embodiments, it should be understood that various modifications could be made to these embodiments without departing from the scope of the invention. Therefore, the present invention is not to be limited to the specific configurations or methodologies of the exemplary embodiments, except insofar as such limitations are included in the following claims. | 32,680 |
11942742 | DETAILED DESCRIPTION In the following, a condenser core for being positioned around a high voltage main electrical conductor, a bushing for a high voltage application, which bushing comprises a condenser core, a high voltage application comprising a condenser core, and a method of producing a bushing for a high voltage application, will be described. The same reference numerals will be used to denote the same or similar structural features. FIG.1schematically represents a high voltage application10comprising a bushing12according to the present disclosure. The high voltage application10is here exemplified as a transformer14arranged in a tank16. The bushing12is for conducting an electrical current in a main electrical conductor18through a wall20of the tank16to the transformer14. The tank16is at least partly filled with an electrically insulating fluid22, in this example a dielectric oil, such as a mineral oil or an ester-based oil. The bushing12extends from the insulating fluid22to the outside of the tank16. In this example, the high voltage application10is surrounded by air. The bushing12thus constitutes an oil-to-air bushing. The transformer14may be a high voltage power transformer, e.g. having a rating or operating voltage of at least 1 kV, such as at least 10 kV, such as at least 35 kV, e.g. within the range of 50-200 kV. Thus, a high voltage current is passed from the transformer14through the bushing12via the main electrical conductor18passing through the through hole of the bushing12. The bushing12may, by means of its associated main electrical conductor18, conduct current from e.g. a winding of the transformer14, through the wall20of the tank16and to e.g. an air-borne line of a power distribution network. The bushing12insulates the current from the wall20, which constitutes a grounded plane, and any other external structures. FIG.2schematically represents the bushing12inFIG.1. The bushing12comprises the main electrical conductor18and a condenser core24positioned around the main electrical conductor18. The condenser core24comprises an electrically insulating body26and a longitudinal through hole28through which the main electrical conductor18passes. The body26includes insulation material, for example combinations of oil and paper, resin and paper, or resin and synthetics.FIG.2further shows a longitudinal axis30of the main electrical conductor18. The condenser core24further comprises a plurality of electrically conductive foils32a,32b,32ccoaxially encircling the through hole28and the main electrical conductor18(each foil32a,32b,32cis also referred to with reference numeral “32”). Any or all of the foils32may be of any suitable conductive material, e.g. aluminium or copper. Each foil32is surrounded by the body26such that each foil32is insulated from any of the other foils32. Although the condenser core24inFIG.2comprises three foils32, the condenser core24may comprise only two foils32, or more than three foils32. The condenser core24of this example further comprises an optional electrically insulating compressive layer34. The compressive layer34may for example comprise cork rubber and Teflon®. The body26is wound onto and around the compressive layer34. As shown inFIG.2, the innermost foil32ais in this example spaced from the compressive layer34by means of an inner part of the body26. The condenser core24further comprises two potential electrical conductors36. The condenser core24may however comprise only one, or more than two potential electrical conductors36. Each potential electrical conductor36is arranged to establish an electrical connection between the innermost foil32aand the main electrical conductor18. Each potential electrical conductor36passes through the compressive layer34and through a part of the body26radially inside of the foil32a(with respect to the longitudinal axis30of the main electrical conductor18). In this example, the potential electrical conductors36are constituted by braided copper wires. As shown inFIG.2, the condenser core24further comprises a fastening device38. The fastening device38is configured to mechanically connect each potential electrical conductor36to the main electrical conductor18to secure an electrical connection therebetween. FIG.3schematically represents a partial enlarged view of the bushing12inFIG.2. In the example inFIG.3, the fastening device38comprises a fastener40, here constituted by a self-tapping screw, and a washer42.FIG.3also shows a longitudinal axis44of the fastener40. The fastener40is engaged in a hole46in the main electrical conductor18. The washer42and a head48of the fastener40are seated in an aperture50of the main electrical conductor18. The aperture50has rounded edges in order to reduce the local electric field enhancement. One example of a method of producing the bushing12according to the present disclosure will now be described. The optional electrically insulating compressive layer34is wound around the main electrical conductor18. One or more sheets of an insulating material, such as paper, are then wound around the compressive layer34. A hole52is cut for each potential electrical conductor36. As shown inFIG.3, each hole52is cut through the compressive layer34and through an inner portion53of the body26inside of the foil32a. The holes52form part of a slit through the compressive layer34and the inner portion53of the body26. The slit may be generally U-shaped, in a circumferential direction of the compressive layer34, such that a flap of the compressive layer34and the inner portion53of the body26can be folded open. The hole46and/or the aperture50in the main electrical conductor18may be produced after having folded open the flap, or prior to winding the compressive layer34around the main electrical conductor18. The contact surfaces of the aperture50in the main electrical conductor18and of the potential electrical conductor36may be cleaned, e.g. with acetone, wiped dry, and polished to remove oxides. One end of each potential electrical conductor36is glued onto the main electrical conductor18by means of electrically conductive glue54such that each potential electrical conductor36is electrically connected to the main electrical conductor18. Each potential electrical conductor36is glued on both sides. Electrically conductive glue54is also applied to the contact surface in the aperture50of the main electrical conductor18. The electrically conductive glue54may be applied in thin layers. The washer42is then placed on top of the ends of the potential electrical conductors36and the fastener40is inserted through the washer42and fastened in the hole46of the main electrical conductor18. The fastening device38is thereby used to mechanically connect each potential electrical conductor36to the main electrical conductor18. In this example, the fastener40is a screw that is screwed into the hole46such that the head48of the screw presses the washer42. The washer42in turn presses the electrically conductive glue54and the potential electrical conductors36against the main electrical conductor18. When tightening the fastener40, the washer42tightly presses the potential electrical conductor36and the electrically conductive glue54against the main electrical conductor18. InFIG.3, the outer surface of the head48of the fastener40and the outer surface of the washer42extend radially outside (with respect to the longitudinal axis30) of the outer surface of the main electrical conductor18. A small play may exist between the outer surfaces of the head48and the washer42and the compressive layer34prior to shrinkage of the body26. The play may for example be approximately 0.5 mm. The washer42further comprises a laterally outer rounded edge56which reduces the local electric field enhancement. The potential electrical conductors36are then lead up through the holes52. The flap is then folded back and the potential electrical conductors36are glued to the foil32a. The foil32ais then folded over the flap. Each potential electrical conductor36is connected to the foil32aby means of electrically conductive glue54. The remaining layers of insulating material and further foils32b,32cmay then be wound over the foil32a. The body26is then impregnated with a resin, such as epoxy, followed by curing of the resin to form the condenser core24. Due to the shrinkage of the body26during curing, the end of each potential electrical conductor36(the upper ends inFIG.3) is self-locked to the foil32a. Furthermore, the shrinkage of the body26causes the fastening device38(e.g. the fastener40and/or the washer42thereof) to be pressed against the main electrical conductor18to secure the electrical contact between the potential electrical conductor36and the main electrical conductor18. Each potential electrical conductor36may be formed with an excess bow or slack, for example of 10 mm. In this way, tension in the potential electrical conductor36, due to the shrinking of the body26when cured, can be reduced or avoided. While the present disclosure has been described with reference to exemplary embodiments, it will be appreciated that the present invention is not limited to what has been described above. For example, it will be appreciated that the dimensions of the parts may be varied as needed. | 9,283 |
11942743 | DETAILED DESCRIPTION Hereinafter, various embodiments of the disclosure will be described with reference to the accompanying drawings. However, it shall be understood that it is not intended to limit the disclosure to specific embodiments, and that the disclosure includes various modifications, equivalents, and/or alternatives of embodiments of the disclosure. In connection with the description of drawings, similar components may be denoted by similar reference numerals. FIG.1is a perspective view illustrating an electronic device according to various embodiments in a folded state.FIG.2is a perspective view illustrating an electronic device in which a display is rotated about 100 degrees according to various embodiments.FIG.3is a perspective view illustrating an electronic device according to various embodiments in an unfolded state. Referring toFIGS.1to3, an electronic device100according to various embodiments may include at least one of, for example, a smartphone, a tablet personal computer (PC), a mobile phone, an image phone, an e-book reader, a desktop PC, a laptop PC, a netbook computer, a workstation, a server, a personal digital assistant (PDA), a portable multimedia player (PMP), an MP3 player, a mobile medical device, a camera, or a wearable device (e.g., smart eyeglasses, a head-mounted-device (HMD), an electronic cloth, an electronic bracelet, an electronic necklace, an electronic appcessory, an electronic tattoo, a smart mirror, or a smart watch). The electronic device100according to various embodiments may include a main body10and a display20. In the main body10, the display20is capable of being folded or unfolded around a hinge axis a. For example, on the top surface10aof the main body10, a plurality of keys11(e.g., a keyboard) and a touch pad12are arranged, and a camera, a speaker21, a microphone, and the like are arranged on the display20. According to an embodiment, the main body10may include a first plate oriented in a first direction {circle around (1)} and a second plate oriented in a second direction {circle around (2)} opposite to the first direction {circle around (1)}. For example, the first plate may be the top surface10aof the main body, and the second plate may include a back cover10b. According to an embodiment, at least a portion of the space between the first and second plates may be surrounded by the side surface15. The side surface15may include multiple receptacles31,32, and33. Respective receptacles31,32, and33may be arranged at intervals in a direction in which the side surface15extends, for example, a third direction {circle around (3)}. The receptacles31,32, and33may be connectors for electrically connecting external connectors to the main body10. For example, the external connectors may include a USB connector and a male type receptacle. Hereinafter, a structure of a receptacle mounted on the side surface of the main body10according to various embodiments will be described with reference to the accompanying drawings. FIG.4Ais a front view illustrating two receptacles arranged on the side surface of an electronic device according to various embodiments of the disclosure, in which one of the receptacles is a fixed receptacle and the other is a movable receptacle. Referring toFIG.4A, receptacles41and42according to various embodiments are female-type connectors, and multiple receptacles41and42may be arranged on the side surface15of a main body (e.g., the main body10illustrated inFIG.1). When two receptacles are arranged on the side surface15, one receptacle, i.e., a first receptacle41, may be arranged to be fixed, and the other receptacle, i.e., a second receptacle42, may be configured to be movable. According to an embodiment, the fixed first receptacle41is one component, and may be mounted on a printed circuit board. According to an embodiment, the movable second receptacle42may include a receptacle body421and a receptacle shell422. The receptacle shell422may be slidably arranged in the receptacle body421in the third direction. FIG.4Bis a front view illustrating two receptacles arranged on the side surface of an electronic device according to various embodiments of the disclosure, in which movable receptacles are arranged side by side. Referring toFIG.4B, receptacles43and44according to various embodiments are female-type connectors, and multiple receptacles may be arranged on the side surface15of the main body. When two receptacles are arranged on the side surface15, one receptacle, i.e., a first receptacle43, may be arranged to be movable, and the other receptacle, i.e., a second receptacle44, may also be configured to be movable. According to an embodiment, the movable first receptacle43may include a receptacle body441and a receptacle shell432. The receptacle shell432may be slidably arranged in the receptacle body431in the third direction. According to an embodiment, the movable second receptacle44may include a receptacle body441and a receptacle shell442. The receptacle shell442may be slidably arranged in the receptacle body441in the third direction. FIG.4Cis a front view illustrating a receptacle arranged on the side surface of an electronic device according to various embodiments of the disclosure. Referring toFIG.4C, the receptacle45according to various embodiments may include a guide device47of the receptacle shell452. The sliding guide device47may include a combination of a guide rail4521and as guide opening4511. The guide rail4521may be configured in the receptacle shell452, and the guide opening4511may be configured in the receptacle body451. However, there is no need to be limited to this structure, and the guide rail4521may be configured in the receptacle body451, and the guide opening4511may be configured in the receptacle shell452. According to an embodiment, the receptacle shell452may move in the third direction {circle around (3)} within the receptacle body451by the sliding guide device47. For example, the receptacle shell452may move to one side by a first distance d1in the inner space of the receptacle body451and to the other side by a second distance d2. FIG.5Ais a perspective view illustrating a receptacle body according to various embodiments of the disclosure. Referring toFIG.5A, a receptacle body521according to various embodiments may be mounted on a printed circuit board (PCB). The receptacle body521may have a box shape, in which the front and rear sides are open. A guide opening5211may be formed in the top surface521aof the receptacle body521. For example, the guide opening5211may be formed in a linear shape. According to an embodiment, the receptacle (e.g., the receptacle45illustrated inFIG.4C) may include a connection structure524configured to electrically connect the receptacle body521and the receptacle shell (e.g., the receptacle shell452illustrated inFIG.4C). According to an embodiment, the connection structure524may include a first connection part5212provided in the receptacle body521and a second connection part5220provided in the receptacle shell. According to an embodiment, the first connection part5212may be disposed on the bottom surface521bof the receptacle body521. The first connection part5212may include multiple first connection terminals. Each of the first connection terminals may extend in the third direction {circle around (3)}. The guide opening5211and the first connection part5212may face each other. FIG.5Bis a perspective view illustrating a receptacle shell according to various embodiments of the disclosure. Referring toFIG.5B, a receptacle shell522according to various embodiments is a female-type connector into which an external connector is inserted, and may be configured in a box shape. The receptacle shell522may have a shape in which the front and rear sides are open and the top and bottom sides are closed. According to an embodiment, a guide rail5222may be configured on the top surface522aof the receptacle shell522. The guide rail5222may protrude in the first direction {circle around (1)} and may extend in the third direction {circle around (3)}. According to an embodiment, the receptacle shell522may include a molded part523. The molded part523may be coupled to the receptacle shell522so as to define the connection position of an external connector. The molded part523may be a support structure that can be fixed parallel to the inside of the receptacle shell522. Reference numeral522bdenotes the bottom surface of the receptacle. FIG.6is a perspective view illustrating a molded part according to various embodiments of the disclosure. Referring toFIG.6, the molded part523coupled to the receptacle shell (e.g., the receptacle shell522illustrated inFIG.5B) may define the connection position of an external connector, and the second connection part5220may be placed in the molded part523. The molded part523may include a first surface523aoriented in a first direction {circle around (1)} and a second surface523boriented in a second direction {circle around (2)} opposite to the first direction {circle around (1)}. For example, the second connection part5220may include one or more second connection terminals, for example, four second connection terminals. According to an embodiment, a first portion5221aof each second connection terminal connected to an external connector may be arranged on the first surface523aof the molded part523. For example, each of the second connection terminals may have approximately the same length. Each of the first portions5221amay have a shape extending in a direction in which the external connector is connected. FIG.7is a perspective view illustrating second terminals according to various embodiments of the disclosure. Referring toFIG.7, the second connection part5220may be arranged on a molded part (e.g., the molded part523illustrated inFIG.6) according to various embodiments. The second connection part5220may include four connection terminals, for example, first to fourth connection terminals5221-5224, and each of the first to fourth connection terminals5221-5224of the second connection part5220may have different shapes. According to an embodiment, the first connection terminal5221of the second connection part may include first to third portions5221a-5221c. According to an embodiment, the first portion5221amay be arranged on the first surface of the molded part (e.g., the first surface523aillustrated inFIG.6) to extend in the direction in which an external connector is attached/detached. According to an embodiment, the second portion5221bmay be bent at least once in the first portion5221a, and may be arranged in a shape extending in a third direction (e.g., the third direction {circle around (3)} illustrated inFIG.5A) toward the second surface (e.g., the second surface523billustrated inFIG.6) of the molded part. The second portion5221bmay be a connection area that is connected to the first connection part (e.g., the first connection part5212illustrated inFIG.5A), and may be a slidable surface contact part. According to an embodiment, the third portion5221cmay be a portion connecting the first and second portions5221aand5221b. According to an embodiment, the second connection terminal5222of the second connection part may include first to fourth portions5222a-5222d. According to an embodiment, the first portion5222amay be arranged on the first surface of the molded part (e.g., the first surface523aillustrated inFIG.6) to extend in the direction in which an external connector is attached/detached. According to an embodiment, the second portion5222bmay be bent at least once in the first portion5222a(e.g., bent about 90 degrees), and may be arranged in a shape extending in a third direction (e.g., the third direction {circle around (3)} illustrated inFIG.5A) toward the second surface (e.g., the second surface523billustrated inFIG.6) of the molded part. The second portion5222bmay be a connection area that is connected to the first connection part (e.g., the first connection part5212illustrated inFIG.5A), and may be a slidable surface contact part. According to an embodiment, the third and fourth portions5222cand5222dmay be portions connecting the first and second portions5222aand5222b. The third portion5222cmay be bent in the first portion5222a, and the fourth portion5222dmay be bent in the third portion5222c. According to an embodiment, the third connection terminal5223of the second connection part may include first to fourth portions5223a-5223d. According to an embodiment, the first portion5223amay be arranged on the first surface of the molded part (e.g., the first surface523aillustrated inFIG.6) to extend in the direction in which an external connector is attached/detached. According to an embodiment, the second portion5223bmay be bent at least once in the first portion5223a(e.g., bent about 90 degrees), and may be arranged in a shape extending in a third direction (e.g., the third direction {circle around (3)} illustrated inFIG.5A) toward the second surface (e.g., the second surface523billustrated inFIG.6) of the molded part. The second portion5223bmay be a connection area that is connected to the first connection part (e.g., the first connection part5212illustrated inFIG.5A), and may be a slidable surface contact part. According to an embodiment, the third and fourth portions5223cand5223dmay be portions connecting the first and second portions5223aand5223b. The third portion5223cmay be bent in the first portion5222a, and the fourth portion5223dmay be bent in the third portion5223c. According to an embodiment, the fourth connection terminal5224of the second connection part may include first to fourth portions5224a-5224d. According to an embodiment, the first portion5224amay be arranged on the first surface of the molded part (e.g., the first surface523aillustrated inFIG.6) to extend in the direction in which an external connector is attached/detached. According to an embodiment, the second portion5224bmay be bent at least once in the first portion5224a(e.g., bent about 90 degrees), and may be arranged in a shape extending in a third direction (e.g., the third direction {circle around (3)} illustrated inFIG.5A) toward the second surface (e.g., the second surface523billustrated inFIG.6) of the molded part. The second portion5224bmay be a connection area that is connected to the first connection part (e.g., the first connection part5212illustrated inFIG.5A), and may be a slidable surface-contact part. According to an embodiment, the third and fourth portions5224cand5224dmay be portions connecting the first and second portions5224aand5224b. The third portion5224cmay be bent in the first portion5222a, and the fourth portion5224dmay be bent in the third portion5224c. According to an embodiment, each of the first portions5221a-5224amay have approximately the same length, and each of the second portions5221b-5224bmay have substantially the same length and be arranged in substantially the same direction. According to an embodiment, in the structure of the second to fourth connection terminals5222-5224, each of the third portions5222c-5224cmay have substantially the same length, and each of the fourth portions5222d-5224dmay have different lengths. According to an embodiment, each of the first portions5221a-5224aextends in the direction in which an external connector is attached/detached, and each of the second portions5221b-5224bmay extend in the third direction (e.g., the third direction {circle around (3)} inFIG.5A). According to an embodiment, in the structure of the second to fourth connection terminals5222-5224, each of the third portions5222c-5224cis arranged in the first direction (e.g., the first direction {circle around (1)} illustrated inFIG.5B), and each of the fourth portions5222d-5224dmay extend in the direction in which an external connector is attached/detached. FIG.8is a plan view illustrating the state in which first and second plugs are connected to first and second receptacles according to various embodiments of the disclosure. Referring toFIG.8, first and second receptacles81and82(e.g., the first and second receptacles41and42illustrated inFIG.4A) arranged on the side surface15(e.g., the side surface15illustrated inFIG.2) may be arranged to be spaced apart from each other. When connecting the first and second plugs83and84to respective first and second receptacles81and82, it is possible to simultaneously connect first and second connection parts832and842of the first and second plugs83and84to the first and second receptacles81and82respectively, by sliding the receptacle shell822of the second receptacle82(e.g., the receptacle shell522illustrated inFIG.5B) from the receptacle body820(e.g., the receptacle body521illustrated inFIG.5A) in the third direction {circle around (3)} (e.g., the third direction {circle around (3)} illustrated inFIG.2). When each of the first and second receptacles81and82is configured to be fixed, the simultaneous connection may not be possible due to the width w1of the first plug body830and the width w2of the second plug body840. However, when any one of the first and second receptacles81and82is configured as a movable receptacle, regardless of the width of each of the first and second plug bodies830and840, the simultaneous connection of the first and second plugs83and84may be possible. FIG.9is a plan view illustrating a plug in which a connection part is configured to be movable according to various embodiments of the disclosure. Referring toFIG.9, in a plug91(e.g., the second plug84illustrated inFIG.8) connected to a receptacle according to various embodiments, a connection part912(e.g., the second connection part842illustrated inFIG.8) may be configured to be movable. According to an embodiment, the plug91may include a plug body910and a connection part912, which is movable in a third direction, i.e., the width direction of the plug body910, in the plug body910by sliding guide devices913and914(e.g., the sliding guide device47illustrated inFIG.4C). The connection part912may slide in the third direction (e.g., the third direction {circle around (3)} illustrated inFIG.2) in the plug body910. For example, the sliding guide device may include a guide rail914(e.g., the guide rail5222illustrated inFIG.5B) and a guide opening913(e.g., the guide opening5211illustrated inFIG.5A). For example, the guide rail914may be configured in the connection part912or the plug body910, and the guide opening913may be configured in the connection part912or the plug body910. FIG.10is a plan view illustrating the state in which first and second plugs are connected to first and second receptacles according to various embodiments of the disclosure. Referring toFIG.10, the first and second receptacles93and94arranged on the side surface15may be arranged to be spaced apart from each other. When connecting the first and second plugs95and96to the first and second receptacles93and94, respectively, the first and second plugs95and96may be respectively connected to the first and second receptacles93and94by sliding the connection part962of the second plug96(e.g., the plug91illustrated inFIG.9) in the third direction {circle around (3)} (e.g., the third direction {circle around (3)} illustrated inFIG.2) in the shell961in the plug body960. Even if each of the first and second receptacles93and94is fixedly arranged, when the connection part of any one of the first and second plugs95and96is configured to be movable, simultaneous connection of the first and second plugs95and96may be possible regardless of the widths w3of the first body950and the width w4of the second plug960. FIG.11Ais a perspective view illustrating a receptacle shell according to various embodiments of the disclosure, andFIG.11Bis a cross-sectional view illustrating a guide device according to various embodiments of the disclosure. Referring toFIGS.11A and11B, a receptacle shell622according to various embodiments is a female-type connector into which an external connector is inserted, and may be configured in a box shape. The receptacle shell622may have a shape having an open front side, a closed lateral side, and closed top and bottom sides. For example, the receptacle shell622may include a top surface622a, a bottom surface622b, both side surfaces622c, and a rear surface622d. According to an embodiment, a guide device623of the receptacle shell622may be arranged on the rear surface622dside. A guide rail6622may be configured on the rear surface622dof the receptacle shell. For example, the guide rail6622may be linear, and the guide rail6622may protrude from the rear surface622dtoward the rear side, and may extend in the third direction {circle around (3)}. According to an embodiment, the receptacle shell622may include a molded part (e.g., the molded part523illustrated inFIG.5B). The molded part is coupled to the receptacle shell622so as to define the connection position of an external connector. According to an embodiment, the receptacle body621into which the receptacle shell622is inserted may have a guide opening6211into which the guide rail6222is inserted, and which is configured in the rear surface621cthereof. The guide opening6211may be linear, and may have a length longer than the extension length of the guide protrusion6222. Thus, limited sliding movement of the guide protrusion6222may be possible. The connection structure configured between the receptacle shell622and the receptacle body621may be configured in the same manner as the connection structure illustrated inFIGS.6and7. FIG.12Ais a perspective view illustrating a receptacle shell according to various embodiments of the disclosure,FIG.12Bis a front view illustrating the receptacle shell according to various embodiments of the disclosure, andFIG.12Cis a cross-sectional view illustrating a guide device according to various embodiments of the disclosure. Referring toFIGS.12A to12C, a receptacle shell722according to various embodiments is a female-type connector into which an external connector is inserted, and may be configured in a box shape. The receptacle shell722may have a shape having an open front side, a closed lateral side, and closed top and bottom sides. For example, the receptacle shell722may include a top surface722a, a bottom surface722b, both side surfaces722c, and a rear surface722d. According to an embodiment, guide devices723of the receptacle shell722may be arranged on both side surfaces722csides, respectively. Guide rails7222may be configured on both side surfaces722cof the receptacle shell, respectively. For example, each guide rail7222may be linear, and may protrude laterally from the corresponding side surface722c. According to an embodiment, the receptacle shell722may include a molded part (e.g., the molded part523illustrated inFIG.5B). The molded part is coupled to the receptacle shell722so as to define the connection position of an external connector. According to an embodiment, the receptacle body721into which the receptacle shell722is inserted may have guide openings7211into which the guide rails7222are inserted, respectively, and which are configured in both side surfaces721cthereof, respectively. The guide opening7211may be linear, and may have a length longer than the extension length of the guide protrusion7222. Thus, limited sliding movement of the guide protrusion7222may be possible. Various embodiments disclosed in this specification and the drawings are provided merely to represent specific examples for the purpose of easily describing the technical contents of the disclosure and helping the understanding of the disclosure, and are not intended to limit the scope of the disclosure. Accordingly, the scope of the disclosure should be construed in such a manner that, in addition to the embodiments disclosed herein, all changes or modifications derived from the technical idea of the disclosure are included in the scope of the disclosure. | 23,988 |
11942744 | The attached figures in the drawing are intended to impart further understanding of the embodiments of the invention. They illustrate embodiments and, in connection with the description, are used to explain principles and concepts of the invention. Other embodiments and many of the mentioned advantages can be seen from the drawings. The elements in the drawings are not necessarily shown true to scale with respect to one another. Identical, functionally identical and identically acting elements, features and components have each been provided with the same reference symbols in the figures in the drawing, where no mention is made to the contrary. The figures will be described contiguously and comprehensively below. DESCRIPTION OF EXEMPLARY EMBODIMENTS In the text which follows, the principle of the method in accordance with the present disclosure for producing a high-frequency connector will be explained with reference toFIGS.1A to1C: In a first manufacturing step shown inFIG.1A, a basic body part1of the high-frequency connector2is produced from a dielectric material. The basic body part1has a single through-hole4, which runs along the longitudinal axis3. The geometry of the dielectric basic body part1does not necessarily need to be hollow-cylindrical, as is illustrated inFIGS.1A to1Cfor reasons of simplicity. Other geometries differing from a hollow-cylindrical geometry for the basic body part1, for example for a high-frequency right-angle connector, are also conceivable. Preferably, the geometry of the basic body part1is formed so as to be rotationally symmetrical with respect to the longitudinal axis3in order to realize concentricity between the inner conductor coating and the outer conductor coating of the high-frequency connector2with the basic body part1acting as insulator element. This concentricity is an essential prerequisite for optimized, in terms of high frequencies, transmission of an unbalanced high-frequency signal within the high-frequency connector. On the basis of this rotationally symmetrical basic geometry of the basic body part1, in particular with a view to further mechanical and electrical functions and/or optimizations, additional technically expedient geometric modifications can be performed. In this case, comparatively complex technical geometries and miniaturized forms as far as into the micrometers and nanometers range can be realized by means of the use of additive manufacturing technologies in the production of the basic body part1. In a further manufacturing step as shown inFIG.1B, the dielectric basic body part1is coated with an electrically conductive coating5. The coating5completely surrounds the dielectric basic body part1. Even in the case of comparatively complex geometric forms of the basic body part1, the entire outer surface of the basic body part1is provided with an electrically conductive coating5without any gaps. The electrically conductive coating5typically contains an electrically conductive layer, i.e. a metallic layer. When using an electrochemical coating method, the dielectric basic body part1needs to be coated with an electrically conductive, preferably a metallic, starting layer by means of a non-electrochemical coating method. Thereupon, the actual metallic layer is constructed onto this starting layer. In addition, the dielectric basic body part1can have in each case a plurality of metallic layers over the entire surface or preferably selectively in certain regions in order to achieve particular mechanical and electrical properties by virtue of this multiple coating. There are increased mechanical and electrical requirements in particular in the contact-making regions711and712on the outer conductor side and on the inner conductor side of the high-frequency connector2with an associated high-frequency mating connector at the first end61of the basic body part1. For example, an additional gold layer in the two contact-making regions711and712advantageously has the effect of increased abrasion resistance and at the same time a lower contact resistance. Increased mechanical and electrical requirements which necessitate a multilayered coating may also be present, however, in the contact-making regions721and722on the outer conductor side and on the inner conductor side at the second end62of the basic body part1which make contact, for example, with a further high-frequency mating connector. In the final, third manufacturing step, as shown inFIG.1C, the electrically conductive coating5, which is composed of at least one metallic layer, is removed in a region341and342surrounding the through-hole4in each case at the first end61and at the second end62, respectively, of the high-frequency connector2. In this way, self-contained regions of the coating5, which are each electrically isolated from one another, form on the outer surface of the basic body part1. One region is the region on the outer lateral surface of the basic body part1which reaches as far as into end faces at the two ends of the basic body part1and forms the outer conductor of the high-frequency connector2. The other region is the region in the through-hole4which reaches as far as into end faces at the two ends of the basic body part1and forms the inner conductor of the high-frequency connector2. By virtue of this manufacturing step, the original coating is divided into a coating51on the outer conductor side and a coating52on the inner conductor side. A contact-making region711on the outer conductor side and a contact-making region712on the inner conductor side are formed at the first end61of the high-frequency connector2. A contact-making region721on the outer conductor side and a contact-making region722on the inner conductor side are formed at the second end62of the high-frequency connector2. In this way, a high-frequency connector2for a high-frequency signal can be produced by means of three successive and typically automatable manufacturing steps. Individual-part manufacture for the inner conductor element, the insulator element and the outer conductor element and subsequent comparatively complex assembly are not required. A basic structure of a connector2for a differential high-frequency signal is shown inFIGS.2A and2B. In this case, two through-holes41and42, which each run from the first end61to the second end62in the longitudinal extent of the high-frequency connector2, are formed by means of the additive manufacturing method. The coatings521and522, respectively, in the two through-holes41and42are each used as inner conductor, while the coating51on the outer lateral surface forms the outer conductor. Instead of two through-holes41and42, any desired and technically expedient number of through-hole pairs can be formed which have an inner coating which in each case forms the inner conductor pairs for transmitting in each case one differential high-frequency signal. The individual pairs of through-holes can be formed within the basic body part1either so as to intersect one another or parallel to one another. A further embodiment of a basic structure of a high-frequency connector2is shown inFIG.3. In this case, the through-hole4of the basic body part1is completely filled with coating material by means of selective coating. Alternatively, a coating within the through-hole4can also be realized which has a greater layer thickness in comparison with the coating51on the outer conductor side and at the same time does not completely fill the through-hole4. Such a selective coating which has an enlarged layer thickness in the inner conductor region is primarily advantageous for transmission of a high-frequency signal in a relatively high power range. An increased layer thickness implemented by means of selective coating in a contact-making region711,712,721and722of the high-frequency connector2makes it possible to extend the service life of a high-frequency connector which gets ever shorter owing to abrasion in the contact-making region. FIGS.4A,4B,4C,4D,4E,4F and4Grelate to a high-frequency connector2which is produced in accordance with a first variant of the production method. In this case, a socket-shaped extension9of the basic body part1is constructed in the region of the first end61of the dielectric basic body part1starting from the substantially hollow-cylindrical basic body part1on the outer conductor side by means of the additive manufacturing method. The socket-shaped extension9of the basic body part1in this case protrudes in the direction of the longitudinal axis of the high-frequency connector beyond the end face10at the first end61of the basic body part. The contact-making region712on the inner conductor side of a high-frequency connector2produced in such a way is realized by a coating52on the inner conductor side applied to the end face10on the inner conductor side. This contact-making region712on the inner conductor side forms end-face contact-making with a contact-making region712′ on the inner conductor side, which is located on an opposite end face10′ of an associated high-frequency mating connector2′. The contact-making region711on the outer conductor side of a high-frequency connector2produced in such a way is implemented by the coating51on the outer conductor side on the inner lateral surface of the socket-shaped extension9of the basic body part1. For this purpose, preferably the coating51on the outer conductor side of the high-frequency connector2is guided from the outer lateral surface of the basic body part1via a plurality of slots11, which are formed in the transition region12between the socket-shaped extension9and the basic body part1by means of the additive manufacturing method, onto the inner lateral surface of the socket-shaped extension9. In this way, the coating51on the outer conductor side is guided over the entire longitudinal extent of the high-frequency connector2with the same radial spacing with respect to the longitudinal axis3of the high-frequency connector2and therefore coaxially with respect to the coating52on the inner conductor side. This contact-making region711on the outer conductor side forms radially directed contact-making with a contact-making region711′ on the outer conductor side, which is located on the outer lateral surface of an associated high-frequency mating connector2′. Electrical isolation between the contact region711on the outer conductor side and the contact region712on the inner conductor side is implemented by virtue of the fact that a region, located between the contact region711on the outer conductor side and the socket-shaped extension9, of the end face10of the basic body part1is not coated. The associated high-frequency mating connector2′ can be produced using a conventional manufacturing method. Alternatively, the high-frequency mating connector2′, as can be seen fromFIGS.4F and4G, can also be produced in accordance with the present disclosure in an additive manufacturing method. The high-frequency mating connector2′ produced in accordance with the present disclosure in an additive manufacturing method is in this case a high-frequency connector2produced in accordance with the fourth variant of the production method with end-face contact-making, which will be explained further below. The end-face contact-making is in this case restricted to contact-making on the inner conductor side via a contact-making region712′ on the inner conductor side since the contact-making on the outer conductor side is implemented by virtue of radial contact-making. In order to improve the contact-making on the outer conductor side between the high-frequency connector2and the associated high-frequency mating connector2′, in a preferred development of the fourth variant of the production method of a high-frequency connector as shown inFIGS.4F and4G, a contact ridge13running radially outwards, preferably a ring-shaped contact ridge13, is constructed on the outer lateral surface of the basic body part1in the region of the first end of the basic body part1by means of the additive manufacturing method. This contact ridge13running radially outwards enables approximately linear contact between the inner lateral surface of the socket-shaped extension9belonging to the high-frequency connector2and the outer lateral surface of the high-frequency mating connector2′. In order to exert sufficient contact pressure of the contact ridge13running radially outwards on the inner lateral surface of the socket-shaped extension9, that region of the basic body part1′ which is adjacent to the contact ridge13running radially outwards is designed to be elastic. This may be, as is illustrated inFIGS.4F and4G, a cavity14which is formed in a region of the basic body part1′ which is adjacent to the contact ridge13running radially outwards by means of the additive manufacturing method. Alternatively, that region of the basic body part1′ which is adjacent to the contact ridge13running radially outwards can also be constructed using an elastic dielectric material by means of the additive manufacturing method. With a view to good contact-making on the outer conductor side and good mechanical guidance, the inner diameter of the socket-shaped extension9plus the coating51on the outer conductor side is matched to the outer diameter of the associated high-frequency mating connector2′. The length of the socket-shaped extension9should be dimensioned sufficiently to likewise ensure good guidance of the high-frequency mating connector2′ in the high-frequency connector2. The inner lateral surface of the socket-shaped extension9of the basic body part1of the high-frequency connector2is used not only as the contact-making region711on the outer conductor side, but also, in combination with the outer lateral surface of the high-frequency mating connector, as a guide region. In a second variant of the production method, a high-frequency connector2is produced with a pin-shaped extension15on the inner conductor side. The pin-shaped extension15of the basic body part1in this case protrudes in the direction of the longitudinal axis of the high-frequency connector beyond the end face10at the first end61of the basic body part. In a preferred embodiment, the pin-shaped extension on the inner conductor side has a star-shaped structure. This star-shaped structure advantageously enables multiple contact-making between the pin-shaped extension15on the inner conductor side and an associated primarily socket-shaped inner conductor of an associated high-frequency mating connector2′. FIGS.5A,5B,5C,5D,5E,5F and5Grelate to a high-frequency connector2which is produced in accordance with a first subvariant of this second variant of the production method. In the first subvariant as well as in the second subvariant explained thereafter of a pin-shaped extension15on the inner conductor side of the basic body part1, in each case a plurality of lamella-shaped regions is constructed as the pin-shaped extension15on the basic body part1by means of additive manufacturing technology. The lamella-shaped regions161,162,163and164of the pin-shaped extension15having a star-shaped structure are constructed on the basic body part1by means of the additive manufacturing method at the first end61of the basic body part1in such a way that in each case two adjacent lamella-shaped regions161,162,163and164each enclose an angle, preferably an identical angle. The angle results from the number n of lamella-shaped regions and corresponds to 360°/n. Therefore, the individual lamella-shaped regions within the pin-shaped extension15are oriented radially and therefore in the form of a star with respect to the longitudinal axis3of the high-frequency connector2. The individual lamella-shaped regions161,162,163and164are constructed in such a way that they are connected to one another in the region of the longitudinal axis3. By virtue of the additive construction, in each case two adjacent lamella-shaped regions161,162,163und164are each connected to the basic body part1, preferably to the inner lateral surface of the hollow-cylindrical basic body part1, spaced apart from one another at an angle of 360°/n. By virtue of the radially directed or star-shaped construction of the individual lamella-shaped regions161,162,163and164, a number of axial through-holes171,172,173and174corresponding to the number of lamella-shaped regions is formed in the pin-shaped extension15. The entire pin-shaped extension15with all of its lamella-shaped regions161,162,163and164is coated contiguously with the coating52on the inner conductor side of the basic body part1via these axial through-holes171,172,173and174. With a view to improved contact-making, i.e. preferably hemispherical contact-making, between the pin-shaped extension15on the inner conductor side of the high-frequency connector2and a socket-shaped inner conductor of the high-frequency mating connector2′, in each case one contact ridge18is constructed on the end face of each lamella-shaped region161,162,163and164. In the event of the presence of manufacturing tolerances and an axial offset or an angular offset between the high-frequency connector2and the high-frequency mating connector2′, the contact ridge18enables reliable contact-making with respect to an areal contact in an end-face segment of the individual lamella-shaped region. The radial cross-sectional profile of each individual lamella-shaped region, i.e. the form of the side faces of each individual lamella-shaped region, should be constructed with the aid of the additive manufacturing method in such a way that, firstly, simple insertion of the pin-shaped extension15on the inner conductor side of the high-frequency connector2into the socket-shaped form on the inner conductor side of the high-frequency mating connector2′ is possible. In addition, reliable contact-making on the inner conductor side is intended to be realized. Therefore, a concavely curved form as shown inFIGS.5A,5C and5Gis suitable. Alternatively, a conically shaped form is also conceivable. The preferably hemispherical contact ridges18are in each case constructed depending on the selected form of the individual lamella-shaped regions in a section of the end face of the lamella-shaped region in which reliable contact-making is possible. In order to exert sufficient contact pressure of the contact ridge18at the end face of the individual lamella-shaped regions on the socket-shaped inner conductor of the high-frequency mating connector2′, the individual lamella-shaped regions161,162,163and164are each designed to be elastic. Preferably, in this case through-bores19are formed in the individual lamella-shaped regions by means of the additive manufacturing method. Alternatively, the individual lamella-shaped regions can also be constructed using an elastic dielectric material. In the case of a high-frequency connector2which is manufactured in accordance with the first subvariant of the second variant of the production method, by way of summary radial contact-making therefore takes place on the inner conductor side between the individual lamella-shaped regions161,162,163and164of the pin-shaped extension15of the basic body part1, said regions forming the contact region712on the inner conductor side of the high-frequency connector2, with a contact region712′ on the inner conductor side of the high-frequency mating connector2′. This contact region712′ on the inner conductor side is located in the through-hole4′ on the inner lateral surface, provided with a coating52on the inner conductor side, of the basic body part1′ belonging to the high-frequency mating connector2′. In order to realize the contact region711on the outer conductor side of the high-frequency connector2, the coating51on the outer conductor side is guided over a specific region of the end face10at the first end61of the basic body part1. This contact-making region711on the outer conductor side of the high-frequency connector2is located in an end-face contact with an opposite contact-making region711′ on the outer conductor side, which is constructed on the outer conductor side at the end face10′ at the first end61of the basic body part1′ belonging to the high-frequency mating connector2′. The high-frequency mating connector2′ can be produced using conventional manufacturing technology as well as using additive manufacturing technology. Electrical isolation between the contact region711on the outer conductor side and the contact region712on the inner conductor side is implemented by virtue of the fact that a region, located between the contact region711on the outer conductor side and the pin-shaped extension15, of the end face10of the basic body part1is not coated. The contact region712on the inner conductor side of the high-frequency connector2forms additionally, in combination with the inner lateral surface of the socket-shaped inner conductor of the high-frequency mating connector2′, the guide region of the high-frequency connector. FIGS.6A,6B,6C,6D,6E,6F and6Grelate to a high-frequency connector2which is produced in accordance with a second subvariant, belonging to the second variant, of the production method. In the case of the second subvariant belonging to the second variant as well, a pin-shaped extension15′ of the basic body part1is constructed with a star-shaped structure comprising a plurality of lamella-shaped regions161′,162′,163′ and164′ constructed in the form of a star with respect to one another with the aid of an additive manufacturing method. In contrast to the first subvariant, the contact-making between the individual lamella-shaped regions161′,162′,163′ and164′ and the inner conductor of the high-frequency connector2′ takes place laterally. For this purpose, in each case one contact ridge18′ is constructed on the two side faces of each lamella-shaped region161′,162′,163′ and164′. Each of these preferably hemispherical contact ridges18′ on a lamella-shaped region161′,162′,163′ and164′ of the pin-shaped extension15′ of the basic body part1belonging to the high-frequency connector2makes contact with an associated projection20in the lateral direction. Each individual projection20is constructed, by means of the additive manufacturing method, so as to protrude into the through-hole4′, starting from the hollow-cylindrical basic body part1′ of the high-frequency mating connector2′, in a region of the basic body part1′ which is adjacent to the first end61′. The individual projections20are constructed in accordance with a high-frequency connector2which is produced in accordance with a preferred development of the fourth variant of the production method corresponding toFIGS.6E,6F and6G. The individual projections are in this case constructed within the hollow-cylindrical basic body part1′ in such a way that an associated lamella-shaped region of the high-frequency connector is guided safely between in each case two adjacent projections20. At the same time, the individual projections are in this case constructed and formed within the hollow-cylindrical basic body part1′ in such a way that safe contact-making with the contact ridges18of the lamella-shaped regions, inserted adjacent in each case, of the high-frequency connector2is realized. Possible forms of the individual projections20are radial cross sections which are either conical or concavely curved, as indicated inFIG.6E. In order to implement sufficient contact pressure between the contact ridges18of the individual lamella-shaped regions of the pin-shaped extension15′ belonging to the high-frequency connector2of the basic body part1and the associated projections20of the high-frequency mating connector2′, an elastic design of the individual projections20is an option. For this purpose, the individual projections20can be constructed in each case using an elastic dielectric material using additive manufacturing technology. Alternatively, an elastic form of the individual projections20, for example by means of the formation of cavities within the projections20, is also possible. The contact-making on the outer conductor side takes place via an end-face contact between a contact region711on the outer conductor side on the end face10of the high-frequency connector2and an opposite contact region711′ on the outer conductor side on the end face10′ of the high-frequency mating connector2′. FIGS.7A,7B,7C,7D,7E,7F and7Grelate to a high-frequency connector2which is produced in accordance with a third subvariant, belonging to the second variant, of the production method. In the third subvariant belonging to the second variant, a pin-shaped extension15″ of the basic body part1is constructed with a star-shaped structure comprising a plurality of rib-shaped regions211,212,213and214constructed in the form of a star with respect to one another with the aid of an additive manufacturing method. The rib-shaped regions211,212,213and214of the pin-shaped extension15″ having a star-shaped structure are constructed on the basic body part1, by means of the additive manufacturing method, at the first end61of the basic body part1in such a way that in each case two adjacent rib-shaped regions211,212,213and214each enclose an angle, preferably an identical angle. The angle results from the number n of rib-shaped regions and corresponds to 360°/n. Therefore, the individual rib-shaped regions within the pin-shaped extension15″ are aligned radially and therefore in the form of a star with respect to the longitudinal axis3of the high-frequency connector2. The individual rib-shaped regions211,212,213and214are constructed in such a way that they are connected to one another in the region of the longitudinal axis3. By virtue of the additive construction, two adjacent rib-shaped regions211,212,213and214are connected to the basic body part1, preferably on the inner lateral surface of the hollow-cylindrical basic body part1, in each case spaced apart from one another at an angle of 360°/n. The star-shaped structure of the pin-shaped extension15″ comprising the individual rib-shaped regions211,212,213and214forms a number of axial through-holes221,222,223and224corresponding to the number of rib-shaped regions. The entire pin-shaped extension15″ with all of its rib-shaped regions211,212,213and214is coated contiguously with the coating52on the inner conductor side of the basic body part1via these axial through-holes221,222,223and224. The individual rib-shaped region of the pin-shaped extension15″ of the basic body part1has, radially inwards and radially outwards, in each case one concavely curved end face. In each case one contact ridge23is constructed on the end face, directed radially outwards, of each rib-shaped region211,212,213and214by means of the additive manufacturing method. Radial multiple contact-making with the contact-making region721′ on the inner conductor side is realized on the inner lateral surface of the substantially hollow-cylindrical basic body part1′ of the high-frequency mating connector2′ via the contact ridges23of all of the rib-shaped regions211,212,213and214. The high-frequency mating connector2′ can in this case be produced using conventional manufacturing technology or, as illustrated inFIGS.7E,7F and7G, also in accordance with the present disclosure using additive manufacturing technology. In order to exert sufficient contact pressure of the contact ridge23at the end face of the individual rib-shaped regions on the contact-making region721′ on the inner conductor side in the socket-shaped inner conductor of the high-frequency mating connector2′, the individual rib-shaped regions211,212,213and214are each designed to be elastic. In this case, through-bores24are preferably formed in the individual rib-shaped regions by means of the additive manufacturing method. Alternatively, the individual rib-shaped regions can also be constructed using an elastic dielectric material. In the case of the high-frequency connector2, which is produced in accordance with the third subvariant, belonging to the second variant, of the production method, radial contact-making is realized on the inner conductor side. Similarly to the first and second subvariants of the second variant of the production method, end-face contact-making with the high-frequency mating connector2is implemented on the outer conductor side. FIGS.8A,8B,8C,8D,8E,8F and8Grelate to a high-frequency connector2which is produced in accordance with a fourth subvariant, belonging to the second variant, of the production method. In the fourth subvariant belonging to the second variant, a pin-shaped extension15′″ of the basic body part1comprising a plurality of regions251,252,253and254in the form of spring arms is constructed on the basic body part1with the aid of an additive manufacturing method. Each individual region251,252,253and254in the form of a spring arm of the pin-shaped extension15′″ of the basic body part1is formed with its main dimension in the direction of the longitudinal axis3of the high-frequency connector2. The individual regions251,252,253and254in the form of spring arms are constructed on the basic body part1with an angular offset preferably on the inner lateral surface of the hollow-cylindrical basic body part1. In this case, in each case two adjacent regions251,252,253and254in the form of spring arms each enclose an angle of 360°/n when the pin-shaped extension15′″ of the basic body part1contains a number n of regions in the form of spring arms. Since the individual regions251,252,253and254in the form of spring arms of the pin-shaped extension15′″ of the basic body part1are not connected to one another in the region of the longitudinal axis3of the high-frequency connector2, the pin-shaped extension15′″ has a single through-hole26. The through-hole26enables a complete and contiguous electrically conductive coating of each individual region251,252,253and254in the form of a spring arm with the coating52on the inner conductor side of the substantially hollow-cylindrical basic body part1. In each case one contact ridge27is constructed on the radially outwardly directed and concavely curved end face of each region251,252,253and254in the form of a spring arm by means of the additive manufacturing method. Radial multiple contact-making with the contact-making region721′ on the inner conductor side is realized on the inner lateral surface of the substantially hollow-cylindrical basic body part1′ of the high-frequency mating connector2′ via the contact ridges27of all of the regions251,252,253and254in the form of spring arms. The high-frequency mating connector2′ can in this case be produced using conventional manufacturing technology or, as illustrated inFIGS.7E,7F and7G, also in accordance with the present disclosure using additive manufacturing technology. Owing to their shaping elasticity, the individual contact regions251,252,253and254in the form of spring arms do not additionally need to be designed to be elastic by means of the additive manufacturing method. In addition to the radially oriented contact-making on the inner conductor side, end-face contact-making with the high-frequency mating connector2′ is realized on the outer conductor side in the high-frequency connector2. This end-face contact-making on the outer conductor side is realized in an equivalent way to the first, second and third subvariants of the second variant of the production method. FIGS.9A,9B,9C,9D,9E,9F and9Grelate to a high-frequency connector2which is produced in accordance with a third variant of the production method. In the case of a high-frequency connector2produced in accordance with the third variant of the production method, a sleeve-shaped extension28of the basic body part1is constructed on the inner conductor side on the basic body part1with the aid of the additive manufacturing method. This sleeve-shaped extension28protrudes in the direction of the longitudinal axis beyond the end face10at the first end61of the basic body part1. This sleeve-shaped extension28is formed in each case with a plurality of slots at its distal end in the direction of the longitudinal axis3of the high-frequency connector. In this way, a spring lug is formed between in each case two adjacent slots29. The sleeve-shaped extension28therefore forms a sleeve which is designed to be elastic or sprung in each case in the radial direction. For improved radial contact-making, in each case one radially outwardly directed contact ridge30is constructed at the distal end of each individual spring lug with the aid of the additive manufacturing method. The sleeve-shaped extension28of the basic body part1, with all of its spring lugs, is coated completely and contiguously with the coating52on the inner conductor side on the inner lateral surface of the substantially hollow-cylindrical basic body part1. Therefore, the sleeve-shaped extension28forms the contact region721on the inner conductor side of the high-frequency connector2. A contact region711on the outer conductor side of the high-frequency connector2is in the form of an end-face contact region and is produced in a manner equivalent to all of the subvariants of the second variant of the production method. The contact-making on the inner conductor side takes place between the contact-making region712on the inner conductor side of the high-frequency connector2, which is formed from the individual contact ridges30running radially outwards on the spring lugs of the sleeve-shaped extension28, and the contact-making region712′ on the inner conductor side on the inner lateral surface of the basic body part1of the high-frequency mating connector2′. The contact-making region712′ on the inner conductor side of the high-frequency mating connector2′ is preferably formed by a step31on the inner lateral surface at the first end61′ of the basic body part1′. The radial extent of the step31substantially corresponds to the wall thickness of the sleeve-shaped extension28at its distal end in order to thus avoid a jump in diameter on the inner conductor side in the transition region between the high-frequency connector2and the high-frequency mating connector2′. Otherwise, an imperfection would be produced which impairs the transmission response of the high-frequency connector to a not inconsiderable extent. FIGS.10A,10B,10C,10D,10E,10F and10Grelates to a high-frequency connector2which is produced in accordance with a fourth variant of the production method. A high-frequency connector2produced in accordance with the fourth variant of the production method preferably makes contact with an associated high-frequency mating connector2′ on the inner conductor side and on the outer conductor side via in each case one end-face contact-making. Alternatively, only one end-face contact-making on the inner conductor side or only one end-face contact making on the outer conductor side is also possible. For this purpose, a contact-making region712on the inner conductor side is produced at the end face10at the first end61of the basic body part1by virtue of the coating52on the inner conductor side on the inner lateral surface of the substantially hollow-cylindrical basic body part1being extended as far as into a region on the inner conductor side on the end face10. In this case, the coating52on the inner conductor side is guided so far into the end face10that there is a sufficiently large contact-making region712on the inner conductor side. With a view to extending the life of the contact-making region712on the inner conductor side in the end-face region, which has been subjected to a certain amount of abrasion owing to high connection cycles, the coating52on the inner conductor side in the end-face region is preferably formed with a plurality of layers or with a relatively high layer thickness. In an equivalent manner, the contact-making region711on the outer conductor side is produced by virtue of the coating51on the outer conductor side being continued from the outer lateral surface of the basic body1into a sufficiently large region on the outer conductor side on the end face10. In order to prevent an angular offset between the high-frequency connector2and the high-frequency mating connector2′ during end-face contact-making, in each case one sleeve-shaped or ring-shaped extension32of the basic body part1at the first end61of the basic body part1is constructed on the inner conductor side and/or on the outer conductor side by means of an additive manufacturing method. In the direct vicinity of this sleeve-shaped or ring-shaped extension32, a cavity33is formed in the basic body part1by means of an additive manufacturing method. The cavity33forms, with the ring-shaped or sleeve-shaped extension32on the end face10, in each case one elastic termination of the basic body part1on the inner conductor side and on the outer conductor side. This elastic termination of the basic body part1can compensate for an angular offset between the two high-frequency connectors which have been inserted one inside the other. As an alternative to a ring-shaped or sleeve-shaped extension32of the basic body part1, a plurality of preferably hemispherical extensions of the basic body part1is also possible. The plurality of preferably hemispherical extensions32of the basic body part1is in each case arranged on a circle, an ellipse or a rectangle in the outer conductor region and inner conductor region. In each case cavities33are formed in the basic body part1in the direct vicinity of the individual preferably hemispherical extensions32as well by means of an additive manufacturing method. In order to compensate for an axial offset between the high-frequency connector2and the high-frequency mating connector2′, a socket-shaped extension34is fastened to one of the two high-frequency connectors. This socket-shaped extension34may be, for example, a sleeve produced from an electrically insulating material, which, as is indicated inFIG.10G, is pressed onto the finished high-frequency connector in the region of the first end61of the basic body part1. Alternatively, a socket-shaped extension as shown inFIGS.4C,4D and4Gis also possible, said extension being constructed on the basic body part1in the region of the first end61of the basic body part1by means of an additive manufacturing method. Owing to the end-face contact-making on the outer conductor side, the coating51on the outer conductor side needs to be removed over the entire outer surface of this socket-shaped extension with the exception of the coating in the slots11by means of a thermal or mechanical method. In addition to a high-frequency connector2having a contact region711and712on the outer conductor side and on the inner conductor side for simultaneous end-face contact-making on the outer conductor side and on the inner conductor side, a high-frequency connector2which has in each case one contact-making region for end-face contact-making only on the outer conductor side or only on the inner conductor side can also be produced by means of the fourth variant of the production method. This has already been explained above in the case of the high-frequency mating connectors2′, which are connectable with the high-frequency connectors2produced in accordance with all of the previously mentioned variants or subvariants of the production method (see in this regard:FIGS.4B,4E,4F,4G;5B,5E,5F,5G;6B,6E,6F,6G;7B,7E,7F,7G;8B,8E,8F,8G;9B,9E,9F,9G). In addition to these previously mentioned embodiments based on the application of the additive manufacturing method for electrical contact-making and guidance of two high-frequency connectors which can be connected to one another, the additive manufacturing methods provide the further considerable advantage of implementing a high-frequency connector having a controlled impedance along its entire longitudinal extent. In particular the more complex geometric forms in the region of the extensions of the basic body part1can result in a deviation from a matched impedance. In order to compensate for this deviation from the impedance, other dielectric materials can be used in these critical regions of the basic body part1by means of the additive manufacturing method. The relative permittivity of these dielectric materials is changed in a suitable manner with respect to the relative permittivity of the dielectric material used in the rest of the impedance-matched regions of the basic body part1. A changed absolute permittivity in these critical regions and therefore impedance matching over the entire longitudinal extent of the high-frequency connector2can also be achieved by means of suitable arrangement and suitable form of cavities in the dielectric basic body1. A further technical function in addition to electrical contact-making and guidance which is quite essential in the case of high-frequency connectors consists in lock technology. For lock technology between two connectable high-frequency connectors which is realized by means of a screw connection, an external thread profile is formed on the outer lateral surface of the basic body part1by means of an additive manufacturing method. The coated external thread profile of the high-frequency connector2is screwed to an appropriately fitting internal thread profile of a union nut, which is mounted rotatably on a high-frequency mating connector2′. The union nut with its internal thread profile can be produced using conventional manufacturing technology or else using additive manufacturing technology with subsequent metallic coating. For a lock technology which is realized by means of a snap-action connection, one or more groove-shaped depressions are formed in the outer lateral surface of the basic body part1of the high-frequency connector2, said depressions realizing a latching connection with associated latching tabs or latching hooks of the high-frequency mating connector2′. In addition to these embodiments of a lock technology, other lock technologies, such as, for example, a bayonet-type connection can also be realized by means of additive manufacturing technology. Finally, a magnetic connection between the high-frequency connectors with which contact is to be made is also possible by virtue of at least one magnet with a corresponding polarity being inserted in the basic body part1in the region of the first end61. The above-mentioned construction principles on the basis of the additive manufacturing method for electrical contact-making and guidance of a high-frequency connector2are similarly applicable to the electrical contact-making and guidance of a further high-frequency mating connector, a high-frequency cable or a high-frequency signal line structure on a printed circuit board, which is connected to the high-frequency connector2at the second end62of the basic body part1. Although the present invention has been described above completely with reference to preferred exemplary embodiments, it is not restricted to these exemplary embodiments, but can be modified in a variety of ways. LIST OF REFERENCE SYMBOLS 1,1′ basic body part2,2′ high-frequency connector, high-frequency mating connector3longitudinal axis4,4′,41,42through-hole5,51,52,521,522coating, coating on the outer conductor side and on the inner conductor side61,61′,62first end and second end711,721contact-making region on the outer conductor side of the high-frequency connector712,722contact-making region on the inner conductor side of the high-frequency connector711′,712′ contact-making region on the outer conductor side and on the inner conductor side of the high-frequency mating connector8connecting region9socket-shaped extension of the basic body part10,10′ end face11slot12transition region13radially outwardly running contact ridge14cavity15,15′,15″,15″″ pin-shaped extension of the basic body part161,162,163,164lamella-shaped region161′,162′,163′,164′ lamella-shaped region171,172,173,174axial through-hole18,18′ contact ridge19through-bore20projection211,212,213,214rib-shaped region221,222,223,224axial through-hole23contact ridge24through-bore251,252,253,254region in the form of a spring arm26axial through-hole27contact ridge28sleeve-shaped extension of the basic body part29slot30outwardly running contact ridge31step32sleeve-shaped, ring-shaped or hemispherical extension of the basic body part33cavity341,342region with coating removed at the first and second ends | 44,477 |
11942745 | DESCRIPTION FIG.1shows a crimping machine1, the basic design of which is disclosed in aforementioned, post-published DE 10 2017 118 968, so that for details it is referred to the relevant explanations in there. Such a crimping machine1has at least one centering and guiding device2, via which the cable ends to be processed can be fed. The contact elements to be crimped with the cable ends, preferably ferrules, are accommodated in a storage arrangement4, which is arranged, for example, on a plate-shaped rest surface, hereinafter referred to as cover surface6, of a housing of the crimping machine1. The actual crimp head3is provided in this housing and is used to crimp the cable end to the ferrule. According to the disclosure, the storage arrangement4is designed with several, or example with five or more, feeding bowls8. In the example shown inFIG.1, the storage arrangement4is designed with five feeding bowls8arranged on a horizontal plane (in this example the rest surface/cover surface6of the housing), in which different types of ferrules are accommodated. The feeding bowls8ato8eare designed as vibration feeding bowls in the embodiment shown, to which a common vibration drive10is assigned according to the invention. This is only exemplarily arranged inFIG.1—the position is chosen in such a way that an optimal operational connection with the feeding bowls8is achieved. In the embodiment shown, the feeding bowls8are arranged on a common pitch circle. Alternatively, the feeding bowls8can also be positioned on one axis next to each other or according to a geometric pattern (seeFIG.7). However, the positioning is carried out in such a way that the outputs of the respective feeding bowls, hereinafter referred to as feeding devices, end in a common conveyor section/conveyor system, hereinafter referred to as feed20, or are in operational connection with it, so that these fed, separated ferrules can be guided to the crimp head3. The feeding bowls8can also be arranged in several offset planes, so that for example three feeding bowls8are arranged in a first plane and two feeding bowls8in a second plane, each of which is assigned a vibration drive or a common vibration drive. FIG.2shows a variant of the crimping machine1according to the disclosure, in which the feeding bowls8ato8eare not arranged in a horizontal plane but as a stack12, which in turn is arranged on the cover surface6of the crimping machine1. This stack12also has a common vibration drive10assigned to it, which is preferably arranged in the axis of the stack12. For easier access to the feeding bowls8bto8ewithin the stack, they can be mounted on a central holder14at a distance from each other or vertically adjustable as shown inFIG.3. The holder14is in turn supported by the cover surface6, which can be designed as a comparatively solid base plate for all examples. In the example shown inFIG.3, the feeding bowls8b,8cshown as an example can be swung out of the central stack position via a pivot device16, thus simplifying loading. It is preferred if individual feeding bowls8ato8ecan be swung out. However, basically it may also be sufficient to swing out the entire stack12and then load the feeding bowls8. FIG.4shows a concrete design of the example as shown inFIG.1. In this variant, four feeding bowls8ato8dare mounted on the plate-shaped cover surface6and can be vibrated via a common vibration drive10. The separated ferrules are then led from a feeding bowl outlet to a common separation device18and then conveyed to the crimp head3via a feed20indicated in a dashed line. This feed20is shown schematically while conveying to the right (viewFIG.4). The feed direction depends on the type of crimping machine1. For example, it can be advantageous if the feed20conveys from the level of the separation devices18downwards. The feed20is then common to all feeding bowls8. Details of a feed20are described in the patent application DE 10 2017 102 618 published after the priority date of this application—regarding further details, it is referred to this application of the Applicant. FIG.5shows a schematic stack arrangement in which five feeding bowls8ato8eare coaxially arranged directly above each other in the stack12. The separation devices18ato18e, of which only some details are shown, are also arranged in the variant according toFIG.5in the axial direction of the stack12, wherein they preferably end in the common feed (not shown). FIG.6shows a variant of the stack12in which the separation devices18ato18eare arranged offset to each other in the circumferential direction, so that they lie on a spiral line in the representation according toFIG.6. FIGS.7and8show another example, where five feeding bowls8a,8b,8c,8dand8eare arranged in a roughly W-shaped pattern (see dashed dotted line inFIG.7). The three feeding bowls8a,8b,8care arranged side by side on a straight line22. The other two feeding bowls8d,8eare arranged on a parallel straight line24. The separation devices18a,18b,18c,18dand18eassigned to the feeding bowls8ato8eare oriented towards the common feed20, through which the respective ferrules are fed to the crimp head3. In the embodiment shown inFIGS.7and8, the feed20runs at least in the area of the separation devices18ato18dat the same parallel distance from the straight lines22and24—in other words, the feed20runs in sections approximately centrally between the two feeding bowl rows8a,8b,8c,8d,8e. In the example according toFIGS.7and8, the feeding bowls8are also designed as vibration feeding bowls, wherein for example all feeding bowls8have a common vibration drive10, or for example the feeding bowls8a,8b,8cor8d,8elying on the straight lines22,24each have a common vibration drive10(vibration conveyor). The feeding bowls8, in particular the vibration drives10, are driven by a control unit26of the crimping machine1, which transmits control signals to the vibration drives10/feeding bowls8via signal lines28or a bus system. A storage arrangement4, designed according to the disclosure, enables an extremely compact design of the crimping machine1, wherein the central control unit26enables automatic assembly of different cable and ferrule types. A crimping machine with a storage arrangement is disclosed, which has a plurality of feeding bowls for separated contact elements. LIST OF REFERENCE SIGNS 1crimping machine2feeding device3crimp head4storage arrangement6cover surface8feeding bowl10vibration drive12stack14holder16pivot device18separation device20feed22straight line24straight line26control unit28signal line | 6,579 |
11942746 | DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. It is understood that the preferred embodiments described below are not intended to limit the present invention. Members/parts that perform the same function are denoted by the same reference signs, and redundant explanations will be omitted or simplified as appropriate. First Preferred Embodiment FIG.1is a schematic front view of a terminal feeder and crimper10(hereinafter simply referred to as the feeder and crimper10) according to a preferred embodiment of the present invention. In the description below, the direction of the rotation axis of a terminal strip reel5is the front-rear direction, and the direction in which a terminal strip6is fed out, of the horizontal direction, is the rightward direction, unless specified otherwise. The designations F, Rr, L, R, U and D, as used in the figures, refer to front, rear, left, right, up and down, respectively. However, these directions are defined only for the purpose of discussion and do not in any way limit the installation of the feeder and crimper10, and do not in any way limit the scope of the present invention. As shown inFIG.1, the feeder and crimper10according to the present preferred embodiment includes a support20that supports the terminal strip reel5, an applicator30, a press40, an interleaf take-up device50, a tension detector80and a controller90(seeFIG.5). As shown inFIG.1, the terminal strip reel5is obtained by winding together the terminal strip6in the form of a strip and an interleaf7in the form of a strip on top of each other, and is configured to be in a generally circular shape as viewed in the winding axial direction (as viewed in the front-rear direction inFIG.1). The terminal strip6includes a plurality of terminals strung together in a strip form. The support20rotatably supports the terminal strip reel5. The support20includes a pillar21, a horizontal arm22, and a rotor23. The pillar21extends in the vertical direction. The horizontal arm22is connected to the pillar21and extends in the left-right direction. The rotor23is provided at the open end of the horizontal arm22(the end opposite to the end engaged to the pillar21), and is supported by the horizontal arm22so as to be rotatable in the left-right direction. A core8of the terminal strip reel5is inserted into the rotor23. Thus, the terminal strip reel5is supported by the support20so as to be rotatable in the left-right direction. Note however that the support20is not limited thereto as long as it is capable of rotatably supporting the terminal strip reel5. The applicator30is a device for crimping terminals of the terminal strip6onto wires while dispensing them from the terminal strip reel5. The applicator30includes a crimper31and a terminal strip feeder32. The crimper31is a device for crimping terminals of the terminal strip6onto wires. The crimper31may be any of various crimpers known in the art. Here, the crimper31includes a movable part (not shown) that includes a tooth mold for crimping terminals and is movable in the up-down direction. The press40presses the movable part of the crimper31downward. Thus, a terminal is crimped onto a wire. The terminal strip feeder32is configured to feed the terminal strip6dispensed from the terminal strip reel5to the crimper31. The terminal strip feeder32is provided on the support20side relative to the crimper31, i.e., leftward. As shown inFIG.1, the terminal strip feeder32includes a feed jaw32afor feeding the terminal strip6dispensed from the terminal strip reel5to the crimper31. The feed jaw32aswings in the left-right direction in conjunction with the terminal crimping operation of the crimper31caused by driving the press40. The terminal strip feeder32feeds the terminal strip6rightward by engaging the feed jaw32a, which swings in the left-right direction, with the terminal strip6. Thus, the terminal strip6dispensed from the terminal strip reel5is fed to the crimper31. The interleaf take-up device50is a device that winds up the interleaf7dispensed from the terminal strip reel5together with the terminal strip6. As shown inFIG.1, the interleaf take-up device50includes an interleaf take-up reel60for taking up the interleaf7dispensed from the terminal strip reel5, and a driver70for rotating the interleaf take-up reel60. The driver70is connected to the interleaf take-up reel60and is configured to provide a rotational torque to the interleaf take-up reel60. FIG.2is a right side view of the interleaf take-up device50.FIG.3is a front view of the interleaf take-up device50. As shown inFIGS.2and3, the interleaf take-up reel60includes a take-up disc61, a plurality of take-up shafts62and a force receiving section63. The take-up disc61is configured to be in a generally circular shape as viewed from the front or rear. The central axis of the take-up disc61extends in the front-rear direction. The central axis of the take-up disc61and the central axis of the terminal strip reel5are parallel or substantially parallel to each other. A central hole61apenetrating in the front-rear direction is formed around the central axis of the take-up disc61. The take-up shafts62are each fixed to the take-up disc61. The take-up shafts62extend forward from the front surface of the take-up disc61. The number of take-up shafts62is herein four. The four take-up shafts62are disposed 90 degrees apart from each other on a single circumference around the central axis of the take-up disc61. The force receiving section63is provided at the central portion of the take-up disc61in the radial direction. The force receiving section63is formed in a generally cylindrical shape. As shown inFIG.2, the force receiving section63includes a central hole63apenetrating in the front-rear direction. The force receiving section63is fixed to the take-up disc61so that the central axis of the central hole63acoincides with the central axis of the take-up disc61. Here, the force receiving section63is fixed to the front surface of the take-up disc61and extends forward from the take-up disc61. As shown inFIG.2, a generally cylindrical collar64is inserted into the central hole63aof the force receiving section63. The collar64has a central hole64athat penetrates in the front-rear direction. The central axis of the central hole64acoincides with the central axis of the take-up disc61and the central axis of the force receiving section63. Here, the collar64is fixed non-rotatably to the central hole63aof the force receiving section63. The collar64may be fixed to the central hole63aby being driven into the central hole63a, for example, or it may be fixed by other means, e.g., a set screw. In the present preferred embodiment, the collar64is made of a resin. As shown inFIG.2, the force receiving section63includes a flange-shaped force receiving plate63b. The force receiving plate63bextends outward in the radial direction of the force receiving section63relative to other portions of the force receiving section63. A plurality of engagement holes63care formed in the force receiving plate63b. Here, the engagement holes63cpenetrate through the force receiving plate63bin the front-rear direction. Note however that the engagement holes63cdo not have to be through holes but may be non-penetrating depressions. The number of engagement holes63cmay be one. Here, a plurality of engagement holes63care arranged at an equal angle apart from each other on a single circumference around the central axis of the force receiving section63. As shown inFIG.2, the driver70includes a drive motor71, a first pulley72, a belt73, a rotation shaft74and a second pulley75. Herein, the drive motor71is a DC motor that does not have the function of changing the rotational torque. Note however that the type of the drive motor71is not limited thereto. The drive motor71includes a drive shaft71athat rotates. The drive shaft71aextends in the front-rear direction and rotates in the left-right direction. The first pulley72is connected to the drive shaft71aand rotates together with the drive shaft71a. The belt73is an endless belt and is wound between the first pulley72and the second pulley75. In the present preferred embodiment, the belt73is a round belt whose cross-sectional shape is generally circular. Note however that the type of the belt73is not limited thereto. For example, the belt73may be a flat belt whose cross-sectional shape is generally rectangular. The rotation shaft74is configured in a generally cylindrical shape, and the axis thereof extends in the front-rear direction. The second pulley75is connected to the rotation shaft74. The rotation shaft74receives power from the drive motor71via the first pulley72, the belt73and the second pulley75to rotate about the axis. As shown inFIG.2, the rotation shaft74includes a main shaft74a, a bracket74band a plunger74c. The second pulley75is connected in the vicinity of the rear end of the main shaft74a. A portion of the section of the main shaft74athat is forward relative to the second pulley75is inserted into the central hole61aof the take-up disc61and the central hole64aof the collar64. The main shaft74ais in contact with the central hole64aof the collar64. The central hole61aof the take-up disc61is formed larger than the main shaft74aas viewed in the front-rear direction, and is not in contact with the main shaft74a. As shown inFIG.2, the front end of the main shaft74ais located forward relative to the force receiving section63. A bracket74bis provided at the front end of the main shaft74a. The bracket74bis formed in a flat plate shape. The bracket74bextends generally perpendicular to the axis of the main shaft74aand rotates together with the main shaft74a. A portion of the bracket74bextends outward in the radial direction of the main shaft74arelative to the main shaft74a. The bracket74band the force receiving plate63bof the force receiving section63are provided generally parallel to each other. The plunger74cis attached to the bracket74b. The plunger74cis a rod-shaped member and extends generally perpendicular to the bracket74b, in other words, generally parallel to the axis of the main shaft74a. As shown inFIG.2, the plunger74cincludes a tubular case74c1, a movable shaft74c2partially housed in the case74c1, and a spring (not shown) housed in the case74c1. The case74c1is attached to the bracket74b. The movable shaft74c2is movable in the front-rear direction along the inner periphery of the case74c1. The movable shaft74c2is biased by a spring toward the force receiving plate63b(herein, backward). By grasping a grip74c3at the front end of the movable shaft74c2, the user can move the movable shaft74c2toward the opposite side of the force receiving plate63b(herein, forward) against the biasing force of the spring. The movable shaft74c2is rotatable in the left-right direction relative to the case74c1. The movable shaft74c2is configured to engage with the case74c1when it is positioned at a predetermined rotation position while being pulled forward. By such an engagement, the position of the movable shaft74c2in the front-rear direction is fixed against the biasing force of the spring. Thus, the movable shaft74c2is configured so that it can be positioned in a first position P1(seeFIG.2) where it is engaged with the case74c1, and a second position P2(seeFIG.4) that is closer to the interleaf take-up reel60than the first position P1. The plunger74cis arranged so as to overlap with the circumference where the engagement holes63care arranged as viewed in the front-rear direction.FIG.4is a right side view of the interleaf take-up device50with the movable shaft74c2of the plunger74cinserted into the engagement hole63c. As shown inFIG.4, the movable shaft74c2is inserted into the engagement hole63cwhen it is positioned in the second position P2. As shown inFIG.2, the movable shaft74c2is detached from the engagement hole63cwhen it is positioned in the first position P1. When engaging the plunger74cwith the engagement hole63c, the user, for example, releases the engagement of the movable shaft74c2with the case74c1and then rotates the interleaf take-up reel60. Thus, the movable shaft74c2is inserted into an adjacent engagement hole63cin the rotation direction. When releasing the engagement between the plunger74cand the engagement hole63c, the user positions the movable shaft74c2in the first position P1and engages it with the case74c1. As the movable shaft74c2of the plunger74cis inserted into the engagement hole63c, the rotation shaft74and the interleaf take-up reel60are engaged. Thus, it is possible to transmit substantially all of the rotational force of the rotation shaft74to the interleaf take-up reel60. The plunger74cdefines the first connecting portion C1of the rotation shaft74, which can be selected to be engaged with or disengaged from the interleaf take-up reel60. A portion of the rotational force of the rotation shaft74is transmitted to the interleaf take-up reel60also by the frictional force between the main shaft74aand the collar64. The contact portion of the main shaft74awith the collar64defines the second connecting portion C2of the rotation shaft74, which transmits the rotational torque of the rotation shaft74to the interleaf take-up reel60. When the rotational load on the interleaf take-up reel60is less than a predetermined load (hereinafter referred to as the first load), the second connecting portion C2is secured by a frictional force to the interleaf take-up reel60(more specifically, the collar64). In other words, there is no slippage between the second connecting portion C2and the interleaf take-up reel60. As a result, the interleaf take-up reel60rotates together with the rotation shaft74. When the rotational load on the interleaf take-up reel60is equal to or greater than the first load, the second connecting portion C2slips against the collar64. Therefore, when the rotational load on the interleaf take-up reel60is equal to or greater than the first load and the first connecting portion C1and the interleaf take-up reel60are not engaged with each other, the interleaf take-up reel60does not rotate together with the rotation shaft74. As shown inFIG.1, a tension detector80is provided in the path of the terminal strip6between the terminal strip reel5and the terminal strip feeder32. The tension detector80is configured to detect the force applied to the terminal strip6by the terminal strip feeder32when feeding the terminal strip6. Here, the tension detector80detects whether the tension of the terminal strip6dispensed from the terminal strip reel5exceeds a predetermined tension. When the amount by which the terminal strip reel5has been rotated by the interleaf take-up device50(the length by which the terminal strip6has been dispensed) is greater than the amount by which the terminal strip6has been fed by the terminal strip feeder32, the terminal strip6slacks. In the opposite case, the terminal strip6is tensioned. Thus, the tension of the terminal strip6fluctuates. As shown inFIG.1, the tension detector80includes a guide member81for guiding the terminal strip6therealong. The guide member81is movable in the left-right direction. The guide member81is biased leftward by a spring (not shown). When the terminal strip6is tensioned, the guide member81moves rightward against the biasing force of the spring by being pulled by the terminal strip6. The tension detector80includes an optical sensor82for detecting the guide member81. When the terminal strip6is tensioned with a tension that exceeds a predetermined tension, thus moving the guide member81rightward by more than a distance corresponding to the predetermined tension, the optical sensor82detects the guide member81. Thus, it is possible to detect the tension of the terminal strip6exceeding the predetermined tension. The tension detector80is configured to send a signal when the optical sensor82detects the guide member81. The feeder and crimper10includes the controller90that controls the operation of the press40and the interleaf take-up device50and also receives a signal from the tension detector80.FIG.5is a block diagram of the feeder and crimper10. As shown inFIG.5, the controller90is connected to the press40, the drive motor71of the interleaf take-up device50and the tension detector80. The crimper31and the terminal strip feeder32operate in conjunction with the operation of the press40. There is no particular limitation on the configuration of the controller90. For example, the controller90may include a central processing unit (CPU), a ROM storing a program or the like to be executed by the CPU, a RAM, etc. Each section of the controller90may be implemented by software or may be implemented by hardware. Each section may be a processor or may be a circuit. As shown inFIG.5, the controller90is configured or programmed to include an operation control section91, a warning section92, an operation screen93and a warning device94. The operation control section91controls the operation of the press40and the interleaf take-up device50so as to feed and crimp terminals. Details of the operation of the feeder and crimper10will be described later. The warning section92is connected to the tension detector80and is set to issue a warning signal when the force detected by the tension detector80exceeds a predetermined force over a predetermined amount of time. Specifically, the warning section92issues a warning signal when a signal from the tension detector80has been received continuously over an amount of time that exceeds the predetermined amount of time. The warning section92may issue warning signals in other cases, but this will not be described herein. Upon receiving a warning signal issued by the warning section92, the warning device94issues a warning to the user. The warning device94includes a buzzer and/or a warning indicator light, for example. Note however that there is no particular limitation on the configuration of the warning device94. The warning may include stopping the operation of the feeder and crimper10. The operation screen93is an example of an interface used to perform operations such as the operation of starting and pausing the feeding of the terminal strip6and the operation of independently driving the interleaf take-up device50, for example. Note however that the interface used to perform various operations of the feeder and crimper10is not limited to the operation screen displayed on the display. Part or whole of the interface used to perform various operations of the feeder and crimper10may include mechanical buttons and switches, for example. Note that the controller90may include other processing sections for other functions, but they will not be described or illustrated herein. The operation of the feeder and crimper10for feeding the terminal strip6from the terminal strip reel5and crimping the terminal strip6will now be described. For feeding the terminal strip6from the terminal strip reel5, the user first sets the terminal strip reel5on the support20. Then, the user dispenses the terminal strip6and interleaf7from the terminal strip reel5. The dispensed terminal strip6is set in the applicator30via the tension detector80. The dispensed interleaf7is set on the interleaf take-up reel60. More specifically, the interleaf7is set on one of the take-up shafts62so as to be wound on the take-up shafts62. As shown inFIG.2, when the interleaf7(seeFIG.1) is set on the interleaf take-up reel60, the plunger74cpreferably is not engaged with the interleaf take-up reel60. In such a state, the user can freely rotate the interleaf take-up reel60. In such a state, the user can easily rotate the interleaf take-up reel60because the driver70and the interleaf take-up reel60are connected to each other only by the frictional force between the second connecting portion C2and the collar64. In other words, in such a state, the second connecting portion C2of the driver70is applying, to the interleaf take-up reel60, only such a braking force that allows the user to manually rotate the interleaf take-up reel60against the force. Therefore, the user can freely manually rotate the interleaf take-up reel60. The braking force that can allow the interleaf take-up reel60to be manually rotated is about 0.1 N or less, for example. By being able to freely manually rotate the interleaf take-up reel60, the user can easily set the interleaf7on the interleaf take-up reel60. After the interleaf7is set, the user can manually rotate the interleaf take-up reel60to take up the slack interleaf7. The user then engages the plunger74cwith the interleaf take-up reel60. Thus, it is possible to transmit almost all of the rotational torque of the rotation shaft74to the interleaf take-up reel60. The braking force applied from the driver70to the interleaf take-up reel60in this state may be a braking force such that the user cannot manually rotate the interleaf take-up reel60. Note however that it may be possible, even in such a state, to manually rotate the interleaf take-up reel60. Thus, the driver70is capable of changing the braking force on the interleaf take-up reel60when it is stopped, depending on whether the plunger74cis engaged with the interleaf take-up reel60. Thereafter, the user uses the operation screen93to start the feeding/crimping operation of the terminal strip6. In the feeding/crimping operation of the terminal strip6, the terminal strip6is fed to the crimper31by the terminal strip feeder32. Terminals of the terminal strip6fed to the crimper31are crimped onto wires. When the terminal strip6is fed and tensioned, and the tension of the terminal strip6becomes equal to or greater than a predetermined tension, the tension detector80outputs a signal. The controller90receives a signal issued by the tension detector80in response to the tension of the terminal strip6being equal to or greater than the predetermined tension. Upon receiving the signal from the tension detector80, the operation control section91of the controller90drives the drive motor71. This causes the interleaf take-up reel60to rotate together with the rotation shaft74. The interleaf7is pulled out from the terminal strip reel5by being taken up onto the interleaf take-up reel60. This rotates the terminal strip reel5and supports the dispensing of the terminal strip6from the terminal strip reel5. As described above, without support for the rotation of the terminal strip reel5by the interleaf take-up device50, all of the force for dispensing the terminal strip6is applied to the terminal strip6engaged with the feed jaw32aof the terminal strip feeder32. The greater the force applied to the terminal strip6, the greater the risk of damaging the terminal strip6, and it is therefore preferred to support the rotation of the terminal strip reel5by the interleaf take-up device50. With the feeder and crimper10according to the present preferred embodiment, it is possible to support the rotation of the terminal strip reel5via the interleaf take-up device50to reduce the force applied to the terminal strip6. When the length by which the terminal strip6has been dispensed by the terminal strip feeder32is larger than the length by which the interleaf7has been taken up by the interleaf take-up device50, a portion of the interleaf7is left slack without being taken up onto the interleaf take-up reel60. Such slack in the interleaf7is preferably removed by taking up the interleaf7by the interleaf take-up reel60. In such a case, the user may temporarily stop the feeding/crimping operation of the terminal strip6. Thereafter, the user may disengage the plunger74cfrom the interleaf take-up reel60. The user may further use the operation screen93to take up the interleaf7, i.e., perform the operation of independently driving the interleaf take-up device50. In the present preferred embodiment, when the operation of taking up the interleaf7is executed with the plunger74cdisengaged from the interleaf take-up reel60, the drive motor71is driven and the rotation shaft74rotates. While there is slack in the interleaf7, the interleaf take-up reel60rotates together with the rotation shaft74. This causes the interleaf7to be taken up onto the interleaf take-up reel60. When there is no more slack in the interleaf7as the interleaf7is taken up onto the interleaf take-up reel60, the rotational load on the terminal strip reel5acts upon the interleaf7and the second connecting portion C2and the collar64stars slipping against each other. Thus, it is possible to take up the interleaf7without unnecessary rotation of the terminal strip reel5. As described above, the driver70is configured to change the rotational torque applied to the interleaf take-up reel60depending on whether the plunger74cis engaged with the interleaf take-up reel60. Specifically, the driver70is configured so as to apply, to the interleaf take-up reel60, a first torque that is sufficient to rotate the terminal strip reel5about the support20, and a second torque that is smaller than the first torque and is insufficient to rotate the terminal strip reel5about the support20. The first torque is a torque that is obtained when the first connecting portion C1is engaged with the interleaf take-up reel60, and is equal or substantially equal to the rotational torque that the rotation shaft74is capable of producing. The second torque is a torque that is obtained when the first connecting portion C1is disengaged from the interleaf take-up reel60, and is equal or substantially equal to the rotational torque that can be transmitted by friction between the second connecting portion C2and the interleaf take-up reel60. Note that the operation of taking up the slack interleaf7as described above may be performed by the user by manually rotating the interleaf take-up reel60. The operation of taking up the interleaf7before starting the feeding/crimping operation of the terminal strip6may be performed by driving the drive motor71with the first connecting portion C1disengaged from the interleaf take-up reel60. When all the terminals of the terminal strip6have been crimped, the interleaf7is preferably rewound onto the core8of the terminal strip reel5for disposal of the interleaf7. In this operation, the user first disengages the first connecting portion C1from the interleaf rewind reel60. Then, the user rotates the terminal strip reel5counterclockwise as viewed from the front. In this process, the interleaf take-up reel60in such a state it can be freely manually rotated, and the interleaf7is taken up onto the core8of the terminal strip reel5. The abnormality process to be performed when an abnormality occurs in the feeder and crimper10according to the present preferred embodiment will now be described. A first abnormality is when the plunger74cfails to be engaged with the interleaf take-up reel60before the start of the feeding/crimping operation of the terminal strip6. Such a situation can occur, for example, when the user forgets to engage the plunger74cwith the interleaf take-up reel60. In this case, the interleaf take-up device50hardly contributes to the rotation of the terminal strip reel5. Therefore, a larger load than normal is applied to the terminal strip6by the terminal strip feeder32. As described above, the feeder and crimper10is configured to issue a warning when a signal from the tension detector80has been received continuously over an amount of time that exceeds a predetermined amount of time. When the feeding/crimping operation of the terminal strip6is started without the plunger74cengaged with the interleaf take-up reel60, the terminal strip6will always be in a tensioned state. As a result, the tension detector80is constantly transmitting the signal. During normal operation, the terminal strip6alternates between being tensioned and being slightly slack due to the pull from the terminal strip feeder32and the push from the interleaf take-up device50. Therefore, based on whether the amount of time over which the signal from the tension detector80has been received continuously exceeds a predetermined amount of time, it is possible to detect an abnormality. Upon detecting an abnormality as described above, the feeder and crimper10, for example, sounds a buzzer, lights an indicator light, or stops the feeding/crimping operation of the terminal strip6. Note however that there is no particular limitation on the type of warning operation. A second abnormality is when an abnormal force is being required to rotate the interleaf take-up reel60. Such a situation can occur, for example, when something becomes entangled in the interleaf take-up reel60, the support20or the terminal strip reel5. When such an abnormality occurs and if no abnormality measure is taken, the rotational torque of the rotation shaft74will continue to be applied to the interleaf take-up reel60, which is stuck and not rotatable, thus possibly damaging the first connecting portion C1and the engagement hole63c. It may also overload the drive motor71. In order to address such an abnormality, the feeder and crimper10according to the present preferred embodiment is configured so that the belt73slips against the first pulley72and the second pulley75when the rotational load on the interleaf take-up reel60is equal to or greater than a predetermined load (hereinafter referred to as the second load). The second load is larger than the first load at which the second connecting portion C2begins to slip against the collar64, and is set to a load that will not damage the first connecting portion C1and the engagement hole63ceven when applied continuously over time. Specifically, a round belt is used as the belt73, thus reducing the frictional force generated between the belt73and the first pulley72and the second pulley75. Thus, the belt73more easily slips against the first pulley72and the second pulley75. When the rotational load on the interleaf take-up reel60is equal to or greater than the second load, the belt73slides against the first pulley72and the second pulley75, thus preventing an excessive force from being applied to the first connecting portion C1and the engagement hole63c. Also, the drive shaft71aof the drive motor71rotates. Thus, it is possible to reduce the risk of damaging the first connecting portion C1or other portions and the risk of overloading the drive motor71. Note that when the rotational load on the interleaf take-up reel60is equal to or greater than the second load, the belt73does not need to slide against both the first pulley72and the second pulley75, but may slide only against one of them. When the rotational load on the interleaf take-up reel60is equal to or greater than the second load, the belt73only needs to slip against at least one of the first pulley72and the second pulley75. Variations of First Preferred Embodiment The feeder and crimper10according to the first preferred embodiment can also be implemented by some variations. Note that in the following description of variations, members that perform the same function as those of the first preferred embodiment will be denoted by the same reference signs. The same applies also to the second and subsequent preferred embodiments and variations thereof. For example, in one preferred variation, a movable shaft that is inserted into and detached from the engagement hole63cmay be moved by an actuator. For example, the actuator may be an air cylinder, and the movable shaft may be a telescoping shaft of the air cylinder. The feeder and crimper10may further include a solenoid valve that controls the supply of compressed air into the air cylinder, for example. The solenoid valve may be connected to the controller90and automatically controlled. Note however that there is no particular limitation on the actuator and the method for controlling the actuator. According to a configuration in which the insertion and the detachment of the movable shaft into and from the engagement hole63ccan be automatically controlled, there is no need for the process of inserting the movable shaft into the engagement hole63c, thus eliminating the possibility of forgetting to perform the process and the possibility of making errors in the process. With such a configuration, the controller90may be set to control the driver70to rotate the rotation shaft74with the movable shaft disengaged from the interleaf take-up reel60(in other words, to apply the second torque to the interleaf take-up reel60) in response to an operation to start the feeding of the terminal strip6. Thus, if there is slack in the interleaf7before the operation to start the feeding of the terminal strip6, the feeding of the terminal strip6can be started after automatically removing the slack in the interleaf7. Since the rotational torque of the interleaf take-up reel60is the second torque, the terminal strip reel5is not rotated unnecessarily by taking up the slack in the interleaf7. Note that by further providing a sensor for detecting slack in the interleaf7, the feeder and crimper10can also automatically remove slack in the interleaf7if slack occurs in the interleaf7before or during the operation of feeding the terminal strip6. In still another variation, the feeder and crimper10may include a sensor that detects the insertion and the detachment of the movable shaft into and from the engagement hole63c. The insertion and the detachment of the movable shaft into and from the engagement hole63cmay be performed by the user. Such a sensor can also reduce the possibility that the user may forget to perform, or make errors in, the process of inserting the movable shaft into the engagement hole63cor the process of detaching the movable shaft from the engagement hole63c. The controller90may be set to prohibit subsequent processes if the process of inserting the movable shaft into the engagement hole63cor the process of detaching the movable shaft from the engagement hole63cis not performed properly. The method of connecting together the first connecting portion and the interleaf take-up reel is not limited to the method of inserting and detaching the movable shaft into and from the engagement hole. There is no limitation on the first connecting portion as long as it can be selectively engaged with or disengaged from the interleaf take-up reel. For example, the first connecting portion and the corresponding portion of the interleaf take-up reel may have gear-shaped or cam-shaped engagement portions. The movable direction of the first connecting portion (e.g., the movable direction of the movable shaft) is not limited to the axial direction of the rotation shaft, but may be the radial direction of the rotation shaft, for example. The same applies also to the contact surface between the second connecting portion and the interleaf take-up device, there is no limitation on the direction in which the contact surface faces. For example, the contact surface between the second connecting portion and the interleaf take-up device may face a direction that is parallel or substantially parallel to the axis of the rotation shaft and the central axis of the interleaf take-up reel. Second Preferred Embodiment In the second preferred embodiment, the rotational torque and the braking force to be applied to the interleaf take-up reel60are changed in a manner different from the first preferred embodiment and variations thereof.FIG.6is a rear view of the interleaf take-up device50according to the second preferred embodiment. Although not shown inFIG.6, in the present preferred embodiment, the driver70includes a connecting portion that connects together the rotation shaft74and the interleaf take-up reel60. This connecting portion firmly connects together the rotation shaft74and the interleaf take-up reel60at all times, and the interleaf take-up reel60rotates together with the rotation shaft74. There is no limitation on the configuration of the connecting portion. As shown inFIG.6, the driver70according to the present preferred embodiment includes a tension roller76, in addition to the drive motor71, the first pulley72, the belt73, the rotation shaft74and the second pulley75. Note that the drive motor71herein may be a DC motor that does not have the function of changing the rotational torque. As shown inFIG.6, the configurations of the drive motor71, the first pulley72, the belt73, the rotation shaft74and the second pulley75in the present preferred embodiment are the same as the first preferred embodiment. The tension roller76is herein provided inward relative to the inner circumferential surface of the endless belt73. The driver70includes a roller mover77that is capable of positioning the tension roller76at a first adjustment position Pa1(shown in a solid line) at which the tension roller76contacts the inner circumferential surface of the belt73and at a second adjustment position Pa2(shown in a two-dot chain line), which is inward relative to the first adjustment position Pa1. Note however that the tension roller76may be provided outward relative to the outer circumferential surface of the endless belt73. In such a case, the roller mover77may be capable of positioning the tension roller76at an alternative first adjustment position at which the tension roller76contacts the outer circumferential surface of the belt73and at an alternative second adjustment position that is outward relative to this alternative first adjustment position. The first adjustment position Pa1is a position of the tension roller76such as to push the endless belt73from inside to outside. The second adjustment position Pa2is a position of the tension roller76that is inward relative to the first adjustment position Pa1, and while at the second adjustment position Pa2, the tension roller76may or may not be in contact with the inner circumferential surface of the belt73. In either case, the tension of the belt73when the tension roller76is positioned at the second adjustment position Pa2is smaller than the tension of the belt73when the tension roller76is positioned at the first adjustment position Pa1. The tension roller76and the roller mover77are an example of a tension adjuster capable of adjusting the tension of the belt73. The roller mover77supports the tension roller76and moves in the radial direction of the belt73. The roller mover77may be configured as shown inFIG.6, for example, including an elongate hole77aand a bolt and nut77bso that the tension roller76can be fixed at the first adjustment position Pa1or the second adjustment position Pa2. The roller mover77may include an actuator for moving the tension roller76. If the roller mover77includes an actuator, the actuator may be controlled by the controller90. There is no particular limitation on the configuration of the roller mover77. In the present preferred embodiment, the rotational torque and the braking force to be applied to the interleaf take-up reel60are changed by changing the tension of the belt73. The frictional force between the belt73and the first pulley72and the second pulley75increases as the tension of the belt73increases, and decreases as the tension of the belt73decreases. When the rotational load on the interleaf take-up reel60exceeds the static frictional force between the belt73and the first pulley72and the second pulley75, the belt73slips against the first pulley72and the second pulley75. This static frictional force between the belt73and the first pulley72and the second pulley75can be changed based on the position of the tension roller76. Therefore, with the tension roller76and the roller mover77, it is possible to change the rotational torque and the braking force to be applied by the driver70to the interleaf take-up reel60. The rotational torque to be applied to the interleaf take-up reel60when the tension roller76is positioned at the first adjustment position Pa1is preferably a torque that is sufficient to rotate the terminal strip reel5about the support20. The rotational torque to be applied to the interleaf take-up reel60when the tension roller76is positioned at the second adjustment position Pa2is preferably a torque that is insufficient to rotate the terminal strip reel5about the support20. The braking force to be applied to the interleaf take-up reel60when the tension roller76is positioned at the second adjustment position Pa2may be a braking force such that the interleaf take-up reel60can be manually rotated against the force. Variations of Second Preferred Embodiment In a preferred variation of the second preferred embodiment, a tension adjuster for changing the tension of the belt73may include a distance adjuster78that supports the drive motor71so that the drive motor71is movable relative to the rotation shaft74.FIG.7is a rear view of the interleaf take-up device50according to a variation of the second preferred embodiment. As shown inFIG.7, the distance adjuster78moves the drive motor71relative to the rotation shaft74to change the distance between the drive motor71and the rotation shaft74. Thus, the tension of the belt73is changed. Specifically, increasing the distance between the drive motor71and the rotation shaft74increases the tension of the belt73. When the distance between the drive motor71and the rotation shaft74is shortened, the tension of the belt73decreases. The distance adjuster78may include an elongate hole78aand a bolt and nut78bas shown inFIG.7, for example, so that the drive motor71can be fixed at two or more positions at different distances from the rotation shaft74. The distance adjuster78may include an actuator for moving the drive motor71. If the distance adjuster78includes an actuator, the actuator may be controlled by the controller90. Note however that there is no particular limitation on the configuration of the distance adjuster78. Other Preferred Embodiments Some preferred embodiments of the present invention have been described above. However, these preferred embodiments are merely illustrative, and various other preferred embodiments are possible. For example, in the preferred embodiments described above, the rotational torque and the braking force to be applied to the interleaf take-up reel60is changed based on whether the connection between the rotation shaft74and the interleaf take-up reel60or between the rotation shaft74and the drive shaft71aof the drive motor71is a strong connection or a weak connection. However, the method of changing the rotational torque and the braking force at the time of stopping that are to be applied by the driver to the interleaf take-up reel is not limited to this. For example, the driver may include a drive motor whose rotational torque can be controlled. The number of different rotational torques to be applied by the driver to the interleaf take-up reel is not limited to two. For example, the driver may be capable of applying, to the interleaf take-up reel, three or more different rotational torques, including a first torque that is sufficient to rotate the terminal strip reel about the support and a second torque that is smaller than the first torque and is insufficient to rotate the terminal strip reel about the support. The method of switching the connection between the drive motor and the interleaf take-up reel between a strong connection and a weak connection is also not limited to that described above. For example, the rotation of the drive shaft of the drive motor may be transmitted to the rotation shaft without a mechanism such as a belt therebetween. Alternatively, the rotation of the drive shaft of the drive motor may be transmitted to the rotation shaft via a non-contact power transmission device such as magnetic gears, for example. For example, in the case of magnetic gears, the transmission of the driving force between gears is done via the magnetic force imparted to the gears, and the torque that can be transmitted is changed by changing the distance between the gears. Otherwise, there is no particular limitation on the method of changing the connection strength between the drive motor and the interleaf take-up reel. The transmission torque can be changed while maintaining a strong connection between the driver and the interleaf take-up reel at all times. For example, the rotation of the drive shaft of the drive motor may be transmitted to the rotation shaft via a combination gear whose gear ratio can be changed. Also with such a configuration, it is possible to change the rotational torque and the braking force to be applied by the driver to the interleaf take-up reel. Note that the connection between the driver and the interleaf take-up reel may be disconnected. In such a case, the rotational torque and the braking force to be applied by the driver to the interleaf take-up reel will be zero. There is no limitation on elements such as the support for rotatably supporting the terminal strip reel, the crimper for crimping terminals onto wires, and the terminal strip feeder for feeding the terminal strip to the crimper. Various devices known in the art can be suitably used for these devices. There is no limitation on the configuration of the tension detector, as long as the tension detector can detect the force applied to the terminal strip by the terminal strip feeder when feeding the terminal strip. Detecting the force applied by the terminal strip feeder to the terminal strip includes detecting whether the force applied by the terminal strip feeder to the terminal strip exceeds a predetermined force, as well as measuring the force applied by the terminal strip feeder to the terminal strip. Furthermore, there is no limitation on the configuration of the interleaf take-up device, e.g., the shape, arrangement, etc., of the parts of the interleaf take-up reel, as long as the function is realized. The configuration and the control sequence of the controller90of the feeder and crimper10described above are merely preferred examples, and there is no limitation thereto. The preferred embodiments do not limit the present invention, except where specifically mentioned. The terms and expressions used herein are for description only and are not to be interpreted in a limited sense. These terms and expressions should be recognized as not excluding any equivalents to the elements shown and described herein and as allowing any modification encompassed in the scope of the claims. The present invention may be embodied in many various forms. This disclosure should be regarded as providing preferred embodiments of the principles of the present invention. These preferred embodiments are provided with the understanding that they are not intended to limit the present invention to the preferred embodiments described in the specification and/or shown in the drawings. The present invention is not limited to the preferred embodiments described herein. The present invention encompasses any of preferred embodiments including equivalent elements, modifications, deletions, combinations, improvements and/or alterations which can be recognized by a person of ordinary skill in the art based on the disclosure. The elements of each claim should be interpreted broadly based on the terms used in the claim, and should not be limited to any of the preferred embodiments described in this specification or referred to during the prosecution of the present application. While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims. | 47,837 |
11942747 | DESCRIPTION OF EMBODIMENTS The following describes in detail referring to the figures an example embodiment of the present disclosure. (A) Configuration of Component Mounter FIG.1shows component mounter10. Component mounter10performs work of mounting components on circuit board12. Component mounter10is provided with device main body20, board conveying and holding device22, component mounting device24, imaging devices26and28, component supply device30, and loose component supply device32. Note that, examples of circuit board12include circuit boards and boards with a three-dimensional construction, examples of a circuit board being a printed wiring board or a printed circuit board. Device main body20is configured from frame section40and beam section42that is mounted on frame section40. Board conveying and holding device22is positioned centrally inside frame section40in the front-rear direction, and includes conveyance device50and clamp device52. Conveyance device50conveys circuit board12, and clamp device52holds circuit board12. Thus, board conveying and holding device22conveys circuit board12and fixedly holds circuit board12at a specified position. Note that, in the descriptions below, the conveyance direction of circuit board12is referred to as the X direction, the direction horizontally perpendicular to the X direction is referred to as the Y direction, and the vertical direction is referred to as the Z direction. That is, the width direction of component mounter10is the X direction, and the front-rear direction is the Y direction. Component mounting device24is provided on beam section42, and includes work heads60and62and work head moving device64. As shown inFIG.2, component gripping tool66is detachably provided on a lower end surface of working head60and62. Component gripping tool66includes pair of claws67, and grips a component by closing the pair of claws67, and releases the gripped component by opening the pair of claws. Further, work head moving device64includes X-direction moving device68, Y-direction moving device70, and Z-direction moving device72. Work heads60and62are moved together to any position on frame40by X-direction moving device68and Y-direction moving device70. Also, work heads60and62are detachably attached to sliders74and76respectively, and Z-direction moving device72moves sliders74and76in a vertical direction individually. That is, work heads60and62are moved in a vertical direction individually by Z-direction moving device72. Imaging device26is attached to slide74in a state facing downwards, and is moved in the X direction, Y direction, and Z direction together with work head60. Thus, imaging device26images any position on frame section40. As shown inFIG.1, imaging device28is provided in a state facing upwards on frame section40between board conveying and holding device22and component supply device30. Thus, imaging device28images a component held by component gripping tool66of work heads60and62. Component supply device30is provided at an end of frame section40in the front-rear direction. Component supply device30includes tray-type component supply device78and feeder-type component supply device (not shown). Tray-type component supply device78supplies components in a state arranged in a tray. The feeder-type component supply device supplies components via a tape feeder or stick feeder (not shown). Loose component supply device32is provided at the other end of frame section40in the front-rear direction. Loose component supply device32lines up multiple components that are in a scattered state, and supplies the components in a lined-up state. That is, this device arranges multiple components that have random orientations to have a specified orientation and supplies the components in the specified orientation. Note that, components supplied by component supply device30and loose component supply device32may include electronic components such as electronic circuit components, configuration components of solar panels, configuration components of power modules, and the like. Also, electronic circuit components include components with leads and components without leads. (B) Component Mounter Operation Component mounter10, according to the above configuration, mounts components on circuit board12held by board conveying and holding device22. Specifically, circuit board12is conveyed to a work position, and is fixedly held at that position by clamp device52. Next, imaging device26moves above circuit board12and images circuit board12. By this, information related to a holding position error of circuit board12is obtained. Also, component supply device30or loose component supply device32supplies components at a specified supply position. One of the work heads60or62moves above the component supply position and holds a component using component gripping tool66. Then, work head60or62holding the component moves above imaging device28, and the component being held by component gripping tool66is imaged by imaging device28. Accordingly, information related to an error of the holding position of the component is obtained. Continuing, work head60or62holding the component moves above circuit board12, and corrects the error in the holding position of circuit board12and the error in the holding position of the component and so on. Then, the component is mounted on circuit board12by being released by component gripping tool66. (C) Structure of Component Gripping Tool As described above, with component mounter10, component gripping tool66grips the component by closing the pair of claws67, and releases the component by opening the pair of claws67so as to perform mounting operation. The electronic component also includes an electronic component, a so-called pin header, having multiple pins extending up and multiple pins extending down. With such an electronic component, the multiple upwardly extending pins are gripped by component gripping tool66, and the multiple downwardly extending pins are inserted into multiple through-holes formed in circuit board12. Specifically, for example, as shown inFIG.3, electronic component80includes a generally block-shaped component main body section82, three lower pins84extending down from the lower surface of component main body section82, and three upper pins86extending up from the upper surface of component main body section82. Further, the three upper pins86of electronic component80are gripped by pair of claws67. Note that, as shown inFIG.4, contact block88is provided between pair of claws67, and when the three upper pins86are gripped by pair of claws67, the upper ends of the three upper pins86contact a lower surface (hereinafter referred to as “contact surface”)90of contact block88. That is, when electronic component80is gripped by component gripping tool66, component gripping tool66is lowered until contact surface90of contact block88contacts the upper end of upper pin86, and when the upper end of upper pin86contacts contact surface90, pair of claws67close to grip upper pins86. Next, when the upper pins86have been gripped by pair of claws67, component gripping tool66, that is, work head60to which component gripping tool66is attached, is moved above circuit board12by the operation of work head moving device64. Here, operation of work head moving device64is controlled such that through-holes (not shown) formed in circuit board12and lower pins84of electronic component80coincide with each other in the XY coordinates, that is, are aligned in the vertical direction. When work head60is lowered, the lower pins84of electronic component80are inserted into the through-holes formed in circuit board12. Note that, the outer diameter of lower pins84is the same as the inner diameter of the through-holes, or is slightly larger than the inner diameter of the through-holes. When electronic component80is gripped by component gripping tool66, the upper ends of the upper pins86are in contact with contact surface90of contact block88. Then, with the upper ends of upper pins86contacting contact surface90of contact block88, work head60is lowered such that lower pins84of electronic component80are inserted into the through-holes. As a result, upper pins86are pushed in by contact block88, whereby lower pins84are press-fitted into the through-holes of circuit board12such that electronic component80is mounted on circuit board12. However, since electronic component80is supplied as a tape component, it may be supplied in an inclined state, and in such cases, electronic component80may not be properly gripped by a conventional component gripping tool. Specifically, as shown inFIG.5, taped components100are configured from carrier tape106in which many accommodation recesses102are formed, with electronic components80being housed in accommodation recesses102. Accommodation recess102is slightly longer than the length dimension of electronic component80, such that electronic component80is housed in accommodation recess102in a state extending in a vertical direction. Further, claws67of component gripping tool66are inserted into the gaps between upper pins86of the electronic component80housed in accommodation recess102and the internal walls of accommodation recess102and upper pins86are gripped by the pair of claws67. Further, since the gripping position of electronic component80by component gripping tool66is a specified supply position, each time an electronic component80is gripped by component gripping tool66, carrier tape106is fed sequentially in the lengthwise direction of carrier tape106. As a result, an accommodation recess102housing an electronic component80arrives at the supply position to supply a new electronic component80. However, as carrier tape106is fed, electronic component80housed in accommodation recess102may be inclined inside accommodation recess102as with the electronic component80shown by the dashed line inFIG.5. Here, conventional component gripping tool110, similar to with component gripping tool66, as shown inFIGS.6and7, includes pair of claws112and contact block114provided between pair of claws112. Each of the pair of claws112includes gripping sections116, arm sections118, and slide sections119. Gripping sections116are portions for gripping the three upper pins86of electronic component80. Thus, the dimension of gripping section116in the widthwise direction is longer than the length dimension of the three upper pins86in the direction in which they are arranged side by side. As a result, the three upper pins86are gripped together by pair of claws112. Note that, the length dimension in the direction in which the three upper pins86are arranged is the distance between the outsides of the two upper pins86located on the outside at both ends of the three upper pins86in the direction in which the three upper pins86are arranged, which is perpendicular to the direction in which upper pins86extend. Further, arm section118is a portion for holding gripping section116, and is configured from main arm section120and bent section122. Main arm section120is provided so as to extend vertically, and is connected to slide section119at an upper end portion thereof. Bent section122continues down from a lower end of main arm section120. Further, bent section122is bent so as to approach contact block114towards the lower end. Gripping section116is fixed to the lower end of bent section122. That is, arm section118is bent toward contact block114at the lower end, and gripping section116is fixed to the lower end of arm section118. Also, slide section119is slidably held by main body section125of component gripping tool110in the left-right direction, and pair of claws112slide so as to close and open. Therefore, as slide sections119slide, pair of claws112close such that gripping sections116of pair of claws112contact each other. Here, pair of arm sections118do not touch due to the bending of bent section122, and pair of arm sections118are separated from each other. Here, the width dimension of arm section118is the same as the width dimension of gripping section116. Therefore, the width dimension of claw112is made uniform in the vertical direction, that is, from main arm section120to gripping section116. Note that, the width dimension is a dimension in the left-right direction perpendicular to the sliding direction of claws112. Contact block114is provided between arm sections118of pair of claws112, and the width dimension of contact block114is longer than the length dimension of the three upper pins86in the side-by-side direction and slightly longer than the width dimension of claws112. Further, the thickness of contact block114is slightly shorter than the distance between main arm section120of pair of arm sections118when pair of claws112are closest to each other. Note that, the thickness dimension is a dimension of claw112in the sliding direction. However, the side surface of contact block114facing bent section122of arm section118is formed as tapered surface126over the entire width direction, and is inclined toward the inside of contact block88toward lower surface128of contact block114(also referred to as “contact surface”). The taper angle of tapered surface126is substantially the same as the bending angle of bent section122of arm section118. Therefore, when pair of claws112are closest to each other, bent sections122of arm section118and tapered surfaces126of contact block114face each other, and contact block114is positioned between arm sections118of pair of claws112without interference between arm section118and contact block114. With such a configuration, the lower end sections of pair of claws112are inserted into accommodation recess102of taped components100by lowering work head60to which component gripping tool110is attached while pair of claws112are separated from each other. Here, the lower ends of pair of claws112are inserted into accommodation recess102such that upper pins86of electronic component80housed in accommodation recess102are positioned between gripping sections116of pair of claws112. Further, the upper ends of upper pins86of electronic component80contact the contact surface128of contact block114located between pair of claws112, and upper pins86are gripped by gripping sections116of pair of claws112when the pair of claws112closes. However, as shown inFIG.7, when electronic component80is inclined inside accommodation recess102, the upper ends of upper pins86of electronic component80inserted between the lower ends of pair of claws112may not contact the contact surface128of contact block114and may enter between contact block114and claws112. In such a case, the upper ends of upper pins86are caught between tapered surface126of contact block114and claw112, such that pair of claws112cannot close, and upper pins86cannot be gripped by pair of claws112. In view of the above, with component gripping tool66, as shown inFIG.3, the width dimension of arm section150of claw67is made narrower than the width dimension of gripping section152, and tapered surface156(seeFIG.4) is formed only on a portion of the side surface of contact block88facing arm section150in the width direction. When pair of claws67close, arm sections150and tapered surfaces156face each other to prevent arm sections150from interfering with contact block88. This allows upper pins86of electronic component80to be gripped by gripping sections152without interference between arm sections150and contact block88. Further, since tapered surface156is formed only in a portion of the side surface of contact block88in the width direction, the thickness of contact surface90of contact block88is made longer than the distance between the pair of gripping section152except for the position where tapered surface156is formed. Further, the thickest thickness dimension of contact surface90is set such that at least two upper pins86of electronic component80contact the contact surface90even if electronic component80is supplied in an inclined state. As a result, when upper pins86of electronic component80inclined inside accommodation recess102of taped components100is gripped by pair of claws67, the upper ends of at least two upper pins86contact the contact surface90of contact block88, such that upper pins86can be appropriately gripped by pair of claws67. Specifically, each of the pair of claws67is configured of gripping section152, arm section150, and slide section158, as shown inFIG.8. Gripping section152is a portion for gripping the three upper pins86of electronic component80, and the width dimension of gripping section152is longer than the length dimension of the three upper pins86in the side-by-side direction, similar to the width dimension of gripping section116of conventional component gripping tool110. Further, arm section150is a portion for holding gripping section152, and the width dimension of arm section150is about one third of the width dimension of gripping section152. Arm section150is configured from main arm section160and bent section162. Main arm section160is provided so as to extend vertically, and is connected to slide section158at an upper end portion thereof. Bent section162continues down from a lower end of main arm section160. Further, as shown inFIG.4, bent section162is bent so as to approach contact block88towards the lower end. The lower end of bent section162is fixed to a central section in the width direction of gripping section152. That is, arm section150is bent toward contact block88at the lower end, and gripping section152having a width dimension that is about three times the width dimension of arm section150is fixed to the lower end of arm section150. Further, as shown inFIG.4, slide section158is held by main body section166of component gripping tool66to be slidable in the left-right direction such that pair of claws67close and open. Therefore, as slide sections158slide, pair of claws67close such that gripping sections152of pair of claws67contact each other. Here, pair of arm sections150do not touch due to the bending of bent section162, and pair of arm sections150are separated from each other. Further, as shown inFIGS.3and4, contact block88is provided between arm sections150of pair of claws67. The width dimension of contact block88is slightly longer than the width dimension of gripping section152(seeFIG.3). In addition, the thickness of contact block88is slightly smaller than the distance between main arm sections160of the pair of arm sections150when the pair of claws67come closest to each other, preventing interference when pair of claws67is operated (seeFIG.4). However, side surface170of contact block88facing the pair of arm sections150is formed as tapered surface156in a portion in the width direction, and tapered surface156of contact block88is inclined toward the inside of contact block88toward contact surface90of contact block88. In detail, as shown inFIG.9, recess174is formed in the center open block section172at which contact surface90and side surface170of contact block88intersect. Recess174has a shape in which the center of block section172is cut out from contact surface90to side surface170, and is formed at a position facing bent section162of arm section150. The bottom surface of recess174serves as tapered surface156. Note that, recess174is formed on the pair of side surfaces170and contact surface90facing the pair of arm sections150of contact block88, and the pair of recesses174formed on the pair of side surfaces170are symmetrically shaped. In this manner, contact block88is formed with recesses174extending from contact surface90to side surface170such that contact surface90is substantially H-shaped. Therefore, a portion of contact surface90where the recess174is formed, that is, a widthwise center section of contact surface90is concave and has a small thickness dimension. On the other hand, a portion of contact surface90where recess174is not formed, that is, both end portions of contact surface90in the widthwise direction, have a large thickness dimension. That is, contact surface90has first surface176having a small thickness dimension at the center in the width direction and second surface178having a large thickness dimension at both ends in the width direction. Note that, the thickness dimension of second surface178is made longer than the distance between the pair of gripping sections152when the pair of claws67are furthest separated from each other. Also, first surface176and second surface178are a single continuous surface. Further, the bottom surface of recess174, that is, the taper angle of tapered surface156is substantially the same as the bending angle of bent section162of arm section150. Also, the width dimension of recess174is slightly larger than the width dimension of bent section162. Thus, when pair of claws67close, bent section162of arm section150enters recess174of contact block88, as shown inFIG.3. In this manner, contact block88is provided between arm section150of pair of claws67without interference occurring between arm section150and contact block88. With such a configuration, the lower end sections of pair of claws67are inserted into accommodation recess102of taped components100by lowering work head60to which component gripping tool66is attached while pair of claws67are separated from each other. Here, the lower ends of pair of claws67are inserted into accommodation recess102such that upper pins86of electronic component80housed in accommodation recess102are positioned between gripping sections152of pair of claws67. Then, in accordance with the lowering of component gripping tool66, the upper ends of the three upper pins86of electronic component80contact the contact surface90of contact block88positioned between pair of claws67. Here, the upper pin86in the center of the three upper pins86contacts first surface176of contact surface90, and the upper pins86at both ends of the three upper pins86contact second surface178of contact surface90. Further, by closing pair of claws67, the three upper pins86are gripped by gripping sections116of pair of claws67. In addition, even when electronic component80is inclined inside accommodation recess102, upper pins86of electronic component80can be properly gripped by component gripping tool66. In detail, as shown inFIGS.11and12, when electronic component80is inclined inside accommodation recess102, the upper pin86in the central of the three upper pins86of electronic component80inserted between the lower ends of pair of claws67does not contact first surface176of contact surface90of contact block88. Note that, inFIG.12, taped components100, claws67, and the like are omitted. On the other hand, of the three upper pins86of electronic component80inserted between the lower ends of pair of claws67, the upper pins86at both ends contact second surface178of contact surface90of contact block88. In particular, since the thickness of second surface178is larger than the distance between pair of gripping sections152when pair of claws67are furthest separated from each other, the upper pins86at both ends contact second surface178even when electronic component80is inclined by a large amount. Therefore, the upper end of the upper pin86of the three upper pins86, which is not in contact with contact surface90, does not enter inside recess174. When pair of claws67close with the upper pins86at both ends of the three upper pins86that determine the length dimension of the upper pins86in the side-by-side direction contact the contact surface90of contact block88, the three upper pins86are pushed by gripping section152of claw67to swing. This corrects the incline of electronic component80such that the three upper pins86contact the contact surface90of contact block88. In other words, the upper pin86in the center of the three upper pins86contacts first surface176of contact surface90, and the upper pins86at both ends of the three upper pins86contact second surface178of contact surface90. Further, by closing pair of claws67, the three upper pins86are gripped by gripping sections152of pair of claws67. Thus, with component gripping tool66, even when electronic component80is inclined inside accommodation recess102, the upper pins86of electronic component80can be gripped by gripping sections152while contacting contact surface90. Note that, component gripping tool66is an example of a component gripping tool. Claw67is an example of a claw. Electronic component80is an example of an electronic component. Upper pin86is an example of a pin or lead. Contact surface90is an example of a contact surface. Recess174is an example of an escape section and a recess. Further, the present disclosure is not limited to the above example embodiments, and various changed or improved methods of embodiment are possible based on the knowledge of someone skilled in the art. Specifically, for example, in an embodiment described above, first surface176and second surface178are a single continuous surface on contact surface90of contact block88, but the contact surface may be a surface which is not a single continuous, that is, may be a non-continuous surface. Specifically, as shown inFIG.13, recess204is formed on the bottom surface of contact block200, that is, on contact surface202. Recess204is cut out from contact surface202to pair of side surfaces206. In other words, contact surface202of contact block200is divided by the recess at a center section in the width direction, and is formed into two third surfaces208. When contact block200having such a structure is used, if electronic component80is inclined as shown inFIG.14, the upper pins86at both ends of the three upper pins86abut against contact surface202, that is, third surfaces208. As a result, for a component gripping tool provided with contact block200, a similar effect as that of component gripping tool66described above can be achieved. Note that, with a component gripping tool provided with contact block200, the upper pins86at both ends of the three upper pins86, that is, two upper pins86, contact the contact surface202. Further, in an embodiment described above, the disclosure is applied to electronic component80having lower pins84and upper pins86, however, the disclosure may be applied to various types of components so long as they have upper pins86. That is, the present disclosure can be applied to an electronic component having multiple pins which are gripped by pair of claws67of component gripping tool66. Note that, it is easy to apply the present disclosure in various modes in which two or more upper pins of an electronic component having multiple upper pins are brought into contact with a contact surface. For example, two or more upper pins of an electronic component having multiple upper pins that contact a contact surface may be selected asymmetrically, and the contact surface may be asymmetrically shaped. Similarly, it is not necessary to grip all the upper pins, and the upper pins to be gripped may be selected asymmetrically. In addition, the length of the dimension in which the upper pins are lined up side by side may exceed the widthwise dimension of the gripping section of the claw or the contact surface. In other words, there may be no relationship between the upper pins gripped by the gripping section and the upper pins contacting the contact surface. Note that, since contact block88of an embodiment described above is a consumable part, one portion of component holding tool66may be configured to be exchangeable, or main body section166that makes up the main body of component holding tool66may be configured integrally with contact block88. Further, the present disclosure may also be applied to an electronic component accommodated in a tray having multiple cavities formed from multiple accommodation recesses, an electronic component supplied in an inclined state, or the like. REFERENCE SIGNS LIST 66: component gripping tool;67: claw;80: electronic component;86: upper pin (pin) (lead);90: contacting surface;174: recess (escape section);202: contacting surface;204: recess (escape section) | 28,076 |
11942748 | DETAILED DESCRIPTION OF SPECIFIC EMBODIMENTS FIG.1ashows an electric cable2with a metallic stranded conductor4and insulation6. The metallic conductor4is preferably a stranded conductor and is particularly resistant to bending. The conductor4is preferably a round conductor. The material of the strands of conductor4is preferably aluminium, in particular aluminium 99.5. The bending stiffness of cable2results when cable2cannot be plastically deformed due to its own weight. A force greater than the weight force is required to cause plastic deformation of cable2. The insulation6is preferably made of PVC or silicone. As shown inFIG.1b, cable2may be stripped in a central area, i.e. away from its respective distal ends, so that a stripped area8is formed. In the stripped area8, conductor4is free of insulation6. After the stripped area8is produced, the cable2or its conductor4can be compacted. Through compacting, the flat area10can be produced by a respective tool. The flat area10preferably has a width which is larger than the diameter of conductor4by a factor of at least 2, preferably between 2 and 5, and a height which is smaller than the diameter of conductor4by at least a factor of 2, preferably between 5 and 10. The height is shown inFIG.1c. InFIG.1cthe flat area10is shown. FIG.2shows a view of a cable2as shown inFIG.1c. It can be seen that the conductor4is a round conductor and is flat in the flat area10. The flat area10is located in the stripped area8, which is positioned away from the distal ends of the cable2. When compacting, a material bond can be formed directly between the strands of conductor4. The strands are pressed together and simultaneously welded together. Here, the pressing tool can also be a welding tool, especially an ultrasonic tool. FIG.3ashows one connecting element as connecting bolt12, but all other connecting elements are referred to in the following and the description also applies to other connecting elements where appropriate. The connecting bolt12shown inFIG.3ais cylindrical and made of a solid material. In particular, connecting bolt12can be made of stainless steel. However, it is also possible to form connecting bolt12from copper, aluminium or alloys of these. Connecting bolt12can be formed by turning or by cutting a rod. FIG.3bshows a connecting bolt12with a connecting lug14at one end, to which a clamping element of an electrical connection can be clamped, for example. In particular, a clamp in the form of a battery pole clamp can be clamped to the terminal lug14. FIG.3cshows a connecting bolt12in with one end fitted with a thread16. An electrical connection, for example, can be screwed to such a connecting bolt12. FIG.3dshows another connecting bolt12, which has an opening18at its end, especially in the form of a screwed hole. Through this opening18, for example, a screw connection can be made to an electrical connection by pushing a screw through an opening18and/or screwing it there. FIG.4shows a connecting bolt as shown inFIG.3bin one view. It can be seen that the cylindrical bolt12has a smaller radius in the area of the connecting lug14and is formed to accommodate a clamping element, for example. FIG.5ashows a top view of a cable2. It can be seen that a relief-shaped profile20is embossed in the flat area10. The areas of the profile20with an increased compression run essentially perpendicular to the longitudinal axis2aof the cable2. The profile20can be provided on both sides of the flat area10and can be uniform. FIG.5bshows a cable2in which the profile20has been embossed by complementary tools on both sides of area10. Here the dashed lines are on the side of area10facing away from the drawing plane. FIG.5cshows a cable2where the profile20has been embossed as a grid structure in the area10. The strands of cable4are highly compacted by profile20and there is a material bond at least in the area of the profile. This makes it possible to weld a connecting bolt12or another connecting element directly onto the cable4or its strands after compacting. FIG.6a, bshow a connecting bolt12which is welded directly onto the flat area10within the flat area10. Due to the profile, the flat area10is suitable and sufficiently compacted for the connecting bolt to be mounted, e.g. by rotary friction welding or ultrasonic welding. FIGS.7a, bshow a flat area10in which an opening22was made during or after compaction, in particular by punching. A sleeve12bcan be inserted into this opening22as a further possible connecting element. The outer flanges of sleeve12bcan then be welded to the strands of conductor4in the flat area10. The sleeve12bcan also have a flange on one side only, so that it can be welded on one surface of the flat area10only with the flange. | 4,762 |
11942749 | DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS A plug connection device according to the invention in the exemplary embodiments is illustrated by means of a so-called FAKRA standardization scheme, wherein only those features that are essential to the invention are illustrated in more detail hereunder. Potential embodiments and variants are derived from DIN 72594. However, the present invention and also the exemplary embodiment illustrated are not to be understood as being limited to a FAKRA plug connector or to a FAKRA housing, respectively. The solution according to the invention is suitable for arbitrary plug connectors. The features ofFIGS.1to14illustrated hereunder can be combined with one another in an arbitrary manner in as far as this is not technically excluded. The invention is implementable in different variants. Two variants are illustrated in an exemplary manner in the exemplary embodiment.FIGS.1to11herein show a first variant in which the fastening means2and the contact element13are configured so as to be mutually separate and capable of being plugged into one another. The fastening means2in these Figures is furthermore configured in such a manner that the fastening means can be mechanically secured on a further construction element/component.FIGS.12to14show a particularly preferred variant of the invention, according to which the fastening means2is configured so as to be integral to the contact element13. No means for mechanically securing the fastening means2on a further (arbitrary) construction element are configured on the fastening means2inFIGS.12to14. This is, however, also possible in principle. Although an integral configuration of the fastening means2and the contact element13is shown inFIGS.12to14, this is not mandatory. The fastening means2and the contact element13can also be configured as independent elements and only electrically and preferably also mechanically connected to one another. FIG.1shows a vertical longitudinal section through the plug connection device according to the invention, having a plug connector1and a fastening means2. The plug connector1has a housing3which is also illustrated in more detail inFIGS.2to4, and8to11. This, herein, can be a so-called FAKRA housing of a plug connector1. FIGS.13and14show a variant of the housing3which deviates somewhat therefrom, but which is preferably likewise configured so as to be compatible with the FAKRA standardization scheme. The housing3is preferably configured from plastics. The plug connector1furthermore has a plug body4which is connected to an outer conductor5of a cable6that inFIG.1is illustrated in only a schematic manner. Connecting the plug body4to the outer conductor5can be performed by way of known measures, for example by soldering/brazing, adhesive bonding, clamping, or crimping. In the exemplary embodiment it is provided (not shown in more detail in the drawing), that the plug body4is crimp-fitted to the outer conductor5. To this end, the plug body4can optionally also be configured in multiple parts; at least one part of the plug body4is preferably configured so as to be crimp-fitted to the outer conductor5. This can be preferably performed in that a cable jacket7of the cable6is stripped so far that the outer conductor5, which can preferably be a braided shield, is exposed. The plug body4can then be crimp-fitted to this braided shield. To this end, it can optionally be provided that a support sleeve (not illustrated) is first crimp-fitted to the outer conductor5, in particular to the braided shield, and the braided shield is subsequently folded back over the support sleeve, and part of the plug body4, or a connection piece for connecting to the plug body4, or the plug body4in an integral manner, is only then crimp-fitted to the folded-back outer conductor5, or is connected to the latter by other means. The plug connector1furthermore has at least one inner conductor part8(cf.FIG.4) which is provided for connecting to an inner conductor9of the cable6. Connecting herein can be performed, for example, by soldering/brazing, adhesive bonding, clamping, or crimping. It is provided in the exemplary embodiment that the inner conductor part8is crimp-fitted to the inner conductor9of the cable6. The inner conductor part8is connected to the inner conductor9of the cable6preferably once the outer conductor5of the cable6has been exposed and preferably folded back, and before the plug body4is crimp-fitted to the outer conductor5. In order for the inner conductor part8to be fastened on the inner conductor9, the latter can first be stripped, which can be performed by way of known measures. FIG.4, in a sectional and exemplary manner, shows the profile and the arrangement of the inner conductor part8within the plug body4. When viewed together withFIG.1, it is illustrated herein how the plug connector1provides a connector for attaching another complementary plug connector (not illustrated) and for electrically connecting the latter to the inner conductor part8and to the plug body4. In the case of the plug connector1illustrated inFIGS.13and14, the connection to the outer conductor5of the cable6(not shown therein) and the connection of the inner conductor9of the cable6to the inner conductor part8can in principle be provided in a similar or identical manner. It is illustrated in the exemplary embodiment that the plug body4receives a single inner conductor part8. Of course, the plug body4can also receive a plurality of inner conductor parts8which are connected to a corresponding number of inner conductors9. It is furthermore illustrated in the exemplary embodiment that the plug connector1receives one plug body4. It can in principle also be provided that the plug connector1receives a plurality of plug bodies4. The exemplary embodiment is to be understood in an analogous manner. As can be seen from the Figures, in particular fromFIGS.1,4,8, and13, the housing3has a receptacle10for inserting the plug body4. The receptacle10in the exemplary embodiment is configured as a bore which extends axially through the housing3. It is furthermore provided in the exemplary embodiment that the plug body4is plugged into the housing3or the receptacle10of the housing3, respectively, by a movement along the longitudinal axis of said plug body4, or in the axial direction A, respectively, (cf.FIG.13). The plug body4and the receptacle10herein are designed in such a manner that a terminal position of the plug body4in the receptacle10is established. In order for the terminal position to be established it is preferably provided that the plug body4in the terminal position thereof latches into the receptacle10in a perceivable manner. To this end, it is provided in the exemplary embodiment that the housing3has at least one latching element11(cfFIG.4) which when pushing in the plug body yields laterally or radially, respectively, and admits the plug body4but, when reaching the terminal position of the plug body4, returns, preferably springs back, to the previous or non-deflected position, respectively, of said latching element11preferably in such a manner that the latching element11blocks the path of the plug body4when the latter is pulled back counter to the push-in direction. The latching element11can preferably be designed in such a manner that the latter is operable and thus can optionally be deflected, for example by pushing in a screwdriver, so as to enable a retrieval of the plug body4from the housing3, or from the receptacle10, again when required. The plug body4preferably has a diminution12into which the latching element11intrudes when the plug body4has reached the terminal position thereof in the receptacle10. This, herein, can also be an arbitrary recess, depression, or the like. However, the configuration of a preferably annularly encircling diminution12has proven to be particularly suitable. The diminution12can also be produced, for example, in that the plug body4has a construction in two or multiple parts, wherein the diminution12is preferably configured in the connection region between two parts of the plug body4. It can be provided in the exemplary embodiment that the receptacle10and the plug body4have mechanical coding features such that the plug-fitting of a plug body4that is not intended for the housing3is mechanically prevented. According to the invention, a contact element13which is plug-fittable in the housing3in such a manner that a front region13aof the contact element13electrically contacts the plug body4, inserted into the housing3, on the external perimeter of said plug body4is provided. The contact element13herein is connected in an electrically conducting manner to the fastening means2. On account thereof, a ground connection to a further component24(cfFIG.14), for example to a conductive body part of a vehicle, can be established independently of the cable6. The front region13aof the contact element13, the former comprising the external perimeter of the plug body4, is particularly well illustrated inFIGS.1,7, and inFIG.12.FIG.4in the horizontal longitudinal section illustrated, shows only a short portion of the front region13aof the contact element13, the latter otherwise being obscured by the plug body4illustrated in the section. FIGS.5,7,9,10, and12show the contact element13, in particular the front region13aof the contact element13, without the plugged-in plug body4. A connection of the contact element13to the fastening means2can be derived in particular fromFIGS.2,6,7,9,10, and11. In the variant ofFIGS.12to14, however, the contact element13is preferably configured so as to be integral to the fastening means2, as has already been mentioned. The front region13aof the contact element13in the exemplary embodiment is connected in a form-fitting manner to at least part of the external perimeter of the plug body4. The front region13aof the contact element13herein is configured as a terminal clamp13a. The terminal clamp13aherein has two terminal clamp arms which are preferably configured so as to be sprung and, for connecting to the external perimeter of the plug body4, are deflected from the de-stressed position of said terminal clamp arms, and upon connecting to the external perimeter of the plug body4spring back again as far as possible, and thus therebetween receive or comprise, respectively, the plug body4. The contact element13can contact the plug body4in principle at any arbitrary position. In the exemplary embodiment it is provided that the contact element13, or the terminal clamp13athereof, engages in the diminution12of the plug body4. The latching element11in the exemplary embodiment also engages in the same diminution12, but this is not mandatory. These here can also be different diminutions, depressions, recesses, or the like. However, the use of a common diminution12can be advantageous in terms of construction and thus in terms of economy. It is provided in the exemplary embodiment that the contact element13is positioned in the housing3in such a manner that the contact element13engages in the diminution12when the plug body4has reached the terminal position thereof, on account of which a connecting dimension of the plug body4is also ensured. As can be furthermore seen fromFIGS.1to11, the plug connector1in this variant has a securing element14which is capable of being incorporated in a clearance15(cf.FIG.4andFIG.8) of the housing3in such a manner that a movement of the housing3in relation to the securing element14is limited in at least one degree of freedom. The limitation of the movement of the housing3in relation to the securing element14in at least one degree of freedom, preferably at least in the movement direction for pushing the plug body4in and out, is particularly advantageous when the securing element14is secured on the fastening means2directly and/or by way of the contact element13. In this case, a movement of the housing3in relation to the fastening means2is already limited by the securing element14, preferably at least in the mentioned movement direction, or the longitudinal direction, or the axial direction A of the housing3, respectively. The securing element14and the clearance15of the housing3are preferably designed in such a manner that the housing3in relation to the securing element14in terms of the movement of said housing3is also limited in further degrees of freedom. It can furthermore be provided that the securing element14, when the latter is fully pushed into the clearance15, latches in the provided terminal position in the housing3. To this end, a latching hook can be provided. The latching hook can preferably be releasable so as to retrieve the securing element14from the clearance15, or from the housing3, respectively, again. By receiving the securing element14in a substantially form-fitting manner in the clearance15and the latching hooks, it can be provided that the securing element14and the housing3are interconnected so as to be substantially immovable. As can be derived in particular from the illustration ofFIG.4, at least part14aof the securing element14protrudes into a displacement path of the plug body4incorporated in the housing3. In the exemplary embodiment herein, part14aof the securing element14protrudes into the diminution12such that pulling the plug body4out of the housing3, or out of the receptacle10, respectively, again is blocked by the part14a. It is illustrated in the exemplary embodiment that both the contact element13and the securing element14are connected to the plug body4by way of an orthogonal movement. The contact element13and also the securing element14thus extend orthogonally in the direction toward the plug body4when the latter is inserted in the terminal position in the housing3. The part14aof the securing element14, as also the terminal clamp13aand the latching element11, protrudes into the same diminution12; this is, however, optional. As can be seen in particular fromFIGS.2,6,9, and10, the contact element13in the variant ofFIGS.1to11is inserted in a form-fitting manner in a clearance17of the fastening means2. Alternatively, the contact element13can also be connected to the fastening means2in any arbitrary manner, for example by soldering/brazing, adhesive bonding, or riveting. The contact element13can also be configured conjointly with the fastening means2as one part or so as to be integral to the latter, respectively. An integral configuration is shown in the variant ofFIGS.12to14. A good mechanical and electrically conducting connection between the contact element13and the fastening means2is established by the form-fitting connection illustrated in the exemplary embodiment. The fastening means2and also the contact element13in all exemplary embodiments are preferably configured so as to be at least in part electrically conducting; the fastening means2and also the contact element13are preferably at least in part formed from an electrically conducting metal. The fastening means2and/or the contact element13are/is preferably formed substantially entirely, particularly preferably entirely, from metal. The form-fitting connection of the contact element13to the clearance17of the fastening means2can be particularly advantageously established in that the contact element13is configured so as to be sprung and has a diminution18in which the periphery of the clearance17engages, so as to fix the contact element13in the clearance17. The contact element13, as is illustrated in the exemplary embodiment according toFIGS.1to11, preferably has a design embodiment having two terminal clamp arms which run in a mutually mirror-symmetrical manner and in each case have one diminution18in which the periphery of the clearance17engages, such as can be seen inFIG.2. Alternatively, the contact element13can also have a protrusion, and the clearance17can be configured in a correspondingly complementary manner in order for a form-fitting connection to be established. As can be derived in particular fromFIG.8andFIG.9, the securing element14can have a passage19for inserting the contact element13and for connecting the front region of the latter, that is to say the terminal clamp13a, to the plug body4. This has the advantage that the housing3does not have to have any additional clearance for admitting the contact element13, but the passage19can be configured in a simple manner in the securing element14which is anyway already located in a clearance15of the housing3. The contact element13is thus plugged into the housing3in the context of the invention on account of the presence of the passage19in the securing element14. The passage19in the exemplary embodiment according toFIGS.1to11is configured in two parts, such that one passage is achieved for each terminal clamping arm of the contact element13. The securing element14in this embodiment is preferably configured from plastics. The securing element14in this embodiment is preferably not electrically conducting. FIG.7shows an alternative design embodiment of the securing element14. A relatively flat configuration of the securing element14is illustrated inFIG.7, but this is presently not the primary focus. The exemplary embodiment ofFIG.7differs from the previously described exemplary embodiment substantially in that the contact element13is inserted in a clearance20of the securing element14. The contact element13herein can be designed in the manner as has been described already in the exemplary embodiment, wherein in this case a periphery of the clearance20of the securing element14engages in the diminution18of the contact element13, or in the terminal clamp arms of the latter that run in a mirror-symmetrical manner, respectively, so as to receive in a form-fitting manner the contact element13in the clearance20. No direct connection between the contact element13and the fastening means2is provided in the exemplary embodiment illustrated inFIG.7. The electrical connection between the contact element13and the fastening means2in the exemplary embodiment according toFIG.7is performed by way of the securing element14. The securing element14to this end is configured so as to be at least in part electrically conducting, preferably at least in part from metal, particularly preferably substantially or entirely from metal. The contact element13can be loosely positioned in a clearance17of the fastening means2. It can be provided that the securing element14is connected to the fastening means2, for example, by a snap-fit connection. However, the connection can also be performed in another manner. In principle, a fixed connection between the securing element14and the fastening means2can also be completely dispensed with. This is possible in particular when the housing3is connected to the fastening means2in such a manner that the securing element14is jammed between the housing3and the fastening means2and, on account thereof, is fixed accordingly. In principle, the securing element14in the exemplary embodiment according toFIG.7can also be inserted in a clearance15of the housing3in such a manner that a movement of the housing3in relation to the securing element14is limited in at least one degree of freedom. The securing element14in the embodiment according toFIG.7herein can also be designed in such a manner that said securing element14has a part14awhich intrudes into a displacement path of the plug body4incorporated in the housing3, when the securing element14is positioned accordingly. As can be seen fromFIGS.1to11, the fastening means2can have a support21and/or at least one snap-fit connection part22for fastening the housing3of a plug connector1. In the exemplary embodiments of the variant ofFIGS.1to11, both a support21on which a lower side of the housing3can be supported, and a snap-fit connection part22which in the exemplary embodiment is configured as a snap-fit hook, are provided. The support21herein can have a securing edge so as to in particular additionally delimit a horizontal movement of the housing3. The fastening means2can furthermore have at least one eyelet23or else a plurality of eyelets23which can be provided for electrically and mechanically connecting the fastening means2to a ground part, or to the further component24, for example a vehicle ground or the like. FIGS.9to11show a design embodiment of the fastening means2for receiving and fastening and for electrically contacting a plurality of plug connectors1. Three plug connectors1are illustrated in the exemplary embodiment; however, the invention is not limited to the specific number of plug connectors1which a fastening means2can receive. In the exemplary embodiments according toFIGS.9to11, the fastening means2has two eyelets23. Alternatively, only one or a plurality of eyelets23can also be provided. Furthermore, the design of the eyelets23, or the presence of the latter, is optional in the case of all fastening means2. The eyelets23can optionally be entirely omitted; however, it is advantageous for the fastening means2to have connection elements in order for the fastening means2to be attached in a simple manner to a ground part, or to the further component24, respectively. As can be derived from the exemplary embodiments relating to the variant ofFIGS.1to11, securing the plug body4can be performed by a corresponding design of the housing3, in particular by the latching element11, as long as the securing element14and the contact element13have not yet been offered up to the plug body4. This is referred to as a primary securing feature. After the securing element14and/or the contact element13have been pushed into the terminal positions thereof, the plug body4that has previously been positioned in the housing3can be secured by said securing element14and/or said contact element13. This is referred to as a secondary securing feature, wherein an interaction of the contact element13and of the securing element14is particularly expedient to this end. The contact element13and the securing element14herein can also be responsible for the positionally accurate seat of the plug body4in the housing3, and can thus also ensure the connecting dimensions for connecting to a complementary plug connector (not illustrated in more detail). FIG.8shows the securing element14in a so-called pre-latching position. The securing element14is preferably preassembled in the housing3. In order for the plug body4to be assembled, it is provided herein that the plug body4is first plugged into the housing3and subsequently, when the plug body4has reached the terminal position thereof in the housing3, the secondary securing feature14is pushed in up to the terminal latching position of the latter. As is illustrated in an exemplary manner inFIGS.9and10, the plug connector1can subsequently be clip-fitted onto the contact element13which is already connected to the fastening means2. A securing element14can be dispensed with in the variant shown inFIGS.12to14. FIG.12shows a particular variant of the fastening means2, said variant being preferred in principle.FIG.13shows a housing3suitable for this variant, andFIG.14illustrates the fastening means2and the housing3in an assembled position. All features described above can herein of course be combined with the features of this variant, in as far as this is not technically excluded. The fastening means2of this variant likewise has a contact element13which now, however, is preferably configured so as to be integral to the fastening means2. Two snap-fit connection parts22for fastening the housing3of the plug connector1are furthermore provided, said snap-fit connection parts22to this end encompassing the housing3on the outer side thereof. The housing in the outer side thereof has a groove25into which the snap-fit connection parts22can intrude so as to configure a form-fitting connection in the axial direction A between the housing3and the fastening means2. The snap-fit connection parts22are also preferably configured so as to be integral to the fastening means2. It can also be provided that the snap-fit connection parts22are configured as arbitrary connection elements and in particular in such a manner that said snap-fit connection parts22intrude into the housing3and, on account thereof, establish a mechanical, in particular form-fitting and/or force-fitting, connection between the fastening means2and the housing3. The fastening means2finally has connection elements26so as to configure the ground connection to the further component24. The connection elements are presently configured as a crimp connection26and are likewise preferably integral to the fastening means2. A ground connector cable27for configuring the ground connection to the further component24(cf.FIG.14) can preferably be crimp-fitted to the fastening means2by way of the crimp connection26. To this end, the ground connector cable27, at that end that is not crimp-fitted to the fastening means2, can preferably have a cable shoe28(or the like) for the electrical and mechanical fastening to the further component24. The fastening means2, in particular according to the variant ofFIGS.12to14, can preferably be configured as a thin metal sheet. The fastening means2can be configured as a punched and bent part. The housing3of the plug connector1and the fastening means2are preferably configured in such a manner that the fastening means2does not project beyond the outer sides of the housing3of the plug connector1, preferably being recessed, when said fastening means is inserted in the housing3of the plug connector1. The housing3to this end can have suitable depressions and/or recesses, as can be seen inFIGS.13and14. While the invention has been described with reference to various preferred embodiments, it should be understood by those skilled in the art that various changes may be made and equivalents substituted for elements thereof without departing from the scope of the invention. In addition, many modifications may be made to adapt to a particular situation or application of the invention without departing from the scope of the invention. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed but rather, that the invention will include all embodiments falling within the scope of the appended claims, either literally or under the Doctrine of Equivalents. | 26,401 |
11942750 | DETAILED DESCRIPTION The technical content of the present disclosure are illustrated using the following specific implementations. One of ordinary skill in the art can readily appreciate advantages and technical effects of the present disclosure based on the disclosed content herein. However, the present disclosure can be implemented or applied using other different specific implementations. FIG.1is a schematic diagram depicting the architecture of a laser inspection system in accordance with the present disclosure. The laser inspection system of the present disclosure is used for inspecting the power of a laser source by exploiting a physical phenomenon between special ions in a gain optical fiber disposed in the transmission path of a laser light with the laser light, thereby achieving monitoring of the power of the laser source. As shown, the laser inspection system1of the present disclosure includes a laser source11, a gain optical fiber12and a light detector13. The laser source11transmits a laser with a first spectrum. The laser with the first spectrum can be transmitted by a first optical fiber14. The gain optical fiber12is connected to the first optical fiber14, that is, after the laser with the first spectrum travels through the first optical fiber14, it enters into the gain optical fiber12. The said connecting method can be welding. In an embodiment, the gain optical fiber12can be provided at the first optical fiber14by fusion splicing, for example, a section of gain optical fiber12can be joined with the first optical fiber14. The light detector13can be disposed at the gain optical fiber12, wherein when the laser with the first spectrum passes through the gain optical fiber12, the gain optical fiber12absorbs part of the energy level of the laser with the first spectrum, so that the laser with the first spectrum is converted to generate light with a second spectrum. The light detector13detects the intensity of the light with the second spectrum. More specifically, special ions inside the gain optical fiber12is capable of absorbing part of the energy level of the laser, and the light with the second spectrum is thus generated through, for example, down conversion. The present disclosure employs the light detector13to detect the intensity of the light with the second spectrum in order to obtain the power of the laser with the first spectrum. In an embodiment, the gain optical fiber12is an optical fiber doped with special ions, wherein the special ions are erbium, that is, the gain optical fiber is a gain optical fiber doped with erbium. In addition, the laser with the first spectrum is a blue laser with a wavelength between 430 nm and 460 nm, and the light with the second spectrum is a green light with a wavelength between 520 nm and 550 nm. The inventors through research have discovered erbium ions can absorb a part of the energy level of blue light. More specifically,FIG.2is a graph depicting the absorption spectrum of erbium ions. As shown in the absorption spectrum of erbium ions, blue light with wavelengths between 443 nm and 450 nm can be absorbed by erbium ions, and the absorption of part of the energy level of blue light can be called “down conversion,” and green fluorescent light can be generated. The present disclosure detects green fluorescent light signals to infer the power of the blue laser source. In addition, different types of optical fibers also influence the attenuation of the light to different extents. More specifically,FIG.3is a graph comparing the attenuation coefficients of different types of gain optical fibers of the present disclosure. As can be seen from the graph, the attenuation coefficients of an optical fiber with a high concentration of hydroxyl groups (High-OH) and an optical fiber with a low concentration of hydroxyl groups (Low-OH) vary with the wavelengths, wherein at a wavelength of 450 nm where blue light is, the attenuation rate of the high-OH optical fiber is significantly better than the low-OH optical fiber, that is, the high-OH optical fiber has a smaller attenuation rate than the low-OH optical fiber. Therefore, in order to reduce the effect of attenuation of the optical fiber on the blue laser, the first optical fiber14of the present disclosure selects a high-OH optical fiber for transmission of the blue laser, since its attenuation rate has a low sensitivity to wavelength, the attenuation effect on the blue laser can be reduced. FIG.4is a graph depicting the power of the laser source in the laser inspection system of the present disclosure versus the power of the fluorescence generated. As shown, in the range of 0-25 watts (W), the power of the blue laser and the power of the green fluorescent light exhibit a linear relationship. Therefore, by detecting the power of the green fluorescent light, the present disclosure can derive the power of the blue laser, thereby achieving the objective of monitoring the blue laser. FIG.5is a schematic diagram depicting the architecture of a laser inspection system in accordance with another embodiment of the present disclosure. As shown, the laser source11, the gain optical fiber12and the first optical fiber14in the laser inspection system1is similar to those described with respect toFIG.1, and will not be repeated. In an embodiment, the light detector13further includes a light sensing unit131and a detecting circuit132connected to the light sensing unit131. The light sensing unit131is used for receiving the light with the second spectrum emitted from the gain optical fiber12. The detecting circuit132is used for determining the intensity of the light with the second spectrum. More specifically, when the laser emitted by the laser source11travels through the gain optical fiber12, the special ions inside the gain optical fiber12absorbs part of the energy level of the laser source11, and other fluorescence is created through down conversion. The light detector13then detects the intensity of the fluorescence, wherein the light sensing unit131receives the fluorescence from the gain optical fiber12, and the detecting circuit132determines the intensity of the fluorescence. In an embodiment, the light sensing unit131can be a light sensor. In an embodiment, a band pass filter15is provided between the gain optical fiber12and the light detector13. Simply put, the band pass filter15is a device that only allows signals of a certain frequency to pass through while suppressing signals of the rest of the frequencies. Its function is to allow waves in a specific frequency band to pass through while blocking those in other frequency bands. Thus, the present disclosure uses the band pass filter15to filter waves, so as to allow passage of green light to be subsequently detected by the light detector13. In another embodiment, the light detector13is connected with a processing system2. The processing system2can determine whether a warning message should be issued based on the intensity of the light with the second spectrum generated by the gain optical fiber12. In other words, the light detector13can be connected to the processing system2, so that the intensity of the light with the second spectrum (i.e., the fluorescence) obtained by the light detector13can be sent to the processing system2for data storage, and a warning unit inside the processing system2can then determine whether the power of the laser source11is satisfactory. If the power of the laser source11is not satisfactory, then a warning message can be issued and sent to the management end. It can be understood from the above that the blue light optical-fiber coupler of present disclosure is designed using an optical fiber with low attenuation, which is in contrast to the existing commercially available coupling mechanisms. For example, an optical fiber specially doped with erbium is fusion welded to the blue laser, the erbium ions in the optical fiber will absorb blue light at a wavelength of about 450 nm to generate a green light at a wavelength of about 543 nm through down conversion phenomenon of the energy level. In addition, the inspection concept of the present disclosure is also applicable to in-line power inspection for high-power seed ends and coupler output ends. There is a myriad of processing applications of blue high-power laser sources. For example, in the processing of5G heat dissipation materials, solder joints on circuit boards are increasingly become smaller, and it is hoped that a good laser source can help improve the yield, and a blue high-power laser source is a preferred choice. In addition, in the welding of copper (Cu) metal sheets, the absorption of light in the blue wavelength range by copper metals is ten times greater than the traditional laser at a wavelength of 1064 nm, which can effectively improve the product processing quality and efficiency. In addition, in terms of improvements in the manufacturing process of inductive components, if a blue high-power laser source can be used for direct welding, the accuracy will be improved and no solder is required, which prevents pollution caused by solder materials currently used. The above description shows that the application of blue laser sources will increase rapidly. Therefore, the inspection method of blue laser sources disclosed in the present disclosure will help users to have better monitoring mechanisms in the future. FIG.6is a schematic diagram depicting the architecture of a laser inspection system in accordance with another embodiment of the present disclosure. In an embodiment, instead of monitoring a single laser source, a plurality of laser sources can be simultaneously monitored. As shown, a laser inspection system3includes a plurality of laser sources31, at least one combiner32, a laser exiting portion33, a plurality of gain optical fibers34and a plurality of light detectors35. The plurality of laser sources31are capable of emitting lasers with a first spectrum. The at least one combiner32is connected with the plurality of laser sources31via a plurality of first optical fibers36. The at least one combiner32combines the plurality of first optical fibers36together. The laser exiting portion33is connected to the at least one combiner32via at least one second optical fiber37. A plurality of gain optical fibers34are disposed at each of the plurality of first optical fibers36and the at least one second optical fiber37, respectively, and a plurality of light detectors35are disposed at the plurality of gain optical fibers34(only one is shown). When the lasers with the first spectrum pass through the plurality of gain optical fibers34, the plurality of gain optical fibers34absorb parts of the energy levels of the lasers with the first spectrum, and the lasers with the first spectrum are converted to generate lights with a second spectrum. The intensities of the lights with the second spectrum are detected by the plurality of light detectors35. In an embodiment, the plurality of gain optical fibers34are doped with erbium, that is, the plurality of gain optical fibers34are gain optical fibers doped with erbium ions. In addition, the lasers with the first spectrum are blue lasers with wavelengths between 430 nm and 460 nm, and the lights with the second spectrum are green lights with wavelengths between 520 nm and 550 nm. Furthermore, the first optical fibers36and the second optical fiber37are high-OH optical fibers. As mentioned before, owing to the fact that the erbium ions can absorb part of the energy level of blue light, that is, blue light with a wavelength between 443 nm and 450 nm can be absorbed by the erbium ions. The absorption of part of the energy level of blue light (or down frequency phenomenon) can cause green fluorescence to be generated. Based on the linear relationship between the power of blue laser light and the power of green fluorescent light in the range of 0-25 W, the present disclosure is able to infer the power of the blue laser source by detecting the green fluorescent light signals. In contrast to the embodiment described with respect toFIG.1, the embodiment ofFIG.6adopts the combiner32to combine the plurality of laser sources31. As shown, seven blue laser sources31can be combined together using one combiner32, and the combiner32is connected with the laser exiting portion33. A first optical fiber36is provided between each of the blue laser sources31and the combiner32, and a second optical fiber37is provided between the combiner32and the laser exiting portion33. The gain optical fibers34can be fused at the first optical fibers36and the second optical fiber37, and the plurality of light detectors35can be provided at the respective gain optical fibers34. As described earlier, when the blue lasers with the first spectrum pass through the gain optical fibers34, parts of the energy levels of the blue lasers can be absorbed by the erbium ions in the gain optical fibers34to generate green fluorescence, which can then be detected by the light detector35provided at each of the gain optical fibers34. The power of the blue lasers can be inferred based on the intensities of the respective green fluorescence. In the case that a plurality of combiners32are used for combing different groups of laser sources31, the optical fibers following the combiners32can be partially or entirely combined together. Inspection can take place as long as there is a gain optical fiber34fused in place; the principle of the inspection is the same and will not be described in details. In an embodiment, each of the light detectors35can include a light sensing unit351and a detecting circuit352connected to the light sensing unit351. The light sensing unit351is used for receiving the light with the second spectrum emitted by the respective gain optical fiber, and the detecting circuit352is used for determining the intensity of the light with the second spectrum. Each of the light detectors35can be subsequently connected to a processing system (not shown) to store and analyze data from the light detector35and to issue warnings. Moreover, a band pass filter38can be provided between each of the gain optical fibers34and the respective light detector35to allow the green light that is to be detected by the light detector35to pass through. FIG.7is a schematic diagram depicting a specific implementation of a laser inspection system in accordance with the present disclosure. As shown, a plurality of blue laser sources71can be combined by a plurality of combiners72. Combiners72are N×1 combiners, wherein N is equal to or greater than 2. Optical fibers at the output ends of the plurality of combiners72can be combined together by a further combiner72before being outputted by a laser exiting portion73. A smart monitoring node can be located at each optical fiber, that is, through fusion splicing, a gain optical fiber doped with special ions can be fused with each optical fiber. More specifically, each optical fiber is cut and a gain optical fiber is fusion spliced between the optical fiber, such that when a blue laser from a blue laser source71passes through the gain optical fiber, blue light is absorbed by the erbium ions, and green fluorescence is generated through down conversion. Finally, the intensity of the green fluorescence is detected to infer the power of the blue laser source71. It can be understood from the above that, by providing a smart monitoring node at each of the optical fibers, inspection can be carried out by the respective light detectors in these nodes, and data can then be sent to a processing system (e.g., in a server) for storage and analysis, and warnings can be issued if required. The present disclosure combines a gain optical fiber doped with special ions with a high-power optical fiber blue laser source. It is found that part of the energy level in the absorption spectrum of the gain optical fiber is in the blue laser wavelength range and can be absorbed, and green fluorescence can be generated as a result of the down conversion of the energy level of the ions after absorption. Accordingly, by monitoring the intensity of the fluorescence, the application of in-line monitoring of the high-power blue laser source can be achieved. It is also possible that in the future, in conjunction with system firmware, data can be uploaded to the cloud to realize a smart optical fiber system. In addition, the present disclosure is an all-optical-fiber transmission, which has a small energy loss and good laser coaxiality. By detecting the intensity of the green fluorescence, the power of the blue laser source can be obtained in real time, thus meeting the needs for real-time inspection. In conclusion, in the laser inspection system proposed by the present disclosure, real-time monitoring can be achieved by coupling a laser seed source with an optical coupler made of an optical fiber in conjunction with another optical fiber doped with erbium that emits green fluorescence. In other words, generating green fluorescence by a gain optical fiber directly absorbing blue light prevents misjudgments caused by blue light leaking from the optical fiber getting scattered by the environment. Compared to the existing upper anti-reflective UV adhesive process technology, production efficiency can be improved, and human labor and time can also be saved. Moreover, real-time smart cloud capability can be incorporated into the system described herein to allow real-time feedback and recording of the operations of the laser. The above embodiments are set forth to illustrate the principles of the present disclosure, and should not be interpreted as to limit the present disclosure in any way. The above embodiments can be modified by one of ordinary skill in the art without departing from the scope of the present disclosure as defined in the appended claims. | 17,900 |
11942751 | DESCRIPTION OF EMBODIMENTS Hereinafter, an embodiment will be described in detail with reference to the drawings. The same or corresponding parts in the drawings are denoted with the same reference signs, and repetitive description may be omitted.FIG.1is a block diagram of a laser processing device according to an embodiment.FIG.2is a schematic view of the laser processing device shown inFIG.1. As an example, the laser processing device (a laser device)100shown inFIGS.1and2performs drilling, cutting, fine processing of a semiconductor, and the like of an object A by irradiating the object A with laser light. The laser processing device100includes a laser light source10, a phase control unit20, a first optical system30, a first detector40, a second detector50, and a control unit60. The laser light source10emits laser light L1. The phase control unit20includes a spatial phase modulator (a liquid crystal type spatial phase modulator)21and a mirror22that guides the laser light L1to the spatial phase modulator21. The spatial phase modulator21has a liquid crystal layer, displays an arbitrary phase modulation pattern (a hologram, a computer generated hologram (CGH)) on the liquid crystal layer under control of the control unit60, and controls a spatial phase of the laser light L1according to the phase modulation pattern. A portion of the laser light L1incident on the spatial phase modulator21is emitted from the spatial phase modulator21with its spatial phase being controlled, while another portion of the laser light L1incident on the spatial phase modulator21is emitted from the spatial phase modulator21without its spatial phase being controlled. That is, the phase control unit20receives the laser light L1emitted from the laser light source10, controls the spatial phase of the portion of the laser light L1, emits the portion of the light as control light L2, and emits the other portion of the laser light L1as non-control light L3. A first optical system30guides the control light L2emitted from the phase control unit20and irradiates the object A with the control light L2. The first optical system30includes mirrors31,32, and33that guide the control light L2emitted from the spatial phase modulator21toward the object A. The control light L2and the non-control light L3are reflected by the mirrors31,32, and33in order, and the object A is irradiated with the reflected light. Further, the first optical system30includes lenses80,34, and35disposed in order on an optical path of the control light L2and the non-control light L3which is formed by the mirrors31,32, and33. The lens80and the lens34form an image of the control light L2of the spatial phase modulator21on the lens35. The lens35is a converging lens that faces the object A to cause the control light L2to converge toward the object A. The first detector (another detector)40is, for example, a camera for capturing an image of the control light L2and can be used for detecting a change in the characteristics of the control light L2under control of a control unit70. The detection result of the first detector40can be used for feedback control of the control light L2by the phase control unit20, for example. Details of such feedback control will be described later. In addition to the control light L2, the non-control light L3may also be incident on the first detector40. Therefore, the first detector40can also capture an image of the non-control light L3. For example, the first detector40is disposed on an extension line of the optical path of the control light L2and the non-control light L3directed from the mirror32to the mirror33and captures an image of a portion of the control light L2(and the non-control light L3) which is transmitted through the mirror33and of which an image is formed on an image capturing surface40s. An image corresponding to a processing surface of the object A is formed on the image capturing surface40sof the first detector40. The second detector (a detector)50is, for example, a camera for capturing an image of the non-control light L3and can be used for detecting a change in the characteristics of the non-control light L3under control of the control unit60. The detection result of the second detector50can be used for feedback control of the non-control light L3by the phase control unit20, for example. Details of such feedback control will be described later. In addition to the non-control light L3, the control light L2may also be incident on the second detector50. Therefore, the second detector50can also capture an image of the control light L2. Here, the second detector50is disposed on an extension line of the optical path of the non-control light L3(and the control light L2) directed from the mirror31to the mirror32and captures an image of a portion of the non-control light L3(and the control light L2) which is transmitted through the mirror32and of which an image is formed on an image capturing surface50s(a detection surface). The lens80is also a second optical system used for causing the non-control light L3(and the control light L2) to converge toward the image capturing surface50s. FIG.3is a diagram showing the image capturing surface of the second detector shown inFIGS.1and2. Here, as an example, by a phase modulation pattern including a diffraction grating pattern being displayed on the spatial phase modulator21, the laser light L1is branched into a plurality of rays of diffraction light, and a plurality of beam spots are formed on the image capturing surface50s. In the example ofFIG.3(a), a beam spot of the non-control light L3, which is 0th-order light, is formed in the center, and beam spots of the control light L2, which is 1st-order light, are formed around the center, for example. In the example ofFIG.3(a), the control light L2and the non-control light L3converge on the image capturing surface50sby a distance Z between the lens80and the image capturing surface50sbeing set to a focal length fin of the lens80. On the other hand, when a pattern corresponding to a predetermined Fresnel lens is superimposed on the phase modulation pattern of the spatial phase modulator21and the second detector50(the image capturing surface50s) is moved in an optical axis direction by position shift from the focal length fin due to addition of a focal length fFL of the Fresnel lens, as shown inFIG.3(b), the control light L2subjected to the control of the spatial phase of the spatial phase modulator21converges on the image capturing surface50s, and a convergence position of the non-control light L3not subjected to the control of the spatial phase modulator21is deviated from the image capturing surface by the focal length fFL to expand the beam spot. Meanwhile, as shown inFIG.3(c), when the image capturing surface50sis returned to a position shown inFIG.3(a), a convergence position of the control light L2is deviated from the image capturing surface50sby the focal length fFL of the Fresnel lens to expand the beam spots, and the non-control light L3converges on the image capturing surface50sas before. A position of the image capturing surface50sin the optical axis direction where the non-control light L3converges (a distance ZO between the lens80and the image capturing surface50s) can be detected, for example, as follows. That is, as shown in a graph ofFIG.4, the distance ZO can be acquired as, for example, a value at which an intensity of the non-control light L3is the maximum value IO, or a value at which a spot size of the non-control light L3on the image capturing surface50sis the minimum value WO by capturing an image of the non-control light L3while moving the image capturing surface50sof the second detector50in the optical axis direction and acquiring the detection result. Each process of the control and the light detection of the phase control unit20and the second detector50can be implemented by the control unit60. Similar to this, each process of the control and the light detection for the control light L2can be implemented by the control unit70. The control unit60and the control unit70may perform different kinds of control on the first detector40and the second detector50. That is, the control unit may implement each process of the control and the light detection for the control light L2different from that for the non-control light L3. That is, the control unit60can control at least the phase control unit20and the second detector50. Further, the control unit70can control at least the phase control unit20and the first detector40. The control unit60executes a process for controlling the phase control unit to correct a control state for a spatial phase of the control light L2in the phase control unit20on the basis of a detection result for the non-control light L3from the second detector50. Further, the control unit70executes a process for controlling the phase control unit20to correct a control state for a spatial phase of the control light L2in the phase control unit20on the basis of a detection result for the control light L2from the first detector40. These processes will be described in detail later. Each of the control units60and70has a processing part, a storage part, and an input reception part (not shown). The processing part is configured as a computer device including a processor, a memory, a storage, a communication device, and the like. In the processing part, the processor executes software (a program) read from the memory or the like and controls reading and writing of data in the memory and the storage, and communication of a communication device. The storage part is, for example, a hard disk or the like, and stores various types of data. The input reception part is an interface unit that displays various pieces of information and receives input of various pieces of information from the user. Subsequently, the details of an operation of the control unit60will be described by describing a correction method for the laser light implemented by the laser processing device100. This method is implemented by the control unit60executing each process.FIG.5is a flowchart showing the correction method for the laser light. The control unit60holds information indicating an initial state of the laser processing device100in advance. The information about the initial state held by the control unit60includes, for example, initial values of a position (coordinates), a spot size (a beam area), luminance, and the like of the non-control light L3on the image capturing surface50s, and initial values of a position (coordinates), a spot size (a beam area), a luminance, and the like of the control light L2on the image capturing surface40s. Here, first, the control unit60measures displacement from an initial position (step S1). More specifically, the control unit60executes a first acquisition process of acquiring a first deviation amount which is a deviation amount of a current position of the non-control light L3from the initial position within a plane intersecting with an optical axis of the non-control light L3(here, the image capturing surface50s, and hereinafter it may be referred to as “an XY plane”) by capturing an image of the non-control light L3using the second detector50.FIG.6(a)shows a state where the beam spot of the non-control light L3is at the initial position (x, y) in the XY plane, andFIG.6(b)shows a state were the beam spot of the non-control light L3is at a position (x+Δx, y+Δy) displaced from the initial position (x, y) in the XY plane. That is, here, each of Δx and Δy is acquired as the first deviation amount. As an example, Δx=+47 pixels, and Δy=−26 pixels. Such deviation may occur, for example, due to aging. FIG.7is an image showing the image capturing surface40sof the first detector40.FIG.7(a)shows a state where the beam spot of the control light L2is at the initial position. As shown inFIG.7(b), if the non-control light L3is deviated from the initial position on the XY plane, the control light L2is also deviated within the plane intersecting with the optical axis. For example, in Au and Av, each of which is the deviation amount on the image capturing surface40s, Δu=+18 pixels, and Δv=−10 pixels. As shown inFIGS.6and7, the control light L2subjected to the control of the phase control unit20is deviated, and the non-control light L3not subjected to the control of the phase control unit20is also deviated. Therefore, it is understood that the deviation includes at least that caused by the laser light source10which is a front stage side of the phase control unit20. In this step S1, the control unit60further executes a second acquisition process of acquiring displacement of a spread angle of the non-control light L3from the initial position by capturing an image of the non-control light L3using the second detector50.FIG.8(a)is an image showing a case where the beam spot of the non-control light L3on the XY plane is in an initial state.FIG.8(b)is an enlarged view ofFIG.8(a). On the other hand,FIG.9(a)is an image showing a state where the beam spot of the non-control light L3has changed from the initial state in the XY plane.FIG.9(b)is an enlarged view ofFIG.9(a). As shown inFIGS.8and9, here, the spread angle of the non-control light L3changes within the XY plane. In addition, inFIGS.8and9, dots drawn by software for detecting the beam spot are shown on an outer peripheral portion of the beam spot. The control unit60acquires a change amount ΔS of the spot size of the non-control light L3on the XY plane from an initial value S and/or a change amount ΔI of the intensity of the non-control light L3on the XY plane from an initial value I on the basis of the detection result (the image) of the second detector50. These change amounts ΔS and AI serve as indices indicating the spread angle of the non-control light L3. FIG.10is an image showing the image capturing surface40sof the first detector40.FIG.10(a)is an image showing a case where the beam spot of the control light L2is in an initial state.FIG.10(b)is an enlarged view ofFIG.10(a). On the other hand,FIG.11(a)is an image showing a state where the beam spot of the control light L2has changed from the initial state.FIG.11(b)is an enlarged view ofFIG.11(a). As shown inFIGS.10and11, here, the spread angle of the control light L2also changes. As shown inFIGS.8to11, if the spread angle of the non-control light L3changes, the spread angle of the control light L2also changes. While the spread angle of the control light L2subjected to the control of the phase control unit20changes, the spread angle of the non-control light L3not subjected to the control of the phase control unit20also changes. Therefore, it is understood that the change includes at least that caused by the laser light source10. In the subsequent step, the control unit60transforms the coordinates (x+Δx, y+Δy) on the XY plane (the image capturing surface of the non-control light L3including Δx and Δy as the first deviation amount into the coordinates on a hologram displayed by the spatial phase modulator21(hereinafter it may be referred to as “coordinates on a UV plane”) (step S2).FIG.12is a diagram for explaining an example of coordinate transformation. The transformation of a scale s between the coordinates on the XY plane and the coordinates on the UV plane is shown by the following equation (1), and the transformation of an angle θ is shown by the following equation (2). Therefore, the coordinate transformation between the coordinates on the XY plane and the coordinates on the UV plane is given by the following equation (3). As an example, when the coordinates of the non-control light L3on the XY plane are (x1, y1), the coordinates of the non-control light L3on the UV plane are calculated as (u1, 0). [Math.1]s=x12+y12u1(1)[Math.2]θ=tan-1(y1x1)(2)[Math.3][uv]=1s[cosθ-sinθsinθcosθ][xy](3) In the subsequent step, the control unit60determines whether or not the state change of the non-control light L3is within an allowable range (step S3). More specifically, the control unit60determines whether or not the change amount ΔS of the spot size of the non-control light L3on the XY plane from the initial value S and/or the change amount ΔI of the intensity of the non-control light L3on the XY plane from the initial value I, which are acquired in step S1, is within the allowable range. That is, here, as an example, it is determined whether or not the spread angle is within the allowable range. In a case where the state change of the non-control light L3is not within the allowable range as a result of the determination in step S3(step S3: No), the control unit60acquires the spread angle of the non-control light L3on the XY plane (step S4, the second acquisition process). More specifically, the control unit60first drives the second detector50in the optical axis direction of the non-control light L3while detecting the non-control light L3using the second detector50and acquires a second deviation amount which is a deviation amount of a position at which the non-control light L3most converges on the image capturing surface50s, from the initial position. FIG.13is a graph of a case where the second deviation amount is acquired on the basis of various indices. InFIG.13, a horizontal axis indicates a relative position (that is, the second deviation amount) of the second detector50(the camera) in the optical axis direction from the initial position.FIG.13(a)uses the peak luminance of the non-control light L3as an index, andFIG.13(b)uses the luminance density of the non-control light L3as an index. In these cases, the maximum value of each index is obtained by moving the second detector50in the optical axis direction, and thus the relative position at which the maximum value is obtained becomes the second deviation amount. On the other hand,FIG.13(c)uses the spot size (the beam area) as an index. In this case, the minimum value can be obtained by moving the second detector50in the optical axis direction. Then, the relative position at which the minimum value is obtained becomes the second deviation amount. Here, in either case, the second deviation amount of 1.5 mm is acquired. The second deviation amount is a shift amount of the focal position of the non-control light L3in the optical axis direction. Furthermore, here, the control unit60calculates the spread angle of the non-control light L3on the basis of the acquired second deviation amount. The spread angle is calculated as the focal length fFL of the Fresnel lens corresponding to the second deviation amount. The focal length fFL corresponding to the second deviation amount is obtained by the following equation. Specifically, the following equation (4) relates to a focal length f0 of the composite lens of the Fresnel lens and the lens80realized by the CGH displayed on the spatial phase modulator21, and the following equations (5) and (6) are obtained by transforming the following equation (4) into an equation for the focal length fFL of the Fresnel lens. d in the following equation is a distance between the lens and the Fresnel lens. [Math.4]f0=fm·fFLfm+fFL-d(4)[Math.5]fFL=d-fm(1-fmf0)(5)[Math.6]fFL=f0(d-fm)f0-fm(6) On the other hand, when the second deviation amount (the shift amount of the focal position) acquired as described above is Δd, f0=fm+Δd. Therefore, when this is introduced in the above equation (6), the focal length fFL of the corresponding Fresnel lens is represented as the following equation (7). In addition, when this equation is further transformed, the focal length fFL is acquired as the following equation (8). As an example, when Δd is 1.5 mm as above, the focal length fFL of the corresponding Fresnel lens is 62570 mm [Math.7]fFL=(fm+Δd)(d-fm)(fm+Δd)-fm(7)[Math.8]fFL=(fm+Δd)(d-fm)Δd(8) In a case where the state change of the non-control light L3is within the allowable range as a result of the determination in step S3(step S3: YES), the control unit60assumes that the spread angle of the non-control light L3is 0, that is, assumes that the focal length fFL of the Fresnel lens is infinite (step S5), and the process proceeds to subsequent step S6. The focal length fFL of the Fresnel lens being infinite means that a component of the Fresnel lens is not added when a CGH for correction is generated. Further, in the above example, a case where the spread angle is positive (a case where a change in a divergence direction occurs) is shown, but a case where the spread angle is negative (a case where a change in a convergence direction occurs) is also possible. In the subsequent step, the control unit60generates a CGH for correcting the state change as described above (step S6). More specifically, the control unit60generates a CGH on which a pattern including Δx and Δy each of which is the first deviation amount acquired as described above and parameters (−Δu, −Δv, −fFL) for counteracting the focal length fFL of the Fresnel lens as the spread angle corresponding to the second deviation amount is superimposed. The control unit60causes the spatial phase modulator21to display the generated CGH. As a result, the spatial phase of the control light L2is controlled by the spatial phase modulator21on which the CGH is displayed (according to the CGH), and the positional deviation of the control light L2within the plane intersecting with the optical axis direction and the spread angle of the control light L2are corrected, and thus it is maintained in the initial state. This point will be described more specifically.FIG.14(a)shows the CGH for correction actually generated. The control unit60causes the spatial phase modulator21to display this CGH. As a result, as shown inFIGS.14(b) to14(d), the spread angle (the luminance, the spot size) of the control light L2is corrected as compared withFIG.11, and it is understood that it returns to the initial state ofFIG.10. Similarly, the positional deviation of the control light L2which occurs within the plane intersecting with the optical axis direction as shown inFIG.15(b)from the initial state ofFIG.15(a)is corrected as shown inFIG.15(c), and thus it returns to the initial state. Since the non-control light L3is not subjected to the control for the spatial phase of the spatial phase modulator21, in a case where the positional deviation occurs within the XY plane as shown inFIG.15(e)from the initial state ofFIG.15(d), even if the CGH is displayed on the spatial phase modulator21, the state ofFIG.15(e)is maintained as shown inFIG.15(f). After that, the control unit60determines whether or not to continue the above control (step S6). In a case where the result of determination in step S6indicates that the control should not be continued, the process ends. On the other hand, in a case where the result of determination in step S6indicates that the control should be continued, the process returns to step S1to repeat the process. As described above, the control unit60executes the correction process of controlling the phase control unit20to correct the control state for the spatial phase of the control light L2in the phase control unit20on the basis of the detection result for the non-control light L3from the second detector50. More specifically, the control unit60executes a first correction process of controlling the phase control unit20to correct the positional deviation of the control light L2within the plane intersecting with the optical axis direction of the control light L2on the basis of the acquired first deviation amount. Further, the control unit60executes a second correction process of controlling the phase control unit20to correct the spread angle of the control light L2on the basis of the acquired spread angle. In particular, here, the phase control unit20includes the spatial phase modulator21that displays the phase modulation pattern (CGH) for diffracting the received laser light L1to branch the laser light L1into a plurality of rays of diffraction light and to emit the branched rays of diffraction light, emits 0th-order light of the laser light L1as the non-control light L3, and emits another order diffraction light of the laser light L1as the control light L2. Then, the control unit adjusts the phase modulation pattern displayed on the spatial phase modulator21on the basis of the detection result for the non-control light L3to correct the control state for the spatial phase of the control light L2in the phase control unit20. In each of the steps described above, the control unit60feedback-controls the phase control unit20to correct a change in a convergence state of the control light L2derived from the laser light source10on the basis of the detection result of the second detector50. On the other hand, in parallel with (or separately from) each of the above steps, the control unit70can execute the process of correcting a change in a convergence state of the control light L2derived from something other than the laser light source10on the basis of the detection result of the first detector40. For example, in a case where the control light L2is branched into multiple points as described above, the control unit70can feedback-control the phase control unit20to make the intensity distribution of the points of the control light L2uniform or to individually control the intensities of the points thereof on the basis of the detection result (the captured image) of the first detector40. In this case, the CGH for the control of the control unit70only has to be superimposed on the CGH generated by the control unit60or the like. As described above, in the laser processing device100, a portion of the laser light L1emitted from the laser light source10is controlled in the spatial phase by the phase control unit20to become the control light L2and is used for the first optical system30to irradiate the object A. On the other hand, another portion of the laser light L1emitted from the laser light source10converges toward the image capturing surface50sof the second detector50as the non-control light L3through the lens80. As a result, the non-control light L3not subjected to the control in the phase control unit20of the laser light L1emitted from the laser light source10is detected. This non-control light L3is less likely to be affected by the phase control unit20and maintains the characteristics of the laser light L1when emitted from the laser light source10. Therefore, the control unit60can easily correct the change in the convergence state of the laser light (the control light L2) caused by the laser light source10by controlling the phase control unit20to correct the control state for the spatial phase of the control light L2in the phase control unit20on the basis of the detection result for this non-control light L3. As a result, even in a case where the characteristics of the laser light L1emitted from the laser light source10change due to aging, for example, the convergence state of the laser light L1with which the object A is irradiated can be easily maintained at a specific initial value. Particularly, if the specific initial value is common among the plurality of laser processing devices100in a case where a plurality of laser processing devices100are used in parallel, the convergence state of the laser light L1in each laser processing device100is maintained at the common initial value even in a case where the change in the convergence state of the laser light L1emitted from the laser light source10varies for each laser processing device100, and thus a machine difference is reduced. As a result, from the detection result of the first detector40, when the control light L2is branched into multiple points, it is possible to make the individual intensities uniform by a common processing method. In this way, since this laser processing device can reduce the machine difference, it is also effective in a case where the plurality of laser processing devices are used in parallel. Further, in the laser processing device100, the control unit60executes the first acquisition process of acquiring the first deviation amount which is the deviation amount of the position of the non-control light L3within the plane intersecting with the optical axis direction of the non-control light L3on the basis of the detection result of the second detector50and executes the first correction process of controlling the phase control unit20to correct the positional deviation of the control light L2within the plane intersecting with the optical axis direction of the control light L2on the basis of the first deviation amount. Therefore, it is possible to easily correct the positional deviation of the control light L2within the plane intersecting with the optical axis direction on the basis of the information on the positional deviation of the non-control light L3within the plane intersecting with the optical axis direction. Further, in the laser processing device100, the control unit60executes the second acquisition process of acquiring the spread angle of the non-control light L3on the basis of the detection result of the second detector50and executes the second correction process of controlling the phase control unit20to correct the spread angle of the control light L2on the basis of the spread angle of the non-control light L3. Therefore, it is possible to easily correct the change in the spread angle of the control light L2on the basis of the information on the change amount in the spread angle of the non-control light L3. Further, in the laser processing device100, the control unit60drives the second detector50in the optical axis direction of the non-control light L3while detecting the non-control light L3, acquires the second deviation amount which is the deviation amount of the position at which the non-control light L3most converges on the image capturing surface50s, from the initial position, and acquires the spread angle on the basis of the second deviation amount. Therefore, according to the mechanical driving of the second detector50, it is possible to acquire the information on the change in the spread angle of the non-control light L3. Further, in the laser processing device100, the phase control unit includes the spatial phase modulator21that displays the phase modulation pattern for diffracting the received laser light L1to branch the laser light L1into a plurality of rays of diffraction light and to emit the branched rays of diffraction light, emits 0th-order light of the laser light L1as the non-control light L3, and emits another order diffraction light of the laser light L1as the control light L2. The control unit60adjusts the phase modulation pattern (CGH) displayed on the spatial phase modulator21on the basis of the detection result for the non-control light L3to correct the control state for the spatial phase of the control light L2in the phase control unit20. In this way, in a case where the spatial phase modulator21is included and the laser light is branched into a plurality of rays by diffraction, while the 0th-order light that is not diffracted is suitably used as the non-control light, the change in the convergence state of the control light L2can be easily corrected through the adjustment of the phase modulation pattern (the hologram) displayed on the liquid crystal layer. The laser processing device100further includes the first detector for detecting the control light L2emitted from the phase control unit20. The control unit70generates the phase modulation pattern for adjusting the control state for the spatial phase of the control light L2in the phase control unit20on the basis of the detection result of the control light L2from the first detector40and causes the spatial phase modulator21to display the phase modulation pattern superimposed on the phase modulation pattern adjusted by the correction process. Therefore, the control state of the control light L2can be adjusted in accordance with the change in the laser light (the control light L2) caused by something other than the laser light source10on the basis of the detection result of the control light L2. The above embodiment describes an aspect of the present disclosure. Accordingly, the present disclosure is not limited to the aspect described above and may be arbitrarily modified. Subsequently, modification examples will be described. FIG.16is a block diagram of a laser processing device according to a modification example.FIG.17is a schematic view of the laser processing device shown inFIG.16. The laser processing device (a laser device)100A shown inFIGS.16and17is different from the laser processing device100in that the phase control unit20further includes a polarization control element23and a polarizer90is provided in a preceding stage of the second detector50as compared with the laser processing device100according to the embodiment described above. The control unit70is omitted from the laser processing device100A. Therefore, the functions of the control unit70described above are realized by the control unit60. In this way, the control unit can be common. The polarization control element23is interposed between the laser light source10and the spatial phase modulator21on the optical path of the laser light L1. The polarization control element23is, for example, a λ/2 wavelength plate and receives the laser light L1emitted from the laser light source10. Then, the polarization control element23changes a polarization direction of the laser light L1such that the received laser light L1includes an S-polarized component and a P-polarized component and emits the changed laser light L1. From the viewpoint of increasing the utilization efficiency of the laser light L1in the spatial phase modulator21, as shown inFIG.18(a), the polarization direction of the laser light L1is changed to have only a polarized component that is sensitive to the liquid crystal layer of the spatial phase modulator21. On the other hand, here, as shown inFIG.18(b), the polarization direction of the laser light L1is changed to include both the P-polarized component and the S-polarized component. Therefore, one of the P-polarized component and the S-polarized component (for example, the P-polarized component) of the laser light L1is subjected to the control of the spatial phase in the spatial phase modulator21and becomes the control light L2, while the other of the P-polarized component and the S-polarized component (for example, the S-polarized component) of the laser light L1is not subjected to the control of the spatial phase in the spatial phase modulator21and becomes the non-control light L3. The polarizer90is interposed between the mirror32and the second detector50on the optical paths of the control light L2and the non-control light L3. The polarizer90transmits only the other of the P-polarized component and the S-polarized component (for example, the S-polarized component). Therefore, in the laser processing device100A, a portion of the control light L2and the non-control light L3emitted from the phase control unit20is transmitted through the mirror32and is incident on the polarizer90, but only the non-control light L3is transmitted through the polarizer90and is incident on the second detector50. That is, here, the second detector50detects (captures an image of) only the non-control light L3. In the laser processing device100A configured as described above, similarly to the laser processing device100, it is possible to control the phase control unit20in order to correct the control state for the spatial phase of the control light L2in the phase control unit20on the basis of the detection result for the non-control light L3. Therefore, it is also possible for the laser processing device100A to achieve the same operations and effects as the laser processing device100. Particularly, in the laser processing device100, the phase control unit20includes the polarization control element23that changes the polarization direction of the laser light L1such that the received laser light L1includes the S-polarized component and the P-polarized component and emits the changed laser light L1, and the spatial phase modulator21that controls the spatial phase of one of the S-polarized component and the P-polarized component of the laser light L1emitted from the polarization control element23to emit the one controlled polarized component as the control light L2and to emit the other of the S-polarized component and the P-polarized component of the laser light L1as the non-control light L3. Then, the control unit60adjusts the phase modulation pattern displayed on the spatial phase modulator21on the basis of the detection result for the non-control light L3to correct the control state for the spatial phase of the control light L2in the phase control unit20. Therefore, while the polarized component that is not sensitive to the liquid crystal layer is suitably used as the non-control light L3, the change in the convergence state of the control light L2can be easily corrected through the adjustment of the phase modulation pattern (the hologram) displayed on the liquid crystal layer. Furthermore, the laser processing device100may include a phase control unit20A (seeFIG.19) using a diffractive optical element (DOE)120instead of the phase control unit20using the liquid crystal type spatial phase modulator21. FIG.19is a schematic view of a phase control unit according to a modification example. As shown inFIG.19, the phase control unit includes a diffractive optical element120, a lens121, a lens122, a movable mirror123, and a movable mirror124. The lens121, the lens122, the movable mirror123, and the movable mirror124are disposed on the optical path of the laser light L1incident on the diffractive optical element120in this order. The diffractive optical element120diffracts the incident laser light L1to branch the laser light L1into a plurality of rays of diffraction light and to emit the plurality of rays of diffraction light. The diffractive optical element120emits the 0th-order light of the laser light L1as the non-control light L3and emits another order diffraction light of the laser light L1as the control light L2. The movable mirror123is rotatable around an axis in the X-axis direction which is one direction that defines the XY plane, for example, and the movable mirror124is rotatable around an axis in the Y-axis direction which is another direction that defines the XY plane, for example. Therefore, in a case where the positional deviation of the non-control light L3occurs within the XY plane (that is, in a case where Δx and Δy are acquired as the first deviation amount), the control unit60adjusts such that Δx and Δy become 0 by driving the movable mirror123and the movable mirror124. As a result, the positional deviation of the control light L2is corrected. Further, the lens121and the lens122constitute, for example, a Galilean telescope. A magnification ration is expressed as −(focal length f2)/(focal length f1) using a focal length f1 of the lens121and a focal length f2 of the lens122. Further, a distance d between the lens121and the lens122in the initial state is equal to the sum of the focal length f1 and the focal length f2. The lens122is movable in the optical axis direction. Therefore, in a case where the spread angle of the non-control light L3changes (that is, in a case where the second deviation amount is acquired), the control unit60changes the position of the lens122in the optical axis direction to correct the spread angle of the control light L2. That is, also in this modification example, the control unit60can execute the correction process of controlling the phase control unit20A to correct the control state for the spatial phase of the control light L2in the phase control unit20A on the basis of the detection result for the non-control light L3from the second detector50. More specifically, the control unit60can execute the first correction process and the second correction process as in the above embodiment. In the phase control unit20A, lenses121A and122A forming a Keplerian telescope as shown inFIG.20may be employed instead of the lenses121and122forming the Galilean telescope. A magnification ration in this case is expressed as (focal length f2)/(focal length f1) using a focal length f1 of the lens121A and a focal length C of the lens122A. Further, a distance d between the lens121and the lens122in the initial state is equal to the sum of the focal length f1 and the focal length C. Furthermore, in the above embodiments and modification examples, the laser processing device for processing the object A is exemplified. However, the present disclosure can also be applied to a laser device for purposes other than processing, such as a microscope. INDUSTRIAL APPLICABILITY It is possible to provide a laser device capable of easily correcting a change in a convergence state. REFERENCE SIGNS LIST 100,100A Laser processing device (laser device)10Laser light source20Phase control unit21Spatial phase modulator (liquid crystal type spatial phase modulator)23Polarization control element30First optical system40First detector (another detector)50Second detector (detector)50sImage capturing surface (detection surface)60,70Control unit80Lens (second optical system) | 41,366 |
11942752 | DETAILED DESCRIPTION Embodiments of the present invention can produce, despite the temperature-dependent power efficiency of an optical component, output laser pulses having low jitter, namely having pulse energy deviations of less than 5%, preferably less than 2%, in particular having in each case the same pulse energy, and also of specifying an associated laser system. According to embodiments of the invention, a current temperature or a current temperature difference of the optical component, or a temperature-dependent current parameter is calculated on the basis of all preceding input or output laser pulses which have contributed to the current heating of the optical component, and the power of a current input laser pulse is set on the basis of the calculated current temperature, the calculated current temperature difference or the calculated current parameter in such a way that the associated output laser pulse has a pulse energy which deviates from a predefined pulse energy by less than 5%, preferably by less than 2%, and in particular is equal to the predefined pulse energy. Preferably, the selected input laser pulses are amplified or frequency-converted by the optical component. The temperature difference may relate to the “cold” equilibrium state (thermal equilibrium) of the optical component. The temperature-dependent parameter can be a temperature-dependent control parameter, for example. According to embodiments of the invention, by means of a computational model, a temperature or temperature difference of the optical component or a temperature-dependent parameter is calculated or simulated almost in real time and from it a correction of the laser pulse energy can be derived and modulated on the current input laser pulse. The calculated temperature, temperature difference and parameter is not a real temperature, temperature difference or measurement variable of the optical component, but rather an abstract variable. In this case, the computational model incorporates every preceding laser pulse which has passed through the optical component and has contributed to the current heating of the optical component. The power of the current input laser pulse is then adapted in order to attain the desired pulse energy after passing through the optical component. By way of example, the power of the current input laser pulse can be set on the basis of the deviation of the calculated current temperature from a predefined (full-load) operating temperature of the optical component. The method according to embodiments of the invention affords the following advantages, in particular:arbitrary dynamic trigger programs can be instigated despite different operating points with differently manifested thermal load.a dead time (typically several seconds) for the settling of the laser before the beginning of the process can be dispensed with.more complex thermal behavior, e.g. with a plurality of optical components each with temperature-dependent power efficiency, can be simulated for example by way of a model with a plurality of separate temperatures. Preferably, the power of the current input laser pulse is set or modified before passing through the optical component by way of the trimming of its pulse shape, in particular by way of the trimming of its amplitude and/or at least one of its two pulse edges. Alternatively or additionally, as early as when the current input laser pulse is generated, the power thereof can be correspondingly set on the basis of the calculated current temperature, the calculated current temperature difference or the calculated current parameter. For the case where the input laser pulses are amplified upstream of the optical component and in the process at least one input laser pulse is used as additional pulse (so-called sacrificial laser pulse), this sacrificial laser pulse is preferably coupled out of the path of the amplified input laser pulses again upstream of the optical component. Instead of a single input laser pulse, a plurality of adjacent input laser pulses can also pass through the optical component as a laser burst and emerge from the optical component as an output laser burst. In one method variant, the input laser pulses are provided at times such that the output laser pulses arrive at an output as POD laser pulses at individually requested times. If necessary, at least one input laser pulse is used as additional pulse (so-called sacrificial laser pulse), which is then coupled out of the path of the amplified input laser pulses again. Preferably, individual laser pulses are selected from a pulse sequence of (seed) laser pulses having known pulse energies, in particular in each case the same pulse energies, said laser pulses preferably being repeated at a fixed frequency, and are provided as input laser pulses having in each case known pulse energies and pulse spacings. Alternatively, laser pulses can already be generated with in each case known pulse energies and pulse spacings and be provided as input laser pulses. In a further aspect, embodiments of the invention also relate to a laser system for generating output laser pulses from input laser pulses having in each case previously known pulse energies and pulse spacings, comprising:a pulse source for providing input laser pulses having in each case previously known pulse energies and pulse spacings,an optical component with temperature-dependent power efficiency, through which the input laser pulses pass and which is heated in the process, the input laser pulses emerging from the optical component as output laser pulses,a power setting device for setting the respective pulse power of the input laser pulses, anda control unit (e.g. FPGA (Field Programmable Gate Array) or microcontroller) programmed to calculate a current temperature or a current temperature difference of the optical component or a temperature-dependent current parameter on the basis of all preceding input laser pulses which have contributed to the current heating of the optical component, and to control the power setting device for a current input laser pulse on the basis of the calculated current temperature, the calculated current temperature difference or the calculated current parameter in such a way that the associated output laser pulse has a pulse energy which deviates from a predefined pulse energy by less than 5%, preferably by less than 2%, and in particular is equal to the predefined pulse energy. The optical component can be for example an optical amplifier for amplifying the input laser pulses or a (nonlinear) conversion crystal for converting the frequency of the input laser pulses. The power setting device is preferably configured as an acousto-optic modulator (AOM) or electro-optic modulator (EOM) for trimming the pulse shape of the current input laser pulse. The modulator can be controlled by the control unit with regard to opening time and opening duration such that the power of the current input laser pulse can be set as desired by way of the trimming of its pulse shape, in particular by way of the trimming of its amplitude and/or at least one of its two pulse edges. Alternatively, the power setting device can also be formed by a power closed-loop control facility for the laser pulses generated as input laser pulses by the pulse source in order to set the power of the current input laser pulse as desired. An optical amplifier for amplifying the input laser pulses can be arranged upstream of the optical component. For the case where sacrificial laser pulses are also amplified in the amplifier, advantageously a coupling-out unit (e.g. AOM or EOM) controlled by the control unit for coupling the amplified sacrificial laser pulses out of the path of the amplified input laser pulses is disposed downstream of the amplifier and in particular upstream of the optical component. In one preferred embodiment, the pulse source comprises a laser pulse generator for generating (seed) laser pulses having known pulse energies, in particular in each case the same pulse energies, said laser pulses preferably being repeated at a fixed frequency, and a selection unit for selecting some of the laser pulses as input laser pulses at in each case previously known pulse times, said selection unit being controlled by the control unit In another preferred embodiment, the pulse source comprises a laser pulse generator controlled by the control unit in order to generate input laser pulses whose pulse energies and pulse times are predefined by the control unit. In this case, the seed laser pulse generator can be embodied as:a fiber oscillator and amplifier (fiber or other medium) with pulse durations in the fs-ns range;laser diode and amplifier (fiber or other medium) with pulse durations in the ns range. Embodiments of the invention also relate to a control program product comprising code means adapted for carrying out all the steps of the method described above when the program runs on a control unit of the laser system described above. The optical component1shown inFIG.1serves for optically influencing a plurality of (here merely by way of example two) input laser pulses2which temporally successively pass through the optical component2and emerge from the optical component2as output laser pulses3. The optical component1has a temperature-dependent power efficiency and is heated by the input laser pulses2passing through, such that the power efficiency of the optical component1changes over time depending on the input laser pulses2that have passed through. The optical component1can be for example a nonlinear conversion crystal for converting the frequency of the input laser pulses2or an optical amplifier for amplifying the input laser pulses2. An (abstract) current temperature T of the optical component1can be calculated on the basis of all preceding input laser pulses2which have passed through the optical component1and have thus contributed to the current heating of the optical component1. FIGS.2a,2bschematically show the temporal profile of the calculated current temperature T of the optical component1with temperature-dependent power efficiency through which input laser pulses2pass in the case of periodically repeated input laser pulses2having in each case identical pulse energies (FIG.2a) and in the case of non-periodically repeated or only partly periodically repeated input laser pulses2having different pulse energies (FIG.2b). The periodically repeated input laser pulses2have the effect that the optical component1, proceeding from an initial temperature T0in the cold (switched-off) state, heats up to a substantially constant operating temperature T B. By contrast, non-periodically repeated input laser pulses2having different temporal spacings and/or different pulse energies lead to large temperature fluctuations between initial temperature T0and operating temperature T B and thus to considerable fluctuations of the power efficiency of the optical component1. The laser system4shown inFIG.3comprises the following components:a pulse source5for providing input laser pulses2having in each case previously known pulse energies,an optical component1with temperature-dependent power efficiency, through which the input laser pulses2pass and which is heated in the process, the input laser pulses2emerging from the optical component1as output laser pulses3,a power setting device6arranged between the pulse source5and the optical component1, e.g. in the form of an AOM (acousto-optic modulator) or EOM (electro-optic modulator), for setting or reducing the respective pulse power of the input laser pulses2, anda control unit7, which controls the pulse source5for providing an input laser pulse2and the power setting device6for setting the respective pulse power. The optical component1can be for example a nonlinear conversion crystal for converting the frequency of the input laser pulses2or an optical amplifier for amplifying the input laser pulses2. The pulse power of the input laser pulses2is reduced by the power setting device6by way of the amplitude and/or one or both pulse edges of the input laser pulses2being trimmed. The pulse portions removed by trimming are directed to an absorber (not shown). The input laser pulses2having known pulse energies are temporally initiated by the control unit7, that is to say that the control unit7knows both the pulse energies and the times of all initiated input laser pulses2. The (abstract) current temperature T or, as described below, a (abstract) current temperature difference ΔT of the optical component1is calculated by the control unit7on the basis of all preceding input laser pulses2which have passed through the optical component1and have thus contributed to the current heating of the optical component1. On the basis of the calculated current temperature T of the optical component1, the control unit7temporally controls the power setting device6for a current input laser pulse2, initiated by the control unit7, in such a way that after passing through the optical component1, the associated output laser pulse3has a pulse energy which deviates from a predefined pulse energy by less than 5%, preferably by less than 2%, and in particular is equal to the predefined pulse energy. The input laser pulses2are initiated or provided by the control unit7—according to a user request8—in such a way that the associated output laser pulses3arrive at an output9at individually requested POD (Pulse on Demand) times. The method described functions solely by way of the temporal control of the laser source5and of the power setting device6by the control unit7, that is to say that closed-loop control is not effected. As shown inFIG.3, the pulse source5can comprise a laser pulse generator10for generating (seed) laser pulses11and a selection unit (pulse picker)12controlled by the control unit7, e.g. in the form of an AOM or EOM, for selecting some of the seed laser pulses11as input laser pulses2. The laser pulse generator10repeats the seed laser pulses11with an input frequency f0which is fixedly set and lies in particular in the MHz range, e.g. in the range between 10 MHz and 200 MHz. The selected seed laser pulses11are allowed to pass as input laser pulses2without being deflected by the pulse picker12, while the seed laser pulses11that are not selected are coupled out by the pulse picker12and directed to an absorber (not shown). Instead of the illustration shown, the selection unit12and the power setting device6can be configured as one element. Instead of a single seed laser pulse11, two or more adjacent seed laser pulses11can in each case be selected as an “input laser burst” (pulse packet) which passes through the optical component1and emerges from the optical component1as an output laser burst. In the laser system4′ inFIG.4, an optical amplifier13for amplifying the input laser pulses2′ is additionally arranged between the power setting device6and the optical component1. In this case, the optical amplifier13has an amplification-free minimum time period which is predefined by the inversion establishment required for a minimum gain in the optical amplifier13, and a maximum time period which is predefined by the inversion establishment required for a maximum gain in the optical amplifier13. The minimum time period is based on the fact that after a pulse amplification, it is necessary first to re-establish the inversion in the gain medium of the optical amplifier13in order to ensure a pulse-to-pulse stability. The maximum time period prevents excessively long pulse pauses and thus excessively high gains which lead to undesirable pulse boosting. For the case where the temporal pulse spacing between two output laser pulses3is greater than the maximum time period, the control unit7inserts a further input laser pulse as sacrificial laser pulse14′ between the two input laser pulses2′, which is separated from the second input pulse2to be amplified by at least the minimum time period and by at most the maximum time period. For this purpose, the pulse source5is temporally controlled accordingly by the control unit7in order to provide a further laser pulse as sacrificial laser pulse14′. The two input laser pulses2′ and the sacrificial laser pulse14′ are amplified to form the laser pulses2,14by means of the optical amplifier13. A further coupling-out unit15arranged between the optical amplifier13and the optical component1, e.g. in the form of an AOM or EOM, is temporally controlled by the control unit7in such a way that the amplified sacrificial laser pulse14is coupled out and directed to an absorber (not shown). The two amplified input laser pulses2pass through the optical component1, e.g. a conversion crystal, and arrive at the output9as output pulses3at the requested times. Instead of being provided externally, as shown, the power setting device6can alternatively also be integrated in the pulse source5. Instead of being arranged upstream of the optical component1, as shown, the further coupling-out unit15can alternatively also be arranged downstream of the optical component1in order to couple out the amplified sacrificial pulse14′. The second laser system4″ shown inFIG.5differs from the laser system4,4′ inFIGS.3and4merely in that here the pulse source5comprises a power closed-loop control facility16controlled by the control unit7for the laser pulse generator10in order thus to generate input laser pulses2having predefined, optionally different, pulse energies and pulse times. Alternatively, the pulse energy can also be set by a power setting device6arranged in the pulse generator5. A computational model for calculating the abstract temperature T of the optical component1is described below. The transient response of the laser efficiency of the optical component1follows a cooling or heating process. Given knowledge of an effective temperature or temperature difference with respect to the “cold” equilibrium state of the optical component1, the power setting device6can effect precompensation of the output power. In this case, the temperature difference can be understood as a correction variable and generally does not correspond to the actual temperature of the laser system4,4′,4″. The transfer function h of the optical component1will be described below by means of the input pulse energy Einof the pulses2and the output pulse energy Eoutof the pulses3upstream and respectively downstream of the optical component1, which also experiences a contribution by ΔT. Ein→h(ΔT)Eout A model for h could be manifested as follows, for example: Eout=h(Ein,ΔT)=h(Ein)(1+ΔT) In this case, let h be the characteristic curve of the optical component1in the cold state (ΔT=0). This characteristic curve can be measured experimentally with low heating power (large pulse spacing) and be stored as a table. It is assumed that for h and ĥ, in the relevant value and definition range, their inversions h and ĥ−1respectively exist. The development of the temperature difference/correction variable ΔT can be described over time t e.g. as a differential equation and constitutes an initial value problem. dΔTdt=-ΔTτ+q˙(t) For such a cooling or heating process, r and {dot over (q)}(t) respectively denote an intrinsic time constant and a variable heating term and need to be known for the solution of ΔT(t). In this case, the heating term {dot over (q)}(t) can make either a negative or a positive contribution to ΔT. The pulsed operation of the laser results in a natural, temporal discretization of the differential equation at the times ti=∑j=0iΔtj, which always relate to an associated time interval Δtiregarding the respectively preceding laser pulse. Hereinafter, ΔTiis synonymous with ΔT(ti). The time intervals Δtineed not be equidistant here. Such a temporal discretization makes possible numerical solution schemes, such as e.g. a description by means of finite differences: ΔTi+1-ΔTiΔti=-ΔTiτ+q˙(ti) The heating power {dot over (q)}(ti) is produced by discrete pulse packets with pulse energies Ep(ti)=Ep,i. Since the pulse duration is in each case very much shorter than the time constant τ, a change in temperature can take place in each case owing to a quantity of heat q(ti), without producing appreciable discretization errors in the result. In this case, q(ti) is generally nonlinearly dependent on the pulse energy propagated by the optical component1and is described hereinafter using the notation q(Ep,i). The quantity of heat supplied can be approximated e.g. by a polynomial of arbitrary order n in Ep,i: q(Ep,i)=∑u=0nau(Ep,i)u In this case, the index p distinguishes whether the input (in) or the output pulse energy (out) is involved, which is crucially responsible for the heating process. For example, an optically nonlinear crystal for frequency conversion in the optical component1typically brings about different degrees of absorption for input and output wavelengths of the light. In the example chosen, p=in is intended to indicate a primary dependence on the input pulses. The output pulse energy E out is calculated here by way of h(ΔT). The effective temperature difference ΔTiis included in the calculation at all times almost in real time. In the cold state, the initial value is ΔT0=0. Every requested (i-th) pulse with pulse energy Ep,imakes an additive input q(Ep,i) to ΔT and the cooling process takes place in the dead times during which no pulses propagate through the optical component1. A sequential specification in order to calculate ΔTifollowing the i-th pulse is given for example as follows: a) cooling during dead time Δtiin m steps where k=1 . . . m and Δti=∑k=1mΔti,k:ΔT^i,0=ΔTi-1ΔT^i,k=ΔT^i,k-1-ΔT^i,k-1τΔti,k b) choose Ein,iby means of 6 so that Eout,icorresponds to the requested output pulse energy Eout,i|target. In this example therefore: Ein,i=hˆ-1(Eout,i❘"\[LeftBracketingBar]"target1+ΔT^i,m) c) change in the temperature: ΔTi=i,m+q(Ein,i) The iterative procedure in subpoint a) is necessary if e.g. long temporal spacings between pulses arise and the condition Δti«τ is no longer met, which would lead to severe errors in the calculation ofi. A maximum discretization step Δtd,max=α·τ is necessary so that Δti,k<Δtd,maxholds true in all m steps. In this case, α«1 ought to be chosen, e.g. α=0.01 or even less. The number of steps m is selected individually for every i-th pulse spacing according to these criteria. The corrections calculated in b) are implemented by the control unit7by way of control of the power setting device6for each pulse. Such laser control could be implemented on a microcontroller or FPGA, for example. In the case of multifactorial contributions to the thermal modification of the output pulse parameters, p effective temperatures ΔTican be included in the calculation, which yield a total correction ΔTtotal: ΔTtotal=∑lpΔTl with the respective p discretized differential equations which have to be solved for every i-th laser pulse, and with in each case an associated heating term {dot over (q)}land time constant τl:ΔTl,i+1-ΔTl,iΔti=-ΔTl,iτl+q˙l,i The calculation of the individual ΔTl,ican be effected in each case according to the above scheme a)-c). Different contributions can be caused for example by varying absorption at different wavelengths during the frequency conversion or by heating of different mechanical components. For the solution of ΔTi, it is necessary, apart from the initial value ΔT(ti=0),to determine the mapping q(Ein) and the time constant τ. The differential equation for ΔT(t) has a simple solution in the case of a constant heating term {dot over (q)}(t)=frep·q(Ein,j)=const where frep=const and initial value ΔT(t=0)=0: ΔT(t)❘"\[RightBracketingBar]"q=q(Ein,j)=frep·q(Ein,j)·τ·(1-e-tτ) Consequently, the time constant τ and q(Ein) can be determined by adapting the calibration function gcal(t,Ein,j)=-b(Ein,j)·e-tτ+cwhereb(Ein,j)=τ·frep·q(Ein,j) to the measurement of the settling behavior of the output pulse energy Eout. This is possible since both the initial temperature ΔT0and the pulse energies Ein/Eout, which are constant during the measurement, are known. During the measurement of the settling behavior, a laser system is operated from the cold state with a constant input pulse energy Einand constant pulse repetition frequency frep=1/Δti=const and the output pulse energy or power is recorded at sufficiently short time intervals Δtmess«τ and stored. The measurement of the settling behavior of the output pulse energy is repeated for at least n different settling curves in conjunction with n different, fixed heating powers or pulse energies Ein,jwhere j=1, 2, . . . , n, such that at least n measurement series exist for unambiguously determining the heating contribution q(Ein,j)=∑u=0nau(Ein,j)u and the coefficients αuthereof. While subject matter of the present disclosure has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive. Any statement made herein characterizing the invention is also to be considered illustrative or exemplary and not restrictive as the invention is defined by the claims. It will be understood that changes and modifications may be made, by those of ordinary skill in the art, within the scope of the following claims, which may include any combination of features from different embodiments described above. The terms used in the claims should be construed to have the broadest reasonable interpretation consistent with the foregoing description. For example, the use of the article “a” or “the” in introducing an element should not be interpreted as being exclusive of a plurality of elements. Likewise, the recitation of “or” should be interpreted as being inclusive, such that the recitation of “A or B” is not exclusive of “A and B,” unless it is clear from the context or the foregoing description that only one of A and B is intended. Further, the recitation of “at least one of A, B and C” should be interpreted as one or more of a group of elements consisting of A, B and C, and should not be interpreted as requiring at least one of each of the listed elements A, B and C, regardless of whether A, B and C are related as categories or otherwise. Moreover, the recitation of “A, B and/or C” or “at least one of A, B or C” should be interpreted as including any singular entity from the listed elements, e.g., A, any subset from the listed elements, e.g., A and B, or the entire list of elements A, B and C. | 26,689 |
11942753 | DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following detailed description, for purposes of explanation and not limitation, specific details are set forth in order to provide a better understanding of the present disclosure. It will be apparent to one skilled in the art that the present disclosure may be practiced in other embodiments that depart from these specific details. FIG.1shows in schematic side sectional view a laser1according to an embodiment of the disclosure, the laser being of the folded slab hybrid waveguide-unstable resonator type. The resonator is based on a resonant cavity bounded by end mirrors2and4, the end mirror2being the output coupler and the end mirror4the end reflector. The output coupler2may be of various forms as known in the art. Three suitable examples of mirror types that can be used as the output coupler in a hybrid waveguide-unstable resonator of the type described herein are:a. Edge-coupled hard-edge mirror where the intracavity beam is magnified on successive round-trips and over-spills the mirror area, thereby producing the output beam.b. Scraper mirror which is a variant of the edge-coupled hard-edge mirror design in which the output beam “gap” alongside the mirror's knife-edge is filled with a scraper mirror, which can be arranged either in front of or alongside the front mirror.c. Variable reflectivity mirror with a soft-edge graded reflectivity profile, such as a super-Gaussian tapered reflectivity profile, on a transmissive substrate. This type of output coupler mirror has a low level of intra- and extra-cavity diffraction ripples, which can result in a higher quality output beam. The laser1has three slab waveguides10a,10b,10care stacked on top of one another, each separated by the same vertical distance ‘h’. (The separation ‘h’ between vertically adjacent slabs can be freely selected, so in other embodiments these may have different values, h1, h2etc . . . ) The three slab waveguides10a,10b,10care thus physically arranged in different planes, which are parallel to each other and vertically offset. The slab waveguides are arranged in between and optionally also defined by RF electrodes28,30,32,34, whose operation is described further below. Each slab waveguide10a,10b,10chas a thickness, i.e. vertical dimension inFIG.1, sized to support at least one waveguide mode vertically in the slab waveguide and a width, i.e. the dimension out of the paper inFIG.1, sized to support free space modes horizontally across the slab waveguide. The principal optical axis of the laser is shown with a dotted line and is denoted with reference numeral ‘O’. The output beam from the laser1is denoted with reference numeral ‘5’. Each of the slab waveguides provides a volume for accommodating a gain medium, it being envisaged that a gaseous gain medium is used, such as carbon dioxide. However, in principle the same design is suitable for other gain media, such as liquids or solids. The three slab waveguides10a,10b,10care optically arranged in series through two cavity folding assemblies20a,20b. Each cavity folding assembly20a,20bis configured to direct a radiation beam emitted from one of the slab waveguides into another of the slab waveguides. The cavity folding assembly20ahas first and second curved mirrors22a,22b. Both the first curved mirror22aand the second curved mirror22bare configured to deflect an incident beam by 90 degrees, so that the principal optical axis ‘O’ has horizontal and vertical segments. The cavity folding assembly20bhas a similar design with first and second curved mirrors22c,22d. FIG.2shows in more detail the optical design around the fold mirror assembly20aofFIG.1. It will be understood that the optical design of the other fold mirror assembly20bfollows the same principles.FIG.2shows the right-hand end16aof the slab waveguide10a, the right-hand end16bof the slab waveguide10band the fold mirror assembly20a. The slab waveguides10a,10bhave a vertical thickness ‘t’ which, as mentioned above, is sized to support a single waveguide mode vertically in the slab waveguide, e.g. the EH11 mode, or a discrete defined number of waveguide modes vertically in the slab waveguide, e.g. 2, 3, 4 or 5 modes. The effect of the fold assembly20ais to subdivide the optical axis O in its section between the two waveguide ends16a,16binto two horizontal segments of length d1and d2and one vertical segment of length ‘h’ corresponding to the vertical offset between the planes of the waveguides10aand10b. The optical path length ‘Z’ over the free-space propagation region between the two waveguides is thus Z=d1+h+d2. As will be understood, when the radiation beam leaves the end of one of the slab waveguides it will diverge in the vertical plane, i.e. orthogonal to the plane of the slab. The role of the fold assembly20ais to focus the divergent radiation beam emitted from the waveguides10a,10bby an amount selected to provide good coupling of one or more selected ones of the vertical waveguide modes into the vertically offset waveguide10b,10arespectively. The cavity folding assembly20athereby counteracts the natural divergence of the vertical waveguide mode(s) as they emerge from the slab waveguides10a,10band couple a selected one or ones of those waveguide modes back into the other slab waveguide10b,10a. In particular, the focusing power can be optimized for maximum coupling efficiency of the fundamental lowest-loss waveguide mode, EH11. The vertical thicknesses ‘t’ of the slab waveguides need not be the same for each slab waveguide and may differ. For example, the vertical thicknesses of the uppermost and/or lowermost slabs could be made greater than for the middle slab(s) to reduce the irradiance (W/cm{circumflex over ( )}2) on the end mirrors. Varying the vertical thicknesses between slabs is also a potential design variable to provide a more highly-discriminating mode-trap in one direction for a particular mode of significance, since it will make the loss and mode discrimination different for the two directions of travel of the beam through the fold. In respect of the free-space modes, in the present embodiment each cavity folding assembly is configured to direct these modes without focus from one waveguide to the other. (Alternatively, some focusing or defocusing could be provided in respect of the free space modes, which would be an independent effect that is not the subject of the present disclosure, but is nevertheless compatible with the present disclosure.) In the present embodiment in which there is focusing of the (vertical) waveguide modes and no focusing of the (horizontal, out-of-paper inFIG.1) free space modes, then the cavity folding assembly effectively constitutes a cylindrical mirror assembly, assuming that the focusing is exclusively performed with mirrors. When the cavity folding assembly is constructed with two mirrors22a,22bas illustrated, then this means that their combined effect is to provide a cylindrical focus. For example, mirrors22a,22bcan each be cylindrical mirrors with half the required focusing power. (Alternatively, one of the mirrors may be planar and the other cylindrical to a degree sufficient to provide all the required focusing power.) Each cavity folding assembly is configured to redirect the radiation beam through 180 degrees and by a vertical distance corresponding to a vertical offset ‘h’ between the associated slabs which are stacked parallel to each other. Having the slabs stacked parallel to each other as illustrated will provide the most compact configuration. Returning toFIG.2, the first mirror22ahas a first radius of curvature, R1(in the plane of the paper). The first mirror22ais arranged at a horizontal distance, d1, from the waveguide end16a. The second mirror22bhas a second radius of curvature, R2(in the plane of the paper). The second mirror22bis arranged at a horizontal distance, d2, from the waveguide end16b. The first and second mirrors22a,22bare vertically offset by a vertical offset, h, between the waveguides10a,10b, wherein the optical path length, Z is the sum of d1, h and d2. In some embodiments, R1can be made equal to, or approximately equal to, R2. Moreover, d1can be made equal to, or approximately equal to, d2. Further, the first and second mirrors22a,22bcan be configured each to reflect light through 90 degrees (as shown), or approximately 90 degrees. In some embodiments using mirrors, the first and second mirrors are both curved. In other embodiments, one of the first and second mirrors may be planar, with the other being curved and thereby being the sole contributor to the effective radius of curvature. In the most preferred implementations, both are curved with an equal degree of curvature, or at least approximately equal degree of curvature. The effect of the fold optics is to provide a suitable focusing power to wholly or partially reverse the divergence of the waveguide mode exiting one waveguide upon reflection back into the other waveguide. Two particular coupling regimes are of special interest for embodiments of the disclosure. These coupling regimes are defined in terms of the ratio of Z/R, i.e. the optical path length ‘Z’ in free space between the waveguide ends being coupled through a fold and the effective radius of curvature ‘R’ of the focusing optics. The focusing optics may be a mirror, a lens, a mirror combination, a lens combination or a lens and mirror combination, where the individual elements or the elements collectively may be spherical, parabolic, cylindrical or aspheric. The first coupling regime of particular interest is the so-called “Case III” coupling regime, for which in our designs each cavity folding assembly will have an effective radius of curvature, R, equal to approximately twice the optical path length, Z. Around this ratio, different embodiments will satisfy the condition that Z/R=0.50±0.05, 0.50±0.10, 0.50±0.15 or 0.50±0.20. In a ‘classic’ Case III coupling reflector, i.e. where a single focusing curved mirror reflects directly back into the same waveguide, the focusing mirror has a radius curvature R and is placed at a distance Z=R/2 from the end of the waveguide. This value of R is the optimum for maximum coupling of the fundamental, lowest-loss waveguide mode, EH11, back into the waveguide, while maximizing discrimination against the efficient coupling of higher-order, lower beam quality modes back into the waveguide. The value of R as calculated in “The Waveguide Laser: A Review”, J. Degnan, Applied Physics, vol. 11, pp. 1 33, (1976) coincides with α=2.415 for circular-bore waveguides and approximately the same for square-bore and slab waveguides, where α=ka2/R, where ‘a’ is the waveguide bore half-width and k=2π/λ, where λ is the laser wavelength. The various relations are therefore as follows: Z=d1+h+d2 R3=Z/2 R3=COS(45°)R1×R2/(R1+R2) CASE III: d1=d2=(R3/2−h)/2 R3=ka2/αIII k=2π/λ αIII=2.415 For example, with a bore size 2a=1.75 mm at a laser wavelength λ=10.6 μm the radius of curvature R is 188 mm, placed a distance 94 mm from the end of the waveguide. However, if the intent is to couple a waveguide mode in the Case III configuration from one waveguide to another above or below using a roof-top mirror assembly like the one shown inFIG.1, then the focusing power of R can be shared by two mirrors with equal radii of curvature, R1=R2=2R/cos 45°. For the example above with R1=R2=532 mm and in order to maintain the equivalent spacing of 94 mm from the waveguide to the mirror, for a height, h=30 mm between waveguides, the roof-top mirror elements should be placed at the following distance away from the waveguide ends, d1=d2=(R/2−h)/2=32 mm. The second coupling regime of particular interest is the so-called “Case II” coupling regime, for which in our designs each cavity folding assembly will have an effective radius of curvature, R, equal to approximately the optical path length, Z, of the radiation beam as it traverses the cavity folding assembly during its passage between ones of the slab waveguides. With optimization for either Case III or Case II, the laser may be designed with a particular Z/R in mind, e.g. 0.5 or 1.0 respectively, and then as part of testing after manufacture Z/R may be varied incrementally around the design value to arrive empirically at an optimum performance condition taking account of factors such as good rejection of unwanted modes as well as good coupling of wanted modes. The coupling regimes of Case II and Case III, and also Case I, are further discussed in “Finite-Aperture Waveguide-Laser Resonators”, J. J. Degnan and D. R. Hall, IEEE J. Quantum Electron. QE-9, 901 (1973), the contents of which is incorporated herein by reference. Generally it will be appreciated that for all reflecting and focusing activity in optics, mirror and lens elements are freely substitutable, so that while specific embodiments described in this document are realized with mirrors in principle each specific mirror embodiment will have a lens equivalent. For example a cylindrical lens and planar mirror could be substituted for a cylindrical mirror to achieve the equivalent optical result. FIG.3is a schematic perspective construction drawing of the laser ofFIG.1. The same reference numerals are used as previously for the optical components, with the output coupler mirror2, part of the fold mirror22aand fold mirrors22cand22dbeing visible. In addition, the laser enclosure26is visible which is essentially a metal (or metallic) box or housing that represents electrical ground. The enclosure26has an upper plate28which acts as an upper, ground RF electrode, and a lower plate30, which acts as a lower, ground RF electrode. Also visible are upper and lower internal electrodes32and34arranged within the enclosure26which each in use receive a drive voltage to discharge an RF electrical current across the vertical gaps between the electrodes, these vertical gaps being the previously mentioned vertical gaps of thickness ‘t’ defining the vertical, mode-confining dimension of the hybrid slab waveguides10a,10b,10c. The electrodes32,34define the waveguides10a,10b,10cand their dimensions in width ‘w’, height ‘t’ and length ‘l’. The electrical design is discussed in more detail further below. Before that, we discuss the optical design in more detail. As will be understood a slab waveguide of the one-sided negative-branch hybrid-unstable type has different waves propagating in each direction in respect of the free-space modes that exist across the slab width, namely a converging wave and a diverging wave. The properties of these converging and diverging waves are now described in more detail. From a geometric optics beam propagation resonator model, the confocal unstable resonator intracavity mode is comprised of a diverging wave that becomes a plane wave after reflecting off the rear mirror, extending the full width of the mirror equaling the width of the waveguide slab, then propagating along the optical axis towards the front mirror. For the one-sided unstable resonator, a portion of this plane wave exits the resonator in the gap between one extreme of the slab width on one side and the edge of the front mirror, thus forming the top-hat intensity profile near-collimated laser output beam. The remainder of the plane wave incident on the output mirror between the output edge and the other extreme of the slab width forms a converging wave upon reflection. For the negative-branch unstable resonator the converging wave comes to a focus at the confocal point in-between the rear and front resonator mirrors. After passing through the focus the converging wave becomes the diverging wave and propagates along the optical axis to the rear mirror, thus completing the resonator round-trip. Once the output edge diffraction effects are incorporated into the beam propagation resonator model, the intracavity resonator mode and the nominally top-hat intensity output mode are modified to include non-uniform intensity profiles and non-planar or non-spherical phase fronts. For hybrid unstable-waveguide resonators, the free-space resonator modes supported in the slab width dimension are predominantly determined by the curvatures of the end mirrors along the width dimension, while the resonator mode in the slab height dimension is limited to a combination of waveguide modes, typically predominantly the fundamental EH11 resonator mode plus several higher-order waveguide modes. While the unstable resonator free-space beam intensity and phase information is propagated directly from the rear resonator mirror to the front resonator mirror in the slab width dimension, in the slab height dimension the end mirrors and fold mirrors couple resonator mode light to their respective waveguide ends but do not control or impress a phase-front curvature on the waveguide modes directly. Outside of the waveguide slab in-between the end of the waveguide and the waveguide end mirrors and in-between the end of the waveguide and the fold mirrors; the waveguide modes couple into free-space modes and then back into waveguide modes upon reentering the waveguide and the adjacent waveguide, respectively. FIGS.4A,4B and4Care top, side and perspective views of the laser ofFIG.1. InFIG.4A, the top part of the enclosure is ‘removed’ to make visible the spatial extent of the converging wave.FIG.4Bis a side view shown for reference.FIG.4Cis a perspective view with the enclosure and the upper electrode ‘removed’, i.e. made invisible. Referring toFIG.4A, in the uppermost waveguide, the converging mode fills the full width of the output coupler2at the left-hand end of the upper waveguide10aand then tapers to fill perhaps only a quarter of the width of the upper fold mirror assembly20a. Referring now toFIG.4C, the converging wave tapers further after leaving the fold assembly20aand reaches a focus ‘F’ approximately half way along the middle waveguide10b. By the time the converging wave reaches the fold assembly20bit has a width similar to that at the fold assembly20a. In the lower waveguide10c, the converging wave then becomes increasingly wider from left to right and fills approximately the full width of the end reflector4as can be seen on the right-hand side of bothFIG.4AandFIG.4C. FIGS.4D and4Eare bottom and side views of the laser ofFIG.1. InFIG.4D, the bottom part of the enclosure is ‘removed’ to show the spatial extent of the diverging wave propagating in the laser cavity. As can be seen the diverging wave fills the whole width of each of the waveguides10a,10b,10c. From these figures, the output beam5can also be seen as it emerges from one side of the output coupler which by way of example is shown as a hard-edge mirror. What is shown for the focus of the converging wave approximately mid-way along the middle waveguide is a specific example of a desirable feature. Expressed more generally this feature is that the end cavity mirrors and the cavity folding assemblies are jointly configured such that the free space modes come to a focus part way along one of the slab waveguides. In particular, the resonator may be configured such that the free space modes come to a focus near the middle, i.e. near midway, along one of the slab waveguides. One natural way to achieve this is to have an odd number of the slab waveguides. In other words, the number of slabs is 3, 5, 7 etc. Having an odd plural number of slabs, in particular in combination with cavity folding assemblies that are planar reflectors in respect of the free space modes, should avoid potential issues with hybrid-mode lasers that have even numbers of slabs, which will tend to produce a focus of the free space modes coincident with a fold, i.e. such that the free-space-mode focus occurs near a surface of one of the components of the fold optics assemblies, bearing in mind that the free-space-mode focus will correspond to a maximum in power density and thus have the greatest propensity to cause burn out of a mirror surface or a lens surface. FIG.5is a schematic end sectional view of the laser ofFIG.1showing electrical design features. The laser enclosure26forms the outer casing of the device with its upper and lower plates28and30which form the upper and lower ground electrodes. The internal, non-grounded, upper and lower electrodes32and34of width ‘w’ are accommodated within the enclosure26. The enclosure26also provides an enclosed volume14for containing a gaseous gain medium. The whole of the enclosure26may be filled with the gas, or the enclosure may have internal design to confine or concentrate the gas in the waveguides, i.e. between the electrodes where the discharge will take place. The gap of thickness ‘t’ between the upper enclosure plate28and upper internal electrode32form the upper waveguide10aand at the same time the discharge gap across which the RF current will excite the gain medium for population inversion. The gap of thickness ‘t’ between the upper internal electrode32and the lower internal electrode34form the middle waveguide10band at the same time its discharge gap. The gap of thickness ‘t’ between the lower internal electrode34and the lower enclosure plate30form the lower waveguide10cand at the same time its discharge gap. The electrodes are thus arranged so that they are drivable pairwise in use by a radio frequency, RF, drive voltage to discharge an RF electrical current through the gas across each of the upper, middle and lower waveguides10a,10b,10c. Moreover, it will be understood that the gaps also form the beam path passageways. The enclosure26and thus its upper and lower plates28,30forming the ground electrodes are connected to an electrical ground, or constitute the electrical ground. The internal electrodes32,34are connected to an RF drive circuit via respective RF supply lines40,42which are fed through into the enclosure26through respective flanges36and38. The RF supply lines40,42are shielded with shields connected to ground as schematically illustrated, e.g. they are coaxial cables. The RF supply lines40,42are driven offset from each other in phase by 120 degrees by a suitable RF source44. The 120 degree phase shift between the RF voltages results in equal voltage drops of V/3 across each of the three slab waveguide discharge channels, where V is the supply voltage of the RF source44. FIG.6is a schematic circuit diagram of the RF drive of the laser ofFIG.1showing how the gaps #1, #2, #3 across waveguides10a,10band10cbetween the respective electrode pairs28/32,32/34and34/30have equal impedance which results in the equal voltage drop V/3. Typically when a gas discharge is excited between two opposing electrodes in an unbalanced fashion, one ground electrode is at ground potential while the other RF electrode is at an elevated RF voltage, V; thus the voltage V also appears between the RF electrode and other grounded fixtures in the vicinity. This can be problematic when the grounded fixtures, such as the gas envelope enclosure, resonator and fold mirrors can be damaged by a gas discharge that can occur between it and the RF electrode. Also, any unwanted gas discharges outside of the gap in-between the opposing electrodes do not contribute to the laser output power and detract from the RF-to-optical conversion efficiency. When a gas discharge is excited between two opposing electrodes in a balanced fashion, with RF voltages applied to the electrodes out of phase, then the voltages between each electrode and grounded fixtures in the vicinity can be reduced significantly. For example, for two electrodes excited 180-degrees out of phase as described in U.S. Pat. No. 6,137,818, the voltage between each electrode to ground is halved. Extending from this idea, significant voltage-to-ground voltage reductions can be achieved by exciting a plurality of pairs of electrodes sharing common electrodes with RF voltages phased at appropriate fractions of the full 360-degrees unbalanced condition. In some embodiments, the gain medium is a gas. A gas of particular interest is carbon dioxide. Other gases of interest include any suitable molecular or atomic gases, or mixtures thereof, e.g. carbon monoxide, helium, nitrogen. Further, it will be understood that some lasers, in particular gas lasers, are sealed units supplied with the gain medium, e.g. gas, encapsulated in the laser as part of the product as shipped to the customer, whereas other lasers, in particular gas lasers, are shipped without the gain medium. Namely, with a gas laser, the laser may be shipped without the gas and the customer introduces the gas at the time of use, e.g. with appropriate plumbing and gas supply lines. The claims should therefore be understood as not necessarily including the gain medium, but rather only to mean that the waveguides provide a suitable volume for accommodating a gain medium which may or may not form part of the laser unit when not being prepared in use. The embodiment described above has three slab waveguides and two cavity folding assemblies. More generally the design is scalable to any number of vertically offset slab waveguides. The smallest number of waveguides and folds with the present design is two waveguides and one fold. FIG.7is a schematic side sectional view of such an embodiment with two slab waveguides and one fold. Reference numerals correspond to those used in the first embodiment. FIG.8is a schematic side sectional view a laser with four slab waveguides and three folds according to a further alternative embodiment. Reference numerals correspond to those used in the first embodiment. FIG.9is a schematic side sectional view a laser with five slab waveguides and four folds according to a further alternative embodiment. Reference numerals correspond to those used in the first embodiment. Further embodiments can be contemplated with still larger numbers of slab waveguides and cavity folding assemblies. It will be understood that the design is scalable to any number of vertically offset slab waveguides, wherein the number of cavity folding assemblies will be one fewer than the number of slab waveguides. FIG.10shows in schematic side sectional view a laser according to an embodiment with a z-fold in which three slab waveguides are stacked on top of one another with the middle slab tilted at an angle in relation to the upper and lower slabs. The embodiment ofFIG.10is a three slab stack in a z-shaped arrangement with the two cavity folding assemblies redirecting the radiation beam by somewhat less than 180 degrees, i.e. 180−θ, where e.g. 5≤θ≤45 to give a redirection angle of between 135 to 175 degrees. The various relations are therefore as follows: CASE II (for Small θ) d˜R R=ka2/αII k=2π/λ αII=0.593 A particular example would be λ=10.6 μm and 2a=1.75 mm which gives R=d=765 mm. Embodiments with Case II are likely to be more practically sized in typical size laser enclosures for small waveguide heights with corresponding small R and small d, i.e. small ‘a’, since R scales with a2. For the example above with 2a=0.875 mm, R becomes 191 mm; which is similar to the value of R for Case III which is 188 mm for 2a=1.75 mm. Another related example with tilted slabs is a four slab stack in a capital epsilon arrangement, Σ, with three cavity folding assemblies two of which redirect the beam by 180−n degrees and one of which by 180−2n degrees, where ‘n’ is e.g. between 5 and 45 degrees. The z-fold or epsilon-fold arrangement of these embodiments is a less compact configuration than in the previously described embodiments that have all the slabs stacked parallel to each other, since it leads to a thicker laser module in the vertical direction. However, tilting the intermediate slab(s) makes it possible to simplify the fold assemblies, so that a single reflector can be used for each fold assembly. In other words, with a z- or epsilon-type of arrangement, a single mirror can be used to effect each fold, as shown inFIG.10, rather than a pair of mirrors as shown in the earlier embodiments, i.e. so-called apex reflectors can be used instead of so-called roof-top reflectors. Another set of variants on the above designs are those which mix Case II and Case III fold assemblies. Any combination of Case II and Case III fold assemblies is possible, since the coupling between adjacent waveguides at any one fold is independent of the coupling at any other fold. Typically a Case III coupling will have a better mode discrimination than Case II to favor the EH11 mode over higher-order modes. However, if a greater distance, d, is needed in the fold, for example to provide sufficient space to accommodate an additional intracavity component, such as an electro-optical Q-switch, then a Case II coupling will provide a greater distance, d, than a Case III coupling (ceteris paribus—i.e. for the same slab waveguide height and laser wavelength). Also, compared with a Case III fold, the greater fold path distances achieved with a Case II fold results in a longer resonator length, L, which provides for better power stability through the thermally-induced laser power signature, which has a c/2L, where ‘c’ is the speed of light, axial mode frequency spacing sweep over the laser gain profile. REFERENCE NUMERALS 1laser2output coupler mirror4end reflector mirror5output laser beam10a,10b,10c. . . slab waveguides12a,12b,12c. . . slab waveguide planes14gain medium volume16a,16b. . . slab waveguide ends18beam path passageway accommodating gaseous gain medium & slab waveguide discharge gap20a,20b. . . cavity fold assembly22a,22b. . . cavity fold mirrors26laser enclosure (ground RF electrodes)28,30upper and lower enclosure plates (upper and lower ground electrodes)32,34intermediate RF electrodes A & B36,38RF lead flanges40,42RF drive leads44RF sourceZ optical path length in free space between waveguide endsR effective radius of curvature of cavity fold assemblyh slab waveguide z-separationt slab waveguide thicknessl slab waveguide lengthw slab waveguide widthO principal optical axis (beam path) It will be clear to one skilled in the art that many improvements and modifications can be made to the foregoing exemplary embodiment without departing from the scope of the present disclosure. The following numbered clauses relate to further aspects of the disclosure. 1. A laser comprising: a resonator cavity; anda plurality of slab waveguides within the resonator cavity each providing a volume for accommodating a gain medium; andat least one cavity folding assembly configured to direct a radiation beam emitted from one of the slab waveguides into another of the slab waveguides,wherein the slab waveguides are physically arranged above one another in a stack and optically arranged in series through the or each cavity folding assembly,wherein each slab waveguide has a thickness sized to support at least one waveguide mode vertically in the slab waveguide and a width sized to support free space modes horizontally across the slab waveguide, andwherein the or each cavity folding assembly is configured to focus the radiation beam emitted from said one of the slab waveguides by an amount selected to couple at least one of the waveguide modes into said other of the slab waveguides. 2. The laser of clause 1, wherein said at least one of the waveguide modes includes an EH11 mode. 3. The laser of clause 1, wherein the or each or at least one cavity folding assembly is configured to direct without focus the free space modes emitted from said one waveguide into said other waveguide. 4. The laser of clause 1, wherein the or each or at least one cavity folding assembly has an effective radius of curvature, R, equal to approximately twice the optical path length, Z, of the radiation beam as it traverses the cavity folding assembly during its passage between ones of the slab waveguides. 5. The laser of clause 4, wherein the equality R is approximately twice Z is met to within a range selected from the group: Z/R=0.50±0.05, 0.50±0.10, 0.50±0.15 and 0.50±0.20. 6. The laser of clause 1, wherein the or each or at least one cavity folding assembly has an effective radius of curvature, R, equal to approximately the optical path length, Z, of the radiation beam as it traverses the cavity folding assembly during its passage between ones of the slab waveguides. 7. The laser of clause 6, wherein the equality R is approximately equal to Z is met to within a range selected from the group: Z/R=1.00±0.05, 1.00±0.10, 1.00±0.15 and 1.00±0.20. 8. The laser of clause 1, wherein the planes of the slab waveguides are all parallel to one another. 9. The laser of clause 1, wherein at least one of the slab waveguides lies in a plane that is tilted at an acute angle relative to at least one other of the slab waveguides. 10. The laser of clause 8 or 9, wherein at least one of the cavity folding assemblies is configured to redirect the radiation beam through 180 degrees and by a vertical distance corresponding to a vertical offset between the associated slabs which are stacked parallel to each other. 11. The laser of clause 10, wherein each said 180-degree redirecting cavity folding assembly comprises:a first mirror surface portion with a first radius of curvature, R1, and arranged at a horizontal distance, d1, from one of the associated slab waveguides; anda second mirror surface portion with a second radius of curvature, R2, and arranged at a horizontal distance, d2, from the other of the associated slab waveguides,the first and second mirror surface portions being vertically offset by a vertical offset, h, between the associated slab waveguides,wherein the optical path length, Z is the sum of d1, h and d2. 12. The laser of clause 11, wherein R1is approximately equal to R2. 13. The laser of clause 12, wherein d1is approximately equal to d2and the first and second mirror portions each reflect light through approximately 90 degrees. 14. The laser of clause 1, wherein there are two of said slab waveguides and one of said cavity folding assemblies. 15. The laser of clause 1, wherein there are three of said slab waveguides and two of said cavity folding assemblies. 16. The laser of clause 1, wherein there are four of said slab waveguides and three of said cavity folding assemblies. 17. The laser of clause 1, wherein the resonator cavity is bounded by first and second cavity end mirrors. 18. The laser of clause 17, wherein each slab waveguide has first and second ends, whereinone of the slab waveguide ends is associated with the first cavity end mirror,another of the slab waveguide ends is associated with the second cavity end mirror, andthe remaining slab waveguide ends are arranged in one or more pairs, each of which is associated with one of said cavity folding assemblies. 19. The laser of clause 17, wherein the first and second cavity end mirrors and the or each cavity folding assembly are jointly configured such that the free space modes come to a focus part way along one of the slab waveguides. 20. The laser of clause 19, wherein there is an odd number of the slab waveguides. 21. The laser of clause 1, wherein the gain medium is a gas and the laser further comprises electrodes which are drivable pairwise in use by a radio frequency, RF, drive voltage to discharge an RF electrical current through the gas. 22. The laser of clause 21, wherein an electrode is arranged between each slab waveguide, as well as above the uppermost one of the slab waveguides and below the lowermost one of the slab waveguides, such that there is a gap between vertically adjacent electrodes across which the RF electrical current can be discharged through the gas. 23. The laser of clause 22, wherein the electrodes above the uppermost one of the slab waveguides and below the lowermost one of the slab waveguides are electrically connected, so that in use they can both be maintained at electrical ground. 24. The laser of clause 21, wherein the gas is carbon dioxide. The following numbered clauses relate to still further aspects of the disclosure. 1. A laser comprising: a resonator cavity;first, second and third beam path passageways within the resonator cavity each providing a volume for accommodating a gaseous gain medium;first and second cavity folding assemblies, the first cavity folding assembly being configured to direct a radiation beam emitted from the first passageway into the second passageway and the second cavity folding assembly being configured to direct a radiation beam emitted from the second passageway into the third passageway, wherein the beam path passageways are physically arranged above one another and optically arranged in series through the first and second cavity folding assemblies; anda plurality of RF-drive electrodes comprising: a first electrode arranged above the first beam path passageway; a second electrode arranged between the first and second beam path passageways; a third electrode arranged between the second and third beam path passageways; and a fourth electrode arranged below the third beam path passageway. 2. The laser of clause 1, wherein the first and fourth electrodes are connected to an electrical ground and wherein the laser further comprises an RF drive circuit connected to the second and third electrodes and operable to apply: a first RF drive voltage the second electrode; and a second RF drive voltage to the third electrode with a 120 degree phase shift to the first RF drive voltage, so that an equal voltage drop is applied across each of the first, second and third passageways. 3. The laser of clause 2, wherein the first and fourth electrodes form part of a common, electrically conducting housing. 4. The laser of clause 1, further comprising an RF drive circuit operable to generate an RF drive voltage and connected to apply the RF drive voltage to the second and third electrodes with the 120 degree phase shift. 5. The laser of clause 1, wherein the beam path passageways are waveguides. 6. The laser of clause 5, wherein the waveguides are slab waveguides. 7. The laser of clause 6, wherein the slab waveguides are arranged above one another in a stack. 8. The laser of clause 6, wherein the slab waveguides are arranged in a common plane. 9. The laser of clause 1, wherein the resonator cavity is bounded by first and second cavity end mirrors. | 38,363 |
11942754 | DETAILED DESCRIPTION In order that the present invention may be more clearly described, the present invention will be further described with reference to the preferred embodiment and the accompanying drawings. Similar components are designated by the similar reference numerals in the drawings. It will be appreciated by those skilled in the art that the following detailed description is illustrative and not restrictive, and should not be taken to limit the scope of the invention. As shown inFIG.1, an embodiment of the present invention provides a driving current correction method for multiple laser devices, including:in a projection period of the n-th pixel point (n is a positive integer):sequentially driving a plurality of laser devices of a laser source to emit lasers, and respectively detecting light intensity information of the lasers emitted from the plurality of laser devices by a light sensor;acquiring an actual light intensity of the lasers emitted from the plurality of laser devices according to an electric signal output by the light sensor, and establishing a corresponding relation between the driving current and the actual light intensity of the each laser device according to the driving current of the each laser device and the actual light intensity of laser emitted from the each laser device when the n-th pixel point is projected;from a projection of the (n+1)-th pixel point:correcting the driving current of the each laser device according to a set light intensity of the each laser device and the corresponding relation between the driving current and the actual light intensity of the each laser device. Wherein, when sequentially driving the plurality of laser devices of the laser source to emit lasers in a projection period of one pixel point, the 1stlaser device may be driven to emit laser first, and then the 2ndlaser device may be driven to emit laser while the 1stlaser device is stopped, and so on. In this case, the light intensity information detected by the light sensor is light intensity information of the lasers emitted from the plurality of laser devices sequentially. Alternatively, the 1stlaser device may be driven to emit laser first, then the 2ndlaser device may be driven to emit laser (in this case, the 1stlaser device is not stopped, that is, the 1stand the 2ndlaser devices are simultaneously driven to emit laser), and so on. Since the light intensity of the laser emitted from a single laser within a projection period of a single pixel point is unchanged, in this case, the light intensity information detected by the light sensor sequentially is the light intensity information of the laser emitted from the 1stlaser device, the sum of the light intensity information of the laser emitted from the 1stlaser device and the light intensity information of the laser emitted from the 2ndlaser device, and so on. In subsequent steps, the actual light intensity of the lasers emitted from the plurality of laser devices during the projection period of this pixel point can be obtained directly by a simple proportional relationship corresponding relation. For example, in the projection period of the 1stpixel point, five laser devices of the laser source are sequentially driven to emit laser, and the actual light intensities of lasers emitted from the 1stto 5thlaser devices are 1 A, 1.5 A, 2 A, 1.3 A, and 1.6 A, respectively, and the light intensity information of the lasers emitted from the five laser devices is detected in real time by the light sensor at the same time; the actual light intensities of the lasers emitted from the five laser devices are obtained according to the electrical signals output by the light sensor, in which the driving currents of the 1stto 5thlaser devices are 25 cd, 30 cd, 55 cd, 48 cd, and 50 cd, respectively; and a corresponding relation between the driving current of the each laser device and the actual light intensity is established, in which the corresponding relation between the driving currents of the 1stto 5thlaser devices and the actual light intensities is 1 A-25 cd, 1.5 A-30 cd, 2 A-55 cd, 1.3 A-48 cd, and 1.6 A-50 cd, respectively, and the corresponding relation between the driving currents of the laser devices and the actual light intensities is a linear relationship; andin the projection period of the 2ndpixel point: the driving currents of the 1stto the 5thlaser devices determined from the laser driving signals when the 2ndpixel point is projected are corrected based on the set light intensities of the 1stto the 5thlaser devices and the corresponding relation between the driving currents and the actual light intensities of the 1stto the 5thlaser devices when the 2ndpixel point is projected. According to the driving current correction method for multiple laser devices provided in the present embodiment, by controlling timing of the driving current of each laser device so that the each laser device successively emits a laser in the projection period of one pixel point, it is possible to correct the driving currents of a plurality of laser devices by using only one light sensor that detect light intensity information, using fewer optical devices, simple optical path and lower cost, and the correction of the driving currents for the plurality of laser devices is easy to implement and has high consistency of detecting light intensity information. It should be noted that since the scanning frequency of the laser projection is very high and the projection period of a single pixel point is very short, in the present embodiment, the emitting period of one laser device is very short in the projection period of one pixel point and a whole projection image can be seen by a human eye, one cannot perceive the projection process from pixel to pixel, and not even the laser emitting process from laser device to laser device. In some alternative implementations of the present embodiment, the method provided in the present embodiment further includes: amending an existing corresponding relation between a driving current and an actual light intensity of each laser device according to a driving current of each laser device and an actual light intensity of laser emitted from the each laser device when a current pixel point is projected, from the projection of the (n+1)-th pixel point. For example, in the projection period of the 1stpixel point, a corresponding relation between the driving current and the actual light intensity of each laser device is established; from the projection of the 2ndpixel point, the driving current of each laser is corrected according to the set light intensity of the each laser device and the corresponding relation between the driving current and the actual light intensity of the each laser device in the projection period of each pixel point, and the existing corresponding relation between the driving current and the actual light intensity of each laser device is amended according to the driving current and the actual light intensity of the each laser device when the current pixel point is projected. The correction may be performed by means of a mean value, a minimum variance, or the like. As the corresponding relation between the driving current and the actual light intensity of each laser device is constantly amended, the accuracy of the correction of the driving current becomes higher and higher. In some alternative implementations of the present embodiment, within the projection period of each pixel point, the length of the period in which each laser device emits the laser is the same. Further, there is a time interval of equal-length between adjacent periods of the lasers emitted from each laser device in the projection period of each pixel point. For example, as shown inFIG.2, in the projection period of one pixel point, the waveforms of the driving currents of the 1stto 5thlaser devices are 201 to 205, respectively, and the 1stto 5thlaser devices sequentially emit lasers at fixed time intervals. In this way, it is easy to implement control when the actual light intensities of the lasers emitted from the plurality of laser devices are obtained according to the electrical signals output by the light sensor while respectively detecting the light intensity information of the lasers emitted from the plurality of laser devices. It can also avoid mutual interference between the lasers emitted from the plurality of laser devices due to the influence of factors such as the accuracy of laser driving timing. And the accuracy of the actual light intensity obtained can be ensured. In some alternative implementations of the present embodiment,the respectively detecting the light intensity information of the lasers emitted from the plurality of laser devices by using the light sensor further includes: splitting the laser emitted from each laser device after optical paths being combined into a first laser for detecting and a second laser for projection, and detecting the light intensity information of the first laser by using the light sensor; andthe acquiring the actual light intensity of the lasers emitted from the plurality of laser devices according to the electric signal output by the light sensor further includes: calculating the actual light intensity of the laser emitted from the each laser device according to the electric signal output by the light sensor and a beam splitting ratio. In some alternative implementations of the present embodiment, calculating the actual light intensity of laser emitted from each laser device according to the electrical signal output by the light sensor and the beam splitting ratio further includes:calculating the actual light intensity of the laser emitted from the each laser device according to a pre-acquired corresponding relation between the electric signal output by the light sensor and a light intensity, the electric signal output by the light sensor, and the beam splitting ratio. Here, the corresponding relation between the electric signal output by the light sensor and the light intensity can be obtained by a pre-test of the light sensor. In some alternative implementations of the present embodiment, the light intensity of the first laser after splitting the laser emitted from each laser device after optical paths being combined is much less than the light intensity of the second laser. In this way, the influence of the beam splitting on the laser for projection may be reduced, and the quality of the laser projection picture may be ensured. Another embodiment of the present invention provides a driving current correction apparatus for multiple laser devices, including:a laser driver that sequentially driving a plurality of laser devices of a laser source to emit laser in a projection period of a single pixel point;a light sensor that respectively detects light intensity information of the lasers emitted from the plurality of laser devices;a data processor that, in a projection period of a n-th pixel: sequentially drives the plurality of laser devices of a laser source to emit lasers, and respectively detects the light intensity information of the lasers emitted from the plurality of laser devices by using the light sensor; acquires an actual light intensity of the lasers emitted from the plurality of laser devices according to the electric signal output by the light sensor, and establishes a corresponding relation between a driving current and an actual light intensity of each laser device according to the driving current of the each laser device and the actual light intensity of the laser emitted from the each laser device when the n-th pixel point is projected; generates and transmits a driving current correction signal to the laser driver according to the set light intensity of each laser device and the corresponding relation between the driving current and the actual light intensity of the each laser device from the projection of the (n+1)-th pixel point; anda memory that stores the corresponding relation between the driving current and the actual light intensity of the each laser device. It will be appreciated that the memory may be an integrated local memory device, or an extended memory device, such as a pluggable memory card, which is not specifically limited in the present embodiment. According to the driving current correction apparatus for multiple laser devices provided in the present embodiment, by controlling timing of the driving current of each laser device so that the each laser device successively emits a laser in the projection period of one pixel point, it is possible to correct the driving currents of a plurality of laser devices by using only one light sensor that detects light intensity information, using fewer optical devices, simple optical path, and lower cost, and the correction of the driving currents for the plurality of laser devices is easy to implement and has high consistency of detecting light intensity information. In some alternative implementations of the present embodiment, the data processor in the apparatus of the present embodiment amends an existing corresponding relation between a driving current and an actual light intensity of each laser device according to a driving current of each laser device and an actual light intensity of laser emitted from the each laser device when a current pixel point is projected, from the projection of the (n+1)-th pixel point. Here, the data processor may implement the correction by means of a mean value, a minimum variance, or the like. As the data processor constantly amends the corresponding relation between the driving current and the actual light intensity of each laser device, the accuracy of the data processor in correcting the driving current becomes higher and higher. In some alternative implementations of the present embodiment, within the projection period of each pixel point, the length of the period in which each laser device emits the laser is the same. Further, there is a time interval of equal-length between adjacent periods of lasers emitted from each laser device in the projection period of each pixel point. In this way, it is easy to implement control when the actual light intensities of the lasers emitted from the plurality of laser devices are obtained according to the electrical signals output by the light sensor while respectively detecting the light intensity information of the lasers emitted from the plurality of laser devices. It can also avoid mutual interference between the lasers emitted from the plurality of laser devices due to the influence of factors such as the accuracy of the laser driving timing. And the accuracy of the actual light intensity obtained by the light sensor can be ensured. In some alternative implementations of the present embodiment, the apparatus provided in the present embodiment further includes:a beam splitter that splits the laser emitted from each laser device301after optical paths being combined into a first laser for detecting and a second laser for projection, the light sensor detects the light intensity information of the first laser; anda data processor for calculating the actual light intensity of the laser emitted from the each laser device according to the electric signal output by the light sensor and a beam splitting ratio. In some alternative implementations of the present embodiment,the memory further stores a pre-acquired corresponding relation between the electric signal output by the light sensor and the light intensity;the data processor is configured to calculating the actual light intensity of the laser emitted from the each laser device according to the corresponding relation between the electric signal output by the light sensor and the light intensity, the electric signal output by the light sensor, and the beam splitting ratio. Here, the corresponding relation between the electric signal output by the light sensor and the light intensity can be obtained by a pre-test of the light sensor by a test system. In some alternative implementations of the present embodiment, the light intensity of the first laser after being split by the beam splitter in the apparatus of the present embodiment is much less than the light intensity of the second laser. In this way, the influence of the beam splitting on the laser for projection may be reduced, and the quality of the laser projection picture may be ensured. As shown inFIG.3, another embodiment of the present invention provides a laser projector that includes a laser source including a plurality of laser devices301, a shaping collimator corresponding to the plurality of laser devices301, a beam combiner302, and a shaper303; a driving current correction apparatus for a multiple laser devices including a laser driver (not shown in the figure), a data processor (not shown in the figure), a memory (not shown in the figure), a beam splitter306which is disposed between the beam combiner302and the shaper303, and a light sensor307; and a MEMS micromirror113which is disposed on the output light path of the laser source. The beam splitter306is disposed between the beam splitter302and the shaper303, in this case, the light sensor307is located on the first output light path of the beam splitter306and the shaper303is located on the second output light path of the beam splitter306. The shaping collimator is used to shape the spot size of the laser emitted from each laser301and collimate the laser. The shaper303is used to shape the spot size of the laser incident on the shaper303through the beam splitter306. The beam splitter may also be provided on the output light path (not shown inFIG.3) of the shaper for shaping the spot size of the laser incident on the shaper after being combined the light path by the beam splitter. The light sensor is located on the first output light path of the beam splitter, and the laser of the second output light path of the beam splitter serves as an output beam of the laser source. Taking the beam splitter306being disposed between the beam combiner302and the shaper303as an example, the beam splitter306splits the laser beam after being combined by the beam combiner302into two beams, one of which enters the light sensor307and the other enters the shaper303. The spot size of the other beam is shaped through the shaper303and then serves as the output laser of the laser source. The output laser of the laser source is projected onto the MEMS micromirror113so that an image can be projected on the projection screen. A laser driver sequentially drives a plurality of laser devices301of a laser source to emit laser in a projection period of a single pixel point. A beam splitter306splits the laser emitted from each laser device301after optical paths being combined into a first laser for detecting and a second laser for projection, the light sensor307detects the light intensity information of the first laser. A light sensor307respectively detects light intensity information of the lasers emitted from the plurality of laser devices301. A data processor: in the projection period of the n-th pixel, calculates the actual light intensity of acquired laser emitted from the plurality of laser devices301according to the electric signal output by the light sensor307and a beam splitting ratio, and establishes a corresponding relation between a driving current and an actual light intensity of each laser device301according to the driving current of the each laser device301and the actual light intensity of the laser emitted from the each laser device301when the n-th pixel point is projected; generates and transmits a driving current correction signal to the laser driver according to the set light intensity of the each laser device301and the corresponding relation between the driving current and the actual light intensity of the each laser device301from the projection of the (n+1)-th pixel point. A memory stores the corresponding relation between the driving current and the actual light intensity of the each laser device301. According to the laser projector provided in the present embodiment, by controlling timing of the driving current of each laser device301so that the each laser device301successively emits a laser in the projection period of one pixel point, it is possible to correct the driving currents of the plurality of laser devices301by using only one light sensor307that detects light intensity information, using fewer optical devices, simple optical path, and lower cost, and the correction of the driving currents for the plurality of laser devices is easy to implement and has high consistency of detecting light intensity information. In some alternative implementations of the present embodiment, the data processor amends an existing corresponding relation between a driving current and an actual light intensity of each laser device301according to the driving current of the each laser device301and the actual light intensity of the laser emitted from the each laser device301when the current pixel point is projected, from the (n+1)-th pixel point of the projection. Here, the data processor may implement the correction by means of a mean value, a minimum variance, or the like. As the data processor constantly amends the corresponding relation between the driving current and the actual light intensity of each laser device301, the accuracy of the data processor in correcting the driving current becomes higher and higher. In some alternative implementations of the present embodiment, within the projection period of each pixel point, the length of the period in which each laser device301emits the laser is the same. Further, there is a time interval of equal-length between adjacent periods of the laser emitted from each laser device in the projection period of each pixel point. In this way, it is easy for the data processor to implement control when the actual light intensity of the lasers emitted from the plurality of laser devices301is obtained according to the electrical signals output by the light sensor307while respectively detecting the light intensity information of the lasers emitted from the plurality of laser devices301. It can also avoid mutual interference between the lasers emitted from the plurality of laser devices301due to the influence of factors such as the accuracy of the laser driving timing. And the accuracy of the actual light intensity obtained by the data processor can be ensured. In some alternative implementations of the present embodiment,the memory further stores a pre-acquired corresponding relation between the electric signal output by the light sensor307and the light intensity;the data processor is configured to calculating the actual light intensity of laser emitted from the each laser device301according to the corresponding relation between the electric signal output by the light sensor307and the light intensity, the electric signal output by the light sensor307, and the beam splitting ratio. Here, the corresponding relation between the electric signal output by the light sensor307and the light intensity can be obtained by a pre-test of the light sensor307by a test system. In some alternative implementations of the present embodiment, the light intensity of the first laser after being split by the beam splitter306is much less than the light intensity of the second laser. In this way, the influence of the beam splitting on the laser for projection may be reduced, and the quality of the laser projection picture may be ensured. That is, the light intensity of the beam incident on the light sensor307after passing through the beam splitter306is much less than the light intensity of the beam incident on the beam splitter306. Similarly, taking the beam splitter306being disposed between the beam combiner302and the shaper303as an example, the light intensity of the beam incident on the light sensor307after passing through the beam splitter306is much less than the light intensity of the beam incident on the beam splitter306, that is, the beam splitter306splits the laser beam after being combined by the beam combiner302into two beams, and the light intensity of one laser beam incident on the light sensor307is much less than the light intensity of the other laser beam incident on the shaper303. In a specific implementation, taking each laser301emitting P-state polarized light as an example, the light intensity of the beam of the first light path from the beam splitter306is about 0.8% of the sum of the light intensities of the beam of the first optical path and the beam of the second optical path from the beam splitter306. In some alternative implementations of the present embodiment, the beam splitter306is flat glass and the incident angle of the beam incident on the flat glass is 45°±20°. When the beam passes through the flat glass, a small part of the beam is reflected, and the light intensity of the reflected small part of the beam accounts for about 0.8% of the total light intensity. Therefore, by transmitting the reflected light on the surface of the flat glass that is not plated with a high-transmittance film into the light sensor307and transmitting the transmission light into the shaper303, the beam splitting requirement of the present embodiment can be achieved and the beam splitting proportion requirement of the present embodiment is basically met. In addition, since the reflection ratio of the flat glass is related to the incident angle of the incident beam, in this embodiment, the incident angle of the beam to be incident on the flat glass is 45°±20°. The incident angle of the flat glass 45°±20° may be achieved by adjusting the position or angle between the beam combiner302or the shaper303and the flat glass. It should be noted that the spectral performance (or reflection performance) of the flat glass is related to the polarization state of the laser and has nothing to do with the wavelength of the laser. If the beam splitter306does not use flat glass, but uses other forms such as plated optical elements or the like, since the operating temperature of each laser device301and its packaging environment will increase after the each laser device301is driven to emit laser or after the laser projector starts to work, then, the center wavelength of the laser emitted from the each laser device301will change. Using other forms of beam splitter306, such as plated optical components or the like, because of the plating, changes in the wavelength of the laser emitted from each laser device301due to changes in the operating temperature will cause changes in the spectral performance of the beam splitter306, thereby affecting the accuracy of the data processor in obtaining the actual light intensity. Therefore, the effect of temperature drift can be eliminated by using flat glass as the beam splitter306. The data processor calculates the actual light intensity of laser emitted from each laser device301according to the corresponding relation between the electric signal output by the light sensor307and the light intensity, the electric signal output by the light sensor307, and the beam splitting ratio with high accuracy. In some alternative implementations of the present embodiment, one of the surfaces of the flat glass is plated with a high-permeability film. Since only one surface is required for reflection, the other surface may be plated with a high-transparency film to reduce the light intensity loss of the laser emitted from the laser source, that is, the light intensity loss of the laser used for projection is reduced. In some alternative implementations of the present embodiment, the light sensor307is a photodiode (Photo Diode). In a case where the normal operating range of the photodiode defines that the intensity value of its detected light intensity is small, the driving current correction apparatus for the multiple laser devices further includes a laser attenuator308disposed between the beam splitter307and the photodiode. In this case, when calculating the actual light intensity of the laser emitted from each laser device301by the data processor, it is only necessary to make a corresponding calculation is made based on the attenuation multiple of the light intensity by the laser attenuator308. In some alternative implementations of the present embodiment, the shaping collimator includes a plurality of shaping collimators309corresponding to the plurality of laser devices301. In some alternative implementations of the present embodiment, the plurality of laser devices301emit P-state polarized light or S-state polarized light respectively, thereby facilitating the fabrication of the plurality of laser devices301, for example, facilitating the routing of input driving signals of the plurality of laser devices301. In some alternative implementations of the present embodiment, the plurality of laser devices301include a green light laser device, a blue light laser device, and two red light laser devices, and a wave plate310disposed between the shaping collimator corresponding to one of the two red light laser devices and the beam combiner302. Since a red light laser devices is relatively sensitive to the operating temperature, when the operating temperature is between 50° C. to 60° C., its light output efficiency is only about 65% of the light output efficiency in the operating temperature between −10° C. to 40° C. Therefore, with two red light laser devices, it is possible to reduce the power of a single red light laser device while ensuring the overall red light intensity of the laser source, thereby reducing the operating temperature of the single red light laser device and the operating temperature in its packaging environment. In addition, even if the operating temperature is relatively high, and the light output efficiency of the red light laser device decreases, the two red light laser devices can ensure the overall red light intensity of the laser source to avoid color distortion of the projected image due to the increase in operating temperature and the decrease in the overall red light intensity of the laser source. When two red light laser devices are used, since the wavelengths of the lasers emitted from the two red light laser devices are the same, while the wave plate310disposed between the shaping collimator corresponding to one of the two red light laser devices and the beam combiner302changes the polarization state of the laser or sets the angle of beam directions of the two red light laser devices to 90°, the beam combiner302can achieve beam combining (the principle of the beam combiner302in this embodiment realizes the beam combining of different wavelength lasers is: if each “45° angle bevel mirror” corresponding to the laser device301in the combiner302shown inFIG.3is coated with an optical film, which only reflects laser beams of certain specific wavelengths and polarization states, and transmits other laser beams, the combiner302combines the laser beams with different wavelengths through the optical film). Herein, the wave plate310is preferably a half-wave plate. In some alternative implementations of the present embodiment, the plurality of laser devices301further include an infrared laser device that may cooperate with other devices to perform functions such as touch control, feedback, and distance measurement or the like when the laser projector is a touch-control laser projector. In specific implementation, this embodiment does not limit the arrangement of the infrared laser device, the green light laser device, the blue light laser device, and the two red light laser devices. In the case of side-by-side arrangement from left to right as shown inFIG.3, the infrared laser device, the red light laser device, the red light laser device, the green light laser device, and blue light laser device may be arranged in order from left to right, they may also be arranged in order from left to right as the blue light laser device, the green light laser device, the red light laser device, the red light laser device, the infrared laser, etc. In some alternative implementations of the present embodiment, the laser source further includes a light source housing, in which an inner cavity formed by the light source housing accommodates a plurality of laser devices301, a shaping collimator, a beam combiner302, a shaper303, a beam splitter306, a photo-sensor307, a laser attenuator308, and a wave plate310. The light source housing is provided with a light outlet. That is, the beam splitter306, the photo-sensor307, and the laser attenuator308in the driving current correction apparatus for multiple laser devices are accommodated in the inner cavity formed by the light source housing together with the devices of the laser source. The laser projector according to the present embodiment further includes a device cover plate312and a device substrate, in which the device cover plate312and the device substrate cooperate to form a device housing, the laser source and the MEMS micromirror313are housed in an inner cavity of the device housing, the MEMS micromirror313is disposed on an light path of the laser source, the device housing is provided with an light outlet, and the light output of the MEMS micromirror313is emitted from the light outlet formed on the device housing. In this way, since the above-mentioned devices are encapsulated in an inner cavity formed by a light source housing independent of the MEMS micromirror113, if the size of the laser projector needs to be adjusted, the device housing of the laser projector can be directly operated when the position of the light source housing is not involved, and the light source housing can ensure the sealing and dustproof property of the devices in the inner cavity thereof. In some alternative implementations of the present embodiment, the laser source further includes a thermistor311housed in the cavity formed by the light source housing, the thermistor311is adapted to detect the temperature in the cavity formed by the light source housing, and may monitor the temperature in cooperation with other devices. In some alternative implementations of the present embodiment, the light source housing includes a substrate304and a light source cover plate305, the substrate304and the light source cover plate305cooperate to form the light source housing, and the above-mentioned devices are fixed on the substrate304. The substrate304and the light source cover plate305may be connected in various forms such as buckling. The substrate304may form, on its top surface, a convex annular enclosure which is connected to the light source cover plate305to form an interior cavity; the interior cavity may also be formed by using a removable annular enclosure together with the substrate304and the light source cover plate305. The optional connection manner between the device cover plate312and the device substrate is similar to that between the light source cover plate305and the substrate304described above, and details are not described herein. In addition, the device substrate and the substrate304forming the light source housing may be one substrate, i.e., the device substrate is the substrate304, and the substrate304and the light source cover plate305cooperate to form the light source housing, and the substrate304and the device cover plate312cooperate to form the device housing. In some alternative implementations of the present embodiment, the light outlet of the device housing is provided with a full lens315. The full-transmission lens315, which may also be referred to as a window glass, may ensure the sealability of the device housing. In some alternative implementations of the present embodiment, the laser projector provided in the present embodiment further includes a reflector314housed in the inner cavity of the device housing and disposed between the laser source and the MEMS micromirror313. If the projection direction needs to be adjusted, the device cover plate312may be opened, and the angle at which the laser source enters the MEMS micromirror313may be adjusted by adjusting the position or the reflection direction of the mirror314. In the description of the present invention, it is to be noted that orientation or position relationship referred by the terms of “upper”, “below” or the like is based on the orientation or positional relationship shown in the drawings, and is just to facilitate the description of the present invention and simplify the description, rather than indicating or implying that the device or element has a specific orientation and is constructed and operated in a specific orientation. Thus, it cannot be understood as a limitation to the present invention. Unless otherwise clearly specified and defined, the terms “install”, “connect”, and “coupled” should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, also can be an electrical connection; it can be directly connected, or it can be indirectly connected through an intermediary, or it can be a connection between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations. It should also be noted that in the description of the present invention, relational terms such as first and second and the like are used merely to distinguish one entity or operation from another entity or operation, without necessarily requiring or implying any such actual relationship or order between such entities or operations. Moreover, the terms “include” “comprise” or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or also includes elements inherent to such process, method, article, or apparatus. Without more limitations, for the elements defined by the sentence “include a . . . ”, it does not exclude that there are other identical elements in the process, method, article or apparatus that includes the elements. Obviously, the above-described embodiments of the present invention are merely illustrative of the present invention and are not intended to limit the embodiments of the present invention. Those skilled in the art, on the basis of the above description, will be able to make other modifications or variations, which are not intended to be exhaustive of all the embodiments. Obvious modifications or variations derived from the solutions of the present invention will fall within the scope of the present invention. | 38,894 |
11942755 | DESCRIPTION OF EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. Note that components common throughout the drawings of this specification are denoted by the same reference signs, and description of such components will be omitted as appropriate. Configuration of First Embodiment FIG.1is a block diagram illustrating a configuration of an optical transmission system according to a first embodiment of the present invention. An optical transmission system10A illustrated inFIG.1is different from the optical transmission system10(FIG.15) of related art in the following respects. The optical transmission system10A measures a bit error rate (BER) of a received signal by using transponder units22ato22non a receiving side, and feeds the BER back to a transmitting side. The feedback is performed via optical fibers14. In addition, the optical transmission system10A is different from the optical transmission system10of the related art in that control of shifting the center frequency of laser light is performed in transponder units21ato21non the transmitting side so that the fed back BER is minimized. For the sake of such a configuration, the optical transmission system10A includes a transmission unit22and a reception unit23(described later) in each of the transponder units21ato21nand22ato22non the transmitting side and the receiving side, respectively. As illustrated inFIG.2, the transmission unit22converts input information signals30aand30bbeing incoming electric signals transmitted from a communication apparatus (not illustrated) to an optical signal40, and transmits the converted optical signal40to the optical fibers14. The transmission unit22includes encoder units31aand31b, digital/analog conversion units (D/As)32a,32b,32c, and32d, a laser light source34, an optical branch unit35, quadrature modulation units36aand36b, a polarization synthesis unit37, and a frequency shift control unit61(also referred to as a control unit61) constituting a characteristic element of the present invention. Note that the optical fibers14constitute an optical transmission line as recited in claims. The frequency shift control unit61constitutes a control unit as recited in claims. As illustrated inFIG.3, the reception unit23converts the incoming optical signal40transmitted through the optical fibers14into output information signals54aand54bbeing electric signals, and transmits the converted output information signals54aand54bto the communication apparatus (not illustrated). The transmission unit22includes a laser light source42, a 90-degree hybrid unit43, balanced optical reception units45a,45b,45c, and45d, analog/digital conversion units (A/Ds)47a,47b,47c, and47d, a wavelength dispersion compensation unit49, a polarization separation unit50, sampling units51aand51b, frequency phase estimation units52aand52b, multi-level signal determination units53aand53b, and a BER measurement unit62constituting a characteristic element of the present invention. Note that the wavelength dispersion compensation unit49, the polarization separation unit50, the sampling units51aand51b, the frequency phase estimation units52aand52b, and the multi-level signal determination units53aand53bconstitute a digital signal processing unit48. The transmission unit22illustrated inFIG.2branches unmodulated laser light output from the laser light source34into two by using the optical branch unit35, and inputs the branching laser light to two respective quadrature modulation units36aand36b. As the quadrature modulation units36aand36b, two sets of Mach-Zehnder (MZ) modulators disposed in parallel on a substrate made of lithium niobate or the like are used. The quadrature modulation units36aand36bperform quadrature modulation processing. In the quadrature modulation processing, a voltage signal modulated at high speed is applied to a modulation signal input end of each MZ modulator, so that the in-phase component (I-component or a real part) and the quadrature component (Q-component or an imaginary part) in the photoelectric field are independently output from an output end thereof. The input information signals30aand30bfrom the communication apparatus are encoded into multi-level signals, such as 16-Quadrature Amplitude Modulation (QAM) signals, by the encoder units31aand31b. The in-phase component and the quadrature component of the multi-level signals are converted into analog signals by the D/As32ato32d, and are then input into in-phase/quadrature modulation ends of the respective quadrature modulation units36aand36b. As a result the above operation, signal light output from the quadrature modulation units36aand36bare independent multi-level modulation light that are individually modulated on the two dimensional complex plane. In other words, the signal light is input to the polarization synthesis unit37in the form of an S-polarization optical modulated signal38and a P-polarization optical modulated signal39, which are converted so that both the polarization states are in quadrature. The signal light is polarization-synthesized by the polarization synthesis unit37into the optical signal40being a polarization multiplexed optical multi-level signal, and is output to an optical multiplexer/demultiplexer unit12(FIG.1) through the optical fibers14. As illustrated inFIG.1, such optical signals40output from respective transponder units21ato21nto the optical fibers14as described above are multiplexed by the optical multiplexer/demultiplexer unit12, amplified in the optical amplification unit13a, and transmitted through the optical fibers14to be transmitted to the receiving side. In the optical fibers14, the transmitted optical signals40are subjected to add/drop processing by the optical cross connect units15aand15n. After being amplified in the optical amplification unit13bon the receiving side, the optical signals40are demultiplexed in the optical multiplexer/demultiplexer unit12b, and are received in respective transponder units16ato16n. The optical signals40demultiplexed in the optical multiplexer/demultiplexer unit12bare polarization multiplexed optical multi-level signals, and are separated into four sets of optical signals of X polarized components {in-phase/quadrature components (X-pol.)} and Y polarized components (in-phase/quadrature components (Y-pol.)) by the 90-degree hybrid unit43illustrated inFIG.3, and the four sets of optical signals are output to four respective balanced optical reception units45ato45d. The frequency of the laser light emitted from the laser light source42is set to be substantially the same as the frequency of the polarization multiplexed optical multi-level signals being the incoming optical signals40transmitted through the optical fibers14. The laser light from the laser light source42is input through another input port of the 90-degree hybrid unit43, and is distributed into respective balanced optical reception units45ato45d. The balanced optical reception units45ato45dcause light from a local oscillator to interfere with the input signal light, and convert the signal light obtained through the interference into analog electric signals by using photodiodes. The electric signals are converted into digital signals (I-component, Q-component) by the A/Ds47ato47d, and are then output to the digital signal processing unit48. In the digital signal processing unit48, first, in the wavelength dispersion compensation unit49, components corresponding to an inverse function of wavelength dispersion resulting from the superimposition in the optical fibers14are applied, and waveform deterioration caused in the optical fibers14is thereby compensated. In the polarization separation unit50, transmitted quadrature polarized components of the signals (X, Y) after being subjected to the deterioration compensation are detected and are then polarization-converted, and the original S-polarized component and P-polarized component on the transmitting side are thereby separately extracted. The S-polarized component is output to the sampling unit51a, and the P-polarized component is output to the sampling unit51b. In the sampling units51aand51b, data of center time of waveforms is extracted. Next, in the frequency phase estimation units52aand52b, an intermediate frequency (IF) offset frequency component and a phase fluctuation component are removed, and data of the I-component and the Q-component are output. Finally, in the multi-level signal determination units53aand53b, the data of the I-component and the Q-component is subjected to multi-level signal determination and decoding processing, and the output information signals54aand54bare thereby obtained. Note that, in general, a framer/error correction circuit is disposed at a subsequent stage of the reception unit23. The framer/error correction circuit analyzes received signals to search for the start of a data frame, performs error correction processing on the following data of the searched start by using error correction information prepared before the transmission, reads information in the header, and performs processing for channels and monitor information, for example. The BER measurement unit62refers to the output information signals54aand54bdemodulated in the multi-level signal determination units53aand53bof the digital signal processing unit48to measure a BER, and feeds the measured BER back to the transmission units22of the transponder units21ato21non the transmitting side. The measured BER indicates a bit error rate of signals between the transponder units21ato21non the transmitting side and the transponder units22ato22non the receiving side. A high BER denotes worsening of the signal transmission state between the transponder units. Thus, in this case, feedback is performed so that the BER is lowered and the signal transmission state is enhanced. The fed back BER is input to the frequency shift control unit61of each transmission unit22of the transponder units21ato21n. The control unit61performs control of shifting the center frequency of the laser light emitted from the laser light source34in accordance with the input BER to make the center frequency match the center frequency of the optical signal40shifted on the receiving side, thereby making both the center frequencies match each other. The matching of both the center frequencies allows for reduction of narrowing of the optical signal40on the receiving side. As inFIG.4(a), the received signal in the transponder units22ato22non the receiving side has a signal waveform W2of a narrow band whose center frequency is a center frequency f5. The center frequency f5is shifted by frequency fD from a center frequency f0of a transmission signal having a signal waveform W1that is transmitted from the transponder units21ato21non the transmitting side. In view of this, when the center frequency f0is shifted by the frequency fD so as to match the center frequency f5, as illustrated inFIG.4(b), the signal waveform W2of the received signal falls within the band of the signal waveform W1of the transmission signal. The laser light source34is manufactured in conformity with the Integrable Tunable Laser Assembly (ITLA) standards, and thus has a function of shifting the center frequency of the laser light according to the frequency shift control of the control unit61. As illustrated inFIG.5, the control unit61sets a value of the fed back BER as an initial value BER0. Next, the center frequency f0of the laser light emitted from the laser light source34when the value is the initial value BER0is shifted twice each by a certain amount ΔP in a direction in which the frequency shift amount is increased (frequency increase direction), for example. Shifting the center frequency f of the laser light in this manner changes incoming values of fed back BERs accordingly. In view of this, the control unit61stores a BER1that is measured and fed back by the BER measurement unit62on the receiving side when the center frequency f0is shifted by ΔP in the frequency increase direction in the first shift in a storage unit (not illustrated), and also stores a BER2that is fed back when the center frequency f0is shifted by ΔP in the second shift in the storage unit. If values of the stored BER1and BER2obtained as a result of the two times of shift change to larger values, the control unit61determines that the signal transmission state between the transponder units has deteriorated (worsened). After making such determination, the control unit61performs frequency shift control of shifting twice the center frequency f0of the laser light from the laser light source34each by a certain amount −ΔP in a frequency decrease direction as indicated by the arrow Y1. The frequency decrease direction is a direction opposite to the frequency increase direction in which the center frequency10is previously shifted twice. After performing the control, the control unit61stores a BER-1 and a BER-2 that are fed back from the BER measurement unit62on the receiving side obtained as a result of the first and second frequency shift, respectively, in the storage unit. If values of the stored BER-1 and BER-2 obtained as a result of the two times of frequency shift change to smaller values, the control unit61determines that the signal transmission state between the transponder units has enhanced. After making such determination, the control unit61performs control of shifting the center frequency f0of the laser light in the frequency decrease direction so that a fed back BER is minimized. When the BER is minimized, the control unit61determines that the center frequency f0of the laser light and the center frequency f5of the optical signal40on the receiving side match each other, and thus stops the control. Operation of First Embodiment Next, the operation of reducing a filter penalty in the optical transmission system10A according to the first embodiment will be described with reference to the flowchart ofFIG.6. Note that, as illustrated inFIG.1, the following optical transmission is being performed. The input information signals30aand30bfrom the communication apparatus (not illustrated) are converted into the optical signals40in the transmission unit22of each of the transponder units21ato21n, and these optical signals40are demultiplexed in the optical multiplexer/demultiplexer unit12aand amplified in the optical amplification unit13ato be transmitted to the optical fibers14. The transmitted optical signals40are added/dropped in the optical cross connect units15aand15nas necessary. Subsequently, the optical signals40are sequentially amplified in the optical amplification unit13bon the receiving side and demultiplexed in the optical multiplexer/demultiplexer unit12b. Further, the optical signals40are received in the transponder units16ato16nto be transmitted to the communication apparatus (not illustrated). During such optical transmission, in Step S illustrated inFIG.6, the BER measurement unit62(FIG.3) of the reception unit23in each of the transponder units22ato22non the receiving side measures a BER, based on the output information signals54aand54bdemodulated in the multi-level signal determination units53aand53bof the digital signal processing unit48. The BER measurement unit62feeds the measured BER back to the transmission units22of the transponder units21ato21non the transmitting side. In Step S2, the fed back BER is input to the frequency shift control unit61of the transmission units22of the transponder units21ato21non the transmitting side. The control unit61performs frequency shift control of shifting the center frequency f0of the laser light emitted from the laser light source34in accordance with the BER so that the center frequency f0approaches the center frequency f5of the optical signal on the receiving side. In Step S3, the control unit61determines whether or not the value of the fed back BER is reduced as a result of the frequency shift control. As a result of the determination, if the control unit61determines that the value is not reduced (No), i.e., determines that the value is increased, in Step S4, the control unit61changes the direction of frequency shift to an opposite direction and performs frequency shift control. After this control, the process returns to Step S3, and determination is performed. As a result of the determination of Step S3, if the control unit61determines that the value of the fed back BER is reduced (Yes), in Step S5, the control unit61performs frequency shift control so that a fed back BER is minimized. In Step S6, the control unit61determines whether or not the BER is minimized. If the BER is not minimized (No), the frequency shift control of Step S5is continued. In contrast, if the BER is minimized (Yes), in Step S7, the control unit61determines that the center frequency f of the laser light and the center frequency f5of the optical signal40on the receiving side match each other. When the center frequencies match each other, the frequency shift control is stopped. Effects of First Embodiment Effects produced by the optical transmission system10A according to the first embodiment will be described. The optical transmission system10A includes the transponder units21ato21nand22ato22non the transmitting side and the receiving side that respectively perform transmission and reception of the optical signal through the optical fibers14in which the optical filters having the multiplexing/demultiplexing function of the optical signal are interposed. The transponder units21ato21nand22ato22neach include the transmission unit22that transmits the optical signal obtained by modulating the laser light emitted from the laser light source34with the electric signal from the communication apparatus to the optical fibers14, and the reception unit23that receives the optical signal from the transmission unit22through the optical fibers14and converts the received optical signal into the electric signal. Features of the first embodiment will be described. The reception unit23includes the BER measurement unit62that measures the BER, based on the received signal of the transponder units22ato22non the receiving side, and feeds the measured BER back to the transponder units21ato21non the transmitting side. The transmission unit22includes the frequency shift control unit61that performs the frequency shift control of shifting the center frequency f0of the laser light emitted from the laser light source34in accordance with the fed back BER so that the center frequency f0approaches the center frequency f5of the optical signal40received in the transponder units22ato22non the receiving side. The control unit61performs the frequency shift control so that the value of the fed back BER is minimized. According to the configuration, when the value of the BER fed back to the transmitting side is minimized as a result of the frequency shift control, the center frequency f0of the laser light matches the center frequency f5of the optical signal shifted on the receiving side. The matching allows for prevention of frequency shift of the optical signals caused by the optical filters in the optical fibers14. As a result, narrowing of the optical signals40is reduced on the receiving side. Accordingly, in the optical fibers14on the receiving side, a filter penalty causing deterioration in quality of received signals can be reduced. In addition, the optical transmission system10A may include a forward error correction (FEC) measurement unit that measures the number of correction bits of FEC and feeds the measured number of correction bits back to the transmitting side, instead of the BER measurement unit62on the receiving side. In this case, the control unit61on the transmitting side performs frequency shift control of shifting the center frequency f0of the laser light emitted from the laser light source34so that the center frequency f0approaches the center frequency f5of the optical signal40received in the transponder units22ato22non the receiving side, in such a manner that the fed back number of correction bits is minimized. Configuration of Second Embodiment FIG.7is a block diagram illustrating a configuration of a transmission unit22A of a transponder unit in an optical transmission system according to a second embodiment of the present invention. Note that the reception unit23(FIG.3) has the same configuration as that in the first embodiment. The transmission unit22A illustrated inFIG.7is different from the transmission unit22(FIG.2) according to the first embodiment in that the transmission unit22A includes a phase control unit63that receives input of the fed back BER. The phase control unit63performs variable phase control of causing phase of multi-level signals encoded in the encoder units31aand31b, such as 16-QAM signals, to be advanced or delayed, in accordance with an input BER. Note that to cause phase to be advanced is said to advance phase and to cause phase to be delayed is said to delay phase. The multi-level signals in the advanced phase state or the delayed phase state as a result of the variable phase control are converted into analog signals by the D/As32ato32d, and are then input to the in-phase/quadrature modulation end of the quadrature modulation units36aand36b. Regarding signal light obtained by performing quadrature modulation on the laser light with the multi-level signals in the quadrature modulation units36aand36b, if signals with phase of the multi-level signals being advanced are used, the center frequency f of the laser light being a component of the signal light shifts in the frequency increase direction. In contrast, if signals with phase of the multi-level signals being delayed are used, the center frequency f0of the laser light being a component of the signal light shifts in the frequency decrease direction. According to the shift of the center frequency f as described above, values of measured BERs in the BER measurement unit62on the receiving side are changed. For example, when the center frequency f0shifts in the frequency increase direction, the value of the BER is increased. In this case, the phase control unit63determines that the signal transmission state between the transponder units has been deteriorated (worsened). When the phase control unit63makes such determination, the phase control unit63performs variable phase control of delaying phase of the multi-level signals of the encoder units31aand31bin accordance with the BER. As a result of the variable phase control, the center frequency fb shifts in the frequency decrease direction, and the value of the BER is thus reduced. In this case, the phase control unit63determines that the signal transmission state between the transponder units has been enhanced. After the phase control unit63makes the determination of the enhancement, the phase control unit63performs variable phase control of delaying phase of the multi-level signals of the encoder units31aand31bso that a fed back BER is minimized. When the BER is minimized, the phase control unit63determines that the center frequency f0of the laser light and the center frequency f5of the optical signals40on the receiving side match each other, and thus stops the control. According to the transmission unit22A of the second embodiment having a configuration as described above, when the value of the BER fed back to the transmitting side is minimized as a result of the variable phase control, the center frequency f0of the laser light matches the center frequency f5of the optical signal shifted on the receiving side. As a result, narrowing of the optical signal40on the receiving side is reduced. Accordingly, in the optical fibers14on the receiving side, a filter penalty causing deterioration in quality of received signals is reduced. In addition, in a similar manner to the first embodiment, instead of the BER measurement unit62on the receiving side, an FEC measurement unit may be included, and the phase control unit63may perform the frequency shift control on the laser light emitted from the laser light source34so that the fed back number of correction bits is minimized. Configuration of Third Embodiment FIG.8is a block diagram illustrating a configuration of a transmission unit22B of a transponder unit in an optical transmission system according to a third embodiment of the present invention. Note that the reception unit23has the same configuration as that illustrated inFIG.3. The transmission unit22B illustrated inFIG.8is different from the transmission unit22A (FIG.7) according to the second embodiment in that the transmission unit22B includes a Nyquist control unit64that receives input of the fed back BER, instead of the phase control unit63. Note that the encoder units31aand31beach include a Nyquist filter (or a roll-off filter) being a frequency filter so as to perform encoding processing to obtain multi-level signals by using a digital signal processing function. The Nyquist control unit64determines a parameter of the Nyquist filter, which is referred to as a roll-off rate, in accordance with the fed back BER so that a signal spectrum passing through the Nyquist filter of the encoder units31aand31bhas a Nyquist form (described later), and variably sets cutoff characteristics of the Nyquist filter by using the parameter. In other words, the Nyquist control unit64performs Nyquist control on the Nyquist filter so that the fed back BER is minimized. The Nyquist control is control of making a signal spectrum of the input information signals30aand30bpassing through the Nyquist filter of the encoder units31aand31bhave a Nyquist form, in which the rectangular waveform due to the cutoff characteristics of a signal includes a larger number of main signal components. The Nyquist form is such a form that cutoff characteristics of a signal have a steep rectangular shape, and a larger number of main signal components are included in a narrow band including the center frequency of such a rectangular shape. Including a large number of main signal components in a narrow band as described above allows the Nyquist form to maintain the main signal components even under the influence of narrowing due to optical filters having the optical multiplexing/demultiplexing function in the optical fibers14. As a result, deterioration in signal quality can be prevented. In other words, a filter penalty can be reduced. In addition, in a similar manner to the second embodiment, instead of the BER measurement unit62on the receiving side, an FEC measurement unit may be included, and the Nyquist control unit64may perform the Nyquist control so that the fed back number of correction bits is minimized. Configuration of Fourth Embodiment FIG.9is a block diagram illustrating a configuration of a transmission unit22C of a transponder unit in an optical transmission system according to a fourth embodiment of the present invention.FIG.10is a block diagram illustrating a configuration of a reception unit of the transponder unit in the optical transmission system according to the fourth embodiment. The transmission unit22C illustrated inFIG.9is different from the transmission unit22(FIG.2) according to the first embodiment in that the transmission unit22C includes a frequency shift control unit65(also referred to as a control unit65) that receives input of optical power (seeFIG.1) fed back from the transponder units22ato22non the receiving side, instead of the frequency shift control unit61(FIG.2) that receives input of fed back optical power. The reception unit23A illustrated inFIG.10is different from the reception unit23(FIG.3) according to the first embodiment in that the reception unit23A includes an optical power measurement unit66, instead of the BER measurement unit62. The optical power measurement unit66measures optical power of received signals being electric signals obtained by converting the signal light in the balanced optical reception units45ato45d, and feeds the optical power back to the frequency shift control unit65in the transmission units22C of the transponder units21ato21non the transmitting side. Note that, when the balanced optical reception units45ato45dconvert the signal light into electric signals, the balanced optical reception units45ato45dperform the conversion by using photodiodes as described above. Regarding the optical power measured in the optical power measurement unit66, small optical power denotes worsening of the signal transmission state between the transponder units. Thus, in this case, feedback is performed so that the optical power is increased and the signal transmission state is enhanced. In this case, when the optical power is maximized, the signal transmission state is most enhanced. The fed back optical power is input to the frequency shift control unit65on the transmitting side. The control unit65performs frequency shift control of shifting (as inFIG.4(a)) the center frequency f of the laser light emitted from the laser light source34to make the center frequency f0match the center frequency f5of the optical signal40shifted on the receiving side, thereby making both the center frequencies match each other, so that the input optical power is maximized. According to the configuration, when the optical power fed back to the transmitting side is maximized as a result of the frequency shift control, the center frequency f0of the laser light matches the center frequency f5of the optical signal shifted on the receiving side. The matching allows for prevention of frequency shift of the optical signals caused by the optical filters in the optical fibers14. As a result, narrowing of the optical signals40is reduced on the receiving side, and a filter penalty causing deterioration in quality of received signals can be thereby reduced. Further, the measurement of the optical power requires only measurement of optical power itself received in the photodiodes. As a result, implementation can be achieved with a simple configuration. In addition, light is used in the control. As a result, high speed control can be implemented. Configuration of Fifth Embodiment FIG.11is a block diagram illustrating a configuration of a transmission unit22D of a transponder unit in an optical transmission system according to a fifth embodiment of the present invention. Note that the reception unit23A (FIG.10) has the same configuration as that in the fourth embodiment. The transmission unit22D illustrated inFIG.11is different from the transmission unit22C (FIG.9) according to the fourth embodiment in that the transmission unit22D includes a phase control unit67that receives input of the fed back optical power. The phase control unit67performs variable phase control of causing phase of multi-level signals encoded in the encoder units31aand31b, such as 16-QAM signals, to be advanced or delayed, in accordance with input optical power. The multi-level signals whose phase is in the advanced phase state or the delayed phase state as a result of the variable phase control are converted into analog signals by the D/As32ato32d, and are then input to the in-phase/quadrature modulation end of the quadrature modulation units36aand36b. Regarding signal light obtained by performing quadrature modulation on the laser light with the multi-level signals in the quadrature modulation units36aand36b, if the multi-level signals are signals in the advanced phase state, the center frequency f0of the laser light being a component of the signal light shifts in the frequency increase direction. In contrast, if the multi-level signals are signals in the delayed phase state, the center frequency f0of the laser light being a component of the signal light shifts in the frequency decrease direction. According to the shift of the center frequency f as described above, values of optical power measured in the optical power measurement unit66on the receiving side are changed. For example, when the center frequency f0shifts in the frequency increase direction, the value of the optical power is reduced. In this case, the phase control unit67determines that the signal transmission state between the transponder units has been deteriorated (worsened). When the phase control unit67makes such determination, the phase control unit67performs variable phase control of delaying phase of the multi-level signals of the encoder units31aand31bin accordance with the optical power. As a result of the variable phase control, the center frequency f0shifts in the frequency decrease direction, and the optical power is thus reduced. In this case, the phase control unit67determines that the signal transmission state between the transponder units has been enhanced. After the phase control unit67makes the determination, the phase control unit67performs variable phase control of delaying phase of the multi-level signals of the encoder units31aand31bso that fed back optical power is maximized. When the optical power is maximized, the phase control unit67determines that the center frequency f0of the laser light and the center frequency f5of the optical signals40on the receiving side match each other, and thus stops the control. According to the transmission unit22D of the fifth embodiment having a configuration as described above, when the value of the optical power fed back to the transmitting side is maximized as a result of the variable phase control, the center frequency f0of the laser light matches the center frequency f5of the optical signal shifted on the receiving side. As a result, narrowing of the optical signal40on the receiving side is reduced. Accordingly, in the optical fibers14on the receiving side, a filter penalty causing deterioration in quality of received signals can be reduced. Configuration of Sixth Embodiment FIG.12is a block diagram illustrating a configuration of a transmission unit22E of a transponder unit in an optical transmission system according to a sixth embodiment of the present invention. Note that the reception unit23A (FIG.10) has the same configuration as that in the fourth embodiment. The transmission unit22E illustrated inFIG.12is different from the transmission unit22D (FIG.11) according to the fifth embodiment in that the transmission unit22E includes a Nyquist control unit68that receives input of the fed back optical power, instead of the phase control unit67. Note that the encoder units31aand31beach include a Nyquist filter (or a roll-off filter) being a frequency filter so as to perform encoding processing to obtain multi-level signals by using a digital signal processing function. The Nyquist control unit68determines a parameter of the Nyquist filter, which is referred to as a roll-off rate, in accordance with the fed back optical power so that a signal spectrum passing through the Nyquist filter of the encoder units31aand31bhas a Nyquist form, and variably sets cutoff characteristics of the Nyquist filter by using the parameter. In other words, the Nyquist control unit68performs Nyquist control on the Nyquist filter so that the fed back optical power is maximized. The Nyquist control is control of making a signal spectrum of the input information signals30aand30bpassing through the Nyquist filter of the encoder units31aand31bhave a Nyquist form, in which the rectangular waveform due to the cutoff characteristics of a signal includes a larger number of main signal components. According to the sixth embodiment having a configuration as described above, making a signal spectrum passing through the Nyquist filter have a Nyquist form including a larger number of main signal components allows for maintenance of the main signal components even under the influence of narrowing due to optical filters having the optical multiplexing/demultiplexing function in the optical fibers14. As a result, deterioration in signal quality can be prevented. In other words, a filter penalty can be reduced. Configuration of Seventh Embodiment FIG.13is a block diagram illustrating a configuration of an optical transmission system10B according to a seventh embodiment of the present invention. The optical transmission system10B illustrated inFIG.13is different from the optical transmission system10A (FIG.1) according to the first embodiment in that the following control is performed in the optical transmission system10B. In the control, the frequency shift amount is determined in the reception units23B of the transponder units22ato22non the receiving side while measuring the optical power of the received optical signals, and the center frequency of the optical filters of the intermediate units (the optical multiplexer/demultiplexer units12aand12band the optical cross connect units15aand15n) is caused to match the center frequency of the laser light on the transmitting side by using the frequency shift amount. Note that the optical multiplexer/demultiplexer units12aand12bbeing the intermediate units include an arrayed waveguide grating (AWG) being an optical device. The AWG is such an optical filter that performs multiplexing/demultiplexing using the wavelength by causing interference in light that has propagated in a large number of waveguides having different optical path lengths. The AWG performs control of separating frequencies by variably changing temperatures, and is thus capable of frequency shift. Further, the optical cross connect units15aand15nbeing the intermediate units are wavelength selective switches (WSSs) capable of frequency shift. The reception unit23B illustrated inFIG.14is different from the reception unit23A illustrated inFIG.10in that the reception unit23B includes a frequency shift control unit69(also referred to as a control unit69), in addition to the optical power measurement unit66(FIG.10). The control unit69determines the frequency shift amount by which the center frequency of the optical signals of the intermediate units is shifted so that the optical power measured in the optical power measurement unit66is maximized, and outputs the determined frequency shift amount to the intermediate units. In the optical multiplexer/demultiplexer units12aand12bbeing the intermediate units, the center frequency of the optical signals in the AWGs is shifted according to the frequency shift amount, and in the optical cross connect units15aand15n, the center frequency of the optical signals in the WSSs is shifted. When the center frequency of the optical signals shifted on the receiving side and the center frequency of the laser light on the transmitting side match each other as a result of the shift, the optical power measured in the optical power measurement unit66is maximized. According to the configuration of the seventh embodiment having a configuration as described above, the frequency shift amount is determined while measuring the optical power of the received optical signals, and the center frequency of the optical filters in the intermediate units in the optical fibers14is shifted by the frequency shift amount. When the measured optical power is maximized as a result of the shift, the center frequency f0of the laser light and the center frequency f5of the optical signal shifted on the receiving side match each other. As a result, narrowing of the optical signal40on the receiving side is reduced. Accordingly, in the optical fibers14on the receiving side, a filter penalty causing deterioration in quality of received signals can be reduced. In addition, examples of types of the optical cross connect units15aand15nbeing the intermediate units include one using a liquid crystal on silicon (LCOS), which is a spatial optical modulator using liquid crystals inside the WSS. When such a type of WSS is used as the optical cross connect units15aand15n, the frequency shift amount transmitted from the frequency shift control unit69may be input to the LCOS so that the center frequency of the optical filters is shifted. In addition, a specific configuration can be changed as appropriate without departing from the spirit of the present invention. Further, although the above embodiments describe an example in which the present invention is applied to multi-level signals, the present invention can also be applied to binary amplitude modulation, phase modulation, and encoding modulation, for example. REFERENCE SIGNS LIST 10A,10B Optical transmission system12a,12bOptical multiplexer/demultiplexer unit13a,13bOptical amplification unit15a,15nOptical cross connect unit21a-21n,22a-22nTransponder unit22,22A,22B,22C,22D,22E Transmission unit23,23A,23B Reception unit61,65,67Frequency shift control unit62BER measurement unit63Phase control unit64,68,69Nyquist control unit66Optical power measurement unit | 40,872 |
11942756 | Elements that are identical, similar or similar acting are given the same reference signs in the figures. The figures and the proportions of the elements shown in the figures are not to be regarded as true to scale. Rather, individual elements can be shown exaggeratedly large for better representability and/or for better comprehensibility. DETAILED DESCRIPTION The schematic sectional view ofFIG.1shows the exemplary embodiment of a semiconductor chip1described herein along a sectional line A-A shown inFIG.2. The semiconductor chip1according to the exemplary embodiment ofFIGS.1and2comprises a semiconductor layer sequence2with at least two active regions6generating radiation during operation.FIG.1shows a sectional view along the sectional line A-A shown inFIG.2. The semiconductor layer sequence2has a first cladding layer3and a second cladding layer4, between which an active zone5is arranged which comprises the active regions6. The active regions6are spaced apart from one another in the lateral direction and are arranged in a common plane. Furthermore, a propagation region12comprises the active zone5. The radiation generated by the active regions6propagates in the propagation region12, which extends parallel to the active zone5. A reflective outer surface8is arranged laterally of each active region6. The reflective outer surface8has an angle of approximately 45° to a main extension plane of the semiconductor chip. Furthermore, the semiconductor chip has an electrically insulating region7arranged between the active regions6. The electrically insulating region7has a reflective inner surface9arranged opposite the reflective outer surface9. Furthermore, the electrically insulating region is formed as a protrusion10, which is laterally delimited by the reflective inner surface9. The reflective inner surface9has an angle of approximately 45° to a main extension plane of the semiconductor chip1. The reflective outer surface8and the reflective inner surface9completely penetrate the active zone4and the propagation region12. Further, the semiconductor chip1has a support24which covers a surface of the semiconductor layer sequence facing the reflective inner surface9and the reflective outer surface8in a form fit manner. In a cross-section perpendicular to the main extension plane of the semiconductor chip1corresponding to the section line A-A inFIG.2, the reflective outer surface8comprises a first region8aand a second region8bfacing one another. Each region of the reflective outer surface8a,8bis associated with an active region6. Furthermore, in the cross-section perpendicular to the main extension plane of the semiconductor chip1, the reflective inner surface9comprises a first region9aand a second region9bfacing one another. Each region of the reflective inner surface9a,9bis associated with an active region6. An active region6is arranged between the first region of the reflective outer surface8aand the first region of the reflective inner surface9a. Furthermore, an active region6is arranged between the second region of the reflective outer surface8band the second region of the reflective inner surface9b. A first contact layer13is arranged in regions on a top surface of the semiconductor layer sequence2. Furthermore, a second contact layer14is arranged on a bottom surface of the semiconductor layer sequence2. In addition to the second contact layer13, a reflective coating15is arranged on the top surface of the semiconductor layer sequence2in the region of the reflective outer surface8. The reflective coating15is preferably a highly reflective coating. Furthermore, an anti-reflective coating16is arranged on the top surface of the semiconductor layer sequence2in the electrically insulating region7. According to the cross-section of the sectional line A-A inFIG.2, the second contact layer14has a first contact region14aand a second contact region14b, which are each arranged spaced apart from one another in the lateral direction on a bottom surface of the semiconductor layer sequence2. Furthermore, the contact regions14a,14beach have a width and a length. According to the arrows shown inFIG.1, directions of propagation of radiation are shown. The radiation generated in each of the active regions forms a beam with a beam profile which, in cross-section perpendicular to a main direction of extension of the beam, has a lateral and a vertical extension. Radiation propagating in the direction of the reflective outer surface8is directed towards the reflective inner surface9by means of the reflective coating15and further reflection at the reflective outer surface8. Emitted radiation that propagates in the direction of the reflective inner surface9is superimposed on the radiation reflected at the reflective outer surface8. The radiation of the active regions6superimposed in this way is superimposed in the region of the anti-reflective coating16and coupled out. The coupled out radiation is thus amplified and exhibits increased brightness and luminous flux. The radiation-emitting semiconductor chip2according to the exemplary embodiment ofFIGS.1and2is formed as a superluminescent light-emitting diode. As shown in the top view ofFIG.2, the reflective outer surface8is formed continuously in the semiconductor chip according to the exemplary embodiment ofFIGS.1and2. The reflective outer surface8completely surrounds the electrically insulating region7formed by the reflective inner surface9. The first contact layer13covers the top surface of the semiconductor layer sequence1to a large extent. Furthermore, the semiconductor chip has a plurality of contact regions14c. The first contact layer13and the second contact layer14with the plurality of contact regions14cpredetermine the lateral dimensions of each active region6. Preferably, an active region6here has a larger area than an associated contact region of the second contact layer14. The active regions6predetermined by the plurality of contact regions14care arranged in pairs opposite one another and in a circular shape. The contact regions of the plurality of contact regions14crespectively predetermine a length and width of the active regions6. The pairwise opposite active regions6have a common axis (see, for example, section A-A) extending along the lengths. An angle is arranged between the axes of pairwise opposite active regions6. In this case, the axes intersect in the electrically insulating region7. Furthermore, the angles between the axes are equidistant. The semiconductor chip1is further surrounded by a frame20. The frame20separates a functional region from the outside. The frame20is, for example, an elevation or a depression. In contrast to the exemplary embodiment according toFIGS.1and2, the reflective inner surface9of the semiconductor chip1according to the exemplary embodiment ofFIG.3partially penetrates the propagation region12. In this exemplary embodiment, the propagation region12is arranged around the active zone5. The propagation region12protrudes beyond the active zone5in vertical direction. That is to say that the beam profile of the beam protrudes beyond the active zone5in vertical direction. The propagation region12is arranged between the first cladding layer3and the second cladding layer4. For example, the propagation region12can comprise materials different from the materials of the first cladding layer3and the second cladding layer4. In this case, the cladding layers3,4have a lower refractive index for the radiation than the propagation region12. The generated radiation thus partially propagates between opposing reflective outer surfaces8in the propagation region12. In the present exemplary embodiment, the propagation region12forms a resonator for the radiation. By means of the anti-reflective coating, for example, a degree of reflection of the radiation can be predetermined. Thus, a portion of the radiation can be guided back into the propagation region12, which can be configured as a resonator, by means of the anti-reflective coating16. If a comparatively small proportion of the radiation is reflected by the reflective inner surface9and a comparatively large proportion of the radiation is reflected back by the anti-reflective coating16, it is possible to generate and couple out laser light. In contrast to the exemplary embodiments in connection withFIGS.1and2or3, the anti-reflective coating16is arranged above the reflective outer surface8. Furthermore, the semiconductor chip2does not have an insulating region7. In this exemplary embodiment, the at least two active regions of the semiconductor chip are directly adjacent to one another. According toFIGS.5,6,7and8, schematic representations are shown in plan view of a semiconductor chip1according to a respective exemplary embodiment, in which the reflective inner surface8has the shape of a circle (FIG.5), a round ring (FIG.6), a polygon (FIG.7) or a polygonal ring (FIG.8) in plan view. In the method according to the exemplary embodiment ofFIGS.9,10,11and12, a semiconductor layer sequence2is first provided on a growth substrate20(FIG.9). An inner recess23and an outer recess23(not shown here) are formed in the semiconductor layer sequence2. A side surface of the inner recess23has an angle21of approximately 45° to a main extension plane of the semiconductor chip1. In the method step according toFIG.10, an electrically insulating layer is applied to a side surface of the inner recess23forming the electrically insulating region7. Furthermore, the second contact layer14is applied on the semiconductor layer sequence2. Further, as shown inFIG.11, a prefabricated carrier24is applied over a surface of the semiconductor layer sequence2having the recesses23,22in a form fit manner. The prefabricated carrier24comprises, for example, silicon. Furthermore, the carrier24can be formed from a potting. For example, the potting is a metal. Subsequently, the semiconductor layer sequence2is removed from the growth substrate20. In a further method step according toFIG.12, the first contact structure13, the anti-reflective coating16and the reflective coating15(not shown here) are applied to the semiconductor layer sequence2exposed from the growth substrate20. InFIG.13, far-field measurements of electromagnetic radiation from a conventional radiation-emitting semiconductor chip having a single active region are plotted on a graph in which a normalised radiant power Lnormof the radiation is plotted in arbitrary units versus polar coordinates θ in degrees [°]. The measured radiant power of the radiation in the far field is here produced by a single active region. Along a fast axis18, the radiation has a radiant power L1that has a full width half maximum (FWHM) of, for example, 40°. A slow axis19is arranged perpendicular to the fast axis18, as shown in a polar coordinate diagram inFIG.14. Radiation along a slow axis19perpendicular to the fast axis18has a radiant power L2with a half-value width of, for example, 8° (seeFIG.13). By means of the width of the active region, the fast axis18can be predetermined. According toFIG.15, the width of the active region is wide compared to an active region as specified inFIG.13, so that the full width half maximum of the radiant power of the fast axis L1is reduced to, for example, 32°. Measurements of the luminous flux Φ of radiation of a semiconductor chip according to an exemplary embodiment are shown inFIG.16. In the diagram, the luminous flux Φ in arbitrary units is plotted against a current I applied to a semiconductor chip in milliamperes [mA]. A first curve Φ1corresponds to a conventional semiconductor chip in which the semiconductor chip has only a single active region. A second curve Φ2corresponds to a semiconductor chip1according to the exemplary embodiment ofFIG.4, in which the semiconductor chip1has two active regions6. The conventional semiconductor chip exemplarily shown inFIG.17has only one active region and is associated with the first curve Φ1. The exemplary semiconductor chip1shown inFIG.18has two opposing active regions6and is assigned to the second curve Φ2. According toFIGS.19,20,21,22,23and24, simulations of the far field of radiation of a semiconductor chip are shown according to an exemplary embodiment each. The far field of the radiation is shown in a polar coordinate diagram. The embodiments ofFIGS.19and20correspond to a semiconductor chip1with two opposing active regions6. The embodiments ofFIGS.21and22correspond to a semiconductor chip1with eight opposing active regions6. The embodiments ofFIGS.23and24correspond to a semiconductor chip1with sixteen opposing active regions6. According toFIGS.19,21and23, the full width half maximum of the radiated power of the radiation is 30° on the fast axis18and 16° on the slow axis19. According toFIGS.20,22and24, the full width half maximum on the fast axis18is 40° and on the slow axis19is 8°. According toFIG.25, measurements of the far field of radiation are plotted on a graph in which a radiant power Leof the radiation is plotted with units [mW/sr] versus polar coordinates θ in degrees [°]. Here, the radiation is generated by a semiconductor chip1having two opposing active regions6. Along the fast axis18, the radiation has a radiant power L1. The radiation has a radiant power L2along the slow axis19. In this exemplary embodiment, the reflective outer surface8and/or the reflective inner surface7has an angle to a main extension plane of the semiconductor chip1different from 45° but between at least 35° and at most 55°. As a result, the spectrum of the radiated power has two separate peaks. According toFIG.26, radiation powers L1of the far field of the radiation along the fast axis18are shown. In this embodiment, the semiconductor chip1has active regions6arranged in pairs opposite one another. Analogous toFIG.25, the reflecting outer surface8and/or the reflecting inner surface7has an angle to a main extension plane of the semiconductor chip1which is different from 45°. By means of the plurality of active regions arranged in pairs opposite to one another and in a circular shape, a common spectrum of radiant powers of the active regions6has only one main peak, unlike inFIG.25. According toFIGS.27,28,29,30and31, the reflective outer surfaces8are not formed continuously. The first region of the reflective outer surface8aand the second region of the reflective outer surface (8b) (not shown here) are straight in these exemplary embodiments and are spaced apart in the lateral direction. In contrast to the exemplary embodiment in connection withFIGS.27,28and29, the contact regions14of the second contact layer14ofFIGS.30and31have a shape tapering (FIG.28) or widening (FIG.29) towards the electrically insulating region7. The invention is not limited to the exemplary embodiments by the description based thereon. Rather, the invention encompasses any new feature as well as any combination of features, which in particular includes any combination of features in the claims, even if this feature or combination itself is not explicitly indicated in the claims or exemplary embodiments. | 15,151 |
11942757 | DETAILED DESCRIPTION Example methods, devices, and systems are described herein. It should be understood that the words “example” and “exemplary” are used herein to mean “serving as an example, instance, or illustration.” Any embodiment or feature described herein as being an “example” or “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments or features. Other embodiments can be utilized, and other changes can be made, without departing from the scope of the subject matter presented herein. Thus, the example embodiments described herein are not meant to be limiting. Aspects of the present disclosure, as generally described herein, and illustrated in the figures, can be arranged, substituted, combined, separated, and designed in a wide variety of different configurations, all of which are contemplated herein. Further, unless context suggests otherwise, the features illustrated in each of the figures may be used in combination with one another. Thus, the figures should be generally viewed as component aspects of one or more overall embodiments, with the understanding that not all illustrated features are necessary for each embodiment. I. OVERVIEW The present disclosure relates to methods for packaging a laser diode and optical lens in an efficient manner with high precision and repeatability. In some cases, a junction of the laser diode could be mounted on a surface of a substrate with its junction side down. Thereafter, at least a portion of the substrate and the laser diode are overmolded with an optically transparent material that is physically referenced and/or aligned to the substrate surface. The overmolded material has at least one registration feature. An optical lens (e.g., a fast-axis collimating lens) is placed over the overmolded material and in front of the laser diode. The optical lens could mate or otherwise align with the registration feature of the overmolded material so as to position the optical lens precisely in at least a vertical dimension with a tolerance of 10 microns or less. In some embodiments, the substrate could be mounted to a printed circuit board with controlled-collapse solder balls (e.g., plastic core solder balls) that may control the height and orientation of the printed circuit board with respect to the substrate and/or the overall orientation and height of the package. In some cases, the printed circuit board may include one or more driver circuits for the laser diode. Accordingly, the present application could provide a beneficial approach to packaging a laser diode and a fast axis collimating (FAC) lens, which may allow for more precise and repeatable manufacturing processes. Furthermore, by way of registration feature(s) and reference surface(s), such manufacturing processes may provide optical systems with more precision and at a higher production rate than using traditional processes. II. EXAMPLE SYSTEMS FIG.1illustrates a block diagram of an optical system100, according to an example embodiment. Optical system100could be utilized in various compact physical mapping functionalities and other spatial awareness applications, which may include a LIDAR system or the like. For example, in some embodiments, the optical system100may be configured to provide information about a surrounding environment or objects therein. In some embodiments, the optical system100could provide important information to an automated or semi-automated vehicle or a plurality of such vehicles. For example, this information could be used to better enhance a self-driving car, an autonomous drone aircraft, an autonomous truck, or an autonomous robot generally. Other examples of vehicles and optical systems are contemplated herein. Optical system100includes a light-emitter substrate110and a carrier substrate116. The light-emitter substrate110could include a semiconductor material (e.g., silicon, GaAs, or the like). Additionally or alternatively, the light-emitter substrate110could include a different solid (e.g., crystalline or poly-crystalline) material. The light-emitter substrate110includes a first surface112, which could include an epitaxially-grown surface of the light-emitter substrate110. That is, in some embodiments, the first surface112could include a “top” surface formed subsequent to underlying epitaxial growth of a laser diode region. The first surface112of the light-emitter substrate110is coupled to a reference surface118of the carrier substrate116. The carrier substrate116could include a portion of a semiconductor wafer or a laminate printed circuit board. However, other materials having a reference surface are contemplated within the context of the present disclosure. The reference surface118could include one of the principal surfaces of the carrier substrate116. In such scenarios, the reference surface118could provide a reference plane for one or more elements of the optical system100. For example, in some embodiments, the reference surface118of the carrier substrate116may be used to register a mold structure. In such scenarios, the mold structure could provide a mold (e.g., an injection mold) for forming an optical material with a desired shape. For example, the mold structure may provide a form for an optical material140that may cover at least a portion of the light-emitter substrate110and the carrier substrate116. In some embodiments, the optical material140may be formed with respect to the reference surface118of the carrier substrate116. That is, the optical material140could be aligned to and/or otherwise physically referenced to the reference surface118. In some embodiments, the reference surface118may include at least one mating feature119(e.g., v groove, notch, line or plane constraints, etc.) or one or more other alignment features. In such scenarios, the mating feature119could mate with the mold structure prior to forming the optical material140. Other ways to align the mold structure and, ultimately, the optical material140to the reference surface118are possible and each is contemplated in the present disclosure. In some embodiments, the optical material could include at least one of: a UV thermosetting material, an epoxy material, or a thermoplastic material. The optical material could include other types of materials. The optical material140may include at least one registration feature136. The registration feature136may provide that the optical material140is physically registered with or aligned to an optical lens element130when coupled together. The optical lens element130may include, for example, a fast-axis collimation (FAC) lens132. The carrier substrate116includes a backside surface120. For example, the backside surface120could be a principal surface of the carrier substrate116that is opposite the reference surface118. In some embodiments, the backside surface120could be coupled to a further surface126of a further substrate124. The further substrate124may contain a control circuit128, which could be configured to provide electrical signals (e.g., current and voltage pulses) to the light-emitter substrate110. In some embodiments, the control circuit128could include one or more pulser circuits. In such examples, the one or more pulser circuits could include a plurality of gallium nitride metal-oxide semiconductor field effect transistors (GaN MOSFETs or GaN FETs). The plurality of GaN FETs could switch the current and voltage pulses on and off. Other types of circuits are possible and contemplated. FIG.2illustrates a side view of the optical system100, according to an example embodiment. As described above, the first surface112of the light-emitter substrate110is coupled to the reference surface118of the carrier substrate116. Furthermore, the optical material140could overmold at least a portion of the reference surface118and the light-emitter substrate110. Additionally, the FAC lens132is coupled to a registration feature136of the optical material140. In some embodiments, the further surface126of the further substrate124may be coupled to the backside surface120of the carrier substrate116by one or more spacers122. In some embodiments, the light-emitter substrate110may be coupled to the reference surface118by one or more wirebonds114. The light-emitter substrate110could additionally or alternatively be coupled to the reference surface118by way of bump bonding or application of a conductive adhesive. The light-emitter substrate110may include at least one laser diode junction113. For example, the light-emitter substrate110may include an epitaxially-grown laser diode region that may be configured to provide laser light in response to a current or voltage pulse. In some embodiments, the laser diode junction113could be formed from epitaxially-grown layers of InGaAs, GaAs, and/or other III/N materials. In some embodiments, the laser diode junction113could be located at a known distance from the first surface112. In some embodiments, the laser diode junction113could be located between 1 and 20 microns from the first surface112. Alternatively, the laser diode junction113could be located at a different distance from the first surface112. In some embodiments, the laser diode junction113could be located along an optical axis150of the FAC lens132. As described elsewhere herein, the laser diode junction113could be configured to emit laser light toward the FAC lens132. Furthermore, the FAC lens132could be configured to collimate the laser light emitted by the laser diode junction113. In some embodiments, upon interaction with the FAC lens132, the collimated light could be directed toward an optical waveguide structure. In an example embodiment, the optical waveguide structure may include a light guide manifold or another type of waveguide. FIGS.4A-4Fillustrate various shapes, which could define registration feature136. For example,FIG.4Aillustrates a registration feature136of the system400, according to an example embodiment. The registration feature136ofFIG.4Amay include an angled ridge with a cross-section having an angle (e.g., an angle that is greater than 90 degrees and less than 180 degrees) that may be used to register and/or align the optical lens element130to the optical material140. In some embodiments, the registration feature136may include a shape different from that illustrated inFIG.4A. For example,FIG.4Billustrates a registration feature136with a right-angled cross-section, according to an example embodiment. Alternatively,FIG.4Cillustrates a registration feature136having an acute angle (e.g., an angle greater than 0 degrees and less than 90 degrees) cross-section, according to an example embodiment. As a further alternative,FIG.4Dillustrates a registration feature136having a curved cross-section, according to an example embodiment. Yet further,FIG.4Eillustrates a registration feature136having square or rectangular cross-section, according to an example embodiment. As another alternative,FIG.4Fillustrates a registration feature136having rounded hill-like cross-section, according to an example embodiment. It will be understood that the optical lens element130could be shaped so as to register, abut, and/or mate with the registration feature136of the optical material140. III. EXAMPLE METHODS FIGS.3A-3Fillustrate various steps of a method of manufacture, according to one or more example embodiments. It will be understood that at least some of the various steps may be carried out in a different order than of that presented herein. Furthermore, steps may be added, subtracted, transposed, and/or repeated.FIGS.3A-3Fmay serve as example illustrations for at least some of the steps or stages described in relation to method500as illustrated and described in relation toFIG.5. Additionally, some steps ofFIGS.3A-3Fmay be carried out so as to provide optical system100, as illustrated and described in reference toFIGS.1and2. FIG.3Aillustrates a step300in a manufacturing method, according to an example embodiment. Step300includes providing a light-emitter substrate110. Specifically, step300could include coupling a first surface112of a light-emitter substrate110to a reference surface118of a carrier substrate116. As illustrated, the light-emitter substrate110could include an epitaxially-grown laser diode junction113. In some embodiments, the laser diode junction113could be located at a known distance below the first surface112of the light-emitter substrate110. The light-emitter substrate110could be coupled to the reference surface118of the carrier substrate116by at least one of: wire bonding, bump bonding, or application of a conductive adhesive. Other ways to couple the light-emitter substrate110to the reference surface118are contemplated and possible. In some embodiments, step300could include positioning the light-emitter substrate110onto the reference surface118relative to at least one alignment feature, such as mating feature119and/or one or more alignment marks. As an example, a pick and place tool could be used to position the light-emitter substrate110on the reference surface according to a plurality of alignment marks. FIG.3Billustrates a step310in a manufacturing method, according to an example embodiment. Step310includes registering a mold structure312with respect to the reference surface118of the carrier substrate116. In an embodiment, step310could include providing the mold structure312, which may include an interior volume313and at least one opening314that provides access to the interior volume313. In some embodiments, the reference surface118of the carrier substrate116may include at least one mating feature119. For instance, the mold structure312can register with the mating feature119and, in turn, provide a more reliable and consistent placement of the mold structure312. In some embodiments, the mold structure may be registered with respect to a different element. For instance, the mold structure312could be registered with respect to the reference surface118. In some embodiments, the optical material140may be injected, or otherwise introduced into the interior volume313through the opening314. For example, an optical epoxy could be introduced into the interior volume313through the opening314and then cured so as to form a solidified optical material140. In this way, the optical material140may be shaped according to a shape of the interior volume313of the mold structure312. FIG.3Cillustrates a step320in a manufacturing method, according to an example embodiment. In step320, the optical material140is formed over at least a portion of the light-emitter substrate110using the mold structure312, and the mold structure312is then removed. As shown inFIG.3C, the optical material140is shaped according to the shape of the interior volume313of the mold structure312. Furthermore, the optical material140could include at least one registration feature136. In some embodiments, the registration feature136includes at least one three-dimensional feature, which, in turn, includes at least one of: a ridge, a slot, an insert, an indent, a dimple, a hole, a post, a Vernier scale, a registration mark, or a mating feature. In some embodiments, the registration feature136may be at a known distance138with respect to the reference surface118, the light-emitter substrate110, and/or the epitaxially-grown laser diode region113. FIG.3Dillustrates a step330in a manufacturing method, according to an example embodiment. Step330includes registering an optical lens element130to the at least one registration feature136. The at least one optical lens element130could include a fast-axis collimating (FAC) lens132. Furthermore, step330could include, after registering the optical lens element130to the at least one registration feature136, coupling the optical lens element130to the optical material140. For example, the optical lens element130could be coupled to the optical material140by way of an optical epoxy, or another optically-transparent adhesive material. Additionally or alternatively, the optical lens element130and the optical material140could be coupled by way of a mechanical coupling (dovetail joint, interlocking members, etc.). As a result of registering and coupling the optical lens element130to the at least one registration feature136, a pointing axis (e.g., a longitudinal axis) of the laser diode junction113of the light-emitter substrate110and the optical axis150may be positioned to within a predetermined tolerance value (e.g., within ten microns of one another). Additionally or alternatively, the pointing axis of the laser diode junction113could be positioned within a desired angle range or cone with respect to the optical axis150of the FAC lens132. In some embodiments, registering the optical lens element130to the at least one registration feature136includes registering a second mold structure to the at least one registration feature. The second mold structure could include an interior volume with a shape configured to form the FAC lens132and optical lens element130generally. Once the second mold structure is aligned to the registration feature136, optical epoxy or some other material could be introduced into the second mold structure. The optical epoxy could be subsequently cured. In some embodiments, the cured optical epoxy could reflect the shape of the interior volume of the second mold structure. FIG.3Eillustrates a step340in a manufacturing method, according to an example embodiment. In some embodiments, step340includes coupling, during a first soldering operation, at least one spacer122to the backside surface120of the carrier substrate116. In some embodiments, the at least one spacer122could include a controlled-collapse solder ball. That is, in an example embodiment, the at least one spacer122could be sintered, soldered, melted, physically pressed, or otherwise coupled to the backside surface120of the carrier substrate116. FIG.3Fillustrates a step350in a manufacturing method, according to an example embodiment. In a second solder operation, the ensemble illustrated inFIG.3Ecould be attached to a further surface126of a further substrate124. In an example embodiment, the further substrate124could include a laminate printed circuit board having one or more control circuits128. As described elsewhere herein, the control circuits128could be configured to provide current/voltage pulses to the laser diode so as to cause the light-emitter substrate110to emit light pulses. In some scenarios, the at least one spacer122could include one or more controlled-collapse solder balls with a plastic core. Such controlled-collapse solder balls could be configured to provide a standoff distance between the backside surface120of the carrier substrate116and the further surface126of the further substrate124. In some embodiments, the at least one spacer122could selected to position the light-emitter substrate110and laser diode region113so as to be in coaxial alignment with the optical axis150and/or within a predetermined tolerance value and/or angular range152. In other words, the at least one laser diode junction113and the optical axis150of the optical lens element130are aligned within a tolerance value. In an example embodiment, the tolerance value is less than ten microns, as measured between the optical axis of the optical lens element and at least one of: an emission axis of the laser diode junction113, an emission plane of the laser diode junction113, or a known distance from the first surface112of the light-emitter substrate110. In some embodiments, the backside surface120of the carrier substrate116is coupled to the further substrate124using spacers122. The spacers122are configured to maintain at least one of a desired height or a desired orientation of the carrier substrate116with respect to the further substrate124. The spacers122include plastic core solder balls configured to, after melting, maintain the desired height between the carrier substrate116and the further substrate124. FIG.5illustrates a method500, according to an example embodiment. Method500may be carried out, at least in part, by way of some or all of the manufacturing steps or blocks illustrated and described in reference toFIGS.3A-3F. It will be understood that the method500may include fewer or more steps or blocks than those expressly disclosed herein. Furthermore, respective steps or blocks of method500may be performed in any order and each step or block may be performed one or more times. In some embodiments, method500and its steps or blocks may be performed to provide an optical system that could be similar or identical to optical system100, as illustrated and described in reference toFIGS.1and2. Block510includes coupling a first surface112of a light-emitter substrate110to a reference surface118of a carrier substrate116. As described herein, coupling the first surface112to the reference surface118could include applying an indium eutectic, one or more ball bonds, one or more wire bonds, an adhesive material, or other ways to physically couple two substrates. Block520includes registering a mold structure312with respect to the reference surface118or mating feature119of the carrier substrate116. In some embodiments, registering a mold structure312with respect to the reference surface118and/or the mating feature119could include performing a photolithography-based alignment (e.g., aligning alignment features on respective surfaces/structures). Other ways to physically align two structures are possible and contemplated. Block530includes after registering the mold structure312with respect to the reference surface118or mating feature119, forming an optical material140over at least a portion of the light-emitter substrate110, according to a shape of the mold structure312, wherein the optical material140comprises at least one registration feature136. In some embodiments, forming the optical material140could include injecting an optical epoxy into the mold structure312and curing the optical epoxy. It will be understood that other ways to form optical material140(e.g., additive manufacturing techniques) are possible and contemplated. Block540includes registering an optical lens element130to the at least one registration feature136. In some embodiments, the optical lens element130could include a fast-axis collimation lens132. Registering the optical lens element130to the registration feature136could provide one degree of freedom—into and out of the page. Other ways to register the optical lens system for zero degrees of freedom are possible and contemplated. Using such a registration feature could provide reliable alignment for a plurality of light-emitter devices. For example, returning toFIG.2, a plurality of light-emitter substrates110could be provided along an axis running “into the page”. Block550includes, after registering the optical lens element130to the at least one registration feature136, coupling the optical lens element130to the optical material140. In such scenarios, coupling the optical lens element130to the optical material140could include, for example, utilizing an optical epoxy or another type of adhesive material. The particular arrangements shown in the Figures should not be viewed as limiting. It should be understood that other embodiments may include more or less of each element shown in a given Figure. Further, some of the illustrated elements may be combined or omitted. Yet further, an illustrative embodiment may include elements that are not illustrated in the Figures. A step or block that represents a processing of information can correspond to circuitry that can be configured to perform the specific logical functions of a herein-described method or technique. Alternatively or additionally, a step or block that represents a processing of information can correspond to a module, a segment, a physical computer (e.g., a field programmable gate array (FPGA) or application-specific integrated circuit (ASIC)), or a portion of program code (including related data). The program code can include one or more instructions executable by a processor for implementing specific logical functions or actions in the method or technique. The program code and/or related data can be stored on any type of computer readable medium such as a storage device including a disk, hard drive, or other storage medium. The computer readable medium can also include non-transitory computer readable media such as computer-readable media that store data for short periods of time like register memory, processor cache, and random access memory (RAM). The computer readable media can also include non-transitory computer readable media that store program code and/or data for longer periods of time. Thus, the computer readable media may include secondary or persistent long term storage, like read only memory (ROM), optical or magnetic disks, compact-disc read only memory (CD-ROM), for example. The computer readable media can also be any other volatile or non-volatile storage systems. A computer readable medium can be considered a computer readable storage medium, for example, or a tangible storage device. While various examples and embodiments have been disclosed, other examples and embodiments will be apparent to those skilled in the art. The various disclosed examples and embodiments are for purposes of illustration and are not intended to be limiting, with the true scope being indicated by the following claims. | 25,525 |
11942758 | MODES FOR CARRYING OUT INVENTION Embodiment 1 An end face protective film forming method for a semiconductor laser, a semiconductor laser device manufacturing method, a semiconductor device manufacturing method, a semiconductor laser device20and a semiconductor device50according to Embodiment 1 will be described referring to the drawings. The same or corresponding components are denoted by the same reference numerals, and repetitive description may be omitted.FIG.1is a flow diagram of a semiconductor device manufacturing method including an end face protective film forming method for a semiconductor laser and a semiconductor laser device manufacturing method according to Embodiment 1.FIG.2is a diagram showing a semiconductor laser device according to Embodiment 1 andFIG.3is a diagram showing a semiconductor device according to Embodiment 1.FIG.4is a bird's eye view of a semiconductor laser bar according to Embodiment 1 andFIG.5is a cross sectional view of the semiconductor laser bar ofFIG.4perpendicular to the y-direction.FIG.6is a bird's eye view of the semiconductor laser bar ofFIG.2with a protective film formed thereon.FIG.7is a cross sectional view of the semiconductor laser bar ofFIG.4perpendicular to the x-direction andFIG.8is a cross sectional view of the semiconductor laser bar ofFIG.6perpendicular to the x-direction.FIG.9is a bird's eye view of a submount bar ofFIG.2, andFIG.10is a cross sectional view of the submount bar ofFIG.9perpendicular to the x-direction.FIGS.11,12, and13each are diagrams illustrating a method of installing the semiconductor laser bar ofFIG.4and the submount bar ofFIG.9in an installation jig.FIG.14is a diagram showing the installation jig according to Embodiment 1, andFIG.15is a side view of the installation jig ofFIG.14in the x-direction.FIGS.16and17each are diagrams illustrating a bonding step according to Embodiment 1.FIGS.18and19each are diagrams illustrating a protective film forming step according to Embodiment 1. A semiconductor laser device20includes a semiconductor laser bar33which is a bar-shaped semiconductor laser having a protective film19formed on cleaved end faces14, and a submount bar21which is a bar-shaped submount having a main body and a metal layer23. The main body of the sub-mount bar21is a submount bar body22. The semiconductor laser bar33includes a semiconductor structure part16in which a plurality of light emitting regions18is formed, a surface side electrode15aformed on a surface of the semiconductor structure part16(the surface opposite to the surface facing the submount bar21), a back side electrode15bformed on the back surface of the semiconductor structure part16(the surface facing the submount bar21), and a protective film19formed on the cleaved end faces14. Each of the front side electrode15aand the back side electrode15bis formed on a different surface from the cleaved end faces14of the semiconductor structure part16. The reference numeral3denotes the semiconductor laser bar having no protective film19formed on the cleaved end faces14. The semiconductor device50includes the semiconductor laser bar33and the submount bar21that are the semiconductor laser device20, and a block51having a block main body52and a metal layer53. The metal layer53is made of gold or the like. The metal layer53is formed on the surface of the block main body52(the surface facing the submount bar21), and the semiconductor laser device20is mounted on the block51by being fixed thereto with solder24which is a brazing material. Here, the coordinate system of the semiconductor laser device20and the semiconductor device50will be described. The longitudinal direction and the lateral direction of the semiconductor laser bar3or33are respectively set to the x-direction and the y-direction, and the direction from the back side electrode15bto the front side electrode15aof the semiconductor laser bar3or33is set to the z-direction. Referring toFIG.1, an end face protective film forming method for the semiconductor laser, a semiconductor laser device manufacturing method, and a semiconductor device manufacturing method will be described. In step S001, the submount bar21and the semiconductor laser bar3that are formed in a bar shape are prepared (material preparation step). In step S002, the semiconductor laser bar3and the submount bar21that are provided in plural number are alternately stacked and installed on an installation jig40(jig installation step). In step S003, the installation jig40in which the semiconductor laser bar3and the submount bar21are fixed is installed in an end face protective film forming apparatus60for forming the protective film19, and the semiconductor laser bar3and the submount bar21are bonded (bonding step). In step S004, the protective film19is formed on the cleaved end faces14of the semiconductor laser bar3in the end face protective film forming apparatus60(protective film forming step). In step S005, the installation jig40is taken out from the end face protective film forming apparatus60, and the semiconductor laser device20having the semiconductor laser bar33with the protective film19formed on the cleaved end faces14is individually taken out from the installation jig40(semiconductor laser device unloading step). Step S001up to step S005are a method of manufacturing the semiconductor laser device20, that is, the semiconductor laser device manufacturing method. When a product is manufactured using the semiconductor laser device20, since there are subsequent steps, the semiconductor laser device manufacturing method of step S001up to step S005will be referred to as a semiconductor laser device manufacturing step. In step S006, the manufactured semiconductor laser device20is fixed to and mounted on the block51to manufacture the semiconductor device50(block mounting step). Step S001up to step S006are a semiconductor device manufacturing method of manufacturing the semiconductor device50. Step S002up to step S004are of an end face protective film forming method for the semiconductor laser. Note that, the semiconductor device manufacturing method includes the semiconductor laser device manufacturing step and the block mounting step. Next, each of the step S001to step S006will be described in detail. The material preparation step of step S001includes a submount bar preparation step of preparing the submount bar21formed in a bar shape and a laser bar preparation step of preparing the semiconductor laser bar3formed in a bar shape. In the submount bar preparation step, the submount bar body22which is a plate-like semiconductor substrate of AlN, SiC or the like separated in a bar shape is produced, and the metal layer23of Au (gold) or the like is formed on a surface (front side surface) to which the back side electrode15bof the semiconductor laser bar3is to be bonded, using a vapor deposition apparatus, a sputtering apparatus, plating technique or the like. The metal layer23is a metal layer to be bonded to the back side electrode15bof the semiconductor laser bar3, and needs to be a metal to be diffusion bonded with the metal. In the case of the diffusion bonded metal between dissimilar metals, the metal layer23may be made of Ag (silver), Pt (platinum) or the like. In general, the back side electrode15bof the semiconductor laser bar33is made of gold, and in this case, the metal layer23is preferably made of gold. In general, it is not preferable to apply a high temperature to the semiconductor laser, and the high temperature causes element degradation. In the case of gold bonding in which gold is bonded to gold, it has been found that the temperature required for bonding is low and is 150 to 200° C. in a high vacuum. An example of gold bonding at 150° C. in air is shown (refer to the Journal of the Japan Society for Precision Engineering, Vol. 79, No. 8, (2013), pp. 719-724). This temperature range does not adversely affect the semiconductor laser. In Embodiment 1, the metal layer23is not formed on the surface (back side surface) of the submount bar21which is not to be bonded to the semiconductor laser bar3. As a result, even if the end face protective film is formed in a state in which the semiconductor laser bar3and the submount bar21that are provided in plural number are in contact with each other (seeFIG.13), the back side surface of the submount bar21and the front side electrode15aof the semiconductor laser bar33are not bonded, namely, the semiconductor laser devices20are not bonded to each other, and the work of taking out the semiconductor laser device20from the installation jig40becomes easy. In the laser bar preparation step, epitaxial layers that constitute the semiconductor laser structure are stacked on a semiconductor substrate made of GaAs, InP, etc. using metal-organic chemical vapor deposition (MOCVD) or molecular beam epitaxy (MBE) apparatus. Then, stripe regions are formed using photolithography technique, etching technique, and impurity implantation technique, etc. After that, a passivation film such as SiN, SiO2, etc. is formed using a vapor deposition apparatus, a sputtering apparatus, chemical vapor deposition (CVD) apparatus, etc. In order to efficiently inject current for driving the semiconductor laser into the stripe region, the semiconductor substrate is thinned to form the semiconductor structure part16. Then, a wafer having the light-emitting regions18of the semiconductor laser for several thousand elements is fabricated in which the semiconductor structure part16is provided with electrodes formed using a vapor deposition apparatus and a sputtering apparatus on the surface of the stacked structure and on the back side surface of the semiconductor substrate. Next, as shown inFIG.4, the fabricated wafer is cleaved along the crystal axis direction to form the cleaved end faces14, which are the end faces of the semiconductor laser, and is separated in a bar shape to fabricate the semiconductor laser bar3. The front side electrode15a, for example, has a layered structure of Ti (titanium)/Pt/Au. Au (gold) is the outermost surface metal. The back side electrode15bis only gold or has a layered structure in which the outermost surface metal is gold. It is preferable that the outermost surface metal of the films that make up each of the front side electrode15aand the back side electrode15bbe gold. Next, the jig installation step of step S002is performed. The semiconductor laser bar3and the submount bar21that are prepared are to be installed in the installation jig40. The installation jig40includes a fixing plate42, an opening member41having an opening43, a pusher46, and a lid44. For example, one opening member41(first opening member) is fixed to the fixing plate42by fixation screws39. The other opening member41(second opening member) is fixed to the fixing plate42by the fixation screws39after the semiconductor laser bar3and the submount bar21are arranged on the fixing plate42. As shown inFIG.13, the semiconductor laser bar3and the submount bar21are to be sequentially stacked and arranged on the fixing plate42such that the submount bar21is on the lower side with respect to the fixing plate42. First, as shown inFIG.11, the submount bar21is brought into contact with the opening member41and is placed on the fixing plate42. Next, as shown inFIG.12, the semiconductor laser bar3is brought into contact with the opening member41and placed on the submount bar21such that the back side electrode15bthereof is brought into contact with the metal layer23of the submount bar21. The installation of an intermediary body34in which the submount bar21and the semiconductor laser bar3constituting the semiconductor laser device20are stacked is completed. As shown inFIG.15, a plurality of the intermediary bodies34is sequentially stacked on the intermediary body34described above.FIG.15shows an example in which four intermediary bodies34are installed in the installation jig40. The material of the installation jig40including the pusher46is preferably stainless steel (SUS). A method of placing the next intermediary body34on the lower intermediary body34will be described in detail. As shown inFIG.13, the submount bar21is brought into contact with the opening member41and is placed on the semiconductor laser bar3such that the back side surface (the surface opposite to the metal layer23) of the submount bar21is brought into contact with the front side electrode15aof the semiconductor laser bar3in the intermediary body34of the lower layer. Next, the semiconductor laser bar3is brought into contact with the opening member41and is placed on the submount bar21such that the back side electrode15bthereof is brought into contact with the metal layer23of the submount bar21.FIG.13shows an example of three intermediary bodies34each in which the submount bar21and the semiconductor laser bar3are stacked are installed on the fixing plate42of the installation jig40. The back side electrode15bof the semiconductor laser bar3is in contact with the metal layer23formed on the submount bar21. The front side electrode15aof the semiconductor laser bar3is in contact with the back side surface of the submount bar21on which the metal layer23is not formed or in contact with the pusher46, namely, the front side electrode15ais intended not to be in contact with the metal layer23formed on the submount bar21. After a plurality of the intermediary bodies34is installed on the fixing plate42, the other opening member41is arranged on the fixing plate42such that the intermediary bodies34each having the submount bar21and the semiconductor laser bar3are sandwiched together with the fixed opening member41, and is temporarily fixed to the fixing plate42by the fixation screws39. At this time, when both ends of the cleaved end face14of the semiconductor laser bar3, namely, both ends in the longitudinal direction (both ends in the x-direction), are not arranged outside the opening43of the opening member41, the arrangement is adjusted such that both ends of the cleaved end face14of the semiconductor laser bar3are outside the opening43of the opening member41. Thereafter, the pusher46as a pressing jig is placed on the uppermost intermediary body34, and the lid44is placed on the fixing plate42so as to cover the longitudinal end faces (end faces in the x-direction) of a plurality of the intermediary bodies34and the surface of the pusher46. A bolt48is inserted into a hole38formed in the opening member41, and the lid44is fixed to the two opening members41by a nut49. Thereafter, the other opening member41which is temporarily fixed is fixed to the fixing plate42, the fixation screw39is screwed into the screw hole37formed in the lid44, and thus a plurality of the intermediary bodies34is sandwiched and fixed between the fixing plate42and the pusher46. In the jig installation step, the submount bar21and the semiconductor laser bar3that are provided in plural number are arranged on an installation jig40such that one cleaved end face14and the other cleaved end face14of the semiconductor laser bar3are exposed from the openings43of one opening member41(first opening member) and the other opening member41(second opening member), respectively, and the submount bar21and the semiconductor laser bar3that are provided in plural number are installed and fixed on the installation jig40in a state in which they are pressed against the fixing plate42by the pusher46. The pressure for pressing the intermediary body34applied by the pusher46needs to be sufficient for metal bonding between the semiconductor laser bar3and the submount bar21. The semiconductor laser bar3and the submount bar21are fixed in a state in which they are pressed in the installation jig40using the pusher46, and then the jig installation step is completed. The pressure for pressing the intermediary bodies34is, for example, 70 gf cm. The installation jig40in which the semiconductor laser bar3and the submount bar21that are provided in plural number are placed is installed in the end face protective film forming apparatus60, and the bonding step of step S003and the protective film forming step of step S004are performed. The end face protective film forming apparatus60is, for example, a sputtering apparatus, a vapor deposition apparatus, a CVD apparatus, an MBE apparatus, or the like.FIG.16shows three intermediary bodies34a,34b, and34cinstalled in the end face protective film forming apparatus60. Reference numeral34is collectively used for the intermediary body, and34a,34b, and34care used for discrimination. Similarly, reference numeral3is collectively used for the semiconductor laser bar, and3a,3b, and3care used for discrimination. Reference numeral21is collectively used for the submount, and21a,21b, and21care used for discrimination.FIG.16shows a cross sectional view perpendicular to the x-direction in the three intermediary bodies34a,34band34cwhich each have the semiconductor laser bar3with the cleaved end faces14arranged on the right and left sides in the y-direction. The opening members41(not shown) are arranged on the right and left sides of the intermediary bodies34a,34b, and34c, namely, on the negative and positive sides in the y-direction, and the pusher46(not shown) is arranged on the surface on the side in the positive z-direction of the intermediary body34c. The intermediary body34ahas the submount bar21aand the semiconductor laser bar3a. Similarly, the intermediary body34bhas the submount bar21band the semiconductor laser bar3b, and the intermediary body34chas the submount bar21cand the semiconductor laser bar3c. After the installation jig40in which the semiconductor laser bar3and the submount bar21that are provided in plural number are placed is installed in the end face protective film forming apparatus60, it is preferable to make the inside of the end face protective film forming apparatus60vacuum in order to prevent oxidation of the cleaved end faces14of the semiconductor laser bar3and to prevent adhesion of an impurity such as carbon (C). Thereafter, the temperature inside the end face protective film forming apparatus60, that is, inside the protective film forming chamber (main chamber), is raised, and the metal layer23formed on the submount bar21and the back side electrode15bof the semiconductor laser bar3are bonded as shown inFIG.17. In the case where the surface of the back side electrode15bof the semiconductor laser bar3is gold and the metal layer23of the submount bar21is gold, the submount bar21and the semiconductor laser bar3are to be bonded by the gold. For example, the temperature in the metal bonding that is the temperature performed at the bonding step is 150 to 200° C. The temperature in the metal bonding preferably be less than the protective film forming temperature for forming the protective film19, and be the temperature at which the metal layer23of the submount bar21is bonded to the surface metal of the back side electrode15bof the semiconductor laser bar3. In the intermediary body34in which the semiconductor laser bar3and the submount bar21are bonded, that is, in the intermediary body34for which bonding step is completed, a metal bonding portion61in which the metal layer23of the submount bar21and the back side electrode15bof the semiconductor laser bar3are bonded is formed. Note that,FIG.17shows a state in which there are small gaps between the intermediary bodies adjacent to each other due to thermal expansion of the three intermediary bodies34a,34b, and34c. InFIG.17, the end face protective film forming apparatus60is omitted, and the gaps are exaggerated. Also, inFIGS.18and19, the end face protective film forming apparatus60is omitted, and the gaps are exaggerated. Next, as shown inFIG.18, after the bonding step, the temperature inside the end face protective film forming apparatus60is changed to the protective film forming temperature, and protective film particles8are adhered to one of the cleaved end faces14of the semiconductor laser bar3from the opening43of the opening member41to form the protective film19. The protective film19consists of, for example, an oxide film such as Al2O3or SiO2or a nitride film such as SiN or the like. When the protective film is formed, the protective film forming temperature is set higher than the room temperature in order to control a composition of the protective film19and improve the film quality thereof. For example, the protective film forming temperature is 100 to 150° C. After the protective film19is formed on one of the cleaved end faces14, as shown inFIG.19, the installation jig40is rotated by 180 degrees by a rotating mechanism (not shown) of the end face protective film forming apparatus60, and the protective film19is formed by adhering the protective film particles8to the other side of the cleaved end faces14. That is, in the protective film forming step, after the protective film19is formed on one of the cleaved end faces14of the semiconductor laser bar3, the orientation of the installation jig40is changed so that the protective film particles8which are material particles of the protective film19reach the other of the cleaved end faces14of the semiconductor laser bar3without disassembling the installation jig40, and thus the protective film19is formed on the other of the cleaved end faces14of the semiconductor laser bar3.FIGS.18and19show an example in which the protective film particles8advance from right to left. In addition, three intermediary bodies34a,34b, and34care shown in which small gaps are formed between the intermediary bodies adjacent to each other due to thermal expansion thereof. At this time, since the back side surface of the submount bar21and the front side electrode15aof the semiconductor laser bar3are uneven, the installation jig40restricts the movement of the intermediary bodies34a,34b,34cin the x-direction, the y-direction, and the z-direction with the pusher46pushing them, there is very little possibility that the gap is extended from the cleaved end face14on the upstream side (positive side in the y-direction) to the cleaved end face14on the downstream side (negative side in the y-direction), which is the direction the protective film particles8advance. The rotating mechanism may be provided in a sub-chamber provided in the end face protective film forming apparatus60. In this case, after the installation jig40is once returned to the sub-chamber and inverted and then installed again in the end face protective film forming apparatus60, the protective film19is formed. In the case where the rotating mechanism is installed in the main chamber where the protective film19is to be formed or the sub-chamber in the end face protective film forming apparatus60, the installation jig40is not exposed to the atmosphere, so that the natural oxide film to be formed on the cleaved end faces14can be significantly reduced. When the end face protective film forming apparatus60has no rotating mechanism, after the protective film19is formed on one of the cleaved end faces14, the installation jig40is taken out from the end face protective film forming apparatus60and is inverted by a conveying apparatus or the like, and after the installation jig40is installed again in the end face protective film forming apparatus60, the protective film19is to be formed on the other of the cleaved end faces14. Even when the end face protective film forming apparatus60is taken out during the protective film forming step, the amount of the natural oxide film to be formed on the cleaved end faces14can be reduced as compared with the end face protective film forming method of Patent Document 1 in which the protective film is to be formed on the cleaved end faces after the steps of die bonding to the submount, wire bonding, and heat resistant sheet covering, after the cleaved end faces are formed on the semiconductor lasers. Note that, an example is described in which the installation jig40is inverted, namely, it is rotated by 180 degrees, but 180 degrees is not a limitation. In the case where the source of the protective film particles8to form the protective film19is only one, the cleaved end face14needs to face the source of the protective film particles8, and for example, the angle between a perpendicular line perpendicular to the cleaved end face14and the line connecting the source and the center of the cleaved end face14in the longitudinal direction needs to be within 30 degrees. In the case where the protective film particles8are generated from two sources, the opening43of the installation jig40from which the cleaved end face14without the protective film19formed are exposed is directed toward the other source. In general, when a semiconductor laser bar is fixed to a jig as shown in FIG. 5 of Patent Document 1, a spacer is inserted between the semiconductor laser bars. During the protective film formation, a gap is generated between the semiconductor laser bar and the spacer due to the difference in thermal expansion coefficients of the semiconductor laser bar, the spacer, and the like as a result of the temperature rise at the protective film formation, and the protective film particles enter the gap and adhere to the electrode surface of the semiconductor laser bar. However, in the formation of the semiconductor laser end face protective film of Embodiment 1, even if the temperature of the portion where the metal bonding portion61is formed rises to the temperature of the formation of the protective film, the metal bonding portion61is already formed and no gap is generated between the semiconductor laser bar3and the submount bar21that are bonded. Therefore, the protective film particles8cannot adhere to each of the surfaces where the metal layer23of the submount bar21and the back side electrode15bof the semiconductor laser bar3are bonded. In general, the semiconductor laser bar and the submount bar are bonded with solder which is a brazing material. However, in the formation of the semiconductor laser end face protective film of Embodiment 1, the metal layer23of the submount bar21and the back side electrode15bof the semiconductor laser bar33are metal-bonded without using solder. In the case where the semiconductor laser device20of Embodiment 1 is bonded with gold, that is, in the case where the metal layer23of the submount bar21is gold, the surface of the back side electrode15bof the semiconductor laser bar33is gold, and the metal bonding portion61is a gold bonding portion. Since the thermal conductivity of gold is higher than that of solder, heat generated by driving the semiconductor laser bar can be efficiently discharged to the submount bar21. Here, the thermal conductivity of gold (Au) is 315 w/m·K and that of gold-tin (AuSn) solder is 57 w/m·K. Although the example is described in which the bonding step is performed in the end face protective film forming apparatus60, the bonding step may be performed in another apparatus. However, it is more efficient in terms of workability and cost to perform the bonding step in the end face protective film forming apparatus60. Next to the protective film forming step of step S004, a semiconductor laser device unloading step of step S005is performed. An installation jig40is taken out from the end face protective film forming apparatus60, and the semiconductor laser device20having the semiconductor laser bar33with the protective film19formed on the cleaved end faces14is individually taken out from the installation jig40. Thereafter, a block mounting step of step S006is performed. Solder or the like is supplied to the back side surface of the submount bar21of the semiconductor laser device20, and the semiconductor laser device20is mounted on the block51. The semiconductor laser device20is bonded to the metal layer53of the block51with a brazing material such as the solder24. Note that, the semiconductor laser device20may be mounted on the block51after supplying the brazing material such as the solder24to the metal layer53of the block51. In the end face protective film forming method for the semiconductor laser of Embodiment 1, the semiconductor laser bar3and the submount bar21are metal-bonded before the protective film19is formed on the cleaved end faces14of the semiconductor laser bar3, so that no gap is generated between the metal layer23of the submount bar21and the back side electrode15bof the semiconductor laser bar3when the protective film19is formed, and therefore, the protective film particles8do not adhere to each of the surfaces where the metal layer23of the submount bar21and the back side electrode15bof the semiconductor laser bar3are bonded. In the semiconductor laser device20and the semiconductor device50of Embodiment 1, since the protective film particles8do not adhere to each of the surfaces where the metal layer23of the submount bar21and the back side electrode15bof the semiconductor laser bar3are bonded, the heat generated by the driving of the semiconductor laser device20and the semiconductor device50can be efficiently discharged to the submount bar21, and the element degradation caused by the end face, such as the COD degradation, can be suppressed. In the end face protective film forming method for the semiconductor laser of Embodiment 1, the bonding step in which the semiconductor laser bar3and the submount bar21are metal-bonded and the protective film forming step in which the protective film19is formed on the cleaved end faces14of the semiconductor laser bar3can be performed in the same apparatus, and the steps from the forming of the cleaved end faces14of the semiconductor laser bar3using cleavage technique up to the forming of the protective film19can be performed in several hours. Therefore, in the end face protective film forming method for the semiconductor laser of Embodiment 1, since the time during which the cleaved end faces14of the semiconductor laser bar3is exposed to the atmosphere is short, the natural oxide film on the cleaved end faces14of the semiconductor laser bar3, which is one of the causes of the degradation of the semiconductor laser device20and the semiconductor device50, can be reduced as compared with the conventional method. In the protective film forming method shown in FIG. 3 of Patent Document 1, since a semiconductor laser chip is fixed and mounted on a submount, and the semiconductor laser and the submount are connected by a wire and then installed in a jig (installation jig) used for forming the protective film, it is necessary to protect the electrode surface of the submount with a heat resistant sheet, and thus a problem arises in that the work steps are complicated and the workability is poor. In contrast, in the end face protective film forming method for the semiconductor laser of Embodiment 1, the jig installation step of step S002, the bonding step of step S003, and the protective film forming step of step S004can be performed using the bar-shaped semiconductor laser bar3and the submount bar21. In the semiconductor device manufacturing method of Embodiment 1, after the step of the end face protective film forming method for the semiconductor laser, the semiconductor laser device unloading step of step S005and the block mounting step of step S006can be performed using the semiconductor laser bar3and the submount bar21that are bonded. That is, in the end face protective film forming method for a semiconductor laser of Embodiment 1, the semiconductor laser bar3and the submount bar21can be installed in the installation jig40in a short time without performing the die bonding step, the wire bonding step, and the heat-resistant sheet covering step in the protective film forming method shown in FIG. 3 of Patent Document 1, and thereafter, with the semiconductor laser bar3and the submount bar21kept installed in the installation jig40, they can be bonded in the bonding step and the protective film forming step of the semiconductor laser bar3can be performed. Therefore, the end face protective film forming method for the semiconductor laser of Embodiment 1 is superior in the workability to the protective film forming method shown in FIG. 3 of Patent Document 1. In the semiconductor laser device20and the semiconductor device50of Embodiment 1, since the back side electrode15bof the semiconductor laser bar3and the metal layer23of the submount bar21each have a metal surface on which no pattern is formed, the bonding area between the back side electrode15bof the semiconductor laser bar3and the metal layer23of the submount bar21can be made wide, and the heat dissipation from the semiconductor laser bar3to the submount bar21can be enhanced. Since the semiconductor device manufacturing method and the semiconductor laser device manufacturing method of Embodiment 1 include the end face protective film forming method for the semiconductor laser of Embodiment 1, the same effects as those of the end face protective film forming method for the semiconductor laser of Embodiment 1 are obtained. In the semiconductor laser device20of Embodiment 1, since the protective film19is formed on the cleaved end faces14of the semiconductor laser bar3with the natural oxide film reduced, it is possible to suppress the element degradation caused by the end face, such as COD degradation. Further, in the semiconductor laser device20of Embodiment 1, since the protective film particles8do not adhere between the back side electrode15bof the semiconductor laser bar3and the metal layer23of the submount bar21, heat generated by driving the semiconductor laser device20can be efficiently discharged to the submount bar21, and element degradation caused by the end surface, such as COD degradation, can be suppressed. Since the semiconductor device50of Embodiment 1 includes the semiconductor laser device20of Embodiment 1, the same effects as those of the semiconductor laser device20of Embodiment 1 can be obtained. As described above, the semiconductor laser device manufacturing method of Embodiment 1 is a method of manufacturing the semiconductor laser device in which the protective film19is formed on the cleaved end faces14of the semiconductor laser bar3which is the bar-shaped semiconductor laser. In the semiconductor laser bar3, the front side electrode15ais formed on one surface different from the cleaved end faces14, and the back side electrode15bis formed on the surface opposite to the one surface. The method includes: the material preparation step of forming the metal layer23on the front side surface of the bar-shaped submount bar body22which is to face the semiconductor laser bar3, to prepare the bar-shaped submount bar21on which the semiconductor laser bar3is to be mounted; the jig installation step of installing the submount bar21and the semiconductor laser bar3that are provided in plural number alternately stacked on the installation jig40such that the metal layer23of the submount bar21and the back side electrode15bof the semiconductor laser bar3face each other; the bonding step of bonding the metal layer23and the back side electrode15bby increasing the temperature of the installation jig40on which the submount bar21and the semiconductor laser bar3that are provided in plural number are installed; and the protective film forming step of forming the protective film19on the cleaved end faces14of the semiconductor laser bar3in the protective film forming apparatus (end face protective film forming apparatus60) using the installation jig40in which the submount bar21and the semiconductor laser bar3that are provided in plural number are installed, after the bonding step. In the end face protective film forming method for the semiconductor laser of Embodiment 1, the submount bar21and the semiconductor laser bar3that are provided in plural number are alternately stacked and installed on the installation jig40, and after the metal layer23of the submount bar21and the back side electrode15bof the semiconductor laser bar3are bonded, the protective film19is formed on the cleaved end faces14of the semiconductor laser bar3, so that, when the protective film is formed on the cleaved end faces14of the semiconductor laser (semiconductor laser bar3), adhesion of the protective film19to the electrode surface (surface of the back side electrode15b) of the semiconductor laser (semiconductor laser bar3) on the side where the submount (submount bar21) is bonded can be prevented, and the protective film19can be formed on the cleaved end faces14of the semiconductor laser (semiconductor laser bar3) in which the natural oxide film is reduced more than in the conventional method. Embodiment 2 FIG.20is a diagram showing a semiconductor laser device according to Embodiment 2 andFIG.21is a diagram showing a semiconductor device according to Embodiment 2.FIG.22is a bird's eye view of a submount bar ofFIG.20andFIG.23is a cross sectional view of the submount bar ofFIG.22perpendicular to the x-direction.FIGS.24,25, and26each are diagrams illustrating a method of installing the semiconductor laser bar and the submount bar ofFIG.22in the installation jig.FIGS.27and28each are diagrams illustrating a bonding step according to Embodiment 2.FIGS.29and30each are diagrams illustrating a protective film forming step according to Embodiment 2. The semiconductor laser device20and the semiconductor device50of Embodiment 2 are different from the semiconductor laser device20and the semiconductor device50of Embodiment 1 in that solder25is formed on the back side surface of the submount bar body22in the submount bar21. Portions different from Embodiment 1 will be mainly described. InFIGS.28,29, and30, the end face protective film forming apparatus60is omitted, and gaps are exaggerated. In the material preparation step of step S001, the submount bar21having the solder25formed on the back side surface of the submount bar body22is prepared. In the submount bar preparation step in the material preparation step, the submount bar body22which is a plate like semiconductor substrate such as AlN or SiC separated in a bar shape is produced, and the metal layer23is formed on a surface (front side surface) to which the back side electrode15bof the semiconductor laser bar3is to be bonded, using a vapor deposition apparatus, a sputtering apparatus, plating technique or the like. Next, the solder25made of tin-copper (SnCu), tin-silver-copper (SnAgCu) or the like is formed on the back side surface which is on the side opposite to the metal layer23of the submount bar body22, using a vapor deposition apparatus, a sputtering apparatus or the like. Here, the solder25to be formed on the submount bar body22needs to be selected from a material that does not melt at the processing temperature of the bonding step of step S003. For example, the melting point of the SnCu solder is 230° C. For example, in the case where the outermost surface metal of the films that make up the front side electrode15aand the back side electrode15bis gold and the metal layer23is gold, the submount bar21and the semiconductor laser bar3are gold-bonded. When the processing temperature at which the submount bar21and the semiconductor laser bar3are gold-bonded is 150 to 200° C., the solder25made of SnCu, SnAgCu or the like does not melt. For example, the melting point of SAgCu is 219° C. Further, since gold is not contained in the solder25, the solder25cannot be bonded to the front side electrode15aof the semiconductor laser bar3. The front side electrode15aof the semiconductor laser bar3bin the intermediary body34bunder the intermediary body34ccannot be bonded to the solder25of the submount bar21cin the intermediary body34c. That is, the front side electrode15aof the semiconductor laser bar3in one intermediary body34under another intermediary body34cannot be bonded to the solder25of the submount bar21in the another intermediary body34. The laser bar preparation step in the material preparation step, the jig installation step of step S002, the bonding step of step S003, the protective film forming step of step S004, and the semiconductor laser device unloading step of step S005are the same as those in Embodiment 1. Note that, in the jig installation step of step S002, the back side electrode15bof the semiconductor laser bar3is brought into contact with the metal layer23formed on the submount bar21as shown inFIG.26. Further, the front side electrode15aof the semiconductor laser bar3is in contact with the solder25of the back side surface of the submount bar21, and thus does not come into contact with the metal layer23formed on the submount bar21. The block mounting step of step S006is different from that in Embodiment 1. In the semiconductor laser device20in which the steps up to the semiconductor laser device unloading step of step S005is carried out, in the block mounting step of step S006, since the solder25is formed on the back side surface of the submount bar21, the semiconductor laser device20is mounted on the block51while the solder25is melted. When the solder25is cooled and solidified, the semiconductor laser device20is fixed to the block51. The solder25can be melted, for example, by a soldering gun, etc. or by heating the block51to the temperature higher than the melting temperature of the solder25. In the end face protective film forming method for the semiconductor laser of Embodiment 2, the semiconductor laser bar3and the submount bar21are metal-bonded before the protective film19is formed on the cleaved end faces14of the semiconductor laser bar3, and the bonding step and the protective film forming step can be carried out in the same apparatus, and the same effects as in the end face protective film forming method for the semiconductor laser of Embodiment 1 can be obtained. In the semiconductor device manufacturing method according to Embodiment 2, a brazing material such as the solder25necessary for the block mounting step is formed on the back side surface of the submount bar21which is not bonded to the semiconductor laser bar3, so that it is not necessary to separately supply solder or the like, and the work efficiency is improved as compared with the semiconductor device manufacturing method of Embodiment 1. Since the semiconductor device manufacturing method and the semiconductor laser device manufacturing method of Embodiment 2 include the end face protective film forming method for the semiconductor laser of Embodiment 2, the same effects as those of the end face protective film forming method for the semiconductor laser of Embodiment 2 are obtained. The semiconductor laser device20of Embodiment 2 has the same structure as that of the semiconductor laser device20of Embodiment 1 except that the solder25is formed on the back side surface of the submount bar21, so that the same effects as those of the semiconductor laser device20of Embodiment 1 are obtained. Since the semiconductor device50of Embodiment 2 includes the semiconductor laser device20of Embodiment 2, the same effects as those of the semiconductor laser device20of Embodiment 2 are obtained. Embodiment 3 FIG.31is a diagram showing a semiconductor laser device according to Embodiment 3 andFIG.32is a diagram showing a semiconductor device according to Embodiment 3.FIG.33is a bird's eye view of a semiconductor laser bar according to Embodiment 3 andFIG.34is a cross sectional view of the semiconductor laser bar ofFIG.33perpendicular to the y-direction.FIG.35is a diagram showing a surface electrode layer ofFIG.34.FIG.36is a bird's eye view of the submount bar ofFIG.31andFIG.37is a diagram showing a metal layer on the back side surface of the submount bar ofFIG.36. The semiconductor laser device20and the semiconductor device50of Embodiment 3 are different from the semiconductor laser device20and the semiconductor device50of Embodiment 2 in that the front side electrode of the semiconductor laser bar33is a patterned front side electrode26and a patterned metal layer27is formed on the back side surface of the submount bar21. Portions different from Embodiments 1 and 2 will be mainly described. In general, the front side electrode15aand the back side electrode15bin the semiconductor laser bar33provided with a plurality of the light emitting regions18are patterned for the purpose of efficient separation into a single semiconductor laser provided with one light emitting region18and for the purpose of recognizing the positions of the light emitting regions, etc. As shown inFIGS.34and35, the semiconductor laser bar33of Embodiment 3 includes the front side electrode26having a first electrode layer11and a patterned second electrode layer10formed on the surface of the first electrode layer11, and the back side electrode15bthat is not patterned. The second electrode layer10is a separated electrode layer that is the layer of the surface far from the back side electrode15b, and it is separated for each of the light emitting regions18. The first electrode layer11has a layered structure of, for example, Ti/Pt, and the second electrode layer10is gold. The back side electrode15bis only gold or has a layered structure in which the outermost surface is gold. It is preferable that the outermost surface metal of the films that make up the front side electrode15aand the back side electrode15bbe gold. An insulating film9is formed on the surface of the first electrode layer11on which the patterned second electrode layer10is not formed. Note that, inFIGS.31to33, the insulating film9on the surface of the semiconductor laser bar3or33is omitted. As shown inFIGS.36and37, the submount bar21of Embodiment 3 includes the metal layer23that is not patterned and a patterned metal layer27. The metal layer23is the same as that in Embodiment 1. When the outmost surface of the back side electrode15bof the semiconductor laser bar33is gold, the metal layer23is preferably gold. The patterned metal layer27has a plurality of separated metal patterns12. A non-metal region13is formed between the adjacent metal patterns12. The non-metal region13is, for example, the exposed back side surface of the submount bar body22. The metal layer27is gold or the like. Here, in the patterned metal layer27, the metal patterns12are formed such that the second electrode layer10of the front side electrode26patterned on the semiconductor laser bar3and the metal patterns12of the patterned metal layer27on the back side surface of the submount bar21do not come into contact with each other when the semiconductor laser bar3and the submount bar21are installed in the installation jig40. The end face protective film forming method for the semiconductor laser of Embodiment 3 is different from the end face protective film forming method for the semiconductor laser of Embodiments 1 and 2 in the material preparation step. In the submount bar preparation step in the material preparation step of step S001, the patterned metal layer27is formed on the back side surface of the submount bar21that is to be bonded to the block51, using photolithography technique, metal layer forming technique, and etching technique. The metal layer forming technique is technique of forming a metal layer using a vapor deposition apparatus, a sputtering apparatus or the like, or plating technique. The etching technique is technique of etching a part of a metal layer by dry etching or wet etching. In the laser bar preparation step in the material preparation step of step S001, a surface electrode26having the first electrode layer11and the patterned second electrode layer10formed on the surface of the first electrode layer11is formed on the surface of the semiconductor structure part16. The patterned second electrode layer10is formed using photolithography technique, metal layer forming technique, and etching technique. The jig installation step of step S002, the bonding step of step S003, the protective film forming step of step S004, and the semiconductor laser device unloading step of step S005are the same as those in Embodiment 1. In the jig installation step of step S002, the intermediary bodies34are arranged such that the second electrode layer10of the front side electrode26patterned on the semiconductor laser bar3does not come into contact with the metal patterns12of the metal layer27patterned on the back side surface of the submount bar21. In the block mounting step of step S006, after the semiconductor laser device20is arranged in the block51, the metal layer27of the semiconductor laser device20and the metal layer53of the block51are heated and bonded to each other to thereby fix and mount the semiconductor laser device20on the block51. When both the metal layer27and the metal layer53are gold, the metal layer27of the semiconductor laser device20and the metal layer53of the block51are to be gold-bonded. For example, the heating temperature in the block mounting step is 150 to 200° C. In the end face protective film forming method for the semiconductor laser of Embodiment 2, a case is considered in which the uppermost surface of the front side electrode15aof the semiconductor laser bar3that is not patterned is gold and the metal formed on the back side surface of the submount bar21is changed from the solder25to gold that is not patterned. In this case, in the bonding step of step S003, a problem will arise in that gold bonding occurs in a portion other than the desired portion, namely, the portion between the gold on the back side surface of the submount bar21and the un-patterned front side electrode15aof the semiconductor laser bar3of another intermediate body34, and thus the intermediary bodies34cannot be separated in the semiconductor laser device unloading step of step S005owing to the intermediary bodies34bonded to each other after the protective film forming step of step S004. However, as in the semiconductor laser end surface protective film forming method of Embodiment 3, when the front side electrode of the semiconductor laser bar3or33is the patterned front side electrode26and the patterned metal layer27is formed on the back side surface of the submount bar21, the semiconductor laser device20having the semiconductor laser bar33with the protective film19formed on the cleaved end faces14can be individually taken out from the installation jig40. In the end face protective film forming method for the semiconductor laser of Embodiment 3, the front side electrode of the semiconductor laser bar3is the patterned front side electrode26, and the patterned metal layer27is formed on the back side surface of the submount bar21, and in the jig installation step of step S002, the intermediary bodies34are arranged such that the second electrode layer10of the patterned front side electrode26in the semiconductor laser bar3and the metal patterns12of the patterned metal layer27on the back side surface of the submount bar21do not come into contact with each other. Therefore, in the bonding step of step S003, the metal bonding portion61by the gold bonding or the like can be formed only in the desired portion, namely, the portion between the back side electrode15bof the semiconductor laser bar3and the metal layer23of the submount bar21, and the metal bonding portion by the gold bonding or the like is not formed in the other portion. In the end face protective film forming method for the semiconductor laser of Embodiment 3, the semiconductor laser bar3and the submount bar21are metal-bonded before the protective film19is formed on the cleaved end faces14of the semiconductor laser bar3, and the bonding step and the protective film forming step can be performed in the same apparatus, and thus the same effects as in the end face protective film forming method for the semiconductor laser of Embodiment 1 can be obtained. The semiconductor device manufacturing method of Embodiment 3 is different from the method of manufacturing the semiconductor device of Embodiment 2 in that the semiconductor laser device20and the block51can be mounted in the block mounting step of step S006using the gold bonding. Since gold has a higher thermal conductivity than solder, heat dissipation between the submount bar21and the block51can be improved. In the semiconductor device manufacturing method of Embodiment 3, since the semiconductor laser device20can be mounted on the block51using the gold bonding, heat dissipation between the semiconductor laser device20and the block51can be improved as compared with the semiconductor device manufacturing method of Embodiment 2. Therefore, the semiconductor device50of Embodiment 3 can improve heat dissipation between the semiconductor laser device20and the block51as compared with the semiconductor device50of Embodiment 2. Note that, although the bonding area between the patterned metal layer27of the semiconductor laser device20and the metal layer53of the block51is smaller than the bonding area between the solder25of the semiconductor laser device20and the metal layer53of the block51in the semiconductor device50of Embodiment 2, there is no problem in the heat dissipation because the distance from the semiconductor laser bar3to the block51corresponds to the thickness of the submount bar21. Since the semiconductor device manufacturing method and the semiconductor laser device manufacturing method of Embodiment 3 include the end face protective film forming method for the semiconductor laser of Embodiment 3, the same effects as those of the end face protective film forming method for the semiconductor laser of Embodiment 3 are obtained. Since the semiconductor laser device20of Embodiment 3 has the same structure as that of the semiconductor laser device20of Embodiment 1 except that the patterned metal layer27is formed on the back side surface of the submount bar21and the patterned front side electrode26is formed on the front side surface of the semiconductor laser bar33, the same effects as those of the semiconductor laser device20of Embodiment 1 are obtained. Since the semiconductor device50of Embodiment 3 includes the semiconductor laser device20of Embodiment 3, the same effects as those of the semiconductor laser device20of Embodiment 3 are obtained. Note that, although the semiconductor laser device20is described as having a plurality of the light emitting regions18, the semiconductor laser device20may be separated into each of the light emitting regions18. That is, after the semiconductor laser device unloading step of step S005, the semiconductor laser device20, that is, the semiconductor laser bar33and the submount bar21, may be cut for each of the light emitting regions18to manufacture the semiconductor laser device20in a small piece having a single light emitting region18. Even in this case, the semiconductor laser device20in a small piece has the same effects as the semiconductor laser device20having the semiconductor laser bar3and the submount bar21that are bar-shaped. Note that, although various exemplary embodiments and examples are described in the present application, various features, aspects, and functions described in one or more embodiments are not inherent in a particular embodiment, and can be applicable alone or in their various combinations to each embodiment. Accordingly, countless variations that are not illustrated are envisaged within the scope of the art disclosed herein. For example, the case where at least one component is modified, added or omitted, and the case where at least one component is extracted and combined with a component in another embodiment are included. DESCRIPTION OF REFERENCE NUMERALS AND SIGNS 3,3a,3b,3c: semiconductor laser bar,8: protective film particle (material particle),10: second electrode layer (separated electrode layer),12: metal pattern,14: cleaved end face,15a: front side electrode,15b: back side electrode,18: light-emitting region,19: protective film,20: semiconductor laser device,21,21a,21b,21c: submount bar,22: submount bar body,23: metal layer,25: solder,26: front side electrode,33: semiconductor laser bar,40: installation jig,41: opening member (first opening member, second opening member),42: fixing plate,43: opening,46: pusher,50: semiconductor device,60: end face protective film forming apparatus (protective film forming apparatus) | 56,237 |
11942759 | DETAILED DESCRIPTION OF THE TECHNOLOGY This technology enables diode lasers which either operate with greater power conversion efficiency or which operate with equivalent power conversion efficiency with greater output power. This is achieved through careful control of the current density profile in the longitudinal direction of the device in order to overcome local current crowding and longitudinal spatial hole burning effects which limit the efficiency and power of long-cavity high power diode lasers. Three techniques for controlling the longitudinal current density at the quantum wells along the length of the diode are described. The first is based on high power broad area diode lasers which use a plurality of apertures (also referred to herein as a plurality of vias) through a dielectric to define the emitting area. The second is based on similar devices which instead create the current aperture through proton implantation in the region of semiconductor which is to be rendered non-conductive. In both cases, the area defined by the aperture controls the location of current injection. By creating a pattern of small (˜100 nm to ˜10 μm diameter) vias, the current injection area becomes pixelated (in either 1 or 2 dimensions). Lateral spreading of the current injected in these areas as it flows down to the quantum wells leads to a reduction of the average current density at the position of the quantum wells. By adjusting the size and spacing of these small apertures in the dielectric or implant region, the injection current profile can be engineered along the length of the diode. The third technique provides a diode laser that has been formed utilizing a patterned-contact layer approach. Exemplary semiconductor materials herein include Si, Ge, GaAs, GaP, InAs, InP, AlAs, GaN and GaSb, as well as ternary, quaternary and quintenary compound semiconductors based on combinations of these material systems. The injection current profile is engineered in a way to promote higher current density flow to regions of the laser which operate at higher efficiency and/or to overcome the effects of longitudinal current crowding in very long cavity diode lasers. The technique can be applied to edge-emitting semiconductor lasers of various designs, including GaAs-based devices operating in the 6xx-12xx nm wavelength band, InP-based devices operating in the 13xx-21xx nm band, and GaN-based devices operating in the 3xx-5xx nm band. FIG.1Ashows a cross-sectional side view of an embodiment of an engineered current-density profile diode laser that has been formed utilizing the dielectric-confined approach of the present technology.FIG.1Bshows the epitaxial growth direction10and the laser emission direction12, which is the longitudinal direction of the laser diode14. The laser diode14includes a first portion of semiconductor material16, an active region18, a second portion of semiconductor material16′, a patterned dielectric insulator20and a metal contact22. The lines24represent current that would flow between the metal contact22and the active region18if a current source is appropriately applied.FIG.1Cillustrates how current density26varies along the longitudinal position of laser diode14according to the pattern of vias in the dielectric insulator20. Example semiconductor materials for16and16′ can be selected from the group consisting of Si, Ge, GaAs, GaP, InAs, InP, AlAs, GaN and GaSb, as well as ternary, quaternary and quintenary compound semiconductors based on combinations of materials from the group. An example fabrication process for the dielectric-confined approach ofFIG.1Ais as follows: 1. Blanket deposit (sputter or PECVD) a thin (500 Å to 5000 Å) dielectric layer (SiNx, SiO2) over the top (epi-side, typically p-doped side) of the wafer. 2. Spin, pattern and develop a photoresist pattern using standard processes. The pattern will define the vias for the subsequent etching step. The dielectric layer between vias will be wide where the current density needs to be low and will be narrow where the current density needs to be high. The further apart that the current apertures are, or the smaller that the current apertures are, the less the average current density will be at the active region. 3. Transfer the photoresist pattern into the insulator layer through wet or dry etching of the insulator layer. Remove the photoresist afterwards. 4. Blanket metal deposit the appropriate ohmic contact. 5. Follow with subsequent standard processing steps (anneals, thinning, backside metal deposition, bar cleave, coat, etc.). FIG.2Ashows a cross-sectional side view of an embodiment of an engineered current-density profile diode laser that has been formed utilizing the implant-confined approach of the present technology.FIG.2Bshows the epitaxial growth direction30and the laser emission direction32, which is the longitudinal direction of the laser diode34. The laser diode34includes a first portion of semiconductor material36, an active region38, a second portion of semiconductor material36′, a patterned proton implant area40(within said second portion of semiconductor material36′) and a metal contact42. The lines44represent current that would flow between the metal contact42and the active region38if a current source is appropriately applied.FIG.2Cillustrates how current density46varies along the longitudinal position of laser diode34according to the pattern of vias formed by the proton implant area40. Example semiconductor materials for36and36′ can be selected from the group consisting of Si, Ge, GaAs, GaP, InAs, InP, AlAs, GaN and GaSb, as well as ternary, quaternary and quintenary compound semiconductors based on combinations of materials from the group. Lateral current spreading in the layers between the contact and quantum well active region will cause the average linear current density at the active region to be related to the fill factor (% via openings in the dielectric) at the contact layer. The spacing between apertures needs to be kept smaller than the average lateral current diffusion length (˜1 to 10 μm) between the contact layer and the quantum well so that the current density profile is smooth at the quantum well. An example fabrication process for the implant-confined approach ofFIG.2Ais as follows: 1. Perform blanket metal deposition of the appropriate ohmic contact. 2. Spin, pattern and develop a photoresist pattern using standard processes. This photoresist is typically quite thick (several microns) and serves to define the proton implant apertures. 3. Perform proton implantation at an appropriate dose and energy to render the epitaxial material which lies in the exposed areas non-conductive. 4. Strip the photoresist. 5. Follow subsequent standard processing steps (anneals, thinning, backside metal deposition, bar cleave, coat, etc.). In some cases, the photoresist and implantation will happen before the blanket metal deposition. This will allow a short wet or dry etch to be performed to remove the highly doped cap layer in order to reduce the lateral diffusion length. FIG.3Ashows a cross-sectional side view of an embodiment of an engineered current-density profile diode laser that has been formed utilizing a patterned-contact layer approach of the present technology. This approach is conceptually similar to the patterned dielectric contact approach. The top epitaxial layer of a diode layer is typically doped p-type to levels in excess of 1E18/cm3. This very high doping level is needed to form a good ohmic contact when p-metal (typically Ti—Pt—Au) is deposited to the doped GaAs (diodes operating in the 6xx-11xx range and grown on GaAs) or InGaAs (diodes operating in the 12xx-21xx rim range and grown on InP). This high-level doping however does not extend very far into the diode epitaxial structure, and as such the “cap” layer is typically limited to between 50 and 5000 nm in thickness. While the dielectric contact approach relies on injecting current through vias opened up in an insulating layer placed on top of the cap layer, this method simply removes the cap layer in the regions where reduced current density is required. This works because the removal of the highly doped ohmic contact layer causes an increase in the contact resistance at the metal-semiconductor interface, thereby inhibiting high current flow. FIG.3Bshows the epitaxial growth direction50and the laser emission direction52, which is the longitudinal direction of the laser diode54. The laser diode54includes a first portion of semiconductor material56, an active region58, a second portion of semiconductor material56′, a patterned highly doped cap layer60and a metal contact62. The lines64represent current that would flow between the metal contact62and the active region58if a current source is appropriately applied.FIG.3Cillustrates how current density66varies along the longitudinal position of laser diode54according to the pattern of dielectric insulator60. Example semiconductor materials for56and56′ can be selected from the group consisting of Si, Ge, GaAs, GaP, InAs, InP, AlAs, GaN and GaSb, as well as ternary, quaternary and quintenary compound semiconductors based on combinations of materials from the group. An example fabrication process for the dielectric-confined approach ofFIG.3Ais as follows: 1. Spin, pattern and develop a photoresist pattern using standard processes. The pattern will define the regions of the highly doped cap layers which will be removed. Removal of the cap layer in these regions will reduce the current density there due to an increased contact resistance in that location. The pattern may be first transferred into a dielectric “hard mask” layer and then etched, or the photoresist layer itself may serve as the etch mask. 2. Etch the highly doped cap layer in the region where the pattern is exposed. This etch may be performed by standard wet or dry-etching techniques. After etching, remove the mask leaving behind a textured surface comprising regions of highly doped semiconductor cap layers and somewhat lower doped semiconductor elsewhere. 3. Blanket metal deposit the appropriate ohmic contact. 4. Follow subsequent standard processing steps (anneals, thinning, backside metal deposition, bar cleave, coat, etc.). Broadly, this writing discloses at least the following. The present technology can be used to control the current injection profile in the longitudinal direction of a high-power diode laser in order to optimize current densities as a function of position in the cavity to promote higher reliable output power and increase the electrical to optical conversion efficiency of the device beyond the level which can be achieved without application of this technique. This approach can be utilized, e.g., in the fabrication of semiconductor laser chips to improve the output power and wall plug efficiency for applications requiring improved performance operation. This writing also presents at least the following Concepts. Concepts:1. A engineered current-density profile diode laser, comprising:a first portion of substrate material;a quantum well active region on said first portion of semiconductor material;a second portion of said substrate material on said active region;a metal contact on said second portion of said semiconductor material; anda plurality of current vias located between said quantum well active region and said metal contact. 2. The diode laser of concepts 1, 7-11 and 13, further comprising dielectric insulator material between said second portion of said semiconductor material and said metal contact, wherein said vias are formed through said dielectric insulator material 3. The diode laser of concepts 1, 7-11 and 13, further comprising a proton implant region within said second portion of semiconductor material, wherein said plurality of vias are formed in said proton implant region. 4. The diode laser of concepts 1, 7-11 and 13, further comprising a patterned capping layer on said second portion of semiconductor material, wherein said plurality of vias are formed in said patterned capping layer, wherein said metal contact is on said second portion of said semiconductor material and on said patterned capping layer. 5. The diode laser of concepts 1, 7-11 and 13, further comprising a plurality of capping layer areas on said second portion of semiconductor material, wherein said plurality of vias are formed in said plurality of capping layer areas, wherein said metal contact is on said second portion of semiconductor material and on said patterned capping layer. 6. The diode laser of concepts 1, 7-11 and 13, further comprising capping layer areas on said second portion of semiconductor material, wherein each area of said capping layer areas is a via of said plurality of vias, wherein said metal contact is on said second portion of semiconductor material and on said capping layer areas. 7. The diode laser of concepts 1-6 and 8-11 and 13, wherein the spacings between said vias are predetermined to provide a desired current density per longitudinal direction of said diode laser. 8. The diode laser of concepts 1-7 and 9-11 and 13, wherein at least one via of said plurality of vias has a diameter within a range from 100 nm to 10 μm. 9. The diode laser of concepts 1-8 and 10, 11 and 13, wherein each via of said plurality of vias has a diameter within a range from 100 nm to 10 μm. 10. The diode laser of concepts 1-9 and 11 and 13, wherein said plurality of vias comprise a pattern that pixelates the current injection area in 1 or 2 dimensions. 11. The diode laser of concepts 1-10 and 13, wherein said laser diode comprises an edge-emitting semiconductor laser. 12. The diode laser of concept 11, wherein said edge-emitting semiconductor laser is selected from the group consisting of a GaAs-based device operating in the 6xx-12xx nm wavelength band, an InP-based device operating in the 13xx-21xx nm band and a GaN-based device operating in the 3xx-5xx nm band. 13. The diode laser of concepts 1-11, wherein said first portion of semiconductor material and said second portion of semiconductor material comprise material selected from the group consisting of Si, Ge, GaAs, GaP, InAs, InP, AlAs, GaN, and GaSb as well as ternary, quaternary, and quintenary compound semiconductors based on combinations of the materials of said group. 14. A method for operating an engineered current-density profile diode laser, comprising providing an engineered current-density profile diode laser, including (i) a first portion of semiconductor material, (ii) a quantum well active region on said first portion of semiconductor material, (iii) a second portion of said semiconductor material on said active region (iv) a metal contact on said second portion of said semiconductor material and (v) a plurality of current vias located between said quantum well active region and said metal contact; and providing a voltage induced current between said metal contact and said active region. 15. The method of concepts 14, 20 and 21, wherein said diode laser further comprises dielectric insulator material between said second portion of said semiconductor material and said metal contact, wherein said vias are formed through said dielectric insulator material. 16. The method of concepts 14, 20 and 21 wherein said diode laser further comprises a proton implant region within said second portion of semiconductor material, wherein said plurality of vias are formed in said proton implant region. 17. The method of concepts 14, 20 and 21, wherein said diode laser further comprises a patterned capping layer on said second portion of semiconductor material, wherein said plurality of vias are formed in said patterned capping layer, wherein said metal contact is on said second portion of said semiconductor material and on said patterned capping layer. 18. The method of concepts 14, 20 and 21 wherein said diode laser further comprises a plurality of capping layer areas on said second portion of semiconductor material, wherein said plurality of vias are formed in said plurality of capping layer areas, wherein said metal contact is on said second portion of semiconductor material and on said patterned capping layer. 19. The method of concepts 14, 20 and 21, wherein said diode laser further comprises capping layer areas on said second portion of semiconductor material, wherein each area of said capping layer areas is a via of said plurality of vias, wherein said metal contact is on said second portion of semiconductor material and on said capping layer areas. 20. The method of concepts 14-19 and 21, wherein the spacings between said vias are predetermined to provide a desired current density per longitudinal direction of said diode laser. 21. The method of concepts 14-20, wherein said first portion of semiconductor material and said second portion of semiconductor material comprise material selected from the group consisting of Si, Ge, GaAs, GaP, InAs, InP, AlAs, GaN, and GaSb as well as ternary, quaternary, and quintenary compound semiconductors based on combinations of the materials of said group. All elements, parts and steps described herein are preferably included. It is to be understood that any of these elements, parts and steps may be replaced by other elements, parts and steps or deleted altogether as will be obvious to those skilled in the art. The foregoing description of the technology has been presented for purposes of illustration and description and is not intended to be exhaustive or to limit the technology to the precise form disclosed. Many modifications and variations are possible in light of the above teaching. The embodiments disclosed were meant only to explain the principles of the technology and its practical application to thereby enable others skilled in the art to best use the technology in various embodiments and with various modifications suited to the particular use contemplated. The scope of the technology is to be defined by the following claims. | 18,088 |
11942760 | DETAILED DESCRIPTION Solid state devices for generation of high frequency signals are typically implemented through the use of short gate length transistors. A gate controls the conductivity of the base region; in a normally off device, a voltage is applied to turn the device on. This voltage can be modulated at high frequency, but the ultimate limit is governed by the transit time through the channel (which in turn is governed by the length and velocity of carriers). Operating at higher frequencies requires higher mobility semiconductors and/or shortening this distance. The latter inevitably results in low voltage devices, limiting the power output. An alternative approach to high frequency generation uses photoexcitation to excite electrons and/or holes, which modulate the conductivity. This is typically done by band-to-band excitation, requiring photon energy equal or greater than the band gap, or by exciting deep levels with below band gap light. In both cases, the maximum frequency of operation is governed by the lifetime of the carriers. This approach has been used to generate microwaves using SiC:V (vanadium-doped silicon carbide) or mmW and THz using Low Temperature-GaAs (gallium arsenide). In the former, high powers can be achieved but with a maximum possible frequency of ˜5 GHz. The latter is not well suited to producing a controlled signal and is not efficient for lower frequency operation. The disclosed technology overcomes these drawbacks and provides additional features and benefits, which allow the use of the disclosed high-voltage switches in many applications including, but not limited to, communication systems (e.g., millimeter wave communication) and the generation of high-power electromagnetic (EM) waves (e.g., radar). The present document uses section headings and sub-headings for facilitating the understanding of the disclosed embodiments, and not for limiting the scope of the disclosed techniques and embodiments to certain sections. Accordingly, embodiments and configurations disclosed in different sections can be used with each other. Overview and Exemplary Operation The exemplary operation of a high-voltage switch, in accordance with some embodiments of the present disclosed technology, is illustrated inFIG.1. The high-voltage switch100is a semiconductor (or solid-state) based switch that can controllably operate (e.g., generate a pulse) in the sub-terahertz (e.g., 10-300 GHz) and single terahertz (e.g., 300 GHz to 3 THz) ranges. The high-voltage switch ofFIG.1includes a first (e.g., positive) electrode110and a second (e.g., negative) electrode120at two ends of an absorbing region130. In some embodiments, the absorbing region is a semiconductor (e.g., doped SiC), and the electrodes are made of a metal or metallic alloy (e.g., a graphite mixture). In some embodiments, one of the electrodes may be a ground electrode (e.g., the second electrode may be at ground level). At t=t0, an input light beam150(e.g., a laser pulse) is incident on the absorbing region130of the high-voltage switch100. At t=t1, the laser pulse has entered the absorbing region130and created a charge carrier cloud160(e.g., an electron cloud) in the region of the absorbing region that the input light beam entered. In some embodiments, the charge carrier is an electron cloud, while in other embodiments, it may be primarily comprised of holes. For example, the absorbing region may be doped SiC, and the charge carrier cloud160may be 2 micron (2×10−6m) tall. While the charge carrier cloud160is illustrated as a rectangle for illustration purposes, the charge carrier cloud160can have different shapes, as will be described later in this document. At t=t2, and as illustrated inFIG.1, the electron cloud160drifts toward the positive electrode110at high-speed. For example, the 2-micron tall electron cloud may travel at a saturation velocity (e.g., the maximum velocity a charge carrier in a semiconductor attains in the presence of very high electric fields) of 2.2×107cm/sec. At t=t3, the electron cloud160reaches the positive electrode110, and begins to be collected by the first electrode110. This begins the “on” time of the pulse that is created by the high-voltage switch. The “on” time ends (which also defines the “off” time of the pulse beginning), when the charge carrier cloud has been collected by the electrode. For example, the 2-micron tall electron cloud generated in SIC, and travelling at a saturation velocity of 2.2×107cm/s, can be collected in 9 picoseconds, which corresponds to an operating frequency of around 60 GHz for a 50% duty cycle. After creation of the charge carrier cloud160, the light beam150passes out of the absorbing region (as illustrated inFIG.1at t=t2), and can be reflected back into the same semiconductor to generate the next pulse (not shown inFIG.1). For example, the laser beam can travel through another medium before being reflected back into the same semiconductor. The distance before re-entering the semiconductor is determined by the speed of light and governs the “off” time of the switch. In the example discussed in the context ofFIG.1, approximately 4 mm in air generates the required 50% off time. Similarly, an operating frequency of 600 GHz may be achieved by using a charge carrier cloud with height 200 nanometers (nm), and over a 1 THz operating frequency can be achieved with 100 nm tall charge carrier cloud. The charge carrier cloud, as illustrated inFIG.1, has a rectangular profile, which may be implemented using, for example, a mask to block some parts of the laser beam as it enters the absorbing material, or using the characteristics of the absorbing material, or both. In some embodiments, the charge carrier cloud has a Gaussian shape as it travels towards one of the electrodes. The exemplary operation described above advantageously relies on the speed of electrons (or, generally, the charged particles) to generate the “on” time of the pulse, and the speed of light to generate the “off” time of the pulse. In particular, a pulse of single polarity carriers (e.g., only electrons) with small size can be generated by a subband gap laser that excites deep levels (e.g., V in SiC, Fe or C in GaN (gallium nitride)), such that the entire pulse can be collected in the “on time” determined by the desired frequency of operation. In some embodiments, the output pulse can be made very short by designing the charge carrier cloud to be small and very high-speed. Exemplary “Single Pulse Vertical” Configurations FIGS.2,3and4illustrate different example configurations of a high-voltage switch that are configured to receive the incident light beam from a top section of the switch. The examples illustrated inFIGS.2-4include some features and/or components that are similar to those illustrated inFIG.1and each other. At least some of these features and/or components may not be separately described in the context of each of these embodiments. FIG.2illustrates an example configuration of a high-voltage switch200. As illustrated inFIG.2, a first electrode210is located on top of a non-absorbing layer240, below which is an absorbing layer230. In an example, the window207that allows in the Incident light to enter the high-voltage switch200is positioned at the top of the high-voltage switch200and adjacent to the non-absorbing layer240(as will be described in the context ofFIGS.10A-10C). Below the absorbing layer230is another non-absorbing layer241, below which is the second electrode220. In other words, the absorbing layer230is sandwiched between two non-absorbing layers (240,241), above and below which are the first and second electrodes (210,220), respectively. In some embodiments, the material of the absorbing layer includes a material such as V-doped SiC, which absorbs sub-band gap light, and the material of the non-absorbing layer includes compensated SIC. In other cases, the non-absorbing layer (or region) comprises a material that has a bandgap that is higher than the bandgap of the material that is used in the absorbing layer (or region). In some embodiments, the electrodes210and220may be highly reflective such that the light reflects multiple times, creating a series of electronic pulses from a single laser pulse. The thickness of the regions240and241is chosen to determine the “off” time of the switch, while the thickness of230is chosen to determine the size of the charge carrier pulse and thus the “on” time. FIG.3illustrates another example configuration of a high-voltage switch300. As illustrated therein, the high-voltage switch configuration is different from that illustrated inFIG.2in that the absorbing layer330is below the first electrode310. In this example, the window307that allows in the incident light to enter the high-voltage switch300is also positioned at the top of the high-voltage switch300, albeit adjacent to the absorbing layer330. Below the absorbing layer330is a non-absorbing layer340, which is on top of the second electrode320. There is no second non-absorbing layer in the configuration illustrated inFIG.3. Compared to the configuration ofFIG.2, in the configuration ofFIG.3the incident light beam enters the absorbing region first before traveling through a longer non-absorbing region, which enables the generation of short duration pulses. In some embodiments, the electrodes310and320may be highly reflective such that the light reflects multiple times, creating a series of electronic pulses from a single laser pulse. The thickness of the non-absorbing layer340is chosen to determine the “off” time of the switch, while the thickness of absorbing layer330is chosen to determine the size of the charge carrier pulse and thus the “on” time. FIG.4illustrates yet another example configuration of a high-voltage switch400. This configuration is similar to that illustrated inFIG.3, but the second electrode420is transparent or substantially transparent, and a mirror490is placed at some distance below the second electrode. In some embodiments, the second electrode may be a substantially transparent electrode420that allows the input light beam to pass through it, and reflect off the mirror490before entering the switch again, thereby advantageously enabling the “off” time of the pulse to be tuned based on the distance between the second electrode420and the mirror490. In the configurations illustrated inFIGS.2-4, the size of the charge carrier cloud may be controlled, for example, by the thickness of the absorbing layer. In some configurations, the thickness and material configuration of the absorbing layer may also be used to define the shape of the charge carrier cloud. For example, a thin (e.g., 10-nm thick) absorbing layer that is illuminated from the top can produce a short duration pulse. In such a configuration, higher power lasers can be used to generate the small-size charge cloud, and the size of such a charge cloud is not limited by the diffraction limit of the optical components or the spot size of the laser. Exemplary “Single Pulse Lateral” Configurations FIG.5illustrates yet another example configuration of a high-voltage switch500that can operate using a single pulse with a source that illuminates the switch laterally from the side of the switch, e.g., the incident light beam is a single laser pulse that is incident upon the switch from a substantially lateral direction. This example includes some features and/or components that are similar to those illustrated inFIGS.1-4. At least some of these features and/or components may not be separately described in the context of each of these configurations. As illustrated inFIG.5, the first electrode is configured as multiple flat conductor strips (510,511,512,513) that are spaced apart from each other. The space between the strips of the first electrode and the second electrode520includes an absorbing region530, and multiple non-absorbing regions (540,541,542) that are located in between the strips of the first electrode. In some embodiments, for the configuration illustrated inFIG.5, the size of the electron cloud may be controlled by the spot size of the input laser pulse. In an example, the window507that allows in the incident light to enter the high-voltage switch500is positioned at the side of the switch, adjacent to the absorbing layer230(as will be described in the context ofFIGS.11A-11C). In some embodiments, the non-absorbing regions (540,541,542) may include a material having a bandgap that is higher than the bandgap of the material that is used in the absorbing region530. In other embodiments, the non-absorbing regions may be eliminated; for example, there may be air gaps where the non-absorbing region is illustrated inFIG.5. Exemplary “Multi-Pulse Axial” Configurations FIGS.6and7illustrate different example embodiments of a high-voltage switches that can operate using multiple pulses, and which have a source that illuminates the switch from above, e.g., the Incident light beam includes multiple laser pulses that are incident upon the switch from a substantially axial direction. The examples illustrated inFIGS.6and7include some features and/or components that are similar to those illustrated. InFIGS.1-5and each other. At least some of these features and/or components may not be separately described in the context of each of these embodiments. As illustrated inFIG.6, the first electrode comprises two sections (610,611) that are spaced apart from each other. The non-absorbing layer640is sandwiched between the two sections of the first electrode and the second electrode620. A layer of absorbing material630is configured on top of the layer of non-absorbing material640and in between the two sections of the first electrode (610,611). In contrast with the configurations illustrated inFIGS.2-5, the absorbing layer inFIG.6absorbs more strongly, and can be made extremely thin, thereby advantageously creating a charge carrier cloud that is shorter than in other configurations. This results in the charge carrier cloud being collected more quickly, thereby reducing the duration between the front and the back of the output pulse. FIG.7illustrates a similar configuration as inFIG.6, but with a thinner layer of absorbing material730(as compared to the configuration illustrated inFIG.6). Furthermore, the configuration illustrated inFIG.7employs two photon absorption to create the charge carrier cloud. Since two-photon absorption is a non-linear process and very dependent on the intensity of the incident light, the embodiment illustrated inFIG.7is typically used with a picosecond (ps) pulse. Alternately, two intersecting laser pulses may be used which produce an intensity sufficient for two-photon absorption only at the intersection. The configurations Illustrated inFIGS.2-5are characterized by the “off” time of the pulse being dependent on the transit time of the incident light through one or more non-absorbing regions (e.g., air, material with high bandgap than that of the absorbing material, or both). In the configurations illustrated inFIGS.6and7, wherein multiple laser pulses are employed, the “off” time of the pulse is based on the time between the generation of two consecutive laser pulses. Other Exemplary Configurations FIGS.8and9illustrate additional configurations of the disclosed technology. The configuration illustrated inFIG.6resembles the configuration illustrated inFIG.5, wherein the first electrode comprises multiple strips (810,811, . . . ,816), the second electrode820is spaced apart from the first electrode, and the space between them includes an absorbing region830and non-absorbing regions (841,842,843) that are located in the spaces between every other strip of the first electrode (e.g., non-absorbing region841is in between first electrode strips813and815). However, in contrast to the configuration illustrated inFIG.5, the configuration illustrated inFIG.8replaces one region of the non-absorbing material with a laser source880. In other words, it is an advantageously integrated version of the one illustrated inFIG.5(which uses an external laser source). In one example, a gallium nitride (GaN) laser source880is used with SiC as the absorbing material, which leverages manufacturing capabilities that enable growing GaN on SIC. In another example, an aluminum gallium arsenide (AlGaAs) laser may be used in conjunction with a gallium arsenide (GaAs) switch. FIG.9illustrates a tunable switch900that includes a high-voltage switch902that Is placed in an optical cavity (or resonator), in accordance with the presently disclosed technology. The configuration illustrated inFIG.9advantageously enables a continuous pulse train to be generated, and allows tunability and amplification of the incident beam as it travels through the cavity, thereby enabling additional control and modulation of the switch output. One example application of the tunable switch900is in high-frequency communications. In one example, the switch902is similar to the configuration illustrated inFIG.2, but rotated 90° and with transparent (or semi-transparent, or substantially transparent) electrodes. The tunable switch900includes two laser gain media (generally identified as980and981) on either side of the switch902that provide amplification for the laser beam that propagates through the gain media980and981. Two end mirrors990,991complete the resonator and allow sustained lasing activity. In some embodiments, the two end mirrors990,911may be more generally implemented as reflective surfaces (e.g., a high reflectance coating deposited on a glass, metal or semiconductor substrate). The configurations illustrated inFIGS.2-5can operate using a single pulse that is incident on the switch, which generates multiple charge carrier clouds as it enters and re-enters the absorbing region (s). Under this operating procedure, after a few reflections, the laser pulse will be completely absorbed by the absorbing layer in the switch. This may result in the last few pulses being somewhat degraded as compared to the initial pulses (e.g. slightly different pulse shape). Thus, sustained operation of such switches requires either injection of new laser pulses, or amplification of the Initial laser pulsed as it weakens due to absorption and reflection. The configuration inFIG.9, among other features and benefits, enables a single laser pulse to be reenergized, or continuously amplified, thereby resulting in a continuous pulse train, wherein subsequent pulses are not degraded compared to the initial pulses. As illustrated inFIG.9, a laser pulse that illuminates the switch902(e.g., generated by the laser gain medium980), travels through the switch902(therein generating a charge carrier cloud, and losing some energy), and continues to travel through the laser gain medium981which amplifies the pulse, which is then reflected back from the mirror991, travels back through the laser gain medium981(and underdoes further amplification), and back into the switch902to generate another charge carrier cloud. Thus, the “on” time of the resulting pulse, as in the case ofFIG.5, is based on the thickness of the absorbing layer, and the “off” time of the pulse is based on the transit time of the pulse after it leaves the switch, reflects off the mirror and re-enters the switch. The pulse then travels in the other direction (through gain medium980and reflecting off mirror990, travels through the gain medium980) and re-enters the switch to generate yet another charge carrier cloud. In this manner, a continuous train of pulses can be created, with the input laser pulse being periodically amplified thereby ensuring the fidelity of the output pulses. Additionally, the configuration ofFIG.9, provides separate amplification (and thus modulation) control for the light that enters the switch from the left and from the light side. In some embodiments, the optical gain (e.g., through changing the bias levels) at each gain medium980,981can be controlled dynamically to provide the desired amplitude modulation of the optical pulses, which in turn can be used to produce modulated electrical pulses that are output from the switch902. In some embodiments, one or more controllable optical attenuators can be placed in the optical cavity (e.g., between gain media980,981and the end mirrors990,991) to provide an additional, or an alternative modulation mechanism). Moreover, in some embodiments, only one laser gain medium may be used in the optical cavity to provide amplification of the laser light. In some embodiments, the reflectively of the mirrors and the transparency of the electrodes can be adjusted as a further mechanism to achieve the required performance and output characteristics, and to modulate the amplitude of the laser pulses. In other embodiments, the voltage on the switch can be modulated. In some embodiments, the laser gain medium may be implemented using a semiconductor laser diode, which could be used to generate the initial laser pulse, and then could be electrically pumped to restore the intensity of the laser pulse. As seen in the context ofFIGS.1-9, embodiments of the disclosed technology describe high-voltage switches that are very tunable and operate across a wide range of frequencies, and their operation is described inFIGS.10-14. Exemplary Methods of Operation of the Disclosed Technology FIGS.10A-10Cillustrate the exemplary operation of the configuration of the high-voltage switch illustrated inFIG.2. As illustrated inFIG.10A, the input laser pulse1050is incident on the non-absorbing layer1040from a substantially vertical orientation. The input laser pulse propagates through the first non-absorbing layer1040, without substantial absorption, and is incident on the layer of absorbing material1030. As illustrated inFIG.10B, a first charge carrier cloud1060is created in the absorbing layer1030. InFIG.10C, the laser pulse reflects off the second electrode1020and back to the layer of absorbing material1030, wherein it creates a second charge carrier cloud1061, while the first charge carrier cloud1060is propagating to the first electrode1010. The process continues with the laser pulse alternatingly reflecting off the second and first electrodes, creating new charge carrier clouds in the absorbing layer1030, and eventually being completely absorbed in the high-voltage switch. As was discussed in the context ofFIG.1, the “on” time of the pulse (or equivalently, the duration over which the high-voltage switch outputs a substantial amount of current) is based on the time by the first electrode to collect the charge carrier cloud. In other words, the size and speed of the charge carrier cloud determines how quickly it Is collected by the electrode, and thus, the “on” time of the pulse. As illustrated inFIG.10C, the “off” time of the pulse (or equivalently, the duration over which the high-voltage switch outputs substantially no current) is based on the propagation time of the laser pulse through the layers of non-absorbing material. Specifically, the “off” time is the duration from the end of the collection of the first charge carrier cloud1060and the start of the collection of the second charge carrier cloud1061, Furthermore, the size of the charge carrier cloud can be controlled by the thickness of the absorbing layer1030. FIGS.11A-11Cillustrate the exemplary operation of an embodiment of the high-voltage switch illustrated inFIG.5. As illustrated inFIG.11A, the laser pulse1150is incident on a region of absorbing material on a lateral surface of the switch. The laser pulse1150creates a charge carrier cloud1160in the first portion of the region of absorbing material as it propagates therein. The pulse then propagates through a first region of non-absorbing material1140, into a second portion of the region of absorbing material (where a second charge carrier cloud1161is created), into a second region of non-absorbing material1141, and so on. FIG.11Cillustrates the input pulse leaving the switch having formed four charge carrier clouds (1160,1161,1162,1163) in the regions of the absorbing layer that are interspersed with the regions of the non-absorbing layer. The charge carrier clouds move towards the respective flat conductor strips of the first electrode, and are collected to generate a substantial amount of current at the first electrode as they are consecutively collected. The “on” time of the pulse corresponds to the duration of the collection of each of the charge carrier clouds, and the “off” time of the pulse is based on the propagation of the laser pulse through the non-absorbing region, as it moves from one portion of the region of absorbing material to the next. In some embodiments, the size and velocity of the charge carrier clouds is controlled by the input laser pulse spot size. In some embodiments, the regions of non-absorbing material may be replaced with an air gap, e.g. any material (or lack thereof) that has a bandgap that is higher than the bandgap of the absorbing material. In some embodiments, the operating frequency is based on the speed of light within the switch, and thus, the absorbing and non-absorbing materials may be selected based on the intended application. In some embodiments, e.g., the configurations with laser reamplification as illustrated inFIGS.2-5, the high-voltage switch may be designed to enable the incident laser pulse to only generate a single charged particle cloud. In other words, once the input laser has passed through the absorbing region, it may be guided through the non-absorbing material until it eventually gets absorbed or exits the high-voltage switch, thereby creating a single charged particle cloud. If a second pulse needs to be output, another incident laser pulse is used. FIGS.12A-12Cillustrate the exemplary operation of the configuration of the high-voltage switch illustrated inFIG.6. As illustrated inFIG.12A, the first laser pulse1250is incident on the switch in a substantially axial orientation. The laser pulse1250strikes the region of absorbing material1230, which is positioned between the two strips of the first electrode. A first charge carrier cloud1260is generated in absorbing layer1230as illustrated inFIG.12A. InFIG.12B, a second laser pulse1251is incident on the absorbing layer1230, and creates a second charge carrier cloud1261. At the same time, the first charge carrier cloud1260propagates towards the second electrode1220through the layer of non-absorbing material1240.FIG.12Cillustrates the operation at a later time wherein the first charge carrier cloud1260has nearly reached the second electrode, and another charge carrier cloud is being created in the absorbing layer. The “on” time in this embodiment is the duration of the collection of the charge carrier cloud by the second electrode, and the “off” time is the time in between consecutive laser pulses (e.g., the time between the first laser pulse1250and the second laser pulse1251). In some embodiments, the example illustrated inFIGS.12A-12Cmay produce pulses with very short “on” times since the charge carrier clouds are generated in a very thin layer of the absorbing material1230. In some embodiments, the absorption of the incident laser pulses (1250,1251, . . . ) in the absorbing layer1230is a linear process (e.g., there is a linear dependence between the rate of absorption and the intensity of the incident laser pulse). FIGS.13A-13Cillustrate the exemplary operation of the configuration of the high-voltage switch illustrated inFIG.7. This example includes some features and/or components that are similar to those illustrated inFIGS.12A-12C. At least some of these features and/or components may not be separately described in the context of each of these embodiments. The operation of the configuration illustrated inFIGS.13A-13Cis similar to that described in the context ofFIGS.12A-12C, with the difference that the layer of absorbing material is thinner and enables two-photon absorption in the absorbing layer1330. Two photon absorption (TPA) is the absorption of two photons of identical or different frequencies in order to excite a molecule from one state (usually the ground state) to a higher energy electronic state. The energy difference between the involved lower and upper states of the molecule is equal to the sum of the photon energies of the two photons. Two-photon absorption is a second-order process, several orders of magnitude weaker than linear absorption at low light intensities (which is used in the configuration illustrated inFIGS.12A-12C). It differs from linear absorption in that the atomic transition rate due to TPA depends on the square of the light intensity, thus it is a nonlinear optical process, and can dominate over linear absorption at high intensities. Thus, the configuration illustrated inFIGS.13A-13Cuses a high intensity pulse with a very short duration (e.g., a high-power picosecond pulse). FIG.14illustrates the exemplary operation of the configuration of the high-voltage switch similar to that illustrated inFIG.1. The high-voltage switch illustrated inFIG.1, which includes a region of absorbing material sandwiched between first and second electrodes, may be replicated to provide the generation of a pulse train, as illustrated inFIG.14. Note thatFIG.1illustrated the evolution of charge carrier cloud in the switch as a function of time, whereasFIG.14illustrates a configuration wherein the switch is replicated and spaced apart (with absorbing layers1430,1431,1432,1433, respectively). The laser pulse1450is illustrated creating a fourth charge carrier cloud1463in the absorbing region1433of the fourth switch. Its propagation through the absorbing regions of the first three switches (1430,1431and1432) has resulted in the creation of three charge carrier clouds (1460,1461and1462), respectively, and which have been moving towards the first electrode of their respective switch. As each of the charge carrier clouds is collected by the respective first electrode, the switch will generate a substantial amount of current. The switches in series will therefore generate a continuous pulse train, which has important applications in high-frequency communication systems. FIGS.15A-15CIllustrate numerical results that span a portion of the trade space used in the design of the high-voltage switches.FIGS.15A and15BIllustrate some of the trade-offs with regard to charge cloud considerations for different velocities. As described above, the operating frequency is based on the time elapsed between the first charge carriers arriving at the electrode until the last charge carriers arrive. For example, at near saturation velocity, the charge carrier cloud must be on the order of 1-3 microns in order to achieve an operating frequency of 20 GHz. In the example of the axial switch embodiments (e.g.,FIGS.6and7), this implies the laser pulse should be fully absorbed within 1-3 microns. In the example of the lateral switch embodiments (e.g.,FIG.5), this implies that the laser spot must be less than 3 microns in size, and the flat conductor strips of the first electrode must be sufficiently small such that the time to traverse that length must impact the charge cloud. FIG.15Cillustrates the transmitted intensity for various absorption coefficients. In the example of the axial switch (e.g.,FIGS.6and7), the absorption coefficient must be at least 10,000 cm−1 to minimize the size of the charge carrier cloud. These considerations will factor into selecting the absorbing and non-absorbing materials, and subsequently matching the wavelength of the input laser pulse to the selected materials. Furthermore, and as illustrated inFIG.7, an intense laser pulse may be used to as to enable two-photon absorption. Other design considerations include the laser spot size being small enough to enable the highest desired frequency operation given the electron velocity, e.g., ˜1×101cm/s, which typically results in a laser spot size of less than 3 microns, and the non-absorbing material having a similar refractive index as the absorbing material, e.g., vanadium-doped SIC for the absorbing material and undoped SiC for the non-absorbing material. In some embodiments, the trade-offs include considering, the recombination time of the carriers. Specifically, a long recombination time is preferred to minimize carrier loss. It is intended that the specification, together with the drawings, be considered exemplary only, where exemplary means an example and, unless otherwise stated, does not imply an ideal or a preferred embodiment. As used herein, the use of “or” is intended to include “and/or”, unless the context clearly indicates otherwise. While this document contains many specifics, these should not be construed as limitations on the scope of an invention that is claimed or of what may be claimed, but rather as descriptions of features specific to particular embodiments. Certain features that are described in this document in the context of separate embodiments can also be implemented in combination in a single embodiment. Conversely, various features that are described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable sub-combination. Moreover, although features may be described above as acting in certain combinations and even initially claimed as such, one or more features from a claimed combination can in some cases be excised from the combination, and the claimed combination may be directed to a sub-combination or a variation of a sub-combination. Similarly, while operations are depicted in the drawings in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. Moreover, the separation of various system components in the embodiments described in this patent document should not be understood as requiring such separation in all embodiments. Only a few implementations and examples are described and other implementations, enhancements and variations can be made based on what is described and illustrated in this disclosure. | 34,339 |
11942761 | MODES FOR CARRYING OUT THE INVENTION Embodiment 1 FIG.1is a sectional view showing a configuration of an optical semiconductor integrated element according to Embodiment 1, which is a longitudinal sectional view taken through a central portion thereof in the direction of laser emission.FIG.2is a transverse sectional view of the optical semiconductor integrated element taken at a position indicated by arrows AA inFIG.1.FIG.3is a vertical sectional view of the optical semiconductor integrated element taken at a position indicated by arrows BB inFIG.1.FIG.4is a vertical sectional view of the optical semiconductor integrated element taken at a position indicated by arrows CC inFIG.1.FIG.5is a vertical sectional view of the optical semiconductor integrated element taken at a position indicated by arrows DD inFIG.1.FIG.6is a top view ofFIG.1. As shown inFIG.1toFIG.6, an optical semiconductor integrated element501of Embodiment 1 is configured with a laser diode section20, a spot-size converter section30, a window region40and a monitor PD50provided on a surface of the window region40. The laser diode section20is a distributed feedback laser, in which an n-type InP cladding layer for vertical confinement, a core layer22, a diffraction grating23and a p-type InP cladding layer24for vertical confinement are stacked in this order on a surface of an n-type InP substrate10, and these layers are patterned into a stripe shape. The respective both sides of the n-type InP cladding layer and the core layer22are buried by p-type InP cladding layers25a,25bfor lateral confinement whose bandgap energy is larger than that of the core layer22. Further, the respective both sides of the diffraction grating23and the p-type InP cladding layer24are buried by n-type InP cladding layers26a,26bfor lateral confinement whose bandgap energy is larger than that of the core layer22. Furthermore, a p-type InP cladding layer27and a p-type contact layer28are stacked in this order on the surfaces of the p-type InP cladding layer24and the n-type cladding layers26a,26b. The surface of the p-type contact layer28is protected by a passivation film60, and a p-electrode29is connected through an opening60acreated in the passivation film60to the p-type contact layer28. An n-electrode70is connected to the under surface of the n-type InP substrate10. The spot-size converter section30is a buried-type spot-size converter having a function of enlarging a beam-spot diameter, located on the emission side of the laser diode section20. A core layer32in the spot-size converter section30is a waveguide that is connected to the core layer22in the laser diode section20and that is tapered down in the propagation direction of laser light incident from the core layer22to form a tapered shape. In the spot-size converter section30, an n-type InP cladding layer31for vertical confinement, the core layer32and a p-type InP cladding layer33for vertical confinement are stacked in this order on a surface of the n-type InP substrate10, and these layers are patterned so that their respective both sides are tapered down in the propagation direction of the laser light, to form a tapered shape. In the spot-size converter section30, the core layer32is so configured that its upper and lower sides are covered with the p-type InP cladding layer33as a front-surface side cladding layer and the n-type InP cladding layer31as a back-surface side cladding layer, respectively, and its left and right sides are covered with n-type cladding layers34a,34bas first cladding layers, respectively. The respective both sides of the n-type InP cladding layer31, the core layer32and the p-type InP cladding layer33are buried by the n-type InP cladding layers34a,34bas the first cladding layers for lateral confinement. The p-type InP cladding layer27common with the laser diode section20is stacked as a second cladding layer on the surfaces of the p-type InP cladding layer33and the n-type cladding layers34a,34b. The surface of the p-type InP cladding layer27is fully protected by the passivation film60. The n-type InP cladding layer31in the spot-size converter section30corresponds to the n-type InP cladding layer21in the laser diode section20. The p-type InP cladding layer33corresponds to the diffraction grating23and the p-type InP cladding layer in the laser diode section20. The n-type InP cladding layers34a,34bcorrespond to the p-type InP layers25a,25band the n-type InP cladding layers26a,26bin the laser diode section20. Here, it is well known that, due to the free-carrier plasma effect, the n-type InP cladding layers34a,34bbecome lower in refractive index than the p-type InP cladding layer27, so that the refractive index of the n-type InP cladding layers34a,34bis set lower than the refractive index of the p-type InP cladding layer27. Note that, in this Embodiment, a vertical refractive-index distribution is defined by the combination of the p-type InP cladding layer27and the n-type InP cladding layers34a,34b; however, this is not limitative. A layer other than that of InP may instead be used. Further, these layers may each be a combination of multiple layers so that the refractive-index distribution is established stepwise. The window region40is made up of a semiconductor material that is transparent to the light incident from the spot-size converter section30, and has an end-face window structure with no waveguide mechanism. An n-type InP layer41and an undoped InP layer42as a first window layer are stacked in this order on a surface of the n-type InP substrate10. The p-type InP cladding layer27as a second window layer and the p-type contact layer28, that are common with the laser diode section20, are stacked in this order on the surface of the undoped InP layer42. Here, undoped InP is employed for the purpose of reducing the optical absorption loss in the window region40. The n-type InP layer41in the window region40corresponds to the n-type InP cladding layer31and lower portions of the n-type InP cladding layers34a,34bin the spot-size converter section30. The undoped InP layer42corresponds to the core layer32, the p-type InP cladding layer33and upper portions of the n-type InP cladding layers34a,34bin the spot-size converter section30. The monitor PD50is a PIN-type photodiode. The monitor PD50is formed of an undoped InP layer51and an n-type contact layer52that are stacked in this order on a surface of the p-type contact layer28in the window region40. The surface of the n-type contact layer52is protected by the passivation film60, and a p-electrode53and an n-electrode54are connected through openings60b,60cto the p-type contact layer28and the n-type contact layer52, respectively. Next, operations of the optical semiconductor integrated element501according to Embodiment 1 will be described.FIG.7is a flowchart for explaining operations in the spot-size converter section30of the optical semiconductor integrated element501according to Embodiment 1. First, in the spot-size converter section30, the laser light emitted from the core layer22in the laser diode section20enters the core layer32in the spot-size converter section30(Step S701). Subsequently, because in the spot-size converter section30, the core layer32is patterned so that its both sides are tapered down in the propagation direction of the laser light, to form a tapered shape, the propagation light is gradually bled to the n-type InP cladding layers34a,34bon the both sides of the core layer32as it propagates in the spot-size converter section30(Step S702). InFIG.2, wavelike dotted lines F2show how the laser light is bled in the traveling direction (light intensity distribution), so that we can see how the propagation light is gradually bled to the n-type InP cladding layers34a,34bon the both sides of the core layer32. Then, in the spot-size converter section30, the laser light bled from the core layer32is deviated upward according to the vertical refractive-index distribution established by the n-type InP cladding layers34a,34bon the both sides of the core layer32and the p-type InP cladding layer27on the upper side of the core layer32and the n-type InP cladding layers34a,34b(Step S703; see, an optical path E2inFIG.1). InFIG.3andFIG.4, elliptic dotted lines F1, F2show the ranges of the laser light around the core layers22,23, respectively. It is found that, as compared with the range of the laser light shown by the elliptic dotted line F1, the range of the laser light shown by the elliptic dotted line F2is not only spread out to the n-type InP cladding layers34a,34bon the both sides of the core layer32, but also is deviated toward the upper-side P-type InP cladding layer27because of the vertical refractive-index distribution established by the n-type InP cladding layers34a,34band the p-type InP cladding layer27. Lastly, the spot-size converter section30radiates the upwardly-deviated laser light to the window region40, so that a part of the laser light enters the monitor PD50provided on the surface of the window region40(Step S704). InFIG.5, it is found that a part of the range of the laser light shown by an elliptic dotted line F3comes into the monitor PD50. To the monitor PD50is applied a reverse bias voltage through the p-electrode53and the n-electrode54, so that laser light absorbed in the p-type contact layer28is photoelectrically converted and then taken as a monitor current into an external circuit. In this manner, in the spot-size converter section30, the core layer32is patterned so that its both sides are tapered down in the propagation direction of the laser light, to form a tapered shape, and the refractive index of the n-type InP cladding layers34a,34bon the both sides of the core layer is set lower than the refractive index of the p-type InP cladding layer27that is placed on the side near the monitor PD50and covers the front surface side of the core layer, so that it is possible to deviate the laser light bled from the core layer toward the monitor PD50, to thereby cause a sufficient amount of light to enter the monitor PD. As described above, the optical semiconductor integrated element501according to Embodiment 1 comprises: the laser diode section20provided on a surface of the n-type InP substrate10; the spot-size converter section30provided on a surface of the n-type InP substrate10, said spot-size converter section being composed of the core layer32which causes laser light emitted from the laser diode section20to propagate therein and whose both sides are tapered down in the propagation direction of the laser light to form a tapered shape, the p-type InP cladding layer33as a front-surface side cladding layer which covers the front surface side of the core layer32, the n-type InP cladding layer31as a back-surface side cladding layer which covers the back surface side of the core layer32, the n-type InP cladding layers34a,34bas first cladding layers provided on the both sides of the core layer32, and the p-type InP cladding layer27as a second cladding layer provided on the respective surfaces of the front-surface side cladding layer and the first cladding layers; the window region40provided on a surface of the n-type InP substrate10that is placed on the front-end side of the core layer32of the spot-size converter section30; and the monitor PD50as a monitor section provided on a surface of the window region40; wherein the refractive index of the first cladding layers is lower than the refractive index of the second cladding layer. Thus, it is possible to deviate the laser light bled from the core layer toward the monitor PD50, to thereby cause a sufficient amount of light to enter the monitor PD. It is noted that in this Embodiment, although the spot-size converter section30is located adjacent to the laser diode section20, even in such a structure in which a waveguide-type device such as a modulator or the like is integrated in between these sections, an effect similar to the above will be achieved. Embodiment 2 In Embodiment 1, in the window region40, the undoped InP layer42is provided as a portion of that region corresponding to the core layer32, the p-type InP cladding layer33and the upper portions of the n-type InP cladding layers34a,34bin the spot-size converter section30; whereas, in Embodiment 2, an n-type InP layer is provided as the portion of that region. FIG.8is a sectional view showing a configuration of an optical semiconductor integrated element according to Embodiment 2, which is a longitudinal sectional view taken through a central portion thereof in the direction of laser emission.FIG.9is a vertical sectional view of the optical semiconductor integrated element taken at a position indicated by arrows GG inFIG.8. As shown inFIG.8andFIG.9, in an optical semiconductor integrated element502of Embodiment 2, an n-type InP layer41which is also a common layer with the n-type InP cladding layers34a,34bas the first cladding layers, is employed instead of the portion of the region as the undoped InP layer42in Embodiment 1. The other configuration of the optical semiconductor integrated element502according to Embodiment 2 is the same as in the optical semiconductor integrated element501of Embodiment 1 and thus, for the equivalent components, the same reference numerals are given, so that description thereof will be omitted. In Embodiment 2, the propagation light emitted from the laser diode section20enters the window region40, in a state being deviated upward by the spot-size converter section30. In Embodiment 1, since the p-type InP cladding layer27and the undoped InP layer42both have a refractive index of 3.204 (in the case where the wavelength is 1.3 μm) with no difference, the light having entered the window region40travels straightforward. In contrast, in Embodiment 2, the refractive index of the n-type InP layer41as the first window layer located at the exit port of the spot-size converter section30is 3.19 (in the case where the wavelength is 1.3 μm and the carrier concentration is 5×1018cm−3; the refractive index becomes lower as the carrier concentration becomes higher), and is thus lower than that of the p-type InP cladding layer27as the second window layer. Accordingly, the light having entered the window region is deviated upward to more extent according the difference between the above refractive indexes (see, an optical path E2inFIG.8, and a range of the laser light: an elliptic dotted line F4, inFIG.9). Thus, as compared with Embodiment 1, it is possible to further increase the amount of light entering the monitor PD50. As described above, in the optical semiconductor integrated element502according to Embodiment 2, the n-type InP layer41as the first window layer is provided as a portion of the window region40corresponding to the n-type InP cladding layers34a,34bas the first cladding layers; the p-type InP cladding layer27as the second window layer is provided as a portion of the window region40corresponding to and in common with the p-type cladding layer27as the second cladding layer; and the refractive index of the first window layer is set lower than the refractive index of the second window layer. Thus, the light having entered the window region is deviated upward to more extent according to the difference between these refractive indexes, so that, as compared with Embodiment 1, it is possible to further increase the amount of light entering the monitor PD. It is noted that in Embodiment 2, in addition to a configuration in which the refractive index of the first cladding layer is set lower than the refractive index of the second cladding layer, such a configuration is employed in which the refractive index of the first window layer is also set lower than the refractive index of the second window layer; however, an effect will be produced merely by the configuration in which the refractive index of the first window layer is set lower than the refractive index of the second window layer. Combining these configurations makes it possible to enjoy both effects thereby. Embodiment 3 In Embodiment 1, the monitor PD50is provided only on the surface of the window region40, whereas in Embodiment 3, a case will be described where the monitor PD is not only placed on the surface of the window region40but also is extended onto a surface of the spot-size converter section30. FIG.10is a sectional view showing a configuration of an optical semiconductor integrated element according to Embodiment 3, which is a longitudinal sectional view taken through a central portion thereof in the direction of laser emission.FIG.11is a transverse sectional view of the optical semiconductor integrated element taken at a position indicated by arrows HH inFIG.10. As shown inFIG.10andFIG.11, in an optical semiconductor integrated element503of Embodiment 3, a monitor PD55results from extension of the monitor PD in Embodiment 1 and is provided so as to extend across between the surface of the window region40and a part of the surface of the spot-size converter section30. The monitor PD55of Embodiment 3 is formed of the p-type contact layer28, the undoped InP layer51and the n-type contact layer52that are stacked in this order so as to extend across between the p-type InP cladding layer27in the spot-size converter section30and the p-type InP cladding layer27in the window region40on their upper side. The other configuration of the optical semiconductor integrated element503according to Embodiment 3 is the same as in the optical semiconductor integrated element501of Embodiment 1 and thus, for the equivalent components, the same reference numerals are given, so that description thereof will be omitted. In Embodiment 3, reflection light from a front-end facet40aof the window region40is effectively utilized. Although a part of the reflection light from the front-end facet40a(see, an optical path E3inFIG.10) enters a portion of the window region40corresponding to the monitor PD55, the amount of light entering the monitor PD55is restricted because the window length is usually short (if it is long, radiation light in the window region may be reflected off the passivation film on the surface of the element, to deform an FFP (Far Field Pattern) shape). In contrast, according to Embodiment 3, the monitor PD55exists also on the surface of the spot-size converter section30located before the window region40, so that the amount of light entering the monitor PD55increases (see, an optical path E4inFIG.10). As described above, in the optical semiconductor integrated element503according to Embodiment 3, the monitor PD55is provided so as to extend across between the surface of the window region40and the surface of the spot-size converter section30, so that, as compared with Embodiment 1, it is possible to further increase the amount of light entering the monitor PD. In this application, a variety of exemplary embodiments and examples are described; however, every characteristic, configuration or function that is described in one or more embodiments, is not limited to being applied to a specific embodiment, and may be applied singularly or in any of various combinations thereof to another embodiment. Accordingly, an infinite number of modified examples that are not exemplified here are supposed within the technical scope disclosed in the present description. For example, such cases shall be included where at least one configuration element is modified; where any configuration element is added or omitted; and furthermore, where at least one configuration element is extracted and combined with a configuration element of another embodiment. DESCRIPTION OF REFERENCE NUMERALS and SIGNS 10: n-type InP substrate,20: laser diode section,22: core layer,27: p-type InP cladding layer (second cladding layer),30: spot-size converter section,34a,34b: n-type InP cladding layers (first cladding layers),40: window region,50,55: monitor PD (monitor section),501,502,503: optical semiconductor integrated element. | 20,037 |
11942762 | DETAILED DESCRIPTION Mode for Invention Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the description of the embodiments, when described as being formed on the “on or under” of each element, the on or under includes both the two elements are in direct contact with each other, or one or more other elements are disposed indirectly between the two elements. In addition, when expressed as “on” or “under”, it may include the meaning of the downward direction as well as the upward direction based on one element. EXAMPLE FIG.2is a cross-sectional view of the surface light emitting laser device200according to the embodiment,FIG.3is an enlarged view of the first region A of the surface light emitting laser device according to the embodiment shown inFIG.2, andFIG.4A. is a first enlarged view of a second region B of the surface light emitting laser device according to the embodiment shown inFIG.2. Refereeing toFIG.2, the surface light emitting laser device200according to the embodiment may include a first electrode215, a substrate210, a first reflection layer220, an active region230, an opening region240, one or more of the second reflection layer250and the second electrode280may be included. The opening area240may include an aperture241and an insulating area242. The insulating region242may be referred to as an oxide layer, and the opening region240may be referred to as an oxidation region, but is not limited thereto. The embodiment may include a delta doping layer241cdisposed between the active region230and the second reflection layer250. For example, the opening region240may include an insulating region242, an aperture241, and a delta doping layer241c. For example, the surface light-emitting laser device200according to the embodiment includes a first electrode215, a substrate210disposed on the first electrode215, and a reflective layer220disposed on the substrate210, and an active region230disposed on the first reflective layer220and including an active layer232(seeFIG.3). In addition, the embodiment includes an opening region240disposed on the active region230including an aperture241and an insulating region242, and a second reflective layer250disposed on the opening region240, a second electrode280disposed on the second reflective layer250, and a delta doping layer241cdisposed between the active region230and the second reflective layer250. The embodiment may further include a second contact electrode255and a passivation layer270. Hereinafter, the technical features of the surface light-emitting laser device200according to the embodiment will be described with reference toFIG.2, and the technical effects will be described with reference toFIGS.3to10. In the drawings of the embodiment, the x-axis direction may be a direction parallel to the longitudinal direction of the substrate210, and the y-axis may be a direction perpendicular to the x-axis. <Substrate, First Electrode> Referring toFIG.2, in an embodiment, the substrate210may be a conductive substrate or a non-conductive substrate. As the conductive substrate, a metal having excellent electrical conductivity may be used, and a GaAs substrate, a metal substrate or a silicon (Si) substrate, etc having high thermal conductivity can be used to sufficiently dissipate heat generated when the surface light-emitting laser device200is operated. In the case of using a non-conductive substrate, an AlN substrate, a sapphire (Al2O3) substrate, or a ceramic substrate may be used. In an embodiment, the first electrode215may be disposed below the substrate210, and the first electrode215may be disposed in a single layer or multiple layers with a conductive material. For example, the first electrode215may be a metal and at least one of aluminum (Al), titanium (Ti), chromium (Cr), nickel (Ni), copper (Cu), and gold (Au) to improve the electrical characteristics and to increase the light output as of a single layer or a multi-layer structure. <First Reflection Layer, Second Reflection Layer> Referring toFIG.2, the embodiment may include a first reflection layer220, an active region230, an insulating region242, and a second reflection layer which are250disposed on the substrate210. FIG.3is an enlarged view of the first area A of the surface light emitting laser device according to the embodiment shown inFIG.2. Hereinafter, the surface light emitting laser device according to the embodiment of the embodiment will be described with reference toFIG.3. The first reflection layer220may be doped with a first conductivity type. For example, the first conductivity type dopant may include an n type dopant such as Si, Ge, Sn, Se, Te, or the like. In addition, the first reflection layer220may include a gallium-based compound, for example, AlGaAs, but is not limited thereto. The first reflection layer220may be a distributed Bragg reflector (DBR). For example, the first reflection layer220may have a structure in which a first layer and a second layer made of materials having different refractive indices are alternately stacked at least once. For example, as shown inFIG.3, the first reflection layer220may include a first group first reflection layer221disposed on the substrate210and a second group first reflection layer222disposed on the first group first reflection layer221. The first group first reflection layer221and the second group first reflection layer222may include a plurality of layers made of a semiconductor material having a compositional formula of AlxGa(1-x)As (0<x<1). As the Al in each layer increases, the refractive index of each layer may decrease, and as Ga increases, the refractive index of each layer may increase. In addition, the thickness of each layer may be λ/4n, λ may be a wavelength of light generated in the active region230, and n may be a refractive index of each layer with respect to light having the aforementioned wavelength. Here, λ may be 650 to 980 nanometers (nm), and n may be the refractive index of each layer. The first reflection layer220having such a structure may have a reflectance of 99.999% for light in a wavelength region of about 940 nanometers. The thickness of the layer in each of the first reflection layers220may be determined according to the refractive index and the wavelength λ of the light emitted from the active region230. In addition, as shown inFIG.3, the first group first reflection layer221and the second group first reflection layer222may also be formed of a single layer or a plurality of layers. For example, the first group first reflection layer221may include about 30-40 pairs of the first group first-first layer221aand the first group first-second layer221b. The first group first-first layer221amay be formed thicker than the first group first-second layer221b. For example, the first group first-first layer221amay be formed at about 40 to 60 nm, and the first group first-second layer221bmay be formed at about 20-30 nm. In addition, the second group first reflection layer222may also include about 5 to 15 pairs of the second group first-first layer222aand the second group first-second layer222b. The second group first-first layer222amay be formed thicker than the second group first-second layer222b. For example, the second group first-first layer222amay be formed at about 40 nm to about 60 nm, and the second group first-second layer222bmay be formed at about 20 nm to about 30 nm. In addition, as shown inFIG.3, the second reflection layer250may include a gallium-based compound, for example, AlGaAs, and the second reflection layer250may be doped with a second conductivity type dopant. The second conductivity type dopant may be a p-type dopant such as Mg, Zn, Ca, Sr, Ba, or the like. Meanwhile, the first reflection layer220may be doped with a p-type dopant, and the second reflection layer250may be doped with an n-type dopant. The second reflection layer250may also be a distributed Bragg reflector (DBR). For example, the second reflection layer250may have a structure in which a plurality of layers made of materials having different refractive indices are alternately stacked at least once. Each layer of the second reflection layer250may include AlGaAs, and in detail, may be formed of a semiconductor material having a compositional formula of AlxGa(1-x)As (0<x<1). Herein, when Al increases, the refractive index of each layer may decrease, and when Ga increases, the refractive index of each layer may increase. The thickness of each layer of the second reflection layer250may be λ/4n, λ may be a wavelength of light emitted from the active layer, and n may be a refractive index of each layer with respect to light having the aforementioned wavelength. The second reflection layer250having such a structure may have a reflectance of 99.9% with respect to light in a wavelength region of about 940 nanometers. The second reflection layer250may be formed by alternately stacking layers, and the number of pairs of layers in the first reflection layer220may be greater than the number of pairs of layers in the second reflection layer250. In this case, as described above, the reflectance of the first reflection layer220may be about 99.999%, which may be greater than 99.9% of the reflectance of the second reflection layer250. In an embodiment, the second reflection layer250may include the first group second reflecting layer251adjacent to the active region230in the active region230and the second group second reflection layer252spaced apart from the first group second reflecting layer251. As shown inFIG.3, the first group second reflection layer251and the second group second reflection layer252may also be formed of a single layer or a plurality of layers, respectively. For example, the first group second reflection layer251may include about 1 to 5 pairs of the first group second-first layer251aand the first group second-second layer251b. The first group second-first layer251amay be formed thicker than the first group second-second layer251b. For example, the first group second-first layer251amay be formed at about 40-60 nm, and the first group second-second layer251bmay be formed at about 20-30 nm. In addition, the second group second reflection layer252may also include about 5 to 15 pairs of the second group second-first layer252aand the second group second-second layer252b. The second group second-first layer252amay be formed thicker than the second group second-second layer252b. For example, the second group second-first layer252amay be formed at about 40 to 60 nm, and the second group second-second layer252bmay be formed at about 20 to 30 nm. <Active Area> Referring toFIG.3, the active region230may be disposed between the first reflection layer220and the second reflection layer250. The active region230may include an active layer232and at least one cavity231and233. For example, as shown inFIG.3, the active region230includes an active layer232, a first cavity231disposed below the active layer232, and a second cavity233disposed above the active layer232. In an embodiment, the active region230may include both the first cavity231and the second cavity233, or may include only one of the two. The active layer232may include any one of a single well structure, a multi well structure, a single quantum well structure, a multi quantum well (MQW) structure, a quantum dot structure, and a quantum line structure. The active layer232may include a well layer232aand a barrier layer232busing a compound semiconductor material of a group III-V element. The well layer232amay be formed of a material having an energy band gap smaller than the energy band gap of the barrier layer232b. The active layer232may be formed in a 1 to 3 pair structure such as InGaAs/AlxGaAs, AlGaInP/GaInP, AlGaAs/AlGaAs, AlGaAs/GaAs, GaAs/InGaAs, but is not limited thereto. Dopants may not be doped in the active layer232. Next, the first cavity231and the second cavity233may be formed of an AlyGa(1-y)As (0<y<1) material, but is not limited thereto. For example, the first cavity231and the second cavity233may each include a plurality of layers of AlyGa(1-y)As. For example, the first cavity231may include a first-first cavity layer231aand a first-second cavity layer231b. The first-first cavity layer231amay be further spaced apart from the active layer232than the first-second cavity layer231b. The first-first cavity layer231amay be formed thicker than the first-second cavity layer231b, but is not limited thereto. In addition, the second cavity233may include a second-first cavity layer233aand a second-second cavity layer233b. The second-second cavity layer233bmay be further spaced apart from the active layer232than the second-first cavity layer233a. The second-second cavity layer233bmay be formed thicker than the second-first cavity layer233a, but is not limited thereto. In this case, the second-second cavity layer233bmay be formed to about 60 to 70 nm, and the first-first cavity layer231amay be formed to about 40 to 55 nm, but is not limited thereto. <Opening Area> Referring back toFIG.2, in an embodiment, the opening region240may include an insulating region242, an aperture241, and a delta doping layer241c. The insulating region242may be formed of an insulating layer, for example, aluminum oxide, to act as a current blocking region, and the aperture241may be defined by the insulating region242. For example, when the opening region240includes aluminum gallium arsenide (AlGaAs), the AlGaAs material at the edge of the opening region240reacts with H2O and the edge changes to aluminum oxide (Al2O3), and the insulating region242can be formed. In addition, the central region of the opening region that does not react with H2O may be an aperture241made of AlGaAs. According to an embodiment, the light emitted from the active region230through the aperture241may be emitted to the upper region, and the light transmittance of the aperture241may be superior to that of the insulating region242. Referring toFIG.3again, the insulating region242may include a plurality of layers, for example, a first insulating layer242aand a second insulating layer242b. The first insulating layer242amay have a thickness that is the same as or different from that of the second insulating layer242b. FIG.4Ais an enlarged view of the first embodiment of the second region B of the surface light emitting laser device according to the embodiment shown inFIG.2. One of the technical problems in the embodiment is to provide a surface light emitting laser device capable of preventing current crowding at the aperture edge and a light emitting device including the same. Another object of the embodiments is to provide a surface light emitting laser device capable of alleviating diffraction of light at an aperture edge, and a light emitting device including the same. In order to solve this technical problem, the surface light emitting laser device according to the embodiment as shown inFIGS.2and4aincludes a delta doping layer241cdisposed between the active region230and the second reflection layer250. In detail, as illustrated inFIG.4A, the delta doped layer241cmay be disposed on the aperture241. The delta doped layer241cmay be a layer doped with a second conductivity type element. For example, the delta doped layer241cmay be doped with any one or more of Be, Mg, C, and Zn, but is not limited thereto. The delta doped layer241cmay be a delta functional doping in the y-axis direction, which is the growth direction of the epitaxial layer, and there may be no difference in the doping concentration in the x-axis direction, which is the plane direction. FIG.4Bis carrier density data E according to the position of the aperture region in the embodiment. For example, the x-axis ofFIG.4Bis data of hole density according to the distance r from the center of the aperture. In the related art R, a current crowding C occurs in which the hole density at the aperture edge rapidly increases as it is applied from a low current to a high current, and the current density at this aperture edge is generated. The higher mode is oscillated, and this higher order oscillation has a problem of increasing the divergence angle of beams. According to the embodiment, the current density is concentrated at the aperture edge by distributing the delta doped layer241cdoped with the second conductivity type element to the aperture241by the even current diffusion in the aperture241. By preventing the phenomenon there is a technical effect that can provide a surface light emitting laser device and a light emitting device including the same that can produce a uniform light output in the entire area of the aperture in accordance with the current diffusion. In Example E, the second conductive element is carbon C, and the concentration is about 8×1018cm−3. In addition, the embodiment arranges the delta doped layer241cdoped with the second conductivity type element in the aperture241so that the current crowding phenomenon in the aperture by current diffusion can be prevented in the aperture241. Accordingly, there is a technical effect that the embodiment prevents a current crowding phenomenon at the aperture edge to prevent higher mode oscillation, thereby increasing the divergence angle of the beams. In addition, in the embodiment, a current flowing from the second electrode280to the first electrode215flows toward the center of the opening region240by the delta doped layer241cdoped with a second conductivity type element. Therefore, there is a technical effect to prevent the current density phenomenon at the aperture edge to prevent higher mode oscillation and to increase the divergence angle of the beams. Next,FIG.4Cis a manufacturing conceptual diagram of the first embodiment of the second region B shown inFIG.4A. As shown inFIG.4C, an AlGa-based layer241afor forming the opening region240is formed on the active region230, and is doped by a second conductivity type element during the growth of the AlGa-based layer241a. The delta doped layer241cmay be disposed in the AlGa based layer241a. The AlGa-based layer241amay include a material such as AlzGa(1-z)As (0<z<1), but is not limited thereto. The delta doped layer241cmay be a delta functional doping with respect to the y-axis direction, which is the growth direction of the AlGa-based layer241a, and there may be no difference in doping concentration in the x-axis direction, which is the plane direction. In some embodiments, the delta doped layer241cmay be doped with a second conductivity type element, but is not limited thereto. For example, the delta doped layer241cmay be doped with any one or more of Be, Mg, C, and Zn, but is not limited thereto. On the other hand,FIG.5is the data of the degree of oxidation according to the doping concentration in the surface light emitting laser device according to the embodiment. Referring toFIG.5, as the doping concentration increases from the first doping concentration D1to the second doping concentration D2, oxidation may be promoted to increase the thickness of the oxide layer. Therefore, according to the embodiment, the oxidized process is performed after the delta doped layer241cis formed on the AlGa series layer241aas shown inFIG.4C, and thus the insulating region242is delta-doped with the second conductivity type element. The oxidation rate in the x-axis direction can be controlled, and sharp edges can be realized by selective or predominant oxidation of the delta-doped region as shown inFIG.4A. In some embodiments, the delta doped layer, which was present at the insulating layer242, is difficult to function as a conductive layer due to oxidation. It may be present in an un-oxidated state. Referring toFIG.4A, an inner end of the insulating region242may overlap the delta doped layer241cin a first direction (x-axis direction). In an embodiment, the minimum thickness of the insulating region242may be in contact with the delta doped layer241c. For example, sharp edges due to dominant oxidation of the insulating region242may be in contact with the delta doped layer241cpositioned in the aperture241. According to the embodiment, as shown inFIG.4A, while the delta doping layer241cis present in the aperture241, the thickness of the insulating region242may be formed to be thinner in the direction of the aperture241. For example, in an embodiment, the first thickness T1in the outer region of the insulating region242may be thicker than the second thickness T2in the inner region adjacent to the aperture241. Accordingly, according to the embodiment, the insulating region242may have the second thickness T2in the inner region adjacent to the aperture241to be thinner than the first thickness T1in the outer region. The problem of increasing the divergence angle of the beams can be solved by alleviating the diffraction of the light. In an embodiment, the first thickness T1of the outer region of the insulating region242may be about 5 nm to 50 nm. If the thickness of the insulating region242is less than 5 nm, problems may occur in current and optical confinement. On the other hand, when the thickness of the insulating region242exceeds 50 nm, there is a problem of increasing the driving voltage or increasing the beam divergence angle. In addition, since the thickness of the insulating region242is controlled to 10 nm to 30 nm, the effects of current and optical restraint may be further increased, and the problem of increase in the divergence angle of the beam may be minimized. In an embodiment, the doping concentration of the delta doping layer241cmay be about 1×1016to 1×1020atoms/cm3. When the oxidation process is performed on the AlGa-based layer241athrough the doping concentration in this range, the delta doping layer as the oxidation proceeds preferentially along241c, the thickness of the insulating region242may be formed to be thinner in the direction of the aperture241as shown inFIG.4A. The doping concentration of the delta doped layer241cmay be 1×1016atoms/cm3or more, which is a background carrier density, and the deterioration of crystalline quality may occur when the doping concentration of the delta doped layer241cexceeds its upper limit, 1×1020atoms/cm3. In addition, in the embodiment, the doping concentration of the delta doping layer241cis preferably controlled at about 1×1017to 1×1019atoms/cm3, so that the oxidation region is more preferentially oxidized in the delta doping layer241c, so that the inner side has a sharp insulating region. By implementing242, the diffraction phenomenon of light at the edge of the aperture241may be remarkably alleviated to prevent an increase in the divergence angle of the beam, and the crystal quality of the AlGa series layer241amay be further improved. Also, in an embodiment, the dopant concentration of the delta doped layer241cmay be higher than the dopant concentration doped in another layer. For example, in an embodiment, the dopant concentration of the delta doped layer241cmay be higher than that of the second conductivity type dopant of the second reflection layer250, so that oxidation proceeds preferentially along the delta doped layer241c. As a result, the insulating region242may be formed to be thinner in the direction of the aperture241. In an embodiment, the delta doped layer241cmay be formed in atomic unit thickness, and may be confirmed by an analytical device such as SIMS. According to the embodiment, the oxidation rate of the insulating region242is controlled by delta doping of the second conductivity type element to implement sharp edges by selective or predominant oxidation of the delta-doped region. The second thickness T2in the inner region adjacent to the aperture241of insulating region242is formed to be thinner than the first thickness T1in the outer region, thereby alleviating the diffraction of light in the aperture241to reduce the beam and the problem of increasing the divergence angle of beams can be solved. FIG.6Ais an enlarged view of the second embodiment of the second region B of the surface light emitting laser device according to the embodiment shown inFIG.2. The second embodiment may adopt the technical features of the first embodiment, and will be described below with reference to the technical features of the second embodiment. In the second embodiment, the aperture241may include a plurality of AlGa-based layers241a, and may include, for example, a first AlGa-based layer241a1and a second AlGa-based layer241a2. And the Al concentration may be different. The first AlGa-based layer241a1and the second AlGa-based layer241a2may include different materials. For example, the first AlGa-based layer241a1may include Alz1Ga(1-z1)As (0<Z1<1), and the second AlGa-based layer241a2may include Alz2Ga(1-z2)As (0<Z2<1), but is not limited thereto. For example, the second Al concentration of the second AlGa-based layer241a2may be higher than that of the first Al of the first AlGa-based layer241a1. In addition, the delta doped layer241cmay be disposed on the second AlGa-based layer241a2having a high Al concentration. At this time, the Al concentration of Alz2Ga(1-z2)N (0<Z2<1) of the second AlGa-based layer241a2may be graded. For example, the Al concentration of the second AlGa-based layer241a2may have the highest Al concentration at its center, and gradually decreases in the growth direction (y-axis direction) or the opposite direction (−y-axis direction). A manufacturing method of the second embodiment of the second region B shown inFIG.6Awill be described with reference toFIG.6B. In the second embodiment, the AlGa-based layer241aincludes a first AlGa-based layer241a1having a first Al concentration and a second AlGa-based layer241a2having a second Al concentration higher than the first concentration at the center thereof such that the opening area240may be formed. For example, in the second embodiment, the first AlGa-based layer241a1may be a first AlGaAs layer having a first Al concentration, and the second AlGa-based layer241a2may be a second AlGaN layer having a second Al concentration. In addition, the second embodiment may include a delta doping layer241cin the second AlGa-based layer241a2. According to the second embodiment, the second AlGa-based layer241a2having a high Al concentration is included in the center, and the oxidation process may be predominantly performed in the second AlGa-based layer241a2in the x-axis direction. Accordingly, as shown inFIG.6A, the insulating region242may be formed to be thinner in the direction of the aperture241. For example, in an embodiment, the first thickness T1in the outer region of the insulating region242may be thicker than the second thickness T2in the inner region adjacent to the aperture241. Further, in the second embodiment, when the second AlGa series layer241a2includes AlzGa(1-z)N (0<z<1), the Al concentration of the AlzGa(1-z)N (0<z<1) can be graded. For example, the Al concentration may be the highest in the central portion of the second AlGa-based layer241a2itself, and the Al concentration may gradually decrease in the −y axis direction opposite to the y axis direction. According to the embodiment, by providing the second AlGa-based layer241a2in which the Al concentration is graded, oxidization is predominantly performed at the center thereof, so that sharper edges can be realized. In some embodiments, the delta doped layer241cmay be disposed on the second AlGa-based layer241a2. Accordingly, as the oxidized process is performed after the delta doped layer241cis formed on the second AlGa-based layer241a2in the second embodiment, the delta doped layer241cexists in the aperture241as shown inFIG.6A. The thickness of the insulating region242may be formed in a sharp edge shape toward the aperture241. For example, in an embodiment, the first thickness T1in the outer region of the insulating region242may be thicker than the second thickness T2in the inner region adjacent to the aperture241. According to an embodiment, the first thickness T1in the outer region of the insulating region242may be thicker than the second thickness T2in the inner region. Accordingly, in the embodiment, the second thickness T2in the inner region adjacent to the aperture241of the insulating region242is formed to be thinner than the first thickness T1in the outer region, so that the light in the aperture241is reduced. The problem of increasing the divergence angle of the beams can be solved by alleviating the diffraction phenomenon of the beam. According to the second embodiment, as Al concentration is graded in the second AlGa-based layer241a2, oxidation may be predominantly performed at the center thereof, and at the same time, delta doping is performed in the second AlGa-based layer241a2. The layer241cmay be disposed to implement sharper edges. Accordingly, according to the second embodiment, the second thickness T2in the inner region adjacent to the aperture241of the insulating region242is formed to be thinner than the first thickness T1in the outer region such that light diffraction may be alleviated to increase the divergence angle of beams in aperture241. In addition, in the second embodiment, by disposing the delta-doped layer241cdoped with the second conductivity-type element on the aperture241, current is concentrated in the aperture by current diffusion in the aperture241. By preventing crowding, it is possible to prevent oscillation in higher mode at the aperture edge. Accordingly, the second embodiment can provide a surface light emitting laser device capable of solving the problem of increasing the divergence angle of beams and a light emitting device including the same. Next,FIG.7Ais an enlarged view of the third embodiment of the second region B of the surface light emitting laser device according to the embodiment shown inFIG.2. The third embodiment may adopt the technical features of the first and second embodiments, and will be described below with reference to the technical features of the third embodiment. In the third embodiment, the aperture241may include a first AlGa-based layer241a1and a GaAs-based layer241a3. For example, the first AlGa-based layer241a1may include AlzGa(1-z)As (0<z<1), and the GaAs-based layer241a3may include a GaAs layer, but is not limited thereto. In addition, the third embodiment may include a delta doping layer241cin the GaAs-based layer241a3. A manufacturing method of the third embodiment of the second region B shown inFIG.7Awill be described with reference toFIG.7B. According to the third embodiment, in order to form the opening region240, the first AlGa-based layer241a1may be included, and a GaAs-based layer241a3may be included at the center thereof. In this case, a delta doped layer241cmay be disposed on the GaAs-based layer241a3. According to the third embodiment, the delta doped layer241cmay be disposed on the GaAs-based layer241a3. Accordingly, after the delta doped layer241cis formed on the GaAs-based layer241a3in the third embodiment, as the oxidation process proceeds, the delta doped layer241cis present in the aperture241as shown inFIG.7A. The thickness of the region242may be formed in the shape of a sharp edge in the direction of the aperture241. For example, in an embodiment, the first thickness T1in the outer region of the insulating region242may be thicker than the second thickness T2in the inner region adjacent to the aperture241. According to an embodiment, the first thickness T1in the outer region of the insulating region242may be thicker than the second thickness T2in the inner region. Accordingly, in the embodiment, the second thickness T2in the inner region adjacent to the aperture241of the insulating region242is formed to be thinner than the first thickness T1in the outer region, so that the problem of increasing the divergence angle of the beams can be solved by alleviating the diffraction phenomenon of the beam in the aperture241. In addition, the third embodiment arranges the delta-doped layer241cdoped with the second conductivity type element in the aperture241so that current is concentrated in the aperture by current diffusion in the aperture241. The third embodiment can provide a surface light emitting laser device capable of solving the problem of increasing the divergence angle of beams by preventing high mode oscillation at the aperture edge by preventing crowding phenomenon and the same. FIG.7Cis a conceptual diagram of 2DHG (2D hole gas) effect in the second region B of the surface light emitting laser device according to the embodiment illustrated inFIG.7A. According to the third embodiment, as shown inFIG.7A, a GaAs-based layer241a3is disposed between the first AlGa-based layers241a1, thereby forming 2D dimensional hole gas (2DHG) as shown inFIG.7Cto spread current through current spreading and the third embodiment can significantly improve carrier distribution uniformity in the aperture region. In addition, according to the third embodiment, the GaAs layer, which is the GaAs series layer241a3, is disposed between the AlGaAs layers, which are the AlGa series layer241a, to form 2D dimensional hole gas (2DHG), thereby providing current spreading. It is possible to provide a surface light emitting laser device and a light emitting device including the same capable of preventing current crowding at the aperture and preventing higher mode oscillations at the aperture edge, thereby increasing the divergence angle of beams. FIG.8Ais a fourth embodiment of a second region B of the surface light emitting laser device according to the embodiment shown inFIG.2, andFIG.8Bis a manufacturing process diagram of the fifth embodiment shown inFIG.8A. The fourth embodiment may adopt the technical features of the first to third embodiments, and will be described below with reference to the technical features of the fourth embodiment. According to the fourth embodiment, the delta doped layer241cmay be disposed in the lower region241bof the aperture241. Referring toFIG.8B, an AlGa-based layer241afor forming the opening region240is formed on the active region230, and the doping of the second conductivity type element during the growth of the AlGa-based layer241ais performed. The delta doped layer241cmay be disposed in the lower region241bof the AlGa series layer241a. The AlGa-based layer241amay include a material such as AlzGa(1-z)As (0<z<1), but is not limited thereto. The delta doped layer241cmay be doped with a second conductivity type element, but is not limited thereto. For example, the delta doped layer241cmay be doped with any one or more of Be, Mg, C, and Zn, but is not limited thereto. According to the fourth embodiment, the delta doped layer241cdoped with the second conductivity type element is disposed in the lower region241bof the aperture241so that the aperture edge can be spread evenly in the aperture241. The present invention can provide a surface light emitting laser device and a light emitting device including the same capable of generating a uniform light output in the entire aperture according to current diffusion by preventing a current density phenomenon at the aperture edge. In addition, according to the fourth embodiment, by disposing the delta-doped layer241cdoped with the second conductivity-type element in the lower region241bof the aperture241, current can be diffused in the aperture241, so that current crowding can be prevented in the aperture. Accordingly, the embodiment may prevent current crowding at the aperture edge to prevent higher mode oscillation. Therefore, the embodiment can provide a surface light emitting laser device a light emitting device including the same capable of solving the problem of increasing the divergence angle of beams. In addition, according to the fourth embodiment, as shown inFIG.8A, while the delta doping layer241cis present in the aperture241, the thickness of the insulating region242may be formed to be thinner in the direction of the aperture241. For example, in an embodiment, the thickness in the outer region of the insulating region242may be thicker than the thickness in the inner region adjacent to the aperture241. Accordingly, in the embodiment, the insulating region242is formed to have a thickness in the inner region adjacent to the aperture241to be thinner than that in the outer region, thereby reducing the diffraction phenomenon of light at the aperture241to reduce the divergence angle of the beam. It is possible to solve the problem of increasing the divergence angle of beams. FIG.10is a conceptual view of a 2DHG effect in the second region B of the surface light emitting laser device according to the embodiment shown inFIG.8A, wherein the delta doping layer241ccan be placed between an AlGa-based layer and a p-AlGaAs layer. For example, the second reflection layer250may include a p-AlGaAs layer, the second cavity233may include a GaAs layer. And the delta doped layer241ccan be disposed between the second cavity233and second reflection layer250to spread the current through the 2DHG effect. According to the embodiment, the oxidization rate of the insulating region242may be controlled by delta doping of the second conductivity type element to implement sharp edges by selective or predominant oxidation of the delta doped region. As shown inFIG.8A, a 2D dimensional hole gas (2DHG) is formed by the growth of a delta doping layer (241c) in the lower region241bof the aperture241, and the current spreading through the 2DHG is performed such that carrier distribution uniformity can be improved in the aperture region. Accordingly, according to the fourth embodiment, the delta doped layer241cdoped with the second conductivity type element is disposed in the lower region241bof the aperture241so that the aperture can be spread evenly in the aperture241. A surface light emitting laser device and a light emitting device including the same capable of improving current injection efficiency by improving current injection efficiency by preventing current condensation at an edge can be provided. In addition, in the fourth embodiment, the delta-doped layer241cdoped with the second conductivity-type element is disposed in the lower region241bof the aperture241to diffuse current in the aperture241such that a higher mode oscillation at the aperture edge can be prevented. Through this, the embodiment can provide a surface light emitting laser device and a light emitting device including the same capable of solving the problem of increasing the divergence angle of beams. Next,FIG.9Ais a fifth embodiment of the second region B of the surface light emitting laser device according to the embodiment shown inFIG.2, andFIG.9Bis a manufacturing process diagram of the fifth embodiment shown inFIG.9A. The fifth embodiment may adopt the technical features of the first to fourth embodiments, and will be described below with reference to the technical features of the fifth embodiment. According to the fifth embodiment, the delta doped layer241cmay be disposed in the upper region241tof the aperture241. Referring toFIG.9B, an AlGa-based layer241afor forming the opening region240is formed on the active region230, and the doping of the second conductivity type element during the growth of the AlGa-based layer241ais performed. The delta doped layer241cmay be disposed in the upper region241tof the AlGa series layer241a. The AlGa-based layer241amay include a material such as AlzGa(1-z)As (0<z<1), but is not limited thereto. FIG.10is a conceptual diagram of a 2DHG effect in the second region B of the surface light emitting laser device according to the embodiment shown inFIG.9A, wherein the delta doping layer241ccan be placed between an AlGa-based p-AlGaAs layer and a GaAs layer. The delta doped layer241cmay be disposed in the upper region241tof the AlGa series layer241a. For example, the second reflection layer250may include a p-AlGaAs layer, the second cavity233may include a GaAs layer, and the delta doped layer241cmay be disposed between a second reflection layer250and the second cavity233to spread the current through the 2DHG effect. According to the fifth embodiment, the stiff edge may be implemented by selective or predominant oxidation of the delta-doped region by controlling the oxidation rate of the insulating region242by delta doping of the second conductivity type element. As shown inFIG.9A, 2D dimensional hole gas (2DHG) is formed in the upper region241tof the aperture241by the growth of a delta doping layer241c, and current spreading through the 2DHG is performed. As a result, carrier distribution uniformity may be improved in the aperture region. Accordingly, according to the fifth embodiment, the delta doped layer241cdoped with the second conductivity type element is disposed in the aperture241so that even current spreading in the aperture241is performed at the edge of the aperture241. It is possible to provide a surface light emitting laser device and a light emitting device including the same, which may improve current injection efficiency by preventing current condensation of the light, thereby improving light output and voltage efficiency. In addition, in the fifth embodiment, an aperture edge is formed by the current diffusion in the aperture241by placing the delta doped layer241cdoped with the second conductivity type element in the upper region241tof the aperture241such that a surface light emitting laser device and a light emitting device including the same capable of solving a problem of increasing divergence angle of beams by preventing higher mode oscillation at an edge can be provided. <Second Contact Electrode, Passivation Layer, Second Electrode> Referring back toFIG.2, the surface-emitting laser device200according to the embodiment can be mesa etched from the second reflection layer250to the insulating region242and the active region230in the region around the aperture241. In addition, even a part of the first reflection layer220may be mesa etched. A second contact electrode255may be disposed on the second reflective layer250. A region between the second contact electrodes255where the second reflective layer250is exposed may correspond to the aperture241. The second contact electrode255may improve contact characteristics between the second reflection layer250and the second electrode280, which will be described later. InFIG.2, a passivation layer270may be disposed on the side and top surfaces of the mesa-etched light emitting structure and the top surface of the first reflection layer220. The passivation layer270may also be disposed on the side surface of the surface emission laser device200separated by device units to protect and insulate the surface emission laser device200. The passivation layer270may be made of an insulating material, for example, nitride or oxide. For example, the passivation layer270may include at least one of polymide, silica (SiO2), or silicon nitride (Si3N4). The passivation layer270may be thinner than the second contact electrode255at the top surface of the light emitting structure, and thus the second contact electrode255may be exposed to the upper portion of the passivation layer270. The second electrode280may be disposed in electrical contact with the exposed second contact electrode255. The second electrode280extends above the passivation layer270to supply current from the outside. The second electrode280may be made of a conductive material, for example, may be a metal. For example, the second electrode280may include at least one of aluminum (A1), titanium (Ti), chromium (Cr), nickel (Ni), copper (Cu), and gold (Au). The embodiment can provide a surface light emitting laser device and a light emitting device including the same, which can solve the problem of increasing the divergence angle of beams by preventing current crowding at the aperture edge to prevent higher mode oscillation. Embodiments can provide a surface light emitting laser device and a light emitting device including the same, which can prevent current condensation at the aperture edge to produce a uniform light output in the entire aperture area according to current diffusion. In addition, the embodiment can provide a surface light emitting laser device and a light emitting device including the same that can solve the problem that the diffraction phenomenon of the light at the aperture edge to increase the divergence angle of the beam. Hereinafter, a method of manufacturing a surface light emitting laser device according to an embodiment will be described with reference toFIGS.11A through16, including the method of each embodiment. First, as shown inFIG.11A, a light emitting structure including a first reflection layer220, an active region230, and a second reflection layer250are formed on a substrate210. The substrate210may be formed of a material suitable for growth of a semiconductor material or a carrier wafer, may be formed of a material having excellent thermal conductivity, and may include a conductive substrate or an insulating substrate. For example, when the substrate210may be a conductive substrate or a non-conductive substrate. As the conductive substrate, a metal having excellent electrical conductivity may be used, and a GaAs substrate, a metal substrate or a silicon (Si) substrate, etc having high thermal conductivity can be used to sufficiently dissipate heat generated when the surface light-emitting laser device200is operated. In addition, when the substrate210is a non-conductive substrate, an AlN substrate, a sapphire (Al2O3) substrate, or a ceramic substrate may be used. In addition, in the embodiment, a substrate of the same type as the first reflection layer220may be used as the substrate210. For example, when the substrate210is a GaAs substrate of the same type as the first reflection layer220, the lattice constant coincides with the first reflection layer210, so that a defect such as lattice mismatch does not occur in the first reflection layer220. Next, a first reflection layer220may be formed on the substrate210, andFIG.11Bis an enlarged view of the first-second area A2of the surface light emitting laser device according to the embodiment shown inFIG.11A. Hereinafter, a surface light emitting laser device according to an embodiment will be described with reference toFIGS.11A and11B. The first reflection layer220may be grown using a chemical vapor deposition method (CVD) or a molecular beam epitaxy (MBE) or a sputtering or hydroxide vapor phase epitaxy (HVPE). The first reflection layer220may be doped with a first conductivity type. For example, the first conductivity type dopant may include an n type dopant such as Si, Ge, Sn, Se, Te, or the like. The first reflection layer220may include a gallium-based compound, for example, AlGaAs, but is not limited thereto. The first reflection layer220may be a distributed Bragg reflector (DBR). For example, the first reflection layer220may have a structure in which layers made of materials having different refractive indices are alternately stacked at least once. For example, as shown inFIG.11B, the first reflection layer220includes the first group first reflection layer221disposed on the substrate210and the second group first reflection layer222disposed on the first group first reflection layer221. The first group first reflection layer221and the second group first reflection layer222may include a plurality of layers made of a semiconductor material having a compositional formula of AlxGa(1-x)As (0<x<1). In addition, when Al in each layer increases, the refractive index of each layer may decrease, and when Ga increases, the refractive index of each layer may increase. In addition, as shown inFIG.11B, the first group first reflection layer221and the second group first reflection layer222may also be formed of a single layer or a plurality of layers, respectively. For example, the first group first reflection layer221may include about 30-40 pairs of the first group first-first layer221aand the first group first-second layer221b. In addition, the second group first reflection layer222may also include about 5 to 15 pairs of the second group first-first layer222aand the second group first-second layer222b. Next, the active region230may be formed on the first reflection layer220. As illustrated inFIG.11B, the active region230may include an active layer232, a first cavity231disposed under the active layer232, and a second cavity233disposed above the active layer232. In an embodiment, the active region230may include both the first cavity231and the second cavity233, or may include only one of the two. The active layer232may include a well layer232aand a barrier layer232busing a compound semiconductor material of a group III-V element. The active layer232may be formed in a 1 to 3 pair structure such as InGaAs/AlxGaAs, AlGaInP/GaInP, AlGaAs/AlGaAs, AlGaAs/GaAs, GaAs/InGaAs, but is not limited thereto. Dopants may not be doped in the active layer232. The first cavity231and the second cavity233may be formed of an AlyGa(1-y)As (0<y<1) material, but is not limited thereto. For example, the first cavity231and the second cavity233may each include a plurality of layers of AlyGa(1-y)As. For example, the first cavity231may include a first-first cavity layer231aand a first-second cavity layer231b. In addition, the second cavity233may include a second-first cavity layer233aand a second-second cavity layer233b. Next, an AlGa series layer241afor forming the opening region240may be formed on the active region230. In example embodiments, the delta-doped layer241cmay be disposed in the AlGa-based layer241aby the doping of the second conductivity type element during the growth of the AlGa-based layer241a. The AlGa-based layer241amay include a material such as AlzGa(1-z)As (0<z<1), but is not limited thereto. The AlGa-based layer241amay include a conductive material, and may include the same material as the first reflection layer220and the second reflection layer250, but is not limited thereto. For example, when the AlGa-based layer241aincludes an AlGaAs-based material, the AlGa-based layer241ais formed of a semiconductor material having a compositional formula of AlxGa(1-x)As (0<x<1). For example, it may have a composition formula of Al0.98Ga0.02As, but is not limited thereto. Technical features of the AlGa series layer241aand the delta doped layer241cwill be described later with reference toFIGS.13A to13E. Next, a second reflection layer250may be formed on the AlGa-based layer241a. The second reflection layer250may include a gallium-based compound, for example AlGaAs. For example, each layer of the second reflection layer250may include AlGaAs, and in detail, may be formed of a semiconductor material having a compositional formula of AlxGa(1-x)As (0<x<1). The second reflection layer250may be doped with a second conductivity type dopant. For example, the second conductivity type dopant may be a p-type dopant such as Mg, Zn, Ca, Sr, or Ba. Meanwhile, the first reflection layer220may be doped with a p-type dopant, and the second reflection layer250may be doped with an n-type dopant. The second reflection layer250may also be a distributed Bragg reflector (DBR). For example, the second reflection layer250may have a structure in which a plurality of layers made of materials having different refractive indices are alternately stacked at least once. For example, the second reflection layer250may include the first group second reflecting layer251adjacent to the active region230in the active region230and the second group second reflection layer252spaced apart from the first group second reflecting layer251. In addition, the first group second reflecting layer251and the second group second reflecting layer252may be formed of a single layer or a plurality of layers, respectively. For example, the first group second reflection layer251may include about 1 to 5 pairs of the first group second-first layer251aand the first group second-second layer251b. In addition, the second group second reflection layer252may also include about 5 to 15 pairs of the second group second-first layer252aand the second group second-second layer252b. Next, as shown inFIG.12, the light emitting structure may be mesa-etched using a predetermined mask300. In this case, the mesa may be etched from the second reflection layer250to the AlGa series layer241aand the active region230, and may be mesa etched to a part of the first reflection layer220. In mesa etching, the AlGa-based layer241aand the active region230may be removed from the second reflection layer250in the peripheral region by an inductively coupled plasma (ICP) etching method. Referring toFIG.12, in the surface light-emitting laser device according to the embodiment, a second region B represents the AlGa-based layer241aand the delta doped layer241c. Embodiments for the second area B are shown inFIGS.13A to13Eand will be described in detail later. Next, as shown inFIG.14, the edge region of the AlGa-based layer may be changed to the insulating region242, and may be changed to, for example, wet oxidation. As a result, the opening region240including the insulating region242and the aperture241which is a non-oxidation region may be formed. For example, when oxygen is supplied from the edge region of the AlGa-based layer241a, AlGaAs of the AlGa-based layer may react with H2O to form aluminum oxide (Al2O3). At this time, by adjusting the reaction time, the center region of the AlGa-based layer does not react with oxygen, and only the edge region reacts with oxygen to form an insulating region242of aluminum oxide. In addition, the embodiment may change the edge region of the AlGa based layer into the insulating region242through ion implantation, but is not limited thereto. During ion implantation, photons may be supplied with energy of 300 keV or more. After the reaction process described above, conductive AlGaAs may be disposed in the central region of the opening region240, and non-conductive Al2O3may be disposed in the edge region. AlGaAs in the central region may be defined as the aperture241as a portion where the light emitted from the active region230proceeds to the upper region. In this case, referring toFIG.14, in the surface light emitting laser device according to the embodiment, the second region B includes the insulating region242and the delta doped layer241c, and each embodiment is shown inFIGS.15A-15E, which will be described below in conjunction withFIGS.13A-13E. First,FIGS.13A and15Aare conceptual views of the first embodiment B1of the second region B shown inFIGS.12and14. As shown inFIG.13A, an AlGa-based layer241afor forming the opening region240is formed on the active region230, and is doped by a second conductivity type element during the growth of the AlGa-based layer241a. The delta doped layer241cmay be disposed in the AlGa based layer241a. The AlGa-based layer241amay include a material such as AlzGa(1-z)As (0<z<1), but is not limited thereto. The delta doped layer241cmay be a delta functional doping with respect to the y-axis direction, which is the growth direction of the AlGa-based layer241a, and there may be no difference in doping concentration in the x-axis direction, which is the plane direction. In some embodiments, the delta doped layer241cmay be doped with a second conductivity type element, but is not limited thereto. For example, the delta doped layer241cmay be doped with any one or more of Be, Mg, C, and Zn, but is not limited thereto. In the embodiment, as the doping concentration increases, oxidation is promoted and the thickness of the oxide layer is increased. Accordingly, when the oxidation process is performed after the delta-doped layer241cis formed on the AlGa-based layer241aas shown inFIG.13A, the x-axis of the insulating region242is performed by delta doping of the second conductivity type element as shown inFIG.15Asuch that the oxidation rate in the direction can be controlled. Therefore, in an embodiment, a sharp edge can be implemented by selective or dominant oxidation of the delta-doped region. As shown inFIG.15A, an inner end of the insulating region242may overlap the delta doped layer241cin a first direction (x-axis direction). In an embodiment, the minimum thickness of the insulating region242may be in contact with the delta doped layer241c. According to the first embodiment, as shown inFIG.15A, while the delta doping layer241cis present in the aperture241, the thickness of the insulating region242may be made thinner in the direction of the aperture241. For example, in the first embodiment, the first thickness T1in the outer region of the insulating region242may be thicker than the second thickness T2in the inner region adjacent to the aperture241. Accordingly, according to the first embodiment, the insulating region242is formed such that the second thickness T2in the inner region adjacent to the aperture241is thinner than the first thickness T1in the outer region. In241, light diffraction may be alleviated to increase the divergence angle of beams. In the first embodiment, the first thickness T1of the outer region of the insulating region242may be about 5 nm to 50 nm. If the thickness of the insulating region242is less than 5 nm, problems may occur in current and optical confinement. On the other hand, when the thickness of the insulating region242exceeds 50 nm, there is a problem of increasing the driving voltage or increasing the beam divergence angle. In addition, since the thickness of the insulating region242is controlled to 10 nm to 30 nm, the effects of current and optical restraint may be further increased, and the problem of increase in the divergence angle of the beam may be minimized. In an embodiment, the doping concentration of the delta doping layer241cmay be about 1×1016to 1×1020atoms/cm3. When the oxidation process is performed on the AlGa-based layer241athrough the doping concentration in this range, the delta doping layer as the oxidation proceeds preferentially along241c, the thickness of the insulating region242may be formed to be thinner in the direction of the aperture241as shown inFIG.15A. The doping concentration of the delta doped layer241cmay be 1×1016atoms/cm3or more, which is a background carrier density, and the deterioration of crystalline quality may occur when the doping concentration of the delta doped layer241cexceeds its upper limit, 1×1020atoms/cm3. In addition, in the embodiment, the doping concentration of the delta doping layer241cis preferably controlled at about 1×1017to 1×1019atoms/cm3, so that the oxidation region is more preferentially oxidized in the delta doping layer241c, so that the inner side has a sharp insulating region. By implementing242, the diffraction phenomenon of light at the edge of the aperture241may be remarkably alleviated to prevent an increase in the divergence angle of the beam, and the crystal quality of the AlGa series layer241amay be further improved. In an embodiment, the delta doped layer241cmay be formed in atomic unit thickness, and may be confirmed by an analytical device such as SIMS. According to the first embodiment, the oxidization rate of the insulating region242is controlled by the delta doping of the second conductivity type element, so that the sharp edge is implemented by the selective or predominant oxidation of the delta-doped region. The second thickness T2in the inner region adjacent to the aperture241of the region242is formed to be thinner than the first thickness T1in the outer region, thereby alleviating the diffraction of light in the aperture241and the problem of increasing the divergence angle of beams can be solved. FIGS.13B and15Bare conceptual views of the second embodiment B2of the second region B shown inFIGS.12and14. The second embodiment may adopt the technical features of the first embodiment, and will be described below with reference to the technical features of the second embodiment. Referring toFIG.13B, in order to form the opening region240according to the second embodiment, the AlGa-based layer241aincludes a first AlGa-based layer241a1having a first Al concentration, and is formed at the center thereof. The second AlGa-based layer241a2having a second Al concentration higher than one concentration may be included. For example, in the second embodiment, the first AlGa-based layer241a1may be a first AlGaAs layer having a first Al concentration, and the second AlGa-based layer241a2may be a second AlGaN layer having a second Al concentration. In addition, the second embodiment may include a delta doping layer241cin the second AlGa-based layer241a2. According to the second embodiment, the second AlGa-based layer241a2having a high Al concentration is included in the center, and the oxidation process may be predominantly performed in the second AlGa-based layer241a2in the x-axis direction. Accordingly, as shown inFIG.15B, the insulating region242may be formed to be thinner in the direction of the aperture241. For example, in an embodiment, the first thickness T1in the outer region of the insulating region242may be thicker than the second thickness T2in the inner region adjacent to the aperture241. Further, in the second embodiment, when the second AlGa series layer241a2includes AlzGa(1-z)N (0<z<1), the Al concentration of the AlzGa(1-z)N (0<z<1) can be graded. For example, the Al concentration may be the highest in the central portion of the second AlGa-based layer241a2itself, and the Al concentration may gradually decrease in the −y axis direction opposite to the y axis direction. According to the embodiment, by providing the second AlGa-based layer241a2in which the Al concentration is graded, oxidization is predominantly performed at the center thereof, so that sharper edges can be realized. In addition, according to the second embodiment, the delta doped layer241cmay be disposed on the second AlGa-based layer241a2. Accordingly, as the oxidized process is performed after the delta doped layer241cis formed on the second AlGa-based layer241a2in the second embodiment, the delta doped layer241cexists in the aperture241as shown inFIG.15B. The thickness of the insulating region242may be formed in a sharp edge shape toward the aperture241. For example, in an embodiment, the first thickness T1in the outer region of the insulating region242may be thicker than the second thickness T2in the inner region adjacent to the aperture241. According to an embodiment, the first thickness T1in the outer region of the insulating region242may be thicker than the second thickness T2in the inner region. Accordingly, in the embodiment, the second thickness T2in the inner region adjacent to the aperture241of the insulating region242is formed to be thinner than the first thickness T1in the outer region, so that the diffraction phenomenon of the light in the aperture241can be reduced. The problem of increasing the divergence angle of the beams can be solved by alleviating the diffraction phenomenon of the beam. According to the second embodiment, as Al concentration is graded in the second AlGa-based layer241a2, oxidation may be predominantly performed at the center thereof, and at the same time, delta doping is performed in the second AlGa-based layer241a2. The layer241cmay be disposed to implement sharper edges. Accordingly, according to the second embodiment, the second thickness T2in the inner region adjacent to the aperture241of the insulating region242is formed to be thinner than the first thickness T1in the outer region such that light diffraction may be alleviated to increase the divergence angle of beams in aperture241. In addition, in the second embodiment, by disposing the delta-doped layer241cdoped with the second conductivity-type element on the aperture241, current is concentrated in the aperture by current diffusion in the aperture241. By preventing crowding, it is possible to prevent oscillation in higher mode at the aperture edge. Accordingly, the second embodiment can provide a surface light emitting laser device capable of solving the problem of increasing the divergence angle of beams and a light emitting device including the same. FIGS.13C and15Care conceptual views of the third embodiment B3of the second region B shown inFIGS.12and14. The third embodiment may adopt the technical features of the first and second embodiments, and will be described below with reference to the technical features of the third embodiment. According to the third embodiment, in order to form the opening region240, the first AlGa-based layer241a1may be included, and a GaAs-based layer241a3may be included at the center thereof. According to the third embodiment, the delta doped layer241cmay be disposed on the GaAs-based layer241a3. Accordingly, after the delta doped layer241cis formed on the GaAs-based layer241a3in the third embodiment, as the oxidation process proceeds, the delta doped layer241cexists in the aperture241as shown inFIG.15C. The thickness of the region242may be formed in the shape of a sharp edge in the direction of the aperture241. For example, in the third embodiment, the first thickness T1in the outer region of the insulating region242may be thicker than the second thickness T2in the inner region adjacent to the aperture241. According to the third embodiment, the first thickness T1in the outer region of the insulating region242may be thicker than the second thickness T2in the inner region. Accordingly, in the third embodiment, the second thickness T2in the inner region adjacent to the aperture241of the insulating region242is formed to be thinner than the first thickness T1in the outer region, thereby opening the aperture241. The problem of increasing the divergence angle of the beams can be solved by alleviating the diffraction of the light. In addition, the third embodiment arranges the delta-doped layer241cdoped with the second conductivity type element in the aperture241so that current is concentrated in the aperture by current diffusion in the aperture241. The third embodiment can provide a surface light emitting laser device capable of solving the problem of increasing the divergence angle of beams by preventing high mode oscillation at the aperture edge by preventing crowding phenomenon and the same. According to the third embodiment, as shown inFIG.15C, a GaAs-based layer241a3is disposed between the first AlGa-based layers241a1, thereby forming 2D dimensional hole gas (2DHG) as shown inFIG.7Cto spread current through current spreading and the third embodiment can significantly improve carrier distribution uniformity in the aperture region. In addition, according to the third embodiment, the GaAs layer, which is the GaAs series layer241a3, is disposed between the AlGaAs layers, which are the AlGa series layer241a, to form 2D dimensional hole gas (2DHG), thereby providing current spreading. It is possible to provide a surface light emitting laser device and a light emitting device including the same capable of preventing current crowding at the aperture and preventing higher mode oscillations at the aperture edge, thereby increasing the divergence angle of beams. FIGS.13D and15Dare conceptual views of the fourth embodiment B4of the second region B shown inFIGS.12and14. The fourth embodiment may adopt the technical features of the first to third embodiments, and will be described below with reference to the technical features of the fourth embodiment. Referring toFIG.13D, an AlGa-based layer241afor forming the opening region240is formed on the active region230, and as shown inFIG.15D, a second conductivity type is formed during the growth of the AlGa-based layer241a. The delta doped layer241cmay be disposed in the lower region241bof the AlGa-based layer241aby the element doping. The AlGa-based layer241amay include a material such as AlzGa(1-z)As (0<z<1), but is not limited thereto. The delta doped layer241cmay be doped with a second conductivity type element, but is not limited thereto. For example, the delta doped layer241cmay be doped with any one or more of Be, Mg, C, and Zn, but is not limited thereto. According to the fourth embodiment, the delta doped layer241cdoped with the second conductivity type element is disposed in the lower region241bof the aperture241so that the aperture edge can be spread evenly in the aperture241. The present invention can provide a surface light emitting laser device and a light emitting device including the same capable of generating a uniform light output in the entire aperture according to current diffusion by preventing a current density phenomenon at the aperture edge. In addition, in the fifth embodiment, an aperture edge is formed by the current diffusion in the aperture241by placing the delta doped layer241cdoped with the second conductivity type element in the upper region241tof the aperture241such that a surface light emitting laser device and a light emitting device including the same capable of solving a problem of increasing divergence angle of beams by preventing higher mode oscillation at an edge can be provided. In addition, according to the fourth embodiment, as shown inFIG.15D, while the delta doping layer241cis present in the aperture241, the thickness of the insulating region242may be formed to be thinner in the direction of the aperture241. For example, in an embodiment, the thickness in the outer region of the insulating region242may be thicker than the thickness in the inner region adjacent to the aperture241. Accordingly, according to the embodiment, the insulating region242has a thickness in the inner region adjacent to the aperture241to be thinner than the thickness in the outer region, thereby alleviating the diffraction of light in the aperture241to reduce the beam such that the problem of increasing the divergence angle of beams can be solved. According to the fourth embodiment, the oxidization rate of the insulating region242may be controlled by delta doping of the second conductivity type element to implement sharp edges by selective or predominant oxidation of the delta doped region. As shown inFIG.15D, a 2D dimensional hole gas (2DHG) is formed in the lower region241bof the aperture241by the growth of a delta doping layer241c, and current spreading through the 2DHG is performed. As a result, carrier distribution uniformity may be improved in the aperture region. Accordingly, according to the fourth embodiment, the delta doped layer241cdoped with the second conductivity type element is disposed in the aperture241so that even current spreading in the aperture241is performed at the edge of the aperture241. It is possible to provide a surface light emitting laser device and a light emitting device including the same, which can improve current injection efficiency by preventing current condensation of the light, thereby improving light output and voltage efficiency. In addition, in the fourth embodiment, the aperture doped by the current diffusion in the aperture241by disposing the delta doped layer241cdoped with the second conductivity type element in the lower region241bof the aperture241. A surface light emitting laser device and a light emitting device including the same capable of solving a problem of increasing divergence angle of beams by preventing higher mode oscillation at an edge can be provided. FIGS.13E and15Eare conceptual views of the fifth embodiment B5of the second region B shown inFIGS.12and14. The fifth embodiment may adopt the technical features of the first to fourth embodiments, and will be described below with reference to the technical features of the fifth embodiment. Referring toFIG.13E, an AlGa-based layer241afor forming the opening region240is formed on the active region230, and the doping of the second conductivity type element during the growth of the AlGa-based layer241ais performed. The delta doped layer241cmay be disposed in the upper region241tof the AlGa series layer241a. The AlGa-based layer241amay include a material such as AlzGa(1-z)As (0<z<1), but is not limited thereto. The delta doped layer241cmay be disposed between the p-AlGaAs layer and the GaAs layer, which are AlGa series layers. The delta doped layer241cmay be disposed in the upper region241tof the AlGa series layer241a. As shown inFIG.15E, according to the fifth embodiment, the oxidation rate of the insulating region242can be controlled by the delta doping of the second conductivity type element so that sharp edges are selected by selective or predominant oxidation of the delta doped region can be implemented. Accordingly, as shown inFIG.9A, 2D dimensional hole gas (2DHG) is formed in the upper region241tof the aperture241by the growth of a delta doping layer241c, and current spreading through 2DHG is performed and may improve carrier distribution uniformity in the aperture region. According to the fifth embodiment, the delta-doped layer241cdoped with the second conductivity type element is disposed in the aperture241so that the current at the edge of the aperture241is evenly spread in the aperture241. It is possible to provide a surface light emitting laser device and a light emitting device including the same, which can improve current injection efficiency by preventing a compaction phenomenon, thereby improving light output and voltage efficiency. In addition, in the fifth embodiment, an aperture edge is formed by the current diffusion in the aperture241by placing the delta doped layer241cdoped with the second conductivity type element in the upper region241tof the aperture241. A surface light emitting laser device and a light emitting device including the same capable of solving a problem of increasing divergence angle of beams by preventing higher mode oscillation at an edge can be provided. Next, as shown inFIG.16, the second contact electrode255may be disposed on the second reflection layer250, and the second reflection layer250is exposed in an area between the second contact electrodes255. The exposed region may correspond to the aperture241which is the central region of the opening region240described above. The second contact electrode255may improve contact characteristics between the second reflection layer250and the second electrode255, which will be described later. Next, the passivation layer270disposed on the second contact electrode255may have a thickness at the top surface of the light emitting structure to be thinner than the second contact electrode255, where the second contact electrode255may be exposed to the top of the passivation layer.270. The passivation layer270may include at least one of polymide, silica (SiO2), or silicon nitride (Si3N4). Next, a second electrode280may be disposed in electrical contact with the exposed second contact electrode255. The second electrode280extends above the passivation layer270to supply current from the outside. The second electrode255may be made of a conductive material, for example, may be a metal. For example, the second electrode255may include at least one of aluminum (A1), titanium (Ti), chromium (Cr), nickel (Ni), copper (Cu), and gold (Au). In addition, a first electrode215may be disposed under the substrate210. Before disposing the first electrode215, a portion of the bottom surface of the substrate210may be removed through a predetermined grinding process to improve heat dissipation efficiency. The first electrode215may be made of a conductive material, for example, metal. For example, the first electrode215may include at least one of aluminum (Al), titanium (Ti), chromium (Cr), nickel (Ni), copper (Cu), and gold (Au). The above-described semiconductor device may be a laser diode, and two reflection layers may act as resonators. At this time, electrons and holes are supplied to the active layer from the first reflection layer220of the first conductivity type and the second reflection layer250of the second conductivity type, and the light emitted from the active region230is reflected inside the resonator. When amplified and the threshold current is reached, it can be emitted to the outside through the aperture241described above. The light emitted from the semiconductor device according to the embodiment may be light of a single wavelength and a single phase, and the single wavelength region may vary according to the composition of the first reflection layer220, the second reflection layer250, and the active region230. First Additional Example A first additional embodiment will now be described. The additional embodiments described below may adopt the technical features of the embodiments described above, and will now be described based on the main features of the additional embodiments. FIG.17is a cross-sectional view of the surface light emitting laser device202B according to the embodiment, andFIG.18is an enlarged view of the first region A1of the surface light emitting laser device according to the embodiment shown inFIG.17. Referring toFIG.17, the surface light emitting laser device202according to the embodiment may include a first electrode215, a substrate210, a first reflection layer220, an active layer232, an aperture region240, an second reflection layer250and a second electrode280. The aperture region240may include an aperture241and a first insulating layer242b. The first insulating layer242bmay be referred to as an oxide layer, and the aperture region240may be referred to as an oxide region or an opening region, but is not limited thereto. In addition, the embodiment may include an AlGa-based transition layer242and a second insulating layer242e. The AlGa series transition layer242may include a first AlGa series transition layer242a1and a second AlGa series transition layer242a2. The second insulating layer242emay include a second-first insulating layer242e1and a second-second insulating layer242e2. For example, referring toFIG.17, the surface light emitting laser device202according to the embodiment includes a first reflection layer220, an active layer232disposed on the first reflection layer220, an aperture region240having a first insulating layer242band an aperture241disposed on the active layer232, a second reflection layer250disposed on the aperture region240, and an AlGa series transition layer242disposed between the active layer232and the second reflection layer250and having an Al composition graded, and a second insulating layer242edisposed between the active layer232and the second reflection layer250. The embodiment may further include a second contact electrode255and a passivation layer270. Hereinafter, technical features of the surface light emitting laser device202according to the embodiment will be described with reference toFIG.17and subsequent drawings. In the drawings of the embodiment, the direction of the x-axis may be a direction parallel to the longitudinal direction of the substrate210, the y-axis may be a direction perpendicular to the x-axis. FIG.18is an enlarged view of the first area A1of the surface light emitting laser device according to the embodiment shown inFIG.17. In an embodiment, the substrate210, the first electrode215, the first reflection layer220, the second reflection layer250, the active layer232, the cavities231and233, the contact electrodes255, and the passivation layer270may adopt the technical features of the embodiments described above. <Aperture Region, AlGa Series Transition Layer and Insulation Region> Referring toFIG.17, in an embodiment, the aperture region240may include a first insulating layer242band an aperture241. The aperture region240may be referred to as an opening region or an oxidation region. The first insulating layer242bmay be formed of an insulating layer, for example, aluminum oxide, to serve as a current blocking region, and an aperture241may be defined by the first insulating layer242b. For example, when the aperture region240includes aluminum gallium arsenide (AlGaAs), the AlGaAs material at the edge of the aperture region240reacts with H2O and the edge changes to aluminum oxide (Al2O3), and the first insulating region242bcan be formed. In addition, the central region of the opening region that does not react with H2O may be an aperture241made of AlGaAs. According to an embodiment, the light emitted from the active layer232through the aperture241may be emitted to the upper region, and the light transmittance of the aperture241may be superior to that of the first insulating layer242b. Referring toFIG.18again, the first insulating layer242bmay include a plurality of layers, for example, the first-first insulating layer242b1and the first-second insulating layer242b2. The first-first insulating layer242b1may have the same thickness as or different from the first-second insulating layer242b2. On the other hand, one of the technical problems of the embodiment is to provide a surface light emitting laser device and a light emitting device including the same that can solve the problem of beam divergence angle of beams becoming increased. In addition, one of the technical problems in the embodiment is to provide a surface light emitting laser device and a light emitting device including the same that can prevent the current crowding phenomenon at the aperture edge. Hereinafter, technical features of the present invention for solving the technical problem will be described in detail with reference toFIGS.19A to25. FIG.19Ais a first enlarged view of a second area A2B of the surface light emitting laser device according to the embodiment shown inFIG.17. Referring toFIG.19A, the embodiment can include an AlGa-based transition layer242disposed on the active layer232and graded with an Al composition. In addition, the embodiment may include a second insulating layer242edisposed between the active layer232and the second reflective layer250. Through this, the embodiment has a technical effect capable of solving the problem of increasing the divergence angle of beams. In addition, the embodiment includes an AlGa-type transition layer242and a second insulating layer242eto which the Al composition is graded, so it is possible to provide a surface light emitting laser device and a light emitting device including the same capable of improving reliability by improving crystal quality at the aperture edge, thereby providing uniform light output in the entire aperture area. Specifically, referring toFIG.19A, the second insulating layer242eextends from the end of the first insulating layer242btoward the aperture241and is disposed on the first insulating layer242b. In an embodiment, the second insulating layer242emay be an insulating layer in which a part of the AlGa series transition layer242is oxidized. In this case, the AlGa series transition layer242may include a first AlGa series transition layer242a1disposed above the first insulating layer242b. In addition, the AlGa series transition layer242may include a second AlGa series transition layer242a2disposed under the first insulating layer242b. In addition, in the embodiment, the second insulating layer242emay include a second-first insulating layer242e1disposed above the first insulating layer242b. The second-1 insulating layer242e1may be an insulating layer in which a part of the first AlGa series transition layer242a1is oxidized. In addition, the second insulating layer242emay further include a second-second insulating layer242e2disposed under the first insulating layer242b. The second-second insulating layer242e2may be an insulating layer in which a portion of the second AlGa-based transition layer242a2is oxidized. In addition, in the embodiment, the second reflection layer250may include a third insulating layer243disposed at an inner side from the outside of the second reflection layer250by a predetermined distance. The third insulating layer243is an insulating part in which an outer part of the first group second-second layer251band an outer part of the second group second-second layer252bare oxidized in the second reflection layer250. FIG.19Bis an enlarged photograph of a third area A3of the second area A2B of the surface light-emitting laser device according to the embodiment shown inFIG.19A. The second insulating layer242eincludes a second-first insulating layer242e1disposed above the first insulating layer242band a second-second insulating layer242e2disposed below the first insulating layer242b. In addition, the second reflective layer250may include a third insulating layer243disposed at a predetermined distance from the outer to the inner side of the second reflective layer250. Referring back toFIG.19A, in the embodiment, a second AlGa-based transition layer242a2and a first AlGa-based transition layer242a1are formed before and after the first insulating layer242b, which is an oxide layer, as an Al grading layer. Through this, the second-second insulating layer242e2and the second-first insulating layer242e1may be formed before and after the high Al oxide layer from the MESA etching interface as shown inFIG.19B. The second-second insulating layer242e2and the second-first insulating layer242e1may be oxide layers in which a part of the second AlGa-based transition layer242a2and the first AlGa-based transition layer242a1are oxidized. FIG.20is a partially enlarged view of the surface light emitting laser device according to the related art. According to the related art, in the case of the DBR layers51and52having a high A1composition of 88% or more in the p-DBR, which is the second reflection layer50, as shown inFIG.20, the second reflection layer50is formed at the mesa (MESA) etching interface. A portion of the outer insulating layer43is oxidized, and the outer insulating layer43has a defect (DL) due to a thickness of 50 nm or more and stress due to oxidation. These defects DL may affect the oxidation layer42bdefining the aperture41, so that cracks may be generated due to oxidation layer damage. In particular, in order to reduce the beam divergence, a thin oxidation layer42bshould be formed. There is a technical contradiction in that the thinner the oxide layer42b, the greater the damage caused by the defect DL. Accordingly, in the related art, when the oxide layer42bis formed thick, an abrupt interface AI may occur in the boundary region with the aperture41. Such an abrupt oxide layer interface AI has a problem of increasing the divergence angle than the design value. For example,FIGS.21A and21Billustrate a near field image and a far field spectrum of a surface light emitting laser device according to the related art. Referring toFIG.21A, as the defects give damage to the oxidation layer42b, the crystal quality of the oxide layer42bdefining the aperture41is degraded by current confinement, thereby reducing electrical reliability. There is a problem that the higher mode is further induced when a high current is applied. Referring toFIG.21B, as the oxide layer42bincludes an abrupt interface AI in the related art, the divergence angle of beams increases to about 29°. FIGS.22A and22Bare near field images and far field spectrums of the surface light emitting laser device according to the embodiment. Referring toFIGS.22A and19A, a second insulating layer242eextends from the end of the first insulating layer242btoward the aperture241and is formed on the first insulating layer242b. As second insulating layer242eis disposed, the defects DL are blocked from being extended to the first insulating layer242b, which is an oxide layer defining the aperture241, by the current confinement, thereby protecting the first insulating layer242b. The crystal quality of the layer242bcan be maintained or improved compared to the conventional one, so that the electrical reliability is improved, such that it is possible to stop accelerating to a higher mode even when a high current is applied. Also, referring toFIGS.22A and19A, the second insulating layer242eextends from the end of the first insulating layer242bin the direction of the aperture241so as to be on the first insulating layer242b. The thickness of the first insulating layer on the inner side may be thinner than the outside according to the degree of oxygen supply during the oxidation process by supplying oxygen inward from the mesa etching interface as it is disposed on the first insulating layer. The interface between the first insulating layer242bat the boundary between242band the aperture241may be sharp. According to the embodiment, the divergence angle may be prevented from being increased by such a rough interface SI of the first insulating layer242b. For example, referring toFIG.22A, as the first insulating layer242bincludes a sharp interface SI, a divergence angle of beams may be controlled to about 21°. In addition, referring toFIG.22B, as the second insulating layer242eextends from the end of the first insulating layer242btoward the aperture241and is disposed on the first insulating layer242b. In addition, the crystal quality of the first insulating layer242bcan be maintained or improved compared to the existing one, and in particular, the crystal quality of the aperture241can be maintained or improved. In the present invention, a surface light emitting laser device capable of producing a uniform light output and a light emitting device including the same can be provided. FIG.23is an enlarged view illustrating the composition of the fourth region A4of the surface light emitting laser device according to the embodiment shown inFIG.19A, andFIG.24is a second enlarged view A22of the second area A2B of the surface light emitting laser device according to the embodiment shown inFIG.17. In an embodiment, the second insulating layer242eextends a predetermined distance from the end of the first insulating layer242btoward the aperture241and is disposed on the first insulating layer242b. It is possible to solve the problem of increasing the divergence angle of the beam at the aperture edge, and to improve the reliability by improving the crystal quality of the first insulating layer242band the aperture241at the aperture edge such that there is a complex technical effect that can produce a light output by improving uniformity in the entire aperture area. In an embodiment, the length of the second insulating layer242emay be controlled according to the Al composition of the AlGa series transition layer242. The AlGa series transition layer242may have an AlxGa1-xAs composition. First, referring toFIG.23, the composition of Al in the first AlGa series transition layer242a1may be graded in the range of 0.01 to 0.99. For example, the composition of Al in the first AlGa series transition layer242a1may be graded in a first range (12% to 80%) of 0.12 to 0.80. For example, the composition of Al in the first AlGa series transition layer242a1may be reduced in the first range of 0.80 to 0.12 in the direction of the first group second-first layer251ain the active layer232. In addition, the composition of Al in the second AlGa series transition layer242a2may be graded in the range of 0.01 to 0.99. For example, the composition of Al in the second AlGa series transition layer242a2may be graded in a second range of 0.30 to 0.65. For example, the composition of Al in the second AlGa series transition layer242a2may be graded in the second range of 0.30 to 0.65 in the direction of the first group second-first layer251ain the active layer232. Accordingly, in the embodiment, the second composition range graded in the second AlGa series transition layer242a2may be within the first composition range of A1graded in the first AlGa series transition layer242a1. According to an embodiment, the composition of Al in the aperture241region may be about 0.99, but is not limited thereto. The composition of Al in the first group second-first layer251amay be 0.12, but is not limited thereto. no. Accordingly, referring toFIG.24, the second-first length L21of the second-first insulating layer242e1may be controlled to be shorter than the first length L1of the first insulating layer242b. The second-second length L22of the second-second insulating layer242e2may be controlled to be shorter than the second-first length L21of the second-first insulating layer242e1. In addition, the second-first length L21of the second-first insulating layer242e1may be controlled to be less than or equal to the remained length L1rof the first length L1of the first insulating layer242b. For example, the second-first length L21of the second-first insulating layer242e1is 0.1 to 1 times of the remained length L1rof the first length L1of the first insulating layer242b. In addition, the second-first length L21of the second-first insulating layer242e1may be longer than the third length L3of the third insulating layer243. For example, second lengths L21and L22of the second insulating layer242emay be greater than five times or less than a third length L3of the third insulating layer243. The second-first length L21of the second-first insulating layer242e1may be 0.5 to 10 μm, but is not limited thereto. In an embodiment, the second-first insulating layer242e1extends from the end of the first insulating layer242bin the direction of the aperture241by a second-first length L21so that the second-first insulating layer242e1is disposed on the first insulating layer242b. Accordingly, by effectively blocking defects (DL), the crystal quality of the first insulating layer242band the aperture241at the aperture edge is improved, and reliability also is improved to produce a uniform light output over the entire aperture area. In addition, the embodiment can solve the problem of increasing the divergence angle of the beam at the aperture edge by controlling the first insulating layer242bto a sharp interface (SI) at the interface between the first insulating layer242band the aperture241. In an embodiment, when the second-first length L21of the second-first insulating layer242e1is longer than the remained length L1rof the first insulating layer242b, the beam divergence may be increased. If the second-first length L21of the second-first insulating layer242e1is shorter than the third length L3of the third insulating layer243, the protection function from the defect DL may be weakened. Next,FIG.25is a third enlarged view A23of the second area A2B of the surface light emitting laser device according to the embodiment shown inFIG.17. In an embodiment, the second-first thickness T21of the second-first insulating layer242e1may be thinner than the first thickness T1of the first insulating layer242b. The second-second thickness T22of the second-second insulating layer242e2may be thinner than the first thickness T1of the first insulating layer242b. The first thickness T1of the first insulating layer242bmay be about 5 nm to about 50 nm, but is not limited thereto. In addition, the first thickness T1of the first insulating layer242bmay be thinner than the third thickness T3of the third insulating layer243. In an embodiment, the first insulating layer242bmay be positioned at the node position NP of the laser oscillated by the active layer232to reduce the beam divergence. In addition, the second insulating layer242emay be positioned at the node position of the laser oscillated by the active layer232to reduce the beam divergence. In an embodiment, when the second-second thickness T22of the second-second insulating layer242e2is thicker than the second-first thickness T21of the second-first insulating layer242e1, the insulating region242is closer to the optical node position (NP), which has a technical effect of reducing beam divergence. In addition, when the second-first thickness T21of the second-first insulating layer242e1is thicker than the second-second thickness T22of the second-second insulating layer242e2, there is an effect of protecting the insulating layer242bfrom defects DL. Accordingly, the second-first thickness T21of the second-first insulating layer242e1may be controlled to be 0.2 to 3 times than the second-second thickness T22of the second-second insulating layer242e2. The thickness of the second insulating layer242emay range from 1 nm to 150 nm, but is not limited thereto. In an embodiment, the first insulating layer242bor the second insulating layer242emay be located between about 100 nm to about 250 nm from the top of the active layer232. The embodiment can provide a surface light emitting laser device and a light emitting device including the same, which can solve the problem of increasing the divergence angle of a beam at an aperture edge. For example, as the second insulating layer242eextends from the end of the first insulating layer242btoward the aperture241and is disposed on the first insulating layer242b, the first insulating layer242eis insulated from the first insulating layer242b. The interface between the first insulating layer242bat the boundary between the layer242band the aperture241may be sharp, and the divergence angle may be prevented from being increased by the sharp interface SI. In addition, the embodiment can provide a surface light emitting laser device and a light emitting device including the same that can improve the reliability by improving the crystal quality at the aperture edge to give a uniform light output in the entire aperture area. Also, for example, as the second insulating layer242eextends from the end of the first insulating layer242btoward the aperture241and is disposed on the first insulating layer242b, the crystal quality of the insulating layer242bcan be maintained or improved compared to the existing one, and in particular, the crystal quality of the aperture241can be maintained or improved, so that not only the aperture edge but also the entire aperture including the center can be uniform. In addition, the embodiment may solve the problem of increasing the divergence angle of beams by preventing current crowding at the aperture edge to prevent higher mode oscillation. For example, as the second insulating layer242eextends from the end of the first insulating layer242btoward the aperture241and is disposed on the first insulating layer242b, the expansion of the defects DL to the first insulating layer242b, which is an oxide layer defining the aperture241, can be blocked by the current confinement so that the first insulating layer242bis protected. The quality can be maintained or improved compared to the conventional one, so that the electrical reliability is improved, and therefore, acceleration in a higher mode even when a high current is applied can be prevented than in the related art. In an embodiment, the second insulating layer242eextends a predetermined distance from the end of the first insulating layer242btoward the aperture241and is disposed on the first insulating layer242b. It is possible to solve the problem of increasing the divergence angle of the beam at the aperture edge, and to improve the reliability by improving the crystal quality of the first insulating layer242band the aperture241at the aperture edge, thereby improving uniformity in the entire aperture area and producing an excellent light output. <Package> Next,FIG.26is a surface light emitting laser package to which the surface light emitting laser device according to the embodiment is applied. Referring toFIG.26, the surface light emitting laser package100according to the embodiment may include a housing110, a surface light emitting laser device201, and a diffusion unit140. For example, the surface emitting laser package100according to the embodiment includes a housing110having a cavity C, a surface light emitting laser device201, a housing110disposed in the cavity C and a diffusion unit140disposed on the housing110. The surface light emitting laser device201may be applied to the surface light emitting laser device202B according to the above-described embodiment. The housing110of the embodiment may comprise a single or a plurality of bodies. For example, the housing110may include a first body110a, a second body110b, and a third body110c. The second body110bmay be disposed on the first body110a, and the third body110cmay be disposed on the second body110b. Next, the embodiment may include a first electrode part181and a second electrode part182. The first electrode part181and the second electrode part182may be disposed in the housing110. In detail, the first electrode181and the second electrode182may be spaced apart from each other on the upper surface of the first body110a. The surface light emitting laser device201may be electrically connected to the second electrode part182by a predetermined wire187. In addition, the embodiment may include a third electrode part183and a fourth electrode part184spaced apart from the lower side of the first body110a, and also a fifth electrode part185and a sixth electrode part186penetrating the first body110a. In an embodiment, the housing110may include a seating part110btin which the diffusion part140is disposed. For example, a portion of the upper surface of the second body110bmay function as a seating portion110bt. The embodiment may include an adhesive member155disposed between the seating portion110btand the diffusion portion140of the housing110. Next, in the embodiment, the diffusion part140may include a glass layer141having a first thickness and a polymer layer145having a second thickness and disposed on the glass layer141. Although the polymer layer145is illustrated below the glass layer141inFIG.26, the polymer layer145may be disposed above the glass layer141in the manufacturing process by a printing process. The polymer layer145may include a pattern including a curved surface, and the pattern may be regular or irregular. In addition, the pattern may be absent in the contact portion of the adhesive member155, and may be formed in a relatively flat surface than the pattern. <Flip Chip Type Surface Emitting Laser Device> Next,FIG.27is another sectional view of the surface emitting laser device202C according to the embodiment. The surface light emitting laser device according to the embodiment can be applied to the flip chip type surface light emitting laser device shown inFIG.27. In addition to the vertical type, the surface emitting laser device according to the embodiment may be a flip chip type in which the first electrode215and the second electrode282face the same direction as shown inFIG.27. For example, the flip chip type surface emitting laser device202C illustrated inFIG.27may include a first electrode part215and217, a substrate210, a first reflection layer220, an active layer232, and an aperture region240, the second reflection layer250, the second electrode parts280and282, the first passivation layer271, the second passivation layer272, and the anti-reflection layer290. In this case, the reflectance of the second reflecting layer250may be designed to be higher than that of the first reflecting layer220. In addition, the flip chip type surface emitting laser device is disposed between the active layer232and the second reflection layer250, and an AlGa-based transition layer (not shown) and an active layer232and the second layer, which are graded Al composition. The second insulating layer242emay be disposed between the reflection layers250. In this case, the first electrode portions215and217may include a first electrode215and a first pad electrode217. The first electrode215may be electrically connected to the first reflective layer220exposed through a predetermined mesa process, and the first pad electrode217may be electrically connected to the first electrode215. The first electrode parts215and217may be made of a conductive material, for example, metal. For example, the first electrode215may include at least one of aluminum (A1), titanium (Ti), chromium (Cr), nickel (Ni), copper (Cu), and gold (Au). The first electrode215and the first pad electrode217may include the same metal or different metals. When the first reflection layer220is an n-type reflection layer, the first electrode215may be an electrode for the n-type reflection layer. The second electrode parts280and282may include a second electrode282and a second pad electrode280, and the second electrode282is electrically connected to the second reflection layer250. The second pad electrode280may be electrically connected to the second electrode282. When the second reflection layer250is a p-type reflection layer, the second electrode282may be a p-type electrode. The second electrode according to the above-described embodiment may be equally applied to the second electrode282of the flip chip surface light emitting laser device. The first insulating layer271and the second insulating layer272may be made of an insulating material, for example, may be formed of nitride or oxide, for example, polyimide, silica (SiO2), or it may include at least one of silicon nitride (Si3N4). Second Additional Embodiment Accordingly, a surface light emitting laser device according to a second additional embodiment will be described. The second additional embodiment may adopt the technical features of the above-described embodiments and the first additional embodiments, and will be described below with reference to the main features of the second additional embodiment. In addition, the first to fifth embodiments described below are descriptions of technical features different from those described above. FIG.28is a cross-sectional view of the surface light emitting laser device according to the second additional embodiment. Referring toFIG.28, in a second additional embodiment, the surface light emitting laser device203may include a first electrode215, a substrate210, a first reflection layer220, a light emitting layer230, an oxide layer240, a second reflection layer250, a passivation layer270, and a second electrode280. The oxide layer240may include an opening241and an insulating region242. The opening241may be a passage area through which current flows. The insulating region242may be a blocking region that blocks the flow of current. The insulating region242may be referred to as an oxide layer or an oxide layer. The oxide layer240may be referred to as a current confinement layer because it restricts the flow or density of the current to emit a more coherent laser beam. The second electrode280may include a contact electrode282and a pad electrode284. FIG.29is an enlarged cross-sectional view of the first portion B13of the surface light emitting laser device according to the embodiment shown inFIG.28. Hereinafter, technical features of the surface light emitting laser device203according to the embodiment will be described with reference toFIGS.28and29. In the drawings of the embodiment, the direction of the x-axis may be a direction parallel to the longitudinal direction of the substrate210, the y-axis may be a direction perpendicular to the x-axis. In a second additional embodiment, the substrate210, the first electrode215, the first reflection layer220, the second reflection layer250, the active layer232, the cavities231and233, the second contact electrode255, and the passivation layer270may adopt the technical features of the embodiments described above. <Oxide Layer> The surface light emitting laser device according to the embodiment may provide the oxide layer240. The oxide layer240may include an insulating region242and an opening241. The insulating region242may surround the opening241. For example, the opening241may be disposed on the first area (center area) of the light emitting layer230, and the insulating area242may be disposed on the second area (edge area) of the light emitting layer230. The second region may surround the first region. The opening241may be a passage area through which current flows. The insulating region242may be a blocking region that blocks the flow of current. The insulating region242may be referred to as an oxide layer or an oxide layer. The amount of current supplied from the second electrode280to the light emitting layer230, that is, the current density may be determined by the size of the opening241. The size of the opening241may be determined by the insulating region242. As the size of the insulating region242increases, the size of the opening241decreases, and accordingly, the current density supplied to the light emitting layer230may increase. In addition, the opening241may be a passage through which the beam generated in the light emitting layer230travels in an upward direction, that is, in a direction of the second reflection layer250. That is, the divergence angle of the beam of the light emitting layer230may vary according to the size of the opening241. The insulating region242may be formed of an insulating layer, for example, aluminum oxide (Al2O3). For example, when the oxide layer240includes aluminum gallium arsenide (AlGaAs), AlGaAs of the oxide layer240reacts with H2O to change its edge into aluminum oxide (Al2O3) to form an insulating region242. The central region that does not react with H2O may be an opening241including AlGaAs. According to the embodiment, the light emitted from the light emitting layer230through the opening241may be emitted to the upper region, and the light transmittance of the opening241may be excellent compared to the insulating region242. Referring toFIG.29, the insulation region242may include a plurality of layers. For example, the insulation region242may be formed on the first insulation region242aand the first insulation region242a. The second insulating region242band the third insulating region242cmay be disposed between the second insulating region242b. One insulating region of the first to third insulating regions242a,242b, and242cmay have the same thickness or different thickness as the other insulating region. The first to third insulating regions242a,242b, and242cmay include at least an oxidation material. The first to third insulating regions242a,242b, and242cmay include at least a group 3-5 or a group 2-6 compound semiconductor material. A technical effect of the surface light emitting laser device203C according to the embodiment will be described in detail with reference toFIGS.30and31. FIG.30is first distribution data of refractive index and light energy in the surface light emitting laser device203C according to the embodiment. According to the embodiment, the distribution E of the light energy emitted from the surface light emitting laser device has a maximum value around the light emitting layer230, as shown inFIG.30, and the predetermined distance increases from the light emitting layer230and can be reduced by the period. Meanwhile, in the embodiment, the light energy distribution E is not limited to the distribution data shown inFIG.30, and the light energy distribution in each layer may be different from that shown inFIG.30by the composition, thickness, etc. of each layer. Referring toFIG.30, the surface light emitting laser device203C according to the second embodiment may include the first reflection layer220, the second reflection layer250, and the light emitting layer230be disposed between the first reflection layer220and the second reflection layer250. In this case, in the surface light emitting laser device203C according to the second embodiment, refractive index n of the material of each of the first reflection layer220, the light emitting layer230, and the second reflection layer250may be the same as shown in the refractive index n is shown inFIG.30, but is not limited to. One of the technical problems of the embodiment is to provide a surface light emitting laser device capable of improving the light output by minimizing the influence of the carrier barrier caused by the generation of an electric field in the reflection layer. Referring toFIG.30, the light energy distribution E according to the position of the surface light emitting laser device203C according to the embodiment may be recognized. As described above, the light energy distribution (E) is relatively spaced apart from the light emitting layer230can be lowered. The second embodiment controls the concentration of the first conductivity type dopant in the first group first reflection layer221to be higher than the dopant concentration in the second group first reflection layer222in consideration of the light energy distribution (E). For example, as shown inFIG.29, in the embodiment, the first reflection layer220includes a first group first reflection layer221and a second group first reflection layer222on the first group first reflection layer221. The second group first reflection layer222can be disposed closer to the light emitting layer230. In this case, the light energy of the second group first reflection layer222disposed adjacent to the light emitting layer230is higher than the light energy of the first group first reflection layer221. The embodiment controls the concentration of the first conductivity type dopant in the second group first reflection layer222to be lower than the dopant concentration in the first group first reflection layer221in consideration of the light energy distribution E, The first conductivity type dopant may be relatively doped in the region of the first group first reflection layer221where the light energy is relatively low. Accordingly, in the second group first reflection layer222, the light absorption by the dopant is minimized to improve the light output, and in the first group first reflection layer221, the voltage efficiency is improved by improving the resistance by the relatively high dopant. There is a peculiar technical effect that can provide a surface light emitting laser device capable of improving light output and voltage efficiency at the same time. For example, the concentration of the first conductivity type dopant in the first group first reflection layer221may be about 2.00E18 and the concentration of the second group first reflection layer222may be about 1.00E18, but is not limited thereto. In addition, in the embodiment, the second reflection layer250may be formed to include the first group second reflection layer251disposed adjacent to the light emitting layer230and the second group second reflection layer252be spaced apart from light emitting layer230. In this case, the light energy of the first group second reflection layer251disposed adjacent to the light emitting layer230is higher than the light energy of the second group second reflection layer252. Accordingly, the embodiment can control the concentration of the second conductivity type dopant in the first group second reflection layer251to be lower than the dopant concentration in the second group second reflection layer252in consideration of the light energy distribution, The second conductivity type dopant may be relatively doped in the region of the second group second reflection layer252where the light energy is relatively low. Accordingly, in the first group second reflection layer251, the light absorption by the dopant is minimized to improve the light output, and in the second group second reflection layer252, the voltage efficiency is improved by the resistance improvement by the dopant. There is a specific technical effect that can provide a surface light emitting laser device and a light emitting device including the same that can improve the light output and voltage efficiency at the same time. In the embodiment, in consideration of the light energy distribution (E), the doping concentration can be lowered in the region where the light energy is high, and the doping concentration is controlled in the region where the light energy is low. It is possible to provide a surface light emitting laser device and a light emitting device including the same that can minimize the light output to improve the light output. Next, one of the technical problems of the embodiment is to provide a surface light emitting laser device capable of improving the light output by minimizing the influence of the carrier barrier caused by the generation of an electric field in the reflection layer. Referring back toFIG.30, in the surface light emitting laser device according to the embodiment, the distribution of light energy (E) according to the position can be recognized. As the relative distance from the light emitting layer230is relatively reduced, the light energy distribution is lowered. In consideration of the energy distribution, the concentration of the first conductivity type dopant in the first group second reflection layer251may be controlled to be lower than that of the dopant concentration in the second group second reflection layer252. For example, the concentration of the first conductivity type dopant in the first group second reflection layer251may be about 7.00E17 to 1.50E18 and the concentration of the first conductivity type dopant in the second group second reflection layer252may be about 1.00E18 to 3.00E18. In an embodiment, the concentration unit 1.00E18 may mean 1.00×1018(atoms/cm3). In an embodiment, the p-type dopant may be C (Carbon), but is not limited thereto. Accordingly, the embodiment controls the concentration of the second conductivity type dopant in the second group second reflection layer252to be higher than the concentration of the dopant in the first group second reflection layer251and has a relatively high light energy. By relatively low doping the second conductivity type dopant in the region of the group second reflection layer251, the first group second reflection layer251minimizes light absorption by the dopant, thereby improving light output and making the second group agent. In the second reflection layer252, a surface light emitting laser device capable of simultaneously improving light output and voltage efficiency by improving voltage efficiency by improving resistance by a relatively high dopant. Next,FIG.32is a cross-sectional view of the surface light emitting laser device203according to the embodiment,FIG.33shows a band gap that varies depending on whether In is added or not in the embodiment, andFIG.34shows the current density according to the embodiment. FIG.32is an enlarged view of the opening241and the insulating region242of the surface light emitting laser device illustrated inFIG.28. The embodiment may be the same as the above-described embodiment except for the opening241and the insulating region242. Referring toFIG.32, the surface light emitting laser device203according to the embodiment may provide an oxide layer240. The oxide layer240may include an insulating region242and an opening241. The insulating region242may surround the opening241. For example, the opening241may be disposed on the first area (center area) of the light emitting layer230, and the insulating area242may be disposed on the second area (edge area) of the light emitting layer230. The second region may surround the first region. The opening241may be a passage area through which current flows. The insulating region242may be a blocking region that blocks the flow of current. The amount of current supplied from the second electrode280to the light emitting layer230, that is, the current density may be determined by the size of the opening241. Since the size of the oxide layer240is fixed, the size of the opening241may be determined by the size of the insulating region242. That is, as the size of the insulating region242increases, the size of the opening241decreases, and accordingly, the current density supplied to the light emitting layer230may increase. In addition, the opening241may be a passage through which the beam generated in the light emitting layer230travels in an upward direction, that is, in a direction of the second reflection layer250. That is, the divergence angle of the beam of the light emitting layer230may vary according to the size of the opening241. Opening241may include a semiconductor material, such as a Group 3-5 or Group 2-6 compound semiconductor material. The insulating region242may be referred to as an oxide layer or an oxidation layer. The insulating region242may include an oxidizing material. The insulating region242may be formed of an insulating layer, for example, aluminum oxide (Al2O3). The insulating region242may be formed by oxidizing the opening241. For example, when the oxide layer240includes aluminum gallium arsenide (AlGaAs), the edge of the oxide layer240is changed to aluminum oxide (Al2O3) through an oxidation process in which AlGaAs of the oxide layer240reacts with H2O. It may be formed as an insulating region242. In addition, a central region that does not react with H2O may be formed as an opening241including AlGaAs. During the oxidation process, H2O and AlGaAs penetrated through the side of the oxide layer240may be oxidized and converted into aluminum oxide (Al2O3). Therefore, the penetration depth of H2O varies depending on the thickness of the oxide layer240, the type or composition of the oxide layer240, and thus, the size of the insulating region242changed to aluminum oxide (Al2O3) may vary. According to the embodiment, the light emitted from the light emitting layer230may be emitted to the upper region through the opening241, and the light transmittance of the opening241may be excellent compared to the insulating region242. The opening241may include a plurality of layers. For example, the opening241may include a first semiconductor region241a, a second semiconductor region241band a second semiconductor region disposed on the first semiconductor region241a. It may include a third semiconductor region241cdisposed on the241b. The first semiconductor region241amay be in contact with the top surface of the light emitting layer230, and the third semiconductor region241cmay be in contact with the bottom surface of the second reflection layer250, but the embodiment is not limited thereto. The insulating region242may include a plurality of layers. For example, the insulating region242may include a first insulating region242aand a second insulating region242bdisposed on the first insulating region242a, and a third insulating region24cdisposed between the second insulating region242b. The first insulating region242amay be in contact with the top surface of the light emitting layer230, and the third insulating region242cmay be in contact with the bottom surface of the second reflection layer250, but is not limited thereto. The first insulating region242aof the insulating region242may surround the first semiconductor region241aof the opening241. The second insulating region242bof the insulating region242may surround the second semiconductor region241bof the opening241. The third insulating region242cof the insulating region242may surround the third semiconductor region241cof the opening241. For example, the first insulating region242aand the first semiconductor region241aare referred to as a first oxide layer, the second insulating region242band the second semiconductor region241bare referred to as a second oxide layer, and the third insulating region242cand the third semiconductor region241cmay be referred to as a third oxide layer. Accordingly, the oxide layer240may include a first oxide layer, a second oxide layer disposed on the first oxide layer, and a third oxide layer disposed on the second oxide layer. The embodiment is not limited thereto, and a plurality of oxide layers240may be provided. For example, a first semiconductor layer including, for example, a first semiconductor material is formed on the entire region of the first oxide layer, and an edge region of the first semiconductor layer is oxidized through an oxidation process to be defined as the first insulating region242aand is oxidized. An unoxidized center region may be defined as the first semiconductor region241a. For example, a second semiconductor layer including, for example, a second semiconductor material is formed on the entire region of the second oxide layer, and an edge region of the second semiconductor layer is oxidized through an oxidation process to be defined as the second insulating region242band is oxidized. An unoxidized center region may be defined as the second semiconductor region241b. For example, a third semiconductor layer including, for example, a third semiconductor material is formed over the entire region of the third oxide layer, and an edge region of the third semiconductor layer is oxidized through an oxidation process to define the third insulating region242cand to oxidize it. An unoxidized center region may be defined as the third semiconductor region241c. According to the embodiment, the oxide layer240is composed of a plurality of layers, for example, the first to third oxide layer, so that the stress of the oxide layer generated when the oxide layer is composed of a single layer can be alleviated. In the first semiconductor region241a, the second semiconductor region241b, and the third semiconductor region241c, the thickness, the concentration, or the size may be the same. In example embodiments, each of the first to third semiconductor regions241a,241b, and241cmay have the same thickness. In example embodiments, the thickness of the second semiconductor region241bmay be smaller than the thickness of the first semiconductor region241aor the thickness of the third semiconductor region241c. For example, the ratio of the thicknesses of the first to third semiconductor regions241a,241b, and241cmay be 1:0.3:1 to 1:1:1. For example, the thickness of each of the first semiconductor region241aand the third semiconductor region241cmay be about 10 nm, and the thickness of the second semiconductor region241bmay be about 3 nm to about 10 nm. The thickness of the first semiconductor region241amay be larger or smaller than the thickness of the third semiconductor region241c. As described above, the first semiconductor layer is partially oxidized to form the first semiconductor region241aand the first insulating region242a, and the second semiconductor layer is partially oxidized to form the second semiconductor region241band the second insulating region242b, and the third semiconductor layer may be partially oxidized to form the third semiconductor region241cand the third insulating region242c. Therefore, the thickness of the first insulating region242ais the same as the thickness of the first semiconductor region241a, the thickness of the second insulating region242bis the same as the thickness of the second semiconductor region241b, and the third thickness of the insulating region242cmay be the same as the thickness of the third semiconductor region241c. In example embodiments, concentrations of the first to third semiconductor regions241a,241b, and241cmay be different. In detail, the Al concentration of each of the first to third semiconductor regions241a,241b, and241cmay be different. For example, the Al concentration of the second semiconductor region241bis lower than that of each of the first semiconductor region241aand the third semiconductor region241c, and the Al concentration of the first semiconductor region241amay be higher than the Al concentration of the third semiconductor region241c. For example, when each of the first to third semiconductor regions241a,241b, and241cincludes AlGaAs, the Al concentration of each of the first semiconductor region241aand the third semiconductor region241cis 0.9 or more and 0.99 or less. The Al concentration of the second semiconductor region241bmay be 0.8 or more and 0.9 or less. In detail, the Al concentration of the first semiconductor region241amay be 0.99, the Al concentration of the second semiconductor region241bmay be 0.84, and the Al concentration of the third semiconductor region241cmay be 0.98. In general, the higher the Al concentration, the easier the H2O to penetrate from the side surfaces of the first to third semiconductor layers. InFIG.32, since the Al concentrations of the first semiconductor region241aand the third semiconductor region241care the same, and the penetration depth of H2O is the same, each size of the first insulating region242aand the third insulating region242cmay be the same. As described above, when the Al concentration (0.99) of the first semiconductor region241ais higher than the Al concentration (0.98) of the third semiconductor region241c, the size of the first semiconductor region241amay be larger than the size of the third semiconductor region241c. The size may be referred to as the width. Since the size of each of the first to third insulating regions242a,242b, and242cis determined by the Al concentration of each of the first to third semiconductor regions241a,241b, and241c, as shown inFIG.32. Each of the first insulating region242aand the third insulating region242chaving a high concentration may be larger than the size of the second insulating region242bhaving a low Al concentration. The diameter of each of the first to third semiconductor regions241a,241b, and241cmay be determined by the size of each of the first to third insulating regions242a,242b, and242c. Since the size of each of the first insulating region242aand the third insulating region242chaving a high Al concentration is large, the first semiconductor region241aand the third insulating layer disposed on the same layer as the first insulating region242aare provided. The diameter D1of each of the third semiconductor regions241cdisposed on the same layer as the region242cis small. Since the size of the second insulating region242bhaving a low Al concentration is small, the diameter D2of the second semiconductor region241bdisposed on the same layer as the second insulating region242bis large. Therefore, the diameter D2of the second semiconductor region241bmay be larger than the diameter D1of each of the first semiconductor region241aand the third semiconductor region241c. From the perspective of the first to third semiconductor regions241a,241b, and241c, the second semiconductor region241bextends outward from an end of the first semiconductor region241aor the third semiconductor region241cmay protrude. The protruding region of the second semiconductor region241bmay not vertically overlap the first semiconductor region241aor the third semiconductor region241c. The protruding regions of the second semiconductor regions241bmay vertically overlap with portions of the first or third insulating regions242aand242c. From the perspective of the first to third insulating regions242a,242b, and242c, the first insulating region242aor the third insulating region242cmay move inward from the inner end of the second insulating region242band can protrude along. Accordingly, the protruding regions of each of the first and third insulating regions242aand242coverlap each other perpendicularly, and the protruding regions of each of the first and third insulating regions242aand242care formed of the second semiconductor region241b. The protruding region of the first insulating region242aor the third insulating region242cmay not overlap with the second insulating region242b. The outer surfaces of the first to third insulating regions242a,242band242cmay be vertically aligned, and the inner surfaces of the first to third insulating regions242a,242band242cmay not vertically coincide. Side surfaces of the first to third semiconductor regions241a,241b, and241cmay not vertically coincide with each other. The side surface of the first semiconductor region241ais in contact with the inner surface of the first insulating region242a, and the side surface of the second semiconductor region241bis in contact with the inner surface of the second insulating region242b. Side surfaces of the semiconductor region241cmay contact inner surfaces of the third insulating region242c. As shown inFIG.34, when a current flows into the second reflection layer250, the light emitting layer230, and the first reflection layer220, the diameter D2of the second semiconductor region241bis determined by the first semiconductor region. Since it is larger than the diameter D2of the first semiconductor region241aor the third semiconductor region241c, the diameter D2is larger than the diameter D1of the third semiconductor region241cafter the current passes through the third semiconductor region241c. Part of the current flows in the first semiconductor region241aalong the vertical direction, and the other part of the current flows in the in-plane direction of the second semiconductor region241band can flow along the outward direction. As a result, the current density can be suppressed by preventing the current from dense in the opening241. As shown inFIG.33A, the band gaps of the first to third semiconductor regions241a,241b, and241cmay be different. The band gap may vary depending on the Al concentration included in the first to third semiconductor regions241a,241b, and241c. For example, as the Al concentration increases, the band gap may increase. As described above, since the Al concentration of the second semiconductor region241bis smaller than the A1concentration of the first semiconductor region241aor the Al concentration of the third semiconductor region241c, the band of the second semiconductor region241bmay be smaller than the band gap of the first semiconductor region241aor the band gap of the third semiconductor region241c. Accordingly, the second semiconductor region241bhaving a small band gap is disposed between the first semiconductor region241aand the third semiconductor region241chaving a large band gap, thereby forming the first to third semiconductor regions of the oxide layer240. Current concentration at241a,241band241ccan be relaxed and the diffraction effect can be reduced. In addition, the shrinkage stress is alleviated by such a sandwich structure. The sandwich structure is that the second semiconductor region241bhaving a small band gap is disposed between the first semiconductor region241aand the third semiconductor region241chaving a large band gap. The deterioration of the laser beam emission characteristics can be prevented due to the bending characteristics of the surface-emitting laser device. As shown inFIG.33B, In (indium) may be added to the second semiconductor region241bto make the band gap relatively smaller. As In is added, the band gap may be reduced. An In concentration added to the second semiconductor region241bmay be 0.05 or more and 0.18 or less, but is not limited thereto. For example, the In concentration added to the second semiconductor region241bmay be 0.1. As shown inFIG.33B, In is added to the second semiconductor region241bas compared with the case where In is not added to the second semiconductor region241bas shown inFIG.33A, the bandgap can be made smaller by a predetermined width Δ. Therefore, when In is added to the second semiconductor region241bto further reduce the band gap, as illustrated inFIG.34, the first carrier, that is, the hole generated in the second reflection layer250, is formed in the third semiconductor region. The second semiconductor region241bmay move along the transverse direction via241c. Accordingly, the current may not only flow to the light emitting layer230via the first semiconductor region241aalong the vertical direction in the second semiconductor region241bbut may also flow along the transverse direction in the second semiconductor region241b. That is, since the current is distributed in the vertical direction and the lateral direction in the second semiconductor region241b, the current density phenomenon in which the current is concentrated along the aperture edge can be alleviated. Next,FIG.35is a cross-sectional view of the surface light emitting laser device according to the fourth embodiment,FIG.36shows a band gap which varies depending on whether In is added or not in the fourth embodiment, andFIG.37shows the fourth embodiment according to the fourth embodiment showing the current density. FIG.35is an enlarged view of the opening241and the insulating region242of the surface light emitting laser device illustrated inFIG.28. The fourth embodiment may be the same as the first to third embodiments except for the opening241and the insulating region242. In particular, in the fourth embodiment, the thicknesses, concentrations, or sizes of the first to third semiconductor regions241a,241b, and241cand the first to third insulating regions242a,242b, and242cof the oxide layer240may differ from those of the third embodiment. In the fourth embodiment, components having the same structure, shape, and/or function as those in the first to third embodiments are denoted by the same reference numerals and detailed description thereof will be omitted. Technical matters omitted in the following description can be easily understood from the above-described first to third embodiments. Referring toFIG.35, the surface light emitting laser device204according to the fourth embodiment may provide an oxide layer240. The oxide layer240may include an insulating region242and an opening241. The oxide layer240may be composed of a plurality of layers. That is, the insulating region242may be composed of a plurality of insulating regions, and the opening241may be composed of a plurality of semiconductor regions. For example, the oxide layer240may include first to third oxide layers. The first oxide layer may be disposed on the light emitting layer230, the second oxide layer may be disposed on the first oxide layer, and the third oxide layer may be disposed on the second oxide layer. The first oxide layer may be in contact with the top surface of the light emitting layer230, but is not limited thereto. The third oxide layer may be in contact with the bottom surface of the second reflection layer250, but is not limited thereto. The opening241may include a first semiconductor region241a, a second semiconductor region241b, and a third semiconductor region241c. The insulation region242may include a first insulation region242a, a second insulation region242b, and a third insulation region242c. The first semiconductor region241aand the first insulating region242amay be disposed on the same layer to be defined as a first oxide layer. The second semiconductor region241band the second insulating region242bmay be disposed on the same layer to be defined as a second oxide layer. The third semiconductor region241cand the third insulating region242cmay be disposed on the same layer to be defined as a third oxide layer. According to the fourth embodiment, since the oxide layer240is composed of a plurality of layers, for example, the first to third oxide layers, the shrinkage stress of the oxide layer generated when the oxide layer is composed of a single layer can be alleviated. In the first semiconductor region241a, the second semiconductor region241b, and the third semiconductor region241c, the thickness, the concentration, or the size may or may not be the same. According to the fourth embodiment, each of the first to third semiconductor regions241a,241b, and241cmay have the same thickness. According to the fourth embodiment, the thickness of the first semiconductor region241aor the thickness of the third semiconductor region241cmay be smaller than the thickness of the second semiconductor region241b. For example, the ratio of the thicknesses of the first to third semiconductor regions241a,241b, and241cmay be 0.3:1:0.3 to 1:1:1. For example, the thickness of each of the second semiconductor regions241bmay be 10 nm, and the thickness of the first semiconductor region241aor the third semiconductor region241cmay be about 3 nm to about 10 nm. According to the fourth embodiment, the concentration of each of the first to third semiconductor regions241a,241b, and241cmay be different. For example, the Al concentration of the second semiconductor region241bis higher than the Al concentration of each of the first semiconductor region241aand the third semiconductor region241c, and the Al concentration of the first semiconductor region241ais the third semiconductor region. It may be the same as or different from the Al concentration of third semiconductor region241c. For example, when each of the first to third semiconductor regions241a,241b, and241cincludes AlGaAs, the Al concentration of each of the first semiconductor region241aand the third semiconductor region241cis 0.8 or more and less than 0.9, The Al concentration of the second semiconductor region241bmay be 0.9 or more and 0.99 or less. In detail, the Al concentration of the first semiconductor region241amay be 0.84, the Al concentration of the second semiconductor region241bmay be 0.99, and the Al concentration of the third semiconductor region241cmay be 0.84. In general, the higher the Al concentration, the easier the H2O to penetrate from the side surfaces of the first to third semiconductor layers. InFIG.35, since the Al concentrations of the first semiconductor region241aand the third semiconductor region241care the same, and the penetration depth of H2O is the same, each size of the first insulating region242aand the third insulating region formed as a result of oxidation may be the same. As described above, when the Al concentration (0.99) of the second semiconductor region241bis higher than the Al concentration (0.84) of each of the first and third semiconductor regions241aand241c, the second semiconductor region241bmay be larger than the size of each of the first and third semiconductor regions241aand241c. When the outer surfaces of the first to third insulating regions242a,242b, and242cvertically coincide with each other, the inner surface of the second semiconductor region241bmay be formed in each of the first and third semiconductor regions241aand241c. The second semiconductor region241bmay protrude in the inward direction from the side. Since the size of each of the first to third insulating regions242a,242b, and242cis determined by the Al concentration of each of the first to third semiconductor regions241a,241b, and241c, as shown inFIG.35. Each size of the second insulating region242bhaving a high concentration may be larger than that of the first or third insulating regions242aand242chaving a low Al concentration. The diameter of each of the first to third semiconductor regions241a,241b, and241cmay be determined by the size of each of the first to third insulating regions242a,242b, and242c. Since the size of each of the second insulating regions242bhaving a high A1concentration is large, the diameter D1of the second semiconductor region241bis small. Since the size of the first or third insulating regions242aand242chaving a low Al concentration is small, the diameter D2of the first or semiconductor regions241aand241cis large. Therefore, the diameter D2of the first or semiconductor regions241aand241cmay be larger than the diameter D1of the second semiconductor region241b. From the perspective of the first to third semiconductor regions241a,241band241c, the first or third semiconductor regions241aand241cmay protrude in an outward direction from an end of the second semiconductor region241b. Therefore, the protruding region of the first semiconductor region241aand the protruding region of the third semiconductor region241coverlap vertically, and the protruding region of the first or third semiconductor regions241aand241cmay not overlap vertically with the second semiconductor region241b. The protruding regions of the first or semiconductor regions241aand241cmay vertically overlap with a portion of the second insulating region242b. In view of the first to third insulating regions242a,242b, and242c, the second insulating region242bmay protrude along an inner direction from an inner end of the first or third insulating regions242aand242c. The protruding regions of the second insulating regions242bmay not vertically overlap with the first or third insulating regions242aand242c. The protruding regions of the second insulating regions242bmay overlap the protruding regions of the first or semiconductor regions241aand241c. The side surface of the first semiconductor region241ais in contact with the inner surface of the first insulating region242a, and the side surface of the second semiconductor region241bis in contact with the inner surface of the second insulating region242b. Side surfaces of the semiconductor region241cmay contact inner surfaces of the third insulating region242c. As shown inFIG.36A, the band gaps of the first to third semiconductor regions241a,241b, and241cmay be different. The band gap may vary depending on the Al concentration included in the first to third semiconductor regions241a,241b, and241c. For example, as the Al concentration increases, the band gap may increase. As described above, since the Al concentration of the first or semiconductor regions241aand241cis smaller than the Al concentration of the second semiconductor region241b, the band gap of the Al concentration of the first or semiconductor regions241aand241cmay be smaller than the band gap of the second semiconductor region241b. Therefore, the first or the semiconductor regions241aand241chaving a small band gap are disposed between the second semiconductor regions241bhaving a large band gap, whereby the first to third semiconductor regions of the oxide layer240are formed. The current concentration at third semiconductor region241ccan be relaxed and the diffraction effect can be reduced. In addition, the shrinkage stress is alleviated by such a sandwich structure in which the first or the semiconductor regions241aand241chaving a small band gap are disposed between the second semiconductor regions241bwith a large band gap and thereby deterioration of the laser beam emission characteristic can be prevented due to the bending characteristic. As shown inFIG.36B, in order to make the band gap relatively smaller, In may be added to the first or semiconductor regions241aand241c, for example. As In is added, the band gap may be reduced. The In concentration added to the first or semiconductor regions241aand241cmay be 0.05 or more and 0.18 or less, but is not limited thereto. For example, the In concentration added to the first or semiconductor regions241aand241cmay be 0.1. As shown inFIG.36B, the first or third semiconductor regions241aand241care compared with the case where In is not added to the first or third semiconductor regions241aand241cas shown inFIG.36A. By adding In, the bandgap can be made smaller by a predetermined width Δ. Therefore, when In is added to the first or third semiconductor regions241aand241cso that the band gap becomes smaller, as shown inFIG.37, holes generated in the second reflection layer250are transferred to the third semiconductor region241cand may be moved along the lateral direction in the first semiconductor region241a. Accordingly, the current may not only flow to the light emitting layer230along the vertical direction, but may also flow along the transverse direction in the first or semiconductor regions241aand241c. That is, since current is distributed in the vertical direction and the transverse direction in the first or third semiconductor regions241aand241c, the current density phenomenon in which the current is concentrated along the aperture edge can be alleviated. Next,FIG.38is a cross-sectional view of the surface light emitting laser device according to the fifth embodiment,FIG.39shows the flow of holes in the fifth embodiment, andFIG.40shows the degree of current density according to the fifth embodiment. FIG.38is an enlarged view of the opening241and the insulating region242of the surface light emitting laser device illustrated inFIG.28. The fifth embodiment may be the same as the first to fourth embodiments except for the opening241and the insulating region242. In particular, the shapes of the first to third semiconductor regions241a,241band241cand the first to third insulating regions242a,242band242cof the oxide layer240are different from those of the third embodiment in the fifth embodiment. In the fifth embodiment, components having the same structure, shape, and/or function as those in the first to third embodiments are denoted by the same reference numerals and detailed description thereof will be omitted. Technical matters omitted in the following description can be easily understood from the above-described first to fourth embodiments. Referring toFIG.38, the surface light emitting laser device205according to the fifth embodiment may provide an oxide layer240. The oxide layer240may include an insulating region242and an opening241. The oxide layer240may be composed of a plurality of layers. That is, the insulating region242may be composed of a plurality of insulating regions, and the opening241may be composed of a plurality of semiconductor regions. For example, the oxide layer240may include first to third oxide layers. The first oxide layer may be disposed on the light emitting layer230, the second oxide layer may be disposed on the first oxide layer, and the third oxide layer may be disposed on the second oxide layer. The first oxide layer may be in contact with the top surface of the light emitting layer230, but is not limited thereto. The third oxide layer may be in contact with the bottom surface of the second reflection layer250, but is not limited thereto. According to the fifth embodiment, the Al concentration of the second semiconductor region241bis lower than the Al concentration of each of the first semiconductor region241aand the third semiconductor region241c, and the Al concentration of the first semiconductor region241amay be higher than the Al concentration of the third semiconductor region241c. For example, when each of the first to third semiconductor regions241a,241b, and241cincludes AlGaAs, the Al concentration of each of the first semiconductor region241aand the third semiconductor region241cis 0.9 or more and 0.99 or less. The Al concentration of the second semiconductor region241bmay be 0.8 or more and 0.9 or less. The higher the Al concentration, the deeper the penetration depth of H2O. Therefore, the size of the first or third semiconductor regions241aand241chaving a high Al concentration may be smaller than that of the second semiconductor region241bhaving a low Al concentration. Since the size of each of the first to third insulating regions242a,242b, and242cis determined by the Al concentration of each of the first to third semiconductor regions241a,241b, and241c, the first or third Al concentration is high. Each of the third insulating regions242aand242cmay have a size larger than that of the second insulating region242bhaving a low Al concentration. The diameter of each of the first to third semiconductor regions241a,241b, and241cmay be determined by the size of each of the first to third insulating regions242a,242b, and242c. The diameter of the second semiconductor region241bmay be larger than the diameter of each of the first semiconductor region241aand the third semiconductor region241c. From the perspective of the first to third semiconductor regions241a,241b, and241c, the second semiconductor region241bextends outward from an end of the first semiconductor region241aor the third semiconductor region241cand may protrude. Therefore, the protruding region of the second semiconductor region241bmay not overlap with the first semiconductor region241aor the third semiconductor region241c. From the perspective of the first to third insulating regions242a,242b, and242c, the first insulating region242aor the third insulating region242cmay move inward from the inner end of the second insulating region242band can protrude along. Accordingly, the protruding region of the first insulating region242aand the protruding region of the third insulating region242cvertically overlap each other, and the protruding region of the first insulating region242aor the third insulating region242cis formed in a first direction. Meanwhile, according to the fifth embodiment, the first oxide layer and/or the third oxide layer may include an Al concentration varying in grading. For example, the Al concentration of the first oxide layer may increase linearly or nonlinearly in the direction of the second reflection layer250in the first light emitting layer230. For example, the Al concentration of the third oxide layer may increase linearly or nonlinearly toward the second reflection layer250in the light emitting layer230. When the oxidation process of the first to third oxide layers having such an Al concentration distribution is performed, as the Al concentration increases in the first or third oxide layer, the first insulating region242ais formed in the first oxide layer. And the inner end of the third insulating region242cformed from the third oxide layer are obstructed regions first interference area241_1and second interference area241_2that protrude gradually inward from the light emitting layer230toward the second reflection layer250. That is, the shape of the first oxide layer gradually protrudes inward from the light emitting layer230toward the second reflection layer250in the inner region of the first insulating region242ain contact with the first semiconductor region241a. It may have a first disturbance area241_1. The third oxide layer has a shape that gradually protrudes inwardly toward the inner side of the third insulating region242cin contact with the third semiconductor region241ctoward the second reflection layer250from the light emitting layer230. Referring toFIGS.39and40, holes generated in the second reflection layer250are formed through the third semiconductor region241cby the second interference region242_2of the third insulating region242c. In addition, the holes moved to the second semiconductor region241bare suppressed from moving to the light emitting layer230via the first semiconductor region241aby the first interference region242_1of the first insulating region242a. In addition, holes moved to the second semiconductor region241bmay be dispersed and moved in the horizontal direction as well as in the vertical direction. As such, since the movement of holes is suppressed at the edge of the opening241of the oxide layer240and the holes are dispersed in the vertical direction and the transverse direction, current density is prevented and the divergence angle of the beam does not change, so the output of the precise laser beam is achieved. Meanwhile, the interference regions241_1and241_2according to the fifth embodiment may also be formed in the second semiconductor region241bdescribed in the fourth embodiment (FIGS.35to37). To this end, in the fourth embodiment, an inner end of the second insulating region242bsurrounding the second semiconductor region241bgradually obstructs the inner side toward the second reflection layer250from the light emitting layer230. INDUSTRIAL APPLICABILITY FIG.41is a perspective view of a mobile terminal to which a surface light emitting laser device is applied according to an embodiment. As illustrated inFIG.41, the mobile terminal1500of the embodiment may include a camera module1520, a flash module1530, and an auto focusing device1510provided at a rear surface thereof. Here, the auto focus device1510may include one of packages of the surface light emitting laser device according to the above-described embodiment as a light emitting unit. The flash module1530may include a light emitting device that emits light therein. The flash module1530may be operated by camera operation of a mobile terminal or control of a user. The camera module1520may include an image capturing function and an auto focus function. For example, the camera module1520may include an auto focus function using an image. The auto focus device1510may include an auto focus function using a laser. The auto focus device1510may be mainly used in a condition in which the auto focus function using the image of the camera module1520is degraded, for example, a proximity or a dark environment of 10 m or less. The auto focus device1510may include a light emitting unit including a vertical cavity surface emitting laser (VCSEL) semiconductor device, and a light receiving unit converting light energy such as a photodiode into electrical energy. Features, structures, effects, etc. described in the above embodiments are included in at least one embodiment, but are not necessarily limited to one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be interpreted that the contents related to this combination and modification are included in the scope of the embodiments. Although the above description has been made with reference to the embodiments, these are merely examples and are not intended to limit the embodiments, and those of ordinary skill in the art to which the embodiments pertain may have various examples that are not illustrated above without departing from the essential characteristics of the embodiments. It will be appreciated that eggplant modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to these modifications and applications will have to be construed as being included in the scope of the embodiments set out in the appended claims. | 157,751 |
11942763 | An exemplary embodiment of a semiconductor laser1is shown inFIG.1. The semiconductor laser1comprises a heat sink3, for example, based on CuW. A semiconductor layer sequence2is attached to the heat sink3. The heat sink3can be designed as a printed circuit board. The semiconductor layer sequence2is based on the material system AlInGaN. In operation, preferably blue light, which emerges from the semiconductor layer sequence2along a beam direction R, is generated in an active zone22of the semiconductor layer sequence2. Optionally, the semiconductor layer sequence2is still located on a growth substrate5. The semiconductor laser1comprises a plurality of emitter strips4, each of which is designed to generate the laser radiation. The semiconductor laser1may be a gain-controlled laser, so that the semiconductor layer sequence2is substantially unstructured as shown inFIG.1. In this case, the emitter strips4are defined in particular by means of strip-shaped first electrodes91which are attached to the emitter strips4along the beam direction R. A width b of the emitter strips4is, for example, 50 μm, a grid dimension N corresponding to a periodicity of the emitter strips4is, for example, 400 μm. This results in a filling factor b/N of 12.5%. That is, only a small portion of the active zone22is actually energized and serves to generate the laser radiation. A length L of the emitter strips4is, for example, 1.2 mm. A total width w of an envelope40of the emitter strips4or of the semiconductor layer sequence2is, for example, 9.2 mm. A thickness t of the semiconductor layer sequence2, alone or together with the growth substrate, is preferably in the range between at least 3 μm or 5 μm and at most 100 μm or 150 μm. In comparison with other material systems, a maximum optical output power P can be achieved with AlInGaN with only a very low filling factor FF. This applies to operation with currents in which the semiconductor layer sequence has a long service life, for example, a service life of at least 1 000 hours or 10 000 hours. The filling factor FF is thus preferably defined as the quotient of the width b of the emitter strips4and the grid dimension N. If the emitter strips4are present at different distances from one another, an average grid dimension can be used. If the semiconductor layer sequence2and/or the heat sink3has wide edges which are free of emitter strips4, an envelope40can be defined around the emitter strips4as a base surface. In contrast toFIG.1, in the example ofFIG.17, the electrode91is in fact structured in strips, but energization regions of the gain-controlled semiconductor laser1ofFIG.17are narrower than the strips of the electrode91itself. The emitter strips4are thus defined via openings in an electrical insulation layer95, for example, of SiO2. The strips of the electrode91partially cover the insulation layer95. The strips of the electrode91can be electrically contacted individually via electrical connecting means94such as bonding wires. In contrast toFIG.17, the electrode91can also be designed as a continuous layer over all emitter strips4, analogously toFIG.7. In the exemplary embodiment ofFIG.2, it is illustrated that the semiconductor layer sequence2is attached to the heat sink3via a connecting means6. The connecting means6can be structured to form large-area electrodes91,92. Correspondingly, the heat sink3has associated contact surfaces and the heat sink3can again be a printed circuit board for electrically connecting the semiconductor layer sequence2. Furthermore, it is shown inFIG.2that the semiconductor layer sequence2is still located on the growth substrate5. The growth substrate5is located on a side of the semiconductor layer sequence2facing away from the heat sink3. The growth substrate5is, for example, of GaN, AlN, AlGaN, InN, InGaN or AlInGaN. Furthermore, substrates outside the material system AlInGaN can be used, for example, growth substrates5made of sapphire, silicon carbide or silicon. The semiconductor layer sequence2is preferably grown on a polar surface such as a {0001} surface or on a non-polar surface such as a-{11-20}, m-{1-100} or {-1100}, or on a semipolar surface such as {11-22}, {20-21}, {20-2-1}, {30-31} or {30-3-1}. The electrodes91,92are in particular metallizations, for example, comprising or consisting of Pd, Ni, Ti, Pt and/or Au. A material of the heat spreader is, for example, silicon carbide, AlN, diamond, direct bond copper or DBC for short, copper and/or CuW. The heat sink3may be an active or a passive component. One design of the heat sink3is, for example, corresponding to an MCC mount, CS mount, C mount, TO mount or HPL mount. Cooling of the semiconductor layer sequence2by the heat sink3can take place from one side, from two sides, from three sides, from four sides or from five sides. It is thus possible that only the coupling-out surface25is partially or completely free of the heat sink3. The above-mentioned statements apply correspondingly also to all other exemplary embodiments. In the exemplary embodiment ofFIG.3, it is illustrated that the semiconductor layer sequence2is located on a side of the growth substrate5facing away from the heat sink3. The connecting means6extends continuously and over the entire surface between the growth substrate5and the heat sink3. electrodes are not shown inFIG.3. It can be seen fromFIG.4that the semiconductor layer sequence2is located between two of the heat sinks3, in each case connected via the connecting means6, which is, for example, a hard solder from the material system AuSn. Again, electrodes are not shown. According toFIG.5, the semiconductor layer sequence2, for example, without a growth substrate, is coupled to a carrier93via two of the connecting means6and the heat sink3. The carrier93can be a printed circuit board. An electrical connection preferably takes place via one or more electrical connections94, for example, in the form of bonding wires or electrically conductive flat coatings over side surfaces of the semiconductor layer sequence2. FIG.6shows that the emitter strips4are index-guided structures and thus form strip waveguides. InFIG.6, the beam direction R runs perpendicular to the plane of the drawing. The semiconductor layer sequence2is thus partially removed between adjacent emitter strips4. The active zone22may extend continuously across all emitter strips4. Optionally, the first electrode91is located on the emitter strips4. The first electrode91can cover the emitter strips4partially or, deviating from the illustration inFIG.6, completely. The second electrode92is optionally located on a side of the heat sink3facing away from the semiconductor layer sequence2and can be configured in a planar manner over a plurality of emitter strips4. In the exemplary embodiment ofFIG.7, the semiconductor laser1is also a strip waveguide laser. In this case, the active zone22can be removed between adjacent emitter strips4. An electrical insulation layer95, on which the first electrode91is applied in a planar manner, is located on the semiconductor layer sequence2. The second electrode92is located, for example, on the electrically conductive growth substrate3. Top sides of the emitter strips4are predominantly free of the insulation layer95and otherwise covered with the first electrode91. As also in all other embodiments, the first electrode91may be composed of a plurality of metal layers. The same applies to the second electrode92. An external electrical connection can take place via the electrodes91,92, which can thus be electrical connection surfaces. FIG.8shows an operating method of the semiconductor laser1. In this case, a material8to be processed is under water7and is irradiated along the beam direction R with the blue or near ultraviolet laser radiation. Such an application is not possible with high-power infrared lasers. According toFIG.9A, the material8is also processed with a semiconductor laser1described here. The material8is reflective for infrared or near-infrared radiation and has, for example, a surface of gold or copper. Accordingly, seeFIG.9B, no processing with an infrared laser1′ is possible because the radiation R′ is predominantly reflected on the material8to be processed. FIGS.10to13each show a dependence of the optical output power P in W as a function of the filling factor FF for various thermal connections and configurations of the heat sink and for different grid dimensions N. InFIG.14, an associated table is found with parameters which flow into a determination of an optimum filling factor FF, as explained in more detail below in connection with the formulae ofFIGS.15and16. According toFIG.10, the InGaN laser bar1is mounted with an AuSn hard solder on a CuW heat sink3with passive cooling. This results in a thermal resistance Rth of approximately 1 K/W. The optimum filling factor FF is approximately 8%, independent of the grid dimension N. The maximum optical output power P achievable is nearly 60 W. InFIG.11, instead of passive cooling, a micro-channel cooler is used, whereby the thermal resistance Rth decreases to approximately 0.75 K/W. The filling factor FF, at which the maximum optical output power P of nearly 80 W is achieved, is 10%. InFIG.12, soft solder mounting of the InGaN laser bar1with indium takes place on a microchannel cooler resulting in a thermal resistance Rth of approximately 0.61 K/W Thus, the filling factor FF for an optimum optical output power P of around 90 W is 12%. With respect toFIG.12, a 20% improved cooling is assumed inFIG.13. The thermal resistance Rth is thus 0.45 K/W to 0.5 K/W, resulting in an optimum filling factor FF of 15% at an optical output power P of a maximum of approximately 120 W. Furthermore, it can be seen fromFIGS.10to13that, for better thermal distribution, the grid dimension N is to be selected comparatively low, since the optical output power P decreases with a larger grid size N. The grid dimension N is preferably at most 150 μm. InFIGS.10to13, the length L of the emitter strips4is 1.2 mm each. In conjunction withFIGS.15and16, a model is created for determining the estimation of the barrier layer temperature Tj, that is, in particular a temperature of the active zone22, which is based on a modeling of the thermal resistance Rth dependent on the filling factor FF. In this case, boundary conditions for reliable long-term operation have been established. This results in a specification of the maximum allowed barrier layer temperature Tj, in particular 135° C. Furthermore, a self-consistent calculation of the single emitter light power at the upper limit of the barrier layer temperature Tj was carried out. A projection was then carried out to the entire bar1. For different cooling configurations, the maximum optical output power P was determined as a function of the filling factor FF. This takes into account thermal crosstalk between adjacent emitter strips, which leads to mutual heating of the emitter strips4. The increase in the barrier layer temperature Tj associated with this heating leads to a thermal rollover of the laser diodes, connected with a drop in the achievable optical output power P when the filling factor FF is too high. In particular, the thermal resistance Rth, which depends in particular on the filling factor FF, and parameters f, c1(L), c2for the thermal connection is included in the calculation. Furthermore, an active chip area A results, as indicated inFIG.16, by a length L of the emitter strips4as well as the total width w. A threshold current Is is also dependent on the filling factor FF as well as on a threshold current density Js. An electrical series resistance Rs is also dependent on the electrical surface conductivity ρ of the semiconductor layer sequence2, if necessary together with the growth substrate5. Furthermore, a steepness Sh of the current-power characteristic is required. In addition, the electrical series resistance Rs, which is also dependent on the filling factor FF, is considered. In addition, the input voltage Uop must be taken into account. These parameters are to be determined in particular for the maximum predetermined permitted barrier layer temperature Tj and can be determined experimentally or also modeled. The indices op indicate the respective operating current or the respective operating voltage. Ploss refers to the power loss. The temperature Ths refers to a boundary surface temperature of the semiconductor layer sequence2towards the at least one heat sink3, so that the temperature Ths on the side of the semiconductor layer sequence in the direction of the at least one heat sink is taken into account. From the relationships indicated inFIG.15, the operating current Iop is thus obtained, see V inFIG.15. In this case, the above-mentioned dependencies fromFIG.16are to be taken into account. The optical output power P can be calculated by inserting the operating current Iop from V into I. If the filling factor FF is then varied, the dependence of the above-mentioned laser input parameters results in different results relating to Iop and to the output power P. On the basis of this, the optimum can be found on the basis of the filling factor FF and the cooling used. Here, the thermal resistance Rth, as indicated inFIG.16, is parameterized. In this case, f represents a factor, c1(L) and c2are constants in each case for a design variant with a predefined resonator length L, for example, 1.2 mm. Exemplary values can be gathered from the table inFIG.14. In the formula for the thermal resistance Rth ofFIG.16, the variable w is to be used without units, corresponding to the numerical value of the indication of w in μm. The results show, as illustrated inFIGS.10to13, that the maximum optical output power P is achieved by filling factors FF at around 10%. In this case, the optimum filling factor FF increases with decreasing thermal resistance Rth. An improved optical output power P can thus be achieved by means of the cooling technique. A position of the maximum of the operating current Iop is independent of the number of emitter strips4with the same filling factor FF and the same emitter design in the calculations. Therefore, the maximum found applies to all bars with different widths as long as the filling factor FF does not change. The emitter strips4are preferably arranged in a grid which is as narrow as possible. Thus, more emitter strips4are obtained per bar1, so that the effects of defective emitter strips4on account of epitaxial defects or individual emitter defects on the total power of the laser bar1are only slight. Overall, design criteria of the laser bars1for the filling factor FF are thus specified, which provide the maximum achievable electro-optical conversion efficiency and thus also the maximum optical output power for given boundary conditions such as the type of cooling and the maximum permissible barrier layer temperature Tj. Optionally, a mirror reflectivity of the coupling-out surface25can additionally flow into the calculation. However, this influence is dependent on the thermal resistance Rth. By means of the reflectivity of the coupling-out surface25, optical losses in the semiconductor layer sequence2, assuming a sufficient amplification factor, can be reduced. Thus, the reflectivity of the coupling-out surface25is preferably at least 15%, for example, 22%±1% or 27%±1%. Unless indicated otherwise, in each case the components shown in the figures follow one another directly in the specified sequence. Layers which are not in contact in the figures are preferably spaced apart from one another. If lines are drawn parallel to one another, the corresponding surfaces are preferably likewise aligned parallel to one another. Likewise, unless indicated otherwise, the relative positions of the illustrated components with respect to one another are correctly reproduced in the figures. The invention described here is not limited by the description with reference to the exemplary embodiments. Rather, the invention comprises each novel feature and any combination of features, including, in particular, any combination of features in the claims, even if this feature or combination itself is not explicitly recited in the claims or embodiments. LIST OF REFERENCES SYMBOLS 1semiconductor laser2semiconductor layer sequence22active zone25coupling-out3heat sink4emitter strip40envelope5growth substrate6connecting means7water8material to be processed91first electrode92second electrode93carrier94electrical connection95electrical insulation layerb width of the emitter stripsFF filling factorL length of emitter stripsN grid dimensionP optical output powerR beam directiont thickness of the semiconductor layer sequence/growth substratew total width of the envelope | 16,822 |
11942764 | DETAILED DESCRIPTION The present description is related to operating a boosted engine. The boosted engine may be operated with a spark plug that is in a lower heat dispersal state during vehicle marshalling. Once vehicle marshalling is complete, the boosted engine may be operated with the spark plug in a higher heat dispersal state. Operating the engine in this way may reduce a possibility of spark plug fouling during vehicle marshalling and reduce a possibility of pre-ignition during normal vehicle operation. The engine may be of the type shown inFIG.1. The engine may include one or more spark plugs as shown inFIGS.2-6. The engine may be operated according to the method ofFIG.7.FIGS.2-6are shown approximately to scale. Referring toFIG.1, internal combustion engine10, comprising a plurality of cylinders, one cylinder of which is shown inFIG.1, is controlled by electronic engine controller12. Controller12receives signals from the various sensors shown inFIG.1. Further, controller12employs the actuators shown inFIG.1to adjust engine operation based on the received signals and instructions stored in non-transitory memory of controller12. Engine10is comprised of cylinder head35and block33, which include combustion chamber30and cylinder32. Piston36is positioned therein and reciprocates via a connection to crankshaft40. Flywheel97and ring gear99are coupled to crankshaft40. Starter96(e.g., an optional low voltage (operated with less than 30 volts) electric machine) includes pinion shaft98and pinion gear95. Pinion shaft98may selectively advance pinion gear95to engage ring gear99. Starter96may be directly mounted to the front of the engine or the rear of the engine. In some examples, starter96may selectively supply torque to crankshaft40via a chain. In one example, starter96is in a base state when not engaged to the engine crankshaft. Combustion chamber30is shown communicating with intake manifold44and exhaust manifold48via respective intake valve52and exhaust valve54. Each intake and exhaust valve may be operated by an intake cam51and an exhaust cam53. The position of intake cam51may be determined by intake cam sensor55. The position of exhaust cam53may be determined by exhaust cam sensor57. Intake valve52may be selectively activated and deactivated by valve activation device59. Exhaust valve54may be selectively activated and deactivated by valve activation device58. Valve activation devices58and59may be electro-mechanical devices. Fuel injector66is shown positioned to inject fuel directly into combustion chamber30, which is known to those skilled in the art as direct injection. Fuel injector66delivers liquid fuel in proportion to the pulse width from controller12. Fuel is delivered to fuel injector66by a fuel system (not shown) including a fuel tank, fuel pump, and fuel rail (not shown). In one example, a high pressure, dual stage, fuel system may be used to generate higher fuel pressures. In addition, intake manifold44is shown communicating with turbocharger compressor162and engine air intake42. In other examples, compressor162may be a supercharger compressor. Shaft161mechanically couples turbocharger turbine164to turbocharger compressor162. Optional electronic throttle62adjusts a position of throttle plate64to control air flow from compressor162to intake manifold44. Pressure in boost chamber45may be referred to a throttle inlet pressure since the inlet of throttle62is within boost chamber45. The throttle outlet is in intake manifold44. In some examples, throttle62and throttle plate64may be positioned between intake valve52and intake manifold44such that throttle62is a port throttle. Compressor recirculation valve47may be selectively adjusted to a plurality of positions between fully open and fully closed. Waste gate163may be adjusted via controller12to allow exhaust gases to selectively bypass turbine164to control the speed of compressor162. Air filter43cleans air entering engine air intake42. Distributorless ignition system88provides an ignition spark to combustion chamber30via spark plug92in response to controller12. Universal Exhaust Gas Oxygen (UEGO) sensor126is shown coupled to exhaust manifold48upstream of catalytic converter70. Alternatively, a two-state exhaust gas oxygen sensor may be substituted for UEGO sensor126. Converter70can include multiple catalyst bricks, in one example. In another example, multiple emission control devices, each with multiple bricks, can be used. Converter70can be a three-way type catalyst in one example. Controller12is shown inFIG.1as a conventional microcomputer including: microprocessor unit102, input/output ports104, read-only memory106(e.g., non-transitory memory), random access memory108, keep alive memory110, and a conventional data bus. Controller12may also include one or more timers and/or counters111that keep track of an amount of time between a first event and a second event. The timer and/or counters may be constructed in hardware or software. Controller12is shown receiving various signals from sensors coupled to engine10, in addition to those signals previously discussed, including: engine coolant temperature (ECT) from temperature sensor112coupled to cooling sleeve114; a position sensor134coupled to a driver demand pedal130for sensing force applied by human driver132; a position sensor154coupled to brake pedal150for sensing force applied by human driver132, a measurement of engine manifold pressure (MAP) from pressure sensor122coupled to intake manifold44; an engine position sensor118sensing crankshaft40position; a measurement of air mass entering the engine from sensor120; and a measurement of throttle position from sensor68. Barometric pressure may also be sensed (sensor not shown) for processing by controller12. In a preferred aspect of the present description, engine position sensor118produces a predetermined number of equally spaced pulses every revolution of the crankshaft from which engine speed (RPM) can be determined. Controller12may also receive input from human/machine interface11. A request to start the engine or vehicle may be generated via a human and input to the human/machine interface11. The human/machine interface may be a touch screen display, pushbutton, key switch or other known device. During operation, each cylinder within engine10typically undergoes a four stroke cycle: the cycle includes the intake stroke, compression stroke, expansion stroke, and exhaust stroke. During the intake stroke, generally, the exhaust valve54closes and intake valve52opens. Air is introduced into combustion chamber30via intake manifold44, and piston36moves to the bottom of the cylinder so as to increase the volume within combustion chamber30. The position at which piston36is near the bottom of the cylinder and at the end of its stroke (e.g. when combustion chamber30is at its largest volume) is typically referred to by those of skill in the art as bottom dead center (BDC). During the compression stroke, intake valve52and exhaust valve54are closed. Piston36moves toward the cylinder head so as to compress the air within combustion chamber30. The point at which piston36is at the end of its stroke and closest to the cylinder head (e.g. when combustion chamber30is at its smallest volume) is typically referred to by those of skill in the art as top dead center (TDC). In a process hereinafter referred to as injection, fuel is introduced into the combustion chamber. In a process hereinafter referred to as ignition, the injected fuel is ignited by known ignition means such as spark plug92, resulting in combustion. During the expansion stroke, the expanding gases push piston36back to BDC. Crankshaft40converts piston movement into a rotational torque of the rotary shaft. Finally, during the exhaust stroke, the exhaust valve54opens to release the combusted air-fuel mixture to exhaust manifold48and the piston returns to TDC. Note that the above is shown merely as an example, and that intake and exhaust valve opening and/or closing timings may vary, such as to provide positive or negative valve overlap, late intake valve closing, or various other examples. Referring now toFIG.2, a schematic of a first example spark plug200is shown. Spark plug200may be the spark plug92that is shown inFIG.1. Spark plug200is shown in cross section. Spark plug200is shown in a higher heat dispersion state for operating with a boosted engine at higher engine loads (e.g., engine load is indicative of air that is consumed by the engine and engine load may range from zero to 1 for engines that are not boosted and above one for boosted engines). The higher heat dispersion state includes a wider spark plug gap212. Spark plug200includes a body202, a center electrode208, and an insulator206. The body202may be of metallic construction and the insulator206may be of ceramic construction. The center electrode208may be comprised of one or more materials including but not limited to copper. Cap211is coupled to center electrode208. Body202includes a crimp flange210, a ground electrode215, and threads203for mating spark plug200to a cylinder head. Insulator206is inserted into body202and insulator206may move relative to body202as indicated by arrow214according to bias forces. In this example, two bias devices are shown. In particular, an upper spring205and a lower spring204are shown. The lower spring204may be constructed to deform in response to heating the spark plug so that shortly after vehicle marshalling, the upper spring causes insulator206to move in the direction of arrow214. The lower spring204provides a force that may be greater than the force that is applied by the upper spring205and the lower spring204may provide a force to move insulator206in the direction that is indicated by arrow213. In some examples, air that fills gap may operate as a spring to adjust the position of insulator206and center electrode208so that spark plug200operates in a higher heat dispersion state. In still other examples, bias may be provided via an annular or other shape of standoff that is inserted between insulator206and body202. The standoff may deform or decompose when it is exposed to heat from the engine so that spark plug200changes from a higher heat dispersion state to a lower heat dispersion state in response to engine temperature increasing. In this example, crimp flange210is shown in a partially clamped position which allows spring204to support a larger distance or spark plug gap212between ground electrode215and center electrode208. Spark plug200is also shown with an optional locking mechanism235. Locking mechanism235may include a cavity220in insulator206, a pawl222, and a bias device (e.g., spring)224. Pawl222may be constructed with an annular, half moon, pin, or other known shape to engage cavity220. InFIG.2, locking mechanism235is shown in a not engaged position. Referring now toFIG.3, a schematic of the first example spark plug200that is shown inFIG.2is shown in a lower heat dispersion state. Spark plug200may be the spark plug92that is shown inFIG.1. Spark plug200is shown in cross section. The lower heat dispersion state includes a narrower spark plug gap212. The components of spark plug200are the same as those described inFIG.2. Spark plug200is shown in the lower heat dispersion state, which is engaged by applying a greater crimping force to crimp flange210to deform crimp flange210and compress spring204. In addition, deforming the crimp flange210applies a force to move insulator206in the direction that is indicated by arrow214. The additional force also allows locking mechanism235to engage and lock spark plug in the lower heat dispersion state. The spark plug gap212is reduced when spark plug200is engaged in the lower heat dispersion state. Referring now toFIG.4, a schematic of a second example spark plug400is shown. Spark plug400may be the spark plug92that is shown inFIG.1. Spark plug400is shown in cross section. Spark plug400is shown in a higher heat dispersion state for operating with a boosted engine at higher engine loads. The higher heat dispersion state includes a wider spark plug gap432. Spark plug400includes a lower body402, an upper body410, a center electrode430, and an insulator420. The lower body402and upper body410may be of metallic construction and the insulator420may be of ceramic construction. The center electrode430may be comprised of one or more materials including but not limited to copper. Lower body402includes outer threads404and inner threads406. Outer threads404are configured to engage a cylinder head (not shown). Inner threads406are configured to engage threads412of upper body410. Insulator420is inserted into lower body402and upper body410. Insulator420may move relative to lower body402as indicated by arrows425and426by rotating upper body410. Rotating upper body410in a clockwise direction may decrease a distance of gap432and rotating upper body410in a counter clockwise direction may increase a distance of gap432. In this example, upper body410is of two piece construction and it includes an annular protrusion414. Alternatively, insulator420may be press fit into upper body410and annular protrusion414may be omitted. Annular protrusion414is inserted into cavity422which encircles insulator420. The annular protrusion414and the cavity422allow upper body410to lift and lower insulator420and center electrode430in a longitudinal direction of insulator420as indicated by arrows425and426when upper body410is rotated with respect to lower body402. During vehicle marshalling, upper body410may be oriented to provide a greater distance at gap432. After vehicle marshalling, upper body410may be oriented to provide a smaller distance at gap432. In this example, upper body410is shown in a position that allows center electrode430and lower body402, which operates as a ground electrode, to support a larger distance or gap432. Referring now toFIG.5, a schematic of the second example spark plug400that is shown inFIG.4is shown in a lower heat dispersion state. Spark plug2400may be the spark plug92that is shown inFIG.1. Spark plug400is shown in cross section. The lower heat dispersion state includes a narrower spark plug gap432. The components of spark plug400are the same as those described inFIG.4. Spark plug400is shown in the lower heat dispersion state, which is engaged by rotating upper body410in a clockwise direction with respect to lower body402. The gap432is reduced when spark plug400is engaged in the lower heat dispersion state. The lower heat dispersion state may be engaged when marshalling a vehicle that includes the engine and spark plug400. Turning now toFIG.6, a schematic of a third example spark plug600is shown. Spark plug600may be the spark plug92that is shown inFIG.1. Spark plug600is shown in cross section. Spark plug600is shown in a higher heat dispersion state for operating with a boosted engine at higher engine loads. The higher heat dispersion state is engaged by adjusting second ceramic insulator610toward the spark plug gap660. Spark plug600includes a lower body602, an intermediate body604, an upper body606, and a center electrode630. The center electrode630is partially covered in a longitudinal direction via a first ceramic insulator620. The first ceramic insulator620is at least partially covered in a longitudinal direction via a second ceramic insulator610. The first and second ceramic insulators may be cylindrical in form. Lower body602, intermediate body604, and upper body606may be of metallic construction. The center electrode630may be comprised of one or more materials including but not limited to copper. Lower body602includes outer threads612and inner threads614. Outer threads612are configured to engage a cylinder head (not shown). Inner threads614are configured to engage outer threads625of intermediate body604. Outer threads622of intermediate body604are configured to engage inner threads618of upper body606. Intermediate body604may be rotated to move second ceramic insulator610up and down in a longitudinal direction relative to lower body602as indicated by arrow650. Upper body606may be rotated to move first ceramic insulator620up and down in a longitudinal direction relative to intermediate body604as indicated by arrow652. In this example, intermediate body604is of two piece construction. The lower and upper bodies are of one piece construction. The respective ceramic insulators may be pressed into the upper and intermediate bodies. In other examples, the intermediate body may be raised and lowered with respect to the lower body via electric or hydraulic actuators. The spark plugs ofFIGS.2-6provide for a spark plug, comprising: a metallic body including a crimp flange; a ceramic insulator; a center electrode; and a bias device arranged to position the ceramic insulator in a first position when the crimp flange is in a second position. In a first example, the spark plug includes where the ceramic insulator is in a second position when the crimp flange is in a third position. In a second example that may include the first example, the spark plug includes where the bias device is a spring. In a third example that may include one or both of the first and second examples, the spark plug further comprises a locking mechanism configured to restrict motion of the ceramic insulator relative to the metallic body. In a fourth example that may include one or more of the first through third examples, the spark plug includes where the ceramic insulator at least partially covers the center electrode, and where the locking mechanism includes a cavity in the ceramic insulator. In a fifth example that may include one or more of the first through fourth examples, the spark plug includes where the locking mechanism includes a spring. In a sixth example that may include one or more of the first through fifth examples, the spark plug includes where the bias device deforms with increasing temperature. In a seventh example that may include one or more of the first through sixth examples, the spark plug includes where the bias device impinges on the ceramic insulator and the metallic body. The spark plugs ofFIGS.2-6provide for a spark plug, comprising: a metallic body; a first ceramic insulator at least partially covering a center electrode; and a second ceramic insulator at least partially covering the first ceramic insulator. In a first example, the spark plug includes where the second ceramic insulator is movable with respect to a longitudinal direction of the first ceramic insulator. In a second example that may include the first example, the spark plug further comprising an intermediate body to adjust a longitudinal position of the second ceramic insulator. In a third example that may include one or both of the first and second examples, the spark plug includes where the second ceramic insulator is formed in a cylindrical shape. In a fourth example that may include one or more of the first through third examples, the spark plug further comprises an upper body configured to adjust a longitudinal position of the first ceramic insulator. Referring now toFIG.7, a flow chart of a method for operating an engine that includes a spark plug that may be operated in a lower heat dispersal state or a higher heat dispersal state is shown. The method ofFIG.7may be applied to the system ofFIG.1. The method ofFIG.7may be performed automatically via spark plug components or via a technician. Further, a controller may perform at least a portion of method700via changing operating statues of a human/machine interface. Operating states of an engine's spark plugs may be transformed automatically or via the technician. At702, method700determines vehicle operation conditions. Operating conditions may include but are not limited an actual total amount of time that an engine of the vehicle has been running (e.g., rotating and combusting fuel) since the vehicle was manufactured, engine temperature, the vehicle's geographical position, and engine load. Method700proceeds to704. At704, method700judges whether or not marshalling of the vehicle has been completed. Method700may judge that marshalling of the vehicle is complete after the vehicle has left a manufacturing facility, engine temperature has reached a threshold operating temperature, the vehicle has reached a destination (e.g., sales office, user location, etc.), or other condition that may be indicative of vehicle marshalling being complete. If method700judges that vehicle marshalling is complete, the answer is yes and method700proceeds to706. Otherwise, the answer is no and method700proceeds to720. At720, method700operates the vehicle with the engine's spark plugs being in an increased heat dispersal state (e.g., a shorter spark plug gap and/or the ceramic that covers the central electrode being moved away from the spark plug gap). The increased heat dispersal state may allow the engine to operate at higher engine loads with a lower possibility of pre-ignition. Method700may prompt a user or technician via a human/machine interface to adjust the spark plug to an increased heat dispersal state, or alternatively, the spark plug's state may change due to engine temperature exceeding a threshold temperature or engine operating duration exceeding a threshold duration. Once the spark plug's operating state is changed, the engine is operated with the spark plug in the increased heat dispersal state. Method700proceeds to exit. At,706, method700operates the vehicle with the engine's spark plugs being in a decreased heat dispersal state (e.g., a larger spark plug gap and/or the ceramic that covers the central electrode being moved toward the spark plug gap). The decreased heat dispersal state may allow the engine to operate at lower engine loads with a lower possibility of spark fouling (e.g., soot accumulation of the spark plug). Method700may indicate to a user or technician via the human/machine interface that the spark plugs are operating in a decreased heat dispersal state. The engine may be operated with the spark plug in the decreased heat dispersal state while marshalling the vehicle. Method700proceeds to708. At708, method700judges whether or not vehicle marshalling is complete. Method700may judge that vehicle marshalling is compete if the vehicle has operated for longer than a threshold amount of time since vehicle manufacture, engine temperature has exceeded a threshold temperature, or the vehicle has left a vehicle manufacturing location. If method700judges that vehicle marshalling is complete, the answer is yes and method700proceeds to710. Otherwise, the answer is no and method700returns to704. At710, method700may prompt a user or technician via a human/machine interface to adjust the spark plug to an increased heat dispersal state, or alternatively, the spark plug's state may change due to engine temperature exceeding a threshold temperature or engine operating duration exceeding a threshold duration. For example, a spring or device within the spark plug may deform to allow the spark plug to change to the increased heat dispersal state. Once the spark plug's operating state is changed, the engine may be operated with the spark plug in the increased heat dispersal state. Method700proceeds to exit. In this way, an operating state of a spark plug may be adjusted once vehicle marshalling is complete so that a possibility of spark plug fouling may be reduced when the vehicle is being marshalled. Once the spark plug state is adjusted, the engine may be operated at higher loads with a reduced possibility of pre-ignition. The method ofFIG.7provides for an engine operating method, comprising: operating an engine with a spark plug in a first heat dispersal state during engine operating conditions when an engine load is expected to be less than a threshold load, wherein the first heat dispersal state is produced via a biasing device applying a force between a metallic body of the spark plug and a ceramic insulator of the spark plug; and operating the engine with the spark plug in a second heat dispersal state during engine operating conditions when the engine load is expected to be greater than the threshold load. In a first example, the method includes where the bias device is a spring. In a second example that may include the first example, the method further comprises locking the spark plug in the second heat dispersal state via adjusting a crimp flange of the spark plug. In a third example that may include one or both of the first and second examples, the method further comprises locking the spark plug in the second heat dispersal state via a locking device that constrains movement between the metallic body of the spark plug and the ceramic insulator of the spark plug. In a fourth example that may include one or more of the first through third examples, the method includes where the locking is achieved via moving the ceramic insulator of the spark plug. In a fifth example that may include one or more of the first through fourth examples, the method includes where the engine load is expected to be less than a threshold load is during vehicle marshalling. In a sixth example that may include one or more of the first through fifth examples, the method includes where the engine load is expected to be greater than a threshold load is subsequent to vehicle marshalling. Note that the example control and estimation routines included herein can be used with various engine and/or vehicle system configurations. The control methods and routines disclosed herein may be stored as executable instructions in non-transitory memory and may be carried out by the control system including the controller in combination with the various sensors, actuators, and other engine hardware. The specific routines described herein may represent one or more of any number of processing strategies such as event-driven, interrupt-driven, multi-tasking, multi-threading, and the like. As such, various actions, operations, and/or functions illustrated may be performed in the sequence illustrated, in parallel, or in some cases omitted. Likewise, the order of processing is not necessarily required to achieve the features and advantages of the example embodiments described herein, but is provided for ease of illustration and description. One or more of the illustrated actions, operations and/or functions may be repeatedly performed depending on the particular strategy being used. Further, at least a portion of the described actions, operations and/or functions may graphically represent code to be programmed into non-transitory memory of the computer readable storage medium in the control system. The control actions may also transform the operating state of one or more sensors or actuators in the physical world when the described actions are carried out by executing the instructions in a system including the various engine hardware components in combination with one or more controllers. This concludes the description. The reading of it by those skilled in the art would bring to mind many alterations and modifications without departing from the spirit and the scope of the description. For example, I3, I4, I5, V6, V8, V10, and V12 engines operating in natural gas, gasoline, diesel, or alternative fuel configurations could use the present description to advantage. | 27,406 |
11942765 | DETAILED DESCRIPTION Initially, this disclosure is by way of example only, not by limitation. Thus, although the instrumentalities described herein are for the convenience of explanation, shown and described with respect to exemplary embodiments, it will be appreciated that the principles herein may be applied equally in other similar configurations involving similar uses of the technology put forth in the field of the invention. The phrases “in one embodiment”, “according to one embodiment”, and the like, generally mean the particular feature, structure, or characteristic following the phrase, is included in at least one embodiment of the present invention and may be included in more than one embodiment of the present invention. Importantly, such phases do not necessarily refer to the same embodiment. If the specification states a component or feature “may”, “can”, “could”, or “might” be included or have a characteristic, that particular component or feature is not required to be included or have the characteristic. As used herein, the terms “having”, “have”, “including” and “include” are considered open language and are synonymous with the term “comprising”. Furthermore, as used herein, the term “essentially” is meant to stress that a characteristic of something is to be interpreted within acceptable tolerance margins known to those skilled in the art in keeping with typical normal world tolerance, which is analogous with “more or less.” For example, essentially flat, essentially straight, essentially on time, etc. all indicate that these characteristics are not expected or even capable of being perfect within the sense of their limits. Accordingly, if there is no specific +/− value assigned to “essentially”, then it is to be assumed that “essentially” has a default meaning to be within +/−2.5% of exact. The term “connected to” as used herein is to be interpreted as a first element physically linked or attached to a second element and not as a “means for attaching” as in a “means plus function”. In fact, unless a term expressly uses “means for” followed by the gerund form of a verb, that term shall not be interpreted under 35 U.S.C. § 112(f). In what follows, similar or identical structures may be identified using identical callouts. With respect to the drawings, it is noted that the figures are not necessarily drawn to scale and are diagrammatic in nature to illustrate features of interest. Descriptive terminology such as, for example, upper/lower, top/bottom, horizontal/vertical, left/right and the like, may be adopted with respect to the various views or conventions provided in the figures as generally understood by an onlooker for purposes of enhancing the reader's understanding and is in no way intended to be limiting. All embodiments described herein are submitted to be operational irrespective of any overall physical orientation unless specifically described otherwise, such as elements that rely on gravity to operate, for example. Certain embodiments of the present invention generally relate to an underarm gang operated vacuum break switch with an in-line disconnect, (or simply, underarm vacuum break switch arrangement). The underarm vacuum break switch arrangement is so named because the electrically live portion of the vacuum break switch is under the mounting arm, as referred to as a phase base cross bar. The underarm vacuum break switch arrangement distinguishes over other vacuum break switches that have the electrically live portion above the mounting arm. Because the mounting arm is not electrified and is above the electrified arm portion, the underarm vacuum break switch arrangement is considerably safer for perching birds and other wildlife. In addition, the nature of the underarm vacuum break switch arrangement provides other benefits including an interlocked in-line disconnect blade that is only operable once the vacuum switch has been opened, therefore adding a visual gap to ensure discontinuity with the switch. Adding to the safety measures is a visual indicator that shows an electrician when the switch is live or not thereby indicating when it is safe to open the disconnect blade with a hot stick. Other safety measures include a shock absorber assembly and inertia slowing mass that help protect electrical contacts within the vacuum break switch from failing. The following description details innovation like these. FIG.1Ais a side view line drawing of an underarm gang operated vacuum break switch with in-line disconnect (hereinafter “underarm vacuum switch arrangement”) consistent with embodiments of the present invention. The underarm vacuum break switch arrangement100generally includes a vacuum (break) switch105that is hanging from a phase base cross bar116via a stationary post insulator114and rotating spindle insulator115(stationary post insulator with rotating inner spindle). Though in the present embodiment the vacuum switch105hangs from the phase base cross bar116at the cross bar bottom side174, certain embodiments envision the stationary post insulator114and rotating spindle insulator115being rigidly attached to the vacuum switch105and the phase base cross bar116in a manner that if the underarm vacuum switch arrangement100were turned on its side, nothing would appreciably bend or move out of place. Unlike the stationary post insulator114, the rotating spindle insulator115comprises a rotating spindle118that passes axially through the center of the post insulator portion of the rotating spindle insulator115. The rotating spindle118can be connected to a vacuum switch motor and/or motorized linkage at a spindle motor mount176on the cross bar top side172(not shown but that is attached to a utility pole155, ofFIG.1D, along with the underarm vacuum switch arrangement) that is configured to rotate the rotating spindle118to open the vacuum switch105. When the vacuum switch105is open, current cannot pass from the right terminal end124to the left terminal end126(i.e., there is no electrical continuity between the left terminal130and the right terminal128). In certain embodiments, the motorized linkage comprises a control rod (not shown) that moves up and down by way of the vacuum switch motor. The control rod operates as bell crank that then rotates the rotating spindle118, though there a many other ways to rotate the rotating spindle118known to those skilled in the art. When the vacuum switch105is in either an open or closed state, an open/close indicator106(located at the actuator mechanism300down facing cover108) visually depicts the state of the vacuum switch105that can be visibly seen by an onlooker, e.g., an electrician, underneath the underarm vacuum break switch arrangement100. The rotating spindle118allows the disconnect blade136to drop down (hinge open and hang via gravity, via a hinge135) only when the vacuum switch105is open, as shown inFIG.1B. The disconnect blade136is dropped down (where it dangles), in an open configuration, by way of a hot stick (not shown) used to pull down on a disconnect blade ring104, which is done by an electrician. The open oriented disconnect blade136definitively shows a visual break (i.e., no power running through the switch100) in any electrical connection between the right terminal end124and the left terminal end126. This is a protective measure for an electrician working on the underarm vacuum break switch arrangement100. In the current configuration ofFIG.1A, when the vacuum switch105is closed, electricity can be made to flow through the disconnect blade136between a disconnect blade busbar140and the left terminal130. With continued reference toFIG.1A, both current and voltage can be sampled or otherwise sensed by a current and voltage sensor110at the right terminal end124. Only the voltage can be sampled via a voltage sensor120at the left terminal end126. The voltage sensor120and the current and voltage sensor110are both insulators, which prevent electricity from flowing across the terminal ends124and126via the phase base cross bar116. The left terminal130is clamped to the vacuum break switch100approximately at the bottom of the voltage sensor120via a left terminal pad134, and the right terminal128is clamped at the right terminal pad133near the bottom of the current and voltage sensor110via a right sensor clamp132. As shown inFIG.1C, the electrically ‘hot’ (i.e., electrified) portion, or arm, of the underarm vacuum break switch arrangement100is a powerline pathway121, which is the only electrical pathway through the underarm vacuum break switch arrangement100. The powerline pathway121includes the left terminal130, the left terminal pad134, the disconnect blade136, the vacuum switch105, the right sensor clamp132, and the right terminal128. Accordingly, the upper portion of the underarm vacuum break switch arrangement100, which includes the current and voltage sensor110, the phase base cross bar116, the voltage sensor120, and the two post insulators114and115are not electrically ‘hot’. The underarm vacuum break switch arrangement100(where the electrified arm portion is hanging under the upper portion) is considerably safer for birds that perch on the underarm vacuum break switch arrangement100because there is essentially no chance of the birds, or animals, being electrocuted. The phase base cross bar116comprises a cross arm recess122that accommodates a cross arm152, which can supports additional underarm vacuum break switch arrangements100.FIG.1Dis a line drawing of a commercial embodiment of a three-phase underarm switch system150, wherein three underarm vacuum break switches100a,100band100care mounted to a cross arm152atop a telephone pole155. The power line156is electrically broken at a powerline bypass158via a powerline insulator160that prevents electrical current from flowing between the powerline bypass junctions162. The powerline insulator160keeps the powerline156in tension but without continuity between the first powerline side156A and the second powerline side156B. A first powerline bypass164connects to the right terminal128and a second powerline bypass166connects to the left terminal130, which enables power to flow through the underarm powerline pathway121of the corresponding underarm vacuum break switch arrangement100. The underarm vacuum break switch arrangement100is also sometimes considered a sectionalizer because if the high voltage powerlines156are somehow disrupted or damaged upstream (e.g., a tree falls on a section of powerline or there is some other kind of fault that trips a recloser circuit breaker) the voltage sensor120and the current and voltage sensor110senses a spike in current from a fault, then a drop in voltage, which sends a message to the vacuum switch motor that, in turn, rotates the spindle118to turn the vacuum switch105to open. This action contains the powerline disruption. The vacuum switch105can be opened via the rotating spindle118that is turned counterclockwise via a control box with the vacuum switch motor and linkage (not shown) that is attached nearby on the telephone/utility pole155. In this way, power can be rerouted from another direction to restore power to customers quickly. With more detail to the vacuum switch105,FIG.2Ais a line drawing of a bottom view of the vacuum switch105consistent with embodiments of the present invention. The two main portions of the vacuum switch105are a vacuum bottle assembly200and an actuator mechanism300that drives an electrical on/off switch inside of the vacuum bottle assembly200. The vacuum bottle switch assembly200generally includes a vacuum bottle220and switch system210and212(shown inFIGS.3A and3B) that are inside of a vacuum bottle silicone overmold202. The vacuum bottle silicone overmold202includes a plurality of circular silicone ice and water sheds204(concentric about a vacuum bottle assembly axis208), that shed water (i.e., they prevent a water bead from forming) thereby preventing ice from forming on the vacuum bottle silicone overmold202. The silicone material also discourages water from accumulating and freezing in a harmful way around the vacuum bottle silicone housing200. The vacuum bottle silicone overmold202additionally functions as an insulator. In the present embodiment, the circular sheds204alternate between larger diameter sheds204aand smaller diameter sheds204b. Certain embodiments envision the sheds204being a continuous/singular silicone mold that includes the vacuum bottle silicone overmold202. A conductive heatsink138extends from a static contact arm210(ofFIGS.3A and3B) within the vacuum bottle220that connects to a conductive right terminal pad133, which is part of the right sensor clamp132. In certain embodiments, the conductive heatsink138and the conductive right terminal pad133are copper. The conductive heatsink138that dissipates excessive heat produced by the vacuum bottle220. The conductive heatsink138is somewhat protected by an aluminum mounting channel206. FIG.2Bis an isometric line drawing of the vacuum switch105with the actuator mechanism down facing cover108inverted (pointing upward). With reference to the actuator mechanism300, the open/close indicator106is extending upward and displays a bottom view visual indicator307on the open/close indicator ground facing surface112, which when installed on a utility pole155with overhead powerlines156, can easily be read by an electrician viewing the vacuum switch105from below. There are additional side view visual indicators309, that are located on either side of the indicator side surface270of the open/close indicator106. In one embodiment, the visual indicators307and309are colored red to indicate that the vacuum switch105is ‘electrically live’ (i.e., closed switch) and green to indicate that the vacuum switch105is ‘electrically dead’ (i.e., open switch). The actuator mechanism300is encased in a poly carbonate actuator mechanism housing302that protects the inner actuator elements from outside weather. The actuator mechanism300drives or otherwise actuates the switch212inside of the vacuum bottle assembly200. For reference, the right terminal pad133, conductive heatsink138, and the aluminum mounting channel206are shown. The actuator mechanism down facing cover108is attached to the actuator mechanism up facing cover109via a plurality of bolts in an actuator mechanism cover flange102. FIG.2Cis an isometric line drawing showing the vacuum switch105with the actuator mechanism down facing cover108pointing downward with the open/close indicator106facing the ground, which is the same orientation when installed on a utility pole155. An open/close pivot shaft326is depicted extending from the actuator mechanism up facing cover109. The open/close pivot shaft326is physically rotated to open or close the vacuum switch105and is configured to be attached to the rotating spindle118that is in the rotating spindle insulator. Next to the open/close pivot shaft326are two electrical contact posts320that connect to the disconnect blade136(shown inFIG.1A) via a disconnect blade busbar140. When the vacuum switch105is closed and the rest of the circuit is closed (thereby connecting the powerlines156A and156B), electricity flows from the right terminal pad133through the two electrical contact posts320and through the left terminal130.FIG.2Dis a line drawing of an exploded view of the open/close indicator106consistent with embodiments of the present invention. Though there are several different ways to design an open/close indicator that cooperates with the open/close rotating shaft325, the embodiment ofFIG.2Dprovides insight into the possibilities. This open/close indicator embodiment106generally comprises a cylindrically shaped inner hub/drum250that is axially connected (along the indicator axis272) to the open/close indicator shaft distal end324of the open/close indicator shaft325at a connection location, which is not shown but is inside of the hub250accessible through an accommodating opening (not shown) in the hub proximal side260. The hub proximal side260faces the actuator mechanism300. The actuator hub250has side view visual indicators309that align with bottom view visual indicators307, as shown. In one embodiment, there is a red panel252and a green panel254that are configured to appear through an indicator side surface window264and in an indicator distal surface window262of an indicator housing265when the hub250is inside of the indicator housing265. Optional embodiments envision white and black or other colors. As should be appreciated, the hub250goes into the indicator housing265via an opening274in the indicator housing proximal side266. When the hub250is inside of the indicator housing265, the hub250can freely rotate therein without being obstructed by the inner housing surface276. Accordingly, when installed, the indicator housing265can be attached or anchored to the actuator mechanism down facing cover108and the hub250can rotate with the open/close indicator shaft325either clockwise or counterclockwise256within the indicator housing265. As the actuator mechanism300closes the switch210and212, the open/close indicator shaft325rotates thereby rotating the hub250in a first position with the red panel252being displayed through the indicator side surface windows264and the indicator distal surface windows262. When the actuator mechanism300opens the switch210and212, the open/close indicator shaft325rotates in the other direction (in a second position) thereby rotating the hub250with the green panel254being displayed through the indicator side surface windows264and the indicator distal surface windows262. FIGS.3A and3Bare line drawings of a cross-section of the vacuum bottle assembly200consistent with embodiments of the present invention.FIG.3Adepicts a cross-section of the vacuum bottle assembly200when the switch is open (open circuit) andFIG.3Bdepicts the cross-section of the vacuum bottle assembly200when the switch is closed (closed circuit). With reference toFIG.3A, shown therein is the vacuum switch200that is in an open configuration with a fixed electrical contact210separated from a dynamic electrical contact212, as shown by the contact gap216. The fixed and movable/dynamic contacts210and212, respectively, are contained in a vacuum (chamber)224that is defined inside of a porcelain ceramic vacuum bottle220. The vacuum224has a dielectric constant that is significantly lower than air thus functioning as a superior medium to lower sparking from the electrical contacts210and212. The vacuum bottle220is essentially encased in a urethane insulator222that provides insulation and protection to the vacuum bottle120. Historically, vacuum bottles have been encased by and insulated with SF-6 gas, now being replaced with nitrogen gas due to SF-6 gas negatively impacting the environment. The urethane insulator222is essentially surrounded by a fiberglass tube226that provides structural integrity to the porcelain ceramic vacuum bottle220. The vacuum bottle silicone overmold202further provides dielectric insulation that helps prevent electricity from arcing between the fixed contact end228and the dynamic contact end230. The vacuum224, the vacuum bottle220, the urethane insulator222, the fiberglass tube226and the vacuum bottle silicone overmold202all function to isolate electricity to passing only between the fixed contact end228and the dynamic contact end230via the fixed electrical contact210and the dynamic electrical contact212. As further shown, the fixed electrical contact210is anchored to a fixed contact lead screw214and the dynamic electrical contact212is anchored to a dynamic contact lead screw215. The fixed contact lead screw214and the dynamic contact lead screw215allows for modular assembly of the vacuum switch105and further provides using an off-the-shelf vacuum bottle that has receiving threaded screw holes. This arrangement also facilitates replacing the vacuum bottle200if it fails.FIG.3Bdepicts the contacts210and212touching, which forms electrical contact thus closing the circuit and permitting electricity to flow between the fixed contact end228and the dynamic contact end230, as shown by the closed gap218. FIGS.4A-4Care line drawings that illustratively depict internal components of the vacuum switch embodiment105consistent with embodiments of the present invention.FIG.4Ais a bottom view of the vacuum switch105depicting the vacuum bottle assembly200and the actuator mechanism between the two section plates370A and370B ofFIG.6Cin the down facing direction of the actuator mechanism300. When the vacuum switch105is closed, electricity flows from the contacts210and212through the flexible busbar312, along an internal electrical bar314and out from the actuator mechanism300via the two electrical contact posts320. The flexible busbar312is a copper laminate comprised of a plurality of thin copper ribbon that moves with the dynamic contact lead screw215and dynamic electrical contact212as shown inFIGS.5B and5C. Electricity ultimately moves to the other end of the actuator mechanism300via an electrical contact post320. The inner end of the electrical contact post320is shown here. With respect to the moving parts of the actuator mechanism300, the open/close pivot shaft326rotates either clockwise or counterclockwise axially as driven by the rotating spindle insulator115. During its rotation, the plate hooks, for example the drive plate hook on the drive plate331of the open/close pivot shaft326engage the driving plate spring310and toggle the spring from a fully open to fully closed position, or vise versa about the pivot point connector324. As the driving plate spring310is toggled over center in compression, the spring releases compression and rotates the linkage plate330to open (clockwise) or close (counter-clockwise) the open/close circuit linkage364. Accordingly, as the linkage plate330rotates clockwise, the lead linkage arm362that is attached to the linkage plate330at pivot point306goes up pulling the contact linkage360down via the pivot point328(seeFIG.4B) at the open/close indicator shaft325. In this way, the dynamic contact lead screw215opens or otherwise separates the dynamic electrical contact212from the static electrical contact210causing the vacuum switch105to be in an ‘open’ state. The motion of the linkage plate330is toggled by the driving plate spring310, which is attached to the linkage plate330via pivot point connector324. FIG.4Cis a cross-section of the actuator mechanism300along cutline A-A ofFIG.4Bshowing the internal electrical pathway308depicted in the highly pixelated elements. Except for the labels to more cleanly show cutline A-A,FIG.4Bis identical toFIG.4A. As shown inFIG.4C, the actuator mechanism's internal electrical pathway308includes the dynamic electrical contact312that is connected to the internal electrical busbar314that is connected to the two electrical contact posts320. For reference, a portion of the vacuum bottle assembly200is shown along with the driving plate spring310as well as the open/close indicator shaft325extending to the left. Also, for reference, the open/close pivot shaft326is shown extending to the right, which connects to the spindle118. The other end315of the open/close pivot shaft326connects to a rotating mass375discussed in connection withFIGS.6A-6C. FIGS.5A-5Care line drawings that illustratively depict cross-sectional views of the vacuum switch105consistent with embodiments of the present invention.FIG.5Ais a bottom view of the vacuum switch105with the actuator mechanism down facing cover108, which is removed to provide a view of the inner elements of the actuator mechanism300. A small portion of the vacuum bottle assembly200is shown approximately where the open/closed indicator shaft325extends outwardly from the polycarbonate actuator mechanism housing302. The vacuum switch105is bisected along cutline B-B. This perspective shows the open/close pivot shaft326and one of the electrical contact posts320extending from the actuator mechanism up facing cover109. FIG.5Billustratively depicts the cross-section view of the vacuum switch105along cutline B-B in an open circuit configuration. Like the configuration ofFIG.4A, the linkage plate330is rotated clockwise thereby pulling the dynamic contact lead screw215and dynamic electrical contact212downward in an open position, which halts the flow of energy from the fixed electrical contact210to the electrical contact posts320. As mentioned earlier, this is accomplished by rotating the insulator spindle118by way of manual manipulation or a vacuum switch motor (not shown), which rotates the open/close pivot shaft326in the curved arrow direction232, as shown. The cross-section helps show that when the contact linkage360is pulled down dynamic electrical contact212is pulled away from the fixed electrical contact210thereby creating the gap216that opens the vacuum switch105causing a break in the flow of electricity (assuming everything else is hooked up to the powerline156). The shock absorber compression spring352is decompressed when the dynamic contact lead screw215is pulled down. FIG.5Cillustratively depicts the cross-section view of the vacuum switch105along the cutline B-B in a closed-circuit configuration. Here, the linkage plate330is rotated counterclockwise as shown by arrow334, which pulls the lead linkage arm362downwards thereby pushing the contact linkage360upwards to close the circuit105. Closing the circuit snaps the fixed electrical contact210and the dynamic electrical contact212together216. When the vacuum switch105is actuated in the closed orientation, the fixed electrical contact210and the dynamic electrical contact212tend to collide together with enough force to endanger breaking the contacts210and212or damaging other components within the vacuum bottle arrangement200. Hence, the shock absorber compression spring352compresses to reduce the moving mass and kinetic energy of the mechanism linkage364and dynamic electrical contact212during the closing event. As shown, the driving plate spring310is rotated about pivot pin329, which also can slide within a driving plate spring shaft slot322. Accordingly, when the vacuum bottle contacts210and212are in contact216, electricity can flow between the right terminal pad133and the electrical contact posts320. FIG.5Dis a line drawing illustratively depicting the shock absorber assembly350with the vacuum switch105in the closed position fromFIG.5C. As shown, the copper dynamic contact screw115that is integrated with or optionally a unitary element of the spring compression hub354compresses about one quarter of an inch from the open circuit orientation ofFIG.5B. The shock absorber compression spring352absorbs the shock from the mass of the moving elements within the actuator mechanism300, which close the circuit (210and212) rapidly, thereby preventing damage to the contacts310and312when they shut. In other words, the shock absorber assembly350helps prevent damage to the contacts210and212from colliding together too hard. The shock absorber housing356, which houses the compression spring552and part of the spring compression hub354, is anchored down by way of an anchor strap358. A housing lip356in the shock absorber housing356(called out inFIG.5E) essentially contacts a bearing guide368in the anchor strap358when the shock absorber compression spring352is compressed. FIG.5Eis a line drawing illustratively depicting the shock absorber assembly350with the vacuum switch105in the open position fromFIG.5B. As shown, the copper dynamic contact screw115is uncompressed about one quarter of an inch from the closed-circuit orientation ofFIG.5C. Likewise, the shock absorber housing356is pulled down along the axis208via the contact linkage360. FIGS.6A-6Care line drawings illustratively depicting a rotating mass configuration in the actuator mechanism300, wherein the actuator mechanism down facing cover108(ofFIG.2A) is removed. For purposes of orienting the reader,FIG.6Areferences some previously discussed components, partially obscured by a section plate370, such as portions of the power pathway, which include the flexible busbar312and an electrical contact post320, as well as the lead linkage arm362and the linkage plate330. A portion the vacuum bottle assembly200extending from the top of the actuator mechanism300is also shown. InFIG.6A, the actuator mechanism300is in the open orientation. The key elements here include a rotating mass375that rotates about the indicator shaft pivot point328of the open/close indicator shaft point325. An open toggle compression spring380is attached to the rotating mass375at a pivot end374and is retained at a retention plate378that provides stability for the oppositely located pivot point of the open toggle compression spring382. The open toggle compression spring380regulates or otherwise smooths movement of the rotating mass375. The rotating mass375further includes a torsion spring372at the indicator shaft pivot point328. The rotating mass375is connected to the open/close circuit linkage364to help assist in slowing down the motion of the contacts210and212when closing. FIG.6Bshows the actuator mechanism300in the closed orientation with the lead linkage arm362extending upwards and the rotating mass375rotated counterclockwise. Note that the open toggle compression spring380is pivoted. FIG.6Cis a perspective line drawing of the actuator mechanism300tilted downwards to show the 3-D perspective of the components of the actuator mechanism300. For reference, a portion of the vacuum bottle assembly200is shown. At this angle, it is easily seen that the lead linkage arm362and the other associated components shown inFIG.4Aare sandwiched between the two section plates370A and370B, which are separated by stays386. In this embodiment, the rotating mass375is formed from plurality of plates that are pinned together, as shown. Further, at this angle, the attached open/close indicator106, is attached to the open/close indicator shaft326(hidden), shows the bottom view indicator307and one of the side view visual indicators309. FIGS.7A and7Bare line drawings illustratively depicting the interlocking mechanism for the visual disconnect consistent with embodiments of the present invention. The visual disconnect is the blade arm136that pivots about a blade pivot shaft146in either an open or closed orientation. As shown inFIG.7AandFIG.1A, the blade arm136is up (i.e., connected) and therefore there is no visual break in the vacuum switch105. The visual break alerts an onlooker that the circuit is connected, i.e., the powerline pathway121is closed. An interlock release hook142locks the interlock plate144, and therefore the disconnect blade136, in place. Hence, when the interlock release hook142is locked, the blade arm136will not be able to disconnect or otherwise open even if the disconnect blade ring104is pulled to open the disconnect blade136. The interlock release hook142is tied to the actuator mechanism300and can only open when the vacuum switch105is open. More specifically, the spindle118is connected to the open/close pivot shaft326shown extending from the actuator mechanism up facing cover109inFIG.2C. Accordingly, a vacuum switch motor (not shown) can be made to open and close the vacuum switch105by rotating the rotating spindle118inside of the rotating spindle insulator115, as previously discussed. Because the interlock release hook142is connected to the spindle118of the open/close pivot shaft326, either directly or indirectly through an intermediary element, when the rotating spindle118is rotated so is the interlock release hook142. So, when the spindle118is rotated in an open direction to a fully open position (that opens or otherwise disconnects the vacuum switch105), the interlock plate144is likewise rotated to a fully open position, which unlocks the interlock plate144. This permits the disconnect blade ring104to unlatch the disconnect blade136when pulled by an electrician via a hot stick hook (not shown). FIG.7Billustratively depicts the blade arm136visually disconnecting the power across the underarm vacuum break switch arrangement100. As shown, the rotating spindle118, and hence the interlock release hook142, are rotated 90°, which unlocks the interlock plate144. Other embodiments contemplate different rotational angles being used so long as the interlock release hook142releases the interlock plate144. With the interlock plate144unlocked, the disconnect blade ring104is enabled to release the disconnect blade136. Accordingly, with the interlock plate144unlocked, when the disconnect blade ring104is pulled, a disconnect linkage148inside of the blade arm136, between the first blade arm side136A and the second blade arm side136B, disengages the disconnect blade136. In other words, with the interlock plate144unlocked, pulling the disconnect blade ring104causes the blade arm136to unlock and drop in the disconnected orientation, as shown inFIGS.1B and7B. FIGS.8A-8Care various line drawing views of the release latch148consistent with embodiments of the present invention. With respect toFIG.8A, depicted is a perspective drawing of a portion of the underarm vacuum break switch arrangement100showing the release latch148with the disconnect blade arm136closed or otherwise connected to the release latch148. In this present perspective, the first blade arm side136A is removed to better show the components of the release latch148, wherein only the second blade arm side136B is shown. In this arrangement, the rotating spindle118is rotated in the open position119, which opens the interlock release hook142thereby releasing or unlocking the interlock plate144. As mentioned earlier, with the interlock plate144unlocked, the release latch148is enabled to release the disconnect blade arm136in the open orientation. The release latch148is located approximately where the voltage sensor120connects to the powerline pathway121. When latched, the release latch148generally comprises a first cam latch180that hooks on a second cam latch182wherein the second cam latch182hooks onto a latch retaining bar184that is integrated with the left terminal130. The disconnect blade ring104is integrated with the first cam latch180, as shown. A latch spring186is connected to the first and second cam latch180/182, which biases the second cam latch182in the retained position on the latch retaining bar184. FIG.8Bis a side view line drawing of the portion of the underarm vacuum break switch arrangement100showing the release latch148with the disconnect blade arm136closed and connected to the release latch148as shown inFIG.8A. When the disconnect blade ring104is pulled in the pulling direction190, such as with a hot stick from below the underarm vacuum break switch arrangement100, the first cam latch180is rotated counterclockwise as shown by the arrow188. By rotating the first cam latch180counterclockwise188, the second cam latch182rotates clockwise, which unlatches the second cam latch finger185from the latch release bar184. As previously mentioned, only the second blade arm side136B is shown to better reveal the release latch components148. FIG.8Cillustratively depicts the disconnect blade arm136in the open orientation after the disconnect blade ring104has been pulled. As shown, the disconnect blade arm136is partially hanging downward via the hinge135, which produces the air gap137that visibly shows electrical break in the underarm vacuum break switch arrangement100. As depicted, the second cam latch182is in rotated in an unlatched orientation (via the first cam latch180) wherein the second cam latch finger185is retracted (causing the release from the latch retaining bar184). With the present description in mind, below are some examples of certain embodiments illustratively complementing some of the methods and apparatus embodiments discussed above and presented in the figures to aid the reader. The elements called out below are provided by example to assist in the understanding of the present invention and should not be considered limiting. The reader will appreciate that the below elements and configurations can be interchangeable within the scope and spirit of the present invention. In that light, one inventive aspect of the present invention that is generally directed to a visual air gap137formed when a disconnect blade136is opened, as mainly depicted inFIGS.1A-1D and7A-7Bthough features and characteristics of the present embodiment are shown in all the other figures, contemplates an underarm vacuum break switch arrangement100as shown inFIG.1Athat generally includes a stationary post insulator114and a rotating spindle insulator115that are both connected to a phase base cross bar116. The underarm vacuum break switch arrangement100is configured to connect two overhead powerlines156A and156B, seeFIG.1D, via a powerline pathway121ofFIG.1C. In this embodiment, the powerline pathway121includes a first powerline connector128that is connected to the first overhead powerline156A via a powerline bypass junction162, a second powerline connector130that is connected to the second overhead powerline156B via another powerline bypass junction162, a vacuum switch105and a disconnect blade136. As discussed above, there are other components that obviously make up the powerline pathway121, such as the left terminal130and the right sensor clamp132, the disconnect blade busbar140, etc., as shown inFIG.1A-1C. As shown inFIG.1C, the stationary post insulator114, the rotating spindle insulator115and the phase base cross bar116are not along the powerline pathway121, which should be appreciated because in order for the underarm vacuum break switch arrangement100to switch electricity off along the powerline156at the powerline bypass158, no electricity can bypass the powerline pathway121when it is broken, which by definition means that there is no electrical continuity between the powerline bypass junctions162. The vacuum switch105hangs from the phase base cross bar116via the stationary post insulator114and the rotating spindle insulator118, meaning that the vacuum switch105is vertically below the phase base cross bar116and hangs means that the phase base cross bar116is largely holding the vacuum switch105in place above the ground. The disconnect blade136generally includes a disconnect latch104that when in a latched state, there is electrical continuity between the vacuum switch105and the second powerline connector130via the disconnect blade136(or more specifically between the powerline bypass junctions162), as shown inFIGS.1A and1C. However, when the disconnect latch104is in an unlatched state there is electrical discontinuity between the vacuum switch105and the second powerline connector130(or more specifically between the powerline bypass junctions162) via an airgap137(FIG.1B) from the disconnected blade136that at least partially hangs, and in this case completely hangs (due to gravity) from a hinge135, which in this embodiment is an axle pinning the disconnect blade136to a hanger extending downwards from the disconnect blade busbar140, but the hinge135can easily be a number of different hinge arrangements known to those in the mechanical art. The underarm vacuum break switch arrangement100embodiment can be further envisioned, wherein the stationary post insulator114and a rotating spindle insulator115are parallel, which is shown in the embodiments herein, but could be at angles as long as the inner rotating spindle118of the rotating spindle insulator115is made operable to rotate the open/close pivot shaft326ofFIG.4C. The underarm vacuum break switch arrangement100embodiment is further envisioned, wherein the underarm vacuum break switch arrangement100is mounted to a utility pole155above the ground. A powerline pole155as envisioned herein can be a single pole, a pilon, such as a triangular pilon with crossbars, or any structure intended to hold up powerlines156—generically used herein as “pole”. In this embodiment, the powerline pathway121is between the phase base cross bar116and the ground, as shown inFIG.1D. The phase base cross bar116is essentially horizontal. The underarm vacuum break switch arrangement100embodiment is further envisioned, wherein the disconnect latch104is a hot stick ring (or some other looped structure) that can accommodate a hot stick hook at the distal end of the hot stick used by an electrical technician to pull on the hot stick ring. The underarm vacuum break switch arrangement100embodiment can further comprise a current and voltage sensor110and voltage only sensor120. The current and voltage sensor110(shown inFIG.1Aas angled) is connected to the phase base cross bar116and the powerline pathway121between the first powerline connector (right terminal)128and the vacuum switch105. The voltage only sensor120is connected to the base cross bar116and the powerline pathway121between the second powerline connector (left terminal)130and the disconnect blade136. The underarm vacuum break switch arrangement100can further comprise an interlock release hook142connected to a rotating pivot shaft326, which extends upward from the vacuum switch105. The rotating pivot shaft326is connected to an actuator linkage assembly364(in the actuator mechanism300) on a first end315and a rotating spindle118inside of the rotating spindle insulator115on a second end316, seeFIG.4C. The actuator linkage assembly364is configured to drive a dynamic contact212in contact with a static contact210to be in a closed orientation (i.e., electrically closed forming electrical continuity between the dynamic contact212and the static contact210, as shown inFIGS.3A and3B) via the rotating pivot shaft326when the rotating spindle118is rotated119in a first position (e.g., when the rotating spindle118is rotated119clockwise). The dynamic contact212is not in contact (i.e., disconnected) from the static contact210when in an open orientation when the rotating spindle118is rotated in a second position (e.g., when the rotating spindle118is rotated119counterclockwise). Notably, the powerline pathway221further comprising the static contact210and the dynamic contact212that when in the open orientation, the powerline pathway121is broken (i.e., no continuity within the vacuum switch105) and when in the closed orientation, the powerline pathway121is intact (i.e., closed with continuity within the vacuum switch105). The interlock release hook142retains or otherwise locks the disconnect blade136in the latched state when in the closed orientation, which prevents an electrical technician from releasing the disconnect blade136. The interlock release hook142does not retain/lock the disconnect blade136in the unlatched state when in the open orientation. Hence, an electrical technician sees that the vacuum switch105is open by way of the open/close indicator106, which in one embodiment is a green signal, before they pull down on the disconnect blade ring104to unlatch the disconnect blade136. When the disconnect blade136is dangling from the hinge135, the electrical technician can be sure that there is no electrical continuity in the powerline bypass158due to the noticeably large air gap from the hanging disconnect blade136, shown inFIG.1B. The static contact210and the dynamic contact212are in a vacuum bottle220as shown inFIGS.4A and4B. The underarm vacuum break switch arrangement100embodiment can further comprise an interlock release hook142connected to a rotating shaft326and118that passes through the rotating spindle insulator115and into the vacuum switch105. The vacuum switch105has an open orientation that breaks (continuity in) the powerline pathway121when the rotating shaft326and118is in a first rotational position. The vacuum switch105has a closed orientation, which does not break (electrical continuity in) the powerline pathway121when the rotating shaft326and118is in a second rotational position. The interlock release hook142is configured to retain the disconnect blade136in the latched state when in the closed orientation. The interlock release hook142is also configured to retain the disconnect blade136in the fully open orientation when in the unlatched and open state. In another embodiment of the present invention involving an airgap137that is formed by an open disconnect blade136, as generally shown inFIGS.1A-1D and7A-7B, contemplates a powerline break switch arrangement100generally comprising a powerline pathway121that is configured to provide electrical continuity between a first overhead powerline156A and a second overhead power line156B. The powerline pathway121is defined by a plurality of components, or simply “components” comprising (among other elements) a vacuum switch105, a disconnect blade136, a first powerline connector (right connector ofFIG.1A)128that is configured to connect to the first overhead powerline156A and a second powerline connector130that is configured to connect to the second overhead powerline156B. The powerline break switch arrangement100further comprises a stationary post insulator114and a rotating spindle insulator115that are connected to and interposed between a cross bar116and the components. The cross bar116is insulated from the powerline pathway121via the stationary post insulator114and a rotating spindle insulator115, in order to isolate the powerline pathway121from being bypassed along the cross bar116. When the powerline break switch arrangement100is mounted to a utility pole155, the cross bar116is further away from the ground than the components. In this embodiment, the vacuum switch105and the second powerline connector130are electrically connected when the disconnect blade136is in a latched orientation, that is when it is “up” and connected as shown inFIG.1A. In the alternative, the vacuum switch105and the second powerline connector130are electrically disconnected when the disconnect blade136is in an unlatched orientation and at least partially hanging from a hinge135, as depicted inFIG.1B. The powerline break switch arrangement100embodiment further envisions that when in the unlatched orientation, there is an air gap137between the second powerline connector130and the vacuum switch105. The air gap137is visible to an onlooker (i.e., anyone looking up at the powerline break switch arrangement100) from below the powerline break switch arrangement100when the powerline break switch arrangement100is mounted to the utility pole155. The powerline break switch arrangement100embodiment is contemplated to further comprise a disconnect latch182that cooperates with the disconnect blade136(i.e., bolted to and actuates the disconnect blade136that when the disconnect latch182is unfastened, the disconnect blade136is in the unlatched orientation and when the disconnect latch182is fastened, the disconnect blade136is in the latched orientation. This assumes that the embodiment either does not include the interlock release hook142or the interlock release hook142has been moved to unlock the disconnect blade136. Certain other embodiments envision that if the interlock release hook142is not in an open orientation then the disconnect latch182cannot be pulled or otherwise actuated. In certain embodiments, the disconnect latch182is configured to be unfastened with an electrical hot stick that is used by an electrical technician. The powerline break switch arrangement100embodiment is contemplated to further comprise an interlock release hook142connected to a rotating shaft326and118, wherein the rotating shaft326and118passes through the rotating spindle insulator115and into the vacuum switch105. The vacuum switch105has an open orientation that breaks, or otherwise disrupts, electrical continuity in the powerline pathway121when the rotating shaft326and118is in a first rotational position. The vacuum switch105has a closed orientation, which does not break the electrical continuity in the powerline pathway121when the rotating shaft326and118is in a second rotational position. The interlock release hook142is configured to lock the disconnect blade136in the latched state when in the closed orientation, but it does not retain the disconnect blade136in the latched state when in the open orientation. A motor (not shown) can be further added to this arrangement to rotate119the rotating shaft326and118in the first or the second rotational positions. The motor being connected to the rotating spindle insulator115via a spindle motor mount176located at a top side172of the cross bar116that is obverse to a bottom side174of the crossbar116wherein the rotating spindle insulator115extends towards the components. Yet another embodiment of the of the present invention involving an airgap137that is formed by an open disconnect blade136, as generally shown inFIGS.1A-1D and7A-7B, contemplates a method that includes providing a powerline break switch arrangement100comprising a powerline pathway121that provides electrical continuity between a first overhead powerline156A and a second overhead power line156B. The powerline pathway121is defined by components comprising a vacuum switch105, a disconnect blade136, a first powerline connector128and a second powerline connector130. The first powerline connector128is configured and arranged to connect to the first overhead powerline156A (via electrical bypass lines164and powerline bypass junctions162) and the second powerline connector130is configured to connect to the second overhead powerline156B. The powerline break switch arrangement100further comprises a stationary post insulator114and a rotating spindle insulator115, which are connected to a cross bar116and the components. The stationary post insulator114and the rotating spindle insulator115are interposed between the cross bar116and the components. The cross bar116is insulated from the powerline pathway121via the stationary post insulator114and a rotating spindle insulator115. The method continues with the step for mounting the powerline break switch arrangement100to a utility pole155with the cross bar116being further away from the ground than the components. Once electricity is running through the powerline break switch arrangement100, the flow of electricity can be halted by electrically disconnecting the vacuum switch105from the second powerline connector130, which is accomplished by moving the disconnect blade136from a latched orientation to an unlatched orientation. The unlatched orientation can be viewed from the ground by the air gap137created when the disconnect blade136is dangling from the powerline break switch arrangement100. The method embodiment is contemplated to further comprise disengaging a release latch148when initiating the moving step. The release latch148is on a first end165of the disconnect blade136and a hinge135on a second end165of the disconnect blade136(as shown inFIG.7B). The release latch148holds the disconnect blade136in line, i.e., in electrical continuity, with the powerline pathway121when the vacuum switch105is closed or otherwise has electrical continuity across the contacts210and212. The method embodiment is contemplated to further comprise disengaging the release latch148by pulling down on a disconnect ring104that is coupled to the release latch148via a hot stick (not shown). The method embodiment is further contemplates viewing an air gap137from below the powerline break switch arrangement100when the disconnect blade136is hanging from the hinge135after the moving step. The method embodiment further contemplating providing an interlock release hook142that is connected to a rotating shaft326and118. The rotating shaft326and118passes through the rotating spindle insulator115and into the vacuum switch105. Yet other embodiments of the present invention contemplate a vacuum bottle insulator used to electrically insulate a vacuum bottle220, as mainly depicted inFIGS.3A-3B, though features and characteristics of the present embodiment are shown in all the other figures. Accordingly, this aspect of the invention contemplates an overhead power line vacuum switch100that generally comprises a vacuum bottle arrangement200that includes a vacuum bottle220containing a fixed electrical contact210and a dynamic electrical contact212. The vacuum bottle220has a tubular member232that extends between a fixed contact end228and a dynamic contact end230. At least 75% of the tubular member232is encapsulated in a urethane insulator222. A rigid fiberglass shell226is sandwiched between an outer vacuum bottle silicone overmold202and the urethane insulator222. The dynamic electrical contact212is fixedly attached to an actuator300that is configured to drive the dynamic electrical contact212in either an open state or a closed state with the fixed electrical contact210, wherein the open state is when the dynamic electrical contact212is spaced apart from the fixed electrical contact210and the closed state is when the dynamic electrical contact212is in contact with the fixed electrical contact210. The overhead power line vacuum switch embodiment100further imagines that the outer vacuum bottle silicone overmold202includes a plurality of ice-and-water sheds204that are concentrically disposed around a vacuum bottle assembly axis208that runs axially though the vacuum bottle arrangement200. This could further be where the outer vacuum bottle silicone overmold202and the plurality of ice-and-water sheds204are a single molded element. In another embodiment, the vacuum bottle220comprises the vacuum bottle 3-ply housing233that encircles a vacuum region224radially as defined by the vacuum bottle assembly axis208. In this embodiment, the vacuum bottle 3-ply housing233consists of the urethane insulator222, the rigid fiberglass shell226, and the outer vacuum bottle silicone overmold202. The vacuum region224is in the vacuum bottle220. The overhead power line vacuum switch embodiment100further imagining the urethane insulator222covering a portion of both ends234and236of the vacuum bottle220. The overhead power line vacuum switch embodiment100further envisioning that the vacuum bottle arrangement200is anchored to the right terminal pad133via a fixed contact lead screw214that is screwed into the fixed electrical contact210. The overhead power line vacuum switch embodiment100further envisioning that the dynamic electrical contact212is fixedly attached to a driving linkage360in the actuator300via a dynamic contact lead screw215. The overhead power line vacuum switch embodiment100further comprising an aluminum mounting channel206that is connected to the vacuum bottle arrangement200at the fixed contact end228, the urethane insulator222, the rigid fiberglass shell226and the outer vacuum bottle silicone overmold202butt up against or otherwise terminate at the aluminum mounting channel206. The overhead power line vacuum switch embodiment100further envisioning that the vacuum bottle220is composed of porcelain ceramic. Other embodiments of a vacuum bottle insulator used in an overhead power line vacuum switch100, which are mainly depicted inFIGS.3A-3B, envision a vacuum bottle arrangement200comprising a vacuum bottle220arranged with a tubular portion232extending along an axis208between a vacuum bottle stationary end234and a vacuum bottle dynamic end236, which are in an internal vacuum chamber224. The vacuum bottle arrangement200has a fixed electrical contact210extending into the internal vacuum chamber224from the vacuum bottle stationary end234and a dynamic electrical contact212extending into the internal vacuum chamber224from the vacuum bottle dynamic end236. The tubular portion232that is surrounded by a urethane insulator222is at least partially surrounded by a rigid shell226that is at least partially surrounded by a vacuum bottle silicone overmold202. Accordingly, electricity is configured to flow through the fixed electrical contact210and the dynamic electrical contact212when the dynamic electrical contact212is moved into contact with the fixed electrical contact210. The vacuum bottle arrangement200further envisions the vacuum bottle overmold (ice-and-water shield)202being silicone. The vacuum bottle arrangement200further envisions the rigid shell226being fiberglass. The vacuum bottle arrangement200further envisions an embodiment wherein only the urethane insulator222, the rigid shell226and vacuum bottle silicone overmold202surround the tubular portion232. The vacuum bottle arrangement200further envisions that the vacuum bottle220, the urethane insulator222, the rigid shell226and vacuum bottle silicone overmold202are insulators that essentially prevent the flow of electricity therethrough. In this way, when the contacts210and212are disconnected, there is a break in the flow of electricity. The vacuum bottle arrangement200further envisions that the urethane insulator222covers a portion of the vacuum bottle stationary end234and the vacuum bottle dynamic end236. In the vacuum bottle arrangement200, the vacuum bottle220can be porcelain ceramic. The vacuum bottle arrangement200can further comprise a plurality of ice-and-water sheds204that concentrically extend outwardly from the vacuum bottle silicone overmold202. Still, another embodiment of a vacuum bottle insulator used to prevent the flow of electricity across the ends of a vacuum bottle switch200envisions a method directed to a vacuum bottle switch200that includes a vacuum bottle220arranged with a tubular portion232extending along an axis208between a vacuum bottle stationary end234and a vacuum bottle dynamic end236, the vacuum bottle220comprising an internal vacuum chamber224, the vacuum bottle switch200defined between a first end228and a second end230. The method includes a step for flowing electricity between the first end228and the second end230through a fixed electrical contact210and a dynamic electrical contact212when electrically connected. The fixed electrical contact210extends into the internal vacuum chamber224from the first end228and a dynamic electrical contact212extends into the internal vacuum chamber224from the second end230. A step for halting the flow of the electricity through the fixed electrical contact210and the dynamic electrical contact212is accomplished by separating the fixed electrical contact210and the dynamic electrical contact212. The vacuum bottle switch arrangement200comprises an insulating vacuum bottle switch housing200that prevents essentially/virtually any of the electricity from flowing between the first end228and the second end230when the fixed electrical contact210and the dynamic electrical contact212are separated. The vacuum bottle silicone overmold202surrounds the tubular portion232by a urethane insulator222that is at least partially surrounded by a rigid shell226that is at least partially surrounded by a vacuum bottle silicone overmold202. The method embodiment contemplates that the vacuum bottle silicone overmold202is silicone and the rigid shell226is fiberglass. On aspect of the method embodiment contemplates that only the urethane insulator222, the rigid shell226and vacuum bottle silicone overmold202surround the tubular portion232. Another inventive aspect of the present invention is directed to a shock absorber350that is inside of the mechanical actuator300. The shock absorber350is used to reduce the moving mass and kinetic energy of the mechanism linkage and dynamic electrical contact212during the closing event in the vacuum switch105, as mainly depicted inFIGS.5A-5E, though features and characteristics of the present embodiment are shown in all the other figures. Accordingly, this aspect of the invention contemplates a power line vacuum switch105comprising a vacuum bottle switch200that includes a fixed electrical contact210and a dynamic electrical contact212(as shown inFIGS.3A and3B) that is connected to a vacuum bottle switch actuator300, which includes an open/close circuit linkage364that is connected to the dynamic electrical contact212via a dynamic contact lead screw215and shock absorber assembly350. The shock absorber350generally comprises a housing356with a shock absorber housing cover342and a shock absorber housing port355that is opposite to the shock absorber housing cover342, a shock absorber compression spring352disposed inside of the housing356and connected to the shock absorber housing cover342, wherein the open/close circuit linkage364is connected to the shock absorber housing cover342outside of the housing356. The power line vacuum switch100has an open orientation with the shock absorber compression spring352in an uncompressed state when the dynamic electrical contact212is separated from the fixed electrical contact210and a closed orientation with the shock absorber compression spring352in a compressed state when the dynamic electrical contact212is connected to the fixed electrical contact210. The open/close circuit linkage364is spaced closer to the fixed electrical contact210in the closed orientation as compared to the open orientation. The shock absorber compression spring352, the shock absorber housing cover342, the fixed electrical contact210, the dynamic electrical contact212, and the shock absorber housing port355are symmetric about a vacuum bottle assembly axis208. The power line vacuum switch embodiment105is further envisioned wherein the dynamic contact shaft250comprises a spring compression hub354and a stop flange345, the spring compression hub354is configured to slide in and out of the shock absorber housing port355and the stop flange345is captured within the housing356. The power line vacuum switch embodiment105contemplates that the shock absorber compression spring352has a higher spring compressive force when in the closed orientation than when in the open orientation. The power line vacuum switch embodiment105contemplates that the shock absorber compression spring352is configured to reduce the moving mass and kinetic energy of the mechanism linkage and dynamic electrical contact212when the dynamic electrical contact212moves from the open orientation to the closed orientation. The power line vacuum switch embodiment105envisions that the open/close circuit linkage364connects to the shock absorber housing356via a housing-linkage extension arm365. The open/close circuit linkage364can connect to the housing-linkage extension arm365at a housing-linkage pivot point366. The power line vacuum switch embodiment105further envisioning that the shock absorber housing356is configured to move along the axis208between the open orientation and the closed orientation. In yet another a shock absorber embodiment350of a vacuum switch arrangement105, a vacuum switch actuator300can comprise a linkage364that drives a dynamic contact lead screw215closer to a vacuum bottle assembly200when in a first position than when in a second position. The dynamic contact lead screw215is fixedly connected to a dynamic electrical contact212that electrically connects to a fixed electrical contact210only when in the first position. A shock absorber compression spring352is interposed between the linkage364and the dynamic contact lead screw215, wherein the dynamic electrical contact212comprises higher resistance from the shock absorber compression spring352when in the first position compared with the second position. When in the first position, the dynamic electrical contact212and the fixed electrical contact210are electrically connected inside of a vacuum bottle220. The vacuum switch actuator embodiment300envision that the shock absorber compression spring352can optionally be a coil spring, wherein the shock absorber compression spring352, the shock absorber housing356, the fixed electrical contact210, the dynamic electrical contact212, and a shock absorber housing port355, which accommodates the dynamic contact shaft250, are symmetric about an axis208. The vacuum switch actuator embodiment300further envision that the dynamic contact shaft250could comprise a spring compression hub354and a stop flange345, the spring compression hub354can be configured to slide in and out of a shock absorber housing port355, the stop flange345can be captured within the housing356. In one option, the dynamic contact lead screw215and the spring compression hub354are a single piece of material. The vacuum switch actuator embodiment300envisions that the linkage364connects to the shock absorber housing356via a pivot point366in a housing-linkage extension arm365. The vacuum switch actuator embodiment300envisions that the shock absorber housing356slidingly engages an anchor strap358, which limits movement of the shock absorber housing356along the axis208. The vacuum switch actuator embodiment300envisions that the shock absorber compression spring352is configured to reduce the moving mass and kinetic energy of the mechanism linkage and dynamic electrical contact212when the dynamic electrical contact212moves from the second position to the first position. Still, another embodiment of the present invention using a shock absorber350in a method to reduce the moving mass and kinetic energy of the mechanism linkage and dynamic electrical contact212when the contact between a fixed electrical contact210and a dynamic electrical contact212meet inside of a vacuum bottle220. The method can comprise a step for moving the dynamic electrical contact212from an open orientation to a closed orientation relative to the fixed electrical contact210via an open/close circuit linkage364, wherein the closed orientation is when the fixed electrical contact210is connected to the dynamic electrical contact212. A step for resisting the moving step via a shock absorber compression spring352that is interposed between a dynamic contact lead screw215, which is connected to the dynamic electrical contact212and a shock absorber housing cover342. The dynamic contact lead screw215cooperates with the shock absorber compression spring352during the resisting step. The method embodiment further contemplates that the shock absorber compression spring352is compressed during the resisting step. The method embodiment further contemplates that the shock absorber compression spring352is inside of a shock absorber housing356. The shock absorber housing356comprises a dynamic contact shaft port355at a first end and the shock absorber housing cover342at a second end. This can further comprise sliding the dynamic contact lead screw215through the dynamic contact shaft port355along a common axis208. This could also comprise the shock absorber compression spring352, the dynamic contact shaft port355, the fixed electrical contact210, the dynamic electrical contact212, and the dynamic contact shaft250being symmetric about an axis208. Another inventive aspect of the present invention is generally directed to a rotational mass375that is inside of the mechanical actuator300, which is used to slow down the closing event in the vacuum switch105. Embodiments of the rotation mass375in a mechanical actuator300is mainly depicted inFIGS.5A-5C and6A-6C, though features and characteristics of the present embodiment are shown in all the other figures. Accordingly, this aspect of the invention contemplates a power line vacuum switch105comprising a vacuum bottle switch200that includes a fixed electrical contact210and a dynamic electrical contact212(as shown inFIGS.3A and3B) that is connected to a vacuum bottle switch actuator300, which includes an open/close circuit linkage364that is connected to the dynamic electrical contact212via a dynamic contact lead screw215. The power line vacuum switch105in an open orientation when the dynamic electrical contact212is separated from the fixed electrical contact210and in a closed orientation when the dynamic electrical contact212is contacting the fixed electrical contact210. The power line vacuum switch105further comprises an indicator shaft325that cooperates with the open/close circuit linkage364(e.g., the indicator shaft325is connected to the linkage364at the indicator shaft pivot point328), wherein the open/close circuit linkage364is configured to pivot in a first direction332about the indicator shaft325, which moves the dynamic electrical contact212in the open orientation, and pivot in a second direction334that is opposite the first direction, which moves the dynamic electrical contact212in the closed orientation. A rotating mass375, also connected to the indicator shaft325in a pivoting relationship (meaning the rotating mass375pivots about the indicator shaft325at pivot point328), is configured to rotate, which resists the movement of the dynamic electrical contact212when transitioning from the open orientation to the closed orientation due to the inertia required to move the mass. This slows down the electrical contacts210and212when they make contact. The power line vacuum switch105embodiment can further comprise an open toggle compression spring380that stabilizes rotation of the rotating mass375, e.g., keeping the mass aligned and from wobbling. The open toggle compression spring380also is used to keep the dynamic vacuum bottle lead screw215in the open position while the linkage plate330and driving plate spring310are in the traveling position somewhere between fully open and fully closed. The power line vacuum switch105embodiment further includes the fixed electrical contact210and the dynamic electrical contact212being in a vacuum bottle220. As mentioned earlier, the rotating mass375is configured to resist the movement of the dynamic electrical contact212when commencing transitioning from the open orientation to the closed orientation. In addition, the rotating mass375is configured to cooperate with a shock absorber assembly350(ofFIGS.5D and5E), which reduces the moving mass and kinetic energy of the mechanism linkage and dynamic electrical contact212during the transition from the open orientation to the closed orientation. The power line vacuum switch105embodiment can further be envisioned, wherein the open/close circuit linkage364comprises an indicator shaft linkage363linked to a lead linkage arm362at a first end361and to a contact linkage360at a second end359, the indicator shaft linkage363is connected to the indicator shaft325in a pivoting relationship (i.e., rotating/moving around a pivot point). Furthermore, the lead linkage arm362and the contact linkage360are configured to essentially move in opposite directions when the rotating mass375rotates. The power line vacuum switch105embodiment is further configured to connect with a first power line156A and a second power line156B, the first power line156A is electrically connected to the second power line156B when the dynamic electrical contact212and the fixed electrical contact210are in the closed orientation. In yet another rotational mass375embodiment used in the vacuum bottle switch actuator300, a vacuum switch arrangement105is envisioned to be operable with a power line vacuum switch100, the vacuum switch arrangement105comprising a fixed electrical contact210and a dynamic electrical contact212disposed in a vacuum bottle220. The vacuum bottle switch actuator300is configured and arranged to move the dynamic electrical contact212from an open orientation, where the dynamic electrical contact212is spaced apart from the fixed electrical contact210to a closed orientation, where the dynamic electrical contact212is in contact with the fixed electrical contact210. The rotating mass375and a linkage360and361are both pivotally connected to an indicator shaft325. The linkage360and361is configured to move the dynamic electrical contact212from the open orientation to the closed orientation and the rotating mass375is configured to slow the movement of the dynamic electrical contact212when going from the open orientation to the closed orientation, which occurs when the indicator shaft325is rotated in a first direction334. The power line vacuum switch105embodiment further contemplates the dynamic contact lead screw215being connected to a shock absorber assembly350. The power line vacuum switch105embodiment further contemplates the power line vacuum switch100being connected to a first power line156A and a second power line156B. The first power line156A is electrically connected to the second power line156B when the dynamic electrical contact212and the fixed electrical contact210are in the closed orientation. The power line vacuum switch105embodiment further contemplates the shock absorber assembly350being configured to assist the rotating mass375in slowing down the dynamic electrical contact212when (the dynamic electrical contact212) moving from the open orientation to the closed orientation. The power line vacuum switch105embodiment further includes the fixed electrical contact210and the dynamic electrical contact212are in a vacuum bottle220. The power line vacuum switch105embodiment further contemplates the linkage360and361being configured to pivot in a second direction that is opposite the first direction, which moves the dynamic electrical contact212in the open orientation. The power line vacuum switch105embodiment further contemplates an open toggle compression spring380stabilizing rotation of the rotating mass375. Another embodiment of the present invention contemplates using a rotational mass375in a method for slowing down a dynamic electrical contact212when contacting a fixed electrical contact210inside of a vacuum bottle220. The method comprises a step for moving the dynamic electrical contact212from an open orientation when spaced apart from the fixed electrical contact210to a closed orientation when the dynamic electrical contact212is in contact with the fixed electrical contact210. During the moving step, a linkage360and361is rotated in a vacuum bottle switch actuator300about an indicator shaft325from a first position to a second position. The moving step is slowed down via a rotating mass375that is fixedly attached to the indicator shaft325. The method embodiment provides that the vacuum bottle switch actuator300and the vacuum bottle220are included in a power line vacuum switch100. Aspects of the method embodiment envision the dynamic electrical contact212being resisted by the rotating mass375more when initially commencing the moving step than when just before completing the moving step. The rotating mass375can further cooperate with a shock absorber assembly350to slow the moving step. The shock absorber assembly350(ofFIGS.5D and5E) resist the moving step more just before completing the moving step than when initially commencing the moving step. The method embodiment further comprises a step for stabilizing the slowing down step with an open toggle compression spring380cooperating with the rotating mass375. Another inventive aspect of the present invention is generally directed to an open/close indicator106that visually shows an onlooker that the vacuum switch105has continuity (is live), as mainly depicted inFIGS.1A,2A-2Dthough features and characteristics of the present embodiment are shown in all the other figures, contemplates a power line vacuum switch105comprising a vacuum bottle switch200and a vacuum bottle switch actuator300. The vacuum bottle switch200includes a fixed electrical contact210and a dynamic electrical contact212, as shown inFIGS.3A and3B. The vacuum bottle switch actuator300includes a linkage assembly364that is configured to drive the power line vacuum switch105in an open orientation defined when the dynamic electrical contact212is separated from the fixed electrical contact210and in a closed orientation when the dynamic electrical contact212is contacting the fixed electrical contact210. The power line vacuum switch105further includes an indicator shaft325that extends orthogonally from the linkage assembly364(seeFIG.4C), wherein the indicator shaft325is rotated in a first position when in the open orientation and in a second position when in the closed orientation. The indicator shaft325is rotated in the first and the second positions via the linkage assembly364. An open/close indicator106is attached to the indicator shaft325, covering a shaft distal end324of the indicator shaft325. The open/close indicator106is configured to visibly show when the power line vacuum switch105is in the open orientation via the indicator shaft being rotated in the first position or the closed orientation when the indicator shaft325is rotated in the second position. The power line vacuum switch105embodiment can be further envisioned, wherein the open/close indicator106comprises an indicia that is a first color, which in one embodiment can be green, indicating the open orientation and a second color, which can be red, indicating the closed orientation. The power line vacuum switch105embodiment can be further envisioned comprising an actuator housing302that houses the vacuum bottle switch actuator300, wherein the indicator shaft325extends outside of the actuator housing302. This can further be wherein the open/close indicator106is cylindrically shaped with an indicator distal surface315extending away from the actuator housing302, an indicator proximal side266facing the actuator housing302and an indicator side surface270between the indicator proximal side266and the indicator distal surface268, the open/close indicator106comprises a bottom view indicia307visible on the indicator distal surface268that indicates when the power line vacuum switch105is in the open orientation or the closed orientation. Optionally, the indicator side surface270can comprise a side view indicia309that an electrical technician can see if up on the electrical pole155or on a ladder at, or near, the level of the power line vacuum switch105. As further shown inFIG.1D, the indicator distal surface268faces downwards when the power line vacuum switch105is connected to a powerline156. With more specificity to the embodiment ofFIG.2D, the open/close indicator106comprises an indicator distal surface window262in the indicator distal surface268through which the bottom view indicia307is viewable and an indicator side surface window264in the indicator side surface270through which the side view indicia309is viewable, the indicia307and309are configured to rotate with the indicator shaft325. In yet another open/close indicator embodiment106a vacuum switch arrangement105can comprise a fixed electrical contact210and a dynamic electrical contact212disposed in a vacuum bottle220. A linkage assembly364that is inside of a vacuum bottle switch actuator300, moves the dynamic electrical contact212from an open orientation, where the dynamic electrical contact212is spaced apart from the fixed electrical contact210, to a closed orientation, where the dynamic electrical contact212is in contact with the fixed electrical contact210. An indicator shaft325is connected to and extends orthogonally from the linkage assembly364. The indicator shaft325is configured to rotate256between a first position and a second position via the linkage assembly364, wherein the open orientation corresponds to the indicator shaft325being in the first position and the closed orientation corresponds to the indicator shaft325in the closed position. An open/close indicator106is attached to the indicator shaft325, wherein the open/close indicator106visibly displays an open orientation indicia254when the indicator shaft325is in the first position and a closed orientation indicia252when the indicator shaft325is in the second position. The vacuum switch arrangement105embodiment can be further envisioned, wherein the open orientation indicia254is green and the closed orientation indicia252is red. In another configuration, the vacuum switch arrangement105embodiment is further envisions the open/close indicator106further comprising an indicator housing265that is defined by cylindrical side surface270that extends between a housing proximal side266and a housing distal side268, wherein the housing proximal side266faces the vacuum bottle switch actuator300. There can be at least one distal surface window262in the housing distal side268and at least one side surface window264in the housing side surface270. In this embodiment, an indicator hub350can be arranged to fit inside of the indicator housing265in a rotating relationship, wherein the indicator hub350can include at least one bottom view visual indicator307that lines up with a side view visual indicator309. This can further be wherein the at least one bottom view visual indicator307is viewable through the at least one distal surface window262and the side view visual indicator309is viewable through the at least one side surface window264. And/or, the indicator hub350can be attached to a shaft distal end324of the indicator shaft325. In one configuration, the indicator hub350is captured in the indicator housing265. In yet another configuration, the housing distal surface268faces downwards when the power line vacuum switch105is connected to a powerline156, so that an onlooker can see if the vacuum switch105is live before attempting to open the disconnect blade136with a hot stick (not shown). Certain aspects of yet another open/close indicator embodiment106envision a method of using a vacuum switch arrangement105having a fixed electrical contact210and a dynamic electrical contact212disposed in a vacuum bottle220, a linkage assembly364that is inside of a vacuum bottle switch actuator300, an indicator shaft325connected to and extending orthogonally from the linkage assembly364, and an open/close indicator106attached to the indicator shaft325. The method envisions moving the dynamic electrical contact212from an open orientation, where the dynamic electrical contact212is spaced apart from the fixed electrical contact210, to a closed orientation, where the dynamic electrical contact212is in contact with the fixed electrical contact210(seeFIGS.3A and3B). This moving step will cause the indicator shaft325to rotate about an axis272between a first position and a second position via the linkage assembly364. The open orientation corresponds to the indicator shaft325being in the first position and the closed orientation corresponds to the indicator shaft325being in the closed position. Once rotated, the open/close indicator embodiment106visibly displays an open orientation indicia254when the indicator shaft325is in the first position and a closed orientation indicia252when the indicator shaft325is in the second position. The method embodiment further contemplates that the indicator shaft325is fixedly connected to an indicator hub250that is inside of an indicator housing265, that the indicator shaft325rotates the indicator hub250inside of the indicator housing265between the first position and the second position, that the indicator housing265does not rotate, wherein the open/close indicator106comprises the indicator hub250and the indicator housing265. The method embodiment further contemplates the open/close indicator106visibly displaying the open orientation indicia254and the closed orientation indicia252at an indicator distal surface268of the open/close indicator106. The open/close indicator106can further visibly display the open orientation or the closed orientation via a side view visual indicator309. The above embodiments are not intended to be limiting to the scope of the invention whatsoever because many more embodiments are easily conceived within the teachings and scope of the instant description. Moreover, the corresponding elements in the above example should not be considered limiting. It is to be understood that even though numerous characteristics and advantages of various embodiments of the present invention have been set forth in the foregoing description, together with the details of the structure and function of various embodiments of the invention, this disclosure is illustrative only, and changes may be made in detail, especially in matters of structure and arrangement of parts within the principles of the present invention to the full extent indicated by the broad general meaning of the terms used herein. For example, though embodiments of the present invention describe an underarm vacuum break switch arrangement100, certain inventive elements can be equally applied to other kinds of vacuum break switch arrangements without departing from the scope and spirit of the present invention. It should also be appreciated that the appropriate mechanical and electrical components not discussed in detail in the present disclosure must be implemented in accordance known to those skilled in the art. The specification and drawings are to be regarded as illustrative and exemplary rather than restrictive. For example, the word “preferably,” and the phrase “preferably but not necessarily,” are used synonymously herein to consistently include the meaning of “not necessarily” or optionally. “Comprising,” “including,” and “having,” are intended to be open-ended terms. It will be clear that the claimed invention is well adapted to attain the ends and advantages mentioned as well as those inherent therein. While presently preferred embodiments have been described for purposes of this disclosure, numerous changes may be made which readily suggest themselves to those skilled in the art and which are encompassed in the spirit of the claimed invention disclosed and as defined in the appended claims. Accordingly, it is to be understood that even though numerous characteristics and advantages of various aspects have been set forth in the foregoing description, together with details of the structure and function, this disclosure is illustrative only, and changes may be made in detail, especially in matters of structure and arrangement to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed. | 85,877 |
11942766 | DETAILED DESCRIPTION OF THE INVENTION Referring to the drawings wherein identical reference numerals denote the same elements throughout the various views,FIG.1illustrates an exemplary clamp apparatus10constructed according to an aspect of the present invention. As shown, the clamp apparatus10includes first and second C-shaped halves12and14(as defined herein, a C-shaped half refers to a half that is closed on 3 sides and open or partially open on a fourth side—as shown inFIGS.1,3and4, the ends may be rounded, V-shaped, or any other suitable shape). The first and second halves12and14are connected together at a first end16such that a rear face18of the first half12rests against a rear face20of the second half14(this causes the C-shaped halves to be reversed from each other such that the partial opening of the “C” in the first half is closed off by the second half). The first and second halves12,14are not connected together at a second end22of the clamp apparatus10to allow the clamp apparatus10to move from a closed position,FIG.1, to an open position,FIGS.5and6, where a conductor can be received between rear faces18and20and back to a closed position,FIG.7, where the conductor is secured in an opening26of the clamp apparatus10. As illustrated, the first and second halves12,14are flared outwardly at the second end22of the clamp apparatus10. An aperture28is positioned at the first end16to receive a hot stick. As illustrated inFIG.2, the clamp apparatus10may include fingers32for securing a first conductor therebetween. The fingers may be flexible to conform to the first conductor or rigid. The fingers32are connected to the clamp apparatus10at the first end16of the clamp apparatus10. It should be appreciated that while the fingers32are described below in use, the fingers32are optional and are not required. Referring toFIGS.3and4, unlike the rounded first and second ends16and22may be formed of different shapes. For example, as shown, the first and second ends16and18may be V-shaped. Additionally, the first and second ends16and22may include anti-slip pads21positioned thereon to prevent the clamp apparatus10from sliding along a conductor. The pads21may be of any suitable material to prevent the clamp apparatus10from sliding along the conductor (for example, rubber). In use, referring toFIGS.5-10, a first conductor30is positioned in the clamp apparatus10and held in position by fingers32. A user then uses a hot stick34connected to aperture28of the clamp apparatus10to raise the clamp apparatus to a second conductor36. It should be appreciated, that a user may also place the clamp apparatus10onto a conductor by hand, as opposed to, using a hot-stick. The second conductor36is positioned between the flared second end22such that the second conductor36is positioned between the first and second halves12,14. The user then pushes the clamp apparatus10upward such that the second conductor36is positioned at about a middle of the clamp apparatus10and in alignment with openings40,42of the first and second halves12,14. The clamp apparatus10is then rotated to allow the second conductor36to be positioned in the opening26and allow the first and second halves12,14to move back to a closed position. The hot stick is then removed and the clamp apparatus10maintains the first and second conductors30,36in a compact relation. As illustrated inFIGS.11-13, to remove the clamp apparatus10, the user attaches the hot stick to aperture28and then raises and rotates the clamp apparatus10such that the second conductor36is now positioned within openings40,42of the first and second halves12and14. By rotating the clamp apparatus10, the second conductor is no longer positioned in opening26and is instead positioned between rear faces18and20. The user then moves the clamp apparatus10downward until the second conductor36is no longer between the first and second halves12and14. The hot stick can be removed and the first conductor30may be removed from the clamp apparatus10in the same manner as the second conductor36. The foregoing has described a clamp apparatus. All of the features disclosed in this specification (including any accompanying claims, abstract and drawings), and/or all of the steps of any method or process so disclosed, may be combined in any combination, except combinations where at least some of such features and/or steps are mutually exclusive. Each feature disclosed in this specification (including any accompanying claims, abstract and drawings) may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise. Thus, unless expressly stated otherwise, each feature disclosed is one example only of a generic series of equivalent or similar features. The invention is not restricted to the details of the foregoing embodiment(s). The invention extends to any novel one, or any novel combination, of the features disclosed in this specification (including any accompanying claims, abstract and drawings), or to any novel one, or any novel combination, of the steps of any method or process so disclosed. | 5,112 |
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